Interconnection structure and alignment method between multi-layer stacked circuits

Abstract

The application relates to the technical field of electronic equipment structure integration, and particularly discloses a multi-layer stacked interconnection structure between circuits and an alignment method, wherein the interconnection structure comprises a bearing structure, an antenna array surface provided with a second SMP radio frequency connector and mounted on the bearing structure, and a radio frequency subarray mounted at the bottom of the bearing structure; the bearing structure comprises a bearing plate, a first positioning pin mounted on the bearing plate and connected with the front surface of the antenna, a second positioning pin mounted on the bearing plate and connected with the radio frequency subarray, and a first positioning hole arranged on the bearing plate and corresponding to the second SMP radio frequency connector; the second SMP radio frequency connector is mounted in the first positioning hole and connected with the radio frequency subarray. The alignment method is disclosed; the application reduces the links for error generation, controls the reasonable precision of the key links, eliminates the cumulative error and the like, improves the consistency and stability of the electrical connection between the circuits of each layer, and ensures that the electrical performance and reliability of the electronic equipment meet the requirements.

Description

Technical Field

[0001] This invention relates to the field of electronic device structure integration technology, and more specifically, to an interconnection structure and alignment method between multilayer stacked circuits. Background Technology

[0002] With the continuous improvement of the performance and installation requirements of electronic equipment such as radar and communication, integration and thinning have become development trends. Tile integration is gradually replacing brick-type integration and is widely used in electronic equipment. Tile integration involves stacking multiple circuit boards vertically, with various electronic components densely arranged on each layer. The circuit boards are electrically interconnected through blind-mating connectors or flexible connectors, and the alignment accuracy between the circuit boards is very high.

[0003] Multilayer circuit boards, including those with organic substrates and ceramic substrates, have complex structures, use a variety of materials, and involve multiple soldering processes. These factors result in numerous points where errors can occur, and these errors are prone to accumulate, making it difficult to guarantee alignment accuracy.

[0004] Active array antennas are an important form of electronic equipment. They have large array dimensions, numerous electrical interconnections, and are arranged in an array. If the alignment accuracy between the circuit layers is insufficient, faults such as open circuits and degraded radio frequency performance can easily occur, seriously affecting the performance and reliability of the equipment.

[0005] Most of the published literature currently focuses on the integrated architecture research of electronic devices. For example, application number CN2016103056525 proposes a scalable, highly integrated active phased array antenna; application number CN2016103430674 proposes a Ka-band tile-structure active phased array antenna; and application number CN2015108179137 proposes a skin-type millimeter-wave satellite communication phased array antenna. Although the above patents all adopt the integration method of vertically stacking multi-layer circuits, they do not mention the precise alignment between the multi-layer circuits. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide an interconnection structure and alignment method between multilayer stacked circuits. By reducing the links that cause errors, controlling the reasonable accuracy of key links, and eliminating accumulated errors, the consistency and stability of electrical connections between circuits of each layer are improved, and the electrical performance and reliability of electronic devices are guaranteed to meet the requirements.

[0007] The solution adopted by this invention to solve the technical problem is:

[0008] on the one hand:

[0009] The present invention discloses an interconnection structure between multilayer stacked circuits, including a carrier structure, an antenna array mounted on the carrier structure and provided with a second SMP RF connector, and an RF subarray mounted at the bottom of the carrier structure.

[0010] The support structure includes a support plate, a first positioning pin mounted on the support plate and connected to the front of the antenna, a second positioning pin mounted on the support plate and connected to the radio frequency subarray, and a first positioning hole disposed on the support plate and corresponding to the second SMP radio frequency connector.

[0011] The second SMP RF connector is installed in the first positioning hole and one end passes through the first positioning hole to connect with the RF subarray.

[0012] In some possible implementations,

[0013] A first pin hole is provided on the side of the antenna array near the support plate; the first positioning pin is installed on the side of the support plate near the antenna array, and the other end is located in the first pin hole and coaxially arranged therewith.

[0014] In some possible implementations,

[0015] A second pin hole is provided on the side of the radio frequency subarray near the carrier plate. One end of the second positioning pin is installed on the side of the carrier plate near the radio frequency subarray, and the other end is located in the second pin hole and coaxially arranged therewith.

