Mounting device and mounting method

Abstract

The present application provides a mounting device and a mounting method, which can reduce errors caused by movement of a bonding head and a photographing unit. The mounting device of the embodiment has: a first position relationship calculating unit that calculates a first position relationship between a head mark and an electronic component based on a first image obtained by photographing the head mark and the electronic component held by the bonding head; a second position relationship calculating unit that calculates a second position relationship between the head mark and a substrate mark based on a second image obtained by photographing the substrate mark at a mounting position and a third image obtained by photographing the head mark in a state where the electronic component held by the bonding head faces the mounting area; a third position relationship calculating unit that calculates a third position relationship between the electronic component and the substrate mark based on the first position relationship and the second position relationship; and a positioning mechanism that positions the electronic component and the substrate mark based on the third position relationship.

Description

Technical Field

[0001] This invention relates to an installation device and an installation method. Background Technology

[0002] Electronic components such as semiconductor chips are picked up from wafers or trays, transferred onto a substrate, and pressed against the substrate for mounting. In this mounting process, multiple electronic components may be mounted on a single substrate. For example, in the manufacturing process of micro-LED displays, a device called mass transfer is used to mount multiple micro-light-emitting diodes (LEDs) as electronic components onto a substrate together. In this mounting of multiple electronic components, sometimes unmounted portions or defective portions of electronic components may occur. Unmounted portions are those where no electronic components are mounted. Defective portions are those electronic components that are determined to be defective through inspection. In the case of micro-LEDs, unlit portions can be cited as an example. Unlit portions are those micro-LEDs that are determined not to light up through inspection.

[0003] For defective parts such as unmounted sections or electronic components, a repair process is required. The repair process involves mounting electronic components on the unmounted sections or removing the defective electronic components and then remounting them. In the repair process, electronic components are mounted one by one using connectors. In this case, the electronic components must be precisely positioned in each mounting area on the substrate. For example, in the case of a miniature LED with a size of 20μm square, an accuracy of approximately 1μm is required.

[0004] To position the substrate and electronic components, the following method is used. First, a connector holding the electronic components on its lower end face is positioned above the mounting area of ​​the substrate. A camera capable of simultaneously capturing images in both vertical and horizontal directions is inserted between the connector and the substrate to capture images of the electronic components held on the connector and the mounting area of ​​the substrate, and then the camera is retracted. Next, based on the images captured by the camera, the horizontal relative position of the substrate and the electronic components is identified. Based on this position identification, the connector is positioned, and the electronic components are mounted onto the substrate.

[0005] [Existing Technical Documents]

[0006] [Patent Literature]

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2010-129913 Summary of the Invention

[0008] [The problem the invention aims to solve]

[0009] To insert the imaging unit between the electronic component and the substrate, a large vertical gap is required between them. Therefore, the distance the imaging unit travels to lower the connector and mount the electronic component onto the substrate, causing it to retract between the electronic component and the substrate, becomes longer. This makes it easier for positional shifts to occur due to the movement at the imaging or positioning location. Furthermore, a longer travel distance results in more dust being generated from the mechanism during movement. Moreover, because the imaging unit repeatedly moves in and out, the imaging position changes with each shot, and errors can easily occur in the imaging positions of the vertical cameras.

[0010] The purpose of this invention is to provide an installation device and method that can reduce errors caused by the movement of the connector and the imaging part.

[0011] [Technical means to solve the problem]

[0012] To achieve the aforementioned objective, the mounting apparatus of the embodiment includes: a mounting device having a connector with a head mark, for mounting an electronic component held by the connector to a mounting area of ​​a substrate at a mounting position; a first imaging unit positioned to capture a first image, the first image being captured by photographing the electronic component held by the connector together with the head mark; and a second imaging unit configured to capture a second image and a third image, the second image being captured by photographing the substrate mark provided in the mounting area at the mounting position, and the third image being captured after the second image is captured, with the connector positioned at the mounting position, and the electronic component held by the connector... The head mark is captured by photographing the device with the device facing the mounting area; a first positional relationship calculation unit calculates the positional relationship between the head mark and the electronic component, i.e., a first positional relationship, based on the first image; a second positional relationship calculation unit calculates the positional relationship between the head mark and the substrate mark, i.e., a second positional relationship, based on the second image and the third image; a third positional relationship calculation unit calculates the positional relationship between the electronic component and the substrate mark, i.e., a third positional relationship, based on the first positional relationship and the second positional relationship; and a positioning mechanism positions the electronic component and the substrate mark based on the third positional relationship before mounting the electronic component.

[0013] In the mounting method of this embodiment, a first image is captured using a first imaging unit. The first image is obtained by capturing the electronic component held by the connector with the head mark and the head mark together. A second image is captured using a second imaging unit. The second image is obtained by capturing the substrate mark of the mounting area of ​​the electronic component provided on the substrate. A third image is captured using the second imaging unit. The third image is obtained by capturing the head mark after capturing the second image, with the connector arranged so that the electronic component and the mounting area face each other. A first positional relationship calculation unit calculates the positional relationship between the head mark and the electronic component, i.e., a first positional relationship, based on the first image. A second positional relationship calculation unit calculates the positional relationship between the head mark and the substrate mark, i.e., a second positional relationship, based on the second and third images. A third positional relationship calculation unit calculates the positional relationship between the electronic component and the substrate mark, i.e., a third positional relationship, based on the first and second positional relationships. A positioning mechanism positions the electronic component and the substrate mark based on the third positional relationship. A mounting device mounts the electronic component held by the connector onto the mounting area of ​​the substrate.

[0014] [The effects of the invention]

[0015] In embodiments of the present invention, errors caused by movement of the coupling head and the imaging part can be reduced. Attached Figure Description

[0016] Figure 1 This is a front view of the mounting device for the implementation method and a block diagram showing the control device.

[0017] Figure 2 It means Figure 1 A plan view of the installation device.

[0018] Figure 3 It means Figure 1 A front view of the electronic components of the installation device during handover.

[0019] Figure 4 It means Figure 3 A plan view of the installation device in its current state.

[0020] Figure 5 yes Figure 1 The AA cross-sectional view is a diagram showing the installation of electronic components.

[0021] Figure 6 This is a cross-sectional view showing the front end of the joint.

[0022] Figure 7 (A) Figure 7(F) is an explanatory diagram showing the capture of a first image using a first imaging unit, and an explanatory diagram showing the capture of a second and a third image using a second imaging unit.

[0023] Figure 8 This is a flowchart illustrating the installation sequence performed in the implementation method.

[0024] Figure 9 (A) Figure 9 (C) is a cross-sectional view showing the head marker of the variant example.

