Thermal device

Abstract

A thermal device of the present disclosure has a container made of ceramic, a fluid, and a seal. The container has an internal space, an opening portion connected to the internal space, and a communication path connecting the internal space and the opening portion. The fluid is located in the internal space. The seal plugs the opening portion. In addition, the seal has a core portion and a flange portion connected to the core portion. The flange portion is engaged with the container around the opening portion. The core portion is located in the opening portion. A portion of the core portion is in contact with a wall surface of the opening portion.

Description

Technical Field

[0001] This disclosure relates to thermal devices. Background Technology

[0002] Previously, thermal devices that utilize the latent heat of phase change materials were known. For example, a heat spreader, as a type of thermal device, utilizes the latent heat of the evaporation and condensation of the working fluid sealed inside to transfer heat from a high-temperature section to a low-temperature section, thereby releasing heat from the heating element (see Patent Document 1).

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Utility Model Application Publication No. 54-42973 Summary of the Invention

[0006] One aspect of the disclosed thermal device includes a ceramic container, a fluid, and a sealing portion. The container has an internal space, an opening connected to the internal space, and a communication passage connecting the internal space and the opening. The fluid is located in the internal space. The sealing portion blocks the opening. Additionally, the sealing portion has a core and a flange connected to the core. The flange engages with the container around the opening. The core is located within the opening. A portion of the core contacts the wall of the opening. Attached Figure Description

[0007] Figure 1 This is a perspective view of the heat dissipation device in the implementation method.

[0008] Figure 2 This is a diagram showing the first component of the embodiment viewed from the negative Z-axis direction towards the positive Z-axis direction.

[0009] Figure 3 This is a diagram of the second component of the embodiment, viewed from the positive Z-axis direction towards the negative Z-axis direction.

[0010] Figure 4 This is a diagram of the intermediate component of the embodiment, viewed from the positive Z-axis direction towards the negative Z-axis direction.

[0011] Figure 5 It is Figure 2 The first groove forming area shown and Figure 3 The second groove forming area shown is relative to Figure 4 The diagram shows the overlapping of intermediate components.

[0012] Figure 6 This is a diagram illustrating the flow of the working fluid in the heat dissipation device of the embodiment.

[0013] Figure 7 This is a diagram illustrating the flow of the working fluid in the heat dissipation device of the embodiment.

[0014] Figure 8 It is a schematic cross-sectional view representing a structural example of a connecting path.

[0015] Figure 9 It is a schematic cross-sectional view showing the structure of the sealing part.

[0016] Figure 10 yes Figure 9 The diagram shows a schematic cross-sectional view in the direction of XX rays.

[0017] Figure 11 This is a schematic cross-sectional view illustrating an example of a ring-shaped structure.

[0018] Figure 12 This is a schematic cross-sectional view illustrating another example of a ring-shaped structure.

[0019] Figure 13 This is a schematic cross-sectional view illustrating another example of a ring-shaped structure.

[0020] Figure 14 This is a schematic cross-sectional view illustrating another example of a ring-shaped structure.

[0021] Figure 15 This is a schematic cross-sectional view illustrating another example of a ring-shaped structure.

[0022] Figure 16 This is a schematic cross-sectional view representing another example of a block-shaped structure.

[0023] Figure 17 This is a schematic cross-sectional view representing another example of a block-shaped structure.

[0024] Figure 18 This is a schematic cross-sectional view representing another example of the structure of a connecting path.

[0025] Figure 19 This is a diagram illustrating an example of a sealing process.

[0026] Figure 20 This is a diagram illustrating an example of a sealing process.

[0027] Figure 21 This is a diagram illustrating an example of a sealing process.

[0028] Figure 22 This is a schematic cross-sectional view showing the structure of the heat dissipation device in the first modified example.

[0029] Figure 23 This is a schematic cross-sectional view showing the structure of the heat dissipation device in the second variation. Detailed Implementation

[0030] Hereinafter, a detailed description of the embodiments for implementing the thermal device of this disclosure (hereinafter referred to as "Embodiments") will be provided with reference to the accompanying drawings. It should be noted that this disclosure is not limited to these embodiments. Furthermore, the various embodiments can be appropriately combined without causing contradictions in the processing content. In addition, in the following embodiments, the same reference numerals are used to label the same parts, and repeated descriptions are omitted.

[0031] Furthermore, in the embodiments shown below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" are sometimes used, but these expressions do not need to be "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. That is, the above expressions allow for deviations in, for example, manufacturing precision, setting precision, etc.

[0032] In addition, in the figures referred to below, for ease of understanding, an orthogonal coordinate system is sometimes shown, which specifies mutually orthogonal X-axis, Y-axis and Z-axis directions and sets the positive Z-axis direction as the vertically upward direction.

[0033] In the aforementioned prior art, there is room for further improvement in terms of enhancing airtightness.

[0034] The disclosed thermal device includes a ceramic container, a fluid, and a sealing portion. The container has an internal space, an opening connected to the internal space, and a passage connecting the internal space and the opening. The fluid is located in the internal space. The sealing portion closes the opening. The sealing portion has a core and a flange connected to the core. The flange engages with the container around the opening. The core is located within the opening. A portion of the core contacts the wall of the opening. The thermal device with this structure has high airtightness.

[0035] The flange can be joined to the container via a bonding layer made of metal. Thermal devices with this structure have higher airtightness.

[0036] The core may have a main body and a large-diameter portion located around the entire circumference of the main body and connected to a flange. In this case, the thickness of the large-diameter portion can be thinner than the thickness of the flange. With this structure, the large-diameter portion is less prone to elastic deformation compared to the flange, and stress concentration in the large-diameter portion is mitigated. As a result, the generation of cracks in the opening edge of the connecting passage can be suppressed.

[0037] The front end of the large-diameter section can have a pointed shape. This helps to suppress the formation of cracks in the wall of the connecting passage.

[0038] The sealing part can be separated from the edge of the opening. This makes it less likely for cracks to form at the edge of the opening of the connecting passage.

[0039] The sealing part may have a recess or a protrusion on its upper surface. For example, if the sealing part has a protrusion, it is easier for the sealing part to come into contact with the heat source. As a result, heat can be easily transferred to the interior of the heat-generating device through the sealing part, thereby improving the heat exchange efficiency of the heat-generating device.

[0040] The container may have a main surface and a recessed surface that is concave relative to the main surface. In this case, the opening may be located on the recessed surface, and the flange may be located on the recessed surface. By adopting this structure, the thickness of the thermal device can be suppressed.

[0041] In the embodiments shown below, an example is given in which the sealing part includes two components, a block and an annular body. However, the sealing part does not necessarily need to include multiple components and may be composed of a single component.

[0042] Furthermore, as an example of the heat dissipation device disclosed herein, a heat dissipation device that efficiently moves heat from a high-temperature section to a low-temperature section by utilizing the latent heat of evaporation and condensation of the working fluid (a fluid or a phase change substance) will be described below. Specifically, a heat spreader will be used as an example.

