Electronic module and device

Abstract

Electronic modules and apparatuses are disclosed. An electronic module includes a rigid printed circuit member having a first electrode, a flexible printed wiring member having a second electrode, and a solder member having a first portion, a second portion, and a third portion. A first direction is perpendicular to a joint surface between the first electrode and the solder member, and a second direction is parallel to the joint surface between the first electrode and the solder member. In the first direction, a second region of the first electrode partially overlaps a leading edge of the second electrode. In the second direction, the second portion is located between the first portion and the third portion, and is joined to each of the first portion and the third portion. A height of the third portion from a reference surface is greater than a height of the second portion from the reference surface and less than a height of the first portion from the reference surface, the reference surface including the joint surface.

Description

Technical Field

[0001] This disclosure relates to an electronic module having a configuration in which flexible printed wiring components are bonded to rigid printed wiring components using solder. Background Technology

[0002] The technique of using solder to bond flexible printed wiring components to rigid printed wiring components is known. Japanese Patent Application Publication No. 2021-168378 discusses an imaging sensor module having a configuration in which a flexible wiring board is connected to a printed wiring board at a connection portion using solder.

[0003] In techniques for bonding flexible printed wiring components to rigid printed wiring components using solder, it is desirable to improve the strength of the connection between the printed wiring board and the flexible wiring substrate. Summary of the Invention

[0004] This disclosure relates to providing techniques that improve the connection strength between rigid printed wiring components and flexible printed wiring components.

[0005] According to one aspect of this disclosure, an electronic module includes: a rigid printed circuit component including a first electrode; a flexible printed wiring component including a second electrode; and a solder component bonded to each of the first and second electrodes, wherein, with a first direction perpendicular to the bonding surface between the first electrode and the solder component and a second direction parallel to the bonding surface between the first electrode and the solder component, the solder component includes: a first portion located in the first direction between the rigid printed circuit component and a first region of the second electrode, wherein the first portion includes one end of the bonding surface between the second electrode and the solder component; and a second portion located in the first direction between the rigid printed circuit component and a first region of the second electrode. Between a first region of the first electrode and a second region of the second electrode, and a third portion located on the second region of the first electrode in a first direction, wherein the third portion includes one end of a bonding surface between the first electrode and a solder member, wherein in the first direction, the second region of the first electrode partially overlaps with the leading edge of the second electrode, wherein in the second direction, the second portion is located between the first portion and the third portion and is continuous to each of the first portion and the third portion, and wherein the height of the third portion from a reference surface is greater than the height of the second portion from the reference surface and less than the height of the first portion from the reference surface, the reference surface including the bonding surface between the first electrode and the solder member.

[0006] Other features of this disclosure will become clear from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0007] Figure 1A and Figure 1B Each diagram illustrates a schematic of the electronic module.

[0008] Figure 2 It is a schematic diagram of the electronic module.

[0009] Figures 3A to 3G Each diagram illustrates a schematic of the electronic module.

[0010] Figure 4A and Figure 4B Each diagram illustrates a schematic of the electronic module.

[0011] Figure 5A and Figure 5B Each of these is a schematic diagram illustrating an image capture unit.

[0012] Figure 6A and Figure 6B Each of these is a schematic diagram illustrating an image capture unit.

[0013] Figure 7 It is a schematic diagram of an electronic device. Detailed Implementation

[0014] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In the following description and drawings, common components in the plurality of figures are indicated by the same reference numerals.

[0015] Therefore, multiple figures will be cross-referenced to describe common components, and descriptions of components indicated by the same reference numerals will be omitted as appropriate.

[0016] Figure 1A and Figure 1B This is a partially enlarged schematic diagram of electronic module 14. Electronic module 14 includes circuit components 11 and wiring components 12. Circuit component 11 includes pad electrodes 9. Wiring component 12 includes connection electrodes 4. Electronic module 14 includes solder components 5 that engage with each of the pad electrodes 9 and connection electrodes 4. Circuit components 11 and wiring components 12 are electrically and mechanically connected to solder components 5. Figure 1AThis is an enlarged view of the connection portion 10, which includes solder components 5 and electrically and mechanically connects circuit components 11 and wiring components 12. Circuit component 11 is a rigid printed circuit component. The rigid printed circuit component is hereinafter simply referred to as circuit component 11. Circuit component 11 is called a printed circuit board (PCB) and is also referred to as a rigid printed wiring component. A predetermined wiring pattern is formed on circuit component 11. Circuit components such as integrated circuit components and passive components are mounted on circuit component 11. Wiring component 12 is a flexible printed wiring component. The flexible printed wiring component is hereinafter simply referred to as wiring component 12. Wiring component 12 has a configuration in which a predetermined wiring pattern is formed on a flexible insulating substrate. Wiring component 12 is called a flexible printed circuit (FPC) and is also referred to as a flexible printed circuit component. Two or more wiring components 12 can be connected to circuit component 11.

[0017] The circuit component 11 includes an insulating substrate 6 and a conductive layer 7 supported on the insulating substrate 6. An insulating layer 8 covers each of the insulating substrate 6 and the conductive layer 7. An opening 80 is provided in the insulating layer 8 between a rearward insulating portion 81 and a forward insulating portion 82. A solder pad electrode 9 corresponds to a portion of the conductive layer 7 not covered by the insulating layer 8, i.e., the portion located below the opening 80. At least a portion of the solder component 5 is located between the rearward insulating portion 81 and the forward insulating portion 82 of the insulating layer 8.

[0018] The wiring component 12 includes an insulating substrate material 1 and a wiring layer 2 supported on the insulating substrate material 1. A cover layer 3 covers the insulating substrate material 1 and the wiring layer 2. The wiring layer 2 is located between the insulating substrate material 1 and the cover layer 3. The connecting electrode 4 corresponds to the portion of the wiring layer 2 that is not covered by the cover layer 3.

[0019] The following description is given under the following assumptions: The direction perpendicular to the bonding surface between the pad electrode 9 and the solder member 5 is defined as the Z direction, and the directions parallel to the bonding surface between the pad electrode 9 and the solder member 5 are defined as the X and Y directions. The X and Y directions intersect the Z direction or are generally perpendicular to the Z direction. In the X direction, the backward insulating portion 81 and the forward insulating portion 82 are positioned side by side through the opening 80. The direction intersecting the X direction is defined as the Y direction. The direction intersecting the X direction is generally perpendicular to the Y direction. The +X direction is referred to as the forward direction and the -X direction is referred to as the backward direction.