[0025] [Explanation of Symbols]

[0026] 1: Installation device

[0027] 2: Electronic components

[0028] 2a: Mounting surface

[0029] 3: Substrate

[0030] 3a: Installation area

[0031] 3b: Substrate marking

[0032] 10: Supply device

[0033] 11: Pallet

[0034] 12: Supply platform

[0035] 13: Platform moving mechanism

[0036] 20: Pickup device

[0037] 21: Pick up the nozzle

[0038] 22: Mobile organization

[0039] 22a: Arm

[0040] 22b: Sliding mechanism

[0041] 22c: Supporting frame

[0042] 22d: Orbit

[0043] 22e: Slider

[0044] 22f: Lifting mechanism

[0045] 23: Tilting Mechanism

[0046] 30: Mounting device

[0047] 40: Substrate carrier

[0048] 41: Support platform

[0049] 42: Platform moving mechanism

[0050] 50: First Shooting Unit

[0051] 60: Second Filming Section

[0052] 61: Framework

[0053] 70: Control device

[0054] 71: Mechanism Control Department

[0055] 72: Image Processing Department

[0056] 73: First positional relationship calculation part

[0057] 74: Second positional relationship calculation part

[0058] 75: Calculation of the third positional relationship

[0059] 76: Storage Department

[0060] 310: Connector

[0061] 311: Joining tools

[0062] 311a: Maintaining surface

[0063] 311b: The surface being maintained

[0064] 312: Adhesive part

[0065] 313: Head Mark

[0066] 314: Maintain the organization

[0067] 315: Maintenance Department

[0068] 315a: Suction port

[0069] 316: Load Control Unit

[0070] 316a: Sleeve

[0071] 316b: Movable shaft

[0072] 317: Rotating Unit

[0073] 317a: outer cylinder

[0074] 317b: Rotating shaft

[0075] 320: Head Movement Mechanism

[0076] 321: Sliding Mechanism

[0077] 321a: Support frame

[0078] 321b: Orbit

[0079] 321c: Slider

[0080] 322: Lifting mechanism

[0081] 322a: Servo motor

[0082] 322b: Track

[0083] 322c: Slider

[0084] P1: Supply Location

[0085] P2: Handover Location

[0086] P3: Installation Location

[0087] α: First image

[0088] β: Second image

[0089] γ: Third image

[0090] S101~S109: Steps. Detailed Implementation

[0091] With reference to the accompanying drawings, embodiments of the present invention (hereinafter referred to as "this embodiment") will be described in detail. Furthermore, the drawings are schematic diagrams, and the dimensions, proportions, etc., of each part include exaggerated portions for ease of understanding.

[0092] [summary]

[0093] like Figures 1-4 As shown, the mounting apparatus 1 of this embodiment includes: a supply device 10 for electronic components 2, a pickup device 20, a mounting device 30, a substrate stage 40, a first imaging unit 50, a second imaging unit 60, and a control device 70. The mounting apparatus 1 performs the mounting in the following manner: the electronic components 2 are picked up from the supply device 10 by the pickup device 20, flipped, and transferred to the mounting device 30, and then mounted on the substrate 3 supported by the substrate stage 40 by the mounting device 30.

[0094] Electronic component 2 is, for example, a thin, rectangular sheet component. In this embodiment, electronic component 2 is a micro-LED. One of the surface and back surfaces of the micro-LED is a mounting surface 2a having electrodes and mounted on a substrate 3. The substrate 3 is, for example, a plate having multiple mounting areas 3a arranged in a matrix for mounting electronic component 2. Electrodes are provided in each mounting area 3a. In this embodiment, the electrodes are substrate marks 3b serving as alignment marks (see reference). Figure 7 (A) Figure 7(F)). In this embodiment, the substrate markings 3b are two parallel straight lines. The electrode portion of the electronic component 2 is bonded to the electrode portion of the mounting region 3a. Therefore, it is necessary to position the electronic component 2 and the mounting region 3a.

[0095] [Supply device]

[0096] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic component 2, which is to be picked up, to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic component 2 that is to be picked up. The supply device 10 includes: a supply platform 12 supporting a tray 11 on which a plurality of electronic components 2 are placed, and a platform moving mechanism 13 for moving the supply platform 12. As the platform moving mechanism 13, for example, a linear guide can be used, which moves a slider on a rail via a ball screw mechanism driven by a servo motor. The supply device 10 moves the electronic component 2, which is to be picked up, from the plurality of electronic components 2 supported on the supply platform 12 by the tray 11 to the supply position P1 via the platform moving mechanism 13.

[0097] The tray 11, which holds the electronic components 2, is a plate on which the electronic components 2 are placed on the upper surface. Although not shown, the tray 11 has recesses formed in a matrix (rows and columns). By placing the electronic components 2 in each recess, the electronic components 2 are arranged in a matrix on the tray 11. In this embodiment, the electronic components 2 are arranged with their mounting surfaces 2a exposed upwards (face up).

[0098] The supply platform 12 is a platform that horizontally supports the tray 11 on which the electronic component 2 is placed. The supply platform 12 is configured to be movable in the horizontal direction via the platform moving mechanism 13. Since the tray 11 is supported on the supply platform 12, it is configured such that as the supply platform 12 moves via the platform moving mechanism 13, the tray 11 and the electronic component 2 placed on the tray 11 can also move in the horizontal direction.

[0099] In addition, such as Figure 1 As shown, in the horizontal direction, the direction in which the supply device 10 and the mounting device 30 are arranged is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Additionally, the direction orthogonal to the plane of the tray 11 is designated as the Z-axis direction or the up-down direction. Furthermore, the direction of rotation in the horizontal direction is designated as the θ-axis direction. However, these directions do not limit the installation direction of the mounting device 1.

[0100] [Pickup Device]

[0101] The pickup device 20 picks up the electronic component 2 from the supply device 10 and transfers the picked-up electronic component 2 to the device of the mounting device 30. The pickup device 20 includes: a pickup nozzle 21, a moving mechanism 22, and a flipping mechanism 23.

[0102] (Pick-up nozzle)

[0103] The pickup nozzle 21 is a mechanism for drawing in and holding the electronic component 2, and for releasing the electronic component 2 by releasing the suction. The pickup nozzle 21 includes a nozzle orifice with an opening at its front end face. The nozzle orifice is connected to a negative pressure generating circuit (not shown) including a vacuum pump, etc. By generating a negative pressure in the circuit, the electronic component 2 is drawn to the front end face of the pickup nozzle 21 and held there. Furthermore, the holding state of the electronic component 2 is released from the front end face by releasing the negative pressure.

[0104] like Figures 1-4 As shown, the moving mechanism 22 is a mechanism that reciprocates the pickup nozzle 21 between the supply position P1 and the transfer position P2, and raises and lowers the pickup nozzle 21 between the supply position P1 and the transfer position P2. Furthermore, the transfer position P2 is the position where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the connector 310, which functions as a receiving unit. The supply position P1 and the transfer position P2 primarily refer to the positions in the XY directions, and not necessarily the positions in the Z-axis direction.