[0016] In some possible implementations,

[0017] The radio frequency subarray includes a radio frequency component connected to the second positioning pin, a mounting plate installed on the side of the radio frequency component away from the antenna array surface, and a radio frequency motherboard installed on the side of the mounting plate away from the radio frequency component.

[0018] The radio frequency component is provided with a second pin hole for mounting a second positioning pin;

[0019] A third positioning pin for connecting to the radio frequency component is provided on the mounting plate, and a third pin hole for mounting the third positioning pin is provided on the bottom of the radio frequency component.

[0020] A fourth positioning pin is provided at the bottom of the mounting plate to connect with the RF motherboard, and a fourth pin hole for installing the fourth positioning pin is provided on the RF motherboard.

[0021] In some possible implementations,

[0022] The radio frequency component includes a package housing connected to the second positioning pin and equipped with a first SMP radio frequency connector, a cover plate installed at the bottom of the package housing and forming a mounting cavity between the cover plate and the package housing, a lower substrate installed in the mounting cavity and connected to the first SMP radio frequency connector, an upper substrate installed on the cover plate, and an internal snap button for connecting the upper substrate and the lower substrate and located between the two.

[0023] Both the lower and upper substrates are ceramic substrates, and the dimensions of the upper substrate before sintering are calculated based on a shrinkage rate of 14%.

[0024] The first SMP RF connector is connected to the second SMP RF connector via a KK head; the KK head is located inside the first positioning hole.

[0025] In some possible implementations,

[0026] The mounting plate is provided with a mounting groove, an external wool button is installed in the mounting groove, and the cover plate is provided with a through hole for the pin of the external wool button to pass through and connect to the upper substrate.

[0027] An external solder pad is provided on the upper substrate to connect with the ejector pin of the external button; the outer diameter of the ejector pin is smaller than the outer diameter of the external solder pad.

[0028] In some possible implementations,

[0029] The mounting groove has a T-shaped structure, with its large end located near the through hole. A fifth positioning pin is provided on the stepped surface of the T-shaped structure. A fifth pin hole for installing the fifth positioning pin is provided on the external button.

[0030] In some possible implementations,

[0031] The first positioning hole includes a mounting section disposed on the side of the carrier plate near the antenna array, and a first positioning section coaxially connected to the mounting section; the second SMP RF connector is coaxially mounted in the mounting section; the diameter of the first positioning section is smaller than the diameter of the mounting section and is coaxially disposed with the KK connector.

[0032] In some possible implementations, in order to effectively position the KK head and allow it to float within an allowable range to avoid jamming and affecting reliability;

[0033] The diameter of the first positioning segment is D1, and the outer diameter of the KK head is d1, where D1-d1=0.2mm.

[0034] on the other hand:

[0035] This invention also discloses an alignment method based on the interconnection structure between the multilayer stacked circuits described above, specifically including the following steps:

[0036] Using the supporting structure as the first positioning reference, the first positioning pin cooperates with the first pin hole on the antenna array to achieve precise alignment between the antenna array and the supporting structure; the second positioning pin cooperates with the second pin hole on the radio frequency subarray to achieve precise alignment between the radio frequency subarray and the supporting structure.

[0037] Using the mounting plate as the second positioning reference, the third positioning pin engages with the third pin hole to achieve precise alignment between the RF component and the mounting plate; the fourth positioning pin engages with the fourth pin hole on the RF motherboard to achieve precise alignment between the RF motherboard and the mounting plate; the fifth positioning pin engages with the fifth pin hole on the external button to achieve precise alignment between the external button and the mounting plate.

[0038] A tooling fixture is used to surface mount a second SMP RF connector on the antenna array surface; a sixth positioning pin and a second positioning hole are provided on the tooling fixture, the sixth positioning pin is correspondingly provided with a first pin hole; the second positioning hole is aligned with the axis of the second SMP RF connector on the antenna array surface;

[0039] By analyzing the horizontal dimension chain of the internal components of the RF assembly, the horizontal positional dimensional tolerance between the second pin hole and the external pad is obtained;

[0040] By treating the RF components as a whole, we analyze the horizontal dimensional chain between the RF components, mounting plate, external fasteners, and RF motherboard to ensure the alignment accuracy between external pads and external fasteners, and between the pads on the RF motherboard and external fasteners.

[0041] Treating the RF subarray as a whole, we analyze the horizontal dimensional chain between the RF subarray, the supporting structure, and the antenna array to ensure that the alignment accuracy of the first SMP RF connector and the second SMP RF connector meets the requirements.

