Sensor driving device

Abstract

A sensor driving device according to one embodiment includes: a fixed portion; a moving portion arranged to be spaced apart from the fixed portion; and a wire portion arranged between the fixed portion and the moving portion, wherein: the fixed portion includes a first substrate including a first lead pattern portion; the moving portion includes an elastic member having a second lead pattern portion, a sensor arranged on the elastic member, the second lead pattern portion including a 2-1 lead pattern portion connected to the sensor, a 2-2 lead pattern portion connected to the wire portion, and a connection pattern portion for elastically connecting the 2-1 lead pattern portion to the 2-2 lead pattern portion; and the wire portion has one end connected to the first lead pattern portion and the other end connected to the 2-2 lead pattern portion to elastically support the moving portion.

Description

Technical Field

[0001] The embodiments relate to sensor driving devices, and more specifically, to sensor driving devices capable of relative motion with respect to the lens barrel. Background Technology

[0002] Typically, camera devices are mounted not only on portable devices such as mobile communication terminals and MP3 players, but also on electronic devices such as automobiles, endoscopes, and CCTV cameras. These camera devices are increasingly being developed with a focus on high pixel counts and are becoming smaller and thinner. Furthermore, current camera devices are evolving to enable various additional functions at low production costs.

[0003] The aforementioned camera device includes: a lens barrel for housing a lens; a lens holder connected to the lens barrel; an image sensor disposed within the lens holder; and a drive substrate on which the image sensor is mounted. In this configuration, the lens transmits an image signal of the object to the image sensor. The image sensor then converts the video signal into an electrical signal.

[0004] Here, the accuracy of the video signal at the camera device is determined based on the focal length, which is defined as the distance between the lens and the image sensor.

[0005] Accordingly, the camera device provides focus correction or shake compensation by moving the lens barrel relative to the image sensor. That is, in the camera device, the lens barrel housing the lens is moved relative to the image sensor along the X, Y, and Z axes. In this case, the camera device requires at least six elastic members, such as springs, to move the lens barrel relative to it. Furthermore, each elastic member is connected to the lens barrel by a method similar to a coupling.

[0006] However, the camera device according to the prior art, as described above, includes an upper spring plate disposed above the lens barrel, a lower spring plate disposed below the lens barrel, and a structure such as an elastic wire for fixing the Z-axis due to the relative movement of the lens barrel, and therefore suffers from the problem of complex modular structure of the camera device.

[0007] In addition, existing camera devices require multiple elastic components to move the lens barrel, which increases the number of assembly processes for the multiple elastic components. Summary of the Invention

[0008] Technical issues

[0009] The implementation provides a sensor driving device with a novel structure.

[0010] Additionally, the embodiment provides a sensor driving device that allows the image sensor to move relative to the lens barrel.

[0011] In addition, the embodiment provides a sensor driving device that can not only realize movement along the X, Y, and Z axes, but also realize tilt correction of the image sensor in order to provide AF and OIS functions.

[0012] In addition, the embodiment provides a sensor driving device that simplifies the spring structure used to provide autofocus or shake correction functions.

[0013] In addition, the embodiment provides a sensor driving device that can prevent tilting when the image sensor moves.

[0014] The technical problems to be solved by the proposed embodiments are not limited to those mentioned above, and those skilled in the art to which the proposed embodiments pertain can clearly understand other technical problems not mentioned.

[0015] Technical solutions

[0016] A sensor driving device according to an embodiment includes: a fixed portion; a movable portion spaced apart from the fixed portion; and a wire portion disposed between the fixed portion and the movable portion. The fixed portion includes a first substrate including a first lead pattern portion. The movable portion includes an elastic member having a second lead pattern portion and a sensor disposed on the elastic member. The second lead pattern portion includes: a second-first lead pattern portion connected to the sensor; a second-second lead pattern portion connected to the wire portion; and a connecting pattern portion elastically connected between the second-first lead pattern portion and the second-second lead pattern portion. The wire portion has one end connected to the first lead pattern portion and another end connected to the second-second lead pattern portion to elastically support the movable portion.

[0017] Additionally, the elastic member includes an insulating portion comprising a first insulating portion and a second insulating portion spaced apart from the first insulating portion; wherein a second-first lead pattern portion is disposed on the first insulating portion, wherein a second-second lead pattern portion is disposed on the second insulating portion, and wherein a connecting pattern portion is elastically connected between the first insulating portion and the second insulating portion.

[0018] In addition, the fixing part includes a first coil portion disposed on the first substrate.

[0019] Additionally, the movable portion includes: a magnet holder having an opening formed in a central region; and a magnet portion disposed on the magnet holder and corresponding to the first coil portion.

[0020] Additionally, the movable part includes: a coil holder having an opening formed in a central region and disposed in the opening of the magnet holder; and a second coil portion disposed on the coil holder and corresponding to the magnet portion.

[0021] Additionally, a first coil portion is disposed on the lower surface of the first substrate facing the upper surface of the magnet portion, and a second coil portion is disposed on the outer surface of the coil holder facing the inner surface of the magnet portion.

[0022] Additionally, the wire section includes multiple wires, wherein at least one of the multiple wires is electrically connected to the second coil section.

[0023] Additionally, the movable part includes a sensor substrate disposed in the opening of the coil holder, a sensor mounted on the sensor substrate, and a terminal portion connected to the second-first lead pattern portion formed on the sensor substrate.

[0024] Additionally, the second lead pattern portion includes a plurality of flexible connecting wires, wherein at least one second-first lead pattern portion of the plurality of flexible connecting wires is disposed on a first side region of the first insulating portion, and wherein a second-second lead pattern portion connected to the second-first lead pattern portion disposed on the first side region is disposed on a second side region of the second insulating portion that does not correspond to the first side region.

[0025] In addition, the connecting pattern section can be bent at least twice.

[0026] Additionally, the second-second lead pattern portion includes: a body portion; a connecting portion that connects to the other end of the wire portion; and a connecting portion that connects the body portion and the connecting portion.

[0027] In addition, the connecting portion of the second-to-second lead pattern includes a bent area.

[0028] Additionally, the first lead pattern portion includes a plurality of first lead patterns, the second lead pattern portion includes a plurality of second lead patterns, the wire portion includes a plurality of wires, and the number of the plurality of wires is equal to or less than the number of each of the plurality of first lead patterns and the plurality of second lead patterns.

[0029] On the other hand, the sensor driving device according to the embodiment includes: a first substrate; an elastic member disposed spaced apart from the first substrate; a wire portion connecting the first substrate and the elastic member; an image sensor module disposed on the elastic member and having a sensor mounted thereon; a first driving portion disposed on the first substrate; a first holder disposed on the elastic member and including an opening in which the image sensor module is disposed; a second holder disposed on the elastic member and including an opening in which the first holder is disposed; a second driving portion disposed on the first holder; and a third driving portion disposed on the second holder, wherein the elastic member includes a plurality of elastic connecting wires, wherein at least one of the plurality of elastic connecting wires is electrically connected to the first substrate and the image sensor module through the wire portion, and wherein the sensor moves along a direction perpendicular to the optical axis through the first driving portion and the third driving portion, and moves along the optical axis through the second driving portion and the third driving portion.

[0030] Additionally, the first driving section includes a plurality of first coils, the second driving section includes a second coil, and the third driving section includes a plurality of magnets facing the plurality of first coils and the second coils.

[0031] Beneficial effects

[0032] According to the embodiment, the image sensor moves and rotates relative to the lens barrel along the X-axis, Y-axis, and Z-axis directions to achieve the OIS and AF functions of the camera module, instead of moving the lens barrel as in the prior art. Therefore, the camera module according to the embodiment eliminates the complex spring structure used to achieve the OIS and AF functions, and correspondingly, the structure can be simplified. Furthermore, by moving the image sensor relative to the lens barrel, the embodiment can provide a more stable structure than the prior art.

[0033] Furthermore, the camera module according to the embodiment includes a lead pattern portion electrically connected to the image sensor. The lead pattern portion has a spring structure. Additionally, the lead pattern portion is configured to float in a position where it does not overlap with the insulating layer in the vertical direction. Accordingly, the camera module can stably and elastically support the image sensor. Furthermore, the camera module can stably move the image sensor relative to the lens barrel.

[0034] Furthermore, X-axis displacement, Y-axis displacement, Z-axis displacement, and Z-axis rotation of the image sensor in the camera module according to the embodiment can be performed for shake correction. Additionally, the camera module according to the embodiment can provide shake correction via lens movement and image sensor movement. Accordingly, the embodiment can provide further improved shake correction functionality.

[0035] Furthermore, in this embodiment, the actuator in the camera module for moving the image sensor relative to the lens barrel includes an internal space. Additionally, electrical components required for the camera circuitry, such as a gyroscope sensor and a driver IC, can be integrated into the internal space of the actuator. Accordingly, this embodiment can reduce the overall height of the camera module.

[0036] Furthermore, by integrating and fusing camera circuit components and actuator components, the camera assembly process according to the embodiments can be simplified.

[0037] In addition, the implementation method allows for easy replacement of the lens module.

[0038] In other words, the OIS or AF function in the camera device of the comparative example should be located in the lens module. Accordingly, when replacing the lens module in the comparative example, the actuator must also be replaced. Furthermore, in the comparative example, if a lens module without an actuator for AF or OIS functions is replaced, AF or OIS functions cannot be provided.

[0039] On the other hand, both the AF and OIS functions in the implementation can be achieved through the movement of the image sensor. Accordingly, when replacing the lens module in the implementation, the lens module can be easily replaced with one that does not have OIS, thereby improving user satisfaction. Attached Figure Description

[0040] Figure 1 This is a view showing the camera module according to the comparison example.

[0041] Figure 2 This is a perspective view of a camera device according to an embodiment.

[0042] Figure 3 It is along Figure 2 The cross-sectional view taken by line AA.

[0043] Figure 4 This is an exploded perspective view of the camera device according to the embodiment;

[0044] Figure 5 yes Figure 4 An exploded perspective view of the actuator shown.

[0045] Figure 6 yes Figure 5 A perspective view of the first retainer of the fixed portion shown.

[0046] Figure 7 It constitutes Figure 5 An exploded perspective view of the first substrate of the fixed portion of the actuator shown.

[0047] Figure 8 This is a view showing the connection between the first substrate portion and the wire portion according to an embodiment.

[0048] Figure 9 This is an exploded perspective view of the moving part of the actuator according to the embodiment.

[0049] Figure 10 This is a perspective view of the second retainer of the movable portion according to the embodiment.

[0050] Figure 11 This is a view showing the connection between the second retainer and the second elastic member according to an embodiment.

[0051] Figure 12 (a) is a perspective view of the third retainer of the moving part according to the embodiment.

[0052] Figure 12 (b) is a view showing the connection of the third holder, the first elastic member, the sensing magnet, the second coil portion and the magnet portion according to the embodiment.

[0053] Figure 13 This is a view showing the arrangement of the first coil portion, the second coil portion, and the magnet portion constituting the drive portion of the actuator according to the embodiment.

[0054] Figure 14 This is an exploded perspective view of the second elastic member of the movable part according to the embodiment.

[0055] Figure 15 yes Figure 14 Plan view of the second elastic member.

[0056] Figure 16 It is based on Figure 14 A plan view of a modified example of the second elastic member.

[0057] Figure 17 yes Figure 14 Bottom view of the second elastic member.

[0058] Figure 18 yes Figure 17 An enlarged view of a specific area of ​​the second elastic member.

[0059] Figure 19 This is an exploded perspective view of the image sensor module of the moving part according to the embodiment.

[0060] Figure 20 This is a view showing the connection between the second elastic member and the image sensor module.

[0061] Figure 21 This is a perspective view of a sensor driving device according to an embodiment where a specific configuration has been removed.

[0062] Figure 22 This is a view used to illustrate x-axis direction displacement drive implemented by some configurations of a sensor driving device according to an embodiment.

[0063] Figure 23 This is a view used to illustrate y-axis displacement drive implemented by some configurations of a sensor driving device according to an embodiment.

[0064] Figure 24 This is a view used to illustrate z-axis rotation drive implemented through some configurations of a camera device according to an embodiment.

[0065] Figure 25 This is a perspective view of the optical device according to the embodiment.

[0066] Figure 26 yes Figure 25 A block diagram of the optical device shown. Detailed Implementation

[0067] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0068] However, the spirit and scope of the invention are not limited to the portion of the described embodiments, and may be implemented in various other forms. Furthermore, within the spirit and scope of the invention, one or more elements of the embodiments may be selectively combined and substituted.

[0069] Furthermore, unless explicitly defined and described otherwise, the terms (including technical and scientific terms) used in the embodiments of this invention are to be interpreted as having the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains, and terms such as those defined in common dictionaries are to be interpreted as having the same meaning as their meaning in the context of the relevant art. Moreover, the terminology used in the embodiments of this invention is for describing the implementation methods and is not intended to limit the invention.

[0070] In this specification, the singular form may also include the plural form unless specifically stated in the phrase, and the singular form, when described as "at least one (or more) of A, B, and C," may include at least one of all combinations that can be combined with A, B, and C. Furthermore, when describing elements of embodiments of the invention, terms such as first, second, A, B, (a), and (b) may be used.

[0071] These terms are used only to distinguish an element from other elements, and are not limited to nature, order, or the order of elements. Furthermore, when an element is described as “connected,” “linked,” or “connected to” another element, this can include not only cases where the element is directly “connected,” “linked,” or “connected to” another element, but also cases where the element is “connected,” “linked,” or “connected” to other elements via another element.

[0072] Furthermore, when described as being formed or positioned "above" or "below" each element, "above" or "below" can include not only cases where two elements are directly connected to each other, but also cases where one or more other elements are formed or positioned between two elements. Additionally, when expressed as "above" or "below," it can include not only the upward direction based on a single element, but also the downward direction.

[0073] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0074] Figure 1 This is a view showing the camera module according to the comparison example.

[0075] Camera modules with optical image stabilization (OIS) and autofocus (AF) require at least two spring plates.

[0076] The camera module according to the comparative example may have two spring plates. The camera module according to the comparative example requires elastic components for the spring plates, such as at least six springs.

