Substrate processing apparatus and substrate processing method

Abstract

The present invention provides a substrate processing apparatus and a substrate processing method that can effectively reduce the amount of phosphoric acid solution used in phosphoric acid processing. The substrate processing apparatus (100) includes a first holding tank (110) that holds phosphoric acid solution, a second holding tank (120) that holds rinse solution, a substrate holding section (130) that holds a substrate and lowers to immerse the substrate (W) in the rinse solution of the second holding tank (120), and a rinse solution diversion section (140) that supplies the rinse solution of the second holding tank (120) during a specific period of the immersion period of the substrate (W) in the rinse solution in the second holding tank (120) to the first holding tank (110) and stops supplying the rinse solution of the second holding tank (120) to the first holding tank (110) after the period following the specific period of the immersion period of the substrate (W) in the rinse solution.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] A substrate processing apparatus is known for processing substrates. This apparatus is suitable for processing semiconductor substrates. Typically, the substrate processing apparatus uses a processing solution to process the substrate.

[0003] The study investigated a batch processing apparatus for processing multiple substrates simultaneously, using a predetermined aqueous phosphoric acid solution, silicone, and DIW supplied to the processing tank to process the substrates (Patent Document 1). In the substrate processing apparatus of Patent Document 1, in order to prevent clogging of the drain pipe, the liquid received by the receiving section is discharged through the receiving section drain pipe to an external drain pipe provided on the outside.

[0004] Patent document 1: Japanese Patent Application Publication No. 2021-64746.

[0005] In the substrate processing apparatus of Patent Document 1, a predetermined aqueous solution of phosphoric acid, silicon, and DIW are supplied to the processing tank. On the other hand, Patent Document 1 does not explore reducing the amount of the predetermined liquid supplied to the processing tank. Summary of the Invention

[0006] The present invention was made in view of the above-mentioned problems, and its object is to provide a substrate processing apparatus and a substrate processing method that can effectively reduce the amount of phosphoric acid solution used in phosphoric acid processing.

[0007] According to one aspect of the present invention, a substrate processing apparatus includes: a first storage tank for storing phosphoric acid solution; a second storage tank for storing rinsing solution; a substrate holding unit for holding and lowering a substrate to immerse the substrate in the rinsing solution of the second storage tank; and a rinsing solution transfer unit for supplying the rinsing solution of the second storage tank to the first storage tank during a specific period of rinsing during which the substrate is immersed in the rinsing solution in the second storage tank, and stopping the supply of the rinsing solution of the second storage tank to the first storage tank for a period after the specific period of rinsing during the ...

[0008] In one embodiment, the substrate processing apparatus further includes a circulation piping that circulates the phosphoric acid solution in the first storage tank by flowing out of and returning to the first storage tank, and the rinsing solution transfer unit supplies the rinsing solution of the second storage tank to the first storage tank via the circulation piping.

[0009] In one embodiment, the substrate processing apparatus further includes: a phosphoric acid supply unit for supplying phosphoric acid to the first storage tank; a diluent supply unit for supplying diluent to the first storage tank; and a rinsing solution supply unit for supplying rinsing solution to the second storage tank.

[0010] In one embodiment, the substrate processing apparatus further includes a heater for heating the phosphoric acid solution flowing through the circulation pipe, wherein the rinsing solution supply unit heats the rinsing solution and supplies it to the second storage tank before the specified period, and supplies the rinsing solution to the second storage tank without heating it after the specified period.

[0011] In one embodiment, the flushing fluid transfer unit includes a storage tank that stores at least a portion of the flushing fluid from the second storage tank during the specific period.

[0012] In one embodiment, the substrate processing apparatus further includes a temperature-controlled tank disposed in the circulation piping, and the storage tank is disposed adjacent to the temperature-controlled tank.

[0013] According to another aspect of the present invention, a substrate processing method includes: a step of immersing a substrate in a phosphoric acid solution stored in a first storage tank; a step of immersing the substrate in a rinsing solution stored in a second storage tank; a step of reusing the rinsing solution in the second storage tank during a specific period of immersion in the rinsing solution of the first storage tank; and a step of stopping the reusing of the rinsing solution in the second storage tank after the specific period of immersion in the rinsing solution of the first storage tank is stopped.

[0014] In one embodiment, the substrate processing method further includes a step of circulating the phosphoric acid solution via a circulation pipe that causes the phosphoric acid solution in the first storage tank to flow out of the first storage tank and return to the first storage tank, and the transfer step supplies the rinsing solution of the second storage tank to the first storage tank via the circulation pipe.

[0015] In one embodiment, the substrate processing method further includes a step of supplying phosphoric acid to the first storage tank; a step of supplying a diluent to the first storage tank; and a step of supplying a rinsing solution to the second storage tank.

[0016] In one embodiment, the substrate processing method further includes a step of heating the phosphoric acid solution flowing through the circulation pipe, wherein in the step of supplying the rinsing solution, the rinsing solution is heated and supplied to the second storage tank before the specific period, and the rinsing solution is supplied to the second storage tank without heating after the specific period.

[0017] In one embodiment, the transfer process includes the process of storing the flushing fluid from the second retention tank during the specific period in a retention vessel.

[0018] In one embodiment, the substrate processing method further includes the step of storing phosphoric acid solution flowing through the circulation piping in a temperature-controlled tank, the storage tank being disposed adjacent to the temperature-controlled tank.

[0019] According to the present invention, the amount of phosphoric acid and diluent used in phosphoric acid treatment can be effectively reduced. Attached Figure Description

[0020] Figure 1 This is a schematic perspective view of the substrate processing apparatus of this embodiment.

[0021] Figure 2 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0022] Figure 3 This is a schematic block diagram of the substrate processing apparatus of this embodiment.

[0023] Figures 4A-4E This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0024] Figure 5 This is a flowchart of the substrate processing method of this embodiment.

[0025] Figure 6 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0026] Figure 7 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0027] Figure 8 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0028] Figure 9 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0029] Figure 10 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0030] Figure 11 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0031] Figure 12 This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0032] Figures 13A to 13D This is a schematic diagram of the substrate processing apparatus of this embodiment.

[0033] Figures 14A-14CThis is a schematic diagram of the substrate processing apparatus of this embodiment.

[0034] Figure 15 This is a schematic diagram of a substrate processing system equipped with the substrate processing apparatus of this embodiment.

[0035] Explanation of reference numerals in the attached figures

[0036] 100 Substrate Processing Apparatus

[0037] 110 First Reservoir

[0038] 112 Phosphoric Acid Supply Department

[0039] 114 Diluent Supply Department

[0040] 120 Second Reservoir

[0041] 122 Rinse Fluid Supply Department

[0042] 130 Substrate Holding Section

[0043] 140 Rinse Fluid Transfer Section

[0044] W substrate Detailed Implementation

[0045] Hereinafter, embodiments of the substrate processing apparatus and substrate processing method of the present invention will be described with reference to the accompanying drawings. It should be noted that the same or equivalent parts are labeled with the same reference numerals in the drawings and will not be described repeatedly. It should also be noted that, in this specification, for ease of understanding of the invention, mutually orthogonal X-axis, Y-axis, and Z-axis are described. Typically, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0046] Reference Figure 1 An embodiment of the substrate processing apparatus 100 of the present invention will be described. Figure 1 This is a schematic perspective view of the substrate processing apparatus 100 of this embodiment.

[0047] The substrate processing apparatus 100 processes the substrate W. The substrate processing apparatus 100 processes the substrate W by means of at least one of etching, surface treatment, oxidation treatment, property imparting, processing film formation, removal of at least a portion of the film, and cleaning.

[0048] The substrate W is a thin plate. Typically, the substrate W is a thin, roughly circular plate. Substrate W includes, for example, semiconductor wafers, substrates for liquid crystal displays, substrates for plasma displays, substrates for field emission displays (FEDs), substrates for optical discs, substrates for magnetic disks, substrates for optical disc drives, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0049] The substrate processing apparatus 100 is a batch-type substrate processing apparatus. The substrate processing apparatus 100 processes multiple substrates W simultaneously. Typically, the substrate processing apparatus 100 processes multiple substrates W in batches. For example, a batch may consist of 25 substrates W. It should be noted that a batch may also consist of 50 substrates W.

[0050] like Figure 1 As shown, the substrate processing apparatus 100 includes a first storage tank 110, a second storage tank 120, and a substrate holding section 130. Here, the second storage tank 120 is disposed adjacent to the first storage tank 110. However, the second storage tank 120 may be disposed away from the first storage tank 110.

[0051] The first storage tank 110 stores phosphoric acid solution. The substrate W is subjected to phosphoric acid treatment by immersing it in the phosphoric acid solution in the first storage tank 110.

[0052] The second storage tank 120 stores the rinsing solution. The substrate W is rinsed by immersing it in the rinsing solution in the second storage tank 120.

[0053] The rinsing solution may contain any of the following: deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid water or reduced water (hydrogen water) with a dilution concentration (e.g., around 10 ppm to 100 ppm).

[0054] The substrate holding section 130 holds the substrate W. The substrate holding section 130 moves while holding the substrate W. For example, the substrate holding section 130 descends into the first storage tank 110 while holding the substrate W. As a result, the substrate W is immersed in the phosphoric acid solution in the first storage tank 110.

[0055] Furthermore, the substrate holding section 130 descends into the second storage tank 120 while holding the substrate W. As a result, the substrate W is immersed in the rinsing liquid of the second storage tank 120.

[0056] The substrate holding portion 130 holds the substrate W. The normal direction of the main surface of the substrate W held by the substrate holding portion 130 is parallel to the Y direction. Multiple substrates W are arranged in a row along the Y direction. The multiple substrates W are arranged approximately parallel in the horizontal direction. In addition, the normal of each of the multiple substrates W extends along the Y direction, and each of the multiple substrates W extends approximately parallel to the X and Z directions.