[0020] An exemplary embodiment is described assuming that the connection portion 10 is divided into multiple regions in the X direction. The connection portion 10 is divided into a rearward region 26, an intermediate region 27, and a forward region 28. The intermediate region 27 is located between the rearward region 26 and the forward region 28. The forward region 28 includes the leading edge of the connection electrode 4.

[0021] The intermediate region 27 can be continued into each of the backward region 26 and the forward region 28. The backward region 26, the intermediate region 27 and the forward region 28 each include the area or portion of the pad electrode 9 or solder component 5 that overlaps with the corresponding connecting electrode 4 in the Z direction.

[0022] The backward region 26 includes the backward region 91 of the pad electrode 9, the backward region 41 of the connecting electrode 4, and the backward portion 51 of the solder component 5. The backward region 91 of the pad electrode 9 includes a first backward region 96 and a second backward region 97. The backward region 41 of the connecting electrode 4 includes a first backward region 46, a second backward region 47, and a third backward region 48. The backward portion 51 of the solder component 5 includes a first backward portion 56, a second backward portion 57, and a third backward portion 58.

[0023] In the X direction, a first rearward region 96 is located between a second rearward region 97 and an intermediate region 92. The first rearward region 96 is connected to each of the second rearward region 97 and the intermediate region 92. A second rearward region 47 is located between a first rearward region 46 and a third rearward region 48. The second rearward region 47 can be connected to each of the first rearward region 46 and the third rearward region 48. A first rearward region 46 is located between a second rearward region 47 and an intermediate region 42. The first rearward region 46 can be connected to each of the second rearward region 47 and the intermediate region 42. A second rearward portion 57 is located between a first rearward portion 56 and a third rearward portion 58. The second rearward portion 57 can be connected to each of the first rearward portion 56 and the third rearward portion 58. In the X direction, a first rearward portion 56 is located between a second rearward portion 57 and an intermediate portion 52. The first rearward portion 56 can be connected to each of the second rearward portion 57 and the intermediate portion 52.

[0024] In the Z-direction, the backward portion 51 of the solder member 5 is located between the circuit member 11 and the backward region 41 of the connecting electrode 4. The backward portion 51 is bonded to each of the backward regions 41 and 91. In the Z-direction, the first backward portion 56 of the solder member 5 is located between the first backward region 96 of the pad electrode 9 and the first backward region 46 of the connecting electrode 4. In the Z-direction, the second backward portion 57 of the solder member 5 is located between the second backward region 97 of the pad electrode 9 and the second backward region 47 of the connecting electrode 4.

[0025] The first rearward portion 56 is joined to each of the first rearward regions 46 and 96. In contrast, the second rearward portion 57 is joined to the second rearward region 47 and spaced apart from the second rearward region 97.

[0026] The boundary between the first backward region 96 and the second backward region 97 can be determined based on whether these regions are engaged with the solder component 5. Specifically, in the backward region 91, the first backward region 96 is engaged with the solder component 5 and the second backward region 97 is not engaged with the solder component 5.

[0027] In the Z direction, the third backward portion 58 of the solder component 5 is located between the backward insulating portion 81 of the insulating layer 8 and the third backward region 48 of the connecting electrode 4. The third backward portion 58 is bonded to the third backward region 48. In the Z direction, the backward insulating portion 81 of the insulating layer 8 is located between the conductive layer 7 and the backward portion 51. Specifically, in the Z direction, the backward insulating portion 81 of the insulating layer 8 is located between the conductive layer 7 and the third backward portion 58. The boundary portion between the second backward region 47 and the third backward region 48 can be determined based on whether these regions overlap with the insulating layer 8. Specifically, in the backward region 41, the third backward region 48 overlaps with the insulating layer 8 and the second backward region 47 does not overlap with the insulating layer 8.

[0028] The intermediate region 27 includes the intermediate region 92 of the pad electrode 9, the intermediate region 42 of the connecting electrode 4, and the intermediate portion 52 of the solder component 5.

[0029] In the X direction, the intermediate region 92 of the pad electrode 9 is located between the rearward region 91 and the forward region 93 of the pad electrode 9. The intermediate region 92 of the pad electrode 9 can be connected to each of the rearward region 91 and the forward region 93 of the pad electrode 9. In the X direction, the intermediate portion 52 of the solder component 5 is located between the rearward portion 51 and the forward portion 53 of the solder component 5. The intermediate portion 52 of the solder component 5 can be connected to each of the rearward portion 51 and the forward portion 53 of the solder component 5.

[0030] In the Z direction, the intermediate portion 52 of the solder component 5 is located between the intermediate region 92 of the pad electrode 9 and the intermediate region 42 of the connecting electrode 4. The intermediate portion 52 is bonded to each of the intermediate regions 42 and 92.

[0031] The forward region 28 includes a forward region 93 of the pad electrode 9, a forward region 43 of the connecting electrode 4, and a forward portion 53 of the solder component 5. Both the forward region 28 and the forward region 43 include a leading edge 40 of the connecting electrode 4. The forward region 93 of the pad electrode 9 includes a first forward region 94 and a second forward region 95. The forward portion 53 of the solder component 5 includes a first forward portion 54 and a second forward portion 55.

[0032] In the X direction, a first forward region 94 is located between a second forward region 95 and an intermediate region 92. The first forward region 94 can be connected to both the second forward region 95 and the intermediate region 92. In the X direction, a first forward portion 54 is located between a second forward portion 55 and an intermediate portion 52. The first forward portion 54 can be connected to each of the second forward portion 55 and the intermediate portion 52.

[0033] In the Z direction, the forward portion 53 of the solder member 5 is located above the forward region 93 of the pad electrode 9. In the Z direction, the leading edge 40 of the connecting electrode 4 is located above the forward region 93 of the pad electrode 9. Therefore, in the Z direction, a portion of the forward region 93 of the pad electrode 9 overlaps with the leading edge 40 of the connecting electrode 4. The portion of the forward region 93 of the pad electrode 9 that overlaps with the leading edge 40 of the connecting electrode 4 may correspond to the boundary portion between the first forward region 94 and the second forward region 95. In the Z direction, the first forward portion 54 of the solder member 5 is located between the first backward region 94 of the pad electrode 9 and the forward region 43 of the connecting electrode 4. In the Z direction, the second forward portion 55 of the solder member 5 is located above the second forward region 95 of the pad electrode 9, does not overlap with the connecting electrode 4, and is not located between the connecting electrode 4 and the pad electrode 9. The boundary portion between the first forward region 94 and the second forward region 95 may be determined based on whether these regions overlap with the connecting electrode 4. Specifically, in the forward region 93, the first forward region 94 overlaps with the connecting electrode 4 and the second forward region 95 does not overlap with the connecting electrode 4.