[0077] Reference Figure 1 The camera module according to the comparative example includes an optical system comprising a lens assembly, an infrared cutoff filter, and a sensor unit. Specifically, the camera module according to the comparative example includes a lens barrel 10, a lens assembly 20, a first elastic member 31, a second elastic member 32, a first housing 41, a housing 42, an infrared cutoff filter 50, a sensor unit 60, a circuit board 80, and drivers 71, 72, 73, and 74.

[0078] In this configuration, the lens barrel 10 is connected to the first housing 41. That is, the lens barrel 10 is connected to the first housing 41 via a first elastic member 31. In other words, the lens barrel 10 is connected to the first housing 41 so that it can move via the first elastic member 31. In this configuration, the first elastic member 31 comprises multiple springs (not shown). For example, the first elastic member 31 connects the lens barrel 10 and the first housing 41 at multiple points.

[0079] The second elastic member 32 is connected to the first housing 41 and the second housing 42 that houses the first housing 41. The second elastic member 32 secures the first housing 41 to the second housing 42 so that it can move. The second elastic member 32 includes a plurality of springs. Specifically, the second elastic member 32 includes a leaf spring.

[0080] In this configuration, the first elastic member 31 supports the lens barrel 10 while simultaneously moving the lens barrel 10 relative to the sensor unit 60 in the vertical direction (Z-axis direction). For this purpose, the first elastic member 31 comprises at least four springs.

[0081] In addition, the second elastic member 32 supports the lens barrel 10 while allowing the lens barrel 10 to move relative to the sensor unit 60 in the horizontal direction (X-axis and Y-axis directions). For this purpose, the second elastic member 32 includes at least two springs.

[0082] As described above, OIS and AF in the camera module according to the comparative example are performed when the lens barrel 10 moves along the X-axis, Y-axis, and Z-axis directions. For this purpose, the camera module according to the comparative example requires at least six elastic members, such as springs. Additionally, the camera module according to the comparative example requires two spring plates to support the elastic members as described above. Furthermore, the camera module according to the comparative example requires additional members, such as elastic wires, for fixing the Z-axis of the lens barrel 10. Therefore, the camera module according to the comparative example has a complex spring structure for moving the lens barrel along the X-axis, Y-axis, and Z-axis directions.

[0083] Furthermore, in the camera module according to the comparative example, the operation of connecting the corresponding elastic member to the lens barrel 10 needs to be performed manually. Consequently, the camera module according to the comparative example has a complex manufacturing process and requires a long manufacturing time.

[0084] Furthermore, the camera module according to the comparative example provides a tilt function for the lens barrel 10, but has a structure that makes image tilt correction substantially difficult. That is, even if the lens barrel 10 is rotated relative to the sensor unit 60, the image incident on the sensor unit 60 does not change, and therefore image tilt correction is difficult, and moreover, the tilt function itself is unnecessary.

[0085] In the following, a substrate for an image sensor, a camera module, and a camera device including the camera module will be described according to embodiments.

[0086] The term "optical axis direction" as used below is defined as the optical axis direction of the lens and / or image sensor connected to the lens drive device.

[0087] The "vertical direction" used below can be a direction parallel to the optical axis. The vertical direction can correspond to the "z-axis direction." The "horizontal direction" used below can be a direction perpendicular to the vertical direction. That is, the horizontal direction can be a direction perpendicular to the optical axis. Accordingly, the horizontal direction can include the "x-axis direction" and the "y-axis direction."

[0088] The "autofocus function" used below adjusts the distance to the image sensor by moving the lens along the optical axis according to the distance to the object, so that a clear image of the object can be obtained through the image sensor. Accordingly, the "autofocus function" is defined as the function of automatically focusing on the object. At the same time, "autofocus" can be the same as "AF (autofocus)".

[0089] The “shake correction function” used below is defined as a function that moves the lens and / or image sensor to counteract vibrations (motions) generated in the image sensor by external forces. Meanwhile, “hand shake correction” can correspond to “OIS (Optical Image Stabilization)”.

[0090] Figure 2 This is a perspective view of the camera device according to the embodiment. Figure 3 It is along Figure 2 The cross-sectional view of line AA, and Figure 4 This is an exploded perspective view of the camera device according to the embodiment.

[0091] The camera device in the embodiments may include a camera module. The camera device may include a lens driving device. Here, the lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens drive motor. The lens driving device may be a lens drive actuator. The lens driving device may include an AF module. The lens driving device may include an OIS module.

[0092] <Camera Device>

[0093] The camera device may include a lens module 100.

[0094] Lens module 100 may include a lens and a lens barrel. Lens module 100 may include one or more lenses and a lens barrel capable of receiving one or more lenses.

[0095] However, one configuration of the lens module 100 is not limited to the lens barrel, and any retainer structure capable of supporting one or more lenses can be used.

[0096] In this embodiment, the lens module 100 remains in a fixed position without moving. That is, the lens module in a typical camera device is tilted in the direction of the optical axis or in a direction perpendicular to the optical axis for AF or OIS. Specifically, the lens module in the comparative example camera device is tilted or moved by an actuator. In other words, the AF or OIS function in the comparative example camera device is implemented by the movement of the lens module.

[0097] On the other hand, both the OIS and AF functions in the implementation can be provided by moving (tilting or shifting) the image sensor module 660 while the position of the lens module 100 is fixed.

[0098] The camera device may include an actuator.

[0099] Specifically, the camera device may include an actuator 400 for shifting the image sensor module 660. The actuator 400 may be an AF module. Alternatively, the actuator 400 may be an OIS module. The actuator 400 can move the image sensor module 660 in a vertical direction (specifically, the optical axis direction) when the lens module 100 is fixed. That is, the actuator 400 can perform autofocus by moving the image sensor module 660 along the optical axis. Furthermore, the actuator 400 can tilt or rotate the image sensor module 660.

[0100] In other words, actuator 400 moves image sensor module 660 along a first direction perpendicular to the optical axis. Furthermore, actuator 400 moves image sensor module 660 along a second direction perpendicular to both the optical axis and the first direction. Additionally, actuator 400 can rotate image sensor module 660 about the optical axis. In this case, the first direction can be the x-axis direction, the second direction can be the y-axis direction, and the optical axis can be the z-axis direction.

[0101] Simultaneously, the actuator 400 may include a driving portion for moving the image sensor module 660. Specifically, the actuator 400 may include a first driving portion to a third driving portion. In this case, two of the first to third driving portions may be a first coil and a second coil. Additionally, the remaining driving portion may be a magnet. In this case, the magnet may be a common magnet. That is, an electromagnetic force is generated in the first coil and the common magnet, allowing the image sensor module 660 to move. Furthermore, an electromagnetic force is generated by the second coil and the common magnet, allowing the image sensor module 660 to move.

[0102] The camera device may include a housing.

[0103] The housing may include a first housing 200 and a second housing 300. The first housing 200 may be an upper housing covering the upper region of the camera device. In this case, the first housing 200 may be a protective cover.

[0104] The first housing 200 may be configured to surround the side portion of the lens module 100, actuator 400, and image sensor module 660 constituting the camera device. The first housing 200 may have a first opening region 210 formed on its upper surface. The first opening region 210 of the first housing 200 may be a hollow hole. The lens module 100 may be disposed within the first opening region 210 of the first housing 200. In this case, the first opening region 210 of the first housing 200 may have a diameter larger than the diameter of the lens module 100.

[0105] Specifically, the first housing 200 may include an upper plate. Additionally, the first housing may include multiple side plates that are bent or folded at the edges of the upper plate and extend downwards. For example, the upper plate of the first housing 200 may have a rectangular shape. Accordingly, the first housing 200 may include four side plates extending downwards from the four edges of the upper plate. For example, the first housing 200 may have a rectangular parallelepiped shape, wherein a first region 210 for inserting the lens module 100 is formed on its upper surface, the lower surface is open, and the corners are rounded.

[0106] Simultaneously, a second opening region (not shown) may be formed on any of the four side plates of the first housing 200. The second opening region (not shown) may be an exposure hole for exposing a portion of the actuator 400 disposed in the first housing 200 to the outside. For example, the second opening region (not shown) of the first housing 200 may expose the terminals of the actuator 400.

[0107] The second housing 300 can be a lower housing that covers the lower area of ​​the camera assembly. The second housing 300 can close the open lower area of ​​the first housing 200.

[0108] The actuator 400 and image sensor module 660 constituting the camera device can be disposed in the receiving space formed by the first housing 200 and the second housing 300.

[0109] The image sensor module 660 can be coupled to the actuator 400. Preferably, the actuator 400 may include a fixed portion 500 and a movable portion 600. Furthermore, the movable portion 600 of the actuator 400 can be connected to the fixed portion 500 via a wire 700. Additionally, the movable portion 600 of the actuator 400 can move relative to the fixed portion by the electromagnetic force of the driving portion. Here, the movement of the fixed portion can include movement along a first direction, movement along a second direction, rotation about the optical axis, and movement along the optical axis.

[0110] Additionally, the image sensor module 660 can be coupled to the moving portion 600 of the actuator 400. The image sensor module 660 may include an image sensor 662. Furthermore, the image sensor 662 may be any of a charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0111] In this embodiment, the image sensor 662 can rotate about the x-axis, y-axis, and z-axis. The image sensor 662 can move relative to the x-axis, y-axis, and z-axis. The image sensor 662 can tilt relative to the x-axis, y-axis, and z-axis.

[0112] In other words, the image sensor module 660 is connected to the moving part 600 of the actuator 400.

[0113] Furthermore, when the moving part of the second actuator 400 moves relative to the fixed part of the second actuator 400, the image sensor module 660 can move together with the moving part of the second actuator 400 relative to the fixed part of the second actuator 400. This allows for the execution of a hand shake correction function.

[0114] As described above, the image sensor module 660 in the embodiment is moved using the actuator 400. Additionally, both the autofocus (AF) function and the hand shake correction function can be performed by moving the image sensor module 660.

[0115] In this embodiment, the camera device performs image stabilization and / or autofocus by moving the image sensor module 660 relative to the lens module 100.

[0116] In other words, with the development of camera technology in recent years, image resolution has improved. Furthermore, the size of the image sensor 662 has also increased as a result.

[0117] In this situation, as the size of the image sensor 662 increases, the size of the lens module 100 and the components of the actuators used to move the lens module 100 also increase. For this reason, with the increased weight of the other actuator components used to move the lens module 100, as well as the increased weight of the lens module 100 itself, it becomes difficult to stably shift the lens module 100 using VCM technology. Specifically, when using VCL technology to move the lens module 100, many reliability issues arise.

[0118] Accordingly, in this embodiment, AF and OIS are executed using an actuator 400 that implements the image sensor shifting method. Consequently, this embodiment can improve the reliability of the camera device.

[0119] Furthermore, there are five types of camera shake in a camera setup. For example, these five types of shake include two shaking motions at an angle, two shaking motions during displacement, and one shaking motion during rotation.

[0120] In this scenario, only four of the five camera shake errors, excluding those caused by rotation, can be corrected using a lens shifting method. For example, lens movement methods cannot be used to correct camera shake caused by rotation. In this case, camera shake caused by rotation can be corrected by rotating the optical module. However, even if the lens module 100 is rotated, the incident optical path remains unchanged. Accordingly, using a lens shifting method, only some of the five camera shake corrections are possible.

[0121] Accordingly, by applying the sensor shifting method, all five image stabilization methods in the implementation are possible. In other words, the implementation method enables the resolution of reliability issues with lens shifting methods that have arisen with advancements in camera technology.

[0122] In the following text, each component of the camera device according to the embodiment will be described in more detail.

[0123] <Actuator>

[0124] Figure 5 yes Figure 4 An exploded perspective view of the actuator shown. Figure 6 yes Figure 5 A perspective view of the first retainer of the fixed portion shown. Figure 7 It constitutes Figure 5 An exploded perspective view of the first substrate of the actuator's fixed portion shown. Figure 8 This is a view showing the connection between the first substrate portion and the wire portion according to an embodiment. Figure 9This is an exploded perspective view of the moving part of the actuator according to the embodiment. Figure 10 This is a perspective view of the second retainer of the movable portion according to the embodiment. Figure 11 This is a view showing the connection between the second retainer and the second elastic member according to an embodiment. Figure 12 (a) is a perspective view of the third retainer of the moving part according to the embodiment. Figure 12 (b) is a view showing the connection of the third holder, the first elastic member, the sensing magnet, the second coil portion, and the magnet portion according to the embodiment. Figure 13 This is a view showing the arrangement of the first coil portion, the second coil portion, and the magnet portion constituting the drive portion of the actuator according to the embodiment. Figure 14 This is an exploded perspective view of the second elastic member of the moving part according to the embodiment. Figure 15 yes Figure 14 A plan view of the second elastic member. Figure 16 It is based on Figure 14 A plan view of a modified example of the second elastic member. Figure 17 yes Figure 14 The bottom view of the second elastic member. Figure 18 yes Figure 17 An enlarged view of a specific region of the second elastic member. Figure 19 This is an exploded perspective view of the image sensor module of the moving part according to the embodiment. Figure 20 This is a view showing the connection between the second elastic member and the image sensor module. Figure 21 This is a perspective view of a sensor driving device according to an embodiment where a specific configuration has been removed.

[0125] The actuator 400 in the embodiment can be a sensor driving device. The actuator 400 can be an AF module that performs AF functions by moving the sensor. The actuator 400 can be an OIS module that performs OIS functions by moving the sensor.

[0126] The actuator 400 may include a fixed portion 500 having a fixed position and a movable portion 600, the position of which is moved by an electromagnetic force of a drive portion when connected to the fixed portion 500.

[0127] The fixed part 500 can refer to the component of the actuator 400 that does not change position and remains fixed when the actuator 400 is driven.

[0128] Furthermore, the moving part 600 may refer to the component of the actuator 400 whose position moves together with the image sensor 662 when the actuator 400 is driven.

[0129] Each component that makes up the actuator 400 will be described below.

[0130] Reference Figures 5 to 24 The actuator 400 includes a fixed part 500 and a movable part 600.

