Silicon wafer variable-pitch conveying table and working method thereof

Abstract

The application relates to a silicon wafer variable-distance transmission workbench and a working method thereof, which comprises the following parts: a workbench frame, a feeding flower basket elevator, a silicon wafer feeding extension mechanism, a feeding whole wafer centering mechanism and a feeding variable-distance mechanism, which constitute a feeding part of semi-finished silicon wafers and are used for feeding the semi-finished silicon wafers; a discharging variable-distance mechanism, a silicon wafer discharging extension mechanism, a discharging whole wafer centering mechanism and a discharging flower basket elevator mechanism, which constitute a discharging part of finished silicon wafers and are used for discharging the finished silicon wafers. The silicon wafer variable-distance transmission workbench and the working method thereof are suitable for the feeding and discharging of photovoltaic industry pipe P and etching, etc. The workbench can automatically realize the feeding of semi-finished silicon wafers and the automatic discharging of finished silicon wafers after a process, and is divided into two independent work units. The workbench realizes the full-automatic feeding and discharging of semi-finished silicon wafers and finished silicon wafers, and greatly improves the production efficiency.

Description

Technical Field

[0001] This invention relates to the field of solar cell and semiconductor manufacturing technology, and in particular to a silicon wafer variable pitch transmission stage and its working method. Background Technology

[0002] In existing technologies, the silicon wafer loading and unloading process combines robotic arm picking and belt conveyor transport. Specifically, the silicon wafers to be processed are pre-stored in a basket, placed on a belt by a robotic arm, and once a certain number of wafers are on the belt, a suction cup robotic arm picks them up and places them onto a tray for coating. After coating, the suction cup robotic arm returns the wafers to the belt and finally transfers them to the basket. The tray, or silicon wafer carrier, is used to carry and transport silicon wafers in vacuum equipment. Existing trays have grooves for holding silicon wafers, and the number of wafers they can hold is determined by the number of grooves. The grooves are evenly spaced on the tray to ensure that the wafers are evenly distributed. For example, a common tray can hold 56 or 64 156mm*156mm silicon wafers.

[0003] However, when manufacturing larger silicon wafers or carrying a greater number of wafers, the strength requirements for the wafer carriers also increase. Currently, to increase the wafer-carrying capacity of wafer carriers and improve work efficiency, high-strength stainless steel is typically used as the raw material for manufacturing wafer carriers. Furthermore, to further ensure load-bearing strength, the grooves on the wafer carrier for placing the wafers may not be perfectly equidistant. If wafers are directly loaded or unloaded, it is difficult to guarantee that the wafers will fall into the grooves on the wafer carrier.

[0004] In summary, when transporting large-sized or numerous silicon wafers, how to ensure the coordination between the loading and unloading mechanisms in the silicon wafer transport system to guarantee the accuracy of the silicon wafer transport process and improve transport efficiency is a technical problem that urgently needs to be solved in the existing technology. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the problem of how to achieve stable transportation of silicon wafers between loading and unloading in the prior art for large quantities of silicon wafers.

[0006] To solve the above-mentioned technical problems, the present invention provides a silicon wafer variable-pitch conveying worktable and its working method, comprising: a worktable frame, which serves as an integral support structure; a loading basket elevator, which is disposed on the worktable frame, and the loading basket elevator contains a silicon wafer storage basket; a silicon wafer loading extension mechanism, which is disposed on the worktable frame, and the silicon wafer loading extension mechanism is used to remove the semi-finished silicon wafers from the bottom of the silicon wafer storage basket; a loading wafer centering mechanism, which is disposed on the silicon wafer loading extension mechanism, and the loading wafer centering mechanism is used to adjust the position of the semi-finished silicon wafers on the silicon wafer loading extension mechanism; and a loading variable-pitch mechanism, which is disposed on the worktable frame. The loading variable-pitch mechanism, the loading basket elevator, and the silicon wafer loading extension mechanism are on the same straight line, and the loading variable-pitch mechanism and the loading basket elevator are respectively located at both ends of the conveying direction of the silicon wafer loading extension mechanism. The semi-finished silicon wafers on the silicon wafer loading extension mechanism... The wafers are conveyed to the loading variable-cutoff mechanism, where a robotic arm picks up the semi-finished silicon wafers and transfers them to a graphite boat. A unloading variable-cutoff mechanism, mounted on the workbench frame, is used by the robotic arm to pick up finished silicon wafers from the graphite boat and transfer them to the unloading variable-cutoff mechanism. A wafer unloading extension mechanism, also mounted on the workbench frame, is used to remove finished silicon wafers from the bottom of the unloading variable-cutoff mechanism. A wafer centering mechanism, mounted on the wafer unloading extension mechanism, is used to adjust the position of the finished silicon wafers on the wafer unloading extension mechanism. A basket lifter, also mounted on the workbench frame, is used to transport the unloading variable-cutoff mechanism, the wafer unloading extension mechanism, and the basket lifter in a straight line, with the unloading variable-cutoff mechanism and the basket lifter located at opposite ends of the conveying direction of the wafer unloading extension mechanism. The finished silicon wafers on the wafer unloading extension mechanism are conveyed to the basket of the basket lifter.

[0007] In one embodiment of the present invention, the loading basket elevator and the unloading basket elevator have the same structure. Both the loading basket elevator and the unloading basket elevator include a linear module, a vertical connecting plate, a lower base plate, an upper support plate, a lower basket pressing assembly, and an upper basket positioning assembly. The linear module is fixedly mounted on the workbench frame, and the linear module moves vertically. The vertical connecting plate is connected to the slider of the linear module. The upper support plate and the lower base plate are respectively connected to the upper and lower ends of the vertical connecting plate. The upper support plate, the lower base plate, and the vertical connecting plate are arranged in a "U" shape. The lower basket pressing assembly is mounted on the lower base plate, and the upper basket positioning assembly is mounted on the upper support plate. Silicon wafer storage baskets are provided inside the upper support plate, the lower base plate, and the vertical connecting plate. The lower basket pressing assembly and the upper basket positioning assembly respectively position the silicon wafer storage baskets.

[0008] In one embodiment of the present invention, the lower basket clamping assembly includes a clamping drive cylinder, a rotating shaft support, a rotating shaft, clamping jaws, a push rod, and a push plate. The clamping drive cylinder and the rotating shaft support are both fixedly mounted on the lower base plate. The rotating shaft support consists of two symmetrically arranged pieces. Both ends of the rotating shaft are mounted on the rotating shaft support. The clamping jaws are sleeved on the rotating shaft. There are two symmetrical clamping jaws, and a push rod is arranged between the two clamping jaws. One end of the push plate is connected to the piston rod of the clamping drive cylinder, and the other end of the push plate is rotatably connected to the push rod. The clamping jaws clamp onto the lower end of the silicon wafer storage basket.

[0009] In one embodiment of the present invention, the upper flower basket positioning assembly includes an upper positioning drive cylinder and an upper positioning head. The upper positioning drive cylinder is fixedly mounted on the upper support plate. The upper positioning head is connected to the upper positioning drive cylinder. The lower end of the upper positioning head is tapered. The top of the silicon wafer storage flower basket is provided with a positioning hole. The upper positioning drive cylinder drives the upper positioning head to extend into the positioning hole.

[0010] In one embodiment of the present invention, the silicon wafer loading and unloading mechanisms have the same structure. The silicon wafer loading and unloading mechanisms include: a mounting base, which serves as a support structure for the transmission mechanism and is connected to the workbench frame; a conveying drive device, which is disposed on the mounting base; a sliding seat, which is slidably connected to the mounting base and is connected to the sliding seat; and a pushing conveying drive device, which is disposed on the mounting base and is connected to the sliding seat. The pushing conveying drive device drives the sliding seat to move closer to or away from the basket.