[0034] The rearward portion 51 includes one end 546 of the bonding surface between the solder member 5 and the connecting electrode 4. In this exemplary embodiment, the third rearward portion 58 includes one end 546 of the bonding surface between the solder member 5 and the connecting electrode 4. The forward portion 53 includes the other end 548 of the bonding surface between the solder member 5 and the connecting electrode 4. In this exemplary embodiment, the second forward portion 55 includes the other end 548 of the bonding surface between the solder member 5 and the connecting electrode 4.

[0035] The forward portion 53 includes one end 598 of the bonding surface between the solder member 5 and the pad electrode 9. In this exemplary embodiment, the second forward portion 55 includes one end 598 of the bonding surface between the solder member 5 and the pad electrode 9. The backward portion 51 includes the other end 594 of the bonding surface between the solder member 5 and the pad electrode 9. In this exemplary embodiment, the third backward portion 58 includes the other end 594 of the bonding surface between the solder member 5 and the pad electrode 9.

[0036] As described above, the range of the rear portion 51 extends from the boundary between the rear portion 51 and the intermediate portion 52 to one end 546. The range of the front portion 53 extends from the boundary between the front portion 53 and the intermediate portion 52 to one end 598.

[0037] In the X direction, the rear portion 51 is located between the rear insulating portion 81 and the intermediate portion 52. In the X direction, the front portion 53 is located between the front insulating portion 82 and the intermediate portion 52.

[0038] Figure 2 The figure illustrates the height of each portion of the solder member 5 from the reference surface. In this exemplary embodiment, a flat surface including the joint surface between the pad electrode 9 and the solder member 5 is defined as the reference surface. The joint surface between the pad electrode 9 and the solder member 5 is formed by an alloy layer including the constituent metal of the pad electrode 9 and the constituent metal of the solder member 5. For ease of illustration, in Figure 2 the illustration of some components is omitted. The height of each portion of the solder member 5 from the reference surface is represented by the peak height of each portion of the solder member 5 from the reference surface.

[0039] In this exemplary embodiment, the height Hc of the front portion 53 from the reference surface is greater than the height Hb of the intermediate portion 52 from the reference surface (Hc>Hb). The height Ha of the rear portion 51 from the reference surface is greater than the height Hb of the intermediate portion 52 from the reference surface (Ha>Hb). The height Ha of the rear portion 51 from the reference surface is greater than the height Hc of the front portion 53 from the reference surface (Ha>Hc).

[0040] Therefore, the height Hc of the front portion 53 from the reference surface is greater than the height Hb of the intermediate portion 52 from the reference surface, and less than the height Ha of the rear portion 51 from the reference surface (Hb<Hc<Ha).

[0041] In Figure 2 the illustrated example, the height Hh of the third rear portion 58 is greater than the height Hf of the first rear portion 56 (Hh>Hf). Therefore, the height Ha of the rear portion 51 is defined by the height Hh. The height Hh corresponds to Figure 1A the height of one end 546 illustrated in. In Figure 2 the illustrated example, the height He of the second front portion 55 is greater than the height Hd of the first front portion 54 (Hd<He). Therefore, the height Hc of the front portion 53 is defined by the height He. The height He corresponds to Figure 1A the height of the other end 548 illustrated in.

[0042] In the connection portion 10 between the connecting electrode 4 and the solder member 5 of the wiring member 12, the area that engages with the solder member 5 extends to the cover layer 3. The maximum height Ha and Hh of the connection portion 10 of the solder member 5 on the cover layer 3 side in the Z direction from the upper surface of the pad electrode 9 is greater than the height of the leading edge of the wiring member 12. One end 546 of the solder member 5 on the cover layer 3 side of the connection portion 10 of the solder member 5 is formed outside the end face of the opening of the insulating layer 8. This configuration increases the volume of the solder member 5 (backward portion 51) on the cover layer 3 side of the connection portion 10 between the connecting electrode 4 and the solder member 5, and forms a chamfered solder member 5. This allows for improved strength of the connection portion 10 of the solder member 5. Figure 1A and Figure 1B In the example shown in the diagram, the bonding surface between the connecting electrode 4 and the solder component 5 is spaced apart from the end face of the cover layer 3. However, the bonding surface between the connecting electrode 4 and the solder component 5 can be positioned to contact the end face of the cover layer 3.

[0043] Ideally, all electrodes on the wiring member 12 may have the shape described in this exemplary embodiment. However, ideally, the electrodes on the wiring member 12 may have this shape at least in the connection portions 10 near both ends of the wiring member 12.

[0044] The forward region 43 of the wiring member 12 can be formed to curve upward from the middle region 42. Therefore, the height Hc of the first forward portion 54 is greater than the height Hb of the middle portion 52. The upward curvature of the wiring member 12 in the forward region 28 increases the volume of the forward portion 53 (first forward portion 54) of the solder member 5. The increased volume of the solder member 5 allows it to withstand high loads. That is, the connection strength of the connection portion 10 of the solder member 5 can be improved.

[0045] The height Hd of the first forward portion 54 from the reference surface and the height He of the second forward portion 55 from the reference surface are greater than the height Hb of the middle portion 52 from the reference surface (Hd & He > Hb). The height Hf of the first backward portion 56 from the reference surface and the height Hh of the third backward portion 58 from the reference surface are greater than the height Hb of the middle portion 52 from the reference surface (Hf & Hh > Hb).

[0046] The length Le of the second forward portion 55 in the X direction can preferably be greater than the height He of the second forward portion 55 (Le>He). The length Ld of the first forward portion 54 in the X direction can preferably be greater than the height Hd of the first forward portion 54 in the X direction (Ld>Hd).

[0047] The length Le of the second forward portion 55 in the X direction can preferably be greater than the length Ld of the first forward portion 54 in the X direction (Le>Ld). In the forward region 28 of the connection portion 10, the length in the X direction from the leading edge of the wiring member 12 to the leading edge of the solder member 5 on the connection electrode 4 is greater than the height of the peak of the connection portion 10 between the connection electrode 4 and the solder member 5 from the upper surface of the pad electrode 9 in the Z direction. This configuration allows the load to be distributed on the solder member 5 and improves the connection strength.