[0105] (Mobile organization)

[0106] The moving mechanism 22 has an arm 22a on which a pickup nozzle 21 is mounted. Moving the arm 22a moves the pickup nozzle 21. The moving mechanism 22 includes a sliding mechanism 22b and a lifting mechanism 22f. The sliding mechanism 22b moves the pickup nozzle 21 back and forth between a supply position P1 and a receiving position P2 by moving the arm 22a on which the pickup nozzle 21 is mounted. Here, the sliding mechanism 22b includes a track 22d extending parallel to the X-axis direction and fixed to a support frame 22c, and a slider 22e that moves along the track 22d. Although not shown, the slider 22e is driven by a ball screw, linear motor, or the like driven by a rotary motor.

[0107] The lifting mechanism 22f moves the pickup nozzle 21 vertically by moving the arm 22a, on which the pickup nozzle 21 is mounted. Specifically, the lifting mechanism 22f can use a linear guide rail, which moves a slider on the rail via a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 is raised and lowered along the Z-axis by the drive of the servo motor.

[0108] (Flipping mechanism)

[0109] A flipping mechanism 23 is disposed between the pickup nozzle 21 and the moving mechanism 22. Here, the flipping mechanism 23 is an actuator comprising a drive source such as a motor that changes the orientation of the pickup nozzle 21, and a rotating guide such as a ball bearing. Changing the orientation refers to rotating 0° to 180° in the vertical direction.

[0110] [Equipped Device]

[0111] The mounting device 30 is a device for mounting electronic components 2 on the mounting area 3a of the substrate 3. The mounting device 30 is as follows: Figure 3 and Figure 4 As shown, the electronic component 2 received from the pickup device 20 is transferred to the installation position P3, as follows. Figure 5 As shown, the component is mounted on the substrate 3. Mounting position P3 is the location where the electronic component 2 is mounted onto the substrate 3. Mounting position P3 primarily refers to the position in the XY direction, but does not necessarily mean the position in the Z-axis direction. The mounting device 30 includes a connector 310 and a head moving mechanism 320.

[0112] (Connector)

[0113] The connector 310 is a device that functions as a receiving part to receive the electronic component 2 from the pick-up nozzle 21 at the junction position P2, and to mount the electronic component 2 onto the substrate 3 at the mounting position P3. The connector 310 holds the electronic component 2 and releases the electronic component 2 after mounting.

[0114] Specifically, the connector 310, such as Figure 6 As shown, it includes: a joining tool 311 and a holding mechanism 314. The joining tool 311 is a light-transmitting plate. Light transmission means that light required for imaging is transmitted through the first imaging unit 50 and the second imaging unit 60, which will be described later. In this embodiment, the joining tool 311 is a circular glass plate. One side of the joining tool 311 faces downward and is a holding surface 311a for holding the electronic component 2. An adhesive portion 312 is provided in the center of the holding surface 311a. The adhesive portion 312 is a component for bonding and holding the electronic component 2. The adhesive portion 312 is, for example, made of polydimethylsiloxane (PDMS).

[0115] The side of the engagement tool 311 opposite to the retaining surface 311a faces upward, and is the retained surface 311b held by the retaining mechanism 314 (described later). A head mark 313 is provided on the retained surface 311b. Figure 6 and Figure 7 (A) Figure 7In (F), the header mark 313 will not appear in the same cross-section as electronic component 2; therefore, for convenience, the header mark 313 is represented by a dashed line. For example... Figure 7 As shown in (D), the head mark 313 is an alignment mark provided on the outside of the electronic component 2 that is adhered and held in the adhesive portion 312, that is, at a position that does not coincide with the electronic component 2 when viewed from above. In this embodiment, two head marks 313 are provided at the positions where the electronic component 2 is clamped when viewed from above. The head mark 313 is a recessed portion in the shape of a circle. Since the joining tool 311 is light-transmitting, the head mark 313 can be photographed from the holding surface 311a side below.

[0116] The holding mechanism 314 is a mechanism for holding the joining tool 311. The holding mechanism 314 includes a holding part 315, a load control part 316, and a rotation unit 317. The holding part 315 is a plate-shaped member that holds the joining tool 311 and releases it from the holding state. Like the joining tool 311, the holding part 315 is formed of a translucent material such as glass. The holding part 315 includes a suction hole 315a. One end of the suction hole 315a opens on the bottom surface of the holding part 315, and the other end opens on the side surface of the holding part 315, communicating with a negative pressure generating circuit (not shown), including a vacuum pump, etc. Therefore, a negative pressure is generated by the negative pressure generating circuit, sucking the joining tool 311 and holding it on the bottom surface of the holding part 315. Furthermore, by releasing the negative pressure, the holding state of the joining tool 311 is released from the bottom surface.

[0117] The load control unit 316 is a component that controls the vertical position of the holding part 315 and the load applied by the holding part 315 to the electronic component 2. The load control unit 316 is an air bearing having a sleeve 316a and a movable shaft 316b. The sleeve 316a has a cylindrical cavity extending vertically through it. The movable shaft 316b is a cylindrical body disposed inside the sleeve 316a in a manner that allows it to move vertically within a specified range. The upper surface of the holding part 315 is mounted on the lower end of the movable shaft 316b. Thus, by using an air bearing, installation can be performed with a low load of 1 N or less.

[0118] The rotating unit 317 has an outer cylinder 317a and a rotating shaft 317b rotatably disposed within the outer cylinder 317a. The rotating shaft 317b is a cylindrical body and is configured to rotate via a belt using a motor (not shown). The lower end of the rotating shaft 317b is mounted to the sleeve 316a of the load control unit 316. Therefore, the rotating unit 317 can rotate the engagement tool 311 held in the load control unit 316 in the horizontal direction. As a result, the rotating unit 317 can position the electronic component 2 held by the engagement tool 311 in the θ-axis direction. Furthermore, the head mark 313 can be photographed from above via the hollow portion of the rotating shaft 317b, the hollow portion of the movable shaft 316b, and the light-transmitting holding portion 315.

[0119] (Head movement mechanism)

[0120] The head moving mechanism 320 is a mechanism that reciprocates the joint head 310 between the junction position P2 and the mounting position P3, and raises and lowers it between the junction position P2 and the mounting position P3. In this embodiment, the head moving mechanism 320, together with the rotating unit 317, functions as a positioning mechanism for positioning the mounting surface 2a of the electronic component 2 relative to the mounting area 3a of the substrate 3. Specifically, the head moving mechanism 320 includes a sliding mechanism 321 and a lifting mechanism 322.