[0042] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0043] This invention uses the load-bearing structure and mounting plate as a unified positioning reference. By setting multiple sets of pins and positioning holes on them and using an integral processing method, the number of steps that cause errors is greatly reduced.

[0044] This invention uses a tooling fixture to precisely position the first SMP RF connector on the antenna array and a positioning fixture to precisely position the upper substrate of the RF component, thereby reducing the accumulation of errors and ensuring the consistency of errors.

[0045] This invention fully considers the shrinkage rate of the ceramic substrate during the sintering process, and the proposed reverse compensation method ensures the accuracy of the pad position on the ceramic substrate, solving the problem of the upper substrate needing to be precisely aligned with both the built-in and external buttons.

[0046] The present invention provides a simplified calculation method for the dimension chain, which can conveniently and quantitatively determine whether the alignment accuracy of all electrical interconnects meets the requirements, and can flexibly adjust the tolerance allocation of key dimensions.

[0047] By combining the above methods, precise alignment of all interconnect structures in the multilayer stacked circuit is achieved, ensuring high reliability of electrical connections; at the same time, all components are interchangeable, supporting mass production. Attached Figure Description

[0048] Figure 1 This is a schematic diagram of the structure of the present invention;

[0049] Figure 2 This is a schematic diagram of the internal structure of the radio frequency component in this invention;

[0050] Figure 3 This is a schematic diagram of the second SMP radio frequency connector, antenna array, and supporting structure in this invention;

[0051] Figure 4 This is a schematic diagram of the external wool button and the upper substrate in this invention;

[0052] Figure 5 This is a schematic diagram of the surface mounting of the second SMP RF connector using a tooling fixture in this invention;

[0053] The components include: 1. Bearing structure; 11. First positioning pin; 12. Second positioning pin; 13. First positioning hole; 131. First positioning segment; 2. RF subarray; 21. RF component; 211. Encapsulation box; 2111. Second pin hole; 2112. Third pin hole; 212. First SMP RF connector; 213. Lower substrate; 214. Built-in button; 215. Upper substrate; 2151. External solder pad; 216. Cover plate; 22. Mounting plate; 221, Third positioning pin; 222, Fourth positioning pin; 223, Mounting slot; 2231, Fifth positioning pin; 23, RF motherboard; 231, Fourth pin hole; 24, External button; 241, Fifth pin hole; 242, Ejector pin; 3, Antenna array; 31, First pin hole; 32, Second SMP RF connector; 4, KK head; 41, Second positioning section; 5, Tooling fixture; 51, Second positioning hole; 52, Sixth positioning pin. Detailed Implementation

[0054] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," etc., do not indicate a quantity limitation, but rather indicate the existence of at least one. In the implementation of this application, "and / or" describes the association relationship of related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. For example, multiple positioning posts refer to two or more positioning posts. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0055] The present invention will now be described in detail.

[0056] like Figures 1-5 As shown:

[0057] The present invention discloses an interconnection structure between multilayer stacked circuits, including a carrier structure 1, an antenna array 3 mounted on the carrier structure 1 and provided with a second SMP radio frequency connector 32, and a radio frequency subarray 2 mounted at the bottom of the carrier structure 1.

[0058] The support structure 1 includes a support plate, a first positioning pin 11 mounted on the support plate and connected to the front of the antenna, a second positioning pin 12 mounted on the support plate and connected to the radio frequency subarray 2, and a first positioning hole 13 disposed on the support plate and corresponding to the second SMP radio frequency connector 32.

[0059] The second SMP RF connector 32 is installed in the first positioning hole 13 and one end passes through the first positioning hole 13 to connect with the RF subarray 2.

[0060] In some possible implementations, in order to effectively achieve the connection and precise alignment between the antenna array 3 and the supporting structure 1;

[0061] A first pin hole 31 is provided on the side of the antenna array 3 near the support plate; the first positioning pin 11 is installed on the side of the support plate near the antenna array 3, and the other end is located in the first pin hole 31 and is coaxially arranged with it.

[0062] In some possible implementations, in order to effectively achieve the connection and precise alignment between the support structure 1 and the radio frequency subarray 2;

[0063] A second pin hole 2111 is provided on the side of the radio frequency subarray 2 near the carrier plate. One end of the second positioning pin 12 is installed on the side of the carrier plate near the radio frequency subarray 2, and the other end is located in the second pin hole 2111 and is coaxial with it.