[0048] The height Hh of the rearward portion 51 from the reference surface can preferably be greater than the thickness Ta of the rearward insulating portion 81. The height of the forward portion 53 from the reference surface is less than the thickness Tb of the forward insulating portion 82.

[0049] This configuration improves the connection strength of the connection part 10.

[0050] exist Figure 1A and Figure 1B as well as Figure 2 In the example shown in the diagram, the gap 800 is located in the Z direction between the rear portion 51 and the pad electrode 9. The end face of the cover layer 3 covering the connection electrode 4 is located outside the end face of the opening 80 in the insulating layer 8 of the circuit member 11. The solder member 5 may not be bonded to a portion of the connection electrode 4. However, like Figures 3A to 3C As in the variant shown in the figure, the gap 800 may not be located between the rear portion 51 and the pad electrode 9 in the Z direction.

[0051] exist Figure 1A and Figure 1B as well as Figure 2 In the example illustrated, the second backward portion 57, which is connected to the first backward portion 56 bonded to each of the connection electrode 4 and the pad electrode 9, is bonded to the connection electrode 4 and spaced apart from the pad electrode 9. However, like Figure 3A As in the variant shown in the figure, the second backward portion 57 can be spaced apart from the connecting electrode 4 and can be bonded to the pad electrode 9.

[0052] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3A In the modified example illustrated, the second backward portion 57 is spaced apart from one of the connecting electrode 4 and the pad electrode 9, and is disposed to the other of the connecting electrode 4 and the pad electrode 9. However, as in Figure 3B and Figure 3C As in the variant illustrated in the figure, the third rearward portion 58 and the first rearward portion 56, which overlap with the rearward insulating portion 81, can be formed continuously without forming the second rearward portion 57.

[0053] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3A In the modified example shown in the diagram, the rearward portion 51 is spaced apart from the rearward insulating portion 81. However, as in... Figure 3B and Figure 3C As in the modified example shown in the figure, the rearward portion 51 can contact the rearward insulating portion 81.

[0054] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3B and Figure 3C In the modified example illustrated in the middle, the backward insulating portion 81 is located between the conductive layer 7 and the backward portion 51 in the Z direction. However, as in... Figure 3A As in the variant shown in the figure, the backward insulating portion 81 may not be located between the conductive layer 7 and the backward portion 51 in the Z direction.

[0055] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3E and Figure 3F In the variant shown in the diagram, a second forward portion 55 is provided. However, as in... Figure 3D As in the variant shown in the diagram, if the height of the first forward portion 54 is greater than the height of the middle portion 52, the second forward portion 55 can be omitted.

[0056] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3D and Figure 3F In the modified example shown in the diagram, the height of the first forward portion 54 is greater than the height of the middle portion 52. However, as in... Figure 3E As in the variant shown in the diagram, if the height of the second forward portion 55 is greater than the height of the middle portion 52, then the height of the first forward portion 54 may not be greater than the height of the middle portion 52.

[0057] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3E In the modified example shown in the diagram, the height of the second forward portion 55 is greater than the height of the first forward portion 54. However, as in... Figure 3F As in the variant shown in the diagram, the height of the second forward portion 55 can be equal to or less than the height of the first forward portion 54.

[0058] exist Figure 1A and Figure 1B as well as Figure 2 Examples shown in the diagram, and Figure 3D and Figure 3E In the modified example shown in the diagram, the forward portion 53 is spaced apart from the forward insulating portion 82. However, as in... Figure 3F As in the variant illustrated, the forward portion 53 can contact the forward insulating portion 82. The area connected to the solder member 5 extends to the leading edge of the connecting electrode 4 of the wiring member 12. The connection area between the solder member 5 and the connecting electrode 4 is increased. This allows for reduced peeling between the solder member 5 and the wiring member 12 and improves the connection strength.

[0059] like Figure 3G As shown in the diagram, the length Lb of the middle portion 52 in the X direction can be greater than the length La of the rear portion 51 in the X direction. The length Lb of the middle portion 52 in the X direction can be greater than the length Lc of the front portion 53 in the X direction. The length Lb of the middle portion 52 in the X direction can be greater than the sum of the length La of the rear portion 51 in the X direction and the length Lc of the front portion 53 in the X direction (La+Lc) (Lb>La+Lc).

[0060] like Figure 3G As illustrated, the wiring member 12 can be bent to include a portion where the wiring layer 2 and the insulating substrate material 1 are located between the cover layer 3 and the circuit member 11. In the connection portion 10, the connection electrode 4 is located between the insulating substrate material 1 and the pad electrode 9. Near the connection portion 10, the wiring layer 2 and the cover layer 3 are arranged between the insulating substrate material 1 and the circuit member 11. However, in the portion spaced apart from the connection portion 10 when the wiring member 12 is bent to flip from the inside out, the wiring layer 2 and the insulating substrate material 1 are located between the cover layer 3 and the circuit member 11. Therefore, even when the wiring member 12 is bent, sufficient connection strength can be obtained at the connection portion 10 where the rearward portion 51 and the forward portion 53 are provided. The load on the connection portion 10 between the wiring member 12 and the circuit member 11 can be reduced.

[0061] Furthermore, in the configuration where the wiring member 12 is folded back once, the end of the cover layer 3 covering the connecting electrode 4 is located outside the opening 80 in the insulating layer 8. In other words, the end of the cover layer 3 is located above the rearward insulating portion 81.

[0062] Figure 4A and Figure 4BThis is a cross-sectional view taken along the Y direction and including the connection portion 10. Multiple pad electrodes 9 are arranged along the Y direction in the circuit component 11. The multiple pad electrodes 9 are located between the side insulating portions 83 and 84 of the insulating layer 8. Multiple connection electrodes 4 are arranged along the Y direction in the wiring component 12. Multiple solder components 5 are bonded to any one of the multiple pad electrodes 9 and any one of the multiple connection electrodes 4. The multiple solder components 5 are surrounded by a rear insulating portion 81, a front insulating portion 82, and side insulating portions 83 and 84. Each of the multiple pad electrodes 9 includes not only a facing surface facing the corresponding connection electrode 4, but also a side surface 99 facing the adjacent pad electrode 9. The facing surfaces of each pad electrode 9 extending along the X and Y directions and intersecting (orthogonal) the Z direction. The side surfaces 99 extending along the Z and X directions and intersecting (orthogonal) the Y direction. The side surfaces 99 of each pad electrode 9 face the side surfaces 99 of the adjacent pad electrode 9. Each of the plurality of connection electrodes 4 includes not only a facing surface that faces the corresponding pad electrode 9, but also a side surface 49 that faces the adjacent connection electrode 4.

