Vacuum processing apparatus and method for manufacturing a vacuum processed substrate

Abstract

Substrates supported in a substrate holder are carried on a holder carrier (5) in a manner that their extended surfaces are exposed to the ambient atmosphere along the extended surface of the holder carrier (5). The holder carrier (5) comprises an axis (A 11TR ,A 11LL ) transverse to the extended surface thereof. The substrates on the holder carrier (5) are vacuum processed in a vacuum processing chamber (15). The chamber (15) communicates with a transfer vacuum chamber (23) via a gate valve (21). The holder carrier (5) with the substrates in the vacuum processing chamber (15) is exchanged with a holder carrier (5) carrying unprocessed substrates from the transfer vacuum chamber 23 by an exchange robot (33). During processing in the vacuum processing chamber (15), the holder carrier (5) with the processed substrates and the holder carrier (5) with the unprocessed substrates are exchanged in the transfer vacuum chamber (23) by a gate valve (25). The transfer vacuum chamber (23) acts as a load lock.

Description

Summary of the Invention

[0001] The starting point of this invention is the need to increase the throughput of processed substrates when processing batches of substrates by evaporation vacuum. However, the solution first discovered by the inventors can be generally applied to vacuum processing techniques that satisfy all of the following definitions, which will be provided by means of... Figures 1 to 6 Let me explain.

[0002] definition:

[0003] i) The substrate holder SH is a means or part of a device for holding the substrate on the holder carrier HC via or therein. Thus, an extended surface of the substrate held in the SH is freely exposed to the ambient atmosphere, possibly in addition to the components used to hold the substrate that overlap with the aforementioned freely exposed surface. Figure 1 An example of SH 1 holding substrate 3 on HC 5 is schematically shown. SH can be an integral part of HC 5, or a discrete part held in HC as shown by the dashed lines. In this example, the two extended surfaces 7 of substrate 3 are freely exposed to the ambient atmosphere.

[0004] The substrate 3 may have an extended surface 7, which in a cross-sectional view may be planar, concave, or convex, or a combination thereof. In a top view, the substrate 3 may have any desired shape, such as circular, elliptical, rectangular, or square, and may be, for example, a wafer, optical glass, or lens.

[0005] ii) Therefore, the retainer carrier HC 5 is a means of holding at least one SH 1 or at least one SH 1 integrated thereto. Only one or two SH1s are on HC 5, especially if the substrate to be processed is large. Otherwise, multiple SH1s are provided along the extent of HC 5. Figure 2 An example of HC 5 is schematically shown. Thus, in a cross-sectional view, HC 5 may have an extended surface 9, along which an extended surface 7 of the substrate 3 is freely exposed to the surrounding environment; this extended surface 9 may be planar, convex, or concave. Figure 3 The example shown depicts a calotte-shaped HC 5, with the mentioned surface 9 being concave. In the top view, HC 5 could be circular (e.g., Figure 4 (as shown in a), square or rectangular (as shown in a) Figure 4 (as shown in b).

[0006] iii) HC 5 has a central axis A transverse to the extended surface 9. HC The extended surface 7 of the substrate is freely exposed to the surrounding environment along the extended surface 9.

[0007] iv) The retainer carrier HC support HCS11 is a device that holds HC 5 in a position and, in some embodiments, causes HC 5 to rotate around the central axis A by a actuator 13. HC Rotation, such as Figure 5 As shown by the dashed line.

[0008] exist Figure 5 and Figure 6 The image schematically illustrates a circular plate-shaped HC 5. Figures 3 to 6 SH 1 is not shown in the text.

[0009] Handling at least one or two or more (i.e., a batch) substrates in a vacuum processing apparatus that meets the aforementioned definition.

[0010] To meet the need for increasing the substrate throughput of vacuum processing equipment or methods for manufacturing vacuum processing substrates (thereby satisfying definitions i) to iv) mentioned above, a vacuum processing equipment is proposed, comprising:

[0011] - At least one substrate holder is positioned along an extended surface of at least one holder carrier, the substrate holder being configured to retain the extended surface of a substrate resting thereon, which is freely exposed to the surrounding environment along the extended surface of the holder carrier. The extended surface of the holder carrier extends about a central axis of the holder carrier, the axis being oriented transversely to the extended surface of the holder carrier (5);

[0012] - At least one vacuum processing chamber, which is connected to a transfer vacuum chamber via a first gate valve;

[0013] -The vacuum processing chamber includes a first retainer carrier support configured to support a retainer carrier;

[0014] - Transfer vacuum chamber, which includes:

[0015] ● Pump port;

[0016] ●A second retainer carrier support, configured to support a retainer carrier;

[0017] ● An exchange transmitter is located between a first gate valve and a second retainer carrier support. The exchange transmitter is configured to: grasp a retainer carrier from the first retainer carrier support and release a retainer carrier from the first retainer carrier support via the first gate valve, and to grasp a retainer carrier from the second retainer carrier support and release a retainer carrier from the second retainer carrier support.

[0018] ●At least one second gate valve, which is open to the surrounding atmosphere;

[0019] ●Another transmitter, configured to receive from the second retainer carrier support (11) via the at least one second gate valve. LL ) transfer the retainer carrier and / or transfer the retainer carrier to the second retainer carrier support (11) LL )superior.

[0020] Because the transfer vacuum chamber is connected to the vacuum processing chamber via a first gate valve, and includes a pump port and the at least one second gate valve, it has a load-locked chamber structure. This allows the holder carrier to be unloaded and loaded via the at least one second gate valve during the time span in which the first gate valve is closed, and thus during the processing operation of the substrate on the holder carrier in the processing chamber within the vacuum processing chamber. Furthermore, when the holder carrier in the transfer vacuum chamber with the untreated substrate is exchanged with the holder carrier in the vacuum processing chamber with the treated substrate, the processing atmosphere in the processing chamber is uninterrupted and is therefore continuously maintained. This significantly contributes to a high throughput of treated substrates.

[0021] In one embodiment of the device according to the invention, the discrete retainer carrier includes at least two discrete segments. The exchange transmitter is configured to: simultaneously grasp one of the discrete segments from a first retainer carrier support and release one of the discrete segments from the first retainer carrier support, and simultaneously retrieve one of the discrete segments from a second retainer carrier support (11). LL ) Grasp one of the discrete segments and the second retainer carrier support (11) LL Release one of the discrete segments on the top.

[0022] Therefore, the exchange conveyor transports one section at a time until the corresponding complete discrete retainer carrier is transported. Thus, the range of the first gate valve is significantly reduced compared to this method of exchanging and transporting the entire retainer carrier at once, while the weight of the portion transported by the exchange conveyor is significantly reduced, and yet the large retainer carrier is processed in a vacuum processing chamber.

[0023] According to one embodiment of the device of the present invention, the first retainer carrier support includes a frame support structure for discrete segments.

[0024] Therefore, the aforementioned segments of the holder carrier are stored and removed one by one from the first holder carrier support, which, due to its frame structure, does not prevent the substrate on the substrate holder from being freely exposed to vacuum processing in the vacuum processing chamber. Clearly, the second holder carrier support may also include a frame support structure for the discrete segments, or even the same structure as the first holder carrier support, to simplify segment handling in the exchanger.

[0025] In one embodiment of the device according to the invention, the extended surface of the retainer carrier is one of planar, convex, or concave shapes.

[0026] In one embodiment of the device according to the invention, the extended surface of the retainer carrier is concave and dome-shaped.

[0027] In one embodiment of the device according to the invention, the extended surface of the retainer carrier is concave or convex and is formed by planar sectors of a flat surface.

[0028] In one embodiment of the device according to the invention, the first retainer carrier support is controllably rotatable about the central axis of the support.

[0029] Perform rotation of the first retainer carrier support as mentioned to homogenize the treatment effect applied to all substrates on the retainer carrier on the first retainer carrier support.

[0030] In an embodiment of the device according to the invention, the discrete retainer carrier includes at least two discrete segments, and the exchange transmitter is configured to simultaneously grasp one of the discrete segments from the first retainer carrier support and release one of the discrete segments from the first retainer carrier support, and simultaneously grasp one of the discrete segments from the second retainer carrier support and release one of the discrete segments from the second retainer carrier support, the first and second retainer carrier supports being rotatable about their respective retainer central axes in an angular stepping manner by at least one stepper driver.

[0031] In one embodiment of the device according to the invention, each of the first and second retainer carrier supports has a retainer central axis (A). 11TR A 11LL Furthermore, the central axes of these retainers are parallel to each other.

[0032] In one embodiment of the device according to the invention, as just mentioned, the central axis of one of the retainers on the first retainer carrier support and the central axis of one of the retainers on the second retainer carrier support coincide with the central axis of the support.

