Electronic component

Abstract

The electronic component of the present application includes: an insulator portion, a plurality of band-shaped internal conductors, and a first external electrode and a second external electrode, the internal conductors are 3 to 5 and are stacked with an insulating layer therebetween, the total of the cross-sectional areas of the plurality of internal conductors is 0.1 mm 2 ~ 0.5 mm 2 When the thickness of the internal conductors is t1, the width is w4, the distance between the internal conductors is t2, t1 / w4 is x, and t2 / t1 is y, (i) when the number of internal conductors is 3, (x, y) is in the region enclosed by A (0.051, 1.0), B (0.051, 5.9), C (0.2, 5.9), D (0.2, 4.4), and E (0.1, 1.4), (ii) when the number of internal conductors is 4, (x, y) is in the region enclosed by F (0.038, 0.26), G (0.038, 5.2), H (0.2, 5.2), I (0.2, 4.9), and J (0.1, 1.9), and (iii) when the number of internal conductors is 5, (x, y) is in the region enclosed by K (0.031, 0.53), L (0.031, 4.9), M (0.15, 4.9), N (0.15, 4.1).

Description

Technical Field

[0001] This disclosure relates to an electronic component. Background Technology

[0002] As electronic components, there are known electronic components that contain multiple strip-shaped internal conductors within a single unit (Patent Document 1). Patent Document 1... Figure 2 and Figure 5 The invention discloses an electronic component having a wide strip-shaped internal conductor as the lead-out portion extending to the end face of a laminate. It is claimed that this electronic component can suppress damage to the cutter and cutting machine when cutting the parent laminate, reduce the DC resistance value, and suppress deformation of the laminate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-210204 Summary of the Invention

[0006] The electronic component in Patent Document 1 requires an increase in the cross-sectional area of ​​the coil conductor to increase the current flowing through it. However, if the cross-sectional area of ​​the inner conductor is increased, the stress near the inner conductor will increase due to the difference in the coefficients of linear expansion between the insulation layer and the inner conductor, which may cause cracks in the unit body.

[0007] The purpose of this disclosure is to provide an electronic component having multiple strip-shaped internal conductors inside a unit body, and to prevent cracking of the unit body even if the cross-sectional area of ​​the internal conductors is increased.

[0008] This disclosure includes the following methods.

[0009] [1] An electronic component, comprising:

[0010] An insulator composed of multiple layers of insulation.

[0011] Multiple strip-shaped internal conductors embedded in the aforementioned insulating portion, and

[0012] A first external electrode and a second external electrode are provided facing the outer surface of the aforementioned insulating portion and are electrically connected to the aforementioned internal conductor;

[0013] The aforementioned internal conductors are 3 to 5, and are stacked with the aforementioned insulating layer in between.

[0014] The total cross-sectional area of ​​the aforementioned internal conductors is 0.1 mm². 2 ~0.5mm 2 ,

[0015] When the thickness of the aforementioned internal conductor is set to t1, the width to w4, the distance between the aforementioned internal conductors to t2, t1 / w4 to x, and t2 / t1 to y,

[0016] (i) When the number of internal conductors is 3: (x, y) is in the region enclosed by A(0.051, 1.0), B(0.051, 5.9), C(0.2, 5.9), D(0.2, 4.4), and E(0.1, 1.4).

[0017] (ii) When the number of internal conductors is 4: (x, y) is in the region enclosed by F(0.038, 0.26), G(0.038, 5.2), H(0.2, 5.2), I(0.2, 4.9), J(0.1, 1.9),

[0018] (iii) When the number of internal conductors is 5: (x, y) is in the region enclosed by K(0.031, 0.53), L(0.031, 4.9), M(0.15, 4.9), N(0.15, 4.1).

[0019] [2] According to the electronic component described in [1] above, the internal conductor has a wire portion and a first lead-out portion and a second lead-out portion located at both ends thereto, wherein the ratio of the width of the first lead-out portion and the second lead-out portion to the width of the insulating portion is 0.4 to 1.0.

[0020] [3] According to the electronic component described in [1] or [2] above, the height of the insulating portion is 1.8 mm to 2.2 mm and the width of the insulating portion is 2.3 mm to 2.7 mm.

[0021] [4] The electronic component according to any one of [1] to [3] above, wherein the insulating layer comprises a magnetic layer containing: 40 mol% to 49.5 mol% Fe as Fe2O3, 2 mol% to 35 mol% Zn as ZnO, 6 mol% to 13 mol% Cu as CuO, and 10 mol% to 45 mol% Ni as NiO.

[0022] [5] The electronic component according to any one of [1] to [4] above, wherein the insulating layer comprises a non-magnetic layer.

[0023] [6] According to the electronic component described in [5] above, the non-magnetic body layer contains 40 mol% to 49.5 mol% Fe as Fe2O3, 6 mol% to 13 mol% Cu as CuO, and 37.5 mol% to 54 mol% Zn as ZnO.

[0024] According to this disclosure, it is possible to provide an electronic component that is less prone to cracking near the internal conductor of a unit. Attached Figure Description

[0025] Figure 1 This is a perspective view schematically showing the electronic component 1 of Embodiment 1 of the present disclosure.

[0026] Figure 2 yes Figure 1 The cross-sectional view of electronic component 1, which is parallel to the LW plane, is shown.

[0027] Figure 3 yes Figure 1 The cross-sectional view of electronic component 1, parallel to the LT plane, is shown.

[0028] Figure 4 yes Figure 1 The cross-sectional view of electronic component 1, parallel to the WT plane, is shown.

[0029] Figure 5 yes Figure 3 A magnified view of a portion of the cross-sectional diagram shown.

