A transmission line transition structure and radar system circuit stack architecture

Abstract

The application discloses a kind of transmission line transition structure and radar system circuit laminated architecture.The transmission line transition structure includes first transition component and second transition component;First transition component includes the first radio frequency dielectric substrate with first circuit transmission line and the first low-frequency dielectric substrate with first waveguide structure, and first circuit transmission line is used to be electromagnetically coupled with first waveguide structure;Second transition component includes the second radio frequency dielectric substrate with second circuit transmission line and the second low-frequency dielectric substrate with second waveguide structure, and second waveguide structure is used to be polarized matching with first waveguide structure, and second circuit transmission line is used to be electromagnetically coupled with second waveguide structure.Through using above-mentioned scheme, it is made by integration pressing process from existing radar system laminated circuit, wherein electromagnetic signal is transmitted through metallized via, and the problem that the variety of via leads to laminated design complex and needs to be used Expensive high-frequency dielectric substrate leads to higher cost.

Description

Technical Field

[0001] This invention relates to the technical field of radar systems, and more particularly to a transmission line transition structure and a radar system circuit stack-up architecture. Background Technology

[0002] With the increasing demand for high resolution in 4D millimeter-wave imaging radar, the number of antenna channels for automotive radar needs to increase exponentially, posing a significant challenge to the miniaturization of automotive radar. To reduce the size of automotive radar, a layered architecture design is adopted, in which the antenna layer, low-frequency circuit layer, and device layer are arranged at different cross-sectional heights from top to bottom, which greatly reduces the size of automotive radar.

[0003] Currently, radar system circuit stack-up architecture is generally achieved using multilayer printed circuit integrated lamination technology. Metallized vias are used to construct coaxial structures to achieve electrical connections between device layers and low-frequency circuit layers, and between device layers and antenna layers. Electromagnetic signals are transmitted through metallized vias between low-frequency circuit layers, device layers, and antenna layers. The overall stack-up vias of radar systems are diverse, and the stack-up design is complex. Moreover, due to the highly integrated nature of the system, the optimization cost is high in the early research and verification stages. In addition, the metallized vias connecting device layers and antenna layers pass through low-frequency circuit layers. To ensure the stability of this transition structure, antenna layers, low-frequency circuit layers, and device layers all need to be implemented using expensive high-frequency dielectric substrates, which greatly increases the cost of radar systems. Summary of the Invention

[0004] This invention provides a transmission line transition structure and a radar system circuit stack-up architecture to solve the problems of existing radar system stack-up circuits being manufactured by an integrated lamination process, in which electromagnetic signals are transmitted through metallized vias, the variety of via types leading to complex stack-up designs, and the need to use expensive high-frequency dielectric substrates resulting in high costs.

[0005] According to one aspect of the present invention, a transmission line transition structure is provided, the transmission line transition structure comprising a first transition component and a second transition component;

[0006] The first transition component includes a first radio frequency dielectric substrate and a first low frequency dielectric substrate stacked together. A first circuit transmission line is provided on the side of the first radio frequency dielectric substrate away from the first low frequency dielectric substrate. A first waveguide structure is provided on the first low frequency dielectric substrate. The first circuit transmission line is used to electromagnetically couple with the first waveguide structure to realize the transmission transition of electromagnetic signals.

[0007] The second transition component includes a stacked second radio frequency dielectric substrate and a second low frequency dielectric substrate. The second low frequency dielectric substrate is provided with a second waveguide structure. The second waveguide structure is used for polarization matching with the first waveguide structure to realize the transmission of electromagnetic signals from the first waveguide structure to the second waveguide structure.

[0008] The second radio frequency dielectric substrate has a second circuit transmission line on the side opposite to the second low frequency dielectric substrate. The second circuit transmission line is used for electromagnetic coupling with the second waveguide structure to realize the transmission transition of electromagnetic signals.

[0009] In an optional embodiment of the present invention, both the first waveguide structure and the second waveguide structure include waveguide ports, wherein the waveguide ports of the first waveguide structure are opposite to and polarized matched with the waveguide ports of the second waveguide structure.

[0010] In an optional embodiment of the present invention, the first transition component and the second transition component are detachably connected, and an assembly gap exists between the first transition component and the second transition component. The transmission line transition structure further includes a gap waveguide structure.

[0011] The assembly gap includes a propagation gap and a spatial gap. The propagation gap is located between the first waveguide structure and the second waveguide structure. The gap waveguide structure is used to suppress the propagation of electromagnetic signals in the spatial gap other than the propagation gap.

[0012] In an optional embodiment of the present invention, the gap waveguide structure includes a periodic printed circuit structure and a metal plane, the periodic printed circuit structure surrounding one of the first waveguide structure and the second waveguide structure, and the metal plane being disposed on the surface where the other corresponding waveguide port of the first waveguide structure and the second waveguide structure is located;

[0013] The periodic printed circuit structure is opposite to the metal plane.

[0014] In an optional embodiment of the present invention, a first partition layer is provided between the first radio frequency dielectric substrate and the first low frequency dielectric substrate, and a second partition layer is provided between the second radio frequency dielectric substrate and the second low frequency dielectric substrate. The number of periodic printed circuit structures is multiple. The periodic printed circuit structure includes a pad and a first conductive via. One end of the first conductive via is connected to the pad, and the other end of the first conductive via passes through the first low frequency dielectric substrate and is electrically connected to the first partition layer or passes through the second low frequency dielectric substrate and is electrically connected to the second partition layer.

[0015] In an optional embodiment of the present invention, the first partition is provided with a first gap, and the first circuit transmission line is used to electromagnetically couple with the first waveguide structure through the first gap to realize the transmission transition of electromagnetic signals.

[0016] And / or, the second partition is provided with a second gap, and the second circuit transmission line is used to electromagnetically couple with the second waveguide structure through the second gap to realize the transmission transition of electromagnetic signals.

[0017] In an optional embodiment of the present invention, a conductive patch is provided in the first gap and / or the second gap, and the length of the conductive patch is less than the length of the first gap and the second gap;

[0018] The first circuit transmission line is used to enhance the electromagnetic coupling with the first waveguide structure through the conductive patch of the first gap, so as to realize the transmission transition of electromagnetic signals.