[0057] Typically, the substrate holding section 130 holds multiple substrates W together. Here, the substrate holding section 130 holds substrates W arranged in a row along the Y direction. The substrate holding section 130 moves the substrates W while holding them. For example, while holding the substrates W, the substrate holding section 130 moves vertically upward or downward in the vertical direction.

[0058] Specifically, the substrate holding section 130 includes a lifting mechanism. The substrate holding section 130 moves vertically upwards or downwards while holding multiple substrates W. By moving the substrate holding section 130 vertically downwards, the multiple substrates W held by the substrate holding section 130 are immersed in the phosphoric acid solution stored in the first storage tank 110. Multiple substrates W can be immersed together in the phosphoric acid solution stored in the first storage tank 110 by the substrate holding section 130.

[0059] Furthermore, the substrate holding portion 130 can move in the horizontal direction. For example, the substrate holding portion 130 can move from above the first storage tank 110 to above the second storage tank 120. Alternatively, the substrate holding portion 130 can move from above the second storage tank 120 to above the first storage tank 110.

[0060] Above the second reservoir 120, by moving the substrate holding part 130 vertically downward, a plurality of substrates W held by the substrate holding part 130 are immersed in the rinsing liquid stored in the second reservoir 120. The substrate holding part 130 can immerse a plurality of substrates W together in the rinsing liquid stored in the second reservoir 120.

[0061] It should be noted that the substrate W can be immersed in phosphoric acid solution while being held in the same substrate holding portion 130, and then immersed in rinsing solution. Alternatively, the substrate W can be immersed in phosphoric acid solution while being held in one substrate holding portion 130, and then transferred to another substrate holding portion 130 before being immersed in rinsing solution. In this way, the immersion of the substrate W in phosphoric acid solution and the immersion of the substrate W in rinsing solution can be performed by different substrate holding portions 130.

[0062] The first storage tank 110 stores phosphoric acid solution for processing substrate W. The phosphoric acid solution is generated by mixing phosphoric acid and a diluent. Phosphoric acid and a diluent can be supplied to the first storage tank 110 separately.

[0063] In one example, phosphoric acid and diluent are mixed in a first storage tank 110. Thus, a phosphoric acid solution, consisting of the mixture of phosphoric acid and diluent, is generated in the first storage tank 110.

[0064] The substrate holding portion 130 includes a main plate 132 and a holding rod 134. The main plate 132 is a plate extending in the vertical direction (Z direction). The holding rod 134 extends from one main surface of the main plate 132 in the horizontal direction (Y direction). Figure 1 In the middle, three retaining rods 134 extend horizontally from one main surface of the main body plate 132. Multiple substrates W are arranged at predetermined intervals and are held in an upright (vertical) position by the multiple retaining rods 134 abutting against the lower edge of each substrate W.

[0065] The substrate holding section 130 may further include a moving unit 136. The moving unit 136 positions the main body plate 132 below the plurality of substrates W held by the holding rod 134 within the first storage tank 110, and above the plurality of substrates W held by the holding rod 134 above the first storage tank 110. Figure 1 The position shown is raised and lowered. Therefore, the main plate 132 is moved to the lower position by the moving unit 136, and the multiple substrates W of the holding rod 134 are immersed in the phosphoric acid solution of the first storage tank 110.

[0066] Multiple substrates W are held by multiple holding rods 134. Specifically, by bringing the lower edges of each substrate W into contact with the multiple holding rods 134, the multiple substrates W are held in an upright (vertical) position by the multiple holding rods 134. More specifically, the multiple substrates W held by the substrate holding portion 130 are arranged at intervals along the Y direction. Therefore, the multiple substrates W are arranged in a row along the Y direction. Furthermore, each of the multiple substrates W is held in the substrate holding portion 130 in a position substantially parallel to the XZ plane.

[0067] The moving unit 136 lifts the main body plate 132. The moving unit 136 moves the multiple substrates W vertically upwards or downwards by lifting the main body plate 132, the main body plate 132, and the holding rod 134. The moving unit 136 has a drive source and a lifting mechanism, the drive source driving the lifting mechanism to raise and lower the main body plate 132. The drive source includes, for example, a motor. The lifting mechanism includes, for example, a rack and pinion mechanism or a ball screw.

[0068] More specifically, the moving unit 136 moves the main body plate 132 between the processing position and the retracting position. Figure 1 The substrates rise and fall between the indicated positions. When the main body plate 132, while holding multiple substrates W, descends vertically downwards (in the Z direction) and moves to the processing position, the multiple substrates W are placed into the first storage tank 110. Specifically, the multiple substrates W held in the substrate holding section 130 move into the first storage tank 110. As a result, the multiple substrates W are immersed in the phosphoric acid solution within the first storage tank 110 for phosphoric acid treatment. On the other hand, as shown... Figure 1 As shown, when the main plate 132 moves to the retracted position, the multiple substrates W held by the retaining rod 134 move upwards toward the first storage tank 110 and are pulled up from the phosphoric acid solution.

[0069] It should be noted that the moving unit 136 can also move the main body plate 132 horizontally. In this case, the moving unit 136 positions the main body plate 132 and the retaining rod 134 above the first storage tank 110. Figure 1The substrate holding section 130 moves between the position shown and the position above the second storage tank 120. When the substrate holding section 130 descends vertically downward (in the Z direction) and moves to the processing position while holding multiple substrates W, the multiple substrates W are placed into the second storage tank 120. Specifically, the multiple substrates W held in the substrate holding section 130 move into the second storage tank 120. As a result, the multiple substrates W are immersed in the rinsing liquid in the second storage tank 120 for rinsing. When the main body plate 132 moves to the retracted position, the multiple substrates W held in the holding rod 134 move upward toward the second storage tank 120 and are pulled out of the rinsing liquid.

[0070] Next, refer to Figure 1 and Figure 2 The substrate processing apparatus 100 of this embodiment will be described. Figure 2 This is a schematic diagram of the substrate processing apparatus 100 of this embodiment.

[0071] like Figure 2 As shown, the substrate processing apparatus 100 includes a first storage tank 110, a second storage tank 120, and a substrate holding section 130. The first storage tank 110 stores phosphoric acid solution. The second storage tank 120 stores rinsing solution.

[0072] As described above, the first storage tank 110 stores phosphoric acid solution. The phosphoric acid solution is a mixture of phosphoric acid and diluent. In the phosphoric acid solution, the concentration (mass concentration) of phosphoric acid is 80% or more and 95% or less.

[0073] The substrate holding section 130 moves while holding the substrate W. The substrate W is lowered into the phosphoric acid solution stored in the first storage tank 110 while being held by the substrate holding section 130, thus immersing the substrate W in the phosphoric acid solution of the first storage tank 110. This performs phosphoric acid treatment on the substrate W.

[0074] Furthermore, by lowering the substrate W into the rinsing liquid stored in the second storage tank 120 while it is held in the substrate holding section 130, the substrate W is immersed in the rinsing liquid in the second storage tank 120. Thus, the substrate W is rinsed.

[0075] The substrate processing apparatus 100 includes a phosphoric acid supply unit 112 and a diluent supply unit 114. The phosphoric acid supply unit 112 supplies phosphoric acid to the first storage tank 110.

[0076] The diluent supply unit 114 supplies diluent to the first storage tank 110. The diluent is used to dilute phosphoric acid. The diluent may contain any one of deionized water (DIW), carbonated water, electrolyzed water, ozone water, ammonia water, hydrochloric acid water with a dilution concentration (e.g., approximately 10 ppm to 100 ppm), or reduced water (hydrogen water). It should be noted that the diluent preferably contains at least a portion of the components of the rinsing solution. Alternatively, the diluent may also be composed of the same components as the rinsing solution.

[0077] In one example, phosphoric acid and a diluent are mixed in a first storage tank 110. Thus, a phosphoric acid solution, a mixture of phosphoric acid and a diluent, is generated in the first storage tank 110. It should be noted that the phosphoric acid supply unit 112 can supply the phosphoric acid solution, a mixture of phosphoric acid and a diluent, to the first storage tank 110, and the concentration of the phosphoric acid solution is adjusted using a diluent supplied by the diluent supply unit 114.

[0078] The substrate processing apparatus 100 further includes a rinsing fluid supply unit 122. The rinsing fluid supply unit 122 supplies rinsing fluid to the second storage tank 120.

[0079] The phosphoric acid supply unit 112 includes a pipe 112a and a valve 112b. Phosphoric acid is sprayed from one end of the pipe 112a into a first storage tank 110. The pipe 112a is connected to a phosphoric acid supply source. The valve 112b is disposed on the pipe 112a. The supply of phosphoric acid to the first storage tank 110 can be controlled by the valve 112b. When the valve 112b is open, phosphoric acid is supplied to the first storage tank 110 through the pipe 112a. In the first storage tank 110, the phosphoric acid is mixed with the phosphoric acid solution in the first storage tank 110.

[0080] The diluent supply unit 114 includes a pipe 114a and a valve 114b. Diluent is sprayed from one end of the pipe 114a into the first storage tank 110. The pipe 114a is connected to a diluent supply source. The valve 114b is disposed on the pipe 114a. The supply of diluent to the first storage tank 110 can be controlled by the valve 114b. When the valve 114b is open, the diluent through the pipe 114a is supplied to the first storage tank 110. In the first storage tank 110, the diluent is mixed with the phosphoric acid solution in the first storage tank 110.

[0081] The flushing fluid supply unit 122 includes a pipe 122a and a valve 122b. Flushing fluid is sprayed from one end of the pipe 122a into the second storage tank 120. The pipe 122a is connected to a flushing fluid supply source. The valve 122b is disposed on the pipe 122a. The supply of flushing fluid to the second storage tank 120 can be controlled by the valve 122b. When the valve 122b is opened under the control of the control device 180, the flushing fluid through the pipe 122a is supplied to the second storage tank 120.