[0043] First, refer to Figure 1 The overall structure of the heat dissipation device in the implementation method will be described. Figure 1 This is a perspective view of the heat dissipation device in the implementation method.

[0044] like Figure 1 As shown, the heat dissipation device 1 has a ceramic container 2. The container 2 has a first component 10, a second component 20, and an intermediate component 30. The first component 10, the second component 20, and the intermediate component 30 are all plate-shaped and are stacked in such a way that the intermediate component 30 is sandwiched between the first component 10 and the second component 20.

[0045] Container 2 has a working area 100 and a frame area 200. The working area 100 has an internal space in which a working fluid, which serves as a phase change substance, is sealed. The working fluid can be, for example, water, hydrocarbon compounds, organic liquids (such as ethanol and methanol), ammonia, etc.

[0046] The frame region 200 is the region surrounding the working region 100. In other words, the frame region 200 is the region in the heat dissipation device 1 that is outside the working region 100. The working region 100 is generally hollow, while the frame region 200 is generally solid.

[0047] The frame region 200 is intentionally formed as a wide area to suppress leakage, such as working fluid or working fluid vapor, from the interface between the first component 10 and the intermediate component 30 or the interface between the second component 20 and the intermediate component 30, or external atmosphere from the aforementioned interfaces into the internal space of the working region 100 (i.e., to ensure airtightness).

[0048] The container 2 has multiple (two in this case) connecting passages 14 and 15 that connect the internal space of the working area 100 to the outside. For example, passage 14 serves as a working fluid injection port, and passage 15 serves as a gas exhaust port. In this case, during the manufacturing process of the heat dissipation device 1, working fluid is injected into the internal space of the working area 100 through passage 14, and simultaneously, gas present in the internal space of the working area 100 is exhausted to the outside through passage 15. Passage 14 is located near one of the four corners of the first member 10, and passage 15 is located near the corner on the diagonal of passage 14.

[0049] It should be noted that the heat dissipation device 1 does not necessarily need to have multiple connecting paths 14 and 15. For example, the heat dissipation device 1 can also be a structure that only has one of the connecting paths 14 and 15.

[0050] Connecting passages 14 and 15 are blocked by the sealing part 5. By blocking connecting passages 14 and 15 using the sealing part 5, the internal space of the heat dissipation device 1 is sealed, and the working fluid is sealed within the working area 100. Thus, the heat dissipation device 1 is a sealed container with its interior sealed.

[0051] The working fluid is filled, for example, at a ratio of 10% to 95% of the total volume of the internal space of the working area 100. Preferably, the ratio is 30% to 75% of the total volume. More preferably, the ratio is 40% to 65% of the total volume. Furthermore, the remaining portion of the internal space of the working area 100, excluding the working fluid, is in a vacuum state containing a portion of the vaporized working fluid. Therefore, even at high temperatures, a vapor-liquid balance can be maintained, making it difficult to dry out. Additionally, efficient thermal diffusion occurs even at low temperatures, thus improving thermal diffusivity across various temperature ranges.

[0052] The first component 10, the second component 20, and the intermediate component 30 are made of ceramic. Examples of ceramics used to construct the first component 10, the second component 20, and the intermediate component 30 include alumina (Al2O3), zirconium oxide (ZrO2), silicon carbide (SiC), silicon nitride (Si3N4), aluminum nitride (AlN), and cordierite (Mg2Al3(AlSi5O3)). 18 (e.g., silicon impregnated silicon carbide (SiSiC)). In addition, the ceramics constituting the first component 10, the second component 20, and the intermediate component 30 can also be single crystals.

[0053] Metal heat sinks are difficult to make rigid due to material and manufacturing processes, making it difficult to achieve a thinner and lighter design. Furthermore, the parts of metal heat sinks that come into contact with the working fluid are metal, leaving room for improvement in corrosion resistance. In contrast, in the heat sink 1 of this embodiment, since the first component 10, the second component 20, and the intermediate component 30 are all made of ceramic, it is easier to achieve a thinner and lighter design compared to metal heat sinks, and it also exhibits superior corrosion resistance.

[0054] exist Figure 1 In the example shown, the heat dissipation device 1 is positioned so that the first member 10 faces upwards, but the position of the heat dissipation device 1 is not limited to this. Figure 1 For example, the heat sink 1 can also be positioned such that the first member 10 faces downwards. Furthermore, the heat sink 1 is not limited to... Figure 1 The horizontal setting shown can also be set vertically.

[0055] For heat dissipation devices with ceramic containers, ensuring durability, such as stress caused by phase change of the working fluid, is an important issue because ceramic is a brittle material.

[0056] In this case, the vapor chamber described in Patent Document 1 has a connecting passage for injecting working fluid in the working area. The thickness of the ceramic in the working area corresponds to the amount of internal space reduction. Therefore, the vapor chamber described in Patent Document 1, with its connecting passage in the working area, is prone to insufficient durability under stress, potentially leading to container breakage. Furthermore, if the container breaks, the working fluid sealed within the internal space may dry out, deteriorating heat dissipation efficiency.

[0057] In contrast, in the heat dissipation device 1 of this embodiment, the connecting paths 14 and 15 are located in the frame region 200. The frame region 200 is different from the working region 100 and is solid. By placing the connecting paths 14 and 15 in the frame region 200, durability can be improved compared to the case where the connecting paths 14 and 15 are located in the working region 100. Thus, the heat dissipation device 1 according to this embodiment can achieve improved durability.

[0058] Furthermore, according to the embodiment, the heat dissipation device 1 can ensure a larger effective space in the working area 100 compared to the case where the connecting paths 14 and 15 are located in the working area 100, thus improving the heat dissipation characteristics.

[0059] Furthermore, the frame region 200 where the connecting paths 14 and 15 are located is made of ceramic, the same material as the working region 100, thus reducing the likelihood of stress caused by thermal expansion differences. Therefore, the heat dissipation device 1 of this embodiment has high reliability.

[0060] Next, refer to Figure 2The structure of the first component 10 will be described. Figure 2 This is a diagram showing the first component 10 of the embodiment viewed from the negative Z-axis direction towards the positive Z-axis direction.

[0061] exist Figure 2 The lower surface of the first member 10 is shown, and more specifically, the surface (third surface) opposite the upper surface (first surface) of the intermediate member 30 is shown. Figure 2 As shown, the first component 10 has a grid-like first groove 11 on its third surface.

[0062] The first groove 11 has a first recess 11a that is recessed relative to the third surface, and a plurality of first protrusions 11b located within the first recess 11a. The first recess 11a is located at the center of the third surface, and its outline when viewed from above is, for example, quadrilateral. The plurality of first protrusions 11b are arranged longitudinally and laterally at intervals within the first recess 11a. Through these first recesses 11a and the plurality of first protrusions 11b, the first groove 11 has a lattice-like structure.

[0063] Hereinafter, the area on the third surface of the first member 10 where the first groove portion 11 is located will be referred to as the "first groove forming region 110". The first groove forming region 110 constitutes a part of the working region 100. In addition, the first member 10 has a rectangular frame-shaped first frame region 210 surrounding the first groove forming region 110. The first frame region 210 constitutes a part of the frame region 200.