[0019] The second circuit transmission line is used to enhance the electromagnetic coupling with the second waveguide structure through the conductive patch of the second gap, thereby realizing the transmission transition of electromagnetic signals.

[0020] In an optional embodiment of the present invention, the transmission line transition structure further includes at least one of the following:

[0021] The second conductive via penetrates the first radio frequency dielectric substrate;

[0022] The third conductive via penetrates the second radio frequency dielectric substrate;

[0023] The first prepreg is disposed between the first radio frequency dielectric substrate and the first low frequency dielectric substrate;

[0024] The second prepreg is disposed between the second radio frequency dielectric substrate and the second low frequency dielectric substrate;

[0025] A fixed threaded hole is provided on the first transition component and the second transition component, and when the fixed threaded hole on the first transition component and the fixed threaded hole on the second transition component are opposite to each other, the waveguide port of the first waveguide structure is opposite to the waveguide port of the second waveguide structure and is polarized matched.

[0026] In an optional embodiment of the present invention, the transmission line transition structure further includes at least one of the following:

[0027] The fourth conductive via penetrates the first radio frequency dielectric substrate and the first prepreg.

[0028] The fifth conductive via penetrates the second radio frequency dielectric substrate and the second prepreg.

[0029] According to another aspect of the present invention, a radar system circuit stack-up architecture is provided, comprising an antenna layer, a low-frequency layer, and a device layer. The radar system circuit stack-up architecture includes a radiating antenna, a radio frequency chip, a low-frequency device, a low-frequency circuit, and a transmission line transition structure as described in any embodiment of the present invention.

[0030] The transmission line transition structure includes a first transition component and a second transition component, wherein the first transition component and the radiating antenna constitute an antenna layer.

[0031] The second transition component includes a second radio frequency dielectric substrate and a second low frequency dielectric substrate stacked together. A second waveguide structure is provided on the second low frequency dielectric substrate, and a second circuit transmission line is provided on the side of the second radio frequency dielectric substrate opposite to the second low frequency dielectric substrate.

[0032] The second radio frequency dielectric substrate, the second low frequency dielectric substrate, the second waveguide structure, and the low frequency circuit constitute a low frequency layer;

[0033] The second circuit transmission line, the radio frequency chip, and the low-frequency device constitute a device layer.

[0034] In an optional embodiment of the present invention, the first low-frequency dielectric substrate is composed of at least one low-frequency dielectric substrate;

[0035] The second low-frequency dielectric substrate is composed of at least one low-frequency dielectric substrate.

[0036] In an optional embodiment of the present invention, the low-frequency layer and the device layer are manufactured by an integrated lamination process;

[0037] The low-frequency layer, the device layer, and the antenna layer are all provided with fixing threaded holes, which are used to achieve detachable connection.

[0038] In an optional embodiment of the present invention, the transmission line transition structure further includes a gap waveguide structure, which is integrated in the antenna layer and the low-frequency layer;

[0039] There is an assembly gap between the first transition component and the second transition component. The assembly gap includes a propagation gap and a spatial gap. The propagation gap is located between the first waveguide structure and the second waveguide structure. The gap waveguide structure is used to suppress the propagation of electromagnetic signals in the spatial gap other than the propagation gap.

[0040] The technical solution of this invention, through the provision of a first transition component and a second transition component, includes a first transition component comprising a stacked first radio frequency (RF) dielectric substrate and a first low-frequency dielectric substrate. A first circuit transmission line is provided on the side of the first RF dielectric substrate facing away from the first low-frequency dielectric substrate. A first waveguide structure is provided on the first low-frequency dielectric substrate, and the first circuit transmission line can electromagnetically couple with the first waveguide structure, thereby transitioning the transmission of electromagnetic signals to the first waveguide structure. Furthermore, the second transition component comprises a stacked second RF dielectric substrate and a second low-frequency dielectric substrate. A second waveguide structure is provided on the second low-frequency dielectric substrate, and the second waveguide structure can polarize-match with the first waveguide structure, thereby transmitting electromagnetic signals from the first waveguide structure to the second waveguide structure. Finally, a second circuit transmission line is provided on the side of the second RF dielectric substrate facing away from the second low-frequency dielectric substrate, and the second circuit transmission line can electromagnetically couple with the second waveguide structure, thereby transitioning the transmission of electromagnetic signals from the second waveguide structure to the second circuit transmission line. Therefore, the electromagnetic signal output from the first circuit transmission line can be transmitted to the second circuit transmission line via the first and second waveguide structures, eliminating the need for multi-layer metallized vias between the first and second circuit transmission lines.

[0041] Furthermore, the first and second transition components can be fabricated separately, reducing the types of vias. The first waveguide structure can be fabricated on the first low-frequency dielectric substrate using printed circuit technology, and the second waveguide structure can be fabricated on the second low-frequency dielectric substrate using printed circuit technology. When applied to radar systems, there is no need to use expensive high-frequency dielectric substrates in the low-frequency layer. Therefore, this solves the problems of electromagnetic signals being transmitted through metallized vias in existing radar system stacked circuits, the complexity of the stacked design due to the variety of via types, and the high cost due to the need to use expensive high-frequency dielectric substrates.

[0042] By fabricating a radar system circuit stack architecture based on the transmission line transition structure provided in any embodiment of the present invention, the transition from the first circuit transmission line to the first waveguide structure, from the first waveguide structure to the second waveguide structure, and from the second waveguide structure to the second circuit transmission line can be realized. This transition structure can be divided into two parts, a first transition component and a second transition component, which are processed separately, reducing the types of vias. The first waveguide structure can be fabricated on the first low-frequency dielectric substrate using printed circuit technology, and the second waveguide structure can be fabricated on the second low-frequency dielectric substrate using printed circuit technology, eliminating the need for expensive high-frequency dielectric substrates in the low-frequency layer. Since the first and second transition components are detachable, the antenna layer formed by the first transition component can be optimized independently, and the device layer and low-frequency layer can be reused, greatly reducing the cost of the radar system.