[0121] The sliding mechanism 321 causes the mating head 310 to reciprocate between the engagement position P2 and the mounting position P3. Here, the sliding mechanism 321 includes two tracks 321b extending parallel to the X-axis direction and fixed to the support frame 321a, and a slider 321c that moves along the tracks 321b. Although not shown, the slider 321c is driven by a ball screw, linear motor, or the like driven by a rotary motor.

[0122] Furthermore, although not shown, the sliding mechanism 321 includes a sliding mechanism that allows the engagement head 310 to slide along the Y-axis. The sliding mechanism may also consist of a track along the Y-axis and a slider that moves along the track. The slider is driven by a ball screw, linear motor, or the like, driven by a rotary motor.

[0123] The lifting mechanism 322 moves the coupling head 310 vertically. Specifically, the lifting mechanism 322 can use a linear guide rail, which, through a ball screw mechanism driven by a servo motor 322a, moves the slider 322c on the track 322b. That is, the coupling head 310 is raised and lowered along the Z-axis by the drive of the servo motor 322a.

[0124] [Substrate stage]

[0125] The substrate stage 40 is a mechanism that supports the substrate 3 for mounting electronic components 2 and positions the mounting area 3a at the mounting position P3. The substrate stage 40 positions a support platform 41, on which the substrate 3 is placed, on a stage moving mechanism 42. The stage moving mechanism 42 causes the support platform 41 to slide in the XY plane, positioning the mounting area 3a in the substrate 3 at the mounting position P3. The stage moving mechanism 42 may, for example, use a linear guide rail, which moves a slider along the rail via a ball screw mechanism driven by a servo motor.

[0126] [First Filming Department]

[0127] like Figure 7 As shown in (A), the first imaging unit 50 is positioned to capture images of the electronic component 2 held in the connector 310 together with the head mark 313. Figure 7 As shown in (D), the image captured by the first imaging unit 50, including the electronic component 2 and the head mark 313, is referred to as the first image α. More specifically, the first imaging unit 50 includes a camera, a lens, a lens barrel, a light source, etc., and in this embodiment, it is provided at the junction position P2. In the first imaging unit 50, the camera faces upward and the optical axis is arranged in the vertical direction so as to be able to capture images of the electronic component 2 and the head mark 313 held in the joining tool 311.

[0128] The first imaging unit 50 is configured such that, at the imaging position, i.e., the handover position P2, the electronic component 2 and the head marker 313 will not leave the imaging field of view. At the handover position P2, there is a deviation between the position of the joint head 310 located at the handover position P2 and the holding position of the electronic component 2 after the self-pickup nozzle 21 is transferred to the joint tool 311. That is, the positions of the electronic component 2 and the head marker 313 deviate relative to the handover position P2. The maximum range of the deviation is the range within which the electronic component 2 and the head marker 313 can move to the maximum extent at the handover position P2.

[0129] The first imaging unit 50 is designed to capture images at a magnification sufficient to ensure the necessary installation accuracy, illuminance based on the light source, or brightness required for position identification. Furthermore, considering the maximum range of movement of the head marker 313 at the junction P2, it has an imaging field of view (field of view range) determined according to these conditions. The first imaging unit 50 is positioned at the center of the imaging field of view, coinciding with the junction P2. The first imaging unit 50 is provided independently of the connector 310 and the pickup nozzle 21 in a manner that does not obstruct their movement.

[0130] The first imaging unit 50 is fixedly supported at a position where it can capture the first image α. In this embodiment, the first imaging unit 50 remains stationary relative to the junction position P2 of the electronic component 2. "Still stationary" here means that it does not move between a position retracted from the junction position P2 and the junction position P2. For example, it may move up or down a few millimeters to align with the camera's focus.

[0131] [Second Filming Department]

[0132] like Figure 7 As shown in (B), the second imaging unit 60 captures an image of the substrate mark 3b at the mounting position P3. Then, the coupling head 310 moves to the mounting position P3, as shown... Figure 7 As shown in (C), the head mark 313 is photographed with the electronic component 2 held by the connector 310 facing the mounting area 3a. Figure 7 As shown in (E), the image of substrate mark 3b captured by the second imaging unit 60 is referred to as the second image β. Figure 7 As shown in (F), the image of the head marker 313 captured by the second imaging unit 60 is referred to as the third image γ. Furthermore, in Figure 7 In (E), for ease of understanding, the installation area 3a is represented by a dashed line. Similarly, in Figure 7 In (F), electronic component 2 is represented by a dashed line, and substrate mark 3b is represented by a double dashed line.

[0133] More specifically, the second imaging unit 60 includes a camera, lens, lens barrel, light source, etc., and is supported by a frame 61 above the joint 310 at the mounting position P3. In the second imaging unit 60, the camera faces downward and the optical axis is arranged in the vertical direction so that the head mark 313 can be photographed through the holding part 315.

[0134] The second imaging unit 60 is configured such that the substrate mark 3b of the substrate 3 and the head mark 313 of the connector 310 do not leave the field of view when in the imaging position, i.e., the mounting position P3. There is a deviation in the support position of the substrate 3 placed on the substrate stage 40. That is, the position of the substrate 3 deviates relative to the mounting position P3. Therefore, the position of the substrate mark 3b of the substrate 3 also deviates. The maximum range of this deviation is the maximum range within which the substrate mark 3b of the substrate 3 can move at the mounting position P3. Furthermore, there is a deviation in the position reached by the connector 310 at the mounting position P3. That is, the position of the head mark 313 deviates relative to the mounting position P3. The maximum range of this deviation is the maximum range within which the head mark 313 can move at the mounting position P3.

[0135] The second imaging unit 60 is designed to capture images at a magnification sufficient to ensure the necessary mounting accuracy, and at the illuminance required for illumination based on the light source or for position recognition. Furthermore, considering the maximum range of movement of the substrate mark 3b and the head mark 313 at the mounting position P3, an imaging field of view (field range) is determined based on these conditions. The size of the engagement tool 311 of the engagement head 310 is set according to the imaging field of view of the second imaging unit 60.

[0136] The second imaging unit 60 is positioned at the center of the imaging field of view, coinciding with the installation position P3. The second imaging unit 60 is arranged independently of the connector 310 and the substrate stage 40 in a manner that does not obstruct their movement.

[0137] The second imaging unit 60 is fixedly supported at a position capable of capturing the second image β and the third image γ. In this embodiment, the second imaging unit 60, like the first imaging unit 50, remains stationary relative to the mounting position P3 of the electronic component 2. "Still stationary" here means that it does not move between a position retracted from the mounting position P3 and the mounting position P3; for example, it may move up or down a few millimeters to align with the camera's focus.

[0138] Furthermore, the coordinates of the first imaging unit 50 and the second imaging unit 60 are adjusted to match the coordinates of the mounting device 1. Specifically, the coordinates of the control device 70 are the XY coordinates designed for the mounting device 1, and its origin can be set as the mounting position P3. Alternatively, a fixed point at a predetermined distance from the origin can be set as the handover position P2.

