A thin silicon wafer continuous transfer device

Abstract

The application discloses a thin silicon wafer continuous transfer device, and relates to the technical field of silicon wafer production equipment, which comprises a transfer platform, the upper surface of the transfer platform is provided with a bottom plate, the upper surface of the bottom plate is provided with a plurality of side plates, a water flow channel is formed between the bottom plate and two adjacent groups of the side plates, a water flow path is arranged in the water flow channel, water flows through the start end of the water flow path, and the silicon wafer is transferred along the water flow path, a transfer frame is arranged at the end of the water flow path and close to the water flow path, and a supporting plate is arranged in the transfer frame; when the water flow transfers the silicon wafer to the supporting plate, the water flow and the silicon wafer on the supporting plate are separated through water-permeable holes arranged on the supporting plate. The application has the effect of reducing the silicon wafer breakage rate.

Description

Technical Field

[0001] This invention relates to the technical field of silicon wafer production equipment, and in particular to a continuous transfer device for thin silicon wafers. Background Technology

[0002] Currently, the silicon wafer production process is as follows: silicon material is sequentially acid-washed, proportioned, and drawn to form a rectangular columnar structure. This rectangular columnar structure is then bonded to a material holder, and processed into thin silicon wafers of about 1mm in a wire-cutting workshop. The silicon wafers are then pre-cleaned to remove silicon sludge and silicon powder. After cleaning, the thin silicon wafers undergo a heating debinding process to remove them from the material holder. The removed thin silicon wafers are then placed inside a cleaning equipment for final cleaning, and finally transferred to the next process via a transfer device. Because silicon wafers are thin, existing thin silicon wafer transport methods use clamping components to clamp and transport them. However, when using existing clamping components to clamp and transport silicon wafers, the contact area between the clamping part of the clamping component and the silicon wafer is prone to uneven stress, which can easily cause the wafer to break during transport. Summary of the Invention

[0003] This application provides a thin silicon wafer continuous transfer device, which has the function of reducing the silicon wafer breakage rate.

[0004] This application provides a continuous transfer device for thin silicon wafers, which adopts the following technical solution: A thin silicon wafer continuous transfer device includes a transfer platform with a base plate on the upper surface and a plurality of side plates on the upper surface of the base plate. A water flow channel is formed between the base plate and two adjacent sets of side plates. A water flow path is provided inside the water flow channel. Water flows through the beginning of the water flow path and transfers the silicon wafer along the water flow path. A transfer frame is provided inside the water flow channel and near the end of the water flow path. A support plate is provided inside the transfer frame. When the water flow transfers the silicon wafer to the support plate, water flow and silicon wafer are separated on the support plate through water-permeable holes.

[0005] By adopting the above technical solution, since the silicon wafer is relatively thin, when using conventional clamping components to clamp and transfer the silicon wafer, impurities are easily adhered to the contact area between the clamping part of the clamping component and the silicon wafer. Therefore, by setting a water flow channel on the transfer platform, the floating water flow in the water flow channel is used to wash away impurities on the surface of the silicon wafer on the one hand, and transfer the silicon wafer to the transfer frame and place it on the support plate on the other hand. The transfer frame is used to transport the silicon wafer to the next process. By transferring the silicon wafer by water flow, the non-destructive transfer of the silicon wafer is achieved, which has the effect of reducing the silicon wafer breakage rate.

[0006] Preferably, the transfer frame is rotatably mounted within the transfer platform, and the support plate is arranged at equal angles around the rotation center of the transfer frame.

[0007] By adopting the above technical solution, in order to sustainably transport silicon wafers, several support plates are set on the transfer frame, which can effectively provide a platform for several silicon wafers. With the help of the rotation of the transfer frame, the silicon wafers are placed on the support plates in sequence according to the rotation direction of the transfer frame, so as to ensure the continuity of silicon wafer transport.

[0008] Preferably, the transfer frame is provided with a groove for accommodating the support plate, and the top of the groove is open, and one side of the groove is provided with an opening, and the opening is on the same horizontal plane as the upper surface of the base plate.