[0011] In one embodiment of the present invention, the loading and unloading wafer centering mechanisms have the same structure. Both the loading and unloading wafer centering mechanisms include a wafer support frame, a wafer linear module, a wafer finger cylinder, and two symmetrically arranged wafer fingers. The wafer support frame is fixedly mounted on a mounting base. The wafer linear module is mounted on the top plate of the wafer support frame and is suspended above the conveying drive device. The wafer finger cylinder is connected to the slider of the wafer linear module. The two symmetrically arranged wafer fingers are connected to the wafer finger cylinder. A wafer guide rod is connected to each wafer finger. The wafer guide rod is cylindrical and has a silicone sleeve at its lower end. The wafer guide rod contacts the edge of the finished or semi-finished silicon wafer on the wafer loading and unloading extension mechanisms.

[0012] In one embodiment of the present invention, the loading variable intercept mechanism and the unloading variable intercept mechanism have the same structure. Both the loading variable intercept mechanism and the unloading variable intercept mechanism include a variable intercept linear module, a variable intercept gantry, a silicon wafer variable intercept placement assembly, and a silicon wafer variable intercept positioning assembly. The variable intercept linear module is fixedly mounted on the workbench frame and is arranged vertically. The variable intercept gantry is connected to the variable intercept linear module. The silicon wafer variable intercept placement assembly and the silicon wafer variable intercept positioning assembly are mounted on the variable intercept gantry. The silicon wafer variable intercept placement assembly has silicon wafers on it, and the silicon wafer variable intercept positioning assembly is used to position the silicon wafers on the silicon wafer variable intercept placement assembly.

[0013] In one embodiment of the present invention, the silicon wafer variable pitch placement assembly includes four rectangular mounting plates, which are respectively located at the four corners of the rectangular cross section. A plurality of silicon wafer support cylinders are arranged sequentially along the vertical direction on the rectangular mounting plates. The plurality of silicon wafer support cylinders are evenly spaced, and the silicon wafers are placed on the silicon wafer support cylinders located on the same horizontal plane.

[0014] In one embodiment of the present invention, the silicon wafer pitch-changing positioning assembly includes a pitch-changing positioning drive cylinder one, a pitch-changing slide plate one, two pitch-changing positioning push plates one, a pitch-changing positioning drive cylinder two, a pitch-changing slide plate two, and two pitch-changing positioning push plates two. The pitch-changing positioning drive cylinder one and the pitch-changing positioning drive cylinder two are both fixedly mounted on the pitch-changing gantry. The piston rods of the pitch-changing slide plate one and the pitch-changing positioning drive cylinder one are connected, and the piston rods of the pitch-changing slide plate two and the pitch-changing positioning drive cylinder two are connected. The upper ends of the two pitch-changing positioning push plates one are connected to the pitch-changing slide plate one, and the upper ends of the two pitch-changing positioning push plates two are connected to the pitch-changing slide plate two. The two pitch-changing positioning push plates one and the two pitch-changing positioning push plates two are arranged in a one-to-one correspondence, and the pitch-changing positioning push plates one and the corresponding pitch-changing positioning push plates two form a set that can be relatively close to or far away from each other for positioning the silicon wafer on the silicon wafer support cylinder rod.

[0015] In one embodiment of the present invention, a method for operating a silicon wafer variable-pitch transmission stage includes the following steps:

[0016] The semi-finished silicon wafer feeding process consists of the following working units: a feeding basket elevator, a silicon wafer feeding extension mechanism, a feeding wafer centering mechanism, and a feeding variable pitch mechanism.

[0017] S1-1. Place the basket containing the semi-finished silicon wafers in the frame consisting of the vertical connecting plate, the bottom plate and the upper support plate. The basket contains a stack of semi-finished silicon wafers, and the semi-finished silicon wafers in the basket are evenly spaced apart.

[0018] S1-2, The silicon wafer feeding extension mechanism is working, pushing the conveyor drive device to drive the sliding seat to extend into the bottom of the basket of semi-finished silicon wafers, so that the starting end of the conveyor belt of the conveyor drive device is located below the lowest semi-finished silicon wafer in the basket of semi-finished silicon wafers.

[0019] S1-3, The feeding basket elevator is working. The feeding basket elevator drives the basket of semi-finished silicon wafers to descend, so that the bottom of the basket of semi-finished silicon wafers comes into contact with the conveyor belt of the conveyor drive device.

[0020] S1-4. The conveyor drive device starts, and the conveyor belt of the conveyor drive device moves the bottom half of the semi-finished silicon wafer out of the semi-finished silicon wafer basket.

[0021] S1-5. The semi-finished silicon wafers move horizontally along the conveyor belt of the conveyor drive device until they reach the position of the feeding and centering mechanism.

[0022] S1-6. The feeding and centering mechanism is in operation. Initially, the position of the two symmetrically arranged whole-piece fingers is adjusted by the whole-piece linear module so that the semi-finished silicon wafer is located between the two symmetrically arranged whole-piece fingers. When the semi-finished silicon wafer moves between the whole-piece guide rods, the whole-piece finger cylinder drives the two symmetrically arranged whole-piece fingers to move closer to each other, so that the whole-piece guide rods connected to the whole-piece fingers contact the semi-finished silicon wafer from both sides, adjusting the position of the semi-finished silicon wafer on the conveyor belt of the conveyor drive device.

[0023] S1-7. The conveyor belt of the conveyor drive device conveys the semi-finished silicon wafers to one side of the loading variable intercept mechanism, and the end of the conveyor belt of the conveyor drive device is located directly below the loading variable intercept mechanism.

[0024] S1-8, The feeding variable pitch mechanism is in operation. Initially, the variable pitch linear module drives the variable pitch gantry to the lowest point. At this time, the end of the conveyor belt of the conveying drive device is located above the silicon wafer support cylindrical rod at the top of the rectangular mounting plate.

[0025] S1-9. The semi-finished silicon wafer is conveyed to the end of the conveyor belt of the conveyor drive device. The variable pitch linear module drives the variable pitch gantry to rise, so that the silicon wafer support cylindrical rod contacts the semi-finished silicon wafer on the end of the conveyor belt of the conveyor drive device. Since the distance between the silicon wafer support cylindrical rods on both sides of the semi-finished silicon wafer is less than the width of the semi-finished silicon wafer, the silicon wafer support cylindrical rod lifts the semi-finished silicon wafer at the end of the conveyor belt of the conveyor drive device during the upward movement, so that the semi-finished silicon wafer is placed on the silicon wafer support cylindrical rod. The variable pitch linear module drives the variable pitch gantry to rise.

[0026] S1-10. Repeat steps S1-3 to S1-9 continuously until semi-finished silicon wafers are placed on several silicon wafer support cylinders. At this time, the semi-finished silicon wafers are stacked with a certain spacing on the feeding variable pitch mechanism.

[0027] S1-11. After the feeding variable pitch mechanism is filled with semi-finished silicon wafers, the silicon wafer variable pitch positioning component of the feeding variable pitch mechanism works. The piston rods of variable pitch positioning drive cylinder one and variable pitch positioning drive cylinder two extend and push variable pitch positioning push plate one and variable pitch positioning push plate two to move respectively, so that the relative variable pitch positioning push plate one and variable pitch positioning push plate two move closer to each other, and adjust the semi-finished silicon wafers on the silicon wafer support cylindrical rod into a neat row.

[0028] S1-12. The robotic arm removes a stack of semi-finished silicon wafers from the loading variable pitch mechanism, thereby completing the loading action of the semi-finished silicon wafers.

[0029] The finished silicon wafer unloading process consists of the following working units: unloading variable pitch mechanism, silicon wafer unloading extension mechanism, unloading whole wafer centering mechanism, and unloading basket elevator.

[0030] S2-1. The robotic arm places the finished silicon wafers into the feeding variable pitch mechanism. The silicon wafer variable pitch positioning component of the feeding variable pitch mechanism works, and the piston rods of variable pitch positioning drive cylinder one and variable pitch positioning drive cylinder two extend, respectively pushing variable pitch positioning push plate one and variable pitch positioning push plate two to move, thereby forming relative variable pitch positioning push plate one and variable pitch positioning push plate two to move closer to each other, adjusting the finished silicon wafers on the silicon wafer support cylindrical rod into a neat row.