[0064] Multiple (two in this case) through holes 141a and 151a that penetrate the first member 10 along the thickness direction (Z-axis direction in this case) are located in the first frame region 210. Through holes 141a form part of the first portion 141 in the connecting path 14, and through holes 151a form part of the first portion 151 in the connecting path 15.

[0065] A heat source is disposed in the center of the upper surface (fifth surface) on the opposite side of the lower surface (third surface) of the first member 10.

[0066] Next, refer to Figure 3 The structure of the second component 20 will be described. Figure 3 This is a diagram of the second component 20 of the embodiment, viewed from the positive Z-axis direction towards the negative Z-axis direction.

[0067] exist Figure 3 The image shows the upper surface of the second member 20, and more specifically, the surface (fourth surface) opposite the lower surface (second surface) of the intermediate member 30. (See image.) Figure 3 As shown, the second member 20 has a grid-like second groove 21 on its fourth surface.

[0068] The second groove 21 has a second recess 21a that is recessed relative to the fourth surface, and a plurality of second protrusions 21b located within the second recess 21a. The second recess 21a is located at the center of the fourth surface, and its outline when viewed from above is, for example, quadrilateral. The plurality of second protrusions 21b are arranged in the second recess 21a at intervals in the longitudinal and transverse directions. Through these second recesses 21a and the plurality of second protrusions 21b, the second groove 21 has a lattice-like structure.

[0069] Hereinafter, the area on the fourth surface of the second member 20 where the second groove portion 21 is located will be referred to as the "second groove forming region 120". The second groove forming region 120 constitutes a part of the working region 100. In addition, the second member 20 has a rectangular frame-shaped second frame region 220 surrounding the second groove forming region 120. The second frame region 220 constitutes a part of the frame region 200.

[0070] The size of the second groove forming region 120 in the second member 20 is the same as the size of the first groove forming region 110 in the first member 10. In addition, the position of the second groove forming region 120 on the fourth surface of the second member 20 is the same as the position of the first groove forming region 110 on the third surface of the first member 10.

[0071] In this way, by setting the shapes of the first groove 11 and the second groove 21 to a grid pattern, the working fluid can circulate efficiently within the internal space of the heat dissipation device 1. It should be noted that the shapes of the first groove 11 and the second groove 21 do not necessarily need to be grid-like.

[0072] Multiple recesses (two in this case) 141b and 151b recessed relative to the upper surface (fourth surface) of the second member 20 are located in the second frame region 220. Recess 141b forms part of the first portion 141 in the connecting path 14, and recess 151b forms part of the first portion 151 in the connecting path 15.

[0073] Additionally, grooves 142b and 152b are located in the second frame region 220. Groove 142b is a passage extending in a second direction (Y-axis direction) intersecting the extension direction (first direction, Z-axis direction in this case) of the first portion 141 in the connecting path 14, with one end opening into the recess 141b in the first portion 141 and the other end opening into the second groove forming region 120. Groove 152b is a passage extending in a second direction (Y-axis direction) intersecting the extension direction (first direction, Z-axis direction in this case) of the first portion 151 in the connecting path 15, with one end opening into the recess 151b in the first portion 151 and the other end opening into the second groove forming region 120.

[0074] Next, refer to Figure 4 The structure of intermediate component 30 is described. Figure 4 This is a diagram of the intermediate member 30 of the embodiment, viewed from the positive Z-axis direction towards the negative Z-axis direction.

[0075] like Figure 4 As shown, the intermediate member 30 has a rectangular frame-shaped third frame region 230. The third frame region 230 constitutes a part of the frame region 200. Furthermore, the intermediate member 30 has a central portion 32, which is circular in plan view and located inside the third frame region 230, and a plurality of connecting portions 33 located between the central portion 32 and the third frame region 230, connecting the central portion 32 and the third frame region 230. Figure 4 In the example shown, the central portion 32 is located in the center of the intermediate member 30. In addition, a plurality of connecting portions 33 extend radially from the central portion 32 toward the third frame region 230, spaced apart from each other.

[0076] The intermediate component 30 also has a plurality of steam holes 36 and a plurality of reflux holes 37. The plurality of steam holes 36 and the plurality of reflux holes 37 all penetrate the upper surface (first surface) and the lower surface (second surface) of the intermediate component 30.

[0077] Multiple steam holes 36 function as part of the steam flow path for the working fluid. The multiple steam holes 36 are located between two adjacent connecting portions 33. That is, the multiple steam holes 36 and the multiple connecting portions 33 are arranged alternately in the circumferential direction. The multiple steam holes 36 and the multiple connecting portions 33 are similarly spaced apart from each other, and extend radially from the central portion 32 toward the third frame region 230.

[0078] Multiple reflux orifices 37 function as part of the flow path for the working fluid. The reflux orifices 37 are micro-holes with an opening area smaller than the aforementioned steam orifices 36. Specifically, the reflux orifices 37 are small enough to induce capillary action in the working fluid passing through them.

[0079] Multiple (two in this case) through holes 141c and 151c that penetrate the intermediate member 30 along the thickness direction (Z-axis direction in this case) are located in the third frame region 230. Through hole 141c forms part of the first portion 141 in the connecting path 14, and through hole 151c forms part of the first portion 151 in the connecting path 15.

[0080] Figure 5 Is to make Figure 2 The first groove forming area 110 shown and Figure 3 The second groove forming region 120 shown is relative to Figure 4 The diagram shows the overlapping of intermediate components 30. It should be noted that... Figure 5 For ease of understanding, connected paths 14 and 15 have been omitted.

[0081] like Figure 5 As shown, the first groove forming region 110 and the second groove forming region 120 overlap with the third frame region 230 of the intermediate member 30. That is, the first groove forming region 110 and the second groove forming region 120 extend outward from the region in the intermediate member 30 where a plurality of steam holes 36 and a plurality of return holes 37 are formed (hereinafter referred to as the "hole forming region").

[0082] In this way, by making the first groove forming region 110 of the first component 10 and the second groove forming region 120 of the second component 20 wider than the hole forming region of the intermediate component 30, the internal space of the heat dissipation device 1 can be expanded outward compared to the case where the first groove forming region 110 and the second groove forming region 120 are set to the same extent as the hole forming region.

[0083] The heat source is located in the center of the heat sink 1. Therefore, the further away from the heat source, i.e., the closer to the outer periphery of the heat sink 1, the lower the temperature of the heat sink 1. Furthermore, the vapor of the working fluid condenses as it moves towards the low-temperature region, thus becoming liquid. Therefore, by expanding the internal space of the heat sink 1 outwards, condensation of the working fluid is made more likely. This makes drying out difficult.

[0084] It should be noted that, here, an example is shown in which the first groove forming region 110 and the second groove forming region 120 extend outward compared to the hole forming region of the intermediate member 30, but it is not limited thereto. The hole forming region of the intermediate member 30 may also extend outward compared to the first groove forming region 110 and the second groove forming region 120.

