Substrate processing apparatus, apparatus start-up method, semiconductor device manufacturing method, and recording medium

Abstract

Provided is a substrate processing apparatus, an apparatus start method, a semiconductor device manufacturing method, and a recording medium, capable of preventing erroneous operation at the time of setting of the substrate processing apparatus and performing efficient setting. A technology is configured to include: a processing chamber capable of processing a substrate; a main control section capable of controlling processing of the substrate; a storage section capable of storing start condition presence / absence information used in judging whether or not a start condition is implemented at the time of starting the main control section, start condition management information for managing the start condition, and a state of the start condition management information; and a start condition control section capable of setting the start condition presence / absence information as valid when the start condition management information satisfies a prescribed condition.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus, an apparatus start-up method, a semiconductor device manufacturing method, and a recording medium. Background Technology

[0002] As a substrate processing apparatus used in the manufacturing process of semiconductor devices, a method is disclosed, for example, in which, when communication begins between the substrate processing apparatus and a management device that connects and manages multiple substrate processing apparatuses based on the SEMI standard, password-based authentication is performed when connecting to a management device that is not recognized in the substrate processing apparatus (see, for example, Patent Document 1). By performing password-based authentication when connecting to the management device, management of the substrate processing apparatus can be achieved.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. WO2016 / 098887 Summary of the Invention

[0006] However, when connecting the substrate processing device to a new management device, there are concerns that the settings of the substrate processing device may not be compatible with the new management device. In addition, it is conceivable that inexperienced operators may make mistakes that could lead to inefficient setup of the substrate processing device.

[0007] The purpose of this invention is to provide a technique that prevents inexperienced operators from making mistakes when connecting a substrate processing apparatus to a new management device, and enables efficient implementation of substrate processing apparatus setup.

[0008] According to one aspect of the present invention, a technology is provided, comprising:

[0009] The processing chamber is capable of processing the substrate;

[0010] The main control unit is capable of controlling the processing of the aforementioned substrate;

[0011] The storage unit is capable of storing information on whether the start-up conditions are implemented, used in determining whether the start-up conditions are implemented when the main control unit starts; start-up condition management information for managing the start-up conditions; and the status of the start-up condition management information.

[0012] The starting condition control unit is capable of setting the start condition implementation information to valid when the start condition management information meets the specified conditions.

[0013] Invention Effects

[0014] According to the technology of the present invention, efficient setup can be achieved by preventing erroneous operation during the setup of the substrate processing apparatus. Attached Figure Description

[0015] Figure 1 This is a schematic structural diagram of a substrate processing apparatus including one embodiment of the present invention.

[0016] Figure 2 This is a perspective view of a substrate processing apparatus according to one embodiment of the present invention.

[0017] Figure 3 This is a side perspective view of a substrate processing apparatus according to one embodiment of the present invention.

[0018] Figure 4 This is a longitudinal sectional view of the processing furnace of a substrate processing apparatus according to one embodiment of the present invention.

[0019] Figure 5 This is a structural block diagram of the main control unit of a substrate processing apparatus according to one embodiment of the present invention.

[0020] Figure 6 This is an explanatory diagram illustrating each step of the start-up condition implementation confirmation process of one embodiment of the present invention.

[0021] Figure 7 This is a flowchart of the start-up condition implementation confirmation process according to one embodiment of the present invention.

[0022] Figure 8 This is a flowchart of the time verification process according to one embodiment of the present invention.

[0023] Figure 9 This is a flowchart of the password verification process according to one embodiment of the present invention.

[0024] Figure 10 This is a flowchart of the main control unit operation and shutdown process according to one embodiment of the present invention.

[0025] Figure 11 This is an explanatory diagram illustrating each step of the start condition implementation confirmation information setting process according to one embodiment of the present invention.

[0026] Figure 12 This is a flowchart of the operation stop count confirmation process according to one embodiment of the present invention.

[0027] Figure 13 This is a flowchart of the management device connection confirmation process according to one embodiment of the present invention.

[0028] Explanation of reference numerals in the attached figures

[0029] 100: Substrate processing apparatus

[0030] 200: Substrate

[0031] 240: Controller for substrate processing apparatus (main control unit)

[0032] 600: Management Device Detailed Implementation

[0033] The embodiments of the present invention will be described below.

[0034] <First Implementation>

[0035] First, the first embodiment of the present invention will be described with reference to the accompanying drawings.

[0036] Structure of a system including a substrate processing device

[0037] use Figure 1 The structure of a system comprising a substrate processing apparatus according to one embodiment of the present invention will be described. Figure 1 This is a schematic structural diagram of a system including a substrate processing apparatus according to one embodiment of the present invention.

[0038] like Figure 1 As shown, the system includes at least one substrate processing apparatus 100 and a management device 600 connected in a manner capable of controlling the substrate of the substrate processing apparatus 100. The substrate processing apparatus 100 is configured to perform a processing process based on a recipe that defines processing steps and processing conditions. The substrate processing apparatus 100 and the management device 600 are connected via a network 400, such as a local area network (LAN) or a wide area network (WAN).

[0039] (2) Structure of the substrate processing device

[0040] Next, refer to Figure 2 , Figure 3 The structure of the substrate processing apparatus 100 of this embodiment will be explained. Figure 2 This is a perspective view of a substrate processing apparatus according to one embodiment of the present invention. Figure 3 This is a side perspective view of a substrate processing apparatus according to one embodiment of the present invention. It should be noted that the substrate processing apparatus 100 of this embodiment is configured as a vertical apparatus for performing oxidation, diffusion processing, CVD processing, etc., on substrates such as wafers.

[0041] like Figure 2 , Figure 3As shown, the substrate processing apparatus 100 of this embodiment includes a housing 111 configured as a pressure-resistant container. A front maintenance opening 103, which is provided as an opening for maintenance, is provided on the front front wall 111a of the housing 111. A pair of front maintenance doors 104 are provided at the front maintenance opening 103 as an entry mechanism for opening and closing the front maintenance opening 103. A wafer cassette (substrate receiving container) 110, which houses wafers (substrates) 200 such as silicon, is used as a carrier for transporting the wafers 200 inside and outside the housing 111.