[0031] S2-2 Initially, the variable pitch linear module drives the variable pitch gantry to the highest position. At this time, the finished silicon wafer at the bottom of the several silicon wafer support cylindrical rods is located above the starting end of the conveyor belt of the conveyor drive device.

[0032] S2-3, The variable pitch linear module drives the variable pitch gantry to descend, so that the finished silicon wafer at the bottom of several silicon wafer support cylindrical rods comes into contact with the conveyor belt of the conveyor drive device.

[0033] S2-4. The conveyor belt of the conveyor drive device drives the finished silicon wafers at the bottom of several silicon wafer support cylinders to move out of the variable pitch gantry.

[0034] S2-5, The conveyor belt of the conveyor drive device moves the finished silicon wafer to the position of the unloading and centering mechanism;

[0035] S2-6. The wafer centering mechanism operates as follows: Initially, the position of the two symmetrically arranged wafer fingers is adjusted by the wafer linear module so that the finished silicon wafer is located between the two symmetrically arranged wafer fingers. When the finished silicon wafer moves between the wafer guide rods, the wafer finger cylinder drives the two symmetrically arranged wafer fingers to move closer to each other, so that the wafer guide rods connected to the wafer fingers contact the finished silicon wafer from both sides, adjusting the position of the finished silicon wafer on the conveyor belt of the conveyor drive device.

[0036] S2-7. The conveyor belt of the conveyor drive device moves the finished silicon wafer to the bottom of the unloading basket elevator. At this time, the frame composed of the vertical connecting plate, the bottom plate and the upper support plate of the linear module is at the lowest point, that is, the finished basket is at the lowest point.

[0037] S2-8, The material feeding basket elevator is working. The linear module 1 drives the finished product basket to move upward. During the upward movement of the finished product basket, it takes away the finished silicon wafers at the end of the conveyor belt of the conveyor drive device. The linear module 1 drives the finished product basket to move upward.

[0038] S2-9. Repeat steps S2-2 to S2-7 continuously to transfer the finished silicon wafers one by one from the feeding variable pitch mechanism to the feeding basket elevator.

[0039] The technical solution of the present invention has the following advantages compared with the prior art:

[0040] The silicon wafer variable-pitch transmission worktable and its working method described in this invention are applicable to processes such as tube forming, texturing, and etching in the photovoltaic industry. This worktable can automatically load semi-finished silicon wafers and automatically unload finished silicon wafers after processing. It is divided into two independent working units. This worktable realizes fully automatic loading and unloading of semi-finished and finished silicon wafers, which greatly improves production efficiency, reduces the labor intensity of workers, avoids the problem of high silicon wafer breakage rate caused by manual loading and unloading, and reduces production costs. Attached Figure Description

[0041] To make the content of this invention easier to understand, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings, wherein...

[0042] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer variable-pitch transmission stage of the present invention;

[0043] Figure 2 This is a schematic diagram of the silicon wafer variable-pitch transmission stage of the present invention;

[0044] Figure 3 This is a partial structural schematic diagram of the silicon wafer variable-pitch transmission stage of the present invention;

[0045] Figure 4 This is a top view of the silicon wafer variable-pitch transmission stage of the present invention;

[0046] Figure 5 This is a structural schematic diagram of the loading basket elevator or unloading basket elevator of the present invention;

[0047] Figure 6 This is a schematic diagram of the structure of the lower basket clamping assembly of the present invention;

[0048] Figure 7 This is a schematic diagram of the overall structure of the silicon wafer feeding and extension mechanism of the present invention;

[0049] Figure 8 This is a schematic diagram of the silicon wafer feeding and extension mechanism of the present invention;

[0050] Figure 9 This is a partial structural diagram of the silicon wafer feeding and extending mechanism of the present invention. Figure 1 ;

[0051] Figure 10 This is a partial structural diagram of the silicon wafer feeding and extending mechanism of the present invention. Figure 2 ;

[0052] Figure 11 This is a partial structural diagram of the silicon wafer feeding and extending mechanism of the present invention. Figure 3 ;

[0053] Figure 12 This is a schematic diagram of the feeding and centering mechanism of the present invention;

[0054] Figure 13 This is a schematic diagram of the structure of the semi-finished silicon wafer sorting assembly of the present invention;

[0055] Figure 14 This is a schematic diagram of the overall structure of the variable intercept feeding mechanism of the present invention;

[0056] Figure 15 This is a partial structural diagram of the variable intercept feeding mechanism of the present invention. Figure 1 ;

[0057] Figure 16 This is a partial structural diagram of the variable intercept feeding mechanism of the present invention. Figure 2 ;

[0058] Figure 17 This is a partial structural diagram of the variable intercept feeding mechanism of the present invention. Figure 3 .

[0059] Explanation of reference numerals in the accompanying drawings: 1. Workbench frame; 2. Feed basket elevator; 3. Linear module 1; 4. Vertical connecting plate; 5. Lower base plate; 6. Upper support plate; 7. Lower basket clamping assembly; 8. Clamping drive cylinder; 9. Rotary shaft support seat; 10. Rotary shaft; 11. Clamping gripper; 22. Push rod; 33. Push plate; 4. Upper basket positioning assembly; 5. Upper positioning drive cylinder; 6. Upper positioning head; 7. Silicon wafer feeding extension mechanism; 8. Mounting base; 9. Mounting base plate. Linear guide rail 3111, motor mounting plate 3112, front support plate 312, rear support plate 313, drive device 32, drive motor 321, drive shaft 322, transmission device 323, transmission device assembly 324, drive wheel 3241, several transmission wheels 3242, fixed driven wheel 3243, movable driven wheel 3244, transmission belt 3245, battery cell picking plate 33, sliding block 34, connecting plate 341, vertical slide plate 342, slider 3421 1. Horizontal support plate 343, Capacitive sensor 3431, Guide wheel 344, Push-in drive device 35, Wafer loading and centering mechanism 4, Wafer support frame 41, Wafer linear module 42, Wafer finger cylinder 43, Wafer finger 44, Wafer guide rod 45, Wafer loading variable pitch mechanism 5, Variable pitch linear module 51, Variable pitch gantry 52, Wafer variable pitch placement assembly 53, Rectangular mounting plate 531, Wafer support cylindrical rod 532, Wafer variable pitch positioning assembly 54, Variable pitch positioning drive cylinder 541. Variable pitch slide plate 1; 542. Variable pitch positioning push plate 1; 543. Variable pitch positioning drive cylinder 2; 544. Variable pitch slide plate 2; 545. Variable pitch positioning push plate 2; 546. Unloading variable pitch mechanism; 6. Silicon wafer unloading extension mechanism; 7. Unloading whole wafer centering mechanism; 8. Unloading basket elevator; 9. Basket; 100. Positioning hole; 101. Semi-finished silicon wafer sorting assembly; 20. Sorting support frame; 201. Sorting drive cylinder; 202. Sorting push plate; 203. Robot arm; 300. Silicon wafer placement fixture; 400. Detailed Implementation

[0060] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments described are not intended to limit the present invention.

