Semiconductor die bonder

Abstract

The application discloses a kind of semiconductor fast die bonding equipment in the technical field of semiconductor production, a kind of semiconductor fast die bonding equipment, including processing table, the support frame is fixedly installed on the processing table, two transmission tracks are fixedly connected on the processing table, the outer side of two transmission tracks is provided with wafer function module, the bonding head turret is arranged on the support frame;It also includes monitoring correction system;The monitoring correction system includes two wafer positioning cameras, two die bonding cameras and two overhead cameras;The wafer positioning camera and die bonding camera are installed on the support frame, and the overhead camera is installed on the processing table;Two wafer positioning cameras, two die bonding cameras and two overhead cameras are arranged in circumferential symmetry about the bonding head turret;The application can greatly improve the production efficiency of semiconductor.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically to a semiconductor rapid die bonding device. Background Technology

[0002] Existing semiconductor die bonding equipment primarily uses single-track, single-head mounting. During operation, the bonding head moves from the die-attaching position after die bonding, then to the wafer-collecting position after wafer collection, and finally to the placement position for placement. Because a single bonding head completes all the actions, the wafer at the die-attaching position is in a waiting state while the bonding head is collecting wafers, and the distance the bonding head travels to the die-attaching position after collecting wafers is relatively long, consuming considerable time. Furthermore, after the bonding head completes collecting wafers and leaves the collecting position, the wafer-collecting module is also in a waiting state, needing to wait for the bonding head to complete die bonding before returning to collect wafers. In this die bonding mode, the waiting time at each station is long, resources are wasted, and production efficiency is low, failing to meet production demands.

[0003] Based on this, the present invention designs a semiconductor rapid die bonding device to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor rapid die bonding device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor rapid die bonding device, including a processing table, a support frame fixedly mounted on the processing table, two transfer tracks fixedly connected to the processing table, a wafer functional module disposed on the outer side of each of the two transfer tracks, and a die bonding turret disposed on the support frame.

[0006] As a further aspect of the present invention, a monitoring and correction system is also included; the monitoring and correction system includes two wafer positioning cameras, two die bonding cameras, and two upward-viewing cameras; the wafer positioning cameras and die bonding cameras are mounted on a support frame, and the upward-viewing cameras are mounted on a processing table; the two wafer positioning cameras, the two die bonding cameras, and the two upward-viewing cameras are all arranged circumferentially symmetrically about the bonding turret.

[0007] As a further embodiment of the present invention, each side of the transmission track is provided with a sheet fixing assembly; the sheet fixing assembly includes a support plate and a first driving assembly; the support plate is slidably installed with the transmission track, two fixing plates are slidably connected to the support plate, a suction cup is fixedly connected to the fixing plate, a piston plate is slidably connected inside the fixing plate, and a second driving assembly for driving the piston plate to move is provided on the fixing plate; a first cylinder is provided between the two fixing plates, and the output end and the fixed end of the first cylinder are respectively connected to the two fixing plates; a wedge-shaped block that can limit the fixing plate is slidably connected to the support plate; a push block for driving the wedge-shaped block to move is provided on the side of the wedge-shaped block; the first driving assembly is used to drive the support plate to move.

[0008] As a further aspect of the present invention, the first driving component includes a second cylinder, which is used to drive the support plate to move.

[0009] As a further embodiment of the present invention, the first driving assembly further includes a first slider; the first slider is fixedly mounted on the output shaft of the second cylinder, the first slider is slidably connected to the transmission rail, a pressure spring is fixedly connected to the first slider, a second slider is fixedly connected to the end of the pressure spring away from the first slider, and the second slider is fixedly connected to the support plate; a plurality of wedge-shaped limiting blocks arranged in a linear array are provided on the side of the second slider, and each wedge-shaped limiting block is elastically slidably connected to the transmission rail; a first sliding rod is provided inside the wedge-shaped limiting block, the first sliding rod is located on the side of the second slider, a first traction rope is fixedly connected to the first sliding rod, a second sliding rod is fixedly connected to the bottom end of the first traction rope, the second sliding rod is elastically slidably connected to the second slider, a push plate capable of driving the second sliding rod to move is provided on the outside of the second sliding rod, the push plate is elastically slidably connected to the transmission rail, a bracket is fixedly connected to the push plate, a top rod is provided on the front side of the bracket, and the top rod is fixedly connected to the turret.