[0043] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a schematic diagram of a transmission line transition structure provided in Embodiment 1 of the present invention;

[0046] Figure 2 This is an exploded structural diagram of a transmission line transition structure provided in Embodiment 1 of the present invention;

[0047] Figure 3 This is a schematic diagram of another transmission line transition structure provided in Embodiment 1 of the present invention;

[0048] Figure 4 This is a schematic diagram of another transmission line transition structure provided in Embodiment 1 of the present invention;

[0049] Figure 5 This is a schematic diagram of another transmission line transition structure provided in Embodiment 1 of the present invention;

[0050] Figure 6 This is a schematic diagram of a radar system circuit stack-up architecture provided in Embodiment 2 of the present invention.

[0051] Wherein: 1. First transition component; 11. First radio frequency dielectric substrate; 12. First low frequency dielectric substrate; 13. First circuit transmission line; 14. First waveguide structure; 15. First separator; 16. Second conductive via; 17. First prepreg; 18. Fourth conductive via; 19. First gap; 2. Second transition component; 21. Second radio frequency dielectric substrate; 22. Second low frequency dielectric substrate; 23. Second waveguide structure; 24. Second circuit transmission line; 25. Second separator; 26. Second gap; 27. 28. Fifth conductive via; 29. ​​Second prepreg; 3. Waveguide port; 4. Gap waveguide structure; 41. Periodic printed circuit structure; 411. Pad; 412. First conductive via; 42. Metal plane; 5. Conductive patch; 6. Fixing threaded hole; 60. Screw; 7. Radiation antenna; 8. RF chip; 9. Low-frequency device; 10. Low-frequency circuit; 20. Antenna layer; 30. Low-frequency layer; 40. Device layer; 50. Assembly gap; 501. Propagation gap; 502. Spatial gap. Detailed Implementation

[0052] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0053] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0054] Example 1

[0055] Figure 1 This is a schematic diagram of a transmission line transition structure provided in Embodiment 1 of the present invention. Figure 2 This is an exploded structural diagram of a transmission line transition structure provided in Embodiment 1 of the present invention. This embodiment can be applied to radar systems, such as... Figure 1 and Figure 2 As shown, the transmission line transition structure includes a first transition component 1 and a second transition component 2.

[0056] The first transition component 1 includes a first radio frequency dielectric substrate 11 and a first low-frequency dielectric substrate 12 stacked together. A first circuit transmission line 13 is provided on the side of the first radio frequency dielectric substrate 11 opposite to the first low-frequency dielectric substrate 12. A first waveguide structure 14 is provided on the first low-frequency dielectric substrate 12. The first circuit transmission line 13 is used for electromagnetic coupling with the first waveguide structure 14 to achieve electromagnetic signal transmission transition. The first radio frequency dielectric substrate 11 refers to a material used for developing radio frequency printed circuit boards, and the first low-frequency dielectric substrate 12 refers to a material used for developing low-frequency printed circuit boards. The first radio frequency dielectric substrate 11 can be disposed above the first low-frequency dielectric substrate 12. The first circuit transmission line 13 refers to a transmission line used for transmitting electromagnetic signals, including but not limited to microstrip lines, striplines, grounded coplanar waveguides, and dielectric integrated waveguide transmission lines, etc., and these can be arbitrarily combined. The first waveguide structure 14 is a structure used to directionally guide electromagnetic waves. Electromagnetic coupling, also known as mutual inductance coupling, occurs when two circuits have mutual inductance, causing a change in current in one circuit to affect the other. Through electromagnetic coupling between the first circuit transmission line 13 and the first waveguide structure 14, electromagnetic signals on the first circuit transmission line 13 can be transmitted to the first waveguide structure 14, achieving a smooth transition in electromagnetic signal transmission.

[0057] The second transition component 2 includes a stacked second radio frequency dielectric substrate 21 and a second low-frequency dielectric substrate 22. A second waveguide structure 23 is provided on the second low-frequency dielectric substrate 22. The second waveguide structure 23 is used for polarization matching with the first waveguide structure 14, enabling the transmission of electromagnetic signals from the first waveguide structure 14 to the second waveguide structure 23. The second radio frequency dielectric substrate 21 refers to a material used for developing radio frequency printed circuit boards, and the second low-frequency dielectric substrate 22 refers to a material used for developing low-frequency printed circuit boards. The second low-frequency dielectric substrate 22 can be disposed above the second radio frequency dielectric substrate 21, and the first waveguide structure 14 can be opposite the second waveguide structure 23. Polarization matching means that the polarization direction of the transmitted electromagnetic wave is consistent with the polarization direction of the receiving end. By polarizing the second waveguide structure 23 with the first waveguide structure 14, the electromagnetic signals from the first waveguide structure 14 can be transmitted to the first waveguide structure 14.

[0058] A second circuit transmission line 24 is provided on the side of the second RF dielectric substrate 21 opposite to the second low-frequency dielectric substrate 22. The second circuit transmission line 24 is used for electromagnetic coupling with the second waveguide structure 23 to achieve electromagnetic signal transmission transition. The second circuit transmission line 24 refers to a transmission line used to transmit electromagnetic signals, including but not limited to microstrip lines, striplines, grounded coplanar waveguides, and dielectric integrated waveguide transmission lines, etc., and these can be arbitrarily combined. Through electromagnetic coupling between the second circuit transmission line 24 and the second waveguide structure 23, electromagnetic signals on the second waveguide structure 23 can be transmitted to the second circuit transmission line 24, achieving electromagnetic signal transmission transition.

[0059] The above scheme, by setting a first transition component 1 and a second transition component 2, includes a first transition component 1 comprising a stacked first radio frequency dielectric substrate 11 and a first low-frequency dielectric substrate 12. A first circuit transmission line 13 is provided on the side of the first radio frequency dielectric substrate 11 facing away from the first low-frequency dielectric substrate 12. A first waveguide structure 14 is provided on the first low-frequency dielectric substrate 12. The first circuit transmission line 13 can electromagnetically couple with the first waveguide structure 14, thereby transitioning the transmission of electromagnetic signals to the first waveguide structure 14. Furthermore, the second transition component 2 comprises a stacked second radio frequency dielectric substrate 21 and a second low-frequency dielectric substrate 22. A second waveguide structure 23 is provided on the second low-frequency dielectric substrate 22. The second waveguide structure 23 can be polarization matched with the first waveguide structure 14, thereby transmitting electromagnetic signals from the first waveguide structure 14 to the second waveguide structure 23. The gap waveguide structure 4 is integrated into the first transition component 1 and the second transition component 2 to suppress the propagation of electromagnetic signals through the assembly gap 502, excluding the assembly gap 501 between the first waveguide structure 14 and the second waveguide structure 23. This achieves low-loss propagation of electromagnetic signals between the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23. Finally, a second circuit transmission line 24 is provided on the side of the second RF dielectric substrate 21 facing away from the second low-frequency dielectric substrate 22. The second circuit transmission line 24 can be electromagnetically coupled to the second waveguide structure 23, enabling the second waveguide structure 23 to transition the transmission of electromagnetic signals to the second circuit transmission line 24. Therefore, the electromagnetic signal output from the first circuit transmission line 13 can be transmitted to the second circuit transmission line 24 via the first waveguide structure 14 and the second waveguide structure 23, eliminating the need for designing multilayer metallized vias from the first circuit transmission line 13 to the second circuit transmission line 24.