[0131] The fixing portion 500 of the actuator 400 may include a first substrate portion and a first retainer 550. Additionally, the first substrate portion may include a first substrate 510 and a first coil portion 520 disposed on the first substrate 510. The first coil portion 520 may be a component for driving the driving portion of the actuator 400.

[0132] The moving portion 600 of the actuator 400 may include a second holder 610, a third holder 620, a drive portion 630, a first elastic member 640, a second elastic member 650, and an image sensor module 660. Here, the drive portion includes a first coil portion 520 of the first substrate portion. That is, the drive portion of the actuator 400 may include a portion disposed on the fixed portion 500 and another portion disposed on the moving portion 600. Additionally, a portion of the drive portion may include the first coil portion 520 disposed on the first substrate 510. Furthermore, the remaining portion of the drive portion may include a magnet portion 630a and a second coil portion 635 disposed on the second holder 610 and the third holder 620 of the moving portion 600.

[0133] Additionally, the actuator 400 may include a housing 800. The housing 800 may have accommodating spaces for accommodating some or all of the components constituting the actuator 400. For example, the housing 800 may accommodate a portion of the first substrate 510, the first coil portion 520, the second holder 610, the third holder 620, the magnet portion 630a, the second coil portion 635, the first elastic member 640, and the image sensor module 660. However, the implementation is not limited to this, and some components may be omitted or disposed outside the housing 800.

[0134] Meanwhile, the fixed portion 500 and the movable portion 600 can be electrically connected to each other via the wire portion 700. Here, the length of the wire portion 700 can be greater than the sum of the thickness of the fixed portion 500 and the thickness of the movable portion 600. Accordingly, the movable portion 600 can be disposed below the fixed portion 500, while being spaced apart from the fixed portion 500 by a predetermined interval.

[0135] In other words, the movable part 600 is arranged in a state (or a flying state) where it is suspended from the fixed part 500 by the wire part 700. In addition, the movable part 600 can be moved relative to the fixed part 500 by electromagnetic force generated by a drive part including the first coil part 520, the second coil part 635 and the magnet part 630a.

[0136] The wire portion 700 can be connected between the fixed portion 500 and the substrate 510. The wire portion 700 can be elastic. The wire portion 700 can be an elastic member. The wire portion 700 can be a wire spring. When the fixed portion 500 and the moving portion 600 are spaced apart by a predetermined interval, the wire portion 700 can be electrically connected between the lead pattern portion of the fixed portion 500 and the lead pattern portion of the moving portion 600. The wire portion 700 can be formed of metal. The wire portion 700 can elastically support the movement of the moving portion 600.

[0137] The cable section 700 may include multiple cables. The cable section 700 may correspond to the number of channels for signals exchanged between the moving section 600 and the stationary section 500. Seven cable sections 700 may be respectively located in the areas between adjacent corners of the four corners of the stationary section 500 and the moving section 600. Accordingly, the cable section 700 may include 28 cables, but is not limited thereto.

[0138] The cable section 700 can be positioned adjacent to different corner areas in the area between the fixed section 500 and the movable section 600.

[0139] For example, the area between the fixed portion 500 and the movable portion 600 may include a first corner area corresponding to the lower right side, a second corner area corresponding to the lower left side, a third corner area corresponding to the upper left side, and a fourth corner area corresponding to the upper right side. Additionally, the wiring portion 700 may include first to fourth wires 710, 720, 730, and 740 disposed adjacent to each of the first to fourth corner areas.

[0140] In this case, each of the first to fourth wires 710, 720, 730 and 740 can be set adjacent to a different corner area in the first to fourth corner areas.

[0141] For example, the first wire 710 can be disposed adjacent to the first corner area between the first corner area and the fourth corner area.

[0142] For example, the second wire 720 can be installed adjacent to the second corner area between the first corner area and the second corner area.

[0143] For example, the third wire 730 can be installed adjacent to the third corner area between the second corner area and the third corner area.

[0144] For example, the fourth wire 740 can be installed adjacent to the fourth corner area between the third corner area and the fourth corner area.

[0145] The arrangement of the wire section 700 improves the rotational reliability of the moving part 600 relative to the fixed part 500. In this way, the accuracy of OIS operation can be improved.

[0146] In other words, the wire section 700 can be evenly distributed in each of the four corner areas. In this case, each of the first to fourth wires 710, 720, 730 and 740 arranged adjacent to different corner areas can have the same number of wires.

[0147] The wire section 700 must elastically support the moving section 600 relative to the fixed section 500 while transmitting signals. Here, when the number of wires in each of the first to fourth wires 710, 720, 730, and 740 differs from each other, a difference in the amount of movement occurs between the section with a large number of wires and the section with a small number of wires. Furthermore, this difference in movement may cause problems with operational reliability.

[0148] Accordingly, in the embodiment, the wire portion 700 is evenly distributed in adjacent areas of different corner regions when it has a circular arrangement structure. Therefore, the embodiment can improve the reliability when the image sensor is tilted, shifted, or rotated.

[0149] The actuator 400 described above will now be described in detail.

[0150] -case-

[0151] The housing 800 may include a centrally formed opening. The housing 800 includes a lower portion. Furthermore, the housing 800 may include sidewall portions projecting from the edge region of the lower portion. Accordingly, the opening may be formed on the lower surface of the housing 800. Additionally, the upper portion of the housing 800 may have an open shape. The housing 800 may be coupled to a first housing 200. For example, the housing 800 may be coupled to the lower portion of the first housing 200. Additionally, an exposed portion (not shown) may be formed between the housing 800 and the first housing 200. The exposed portion allows a portion of the first substrate 510 housed within the housing 800 to be exposed to the outside of the housing 800. At this point, the figures show the exposed portion formed on the lower portion of the first housing 200, but the embodiment is not limited to this. For example, the exposed portion may be formed on the upper portion of the sidewall portion of the housing 800.

[0152] -Fixed Part-

[0153] The actuator 400 includes a fixing portion 500. The fixing portion 500 includes a first substrate 510, a first coil portion 520, and a first retainer 550.

[0154] The first holder 550 may be a substrate holder. For example, the first holder 550 allows a portion of the first substrate 510 to be stably seated in the housing 800.

[0155] The first holder 550 may be a protective portion protecting the upper region of the first substrate 510. For example, the first holder 550 may be a protective portion protecting various electronic components disposed on the first substrate 510. For example, the first substrate 510 may include various electronic components disposed on its upper surface. In addition, the various electronic components disposed on the upper surface of the first substrate 510 may be covered by the first holder 550.

[0156] Accordingly, the first holder 550 may be disposed on the first substrate 510.

[0157] The first holder 550 may be a plate-like member disposed on the first substrate 510. A first opening 551 may be formed in the center of the first holder 550. The first opening 551 may be aligned with the lens module 100 in the optical axis direction. The first opening 551 may have a circular shape. For example, the first opening 551 may have a circular shape to correspond to the shape of the lens module 100. However, the implementation is not limited to this, and the shape of the first opening 551 may be changed in different ways.

[0158] The first retainer 550 may include a plurality of first recesses 552 located on a side surface and recessed in an inward direction.

[0159] For example, refer to Figure 6 (a) The first retainer 550 includes a first-first recess 552-1 formed on a first side surface, a first-second recess 552-2 formed on a second side surface, a first-third recess 552-3 formed on a third side surface, and a first-fourth recess 552-4 formed on a fourth side surface.

[0160] The first recess 552 of the first holder 550 can expose some components disposed on the upper surface of the first substrate 510. For example, the first recess 552 of the first holder 550 can expose the first lead pattern portion 513 disposed on the upper surface of the first substrate 510. Accordingly, the position and area of ​​the first recess 552 of the first holder 550 can correspond to the arrangement position and area of ​​the first lead pattern portion 513 disposed on the upper surface of the first substrate 510.

[0161] Simultaneously, the first holder 550 may include a second opening 553. The second opening 553 may be a component exposure portion that exposes a part of an electronic component disposed on the first substrate 510. For example, the second opening 553 may be an exposure portion that exposes a gyroscope sensor 514 disposed on the upper surface of the first substrate 510. The second opening 553 may be a through portion passing through both the upper and lower surfaces of the first holder 550. Accordingly, a part of the gyroscope sensor 514 disposed on the upper surface of the first substrate 510 may be exposed through the second opening 553 of the first holder 550. For example, a part of the gyroscope sensor 514 may protrude from the upper surface of the first holder 550 through the second opening 553.

[0162] Therefore, the thickness of the first holder 550 in this embodiment does not need to be increased to correspond to the element thickness of the gyroscope sensor 514. This allows for a reduction in the thickness of the product in this embodiment.

[0163] Meanwhile, a plurality of second recesses 554 may be formed on the lower surface of the first holder 550. The plurality of second recesses 554 may be component receiving portions, in which a portion of the electronic components disposed on the upper surface of the first substrate 510 are received. That is, some of the electronic components disposed on the first substrate 510 may be received in the second recesses 554 of the first holder 550 for protection.

[0164] The second recess 554 may be formed in a corner portion of the lower surface of the first holder 550. For example, the second recess 554 may include a second-first recess 554-1 formed on a first corner portion of the lower surface of the first holder 550, a second-second recess 554-1 formed on a second corner portion of the first holder 550, a second-third recess 554-3 formed on a third corner portion, and a second-fourth recess 554-4 formed on a fourth corner portion. A portion of an electronic component disposed on the first substrate 510 may be accommodated in the second recess 554 of the first holder 550. Meanwhile, the second opening 553 may be formed on a corner portion in which any of the plurality of second recesses are formed. For example, the second opening 553 may be formed in a second-first recess 554-1, which is formed on the first corner portion. Accordingly, a portion of the second-first recess 554-1 may include the second opening 553.

[0165] For example, a driver IC 515 in an electronic component disposed on the first substrate 510 may be disposed in a portion of the plurality of second recesses 554. Additionally, capacitors may be disposed in the remaining portions of the plurality of second recesses 554. Furthermore, memory may be disposed in the remaining portions of the plurality of second recesses 554.

[0166] Meanwhile, the fixing portion 500 may include the first substrate 510. In this case, the first retainer 550 may be disposed on the first substrate 510.

[0167] The first substrate 510 includes a first substrate region 511 having a third opening 512 formed therein at its center. Additionally, the first substrate 510 includes a second substrate region 519 extending from the first substrate region 511. A connector 519a for connecting to an external device may be disposed on the second substrate region 519.

[0168] The first substrate 510 may include a first lead pattern portion 513 disposed on a first substrate region 511. The first substrate 510 may be coupled to a wire portion 700 via the first lead pattern portion 513. That is, one end of the wire portion 700 may be coupled to the first lead pattern portion 513 of the first substrate 510. The first lead pattern portion 513 and the wire portion 700 may be coupled by soldering. The first lead pattern portion 513 may be a portion in which solder resist is opened for electrical connection with the wire portion 700.

[0169] Specifically, the first lead pattern portion 513 includes a first hole 513-2 and a first lead pattern 513-1 disposed around the first hole 513-2. That is, the first lead pattern portion 513 can be a pad including the first hole 513-2 through which the wire portion 700 passes. Accordingly, the wire portion 700 is soldered while passing through the first hole 513-2, and thereby the first lead pattern 513-1 disposed around the first hole 513-2 can be electrically connected.

[0170] The first lead pattern portion 513 is configured in multiple ways. That is, the first lead pattern portion 513 includes multiple first lead patterns. Furthermore, the multiple first lead patterns are connected to the wire portion 700. In this case, the number of first lead patterns can be equal to or less than the number of wire portions 700. When the number of first lead patterns is the same as the number of wire portions 700, all the first lead patterns in the first lead pattern can be connected to the wire portion. Conversely, when the number of first lead patterns is less than the number of wire portions 700, at least one of the first lead patterns may not be connected to the wire portion.

[0171] Connector 519a may be disposed in a second substrate region 519 connected to the first substrate region 511. Connector 519a may be a port for electrical connection to an external device. Although connector 519a is illustrated in the drawings as being disposed on the lower surface of the second substrate region 519, the invention is not limited thereto. For example, coil portion 520 may be disposed on the upper surface of the second substrate region 519.

[0172] In this configuration, the first substrate region 511 is disposed inside the camera device. The second substrate region 519 extends from the first substrate region 511 to be exposed to the outside of the camera device.

[0173] In other words, the first substrate region 511 is disposed in the receiving space formed by the first shell 300 and the housing 800. In addition, the second substrate region 519 can be exposed to the outside of the receiving space and can be connected to an external device via connector 519a.

[0174] The first substrate 510 can transmit signals to the movable part 600 or receive signals transmitted from the movable part 600.

[0175] In other words, the first substrate 510 is electrically connected to the movable part 600 via the wire portion 700. Accordingly, the first substrate 510 transmits power signals or communication signals to the movable part 600 via the wire portion 700. Furthermore, the first substrate 510 can receive image signals obtained from the image sensor module 660 of the movable part 600 via the wire portion 700.

[0176] The first substrate 510 may include multiple electronic components. For example, multiple electronic components may be mounted on a first substrate region 511 of the first substrate 510. For example, a gyroscope sensor 514 may be mounted on the first substrate region 511 of the first substrate 510. For example, a driver IC 515 may be mounted on the first substrate region 511 of the first substrate 510. For example, a capacitor or a memory may be mounted on the first substrate region 511 of the first substrate 510.

[0177] In other words, the gyroscope sensor 514 used to prevent hand tremors in this embodiment is mounted on and embedded in the first substrate 510. Therefore, in this embodiment, angular velocity / linear velocity detection information caused by hand tremors can be fed back to the moving part 600. Accordingly, in this embodiment, by providing the gyroscope sensor 514 on the first substrate 510, there is an effect that no additional space is needed for arranging the gyroscope sensor 514.

[0178] Meanwhile, the gyroscope sensor 514 can be exposed on the first holder 550 through the second opening 553 of the first holder 550 disposed on the first substrate 510. Accordingly, in this embodiment, the sensing performance of the gyroscope sensor 514 can be improved.