[0085] The working area 100 of the heat dissipation device 1 has an internal space enclosed by a first groove forming region 110 and a second groove forming region 120, and a working fluid is sealed in this internal space. Furthermore, an intermediate member 30 is sandwiched between the first groove forming region 110 and the second groove forming region 120 in the internal space, thereby dividing the working area 100 into a first space enclosed by the first groove forming region 110 and the intermediate member 30, and a second space enclosed by the second groove forming region 120 and the intermediate member 30. These first and second spaces are connected by a vapor hole 36 and a return hole 37 formed on the intermediate member 30.

[0086] Next, refer to Figure 6 as well as Figure 7 The flow of the working fluid in the heat dissipation device 1 of the embodiment will be described. Figure 6 as well as Figure 7 This is a diagram illustrating the flow of the working fluid in the heat dissipation device 1 according to the embodiment. It should be noted that... Figure 6 From Figure 5 The diagram shown omits the area 230 in the third frame. Figure 7 yes Figure 6 Sectional view along line VII-VII. Additionally, in Figure 6 as well as Figure 7 In the diagram, hollow arrows represent the flow of steam, while black arrows represent the flow of liquid.

[0087] The working fluid is vaporized by heating with a heat source, thus becoming steam. As described above, the heat source is located in the first component 10 (see reference 10). Figure 1 , Figure 2 The central portion of the upper surface (fifth surface) of the first space. Therefore, the vapor of the working fluid is generated in the central portion of the first space (the space sandwiched between the first member 10 and the intermediate member 30).

[0088] The vapor of the working fluid diffuses into the in-plane direction (XY plane direction) of the heat dissipation device 1 through the first tank portion 11 of the first tank forming region 110 (see reference). Figure 6 The hollow arrow shown moves through multiple steam holes 36 into the second space (the space sandwiched between the second member 20 and the intermediate member 30) (see reference). Figure 7 (The arrow shown is marked in white).

[0089] The steam moving towards the second space condenses due to the decrease in temperature, thus becoming a liquid. The liquefied working fluid, through the capillary force of the second tank section 21, causes the second tank forming area 120 to move towards the center of the heat dissipation device 1 (see reference). Figure 6 (The blackened arrows are shown). During this process, the working fluid enters the reflux orifice 37 and returns to the first space through the capillary force of the reflux orifice 37 (see reference). Figure 7 (The blacked-out arrows are shown). By repeating the above cycle, heat dissipation device 1 is able to move heat away from the heat source.

[0090] Next, refer to Figure 8 The structure of connecting paths 14 and 15 is explained. Figure 8 This is a schematic cross-sectional view showing a structural example of connecting path 14. Figure 8 As an example, connected path 14 is illustrated, but connected path 15 also has the same structure as connected path 14.

[0091] like Figure 8 As shown, the connecting path 14 connects the internal space of the working area 100 to the outside. The connecting path 14 has a first portion 141 that extends along the thickness direction of the container 2 (here, the Z-axis direction) and opens to the outside, and a second portion 142 that extends along the surface direction of the container 2 (here, the Y-axis direction) and opens to the internal space of the working area 100.

[0092] The first portion 141 is formed by the through hole 141a of the first member 10, the recess 141b of the second member 20, and the through hole 141c of the intermediate member 30. The second portion 142 is formed by the groove 142b of the second member 20 and the lower surface 302 (second surface) of the intermediate member 30. It should be noted that... Figure 8 The example shown is that the recess 141b of the connecting path 14 is recessed than the groove 142b of the second part 142, but the recess 141b and the groove 142b can also be on the same surface.

[0093] Thus, the connecting path 14 has a first portion 141 extending in a first direction (here, the Z-axis direction) and a second portion 142 extending in a direction intersecting the first direction (here, the Y-axis direction). In other words, the connecting path 14 is curved. Therefore, according to the embodiment of the heat dissipation device 1, even when high pressure is generated in the working area 100, it is not easy to apply high pressure to the sealing portion 5, thus achieving high reliability.

[0094] The first portion 141 opens on the upper surface of the first member 10 and extends across the first and second spaces of the working area 100 in the frame region 200. The second portion 142 is located in the frame region 200 on the second space side of the working area 100.

[0095] In the heat dissipation device 1, the first space side of the first space and the second space becomes high pressure. In other words, the pressure of the second space side of the first space and the second space is relatively low. Therefore, by having the second part 142 located on the second space side, it is possible to suppress the application of high pressure to the connecting path 14.

[0096] like Figure 1 As shown, connecting path 14 is located between connecting path 15, sandwiching the working area 100. By configuring the two connecting paths 14 and 15 in this way, compared to, for example, a case where the two connecting paths 14 and 15 are arranged laterally, it is possible to suppress localized degradation of durability.

[0097] It should be noted that the through hole 141a in the first part 141 of the connecting path 14 is equivalent to a first passage 141a having a first opening and opening to the outside. In addition, the through hole 141c is equivalent to a second passage 141c that is continuous with the through hole 141a and has a smaller diameter than the first passage.

[0098] Next, the structure of the sealing part 5 will be explained. Figure 9 This is a schematic cross-sectional view showing the structure of the sealing part 5.

[0099] like Figure 9As shown, the sealing part 5 has a block-shaped body 51 and an annular body 52. ​​The block-shaped body 51 and the annular body 52 constitute the core and flange of the sealing part 5. The block-shaped body 51 and the annular body 52 are made of metal, for example. Examples of metals constituting the block-shaped body 51 and the annular body 52 include Cu (copper). It should be noted that the block-shaped body 51 and the annular body 52 may also be made of metals other than Cu. Examples of metals other than Cu include Al, Cr, Ni, Co, Sn, Au, Fe, and Co. Furthermore, the metal constituting the block-shaped body 51 and the annular body 52 may be an alloy containing at least two of Cu, Al, Cr, Ni, Co, Sn, Au, Fe, and Co, such as stainless steel. It should be noted that the metal constituting the block-shaped body 51 and the annular body 52 is preferably a metal with Cu as its main component. The main component is, for example, a material that accounts for 50% or more by mass or 80% or more by mass of the material.

[0100] The block 51 is a block-shaped component. For example, the block 51 is generally spherical. In the embodiment, the block 51 has flat surfaces 511 and 512 at its first end (here, the upper end of the block 51) and second end (here, the lower end of the block 51) in the thickness direction of the first component 10, respectively. The flat surfaces 511 and 512 are parallel to each other. When viewed in a cross-section cut with a section perpendicular to the flat surfaces 511 and 512 (i.e., Figure 9 (As shown in the cross-section view), the flat surfaces 511 and 512 are connected by convex curved surfaces. Thus, the block 51 of the embodiment is a sphere having flat surfaces 511 and 512 at the first and second ends.

[0101] The annular body 52 has an opening 520 (an example of a second opening) with a diameter smaller than the opening diameter (diameter in the upper surface of the first member 10) of the opening on the outer side of the through hole 141a (an example of a first opening), and is located on the first member 10 such that the opening 520 overlaps with the first opening of the through hole 141a.