[0010] As a further embodiment of the present invention, a second spring is fixedly connected to the fixing plate on the left side, and the second spring is fixedly connected to the support plate.

[0011] As a further aspect of the present invention, the support is made of a lightweight material.

[0012] As a further embodiment of the present invention, rollers are rotatably connected to the fixed plate.

[0013] As a further embodiment of the present invention, a pull rod is fixedly connected to the outer wall of the suction cup, and a wedge-shaped push rod is provided on the side of the pull rod for driving its movement. The wedge-shaped push rod is elastically slidably connected to the fixed plate, and a rack rod is fixedly connected to the wedge-shaped push rod. The rack rod meshes with a first gear, and the first gear is rotatably connected to the fixed plate. A first bevel gear is fixedly connected to the rotation shaft of the first gear, and the first bevel gear meshes with a second bevel gear. The second bevel gear is fixedly connected to the rotation shaft of the roller.

[0014] As a further embodiment of the present invention, the second drive assembly includes a third cylinder, which is fixedly connected to a fixed plate, and the output end of the third cylinder is fixedly connected to a piston plate.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This invention, through the setting of multiple bonding heads, can simultaneously complete two wafer suctions, two upward viewings and two die bondings, but only consumes the time of one die bonding. At the same time, through the setting of the monitoring and correction system, production quality can be better controlled without affecting the production cycle, greatly shortening the die bonding cycle and increasing die bonding capacity.

[0017] 2. By incorporating a support plate, a fixing plate, and a suction cup, this invention allows the die bonder to stably fix the die sheet on the transport track during die bonding operations. This prevents the die sheet from shaking during the bonding process, significantly improving both bonding capacity and quality. Furthermore, the inclusion of a first cylinder allows the suction cup to adjust the die sheet's fixing position based on the bonding location. This ensures that the fixing plate does not obstruct the view of the die bonding camera or hinder the bonding process, resulting in smoother die bonding operations. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 This is a front view of the overall structure of the present invention (the support frame is hidden);

[0020] Figure 3 This is a schematic diagram showing the connection and positional relationship between the sheet fixing component and the transmission track of the present invention;

[0021] Figure 4 This is a cross-sectional schematic diagram showing the connection and positional relationship between the second slider, the wedge-shaped limiting block, the first slider, and the second slider of the present invention.

[0022] Figure 5 This is a cross-sectional schematic diagram showing the positional relationship between the first slide bar, the first traction rope, the second slide bar, and the push plate of the present invention.

[0023] Figure 6 This is a schematic cross-sectional view of the overall structure of the present invention;

[0024] Figure 7 This is a cross-sectional schematic diagram of the fixing plate and its internal structure of the present invention.

[0025] The attached diagram lists the components represented by each number as follows:

[0026] 1. Processing table; 2. Support frame; 3. Transfer track; 4. Wafer functional module; 5. Bonding turret; 6. Wafer positioning camera; 7. Die-bonding camera; 8. Top-view camera; 9. Support plate; 10. Fixing plate; 11. Suction cup; 12. Piston plate; 13. First cylinder; 14. Wedge-shaped block; 15. Push block; 16. Second cylinder; 17. First slider; 18. Pressure spring; 19. Second slider; 20. Wedge-shaped limit block; 21. First sliding rod; 22. Third cylinder; 23. First traction rope; 24. Second sliding rod; 25. Push plate; 26. Bracket; 27. Top rod; 28. Second spring; 29. ​​Roller; 30. Pull rod; 31. Wedge-shaped push rod; 32. Rack rod; 33. First bevel gear; 34. Second bevel gear; 35. Detailed Implementation

[0027] Please see Figure 1-7 The present invention provides a technical solution: a semiconductor rapid die bonding device, including a processing table 1, a support frame 2 fixedly installed on the processing table 1, two transmission tracks 3 fixedly connected to the processing table 1, a wafer functional module 4 arranged on the outer side of each of the two transmission tracks 3, and a bonding turret 5 arranged on the support frame 2.