[0179] Additionally, electronic components such as a driver IC 515, capacitors, and memory are mounted on the first substrate 510. In this case, the mounted electronic components are housed in the second recess 554 of the first holder 550. Thus, this embodiment can reliably protect the electronic components from risk factors that may occur in various operating environments of the sensor driving device.

[0180] Simultaneously, the first lead pattern portion 513 formed on the first substrate 510 can be exposed through the first recess 552 of the first holder 550. That is, with the first holder 550 disposed on the first substrate 510, the first lead pattern portion 513 is exposed through the first recess 552 of the first holder 550. In addition, the embodiment allows the first lead pattern portion 513 exposed through the first recess 552 to be used as a test pad when testing the signal transmission performance of the sensor driving device, and accordingly, the embodiment can easily perform the test operation.

[0181] Simultaneously, a portion of the drive section for driving the actuator 400, which serves as a sensor driving device, can be disposed on the lower surface of the first substrate 510. For example, the first coil portion 520 can be disposed on the lower surface of the first substrate 510. In this case, when considering only OIS operation, the actuator 400 can operate using a magnet movement method where the magnet moves relative to the coil. However, when considering AF operation, the actuator 400 can operate using a coil movement method where the coil moves relative to the magnet. That is, the embodiment includes multiple drive sections for AF and OIS operations. Each of the multiple drive sections may include a coil portion and a magnet portion. However, in the embodiment, the magnet portions of the multiple drive sections are shared as a single magnet portion. Furthermore, in the embodiment, the movement operation of the moving portion 600 is performed using a single shared magnet portion. For example, depending on the intensity and direction of the current applied to the multiple coil portions, the moving portion 600 can tilt, shift, or rotate together with the single shared portion.

[0182] This will be described in more detail below.

[0183] The first coil portion 520 may include a plurality of coils. For example, the first coil portion 520 may include a first-first coil 521 disposed on a first corner region of the lower surface of the first substrate 510, a first-second coil 522 disposed on a second corner region of the first substrate 510, a first-third coil 523 disposed on a third corner region, and a first-fourth coil 524 disposed on a fourth corner region.

[0184] The first coil portion 520 may face the magnet portion 630a disposed on the movable portion 600. For example, the first coil 521 may be configured to face the first magnet 631 of the magnet portion 630a. Furthermore, the first and second coils 522 may be configured to face the second magnet 632 of the magnet portion 630a. Furthermore, the first and third coils 523 may be configured to face the third magnet 633 of the magnet portion 630a. Furthermore, the first and fourth coils 524 may be configured to face the fourth magnet 634 of the magnet portion 630a.

[0185] Meanwhile, the coil portion 520 can be configured to have multiple magnetic poles facing the magnet portion 630a.

[0186] For example, the first coil 521 can face the N and S poles of the first magnet 631 of the magnet portion 630a in the vertical direction (or the z-axis direction or the optical axis direction).

[0187] For example, the first and second coils 522 can face the N and S poles of the second magnet 632 of the magnet portion 630a in the vertical direction (or the z-axis direction or the optical axis direction).

[0188] For example, the first-third coil 523 can face the N and S poles of the third magnet 633 of the magnet part 630a in the vertical direction (or the z-axis direction or the optical axis direction).

[0189] For example, the first to fourth coils 524 can face the N and S poles of the fourth magnet 634 of the magnet part 630a in the vertical direction (or the z-axis direction or the optical axis direction).

[0190] In this implementation, the OIS operation is performed based on the direction and intensity of the current applied to the first coil portion 520.

[0191] For example, the movable portion 600 in the embodiment can move relative to the fixed portion 500 along the x-axis direction according to the direction and intensity of the current applied to a specific coil of the first coil portion 520.

[0192] For example, the movable portion 600 in the embodiment can move relative to the fixed portion 500 along the y-axis direction according to the direction and intensity of the current applied to a specific coil of the first coil portion 520.

[0193] For example, in the embodiment, the movable portion 600 can move relative to the fixed portion 500 along the z-axis direction according to the direction and intensity of the current applied to a specific coil of the first coil portion 520.

[0194] The arrangement and control operation of the first coil section 520 as described above will be described in detail below.

[0195] The first coil section 520 may include four coils.

[0196] At this point, current can be independently applied to at least three of the four coils. In the first embodiment, the first coil portion 520 can be controlled via three control channels. Alternatively, in the second embodiment, the first coil portion 520 can be controlled via four independent control channels.

[0197] The four coils constituting the first coil section 520 can be electrically disconnected from each other. Either a forward current or a reverse current can be selectively applied to each of the four coils in the first coil section 520. In this embodiment, three of the four coils can be electrically disconnected, and the other coil can be electrically connected to any one of the three coils. Alternatively, all four coils can be electrically disconnected. When only three of the four coils are electrically disconnected, three pairs of six leads can be drawn from the first coil section 520. Furthermore, when all four coils are electrically disconnected, four pairs of eight leads can be drawn from the first coil section 520.

[0198] Furthermore, when the four coils are controlled by three control channels, a pair of first coil portions 520 and magnet portions 630a can be driven to rotate the z-axis around the central axis.

[0199] In addition, when the four coils are controlled by the four control channels, the two pairs of first coil portions 520 and magnet portions 630a can be driven to rotate the z-axis around the central axis.

[0200] As described above, the first coil portion 520 can be configured to face the magnet portion 630a. The first coil portion 520 is disposed at each corner region of the lower surface of the first substrate 510. Furthermore, the first-first coil 521-1 and the first-third coil 521-3 can be disposed on the lower surface of the first substrate 510 along a first diagonal direction. Additionally, the first-second coil 521-2 and the first-fourth coil 521-4 can be disposed on the lower surface of the first substrate 510 along a second diagonal direction. The first-first coil 521-1 and the first-third coil 521-3 extend along a first direction on the lower surface of the first substrate 510. The first-second coil 521-2 and the first-fourth coil 521-4 can extend along a second direction orthogonal to the first direction on the lower surface of the first substrate 510. For example, the long side of the first-first coil 521-1 and the long side of the first-third coil 521-3 can be disposed parallel to each other. In addition, the long sides of the first-second coil 521-2 and the long sides of the first-fourth coil 521-4 can be set parallel to each other.

[0201] Each of the long sides of the first-first coil 521-1 and the first-third coil 521-3 can be orthogonal to each of the long sides of the first-second coil 521-2 and the first-fourth coil 521-4.

[0202] Meanwhile, the first substrate 510 may include a position sensor portion. The position sensor portion detects the position of the magnet portion 630a relative to the first coil portion 520.

[0203] In this embodiment, the position detection sensor may be configured to correspond to three of the four coils constituting the first coil portion 520. The position detection sensor may be a magnetic sensor. For example, it may be a Hall sensor. Specifically, the first Hall sensor to the third Hall sensor 516, 517, and 518 may be disposed on the first substrate 510. In this case, the first Hall sensor to the third Hall sensor 516, 517, and 518 may be disposed on the surface of the first substrate 510 opposite to the surface on which the first coil portion 520 is disposed. For example, the first coil portion 520 may be disposed on the lower surface of the first substrate 510. Alternatively, the first Hall sensor to the third Hall sensor 516, 517, and 518 may be disposed on the upper surface of the first substrate 510. However, the embodiment is not limited to this. The first Hall sensor to the third Hall sensor 516, 517, and 518 may be disposed in the inner regions of different coils on the same surface of the first substrate 510 as the surface on which the first coil portion 520 is disposed.

[0204] On the other hand, when the surface where the Hall sensor is disposed and the surface where the first coil portion 520 is disposed are different from each other, the Hall sensor can be disposed on the upper surface of the first substrate 510 in a region that overlaps with the inner region of the first coil portion 520.

[0205] In this embodiment, the Hall sensors can be configured to correspond to three of the four coils constituting the first coil portion 520. In one embodiment, the first coil portion 520, comprising four coils, is controlled by three control channels. Accordingly, none of the four coils needs to be equipped with a Hall sensor. The first Hall sensor to the third Hall sensors 516, 517, and 518 can detect the magnetic force of the magnet in the magnet portion 630a. The movement of the image sensor module can be detected in real time by the magnetic force of the magnet portion 730 detected by the first Hall sensor to the third Hall sensors 516, 517, and 518. And thus, OIS feedback control is possible.

[0206] In this implementation, the Hall sensor used for OIS operation includes three Hall sensors, namely, the first Hall sensor to the third Hall sensor 516, 517, and 518. Furthermore, the movement of the image sensor along the x-axis, the movement along the y-axis, and the rotation about the z-axis can all be detected by the three Hall sensors.

[0207] -Moving Part-

[0208] The moving part 600 will be described below.

[0209] The movable part 600 can be separated from the fixed part 500 by a predetermined interval through the wire part 700.

[0210] Furthermore, the moving part 600 can move along the x-axis direction by the electromagnetic force provided from the driving part. Additionally, the moving part 600 can move along the y-axis direction by the electromagnetic force provided from the driving part. Furthermore, the moving part 600 can move along the z-axis direction by the electromagnetic force provided from the driving part. Furthermore, the moving part 600 can rotate the z-axis to become a rotation axis by the electromagnetic force provided from the driving part.

[0211] The moving part 600 may include a second retainer 610, a third retainer 620, an AF drive part 630, a first elastic member 640, a second elastic member 650, and an image sensor module 660.

[0212] Simultaneously, the moving part 600 can be described as including the second holder 610, the third holder 620, the AF drive part 630, the first elastic member 640, the second elastic member 650, and the image sensor module 660. That is, this is because when considering both OIS operation and AF operation in the overall structure of the actuator 400, the second holder 610, the third holder 620, the AF drive part 630, the first elastic member 640, the second elastic member 650, and the image sensor module 660 move. However, when only the AF operation is performed in the embodiment, the second holder 610 of the moving part 600 operates as a fixed part, and the third holder 620 and the image sensor module 660 of the moving part 600 operate as moving parts.

[0213] In other words, when OIS operation is performed in the sensor driving device of the embodiment, the first substrate 510 is a fixed part, and the second holder 610, the third holder 620, the AF driving part 630, the first elastic member 640, the second elastic member 650, and the image sensor module 660 can be movable parts.

[0214] Additionally, when AF operation is performed in the sensor driving device of the embodiment, the second holder 610 is a fixed part, and the third holder 620, the second elastic member 650 and the image sensor module 660 can be movable parts.

[0215] However, the sensor driving device according to the embodiment can perform both AF operation and OIS operation. Accordingly, the second holder 610, the third holder 620, the AF driving part 630, the first elastic member 640, the second elastic member 650, and the image sensor module 660 can be moving parts.

[0216] On the other hand, in this embodiment, the third retainer 620 of the moving portion 600 is elastically supported to the second retainer 610 in the vertical direction by the first elastic member 640 and the second elastic member 650. Furthermore, the second retainer 610 can move along the x-axis, move along the y-axis, and rotate about the z-axis, which serves as the axis of rotation, through the electromagnetic interaction between the AF drive portion 630 and the first coil portion 520. Thus, the OIS function in this embodiment can be performed.

[0217] In this implementation, when the third retainer 620 moves along the z-axis direction via the electromagnetic interaction of the AF drive portion 630, the autofocus (AF) function can be performed.

[0218] The moving portion 600 of the actuator 400 includes a second retainer 610.

[0219] In an embodiment, the second holder 610 may be a magnet holder in which a magnet portion 630a is disposed. The second holder 610 may have a fourth opening 611, which overlaps with the first opening 551 of the first holder 550 and the third opening 511 of the first substrate 510 in the z-axis direction (optical axis direction). The shape of the fourth opening 611 may correspond to the shape of the third holder 620. Preferably, the fourth opening 611 may be a region in which the third holder 620 is disposed.

[0220] The second retainer 610 may include a first region 612 corresponding to the edge region and a second region 613 located between the first region 612 and the fourth opening 611.

[0221] Furthermore, a through-hole 616 may be formed in the first region 612 of the second holder 610. In this case, the through-hole 616 may be aligned in the optical axis direction with the first hole 513-1 of the first lead pattern portion 513 formed on the first substrate 510. The through-hole 616 may be a wire through-hole through which the wire portion 700 connected to the first lead pattern portion 513 of the first substrate 510 passes. The number of through-holes 616 corresponding to the number of wires constituting the wire portion 700 may be formed in the first region 612 of the second holder 610. For example, the number of through-holes 616 formed in the first region 612 of the second holder 610 may be 27, but is not limited thereto.

[0222] The second region 613 of the second holder 610 may have a step difference relative to the first region 612. A third recess 614 on which the magnet portion 630a is seated may be formed in the second region 613 of the second holder 610. The third recess 614 may correspond to the first coil portion 520 disposed in the third recess 614. For example, the third recess 614 may include third-first recesses to third-fourth recesses 614-1, 614-2, 614-3, and 614-4 corresponding to the first-first coil to first-fourth coils 521, 522, 523, and 524 constituting the first coil portion 520. Preferably, the third-first recess 614-1 may correspond to the first-first coil 521. Preferably, the third-first recess 614-1 may be formed in the region of the second region 613 of the second holder 610 facing the first-first coil 521. The third-second recess 614-2 may be formed in the region of the second region 613 of the second holder 610 facing the first-second coil 522. The third-third recess 614-3 may be formed in the region of the second region 613 of the second holder 610 facing the first-third coil 523. The third-fourth recess 614-4 may be formed in the region of the second region 613 of the second holder 610 facing the first-fourth coil 524.

[0223] The third-first recess 614-1 may be a mounting portion on which a first magnet 631 constituting the magnet portion 630a of the AF drive portion 630 is mounted. The third-second recess 614-2 may be a mounting portion on which a second magnet 632 constituting the magnet portion 630a of the AF drive portion 630 is mounted. The third-third recess 614-3 may be a mounting portion on which a third magnet 633 constituting the magnet portion 630a of the AF drive portion 630 is mounted. The third-fourth recess 614-4 may be a mounting portion on which a fourth magnet 634 constituting the magnet portion 630a of the AF drive portion 630 is mounted. The magnet portions 630a described above may be configured to rotate 90 degrees relative to each other on the second holder 610. In addition, the third recess 614 may be formed in the second region 613 of the second holder 610 to correspond to the magnet portion 630a.