[0033] In one embodiment of the device according to the invention, the central axis of one of the retainers on the first retainer carrier support and the central axis of one of the retainers (5) on the second retainer carrier support (A) HC ) are parallel to each other.

[0034] In one embodiment of the device according to the invention, as just mentioned, the central axis is vertical.

[0035] In one embodiment of the device according to the invention, the exchange transmitter is configured to transmit the retainer carrier perpendicular to the central axis of the retainer carrier on the first and second retainer carrier supports.

[0036] In one embodiment of the device according to the invention, the exchange transmitter includes at least two extendable and retractable gripping arms (33a, 33b) that are extendable and retractable relative to the rotation axis of the exchange transmitter and are capable of jointly and controllably rotating about the rotation axis by a rotary actuator. Each of the gripping arms includes a gripping unit configured to controllably grip and release the retainer carrier either as a single part or, if the retainer carrier is composed of discrete segments, by gripping and releasing the retainer carrier segment by segment.

[0037] In one embodiment of the device according to the invention, as just mentioned, the central axis of one of the retainers on the first retainer carrier support and the central axis of one of the retainers on the second retainer carrier support are parallel to the axis of rotation.

[0038] In one embodiment of the device according to the invention, the gripping arms are independently and controllably extended and retracted.

[0039] In one embodiment of the device according to the invention, each of the gripping arms is retractable and expandable only when the other gripping arm is retracted.

[0040] In one embodiment of the device according to the invention, as just mentioned, the gripping unit grips and releases a segment of the retainer carrier or retainer carrier via a link of pins (51v, 51b) and holes (53v, 53b).

[0041] In one embodiment, as just mentioned, the connection between the pin and the hole is established and released by the relative movement of the pin (51v, 51b) and the hole (53v, 53b) in the radial direction relative to the axis of rotation. We also understand "hole" as a guide, such as a side-opening guide rail.

[0042] In one embodiment of the device according to the invention, a second gate valve is located in the bottom wall of the transfer vacuum chamber, and another transmitter includes a controllably driven elevator capable of moving toward and from the bottom wall and carrying a valve plate oriented parallel to the bottom wall, the valve plate sealing the transfer vacuum chamber when the elevator is in the position closest to the bottom wall.

[0043] One embodiment of the device according to the invention includes at least two second gate valves, and another transmitter is configured to transfer a retainer carrier from one of the at least two second gate valves through the second retainer carrier support and to the second retainer carrier support through the other of the at least two second gate valves.

[0044] In one embodiment of the device according to the invention, another transmitter is configured to bidirectionally transfer the retainer carrier back and forth through one of the at least one second gate valve from the second retainer carrier support and onto the second retainer carrier support.

[0045] In one embodiment of the device according to the invention, the retainer carrier includes at least two substrate retainers or a plurality of substrate retainers.

[0046] In one embodiment of the device according to the invention, the at least one substrate holder is either inseparable from the holder carrier or is a discrete portion that can be separated from the holder carrier.

[0047] In one embodiment of the device according to the invention, the exchange transmitter includes at least two extendable and retractable gripping arms, which are extendable and retractable relative to the rotation axis of the exchange transmitter and are jointly and controllably rotatable about the rotation axis by a rotary actuator. The gripping arms have strokes to grip a retainer carrier from a first retainer carrier support and release the retainer carrier from the first retainer carrier support via a first gate valve, and to grip a retainer carrier from a second retainer carrier support and release the retainer carrier from the second retainer carrier support.

[0048] In one embodiment of the device according to the invention, as just mentioned, the gripping arm is a frog-leg type arm.

[0049] In one embodiment of the aforementioned example, the two gripping arms consist of identical frog-like legs.

[0050] In one of the embodiments just mentioned, only one of the gripping arms can be scaled up at a time.

[0051] One embodiment of the device according to the invention includes a loading / unloading conveyor (63) in an ambient atmosphere, configured to load at least one substrate onto a substrate holder and unload at least one substrate from the substrate holder in an ambient atmosphere.

[0052] One embodiment of the device according to the invention includes a timing unit that controls the operation of at least another transmitter and a second gate valve, and is configured to control the operation of the other transmitter to exchange the retainer carrier on the second retainer carrier support during processing operations in the vacuum processing chamber.

[0053] Since another transmitter is controlled to exchange a second holder carrier support with at least one treated substrate on a holder carrier with at least one untreated substrate, and since the load-locking structure of the transfer vacuum chamber does not require any change in the processing atmosphere in the vacuum processing chamber, and the processing is only interrupted by the action of the exchange transmitter.

[0054] In one embodiment of the device according to the invention,

[0055] a) The vacuum processing chamber is an evaporation coating chamber and includes at least one evaporator source;

[0056] b) The retainer carrier comprises at least two separate sections and is dome-shaped;

[0057] c) The first and second retainer carrier supports are dome-shaped and can be rotated controllably about their respective central axes.

[0058] The embodiments mentioned above can be implemented in any combination unless they contradict each other.

[0059] The invention also relates to a retainer carrier suitable for use in a device according to the invention, the retainer carrier being configured to retain extended surfaces of at least two substrates applied thereto freely exposed to the surrounding environment along the extended surfaces of the retainer carrier, the extended surfaces of the retainer carrier extending about an orientation set transverse to the central axis of the extended surfaces of the retainer carrier, the retainer carrier comprising at least two discrete segments, each segment having at least one substrate retainer, the segments being assembled to produce the retainer carrier and being disassembled.

[0060] In one embodiment of the retainer carrier according to the invention, the retainer carrier is dome-shaped.

[0061] The present invention also relates to a method for manufacturing a vacuum-treated substrate, by which the aforementioned objective is achieved, namely, increasing substrate throughput. Therefore, the method for manufacturing a vacuum-treated substrate includes:

[0062] • Provide more than one retainer carrier, each of the retainer carriers including an extended surface and at least one substrate retainer distributed along the extended surface, the at least one substrate retainer being configured to retain the extended surface of a substrate resting thereon, which is freely exposed to the surrounding environment along the extended surface of the retainer carrier, the extended surface of each retainer carrier extending about a central axis of the retainer carrier, the axis being oriented transversely to the extended surface of the retainer carrier.

[0063] • Provide at least one vacuum processing chamber configured to process the at least one substrate on a single substrate in a holder carrier;

[0064] • Provides a transfer vacuum chamber connected to the at least one vacuum processing chamber via a gate valve, and

[0065] • Perform the following additional steps:

[0066] a) A substrate on one of the holder carriers is processed in a vacuum processing chamber to produce a processed substrate on one of the holder carriers, thereby performing the processing under process pressure in the vacuum processing chamber, which continues during the processing time span;

[0067] b) During the processing time span:

[0068] b1) Transferring one of the holder carriers with the previously treated substrate from the transfer vacuum chamber toward the environment, thereby venting the transfer vacuum chamber, and

[0069] b2) Transfer one of the holder carriers with the untreated substrate from the environment to the transfer vacuum chamber, and establish process pressure in the transfer vacuum chamber.

[0070] c) After processing, in the vacuum processing chamber, a holder carrier with an untreated substrate is exchanged from the transfer vacuum chamber by a gate valve for a holder carrier with a treated substrate, and in the transfer vacuum chamber, a holder carrier with an untreated substrate is exchanged from the vacuum processing chamber by a gate valve for a holder carrier with a treated substrate.

[0071] d) Repeat steps a) to c).

[0072] A variation of the method according to the invention includes performing the unloading of at least one treated substrate from one of the holder carriers in the ambient atmosphere and the loading of at least one untreated substrate onto one of the holder carriers.

[0073] One variation of the method according to the invention, as just mentioned, includes unloading the at least one treated substrate from a retainer carrier and loading the at least one untreated substrate into the same retainer carrier.

[0074] A variation of the method according to the invention includes constructing each retainer carrier from at least two discrete segments (at least one of the segments includes at least one substrate retainer) and performing step c by exchanging the segments.

[0075] Therefore, another variation of the aforementioned variant includes performing the exchange by repeatedly exchanging a segment from a segment in the vacuum processing chamber with a segment from the transfer vacuum chamber and by repeatedly exchanging a segment from a segment in the transfer vacuum chamber with a segment from the vacuum processing chamber.

[0076] In a variant of the method according to the invention, the referred treatment is evaporative coating, and the holder carrier is selected as a dome.

[0077] In a variant of the method according to the invention, the method is performed using one or more of the device according to the invention or embodiments thereof.