[0028] It also includes a monitoring and correction system; the monitoring and correction system includes two wafer positioning cameras 6, two die bonding cameras 7 and two upward-viewing cameras 8; the wafer positioning cameras 6 and die bonding cameras 7 are mounted on the support frame 2, and the upward-viewing cameras 8 are mounted on the processing table 1; the two wafer positioning cameras 6, the two die bonding cameras 7 and the two upward-viewing cameras 8 are all arranged symmetrically about the turret 5.

[0029] The turret consists of multiple bearings and a turret. Each bearing has its own calibration motor, suction plate, and force-controlled voice coil motor for die bonding.

[0030] At work, such as Figures 1-2As shown, the turret can be equipped with 4-32 die bonders for simultaneous production. One machine is equipped with two die bonder transport tracks 3, two wafer supply modules, and two monitoring and correction systems. Two wafers requiring die bonding are placed onto the two transport tracks 3, which then transport the wafers to the die bonding position. After the turret rotates the die bonder to the front of the wafer on the wafer functional module 4, a wafer positioning camera is used to photograph and lock the chip, confirming its position and angle. The die bonder then picks up the accurately positioned wafer. The turret then rotates the die bonder again, and the die bonder passes through an upward-facing camera, which photographs and locks the die bonder's position. The chip's posture, position, and angle information are fed back to the track transmission module and bonding head module for correction. After the bonding head rotates to the die-bonding position, the die-bonding camera is used to photograph the die-bonding area within the wafer, locking the bonding head's die-bonding position and angle. Then, the bonding head bonds the wafer to the wafer. This invention, through the setting of multiple bonding heads, can simultaneously complete two wafer suctions, two upward views and two corrections, and two die-bondings, but only consumes the time of one die-bonding. At the same time, through the setting of the monitoring and correction system, production quality can be better controlled without affecting the production cycle, greatly shortening the die-bonding cycle and increasing die-bonding capacity.

[0031] As a further embodiment of the present invention, each side of the transmission track 3 is provided with a sheet fixing assembly; the sheet fixing assembly includes a support plate 9 and a first driving assembly; the support plate 9 is slidably installed with the transmission track 3, and two fixing plates 10 are slidably connected to the support plate 9, a suction cup 11 is fixedly connected to the fixing plate 10, a piston plate 12 is slidably connected inside the fixing plate 10, and a second driving assembly for driving the piston plate 12 to move is provided on the fixing plate 10; a first cylinder 13 is provided between the two fixing plates 10, and the output end and the fixed end of the first cylinder 13 are respectively connected to the two fixing plates 10; a wedge-shaped locking block 14 that can limit the fixing plate 10 is slidably connected to the support plate 9; a push block 15 for driving the wedge-shaped locking block 14 to move is provided on the side of the wedge-shaped locking block 14; the first driving assembly is used to drive the support plate 9 to move.