[0139] The coordinates of the second imaging unit 60 are, for example, set such that the imaging center is the origin of the XY coordinate system, and this origin, as mechanical or computational information, coincides with the mounting position P3. In this case, the reference position in the XY coordinate system of the mounting device 1 is the mounting position P3, and the imaging center of the second imaging unit 60 also becomes the same reference position. Furthermore, the coordinates of the first imaging unit 50 are, for example, set such that the imaging center is the origin of the XY coordinate system, and this origin, as mechanical or computational information, coincides with the handover position P2. Since the handover position P2 is a position located at a predetermined distance relative to the mounting position P3, the imaging center of the first imaging unit 50 also has the same reference position as the mounting device 1.

[0140] [Control Device]

[0141] The control device 70 controls the start, stop, speed, and timing of the supply device 10, pickup device 20, mounting device 30, substrate stage 40, first imaging unit 50, and second imaging unit 60. To realize the various functions of the mounting device 1, the control device 70 includes: a processor for executing programs, a memory for storing various information such as programs or operating conditions, and drive circuits for driving each component. Furthermore, the control device 70 is connected to an input device for the operator to input instructions or information required for control, and an output device for confirming the status of the device.

[0142] like Figure 1 As shown, the control device 70 of this embodiment includes a mechanism control unit 71, an image processing unit 72, a first positional relationship calculation unit 73, a second positional relationship calculation unit 74, a third positional relationship calculation unit 75, and a storage unit 76. The mechanism control unit 71 controls the mechanisms of each part of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 40. For example, the mechanism control unit 71 positions the mounting surface 2a of the electronic component 2 relative to the mounting area 3a of the substrate 3 by controlling the rotation unit 317 and the head movement mechanism 320. In addition, the mechanism control unit 71 controls the load applied to the electronic component 2 and the substrate 3 by controlling the load control unit 316.

[0143] The image processing unit 72 processes the first image α captured by the first imaging unit 50 to extract the shapes of the head mark 313 and the electronic component 2. Additionally, the image processing unit 72 processes the second image β and the third image γ captured by the second imaging unit 60 to extract the shapes of the substrate mark 3b and the head mark 313. Furthermore, since the size of the head mark 313 and the distance between multiple head marks 313 are known, even if the size of the head mark 313 and the distance between multiple head marks 313 differ due to the magnification difference between the first imaging unit 50 and the second imaging unit 60, correction can be performed based on the known size and distance data.

[0144] The first positional relationship calculation unit 73 calculates the positional relationship between the head mark 313 of the first image α and the electronic component 2 by detecting their center of gravity, angle, etc. That is, in order to determine their respective positions on a coordinate system with the shooting center of the first shooting unit 50 as the origin, the first positional relationship calculation unit 73 calculates the position coordinates (X, Y, θ) of the head mark 313 of the first image α and the position coordinates (X, Y, θ) of the electronic component 2.

[0145] The second positional relationship calculation unit 74 calculates the positional relationship between the substrate mark 3b of the second image β and the head mark 313 of the third image γ by detecting the center of gravity, angle, etc. Both the second image β and the third image γ are captured by the same second imaging unit 60. Therefore, both the second image β and the third image γ are captured using the same coordinate system of the second imaging unit 60. Furthermore, since they are captured by a fixed second imaging unit 60, there is no origin offset between the second image β and the third image γ. That is, in order to determine the positions of the substrate mark 3b and the head mark 313, which constitute the second positional relationship, on a coordinate system with the imaging center of the second imaging unit 60 as the origin, the second positional relationship calculation unit 74 calculates the position coordinates (X, Y, θ) of the substrate mark 3b of the second image β and the position coordinates (X, Y, θ) of the head mark 313 of the third image γ.

[0146] The third positional relationship calculation unit 75 calculates the positional relationship between the electronic component 2 and the substrate mark 3b, i.e., the third positional relationship, based on the first and second positional relationships. Specifically, it calculates the offset between the position coordinates of the head mark 313 in the first positional relationship and the position coordinates of the head mark 313 in the second positional relationship, and the offset between the position coordinates of the electronic component 2 in the first positional relationship and the position coordinates of the substrate mark 3b in the second positional relationship. In other words, by calculating the offset between the position of the head mark 313 at the intersection position P2 and the position at the mounting position P3, and adding this offset to the offset between the electronic component 2 and the substrate mark 3b, the position of the electronic component 2 at the mounting position P3 relative to the substrate mark 3b can be determined.

[0147] Based on the third positional relationship, the mechanism control unit 71 controls the positioning mechanism (rotation unit 317 and head movement mechanism 320) to move the electronic component 2 with an offset correction and in a movement amount and direction that aligns the electronic component 2 with the substrate mark 3b (within the allowable range of installation). After such positioning, the mechanism control unit 71 lowers the coupling head 310 via the lifting mechanism 322 of the head movement mechanism 320 to install the electronic component 2 onto the mounting area 3a of the substrate 3.

[0148] Furthermore, the image processing unit 72 and the first positional relationship calculation unit 73 may also be configured as the circuitry of the first imaging unit 50. Additionally, the image processing unit 72, the second positional relationship calculation unit 74, and the third positional relationship calculation unit 75 may also be configured as the circuitry of the second imaging unit 60.

[0149] Storage unit 76 is a storage device that includes various types of memory (such as hard disk drives (HDDs) or solid state drives (SSDs)) as recording media, and an interface between the recording media and external devices. Storage unit 76 stores data and programs required for the operation of mounting device 1. Required data includes, for example, a first image α, a second image β, a third image γ, a first positional relationship, a second positional relationship, a third positional relationship, and various thresholds. Additionally, data output by each device is also appropriately stored in storage unit 76. In the following description, data output by each device, such as images captured by the first imaging unit 50 and images captured by the second imaging unit 60, is also equivalent to being stored in storage unit 76.

[0150] [action]

[0151] In the installation device 1 described above, referring to the above... Figures 1-6 , Figure 7 (A) Figure 7 (F) and Figure 8 The flowchart illustrates the sequence of picking up electronic component 2 from supply device 10 via pickup device 20, transferring electronic component 2 to mounting device 30, and mounting electronic component 2 onto substrate 3 in mounting device 30.

[0152] That is, the pickup nozzle 21 is moved to the supply position P1 by the moving mechanism 22 of the pickup device 20. On the other hand, the supply device 10 moves the supply stage 12 so that the electronic component 2 to be picked up is located at the supply position P1. Then, the pickup nozzle 21 descends, gradually approaches the electronic component 2, and stops upon contact with the electronic component 2. Then, with the pickup nozzle 21 stopped, suction from the nozzle orifice begins. In this state, if the pickup nozzle 21 rises, the electronic component 2 sucked by the pickup nozzle 21 is picked up from the tray 11.