[0102] The annular body 52 has a first portion 521 located on the upper surface of the first member 10 and a second portion 522 located on the wall of the through hole 141a. The first portion 521 is a thin plate-like portion that extends along the upper surface of the first member 10. The first portion 521 is bonded to the upper surface of the first member 10 by a bonding layer 55 made of a bonding material such as brazing filler metal.

[0103] The first portion 521 is roughly annular in top view, with the opening 520 located in the center. The second portion 522 extends from the edge of the opening 520 toward the depth of the through hole 141a. It should be noted that the depth of the through hole 141a is simply a position deeper than the edge of the opening 520, and is not limited to a specific location. The second portion 522 extends along the wall of the through hole 141a. It should be noted that the second portion 522 does not necessarily need to be along the wall of the through hole 141a. Furthermore, the second portion 522 does not necessarily need to contact the wall of the through hole 141a; a gap may exist between the second portion 522 and the wall of the through hole 141a.

[0104] Figure 10 yes Figure 9 A schematic cross-sectional view shown in the X-ray direction. (See attached image.) Figure 10 As shown, the second portion 522 of the annular body 52 is located between the first member 10 and the block body 51. The block body 51 is located radially inward of the second portion 522 near the through hole 141a, and is in contact with the second portion 522 around its entire circumference. Furthermore, the block body 51 is physically integrated with the annular body 52 at the contact portion with the second portion 522. Here, "physically integrated" means that the block body 51 and the annular body 52 are physically joined without gaps. Additionally, "physically integrated" means that the proportion of diffusion bonding is zero or minimal.

[0105] The block 51 presses the second portion 522 toward the wall of the through hole 141a. In other words, the block 51 presses the through hole 141a via the second portion 522. As described above, the second portion 522 may not necessarily be in contact with the wall of the through hole 141a. Even in this case, since the first portion 521 is joined to the upper surface of the first member 10 by a bonding material, the airtightness of the heat dissipation device 1 is not compromised.

[0106] Thus, the sealing portion 5 of the embodiment seals the heat dissipation device 1 by blocking the through hole 141a using the block body 51 and the annular body 52. ​​According to this structure, for example, compared with the case where only the block body 51 is used to block the through hole 141a, that is, the case where the seal is performed between the metal and the ceramic, it is possible to suppress the generation of cracks in the first member 10 and block the through hole 141a.

[0107] Furthermore, in this embodiment, the sealing portion 5 utilizes the second portion 522 located inside the through hole 141a in the annular body 52 and the block body 51 to block the through hole 141a. According to this structure, by pressing the block body 51 and the second portion 522 against each other, the airtightness of the heat dissipation device 1 can be improved.

[0108] Furthermore, in the sealing portion 5 of the embodiment, the block 51 enters the through hole 141a. By adopting this structure, for example, it is possible to suppress the working fluid from adhering to the wall surface of the through hole 141a.

[0109] Furthermore, in the heat dissipation device 1 of the embodiment, the through hole 141c, which serves as the second passage, is located below the block body 51. In other words, when the heat dissipation device 1 is viewed from above, the through hole 141c is positioned overlapping with the block body 51. Moreover, in the sealing portion 5 of the embodiment, the block body 51 blocks the through hole 141c. Specifically, the block body 51 has a flat surface 511, which blocks the opening of the through hole 141c. By adopting this structure, the infiltration of working fluid into the connecting passage 14 (through hole 141a) can be more reliably suppressed. Furthermore, the airtightness of the heat dissipation device 1 can be further improved.

[0110] Additionally, although the illustration is omitted here, multiple protrusions and recesses may exist on the upper surface (first surface) of the intermediate member 30, opposite the flat surface 511 of the block 51. In this case, it is possible to suppress the positional shift of the block 51 in the horizontal direction (the direction orthogonal to the thickness direction of the heat dissipation device 1).

[0111] In the heat dissipation device 1 of the embodiment, a through hole 141c is provided in the intermediate member 30 made of ceramic. According to this structure, when the block 51 is pressed into the connecting passage 14, even when the block 51 is in contact with the intermediate member 30, the breakage of the intermediate member 30 can be suppressed compared with the case where the through hole 141c is not provided at the contact point.

[0112] Furthermore, the heat dissipation device 1 in this embodiment is a sealed container made of ceramic. That is, the first component 10, the second component 20, and the intermediate component 30 are made of ceramic.

[0113] Compared to metals, ceramics have a larger Young's modulus, meaning they are more rigid. The block 51 (metal block) of the metal sealing part 5 deforms under heat in the direction of pressing and expanding the connecting passage 14 (through hole 141a). Assuming the heat sink is made of metal, if the block 51 deforms in the direction of pressing and expanding the connecting passage 14, the through hole 141a will also easily deform in the direction of diameter expansion. In contrast, even if the block 51 of the ceramic heat sink 1 deforms in the direction of pressing and expanding the through hole 141a, the through hole 141a is less prone to deformation compared to the metal heat sink. Therefore, the ceramic heat sink 1 more easily ensures airtightness relative to temperature changes (especially temperature rises) compared to the metal heat sink.

[0114] Furthermore, according to another perspective, ceramics have a smaller coefficient of thermal expansion compared to most metals, except for a few metals such as W (tungsten), Mo (molybdenum), Ti (titanium), Nb (niobium), and Zr (zirconium). That is, ceramic heat sinks are less prone to thermal deformation than metal heat sinks. Therefore, ceramic heat sinks are more likely to maintain the state where the block 51 is pressed against the through hole 141a by the annular body 52, compared to metal heat sinks. Thus, ceramic heat sinks are more likely to ensure airtightness relative to thermal cycling compared to metal heat sinks. Additionally, ceramic heat sinks are less prone to corrosion even when exposed to acids or high-temperature water vapor, and are less prone to oxidation even at high temperatures, compared to metal heat sinks.

[0115] It should be noted that, as mentioned above, examples of ceramics constituting the first component 10, the second component 20, and the intermediate component 30 include alumina, zirconium oxide, and silicon carbide. Among these ceramics, alumina is preferred as the ceramic constituting the first component 10, the second component 20, and the intermediate component 30, considering its low cost, minimal environmental impact, and excellent processability.

[0116] In the embodiment, the interior of the heat dissipation device 1 is in a depressurized state (including vacuum) when no heat source is placed on the upper surface (fifth surface) of the first member 10. On the other hand, if a heat source is placed on the upper surface of the first member 10, the working fluid vaporizes and expands in volume, thereby pressurizing the interior of the heat dissipation device 1. Thus, the pressure state inside the heat dissipation device 1 alternates between a depressurized state and a pressurized state depending on the presence or absence of a heat source.

[0117] In contrast, the sealing part 5 of the embodiment uses the block 51 to press the annular body 52 toward the wall of the connecting passage 14, thus easily ensuring both airtightness under depressurization and airtightness under pressurization.