[0063] The opposing surfaces of each connecting electrode 4 facing the corresponding pad electrode 9 extend along the X and Y directions and intersect (orthogonally) the Z direction. Side surfaces 49 extend along the Z and X directions and intersect (orthogonally) the Y direction. The side surfaces 49 of each connecting electrode 4 face the side surfaces 49 of adjacent connecting electrodes 4. Solder members 5 are bonded to each of the side surfaces 99 of each pad electrode 9 and each of the side surfaces 49 of each connecting electrode 4. The solder members 5 cover the area of ​​each side surface of each connecting electrode 4 and each side surface of each pad electrode 9. This configuration allows for an increase in the connection area of ​​the solder members 5 and improves the connection strength of the connection portion 10.

[0064] Electronic module 14 will now be described in detail.

[0065] The circuit component 11 includes an insulating substrate 6, a conductive layer 7, and an insulating layer 8. The circuit component 11 is formed by stacking multiple conductive layers 7 via the insulating substrate 6. Unlike the wiring component 12, the circuit component 11 is a rigid wiring substrate.

[0066] For example, the circuit component 11 can be formed of glass epoxy material or a ceramic substrate. For example, a planar grid array (LGA) type or a ceramic leadless chip carrier (CLCC) type circuit component 11 can also be used.

[0067] Although this exemplary embodiment illustrates an example of forming four conductive layers 7 in the circuit component 11, the number of conductive layers 7 is not limited to four. One or more conductive layers 7 may be formed in the circuit component 11. Specifically, four or fewer conductive layers 7, or four or more conductive layers 7, may be formed.

[0068] The insulating substrate 6 is an insulating base material formed on a substrate, for example, a rigid composite material. Unlike the insulating base material 1, the insulating substrate 6 is rigid. The insulating material forming the insulating substrate 6 can have electrical insulating properties. For example, the insulating substrate 6 can be a resin substrate obtained by curing a resin such as epoxy resin or a ceramic substrate formed using ceramics.

[0069] Each conductive layer 7 is a conductive layer formed from a metal foil such as copper foil. Each conductive layer 7 includes a wiring pattern. Conductive layers 7 are formed on one or two surfaces of the insulating substrate 6. One or more conductive layers 7 are also formed in the insulating substrate 6. Figures 3A to 3G as well as Figure 4A and Figure 4B Examples of forming four conductive layers 7 are illustrated, including two conductive layers 7 on two surfaces of an insulating substrate 6 and two conductive layers 7 within the insulating substrate 6. Through-holes 13 are formed in the insulating substrate 6 to electrically connect the conductive layers 7. Some of the pad electrodes 9 can be directly connected to the through-holes 13. In the solder member 5 connecting each connecting electrode 4 and each pad electrode 9, the conductors of each of the conductive layers 7 and through-holes 13 are made of a material with higher electrical and thermal conductivity than the insulating material. For example, this material is a metal such as copper or gold.

[0070] Insulating layer 8 is an insulating protective film that protects each circuit formed by conductive layer 7. Insulating layer 8 is formed using a hardened liquid resist agent, film-like solder resist, etc.

[0071] The insulating layer 8 can be referred to as a solder resist layer. The insulating layer 8 is formed to cover a conductive layer 7 on one of the surfaces where the wiring members 12 of the circuit member 11 are connected. In addition, the insulating layer 8 is formed to cover a conductive layer 7 on another surface of the image capture device 15 on which the circuit member 11 is mounted.

[0072] The insulating layer 8 has an opening that exposes each conductive layer 7. The exposed portion of each conductive layer 7 forms a corresponding pad electrode 9. The pad electrode 9 is arranged on, for example, the central portion of the circuit component 11. The upper surface of each pad electrode 9 is electrically connected to an electrode in the wiring component 12 via a solder component 5.

[0073] When using solder component 5 to connect each connecting electrode 4 and each pad electrode 9, the connecting electrode 4 and the pad electrode 9 can be joined and connected to solder component 5 while the solder component 5 is heated to its melting point or higher. Solder component 5 can be, for example, a paste supplied with Sn-3.0% Ag-0.5% Cu solder, Sn-58Bi solder, etc., and flux.

[0074] The wiring component 12 includes an insulating substrate material 1, a wiring layer 2, and a cover layer 3. The wiring component 12 is configured such that one or more conductive layers are formed as wiring layers 2, and conductor layers are stacked via the insulating substrate material 1 as insulating layers 8. Although this exemplary embodiment illustrates an example of forming a single conductive layer 7 in the wiring component 12, the number of conductive layers 7 is not limited to one. Two or more conductive layers 7 may be formed.

[0075] Although not shown, one or more conductive shielding layers, one or more protective films, one or more reinforcing films, etc., may be formed on one or both of the insulating substrate material 1 and the cover layer 3 of the wiring member 12. These layers may cover the entire surface of the wiring member 12 or a portion thereof.

[0076] The insulating substrate material 1 is a sheet or film-like insulating substrate material made of resin or the like, and it has plasticity and flexibility. Therefore, the wiring member 12 is deformable. For example, the wiring member 12 is bendable. The insulating material forming the insulating substrate material 1 can have electrical insulating properties. Examples of insulating materials forming the insulating substrate material 1 include polyimide and polyethylene terephthalate.

[0077] Wiring layer 2 is a conductive layer formed from a metal foil such as copper foil. Wiring layer 2 includes a wiring pattern. Wiring layer 2 is formed on one or two surfaces of the insulating substrate material 1. The conductor forming wiring layer 2 is a material with higher electrical and thermal conductivity than the insulating material. The conductor is a metal such as copper, silver, or gold. Wiring layer 2 may be formed on at least one surface of the insulating substrate material 1.

[0078] Cover layer 3 is an insulating layer that protects each circuit formed by wiring layer 2. Cover layer 3 is formed using a cover film or outer coating. Cover layer 3 is formed to cover wiring layer 2 on the surface of wiring layer 2, which forms insulating substrate material 1.