[0060] Furthermore, the first transition component 1 and the second transition component 2 can be fabricated separately, reducing the types of vias. The first waveguide structure 14 can be fabricated on the first low-frequency dielectric substrate 12 using printed circuit technology, and the second waveguide structure 23 can be fabricated on the second low-frequency dielectric substrate 22 using printed circuit technology. When applied to a radar system, there is no need to use an expensive high-frequency dielectric substrate in the low-frequency layer 30. Therefore, the problems of electromagnetic signals being transmitted through metallized vias in existing radar system stacked circuits, the complexity of the stacked design due to the variety of via types, and the high cost due to the need for expensive high-frequency dielectric substrates are solved. The radar system circuit stack can be disassembled, the antenna layer can be optimized separately, and the device layer and low-frequency circuit layer can be reused, further reducing the development cost of the radar system.

[0061] In an optional embodiment of the present invention, both the first waveguide structure 14 and the second waveguide structure 23 include waveguide ports 3, and the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23 are opposite to each other and polarization-matched. Since the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23 are opposite to each other and polarization-matched, the electromagnetic signal output from the first waveguide structure 14 can be transmitted to the second waveguide structure 23 via the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23.

[0062] Specifically, the first waveguide structure 14 can be fabricated on the first low-frequency dielectric substrate 12 using printed circuit technology. For example, a space with a metal inner wall can be provided on the first low-frequency dielectric substrate 12, which is the first waveguide structure 14. In this case, the waveguide port 3 of the first waveguide structure 14 is flush with the side of the first low-frequency dielectric substrate 12 that is away from the first radio frequency dielectric substrate 11.

[0063] Specifically, the second waveguide structure 23 can be fabricated on the second low-frequency dielectric substrate 22 using printed circuit technology. For example, a space with a metal inner wall can be provided on the second low-frequency dielectric substrate 22, which is the second waveguide structure 23. In this case, the waveguide port 3 of the second waveguide structure 23 is flush with the side of the second low-frequency dielectric substrate 22 that is away from the second radio frequency dielectric substrate 21.

[0064] In an optional embodiment of the present invention, the first transition component 1 and the second transition component 2 are detachably connected, and there is an assembly gap 50 between the first transition component 1 and the second transition component 2. The transmission line transition structure further includes a gap waveguide structure 4. The assembly gap 50 includes a propagation gap 501 and a spatial gap 502. The propagation gap 501 is located between the first waveguide structure 14 and the second waveguide structure 23. The gap waveguide structure 4 is used to suppress the propagation of electromagnetic signals in the spatial gap 502 other than the propagation gap 501.

[0065] Ideally, the relative distance between the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23 is such that almost all of the electromagnetic signal of the first waveguide structure 14 is conducted to the second waveguide structure 23. Since the first transition component 1 and the second transition component 2 are detachably connected, there may be an assembly gap 50 between the first transition component 1 and the second transition component 2 during actual assembly. At this time, part of the electromagnetic signal output by the first waveguide structure 14 will be transmitted to the second waveguide structure 23 through the propagation gap 501, and another part will be transmitted to other spaces through the spatial gap 502 in the assembly gap 50, resulting in electromagnetic signal loss. Since the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 are opposite to each other, there is also an assembly gap 50, i.e., a propagation gap 501, between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23. The gap waveguide structure 4 refers to a structure that can suppress the propagation of electromagnetic signals in the spatial gap 502 other than the propagation gap 501 between the first waveguide structure 14 and the second waveguide structure 23. By setting the gap waveguide structure 4, most of the electromagnetic signals can be transmitted from the waveguide port 3 of the first waveguide structure 14 to the waveguide port 3 of the second waveguide structure 23, thereby achieving low-loss transmission of electromagnetic signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23, and suppressing the diffusion and propagation of electromagnetic signals in other spatial regions.

[0066] Based on the above embodiments, the gap waveguide structure 4 includes a periodic printed circuit structure 41 and a metal plane 42. The periodic printed circuit structure 41 surrounds one of the first waveguide structure 14 and the second waveguide structure 23, and the metal plane 42 is disposed on the surface where the other corresponding waveguide port 3 in the first waveguide structure 14 and the second waveguide structure 23 is located; the periodic printed circuit structure 41 and the metal plane 42 are opposite to each other.

[0067] In this structure, by setting up a relative periodic printed circuit structure 41 and a metal plane 42, a gap waveguide structure 4 can be formed. The band-stop principle of the gap waveguide structure 4 is based on electromagnetic theory. When the air gap between an ideal magnetic conductor (PMC) and an ideal electric conductor (PEC) is less than a quarter wavelength, no mode of electromagnetic wave can propagate between the PEC and PMC layers. Since an ideal magnetic conductor does not exist in real life, some periodic structures can be used to construct the effect of an ideal magnetic conductor (PMC), that is, an artificial magnetic conductor (AMC). Since the periodic printed circuit structure 41 surrounds one of the first waveguide structure 14 and the second waveguide structure 23, and the metal plane 42 is disposed on the surface where the other corresponding waveguide port 3 in the first waveguide structure 14 and the second waveguide structure 23 is located, the gap waveguide structure 4 formed by the relative periodic printed circuit structure 41 and the metal plane 42 can suppress the transmission of electromagnetic signals to the spatial gap 502 other than the propagation gap 501 between the first waveguide structure 14 and the second waveguide structure 23, thereby realizing low-loss transmission of electromagnetic signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23, and suppressing the diffusion and propagation of electromagnetic signals in other spatial regions.