[0082] In this embodiment, the substrate processing apparatus 100, in addition to the first storage tank 110, the second storage tank 120, and the substrate holding section 130, further includes a rinsing liquid transfer section 140. The rinsing liquid transfer section 140 transfers the rinsing liquid from the second storage tank 120. More specifically, the rinsing liquid transfer section 140 transfers the rinsing liquid from the second storage tank 120 and supplies it to the first storage tank 110.

[0083] More specifically, the rinsing solution transfer unit 140 supplies the rinsing solution of the second storage tank 120 to the first storage tank 110 during a specific period of rinsing immersion of the substrate W in the rinsing solution in the second storage tank 120. The rinsing solution of the second storage tank 120 contains phosphoric acid components flowing out from the substrate W. For example, the phosphoric acid concentration of the rinsing solution of the second storage tank 120 is 0.5% or more and 5% or less. By transferring the rinsing solution of the second storage tank 120 to the first storage tank 110, the phosphoric acid components flowing out from the substrate W can be utilized in the first storage tank 110. Furthermore, by transferring the rinsing solution of the second storage tank 120 to the first storage tank 110, the phosphoric acid in the first storage tank 110 can be replenished.

[0084] Furthermore, the rinsing solution transfer unit 140 stops supplying rinsing solution to the second storage tank 120 for a period after a specific period during the rinsing solution impregnation period to the first storage tank 110. Over time, the amount of phosphoric acid component in the rinsing solution flowing from the substrate W to the second storage tank 120 decreases. Therefore, by stopping the transfer of rinsing solution from the first storage tank 110 to the second storage tank 120, it is possible to prevent an excessive decrease in the concentration of phosphoric acid solution in the first storage tank 110.

[0085] The flushing fluid transfer unit 140 includes a piping 141, a valve 142, and a pump 143. Flushing fluid from the second reservoir 120 is supplied to the first reservoir 110 via the piping 141. One end of the piping 141 is connected to the second reservoir 120, and the other end faces the first reservoir 110. The pump 143 delivers flushing fluid to the first reservoir 110 via the piping 141. Therefore, the flushing fluid flowing through the piping 141 is sprayed from the other end of the piping 141 into the first reservoir 110.

[0086] A valve 142 and a pump 143 are configured on piping 141. Typically, valve 142 is located downstream of pump 143. The supply of flushing fluid to the first reservoir 110 can be controlled by valve 142. When valve 142 is open, flushing fluid is supplied to the first reservoir 110 through piping 141. In the first reservoir 110, the flushing fluid mixes with the phosphoric acid solution in the first reservoir 110. When valve 142 is closed, flushing fluid is not supplied to the first reservoir 110 through piping 141.

[0087] It should be noted that a filter is preferably installed in piping 141. The filter can remove impurities from the flushing fluid flowing through piping 141. It should also be noted that the filter is preferably located upstream of valve 142 and pump 143.

[0088] Next, refer to Figures 1-3 An embodiment of the substrate processing apparatus 100 of the present invention will be described. Figure 3 This is a schematic block diagram of the substrate processing apparatus 100 of this embodiment.

[0089] like Figure 3 As shown, the control device 180 includes a control unit 182 and a storage unit 184. The control unit 182 controls the operation of each part of the board processing device 100.

[0090] The control unit 182 includes a processor. The processor may have, for example, a central processing unit (CPU). Alternatively, the processor may have a general-purpose arithmetic unit.

[0091] Storage unit 184 stores data and computer programs. Storage unit 184 includes a main storage device and an auxiliary storage device. The main storage device is, for example, a semiconductor memory. The auxiliary storage device is, for example, a semiconductor memory and / or a hard disk drive. Storage unit 184 may include removable media. The processor of control unit 182 executes the computer program stored in storage unit 184 to perform a substrate processing method.

[0092] The control unit 182 controls the phosphoric acid supply unit 112, the diluent supply unit 114, the rinsing solution supply unit 122, the substrate holding unit 130, and the rinsing solution transfer unit 140 according to a predetermined program. Specifically, the control unit 182 controls the operation of the moving unit 136. Additionally, the control unit 182 controls the opening and closing of valves 112b, 114b, 122b, and 142. Furthermore, the control unit 182 controls the drive of the pump 143.

[0093] The control unit 182 moves the main body plate 132 by controlling the moving unit 136. For example, the control unit 182 can move (lift or lower) the main body plate 132 in the vertical direction by controlling the moving unit 136. In addition, the control unit 182 can move the main body plate 132 in the horizontal direction by controlling the moving unit 136.

[0094] The control unit 182 can control valve 112b of the phosphoric acid supply unit 112, switching the state of valve 112b between an open and closed state. Specifically, by controlling valve 112b of the phosphoric acid supply unit 112 to be in the open state, the control unit 182 can allow phosphoric acid flowing through pipe 112a to pass through. Conversely, by controlling valve 112b of the phosphoric acid supply unit 112 to be in the closed state, the control unit 182 can stop the supply of phosphoric acid flowing through pipe 112a. It should be noted that the control unit 182 can also similarly control valve 114b of the diluent supply unit 114 and valve 122b of the rinsing solution supply unit 122.

[0095] Furthermore, the control unit 182 controls the valve 142 of the flushing fluid transfer unit 140, switching the state of the valve 142 between an open state and a closed state. The control unit 182 also controls the pump 143 of the flushing fluid transfer unit 140, switching the state of the pump 143 between a driven state and a stopped state. Specifically, the control unit 182 controls the valve 142 and pump 143 of the flushing fluid transfer unit 140. By keeping the valve 142 open and the pump 143 driven, the flushing fluid from the second storage tank 120 can flow through the piping 141 and be supplied to the first storage tank 110. Conversely, the control unit 182 controls the valve 142 and pump 143 of the flushing fluid transfer unit 140. By keeping the valve 142 closed or the pump 143 stopped, the flow of flushing fluid from the second storage tank 120 through the piping 141 and its supply to the first storage tank 110 can be stopped.

[0096] Next, refer to Figures 1 to 4E The substrate processing apparatus 100 of this embodiment will be described. Figures 4A-4E This is a schematic diagram of the substrate processing apparatus 100 of this embodiment.

[0097] like Figure 4A As shown, the first storage tank 110 and the second storage tank 120 are arranged adjacent to each other. As described above, the first storage tank 110 can store phosphoric acid solution, and the second storage tank 120 can store rinsing solution. However, here, both the first storage tank 110 and the second storage tank 120 are empty.

[0098] like Figure 4B As shown, phosphoric acid solution is supplied to the first storage tank 110. For example, phosphoric acid supply unit 112 supplies phosphoric acid to the first storage tank 110. Additionally, diluent supply unit 114 supplies diluent to the first storage tank 110. In the first storage tank 110, phosphoric acid and diluent are mixed to form a phosphoric acid solution. Thus, the first storage tank 110 stores the phosphoric acid solution. Here, the first storage tank 110 stores the phosphoric acid solution to its full capacity.

[0099] like Figure 4CAs shown, the substrate W is immersed in the phosphoric acid solution in the first storage tank 110. For example, the substrate holding section 130 is lowered while holding the substrate W to immerse the substrate W in the phosphoric acid solution in the first storage tank 110. Thus, the substrate W is subjected to phosphoric acid treatment.

[0100] It should be noted that, in Figure 4B In this process, when the amount of phosphoric acid solution exceeds the capacity of the first storage tank 110, some of the phosphoric acid solution may overflow from the first storage tank 110 due to the impregnation of the substrate W. It should be noted that this overflow can also occur even when... Figure 4C When the substrate W is immersed in the phosphoric acid solution in the first storage tank 110, the amount of phosphoric acid solution supplied to the first storage tank 110 is adjusted in such a way that no part of the phosphoric acid solution overflows from the first storage tank 110.

[0101] Additionally, during the period when the substrate W is immersed in the phosphoric acid solution in the first reservoir 110, rinsing liquid can be supplied to the second reservoir 120. For example, the rinsing liquid supply unit 122 supplies rinsing liquid to the second reservoir 120.

[0102] like Figure 4D As shown, substrate W is immersed in the rinsing solution of the second reservoir 120. For example, substrate holding portion 130 pulls substrate W from the phosphoric acid solution in the first reservoir 110 and moves it horizontally above the second reservoir 120. Thereafter, substrate holding portion 130 lowers while holding substrate W to immerse substrate W in the rinsing solution of the second reservoir 120. This performs a rinsing process on substrate W. Substrate W is immersed in the rinsing solution of the second reservoir 120 for a predetermined period. In this specification, the period during which substrate W is immersed in the rinsing solution of the second reservoir 120 is sometimes referred to as the rinsing solution immersion period.

[0103] It should be noted that, as the substrate holding part 130 pulls the substrate W out of the phosphoric acid solution in the first storage tank 110, the amount of phosphoric acid solution in the first storage tank 110 decreases.

[0104] In this embodiment, during a specific period of the rinsing solution immersion, the rinsing solution from the second storage tank 120 is transferred to the first storage tank 110. For example, the rinsing solution transfer unit 140 supplies the rinsing solution from the second storage tank 120 to the first storage tank 110. The control unit 182, by opening the valve 142 and driving the pump 143, enables the rinsing solution from the second storage tank 120 to flow through the piping 141 and be supplied to the first storage tank 110.

[0105] When the substrate W is immersed in the rinsing solution of the second reservoir 120, the phosphoric acid solution component flows from the substrate W, which has been previously treated with phosphoric acid, into the rinsing solution of the second reservoir 120. Therefore, by transferring the rinsing solution of the second reservoir 120 to the first reservoir 110, the phosphoric acid solution component flowing out from the substrate W can be utilized in the first reservoir 110. Furthermore, by transferring the rinsing solution of the second reservoir 120 to the first reservoir 110, the phosphoric acid solution in the first reservoir 110 can be effectively replenished even if the phosphoric acid solution in the first reservoir 110 decreases.