[0030] Figure 6 yes Figure 2 A magnified view of a portion of the cross-sectional diagram shown.

[0031] Figure 7 This is a cross-sectional view of the electronic component according to Embodiment 2 of this disclosure.

[0032] Figure 8 This is a cross-sectional view of an electronic component according to another embodiment 2 of this disclosure.

[0033] Figure 9 This is a cross-sectional view of the electronic component according to Embodiment 3 of this disclosure.

[0034] Figure 10 This is a cross-sectional view of the electronic component according to Embodiment 4 of this disclosure.

[0035] Figure 11 The results are shown when there are 3 internal conductors in the embodiment.

[0036] Figure 12 The results are shown when there are 4 internal conductors in the embodiment.

[0037] Figure 13 The results are shown when there are 5 internal conductors in the embodiment.

[0038] Figure 14 The impedance measurement results in the examples are shown.

[0039] Symbol Explanation

[0040] 1… Electronic components

[0041] 3…Internal conductor

[0042] 4…line section

[0043] 5… Section 1 Introduction

[0044] 6…Section 2

[0045] 7…Insulator section

[0046] 11…First end face

[0047] 12…Second end face

[0048] 13…lower surface

[0049] 14… Upper surface

[0050] 15…First side

[0051] 16…Second side

[0052] 17…The first principal surface of the internal conductor

[0053] 18…Second principal surface of the internal conductor

[0054] 21…First external electrode

[0055] 22…Second External Electrode

[0056] 31, 32… Non-magnetic layers Detailed Implementation

[0057] Hereinafter, the electronic components of this disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the shape and arrangement of the electronic components and constituent elements in this embodiment are not limited to the examples shown in the drawings.

[0058] <Implementation Method 1>

[0059] A perspective view of the electronic component 1 of this embodiment is shown in [the figure]. Figure 1 The cross-section parallel to the LW plane is shown in the diagram. Figure 2 The cross-section parallel to the LT plane is shown in the diagram. Figure 3 The cross-section parallel to the WT plane is shown in the diagram. Figure 4 The shapes and arrangements of the electronic components and constituent elements in the following embodiments are not limited to the examples shown in the figures.

[0060] like Figures 1-4As shown, the electronic component 1 in this embodiment is an electronic component having a generally cuboid shape. The electronic component 1 generally includes an insulator portion 7, a plurality of internal conductors 3 embedded in the insulator portion 7, and a first external electrode 21 and a second external electrode 22 disposed on both end faces of the insulator portion 7. The insulator portion 7 has a generally cuboid shape. In the insulator portion 7, [the following is a description of the components and their arrangement:] Figure 1 The two surfaces perpendicular to the L-axis are called the first end face and the second end face, respectively. The surface perpendicular to the W-axis is called the first side face and the second side face, and the surface perpendicular to the T-axis is called the upper surface and the lower surface, respectively. The internal conductor 3 includes a wire portion 4, a first lead-out portion 5, and a second lead-out portion 6. The internal conductor 3 is electrically connected to the first external electrode 21 at the first lead-out portion 5 and to the second external electrode 22 at the second lead-out portion 6.

[0061] The electronic component disclosed herein preferably has a length (L) of 2.5 mm to 4.0 mm, a width (W) of 2.0 mm to 3.0 mm, and a height (T) of 1.5 mm to 2.5 mm. More preferably, it has a length of 2.8 mm to 3.5 mm, a width of 2.3 mm to 2.7 mm, and a height of 1.8 mm to 2.2 mm.

[0062] (Insulator section)

[0063] In the electronic component 1 of this embodiment, an insulator portion 7 is formed by stacking multiple insulating layers. The insulating layers are... Figure 1 Stacking is performed in the T direction.

[0064] The aforementioned insulating layer includes a magnetic layer.

[0065] The aforementioned magnetic layer contains at least Fe, Zn, Cu, and Ni.

[0066] The aforementioned magnetic layer is composed of sintered magnetic materials containing at least Fe, Zn, Cu, and Ni as main components.

[0067] The aforementioned principal component refers to the component that constitutes the majority of the components contained in the magnetic layer. Typically, the principal component is present in an amount exceeding 50% by mass relative to the total of all components contained in the magnetic layer.

[0068] In the above-mentioned sintered magnetic materials, the Fe content, converted to Fe2O3, is preferably 40.0 mol% to 49.5 mol% (based on the total of the main components, the same applies below), and more preferably 45.0 mol% to 49.5 mol%.

[0069] In the above-mentioned sintered magnetic materials, the Zn content, converted to ZnO, is preferably 2.0 mol% to 35.0 mol% (based on the total of the main components, the same applies below), and more preferably 5.0 mol% to 30.0 mol%.

[0070] In the above-mentioned sintered magnetic materials, the Cu content, converted to CuO, is preferably 6.0 mol% to 13.0 mol% (based on the total of the main components, the same applies below), and more preferably 7.0 mol% to 10.0 mol%.

[0071] In the above-mentioned sintered magnetic materials, the Ni content is not particularly limited and can be the balance of the other main components, namely Fe, Zn and Cu, converted to NiO, preferably 10.0 mol% to 45.0 mol% (based on the total of the main components, the same below), more preferably 15.0 mol% to 40.0 mol%.

[0072] Excellent electrical properties can be obtained by keeping the contents of Fe, Zn, Cu and Ni in the magnetic layer within the above range.