[0068] Optionally, in one specific embodiment, such as Figure 3 As shown, a periodic printed circuit structure 41 is disposed on the first low-frequency dielectric substrate 12 and surrounds the first waveguide structure 14. A metal plane 42 is located on the side of the second low-frequency dielectric substrate 22 opposite to the first low-frequency dielectric substrate 12, and is opposite to the periodic printed circuit structure 41. In another specific embodiment, as... Figure 1 As shown, the periodic printed circuit structure 41 is disposed on the second low-frequency dielectric substrate 22 and surrounds the second waveguide structure 23. The metal plane 42 is located on the opposite side of the first low-frequency dielectric substrate 12 and the second low-frequency dielectric substrate 22 and is opposite to the periodic printed circuit structure 41.

[0069] For example, such as Figure 1As shown, a first spacer 15 is provided between the first RF dielectric substrate 11 and the first low-frequency dielectric substrate 12, and a second spacer 25 is provided between the second RF dielectric substrate 21 and the second low-frequency dielectric substrate 22. Multiple periodic printed circuit structures 41 are present. Each periodic printed circuit structure 41 includes a pad 411 and a first conductive via 412. One end of the first conductive via 412 is connected to the pad 411, and the other end of the first conductive via 412 electrically connects the first low-frequency dielectric substrate 12 to the first spacer 15 or electrically connects the second low-frequency dielectric substrate 22 to the second spacer 25. When the metal plane 42 is located on the first low-frequency dielectric substrate 12, one end of the pad 411 is opposite to the metal plane 42, and the other end of the pad 411 is connected to the first conductive via 412. The end of the first conductive via 412 away from the pad 411 passes through the second low-frequency dielectric substrate 22 and is electrically connected to the second partition layer 25. When the metal plane 42 is located on the second low-frequency dielectric substrate 22, one end of the pad 411 is opposite to the metal plane 42, and the other end of the pad 411 is connected to the first conductive via 412. The end of the first conductive via 412 away from the pad 411 passes through the first low-frequency dielectric substrate 12 and is electrically connected to the first partition layer 15.

[0070] The first partition 15 may be made of metal in part or in whole, and the second partition 25 may be made of metal in part or in whole. The pad 411 may be circular, square or other shapes. Therefore, the shape of the pad 411 and the first conductive via 412 is similar to a mushroom. By printing the pad 411 and the first conductive via 412 using printed circuit technology, the pad 411 and the first conductive via 412 can form an artificial magnetic conductor (AMC) with the effect of an ideal magnetic conductor (PMC) in the gap waveguide. The metal plane 42 forms an ideal electrical conductor (PEC). The PEC and PMC will ensure that the electromagnetic wave propagates along the first waveguide structure 14 to the second waveguide structure 23 and suppress the diffusion and propagation of the electromagnetic signal in other spatial regions.

[0071] In an optional embodiment of the present invention, the first partition 15 is provided with a first gap 19, and the first circuit transmission line 13 is used to electromagnetically couple with the first waveguide structure 14 through the first gap 19 to realize the transmission transition of electromagnetic signals.

[0072] The first gap 19 can be located between the first circuit transmission line 13 and the first waveguide structure 14. Through the first gap 19, the first circuit transmission line 13 can realize the electromagnetic coupling of electromagnetic signals from the first circuit transmission line 13 to the first waveguide structure 14, thereby realizing the transmission transition of electromagnetic signals.

[0073] Based on the above embodiment, a conductive patch 5 is provided within the first gap 19. The length of the conductive patch 5 is less than the length of the first gap 19. The first circuit transmission line 13 is used to strengthen the electromagnetic coupling with the first waveguide structure 14 through the conductive patch 5 in the first gap 19, thereby realizing the transmission transition of electromagnetic signals. Therefore, the conductive patch 5 and the inner wall of the first gap 19 can also form a new gap, which can further strengthen the electromagnetic coupling between the first circuit transmission line 13 and the first waveguide structure 14, thereby realizing the transmission transition of electromagnetic signals. The number of conductive patches 5 can be one or more, and is not specifically limited here.

[0074] In an optional embodiment of the present invention, the transmission line transition structure further includes a second conductive via 16, which penetrates the first radio frequency dielectric substrate 11. The second conductive via 16 can suppress the diffusion of electromagnetic signals in the first radio frequency dielectric substrate 11, thereby enabling the electromagnetic signals of the first circuit transmission line 13 to be transmitted to the first waveguide structure 14 with low loss.

[0075] In optional embodiments of the present invention, such as Figure 4 As shown, the transmission line transition structure also includes a first prepreg 17, which is disposed between the first RF dielectric substrate 11 and the first low-frequency dielectric substrate 12. The first prepreg 17 is one of the main materials used in multilayer board production, primarily composed of resin and reinforcing materials. These reinforcing materials are categorized into several types, including fiberglass cloth, paper-based materials, and composite materials. Most prepregs (bonding sheets) used in the fabrication of multilayer printed circuit boards employ fiberglass cloth as the reinforcing material. By placing the first prepreg 17 between the first RF dielectric substrate 11 and the first low-frequency dielectric substrate 12, the connection between the two substrates becomes more stable, preventing them from easily separating.

[0076] Based on the above embodiments, such as Figure 4 As shown, the transmission line transition structure also includes a fourth conductive via 18; the fourth conductive via 18 penetrates the first radio frequency dielectric substrate 11 and the first prepreg 17. The fourth conductive via 18 can suppress the diffusion of electromagnetic signals in the first radio frequency dielectric substrate 11 and the first prepreg 17, thereby enabling the electromagnetic signals of the first circuit transmission line 13 to be transmitted to the first waveguide structure 14 with low loss.

[0077] In one specific embodiment, the transmission line transition structure includes a second conductive via 16 and a fourth conductive via 18. The second conductive via 16 is closer to the first waveguide structure 14 than the fourth conductive via 18, thereby preventing the fourth conductive via 18 from being too close to the first waveguide structure 14 and affecting the transmission of electromagnetic signals. It can also suppress the diffusion of electromagnetic signals in the first radio frequency dielectric substrate 11 and the first prepreg 17.