[0224] On the other hand, the first to fourth magnets 631, 632, 633, and 634 of the magnet portion 630a in the third recess 614 may have N and S poles arranged along the x-axis or y-axis direction. Furthermore, the first to fourth magnets 631, 632, 633, and 634 may be configured to face the fourth opening 611 of the second retainer 610 with the same polarity. In the figures, the N pole of each of the first to fourth magnets 631, 632, 633, and 634 is illustrated as facing the fourth opening 611, but the embodiment is not limited to this. For example, in another embodiment, the S pole of each of the first to fourth magnets 631, 632, 633, and 634 may be configured to face the fourth opening 611.

[0225] With the arrangement described above, the N pole and S pole of each of the first to fourth magnets 631, 632, 633, 634 can be configured to face the first-first coil to the first-fourth coils 521, 522, 523 and 524 of the first coil portion 520.

[0226] Simultaneously, a fourth recess 615 is formed on the second region 613 of the second retainer 610. The fourth recess 615 may be a connecting groove for connecting the third retainer 620 to the second retainer 610. The fourth recess 615 may be formed adjacent to the third recess 614. That is, the fourth recess 615 may include the fourth-first recess to the fourth-fourth recess 615-1, 615-2, 615-3 and 615-4 disposed adjacent to the third-first recess to the third-fourth recess 614-1, 614-2, 614-3 and 614-4.

[0227] Meanwhile, the second retainer 610 may include a seat portion for an elastic member, on which the first elastic member 640 is seated. Preferably, the third recess 614 and the fourth recess 615 are formed on the second region 613 of the second retainer 610. Alternatively, the first elastic member 640 may be disposed in the region of the second region 612 of the second retainer 610 where the third recess 614 and the fourth recess 615 are not formed.

[0228] Additionally, a fifth recess 617 may be formed on the lower surface of the second retainer 610. The fifth recess 617 may be formed around the area in the lower surface of the second retainer 610 where the through hole 616 is formed. The fifth recess 617 may be a seating portion on which the portion of the second elastic member 650 of the moving portion 600 connected to the plurality of wire portions 700 passing through the through hole 616 (obviously the second lead pattern portion 652) sits.

[0229] In other words, in this embodiment, the second elastic member 650 of the movable portion 600 is disposed below the second retainer 610. Accordingly, when the image sensor module 660 moves relative to the fixed portion 500, the image sensor module 660 and the first substrate 510 can be electrically connected.

[0230] Meanwhile, the third retainer 620 may be disposed in the fourth opening 611 of the second retainer 610. Accordingly, the fourth opening 611 of the second retainer 610 may have a shape corresponding to the external shape of the third retainer 620.

[0231] In this case, the size of the fourth opening 611 of the second retainer 610 can be larger than the size of the third retainer 620. Accordingly, with the third retainer 620 disposed in the fourth opening 611 of the second retainer 610, a predetermined gap can be formed between the inner surface of the second retainer 610 and the outer surface of the third retainer 620.

[0232] The third retainer 620 may include a fifth opening 621. The fifth opening 621 may have a shape corresponding to that of the lens module 100. For example, the fifth opening 621 may have a circular shape corresponding to the shape of the lens module 100, but is not limited thereto.

[0233] The third retainer 620 can be coupled to the image sensor module 660. For example, the image sensor module 660 can be inserted into the fifth opening 621 of the third retainer 620 to be coupled to the third retainer 620.

[0234] The third holder 620 may include a plurality of outwardly protruding first protrusions 622. The first protrusions 622 of the third holder 620 may have a size and shape corresponding to the fourth recess 615 of the second holder 610. The first protrusions 622 of the third holder 620 may be disposed within the fourth recess 615 of the second holder 610. Accordingly, when the first holder 550, in which a magnet portion 630a is disposed, moves by an electromagnetic force generated between the first coil portion 520 and the magnet portion 630a, the third holder 620 and the image sensor module 660 disposed in the fifth opening 621 of the third holder 620 may move together with the first holder 550. The first protrusions 622 of the third holder 620 may include first-first protrusions to first-fourth protrusions 622-1, 622-2, 622-3, and 622-4 corresponding to the fourth recess 615.

[0235] Additionally, the plurality of first protrusions 622 can serve as stops. For example, the plurality of first protrusions 622 are formed above the second protrusion 623 on which the first elastic member 640 is provided. Furthermore, when the third retainer 620 moves upward to its highest height, the plurality of first protrusions 622 can prevent further movement of the third retainer 620. For example, when the third retainer 620 moves upward to its maximum height, the upper surfaces of the plurality of first protrusions 622 can contact the lower surface of the first substrate 510. Thus, additional movement of the third retainer 620 in the upward direction can be limited.

[0236] Simultaneously, with the first protrusion 622 inserted into the fourth recess 615, a predetermined gap may exist between the first protrusion 622 and the fourth recess 615. For example, with the second retainer 610 and the third retainer 620 connected to each other, a predetermined gap exists between the lower surface of the first protrusion 622 and the lower surface of the fourth recess 615. Furthermore, the predetermined gap may correspond to the distance (or stroke) by which the third retainer 620 moves downward. Additionally, when the third retainer 620 moves downward to its lowest height, the lower surface of the first protrusion 622 may contact the lower surface of the fourth recess 615. This restricts any additional movement of the third retainer 620 in the downward direction.

[0237] The second protrusion 623 may be formed on the upper surface of the third retainer 620 in a region adjacent to the first protrusion 622. The second protrusion 623 may allow the third retainer 620 to be elastically supported by the first elastic member 640.

[0238] A coil winding portion 625 extending around the second coil portion 520 can be formed on the third holder 620. For example, the coil winding portion 625 in the form of an inwardly recessed portion can be formed on the outer surface of the third holder 620. Additionally, the second coil portion 635 can be wound around the coil winding portion 625. The second coil portion 635 can have a "coil block" shape. The second coil portion 635 can be an "electromagnet." The second coil portion 635 can be configured to face the magnet portion 630a with a specific polarity. Accordingly, the second coil portion 635 wound around the coil winding portion 625 of the third holder 620 can electromagnetically interact with the magnet unit 630a to generate an electromagnetic force. In this case, the second coil portion 635 can be electrically connected to the second elastic member 650 or the first elastic member 640, which will be described later. Accordingly, the second coil portion 635 can receive current from the second elastic member 650 or the first elastic member 640 to generate an electromagnetic force. Therefore, the third holder 620 can move along the optical axis to perform an AF function. Preferably, the second coil portion 635 is electrically connected to the second elastic member 650, thereby receiving a power signal. In this case, the second elastic member 650 can receive a power signal from the first substrate 510 via the wire portion 700. Accordingly, at least two of the plurality of wires constituting the wire portion 700 can be electrically connected to the second coil portion 635. Additionally, the moving portion 600 may include a Hall sensor (not shown) or a Hall sensor-in-place driver IC (not shown) for controlling the operation of the AF drive portion 630. Accordingly, some of the plurality of wires in the wire portion 700 can be connected to the Hall sensor or the Hall sensor-in-place driver IC for controlling the operation of the AF drive unit 630. Simultaneously, the driver IC for controlling the operation of the AF drive portion 630 can be used as a driver IC 515 disposed on the first substrate 510. In this case, the wire portion 700 may only include the wire connected to the second coil portion 635.

[0239] On the other hand, the third holder 620 may include a sensor magnet mounting portion 624. Preferably, the third holder 620 may include a first sensor magnet mounting portion 624-1 and a second sensor magnet mounting portion 624-3. The first sensor magnet mounting portion 624-1 and the second sensor magnet mounting portion 624-3 may be arranged facing each other diagonally based on the center of the fifth opening 621 on the upper surface of the third holder 620.

[0240] The first sensor magnet 636 and the second sensor magnet 637 can be respectively disposed in the first sensor magnet mounting portion 624-1 and the second sensor magnet mounting portion 624-3. The first sensor magnet 636 and the second sensor magnet 637 can be disposed on the third holder 620 to sense the position of the third holder 620. That is, the Hall sensor disposed on the first substrate 510 can sense changes in the magnetic field of the magnet portion 630a to detect the position of the magnet portion 630a and the position of the second holder 610. Furthermore, when the third holder 620 moves relative to the first substrate 510 along the z-axis, the first sensor magnet 636 and the second sensor magnet 637 can detect the movement position of the third holder 620.

[0241] Specifically, the distance between the first sensor magnet 636 and the second sensor magnet 637 and the first substrate 510 changes as the third holder 620 moves. Correspondingly, the magnitude of the magnetic field sensed by the driver IC 515 disposed on the first substrate 510 changes. Furthermore, the driver IC 515 can detect the positions of the first sensor magnet 636 and the second sensor magnet 637 based on the change in the magnitude of the changing magnetic field. In addition, the driver IC 515 can detect the position of the third holder 620 and the position of the image sensor module 660.

[0242] A first elastic member 640 is disposed on the second retainer 610 and the third retainer 620. Accordingly, the second retainer 610 and the third retainer 620 can be elastically supported upward by the first elastic member 640. In addition, the second retainer 610 and the third retainer 620 can be elastically supported downward by a second elastic member 650 disposed below the second retainer 610.

[0243] The first elastic member 640 may be a leaf spring. The first elastic member 640 may be made of metal. Alternatively, the first elastic member 640 may be non-magnetic. Accordingly, the first elastic member 640 may be unaffected by the magnetic force of the magnet portion 630a and the electromagnetic force of the first coil portion 520 or the second coil portion 635.

[0244] The first elastic member 640 may be disposed on the second retainer 610. Alternatively, the first elastic member 640 may be disposed on the third retainer 620. The first elastic member 640 may include an opening 641.

[0245] The first elastic member 640 includes a first elastic portion 642 disposed on the third retainer 620 to elastically support the third retainer 620. Furthermore, the first elastic member 640 may include a second elastic portion 643 extending from the first elastic portion 642 and coupled to the second retainer 610.

[0246] Meanwhile, as described above, the drive section 630 in the embodiment may include an OIS drive section and an AF drive section.

[0247] The OIS driving section may include a first coil section 520.

[0248] In addition, the AF drive section may include a second coil section 635.

[0249] Furthermore, the magnet part 630a can be an OIS drive part or an AF drive part. In other words, the magnet part 630a can be a magnet commonly used for OIS drive and AF drive.

[0250] In other words, the magnet portion 630a is disposed on the second retainer 610.

[0251] Furthermore, the first substrate 510 is disposed on the second holder 610. In addition, the first coil portion 520 is disposed on the first substrate 510.

[0252] At this time, the magnet portion 630a has a magnetization structure with N poles and S poles arranged in the x-axis direction or the y-axis direction. Accordingly, each coil in the coil constituting the first coil portion 520 is configured to face the upper surface of the N pole and S pole of each magnet constituting the magnet portion 630a. Specifically, both the N pole and S pole constituting the magnet portion 630a can be configured to face the first coil portion 520 in the z-axis direction. Accordingly, the actuator 400, as a sensor driving device, can move the magnet portion 630a relative to the first coil portion 520 through the electromagnetic interaction between the magnet portion 630a and the first coil portion 520. Accordingly, the first holder 550, in which the magnet portion 630a is disposed, can move in response to the movement of the magnet portion 630a. Furthermore, the second holder 610 connected to the first holder 550 can thus move. Furthermore, the image sensor module 660 disposed in the second holder 610 can thus move.

[0253] Additionally, either the N pole or the S pole constituting the magnet portion 630a can be configured to face the second coil portion 635 in the x-axis or y-axis direction. Accordingly, the actuator 400 corresponding to the sensor driving device can move the third holder 620 relative to the second holder 610 in the z-axis direction (e.g., upward or downward) through the electromagnetic interaction between the magnet portion 630a and the second coil portion 635.

[0254] The second elastic member 650 may be disposed below the second retainer 610 and the third retainer 620.

[0255] In one embodiment, the second elastic member 650 may be a substrate. Specifically, the second elastic member 650 is connected to the wire portion 700 while elastically supporting the second holder 610 and the third holder 620. Accordingly, the second elastic member 650 may provide a signal transmission path between the image sensor module 660 and the first substrate 510.

[0256] The second elastic member 650 can be electrically connected to the first substrate 510 via the wire portion 700. In this case, the second elastic member 650 in the embodiment can be referred to as the substrate portion. That is, the second elastic member 650 includes an insulating portion and a lead pattern portion. The lead pattern portion is formed on the insulating portion. In addition, the lead pattern portion can transmit electrical signals while elastically supporting the second holder 610 and the third holder 620. However, the insulating portion in the embodiment is not a necessary component and can be optionally omitted. For example, in the following description of the second elastic member 650, the insulating portion can be omitted or removed. That is, the second elastic member 650 in the embodiment may only include the wiring pattern portion as described below. And, when the second elastic member 650 only includes the wiring pattern portion, the second elastic member 650 can be manufactured by the following method. That is, when the second elastic member 650 only includes the wiring pattern portion, the wiring pattern portion has a structure in which all the wires are connected to each other and can be coupled to the second holder 610 and the third holder 620. Furthermore, after being connected to the wire section 700 and the image sensor module 660, the wiring pattern section can be separated into multiple signal lines by processing using a laser or the like. However, in the following description, the second elastic member 650 will be described as including an insulating section and a wiring pattern section.

[0257] The second elastic member 650 enables the movement (tilting, shifting, and rotating) of the image sensor module 660, and also enables signal transmission.

[0258] The second elastic member 650 may be disposed between the image sensor module 660 and the first substrate 510. Preferably, the second elastic member 650 may be disposed between the wire portion 700 connected to the first substrate 510 and the image sensor module 660. At least a portion of the second elastic member 650 may be elastic.

[0259] Additionally, the image sensor module 600 can be electrically connected to the second elastic member 650 while being elastically supported by the second elastic member 650. In this case, the image sensor module 660 can be moved relative to the lens module 100 or the first substrate 510 by the elastic force of the second elastic member 650 and the interaction between the magnet portion 630a and the second coil portion 635.