[0032] At work, such as Figures 3-4 As shown, it should be noted that in this embodiment, two wedge-shaped blocks 14 are provided, and the two wedge-shaped blocks 14 are located on the left and right sides of the support plate 9, respectively. The wedge-shaped block 14 on the left side is used to limit the fixing plate 10 on the left side. When the conveying track 3 transports the sheet to the die bonding position, the sheet is between the two support plates 9. At this time, the suction cup 11 on the fixing plate 10 is in contact with the sheet. Then, the second drive assembly drives the piston plate 12 to move away from the suction cup 11. The suction cup 12 will adhere to the sheet under the action of air pressure, thereby achieving the function of fixing the sheet. This can ensure that the sheet will not shake when the die bonding head is performing die bonding work. On the basis of ensuring die bonding capacity, it can also greatly improve the die bonding quality. Figure 2As shown, after each die bonding operation, the first drive assembly drives the support plate 9 to move a certain distance to the right, so that the die bonding position of the sheet can be stopped on the right side of the bonding head. When the die bonding area on the right side of the sheet is completed, the second drive assembly on the right-side fixing plate 10 drives the piston plate 12 to move closer to the suction cup 11, so that the right-side suction cup cancels the suction of the sheet. Then the first cylinder 13 begins to extend. Since the left end of the first cylinder 13 is fixed to the left-side fixing plate 10, the left-side fixing plate 10 is limited by the support plate 9 at this time. The extension of the first cylinder 13 will drive the right-side fixing plate 10 to move to the right until the right-side fixing plate 10 moves to the right side of the right-side die bonding area. At this time, the right-side fixing plate 10 will be limited by the wedge-shaped block 14; then the second drive assembly can drive the piston plate 12 to move upward so that the right-side suction cup can pick up the sheet again. At this time, the bonding head needs to perform a die bonding operation on the middle area of ​​the sheet. This ensures that the fixing plate 10 will not obstruct the view of the die bonding camera 7, nor will it obstruct the bonding head from performing the die bonding operation, ensuring that the die bonding work is carried out more smoothly. After the die bonding work in the middle area of ​​the sheet is completed, the left-side wedge-shaped block 14 moves to contact the push block 15. The push block 15 will drive the left-side wedge-shaped block 14 to move upward to cancel the limitation on the left-side fixing plate 10; the suction cup 11 on the left-side fixing plate 10 will release the fixing of the sheet, and then the first cylinder 1 3. The contraction process continues. At this point, because the right-side fixing plate 10 is fixed by the wedge-shaped locking block 14, the first cylinder 13 will drive the left-side fixing plate 10 to move to the right until the two fixing plates 10 are respectively located on the left and right sides of the die-bonding area on the right side of the sheet. After this, the left-side fixing plate 10 will not affect the die-bonding work on the left side of the sheet. After the die-bonding work is completed, the first cylinder 13 will extend again, driving the left-side fixing plate 10 to move to the left between the left-side wedge-shaped locking block 14 and the support plate 9. At this point, the left-side fixing plate 10 is fixed by the wedge-shaped locking block 14. Then, the first drive assembly will drive the support plate 9 to move to the left back to its initial position. When the support plate 9 moves to its initial position, the push block 15 will... The right-side wedge-shaped block 14 is moved upward to a position offset from the right-side fixing plate 10. Then, the first cylinder 13 can drive the fixing plate 10 to move to the left back to the initial position. At this time, the support plate 9 and the fixing plate 10 move back to the initial position. Then, the transmission track 3 can transport the next sheet to the two support plates 9 for the next sheet to be die-bonded. Through the setting of the support plate 9, the fixing plate 10 and the suction cup 11, the fixing plate 10 and the suction cup 11 can stably fix the sheet on the transmission track 3 when the die bonding head is performing the die bonding operation. This can ensure that the sheet will not shake when the die bonding head is performing the die bonding operation. While ensuring the die bonding capacity, it can also greatly improve the die bonding quality.Furthermore, by setting the first cylinder 13, the suction cup 11 can change the die-bonding position according to the die-bonding location, ensuring that the fixing plate 10 does not obstruct the view of the die-bonding camera 7, nor does it hinder the die-bonding head from performing the die-bonding operation, thus ensuring smoother die-bonding work.

[0033] As a further aspect of the present invention, the first driving component includes a second cylinder 16, which is used to drive the support plate 9 to move.

[0034] During operation, after each die bonding operation is completed, the second cylinder 16 drives the support plate 9 to move to the right by one die bonding distance. The support plate 9 will drive the fixing plate 10 to move to the right synchronously. The fixing plate 10 will drive the suction cup 11 and the die to move to the right synchronously, so that the die can be stopped at the die bonding position.