[0078] Variations of the method according to the invention can be performed in any combination, unless they are contradictory. Attached Figure Description

[0079] The apparatus and method according to the invention will now be further illustrated by way of the accompanying drawings. The drawings show:

[0080] Figure 1 A portion of the retainer carrier with a substrate retainer is schematically shown in cross-section;

[0081] Figure 2 With similar Figure 1 The representation shows a portion of the retainer carrier;

[0082] Figure 3 An embodiment of the retainer carrier is schematically shown in cross-section;

[0083] Figure 4 a) A top view schematically illustrating an embodiment of the retainer carrier;

[0084] Figure 4 b) A top view schematically illustrating an embodiment of the retainer carrier;

[0085] Figure 5 A side view of an embodiment of the retainer carrier support is shown schematically and in a simplified manner;

[0086] Figure 6 A top view schematically and simplified of an embodiment of the retainer carrier support is shown;

[0087] Figure 7 An embodiment of the device according to the invention is shown schematically and simplified in a top view, which is adapted to perform variations of the method according to the invention;

[0088] Figure 8 As shown in the side view Figure 7 The embodiments shown;

[0089] Figure 9 An embodiment of a switching transmitter, which may be applied to a device according to the invention, is illustrated schematically and in a simplified manner.

[0090] Figure 10 schematically and simplifiedly illustrates an embodiment of a switching transmitter that can be applied to a device according to the invention:

[0091] Figure 10a The two gripping arms are shown in the retracted position;

[0092] Figure 10b A gripping arm in an extended position is shown;

[0093] Figure 10c Another gripping arm in its extended position is shown;

[0094] Figure 11 The most illustrative example is shown as in Figures 10a to 10c The mechanical blocking operation of a portion of the switching transmitter is represented in the image.

[0095] Figure 12 A cross-sectional representation of an embodiment of a gripping unit applicable to a device according to the invention is shown schematically;

[0096] Figure 13 It shows Figure 12 A top view of the grabbing unit;

[0097] Figure 14 The schematic and simplified cross-section shows a figure with a similar shape. Figure 12 and Figure 13 The dome-shaped holder carrier of the gripping unit, as shown in the diagram;

[0098] Figure 15 It schematically shows the relationship with, for example Figures 12 to 14 The shape of the gripping hole in the embodiment shown is corresponding to the gripping pin engagement.

[0099] Figure 16 An embodiment of the apparatus according to the invention for performing the method according to the invention is illustrated schematically and in a simplified manner;

[0100] Figure 17 Another embodiment of the apparatus according to the invention, which performs the method according to the invention, is illustrated schematically and in a simplified manner;

[0101] Figure 18 Another embodiment of the apparatus according to the invention, which performs the method according to the invention, is illustrated schematically and in a simplified manner;

[0102] Figure 19An embodiment of a retainer carrier segment as shown in schematic simplified perspective, and a corresponding retainer carrier embodiment for supporting the retainer carrier formed by such a segment, are illustrated.

[0103] Figure 20 A simplified perspective illustration shows a retainer carrier segment as in an embodiment of the device according to the invention, and another embodiment of a corresponding retainer carrier for supporting a frame shape of such a retainer carrier segment;

[0104] Figure 21 (a) A side view schematically showing an embodiment of a gripping unit, such as that applicable to a segment of a dome-shaped retainer carrier, in an embodiment of the device according to the invention;

[0105] Figure 21 (b) shows Figure 21 (a) Top view of the grabbing unit;

[0106] Figure 22 The illustration schematically depicts an apparatus according to the invention as practiced today, and an embodiment of performing the method according to the invention.

[0107] Figure 23 A timing diagram of the subsequent handling of the retainer carrier is shown schematically and simplified in embodiments of the device according to the invention and in variations of the method according to the invention;

[0108] Figure 24 The embodiments of the device according to the invention and variations thereof for performing the method according to the invention are illustrated schematically and simplified, wherein the retainer carrier is composed of discrete segments. Detailed Implementation

[0109] Figure 7 and Figure 8 The embodiments of the device according to the invention and the method according to the invention are shown simplified and schematically in side and top views, respectively.

[0110] A retainer carrier support component HCS11 is installed inside the vacuum processing chamber 15. TR It is either stationary or capable of orbiting the vertical axis A via the actuator 13. 11TR Rotate, as shown by the dashed line and the arrow W. 11TR As shown. Generally, the processing chamber 15 can be a chamber in which any type of vacuum processing can be performed on the surface of the substrate 3. Therefore, the vacuum processing chamber 15 (not shown) is provided with appropriate equipment for performing the desired vacuum process.

[0111] The vacuum chamber 15 includes a pump port 17 for applying pump 19 to the vacuum chamber 15.

[0112] Vacuum processing chamber 15 is connected to transfer vacuum chamber 23 via gate valve 21, and transfer vacuum chamber 23 is connected to ambient atmosphere AM either via another gate valve 25 or directly or via one or more other vacuum chambers (not shown). Transfer vacuum chamber 23 includes a pump port 27 for applying pump 29 to transfer vacuum chamber 23.

[0113] Therefore, the vacuum transfer chamber 23 actually acts as a load locking chamber in terms of pressure handling.

[0114] HCS11 is installed in the transfer vacuum chamber 23. LL According to Figure 7 and Figure 8 In the embodiment, the HCS11 LL It is stationary, as schematically shown by the "stationary" symbol at point 31 used throughout the accompanying figure.

[0115] In this embodiment, HCS11 TR and 11 LL Suitable for use along parallel plane PL respectively TR and PL LL Positioning retainer carrier HC5. If HC5 has a planar extended surface 9, and the extended surface 7 of the substrate or more than one extended surface 7 of the substrate 3 is freely exposed along the planar extended surface 9, then the planar PL TR and PL LL Consistent with extended surface 9. If HC 5 is dome-shaped, then the mentioned plane PL TR and PL LL Perpendicular to the central axis A of the retainer carrier 5 HC ,like Figure 3 As shown in the image.

[0116] The exchange transmitter 33 (e.g., an exchange robot) resides in the transfer vacuum chamber 23, in HCS11 LL Between the gate valve 21 and the exchange transmitter 33, the exchange transmitter 33 includes a pair of extendable and retractable gripping arms 33a and 33b, each arm equipped with terminal gripping units 35a and 35b, as schematically shown. When the respective gripping arms extend, the retainer carrier HC 5 can be removed from the respective retainer carrier support HCS11 by each gripping unit 35a, 35b. TR and 11 LL One of the gripping or releasing in the corresponding retainer carrier support HCS11 TR and 11 LLOne of them is on top. As schematically shown, each of the gripping arms 33a, 33b is controllably extended and retracted via extension actuators 37a, 37b. The gripping arms 33a, 33b are along a rotation axis A perpendicular to the exchange conveyor 33. 33 (W3) extension plane PL 33 The operation allows for extension and retraction, as indicated by the double arrow W2. Therefore, the gripping arm can rotate around axis A. 33 It can be rotated controllably and driven, and can rotate along a path parallel to the positioning plane PL. TR and P LL Plane PL 33 Extend and retract. Specifically, if the plane PL... LL and PL TR If they are different, the swapping robot 33 can raise and lower the gripping arms 33a and 33b, as schematically shown by arrow W4. Axis A 11TR A 11LL and A 33 It can be parallel, and therefore can be vertically oriented. Once applied to the retainer carrier support 11 TR 11 LL On one of them, the central axis A of HC 5 is applied accordingly. HC Can be used with the corresponding axis A 11TR A 11LL coincide.

[0117] During operation, the exchange conveyor 33 uses one of the gripping arms 33a or 33b and from HCS11 TR Grasp the holding carrier HC 5, on which one or more substrates 3 have been processed in vacuum processing chamber 15, and use another gripping arm 33b or 33a to grasp it from HCS11. LL The holding carrier HC 5, on which one or more substrates 3 have not yet been processed in the vacuum processing chamber 15, is grasped. After retraction, the grasping arms 33a and 33b together rotate around the axis of rotation A. 33 The gripping arm 33a, which rotates, then expands and carries the HC 5 with at least one processed substrate 3, stores the HC 5 in HCS11. LL Above, another gripping arm 33b, carrying the HC 5 with the unprocessed substrate 3, stores the HC 5 in HCS11. TRThe exchange operation is performed with the pressure in the transfer vacuum chamber 23, where gate valve 21 is open, gate valve 25 is closed, and the pressure acts as a load lock, equal to the processing pressure in the vacuum processing chamber 15. Therefore, the vacuum processing chamber 15 is neither vented nor pumped for processing a series of subsequent HC 5. Consequently, the throughput of HC 5 with the processed substrate is significantly increased. During the processing of HC 5 with its substrate 3 in the vacuum processing chamber 15, the pressure in the transfer vacuum chamber 23 is adjusted, on the one hand, by venting to the ambient atmosphere to the pressure outside gate valve 25, and on the other hand, to the processing pressure in the vacuum processing chamber 15. Therefore, the volume of the transfer vacuum chamber 23 can generally be selected to be significantly smaller than the volume of the vacuum processing chamber 15, since processing equipment (e.g., evaporation sources, sputtering sources, etc.) will be installed in the vacuum processing chamber 15 for the corresponding processes. Venting and repressurizing of the transfer vacuum chamber are performed within a time span significantly shorter than the processing time for the holder carrier 5 in the vacuum processing chamber 15 and significantly shorter than the time span required for venting and repressurizing the vacuum processing chamber 15.