[0073] In this disclosure, the sintered magnetic material may further contain additives. Examples of additives in the sintered magnetic material include Mn, Co, Sn, Bi, and Si, but it is not limited to these. The content (amount of addition) of Mn, Co, Sn, Bi, and Si, relative to 100 parts by mass of the main components (Fe (Fe2O3 conversion), Zn (ZnO conversion), Cu (CuO conversion), and Ni (NiO conversion)) converted to Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2, is preferably 0.1 to 1 part by mass, respectively. Furthermore, the sintered magnetic material may further contain impurities unavoidable in manufacturing.

[0074] The distance between the upper surface 14 and the lower surface 13 of the insulator portion 7, i.e. the height h1 of the insulator portion 7, is preferably 1.8 mm to 2.2 mm.

[0075] The distance between the first side 15 and the second side 16 of the insulator portion 7, i.e. the width w1 of the insulator portion 7, is preferably 2.3 mm to 2.7 mm.

[0076] In one embodiment, the height h1 of the insulator portion 7 is 1.8 mm to 2.2 mm, and the width w1 of the insulator portion 7 is 2.3 mm to 2.7 mm.

[0077] The size of the insulating part 7 is not particularly limited, but preferably the height h1 of the insulating part 7 is 1.8mm to 2.2mm and the width w1 of the insulating part 7 is 2.3mm to 2.7mm.

[0078] (Internal conductor)

[0079] Multiple strip-shaped internal conductors 3 are embedded in the insulator part 7. Strip-shaped refers to a surface shape with length and width.

[0080] The inner conductor 3 has its length along the L-axis, its width along the W-axis, and its thickness along the T-axis; these axes can be straight. The inner conductor 3 has a first main surface 17, which serves as the main surface to the upper surface 14, and a second main surface 18, which serves as the main surface to the lower surface 13.

[0081] The internal conductor 3 has a wire portion 4 and a first lead-out portion 5 and a second lead-out portion 6 located at its two ends. The first lead-out portion 5 is exposed at a first end face 11 and is electrically connected to a first external electrode 21. The second lead-out portion 6 is exposed at a second end face 12 and is electrically connected to a second external electrode 22.

[0082] Multiple internal conductors 3 exist, stacked with an insulating layer between them. The electronic component of this disclosure functions like a coil by fabricating such a structure. The stacked internal conductors are arranged in substantially the same position in the top view. It should be noted that substantially the same position means not only completely identical, but also that most, for example, more than 90% of the area in the top view overlaps.

[0083] The number of internal conductors 3 is preferably 3 to 5, more preferably 4 or 5.

[0084] The total cross-sectional area of ​​the wire portion 4 of the internal conductor 3 is preferably 0.1 mm². 2 ~0.5mm 2 By making the total cross-sectional area of ​​line part 4 0.1 mm. 2 In this way, the resistance of the internal conductor can be reduced. Furthermore, by making the total cross-sectional area of ​​wire portion 4 0.5 mm²... 2 Therefore, electronic component 1 can be made smaller.

[0085] The thickness t1 of the wire portion 4 of the inner conductor 3 is preferably 0.03 mm or more, more preferably 0.04 mm or more. Furthermore, the thickness t1 of the wire portion 4 of the inner conductor 3 is preferably 0.1 mm or less, more preferably 0.09 mm or less, and even more preferably 0.08 mm or less. In one embodiment, the thickness t1 of the wire portion 4 of the inner conductor 3 may preferably be 0.03 mm to 0.1 mm, more preferably 0.04 mm to 0.08 mm.

[0086] The distance between the wire portions 4 of the inner conductor 3 (in other words, the thickness of the insulating layer between the wire portions 4 of the inner conductor 3) t2 is preferably 0.01 mm to 0.6 mm, more preferably 0.07 mm to 0.48 mm, and even more preferably 0.10 mm to 0.36 mm.

[0087] By ensuring that the distance t2 between the aforementioned wires is 0.01 mm or more, the insulation between the internal conductor layers can be ensured more reliably. Furthermore, by ensuring that the distance t2 between the aforementioned wires is 0.6 mm or less, superior electrical characteristics can be obtained.

[0088] The width w4 of the wire portion 4 of the internal conductor 3 is preferably 0.3 mm to 2.0 mm, more preferably 0.5 mm to 1.5 mm, and even more preferably 0.6 mm to 1.3 mm.

[0089] The width w3 of the lead-out portion of the internal conductor 3 is preferably 0.5 mm to 2.5 mm, more preferably 0.8 mm to 2.5 mm, and even more preferably 1.0 mm to 2.0 mm.

[0090] The ratio of the distance h3 between the first main surface 17 of the wire portion 4 of the inner conductor 3d closest to the upper surface 14 of the insulator portion 7 and the second main surface 18 of the wire portion 4 of the inner conductor 3a closest to the lower surface 13 of the insulator portion 7 and the height h1 of the insulator portion 7 (h3 / h1) is preferably 0.25 to 0.55, more preferably 0.30 to 0.45. By keeping h3 / h1 within the above range, the generation of cracks in the insulator portion and the external electrode can be suppressed.

[0091] The ratio (w3 / w1) of the width w3 of the lead-out portion of the internal conductor 3 to the width w1 of the insulator portion 7 is preferably 0.40 to 1.0, more preferably 0.40 or more and less than 1.0, and even more preferably 0.50 to 0.80.

[0092] It should be noted that w3 is the width at approximately the center of the axial (i.e., L-axis direction) lead-out portion of the inner conductor. w3 is also the width of the inner conductor located at the center in the stacking direction. For example, when there are 5 inner conductors, w3 is the width of the 3rd inner conductor from the upper surface 14 or the lower surface 13. Furthermore, when there is an even number of inner conductors, w3 is the average of the widths of the two central inner conductors, 3b and 3c, in the illustrated example.