[0078] In a specific embodiment, such as Figure 5 As shown, the transmission line transition structure includes only the fourth conductive via 18. The number of fourth conductive vias 18 is multiple, which can better suppress the diffusion of electromagnetic signals in the first radio frequency dielectric substrate 11 and the first prepreg 17, so that the electromagnetic signals of the first circuit transmission line 13 can be transmitted to the first waveguide structure 14 with low loss.

[0079] In optional embodiments of the present invention, such as Figure 3 As shown, the second partition 25 is provided with a second gap 26, and the second circuit transmission line 24 is used to electromagnetically couple with the second waveguide structure 23 through the second gap 26 to realize the transmission transition of electromagnetic signals.

[0080] The second gap 26 can be located between the second circuit transmission line 24 and the second waveguide structure 23. Through the second gap 26, the second circuit transmission line 24 can realize the electromagnetic coupling of electromagnetic signals from the second circuit transmission line 24 to the second waveguide structure 23, thus realizing the transmission transition of electromagnetic signals.

[0081] Based on the above embodiment, a conductive patch 5 is provided within the second gap 26, and the length of the conductive patch 5 is less than the length of the second gap 26. The second circuit transmission line 24 is used to strengthen the electromagnetic coupling with the second waveguide structure 23 through the conductive patch 5 in the second gap 26, thereby realizing the transmission transition of electromagnetic signals. Therefore, the conductive patch 5 and the inner wall of the second gap 26 can also form a new gap, which can further strengthen the electromagnetic coupling between the second circuit transmission line 24 and the second waveguide structure 23, thereby realizing the transmission transition of electromagnetic signals. The number of conductive patches 5 can be one or more, and is not specifically limited here.

[0082] In an optional embodiment of the present invention, the transmission line transition structure further includes a third conductive via 27 that penetrates the second radio frequency dielectric substrate 21. The third conductive via 27 can suppress the diffusion of electromagnetic signals in the second radio frequency dielectric substrate 21, thereby enabling the electromagnetic signals of the second circuit transmission line 24 to be transmitted to the second waveguide structure 23 with low loss.

[0083] In optional embodiments of the present invention, such as Figure 4As shown, the transmission line transition structure also includes a second prepreg 29, which is disposed between the second RF dielectric substrate 21 and the second low-frequency dielectric substrate 22. The second prepreg 29 is one of the main materials used in multilayer board production, primarily composed of resin and reinforcing materials. These reinforcing materials are categorized into several types, including fiberglass cloth, paper-based materials, and composite materials. Most prepregs (bonding sheets) used in multilayer printed circuit boards employ fiberglass cloth as the reinforcing material. By placing the second prepreg 29 between the second RF dielectric substrate 21 and the second low-frequency dielectric substrate 22, the connection between the two substrates becomes more stable, preventing them from easily separating.

[0084] Based on the above embodiments, the transmission line transition structure further includes a fifth conductive via 28; the fifth conductive via 28 penetrates the second radio frequency dielectric substrate 21 and the second prepreg 29. The fifth conductive via 28 can suppress the diffusion of electromagnetic signals in the second radio frequency dielectric substrate 21 and the second prepreg 29, thereby enabling the electromagnetic signals of the second waveguide structure 23 to be transmitted to the second circuit transmission line 24 with low loss.

[0085] In a specific embodiment, such as Figure 4 As shown, the transmission line transition structure includes a third conductive via 27 and a fifth conductive via 28. The third conductive via 27 is closer to the second waveguide structure 23 than the fifth conductive via 28, thereby preventing the fifth conductive via 28 from being too close to the second waveguide structure 23 and affecting the transmission of electromagnetic signals. It can also suppress the diffusion of electromagnetic signals in the second radio frequency dielectric substrate 21 and the second prepreg 29.

[0086] In a specific embodiment, such as Figure 5 As shown, the transmission line transition structure includes only the fifth conductive via 28. The number of fifth conductive vias 28 is multiple, which can better suppress the diffusion of electromagnetic signals in the second radio frequency dielectric substrate 21 and the second prepreg 29, so that the electromagnetic signals of the second circuit transmission line 24 can be transmitted to the second waveguide structure 23 with lower loss.

[0087] In an optional embodiment of the present invention, the transmission line transition structure further includes a fixing threaded hole 6 disposed on the first transition component 1 and the second transition component 2. When the fixing threaded hole 6 on the first transition component 1 and the fixing threaded hole 6 on the second transition component 2 are opposite to each other, the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 are opposite to each other and polarization matched. When the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 are opposite to each other and polarization matched, a screw 60 can pass through the fixing threaded hole 6 on the first transition component 1 and the second transition component 2, facilitating the assembly of the first transition component 1 and the second transition component 2.

[0088] Example 2

[0089] Figure 6 This is a schematic diagram of a radar system circuit stack-up architecture provided in Embodiment 2 of the present invention. The radar system circuit stack-up architecture generally consists of an antenna layer 20, a low-frequency layer 30, and a device layer 40, as shown below. Figure 6 As shown, the radar system circuit stack-up architecture provided in Embodiment 2 of the present invention includes a radiating antenna 7, an RF chip 8, a low-frequency device 9, a low-frequency circuit 10, and a transmission line transition structure in any embodiment of the present invention.

[0090] The transmission line transition structure includes a first transition component 1 and a second transition component 2. The first transition component 1 and the radiating antenna 7 constitute the antenna layer 20. The radiating antenna 7 can control the direction of radiated energy, enabling the transmission and reception of signals involved in the radar system. The antenna layer 20 can be processed using multilayer printed circuit board technology or low-temperature co-fired ceramic technology to achieve the transition and conversion of electromagnetic signals from the first waveguide structure 14 to the antenna electromagnetic wave signal.

[0091] The second transition component 2 includes a stacked second radio frequency dielectric substrate 21 and a second low-frequency dielectric substrate 22. A second waveguide structure 23 is provided on the second low-frequency dielectric substrate 22, and a second circuit transmission line 24 is provided on the side of the second radio frequency dielectric substrate 21 opposite to the second low-frequency dielectric substrate 22. The second radio frequency dielectric substrate 21, the second low-frequency dielectric substrate 22, the second waveguide structure 23, and the low-frequency circuit 10 constitute the low-frequency layer 30. The second circuit transmission line 24, the radio frequency chip 8, and the low-frequency device 9 constitute the device layer 40. The radio frequency chip 8 primarily functions to transmit and receive radio frequency signals. The radio frequency chip 8 can convert and transition its signal to the second waveguide structure 23 via the second circuit transmission line 24. The low-frequency device 9 is used in the low-frequency circuit 10, and its low-frequency signal can be electrically connected to the low-frequency circuit 10 through a via electroplating process, enabling low-frequency signal control. The low-frequency layer 30 and the device layer 40 can be integrated using a multilayer printed circuit board process or a low-temperature co-fired ceramic process.