[0260] The second elastic member 650 may include an insulating portion having an inner frame and an outer frame, and an elastic pattern portion disposed on the insulating portion. In this case, as described above, the insulating portion including the inner frame and the outer frame may be optionally omitted.

[0261] The second elastic member 650 includes an insulating portion 651 and a second lead pattern portion 652 disposed on one surface of the insulating portion 651. Although the accompanying drawings show the pattern portion 652 disposed on the lower surface of the insulating portion 651, the embodiment is not limited thereto. For example, the second lead pattern portion 652 may be disposed on the upper surface of the insulating portion 651.

[0262] The insulating portion 651 can be divided into multiple regions that are separate from each other.

[0263] For example, insulating portion 651 includes a first insulating portion 651-1 having an opening formed in its center. Furthermore, insulating portion 651 may include a second insulating portion 651-2 disposed outside and spaced apart from the first insulating portion 651-1. Although the first insulating portion 651-1 and the second insulating portion 651-2 are shown separated from each other in the figures, the implementation is not limited to this. For example, a connecting insulating portion (not shown) may be further disposed between the outside of the first insulating portion 651-1 and the inside of the second insulating portion 651-2. In other words, the first insulating portion 651-1 and the second insulating portion 651-2 of insulating portion 651 may have a structure that is physically completely separated from each other, wherein an open area is inserted between the first insulating portion 651-1 and the second insulating portion 651-2. In contrast, the first insulating portion 651-1 and the second insulating portion 651-2 of insulating portion 651 may be connected to each other in some areas by a connecting insulating portion disposed in the open area. In other words, in the region between the first insulating portion 651-1 and the second insulating portion 651-2, the insulating portion is not completely removed, but rather a portion is retained. Furthermore, the retained portion can serve as a connecting insulating portion to connect the first insulating portion 651-1 and the second insulating portion 651-2. This connecting insulating portion can provide elastic force during the movement of the image sensor module 660. Additionally, the connecting insulating portion can prevent the first insulating portion 651-1 from disengaging from the second insulating portion 651-2 during the movement process. In this case, the insulating portion 651 can be formed on an insulating member by etching or physically stamping to remove the area corresponding to the open area.

[0264] However, it is important here that the insulating portion 651 in the embodiment includes an open area formed between the first insulating portion 651-1 and the second insulating portion 651-2, and the first insulating portion 651-1 and the second insulating portion 651-2 can be separated from each other in the open area without being connected to each other.

[0265] In other words, the second insulating portion 651-2 can be spaced apart from the first insulating portion 651-1 by a predetermined distance through an open area, and is configured to surround the first insulating portion 651-1 at the spaced-apart position. In this case, the first insulating portion 651-1 and the second insulating portion 651-2 can have a single layer structure disposed on the same plane.

[0266] The insulating layer 651 can have a thickness of 20 μm to 100 μm. For example, the insulating layer 651 can have a thickness of 25 μm to 50 μm. For example, the insulating layer 651 can have a thickness of 30 μm to 40 μm. If the thickness of the insulating portion 651 exceeds 100 μm, the thickness of the second elastic member 650 may increase. If the thickness of the insulating portion 651 is less than 20 μm, it may not be able to stably support the second lead pattern portion 652. For example, if the thickness of the insulating portion 651 is less than 20 μm, the insulating portion 651 may be susceptible to heat / pressure during the soldering process for connection with the image sensor module 660. And thus, the connection force with the image sensor module 660 will be reduced.

[0267] Meanwhile, although not shown in the accompanying drawings, at least one slit (not shown) can be formed in the first insulating portion 651-1. The slit can be formed to maintain the flatness of the first insulating portion 651-1. The slit can maintain flatness while reducing the weight of the insulating portion 651 and the second elastic member 650. Accordingly, the overall reliability of the camera module can be improved.

[0268] The second lead pattern portion 652 is disposed on one surface of the insulating portion 651. That is, the first lead pattern portion 513 in the embodiment is formed on the first substrate 510. Furthermore, the second lead pattern portion 652 in the embodiment can constitute the second elastic member 650. In addition, the second-first lead pattern portion 652-1 corresponding to one end of the second lead pattern portion 652 can be connected to the image sensor module 660. In addition, the second-second lead pattern portion 652-2 corresponding to the other end of the second lead pattern portion 652 can be connected to the second lead pattern portion 513 of the first substrate 510 via the wire portion 700.

[0269] The second lead pattern portion 652 includes a second-first lead pattern portion 652-1 disposed on the first insulating portion 651-1 of the insulating portion 651. The second lead pattern portion 652 includes a second-second lead pattern portion 652-2 disposed on the second insulating portion 651-2. The second lead pattern portion 652 includes a connecting pattern portion 652-3 disposed in an open area located between the first insulating portion 651-1 and the second insulating portion 651-2. The connecting pattern portion 652-3 can electrically connect the second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2. In this case, the connecting pattern portion 652-3 can be disposed in the open area located between the first insulating portion 651-1 and the second insulating portion 651-2. Preferably, the connecting pattern portion 652-3 can resiliently support the image sensor module 660.

[0270] In other words, the second lead pattern portion 652 may include a plurality of elastic connecting lines, the plurality of elastic connecting lines including the second-first lead pattern portion 652-1, the second-second lead pattern portion 652-2, and the connecting pattern portion 652-3.

[0271] Here, the first insulating portion 651-1 of the insulating portion 651 and the second-first lead pattern portion 652-1 of the second lead pattern portion 652 can form the inner frame of the second elastic member 650.

[0272] Furthermore, the second insulating portion 651-2 of the insulating portion 651 and the second lead pattern portion 652-2 of the second lead pattern portion 652 can form the outer frame of the second elastic member 650. Additionally, the connecting pattern portion 652-3 can form a connecting portion that elastically connects the outer frame and the inner frame of the second elastic member 650. The connecting pattern portion 652-3 can form a signal transmission path between the inner frame and the outer frame of the second elastic member 650.

[0273] The second-first lead pattern portion 652-1 can be disposed on each of the four side regions of the first insulating portion 651-1. That is, the first insulating portion 651-1 may include a left side region, a right side region, an upper side region, and a lower side region. Furthermore, the second-first lead pattern portion 652-1 may be disposed adjacent to the corner regions of the four side regions of the first insulating portion 651-1. For example, the second-first lead pattern portion 652-1 may be disposed adjacent to the lower left corner of the left side region. For example, the second-first lead pattern portion 652-1 may be disposed adjacent to the upper right corner of the right side region. For example, the second-first lead pattern portion 652-1 may be disposed adjacent to the upper left corner of the upper side region. For example, the second-first lead pattern portion 652-1 may be disposed adjacent to the lower right corner of the lower side region.

[0274] The second-second lead pattern portion 652-2 can be disposed on each of the four side regions of the second insulating portion 651-2. The second insulating portion 651-2 may include a left side region, a right side region, an upper side region, and a lower side region. Additionally, the second-second lead pattern portion 652-2 may be disposed adjacent to the corner regions of the four side regions of the second insulating portion 651-2.

[0275] In this case, at least one of the second-first lead pattern portions 652-1 can be formed on the left side region (e.g., the first side region) of the first insulating portion 651-1. Additionally, a second-second lead pattern portion 652-2 directly connected to the second-first lead pattern portion 652-1 formed on the left side region can be formed on a second side region of the second insulating portion 651-2 that does not correspond to the first side region, for example, on the lower side region.

[0276] The second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2 have a rotational shape and can be positioned adjacent to different corner regions of the insulating portion. This can improve the reliability of the Z-axis roll process of the image sensor module 660.

[0277] Here, the second-first lead pattern portion 652-1 may be the external lead pattern portion of the terminal portion 661-1 connected to the image sensor module 660.

[0278] The second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2 can be connected to each other via a connecting pattern portion 652-3. One end of the connecting pattern portion 652-3 is connected to the second-first lead pattern portion 652-1. The other end of the connecting pattern portion 652-3 is connected to the second-second lead pattern portion 652-2. Furthermore, the area of ​​the connecting pattern portion 652-3, excluding one end and the other end, can be positioned over an open area between the first insulating portion 651-1 and the second insulating portion 651-2. That is, the connecting pattern portion 652-3 can be arranged to be suspended above the open area. Here, "suspended" means that at least a portion of the connecting pattern portion 652-3 is not in contact with the insulating portion 651. For example, "suspended" means that at least a portion of the connecting pattern portion 652-3 is disposed in a floating state over the open area without contacting the insulating portion 651.

[0279] At this time, a plurality of second-first lead pattern portions 652-1 are configured. In addition, a plurality of second-second lead pattern portions 652-2 are configured. Furthermore, a connecting pattern portion 652-3 can be connected between the plurality of second-first lead pattern portions 652-1 and the plurality of second-second lead pattern portions 652-2 at a 1:1 ratio.

[0280] In this case, the number of second-first lead patterns in the second-first lead pattern portion 652-1 can be 28. Additionally, the number of second-second lead patterns in the second-second lead pattern portion 652-2 can be 28. Furthermore, the number of connecting patterns in the connecting pattern portion 652-3 can be 28. Accordingly, the connecting pattern portion 652-3 can be connected between the first lead pattern and the second lead pattern.

[0281] The connecting pattern portion 652-3 can be bent at least once in the open area and is thus configured. That is, the connecting pattern portion 652-3 may include at least one bent portion. The connecting pattern portion 652-3 may be configured to have a rotational structure in the open area.

[0282] For example, when the second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2 are arranged to face each other on the insulating portion 651, the connecting pattern portion 652-3 can connect the second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2 in a straight line without any bends.

[0283] In contrast, the second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2 in this embodiment are not arranged to face each other based on the second lead pattern portions that are directly connected to each other. Therefore, the connecting pattern portion 652-3 includes a bent portion that is bent at least once. In addition, the bent portion of the connecting pattern portion 652-3 can improve the elasticity of the connecting pattern portion 652-3. Furthermore, the bent portion of the connecting pattern portion 652-3 can improve the rigidity of the connecting pattern portion 652-3.

[0284] In this case, the length of the connecting pattern portion 652-3 is greater than the width of the open area between the first insulating portion 651-1 and the second insulating portion 651-2.

[0285] The connecting pattern portion 652-3 can be formed by etching to have the shape described above. Preferably, the second-first lead pattern portion 652-1, the second-second lead pattern portion 652-2 and the connecting pattern portion 652-3 are integrally formed with each other, and correspondingly, they can be formed simultaneously by etching a metal layer.

[0286] On the other hand, the thickness of each of the second-first lead pattern portion 652-1, the second-second lead pattern portion 652-2, and the connecting pattern portion 652-3 (that is, the thickness of the second lead pattern portion) can be from 10 μm to 50 μm. For example, the thickness of the second lead pattern portion 652 can be from 30 μm to 40 μm.

[0287] In this case, if the thickness of the second lead pattern portion 652 is less than 10 μm, breakage of the second lead pattern portion 652 may occur during the movement of the image sensor module 660. Additionally, if the thickness of the second lead pattern portion 652 is greater than 50 μm, the elastic force connecting the pattern portions 652-3 may be reduced. Furthermore, if the elastic force is reduced, the mobility of the image sensor module 660 may be reduced. Accordingly, in this embodiment, the thickness of the second lead pattern portion 652 is 35 μm ± 5 μm to ensure stable movement of the image sensor module 660.

[0288] The length of the connecting pattern portion 652-3 is greater than the width of the open area between the first insulating portion 651-1 and the second insulating portion 651-2. Here, the width of the open area can be the straight-line distance connecting the first insulating portion 651-1 and the second insulating portion 651-2.

[0289] The length of the connecting pattern portion 652-3 is at least 1.5 times the linear distance. Additionally, the length of the connecting pattern portion 652-3 is set to 20 times or less the linear distance.

[0290] At this time, if the length of the connecting pattern portion 652-3 is less than 1.5 times the linear distance, the shifting operation of the image sensor module 660 may be affected by the reduction in the elastic force of the connecting pattern portion 652-3. Furthermore, if the length of the connecting pattern portion 652-3 is greater than 20 times the linear distance, the resistance may increase with the increase in the signal transmission distance of the connecting pattern portion 652-3. Additionally, if the resistance increases, noise may be included in the signal transmitted through the connecting pattern portion 652-3. Accordingly, the length of the connecting pattern portion 652-3 is set to be less than or equal to 10 times the linear distance between the second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2.

[0291] Meanwhile, the second lead pattern portion 652 described above is a wire for transmitting electrical signals and can be formed of a highly conductive metallic material. For this purpose, the second lead pattern portion 652 can be formed of at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Alternatively, the second lead pattern portion 652 can be formed of a paste or solder paste including at least one metallic material selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn).

[0292] Preferably, the second lead pattern portion 652 can be formed of a metal material with elasticity, so that the image sensor module 660 can be moved while being used for wiring. For this purpose, the second lead pattern portion 652 can be formed of a metal material with a tensile strength of 1000 MPa or higher. For example, the second lead pattern portion 652 can be a binary alloy or a ternary alloy including copper. For example, the second lead pattern portion 652 can be a copper (Cu)-nickel (Ni) binary alloy. For example, the second lead pattern portion 652 can be a copper (Cu)-tin (Sn) binary alloy. For example, the second lead pattern portion 652 can be a copper (Cu)-beryllium (Be) binary alloy. For example, the second lead pattern portion 652 can be a copper (Cu)-cobalt (Co) binary alloy. For example, the second lead pattern portion 652 can be a copper (Cu)-nickel (Ni)-tin (Sn) ternary alloy. For example, the second lead pattern portion 652 can be a ternary alloy of copper (Cu), beryllium (Be), and cobalt (Co). Besides metallic materials, the second lead pattern portion 652 can be formed from alloys such as iron (Fe), nickel (Ni), and zinc, which possess good electrical properties and elastic force suitable for use as a spring. Furthermore, the second lead pattern portion 652 can be surface-treated using a plating of metallic materials including, for example, gold (Au), silver (Ag), or palladium (Pd). This improves electrical conductivity.

[0293] Meanwhile, the line width of the second-first lead pattern portion 652-1 can be the same as the line width of the second-second lead pattern portion 652-2.