[0064] Preferably, the first positioning pin 11 and the second positioning pin 12 have the same machining reference. The first positioning pin 11 cooperates with the first pin hole 31 on the antenna array 3 to achieve precise alignment between the antenna array 3 and the supporting structure 1. The second positioning pin 12 cooperates with the second pin hole 2111 on the radio frequency subarray 2 to achieve precise alignment between the radio frequency subarray 2 and the supporting structure 1.

[0065] In some possible implementations, in order to effectively achieve the connection and precise alignment between the mounting plate 22 and the radio frequency component 21;

[0066] The radio frequency subarray 2 includes a radio frequency component 21 connected to the second positioning pin 12, a mounting plate 22 installed on the side of the radio frequency component 21 away from the antenna array 3, and a radio frequency motherboard 23 installed on the side of the mounting plate 22 away from the radio frequency component 21.

[0067] The second pin hole 2111 is on the radio frequency component 21;

[0068] A third positioning pin 221 connected to the radio frequency component 21 is provided on the mounting plate 22, and a third pin hole 2112 for mounting the third positioning pin 221 is provided at the bottom of the radio frequency component 21.

[0069] A fourth positioning pin 222 is provided at the bottom of the mounting plate 22 and is connected to the radio frequency motherboard 23. A fourth pin hole 231 for installing the fourth positioning pin 222 is provided on the radio frequency motherboard 23.

[0070] The machining reference of the third positioning pin 221 and the fourth positioning pin 222 is consistent. The third positioning pin 221 cooperates with the third pin hole 2112 on the upper end face of the RF component 21 to achieve precise alignment between the RF component 21 and the mounting plate 22. The fourth positioning pin 222 cooperates with the fourth pin hole 231 on the RF motherboard 23 to achieve precise alignment between the RF motherboard 23 and the mounting plate 22.

[0071] In some possible implementations,

[0072] like Figure 2As shown, the radio frequency component 21 includes a package 211 connected to the second positioning pin 12 and equipped with a first SMP radio frequency connector 212, a cover plate 216 installed at the bottom of the package 211 and forming a mounting cavity between the cover plate 211 and the package housing, a lower substrate 213 installed in the mounting cavity and connected to the first SMP radio frequency connector 212, an upper substrate 215 installed on the cover plate 216, and an internal snap button 214 for connecting the upper substrate 215 and the lower substrate 213 and located between the two.

[0073] Both the lower substrate 213 and the upper substrate 215 are ceramic substrates. The size of the upper substrate 215 before sintering is calculated by reverse calculation based on a shrinkage rate of 14%. This method will make the connection position between the upper substrate 215 and the mounting plate 22, and between the upper substrate 215 and the built-in button 214 more accurate.

[0074] The first SMP RF connector 212 is connected to the second SMP RF connector 32 through the KK head 4 to realize the transmission of RF signals; the KK head 4 is located in the first positioning hole 13.

[0075] In the RF assembly 21, the cover plate 216 and the upper substrate 215 are brazed to form a whole, and then the whole is hermetically sealed to the package 211 by laser sealing. The upper substrate 215 and the lower substrate 213 are stacked in parallel, and the built-in button 214 is placed between the two, with its two ends connected to the upper substrate 215 and the lower substrate respectively. The lower substrate 213 is welded to the inner conductor inside the first SMP RF connector 212 installed on the package 211, thereby realizing the electrical connection with the antenna array 3.

[0076] In some possible implementations,

[0077] like Figure 2 As shown, a mounting groove 223 is provided on the mounting plate 22, and an external hair button 24 is installed in the mounting groove 223. A through hole is provided on the cover plate 216 for the pin 242 of the external hair button 24 to pass through and connect to the upper substrate 215.

[0078] like Figure 4 As shown, an external solder pad 2151 is provided on the upper substrate 215, which is connected to the ejector pin 242 of the external button 24. The upper substrate 215 and the RF motherboard 23 are electrically connected through the external solder pad 2151 and the external button 24, thereby realizing the transmission of power supply and signal. The outer diameter of the ejector pin 242 is smaller than the outer diameter of the external solder pad 2151. Further, the outer diameter of the ejector pin 242 is d2, the outer diameter of the external solder pad is D2, the ejector pin 242 and the external solder pad are coaxially arranged, and D2-d2=0.2mm.