[0009] By adopting the above technical solution, since the support plate is a planar structure, the support plate will detach from the support plate as the transfer frame rotates centrifugally. Therefore, by providing a groove on the transfer frame, the sidewall of the groove can form a lateral barrier on the side of the silicon wafer. During the transfer of the silicon wafer, the silicon wafer slides on the upper surface of the base plate and passes through the opening of the groove, and sits on the support plate, which can effectively prevent the silicon wafer from slipping off the support plate and enhance the stability of the silicon wafer transfer.

[0010] Preferably, an adjustment plate is provided inside the groove for sliding up and down.

[0011] By adopting the above technical solution, since the number of support plates set in the horizontal direction of the transfer frame is limited, in order to improve the transfer efficiency of the transfer frame for silicon wafers in the vertical direction, an adjustable plate that can slide up and down is provided inside the groove. By controlling the horizontal displacement difference between the adjustable plate and the base plate, the silicon wafers are continuously stacked in the groove by water flow, which greatly increases the number of silicon wafers to be transferred in the groove, thereby improving the transfer efficiency of the transfer frame for silicon wafers in the vertical direction.

[0012] Preferably, a guide component is provided on the base plate near the end of the water flow path, the guide component being used to guide the silicon wafer in the water flow to the support plate.

[0013] By adopting the above technical solution, since the opening of the groove and the end of the water flow path are different in size, the silicon wafer will tilt on the base plate during the process of transporting the silicon wafer by water flow, causing the silicon wafer to get stuck at the opening of the groove, making it difficult to ensure the continuous transport of the silicon wafer. Therefore, by setting a guide component to correct the silicon wafer in the water flow and guide it to the support plate in the groove, the continuity of silicon wafer transport is further guaranteed.

[0014] Preferably, the guiding component includes guide blocks disposed on the base plate. There are two sets of guide blocks, and a guiding channel is formed between the two sets of guide blocks. The cross-sectional area at the entrance of the guiding channel is larger than the cross-sectional area at the exit of the guiding channel, and the cross-sectional area varies uniformly. Several guide rollers are provided on the inner wall of the guiding channel. The silicon wafer is guided into the opening of the groove by the rolling of the guide rollers.

[0015] By adopting the above technical solution, the guide blocks set on both sides of the silicon wafer form a limit, so that when the silicon wafer passes through the entrance of the guide channel, the cross-sectional size of the guide channel is gradually reduced, the orientation of the silicon wafer is gradually limited and corrected, and the silicon wafer is driven into the interior of the groove by the rolling of the guide rollers, so as to guide and fine-tune the silicon wafer and enable the silicon wafer to enter the guide channel smoothly.

[0016] Preferably, the outer side of the guide assembly is provided with a rinsing assembly for secondary rinsing of the silicon wafer.

[0017] By adopting the above technical solution, in order to further remove impurities from the surface of silicon wafers, a rinsing component is used to rinse the impurities from the surface of the silicon wafers, so that the surface of the silicon wafers is in a clean state when they are stacked layer by layer, and to avoid impurities being trapped between the silicon wafers and causing damage to the silicon wafers.

[0018] Preferably, the rinsing assembly includes a water tank and a support frame mounted on a transfer platform. A water pump is mounted on the support frame. The output end of the water tank is connected to the input end of the water pump, and the output end of the water pump is connected to a rinsing nozzle.

[0019] By adopting the above technical solution, water is pumped from the water tank and sprayed onto the surface of the silicon wafer using a rinsing nozzle, thereby rinsing the impurities on the surface of the silicon wafer. The structure is simple, easy to implement, and convenient to carry out.

[0020] Preferably, a plurality of the rinsing nozzles are provided on the support frame, and the rinsing nozzles are rotatably mounted on the support frame.

[0021] By adopting the above technical solution, the angle between the water jet and the silicon wafer at the point of spraying through the rinsing nozzle can be reasonably controlled by adjusting the rotation angle of the rinsing nozzle, thereby controlling the cleaning range.

[0022] Preferably, the side plate is provided with a correction component, which is used to correct the silicon wafers in the water flow.