[0106] like Figure 4E As shown, during a period following a specific period of the rinsing fluid immersion process, the transfer of rinsing fluid from the second storage tank 120 to the first storage tank 110 is stopped. For example, the rinsing fluid transfer unit 140 stops supplying rinsing fluid from the second storage tank 120 to the first storage tank 110. In one example, the control unit 182 stops the flow of rinsing fluid from the second storage tank 120 through the piping 141 and its supply to the first storage tank 110 by closing the valve 142.

[0107] Over time, the amount of phosphoric acid in the rinsing solution flowing from the substrate W into the second storage tank 120 decreases. Therefore, by stopping the transfer of the rinsing solution from the second storage tank 120 to the first storage tank 110, it is possible to prevent the concentration of phosphoric acid in the first storage tank 110 from being excessively reduced by the rinsing solution from the second storage tank 120.

[0108] According to this embodiment, the amount of phosphoric acid solution used in phosphoric acid processing can be effectively reduced. By transferring the rinsing liquid from the second reservoir 120 to the first reservoir 110, the phosphoric acid solution components flowing out of the substrate W can be used in the first reservoir 110. Furthermore, by transferring the rinsing liquid from the second reservoir 120 to the first reservoir 110, even if the phosphoric acid solution in the first reservoir 110 decreases, the phosphoric acid solution in the first reservoir 110 can be effectively replenished. In addition, by subsequently stopping the transfer of the rinsing liquid from the second reservoir 120 to the first reservoir 110, the excessive decrease in the concentration of phosphoric acid solution in the first reservoir 110 due to the rinsing liquid from the second reservoir 120 can be prevented.

[0109] Next, refer to Figures 1-5 The substrate processing method of this embodiment is explained. Figure 5 This is a flowchart of the substrate processing method of this embodiment.

[0110] like Figure 5 As shown, in step S10, phosphoric acid solution is supplied to the first storage tank 110. For example, phosphoric acid supply unit 112 supplies phosphoric acid to the first storage tank 110. Diluent supply unit 114 supplies diluent to the first storage tank 110. Phosphoric acid and diluent are mixed in the first storage tank 110 to generate phosphoric acid solution.

[0111] In step S12, the substrate W is immersed in the phosphoric acid solution in the first storage tank 110. The control unit 182 controls the substrate holding unit 130 to lower the substrate holding unit 130 into the first storage tank 110 while holding the substrate W. Thus, the substrate W is immersed in the phosphoric acid solution in the first storage tank 110, and the phosphoric acid treatment of the substrate W begins.

[0112] It should be noted that, in the phosphoric acid treatment, a phosphoric acid solution of a specified concentration can be supplied to the first storage tank 110. For example, the phosphoric acid supply unit 112 can supply phosphoric acid to the first storage tank 110, and the diluent supply unit 114 can supply diluent to the first storage tank 110.

[0113] In step S14, the immersion of substrate W in the phosphoric acid solution of the first storage tank 110 is completed. The control unit 182 controls the substrate holding unit 130 to raise the substrate holding unit 130 from the first storage tank 110 while holding substrate W.

[0114] In step S20, rinsing fluid is supplied to the second storage tank 120. For example, the rinsing fluid supply unit 122 supplies rinsing fluid to the second storage tank 120. It should be noted that step S20 can be performed during steps S12 and / or S14. Alternatively, it can be performed before step S12 or after step S14.

[0115] In step S22, the substrate W is immersed in the rinsing solution of the second reservoir 120. The control unit 182 controls the substrate holding unit 130 to lower the substrate holding unit 130 into the second reservoir 120 while holding the substrate W. Thus, the substrate W is immersed in the rinsing solution of the second reservoir 120, and the rinsing process of the substrate W begins.

[0116] It should be noted that rinsing fluid can be supplied to the second storage tank 120 during the rinsing process. For example, the rinsing fluid supply unit 122 can supply rinsing fluid to the second storage tank 120.

[0117] In step S24, the flushing fluid in the second reservoir 120 is transferred to the first reservoir 110. The flushing fluid transfer unit 140 transfers the flushing fluid from the second reservoir 120 to the first reservoir 110. In one example, the control unit 182 opens the valve 142, allowing the flushing fluid from the second reservoir 120 to flow through the piping 141 and be supplied to the first reservoir 110.

[0118] In step S26, the transfer of flushing fluid from the second reservoir 120 to the first reservoir 110 is stopped. The flushing fluid transfer unit 140 stops the transfer of flushing fluid from the second reservoir 120 to the first reservoir 110. In one example, the control unit 182 stops the flow of flushing fluid from the second reservoir 120 through the piping 141 and its supply to the first reservoir 110 by closing the valve 142.

[0119] In step S28, the immersion of substrate W in the rinsing solution of the second storage tank 120 is completed. The control unit 182 controls the substrate holding unit 130 to raise the substrate holding unit 130 from the second storage tank 120 while holding substrate W.

[0120] According to this embodiment, a rinsing process is performed after the substrate W is treated with phosphoric acid. During a specific period of immersion in the rinsing solution, the rinsing solution from the second reservoir 120 is supplied to the first reservoir 110, and thereafter, the supply of rinsing solution from the second reservoir 120 to the first reservoir 110 is stopped. This effectively reduces the amount of phosphoric acid solution used in the phosphoric acid treatment.

[0121] It should be noted that the flushing fluid transfer unit 140 can supply flushing fluid overflowing from the second storage tank 120 to the first storage tank 110.

[0122] Next, refer to Figures 1-6 The substrate processing apparatus 100 of this embodiment will be described. Figure 6 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 6 As for the substrate processing apparatus 100, in addition to the rinsing liquid transfer unit 140 receiving the rinsing liquid overflowing from the second storage tank 120, the piping 141 being connected to the piping 114a of the diluent supply unit 114, and the measuring of the phosphoric acid concentration of the rinsing liquid overflowing from the second storage tank 120, it also has the same features as the reference. Figure 2 The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0123] like Figure 6 As shown, in addition to the piping 141, valve 142, and pump 143, the rinsing fluid transfer unit 140 further includes a rinsing fluid receiving unit 146. The rinsing fluid receiving unit 146 receives rinsing fluid overflowing from the second reservoir 120. For example, when the substrate W is immersed in the rinsing fluid in the second reservoir 120, the rinsing fluid receiving unit 146 receives rinsing fluid overflowing from the second reservoir 120.

[0124] The flushing fluid receiving section 146 is disposed vertically below the second reservoir 120. The width and length (length in the X and Y directions) of the flushing fluid receiving section 146 are preferably greater than the width and length of the second reservoir 120. However, the depth (length in the Z direction) of the flushing fluid receiving section 146 is preferably less than the depth (length in the Z direction) of the second reservoir 120.

[0125] The flushing fluid received in the flushing fluid receiving unit 146 is supplied to the first storage tank 110 via pipe 141. Here, the pipe 141 of the flushing fluid receiving unit 146 is connected to the pipe 114a of the diluent supply unit 114.

[0126] The flushing fluid transfer unit 140 may further include a piping 148a and a valve 148b. The piping 148a is connected to the flushing fluid receiving unit 146 and the waste fluid mechanism. The valve 148b is disposed on the piping 148a. When the valve 148b is opened, the flushing fluid through the piping 148a is supplied to the waste fluid mechanism. In this way, the flushing fluid in the flushing fluid receiving unit 146 can be discarded by the piping 148a and the valve 148b.

[0127] When the flushing fluid transfer unit 140 transfers the flushing fluid from the second storage tank 120 to the first storage tank 110, the control unit 182 opens valve 142 and closes valve 148b, allowing the flushing fluid received by the flushing fluid receiving unit 146 from the second storage tank 120 to flow through pipe 141 and be supplied to the first storage tank 110. Subsequently, when the flushing fluid transfer unit 140 stops transferring the flushing fluid from the flushing fluid receiving unit 146 to the first storage tank 110, the control unit 182 closes valve 142 and opens valve 148b, allowing the flushing fluid from the flushing fluid receiving unit 146 to flow through pipe 148a and be discarded.

[0128] The rinsing fluid transfer unit 140 may further include a concentration sensor 149 capable of detecting the concentration of phosphoric acid contained in the rinsing fluid. For example, the control unit 182 may determine whether to transfer the rinsing fluid from the rinsing fluid receiving unit 146 to the first storage tank 110 based on the detection result of the concentration sensor 149. Typically, if the phosphoric acid concentration in the rinsing fluid detected by the concentration sensor 149 is higher than a threshold, the control unit 182 determines to transfer the rinsing fluid from the rinsing fluid receiving unit 146 to the first storage tank 110. On the other hand, when the phosphoric acid concentration in the rinsing fluid detected by the concentration sensor 149 decreases to below the threshold, the control unit 182 determines to stop transferring the rinsing fluid from the rinsing fluid receiving unit 146 to the first storage tank 110.

[0129] Concentration sensor 149 measures the phosphoric acid concentration of the rinsing solution located in the second storage tank 120. For example, concentration sensor 149 is installed in rinsing solution receiving section 146. Concentration sensor 149 measures a value representing the specific gravity of the rinsing solution stored in rinsing solution receiving section 146. Concentration sensor 149 measures the back pressure of rinsing solution receiving section 146.

[0130] For example, the tip of the concentration sensor 149 is positioned at a predetermined depth from the liquid surface of the flushing liquid receiving section 146. Gas is supplied to the tip of the concentration sensor 149 to form bubbles within the flushing liquid in the flushing liquid receiving section 146. Consequently, the hydraulic pressure of the flushing liquid stored in the flushing liquid receiving section 146 is detected as the gas pressure at the tip of the concentration sensor 149, positioned at a predetermined depth from the liquid surface of the flushing liquid receiving section 146. Nitrogen gas is typically used as the gas. The relationship between gas pressure and the phosphoric acid concentration of the flushing liquid is predetermined, and a table showing the relationship between gas pressure and flushing liquid is prepared beforehand, thereby enabling the measurement of the specific gravity of the flushing liquid based on the gas pressure at which bubbles are formed.