[0118] In addition, such as Figure 8 and Figure 9 As shown, the through hole 141a of the connecting path 14 has a tapered shape that expands from the upper surface of the first member 10 toward the lower surface (third surface). By adopting this structure, even when the interior of the heat dissipation device 1 is under pressure, the block 51 is difficult to detach from the connecting path 14, thus ensuring a more reliable seal under pressure.

[0119] It should be noted that, not limited to this example, the through hole 141a of the connecting path 14 can also have a tapered shape that narrows from the upper surface of the first member 10 toward the lower surface (third surface). In this case, when the block 51 is pressed into the through hole 141a, the stress applied to the through hole 141a can also be dispersed in the thickness direction of the first member 10, thus making it less likely for cracks to form in the through hole 141a when the block 51 is pressed in.

[0120] In the sealing portion 5 of the embodiment, the annular body 52 has a first portion 521, which engages with the upper surface of the first member 10 around the through hole 141a. According to this structure, it is possible to suppress the generation or progression of cracks around the through hole 141a.

[0121] In the sealing portion 5 of the embodiment, the diameter of the opening 520 of the annular body 52 is smaller than the diameter of the through hole 141a. In other words, the first portion 521 of the annular body 52 extends radially inward into the through hole 141a more than the opening edge of the through hole 141a (i.e., the edge of the first opening). By adopting this structure, it is possible to suppress the generation or progression of cracks from around the through hole 141a, especially from the opening edge of the through hole 141a.

[0122] In the sealing portion 5 of the embodiment, the annular body 52 is joined to the upper surface of the first member 10 via the bonding layer 55. By adopting this structure, the sealing performance between the upper surface of the first member 10 and the sealing portion 5 can be improved.

[0123] In the sealing portion 5 of the embodiment, when comparing the block body 51 and the annular body 52, the block body 51 protrudes more (protrusion height) from the upper surface of the first member 10 than the annular body 52. ​​That is, the block body 51 protrudes more from the upper surface of the first member 10 than the annular body 52. ​​With this structure, when a heat source is disposed on the upper surface of the block body 51, it is easy to bring the block body 51 into contact with the heat source. By bringing the metal block body 51 into contact with the heat source, heat can be easily transferred to the interior of the heat dissipation device 1 through the block body 51, thereby improving the heat exchange efficiency of the heat dissipation device 1.

[0124] It should be noted that, in the heat dissipation device 1 of the embodiment, it is preferable that the stress applied to the container 2 does not exceed the destructive strength of the container 2. In addition, it is preferable that the residual stress in the region not in contact with the annular body 52 in the residual stress applied to the container 2 by the block 51 is greater than the residual stress in the region in contact with the annular body 52.

[0125] Figure 11 This is a schematic cross-sectional view illustrating an example of the structure of the ring-shaped body 52. ​​(See attached image.) Figure 11As shown, the thickness T2 of the second portion 522 in the annular body 52 can be thinner than the thickness T1 of the first portion 521. The block body 51 applies stress in the direction of pressing the annular body 52. ​​This stress concentrates at the opening edge 101 of the connecting passage 14, which may cause cracks to form at the opening edge 101 of the connecting passage 14. In contrast, when the thickness T2 of the second portion 522 is thinner than the thickness T1 of the first portion 521, the elastic deformation of the second portion 522 is relatively reduced, thereby alleviating the stress concentration and thus suppressing the formation of cracks in the opening edge 101 of the connecting passage 14.

[0126] Furthermore, the opening edge 101 of the connecting passage 14 can be separated from the annular body 52. ​​For example, as Figure 11 As shown, the opening edge 101 of the connecting path 14 can be chamfered into an R-shape when viewed in cross-section. In other words, the opening edge 101 can be bent into a convex shape when viewed in cross-section. As a result, a gap can be formed between the opening edge 101 of the connecting path 14 and the corner of the annular body 52. ​​That is, the opening edge 101 of the connecting path 14 can be separated from the annular body 52.

[0127] In this way, by separating the opening edge 101 of the connecting path 14 from the annular body 52, the stress caused by the thermal expansion difference between the first member 10 and the annular body 52 is difficult to be transmitted to the opening edge 101 of the connecting path 14, thus making it less likely for cracks to form in the opening edge 101 of the connecting path 14.

[0128] Figure 12 and Figure 13 This is a schematic cross-sectional view illustrating another example of the structure of the ring-shaped body 52. ​​(See attached image.) Figure 12 As shown, the annular body 52 may have a recess 527 at the corner of the first portion 521 and the second portion 522 opposite to the opening edge 101 of the connecting passage 14. The recess 527 extends circumferentially and is recessed in a direction away from the opening edge 101 of the connecting passage 14. Even in this case, the opening edge 101 of the connecting passage 14 can be separated from the annular body 52. ​​In addition, as Figure 13 As shown, regarding the annular body 52, the corner 523 of the first portion 521 and the second portion 522, which are opposite to the opening edge 101 of the connecting passage 14, can also be located radially inward of the connecting passage 14 than the opening edge 101 of the connecting passage 14. Even in this case, the opening edge 101 of the connecting passage 14 can be separated from the annular body 52.

[0129] like Figure 11As shown, the front end portion 525 of the second portion 522 can have a pointed shape. In other words, the front end portion 525 of the second portion 522 can have a shape in which the thickness decreases towards the front end. In this way, by making the front end portion 525 of the second portion 522 into a pointed shape, the stress concentration caused by the expansion of the wall surface of the through hole 141a by the block 51 can be mitigated, and thus the generation of cracks in the wall surface of the through hole 141a can be suppressed.

[0130] like Figure 11 As shown, the foremost point of the front end 525 in the second part 522 can also be close to the wall side of the through hole 141a. When the second part 522 of the annular body 52 is in contact with the through hole 141a, if the foremost point of the second part 522 is close to the wall side of the through hole 141a, the contact area between the second part 522 and the wall of the through hole 141a is large, and therefore the heat dissipation device 1 has high airtightness.

[0131] Figure 14 and Figure 15 This is a schematic cross-sectional view illustrating another example of the structure of the ring-shaped body 52. ​​(See attached image.) Figure 14 and Figure 15 As shown, the foremost point of the front portion 525 in the second part 522 can be close to the block body 51. In this case, the contact area between the second part 522 and the block body 51 is large, thus the heat dissipation device 1 has high airtightness. It should be noted that, as Figures 11-14 As shown, the front end 525 of the second part 522 can be convexly curved when viewed in cross-section, or it can be as shown in the figure. Figure 15 As shown, it exhibits a concave curvature when viewed in cross-section.

[0132] Figure 16 and Figure 17 This is a schematic cross-sectional view illustrating another example of the structure of block 51. (See attached image.) Figure 16 As shown, the second end of the block 51 (here, the lower end of the block 51) can enter the through hole 141c. By adopting this structure, the infiltration of working fluid into the through hole 141a can be more reliably suppressed. Furthermore, the airtightness of the heat dissipation device 1 can be further improved. Additionally, as... Figure 17 As shown, the block 51 can be separated from the upper surface (first surface) of the intermediate member 30. In this case, the block 51 may have a flat surface 512 only at the first end (here, the upper end of the block 51) and the second end (here, the lower end of the block 51).