[0079] Furthermore, a solder pad is provided at the bottom of the mounting slot 223, and an external button 24 is mounted on the solder pad.

[0080] In some possible implementations, in order to effectively achieve effective connection and precise alignment between the upper substrate 215 and the mounting plate 22;

[0081] like Figure 1 , Figure 2 As shown, the mounting groove 223 has a T-shaped structure, with its large end located near the through hole. A fifth positioning pin 2231 is provided on the stepped surface of the T-shaped structure. A fifth pin hole 241 for installing the fifth positioning pin 2231 is provided on the external button 24.

[0082] The fifth positioning pin 2231 engages with the fifth pin hole 241 on the external bob button 24 to achieve precise alignment between the bob button and the mounting plate 22; the machining datum of the fifth positioning pin 2231 is consistent with that of the third positioning pin 221.

[0083] In some possible implementations, in order to effectively achieve a connection between the second SMP RF connector 32 and the first SMP RF connector 212;

[0084] The first positioning hole 13 includes a mounting section disposed on the side of the carrier plate near the antenna array 3, and a first positioning section 131 coaxially connected to the mounting section; the second SMP RF connector 32 is coaxially mounted in the mounting section; the diameter of the first positioning section 131 is smaller than the diameter of the mounting section and is coaxially disposed with the KK head 4.

[0085] In some possible implementations, in order to effectively position the KK head 4 and allow it to float within an allowable range to avoid jamming and affecting reliability;

[0086] like Figure 3 As shown, the diameter of the first positioning segment 131 is D1, and the outer diameter of the KK head 4 is d1, where D1-d1=0.2mm.

[0087] on the other hand:

[0088] This invention also discloses an alignment method based on the interconnection structure between the multilayer stacked circuits described above, specifically including the following steps:

[0089] Using the support structure 1 as the first positioning reference, the first positioning pin 11 cooperates with the first pin hole 31 on the antenna array 3 to achieve precise alignment between the antenna array 3 and the support structure 1; the second positioning pin 12 cooperates with the second pin hole 2111 on the radio frequency subarray 2 to achieve precise alignment between the radio frequency subarray 2 and the support structure 1.

[0090] Using the mounting plate 22 as the second positioning reference, the third positioning pin 221 engages with the third pin hole 2112 to achieve precise alignment between the RF component 21 and the mounting plate 22; the fourth positioning pin 222 engages with the fourth pin hole 231 on the RF motherboard 23 to achieve precise alignment between the RF motherboard 23 and the mounting plate 22; the fifth positioning pin 2231 engages with the fifth pin hole 241 on the external button 24 to achieve precise alignment between the external button 24 and the mounting plate 22.

[0091] The second SMP RF connector 32 is surface-mounted on the antenna array 3 using a tooling fixture 5; a sixth positioning pin and a second positioning hole 51 are provided on the tooling fixture 5, the sixth positioning pin being correspondingly provided to the first pin hole 31; the second positioning hole 51 is aligned with the axis of the second SMP RF connector 32 on the antenna array 3;

[0092] Furthermore, the tooling fixture 5 is a metal part machined by CNC milling, which can well ensure the positional accuracy between the sixth positioning pin and the sixth positioning hole, thereby ensuring the positional accuracy between the first pin hole 31 and the second SMP RF connector 32 on the antenna array 3.

[0093] The alignment of the RF component 21 with the external structure is achieved through the second pin hole 2111 and the third pin hole 2112 on the package 211. In order to ensure that the external pads of the upper substrate 215 are precisely aligned with the external button 24, the upper substrate 215 must first be precisely aligned with the cover plate 216 through the positioning fixture, and the cover plate 216 then achieves the final alignment accuracy by matching its outer contour with the inner contour of the package 211.

[0094] The positioning fixture is mainly used to achieve precise alignment between the upper substrate 215 and the cover plate 216;

[0095] The simplified calculation of the dimension chain includes the following steps:

[0096] Analyze the horizontal dimension chain of the internal components of the RF component 21 to ensure that the alignment accuracy of the lower substrate 213, the built-in button 214 in the RF component 21, and the upper substrate 215 meets the requirements, and obtain the horizontal position dimension tolerance between the second pin hole 2111 and the external solder pad 2151.