[0131] It should be noted that, in reference Figure 6 In the above description, the concentration sensor 149 measures the phosphoric acid concentration in the flushing fluid received in the flushing fluid receiving section 146, but this embodiment is not limited to this. The concentration sensor 149 can measure the phosphoric acid concentration in the flushing fluid flowing through the piping 141. In this case, the flushing fluid transfer section 140 may not have a flushing fluid receiving section 146.

[0132] It should be noted that, in Figure 6 In the substrate processing apparatus 100 shown, the rinsing fluid transfer unit 140 supplies the rinsing fluid received in the rinsing fluid receiving unit 146 to the first storage tank 110, but this embodiment is not limited to this. The rinsing fluid transfer unit 140 may also supply the rinsing fluid in the second storage tank 120 to the first storage tank 110.

[0133] Next, refer to Figures 1 to 7 The substrate processing apparatus 100 of this embodiment will be described. Figure 7 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 7 Regarding the substrate processing apparatus 100, in addition to the first storage tank 110 and the second storage tank 120 each having a double-tank structure, and the rinsing liquid transfer unit 140 supplying the rinsing liquid from the outer tank 120b of the second storage tank 120 to the first storage tank 110, it also has the same characteristics as the reference. Figure 6 The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0134] like Figure 7As shown, the first storage tank 110 has a double-tank structure. The first storage tank 110 has an inner tank 110a and an outer tank 110b. The outer tank 110b surrounds the inner tank 110a. Both the inner tank 110a and the outer tank 110b have upward-facing upper openings.

[0135] The inner tank 110a stores phosphoric acid solution and is configured to accommodate multiple substrates W. The outer tank 110b is disposed on the outer side of the upper opening of the inner tank 110a. The upper edge of the outer tank 110b is higher than the upper edge of the inner tank 110a.

[0136] The inner tank 110a and the outer tank 110b each store phosphoric acid solution. Multiple substrates W are placed into the inner tank 110a. Specifically, multiple substrates W held in the substrate holding section 130 are placed into the inner tank 110a. By placing the multiple substrates W into the inner tank 110a, they are immersed in the phosphoric acid solution within the inner tank 110a.

[0137] The second storage tank 120 has a double-tank structure. The second storage tank 120 has an inner tank 120a and an outer tank 120b. The outer tank 120b surrounds the inner tank 120a. Both the inner tank 120a and the outer tank 120b have upward-facing upper openings.

[0138] The inner tank 120a stores rinsing fluid and is configured to accommodate multiple substrates W. The outer tank 120b is disposed on the outer side of the upper opening of the inner tank 120a. The upper edge of the outer tank 120b is higher than the upper edge of the inner tank 120a.

[0139] The inner tank 120a and the outer tank 120b each store rinsing fluid. Multiple substrates W are placed into the inner tank 120a. Specifically, multiple substrates W held in the substrate holding section 130 are placed into the inner tank 120a. By placing the multiple substrates W into the inner tank 120a, they are immersed in the rinsing fluid within the inner tank 120a.

[0140] The flushing fluid transfer unit 140 includes a piping 141, a valve 142, and a pump 143. Flushing fluid from the second reservoir 120 is supplied to the first reservoir 110 via piping 141. One end of piping 141 is located in the outer tank 120b of the second reservoir 120, and the other end of piping 141 is connected to piping 114a. Therefore, flushing fluid from the second reservoir 120 is supplied to the first reservoir 110 via piping 141 and piping 114a.

[0141] Pipe 141 is connected to pipe 148a. Pipe 148a is connected to pipe 141 and the waste liquid mechanism. It should be noted that the connection point between pipe 141 and pipe 148a is preferably located downstream of pump 143.

[0142] A valve 148b is installed on pipe 148a. When valve 148b is opened, flushing fluid is supplied to the waste fluid mechanism through pipe 148a. In this way, flushing fluid can be disposed of through pipe 148a and valve 148b.

[0143] According to this embodiment, the rinsing fluid in the outer tank 120b of the second storage tank 120 can be selectively transferred to the first storage tank 110.

[0144] It should be noted that, in Figures 1 to 7 In the substrate processing apparatus 100 shown, the rinsing liquid transferred in the rinsing liquid transfer unit 140 can be directly supplied to the first storage tank 110, but this embodiment is not limited to this. The rinsing liquid transferred in the rinsing liquid transfer unit 140 can be supplied to the first storage tank 110 via a circulation pipe that circulates the phosphoric acid solution in the first storage tank 110.

[0145] In addition, Figures 1 to 7 In the substrate processing apparatus 100 shown, the rinsing liquid supply unit 122 is located above the second storage tank 120, but this embodiment is not limited to this.

[0146] Next, refer to Figures 1 to 8 The substrate processing apparatus 100 of this embodiment will be described. Figure 8 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 8 As for the substrate processing apparatus 100, in addition to supplying rinsing liquid from the second storage tank 120 to the first storage tank 110 via a circulation pipe that circulates the phosphoric acid solution in the first storage tank 110, discharging the phosphoric acid solution from the first storage tank 110, and supplying rinsing liquid from the second storage tank 120, it has the same characteristics as the reference. Figure 6 or Figure 7 The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0147] like Figure 8 As shown, the first storage tank 110 has a double-tank structure. The first storage tank 110 has an inner tank 110a and an outer tank 110b. The outer tank 110b surrounds the inner tank 110a. Both the inner tank 110a and the outer tank 110b have upward-facing upper openings.

[0148] The inner tank 110a stores phosphoric acid solution and is configured to accommodate multiple substrates W. The outer tank 110b is disposed on the outer side of the upper opening of the inner tank 110a. The upper edge of the outer tank 110b is higher than the upper edge of the inner tank 110a.

[0149] The inner tank 110a and the outer tank 110b each store phosphoric acid solution. Multiple substrates W are placed into the inner tank 110a. Specifically, multiple substrates W held in the substrate holding section 130 are placed into the inner tank 110a. By placing the multiple substrates W into the inner tank 110a, they are immersed in the phosphoric acid solution within the inner tank 110a.

[0150] The first storage tank 110 is connected to a circulation pipe 116. The circulation pipe 116 circulates the phosphoric acid solution in the first storage tank 110 by allowing it to flow out of and back into the first storage tank 110. The circulation pipe 116 connects the lower parts of the outer tank 110b and the inner tank 110a.

[0151] The circulation piping 116 is equipped with a pump 116a. Pump 116a supplies phosphoric acid solution to the first storage tank 110. The circulation piping 116 circulates the phosphoric acid solution within the first storage tank 110. As the phosphoric acid solution in the first storage tank 110 circulates through the circulation piping 116, impurities in the phosphoric acid solution can be removed. Alternatively, as the phosphoric acid solution in the first storage tank 110 circulates through the circulation piping 116, the phosphoric acid solution can be heated to a specified temperature.

[0152] The circulation piping 116 is connected to the circulation liquid supply pipe 116t. The circulation piping 116 guides the phosphoric acid solution flowing out of the first storage tank 110 back into the first storage tank 110. Specifically, the upstream end of the circulation piping 116 is located in the outer tank 110b, and the downstream end of the circulation piping 116 is located in the inner tank 110a. The downstream end of the circulation piping 116 is connected to the circulation liquid supply pipe 116t located in the inner tank 110a.

[0153] A circulating liquid supply pipe 116t is disposed in the inner tank 110a. Here, the circulating liquid supply pipe 116t is located at the bottom of the inner tank 110a of the first storage tank 110. The circulating liquid supply pipe 116t supplies circulating phosphoric acid solution to the inner tank 110a. Therefore, when the substrate W is immersed in the phosphoric acid solution in the inner tank 110a, an upward flow can be formed in the inner tank 110a by supplying phosphoric acid solution from the circulating liquid supply pipe 116t.

[0154] The first storage tank 110 is connected to a drain section 118. The phosphoric acid solution in the first storage tank 110 can be discharged through the drain section 118. In addition, the drain section 118 discharges the phosphoric acid solution stored in the first storage tank 110, and the phosphoric acid supply section 112 and the diluent supply section 114 supply phosphoric acid and diluent to the first storage tank 110, thereby replacing the phosphoric acid solution stored in the first storage tank 110 with new phosphoric acid solution.

[0155] The drainage section 118 has a drainage pipe 118a and a valve 118b. Phosphoric acid solution from the inner tank 110a is discharged through the drainage pipe 118a and the valve 118b.

[0156] A drain pipe 118a is connected to the bottom wall of the inner tank 110a. The drain pipe 118a is equipped with a valve 118b. The valve 118b is opened and closed by a control device 180. By opening the valve 118b, the phosphoric acid solution stored in the inner tank 110a is discharged to the outside through the drain pipe 118a. The discharged phosphoric acid solution is sent to a drainage treatment device (not shown) for processing. It should be noted that, preferably, similar to the first storage tank 110, the rinsing liquid from the second storage tank 120 can also be discharged.

[0157] The flushing fluid supply unit 122 includes a pipe 122a, a valve 122b, and a flushing fluid supply pipe 122t. Fluid is sprayed from the flushing fluid supply pipe 122t into the second storage tank 120. One end of the pipe 122a is connected to a flushing fluid supply source. The pipe 122a is equipped with the valve 122b. The other end of the pipe 122a is equipped with the flushing fluid supply pipe 122t. Fluid can be supplied to the second storage tank 120 under the control of the valve 122b. When the valve 122b is opened under the control of the control device 180, the flushing fluid through the pipe 122a is supplied to the second storage tank 120 from the flushing fluid supply pipe 122t.