[0153] The pickup device 20 flips the pickup nozzle 21 via the flipping mechanism 23. The pickup device 20 then moves the picked-up electronic component 2 to the handover position P2 via the moving mechanism 22. Figure 3 , Figure 4 As shown, at the handover position P2, the connector 310 of the mounting device 30 is in standby mode, facing the electronic component 2 held in the flipped pick-up nozzle 21. The pick-up nozzle 21 is raised toward the connector 310, allowing the electronic component 2 to adhere to and be held on the adhesive portion 312 of the joining tool 311. Then, the negative pressure on the pick-up nozzle 21 is released, thereby handing the electronic component 2 over to the connector 310. The pick-up nozzle 21 then descends to leave the connector 310 and returns to the supply position P1.

[0154] In the stated state, such as Figure 7 (A) Figure 7 As shown in (D), the first imaging unit 50 captures the first image α (step S101). That is, the first imaging unit 50 captures images of the electronic component 2 held on the joining tool 311 and the head mark 313 provided on the joining tool 311. The first positional relationship calculation unit 73 calculates the first positional relationship based on the image after the image processing unit 72 processes the first image α (step S102). In addition, in parallel with this, as Figure 7 (B) Figure 7 As shown in (E), the second imaging unit 60 captures the second image β (step S103). That is, the second imaging unit 60 captures the substrate mark 3b of the substrate 3 supported on the substrate stage 40, with the mounting area 3a located at the mounting position P3.

[0155] Secondly, such as Figure 1 and Figure 2 As shown, the connector 310 moves to the mounting position P3, so that the mounting surface 2a of the electronic component 2 faces the mounting area 3a of the substrate 3 (step S104). Then, as... Figure 7 (C) Figure 7 As shown in (F), the second imaging unit 60 captures the third image γ (step S105). That is, the second imaging unit 60 captures the head mark 313 of the joining tool 311 through the holding unit 315. The second positional relationship calculation unit 74 calculates the second positional relationship based on the image processed by the image processing unit 72 on the second image β and the third image γ (step S106).

[0156] The third positional relationship calculation unit 75 calculates the third positional relationship based on the first and second positional relationships (step S107). That is, it calculates the X, Y, and θ offsets of the head mark 313 and the X, Y, and θ offsets of the electronic component 2 and the substrate mark 3b. Based on the third positional relationship, the mechanism control unit 71 operates the rotation unit 317 and the head movement mechanism 320 to eliminate the offsets, thereby performing positioning (step S108). Then, as... Figure 5 As shown, the lifting mechanism 322 of the head moving mechanism 320 lowers the joint head 310, and the electronic component 2 is mounted on the mounting area 3a of the substrate 3 (step S109).

[0157] [Calculation of positional relationships]

[0158] The calculation of the positional relationships will be explained in more detail below. Furthermore, "in the coordinate system" as used below refers to the position of X, Y, and θ relative to the origin in each coordinate system. First, based on the first image α, the position of the head mark 313 is calculated in the coordinate system of the first imaging unit 50 at the junction position P2. Additionally, the position of the electronic component 2 is calculated in the coordinate system of the first imaging unit 50. Second, based on the second image β at the mounting position P3, the position of the substrate mark 3b is calculated in the coordinate system of the second imaging unit 60. Additionally, based on the third image γ, the position of the head mark 313 is calculated in the coordinate system of the second imaging unit 60. Then, the offset between the position of the head mark 313 in the coordinate system of the first imaging unit 50 and the position of the head mark 313 in the coordinate system of the second imaging unit 60 is determined. Since the head mark 313 is common, the offset corresponds to the offset between the coordinate systems of the first imaging unit 50 and the second imaging unit 60.

[0159] Therefore, by correcting the position of the electronic component 2 in the coordinate system of the first imaging unit 50 using the offset, it can be converted into a position in the coordinate system of the second imaging unit 60. The offset between the position of the electronic component 2 in the coordinate system of the second imaging unit 60 and the substrate mark 3b in the coordinate system of the second imaging unit 60 is equivalent to the offset between the electronic component 2 and the substrate mark 3b at the mounting position P3, which becomes the third positional relationship. The mechanism control unit 71 positions both to eliminate the offset between the electronic component 2 and the substrate mark 3b as the third positional relationship. As a result, the electronic component 2 is mounted into the mounting area of ​​the substrate 3 to be mounted.

[0160] [Effect]

[0161] (1) The mounting device 1 of this embodiment includes: a mounting device 30 having a connector 310 with a head mark 313, which mounts the electronic component 2 held by the connector 310 to the mounting area 3a of the substrate 3 at the mounting position P3; a first imaging unit 50, which is positioned to capture a first image α, the first image α being captured by capturing the electronic component 2 held by the connector 310 together with the head mark 313; and a second imaging unit 60, which is configured to capture a second image β and a third image γ, the second image β being captured by capturing the substrate mark 3b provided in the mounting area 3a at the mounting position P3, and the third image γ being captured by capturing the head mark 313 after capturing the second image β, with the connector 310 positioned at the mounting position P3 and the electronic component 2 held by the connector 310 facing the mounting area 3a.

[0162] In addition, the mounting device 1 includes: a first positional relationship calculation unit 73, which calculates the positional relationship between the head mark 313 and the electronic component 2, i.e., the first positional relationship, based on the first image α; a second positional relationship calculation unit 74, which calculates the positional relationship between the head mark 313 and the substrate mark 3b, i.e., the second positional relationship, based on the second image β and the third image γ; a third positional relationship calculation unit 75, which calculates the positional relationship between the electronic component 2 and the substrate mark 3b, i.e., the third positional relationship, based on the first positional relationship and the second positional relationship; and a positioning mechanism, which positions the electronic component 2 and the substrate mark 3b before mounting the electronic component 2 based on the third positional relationship.

[0163] In addition, in the installation method of this embodiment, a first image α is captured by the first imaging unit 50. The first image α is obtained by capturing the electronic component 2 held by the connector 310 with the head mark 313 together with the head mark 313. A second image β is captured by the second imaging unit 60. The second image β is obtained by capturing the substrate mark 3b of the mounting area 3a of the electronic component 2 provided on the substrate 3. A third image γ is captured by the second imaging unit 60. The third image γ is obtained by capturing the head mark 313 with the connector 310 arranged so that the electronic component 2 and the mounting area 3a face each other after capturing the second image β.