[0042] A wafer cassette loading / unloading outlet (substrate receiving container loading / unloading outlet) 112 is provided on the front wall 111a of the housing 111 to allow communication between the inside and outside of the housing 111. The wafer cassette loading / unloading outlet 112 is opened and closed by a front gate (substrate receiving container loading / unloading outlet opening / closing mechanism) 113. A loading port (substrate receiving container transfer station) 114 is provided as a placement part on the front side of the wafer cassette loading / unloading outlet 112. The wafer cassette 110 is configured to be placed on the loading port 114 and aligned. The wafer cassette 110 is configured to be moved onto the loading port 114 by an in-process transport device (not shown) such as an OHT (Overhead Hoist Transport).

[0043] A rotary wafer cassette holder (substrate receiving container holder) 105 is provided at the upper part of approximately the center in the front-rear direction within the housing 111. It is configured to store multiple wafer cassettes 110 on the rotary wafer cassette holder 105. The rotary wafer cassette holder 105 includes: a vertically erected support column 116 that rotates intermittently in the horizontal plane; and multiple shelf plates (substrate receiving container holders) 117 radially supported on the support column 116 at various positions in the upper, middle, and lower layers. The multiple shelf plates 117 are configured to hold the multiple wafer cassettes 110 in a state where each wafer cassette 110 is respectively placed on it.

[0044] A wafer cassette transport device (substrate receiving container transport device) 118 is provided between the loading port 114 and the rotary wafer cassette holder 105 within the housing 111. The wafer cassette transport device 118 consists of a wafer cassette lift (substrate receiving container lifting mechanism) 118a that can move up and down while holding the wafer cassette 110, and a wafer cassette transport mechanism (substrate receiving container transport mechanism) 118b that serves as a transport mechanism. The wafer cassette transport device 118 is configured to transport the wafer cassette 110 between the loading port 114, the rotary wafer cassette holder 105, and the wafer cassette opener (substrate receiving container cover opening and closing mechanism) 121 through the continuous operation of the wafer cassette lift 118a and the wafer cassette transport mechanism 118b.

[0045] A sub-shell 119 is provided in the lower part of the housing 111, extending from approximately the center to the rear end in the front-rear direction within the housing 111. On the front wall 119a of the sub-shell 119, a pair of wafer inlet / outlet ports (substrate inlet / outlet ports) 120 are arranged vertically in two layers for conveying the wafer 200 to and from the sub-shell 119. A wafer cassette opener 121 is provided at each of the upper and lower wafer inlet / outlet ports 120.

[0046] Each wafer cassette opener 121 includes a pair of mounting stages 122 for placing wafer cassettes 110 and a cover mounting / removing mechanism (cover mounting / removing mechanism) 123 for mounting and dismounting the cover (cover body) of the wafer cassette 110. The wafer cassette opener 121 is configured to open and close the wafer inlet / outlet of the wafer cassette 110 by mounting and dismounting the cover of the wafer cassette 110 placed on the mounting stage 122 using the cover mounting / removing mechanism 123.

[0047] A transfer chamber 124 is formed within the sub-housing 119, which is fluidly isolated from the space where the wafer cassette transport device 118 and the rotary wafer cassette holder 105 are located. A wafer transfer mechanism (substrate transfer mechanism) 125 is provided in the front region of the transfer chamber 124. The wafer transfer mechanism 125 consists of a wafer transfer device (substrate transfer device) 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction, and a wafer transfer device lift (substrate transfer device lifting mechanism) 125b capable of lifting the wafer transfer device 125a. Figure 2 As shown, the wafer transfer device elevator 125b is located between the right end of the front region of the transfer chamber 124 of the sub-housing 119 and the right end of the housing 111. The wafer transfer device 125a includes a clamp-like member (substrate holder) 125c that serves as a mounting portion for the wafer 200. The configuration allows for the continuous operation of these wafer transfer device elevators 125b and wafer transfer devices 125a to load (load) and unload (unload) the wafer 200 relative to the boat (substrate holder) 217.

[0048] In the rear region of the transfer chamber 124, a standby section 126 is formed to receive the vessel 217 and keep it in standby mode. A processing furnace 202 is provided above the standby section 126. The lower end of the processing furnace 202 is configured to be opened and closed by a furnace opening gate (furnace opening opening and closing mechanism) 147.

[0049] like Figure 2As shown, a boat lifting mechanism (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is provided between the right end of the standby section 126 of the sub-housing 119 and the right end of the housing 111. An arm 128 serving as a connecting member is connected to the lifting platform of the boat lifting mechanism 115. A sealing cover 219 serving as a cover is horizontally mounted on the arm 128. The sealing cover 219 is configured to vertically support the boat 217 and can close the lower end of the processing furnace 202.

[0050] The substrate transport system of this embodiment mainly consists of a rotary wafer cassette holder 105, a boat lift 115, a wafer cassette transport device (substrate receiving container transport device) 118, a wafer transfer mechanism (substrate transfer mechanism) 125, a boat 217, and a rotating mechanism 254 described later. These components—rotary wafer cassette holder 105, boat lift 115, wafer cassette transport device (substrate receiving container transport device) 118, wafer transfer mechanism (substrate transfer mechanism) 125, boat 217, and rotating mechanism 254—are electrically connected to a transport controller 11, which serves as a secondary controller, described later.

[0051] The boat 217 has multiple holding members. The boat 217 is configured to hold multiple wafers 200 (e.g., about 50 to 125 wafers) horizontally in a state where their centers are aligned and arranged in a vertical direction.

[0052] like Figure 2 As shown, a cleaning unit 134 is provided at the left end of the transfer chamber 124, opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side. The cleaning unit 134 consists of a supply fan and a dust filter to supply cleaned ambient gas or clean air 133 as an inactive gas. Between the wafer transfer device 125a and the cleaning unit 134, a notch alignment device (not shown) is provided as a substrate matching device to match the circumferential position of the wafer.

[0053] The clean air 133 blown out from the cleaning unit 134 is configured such that after flowing through the notch alignment device (not shown), the wafer transfer device 125a, and around the boat 217 in the standby section 126, it is drawn in by a pipe (not shown) and discharged to the outside of the housing 111, or it is circulated to the suction side (supply side) of the cleaning unit 134 and blown out again into the transfer chamber 124 by the cleaning unit 134.