[0023] By adopting the above technical solution, in order to correct the angle of the silicon wafer during the transfer process, a correction component is set inside the water flow channel to effectively prevent the silicon wafer from shifting significantly within the water flow channel, allowing the silicon wafer to smoothly enter the entrance position of the guide channel.

[0024] In summary, this application has the following beneficial effects: 1. By setting up a water flow channel on the transfer platform, the floating water flow within the channel serves two purposes: firstly, it washes away impurities on the surface of the silicon wafers; secondly, it transfers the silicon wafers to the transfer frame and places them on the support plate. The transfer frame then transports the silicon wafers to the next process, thus achieving the transfer function of the silicon wafers. During the entire transfer process, there is no manual intervention or clamping mechanical equipment to handle the silicon wafers, which effectively avoids secondary contamination of the silicon wafer surface after transfer. In addition, the water flow transfer method serves two purposes: second cleaning of the silicon wafers and effective non-destructive transfer of the silicon wafers.

[0025] 2. Several support plates set on the transfer frame can effectively provide a platform for placing several silicon wafers. With the rotation of the transfer frame, the silicon wafers are placed on the support plates in sequence according to the rotation direction of the transfer frame, so as to ensure the continuity of silicon wafer transfer. The support plates are installed inside the groove, and the groove is equipped with an adjustable plate that can slide up and down. By controlling the horizontal displacement difference between the adjustable plate and the base plate, the silicon wafers are continuously stacked in the groove by water flow, which greatly increases the number of silicon wafers to be transferred in the groove, thereby improving the transfer efficiency of the transfer frame in the longitudinal direction. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the transfer device in this embodiment; Figure 2 This is a schematic diagram of the overall structure of the transfer frame in this embodiment; Figure 3 This is a schematic diagram of the connection structure between the adjusting plate and the transfer frame in this embodiment; Figure 4 This is a cross-sectional view of the transfer platform in this embodiment; Figure 5 This is a schematic diagram of the overall structure of the protective sleeve in this embodiment; Figure 6 This is a cross-sectional view of the protective sleeve in this embodiment.

[0027] Explanation of reference numerals in the attached drawings: 1. Transfer platform; 2. Base plate; 3. Side plate; 4. Transfer frame; 5. Support plate; 6. Water permeable hole; 7. Groove; 8. Adjusting plate; 9. Guide assembly; 901. Guide block; 902. Guide roller; 10. Flushing assembly; 1001. Water tank; 1002. Water pump; 1003. Support frame; 1004. Flushing nozzle; 11. Correction assembly; 1101. Protective sleeve; 1102. Creeping surface; 1103. Drive assembly; 110301. Transmission belt; 110302. Drive wheel; 110303. Eccentric rod; 110304. Limiting roller. Detailed Implementation

[0028] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0029] Example: This invention discloses a continuous transfer device for thin silicon wafers, such as... Figure 1 As shown, the device includes a transfer platform with a base plate on its upper surface and two sets of side plates on its upper surface. A water flow channel is formed between the base plate and the two sets of side plates. Due to the thinness of the silicon wafer, impurities easily adhere to the contact area between the clamping part of the clamping component and the silicon wafer when using conventional clamping components to hold and transfer the silicon wafer. By utilizing the floating water flow within the water flow channel, not only can the silicon wafer be transferred without damage, but impurities on the surface of the silicon wafer can also be washed away. The water flow channel has a water flow path inside, and the water flows through the beginning of the water flow path and transfers the silicon wafer along the water flow path. A transfer frame is located inside the water flow channel and near the end of the water flow path. The transfer frame has a support plate inside, and the water flows along the water flow path to transfer the silicon wafer onto the transfer frame, where it rests on the support plate. The silicon wafer is then transported to the next process via the transfer frame, thereby realizing the transfer of the silicon wafer. The transfer function deserves further explanation. By reasonably controlling the water flow rate, the transfer rate of the silicon wafer in the water flow is controlled, ensuring the stability of the silicon wafer transfer in the water flow. This effectively prevents the outer edge of the silicon wafer from hitting the side plate, thus protecting the silicon wafer. When the water flow transfers the silicon wafer to the support plate, the water flow and silicon wafer are separated through the water permeable holes in the support plate. The silicon wafer is transferred to the support plate, while the water flow passes through the water permeable holes in the support plate and drips into the water collection tank located in the transfer platform. During the above silicon wafer transfer process, there is no manual intervention or clamping mechanical equipment to handle the silicon wafer. This effectively avoids secondary contamination of the silicon wafer surface after transfer. In addition, the water flow transfer method serves two purposes: firstly, it is used for secondary cleaning of the silicon wafer, and secondly, it effectively achieves non-destructive transfer of the silicon wafer.