[0093] By keeping w3 / w1 within the aforementioned range, it is possible to suppress the generation of cracks in the insulator portion and the external electrode.

[0094] When the thickness of the internal conductor is set to t1, the width to w4, the distance between the internal conductors to t2, t1 / w4 to x, and t2 / t1 to y,

[0095] (i) When the number of internal conductors is 3: (x, y) is in the region enclosed by A(0.051, 1.0), B(0.051, 5.9), C(0.2, 5.9), D(0.2, 4.4), and E(0.1, 1.4).

[0096] (ii) When the number of internal conductors is 4: (x, y) is in the region enclosed by F(0.038, 0.26), G(0.038, 5.2), H(0.2, 5.2), I(0.2, 4.9), J(0.1, 1.9),

[0097] (iii) When the number of internal conductors is 5: (x, y) is in the region enclosed by K(0.031, 0.53), L(0.031, 4.9), M(0.15, 4.9), N(0.15, 4.1).

[0098] By setting x and y to values ​​within the aforementioned range, crack formation can be suppressed, and the strength of electronic components can be increased.

[0099] The inner conductor 3 has protrusions that protrude from the first end face 11 and the second end face 12.

[0100] The protrusion distances p1 and p2 of the internal conductor 3 that protrude most at the first end face 11 and the second end face 12 are preferably 0.10 mm or less, more preferably 0.05 mm or less, and even more preferably 0.04 mm or less. In addition, there is no particular limitation on the lower limit of the protrusion distances p1 and p2, and the smaller the better, for example, 0.03 mm or more or 0.01 mm or more.

[0101] The ratio (p1 / h2) of the protrusion distance p1 of the inner conductor that protrudes most at the first end face 11 and the second end face 12 to the distance h2 between the first main surface 17 of the inner conductor 3d closest to the upper surface 14 of the insulator portion 7 and the second main surface 18 of the inner conductor 3a closest to the lower surface 13 of the insulator portion 7 is preferably 0.07 or less, more preferably 0.05 or less, and even more preferably 0.04 or less. In addition, p1 / h2 is, for example, 0.01 or more.

[0102] The ratio (p2 / w2) of the protrusion distance p2 of the inner conductor 3 at the first end face 11 and the second end face 12 to the width w2 of the inner conductor 3 exposed from each end face is preferably 0.06 or less, more preferably 0.05 or less, and even more preferably 0.04 or less. Additionally, p2 / w2 is, for example, 0.01 or more. Here, w2 and p2 refer to the width and protrusion distance of the inner conductor located at the center of the stacking direction. For example, when there are five inner conductors, w2 and p2 refer to the width and protrusion distance of the third inner conductor from the upper surface 14 or the lower surface 13. Furthermore, when the number of inner conductors is even, w2 and p2 are the average of the widths of the two central inner conductors 3b and 3c in the illustrated example.

[0103] The conductive material constituting the internal conductor 3 is not particularly limited; examples include Au, Ag, Cu, Pd, and Ni. The material constituting the internal conductor 3 is preferably Ag or Cu, and more preferably Ag. There may be only one type of conductive material, or there may be two or more types.

[0104] (External electrode)

[0105] The external electrodes 21 and 22 are configured to cover the first end face 11 and the second end face 12 of the insulating portion 7.

[0106] The conductive materials constituting the external electrodes 21 and 22 are not particularly limited, and can be, for example, one or more metallic materials selected from Au, Ag, Pd, Ni, Sn and Cu.

[0107] The external electrodes 21 and 22 can be single-layered or multi-layered. In one embodiment, the external electrodes 21 and 22 can be multi-layered, preferably 2 to 4 layers, for example, 3 layers.

[0108] In one embodiment, the external electrodes 21 and 22 are multilayered, and may include layers containing Ag or Pd, Ni, or Sn. Preferably, the external electrodes 21 and 22 are composed of layers containing Ag or Pd, Ni, and Sn. Preferably, the layers are arranged sequentially from the inner conductor side: a layer containing Ag or Pd, preferably a layer containing Ag, a layer containing Ni, and a layer containing Sn. Preferably, the Ag or Pd layer is formed by sintering Ag paste or Pd paste, and the Ni and Sn layers can be plating layers.

[0109] (Determination Method)

[0110] The height h1 and width w1 of the insulating portion 7, the cross-sectional area, thickness t1 and width w4 of the wire portion 4 of the internal conductor 3, the distance t2 between the wire portions 4, and the distance h3 between the first main surface 17 of the internal conductor 3d closest to the upper surface 14 of the insulating portion 7 and the second main surface 18 of the internal conductor 3a closest to the lower surface 13 can be measured as follows.

[0111] The electronic component sample was fixed with resin with the WT side exposed, and then ground in the L direction using a grinder until approximately the center of the insulator portion 7 was exposed. After grinding, the cross-section was photographed using a digital microscope. The obtained image was analyzed using image analysis software to obtain the cross-sectional area, thickness t1, width w4, distance t2, and distance h3 of the internal conductor 3. It should be noted that the height h1 is the height of the approximately central portion in the width direction. The width w1 is the width of the approximately central portion in the height direction. The thicknesses t1 and t2 are the thicknesses of the internal conductor in the aforementioned cross-section at the center in the width direction.

[0112] The width w3 of the lead-out portion of the aforementioned internal conductor 3 can be measured as follows.

[0113] The electronic component sample was fixed with resin with the WT side exposed. A grinder was used to grind along the L direction until approximately the center of the lead-out portion was exposed along the L-axis. After grinding, the cross-section was photographed using a digital microscope. The obtained image was analyzed using image analysis software to obtain the width w3 of the lead-out portion of the internal conductor 3.