[0294] Furthermore, the line width of the connecting pattern portion 652-3 may be smaller than the line width of the second-first lead pattern portion 652-1 and the second-second lead pattern portion 652-2.

[0295] At this time, there are buffer portions between the second-first lead pattern portion 652-1 and the connecting pattern portion 652-3, and between the second-second lead pattern portion 652-2 and the connecting pattern portion 652-3, which have rounded side surfaces as the width gradually decreases.

[0296] In other words, the side surfaces at both ends of the connecting pattern portion 652-3 may have curvature. In this case, when the side surfaces at both ends of the connecting pattern portion 652-3 have a linear shape, stress may concentrate on that portion. Furthermore, when stress concentrates, a cracking phenomenon may occur, causing the connecting pattern portion 652-3 to separate from the second-first lead pattern portion 652-1 or the second-second lead pattern portion 652-2.

[0297] Accordingly, the side surfaces at the ends of the connecting pattern portion 652-3 have a rounded shape. This prevents stress concentration at the ends.

[0298] In this case, the curvature R value of the side surface at the end of the connecting pattern portion 652-3 can be between 30 and 100. When the curvature R value of the side surface is less than 30, the effect of preventing stress concentration may not be significant. When the curvature R value of the side surface is greater than 100, the elastic force of the connecting pattern portion 652-3 may decrease.

[0299] Here, the linewidth of the connecting pattern portion 652-3 can be from 20 μm to 1000 μm. When the linewidth of the connecting pattern portion 652-3 is less than 20 μm, the overall rigidity of the connecting pattern portion 652-3 may decrease. Furthermore, when the linewidth of the connecting pattern portion 652-3 is greater than 1000 μm, the elastic force of the connecting pattern portion 652-3 may decrease, and the mobility of the image sensor module 660 may decrease.

[0300] at the same time, Figure 15 In the first embodiment, the second-first lead pattern portion 652-1 may be provided only on the first insulating portion 651-1 of the insulating portion 651. Alternatively, Figure 16In the second embodiment, the second-first lead pattern portion 652-1a includes a first portion disposed on the first insulating portion 651-1 and a second portion extending from the first portion and protruding inwardly from the first insulating portion 651-1. For example, the second portion may overlap with the central opening of the first insulating portion 651-1 in the vertical direction or the optical axis direction. The second portion of the second-first lead pattern portion 652-1 is configured to protrude inwardly from the first insulating portion 651-1. Accordingly, according to the embodiment, ease of soldering process performed for connection with the terminal portion 641-1 of the image sensor module 660 can be provided.

[0301] Additionally, the second-second lead pattern portion 652-2 includes a first portion 652-21 disposed on the second insulating portion 651-2 of the insulating portion 651. Furthermore, the second-second lead pattern portion 652-2 may include a second portion 652-22 and a third portion 652-23, which extend from the first portion 652-21 and protrude outwards from the first insulating portion 651-2. The second portion 652-22 and the third portion 652-23 can protrude outwards from the second insulating portion 651-2. Accordingly, this embodiment can provide simplicity in the soldering process performed for connection with the wire portion 700.

[0302] Specifically, the second-second lead pattern portion 652-2 includes a first portion 652-21 disposed on the insulating portion 651, a third portion 652-23 connected to the wire portion 700, and a second portion 652-22 connecting the first portion 652-21 and the third portion 652-23. Additionally, one end of the first portion 652-21 of the second-second lead pattern portion 652-2 can be connected to the connecting pattern portion 652-3.

[0303] Here, the first portion 652-21 can be referred to as the body portion of the second-second lead pattern portion 652-2. That is, the first portion 652-21 can be the body portion of the second-second lead pattern portion 652-2 that is disposed on the insulating portion and supports the other portions of the second-second lead pattern portion 652-2. Additionally, the third portion 652-23 can be referred to as the connecting portion connected to the wire portion 700. Furthermore, the second portion 652-22 can be the connecting portion that connects the first portion 652-21 and the third portion 652-23.

[0304] A hole through which the wire portion 700 passes can be formed in the third part 652-23. The third part 652-23 can be soldered to the wire portion 700. The second part 652-22 may include a bent portion. The second part 652-22 can be bent multiple times in one direction. The second part 652-22 can be elastic. Therefore, the second-second lead pattern portion 652-2 can be elastic.

[0305] In this scenario, when the second portion 652-22 does not include the bending portion, the wire portion 700 may move along with the image sensor module 660, potentially causing bending. Furthermore, depending on the degree of warping, breakage may occur. Alternatively, in this embodiment, the second portion 652-22 includes the bending portion. Accordingly, the second portion 652-22 can function as a support rod when the image sensor module 660 moves. Accordingly, the rigidity of the wire portion 700 in this embodiment can be increased by providing elasticity to it.

[0306] The third part 652-23 may be a bonding pad electrically connected to the wire portion 700. That is, the third part 652-23 may be a solder pad soldered to the wire portion 700. For this purpose, the third part 652-23 may include a hole through which the wire portion 700 passes.

[0307] The second portion 652-22 can connect the first portion 652-21 and the third portion 652-23. For this purpose, the second portion 652-22 may include multiple bent portions. For example, the second portion 652-22 may include a bent portion that rotates in a clockwise direction. That is, the second portion 652-22 can be bent in a direction corresponding to the rotation direction of the image sensor module. Accordingly, when the image sensor module rotates about the z-axis, the second portion 652-22 can minimize damage applied to the second-second lead pattern portion 652-2. This prevents cracks from appearing in the second-second lead pattern portion 652-2 in the embodiment. Furthermore, the embodiment can prevent the second-second lead pattern portion 652-2 from separating from the insulating portion 651. Simultaneously, the embodiment may include an adhesive member (not shown) disposed between the insulating portion 651 and the second-second lead pattern portion 652-2. An adhesive member can be inserted between the insulating portion 651 and the second-second lead pattern portion 652-2 to prevent the second-second lead pattern portion 652-2 from separating from the insulating portion 651. The adhesive member may include an adhesive for curing. Additionally, the adhesive member may be electroplated to increase adhesion to the second-second lead pattern portion 652-2, and thus, to impart surface roughness.

[0308] Meanwhile, the second-second lead pattern portion 652-2 can have different linewidths for each portion. The first portion 652-21 can have a wider width compared to the other portions to improve adhesion with the insulating portion 651. Furthermore, the second portion 652-22 can have a narrower linewidth compared to the first portion 652-21 to provide elasticity. In this case, the second portion 652-22 can have a linewidth of 20 μm to 1000 μm. When the linewidth of the second portion 652-22 is less than 20 μm, the overall rigidity of the second-second lead pattern portion 652-2 may decrease, and correspondingly, the reliability of the second-second lead pattern portion 652-2 may decrease. Furthermore, when the linewidth of the second portion 652-22 is greater than 1000 μm, the elasticity of the second-second lead pattern portion 652-2 decreases, and correspondingly, problems may occur regarding the displacement of the image sensor module 660.

[0309] Simultaneously, a buffer pattern portion can be formed on the second portion 652-22 to serve as a buffer in region A connected to the first portion 652-21. The buffer pattern portion can have a shape in which the width gradually decreases in the direction from the first portion 652-21 to the second portion 652-22. In this case, the decrease in width can have a non-linear characteristic rather than a linear characteristic. Accordingly, the outer surface of the buffer pattern portion can have a rounded shape.

[0310] Meanwhile, the buffer pattern portion can solve problems such as pattern damage caused by the difference in pattern width between the first portion 652-21 and the second portion 652-22. In other words, the buffer pattern portion can stably connect the first portion 652-21 and the third portion 652-23.

[0311] Furthermore, the buffer pattern portion may not overlap with the insulating layer in the vertical direction. When the substrate is tilted, the connection points between the connecting portion and the pattern portion do not exist on the insulating layer, but may exist outside the insulating layer. Accordingly, the embodiment can effectively reduce pattern breakage caused by the width difference between the connecting portion and the pattern portion.

[0312] Meanwhile, the second portion 652-22 can be bent at least once as described above. Therefore, the second portion 652-22 includes a second-first portion 652-22a extending in one direction, and a second portion 652-22b extending in a direction different from the one direction.

[0313] In this case, the side surface of the second-second portion 652-22b can have a rounded shape instead of a straight line. That is, when the side surface of the second-second portion 652-22b has a linear shape, stress may concentrate in that portion, and therefore the second-second lead pattern portion 652-2 may break. Therefore, the side surface of the second-second portion 652-22b has a rounded shape to prevent stress concentration in the second-second portion 652-22b. In this case, the curvature R of the side surface of the second-second portion 652-22b is set between 30 and 100. When the curvature R of the side surface is less than 30, the effect of preventing stress concentration may not be significant. When the curvature R of the side surface is greater than 100, the elastic force of the second-second lead pattern portion 652-2 may decrease. In this case, the second-second portion 652-22b may include an inner surface and an outer surface depending on the bending direction. Furthermore, the curvature R of the inner surface of the second portion 652-22b can be different from the curvature R of the outer surface of the second portion 652-22b. Therefore, this embodiment allows for maximization of the stress relaxation effect.

[0314] Furthermore, the second portion 652-22b may have a different line width than the second portion 652-22a. For example, the line width of the second portion 652-22b may be greater than the line width of the second portion 652-22a. Therefore, this embodiment can prevent stress concentration in the second portion 652-22b.

[0315] Meanwhile, although it has been described that the second portion 652-22 of the second-second lead pattern portion 652-2 has a rectangular shape with rounded corners, the implementation is not limited to this. For example, the second portion 652-22 of the second-second lead pattern portion 652-2 may have a circular shape or a polygonal shape, and may be bent.

[0316] Using the above structure, the image sensor module 660 can be positioned at a predetermined distance from the first substrate 510 and elastically supported by the wire portion 700. Furthermore, the image sensor module 660 can be elastically supported by elastic members provided on the upper and lower sides. In this case, the second elastic member 650 provided below the image sensor module 660 may include a second-first lead pattern portion 652-1 connected to the image sensor module 660, a second-second lead pattern portion connected to the wire portion, and a connecting pattern portion 652-3 connecting the second-first lead pattern portion 652-1 and the second-second lead pattern portion. Additionally, at least two of the second lead patterns constituting the second lead pattern portion 652 are electrically connected to the second coil portion 635. Accordingly, a forward current or a reverse current can be provided to the second coil portion 635.

[0317] Meanwhile, the image sensor module 660 may include a sensor substrate 661, an image sensor 662, a sensor base 663, and a filter 664.

[0318] Therefore, the image sensor module 660 includes a sensor base 663.

[0319] Sensor base 663 may include an opening 663-1. Additionally, sensor base 663 may include a step 663-2 adjacent to the opening 663-1, on which filter 664 may be mounted. An adhesive member (not shown) may be disposed on step 663-2. Filter 664 may be fixedly disposed on the adhesive member. Filter 664 may be used to block light of a specific frequency band passing through lens module 100 from incident on image sensor 662. Filter 664 may be disposed parallel to the xy plane. Filter 664 may be disposed between lens module 100 and image sensor 662. Filter 664 may include an infrared filter. The infrared filter may absorb or reflect infrared light incident on it.

[0320] Sensor substrate 661 can be a package substrate. That is, image sensor 662 can be mounted on sensor substrate 661 in a packaged form. Sensor substrate 661 can include a printed circuit board (PCB). Sensor substrate 661 can include a circuit board. Image sensor 662 can be disposed on sensor substrate 661. Sensor substrate 661 can be coupled to second elastic member 650. For this purpose, terminal portion 641-1 electrically connected to the second-first lead pattern portion 652-1 of the second elastic member 650 can be disposed on the lower surface of sensor substrate 661.

[0321] Meanwhile, the sensor substrate 661 can be disposed in the opening of the third holder 620. Accordingly, the terminal portion 641-1 can be electrically connected by welding or the like while it is aligned with the second-first lead pattern portion 652-1 of the second elastic member 650.

[0322] Image sensor 662 may have a configuration in which light passing through lens module 100 and filter 664 is incident to form an image. Image sensor 662 may be mounted on sensor substrate 661. Image sensor 662 may be electrically connected to sensor substrate 661. For example, image sensor 662 may be connected to sensor substrate 661 via surface mount technology (SMT). As another example, image sensor 662 may be connected to sensor substrate 661 via flip chip technology. The optical axis of image sensor 662 may be arranged to coincide with the optical axis of lens module 100. That is, the optical axis of image sensor 662 and the optical axis of lens module 100 may be aligned. Image sensor 662 may convert light incident on the effective image area of ​​image sensor 662 into an electrical signal. Alternatively, the converted electrical signal may be an image signal. Image sensor 662 may be any of charge-coupled device (CCD), metal-oxide-semiconductor (MOS), CPD, and CID.

[0323] <Image Sensor Module Shift Drive Operation>

[0324] The shifting operation of the image sensor module 660 will be described below.

[0325] Figure 22 This is a view used to illustrate how x-axis displacement drive is achieved through some configurations of a sensor driving device according to an embodiment. Figure 23 This is a view used to illustrate how y-axis displacement drive is achieved through some configurations of the sensor driving device according to embodiments, and Figure 24 This is a view used to illustrate the implementation of z-axis rotation drive through some configurations of a camera device according to an embodiment.

[0326] First, refer to Figures 22 to 24 The OIS operation of the actuator 400, which is a sensor driving device according to the embodiment, is described.

[0327] like Figure 22 As shown, currents in the same direction can be applied to the first-first coil 521 and the first-third coil 523. Accordingly, the image sensor 662, connected to the image sensor module 660, can be moved (displaced) along the x-axis direction by the electromagnetic interaction between the first magnet 631 and the third magnet 633. That is, the first-first coil 521 and the first magnet 631, as well as the first-third coil 523 and the third magnet 633, can be used to displace the image sensor 662 along the x-axis direction. At this time, the first-first coil 521 and the first magnet 631 can be the first x-axis displacement driving part X1, and the first-third coil 523 and the third magnet 633 can be the second x-axis displacement driving part X2.