[0030] like Figure 2As shown, in order to ensure the continuous transfer of silicon wafers and maintain the continuity of workshop production, this invention provides a platform for placing silicon wafers by setting several support plates on the transfer frame at equal angles around the rotation center of the transfer frame. A drive motor is located at the center of the transfer frame, allowing the frame to rotate within the transfer platform. The rotation of the transfer frame causes the silicon wafers to be placed sequentially on the support plates according to the rotation direction, ensuring the continuity of silicon wafer transfer. Since the support plates are planar, the centrifugal rotation of the transfer frame can cause them to detach. Therefore, the transfer frame is provided with grooves for accommodating the support plates, with the top of the groove open and one side having an opening at the same level as the upper surface of the base plate. The sidewall of the groove forms a lateral barrier on the side of the silicon wafer. During the transfer process, the silicon wafer slides on the upper surface of the base plate, passes through the opening of the groove, and sits on the support plate, effectively preventing the silicon wafer from slipping off the support plate and enhancing the stability of silicon wafer transfer. like Figure 3 As shown, due to the limited number of support plates in the horizontal direction of the transfer frame, in order to improve the transfer efficiency of silicon wafers in the vertical direction, an adjustable plate that can slide up and down is provided inside the groove. An electric telescopic rod is provided between the adjustable plate and the support plate. By controlling the horizontal displacement difference between the adjustable plate and the base plate, the silicon wafers are continuously stacked layer by layer in the groove using water flow, which greatly increases the number of silicon wafers to be transferred in the groove, thereby improving the transfer efficiency of silicon wafers in the vertical direction. A gap is formed between the side of the adjustable plate and the inner wall of the groove. During the stacking of two sets of silicon wafers, as the two sets of silicon wafers approach each other, the water flow between the two sets of silicon wafers is squeezed into the gap and collected in the water collection tank through the water permeable holes. Since the surface of the silicon wafer is oxidized to form silicon dioxide, which is a hydrophilic material, when the two sets of silicon wafers approach each other, the water will form a relatively tight water film between the two sets of silicon wafers, making it difficult for air to enter between the two sets of silicon wafers, enhancing the interaction force between the two sets of silicon wafers, making the layers of silicon wafers form a whole, and preventing dust from adhering between the two sets of silicon wafers.

[0031] like Figure 4As shown, because the opening of the groove and the end of the water flow path have different dimensions, the silicon wafer will tilt on the base plate during the water flow transfer process, causing it to get stuck at the opening of the groove, making it difficult to ensure continuous transfer of the silicon wafer. Therefore, this invention provides a guide component on the base plate near the end of the water flow path. The guide component is used to guide the silicon wafer in the water flow to the support plate. The guide component includes guide blocks on the base plate, with two sets of guide blocks forming a guide channel between the two sets. The cross-sectional area at the entrance of the guide channel is larger than the cross-sectional area at the exit of the guide channel, and the cross-sectional area changes uniformly. The inner wall of the guide channel is provided with several... A guide roller, through its rolling motion, guides the silicon wafer into the opening of the groove. Guide blocks on either side of the wafer limit its movement, gradually narrowing the cross-sectional size of the guide channel as it passes through the entrance, thus controlling and correcting the wafer's orientation. The rolling of the guide rollers brings the wafer into contact with their surfaces, transporting it into the groove. This guide component guides and fine-tunes the wafer, ensuring its smooth entry into the guide channel. Therefore, by incorporating this guiding assembly to correct the silicon wafer in the water flow and guide it to the support plate within the groove, the continuity of wafer transport is further guaranteed.