[0118] Will pass Figure 23 The timing diagram is used to explain the handling steps of HC 5 and therefore variations of the method according to the invention.

[0119] To initiate the process, the first HC1 residing in the ambient atmosphere AM is transferred to the transfer vacuum chamber 23, which serves as the load locking chamber. As indicated by the double arrow p, the pressure in the transfer vacuum chamber 23 decreases from the initial exhaust pressure to a higher pressure, p, the processing pressure p required to process the substrate 3 in the vacuum processing chamber 15. TR .

[0120] Then, HC1 is transferred to vacuum processing chamber 15, which has been pumped down to process pressure p. TR HCl with at least one substrate 3 is processed in vacuum processing chamber 15.

[0121] During the processing time span T of HC1 TR During this process, HC2 is transferred from the ambient AM to the transfer vacuum chamber 23. For this purpose, the transfer vacuum chamber 23 is vented, and once the HC2 is inside, it is pumped down to the processing pressure p. TR .

[0122] Once the processing of HC1 is terminated, and HC2 in transfer vacuum chamber 23 and transfer vacuum chamber 23 are at the processing pressure p TRHC1 and HC2 are exchanged via exchange transmitter 33. This means that HC1 in vacuum processing chamber 15 with the processed substrate 3 is replaced by HC2 with the unprocessed substrate from transfer vacuum chamber 23, and vice versa, HC2 with the unprocessed substrate in transfer vacuum chamber 23 is replaced by HC1 with the processed substrate from vacuum processing chamber 15.

[0123] The time span T during which HC2 was processed in vacuum processing chamber 15 TR During this period, HC2 is now residing in the transfer vacuum chamber 23, which is under process pressure p. TR It is vented, and HC1 is transported towards the surrounding environment AM.

[0124] The time series experienced by the third HC3 is now becoming apparent to technicians.

[0125] Therefore, it becomes clear that more than one retainer carrier 5 (HC1 to HC3) is provided. One is being processed in vacuum processing chamber 15 for a processing time span T. TR During this process, a holder carrier 5 is conveyed from the surrounding environment toward and into the transfer vacuum chamber 23, and a holder carrier 5 is conveyed from the transfer vacuum chamber 23 toward the surrounding environment. As mentioned, each of the holder carriers 5 includes an extension surface 9 and at least one substrate holder 1 along the extension surface 9. Each of the substrate holders 1 is configured to hold the extended surface 7 of the substrate 3 to be processed, which is placed in the substrate holder, freely exposed to the surrounding environment along the extension surface 9 of the holder carrier 5. The extension surface 9 of each holder carrier 5 is about the central axis A of the holder carrier 5. HC The axis is extended and its direction is set transversely to the extended surface 9 of the retainer carrier 5.

[0126] The vacuum processing chamber 15 is configured to process the at least one substrate 3 on a single retainer carrier 5. Therefore, the retainer carriers 5 can be introduced into, processed in, and removed from the vacuum processing chamber 15 sequentially, one after another.

[0127] At least one substrate 3 on one of the holder carriers 5 is processed once in a vacuum processing chamber 15. This step is performed in... Figure 23 The part at (a) is indicated. This produces a processed substrate 3 on a holder carrier 5 in a vacuum processing chamber 15. The processing in the vacuum processing chamber 15 is carried out at a process pressure p selected according to the desired processing procedure for the substrate in the vacuum processing chamber 15. TR Execute the following. Process over a time span T. TR The period lasted;

[0128] In processing time span TTR Inside, one of the holder carriers 5 carrying at least one treated substrate 3 passes through gate valve 25 and according to Figure 7 and Figure 8 In this embodiment, the vacuum chamber 23 is conveyed towards the surrounding environment AM by a conveyor 26. Therefore, the vacuum chamber 23 is vented towards a higher pressure. This step is... Figure 23 The middle part is shown by (b1).

[0129] Still in the time span T TR Inside, according to Figure 7 and Figure 8 In one embodiment, a holder carrier 5 with at least one untreated substrate 3 is conveyed through a gate valve 25 and by a conveyor 26 into a transfer vacuum chamber 23. The gate valve 25 is closed, and the transfer vacuum chamber 23 is pumped down to a processing pressure p. TR This step is in Figure 23 The middle part is shown by (b2).

[0130] After processing at least one substrate on a holder carrier 5 in the vacuum processing chamber 15, the holder carrier 5 with the processed substrate 3 is replaced by a holder carrier 5 with an unprocessed substrate 3 from the transfer vacuum chamber 23 via gate valve 21, and vice versa, in the transfer vacuum chamber 23, a holder carrier 5 with an unprocessed substrate 3 is replaced by a holder carrier 5 with a processed substrate 3 from the vacuum processing chamber 15 via gate valve 21. This step is performed by the exchange conveyor 33, and in Figure 23 It is shown at (c) in the text.

[0131] These steps are repeated: a retainer carrier is processed, during the processing time an unprocessed retainer carrier in transfer vacuum chamber 23 is exchanged for a processed retainer carrier, and after processing, an unprocessed retainer carrier from transfer vacuum chamber 23 is exchanged for a processed retainer carrier in vacuum processing chamber 15, and vice versa, a processed retainer carrier from vacuum processing chamber 15 is exchanged for an unprocessed retainer carrier in transfer vacuum chamber 23.

[0132] It becomes clear that, using the apparatus and method according to the invention, the processing in the vacuum processing chamber 15 is interrupted only in step (c) by exchanging HC 5. The time span T available for processing the substrate in the vacuum processing chamber 15 is... TR The pressure is not reduced by any pumping or venting time span because the process pressure is also maintained in the vacuum processing chamber 15 during the HC 5 exchange in step c).

[0133] This significantly improves the throughput of the processed substrate.

[0134] Through observation Figure 23As can be seen, when the time spans of steps (b1) and (b2) are appropriately tailored (e.g., the time spans for transporting HC1 and HC3 are shortened), a treated substrate on one HC can be exchanged for an untreated substrate on the same HC in the ambient atmosphere AM. This is because, for example, HC1 arrives in the ambient atmosphere AM with a treated substrate before HC3 leaves with an untreated substrate, so HC1 can be used as HC3 after the treated substrate is exchanged for the untreated substrate.

[0135] Therefore, and as is currently achieved, unloading a treated substrate from one of the holder carriers 5 and loading an untreated substrate into one of the holder carriers 5 can be performed in the ambient atmosphere, and / or unloading a treated substrate from one holder carrier and loading an untreated substrate can be performed in the same holder carrier 5. Loading and unloading of substrate 3 in the ambient atmosphere AM can be performed manually if possible, but is performed by a robot as is currently practiced, as in Figure 16 As shown in position 63.

[0136] Regarding the implementation of the switching transmitter 33, the following considerations are dominant:

[0137] - The radius of rotation R of the outermost portions of the two HC 5s transmitted through the gate valve 21 (see...) Figure 7 The size should be as small as possible to minimize the range of gate valve 21. This is why the two gripping arms 33a and 33b, after gripping HC 5 respectively, can retract via extension actuators 37a and 37b and can extend to store the corresponding HC 5 in the corresponding HCS11. TR 11 LL The above reasons. In addition, and in order to minimize the range of the gate valve 21, the larger of the two minimum strokes (in the retracted position) of the two gripping arms 33a, 33b should be as small as possible.

[0138] - The gripping strokes of the two gripping arms 33a and 33b can be equal for use in transferring HCS11 from the vacuum chamber 23. LL Capture HC 5 / in HCS11 LL HC 5 is stored on top, and is used to extract HCS11 from vacuum processing chamber 15. TR Grab HC 5 / Store HC 5 in HCS11 in vacuum processing chamber 15 TR This requires HCS11. LL and HCS11 TR On the rotation axis A of the exchange transmitter 33 33 Precise positioning at equal distances. This is likely difficult to achieve due to construction tolerances, and is in fact undesirable because of HCS11. LL Possibly more than HCS11TR Closer to the axis of rotation A 33 The former is to minimize the volume of the vacuum transfer chamber 23, while the latter is typically determined by the type of process to be performed in the vacuum processing chamber 15. Therefore, in one embodiment of the invention, the extension / retraction of the gripping arms 33a, 33b is independently controlled by extension actuators 37a, 37b.