[0133] Figure 18 This is a schematic cross-sectional view illustrating another example of the structure of connecting path 14. (See attached image.) Figure 18 As shown, the connecting path 14 can be located in the working area 100. In this case, the connecting path 14 can be formed solely by a through hole 141a as described above (e.g., refer to...). Figure 8 It is a component of ) . Figure 18 In this state, the block 51 is raised from the upper surface of the second component 20, but the block 51 can be in contact with the upper surface of the second component 20.

[0134] Next, an example of the manufacturing method of the heat dissipation device 1 according to the embodiment will be described. First, using the raw materials of the first component 10, the second component 20 and the intermediate component 30, green sheets are formed by means of a scraper method or a roll compression method, and a laminate is obtained by stacking multiple green sheets.

[0135] Next, the obtained laminate is subjected to laser processing and die punching to obtain the first component 10, the second component 20, and the intermediate component 30. For example, by performing laser processing on the laminate, an intermediate component 30 with through holes 141c and 151c, multiple steam holes 36, and multiple reflux holes 37 can be obtained. In addition, by performing laser processing on the obtained laminate, a first component 10 with through holes 141a and 151a and a first groove forming region 110 can be obtained. In addition, by performing laser processing on the obtained laminate, a second component 20 with recesses 141b and 151b, grooves 142b and 152b, and a second groove forming region 120 can be obtained.

[0136] Next, the formed bodies of the first component 10, the second component 20, and the intermediate component 30 are stacked and fired in the order of the second component 20, the intermediate component 30, and the first component 10, thereby obtaining a sintered body of the container 2 in which the first component 10, the second component 20, and the intermediate component 30 are integrated. In this way, the first component 10, the second component 20, and the intermediate component 30 are integrally formed. Therefore, adhesives are not required, and a highly reliable heat dissipation device 1 can be obtained.

[0137] It should be noted that the method for obtaining the shaped bodies of the first component 10, the second component 20, and the intermediate component 30 is not limited to the method described above. For example, the shaped bodies can also be obtained by stacking the green sheets after processing them. In addition, in the example above, the shaped bodies of the container 2 are obtained by stacking them after the first component 10, the second component 20, and the intermediate component 30 are manufactured separately. However, the shaped body of the container 2 can also be obtained by sequentially stacking, for example, processed green sheets.

[0138] Next, for example, working fluid is injected into the interior of the sintered body from one of the connecting passages 14 and 15. Gases present inside the sintered body are discharged to the outside from the other direction of the connecting passages 14 and 15 as the working fluid is injected.

[0139] Next, a vacuum pump or other pressure-reducing device is used to evacuate the interior of the sintered body via connecting paths 14 and 15. It should be noted that the interior of the sintered body is preferably in a vacuum state, but it does not need to be strictly in a vacuum state; for example, it can also be in a pressure-reducing state close to a vacuum state.

[0140] Next, the connecting passages 14 and 15 are sealed under a vacuum inside the sintered body. (Refer to...) Figures 19-21 An example of this sealing process will be described. Figures 19-21 This is a diagram illustrating an example of a sealing process.

[0141] First, prepare Figure 19 The indented annular body 52X and shown Figure 20 The pre-pressed block 51X is shown. The pre-pressed annular body 52X is, for example, a thin sheet of metal with an opening 520X in the center. A metal washer can be used as such a pre-pressed annular body 52X. Alternatively, the pre-pressed block 51X can be, for example, a spherical metal. The diameter of the pre-pressed block 51X is larger than the diameter of the opening 520X, but smaller than the diameter of the connecting passage 14.

[0142] like Figure 19 As shown, the pre-pressed annular body 52X is joined to the upper surface of the first member 10 via the bonding layer 55. It should be noted that the pre-pressed annular body 52X is placed on the upper surface of the first member 10 such that the center of the opening 520X coincides with the center of the through hole 141a in the connecting passage 14. The diameter of the opening 520X is smaller than the diameter of the through hole 141a, and a portion of the pre-pressed annular body 52X located on the opening 520X side extends radially inward into the connecting passage 14 beyond the opening edge of the connecting passage 14. The bonding layer 55 is not located in the portion of the pre-pressed annular body 52X that extends radially inward into the connecting passage 14 beyond the opening edge of the connecting passage 14.

[0143] Next, as Figure 20 As shown, a pre-pressed block 51X is placed on the opening 520X of the pre-pressed annular body 52X. Furthermore, as... Figure 21As shown, for example, a stamping device 300 is used to press the pre-pressed block 51X from above. As a result, the pre-pressed block 51X is pressed into the through hole 141a. The pre-pressed annular body 52X deforms by bending the periphery of the opening 520X toward the inside of the through hole 141a as the pre-pressed block 51X is pressed in. Thus, the pre-pressed annular body 52X becomes an annular body 52 having a first portion 521 and a second portion 522. Furthermore, the pre-pressed block 51X becomes a block 51 with a flat surface 512 by having its upper end pressed against the stamping surface of the stamping device 300. Additionally, when the pre-pressed block 51X is pressed in until it contacts the upper surface of the intermediate member 30, it becomes a block 51 with a flat surface 511.

[0144] When the pre-pressed block 51X is pressed into the through hole 141a, it applies stress to the pre-pressed annular body 52X while rubbing against it. As a result, the pre-pressed block 51X and the pre-pressed annular body 52X are joined without gap. That is, the block 51 and the annular body 52 are physically integrated. Thus, the connecting passages 14 and 15 are sealed by the sealing part 5, resulting in the heat dissipation device 1.

[0145] (Example)

[0146] A heat dissipation device was manufactured using alumina as the first, second, and third components, and Cu (copper) as the ring and bulk bodies, by the manufacturing method described above. The dimensions of the manufactured heat dissipation device (hereinafter referred to as the "heat dissipation device of the embodiment") are as follows.

[0147] External dimensions (width × length × thickness): 50mm × 50mm × 0.5mm

[0148] Width of the frame area located on the outer side of the groove forming area: 10mm

[0149] Through hole opening diameter: 1.7mm

[0150] Dimensions of the pre-pressed annular body (outer diameter × inner diameter × thickness): 8mm × 0.9mm × 0.2mm

[0151] Outer diameter of the pre-pressed block: 1.2mm

[0152] Furthermore, the airtightness of the heat dissipation device of the embodiment was tested. Specifically, the heat dissipation device of the embodiment was placed in a vacuum for a specified period (several days), and the presence or absence of weight change before and after placement was confirmed. The result was that no weight change was observed in the heat dissipation device of the embodiment before and after placement in a vacuum. This means that the working fluid located in the internal space of the heat dissipation device did not leak to the outside of the heat dissipation device. This result confirms that the airtightness of the heat dissipation device of the embodiment is ensured.