[0032] like Figure 4 As shown, to further remove impurities from the surface of silicon wafers, this invention provides a rinsing assembly for secondary rinsing of the silicon wafers on the outside of the guide assembly. This rinsing assembly removes impurities from the silicon wafer surface, ensuring a clean surface during stacking and preventing impurities from getting trapped between wafers and causing damage. The rinsing assembly includes a water tank and a support frame mounted on a transfer platform. A water pump is mounted on the support frame, and the output end of the water tank is connected to the input end of the water pump. A rinsing nozzle is connected to the output end of the water pump, and several rinsing nozzles are mounted on the support frame and rotatably. By adjusting the rotation angle of the rinsing nozzles, the angle between the water jet and the silicon wafer can be controlled, thus controlling the cleaning range. Water is drawn from the water tank by the water pump and sprayed onto the surface of the silicon wafers using the rinsing nozzles, effectively rinsing away impurities. The structure is simple, easy to implement, and convenient to carry out.

[0033] like Figure 4 As shown, in order to correct the angle of the silicon wafer during the transfer process, the present invention provides a correction component on the side plate. The correction component is used to correct the silicon wafer in the water flow, so that the silicon wafer can smoothly enter the entrance position of the guide channel, which can effectively prevent the silicon wafer from being deviated significantly in the water flow channel. like Figure 5As shown, the correction assembly includes a protective sleeve on the side plate. There are two sets of protective sleeves. A peristaltic surface is formed on one side of the two sets of protective sleeves. A correction channel is formed between the two sets of peristaltic surfaces and the upper surface of the base plate for the silicon wafer and water to pass through. When the water carries the silicon wafer through the correction channel, the peristaltic surface undergoes irregular peristalsis by mimicking the behavior of "swallowing by contracting the throat muscles". With the contact between the peristaltic surface and the side of the silicon wafer, the transfer direction of the silicon wafer is always in a fine-tuning state, so as to avoid the silicon wafer from deviating by a large size and causing the silicon wafer to block the entrance of the guide channel. like Figure 6 As shown, the protective sleeve has an internal drive assembly for driving the peristaltic surface to move irregularly. The drive assembly includes a transmission belt and several drive wheels. The drive wheels rotate via the transmission belt. An eccentric rod is located at the bottom of the drive wheel and near its center. One end of the eccentric rod is connected to the drive wheel, and the other end is rotatably connected to a limit roller. The limit roller is in contact with the peristaltic surface. The transmission belt drives the drive wheels to rotate, which in turn causes the eccentric rod to rotate in a circular motion. When the eccentric rod approaches the peristaltic surface, the limit roller contacts and squeezes the peristaltic surface, causing the peristaltic surface of the protective sleeve to deform outward. When the eccentric rod moves away from the peristaltic surface, the eccentric rod disengages from the peristaltic surface, and with the natural contraction of the protective sleeve, the peristaltic surface deforms inward.

[0034] Working principle: When in use, the user first connects the cleaning equipment to the transfer device, so that the discharge end of the cleaning equipment faces the beginning of the water flow path. The silicon wafers and water in the cleaning equipment are fed into the water flow channel by manual or robotic arm. The water flows through the beginning of the water flow path and transfers the silicon wafers along the water flow path.

[0035] Then, through the irregular peristalsis of the two sets of peristaltic surfaces, and the contact between the peristaltic surfaces and the sides of the silicon wafer, the transport direction of the silicon wafer is always in a state of fine adjustment, so as to avoid large-scale displacement of the silicon wafer and correct the transport direction of the silicon wafer.

[0036] When the silicon wafer is transferred to the entrance of the guide channel, the cross-sectional size of the guide channel is gradually reduced to gradually limit and correct the orientation of the silicon wafer. The silicon wafer is brought into contact with the surface of the guide roller by the rolling of the guide roller, which plays the role of guiding the silicon wafer. During the silicon wafer guiding process, a rinsing component is used to rinse away impurities on the surface of the silicon wafer, ensuring that the surface of the silicon wafer remains clean when it is stacked layer by layer, thus preventing impurities from getting trapped between the silicon wafers and causing damage.