[0139] The most suitable device to meet the requirements of the exchange transmitter 33 is the exchange transmitter with frog-leg-shaped gripping arms 33a and 33b.

[0140] exist Figure 9 An example is schematically shown. The exchange conveyor 33 includes two opposing gripping arms 33a and 33b, which are implemented as frog-leg-shaped arms with controlled electric motors 41 for controlling the mutual angle of the frog legs 39. The strokes of the gripping arms 33a and 33b can be individually controlled by appropriate control of the electric motors 41. Figure 9 In the diagram, the dominant position of gripping arm 33a is shown as the retracted position, indicated by a rigid line (solid line). Gripping arm 33a carries HC 5 via gripping unit 35a, which is schematically shown. Gripping arm 33a is shown in the extended position, indicated by a dashed line. To demonstrate the independence of stroke control at the two gripping arms 35a and 35b, the frog legs 39 of gripping arm 35b in the dominant position (i.e., the extended position) are shown by solid lines, while the positions of these legs 39 in the retracted minimum stroke position are drawn by dashed lines.

[0141] exist Figure 10a )to Figure 10c The second example used in the practice of the present invention is shown in Figure 10. Here, the exchange transmitter 33 may also be said to include two gripping arms 35a and 35b, although in fact the same frog leg 39 is used to subsequently implement one of the gripping arms, and then the second gripping arm. This becomes apparent from Figure 10.

[0142] exist Figure 10a In the process, the two gripping arms 33a and 33b (see also...) Figure 10b This can be considered to be in the minimum stroke position. The two pairs of frog legs 39 are connected to reference blocks 43a and 43b via corresponding electric motors 41, which can alternatively be held stationary relative to the rotating portion of the exchange transmitter 33. This is in Figure 11 The diagram is most schematically shown by mechanically connecting one or the other of the reference blocks 43 to the rotating portion 45 of the exchange transmitter 33. The mechanical link is schematically represented by a switch symbol at 47.

[0143] Returning to Figure 10: In order to... Figure 10bThe extended gripping arm 35a shown is blocked by the reference block 43a against the rotating portion 45 of the exchange conveyor 33. According to... Figure 11 The schematic representation shows the mechanical connection switch 47 in the right-hand position. The gripping arm 33b is in the retracted position. Conversely, in order to extend the gripping arm 33b, the reference block 47b is mechanically blocked from the rotating portion 45 of the exchange conveyor 33.

[0144] For this type of exchange transmitter best suited for implementing the present invention, one of the gripping arms 33a, 33b is extendable only when the other gripping arm 33b or 33a is fully retracted. Such a transmitter suited to the specific needs of the present invention is referred to as "double-symmetric" and is commercially available from Brooks, Vacuumrobotics.

[0145] exist Figures 12 to 14 The diagram illustrates embodiments of gripping units 35a and 35b as practiced today. It will be apparent to those skilled in the art that other implementations of gripping units 35a and 35b are possible, for example, for magnetic gripping and release or for gripping and release of the retainer carrier HC 5 by other types of mechanical gripping.

[0146] Figure 12 and Figure 13 The gripping units 35a and 35b for the HC 5 are shown schematically and simplifiedly, respectively. The HC 5 is rectangular in top view as an example. Figure 13 And in the cross-sectional view, it is a flat plate shape. Figure 12 ).

[0147] Protrusion 49 v and 49 b Installed to HC 5, or integrated with HC 5, and parallel to the extension plane PL of the gripping arms 33a, 33b of the exchange conveyor 33. 33 The gripping units 35a and 35b are extended by extending gripping pins 51v and 51b, wherein the gripping pins 51v and 51b are aligned with holes 53v and 53b in the corresponding protrusions 49v and 49b.

[0148] By extending and retracting the gripping arms 33a and 33b respectively, the gripping pins 51v and 51b are simultaneously introduced into or simultaneously removed from the holes 53v and 53b respectively. Three protrusions 49v and 49b are provided along the periphery of HC 5, as shown in the figure. For example, one 49v at the distal end of HC 5 is considered to be in the extension direction of the gripping arm 33a or 33b, and the two at the proximal end of HC 5 are considered to be in the aforementioned direction. By providing specifically in Figure 13The diagram shows the three-point grasp of HC 5; once grasped, stable and precise positioning of HC 5 is achieved. To separately obtain information from HCS11... TR Or from HCS11 LL Lift HC 5 and store HC 5 in the corresponding retaining carrier support HCS11 TR Or HCS11 LL Above, the exchange transmitter 33 can be as follows: Figure 12 Arrow W4 in the diagram indicates the axis of rotation A. 33 The gripping arms 33a and 33b can be controllably raised and lowered in the direction of rotation, or the arrangement of all gripping pins 51v and 51b can be controllably raised and lowered relative to the gripping arms 33a and 33b (not shown in the figures). This is particularly applicable to commercially available transmitters that do not themselves provide a direction of rotation along the axis A of the transmitter 33. 33 The situation regarding increasing or decreasing the capabilities of gripping arms 33a and 33b in the direction of [the action / action].

[0149] Figure 14 It shows the relationship with Figure 12 and Figure 13 The rectangular HC 5 shown is custom-designed in a completely similar dome shape to the gripped HC 5. Note that holes 53v and 53b can be directly set in the HC 5.

[0150] It is clear that, with Figures 12 to 14 Conversely, gripping pins 51v, 51b, or some of them may be installed into HC 5, and holes 53v, 53b, or some of them may be installed into gripping units 35a, 35b.

[0151] To ensure proper alignment of HS 5 relative to the gripping pin, holes 53v and 53b can be tapered, such as... Figure 15 As shown in the image.

[0152] like Figure 16 As schematically shown, the transfer vacuum chamber 23 may communicate with a series of one or more other vacuum chambers 55, each equipped with a holder carrier support 57 and an exchange conveyor 59, which are at least similar to HCS11. LL HS 5 is constructed and transported in the same manner as the exchange conveyor 33. For example, if the processing time T in the vacuum processing chamber 15 is... TR Too short, in order to achieve this at time T TRDuring the process of venting and pumping gas into the transfer vacuum chamber 23 and exchanging HC 5 through the gate valve 25, two or more transfer vacuum chambers 23, each acting as a load lock, can be installed in series, as explained in WO2019 / 219371 of the same applicant as this application. The added vacuum chamber 55 can also be a pretreatment chamber for HC 5, such as a heating chamber, etching chamber, layer deposition chamber, etc. Therefore, it should be noted that some pretreatment of HC 5 can also be performed in the transfer vacuum chamber 23, for example, preheating by a heating lamp (not shown). Figure 16 In the embodiment shown, the pretreatment chamber 55 is typically disabled when HC 5 returns to the surrounding atmosphere along with the treated substrate through these chambers.

[0153] Therefore, HC 5 directly supplies input to / from the output of the entire device through gate valve 25, which then acts as an input / output gate valve, from the ambient atmosphere AM or through a downstream gate valve (such as...). Figure 16 (As shown in reference number 61) it originates from the surrounding atmosphere.

[0154] HC 5 and its corresponding SH1 are loaded with untreated substrate 3, and treated substrate 3 is unloaded in the ambient atmosphere AM by manual or by loading / unloading robot 63, as follows. Figure 16 As shown schematically in the diagram.

[0155] Because the loading / unloading robot 63 operates in the ambient atmosphere, it can be customized for highly complex three-dimensional gripping and storage operations on substrate 3, as opposed to HC 5.

[0156] exist Figure 17 Another possible configuration of the device according to the invention is shown. Because the pretreatment prior to the treatment in the vacuum processing chamber 15 can differ from the post-treatment following the treatment in the vacuum processing chamber 15, HC 5 with a substrate that has not yet been treated in the vacuum processing chamber 15 is processed via one or more pretreatment chambers 55. IN A gate valve 25 transfers data from the surrounding environment to the transfer vacuum chamber 23. IN And HC 5, which has already been processed in vacuum processing chamber 15, is discharged via gate valve 25. OUT And one or more post-processing chambers 55 OUT Transmit to the surrounding atmosphere AM.