[0114] The aforementioned distances h2 and p1 can be measured as follows.

[0115] The electronic component sample was exposed at the LT side and fixed with resin around it. It was then ground in the W direction using a grinder until approximately the center of the internal conductor was exposed. After grinding, the cross-section was photographed using a digital microscope. The obtained images were analyzed using image analysis software to obtain h1 and p1.

[0116] It should be noted that p1 is the distance in the obtained cross section from the front end of the most protruding internal conductor to the contact point x1 of the first main surface 17 of the internal conductor 3d that is closest to the upper surface 14 of the insulator 7 and the contact point x2 of the internal conductor 3a that is closest to the lower surface 13 of the insulator 7.

[0117] The width w2 and protrusion distance p2 mentioned above can be determined as follows.

[0118] The electronic component sample was fixed with resin with the LW side exposed. A grinder was used to grind along the T direction until approximately the center of the inner conductor (in the illustrated example, inner conductor 3b or 3c) in the thickness direction was exposed. After grinding, the cross-section was photographed using a digital microscope. The obtained image was analyzed using image analysis software to obtain w2 and p2. It should be noted that p2 is the distance in the obtained cross-section from the front end of the inner conductor to the straight line connecting the contact points x3 and x4 between the first or second end face of the insulator portion 7 and the inner conductor 3.

[0119] (Manufacturing method)

[0120] The manufacturing method of electronic component 1 will be described below.

[0121] (1) Preparation of magnetic materials (pre-fired magnetic powder)

[0122] First, prepare the raw materials for the magnetic material. The raw materials for the magnetic material contain Fe, Zn, Cu, and Ni as main components. Usually, the main components of the above raw materials are actually composed of oxides of Fe, Zn, Cu, and Ni (ideally Fe2O3, ZnO, CuO, and NiO).

[0123] As the above raw materials, Fe2O3, ZnO, CuO, NiO, and any necessary additives are weighed in a manner that forms a specified composition, and then mixed and pulverized. The resulting powder is dried and pre-calcined to obtain pre-calcined magnetic powder. Preferably, the obtained pre-calcined magnetic powder is pulverized and micronized.

[0124] In the aforementioned pre-calcined magnetic powder, the Fe content, converted to Fe2O3, is preferably 40.0 mol% to 49.5 mol% (based on the total of the main components, the same applies below), and more preferably 45.0 mol% to 49.5 mol%.

[0125] In the aforementioned pre-calcined magnetic powder, the Zn content, converted to ZnO, is preferably 2.0 mol% to 35.0 mol% (based on the total of the main components, the same applies below), and more preferably 5.0 mol% to 30.0 mol%.

[0126] In the aforementioned pre-calcined magnetic powder, the Cu content, converted to CuO, is preferably 6.0 mol% to 13.0 mol% (based on the total of the main components, the same applies below), and more preferably 7.0 mol% to 10.0 mol%.

[0127] In the aforementioned pre-calcined magnetic powder, the Ni content is not particularly limited and can be considered as the balance of the other main components, namely Fe, Zn, and Cu. Converted to NiO, it is preferably 10.0 mol% to 45.0 mol% (based on the total of main components, the same applies below), and more preferably 15.0 mol% to 40.0 mol%.

[0128] In this disclosure, the pre-calcined magnetic powder may further contain additives. Examples of additives in the pre-calcined magnetic powder include Mn, Co, Sn, Bi, and Si, but it is not limited to these. The content (amount added) of Mn, Co, Sn, Bi, and Si, relative to 100 parts by mass of the main components (Fe (Fe2O3 conversion), Zn (ZnO conversion), Cu (CuO conversion), and Ni (NiO conversion)), is preferably 0.1 to 1 part by mass of Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2, respectively. Furthermore, the pre-calcined magnetic powder may further contain impurities unavoidable in manufacturing.

[0129] It should be noted that the Fe content (Fe2O3 conversion), Zn content (ZnO conversion), Cu content (CuO conversion), and Ni content (NiO conversion) in the pre-calcined magnetic powder can be considered to be substantially the same as those in the calcined sintered magnetic material.

[0130] (2) Preparation of conductive paste

[0131] Prepare a conductive material. Examples of conductive materials include Au, Ag, Cu, Pd, and Ni, with Ag or Cu being preferred, and Ag being more preferred. Weigh a specified amount of conductive material powder, mix a specified amount of solvent (eugenol, etc.), resin (ethyl cellulose, etc.), and dispersant using a planetary mixer or similar equipment, and then disperse the mixture using a three-roll mill or similar equipment to prepare a conductive paste.

[0132] (3) Sheet production

[0133] The magnetic materials prepared above are mixed in a specified manner. This mixture, along with, for example, PSZ media, is placed in a ball mill, and organic binders such as polyvinyl butyral, organic solvents such as ethanol and toluene, and plasticizers are further added and mixed to obtain a slurry. Next, the slurry is formed into sheets using a scraper or similar method, and then punched into rectangles to produce green sheets.

[0134] The thickness of the green sheet can be, for example, 20 μm to 100 μm, preferably 30 μm to 80 μm, and more preferably 30 μm to 60 μm. By keeping the thickness of the green sheet within the above range, high insulation and excellent electrical properties can be obtained.

[0135] Next, the conductive paste prepared above is screen-printed onto the raw film prepared above, thereby forming a pattern of the internal conductor.