[0061] Reference Figure 1-4As shown, the silicon wafer variable-pitch transfer worktable and its working method of the present invention include: a worktable frame 1, a loading basket elevator 2, a silicon wafer loading extension mechanism 3, a loading and centering mechanism 4, a loading variable-pitch mechanism 5, a unloading variable-pitch mechanism 6, a silicon wafer unloading extension mechanism 7, an unloading and centering mechanism 8, and an unloading basket elevator 9; the loading basket elevator 2, the silicon wafer loading extension mechanism 3, the loading and centering mechanism 4, and the loading variable-pitch mechanism 5 constitute the loading part of the semi-finished silicon wafer, which is used for loading the semi-finished silicon wafer; the unloading variable-pitch mechanism 6, the silicon wafer unloading extension mechanism 7, the unloading and centering mechanism 8, and the unloading basket elevator 9 constitute the loading part of the semi-finished silicon wafer; The elevator 9 constitutes the unloading section for finished silicon wafers. This section is used for unloading finished silicon wafers. Between the loading unit and the unloading unit, a robotic arm unloads semi-finished silicon wafers to the process area. From the process area, finished silicon wafers that have completed the process are transported to the unloading unit. The loading direction and the unloading direction are opposite, so the loading basket elevator 2, silicon wafer loading extension mechanism 3, loading whole wafer centering mechanism 4, loading variable pitch mechanism 5, unloading variable pitch mechanism 6, silicon wafer unloading extension mechanism 7, unloading whole wafer centering mechanism 8 and unloading basket elevator 9 can be reasonably set up on the workbench frame 1 to maximize the use of space and meet the needs of loading and unloading at the same time.

[0062] Specifically, the system comprises: a workbench frame 1, serving as the overall support structure; a loading basket elevator 2, mounted on the workbench frame 1, containing a silicon wafer storage basket; a silicon wafer loading extension mechanism 3, mounted on the workbench frame 1, used to remove semi-finished silicon wafers from the bottom of the silicon wafer storage basket; a loading wafer centering mechanism 4, mounted on the silicon wafer loading extension mechanism 3, used to adjust the position of the semi-finished silicon wafers on the silicon wafer loading extension mechanism 3; and a loading variable-intercept mechanism 5, mounted on the workbench frame 1. The loading variable-intercept mechanism 5, the loading basket elevator 2, and the silicon wafer loading extension mechanism 3 are all on the same straight line, with the loading variable-intercept mechanism 5 and the loading basket elevator 2 located at opposite ends of the conveying direction of the silicon wafer loading extension mechanism 3. The semi-finished silicon wafers on the silicon wafer loading extension mechanism 3 are conveyed to the loading variable-intercept mechanism 5, where a robotic arm grasps them. The semi-finished silicon wafers in the loading variable-intercept mechanism 5 are fed into the graphite boat; the unloading variable-intercept mechanism 6, which is set on the workbench frame 1, is used by a robot to grab the finished silicon wafers in the graphite boat and feed them into the unloading variable-intercept mechanism 6; the silicon wafer unloading extension mechanism 7, which is set on the workbench frame 1, is used to remove the finished silicon wafers at the bottom of the unloading variable-intercept mechanism 6; the unloading whole-wafer centering mechanism 8, which is set on the silicon wafer unloading extension mechanism 7, is used to adjust the position of the finished silicon wafers on the silicon wafer unloading extension mechanism 7; the unloading basket elevator 9, which is set on the workbench frame 1, is located on a straight line with the unloading variable-intercept mechanism 6, the silicon wafer unloading extension mechanism 7, and the unloading basket elevator 9, which are located at opposite ends of the conveying direction of the silicon wafer unloading extension mechanism 7, and the finished silicon wafers on the silicon wafer unloading extension mechanism 7 are conveyed into the basket of the unloading basket elevator 9.

[0063] Reference Figure 5As shown, the loading basket elevator 2 and the unloading basket elevator 9 have the same structure. Both the loading basket elevator 2 and the unloading basket elevator 9 include a linear module 21, a vertical connecting plate 22, a lower base plate 23, an upper support plate 24, a lower basket pressing assembly 25, and an upper basket positioning assembly 26. The linear module 21 is fixedly mounted on the workbench frame 1, and the moving direction of the linear module 21 is vertical. The vertical connecting plate 22 is connected to the slider of the linear module 21. The support plate 24 and the lower base plate 23 are respectively connected to the upper and lower ends of the vertical connecting plate 22, and the upper support plate 24, the lower base plate 23 and the vertical connecting plate 22 are arranged in a "U" shape. The lower basket pressing component 25 is arranged on the lower base plate 23, and the upper basket positioning component 26 is arranged on the upper support plate 24. The upper support plate 24, the lower base plate 23 and the vertical connecting plate 22 are provided with silicon wafer storage baskets. The lower basket pressing component 25 and the upper basket positioning component 26 respectively position the silicon wafer storage baskets.

[0064] Reference Figure 6 As shown, the lower basket clamping assembly 25 includes a clamping drive cylinder 251, a rotating shaft support 252, a rotating shaft 253, clamping jaws 254, a push rod 255, and a push plate 256. The clamping drive cylinder 251 and the rotating shaft support 252 are both fixedly mounted on the lower base plate 23. The rotating shaft support 252 consists of two symmetrically arranged pieces. Both ends of the rotating shaft 253 are mounted on the rotating shaft support 252. The clamping jaws 254 are sleeved on the rotating shaft 253. There are two symmetrical clamping jaws 254, and a push rod 255 is arranged between the two clamping jaws 254. One end of the push plate 256 is connected to the piston rod of the clamping drive cylinder 251, and the other end of the push plate 256 is rotatably connected to the push rod 255. The clamping jaws 254 are clamped onto the lower end of the silicon wafer storage basket.

[0065] In the above structure, the upper flower basket positioning component 26 includes an upper positioning drive cylinder 261 and an upper positioning head 262. The upper positioning drive cylinder 261 is fixedly mounted on the upper support plate 24. The upper positioning head 262 is connected to the upper positioning drive cylinder 261. The lower end of the upper positioning head 262 is tapered. The top of the silicon wafer storage flower basket is provided with a positioning hole 101. The upper positioning drive cylinder 261 drives the upper positioning head 262 to extend into the positioning hole 101.

[0066] Reference Figure 7-11As shown, the silicon wafer loading extension mechanism 3 and the silicon wafer unloading extension mechanism 7 have the same structure. The silicon wafer loading extension mechanism 3 and the silicon wafer unloading extension mechanism 7 include: a mounting base 31, which serves as a support structure for the transmission mechanism and is connected to the workbench frame 1; a conveying drive device 32, which is mounted on the mounting base 31; a sliding seat 34, which is slidably connected to the mounting base 31 and is connected to the sliding seat 34; and a pushing conveying drive device 35, which is mounted on the mounting base 31 and is connected to the sliding seat 34. The pushing conveying drive device 35 drives the sliding seat 34 to move closer to or away from the basket. Depending on the application, the pushing conveying drive device 35 can be a cylinder, a hydraulic cylinder, or an electric cylinder.

[0067] The mounting base 31 can be installed on the ground or on the required equipment. Pushing in the conveying drive device 35 pushes the sliding seat 34 towards the silicon wafer basket. Then the conveying drive device 32 moves to the bottom of the silicon wafer basket, and the silicon wafer is placed on the conveying drive device 32. The conveying drive device 32 drives in reverse, so that the conveying drive device 32 conveys the silicon wafer.

[0068] In the above structure, the mounting base 31 includes a mounting base plate 311, two symmetrically arranged front support plates 312, and two symmetrically arranged rear support plates 313. The two symmetrically arranged front support plates 312 and two symmetrically arranged rear support plates 313 are all mounted on the mounting base plate 311, and are located at the four corners of a rectangle. One front support plate 312 and one rear support plate 313 form a group, and are arranged in a straight line. The two symmetrically arranged front support plates 312 and two symmetrically arranged rear support plates 313 constitute the support structure for the transmission part of the conveying drive device 32.