[0037] When the silicon wafer passes through the opening of the groove and is guided into the groove, the silicon wafer sits on the adjusting plate. Then, the adjusting plate is slid down using an electric telescopic rod until the silicon wafer on the upper surface of the adjusting plate is flush with the upper surface of the base plate. The water flow then continuously stacks the silicon wafers layer by layer in the groove. After a certain number of silicon wafers have been stacked in the groove, the transfer frame is rotated to stack the silicon wafers layer by layer in the groove according to the rotation direction of the transfer frame, so as to ensure the continuity of silicon wafer transfer. It is worth noting that the water and silicon wafer are separated inside the groove, where the water passes through the gap and enters the water collection tank through the water permeable hole.

[0038] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A thin wafer continuous transfer device, characterized by: The system includes a transfer platform (1), a base plate (2) on the upper surface of the transfer platform (1), and several side plates (3) on the upper surface of the base plate (2). A water flow channel is formed between the base plate (2) and two adjacent sets of side plates (3). A water flow path is provided inside the water flow channel. The water flows through the beginning of the water flow path and transfers the silicon wafer along the water flow path. A transfer frame (4) is provided inside the water flow channel and near the end of the water flow path. A support plate (5) is provided inside the transfer frame (4). When the water flows to transfer the silicon wafer to the support plate (5), the water flow and the silicon wafer are separated from the support plate (5) through the water-permeable holes (6) provided on the support plate (5).

2. The thin silicon wafer continuous transfer device according to claim 1, wherein: The transfer frame (4) is rotatably mounted inside the transfer platform (1), and the support plate (5) is set at equal angles around the rotation center of the transfer frame (4).

3. The thin silicon wafer continuous transfer device of claim 1, wherein: The transfer frame (4) is provided with a groove (7) for accommodating the support plate (5), and the top of the groove (7) is open. One side of the groove (7) is provided with an opening, and the opening is on the same horizontal plane as the upper surface of the base plate (2).

4. The thin silicon wafer continuous transfer device according to claim 3, wherein: An adjustment plate (8) is provided inside the groove (7) and slides up and down.

5. The thin silicon wafer continuous transfer device according to claim 1, characterized in that: A guide component (9) is provided on the base plate (2) near the end of the water flow path. The guide component (9) is used to guide the silicon wafer in the water flow to the support plate (5).

6. The thin silicon wafer continuous transfer device according to claim 5, wherein: The guiding component (9) includes a guide block (901) disposed on the base plate (2). There are two sets of guide blocks (901), and a guiding channel is formed between the two sets of guide blocks (901). The cross-sectional area at the entrance of the guiding channel is larger than the cross-sectional area at the exit of the guiding channel, and the cross-sectional area changes uniformly. Several guide rollers (902) are disposed on the inner wall of the guiding channel. The guide rollers (902) are used to guide the silicon wafer into the opening of the groove (7) by rolling.

7. The thin silicon wafer continuous transfer device of claim 5, wherein: The outer side of the guide assembly (9) is provided with a rinsing assembly (10) for secondary rinsing of the silicon wafer. 8.The thin silicon wafer continuous transfer device according to claim 7, wherein: The flushing assembly (10) includes a water tank (1001) and a support frame (1003) mounted on a transfer platform (1). A water pump (1002) is mounted on the support frame (1003). The output end of the water tank (1001) is connected to the input end of the water pump (1002). The output end of the water pump (1002) is connected to a flushing nozzle (1004).

9. The thin silicon wafer continuous transfer device according to claim 8, characterized in that: The flushing nozzles (1004) are provided in a plurality of units on the support frame (1003), and the flushing nozzles (1004) are rotatably mounted on the support frame (1003).

10. The thin silicon wafer continuous transfer device of claim 1, wherein: The side plate (3) is provided with a correction component (11), which is used to correct the silicon wafers in the water flow.

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