[0136] (4) Lamination, pressing and monolithization

[0137] The raw sheets obtained above are stacked in a prescribed order and then hot-pressed to produce a laminated block. The resulting laminated block is cut into individual sheets using a cutting machine or similar device to obtain uncalcined unit bodies.

[0138] (5) Calcination

[0139] The uncalcined unit body obtained above is calcined to obtain the unit body of the electronic component.

[0140] The calcination temperature is preferably 850℃~950℃, and more preferably 900℃~920℃.

[0141] The calcination time can preferably be 1 hour to 6 hours, more preferably 2 hours to 4 hours.

[0142] After calcination, the obtained unit body and the medium can be placed into a rotating drum device for rotation, thereby forming R on the edges and corners of the unit body.

[0143] (6) Electrode formation

[0144] Forming the base electrode. The base electrode can be formed by sintering a conductive paste, such as one containing Ag and glass, applied to the end face from which the internal conductor is led out.

[0145] The thickness of the aforementioned substrate electrode can be, for example, 5 μm to 80 μm, preferably 10 μm to 70 μm, and more preferably 40 μm to 60 μm.

[0146] The sintering temperature can be, for example, 800℃~820℃.

[0147] A metal layer is formed on the substrate electrode as described above by electroplating. This film can be a single layer or multiple layers; for example, a Ni film can be formed on the substrate electrode, followed by a Sn film.

[0148] The electronic component 1 disclosed herein can be manufactured as described above.

[0149] (Implementation Method 2)

[0150] A cross-section of the electronic component of Embodiment 2 is shown. Figure 7 . Figure 7 The cross-sectional view and the embodiment 1 Figure 4 The corresponding cross-sectional view.

[0151] like Figure 7 As shown, the electronic component of this embodiment 2 includes non-magnetic layers 31 and 32 in the insulating portion 7. Other configurations are the same as those of the electronic component 1 of embodiment 1 described above. The electronic component of this embodiment exhibits excellent DC overlap characteristics due to the presence of non-magnetic layers.

[0152] A non-magnetic layer 31 is disposed between internal conductors 3d and 3c in contact with internal conductor 3d. Similarly, a non-magnetic layer 32 is disposed between internal conductors 3b and 3a in contact with internal conductor 3b.

[0153] It should be noted that the location of the non-magnetic layer is not limited to the above-described cases. For example, in one embodiment, it can be as follows: Figure 8 The ground shown is isolated from the internal conductors and is positioned between internal conductors 3d and 3c and between internal conductors 3b and 3a.

[0154] In another approach, the non-magnetic layer can be disposed only in the central portion of the stacking direction of the inner conductors, i.e., between the inner conductors 3c and 3b.

[0155] In another approach, a non-magnetic layer can be disposed between all the internal conductors.

[0156] The aforementioned non-magnetic layer contains at least Fe, Cu, and Zn.

[0157] The aforementioned non-magnetic layer is preferably composed of a sintered non-magnetic material containing at least Fe, Cu and Zn as main components.

[0158] In the above-mentioned sintered nonmagnetic materials, the Fe content, converted to Fe2O3, is preferably 40.0 mol% to 49.5 mol% (based on the total of the main components, the same applies below), and more preferably 45.0 mol% to 49.5 mol%.

[0159] In the above-mentioned sintered non-magnetic materials, the Cu content, converted to CuO, is preferably 6.0 mol% to 13.0 mol% (based on total main components, the same applies below), and more preferably 7.0 mol% to 10.0 mol%.

[0160] In the above-mentioned sintered non-magnetic materials, the Zn content is not particularly limited and can be used as the balance of the other main components, namely Fe and Cu. Converted to ZnO, it is preferably 37.5 mol% to 54 mol% (based on the total of main components, the same below), and more preferably 40.5 mol% to 48 mol%.

[0161] Excellent electrical properties can be obtained by keeping the contents of Fe, Cu and Zn within the above range.

[0162] In this disclosure, the sintered nonmagnetic material may further contain additives. Examples of additives in the sintered nonmagnetic material include Mn, Co, Sn, Bi, and Si, but it is not limited to these. The content (amount of addition) of Mn, Co, Sn, Bi, and Si, relative to 100 parts by mass of the main components (Fe (Fe2O3 conversion), Zn (ZnO conversion), Cu (CuO conversion), and Ni (NiO conversion)), converted to Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2 respectively, is preferably 0.1 to 1 part by mass. Furthermore, the sintered nonmagnetic material may further contain impurities unavoidable in manufacturing.

[0163] The thickness of the non-magnetic layers 31 and 32 is preferably 0.01 mm to 0.4 mm, more preferably 0.03 mm to 0.30 mm, and even more preferably 0.06 mm to 0.20 mm.

[0164] The manufacturing method of the electronic component in this embodiment is the same as the manufacturing method of the electronic component 1 in Embodiment 1, except that it includes the step of setting a non-magnetic body layer.

[0165] The raw materials for non-magnetic materials contain Fe, Cu, and Zn as their main components. Typically, the main components of these raw materials are essentially oxides of Fe, Cu, and Zn (ideally Fe₂O₃, CuO, and ZnO).

[0166] As the above raw materials, Fe2O3, CuO, ZnO, and any necessary additives are weighed in a manner that forms a specified composition, and then mixed and pulverized. The resulting powder is dried and pre-calcined to obtain a pre-calcined non-magnetic powder. Preferably, the obtained pre-calcined non-magnetic powder is pulverized and micronized.

[0167] In the aforementioned pre-calcined non-magnetic powder, the Fe content, converted to Fe2O3, is preferably 40.0 mol% to 49.5 mol% (based on the total of the main components, the same applies below), and more preferably 45.0 mol% to 49.5 mol%.