[0069] In the above structure, the conveying drive device 32 includes a drive motor 321, a drive shaft 322, and two symmetrically arranged transmission devices 323. The drive motor 321 is mounted on the mounting base plate 311, and the shaft of the drive motor 321 is connected to the drive shaft 322. The two symmetrically arranged transmission devices 323 are both connected to the drive shaft 322. The drive motor 321 drives the drive shaft 322 to rotate, and the drive shaft 322 synchronously drives the two symmetrically arranged transmission devices 323. The transmission devices 323 are mounted on a support structure composed of a front support plate 312 and a rear support plate 313. The transmission device 323 comprises two symmetrically arranged transmission device assemblies 324. Each transmission device assembly 324 includes a drive wheel 3241, several drive wheels 3242, a fixed driven wheel 3243, a movable driven wheel 3244, and a transmission belt 3245. The drive wheel 3241 is mounted on the drive shaft 322. The drive wheel 3241 and several drive wheels 3242 are mounted on the side wall of the rear support plate 313. The fixed driven wheel 3243 is mounted on the side wall of the front support plate 312. The movable driven wheel 3244 is mounted on the sliding seat 34. The transmission belt 3245 is mounted on the drive wheel 3241, several drive wheels 3242, the fixed driven wheel 3243, and the movable driven wheel 3244. Since the movable driven wheel 3244 is mounted on the sliding seat 34, when the push-in conveying drive device 35 pushes the sliding seat 34 to move, the movable driven wheel 3244 moves with the sliding seat 34, and the movable driven wheel 3244 moves in the same way as a movable pulley.

[0070] In the above structure, the sliding seat 34 includes a connecting plate 341 and two symmetrically arranged vertical sliding plates 342. The lower ends of the two symmetrically arranged vertical sliding plates 342 are connected to the ends of the connecting plate 341 along its length, and the connecting plate 341 and the two symmetrically arranged vertical sliding plates 342 form a "U" shape. The pushing and conveying drive device 35 is connected to the connecting plate 341. The movable driven wheel 3244 is disposed on the side wall of the vertical sliding plate 342, and the vertical sliding plate 342 is located between two symmetrically arranged transmission device assemblies 324. The pushing and conveying drive device 35 acts as a power structure to drive the connecting plate 341 to move. Since the two symmetrically arranged vertical sliding plates 342 are connected to the connecting plate 341, the two symmetrically arranged vertical sliding plates 342 move together, driving the movable driven wheel 3244 to move together.

[0071] In the above structure, a horizontal support plate 343 is connected to the upper end of the vertical slide plate 342. One end of the horizontal support plate 343 is connected to the vertical slide plate 342, and the other end of the horizontal support plate 343 is provided with a guide wheel 344. The transmission belt 3245 passes around the guide wheel 344 and contacts the upper and lower end faces of the horizontal support plate 343. During the process of the push-in conveying drive device 35 driving the sliding seat 34 to move, the horizontal support plate 343 can extend or retract. The horizontal support plate 343 is a rectangular flat plate, and the upper end face of the horizontal support plate 343 is provided with a groove. A capacitive sensor 3431 is installed in the groove. The capacitive sensor 3431 is used to sense whether there is a silicon wafer on the transmission belt 3245.

[0072] In the above structure, a slider 3421 is connected to the lower end of the vertical slide plate 342. Two parallel linear guide rails 3111 are provided on the mounting base plate 311, and the linear guide rails 3111 are arranged along the conveying direction of the transmission belt 3245. During the horizontal movement of the vertical slide plate 342, the slider 3421 slides along the linear guide rails 3111.

[0073] In addition, a motor mounting plate 3112 is provided on the mounting base plate 311, and the drive motor 321 is mounted on the motor mounting plate 3112.

[0074] Reference Figure 12 As shown, the loading and unloading wafer centering mechanism 4 and the unloading wafer centering mechanism 8 have the same structure. Both the loading and unloading wafer centering mechanism 4 and the unloading wafer centering mechanism 8 include a wafer support frame 41, a wafer linear module 42, a wafer finger cylinder 43, and two symmetrically arranged wafer fingers 44. The wafer support frame 41 is fixedly mounted on the mounting base 31. The wafer linear module 42 is mounted on the top plate of the wafer support frame 41 and is suspended above the conveying drive device 32. The wafer finger cylinder 43 is connected to the slider of the wafer linear module 42. The two symmetrically arranged wafer fingers 44 are connected to the wafer finger cylinder 43. A wafer guide rod 45 is connected to the wafer finger 44. The wafer guide rod 45 is cylindrical and has a silicone sleeve at its lower end. The wafer guide rod 45 contacts the edge of the finished or semi-finished silicon wafer on the wafer loading extension mechanism 3 and the wafer unloading extension mechanism 7.

[0075] Reference Figure 14-17As shown, the loading variable intercept mechanism 5 and the unloading variable intercept mechanism 6 have the same structure. Both the loading variable intercept mechanism 5 and the unloading variable intercept mechanism 6 include a variable pitch linear module 51, a variable pitch gantry 52, a silicon wafer variable pitch placement assembly 53, and a silicon wafer variable pitch positioning assembly 54. The variable pitch linear module 51 is fixedly mounted on the workbench frame 1 and is arranged vertically. The variable pitch gantry 52 is connected to the variable pitch linear module 51. The silicon wafer variable pitch placement assembly 53 and the silicon wafer variable pitch positioning assembly 54 are mounted on the variable pitch gantry 52. ​​The silicon wafer variable pitch placement assembly 53 has silicon wafers on it, and the silicon wafer variable pitch positioning assembly 54 is used to position the silicon wafers on the silicon wafer variable pitch placement assembly 53. The silicon wafer pitch-changing placement assembly 53 includes four rectangular mounting plates 531, which are located at the four corners of the rectangular cross-section. A plurality of silicon wafer support cylindrical rods 532 are arranged vertically on each of the rectangular mounting plates 531, with the cylindrical rods 532 spaced evenly apart. The silicon wafers are placed on the silicon wafer support cylindrical rods 532 located on the same horizontal plane. The silicon wafer pitch-changing positioning assembly 54 includes a pitch-changing positioning drive cylinder 541, a pitch-changing slide plate 542, two pitch-changing positioning push plates 543, a pitch-changing positioning drive cylinder 544, a pitch-changing slide plate 545, and two pitch-changing positioning push plates 546. The pitch-changing positioning drive cylinders 541 and 544 are fixedly mounted on the pitch-changing gantry frame 52. The pitch-changing slide plate 542 is connected to the piston rod of the pitch-changing positioning drive cylinder 541, and the pitch-changing slide plate 545 is connected to the piston rod of the pitch-changing gantry frame 52. The piston rod of the second position drive cylinder 544 is connected. The upper ends of the two variable pitch positioning push plates 543 are connected to the variable pitch sliding plate 542. The upper ends of the two variable pitch positioning push plates 546 are connected to the variable pitch sliding plate 545. The two variable pitch positioning push plates 543 and 546 are arranged in a one-to-one correspondence. The variable pitch positioning push plates 543 and 546 form a set that can be relatively close to or far away from each other for positioning the silicon wafer on the silicon wafer support cylindrical rod 532.

[0076] Reference Figure 13As shown, the workbench frame 1 is also equipped with a semi-finished silicon wafer sorting assembly 20. The semi-finished silicon wafer sorting assembly 20 is located on the side where the semi-finished silicon wafers enter the feeding variable pitch mechanism 5. When the transmission belt 3245 feeds the semi-finished silicon wafers into the feeding variable pitch mechanism 5 in sequence, after the feeding variable pitch mechanism 5 is full of semi-finished silicon wafers, because the transmission belt 3245 feeds the semi-finished silicon wafers onto the silicon wafer support cylindrical rod 532, the semi-finished silicon wafers cannot be guaranteed to be in the same position on the silicon wafer support cylindrical rod 532. Therefore, the semi-finished silicon wafers placed on the silicon wafer support cylindrical rod 532 are not completely aligned. After the silicon wafers are processed, the semi-finished silicon wafer sorting assembly 20 operates. The semi-finished silicon wafer sorting assembly 20 includes a sorting support frame 201, a sorting drive cylinder 202, and a sorting push plate 203. The sorting support frame 201 is fixedly mounted on the workbench frame 1, and the sorting drive cylinder 202 is fixedly mounted on the sorting support frame 201. The sorting push plate 203 is connected to the piston rod of the sorting drive cylinder 202. The sorting push plate 203 is a rectangular flat plate and is perpendicular to the semi-finished silicon wafers on the silicon wafer support cylindrical rod 532. During operation, the piston rod of the wafer-arranging drive cylinder 202 extends, driving the wafer-arranging push plate 203 to move towards the silicon wafer support cylindrical rod 532. The wafer-arranging drive cylinder 202 drives the wafer-arranging push plate 203 and the semi-finished silicon wafers on the silicon wafer support cylindrical rod 532 to move, thereby pushing the semi-finished silicon wafers arranged sequentially from top to bottom on the silicon wafer support cylindrical rod 532 neatly.