[0097] Taking the RF component 21 as a whole, analyze the horizontal dimensional chain between the RF component 21, mounting plate 22, external button 24, and RF motherboard 23, and adjust the alignment between the RF component 21, mounting plate 22, external button 24, and RF motherboard 23 to ensure the alignment accuracy between the external pad 2151 and the external button 24, and between the pads on the RF motherboard 23 and the external button 24.

[0098] Taking the RF subarray 2 as a whole, analyze the horizontal dimensional chain between the RF subarray 2, the support structure 1, and the antenna array 3, and adjust the alignment between the RF subarray 2, the support structure 1, and the antenna array 3; ensure that the alignment accuracy of the first SMP RF connector 212 and the second SMP RF connector 32 meets the requirements.

[0099] This invention achieves precise alignment of all interconnect structures in a multilayer stacked circuit, ensuring high reliability of electrical connections; at the same time, all components are interchangeable, supporting mass production.

[0100] In the prior art, about 15% of the radio frequency channels of tile-type active array antennas are not connected. After applying the present invention, the number of unconnected radio frequency channels of tile-type active array antennas is greatly reduced to less than 0.5% during assembly and alignment.

[0101] Example 1:

[0102] like Figures 1-5 As shown, an interconnection structure between multilayer stacked circuits includes: a carrier structure 1, a radio frequency subarray 2 and an antenna array 3. The radio frequency subarray 2 consists of eight 16-channel radio frequency components 21, one mounting plate 22, one radio frequency motherboard 23 and three external buttons 24. The radio frequency components 21 and the radio frequency motherboard 23 are connected by external buttons 24 to achieve power supply and transmission of radio frequency signals and control signals.

[0103] Using the support structure 1 as the installation reference, the antenna array 3 is installed onto the support structure 1 from front to back, and the radio frequency subarray 2 is installed onto the support structure 1 from back to front; the radio frequency subarray 2 and the antenna array 3 are connected by 128 second SMP radio frequency connectors 32 and KK heads 4 of equal number and corresponding arrangement to achieve radio frequency signal transmission.

[0104] The radio frequency component 21 includes a package housing 211, and a lower substrate 213 and an upper substrate 215 stacked inside the package housing 211. The two substrates are connected by built-in snap fasteners 214. The lower substrate 213 is soldered to the inner conductors of 16 first SMP radio frequency connectors 212 for electrical connection with the antenna array 3. The upper substrate 215 has four sets of external solder pads 2151 for electrical connection with the radio frequency motherboard 23. The cover plate 216 is first brazed to the upper substrate to form an integral structure, and then hermetically sealed to the package housing 211 by laser sealing. Preferably, both the lower substrate 213 and the upper substrate 215 are LTCC substrates, and the materials of the package housing 211 and the cover plate 216 are aluminum alloy and aluminum silicon, respectively.

[0105] The above structure involves 4 layers of circuitry and 3 layers of electrical connections. The precise alignment between each layer is designed using the following method:

[0106] 1. Using the supporting structure 1 as the first positioning reference, a first positioning pin 11 is provided on the upper surface of the supporting plate near the front of the antenna, and a second positioning pin 12 is provided on its lower surface away from the front of the antenna. The supporting structure 1 is preferably made of aluminum alloy and is machined by multiple milling operations in a single clamping. The first positioning pin 11 cooperates with the first pin hole 31 on the antenna array surface to achieve precise alignment between the antenna array surface and the supporting structure. The second positioning pin 12 cooperates with the second pin hole 2111 on the radio frequency subarray to achieve precise alignment between the radio frequency subarray and the supporting structure. Preferably, the second pin hole 2111 is a pin hole on two diagonally opposite radio frequency components 21.

[0107] 2. Using the mounting plate 22 as the second positioning reference, a third positioning pin 221 is provided on the side of its upper surface near the RF component, a fourth positioning pin 222 is provided on the side of its lower surface near the RF motherboard, and a fifth positioning pin 2231 is provided in its mounting groove 223. The mounting groove 223 is used for the installation of the external button 24. The mounting plate 22 is preferably made of aluminum alloy and is milled several times in one clamping.