[0092] The above solution, by fabricating a radar system circuit stack architecture based on the transmission line transition structure provided in any embodiment of the present invention, can realize the transition from the first circuit transmission line 13 to the first waveguide structure 14, from the first waveguide structure 14 to the second waveguide structure 23, and from the second waveguide structure 23 to the second circuit transmission line 24. This transition structure can be divided into two parts, the first transition component 1 and the second transition component 2, for separate processing, reducing the types of vias. The first waveguide structure 14 can be fabricated on the first low-frequency dielectric substrate 12 using printed circuit technology, and the second waveguide structure 23 can be fabricated on the second low-frequency dielectric substrate 22 using printed circuit technology, eliminating the need for an expensive high-frequency dielectric substrate in the low-frequency layer 30. Since the first transition component 1 and the second transition component 2 are detachable, the antenna layer 20 formed by the first transition component 1 can be optimized independently, and the device layer 40 and the low-frequency layer 30 can be reused, greatly reducing the cost of the radar system.

[0093] In an optional embodiment of the present invention, the radar system circuit stack-up architecture further includes a signal via extending from the device layer 40 to the low-frequency circuit 10. The signal via is used to electrically connect the radio frequency chip 8 to the low-frequency circuit 10. Depending on the low-frequency circuit 10, the type of signal via will also be different. The signal via can realize the electrical connection of the low-frequency signal of the radio frequency chip 8 to the low-frequency circuit 10, thereby realizing low-frequency signal control.

[0094] In an optional embodiment of the present invention, the first low-frequency dielectric substrate 12 is composed of at least one low-frequency dielectric substrate, that is, the first low-frequency dielectric substrate 12 can be made of a single low-frequency dielectric substrate or can be made by laminating multiple low-frequency dielectric substrates, without specific limitation.

[0095] In an optional embodiment of the present invention, the second low-frequency dielectric substrate 22 is composed of at least one low-frequency dielectric substrate, that is, the second low-frequency dielectric substrate 22 can be made of a single low-frequency dielectric substrate or can be made by laminating multiple low-frequency dielectric substrates, without specific limitation.

[0096] In an optional embodiment of the present invention, the transmission line transition structure includes a gap waveguide structure 4, which is integrated into the antenna layer 20 and the low-frequency layer 30. A mounting gap 50 is provided between the first transition component 1 and the second transition component 2. The mounting gap 50 includes a propagation gap 501 and a spatial gap 502. The propagation gap 501 is located between the first waveguide structure 14 and the second waveguide structure 23. The gap waveguide structure 4 is used to suppress the propagation of electromagnetic signals in the spatial gap 502, excluding the propagation gap 501.

[0097] Since the first transition component 1 is located in the antenna layer 20, that is, the first waveguide structure 14 is also integrated in the antenna layer 20, and the second waveguide structure 23 is integrated in the low-frequency layer 30, by integrating the gap waveguide structure 4 in the antenna layer 20 and the low-frequency layer 30, the propagation of electromagnetic signals in the spatial gap 502 other than the propagation gap 501 can be suppressed. This allows most of the electromagnetic signals to be transmitted from the waveguide port 3 of the first waveguide structure 14 to the waveguide port 3 of the second waveguide structure 23, thereby achieving low-loss transmission of electromagnetic signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23, and suppressing the diffusion and propagation of electromagnetic signals in other spatial regions.

[0098] In an optional embodiment of the present invention, the radar system circuit stack-up architecture physically comprises an antenna layer 20 and an integrated low-frequency layer 30 and a device layer 40. The low-frequency layer 30, device layer 40, and antenna layer 20 are all provided with fixing threaded holes 6, which allow for detachable connection. Specifically, when the antenna layer 20 and the integrated low-frequency layer 30 and device layer 40 are aligned and polarization-matched at the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23, they can be physically fixed with screws 60. The gap waveguide structure 4 facilitates the propagation of electromagnetic signals between the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23, suppressing the diffusion of electromagnetic signals in other spatial regions. When disassembly is required, simply removing the screws 60 allows for separation of the antenna layer 20 and the integrated low-frequency layer 30 and device layer 40.

[0099] Furthermore, since the radar system circuit stack-up architecture is physically composed of an antenna layer 20 and an integrated low-frequency layer 30 and a device layer 40, the antenna layer 20 of the radar system circuit stack-up architecture can be processed and optimized multiple times, and the low-frequency layer 30 and the device layer 40 can be reused.

[0100] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0101] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A transmission line transition structure, characterized in that, Includes a first transition component (1) and a second transition component (2); The first transition component (1) includes a first radio frequency dielectric substrate (11) and a first low frequency dielectric substrate (12) stacked together. The first radio frequency dielectric substrate (11) has a first circuit transmission line (13) on the side away from the first low frequency dielectric substrate (12). The first low frequency dielectric substrate (12) has a first waveguide structure (14). The first circuit transmission line (13) is used to electromagnetically couple with the first waveguide structure (14) to realize the transmission transition of electromagnetic signals. The second transition component (2) includes a stacked second radio frequency dielectric substrate (21) and a second low frequency dielectric substrate (22). The second low frequency dielectric substrate (22) is provided with a second waveguide structure (23). The second waveguide structure (23) is used to polarize match with the first waveguide structure (14) to realize the transmission of electromagnetic signals from the first waveguide structure (14) to the second waveguide structure (23). The second radio frequency dielectric substrate (21) has a second circuit transmission line (24) on the side opposite to the second low frequency dielectric substrate (22). The second circuit transmission line (24) is used to electromagnetically couple with the second waveguide structure (23) to realize the transmission transition of electromagnetic signals. Both the first waveguide structure (14) and the second waveguide structure (23) include waveguide ports (3), and the waveguide ports (3) of the first waveguide structure (14) are opposite to and polarized matched with the waveguide ports (3) of the second waveguide structure (23); The first transition component (1) and the second transition component (2) are detachably connected, and there is an assembly gap (50) between the first transition component (1) and the second transition component (2). The transmission line transition structure also includes a gap waveguide structure (4). The assembly gap (50) includes a propagation gap (501) and a spatial gap (502). The propagation gap (501) is located between the first waveguide structure (14) and the second waveguide structure (23). The gap waveguide structure (4) is used to suppress the propagation of electromagnetic signals in the spatial gap (502) other than the propagation gap (501).