[0153] (First variation)

[0154] Figure 22 This is a schematic cross-sectional view showing the structure of the heat dissipation device 1 in the first modified example. For example... Figure 22 As shown, the container 2 of the heat dissipation device 1 may have a recessed surface 112 on the upper surface 111 (fifth surface) of the first member 10. In this case, the through hole 141a (an example of an opening) may open on the recessed surface 112. In addition, the first portion 521 of the annular body 52, which is part of the flange portion, may also be located on the recessed surface 112. By adopting this structure, the heat dissipation device 1 can be made thinner. In addition, in this case, the flat surface 512 of the sealing portion 5 (the surface of the sealing portion 5 that protrudes most from the recessed surface 112) may be lower than the upper surface 111 of the first member 10. By adopting this structure, the heat dissipation device 1 can be further made thinner.

[0155] (Second variation)

[0156] In the above embodiments, an example was described where the sealing part 5 includes two components: a block-shaped body 51 and an annular body 52. ​​However, the sealing part 5 can also be a single component. (Refer to...) Figure 23 An example of this situation will be provided. Figure 23 This is a schematic cross-sectional view showing the structure of the heat dissipation device 1 in the second variation.

[0157] like Figure 23 As shown, the heat dissipation device 1 includes a sealing portion 5 comprising a core portion 501 and a flange portion 502 connected to the core portion 501. The core portion 501 is the portion of the sealing portion 5 located inside the opening 115, and the flange portion 502 is the portion located outside the opening 115. The boundary between the core portion 501 and the flange portion 502 is the edge portion 116 of the opening 115. That is, in Figure 23 In the middle, the part located below the edge 116 of the opening 115 is the core 501, and the part located above is the flange 502.

[0158] The flange portion 502 engages with the container 2 around the opening 115. Specifically, the flange portion 502 engages with the upper surface 111 of the container 2 located around the opening 115 via the engagement layer 55.

[0159] A portion of the core 501 contacts the wall surface of the opening 115. Specifically, the core 501 has a main body 505 and a large-diameter portion 506 located on the entire circumference of the main body 505 and connected to the flange 502. The large-diameter portion 506 is connected to the flange 502 on the entire circumference.

[0160] In the above embodiments, examples of through holes 141a and 151a having a conical shape have been described, but the shapes of through holes 141a and 151a are not limited to conical shapes. For example, the shapes of through holes 141a and 151a may also be straight lines with a substantially constant diameter.

[0161] Furthermore, in the above embodiments, an example of a generally spherical block 51 has been described, but the block 51 does not necessarily need to be spherical. For example, the block 51 may also have a wedge shape, that is, the width of the block 51 gradually narrows from the first end exposed to the outside of the heat dissipation device 1 (here, the upper end of the block 51) toward the second end located inside the connecting passage 14 (here, the lower end of the block 51).

[0162] As described above, the thermal device of the embodiment (for example, heat dissipation device 1) is a thermal device that utilizes the latent heat of a phase change substance (for example, a working fluid). The thermal device of the embodiment has a ceramic container (for example, container 2) and a sealing part (for example, sealing part 5). The ceramic container has a phase change region (for example, working region 100) containing the phase change substance and a connecting passage (for example, connecting passages 14 and 15) connecting the phase change region to the outside. The sealing part blocks the connecting passage. In addition, the sealing part has a metal annular body (for example, annular body 52) and a block body (for example, block body 51). The annular body has an opening with a diameter smaller than the connecting passage, and the opening is located on the container in a manner that overlaps with the connecting passage. The block body is located radially inside the connecting passage compared to the annular body, contacts the annular body around its entire circumference, and is integrated with the annular body at the contact point.

[0163] Therefore, the thermal device according to the embodiment can improve the airtightness.

[0164] The thermal device disclosed herein is not limited to a heat dissipation device. For example, the thermal device disclosed herein may also be a heat storage device that stores the latent heat of a phase change accompanying a heat storage material (an example of a phase change substance) as thermal energy. In this case, the heat storage material may be a material undergoing a solid-liquid phase change or a solid-solid phase change. Thus, the phase change substance does not necessarily need to undergo a gas-liquid phase change. In other words, the phase change substance is not necessarily a liquid, but may also be a solid.

[0165] The embodiments disclosed herein should be considered illustrative rather than limiting in all respects. In fact, the above-described embodiments can be presented in various ways. Furthermore, the above-described embodiments can be omitted, substituted, or modified in various ways without departing from the appended technical solutions and their spirit.

[0166] Explanation of reference numerals in the attached figures

[0167] 1. Heat dissipation components

[0168] 5. Sealing section

[0169] 10 First Component

[0170] 11 First trench section

[0171] 11a first recess

[0172] 11b first convex part

[0173] Connecting paths 14 and 15

[0174] 20 Second component

[0175] 21 Second Groove

[0176] 21a Second recess

[0177] 21b second convex part

[0178] 30 Intermediate components

[0179] 36 Steam holes

[0180] 37 Reflux hole

[0181] 51. Blocky body

[0182] 52 Circular bodies

[0183] 100 work areas

[0184] 141 First Part

[0185] 141a Through hole, first passage

[0186] 141b recess

[0187] 141c Through hole, second passage

[0188] 142 Second Part

[0189] 200-frame area

[0190] 501 core

[0191] 502 Flange

[0192] 520 Opening.

Claims

1. A thermal device, wherein, The thermal device has: A ceramic container having an interior space, an opening connected to the interior space, and a passage connecting the interior space and the opening; Fluid, which is located in the internal space; and A sealing part that blocks the opening. The sealing portion has a core and a flange portion connected to the core. The flange portion engages with the container around the opening. The core is located within the opening. A portion of the core contacts the wall surface of the opening. The flange is joined to the container via a bonding layer made of metal. The core has: Main body; and The large-diameter portion is located on the entire circumference of the main body portion and is connected to the flange portion. The thickness of the large-diameter portion is thinner than the thickness of the flange portion.

2. The thermal device according to claim 1, wherein, The front end of the large-diameter portion has a pointed shape.

3. The thermal device according to claim 1 or 2, wherein, The sealing part is separated from the edge of the opening.

4. The thermal device according to claim 1 or 2, wherein, The sealing part has a concave or convex portion on its upper surface.

5. The thermal device according to claim 1 or 2, wherein, The container has a main surface and a recessed surface that is concave relative to the main surface. The opening is located on the concave surface. The flange portion is located on the recessed surface.

6. The thermal device according to claim 1 or 2, wherein, The container has: A flat intermediate member having a plurality of reflux holes extending through a first surface and a second surface located on the opposite side of the first surface; The first component has a first groove on a third surface facing the first surface of the intermediate component; as well as The second component has a second groove on a fourth surface opposite to the second surface of the intermediate component.

7. The thermal device according to claim 1 or 2, wherein, The connecting path has: A first passage, which is connected to the opening; and The second passage is connected to the first passage and is located on the internal space side. The diameter of the second passage is smaller than the diameter of the first passage. The second passage is blocked by the core.

8. The thermal device according to claim 7, wherein, A portion of the core enters the second passage.

9. The thermal device according to claim 1 or 2, wherein, The connecting path has a tapered portion when viewed in cross-section.

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