[0079] At one of the leading edges of the wiring member 12, no cover layer 3 is formed and the wiring layer 2 is exposed. Each connection electrode 4 is formed at the exposed portion 24 of the wiring layer 2. The surface of each connection electrode 4 may be plated with gold or tin. Multiple connection electrodes 4 are arranged at a predetermined pitch. All connection electrodes 4 may be arranged at the same pitch or at different pitches. Therefore, each connection electrode 4 is formed freely in the wiring layer 2 exposed at the leading edge of the wiring member 12. One of the leading edges of the wiring member 12 where the connection electrodes 4 are formed is configured as an insertion terminal.

[0080] Although not shown, another of the leading edges of the wiring member 12 may also be configured to form an insertion terminal for the connecting electrode 4. Alternatively, electrodes with connector assemblies having a surface mount configuration may be exposed on the upper surface of the cover layer 3.

[0081] Although not shown, the wiring component 12 may be provided with a foil-like or mesh-like shielding layer made of silver or the like. Additionally, a protective layer for protecting the shielding layer may be formed on the shielding layer.

[0082] One of the connection electrodes 4 in the wiring member 12, which has connection electrodes 4, is connected to a corresponding pad electrode 9 in the circuit member 11 via a solder member 5. The other connection electrode 4 in the wiring member 12 is connected to a connector mounted on a circuit member (not shown) via a connector assembly mounted on the wiring member 12. Alternatively, the other connection electrode 4 in the wiring member 12 is inserted into a connector mounted on a circuit member (not shown). Further alternatively, the other connection electrode 4 in the wiring member 12 is bonded to a circuit member (not shown) using solder. Thus, the wiring member 12 electrically connects the circuit member 11 and the circuit member to each other.

[0083] Now, refer to Figure 5A and Figure 5B as well as Figure 6A and Figure 6B The electronic module 14 according to this exemplary embodiment is described as being used as an image capture module and is configured to be applied to the image capture unit 400. Figure 5A This is a top schematic diagram illustrating the illustrative configuration of the image capture unit 400. Figure 5B This is a schematic diagram illustrating an exemplary configuration of the image capture unit 400 according to this exemplary embodiment, and it also illustrates the arrangement along... Figure 5A The cross-sectional view taken by line B-B' in the diagram.

[0084] The image capture unit 400 includes a circuit component 11 on which an image capture device 15 is mounted, and a wiring component 12 connected to the circuit component 11. The image capture unit 400 also includes a drive device 410 that moves the circuit component 11. The drive device 410 provides image stabilization functions such as camera shake correction. The electronic module 14, used as the image capture module, includes the circuit component 11, the image capture device 15, a housing 17, and a cover 16. The circuit component 11 is bonded to and fixed to the housing 17 using an adhesive such as an ultraviolet (UV) curable resin. As described below, the electronic module 14 is held on the drive device 410 in a manner that allows the electronic module 14 to move relative to the drive device 410.

[0085] Alternatively, the image capture device 15 can be mounted on a ceramic substrate, and the ceramic substrate and circuit component 11 are connected to a pair of electrodes via solder component 5. In this case, it can also be said that the image capture device 15 is mounted on the circuit component 11.

[0086] Image capture device 15 is a solid-state image sensor such as a complementary metal-oxide-semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor. Image capture device 15 is mounted on circuit member 11 such that it does not contact cover 16 within a hollow portion surrounded by circuit member 11, cover 16 serving as protective glass, and frame 17. Frame 17 may be made of metal or resin. Image capture device 15 is electrically connected to wiring pads 23 of circuit member 11 via metal wiring 18. Wiring pads 23 are, for example, gold-plated. Although this exemplary embodiment illustrates an example with frame 17 mounted, the location of frame 17 is not limited to the upper part near circuit member 11. A substrate may also be embedded in frame 17 in a cavity. Image capture device 15 may also be deployed in a structure with countersunk holes, such as a cavity substrate, where a hollow portion of circuit member 11 is not formed.

[0087] Although not shown, electronic components for the operation of the image capture device 15 are mounted on the circuit member 11. Although not shown, UV-curable resin, thermosetting resin, or a film-like reinforcing member can be used to cover only the two ends in the width direction of the insulating substrate material 1, or the front surface in the width direction. With this configuration, the structure of the connection portion 10 between the reinforcing member 21 and the solder member 5 improves the connection strength. Although Figure 5A and Figure 5B The illustration shows an example of wiring member 12 mounted parallel to the short side of circuit member 11, but wiring member 12 can also be mounted parallel to the long side of circuit member 11. Although Figure 5A and Figure 5BThe illustration shows an example of only one wiring member 12 connected to the circuit member 11, but two or more wiring members 12 can also be connected. If multiple wiring members 12 are installed, they can be led out in the same direction or in different directions.

[0088] The drive device 410 supports the frame 17, allowing the electronic module 14, which is fixed to the frame 17, to move in the X and Y directions and rotate in the θ direction in the XY plane. The drive device 410 moves or rotates the electronic module 14 according to camera shake, thereby enabling camera shake correction.

[0089] The circuit unit connected to the wiring component 12 can be an information processing unit that processes information based on signals obtained by the image capture device 15. Examples of information based on signals obtained by the image capture device 15 include images, image features, and distance information.

[0090] The image capture unit 400 according to this exemplary embodiment has the configuration described above.

[0091] Now, refer to Figure 7 To describe an electronic device including electronic module 14. Figure 7 This is a schematic diagram illustrating a camera configuration as an example of an electronic device according to this exemplary embodiment.

[0092] A digital camera 100, serving as an example image capturing device used as an electronic device according to this exemplary embodiment, is, for example, a mirrorless camera with interchangeable lenses. The digital camera 100 includes a camera body 200 and an interchangeable lens 300 detachably mounted on the camera body 200. The interchangeable lens 300 includes a lens barrel 301 and a plurality of lenses 311 housed within the lens barrel 301. A circuit component 11 to which the image capturing device 15 is mounted and a wiring component 12 soldered to the circuit component 11 are stored in a housing 210 of the camera body 200. The wiring component 12 is connected to a connector 430 of a circuit unit 420. A drive device 410 is disposed in the housing 210, and the drive device 410 moves the circuit component 11 relative to the circuit unit 420. A force applied when the circuit component 11 moves relative to the circuit unit 420 is added to the connection portion 10. However, the connection portion 10 according to this exemplary embodiment has high strength, thereby ensuring reliability. The circuit unit 420 processes information based on signals obtained by the image capturing device 15. The wiring component 12 can be configured to establish high-speed and high-capacity communication, enabling the transmission of large amounts of information from the image capture device 15. The image generated by the circuit unit 420 is displayed on the display device 450 via the wiring component 440.