[0157] exist Figure 18 The diagram schematically illustrates another overall structure of the device according to the invention, and this structure is compatible with... Figure 16 or Figure 17This is combined with one of the structures mentioned in the context. Here, a transfer vacuum chamber 23 exchanges HC 5 with more than one vacuum processing chamber 15, such as having two such chambers 15A and 15B. Figure 18 As indicated in the diagram. Therefore, it becomes possible to distribute HC 5, which is input through gate valve 25, to one vacuum processing chamber (e.g., 15A), and then distribute another HC 5 to another vacuum processing chamber (e.g., 15B), or to first deliver one of the HC 5 to one vacuum processing chamber (e.g., 15A) and then circulate it via transfer vacuum chamber 23, and deliver such HC 5 to another vacuum processing chamber (e.g., 15B) before it leaves transfer vacuum chamber 23 via gate valve 25.

[0158] So far, we have explained the apparatus and method according to the invention, wherein the complete retainer carrier HC 5 is handled as a single piece. Such an HC 5 can be very large and heavy, such as a dome-shaped HC 5 used, for example, for performing evaporation coating of a substrate on a dome-shaped HC 5 in a vacuum processing chamber 15.

[0159] Therefore, and in one embodiment of the device and method according to the invention as practiced today, the retainer carrier HC 5 is subdivided into more than one retainer carrier segment HC. Se HC with carrier segment Se HC5 is transported as described so far as HC5. The exchange step c) mentioned above is performed segment by segment. A segment may carry one, two or more substrate holders SH1, and a segment may even be an empty segment without SH1.

[0160] Retainer carrier support 11 LL and 11 TR Implemented as a framework structure, HC Se It can be stored on and removed from it by an exchange conveyor 33 having gripping arms 33a, 33b and gripping units 35a, 35b, as described for transporting a complete single piece HC 5.

[0161] Handling of a single HC 5 unit and HC Se The only general difference between the transport components of the HC 5 is the presence of two retainer carrier supports HCS11, one in the transfer vacuum chamber 23 and the other in the vacuum processing chamber 15. LL and 11 TR It must be able to controllably rotate around the corresponding axis A 11TR A 11LL Rotate gradually.

[0162] Figure 19A schematic perspective view shows the retainer carrier sector HC of a rectangular HC 5 with multiple substrates 3. Se 65. Already on the topic of Figures 1 to 18 The features explained in the content are indicated by the same reference numerals, and are explained separately only when differences must be pointed out.

[0163] Retainer carrier support component HCS11 LL and 11 TR Implemented by a two-dimensional frame structure 67, triangular plane HC Se 65 is stored on and removed from the two-dimensional frame structure 67. Note that even the HC mentioned in rectangle HC 5... Se 65 are unequal, in order to grasp and release the corresponding unequal HC by means of grasping pins 51v, 51b and holes 53v, 53b as described above. Se 65, for different HC Se 65. These geometric arrangements can also be equal. All are implemented by the frame structure 67 in HCS11. LL and 11 TR Both can be controlled to rotate around the corresponding axis A. 11TR A 11LL Rotate gradually. Please note that... Figure 8 The dashed line in the middle is used for HCS11 LL Rotary support stepper driver 69.

[0164] Figure 24 An embodiment of the device according to the invention is illustrated schematically, which operates together with segment HC 5.

[0165] Once again, the already described parts will not be mentioned again and will have the same reference numerals as in the figures discussed so far. For the exchange of the untreated substrate with the treated substrate via the opened gate valve 21, HCS11 is supported thereon in the corresponding HC 5 segment 65. TR and 11 LL Segment 65 of HC 5 is switched segment by segment by the switching transmitter 33.

[0166] Therefore, HCS11 TR and 11 LL Around the corresponding axis A 11LL and A 11TR Gradually rotate by an angle β, which is relative to the axis A of segment 65. HC The angular range β is consistent. HCS11 TR and 11 LL The gradual rotation of angle β is driven by one or two rotary actuators 69.

[0167] Possibly, in addition to other operations of the entire device according to the invention, the opening / closing of gate valves 21 and 25, the operation of pump 29 to transfer vacuum chamber 23, and the operation of exchange transmitters 33 and 26 are all controlled by timing unit 85, as generally as described above (e.g., regarding...). Figure 23 As mentioned in the content.

[0168] Please note that if HC 5 is a single unit as described above, then timing unit 85 controls the normal operation as mentioned.

[0169] Therefore, HCS11 TR Can be around axis A in different ways 11TR Rotation, that is, on the one hand, continuous rotation to perform the processing, and on the other hand, stepwise rotation if HC 5 is constructed from segment 65. If HC 5 is constructed from segment 65, then HCS11 LL In reality, it only rotates angularly in steps and is otherwise stationary.

[0170] Figure 20 A schematic perspective view shows the HC for the dome-shaped HC 5. Se 65 and HCS 11 LL and 11 TR The corresponding framework structure is 73. Again, the explained features are represented using the same reference numerals, and are only further explained where differences must be pointed out.

[0171] Figure 21 a) and Figure 21 b) respectively using the side view ( Figure 21 a) and top view ( Figure 21 b) A schematic and simplified illustration of the HC section for the dome. Se 65 and functionally similar Figure 12 and Figure 13 The embodiment shown is of gripping units 35a and 35b for handling a single HC 5 piece. Also in... Figure 12 and Figure 13 The central arm 52 shown in the figure is curved in this embodiment, following the HC... Se The external shape is 65 and it carries the gripping pin 51v. The side arm 54 is also based on HC. Se The external shape of 65 is formed and each carries the gripping pin 51b.

[0172] Figure 22 The illustration schematically depicts an apparatus according to the invention as practiced today, and an embodiment of performing the method according to the invention.

[0173] according to Figure 22 Vacuum processing chamber 15 is an evaporation coating chamber. For example... Figure 20 As schematically shown, the retainer carrier support HCS11 TR Implemented as a frame structure 73, on which additions and removals can be made, as well as... Figure 20 HC shown in Se 65. HCS 11 dome-frame structure TR Capable of controlling rotation around central axis A HC Rotation (W) 11TR ), the central axis A HC Rotation axis A in a vertical fixed direction 11TR Overlap. Evaporation source 75 (e.g., electron beam evaporation source or thermal evaporation source) at HCS11 TR Vertically centered below. Therefore, the extended surface 7 of the substrate (not shown) is freely exposed to the evaporation source 75 along the lower extended surface of the holder carrier HC 5, which is caused by... Figure 20 The discrete HC shown in the figure Se 65 is implemented or constituted by it. The vacuum processing chamber 15 (here, the evaporation chamber) is connected to the transfer vacuum chamber 23 via the gate valve 21.

[0174] The retainer carrier 5, consisting of discrete dome sections 65, is conveyed into and removed from the transfer vacuum chamber 23 via gate valve 25. HCS11 LL Capable of controllably rotating around axis A 11LL Coincident vertical central axis A HC Rotate gradually (W) 11LL The substrate 3, which is discharged from the holder carrier 5 carrying the treated substrate 3 via the gate valve 25, is unloaded from the holder carrier 5 and thus from its section 65, and replaced by an untreated substrate 3 in the ambient atmosphere AM. This is performed by a loading / unloading robot 63 that transports the substrate between a set of boxes 77 and HC 5.

[0175] like Figure 22 As shown by the dashed line in the middle, HC Se The loading and unloading of HC 5, and therefore HC 65, are performed below the transfer vacuum chamber 23. The HC 5, and therefore the untreated substrate 3, are then loaded. Se 65 HCS11 LL The HC 5, carrying the untreated substrate 3, is lowered (W79) by the gate valve 25 and exits the transfer vacuum chamber 23, and is lifted into the transfer vacuum chamber 23 by the vertical movement actuator 79 with the rod 83.

[0176] The gate valve 25 is implemented by a valve plate 81, which is mounted horizontally relative to the rod 83 (i.e., parallel to the outer surface of the bottom wall of the transfer vacuum chamber 23).

[0177] In the highest position, valve plate 81 seals the transfer vacuum chamber, as schematically shown by seal 84.

[0178] As shown by the solid line, the switch transmitter 33 in HCS11 TR and HCS in the upper position LL HC exchange Se 65. The switching transmitter 33 is constructed by means of, as shown in Figure 10 and Figure 11 The presenting transmitter type implementation, and the grasping unit such as by means of Figure 21 It is implemented as illustrated and explained.

[0179] The operation of this device is as follows, and conforms to... Figure 23 The image shown and in relation to Figure 23 The order of explanation in the content: such as Figure 23 The exchange step (c) shown is performed as follows:

[0180] a) make as Figure 10a The retracted gripping arms 33a and 33b, shown in the retracted position, are aligned with two axes A. 11LL and A 11TR Align and rotate.

[0181] b) Make, for example, gripping arm 33a (see...) Figure 10b ) Expand and through such Figure 21 The grasping unit 35a shown in the diagram grasps from, for example... Figure 20 The HCS11 shown is implemented with a treated (i.e., evaporated coated) substrate 3. TR Grab an HC Se 65.