[0054] Furthermore, multiple device covers (not shown) are installed on the outer periphery of the housing 111 and the sub-housing 119 as entry mechanisms for entering the substrate processing apparatus 100. During maintenance, maintenance personnel can remove these device covers to enter the substrate processing apparatus 100. Door switches 130, serving as entry sensors, are provided at the ends of the housing 111 and the sub-housing 119 opposite to these device covers. Additionally, a door switch 130, also serving as an entry sensor, is provided at the end of the housing 111 opposite to the front maintenance door 104. Furthermore, a substrate detection sensor 140 is provided on the loading port 114 to detect the placement of the wafer cassette 110. These door switches 130 and substrate detection sensors 140, and other switches and sensors 15, are electrically connected to the substrate processing apparatus controller 240 described later.

[0055] (3) Operation of the substrate processing device

[0056] Next, refer to Figure 2 , Figure 3 The operation of the substrate processing apparatus 100 in this embodiment will be explained.

[0057] like Figure 2 , Figure 3 As shown, if the wafer cassette 110 is supplied to the loading port 114 via an in-process conveying device (not shown), the wafer cassette 110 is detected by the substrate detection sensor 140, and the wafer cassette inlet / outlet 112 is opened through the front gate 113. Then, the wafer cassette 110 on the loading port 114 is moved from the wafer cassette inlet / outlet 112 into the housing 111 by the wafer cassette conveying device 118.

[0058] The wafer cassette 110, once inside the housing 111, is automatically transferred via the wafer cassette transfer device 118 to the rack 117 of the rotating wafer cassette rack 105 and temporarily stored. Afterward, the wafer cassette 110 is transferred from the rack 117 to the mounting stage 122 of one of the wafer cassette openers 121. Alternatively, the wafer cassette 110 can also be directly transferred from the housing 111 to the mounting stage 122 of the wafer cassette opener 121 via the wafer cassette transfer device 118. At this time, the wafer inlet / outlet 120 of the wafer cassette opener 121 is closed by the cover removal mechanism 123, and clean air 133 flows into and fills the transfer chamber 124. For example, by filling the transfer chamber 124 with nitrogen as clean air 133, the oxygen concentration in the transfer chamber 124 becomes, for example, below 20 ppm, which is set much lower than the oxygen concentration in the shell 111, which serves as the atmospheric environment.

[0059] The open end face of the wafer cassette 110, placed on the stage 122, is pressed against the edge of the wafer loading / unloading outlet 120 on the front wall 119a of the sub-cassette 119, and the cover of the wafer cassette 110 is removed by the cover removal mechanism 123, opening the wafer loading / unloading inlet and outlet. Then, the wafer 200 is picked up from the wafer cassette 110 by the clamping member 125c of the wafer transfer device 125a, passing through the wafer loading / unloading inlet and outlet. After being aligned by the notch alignment device, it is moved into the standby section 126 located behind the transfer chamber 124 and loaded into the carrier 217. After loading the wafer 200 into the carrier 217, the wafer transfer device 125a returns to the wafer cassette 110 to load the next wafer 200 into the carrier 217.

[0060] During the operation of loading wafers 200 into the boat 217 by the wafer transfer mechanism 125 in the wafer cassette opener 121 of one side (upper or lower layer), another wafer cassette 110 is transferred from the rotary wafer cassette rack 105 to the platform 122 of the wafer cassette opener 121 of the other side (lower or upper layer) by the wafer cassette transfer device 118, and the opening operation of the wafer cassette 110 based on the wafer cassette opener 121 is carried out at the same time.

[0061] If a predetermined number of wafers 200 are loaded into the boat 217, the lower end of the processing furnace 202, which is closed by the furnace gate 147, is opened by the furnace gate 147. Then, the boat 217 holding the wafer group is moved (loaded) into the processing furnace 202 by raising the sealing cover 219 using the boat lift 115.

[0062] After loading, the wafer 200 is subjected to arbitrary processing in the processing furnace 202. After processing, except for the wafer matching process performed using the notch alignment device 135, the boat 217 containing the processed wafer 200 is removed from the processing chamber 201 in a process that is roughly the reverse of the above steps, and the wafer cassette 110 containing the processed wafer 200 is removed from the housing 111.

[0063] (4) Processing furnace structure

[0064] Next, use Figure 4 The structure of the processing furnace 202 in this embodiment will be explained. Figure 4 This is a longitudinal sectional view of the processing furnace 202 of a substrate processing apparatus 100 according to one embodiment of the present invention.

[0065] like Figure 4As shown, the processing furnace 202 includes a process tube 203 serving as a reaction tube. The process tube 203 includes an inner tube 204 serving as an internal reaction tube and an outer tube 205 located outside the inner tube 204 serving as an external reaction tube. The inner tube 204 is made of a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC). The inner tube 204 is formed into a cylindrical shape with openings at both the upper and lower ends. A processing chamber 201 for processing a wafer 200 serving as a substrate is formed in the hollow portion of the inner tube 204. The processing chamber 201 is configured to accommodate a boat 217, described later. The outer tube 205 is arranged concentrically with the inner tube 204. The outer tube 205 is formed into a cylindrical shape with an inner diameter larger than the outer diameter of the inner tube 204, closed at the upper end and open at the lower end. The outer tube 205 is made of a heat-resistant material such as quartz or silicon carbide.

[0066] A heater 206, serving as a heating mechanism, is provided on the outside of the process tube 203, surrounding the side wall of the process tube 203. The heater 206 is cylindrical in shape. The heater 206 is vertically mounted by means of a heater base 251, which serves as a retaining plate.

[0067] Below the outer tube 205, a manifold 209 is arranged concentrically with the outer tube 205. The manifold 209 is made of, for example, stainless steel. The manifold 209 is formed into a cylindrical shape with open upper and lower ends. The manifold 209 engages with the lower end of the inner tube 204 and the lower end of the outer tube 205, respectively. The manifold 209 is configured to support the lower ends of the inner tube 204 and the lower ends of the outer tube 205. In addition, an O-ring 220a is provided between the manifold 209 and the outer tube 205 as a sealing member. By supporting the manifold 209 on the heater base 251, the process tube 203 is vertically mounted. The process tube 203 and the manifold 209 form a reaction vessel.