[0108] The third positioning pin 221 cooperates with the third pin hole 2112 on the RF component 21 to achieve precise alignment between the RF component 21 and the mounting plate 22; the fourth positioning pin 222 cooperates with the fourth pin hole 231 on the RF motherboard 23 to achieve precise alignment between the RF motherboard 23 and the mounting plate 22; the fifth positioning pin 2231 cooperates with the fifth pin hole 241 on the external button 24 to achieve precise alignment between the external button 24 and the mounting plate 22.

[0109] 3. The antenna array 3 has two surface-mount second SMP RF connectors 32, corresponding to four RF subarrays. A fixture 5 is designed to control the positional accuracy of the surface-mount second SMP RF connectors 32. The fixture 5 is provided with two sixth positioning pins 52 and two second positioning holes 51. The sixth positioning pins 52 correspond to the first pin holes 31 on the antenna array 3; the second positioning holes 51 are aligned with the axis of the first SMP RF connector 212 on the antenna array 3.

[0110] Furthermore, the positional tolerances between all positioning holes, positioning pins, and pin holes in 1 to 3 above are controlled within ±0.02mm.

[0111] 4. During assembly, first install the antenna array 3 onto the supporting structure 1, and then insert the two KK heads 4 one by one through the first positioning hole 13 into the second SMP RF connector 32 on the antenna array 3.

[0112] Preferably, one end of the KK head 4 is an escapement end and the other end is an optical aperture end. The escapement end is inserted into the second SMP RF connector 32. Finally, the four RF subarrays 2 are installed sequentially on the carrier structure 1. The 128 first SMP RF connectors 212 on each RF subarray 2 are precisely aligned with the KK head 4, and the optical aperture end of the KK head 4 is inserted into the first SMP RF connector 212.

[0113] like Figure 3 As shown, in order to ensure that the KK head 4 is in the correct position before the RF subarray 2 is installed, the diameter of the first positioning segment 131 of the first positioning hole 13 is D1 = 3.2mm, the diameter of the second positioning segment 41 of the KK head 4 is d1 = 3.0mm, and the single-sided gap is 0.1mm.

[0114] 5. The upper substrate 215 of the radio frequency component 21 is an LTCC substrate. Based on the layout design of the copper layer, vias, pads, etc. of the upper substrate 215, the size of the green ceramic before sintering is calculated with a shrinkage rate of 14%. The size after sintering deviates from the theoretical value by less than 0.2%.

[0115] 6. The upper substrate 215 of the radio frequency component 21 is precisely aligned with the cover plate 216 through a positioning fixture, achieving an alignment accuracy of ±0.1mm between the ejector pin 242 of the external button 24 and the external solder pad 2151 of the upper substrate 215. Figure 4 As shown, the design has D2 = 0.7 mm and d2 = 0.5 mm, which meets the alignment requirements.

[0116] 7. Finally, through dimensional chain analysis and tolerance allocation for critical dimensions, the alignment accuracy between SMPs is better than ±0.15mm, and the alignment accuracy between the fuzzy button and the pad is better than ±0.1mm.

[0117] This invention is not limited to the specific embodiments described above. The invention extends to any new feature or combination disclosed in this specification, as well as any new method or process step or combination disclosed herein.

Claims

1. An interconnection structure between multilayer stacked circuits, characterized in that, It includes a support structure, an antenna array mounted on the support structure and equipped with a second SMP RF connector, and an RF subarray mounted at the bottom of the support structure; The support structure includes a support plate, a first positioning pin mounted on the support plate and connected to the front of the antenna, a second positioning pin mounted on the support plate and connected to the radio frequency subarray, and a first positioning hole disposed on the support plate and corresponding to the second SMP radio frequency connector. The second SMP RF connector is installed inside the first positioning hole, with one end passing through the first positioning hole and connecting to the RF subarray. The radio frequency subarray includes a radio frequency component connected to the second positioning pin, a mounting plate installed on the side of the radio frequency component away from the antenna array surface, and a radio frequency motherboard installed on the side of the mounting plate away from the radio frequency component. The radio frequency component includes a package housing connected to the second positioning pin and equipped with a first SMP radio frequency connector, a cover plate installed at the bottom of the package housing and forming a mounting cavity between the cover plate and the package housing, a lower substrate installed in the mounting cavity and connected to the first SMP radio frequency connector, an upper substrate installed on the cover plate, and an internal snap button for connecting the upper substrate and the lower substrate and located between the two. Both the lower and upper substrates are ceramic substrates, and the dimensions of the upper substrate before sintering are calculated by reverse calculation based on a shrinkage rate of 14%. The mounting plate is provided with a mounting groove, an external wool button is installed in the mounting groove, and the cover plate is provided with a through hole for the pin of the external wool button to pass through and connect to the upper substrate. An external solder pad is provided on the upper substrate to connect with the ejector pin of the external button; the outer diameter of the ejector pin is smaller than the outer diameter of the external solder pad.