[0035] As a further embodiment of the present invention, the first driving assembly further includes a first slider 17; the first slider 17 is fixedly mounted on the output shaft of the second cylinder 16, the first slider 17 is slidably connected to the transmission track 3, the first slider 17 is fixedly connected to a pressure spring 18, and the end of the pressure spring 18 away from the first slider 17 is fixedly connected to a second slider 19, the second slider 19 is fixedly connected to a support plate 9; a plurality of wedge-shaped limiting blocks 20 arranged in a linear array are provided on the side of the second slider 19, and the wedge-shaped limiting blocks 20 are all elastically slidably connected to the transmission track 3; the wedge-shaped A first slide rod 21 is provided inside the limiting block 20. The first slide rod 21 is located on the side of the second slider 19. A first traction rope 23 is fixedly connected to the first slide rod 21. A second slide rod 24 is fixedly connected to the bottom end of the first traction rope 23. The second slide rod 24 is elastically slidably connected to the second slider 19. A push plate 25 capable of driving the second slide rod 24 is provided on the outside of the second slide rod 24. The push plate 25 is elastically slidably connected to the transmission track 3. A bracket 26 is fixedly connected to the push plate 25. A top rod 27 is provided on the front side of the bracket 26. The top rod 27 is fixedly connected to the turret 5.

[0036] At work, such as Figures 3-7 As shown, when the die bonder moves downward to perform the die bonding operation, the die bonder will drive the push rod 27 to move backward, the push rod 27 will drive the support 26 to move backward, and the support 26 will drive the push plate 25 to move backward synchronously; as Figure 5As shown, when the second slider 19 contacts the wedge-shaped limiting block 20, the second slider 19 will push the first slider 21 to move inward into the wedge-shaped limiting block 20. The first slider 21 will drive the second slider 24 to move outward through the first traction rope 23. The second slider 24 will move to the inside of the push plate 25. During the backward movement of the push plate 25, the wedge-shaped limiting block 20 that is in contact with the second slider 19 will move backward synchronously. When the die bonding work is completed, the wedge-shaped limiting block 20 moves to a position that is offset from the second slider 19. At this time, the pressure spring 18 will drive the second slider 19 and the support plate 9 to move to the right to the position that is in contact with the next wedge-shaped limiting block 20. The support plate 9 will drive the material sheet to the right through the fixing plate 10 and the suction cup 11. The material sheet is moved a short distance to the next die-bonding position. Then, the second cylinder 16 drives the first slider 17 to move to the right to compress the pressure spring 18. When the die bonding head performs the next die bonding operation, the push plate 25 will drive the wedge-shaped limiting block 20, which is in contact with the second slider 19, to move backward. After the die bonding is completed, the second slider 19 will drive the support plate 9, the fixing plate 10, the suction cup 11, and the material sheet to move a short distance to the right under the action of the pressure spring 18. By setting the wedge-shaped limiting block 20, the present invention can ensure that the support plate 9 can move a fixed distance each time, which can better ensure that the material sheet can stop at the accurate die-bonding position after each movement, and can better ensure the die bonding quality of the material sheet.

[0037] As a further embodiment of the present invention, a second spring 28 is fixedly connected to the fixing plate 10 on the left side, and the second spring 28 is fixedly connected to the support plate 9.

[0038] At work, such as Figure 2 and Figure 3 As shown, in this embodiment, only one wedge-shaped locking block 14 is provided on the support plate 9, and the wedge-shaped locking block 14 is located on the right side of the support plate 9. When the first cylinder 13 retracts and drives the left fixing plate 10 to move to the right, the fixing plate 10 will drive the second spring 28 to retract. After all areas on the sheet have completed the die bonding work, the two fixing plates 10 are located on the right side of the support plate 9. When the second cylinder 16 drives the support plate 9 to move to the left back to the initial position, the push block 15 will push the wedge-shaped locking block 14 to move upward to cancel the restriction on the right fixing plate 10. Then, the left fixing plate 10 will drive the first flagpole 13 and the right fixing plate 10 to quickly return to the initial position under the elastic force of the second spring 28, which can speed up the die bonding efficiency of the sheet.

[0039] As a further embodiment of the present invention, the support 26 is made of a lightweight material.

[0040] During operation, setting the bracket 26 to be made of a lightweight material makes it easier for the push plate 25 to reset.