[0164] The first positional relationship calculation unit 73 calculates the positional relationship between the head mark 313 and the electronic component 2, i.e., the first positional relationship, based on the first image α; the second positional relationship calculation unit 74 calculates the positional relationship between the head mark 313 and the substrate mark 3b, i.e., the second positional relationship, based on the second image β and the third image γ; the third positional relationship calculation unit 75 calculates the positional relationship between the electronic component 2 and the substrate mark 3b, i.e., the third positional relationship, based on the first and second positional relationships; the positioning mechanism positions the electronic component 2 and the substrate mark 3b based on the third positional relationship, and the mounting device 30 mounts the electronic component 2 held by the connector 310 onto the mounting area 3a of the substrate 3.

[0165] In this manner, the first image α captured by the first imaging unit 50 and the third image γ captured by the second imaging unit 60 share a common head mark 313, thus eliminating the offset in the positional relationship between the first imaging unit 50 and the second imaging unit 60. Furthermore, since the second image β, including the substrate mark 3b, and the third image γ, including the head mark 313, are captured using the same second imaging unit 60, the positional relationship between the substrate mark 3b and the head mark 313 is fixed. Moreover, since the second imaging unit 60 captures the second image β and the third image γ at the same mounting position P3, no movement error of the second imaging unit 60 occurs. Therefore, the electronic component 2 can be correctly positioned and mounted relative to the mounting area 3a of the substrate 3. Therefore, this embodiment is particularly suitable for situations requiring high-precision mounting of the electronic component 2, such as in the repair process of micro-LEDs.

[0166] Furthermore, the second imaging unit 60 at mounting position P3 only needs to photograph the head mark 313, without photographing the electronic component 2 and the substrate mark 3b, thus simplifying the structure. For example, since there is no need for an imaging unit to simultaneously photograph in both the vertical and horizontal directions, the imaging position does not change with each photograph, and there is no error in the shooting position of the vertical cameras. Since it is not necessary to significantly separate the connector 310 from the substrate 3 to allow the camera to enter, the amount of movement during installation after positioning can be suppressed, reducing movement errors. In particular, since the distance during alignment and installation can be made closer, horizontal offset after alignment can be minimized. Furthermore, at mounting position P3, it is not necessary to identify the electronic component 2 and the substrate mark 3b, so positioning can be performed even if they overlap.

[0167] Furthermore, the cameras used in the first imaging unit 50 and the second imaging unit 60 are not limited to any specific camera, as long as they can capture images of the electronic component 2, the head mark 313, and the substrate mark 3b. However, a common camera that captures visible light can be used, and it is not necessary to use a special camera such as an infrared camera, thus ensuring installation accuracy while reducing device costs.

[0168] (2) The head mark 313 is positioned on the outside of the electronic component 2 held by the connector 310 when viewed from above. Therefore, the head mark 313 and the electronic component 2 can be photographed in a clearly distinguishable manner using the first imaging unit 50. In the PDMS-based holding method described in the above embodiment, it is conceivable that the PDMS film has a large dimensional deviation and the head mark 313 is covered, or that the head mark 313 is contaminated during the formation of the PDMS film, making it impossible to take a picture. However, this situation can be avoided. Of course, even when the electronic component 2 is held by suction, since there is a deviation in the holding position, it is possible to avoid the situation where the head mark 313 is covered and cannot be photographed.

[0169] (3) The bonding head 310 has a bonding tool 311 for holding the electronic component 2 and a holding part 315 for holding the bonding tool 311. The head mark 313 is provided on the bonding tool 311. Therefore, the difference in distance between the electronic component 2, the head mark 313 and the first imaging unit 50 is small. When the first imaging unit 50 captures the first image α, it is easy to focus on both, and the error in position recognition between the two is small. In addition, the second imaging unit 60 is in the mounting position P3, and can capture the head mark 313 at a position close to the substrate 3. Therefore, the focus when capturing the second image β is close to the focus when capturing the third image γ, and the error in position recognition between the substrate mark 3b and the head mark 313 captured is small.

[0170] (4) The joining tool 311 and the holding part 315 are light-transmitting. Therefore, the first shooting part 50 and the second shooting part 60 can capture the head mark 313 from either the top or the bottom. Therefore, since the head mark 313 requiring high precision only needs to be set in one place, the cost of the device can be reduced. In addition, even if the shooting is performed by different shooting parts (first shooting part 50 and second shooting part 60) in separate locations, the same head mark 313 is captured, thus eliminating the difference between the shooting parts.

[0171] (5) The head mark 313 is a recess. Therefore, the head mark 313 is easily formed and will not disappear due to contact with other components. For example, even if there is contact between the engagement tool 311 and the retaining part 315, the changes caused by wear are less.

[0172] (6) The first imaging unit 50 is fixedly supported at a position capable of capturing the first image α. Furthermore, the second imaging unit 60 is fixedly supported at a position capable of capturing the second image β and the third image γ. Therefore, there is no error caused by the movement of the first imaging unit 50 and the second imaging unit 60. In addition, since no mechanism for movement is required, it can be constructed simply and inexpensively.

[0173] [Variation Example]

[0174] This invention is not limited to the embodiments described. The following variations can also be applied, sharing the same basic structure as the embodiments described.

[0175] (1) The position or number of header markers 313 are not limited to those described. For example, such as Figure 9 As shown in (A), by placing the head mark 313 on the holding surface 311a of the joining tool 311, the head mark 313 can be brought close to the electronic component 2, thus bringing the focus closer. Therefore, a clear image of the head mark 313 and the electronic component 2 can be obtained, thereby improving the accuracy of position recognition. Furthermore, as... Figure 9As shown in (B), the head mark 313 can also be provided on the upper surface of the holding portion 315. In this case, since there is no part in contact with the head mark 313, it will not be damaged or peeled off even if a metal film as described later is provided. Since the position or shape of the head mark 313 can be accurately formed using the metal film, the accuracy of position recognition can be improved. Furthermore, as... Figure 9 As shown in (C), a head mark 313 may also be provided on the lower surface of the holding portion 315. In this case, in the holding method utilizing PDMS as described in the embodiment, it is conceivable that the PDMS film might become contaminated or covered during formation, making it unidentifiable, but this situation can be avoided. Of course, it is also possible to avoid situations where the head mark 313 becomes unidentifiable due to contact with the electronic component 2 caused by suction holding, etc. Furthermore, Figure 6 , Figure 9 (C) is also an example of setting the head mark 313 between the engagement tool 311 and the retaining part 315.

[0176] (2) The shape of the head mark 313 is not limited to the recess. For example, it can also be formed by vapor deposition of a metal film. Chromium (Cr) is used as a metal film, for example. Therefore, the accuracy of the shape of the head mark 313 can be improved. However, in order to prevent peeling due to contact with other components, it is preferable to provide a transparent cover covering the metal film, or to form the metal film at the bottom of the step or recess. The shape of the substrate mark 3b is also not limited to the electrode. It can also be a mark formed separately from the electrode.