[0168] In the aforementioned pre-calcined non-magnetic powder, the Cu content, converted to CuO, is preferably 6.0 mol% to 13.0 mol% (based on the total of the main components, the same applies below), and more preferably 7.0 mol% to 10.0 mol%.

[0169] In the aforementioned pre-calcined non-magnetic powder, the Zn content, converted to ZnO, is preferably 37.5 mol% to 54 mol% (based on total main components, the same applies below), and more preferably 40.5 mol% to 48 mol%.

[0170] It should be noted that the Fe content (Fe2O3 conversion), Zn content (ZnO conversion), Cu content (CuO conversion), and Ni content (NiO conversion) in the pre-calcined non-magnetic powder can be considered to have no substantial difference from the Fe content (Fe2O3 conversion), Zn content (ZnO conversion), Cu content (CuO conversion), and Ni content (NiO conversion) in the calcined sintered non-magnetic material.

[0171] Using the aforementioned pre-calcined non-magnetic powder, a green sheet is prepared in the same manner as the aforementioned magnetic layer, and then stacked at a predetermined position. Next, it is monolithized, calcined, and electrode formed in the same manner as the aforementioned magnetic layer, thereby manufacturing the electronic component of Embodiment 2.

[0172] (Implementation Method 3)

[0173] A cross-section of the electronic component of Embodiment 3 is shown. Figure 9 . Figure 9 The cross-sectional view and the embodiment 1 Figure 2 The corresponding cross-sectional view.

[0174] like Figure 9 As shown, the electronic component of this embodiment 3 is the same as the electronic component 1 of embodiment 1, except that the lead-out portion is closer to one side.

[0175] (Implementation Method 4)

[0176] A cross-section of the electronic component of Embodiment 4 is shown. Figure 10 . Figure 10 The cross-sectional view and the embodiment 1 Figure 2 The corresponding cross-sectional view.

[0177] like Figure 10 As shown, the electronic component of this embodiment 4 is the same as the electronic component 1 of embodiment 1, except that the lead-out portion is in the opposite position on the first end face side and the second cross-section side.

[0178] The above describes one embodiment of the present invention, but various modifications can be made to this embodiment.

[0179] The following examples illustrate the electronic components of this disclosure, but the present invention is not limited to the above examples.

[0180] [Example]

[0181] Example 1

[0182] The internal stress of electronic components with the following characteristics was calculated using the simulation software Femtet (registered trademark) (manufactured by Murata Software Co., Ltd.). A condition where the internal stress exceeds 215 MPa is marked as ×, and a condition where the internal stress is below 215 MPa is marked as 0, as shown in the table below.

[0183] Insulator components

[0184] Fe-Zn-Cu-Ni ferrite

[0185] • Internal conductor

[0186] Ag conductor

[0187] • Dimensions are shown in the table below. It should be noted that samples marked with * are comparative examples.

[0188] Table 1

[0189]

[0190] (i) When the number of coil conductors is 3

[0191] (x, y) lies within the region bounded by A(0.051, 1.0), B(0.051, 5.9), C(0.2, 5.9), D(0.2, 4.4), and E(0.1, 1.4). Figure 11 When (as shown), the internal stress is below 215 MPa.

[0192] (ii) When the number of coil conductors is 4

[0193] (x, y) lies in the region enclosed by F(0.038, 0.26), G(0.038, 5.2), H(0.2, 5.2), I(0.2, 4.9), and J(0.1, 1.9). Figure 12 When (as shown), the internal stress is below 215 MPa.

[0194] (iii) When the number of coil conductors is 5

[0195] (x, y) lies within the region bounded by K(0.031, 0.53), L(0.031, 4.9), M(0.15, 4.9), and N(0.15, 4.1). Figure 13 When (as shown), the internal stress is below 215 MPa.

[0196] When (x, y) is located below the aforementioned region, the internal stress exceeds 215 MPa, increasing the risk of cracking. Conversely, when (x, y) is above the aforementioned region, the distance between the internal conductor and the surface of the insulator is less than 250 μm, reducing the strength of the electronic component.

[0197] Example 2

[0198] Preparation of magnetic materials

[0199] A mixture was prepared by combining Fe₂O₃ (48.0 mol%), ZnO (21.0 mol%), CuO (8.0 mol%), and NiO (23.0 mol%). This mixture was then wet-mixed, pulverized, and dried to remove moisture. The dried product was pre-calcined at 800°C for 2 hours to obtain the magnetic material.

[0200] Preparation of nonmagnetic materials

[0201] A mixture was prepared by combining Fe₂O₃ (48.0 mol%), ZnO (44.0 mol%), and CuO (8.0 mol%). This mixture was then wet-mixed, pulverized, and dried to remove moisture. The resulting dried material was pre-calcined at 800°C for 2 hours to obtain a non-magnetic material.

[0202] Preparation of conductive paste

[0203] A conductive paste is prepared by mixing Ag powder with a specified amount of solvent, resin and dispersant using a planetary mixer and then dispersing it using a three-roll mill.

[0204] Production of raw film

[0205] The obtained magnetic and non-magnetic materials were respectively mixed with specified amounts of organic binders such as polyvinyl butyral, organic solvents such as ethanol and toluene, and plasticizers in a ball mill. Next, the mixture was formed into a sheet with a film thickness of approximately 25 μm using a doctor blade method, and then punched into rectangles to produce magnetic and non-magnetic green sheets. Furthermore, the aforementioned conductive paste was screen-printed onto the green sheets, thereby forming a pattern of internal conductors.