[0182] On axis A 11TR Slightly raise the gripping unit 35a in the direction of the gripping motion and retract the gripping arm 33a. Figure 10a ).

[0183] Make the gripper arm 33b ( Figure 10c ) Expand and through such Figure 21 The grasping unit 35b shown in the diagram grasps from, for example... Figure 20 The HCS11 shown is implemented with an untreated substrate 3. LL Grab an HC Se 65. On axis A 11LL Slightly raise the gripping unit 35b in the direction of the gripping motion and retract the gripping arm 33b. Figure 10a ).

[0184] c) Position the gripping arms 33a and 33b relative to the two axes A. 11LL and A 11TR In opposite aligned positions, around the rotation axis A 33Rotate 180°.

[0185] d) Extend one of the gripping arms (e.g., 33a) along axis A 33 Slightly lower the gripping arm in the direction of the hole 53v, 53b to release the gripping pins 51v, 51b, thereby allowing the EC with the treated substrate 3 to be placed. Se 65 stored in HCS11 LL Move upwards. This retracts the currently airborne gripper arm 33a.

[0186] e) Extend the gripping arm 33b and align it with axis A 33 Slightly lower the gripping arm in the direction of the hole, and release the gripping pins 51v and 51b from the holes 53v and 53b, thereby holding the EC with the untreated substrate 3. Se 65 stored in HCS11 TR Move upwards. This retracts the currently airborne gripper arm 33b.

[0187] f) Make HCS11 TR and HCS11 LL The angular step of the rotation range β, and

[0188] g) Repeat steps a) to f) until HCS11 in vacuum chamber 15 is removed. TR All HC on the substrate 3 with bearing treatment Se 65 and from transfer vacuum chamber 23 and in HCS 11 LL Conversely, HC carries untreated substrate 3 Se 65 exchange.

[0189] also:

[0190] During the evaporation process in the vacuum processing chamber 15, HC 5 with the treated substrate is transferred from the transfer vacuum chamber 23 to the ambient atmosphere, unloaded, then reloaded with an untreated substrate and transferred to the transfer vacuum chamber 23, ready to be exchanged with HC 5 with the treated substrate from the vacuum processing chamber 15.

[0191] Vacuum processing chamber 15 is not vented until the processing of all substrates as required is completed.

[0192] HC Se 65 does not need to carry the same number of SH 1. For example, for small substrate batches, it is possible to introduce empty HC. Se 71 (i.e., without SH 1) or provided on a portion of the corresponding HCS with only one HC Se 65% HC 5, while the other part has no HC. Se 65, or provide only two HCs Se65 (e.g., each carrying a large substrate), etc.

Claims

1. A vacuum processing apparatus, comprising: At least one substrate holder (1) is positioned along an extended surface (9) of at least one holder carrier (5), the substrate holder (1) being configured to retain an extended surface (7) of a substrate (3) resting thereon, the extended surface (9) of which is freely exposed to the surrounding environment along the extended surface (9) of the holder carrier (5), the extended surface (9) of which is about the central axis (A) of the holder carrier (5). HC ) extends, the central axis (A) HC The orientation is set to be transverse to the extended surface (9) of the retainer carrier (5); At least one vacuum processing chamber (15) is connected to a transfer vacuum chamber (23) via a first gate valve (21); The vacuum processing chamber (15) includes a first retainer carrier support (11) configured to support a retainer carrier (5). TR ); The transfer vacuum chamber (23) includes: Pump port (27); Second retainer carrier support (11) LL ), which is constructed to support a retainer carrier (5); In the first gate valve (21) and the second retainer carrier support (11) LL The exchange transmitter (33) between the first retainer carrier support (11) is configured to: transfer the first gate valve (21) from the first retainer carrier support (11) to the first retainer carrier support (12) via the first gate valve (21). TR ) The gripper carrier (5) and the first retainer carrier support (11) TR Release the retainer carrier (5) from the second retainer carrier support (11) and release the retainer carrier (5) from the second retainer carrier support (1 ... LL ) gripping retainer carrier (5) and in the second retainer carrier support (11) LL Release retainer carrier (5) on the upper part; At least one second gate valve (25) is connected to the ambient atmosphere (AM); Another transmitter (26), configured to transmit power from the second retainer carrier support (11) via the at least one second gate valve (25). LL ) transfer the retainer carrier (5) and / or transfer the retainer carrier (5) to the second retainer carrier support (11) LL )superior.

2. The vacuum processing equipment according to claim 1, wherein, The at least one retainer carrier (5) comprises at least two separate segments (65), and the exchange transmitter (33) is configured to transfer data from the first retainer carrier support (11) at a time. TR ) Grasp one of the discrete segments (65) and in the first retainer carrier support (11) TR Release one of the discrete segments (65) from the second retainer carrier support (11) at a time. LL ) Grasp one of the discrete segments (65) and in the second retainer carrier support (11) LL Release one of the discrete segments (65) on the above.

3. The vacuum processing equipment according to claim 2, wherein, The first retainer carrier support (11) TR It includes a frame support structure for the discrete section (65).

4. The vacuum processing equipment according to claim 1, wherein, The extended surface (9) of the retainer carrier (5) is one of planar, convex or concave.

5. The vacuum processing equipment according to claim 1, wherein, The extended surface (9) of the retainer carrier (5) is concave and dome-shaped.

6. The vacuum processing equipment according to claim 1, wherein, The extended surface (9) of the retainer carrier (5) is concave or convex and is formed by sectors of a flat surface.

7. The vacuum processing equipment according to claim 1, wherein, The first retainer carrier support (11) TR It can controllably rotate around the central axis of the retainer (A) 11TR Rotate.

8. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The at least one retainer carrier (5) comprises at least two separate segments (65), and the exchange transmitter (33) is configured to transfer data from the first retainer carrier support (11) at a time. TR ) Grasp one of the discrete segments (65) and in the first retainer carrier support (11) TR Release one of the discrete segments (65) from the second retainer carrier support (11) at a time. LL ) Grasp one of the discrete segments (65) and in the second retainer carrier support (11) LL Release one of the discrete segments (65) on the first retainer carrier support (11) and release one of the discrete segments (65) on the first retainer carrier support (11). TR ) and the second retainer carrier support (11) LL It can be driven by at least one stepper driver to step around the corresponding retainer center axis (A) in an angular manner. 11TR A 11LL Rotate.

9. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The first retainer carrier support (11) TR ) and the second retainer carrier support (11) LL Each of them has a retainer central axis (A) 11TR A 11LL And the central axis of the retainer (A) 11TR A 11LL ) are parallel to each other.

10. The vacuum processing apparatus according to claim 9, wherein, The first retainer carrier support (11) TR The central axis (A) of one of the retainer carriers (5) on the ) HC ) and the second retainer carrier support (11) LL The central axis (A) of one of the retainer carriers (5) on the ) HC ) respectively with the central axis of the retainer (A) 11TR A 11LL )coincide.

11. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The first retainer carrier support (11) TR The central axis (A) of one of the retainer carriers (5) on the ) HC ) and the second retainer carrier support (11) LL The central axis (A) of one of the retainer carriers (5) on the ) HC ) are parallel to each other.

12. The vacuum processing apparatus according to claim 11, wherein, The central axis is vertical.

13. The vacuum processing apparatus according to claim 11, wherein, The exchange transmitter (33) is configured to be perpendicular to the first retainer carrier support (11). TR ) and the second retainer carrier support (11) LL The central axis (A) of the retainer carrier (5) on the ) HC )Transmit the holder carrier (5).

14. The vacuum processing apparatus according to claim 1, wherein the exchange conveyor (33) includes a rotation axis (A) relative to the exchange conveyor (33). 33 At least two extendable and retractable gripping arms (33a, 33b), and the at least two gripping arms (33a, 33b) are jointly and controllably capable of being rotated around the axis of rotation (A) by a rotary actuator. 33 The gripping arms (33a, 33b) rotate, each of which includes a gripping unit (35a, 35b) configured to controllably grip and release the retainer carrier.

15. The vacuum processing apparatus according to claim 14, wherein, The first retainer carrier support (11) TR The central axis (A) of one of the retainer carriers (5) on the ) HC ) and the second retainer carrier support (11) LL The central axis (A) of one of the retainer carriers (5) on the ) HC It is parallel to the axis of rotation.

16. The vacuum processing apparatus according to claim 14, wherein the gripping arms (33a, 33b) are controllably and independently extended and retracted.