[0068] On the sealing cover 219 (described later), a processing gas nozzle 230a and a purge gas nozzle 230b, serving as gas inlet sections, are connected in a manner communicating with the interior of the processing chamber 201. A processing gas supply pipe 232a is connected to the processing gas nozzle 230a. Upstream of the processing gas supply pipe 232a (opposite to the side connected to the processing gas nozzle 230a), a processing gas supply source (not shown) is connected via an MFC (mass flow controller) 241a, which functions as a gas flow controller. Similarly, a purge gas supply pipe 232b is connected to the purge gas nozzle 230b. Upstream of the purge gas supply pipe 232b (opposite to the side connected to the purge gas nozzle 230b), a purge gas supply source (not shown) is connected via an MFC (mass flow controller) 241b, which functions as a gas flow controller.

[0069] The processing gas supply system of this embodiment mainly consists of a processing gas supply source (not shown), MFC241a, processing gas supply pipe 232a, and processing gas nozzle 230a. The purge gas supply system of this embodiment mainly consists of a purge gas supply source (not shown), MFC241b, purge gas supply pipe 232b, and purge gas nozzle 230b. The gas supply system of this embodiment mainly consists of the processing gas supply system and the purge gas supply system. MFC241a and 241b are electrically connected to the gas supply controller 14, which serves as a secondary controller and will be described later.

[0070] The manifold 209 is provided with an exhaust pipe 231 for exhausting the ambient gas in the processing chamber 201. The exhaust pipe 231 is disposed at the lower end of the cylindrical space 250 formed by the gap between the inner pipe 204 and the outer pipe 205. The exhaust pipe 231 communicates with the cylindrical space 250. On the downstream side of the exhaust pipe 231 (opposite to the side connected to the manifold 209), a pressure sensor 245 as a pressure detector, a pressure adjustment device 242 configured as an APC (Auto Pressure Controller), and a vacuum exhaust device 246 such as a vacuum pump are sequentially connected from the upstream side. The gas exhaust system of this embodiment is mainly composed of the exhaust pipe 231, the pressure sensor 245, and the pressure adjustment device 242. The pressure adjustment device 242 and the pressure sensor 245 are electrically connected to the pressure controller 13, which is described later as a sub-controller. Alternatively, the vacuum exhaust device 246 may be included in the gas exhaust system.

[0071] Below the manifold 209, a sealing cap 219, serving as a furnace opening cover, is provided to airtightly seal the lower opening of the manifold 209. The sealing cap 219 abuts against the lower end of the manifold 209 from the lower vertical direction. The sealing cap 219 is made of a metal such as stainless steel. The sealing cap 219 is formed in a disc shape. An O-ring 220b, serving as a sealing member, is provided on the upper surface of the sealing cap 219, abutting against the lower end of the manifold 209.

[0072] Near the center of the sealing cap 219 and on the side opposite to the processing chamber 201, a rotation mechanism 254 for rotating the boat is provided. The rotation shaft 255 of the rotation mechanism 254 passes through the sealing cap 219 and supports the boat 217 from below. The rotation mechanism 254 is configured to rotate the wafer 200 by rotating the boat 217.

[0073] The sealing cap 219 is configured to move vertically upwards and downwards via a boat lift 115, which serves as a substrate holder lifting mechanism and is vertically mounted outside the process tube 203. This configuration allows the boat 217 to be moved in and out of the processing chamber 201 by raising and lowering the sealing cap 219. The rotating mechanism 254 and the boat lift 115 are electrically connected to a transfer controller 11, described later as a secondary controller.

[0074] As described above, the boat 217, serving as a substrate holder, is configured to hold multiple wafers 200 in a horizontal orientation with their centers aligned, and is arranged in multiple layers. The boat 217 is made of a heat-resistant material such as quartz or silicon carbide. At the bottom of the boat 217, multiple heat-insulating plates 216, serving as heat-insulating components, are arranged in a horizontal orientation and in multiple layers. The heat-insulating plates 216 are formed in a circular plate shape. The heat-insulating plates 216 are made of a heat-resistant material such as quartz or silicon carbide. The heat-insulating plates 216 are configured to make it difficult for heat from the heater 206 to be transferred to the manifold 209 side.

[0075] A temperature sensor 263, serving as a temperature detector, is installed inside the process tube 203. The heating mechanism of this embodiment mainly consists of the heater 206 and the temperature sensor 263. These heaters 206 and temperature sensors 263 are electrically connected to the temperature controller 12, which serves as a secondary controller and will be described later.

[0076] The substrate processing system of this embodiment mainly consists of a gas exhaust system, a gas supply system, and a heating mechanism.

[0077] (5) Operation of the processing furnace

[0078] Next, as a step in the manufacturing process of semiconductor devices, refer to... Figure 4 The method for forming a thin film on a wafer 200 using a processing furnace 202 with the above-described structure will be explained. It should be noted that, in the following description, the operation of each part constituting the substrate processing apparatus 100 is controlled by the substrate processing apparatus controller 240.

[0079] If multiple wafers 200 are loaded into the boat 217 (wafer loading), then as Figure 4 As shown, a boat 217 holding multiple wafers 200 is lifted by a boat lift 115 and moved into the processing chamber 201 (boat loading). In this state, the sealing cap 219 seals the lower end of the manifold 209 via an O-ring 220b.

[0080] Vacuum exhaust is performed by vacuum exhaust device 246 to bring the processing chamber 201 to the desired pressure (vacuum level). At this time, the opening of the valve in pressure adjustment device 242 is controlled by feedback based on the pressure value measured by pressure sensor 245. Additionally, heating is performed by heater 206 to bring the processing chamber 201 to the desired temperature. At this time, the power supply to heater 206 is controlled by feedback based on the temperature value detected by temperature sensor 263. Next, the boat 217 and wafer 200 are rotated by rotation mechanism 254.

[0081] Next, the process gas supplied from the process gas supply source and controlled to the desired flow rate via MFC241a flows through the gas supply pipe 232a and is introduced into the process chamber 201 through the process gas nozzle 230a. The introduced process gas rises within the process chamber 201, flows out from the upper opening of the inner pipe 204 into the cylindrical space 250, and is discharged through the exhaust pipe 231. As the gas passes through the process chamber 201, it comes into contact with the surface of the wafer 200, where a thin film is deposited on the surface of the wafer 200 through a thermal CVD reaction.