[0041] As a further embodiment of the present invention, a roller 29 is rotatably connected to the fixed plate 10.

[0042] During operation, the rollers 29 allow the fixed plate 10 to slide more smoothly on the support frame 9.

[0043] As a further embodiment of the present invention, a pull rod 30 is fixedly connected to the outer wall of the suction cup 11, and a wedge-shaped push rod 31 for driving its movement is provided on the side of the pull rod 30. The wedge-shaped push rod 31 is elastically slidably connected to the fixing plate 10. A rack rod 32 is fixedly connected to the wedge-shaped push rod 31. The rack rod 32 meshes with a first gear 33. The first gear 33 is rotatably connected to the fixing plate 10. A first bevel gear 34 is fixedly connected to the rotation shaft of the first gear 33. The first bevel gear 34 meshes with a second bevel gear 35. The second bevel gear 35 is fixedly connected to the rotation shaft of the roller 29.

[0044] At work, such as Figure 4 As shown, during the movement of the fixed plate 10, the roller 29 will rotate under the friction of the inner wall of the support frame 9. The roller 29 will drive the second bevel gear 35 to rotate, the second bevel gear 35 will drive the first bevel gear 34 to rotate, the first bevel gear 34 will drive the first gear 33 to rotate, and the rotation of the first gear 33 will drive the rack rod 32 and the wedge push rod 31 to move closer to the pull rod 30. The wedge push rod 31 will drive the pull rod 30 to move upward, and the pull rod 30 will pull the bottom of the suction cup 11 upward. During the movement, the suction cup 11 can detach from the material, which can prevent the suction cup 11 from scraping the fixed wafer during the movement.

[0045] As a further embodiment of the present invention, the second drive assembly includes a third cylinder 22, which is fixedly connected to the fixed plate 10, and the output end of the third cylinder 22 is fixedly connected to the piston plate 12.

[0046] During operation, when the suction cup 11 needs to adsorb the material, the third cylinder 22 drives the piston plate 12 to move away from the suction cup 11. Conversely, when the third cylinder 22 drives the piston plate 12 to move closer to the suction cup 11, the suction cup 11 cancels the adsorption of the material.

[0047] Working principle: such as Figures 1-2As shown, the turret can be equipped with 4-32 die bonders for simultaneous production. One machine is equipped with two die bonder transport tracks 3, two wafer supply modules, and two monitoring and correction systems. Two wafers requiring die bonding are placed onto the two transport tracks 3, which then transport the wafers to the die bonding position. After the turret rotates the die bonder to the front of the wafer on the wafer functional module 4, a wafer positioning camera is used to photograph and lock the chip, confirming its position and angle. The die bonder then picks up the accurately positioned wafer. The turret then rotates the die bonder again, and the die bonder passes through an upward-facing camera, which photographs and locks the die bonder's position. The chip's posture, position, and angle information are fed back to the track transmission module and bonding head module for correction. After the bonding head rotates to the die-bonding position, the die-bonding camera is used to photograph the die-bonding area within the wafer, locking the bonding head's die-bonding position and angle. Then, the bonding head bonds the wafer to the wafer. This invention, through the setting of multiple bonding heads, can simultaneously complete two wafer suctions, two upward views and two corrections, and two die-bondings, but only consumes the time of one die-bonding. At the same time, through the setting of the monitoring and correction system, production quality can be better controlled without affecting the production cycle, greatly shortening the die-bonding cycle and increasing die-bonding capacity.