17. The vacuum processing apparatus of claim 14, wherein each of the gripping arms (33a, 33b) is only capable of retracting and extending when the other gripping arm retracts.

18. The vacuum processing apparatus according to any one of claims 14 to 17, wherein the gripping unit (35a, 35b) grips and releases the retainer carrier (5) via a link of pins (51v, 51b) and holes or slots (53v, 53b).

19. The vacuum processing apparatus of claim 18, wherein the connection of the pin and the hole is established and released by the relative movement of the pin (51v, 51b) and the hole (53v, 53b) in the radial direction relative to the axis of rotation.

20. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The second gate valve (25) is located in the bottom wall of the transfer vacuum chamber (23). The other transmitter (26) includes a controllably driven elevator that is drivable toward and from the bottom wall and carries a valve plate (81) oriented parallel to the bottom wall. When the elevator is in the position closest to the bottom wall, the valve plate (81) seals the transfer vacuum chamber.

21. The vacuum processing apparatus according to any one of claims 1 to 7, comprising at least two of the second gate valves (25), and the other transmitter (26) being configured to transfer the retainer carrier (5) from the second retainer carrier support (11). LL The retainer carrier (5) is conveyed through one of the at least two second gate valves (25) and the retainer carrier (5) is conveyed through the other of the at least two second gate valves to the second retainer carrier support (11). LL )superior.

22. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The other transmitter (26) is configured to move back and forth from the second retainer carrier support (11) via one of the at least one second gate valve (25). LL ) transfer retainer carrier (5) and transfer the retainer carrier (5) to the second retainer carrier support (11) LL )superior.

23. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The holder carrier (5) includes at least two or more of the substrate holders (1).

24. The vacuum processing apparatus according to any one of claims 1 to 7, wherein, The at least one substrate holder is either not separable from the holder carrier (5) or is a separate portion that is separable from the holder carrier (5).

25. The vacuum processing apparatus according to any one of claims 1 to 7, wherein the exchange conveyor (33) comprises at least two extendable and retractable gripping arms (33a, 33b), the gripping arms being rotatable relative to the rotation axis (A) of the exchange conveyor (33). 33 The gripping arms (33a, 33b) extend and retract, and are capable of rotating jointly and controllably about the rotation axis via a rotary actuator. They have a stroke to release from the first retainer carrier support (11) via the first gate valve (21). TR ) The gripper carrier (5) and the first retainer carrier support (11) TR Release the retainer carrier (5) from the second retainer carrier support (11) and release the retainer carrier (5) from the second retainer carrier support (1 ... LL ) gripping retainer carrier (5) and in the second retainer carrier support (11) LL Release the retainer carrier (5) on the upper part.

26. The vacuum processing apparatus according to claim 25, wherein, The grasping arms (33a, 33b) are frog-leg shaped arms.

27. The vacuum processing apparatus according to claim 26, wherein, Both grasping arms are composed of the same frog legs (39).

28. The vacuum processing apparatus according to claim 25, wherein, Only one of the gripping arms (33a, 33b) can be extended at a time.

29. The vacuum processing apparatus according to any one of claims 1 to 7, comprising a loading / unloading conveyor (63) in an ambient atmosphere, the loading / unloading conveyor being configured to load a substrate (3) on the at least one substrate holder (1) and unload a substrate (3) from the at least one substrate holder (1) in an ambient atmosphere.

30. The vacuum processing apparatus according to any one of claims 1 to 7, comprising a timing unit (85) that controls at least the operation of the other transmitter (26) and the second gate valve (25), and is configured to control the operation of the other transmitter (26) to exchange the second retainer carrier support (11) during processing operations in the vacuum processing chamber (15). LL The retainer carrier (5) on the ).

31. The vacuum processing apparatus according to any one of claims 1 to 7, wherein: a) The vacuum processing chamber (15) is an evaporation coating chamber and includes at least one evaporator source (75); b) The retainer carrier (5) comprises at least two separate segments (65) and is dome-shaped; c) The first retainer carrier support (11) TR ) and the second retainer carrier support (11) LL It is dome-shaped and can be controlled to rotate around the corresponding axis (A). 11TR A 11LL Rotate.

32. The vacuum processing apparatus according to any one of claims 14 to 17, wherein, The at least one retainer carrier (5) comprises at least two separate segments (65), and the exchange transmitter (33) is configured to transfer data from the first retainer carrier support (11) at a time. TR ) Grasp one of the discrete segments (65) and in the first retainer carrier support (11) TR Release one of the discrete segments (65) from the second retainer carrier support (11) at a time. LL ) Grasp one of the discrete segments (65) and in the second retainer carrier support (11) LL The gripping unit (35a, 35b) grips and releases one of the discrete segments (65) of the retainer carrier (5) via a link of pins (51v, 51b) and holes or slots (53v, 53b).

33. A retainer carrier (5) suitable for use in a device according to any one of claims 1 to 32, the retainer carrier (5) being configured to retain extended surfaces (7) of at least two substrates (3) applied thereto, which are freely exposed to the surrounding environment along extended surfaces (9) of the retainer carrier (5), the extended surfaces (9) of the retainer carrier (5) being oriented transversely to the central axis (A) of the extended surfaces (9) of the retainer carrier (5). HC Furthermore, the retainer carrier includes at least two separate segments (65) that can be assembled to produce the retainer carrier (5) and disassembled.

34. The retainer carrier according to claim 33, wherein it is dome-shaped.

35. A method for manufacturing a vacuum-treated substrate, comprising: More than one retainer carrier (5) is provided, each of the retainer carriers (5) including an extension surface (9) and at least one substrate retainer (1) along the extension surface (9), the at least one substrate retainer (1) being configured to retain the extension surface (7) of a substrate (3) resting thereon, which is freely exposed to the surrounding environment along the extension surface (9) of the retainer carrier (5), the extension surface (9) of the retainer carrier (5) being oriented transversely to the central axis (A) of the retainer carrier (5) about the extension surface (9) of the retainer carrier (5). HC )extend; At least one vacuum processing chamber (15) is provided, the at least one vacuum processing chamber (15) being configured to process the at least one substrate (3) on a single retainer carrier (5) in the retainer carrier (5); A transfer vacuum chamber (23) is provided, connected via a gate valve (21) to the at least one vacuum processing chamber (15), and Perform the following additional steps: a) The substrate (3) on one of the holder carriers (5) is processed in the vacuum processing chamber (15) at a time to produce a processed substrate (3) on the one holder carrier (5), thereby performing the processing in the vacuum processing chamber (15) under process pressure, the processing spanning a processing time (T). TR (This period continues) b) During the processing time span (T) TR )period: b1): One of the holder carriers (5) with the previously treated substrate is transferred from the transfer vacuum chamber (23) toward the environment, thereby venting the transfer vacuum chamber, and b2): One of the holder carriers (5) with the untreated substrate (3) is transferred from the environment to the transfer vacuum chamber (23), and a process pressure (p) is established in the transfer vacuum chamber (23). TR ), c) After the treatment, in the vacuum treatment chamber (15), the holder carrier (5) with the treated substrate (3) is exchanged with the holder carrier (5) with the untreated substrate (3) from the transfer vacuum chamber (23) through the gate valve (21), and in the transfer vacuum chamber (23), the holder carrier (5) with the untreated substrate (3) is exchanged with the holder carrier (5) with the treated substrate (3) from the vacuum treatment chamber (15) through the gate valve (21); d) Repeat steps a) through c).

36. The method of manufacturing a vacuum-treated substrate according to claim 35, comprising performing unloading at least one treated substrate from one of the holder carriers (5) in an ambient atmosphere and loading at least one untreated substrate into one of the holder carriers (5).

37. The method of manufacturing a vacuum-treated substrate according to claim 35, wherein at least one treated substrate is unloaded from a retainer carrier (5) and at least one untreated substrate is loaded onto the same retainer carrier (5).

38. The method of manufacturing a vacuum-treated substrate according to claim 35, wherein each of the holder carriers (5) is constructed by at least two discrete segments (65) and step c) is performed by exchanging segments (65), at least one of the at least two discrete segments (65) comprising at least one substrate holder (1).

39. The method of manufacturing a vacuum-treated substrate according to claim 38, wherein the exchange is performed by repeatedly exchanging one segment (65) from one segment (65) in the vacuum treatment chamber (15) and by repeatedly exchanging one segment from one segment (65) in the transfer vacuum chamber (23).

40. The method of manufacturing a vacuum-treated substrate according to any one of claims 35 to 39, wherein, The process is an evaporative coating, and the holder carrier (5) is a dome.

41. The method of manufacturing a vacuum-treated substrate according to any one of claims 35 to 39, performed using the apparatus according to any one of claims 1 to 32.

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