[0082] If the preset processing time has elapsed, purge gas supplied from the purge gas supply source and controlled to the desired flow rate by MFC241b is supplied into the processing chamber 201, where it is replaced with an inactive gas, and the pressure in the processing chamber 201 returns to atmospheric pressure.

[0083] Next, the sealing cover 219 is lowered by the boat lift 115, opening the lower end of the manifold 209, and the boat 217 holding the processed wafer 200 is moved from the lower end of the manifold 209 to the outside of the process tube 203 (boat unloading). Then, the processed wafer 200 is removed from the boat 217 and stored in the wafer cassette 110 (wafer unloading).

[0084] (6) Structure of the controller for the substrate processing device (main control unit)

[0085] The following is for reference Figure 5 The control device (hereinafter also referred to as the main control unit) 240, which is a controller for a substrate processing apparatus, will be described.

[0086] The main control unit 240 mainly consists of the following parts: a CPU (Central Processing Unit) 25 serving as an arithmetic control unit; a processing control unit 20 that controls the processing controller; a transport control unit 27 that controls the transport controller 11; a transceiver module 42 that communicates with the management device 600; a storage unit 28 consisting of RAM, ROM, or HDD; an input unit 29 such as a mouse and keyboard, and a display unit 31 such as a monitor; a start-up condition control unit 40 that controls the start-up condition implementation information 72 used in determining whether start-up conditions are implemented when starting the main control unit 240 is started; a password calculation unit 41 that calculates the password when the start-up condition control unit 40 determines that password authentication is required; and a counting unit 43 that counts the number of times the main control unit 240 stops operating and the number of times the password is entered incorrectly. In addition, the operation unit, consisting of CPU 25, storage unit 28, input unit 29, display unit 31, start condition control unit 40, password calculation unit 41, counting unit 43 and clock function (not shown), is capable of setting various data.

[0087] The CPU 25 forms the central hub of the main control unit 240, executing control programs stored in a ROM (not shown) and following instructions from the display unit 31 to execute recipes (such as process recipes for substrate processing) stored in the storage unit 28, which also constitutes the recipe storage unit 50. The ROM, composed of EEPROM, flash memory, hard disk, etc., is a recording medium for storing the CPU 25's operating programs. The RAM functions as the CPU 25's working area (temporary storage).

[0088] Here, the substrate processing recipe defines the processing conditions and processing steps for processing the wafer 200. In addition, the recipe document sets setting values ​​(control values) and transmission timings for each step of the substrate processing, which are sent to the transport controller 11, temperature controller 12, pressure controller 13, gas supply controller 14, etc.

[0089] Furthermore, the main control unit 240 of the embodiments of the present invention does not depend on a dedicated system and can be implemented using a conventional computer system. For example, by installing various programs (floppy disk, CD-ROM, USB, external HDD, etc.) containing various programs including control programs for performing the above-described processes onto a general-purpose computer, the main control unit 240 for performing the above-described processes can be configured, for example.

[0090] Furthermore, the means by which these various programs are supplied are arbitrary. Besides being supplied via the prescribed recording medium as described above, they can also be supplied via, for example, communication lines, communication networks, or communication systems. In this case, for example, the program can be advertised on a bulletin board of a communication network and provided by overlaying it onto a carrier wave via the network. Moreover, by starting such a program and executing it under the control of the OS in the same way as other applications, the aforementioned processing can be performed.

[0091] The aforementioned processing control unit 20 has the function of controlling the temperature and pressure inside the processing furnace 201, the flow rate of the processing gas introduced into the processing furnace 201, etc., so as to perform a specified processing on the wafer 200 loaded into the processing furnace 201.

[0092] The aforementioned transport control unit 27 has the function of controlling the drive of the aforementioned wafer cassette transport device 105, the aforementioned wafer transfer mechanism 125, the aforementioned boat lift 115, and other transport mechanisms via a drive motor (not shown).

[0093] The aforementioned storage unit 28 includes a data storage area 32 for storing various types of data and a program storage area 33 for storing various programs.

[0094] Data storage area 32 stores various parameters associated with the aforementioned formula document. Additionally, it stores information such as the handover position on the mounting stage 114 (which serves as an I / O station) when the wafer cassette 110 is moved into the housing 111 and when it is moved out of the housing 111; the sequence of actions when the wafer cassette transport device 118 (which serves as a carrier loader) moves to the handover position; and the sequence of actions when the carrier loader 118 moves from the handover position. Furthermore, carrier information, including at least the carrier ID for identifying each wafer cassette 110 and information about the type of wafer 200 within the wafer cassette 110, is stored in the data storage area 32.

[0095] In addition, in this embodiment, the threshold information of elapsed time (also known as the first threshold information) 60, the threshold information of the number of password mismatches (also known as the second threshold information) 61, and the threshold information of the number of times the main control unit 240 has stopped operation (also known as the third threshold information) 62, which is one of the setting conditions for whether the start condition implementation information 72 is implemented, are stored in the data storage area 32.

[0096] In addition, in this embodiment, the data storage area 32 stores start-up condition management information 52 as information related to the start-up of the main control unit 240. The start-up condition management information 52 stores the management device connection status 70, which stores the connection status with the management device 600; the number of operation stop times 71, which records the number of operation stop times of the main control unit 240; the start-up condition implementation information 72, which is used as authentication information when starting the main control unit 240; and the operation stop information 73, which has the date and time of the previous operation stop of the main control unit 240.

[0097] Furthermore, in this embodiment, the storage unit 28 can temporarily store the calculated password by the password calculation unit, and the number of password mismatches counted when password authentication is required during the startup of the main control unit 240. The counting of the number of password mismatches is performed by the counting unit.

[0098] In the program storage area 33, in addition to the substrate processing formulas mentioned above, various programs required for loading and unloading the wafer cassette 110 are stored, as well as formulas for cleaning the furnace interior in a substrate-free state. Furthermore, it is configured to store, for example, software programs for performing authentication checks during the startup of the main control unit (described later). Additionally, it is configured to store, as described later, software programs for calculating passwords when password authentication is required during the startup of the main control unit.

[0099] A touch panel is provided on the display unit 31 of the main control unit 240. The touch panel is configured to display an operation screen that accepts input of operation commands to the aforementioned substrate transport system and substrate processing system. Such an operation screen has various display bars and operation buttons for checking the status of the substrate transport system and substrate processing system or for inputting action instructions to the substrate transport system and substrate processing system. In addition, the operation unit can be any structure that includes at least a display unit 31 and an input unit 29, such as an operating terminal (terminal device) like a personal computer or mobile phone.