[0158] The rinsing fluid supply pipe 122t is disposed within the second reservoir 120. The rinsing fluid supply pipe 122t is disposed at the bottom of the second reservoir 120. Therefore, when the substrate W is immersed in the rinsing fluid in the second reservoir 120, an upward flow can be formed in the second reservoir 120 by supplying rinsing fluid from the rinsing fluid supply pipe 122t.

[0159] It should be noted that in the substrate processing apparatus 100, the phosphoric acid treatment is preferably performed by immersing the substrate W in heated phosphoric acid. This allows the phosphoric acid treatment to be completed in a short time. Furthermore, the rinsing treatment is preferably performed by immersing the substrate W in a heated rinsing solution. This suppresses damage to the phosphoric acid-treated substrate W caused by temperature changes, and allows the rinsing treatment to be performed in a short time.

[0160] Next, refer to Figures 1-9 The substrate processing apparatus 100 of this embodiment will be described. Figure 9 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 9 Regarding the substrate processing apparatus 100, in addition to performing high-temperature phosphoric acid treatment and rinsing on the substrate W, and switching the use of the rinsing solution according to the temperature of the rinsing solution, it also has the same functions as the reference apparatus. Figure 8 The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0161] like Figure 9As shown, the phosphoric acid solution in the first storage tank 110 can be heated. Here, the substrate processing apparatus 100 further includes a filter 116b, a heater 116c, a regulating valve 116d, and a valve 116e. In addition to the pump 116a, the circulation piping 116 is also equipped with a filter 116b, a heater 116c, a regulating valve 116d, a valve 116e, and a circulation liquid supply pipe 116t. These components are arranged from upstream to downstream in the order of pump 116a, filter 116b, heater 116c, regulating valve 116d, and valve 116e.

[0162] The circulation piping 116 guides the phosphoric acid solution flowing out of the first storage tank 110 back into the first storage tank 110. Specifically, the upstream end of the circulation piping 116 is located in the outer tank 110b, and the downstream end is located in the inner tank 110a. The downstream end of the circulation piping 116 is connected to the circulating liquid supply pipe 116t located in the inner tank 110a.

[0163] Pump 116a delivers phosphoric acid solution from circulation piping 116 to circulation fluid supply piping 116t. Filter 116b filters the phosphoric acid solution flowing through circulation piping 116. Filter 116b filters and removes particles and other foreign matter from the phosphoric acid solution flowing in circulation piping 116.

[0164] Heater 116c heats the phosphoric acid solution flowing through circulation piping 116. The temperature of the phosphoric acid solution is regulated by heater 116c. Heater 116c heats the phosphoric acid solution flowing in circulation piping 116 to regulate it to a processing temperature. The processing temperature is, for example, about 160°C or higher and 200°C or lower. Heater 116c can heat the phosphoric acid solution and measure its temperature. In this case, heater 116c has a heating section and a temperature measuring section.

[0165] Regulating valve 116d adjusts the opening of circulation pipe 116 to regulate the flow rate of phosphoric acid solution supplied to circulation liquid supply pipe 116t. Regulating valve 116d includes a valve body (not shown) with a valve seat internally disposed, a valve core for opening and closing the valve seat, and an actuator (not shown) for moving the valve core between the open and closed positions. Other regulating valves are similar. Valve 116e opens and closes circulation pipe 116. It should be noted that regulating valve 116d can be omitted. In this case, the flow rate of phosphoric acid solution supplied to circulation liquid supply pipe 116t is regulated by controlling pump 116a.

[0166] A circulating liquid supply pipe 116t is disposed in the inner tank 110a. Here, the circulating liquid supply pipe 116t is disposed at the bottom of the inner tank 110a of the first storage tank 110. The circulating liquid supply pipe 116t is disposed within the inner tank 110a. The circulating liquid supply pipe 116t supplies circulating phosphoric acid solution to the inner tank 110a.

[0167] It should be noted that, in Figure 9 To avoid excessive complexity in the accompanying drawings, only one regulating valve 116d and one valve 116e are shown, but at least one of the regulating valves 116d and 116e can be provided in multiples.

[0168] exist Figure 9 In this system, the second storage tank 120 is capable of storing heated rinsing fluid. The rinsing fluid supply unit 122 has a first rinsing fluid supply unit 122p and a second rinsing fluid supply unit 122q. The first rinsing fluid supply unit 122p supplies heated rinsing fluid to the second storage tank 120. For example, the first rinsing fluid supply unit 122p supplies rinsing fluid heated to 45°C or higher and 70°C or lower to the second storage tank 120. The second rinsing fluid supply unit 122q supplies rinsing fluid at room temperature to the second storage tank 120.

[0169] The first flushing fluid supply unit 122p includes a piping 122a1, a valve 122b1, and a heater 122c. The piping 122a1 is connected to a flushing fluid supply source. The piping 122a1 is equipped with the valve 122b1 and the heater 122c. The valve 122b1 controls the supply of flushing fluid to the second storage tank 120. The heater 122c regulates the temperature of the flushing fluid. The heater 122c heats the flushing fluid flowing in the piping 122a1 to regulate it to a temperature (e.g., approximately 60°C to 80°C).

[0170] The second flushing fluid supply unit 122q includes a pipe 122a2 and a valve 122b2. Flushing fluid is sprayed from one end of the pipe 122a2 into the second storage tank 120. The pipe 122a2 is connected to a flushing fluid supply source. The pipe 122a2 is equipped with the valve 122b2. The supply of flushing fluid to the second storage tank 120 can be controlled by the valve 122b2.

[0171] One end of pipe 122a is connected to pipes 122a1 and 122a2. The other end of pipe 122a is provided with a flushing fluid supply pipe 122t. Flushing fluid is supplied from the flushing fluid supply pipe 122t to the second storage tank 120.

[0172] For example, during a specific period when the rinsing fluid transfer unit 140 supplies rinsing fluid to the second storage tank 120 for immersion in the first storage tank 110, the first rinsing fluid supply unit 122p may supply heated rinsing fluid to the second storage tank 120. It should be noted that the first rinsing fluid supply unit 122p may supply heated rinsing fluid to the second storage tank 120 before the specific period. Additionally, the first rinsing fluid supply unit 122p may supply heated rinsing fluid to the second storage tank 120 during the specific period.

[0173] On the other hand, when the rinsing fluid transfer unit 140 stops supplying rinsing fluid to the second storage tank 120 during a specific period of the rinsing fluid immersion period in the first storage tank 110, the second rinsing fluid supply unit 122q can supply rinsing fluid to the second storage tank 120. Additionally, the second rinsing fluid supply unit 122q can supply unheated rinsing fluid to the second storage tank 120 after the specific period.

[0174] It should be noted that, in Figure 9 In the process, piping 122a1 and piping 122a2 are connected to flushing fluid supply pipe 122t via piping 122a, but piping 122a1 can also be separated from piping 122a2 and connected to flushing fluid supply pipe 122t.

[0175] The flushing fluid transfer unit 140 may further include a temperature sensor 149a capable of detecting the temperature of the flushing fluid. For example, the control unit 182 may determine whether to transfer the flushing fluid from the flushing fluid receiving unit 146 to the first storage tank 110 based on the detection result of the temperature sensor 149a. Typically, if the temperature of the flushing fluid detected by the temperature sensor 149a is higher than a threshold, the control unit 182 determines to transfer the flushing fluid from the flushing fluid receiving unit 146 to the first storage tank 110. On the other hand, if the temperature of the flushing fluid detected by the temperature sensor 149a drops below the threshold, the control unit 182 determines to stop transferring the flushing fluid from the flushing fluid receiving unit 146 to the first storage tank 110.

[0176] It should be noted that, in Figure 6 , Figure 8 and Figure 9 In the substrate processing apparatus 100 shown, the rinsing liquid transfer unit 140 includes a rinsing liquid receiving unit 146 for receiving rinsing liquid overflowing from the second storage tank 120. The rinsing liquid in the rinsing liquid receiving unit 146 flows from the rinsing liquid receiving unit 146 to the first storage tank 110 or the circulation pipe 116, but this embodiment is not limited to this. The rinsing liquid in the rinsing liquid receiving unit 146 can flow from the rinsing liquid receiving unit 146 to the first storage tank 110 or the circulation pipe 116 via the tank for storing rinsing liquid.

[0177] In addition, Figure 6 , Figure 8 and Figure 9 In the substrate processing apparatus 100 shown, the rinsing liquid is discarded after the rinsing liquid transfer unit 140 stops transferring the rinsing liquid to the first storage tank 110, but this embodiment is not limited to this. Even after the rinsing liquid transfer unit 140 stops transferring the rinsing liquid to the first storage tank 110, the rinsing liquid transfer unit 140 may use the rinsing liquid for other purposes.

[0178] Next, refer to Figures 1-10 The substrate processing apparatus 100 of this embodiment will be described. Figure 10 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 10 Regarding the substrate processing apparatus 100, in addition to the rinsing liquid transfer unit 140 further comprising a storage tank 147, which reuses the rinsing liquid according to its conductivity, it also has the same features as the reference. Figure 9 The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0179] like Figure 10 As shown, the flushing fluid transfer unit 140 further includes a storage tank 147. The storage tank 147 stores flushing fluid between the flushing fluid receiving unit 146 and the circulation pipe 116. A valve 142a is disposed between the storage tank 147 and the flushing fluid receiving unit 146, and a valve 142b is disposed between the storage tank 147 and the circulation pipe 116. During the period until the flushing fluid is supplied to the first storage tank 110 via the circulation pipe 116, the flushing fluid in the flushing fluid receiving unit 146 is temporarily stored by the storage tank 147, valves 142a and 142b. Therefore, the timing of the flushing fluid flow to the circulation pipe 116 can be appropriately adjusted.