[0328] like Figure 23As shown, currents in the same direction can be applied to the first-second coil 522 and the first-fourth coil 524. Thus, the image sensor 662, connected to the image sensor module 660, can move (displace) along the y-axis direction through electromagnetic interaction with the second magnet 632 and the fourth magnet 634. In other words, the first-second coil 522, the second magnet 632, the first-fourth coil 524, and the fourth magnet 634 can be used to displace the image sensor 662 along the y-axis. At this time, the first-second coil 522 and the second magnet 632 can be the first y-axis displacement driving part Y1, and the first-fourth coil 524 and the fourth magnet 634 can be the second y-axis displacement driving part Y2.

[0329] like Figure 24 As shown, currents in opposite directions can be applied to the first-first coil 521 and the first-third coil 523. Additionally, currents in opposite directions can be applied to the first-second coil 522 and the fourth coil 524. In this case, if the rotation direction of the magnet portion 630a is the same due to the currents applied to the first-first coil 521 and the second coil 522, then the image sensor 662 connected to the image sensor module 660 can rotate (roll, roll) about the z-axis. Figure 24 The illustrated embodiment shows the first coil section 520 being controlled by four control channels. Furthermore, when the first coil section 520 is controlled by three control channels, the image sensor 662 can rotate via the first-first coil 521 and the first-third coil 523 or the first-second coil 522 and the first-fourth coil.

[0330] On the other hand, the AF operation of the actuator 400 can be performed by using the electromagnetic interaction between the magnet portion 630a and the second coil portion 635 to move the image sensor 662 connected to the image sensor module 660 along the z-axis direction. For example, when a positive current is supplied to the second coil portion 635, the image sensor 662 connected to the image sensor module 660 can move closer to the first substrate 510 along the +z (or upper) direction. For example, when a reverse current is supplied to the second coil portion 635, the image sensor 662 connected to the image sensor module 660 can move away from the first substrate 510 along the -z (or lower) direction.

[0331] <Optical Devices>

[0332] In the following description, the optical device according to this embodiment will be described with reference to the accompanying drawings.

[0333] Figure 25 This is a perspective view of the optical device according to the embodiment, and Figure 26 yes Figure 25 A block diagram of the optical device shown.

[0334] Optical devices can be any of the following: handheld phones, mobile phones, smartphones, portable smart devices, digital cameras, laptops, digital broadcasting terminals, PDAs (personal digital assistants), PMPs (portable multimedia players), and navigation devices. However, the types of optical devices are not limited to these, and any device used to capture images or photographs can be included in an optical device.

[0335] The optical device may include a body 1250. The body 1250 may have a strip shape. Alternatively, the body 1250 may have various structures, such as a sliding structure, a folding structure, a swinging structure, or a rotating structure, wherein two or more sub-bodies are coupled to be movable relative to each other. The body 1250 may include a shell (outer shell, housing, or cover) forming the exterior. For example, the body 1250 may include a front shell 1251 and a rear shell 1252. Various electronic components of the optical device may be embedded in the space formed between the front shell 1251 and the rear shell 1252. A display 1151 may be disposed on one surface of the body 1250. A camera 1121 may be disposed on one or more surfaces of the body 1250 and another surface disposed opposite to that surface.

[0336] The optical device may include a wireless communication unit 1110. The wireless communication unit 1110 may include one or more modules that enable wireless communication between the optical device and a wireless communication system, or between the optical device and the network in which the optical device resides. For example, the wireless communication unit 1110 may include any one or more of the following: a broadcast receiving module 1111, a mobile communication module 1112, a wireless internet module 1113, a short-range communication module 1114, and a location information module 1115.

[0337] The optical device may include an A / V input unit 1120. The A / V (audio / video) input unit 1120 is used to input audio or video signals and may include any or more of a camera 1121 and a microphone 1122. In this case, the camera 1121 may include the camera device according to this embodiment.

[0338] The optical device may include a sensing unit 1140. The sensing unit 1140 can detect the current state of the optical device, such as its on / off state, position, presence of user contact, orientation, and acceleration / deceleration, and generate sensing signals for controlling the operation of the optical device. For example, when the optical device is in the form of a slider phone, it can sense whether the slider phone is on or off. Additionally, the sensing unit 1140 can handle sensing functions related to whether the power supply unit 1190 is powered and whether the interface unit 1170 is connected to an external device.

[0339] The optical device may include an input / output unit 1150. The input / output unit 1150 may be configured to generate inputs or outputs related to vision, hearing, or touch. The input / output unit 1150 may generate input data for controlling the operation of the optical device and may output information processed by the optical device.

[0340] Input / output unit 1150 may include any or more of keyboard unit 1130, display 1151, audio output module 1152, and touchscreen panel 1153. Keyboard unit 1130 may generate input data in response to keyboard input. Display 1151 may output images captured by camera 1121. Display 1151 may include multiple pixels, the colors of which change according to electrical signals. For example, display 1151 may include at least one of the following: liquid crystal display, thin-film transistor liquid crystal display, organic light-emitting diode, flexible display, or three-dimensional display (3D display). Audio output module 1152 may output audio data received from wireless communication unit 1110 in call signal receiving mode, call mode, recording mode, voice recognition mode, or broadcast receiving mode, or may output audio data stored in memory unit 1160. Touchscreen panel 1153 may convert capacitance changes caused by a user touching a specific area of ​​the touchscreen into electrical input signals.

[0341] The optical device may include a memory unit 1160. Programs for processing and controlling the controller 1180 may be stored in the memory unit 1160. Furthermore, the memory unit 1160 may store input / output data, such as any or more of a phone book, messages, audio, still images, photographs, and moving images. The memory unit 1160 may store images, such as pictures or videos, captured by the camera 1121.

[0342] The optical device may include an interface unit 1170. The interface unit 1170 serves as a channel for connecting to an external device connected to the optical device. The interface unit 1170 may receive data from the external device, receive power and transmit it to each component within the optical device, or transmit data from within the optical device to an external device. The interface unit 1170 may include any one or more of the following: a wired / wireless headphone port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting a device with an identification module, and audio I / O ports (input / output), video input / output (I / O) ports, and an earpiece port.

[0343] The optical device may include a controller 1180. The controller 1180 can control the overall operation of the optical device. The controller 1180 can perform related control and processing for voice calls, data communication, video calls, etc. The controller 1180 may include a multimedia module 1181 for playing multimedia. The multimedia module 1181 may be located within the controller 1180 or may be located separately from the controller 1180. The controller 1180 can execute a pattern recognition program that can recognize handwritten input or drawing input performed on the touchscreen as characters and images, respectively.

[0344] The optical device may include a power supply unit 1190. The power supply unit 1190 may receive external or internal power under the control of the controller 1180 to supply the power required for the operation of each component.

[0345] According to the embodiment, the image sensor moves and rotates relative to the lens barrel along the X-axis, Y-axis, and Z-axis directions to achieve the OIS and AF functions of the camera module, instead of moving the lens barrel as in the prior art. Therefore, the camera module according to the embodiment eliminates the complex spring structure used to achieve the OIS and AF functions, and correspondingly, the structure can be simplified. Furthermore, by moving the image sensor relative to the lens barrel, the embodiment can provide a more stable structure than the prior art.

[0346] Furthermore, the camera module according to the embodiment includes a lead pattern portion electrically connected to the image sensor. The lead pattern portion has a spring structure. Additionally, the lead pattern portion is configured to float in a position where it does not overlap with the insulating layer in the vertical direction. Accordingly, the camera module can stably and elastically support the image sensor. Furthermore, the camera module can stably move the image sensor relative to the lens barrel.

[0347] Furthermore, X-axis displacement, Y-axis displacement, Z-axis displacement, and Z-axis rotation of the image sensor in the camera module according to the embodiment can be performed for shake correction. Additionally, the camera module according to the embodiment can provide shake correction via lens movement and image sensor movement. Accordingly, the embodiment can provide further improved shake correction functionality.

[0348] Furthermore, in this embodiment, the actuator in the camera module for moving the image sensor relative to the lens barrel includes an internal space. Additionally, electrical components required for the camera circuitry, such as a gyroscope sensor and a driver IC, can be integrated into the internal space of the actuator. Accordingly, this embodiment can reduce the overall height of the camera module.

[0349] Furthermore, by integrating and fusing camera circuit components and actuator components, the camera assembly process according to the embodiments can be simplified.

[0350] In addition, the implementation method allows for easy replacement of the lens module.

[0351] In other words, the OIS or AF function in the camera device of the comparative example should be located in the lens module. Accordingly, when replacing the lens module in the comparative example, the actuator must also be replaced. Furthermore, in the comparative example, if a lens module without an actuator for AF or OIS functions is replaced, AF or OIS functions cannot be provided.

[0352] On the other hand, both the AF and OIS functions in the implementation can be achieved through the movement of the image sensor. Accordingly, when replacing the lens module in the implementation, the lens module can be easily replaced with one that does not have OIS, thereby improving user satisfaction.

[0353] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment, but are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc., illustrated in each embodiment can be combined or modified by those skilled in the art for other embodiments. Accordingly, content related to these combinations and variations should be interpreted as being included within the scope of the embodiments.

[0354] The foregoing has primarily described embodiments, but these are merely examples and do not limit the scope of the embodiments. Those skilled in the art will understand that various modifications and applications not described above are possible without departing from the fundamental characteristics of these embodiments. For example, each component specifically shown in the embodiments can be implemented through modification. Furthermore, differences associated with these modifications and applications should be interpreted as including within the scope of the embodiments set forth in the appended claims.

Claims

1. A sensor driving device, comprising: The fixing portion includes a first substrate having a first lead pattern portion and a first coil portion disposed on the first substrate; A movable portion, which is spaced apart from the fixed portion; as well as The wire portion is disposed between the fixed portion and the movable portion. The movable part includes a magnet holder, a coil holder, an image sensor module, a first elastic member, and a second elastic member. The magnet portion is disposed within the magnet holder. The coil holder is disposed inside the magnet holder and includes a second coil portion. The image sensor module is disposed inside the coil holder and connected to it. The first elastic member is disposed on the magnet holder and the coil holder and elastically supports them. The second elastic member is disposed below the magnet holder and the coil holder and elastically supports them. The magnet holder, the coil holder, and the image sensor module move relative to the fixed portion in a first direction perpendicular to the optical axis, move in a second direction perpendicular to both the optical axis and the first direction, and rotate about the optical axis, through the electromagnetic interaction between the first coil portion and the magnet portion. The coil holder and the image sensor module move relative to the magnet holder along the optical axis via electromagnetic interaction between the second coil portion and the magnet portion. When the coil holder and the image sensor module move along the optical axis, the magnet holder remains stationary relative to the fixed part.

2. The sensor driving device according to claim 1, wherein, The second elastic member includes: An insulating portion, comprising a first insulating portion and a second insulating portion, wherein the second insulating portion is disposed outside the first insulating portion and spaced apart from the first insulating portion; and The second lead pattern portion is disposed on the insulating portion. The second lead pattern includes: The second-first lead pattern portion is disposed on the first insulating portion; The second-second lead pattern portion is disposed on the second insulating portion; and The connecting pattern portion is disposed in the partition space between the first insulating portion and the second insulating portion. Wherein, one end of the wire portion is connected to the first lead pattern portion of the fixed portion, and the other end of the wire portion is connected to the second lead pattern portion to elastically support the moving portion; One end of the connecting pattern portion is connected to the second-first lead pattern portion, and the other end of the connecting pattern portion is connected to the second-second lead pattern portion, so as to elastically support the image sensor module disposed on the first insulating portion. The first substrate is electrically connected to the image sensor module through the wire portion and the second lead pattern portion.

3. The sensor driving device according to claim 1, wherein, The magnet holder includes a fourth recess, and the coil holder includes a first protrusion corresponding to the fourth recess. When the coil holder moves to its maximum height in the upward direction, the first protrusion directly contacts the first substrate, and When the coil holder moves to its maximum height in the downward direction, the first protrusion comes into direct contact with the bottom surface of the fourth recess.

4. The sensor driving device according to claim 2, wherein, The first coil portion is disposed on the lower surface of the first substrate, facing the upper surface of the magnet portion, and The second coil portion is disposed on the outer surface of the coil holder, facing the inner surface of the magnet portion.

5. The sensor driving device according to claim 2, wherein, The wire portion includes multiple wires. At least one of the plurality of wires is electrically connected to the second coil portion.

6. The sensor driving device according to claim 2, wherein, The image sensor module includes: A sensor substrate is disposed in the opening of the coil holder, an image sensor is mounted on the sensor substrate, and a terminal portion connected to the second-first lead pattern portion is formed on the sensor substrate.

7. The sensor driving device according to claim 2, wherein, The second lead pattern portion includes multiple flexible connecting lines. Wherein, at least one second-first lead pattern portion of the plurality of elastic connecting wires is disposed on the first side region of the first insulating portion, and The second-second lead pattern portion, which is connected to the second-first lead pattern portion disposed on the first side region, is disposed on the second side region of the second insulating portion that does not correspond to the first side region.

8. The sensor driving device according to claim 7, wherein, The connecting pattern portion is bent at least twice.

9. The sensor driving device according to claim 2, wherein, The second-second lead pattern portion includes: Main body part; A connecting portion, said connecting portion being connected to said other end of said wire portion; and A connecting portion that connects the body portion and the connecting portion.

10. The sensor driving device according to claim 9, wherein, The connecting portion has a hole through which the wire portion passes.

11. The sensor driving device according to claim 2, wherein, The second-second lead pattern portion overlaps with the wire portion in the optical axis direction, but does not overlap with the first insulating portion and the second insulating portion in the optical axis direction.

12. The sensor driving device according to claim 11, wherein, The second-first lead pattern portion includes: an overlapping portion that overlaps with the first insulating portion in the optical axis direction; and a non-overlapping portion that extends from the overlapping portion and does not overlap with the first insulating portion in the optical axis direction.

13. The sensor driving device according to claim 2, wherein, The first lead pattern portion includes multiple first lead patterns. The second lead pattern portion includes multiple second lead patterns. The wire portion includes multiple wires, and The number of the plurality of wires is equal to or less than the number of each of the plurality of first lead patterns and the plurality of second lead patterns.

Images