[0100] The transfer controller 11 is configured to control the transfer operations of the rotary wafer cassette 105, the boat lift 115, the wafer cassette transfer device (substrate receiving container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the rotation mechanism 254 constituting the substrate transfer system. Furthermore, although not shown, sensors are built into each of the rotary wafer cassette 105, the boat lift 115, the wafer cassette transfer device (substrate receiving container transfer device) 118, the wafer transfer mechanism (substrate transfer mechanism) 125, the boat 217, and the rotation mechanism 254 constituting the substrate transfer system. The transfer controller 11 is configured to notify the main control unit 240 when these sensors indicate predetermined or abnormal values.

[0101] The pressure controller 13 is configured to control the pressure adjustment device 242 based on the pressure value detected by the pressure sensor 245 so that the pressure in the processing chamber 201 becomes the desired pressure at the desired time, and to notify the main control unit 240 of its purpose when the pressure sensor 245 shows a specified value or an abnormal value.

[0102] The gas supply controller 14 is configured to control the supply and stop of gas from the processing gas supply pipe 232a and the purge gas supply pipe 232b by opening and closing gas valves (not shown). Furthermore, the gas supply controller 14 is configured to control MFCs 241a and 241b to ensure that the flow rate of gas supplied to the processing chamber 201 is the desired flow rate at a desired time. The gas supply controller 14 is configured to notify the main control unit 240 when a sensor (not shown) on the gas valve (not shown) or on the MFCs 241a and 241b indicates a predetermined value or an abnormal value.

[0103] (Preferred embodiments of the present invention)

[0104] Next, use Figure 6 , Figure 7 , Figure 8 and Figure 9 The implementation methods related to determining the start-up conditions of the main control unit will be described, and furthermore, the following will be used. Figure 10The implementation methods related to the operation and shutdown of the main control unit 240 will be described, and additionally, the use of Figure 11 , Figure 12 and Figure 13 The implementation methods related to the setting of whether or not the start-up condition implementation information 72 is present will be described.

[0105] Figure 6 The operation of implementing the start-up conditions when starting the main control unit is shown, which consists of, for example, the following steps: a start-up condition implementation confirmation step (S100) to determine whether the implementation of the start-up conditions is required; an elapsed time confirmation step (S110) to confirm the elapsed time since the most recent operation stop time of the main control unit 240 if the start-up condition implementation confirmation step (S100) determines that the implementation of the start-up conditions is required; and a password confirmation step (S120) to be implemented if authentication based on password input is required.

[0106] Startup condition implementation confirmation procedure (S100)

[0107] Next, the start-up condition implementation confirmation process S100 will be explained. In the start-up condition implementation confirmation process S100, if the main control unit 240 starts, the CPU 25 sends an instruction to the start-up condition control unit 40 to confirm the start-up condition implementation. The start-up condition control unit 40 follows the instruction from the CPU 25 to confirm the start-up condition implementation. Figure 7 The start condition confirmation operation is shown. The start condition control unit 40 acquires the setting status of the start condition implementation information 72 stored in the data storage area 32 of the storage unit 28 (S1000), and confirms whether the acquired start condition implementation information 72 exists (S1010). If the start condition implementation information 72 is set to be valid, it is confirmed that the implementation of the start condition is required (S1020). If the start condition implementation information 72 is set to be invalid, it is confirmed that the implementation of the start condition is not required (S1030). The confirmation result is returned to the CPU 25 as the start condition confirmation result.

[0108] If the CPU25 determines that the start-up condition needs to be implemented based on the confirmation result from the start-up condition control unit 40, it instructs the start-up condition control unit 40 to confirm the time elapsed.

[0109] In addition, if the CPU25 determines that the start-up condition does not need to be implemented based on the start-up condition confirmation result from the start-up condition control unit 40, it may continue to start the main control unit 240 without performing the subsequent elapsed time confirmation process (S110) and password confirmation process (S120).

[0110] After time confirmation process (S110)

[0111] Next, the elapsed time verification process S110 will be explained. The start-up condition control unit 40 performs the elapsed time verification according to the instruction from the CPU 25. Figure 8 The time elapsed confirmation action is shown. The start condition control unit 40 obtains the operation stop information 72 stored in the data storage area 32 of the storage unit 25 (S1100), and further obtains the start information of the main control unit 240 from the clock function of the main control unit (S1110). Based on the operation stop information 72 and the start information, the elapsed time since the last operation stop is calculated (S1120).

[0112] Next, the start-up condition control unit 40 obtains the first threshold stored in the parameter storage unit 51 of the storage unit 25 and compares it with the elapsed time calculated in (S1120) (S1130). If the result of the comparison in (S1130) is that the elapsed time calculated in (S1120) is equal to or greater than the first threshold 60, it is confirmed that password authentication is required (S1140). If it is determined that the elapsed time calculated in (S1120) is less than the first threshold 60, it is confirmed that password authentication is not required (S1150). The confirmation result is returned to the CPU 25 as the confirmation result of the elapsed time.

[0113] If the CPU25 determines that password authentication is required based on the elapsed time confirmation result from the start-up condition control unit 40, it instructs the start-up condition control unit 40 to perform password authentication.

[0114] In addition, if the CPU25 determines that no password authentication is required based on the confirmation result from the startup condition control unit 40, it may skip the next password confirmation process (S120) and continue to start the main control unit 240.

[0115] If the CPU 25 determines that password authentication is required based on the elapsed time confirmation result from the startup condition control unit 40, it instructs the password calculation unit 41 to perform password calculation. If the password calculation unit 41 accepts the password calculation instruction from the CPU 25, it calculates a password that is only valid for the current day and stores it as the calculated password 82 in the data storage area of ​​the storage unit 28.

[0116] The calculated password 82 is valid as long as it is valid during the password confirmation process (S120), or it can be deleted from the data storage area 32 of the storage unit 28 after the password confirmation process (S120) is completed.