2. The interconnection structure between multilayer stacked circuits according to claim 1, characterized in that, A first pin hole is provided on the side of the antenna array near the support plate; the first positioning pin is installed on the side of the support plate near the antenna array, and the other end is located in the first pin hole and coaxially arranged therewith.

3. The interconnection structure between multilayer stacked circuits according to claim 1, characterized in that, A second pin hole is provided on the side of the radio frequency subarray near the carrier plate. One end of the second positioning pin is installed on the side of the carrier plate near the radio frequency subarray, and the other end is located in the second pin hole and coaxially arranged therewith.

4. The interconnection structure between multilayer stacked circuits according to claim 3, characterized in that, The radio frequency component is provided with a second pin hole for mounting a second positioning pin; A third positioning pin for connecting to the radio frequency component is provided on the mounting plate, and a third pin hole for mounting the third positioning pin is provided on the bottom of the radio frequency component. A fourth positioning pin is provided at the bottom of the mounting plate to connect with the RF motherboard, and a fourth pin hole for installing the fourth positioning pin is provided on the RF motherboard.

5. The interconnection structure between multilayer stacked circuits according to claim 4, characterized in that, The first SMP RF connector is connected to the second SMP RF connector via a KK head; the KK head is located inside the first positioning hole.

6. The interconnection structure between multilayer stacked circuits according to claim 5, characterized in that, The mounting groove has a T-shaped structure, with its large end located near the through hole. A fifth positioning pin is provided on the stepped surface of the T-shaped structure. A fifth pin hole for installing the fifth positioning pin is provided on the external button.

7. The interconnection structure between multilayer stacked circuits according to claim 6, characterized in that, The first positioning hole includes a mounting section disposed on the side of the carrier plate near the antenna array, and a first positioning section coaxially connected to the mounting section; the second SMP RF connector is coaxially mounted in the mounting section; the diameter of the first positioning section is smaller than the diameter of the mounting section and is coaxially disposed with the KK connector.

8. The interconnection structure between multilayer stacked circuits according to claim 7, characterized in that, The diameter of the first positioning segment is D1, and the outer diameter of the KK head is d1, where D1-d1=0.2mm.

9. A method for aligning interconnects between multilayer stacked circuits according to any one of claims 6-8, characterized in that, Specifically, the following steps are included: Using the supporting structure as the first positioning reference, the first positioning pin cooperates with the first pin hole on the antenna array to achieve precise alignment between the antenna array and the supporting structure; the second positioning pin cooperates with the second pin hole on the radio frequency subarray to achieve precise alignment between the radio frequency subarray and the supporting structure. Using the mounting plate as the second positioning reference, the third positioning pin engages with the third pin hole to achieve precise alignment between the RF component and the mounting plate; the fourth positioning pin engages with the fourth pin hole on the RF motherboard to achieve precise alignment between the RF motherboard and the mounting plate; the fifth positioning pin engages with the fifth pin hole on the external button to achieve precise alignment between the external button and the mounting plate. A tooling fixture is used to surface mount a second SMP RF connector on the antenna array surface; a sixth positioning pin and a second positioning hole are provided on the tooling fixture, the sixth positioning pin is correspondingly provided with a first pin hole; the second positioning hole is aligned with the axis of the second SMP RF connector on the antenna array surface; By analyzing the horizontal dimension chain of the internal components of the RF assembly, the horizontal positional dimensional tolerance between the second pin hole and the external pad is obtained; By treating the RF components as a whole, we analyze the horizontal dimensional chain between the RF components, mounting plate, external fasteners, and RF motherboard to ensure the alignment accuracy between external pads and external fasteners, and between the pads on the RF motherboard and external fasteners. By treating the RF subarray as a whole, we analyze the horizontal dimensional chain between the RF subarray, the supporting structure, and the antenna array to ensure that the alignment accuracy between the first SMP RF connector and the second SMP RF connector meets the requirements.

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