Claims

1. A semiconductor rapid die bonding device, characterized in that: Includes a processing table (1), on which a support frame (2) is fixedly installed, and two transmission rails (3) are fixedly connected to the processing table (1). Wafer functional modules (4) are provided on the outer side of the two transmission rails (3), and a turret (5) is provided on the support frame (2). It also includes a monitoring and correction system; the monitoring and correction system includes two wafer positioning cameras (6), two die bonding cameras (7) and two upward-looking cameras (8); the wafer positioning cameras (6) and die bonding cameras (7) are mounted on the support frame (2), and the upward-looking cameras (8) are mounted on the processing table (1); the two wafer positioning cameras (6), the two die bonding cameras (7) and the two upward-looking cameras (8) are all arranged symmetrically about the turret (5) around the head; The side of the transmission track (3) is provided with a material sheet fixing assembly; the material sheet fixing assembly includes a support plate (9) and a first drive assembly; the support plate (9) is slidably installed with the transmission track (3), and two fixing plates (10) are slidably connected on the support plate (9). The fixing plate (10) is fixedly connected to a suction cup (11), and a piston plate (12) is slidably connected inside the fixing plate (10). A second drive assembly for driving the piston plate (12) to move is provided on the fixing plate (10); a first cylinder (13) is provided between the two fixing plates (10), and the output end and the fixed end of the first cylinder (13) are respectively connected to the two fixing plates (10); a wedge-shaped block (14) that can limit the fixing plate (10) is slidably connected on the support plate (9); a push block (15) for driving the wedge-shaped block (14) to move is provided on the side of the wedge-shaped block (14); the first drive assembly is used to drive the support plate (9) to move.

2. The semiconductor rapid die bonding equipment according to claim 1, characterized in that: The first drive assembly includes a second cylinder (16) for driving the support plate (9) to move.

3. The semiconductor rapid die bonding equipment according to claim 2, characterized in that: The first drive assembly further includes a first slider (17); the first slider (17) is fixedly mounted on the output shaft of the second cylinder (16), the first slider (17) is slidably connected to the transmission rail (3), the first slider (17) is fixedly connected to a pressure spring (18), the end of the pressure spring (18) away from the first slider (17) is fixedly connected to a second slider (19), the second slider (19) is fixedly connected to the support plate (9); the side of the second slider (19) is provided with a plurality of wedge-shaped limiting blocks (20) arranged in a linear array, the wedge-shaped limiting blocks (20) are all elastically slidably connected to the transmission rail (3); the wedge-shaped limiting blocks (20) are provided with There is a first slide bar (21), which is located on the side of the second slider (19). A first traction rope (23) is fixedly connected to the first slide bar (21). A second slide bar (24) is fixedly connected to the bottom end of the first traction rope (23). The second slide bar (24) is elastically slidably connected to the second slider (19). A push plate (25) capable of driving the second slide bar (24) is provided on the outside of the second slide bar (24). The push plate (25) is elastically slidably connected to the transmission track (3). A bracket (26) is fixedly connected to the push plate (25). A top rod (27) is provided on the front side of the bracket (26). The top rod (27) is fixedly connected to the turret (5).

4. The semiconductor rapid die bonding equipment according to claim 3, characterized in that: A second spring (28) is fixedly connected to the fixed plate (10) on the left side, and the second spring (28) is fixedly connected to the support plate (9).

5. A semiconductor rapid die bonding device according to claim 3, characterized in that: The support (26) is made of lightweight material.

6. The semiconductor rapid die bonding equipment according to claim 1, characterized in that: Rollers (29) are rotatably connected to the fixed plate (10).

7. A semiconductor rapid die bonding device according to claim 6, characterized in that: A pull rod (30) is fixedly connected to the outer wall of the suction cup (11). A wedge-shaped push rod (31) for driving the pull rod (30) is provided on the side. The wedge-shaped push rod (31) is elastically slidably connected to the fixed plate (10). A rack rod (32) is fixedly connected to the wedge-shaped push rod (31). The rack rod (32) meshes with a first gear (33). The first gear (33) is rotatably connected to the fixed plate (10). A first bevel gear (34) is fixedly connected to the rotation shaft of the first gear (33). The first bevel gear (34) meshes with a second bevel gear (35). The second bevel gear (35) is fixedly connected to the rotation shaft of the roller (29).

8. The semiconductor rapid die bonding equipment according to claim 1, characterized in that: The second drive assembly includes a third cylinder (22), which is fixedly connected to a fixed plate (10), and the output end of the third cylinder (22) is fixedly connected to a piston plate (12).

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