[0093] The image capture device 15 in the electronic module 14 is a solid-state image sensor, such as a CMOS image sensor or a CCD image sensor, that performs photoelectric conversion on the optical image formed by the image capture optical system. As described above, the digital camera 100 is configured as an image capture device including the image capture unit 400.

[0094] As described above, according to this exemplary embodiment, even in the event of a drop impact or carrying, such as with a mirrorless camera, the load generated at the connection portion 10 between the wiring member 12 and the circuit member 11 can be reduced, resulting in improved camera performance. While the above exemplary embodiment illustrates an example of an interchangeable lens 300 mounted on a camera body 200 to capture images, this disclosure is not limited to this example. A camera body 200 without the interchangeable lens 300 can also be used in an electronic device.

[0095] Although the above exemplary embodiment illustrates an example where the camera is divided into a camera body 200 and an interchangeable lens 300, an integrated camera in which the lens is mounted in the camera body 200 may also be used.

[0096] While the above exemplary embodiments illustrate an example of a camera being used as an image capturing device as an example of an electronic device, this disclosure is not limited to that example.

[0097] [Example 1]

[0098] exist Figure 5A and Figure 5B The layout configuration of the image capture unit 400 shown in the figure includes having Figure 3G The image capture unit 400 of the connection portion 10 in the diagram is made as an image capture unit 400 according to Example 1.

[0099] In the image capture unit 400 according to Example 1, a frame 17 made of resin and having a thickness of 2 mm is used. An image sensor with a flat rectangular surface of 30 mm × 20 mm is used as the image capture device 15. A glass plate (protective glass) with a flat rectangular shape of 28 mm × 38 mm is used as the cover 16.

[0100] The wiring component 12 is configured as follows: the insulating substrate material 1 and the capping layer 3 are made of polyimide material, and the wiring layer 2 and each connecting electrode 4 are made of Cu material. The thickness of each of the flexible wiring substrate material and the capping layer 3 is 12.5 μm, and the thickness of the wiring layer 2 is 12 μm.

[0101] The circuit component 11 uses the following configuration: the insulating substrate 6 is made of glass epoxy material, and the conductive layer 7 and each pad electrode 9 are made of Cu material. The thickness of each of the conductive layer 7 and the pad electrode 9 is approximately 30 μm. An insulating layer 8 is formed of a film resistive agent and has a thickness of 20 μm (Ta = Tb = 20 μm).

[0102] A UV-curable resin is used as the adhesive for fixing the circuit component 11 to the metal frame 17. The metal frame 17 has a profile of 50mm × 60mm.

[0103] The connecting electrodes 4 in wiring component 12 and the pad electrodes 9 in circuit component 11 are connected by solder component 5. The pad electrodes 9 are arranged with a pitch of 0.2 mm. Each pad electrode 9 is 0.15 mm wide and uses 80 traces. The exposed opening size of the pad electrodes 9 in insulating layer 8 is 1.1 mm × 20 mm. The connecting electrodes 4 are arranged with a pitch of 0.2 mm. Each connecting electrode 4 is 0.15 mm wide and uses 80 traces. The exposed opening size of the pad electrodes 9 in cover layer 3 is 1.2 mm from the leading edge. The width of wiring component 12 is 22 mm, which is greater than the 20 mm opening width in insulating layer 8. The pitch between electrodes, the width of each electrode, and the number of electrodes are appropriately set depending on the specifications of electronic module 14.

[0104] Solder component 5 is made of Sn-3.0% Ag-0.5% Cu solder. Drive device 410 is used with an L-shape having a rectangle of 70mm×55mm cut from a rectangle of 85mm×70mm.

[0105] The connecting portion 10 of the solder component 5 is formed with the leading and trailing edges of the wiring component 12 curved upwards. The middle region 42 connecting the leading region 43 and the trailing region 41 of the wiring component 12 is parallel to the upper surface of the pad electrode 9.

[0106] The wiring member 12 is formed to curve upwards within a range (Ld = 0.1 mm) from the leading edge of the wiring member 12 in the backward direction. The leading edge of the wiring member 12 curves upwards only 2 μm from the intermediate region 42. The height of the connecting portion 10 of the solder member 5 from the corresponding pad electrode 9 below the leading edge of the wiring member 12 is 5 μm (Hd = 5 μm). The solder member 5 is bonded to the end face of each connecting electrode 4, and the peak height of the forward portion 53 of the solder member 5 is 17 μm (He = Hc = 17 μm). The length of the second forward portion 55 of the solder member 5 is 0.08 mm (Le = 0.08 mm). The height of the solder member 5 at a position 0.1 mm from the leading edge of the wiring member 12 in the backward direction is 3 μm. In the intermediate region 27 of the connection portion 10 of the solder component 5, the height of the solder component 5 from the upper surface of the pad electrode 9 is 3 μm (Hb = 3 μm). The length of the intermediate region 27 of the connection portion 10 of the solder component 5 is 0.6 mm (Lb = 0.6 mm). The rearward region 41 of the wiring component 12 is located on the rearward side at a position 0.7 mm away from the leading edge of the wiring component 12 (Lb + Ld = 0.7 mm). The wiring component 12 warps in the Z direction from this position. The distance from this position to the rearward insulating portion 81 of the insulating layer 8 is 0.2 mm (Lf = 0.2 mm). Figure 3G In the configuration shown in the diagram, Figure 1A The first rearward portion 56 in the diagram is in contact with the rearward insulating portion 81. Therefore, Figure 1A The second backward portion 57 shown in the diagram is absent, and therefore the third backward portion 58 and the first backward portion 56 are formed continuously. The second backward region 97 and the second backward region 47 are also absent (Lg = 0 mm). The solder member 5 is 35 μm (Hf = 35 μm) above the pad electrode 9 located directly above the end of the backward insulating portion 81 of the insulating layer 8 in the Z direction on the side of the opening 80. The solder member 5 is connected to the connecting electrode 4 within a range from the end of the backward insulating portion 81 of the insulating layer 8 on the side of the opening 80 to a position spaced 0.1 mm apart in the -X direction (Lh = 0.1 mm). The connection portion 10 between the connecting electrode 4 and the solder member 5 is 40 μm (Ha = Hh = 40 μm) above the upper surface of the pad electrode 9 at this location. Satisfactory optical performance of the CMOS image sensor incorporated into the complete image capture unit 400 according to Example 1 is ensured.