[0117] If the CPU 25 determines that password authentication is required based on the elapsed time confirmation result from the start-up condition control unit 40, it instructs the input unit 29 to input a password. Additionally, it displays the password requirement on the display unit 31. If the input unit 29 accepts the password input, it returns the input password to the CPU 25 in response to the password input instruction. The CPU 25 then delivers the input password received from the input unit 29 to the start-up condition control unit 40.

[0118] Password confirmation process (S120)

[0119] Next, the password confirmation process S120 will be explained. The start-up condition control unit 40 performs the password confirmation according to the instruction from the CPU 25. Figure 9 The password confirmation action is shown. If the start condition control unit 40 obtains the input password from the CPU 25 (S1200), it obtains the calculated password 82 stored in the data storage area 32 of the storage unit 25 (S1210) and compares the input password with the calculated password 82 (S1220).

[0120] Next, if the result of (S1220) is that there is a match, the start condition control unit 40 sets the password authentication result to OK (S1250) and returns the judgment result to the CPU 25.

[0121] If the result of the start condition control unit (S1220) is that there is no match, the counting unit 43 increments the number of password mismatches 83 stored in the data storage area 32 of the storage unit 28 by 1 (S1230).

[0122] Next, the start condition control unit 40 compares the number of password mismatches 83 with the second threshold 61 stored in the parameter storage area of ​​the storage unit 28 (S1240). If it determines that the password is equal to or exceeds the second threshold 61, the password authentication result is set to NG (S1260), and the determination result is returned to the CPU 25.

[0123] The start condition control unit 40 compares the number of password mismatches 83 with the second threshold 61 stored in the parameter storage area of ​​the storage unit 28 (S1240). If it is determined that the number of password mismatches is less than the second threshold 61, the password authentication result is set to retry (S1270), and the determination result is returned to the CPU 25.

[0124] CPU25 determines the password authentication result from startup condition control unit 40. If it is OK, the startup of the main control unit continues.

[0125] CPU25 determines the password authentication result from startup condition control unit 40. If the result is NG, it instructs display unit 31 to display a startup failure message. Then, it proceeds... Figure 10 The operation of the main control unit 240 shown is stopped.

[0126] CPU25 determines the password authentication result from the start-up condition control unit 40. If it is a retry, it instructs the input unit 29 to input the password again and displays the password on the display unit 31, repeating the password confirmation process (S120).

[0127] Next, the operation stop information update process in the event that the main control unit 240 has stopped operating will be explained. In the operation stop information update process, when the CPU 25 detects that the main control unit 240 has stopped operating, it sends an operation stop notification to the start condition control unit 40, and the start condition control unit 40 then... Figure 10 The actions shown.

[0128] (S1300)

[0129] The start-up condition control unit 40 performs a start-up stop state determination (S1300) to determine whether the start-up stop state is a normal state or an abnormal state. Here, a normal state refers to a situation where the start-up stop of the main control unit 240 is performed through normal procedures, for example, and an abnormal state refers to a situation where the start-up stop is forced to terminate due to a sudden power cut-off, forced power disconnection, or failure to implement start-up conditions.

[0130] If the start-up condition control unit 40 determines that the operation is in an abnormal state during the operation stop state (S1300) judgment, it will not perform any action but will notify the main control unit 240 to continue the operation of the CPU 25 without performing any action.

[0131] (S1310)

[0132] If the operation stop state (S1300) is judged to be normal, the start condition control unit 40 obtains the operation stop date and time information of the main control unit 240 through the clock function of the main control unit 240, and saves it to the operation stop information 73 of the storage unit 28.

[0133] (S1320)

[0134] Next, the start condition control unit 40 obtains the start condition implementation information 72 stored in the storage unit 28, confirms whether the start condition implementation information 72 is valid or invalid, and if it is valid, it does not perform any action but notifies the CPU 25 to continue the operation of the main control unit 240.

[0135] (S1330)

[0136] If the startup condition implementation information 72 is invalid, the counting unit 43 increments the operation stop count 71, which represents the number of operation stops, in the storage unit 28, and notifies the CPU 25 of the main control unit 240 to continue the operation stop.

[0137] Figure 11 The following describes the setting operation for determining whether the start condition implementation information 72 is enabled after the main control unit 240 is started. This operation consists of, for example, the following steps: a start condition implementation information confirmation step (S200) to determine whether it is necessary to set the start condition implementation information 72; an operation stop count confirmation step (S210) to determine whether the start condition implementation information 72 is enabled based on the number of operation stops 71 stored in the storage unit 28; and a management device connection confirmation step (S220) to determine whether the start condition implementation information 72 is enabled based on the management device connection status 70 stored in the storage unit.

[0138] Does the start-up condition include an implementation information confirmation process (S200)?

[0139] Next, the start-up condition implementation information confirmation process S200 will be explained. In the start-up condition implementation information confirmation process S200, following the instructions of the CPU 25, the start-up condition control unit 40 obtains the setting status of the start-up condition implementation information 72 stored in the storage unit 28 and confirms whether the obtained start-up condition implementation information 72 is valid. If the start-up condition implementation information 72 is set to be valid, no action is taken and a response is returned to the CPU 25. If the start-up condition implementation information 72 is set to be invalid, the operation stop count confirmation process (S210) is performed.

[0140] Operation stop count confirmation process (S210)

[0141] Next, the operation stop count confirmation process S210 will be explained. The operation stop count confirmation process S210 is performed... Figure 12 The operation stop confirmation action is shown. The number of operation stops 71 stored in the storage unit 28 is obtained (S2000), the third threshold information 62 stored in the parameter storage unit 51 of the storage unit 28 is obtained, and compared with the number of operation stops 71 (S2010).

[0142] If the number of operation stops 71 is equal to or less than the third threshold information 62, the operation ends without taking any action.

[0143] If the number of operation stops 71 exceeds the third threshold information 62, the setting state of whether the start condition is implemented 72 is set to valid (S2020), it is stored in the storage unit 28 and the process ends.

[0144] Management device connection verification process (S220)

[0145] Next, the management device connection confirmation process S220 will be explained. This process is performed if the start-up condition implementation information 72 was not set to valid in the operation stop count confirmation process S210. The management device connection confirmation process S220 is performed. Figure 13 The management device connection confirmation operation is shown. The management device connection status 70 stored in the storage unit 28 is obtained (S2100), and the connection status of the management device 600 is confirmed (S2110).