[0180] Piping 141 is equipped with a conductivity meter 145. The conductivity of the rinsing solution can be measured by the conductivity meter 145. For example, after a predetermined time during rinsing solution immersion, almost no phosphoric acid solution components flow out from the substrate W. Therefore, the rinsing solution in the second reservoir 120 is almost free of impurities, and the rinsing solution in the second reservoir 120 can be reused as a new rinsing solution. For example, by measuring the conductivity of the rinsing solution, it can be determined whether the rinsing solution can be reused.

[0181] The flushing fluid transfer unit 140 further includes a pipe 148p and a valve 148q. Pipe 148p is connected to pipe 141 and the flushing fluid supply mechanism. The valve 148q is mounted on pipe 148p. When valve 148q is opened, the flushing fluid through pipe 148p is supplied to the flushing fluid supply mechanism. For example, depending on the conductivity of the flushing fluid, opening valve 148q allows the flushing fluid in the second storage tank 120 to be reused.

[0182] It should be noted that, in Figures 1-10 In the description shown, rinsing is performed in the second storage tank 120, but this embodiment is not limited to this. Other treatments besides rinsing can also be performed in the second storage tank 120.

[0183] Next, refer to Figures 1 to 11 The substrate processing apparatus 100 of this embodiment will be described. Figure 11 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 11 For the substrate processing apparatus 100, in addition to supplying a processing liquid other than the rinsing liquid to the second storage tank 120, it has the same processing liquid as the reference. Figure 10 The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0184] like Figure 11 As shown, not only is rinsing fluid supplied to the second storage tank 120, but also a first component liquid and a second component liquid are supplied. For example, ammonia is supplied to the second storage tank 120 as the first component liquid and hydrogen peroxide is supplied as the second component liquid.

[0185] The substrate processing apparatus 100 further includes a first component liquid supply unit 123 and a second component liquid supply unit 124. The first component liquid supply unit 123 includes a pipe 123a and a valve 123b. One end of the pipe 123a is connected to a first component liquid supply source. The valve 123b is disposed on the pipe 123a. The other end of the pipe 123a is connected to a pipe 122a. The first component liquid can be supplied to the second storage tank 120 via the pipe 123a and the pipe 122a under the control of the valve 123b. When the valve 123b is opened under the control of the control device 180, the first component liquid is supplied to the second storage tank 120 through the pipe 123a and the pipe 122a.

[0186] The second component liquid supply unit 124 includes a pipe 124a and a valve 124b. One end of the pipe 124a is connected to a second component liquid supply source. The valve 124b is disposed on the pipe 124a. The other end of the pipe 124a is connected to a pipe 122a. The second component liquid can be supplied to the second storage tank 120 via the pipes 124a and 122a under the control of the valve 124b. When the valve 124b is opened under the control of the control device 180, the second component liquid is supplied to the second storage tank 120 through the pipes 124a and 122a.

[0187] Here, the first component liquid supply unit 123 and the second component liquid supply unit 124 supply the first component liquid and the second component liquid to the second storage tank 120. As a result, the second storage tank 120 can not only rinse the substrate W, but also treat the substrate W with the solution.

[0188] It should be noted that the circulating piping 116 is preferably equipped with a storage tank for storing heated phosphoric acid solution. Furthermore, it is preferable to spray rinsing liquid from the upper part of the second storage tank 120 towards the substrate W.

[0189] Next, refer to Figures 1-12 The substrate processing apparatus 100 of this embodiment will be described. Figure 12 This is a schematic diagram of the substrate processing apparatus 100 according to this embodiment. Figure 12 Regarding the substrate processing apparatus 100, in addition to having a temperature-controlled tank for storing heated phosphoric acid solution arranged in the circulation piping 116, and spraying rinsing liquid onto the substrate W from above the second storage tank 120, it has the same features as the reference. Figure 11The above descriptions constitute the same record, and to avoid redundancy, repeated descriptions are omitted.

[0190] like Figure 12 As shown, the substrate processing apparatus 100 further includes a temperature-controlled tank 116f. The temperature-controlled tank 116f is disposed in the circulation piping 116. Thus, the temperature-controlled tank 116f can store heated phosphoric acid solution. It should be noted that the storage tank 147 is preferably disposed adjacent to the temperature-controlled tank 116f. For example, the storage tank 147 is preferably disposed within a 2m range relative to the temperature-controlled tank 116f. This allows the temperature of the rinsing solution stored in the storage tank 147 to be maintained at a high temperature.

[0191] Furthermore, it is preferable to arrange rinsing liquid outlets 122f and 122g above the second reservoir 120. Rinsing liquid can be sprayed from the rinsing liquid outlets 122f and 122g onto the substrate W before or after the rinsing liquid immersed in the second reservoir 120.

[0192] Next, refer to Figures 1 to 14C The substrate processing method of this embodiment is explained. Figures 13A to 14C This is a schematic diagram illustrating the substrate processing method of this embodiment.

[0193] like Figure 13A As shown, the substrate holding unit 130 holds the substrate W above the first storage tank 110. The substrate holding unit 130 can receive the substrate W from another substrate holding mechanism above the first storage tank 110. Alternatively, the substrate holding unit 130 can move above the first storage tank 110 while holding the substrate W.

[0194] like Figure 13B As shown, the substrate holding section 130 immerses the substrate W in the phosphoric acid solution of the first storage tank 110. The control section 182 controls the substrate holding section 130 to lower the substrate W while holding it, thereby immersing it in the phosphoric acid solution of the first storage tank 110.

[0195] like Figure 13C As shown, the substrate holding section 130 pulls up the substrate W from the phosphoric acid solution in the first storage tank 110. The control section 182 controls the substrate holding section 130 to raise the substrate W while holding it, thereby pulling it up from the phosphoric acid solution in the first storage tank 110.

[0196] It should be noted that at this time, the flushing fluid in the second storage tank 120 can be discarded.

[0197] like Figure 13DAs shown, the substrate holding unit 130 holds the substrate W above the second storage tank 120. The substrate holding unit 130 can receive the substrate W from another substrate holding mechanism above the second storage tank 120. Alternatively, the substrate holding unit 130 can move above the second storage tank 120 while holding the substrate W.

[0198] At this point, flushing fluid can be supplied to the second reservoir 120. In this case, it is preferable to supply heated flushing fluid to the second reservoir 120.

[0199] like Figure 14A As shown, the substrate holding section 130 immerses the substrate W in the rinsing liquid of the second storage tank 120. The control section 182 controls the substrate holding section 130 to immerse the substrate W in the rinsing liquid of the second storage tank 120 by lowering the substrate holding section 130 while holding the substrate W.

[0200] Here, when the substrate W is immersed in the rinsing solution of the second storage tank 120, the rinsing solution overflows from the second storage tank 120. When the substrate W is treated with high-temperature phosphoric acid, the temperature of the rinsing solution in the second storage tank 120 also rises. The rinsing solution receiving unit 146 receives the rinsing solution overflowing from the second storage tank 120. It should be noted that the rinsing solution from the second storage tank 120 is supplied to the first storage tank 110 via the rinsing solution receiving unit 146, the storage tank 147, and the circulation piping 116. It should also be noted that the rinsing solution from the second storage tank 120 can be temporarily stored in the rinsing solution receiving unit 146 and / or the storage tank 147, and supplied to the first storage tank 110 at a predetermined time.

[0201] At this point, flushing fluid can be supplied to the second reservoir 120. In this case, it is preferable to supply heated flushing fluid to the second reservoir 120.

[0202] like Figure 14B As shown, the substrate holding section 130 maintains the substrate W immersed in the rinsing liquid of the second reservoir 120. The control section 182 controls the substrate holding section 130 to maintain the substrate W immersed in the rinsing liquid of the second reservoir 120. It should be noted that after a predetermined period of immersion of the substrate W in the rinsing liquid of the second reservoir 120, rinsing liquid is not supplied to the first reservoir 110 to the rinsing liquid receiving section 146. For example, the rinsing liquid in the rinsing liquid receiving section 146 is discarded.

[0203] At this point, flushing fluid can be supplied to the second reservoir 120. In this case, unheated flushing fluid can be supplied to the second reservoir 120.

[0204] like Figure 14CAs shown, the substrate holding section 130 rises to pull up the substrate W from the rinsing liquid in the second reservoir 120. The control section 182 controls the substrate holding section 130 to rise while holding the substrate W, pulling up the substrate W from the rinsing liquid in the second reservoir 120. At this time, rinsing liquid is sprayed onto the substrate W from the rinsing liquid spray outlets 122f and 122g.

[0205] Afterward, the rinsing liquid is discharged from the second storage tank 120 and other chemical solutions are supplied to the second storage tank 120, so that the substrate W can be treated with chemical solutions separately.

[0206] According to this embodiment, the rinsing solution from the second storage tank 120 for a specific period is stored in the storage tank 147. This allows for the efficient supply of a high-phosphoric acid concentration and high-temperature rinsing solution to the first storage tank 110.

[0207] Next, refer to Figure 15 This describes a substrate processing system 10 equipped with the substrate processing apparatus 100 of this embodiment. Figure 15 This is a schematic diagram of a substrate processing system 10 equipped with the substrate processing apparatus 100 of this embodiment. Figure 15 The substrate processing system 10 shown includes a first substrate processing apparatus 100A to a third substrate processing apparatus 100C.

[0208] like Figure 15 As shown, the substrate processing system 10 includes an input unit 20, multiple storage units 30, a transfer mechanism 40, a delivery unit 50, a buffer unit BU, a first conveying device CTC, a second conveying device WTR, a drying processing device 60, multiple substrate processing devices 100, and a control device 180.

[0209] Multiple substrate processing apparatuses 100 include a first substrate processing apparatus 100A, a second substrate processing apparatus 100B, and a third substrate processing apparatus 100C. The drying apparatus 60, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are arranged in one direction. For example, the drying apparatus 60, the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C are adjacent to the transport path of the first transport apparatus CTC, and are arranged in the order of drying apparatus 60, first substrate processing apparatus 100A, second substrate processing apparatus 100B, and third substrate processing apparatus 100C, starting from near the transport path of the first transport apparatus CTC.