[0077] For the semi-finished silicon wafers on the silicon wafer support cylinder 532, the long side of the rectangular thin-film semi-finished silicon wafers is pushed and arranged by the variable pitch positioning push plate 1 543 and the corresponding variable pitch positioning push plate 2 546, and the short side of the semi-finished silicon wafers is pushed and arranged by the wafer sorting push plate 203, so that the semi-finished silicon wafers on the silicon wafer support cylinder 532 are arranged neatly.

[0078] The silicon wafer variable-pitch transmission stage and its operating method of the present invention include the following steps:

[0079] The semi-finished silicon wafer feeding process consists of the following working units: 2. Feeding basket elevator; 3. Silicon wafer feeding extension mechanism; 4. Feeding whole wafer centering mechanism; and 5. Feeding variable pitch mechanism.

[0080] S1-1. Place the basket containing the semi-finished silicon wafers in the frame formed by the vertical connecting plate 22, the lower base plate 23 and the upper support plate 24. The basket contains a stack of semi-finished silicon wafers, and the semi-finished silicon wafers in the basket are evenly separated.

[0081] S1-2, the silicon wafer feeding extension mechanism 3 is working, pushing the conveyor drive device 35 to drive the sliding seat 34 to extend into the bottom of the basket of semi-finished silicon wafers, so that the starting end of the conveyor belt of the conveyor drive device 32 is located below the lowest semi-finished silicon wafer in the basket of semi-finished silicon wafers.

[0082] S1-3, The feeding basket elevator 2 is working. The feeding basket elevator 2 drives the basket of semi-finished silicon wafers to descend, so that the bottom half of the basket of semi-finished silicon wafers comes into contact with the conveyor belt of the conveyor drive device 32.

[0083] S1-4, The conveyor drive device 32 is started, and the conveyor belt of the conveyor drive device 32 drives the bottom half of the semi-finished silicon wafer basket to move out of the semi-finished silicon wafer basket.

[0084] S1-5. The semi-finished silicon wafers move horizontally along the conveyor belt of the conveyor drive device 32 until they reach the position of the feeding and centering mechanism 4.

[0085] S1-6. The feeding and centering mechanism 4 operates. Initially, the positions of the two symmetrically arranged wafer fingers 44 are adjusted by the wafer linear module 42 so that the semi-finished silicon wafer is located between the two symmetrically arranged wafer fingers 44. When the semi-finished silicon wafer moves between the wafer guide rods 45, the wafer finger cylinder 43 drives the two symmetrically arranged wafer fingers 44 to move closer to each other, so that the wafer guide rods 45 connected to the wafer fingers 44 contact the semi-finished silicon wafer from both sides, adjusting the position of the semi-finished silicon wafer on the conveyor belt of the conveyor drive device 32.

[0086] S1-7. The conveyor belt of the conveyor drive device 32 conveys the semi-finished silicon wafers to one side of the loading variable pitch mechanism 5, and the end of the conveyor belt of the conveyor drive device 32 is located directly below the loading variable pitch mechanism 5.

[0087] S1-8, the feeding variable pitch mechanism 5 is working. Initially, the variable pitch linear module 51 drives the variable pitch gantry 52 to the lowest point position. At this time, the end of the conveyor belt of the conveying drive device 32 is located above the silicon wafer support cylindrical rod 532 at the top of the rectangular mounting plate 531.

[0088] S1-9. The semi-finished silicon wafer is conveyed to the end of the conveyor belt of the conveyor drive device 32. The variable pitch linear module 51 drives the variable pitch gantry 52 to rise, so that the silicon wafer support cylindrical rod 532 contacts the semi-finished silicon wafer at the end of the conveyor belt of the conveyor drive device 32. Since the distance between the silicon wafer support cylindrical rods 532 on both sides of the semi-finished silicon wafer is less than the width of the semi-finished silicon wafer, the silicon wafer support cylindrical rod 532 lifts the semi-finished silicon wafer at the end of the conveyor belt of the conveyor drive device 32 during the upward movement, so that the semi-finished silicon wafer is placed on the silicon wafer support cylindrical rod 532. The variable pitch linear module 51 drives the variable pitch gantry 52 to rise.

[0089] S1-10. Repeat steps S1-3 to S1-9 continuously until semi-finished silicon wafers are placed on several silicon wafer support cylindrical rods 532. At this time, the semi-finished silicon wafers are stacked with a certain spacing on the feeding variable pitch mechanism 5.

[0090] S1-11. After the feeding variable pitch mechanism 5 is filled with semi-finished silicon wafers, the silicon wafer variable pitch positioning component 54 of the feeding variable pitch mechanism 5 works. The piston rods of variable pitch positioning drive cylinder one 541 and variable pitch positioning drive cylinder two 544 extend and push variable pitch positioning push plate one 543 and variable pitch positioning push plate two 546 to move respectively, thereby forming relative variable pitch positioning push plate one 543 and variable pitch positioning push plate two 546 to move closer to each other, adjusting the semi-finished silicon wafers on the silicon wafer support cylindrical rod 532 into a neat row.

[0091] S1-12, The robotic arm removes a stack of semi-finished silicon wafers from the loading variable pitch mechanism 5, thereby completing the loading action of the semi-finished silicon wafers.

[0092] The finished silicon wafer unloading process consists of the following working units: unloading variable cutoff mechanism 6, silicon wafer unloading extension mechanism 7, unloading whole wafer centering mechanism 8, and unloading basket elevator 9.

[0093] S2-1. The robotic arm places the finished silicon wafer into the feeding variable pitch mechanism 6. The silicon wafer variable pitch positioning component 54 of the feeding variable pitch mechanism 6 works. The piston rods of the variable pitch positioning drive cylinder 1 541 and the variable pitch positioning drive cylinder 2 544 extend and push the variable pitch positioning push plate 1 543 and the variable pitch positioning push plate 2 546 to move respectively, thereby forming the relative variable pitch positioning push plate 1 543 and the variable pitch positioning push plate 2 546 to move closer to each other, and adjusting the finished silicon wafers on the silicon wafer support cylindrical rod 532 into a neat row.

[0094] S2-2 Initially, the variable pitch linear module 51 drives the variable pitch gantry 52 to the highest position. At this time, the finished silicon wafer at the bottom of the several silicon wafer support cylindrical rods 532 is located above the starting end of the conveyor belt of the conveyor drive device 32.

[0095] S2-3, the variable pitch linear module 51 drives the variable pitch gantry 52 to descend, so that the finished silicon wafer at the bottom of the silicon wafer support cylindrical rod 532 comes into contact with the conveyor belt of the conveyor drive device 32.

[0096] S2-4, The conveyor belt of the conveyor drive device 32 drives the finished silicon wafers at the bottom of the silicon wafer support cylindrical rods 532 to move out of the variable pitch gantry frame 52.

[0097] S2-5, The conveyor belt of the conveyor drive device 32 drives the finished silicon wafer to the position of the unloading and centering mechanism 8;

[0098] S2-6, The wafer centering mechanism 8 operates. Initially, the positions of the two symmetrically arranged wafer fingers 44 are adjusted by the wafer linear module 42 so that the finished silicon wafer is located between the two symmetrically arranged wafer fingers 44. When the finished silicon wafer moves between the wafer guide rods 45, the wafer finger cylinder 43 drives the two symmetrically arranged wafer fingers 44 to move closer to each other, so that the wafer guide rods 45 connected to the wafer fingers 44 contact the finished silicon wafer from both sides, adjusting the position of the finished silicon wafer on the conveyor belt of the conveyor drive device 32.