[0146] If the management device 600 is not connected, the management device connection confirmation process S220 ends without any action. If the management device 600 is connected, the setting status of whether the start condition implementation information 72 is valid is set to valid (S2130), which is stored in the storage unit 28 and the process ends.

[0147] In this embodiment, by setting the start-up condition implementation information 72, it is not necessary to deal with unnecessary password authentication during the setup period, such as before connecting to the management device 600 of a new device, thus preventing a decrease in work efficiency related to the setup process.

[0148] Furthermore, in this embodiment, by setting whether the start-up condition implementation information 72 exists, it is possible to prevent work losses in the setup process caused by the erroneous operation of an inexperienced operator, and to prevent a decrease in work efficiency related to the setup process.

[0149] <Other Implementation Methods>

[0150] The first and second embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments and various modifications can be made without departing from its spirit.

[0151] In the above-described form, an example of forming a film using a batch substrate processing apparatus that processes multiple substrates at a time was described. The present invention is not limited to the above-described form; for example, it can also be well applied when forming a film using a leaf-type substrate processing apparatus that processes one or several substrates at a time. Even when using a leaf-type substrate processing apparatus, startup can be prevented from occurring when the apparatus is not fully configured by password authentication during device controller startup. Furthermore, in the above-described form, an example of forming a film using a substrate processing apparatus with a hot-wall type furnace was described. The present invention is not limited to the above-described form; it can also be well applied when forming a film using a substrate processing apparatus with a cold-wall type furnace.

Claims

1. A substrate processing apparatus, characterized in that, include: The processing chamber is capable of processing the substrate; The main control unit is capable of controlling the processing of the substrate; The storage unit is capable of storing start-up condition implementation information used in determining whether start-up conditions are implemented when the main control unit starts, start-up condition management information for managing the start-up conditions, and the state of the start-up condition management information; and The starting condition control unit is capable of setting the start condition implementation information to valid when the start condition management information meets specified conditions. The start-up condition control unit is configured to execute the start-up condition if the start-up condition implementation information is valid when the substrate processing apparatus is started, and not execute the start-up condition if the start-up condition implementation information is invalid.

2. The substrate processing apparatus as claimed in claim 1, characterized in that, Even if the main control unit stops operating, the start-up conditions and whether or not they are implemented are maintained in the storage unit.

3. The substrate processing apparatus as claimed in claim 1, characterized in that, The substrate processing device is connected to the management device. The starting condition management information is information obtained by the main control unit through identification of the management device. The specified condition is the first time the information obtained through identification is acquired.

4. The substrate processing apparatus as claimed in claim 1, characterized in that, It also includes a counting unit that counts the number of times the main control unit stops operating. The starting condition management information is the number of times the operation has stopped, obtained by the counting unit. The specified condition is when the number of times the main control unit stops operating exceeds a predefined number.

5. The substrate processing apparatus as claimed in claim 1, characterized in that, The storage unit can update and store information on whether the start-up conditions have been implemented, in accordance with the instructions of the main control unit.

6. The substrate processing apparatus as claimed in claim 3, characterized in that, The start-up condition control unit can determine the start-up conditions based on the connection status with the management device.

7. The substrate processing apparatus as claimed in claim 1, characterized in that, The storage unit is capable of storing the operation and shutdown information of the main control unit. When the start-up condition implementation information is valid, the start-up condition control unit can calculate the elapsed time from the start-up of the main control unit based on the operation stop information and the start-up information of the main control unit, and notify the main control unit of the result of comparing the elapsed time with a predefined elapsed time threshold, i.e., the first threshold.

8. The substrate processing apparatus as claimed in claim 1, characterized in that, If the start-up condition control unit is invalid due to the absence of start-up condition implementation information, it can notify the main control unit to continue operation.

9. The substrate processing apparatus as claimed in claim 1, characterized in that, When the main control unit determines that password authentication is required based on a notification from the start-up condition control unit, it can instruct the input unit that performs the operation of the main control unit to require password input.

10. The substrate processing apparatus as claimed in claim 9, characterized in that, The main control unit has a display unit that can display the status of the device and can display instructions requiring a password on the display unit.

11. The substrate processing apparatus as claimed in claim 10, characterized in that, The main control unit also has a password calculation unit capable of calculating a password and outputting the calculated password as the calculated password, and is capable of giving the output instruction of the calculated password to the password calculation unit.

12. The substrate processing apparatus as claimed in claim 11, characterized in that, The storage unit can store the calculated password only while the main control unit is in operation.

13. The substrate processing apparatus as claimed in claim 11, characterized in that, The starting condition control unit accepts the input password entered through the input unit, confirms the matching of the input password with the calculated password, and notifies the main control unit of the password authentication result.

14. The substrate processing apparatus as claimed in claim 13, characterized in that, The start-up condition control unit can count the number of mismatches when the input password and the calculated password are not matched, and notify the main control unit that the system cannot operate when the number of mismatches exceeds a predetermined second threshold.

15. The substrate processing apparatus as claimed in claim 13, characterized in that, The main control unit accepts the password authentication result and stops operating if it becomes inoperable.

16. The substrate processing apparatus as claimed in claim 13, characterized in that, The main control unit accepts the password authentication result and, in the event of malfunction, can display a message indicating that the unit is not operational.

17. A method for starting a device, characterized in that, It has the following processes: The process of storing whether the start-up condition is implemented and the start-up condition management information, wherein the start-up condition implementation information is used as authentication information when the device is started, and the start-up condition management information manages the conditions for setting the start-up condition implementation information as valid. The process of monitoring the operating status of the device; Referring to the start-up condition management information, if the conditions managed by the start-up condition management information are met, the process is set as having whether or not the start-up condition has been implemented; and The start-up condition confirmation process involves executing the start-up condition if the start-up condition implementation information is valid when the device is started, and not executing the start-up condition if the start-up condition implementation information is invalid.

18. The device starting method as described in claim 17, characterized in that, The process includes the following steps: when the device is started, a determination is made as to whether a password is required based on whether there is implementation information for the start-up conditions and the elapsed time since the device stopped operating.

19. A method for manufacturing a semiconductor device, characterized in that, It has all the processes described in claim 17 and the process of processing the substrate.

20. A recording medium readable by a computer, characterized in that, The computer is recorded with a program that enables it to perform all the steps described in claim 17.

Images