[0107] [Example 2]

[0108] The difference between the image capture unit 400 according to Example 2 and the image capture unit 400 according to Example 1 is that it employs... Figure 6A and Figure 6BThe layout configuration of the image capture unit 400 is shown in the figure. Furthermore, the image capture unit 400 according to Example 2 differs from the image capture unit 400 according to Example 1 in that the wiring member 12, as shown... Figure 6A and Figure 6B The image capture unit 400 is drawn out on the opposite side of the drive device 410 and folded back once, as illustrated in the diagram. Other features of the image capture unit 400 according to Example 2 may be the same as those of the image capture unit 400 according to Example 1.

[0109] In the image capture apparatus 400 according to Example 2, which is fully incorporated, satisfactory optical performance of the CMOS image sensor incorporated into the image capture apparatus is ensured. According to Example 2, even in a bent state, the load generated at the connection portion 10 between the wiring member 12 and the circuit member 11 can be reduced. Although not shown, forming hemispherical or semi-elliptical UV-curable resin with a diameter of 3 mm and a height of about 1 mm at both ends of the wiring member 12 can further reduce the load generated at the connection portion 10 of the solder member 5.

[0110] According to the exemplary embodiments described above, a technique can be provided that is beneficial to improving the connection strength between rigid printed wiring components and flexible printed wiring components.

[0111] Without departing from the technical concept of this disclosure, the exemplary embodiments described above can be modified as needed. For example, multiple exemplary embodiments can be combined. Additionally, at least some features in the exemplary embodiments can be deleted or replaced. New features can also be added to at least one of the exemplary embodiments.

[0112] The disclosure in this specification includes not only the features explicitly described herein, but also all features that can be understood from this specification and the accompanying drawings. The disclosure also includes a complementary set of concepts described herein. Specifically, if there is a description of "A is B" in this specification, for example, it is assumed that even if the description of "A is not B" is omitted, this specification discloses or implies "A is not B". This is because the premise of "A is B" takes into account the case of "A is not B".

[0113] While this disclosure has been described with reference to exemplary embodiments, it is to be understood that this disclosure is not limited to the disclosed exemplary embodiments. The scope of the appended claims is to be interpreted in the broadest possible sense to include all such modifications and equivalent structures and functions.

Claims

1. An electronic module, comprising: A rigid printed circuit component, the rigid printed circuit component including a first electrode; A flexible printed wiring component, the flexible printed wiring component including a second electrode; as well as A solder component, said solder component being bonded to each of the first electrode and the second electrode. Wherein, in the case that the direction perpendicular to the bonding surface between the first electrode and the solder component is the first direction and the direction parallel to the bonding surface between the first electrode and the solder component is the second direction, the solder component includes: A first portion, located in the first direction between the rigid printed circuit component and a first region of the second electrode, wherein the first portion includes one end of the bonding surface between the second electrode and the solder component. The second part, located in the first direction between the first region of the first electrode and the second region of the second electrode, and The third portion is located on the second region of the first electrode in the first direction, wherein the third portion includes one end of the bonding surface between the first electrode and the solder component. In the first direction, the second region of the first electrode partially overlaps with the leading edge of the second electrode. In the second direction, the second portion is located between the first portion and the third portion, and is continued to each of the first portion and the third portion. Wherein, the height of the third portion from the reference surface is greater than the height of the second portion from the reference surface but less than the height of the first portion from the reference surface, and the reference surface includes the bonding surface between the first electrode and the solder component. The rigid printed circuit component includes a conductive layer containing the first electrode and an insulating layer covering the conductive layer, and at least a portion of the solder component is located between a first insulating portion and a second insulating portion of the insulating layer. In the second direction, the first portion is located between the first insulating portion and the second portion, and In the second direction, the third portion is located between the second insulating portion and the second portion.

2. The electronic module according to claim 1, wherein, The height of the first portion from the reference surface is greater than the thickness of the first insulating portion.

3. The electronic module according to claim 1, wherein, The third part is in contact with the second insulating part.

4. The electronic module according to claim 1, wherein, The height of the second portion from the reference surface is less than the thickness of the second insulating portion.

5. The electronic module according to claim 1, wherein, The first part is in contact with the first insulating part.

6. The electronic module according to claim 1, wherein, In the first direction, the first insulating portion is located between the conductive layer and the first portion.

7. The electronic module according to claim 1, wherein, In the first direction, the gap is located between the first portion and the first electrode.

8. The electronic module according to claim 1, wherein, The third part further includes a fourth part, which overlaps with the second electrode in the first direction, and the fourth part is at a greater height from the reference surface than the second part is at a greater height from the reference surface.

9. The electronic module according to any one of claims 1 to 7, wherein, The third part further includes a fourth part and a fifth part, wherein the fourth part overlaps with the second electrode in the first direction and the fifth part does not overlap with the second electrode in the first direction.

10. The electronic module according to claim 9, wherein, The fifth part is at a greater height from the reference surface than the fourth part is at a greater height from the reference surface.

11. The electronic module according to claim 9, wherein, The length of the fifth portion in the second direction is greater than the height of the fifth portion from the reference surface.

12. The electronic module according to claim 9, wherein, The fourth part is at a greater height from the reference surface than the second part is at a greater height from the reference surface.

13. The electronic module according to claim 1, wherein, The solder component is bonded to the side surface of the first electrode along the first direction and to the side surface of the second electrode along the first direction.

14. The electronic module according to claim 1, in, The flexible printed wiring component includes a wiring layer containing the second electrode, an insulating substrate material configured to support the wiring layer, and a cover layer covering the wiring layer. The wiring layer is located between the insulating substrate material and the cover layer, and the first electrode is located between the insulating substrate material and the second electrode.

15. The electronic module according to claim 14, wherein, The flexible printed wiring component is bent to include the portion of the wiring layer and the insulating substrate material located between the cover layer and the rigid printed circuit component.

16. An apparatus including an electronic module, comprising: The circuit unit is connected to the rigid printed circuit unit via a flexible printed wiring component. The electronic module is the electronic module according to any one of claims 1 to 14.

17. The apparatus of claim 16, further comprising a driving device configured to move a rigid printed circuit component relative to a circuit unit.

18. The apparatus according to claim 16, wherein, The image capture device is mounted on a rigid printed circuit board component.

19. The apparatus according to claim 18, wherein, The circuit unit is configured to process information based on signals obtained by the image capture device.

Images