[0206] • Manufacturing of electronic components

[0207] The raw sheets obtained above are stacked into layers. Figures 1-4 The shape (sample number 42) and Figure 7 The shape (sample number 43) was hot-pressed to produce a laminated block. The resulting laminated block was cut and single-pieced using a cutting machine to obtain uncalcined unit bodies.

[0208] The uncalcined unit body obtained above is calcined at a maximum temperature of 920°C for 4 hours to obtain the unit body of the electronic component. The obtained unit body and the dielectric are placed in a rotating drum device and rotated, thereby forming R on the edges and corners of the unit body.

[0209] A conductive paste containing Ag and glass was coated on the end face of the unit obtained above, and sintered at 820°C to form a base electrode, resulting in electronic components with sample number 42 (without non-magnetic layer) and sample number 43 (with non-magnetic layer).

[0210] The manufactured electronic spare part has four internal conductors, each with a thickness of 0.06 mm and a width of 1.0 mm. The distance between the internal conductors is 0.11 mm. The dimensions of the electronic component made from the internal conductors are: length (L) 3.2 mm, width (W) 2.5 mm, and height (T) 2.0 mm.

[0211] (evaluate)

[0212] A direct current of less than 20A was applied to the obtained samples 42 and 43, and the impedance was measured. The results are shown below. Figure 14 .according to Figure 14 The results show that by configuring a non-magnetic layer between the internal conductors, the impedance reduction when there is no overlapping current can be reduced, and the impedance reduction when there is overlapping DC current can be suppressed.

[0213] Industrial availability

[0214] The electronic components disclosed herein can be used for a variety of purposes, such as as impedance elements or inductors.

Claims

1. An electronic component, comprising: An insulator composed of multiple layers of insulation. Multiple strip-shaped internal conductors embedded in the insulator portion, and A first external electrode and a second external electrode are configured to face the outer surface of the insulator portion and be electrically connected to the internal conductor; The internal conductors consist of 3 to 5 layers, which are stacked together by the insulating layer. The total cross-sectional area of ​​the plurality of internal conductors is 0.1 mm. 2 ~0.5mm 2 , The coefficient of linear expansion of the insulator portion is less than the coefficient of linear expansion of the internal conductor. When the thickness of the inner conductor is set to t1, the width of the inner conductor's line portion is set to w4, the distance between the inner conductors is set to t2, t1 / w4 is set to x, and t2 / t1 is set to y, (i) When the number of internal conductors is 3: (x, y) is in the region enclosed by A(0.051, 1.0), B(0.051, 5.9), C(0.2, 5.9), D(0.2, 4.4), and E(0.1, 1.4). (ii) When the number of internal conductors is 4: (x, y) in the region enclosed by F(0.038, 0.26), G(0.038, 5.2), H(0.2, 5.2), I(0.2, 4.9), J(0.1, 1.9), (iii) When the number of internal conductors is 5: (x, y) is in the region enclosed by K (0.031, 0.53), L (0.031, 4.9), M (0.15, 4.9), N (0.15, 4.1).

2. The electronic component according to claim 1, wherein, The inner conductor has a wire portion and a first lead and a second lead located at both ends thereto, the width of the first lead and the second lead being 0.4 to 1.0 the width of the insulator portion.

3. The electronic component according to claim 1 or 2, wherein, The height of the insulating part is 1.8mm to 2.2mm, and the width of the insulating part is 2.3mm to 2.7mm.

4. The electronic component according to claim 1 or 2, wherein, The insulating layer includes a magnetic layer containing 40 mol% to 49.5 mol% Fe (calculated as Fe2O3), 2 mol% to 35 mol% Zn (calculated as ZnO), 6 mol% to 13 mol% Cu (calculated as CuO), and 10 mol% to 45 mol% Ni (calculated as NiO).

5. The electronic component according to claim 3, wherein, The insulating layer includes a magnetic layer containing 40 mol% to 49.5 mol% Fe (calculated as Fe2O3), 2 mol% to 35 mol% Zn (calculated as ZnO), 6 mol% to 13 mol% Cu (calculated as CuO), and 10 mol% to 45 mol% Ni (calculated as NiO).

6. The electronic component according to claim 1 or 2, wherein, The insulating layer comprises a non-magnetic layer.

7. The electronic component according to claim 3, wherein, The insulating layer comprises a non-magnetic layer.

8. The electronic component according to claim 4, wherein, The insulating layer comprises a non-magnetic layer.

9. The electronic component according to claim 5, wherein, The insulating layer comprises a non-magnetic layer.

10. The electronic component according to claim 6, wherein, The non-magnetic layer contains 40 mol% to 49.5 mol% Fe (calculated as Fe2O3), 6 mol% to 13 mol% Cu (calculated as CuO), and 37.5 mol% to 54 mol% Zn (calculated as ZnO).

11. The electronic component according to claim 7, wherein, The non-magnetic layer contains 40 mol% to 49.5 mol% Fe (calculated as Fe2O3), 6 mol% to 13 mol% Cu (calculated as CuO), and 37.5 mol% to 54 mol% Zn (calculated as ZnO).

12. The electronic component according to claim 8, wherein, The non-magnetic layer contains 40 mol% to 49.5 mol% Fe (calculated as Fe2O3), 6 mol% to 13 mol% Cu (calculated as CuO), and 37.5 mol% to 54 mol% Zn (calculated as ZnO).

13. The electronic component according to claim 9, wherein, The non-magnetic layer contains 40 mol% to 49.5 mol% Fe (calculated as Fe2O3), 6 mol% to 13 mol% Cu (calculated as CuO), and 37.5 mol% to 54 mol% Zn (calculated as ZnO).

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