[0099] S2-7, The conveyor belt of the conveyor drive device 32 drives the finished silicon wafer to move directly below the unloading basket elevator 9. At this time, the frame composed of the vertical connecting plate 22, the lower bottom plate 23 and the upper support plate 24 driven by the linear module 1 21 is at the low point position, that is, the finished basket is at the low point position.

[0100] S2-8, the material feeding basket elevator 9 is working, the linear module 21 drives the finished product basket to move upward, and during the upward movement of the finished product basket, it takes away the finished silicon wafers at the end of the conveyor belt of the conveyor drive device 32. The linear module 21 drives the finished product basket to move upward.

[0101] S2-9. Repeat steps S2-2 to S2-7 continuously to transfer the finished silicon wafers in the feeding variable pitch mechanism 6 one by one to the feeding basket elevator 9.

[0102] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A silicon wafer variable-pitch transmission stage, characterized in that, include: The workbench frame serves as the overall supporting structure. A loading basket elevator is installed on a workbench frame, and the loading basket elevator is equipped with a silicon wafer storage basket; A silicon wafer feeding extension mechanism is set on the workbench frame, and the silicon wafer feeding extension mechanism is used to remove the semi-finished silicon wafers from the bottom of the silicon wafer storage basket; A wafer feeding and centering mechanism is provided on the wafer feeding and extension mechanism, and the wafer feeding and centering mechanism is used to adjust the position of the semi-finished silicon wafer on the wafer feeding and extension mechanism; A variable-cutoff-pitch feeding mechanism is set on the workbench frame. The variable-cutoff-pitch feeding mechanism, the basket elevator, and the silicon wafer feeding extension mechanism are on the same straight line. The variable-cutoff-pitch feeding mechanism and the basket elevator are located at opposite ends of the conveying direction of the silicon wafer feeding extension mechanism. The semi-finished silicon wafers on the silicon wafer feeding extension mechanism are conveyed to the variable-cutoff-pitch feeding mechanism. The robot arm grabs the semi-finished silicon wafers in the variable-cutoff-pitch feeding mechanism and puts them into the graphite boat. A variable-cutoff-pitch feeding mechanism is set on the workbench frame. A robotic arm picks up finished silicon wafers from a graphite boat and feeds them to the variable-cutoff-pitch feeding mechanism. A silicon wafer unloading extension mechanism is mounted on the workbench frame, and the silicon wafer unloading extension mechanism is used to remove the finished silicon wafer from the bottom of the unloading variable pitch mechanism; A wafer unloading and centering mechanism is provided on the wafer unloading and extension mechanism, and the wafer unloading and centering mechanism is used to adjust the position of the finished silicon wafer on the wafer unloading and extension mechanism; The material feeding basket elevator is set on the workbench frame. The material feeding variable intercept mechanism, the silicon wafer feeding extension mechanism and the material feeding basket elevator are in a straight line. The material feeding variable intercept mechanism and the material feeding basket elevator are located at opposite ends of the conveying direction of the silicon wafer feeding extension mechanism. The finished silicon wafers on the silicon wafer feeding extension mechanism are conveyed to the basket of the material feeding basket elevator.

2. The silicon wafer variable-pitch transfer stage according to claim 1, characterized in that: The loading and unloading basket elevators have the same structure. Both include a linear module, a vertical connecting plate, a lower base plate, an upper support plate, a lower basket pressing assembly, and an upper basket positioning assembly. The linear module is fixedly mounted on the workbench frame, and its movement direction is vertical. The vertical connecting plate is connected to the slider of the linear module. The upper support plate and the lower base plate are respectively connected to the upper and lower ends of the vertical connecting plate, and the upper support plate, lower base plate, and vertical connecting plate are arranged in a "U" shape. The lower basket pressing assembly is mounted on the lower base plate, and the upper basket positioning assembly is mounted on the upper support plate. Silicon wafer storage baskets are provided inside the upper support plate, lower base plate, and vertical connecting plate. The lower basket pressing assembly and upper basket positioning assembly respectively position the silicon wafer storage baskets.

3. The silicon wafer variable-pitch transfer stage according to claim 2, characterized in that: The lower basket clamping assembly includes a clamping drive cylinder, a rotating shaft support, a rotating shaft, clamping jaws, a push rod, and a push plate. The clamping drive cylinder and the rotating shaft support are both fixedly mounted on the lower base plate. The rotating shaft support consists of two symmetrically arranged pieces. Both ends of the rotating shaft are mounted on the rotating shaft support. The clamping jaws are sleeved on the rotating shaft. There are two symmetrical clamping jaws, and a push rod is arranged between the two clamping jaws. One end of the push plate is connected to the piston rod of the clamping drive cylinder, and the other end of the push plate is rotatably connected to the push rod. The clamping jaws clamp onto the lower end of the silicon wafer storage basket.

4. The silicon wafer variable-pitch transfer stage according to claim 2, characterized in that: The upper flower basket positioning assembly includes an upper positioning drive cylinder and an upper positioning head. The upper positioning drive cylinder is fixedly mounted on the upper support plate. The upper positioning head is connected to the upper positioning drive cylinder. The lower end of the upper positioning head is tapered. The top of the silicon wafer storage flower basket is provided with a positioning hole. The upper positioning drive cylinder drives the upper positioning head to extend into the positioning hole.

5. The silicon wafer variable-pitch transfer stage according to claim 1, characterized in that: The silicon wafer loading and unloading mechanisms have the same structure. Each mechanism includes: a mounting base serving as a support structure for the transmission mechanism, and the mounting base is connected to the workbench frame; a conveying drive device mounted on the mounting base; a sliding pusher seat slidably connected to the mounting base, and the conveying drive device is connected to the sliding pusher seat; and a pushing-in conveying drive device mounted on the mounting base, and the pushing-in conveying drive device is connected to the sliding pusher seat, which drives the sliding pusher seat to move closer to or further away from the basket.

6. The silicon wafer variable-pitch transfer stage according to claim 5, characterized in that: The loading and unloading wafer centering mechanisms have the same structure. Both mechanisms include a wafer support frame, a wafer linear module, a wafer finger cylinder, and two symmetrically arranged wafer fingers. The wafer support frame is fixedly mounted on a mounting base. The wafer linear module is mounted on the top plate of the wafer support frame and suspended above the conveying drive device. The wafer finger cylinder is connected to the slider of the wafer linear module. The two symmetrically arranged wafer fingers are connected to the wafer finger cylinder. A wafer guide rod is connected to each wafer finger. The wafer guide rod is cylindrical and has a silicone sleeve at its lower end. The wafer guide rod contacts the edge of the finished or semi-finished silicon wafer on the wafer loading and unloading extension mechanisms.

7. The silicon wafer variable-pitch transfer stage according to claim 1, characterized in that: The loading and unloading variable-intercept mechanism have the same structure. Both the loading and unloading variable-intercept mechanism include a variable-intercept linear module, a variable-intercept gantry, a silicon wafer variable-intercept placement assembly, and a silicon wafer variable-intercept positioning assembly. The variable-intercept linear module is fixedly mounted on the workbench frame and is arranged vertically. The variable-intercept gantry is connected to the variable-intercept linear module. The silicon wafer variable-intercept placement assembly and the silicon wafer variable-intercept positioning assembly are mounted on the variable-intercept gantry. The silicon wafer variable-intercept placement assembly has silicon wafers on it, and the silicon wafer variable-intercept positioning assembly is used to position the silicon wafers on the silicon wafer variable-intercept placement assembly.

8. The silicon wafer variable-pitch transfer stage according to claim 7, characterized in that: The silicon wafer variable-pitch placement assembly includes four rectangular mounting plates, which are located at the four corners of the rectangular cross-section. Several silicon wafer support cylinders are arranged vertically on the rectangular mounting plates, and the silicon wafers are placed on the silicon wafer support cylinders located on the same horizontal plane.