2. The transmission line transition structure according to claim 1, characterized in that, The gap waveguide structure (4) includes a periodic printed circuit structure (41) and a metal plane (42). The periodic printed circuit structure (41) surrounds one of the first waveguide structure (14) and the second waveguide structure (23). The metal plane (42) is disposed on the surface of the other corresponding waveguide port (3) in the first waveguide structure (14) and the second waveguide structure (23). The periodic printed circuit structure (41) and the metal plane (42) are opposite each other.

3. The transmission line transition structure according to claim 2, characterized in that, A first partition layer (15) is provided between the first radio frequency dielectric substrate (11) and the first low frequency dielectric substrate (12), and a second partition layer (25) is provided between the second radio frequency dielectric substrate (21) and the second low frequency dielectric substrate (22). There are multiple periodic printed circuit structures (41). Each periodic printed circuit structure (41) includes a pad (411) and a first conductive via (412). One end of the first conductive via (412) is connected to the pad (411), and the other end of the first conductive via (412) is electrically connected to the first low frequency dielectric substrate (12) and the first partition layer (15) or electrically connected to the second low frequency dielectric substrate (22) and the second partition layer (25).

4. The transmission line transition structure according to claim 3, characterized in that, The first partition (15) is provided with a first gap (19), and the first circuit transmission line (13) is used to electromagnetically couple with the first waveguide structure (14) through the first gap (19) to realize the transmission transition of electromagnetic signals; And / or, the second partition (25) is provided with a second gap (26), and the second circuit transmission line (24) is used to electromagnetically couple with the second waveguide structure (23) through the second gap (26) to realize the transmission transition of electromagnetic signals.

5. The transmission line transition structure according to claim 4, characterized in that, A conductive patch (5) is provided in the first gap (19) and / or the second gap (26), and the length of the conductive patch (5) is less than the length of the first gap (19) and the second gap (26); The first circuit transmission line (13) is used to enhance the electromagnetic coupling with the first waveguide structure (14) through the conductive patch (5) of the first gap (19) to realize the transmission transition of electromagnetic signals; The second circuit transmission line (24) is used to enhance the electromagnetic coupling with the second waveguide structure (23) through the conductive patch (5) of the second gap (26) to realize the transmission transition of electromagnetic signals.

6. The transmission line transition structure according to claim 1, characterized in that, The transmission line transition structure further includes at least one of the following: The second conductive via (16) penetrates the first radio frequency dielectric substrate (11); The third conductive via (27) penetrates the second radio frequency dielectric substrate (21); The first prepreg (17) is disposed between the first radio frequency dielectric substrate (11) and the first low frequency dielectric substrate (12); The second prepreg (29) is disposed between the second radio frequency dielectric substrate (21) and the second low frequency dielectric substrate (22); A fixed threaded hole (6) is provided on the first transition component (1) and the second transition component (2), and when the fixed threaded hole (6) on the first transition component (1) and the fixed threaded hole (6) on the second transition component (2) are opposite to each other, the waveguide port (3) of the first waveguide structure (14) is opposite to the waveguide port (3) of the second waveguide structure (23) and polarization matched.

7. The transmission line transition structure according to claim 6, characterized in that, The transmission line transition structure further includes at least one of the following: The fourth conductive via (18) penetrates the first radio frequency dielectric substrate (11) and the first prepreg (17); The fifth conductive via (28) penetrates the second radio frequency dielectric substrate (21) and the second prepreg (29).

8. A radar system circuit stacked architecture, comprising an antenna layer (20), a low-frequency layer (30), and a device layer (40), characterized in that, The radar system circuit stack-up architecture includes a radiating antenna (7), a radio frequency chip (8), a low-frequency device (9), a low-frequency circuit (10), and a transmission line transition structure as described in any one of claims 1-7; The transmission line transition structure includes a first transition component (1) and a second transition component (2), wherein the first transition component (1) and the radiating antenna (7) constitute an antenna layer (20); The second transition component (2) includes a stacked second radio frequency dielectric substrate (21) and a second low frequency dielectric substrate (22). The second low frequency dielectric substrate (22) is provided with a second waveguide structure (23). The second radio frequency dielectric substrate (21) is provided with a second circuit transmission line (24) on the side away from the second low frequency dielectric substrate (22). The second radio frequency dielectric substrate (21), the second low frequency dielectric substrate (22), the second waveguide structure (23) and the low frequency circuit (10) constitute a low frequency layer (30); The second circuit transmission line (24), the radio frequency chip (8), and the low frequency device (9) constitute the device layer (40).

9. The radar system circuit stack-up architecture according to claim 8, characterized in that, The first low-frequency dielectric substrate (12) is composed of at least one low-frequency dielectric substrate; The second low-frequency dielectric substrate (22) is composed of at least one low-frequency dielectric substrate.

10. The radar system circuit stack-up architecture according to claim 8, characterized in that, The low-frequency layer (30) and the device layer (40) are manufactured as a single unit; The low-frequency layer (30), the device layer (40) and the antenna layer (20) are all provided with fixing threaded holes (6), and the low-frequency layer (30), the device layer (40) and the antenna layer (20) are used to achieve detachable connection through the fixing threaded holes (6).

11. The radar system circuit stack-up architecture according to claim 8, characterized in that, The transmission line transition structure further includes a gap waveguide structure (4), which is integrated in the antenna layer (20) and the low-frequency layer (30); There is an assembly gap (50) between the first transition component (1) and the second transition component (2), the assembly gap (50) includes a propagation gap (501) and a spatial gap (502), the propagation gap (501) is located between the first waveguide structure (14) and the second waveguide structure (23), and the gap waveguide structure (4) is used to suppress the propagation of electromagnetic signals in the spatial gap (502) other than the propagation gap (501).

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