[0210] Here, the first substrate processing apparatus 100A to the third substrate processing apparatus 100C each include a first storage tank 110 for storing phosphoric acid solution, a second storage tank 120 for storing rinsing solution for at least a certain period, and a substrate holding section 130. Here, the substrate holding section 130 in the first substrate processing apparatus 100A to the third substrate processing apparatus 100C is sometimes referred to as substrate holding sections 130A to 130C. Substrates W that have undergone different treatments can be fed into the first substrate processing apparatus 100A to the third substrate processing apparatus 100C respectively.

[0211] The substrate W to be processed in the substrate processing apparatus 100 is brought in from the input section 20. The input section 20 includes a plurality of mounting stages 22. The substrate W to be processed in the substrate processing apparatus 100 is taken out from the output section 50. The output section 50 includes a plurality of mounting stages 52.

[0212] The input section 20 has a receiving section 30 for receiving substrates W. The receiving section 30 placed in the input section 20 receives substrates W that have not been processed by the substrate processing apparatus 100. Here, the two receiving sections 30 are respectively placed on two mounting stages 22.

[0213] Multiple storage sections 30 each store multiple substrates W. Each substrate W is stored in a horizontal position in the storage section 30. The storage section 30 is, for example, a FOUP (Front Opening Unified Pod).

[0214] The receiving section 30, placed in the delivery section 50, receives the substrate W that has been processed by the substrate processing apparatus 100. The delivery section 50 includes a plurality of mounting stages 52. Two receiving sections 30 are respectively placed on two mounting stages 52. The delivery section 50 receives the processed substrate W in the receiving section 30 and delivers it together with the receiving section 30.

[0215] The buffer unit BU is disposed adjacent to the input section 20 and the output section 50. The buffer unit BU takes the receiving section 30, along with the substrate W, placed in the input section 20 and inserts it into its interior, then places the receiving section 30 onto a shelf (not shown). Additionally, the buffer unit BU receives the processed substrate W and stores it in the receiving section 30, then places the receiving section 30 onto the shelf. A transfer mechanism 40 is disposed within the buffer unit BU.

[0216] The transfer mechanism 40 transfers the receiving section 30 between the input section 20 and the output section 50 and the shelf. Furthermore, the transfer mechanism 40 only transfers substrate W with the first conveying device CTC. That is, the transfer mechanism 40 and the first conveying device CTC perform batch transfers of substrate W.

[0217] After receiving a batch of unprocessed substrates W from the transfer mechanism 40, the first transfer device CTC changes the orientation of the substrates W from a horizontal to a vertical position and transfers the substrates W to the second transfer device WTR. Conversely, after receiving a batch of processed substrates W from the second transfer device WTR, the first transfer device CTC changes the orientation of the substrates W from a vertical to a horizontal position and transfers the batch of substrates W to the transfer mechanism 40.

[0218] The second conveying device WTR can move from the third substrate processing apparatus 100C to the second substrate processing apparatus 100B along the length direction of the substrate processing system 10. The second conveying device WTR can transport substrates W in batches into and out of the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C. In detail, the second conveying device WTR delivers the substrates W to the substrate holding sections 130A to 130C of the first substrate processing apparatus 100A, the second substrate processing apparatus 100B, and the third substrate processing apparatus 100C, where the substrates W are subjected to phosphoric acid treatment and rinsing treatment, respectively.

[0219] It should be noted that, in reference Figures 1 to 15 The above description illustrates a scheme where the rinsing solution from the second reservoir 120 of the substrate processing apparatus 100 is transferred to the first reservoir 110 of the same substrate processing apparatus 100; however, this embodiment is not limited to this. The rinsing solution from the second reservoir 120 can be transferred to the first reservoir 110 of another substrate processing apparatus 100. Furthermore, the rinsing solution from the second reservoir 120 can also be transferred to a first reservoir 110 different from the first reservoir 110 where the substrate W immersed in the rinsing solution of the second reservoir 120 has been treated.

[0220] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from its spirit. Furthermore, various inventions can be formed by appropriately combining the multiple constituent elements disclosed in the above embodiments. For example, several constituent elements can be deleted from all the constituent elements shown in the embodiments. In addition, constituent elements from different embodiments can be appropriately combined. For ease of understanding, the accompanying drawings are schematically shown with each constituent element as the main body. The thickness, length, number, spacing, etc., of each constituent element shown may differ from the actual dimensions due to the fabrication of the drawings. Furthermore, the material, shape, size, etc., of each constituent element shown in the above embodiments are merely examples and are not particularly limited; various modifications can be made without substantially departing from the effects of the present invention.

[0221] Industrial applicability

[0222] This invention applies to substrate processing apparatus and substrate processing methods.

Claims

1. A substrate processing apparatus, wherein, have: The first storage tank is used to store phosphoric acid solution; The second storage tank stores the rinsing solution; The substrate holding section holds the substrate and allows it to descend and rise; and After immersing the substrate in the phosphoric acid solution stored in the first storage tank, the substrate holding section lifts the substrate and moves it to the second storage tank, so that the substrate is immersed in the rinsing solution stored in the second storage tank during rinsing solution immersion. The substrate processing apparatus further includes a rinsing fluid transfer unit that immerses the substrate in the rinsing fluid in the second reservoir, and, during a specific period of the rinsing fluid immersion, supplies the rinsing fluid from the second reservoir to the first reservoir; and, after the specific period of the rinsing fluid immersion, the rinsing fluid transfer unit stops supplying the rinsing fluid from the second reservoir to the first reservoir. During the rinsing process, the rinsing solution stored in the second storage tank contains components of the phosphoric acid solution. After the rinsing liquid transfer unit stops supplying the rinsing liquid, the substrate holding unit raises the substrate immersed in the rinsing liquid stored in the second storage tank.

2. The substrate processing apparatus as claimed in claim 1, wherein, The system further includes a circulation piping system that circulates the phosphoric acid solution in the first storage tank by allowing it to flow out of and back into the first storage tank. The flushing fluid transfer unit supplies the flushing fluid to the second storage tank via the circulation piping to the first storage tank.

3. The substrate processing apparatus as claimed in claim 2, wherein, Further features include: A phosphoric acid supply unit that supplies phosphoric acid to the first storage tank; A diluent supply unit that supplies diluent to the first storage tank; and A flushing fluid supply unit that supplies flushing fluid to the second storage tank.

4. The substrate processing apparatus as claimed in claim 3, wherein, The system further includes a heater for heating the phosphoric acid solution flowing through the circulating piping. The flushing fluid supply unit includes: a first flushing fluid supply unit having a heater for heating the flushing fluid and supplying heated flushing fluid; and a second flushing fluid supply unit supplying flushing fluid at room temperature. The first rinsing fluid supply unit supplies the heated rinsing fluid to the second storage tank from the beginning to the end of the specific period during the rinsing fluid immersion period. The second flushing fluid supply unit supplies the flushing fluid at room temperature to the second storage tank from the end of the specific period during the flushing fluid immersion period.

5. The substrate processing apparatus as claimed in claim 4, wherein, The flushing fluid transfer unit includes a storage tank that stores at least a portion of the flushing fluid from the second storage tank during the specific period.

6. The substrate processing apparatus as claimed in claim 5, wherein, It further includes a temperature-regulating tank configured in the circulating piping. The storage tank is arranged adjacent to the temperature control tank.

7. A substrate processing method, wherein, Include: A phosphoric acid treatment process in which the substrate is immersed in a phosphoric acid solution stored in a first storage tank; After the phosphoric acid treatment process, the substrate is pulled up from the phosphoric acid solution and moved to the second storage tank, where the substrate is immersed in the rinsing solution stored in the second storage tank during the rinsing process. The process involves immersing the substrate in the rinsing solution and, during a specific period of the rinsing solution immersion, supplying the rinsing solution from the second storage tank to the first storage tank for reuse. The process of immersing the substrate in the rinsing solution and, after a specific period during the rinsing solution immersion, stopping the supply of the rinsing solution to the second reservoir into the first reservoir is a process of stopping the transfer of the rinsing solution. After the transfer stop process, the process of immersing the substrate in the rinsing solution stored in the second storage tank is completed. During the rinsing process, the rinsing solution stored in the second storage tank contains components of the phosphoric acid solution.

8. The substrate processing method as described in claim 7, wherein, The method further includes a step of circulating the phosphoric acid solution via a circulation pipe that allows the phosphoric acid solution in the first storage tank to flow out of and return to the first storage tank. The transfer process supplies the flushing fluid of the second storage tank to the first storage tank via the circulation piping.

9. The substrate processing method as described in claim 8, wherein, Further includes: The process of supplying phosphoric acid to the first storage tank; The process of supplying diluent to the first storage tank; The process of supplying rinsing fluid to the second storage tank.

10. The substrate processing method as described in claim 9, wherein, The process further includes heating the phosphoric acid solution flowing through the circulating piping. The process of supplying the flushing fluid includes: a first flushing fluid preparation step, which involves heating the flushing fluid and preparing the heated flushing fluid; and a second flushing fluid preparation step, which involves preparing the flushing fluid at room temperature. From the beginning to the end of the specific period during the rinsing process, heated rinsing fluid is supplied to the second storage tank; from the end of the specific period during the rinsing process, unheated rinsing fluid at room temperature is supplied to the second storage tank.

11. The substrate processing method as described in claim 10, wherein, The transfer process includes the process of storing the flushing fluid from the second retention tank during the specific period in a retention vessel.

12. The substrate processing method as described in claim 11, wherein, The process further includes storing the phosphoric acid solution flowing through the circulation piping in a temperature-controlled tank. The storage tank is arranged adjacent to the temperature control tank.

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