9. The silicon wafer variable-pitch transmission stage according to claim 8, characterized in that: The silicon wafer pitch-changing positioning assembly includes a pitch-changing positioning drive cylinder 1, a pitch-changing slide plate 1, two pitch-changing positioning push plates 1, a pitch-changing positioning drive cylinder 2, a pitch-changing slide plate 2, and two pitch-changing positioning push plates 2. Both pitch-changing positioning drive cylinders 1 and 2 are fixedly mounted on a pitch-changing gantry. The piston rods of pitch-changing slide plate 1 and pitch-changing positioning drive cylinder 1 are connected, and the piston rods of pitch-changing slide plate 2 and pitch-changing positioning drive cylinder 2 are connected. The upper ends of both pitch-changing positioning push plates 1 and 2 are connected to pitch-changing slide plate 1, and the upper ends of both pitch-changing positioning push plates 2 are connected to pitch-changing slide plate 2. The two pitch-changing positioning push plates 1 and 2 are arranged in a one-to-one correspondence, and the pitch-changing positioning push plates 1 and their corresponding pitch-changing positioning push plates 2 form a set that can be relatively close to or far away from each other for positioning the silicon wafer on the silicon wafer support cylinder.

10. A method for operating a silicon wafer variable-pitch transfer stage, characterized in that: Includes the following steps: The semi-finished silicon wafer feeding process consists of the following working units: a feeding basket elevator, a silicon wafer feeding extension mechanism, a feeding wafer centering mechanism, and a feeding variable pitch mechanism. S1-1. Place the basket containing the semi-finished silicon wafers in the frame consisting of the vertical connecting plate, the bottom plate and the upper support plate. The basket contains a stack of semi-finished silicon wafers, and the semi-finished silicon wafers in the basket are evenly spaced apart. S1-2, The silicon wafer feeding extension mechanism is working, pushing the conveyor drive device to drive the sliding seat to extend into the bottom of the basket of semi-finished silicon wafers, so that the starting end of the conveyor belt of the conveyor drive device is located below the lowest semi-finished silicon wafer in the basket of semi-finished silicon wafers. S1-3, The feeding basket elevator is working. The feeding basket elevator drives the basket of semi-finished silicon wafers to descend, so that the bottom of the basket of semi-finished silicon wafers comes into contact with the conveyor belt of the conveyor drive device. S1-4. The conveyor drive device starts, and the conveyor belt of the conveyor drive device moves the bottom half of the semi-finished silicon wafer out of the semi-finished silicon wafer basket. S1-5. The semi-finished silicon wafers move horizontally along the conveyor belt of the conveyor drive device until they reach the position of the feeding and centering mechanism. S1-6. The feeding and centering mechanism is in operation. Initially, the position of the two symmetrically arranged whole-piece fingers is adjusted by the whole-piece linear module so that the semi-finished silicon wafer is located between the two symmetrically arranged whole-piece fingers. When the semi-finished silicon wafer moves between the whole-piece guide rods, the whole-piece finger cylinder drives the two symmetrically arranged whole-piece fingers to move closer to each other, so that the whole-piece guide rods connected to the whole-piece fingers contact the semi-finished silicon wafer from both sides, adjusting the position of the semi-finished silicon wafer on the conveyor belt of the conveyor drive device. S1-7. The conveyor belt of the conveyor drive device conveys the semi-finished silicon wafers to one side of the loading variable intercept mechanism, and the end of the conveyor belt of the conveyor drive device is located directly below the loading variable intercept mechanism. S1-8, The feeding variable pitch mechanism is in operation. Initially, the variable pitch linear module drives the variable pitch gantry to the lowest point. At this time, the end of the conveyor belt of the conveying drive device is located above the silicon wafer support cylindrical rod at the top of the rectangular mounting plate. S1-9. The semi-finished silicon wafer is conveyed to the end of the conveyor belt of the conveyor drive device. The variable pitch linear module drives the variable pitch gantry to rise, so that the silicon wafer support cylindrical rod contacts the semi-finished silicon wafer on the end of the conveyor belt of the conveyor drive device. Since the distance between the silicon wafer support cylindrical rods on both sides of the semi-finished silicon wafer is less than the width of the semi-finished silicon wafer, the silicon wafer support cylindrical rod lifts the semi-finished silicon wafer at the end of the conveyor belt of the conveyor drive device during the upward movement, so that the semi-finished silicon wafer is placed on the silicon wafer support cylindrical rod. The variable pitch linear module drives the variable pitch gantry to rise. S1-10. Repeat steps S1-3 to S1-9 continuously until semi-finished silicon wafers are placed on several silicon wafer support cylinders. At this time, the semi-finished silicon wafers are stacked with a certain spacing on the feeding variable pitch mechanism. S1-11. After the feeding variable pitch mechanism is filled with semi-finished silicon wafers, the silicon wafer variable pitch positioning component of the feeding variable pitch mechanism works. The piston rods of variable pitch positioning drive cylinder one and variable pitch positioning drive cylinder two extend and push variable pitch positioning push plate one and variable pitch positioning push plate two to move respectively, so that the relative variable pitch positioning push plate one and variable pitch positioning push plate two move closer to each other, and adjust the semi-finished silicon wafers on the silicon wafer support cylindrical rod into a neat row. S1-12. The robotic arm removes a stack of semi-finished silicon wafers from the loading variable pitch mechanism, thereby completing the loading action of the semi-finished silicon wafers. The finished silicon wafer unloading process consists of the following working units: unloading variable pitch mechanism, silicon wafer unloading extension mechanism, unloading whole wafer centering mechanism, and unloading basket elevator. S2-1. The robotic arm places the finished silicon wafers into the feeding variable pitch mechanism. The silicon wafer variable pitch positioning component of the feeding variable pitch mechanism works, and the piston rods of variable pitch positioning drive cylinder one and variable pitch positioning drive cylinder two extend, respectively pushing variable pitch positioning push plate one and variable pitch positioning push plate two to move, thereby forming relative variable pitch positioning push plate one and variable pitch positioning push plate two to move closer to each other, adjusting the finished silicon wafers on the silicon wafer support cylindrical rod into a neat row. S2-2 Initially, the variable pitch linear module drives the variable pitch gantry to the highest position. At this time, the finished silicon wafer at the bottom of the several silicon wafer support cylindrical rods is located above the starting end of the conveyor belt of the conveyor drive device. S2-3, The variable pitch linear module drives the variable pitch gantry to descend, so that the finished silicon wafer at the bottom of several silicon wafer support cylindrical rods comes into contact with the conveyor belt of the conveyor drive device. S2-4. The conveyor belt of the conveyor drive device drives the finished silicon wafers at the bottom of several silicon wafer support cylinders to move out of the variable pitch gantry. S2-5, The conveyor belt of the conveyor drive device moves the finished silicon wafer to the position of the unloading and centering mechanism; S2-6. The wafer centering mechanism operates as follows: Initially, the position of the two symmetrically arranged wafer fingers is adjusted by the wafer linear module so that the finished silicon wafer is located between the two symmetrically arranged wafer fingers. When the finished silicon wafer moves between the wafer guide rods, the wafer finger cylinder drives the two symmetrically arranged wafer fingers to move closer to each other, so that the wafer guide rods connected to the wafer fingers contact the finished silicon wafer from both sides, adjusting the position of the finished silicon wafer on the conveyor belt of the conveyor drive device. S2-7. The conveyor belt of the conveyor drive device moves the finished silicon wafer to the bottom of the unloading basket elevator. At this time, the frame composed of the vertical connecting plate, the bottom plate and the upper support plate of the linear module is at the lowest point, that is, the finished basket is at the lowest point. S2-8, The material feeding basket elevator is working. The linear module 1 drives the finished product basket to move upward. During the upward movement of the finished product basket, it takes away the finished silicon wafers at the end of the conveyor belt of the conveyor drive device. The linear module 1 drives the finished product basket to move upward. S2-9. Repeat steps S2-2 to S2-7 continuously to transfer the finished silicon wafers one by one from the feeding variable pitch mechanism to the feeding basket elevator.

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