[0177] (3) In the above embodiment, the joining tool 311 and the holding part 315 are designed to be translucent, but they are not necessarily required to be translucent. As long as the structure can accurately photograph the head mark 313 from the top and bottom, it is acceptable. For example, the head mark 313 can be a through hole. In addition, by providing the head mark 313 on both sides of the joining tool 311 and the holding part 315, the first shooting part 50 which photographs from below and the second shooting part 60 which photographs from above can photograph the head mark 313.

[0178] (4) The electronic component 2 is not limited to a micro LED, and can be applied to various electronic components 2 mounted on the substrate 3. In the above embodiment, in the supply device 10, the electronic component 2 is arranged in an upward-facing state with its functional surface, such as the one with electrodes, exposed at the top, but it can also be arranged in a downward-facing state with its functional surface facing down to the tray 11. In addition, the electronic component 2 includes both a downward-facing mounting relative to the substrate 3 and an upward-facing mounting. That is, the upward-facing electronic component 2 can be joined downward-facing by flipping it over, and upward-facing joining can be performed by providing a relay device and via the relay device. In addition, the downward-facing electronic component 2 can be joined upward-facing by flipping it over, and downward-facing joining can be performed via the relay device.

[0179] When the relay device is used, the picked-up electronic component 2 is temporarily placed on the relay device, and in this state, it is photographed by the first imaging unit 50. Therefore, the first imaging unit 50 is positioned above the relay device. That is, two first imaging units 50 can be arranged with the relay device sandwiched between the top and bottom, and the photographing can be performed by switching between the case with and without the relay device. In this way, both face-up and face-down bonding can be used, thus expanding the application range of the mounting method in the mounting device 1. Furthermore, as will be described later, the first imaging unit 50 can also be arranged only above the relay device.

[0180] Furthermore, if the stage for mounting the electronic component 2 of the relay device is light-transmitting, the electronic component 2 mounted on the relay device can be photographed from below the relay device via the first imaging unit 50. In this case, both upward-facing and downward-facing bonding can be used.

[0181] Furthermore, in any situation, when the joining tool 311 is close to the electronic component 2 mounted on the relay device, or when the joining tool 311 is in contact with the electronic component 2 mounted on the relay device in order to receive it, the first imaging unit 50 is used to take a picture. This allows the focal lengths from the first imaging unit 50 to the head mark 313 and the electronic component 2 to be close, thereby enabling clear imaging of both. Furthermore, the relay device can be configured to be detachable and can also be configured to retract from the junction position P2.

[0182] (5) The first imaging unit 50 may also be positioned above the connector 310 at the junction position P2, regardless of the presence or absence of the relay device. That is, the first imaging unit 50 may also be in a form where the camera faces downwards and takes pictures through the head mark 313 and electronic component 2 below.

[0183] Furthermore, in this configuration, the first imaging unit 50 is positioned at the junction position P2. However, the first imaging unit 50 only needs to be positioned where it can capture images of the electronic component 2 held on the connector 310 together with the head mark 313. Between the junction position P2 and the mounting position P3, the first imaging unit 50 can be positioned anywhere along the movement path of the connector 310. In this case, the first imaging unit 50 can also be positioned both above and below the connector 310. The appropriate placement location can be determined based on the layout of other units such as the substrate stage 40.

[0184] When the first imaging unit 50 is positioned midway along the path of the connector 310, the movement of the connector 310 can be stopped or not for the purpose of taking a picture. If it is stopped, time is required for stopping, but a clearer image can be captured, thereby improving the accuracy of position recognition. If the picture is taken while moving without stopping, the time for stopping and the time for taking the picture can be shortened according to the throughput. When taking pictures while moving, it is preferable to increase the shutter speed or brighten the illumination to maintain recognition accuracy. Whether to stop or not can be determined appropriately based on the required accuracy and throughput.

[0185] Furthermore, when the device is set at the handover position P2, the first image α can be captured in the same state as when the electronic component 2 was handed over, immediately after the handover and before the connector 310 begins to move. Therefore, it takes time to capture the image, but as mentioned above, the recognition accuracy will not be reduced due to the capture being temporarily stopped after the connector 310 begins to move or during the movement process.

[0186] (6) The holding of the electronic component 2 by the joint 310 is not limited to bonding. For example, it can also be held by suction through negative pressure. For example, the end of the suction path connected to the negative pressure generating circuit becomes a suction port that opens on the holding surface of the electronic component 2 of the joint tool 311, and the electronic component 2 can also be held by suction through the suction port.

[0187] (7) The supply device 10 may also be a device having a supply platform and an upward pushing mechanism, wherein the supply platform supports the sheet on which the electronic component 2 is attached, and the upward pushing mechanism pushes the electronic component 2 upward through the sheet when picking it up.

[0188] [Other Implementation Methods]

[0189] This invention is not limited to the described embodiments, but also includes forms that combine all or any of the described embodiments. Furthermore, without departing from the scope of the invention, these embodiments can be omitted, substituted, or modified in various ways, and such modifications are also included in this invention.

Claims

1. An installation device, characterized in that... have: The mounting device has a connector with a head mark, which mounts electronic components held by the connector onto the mounting area of ​​a substrate at a mounting position. A first imaging unit is positioned to capture a first image, which is obtained by capturing the electronic component held in the connector together with the head mark. The second imaging unit is configured to capture a second image and a third image. The second image is obtained by capturing a substrate mark disposed in the mounting area at the mounting position. The third image is obtained by capturing the head mark after capturing the second image, with the connector in the mounting position and the electronic component held by the connector facing the mounting area. The first positional relationship calculation unit calculates the positional relationship between the head mark and the electronic component, i.e., the first positional relationship, based on the first image; The second positional relationship calculation unit calculates the positional relationship between the head mark and the substrate mark, i.e., the second positional relationship, based on the second image and the third image; The third positional relationship calculation unit calculates the positional relationship between the electronic component and the substrate mark, i.e., the third positional relationship, based on the first positional relationship and the second positional relationship; as well as The positioning mechanism, based on the third positional relationship, positions the electronic component and the substrate mark before mounting the electronic component; The joint has: A joining tool is used to hold the electronic component. as well as The retaining part retains the retaining surface of the engagement tool. The head mark is provided only on any one of the following: the retaining surface of the joining tool, the retaining surface of the holding portion that holds the joining tool, and the surface of the holding portion opposite to the retaining surface of the joining tool. The joining tool and the retaining part are made of a light-transmitting material.

2. The installation device according to claim 1, characterized in that, The head marking is positioned on the outside of the electronic component held by the connector when viewed from above.

3. The installation device according to claim 1 or 2, characterized in that, The head mark is a recess.

4. The installation device according to claim 1 or 2, characterized in that, The head marker is a metal film.

5. The installation device according to claim 1 or 2, characterized in that, The head mark is a metal film formed at the bottom of a step or recess.

6. The installation device according to claim 1 or 2, characterized in that, The head marker is a metal film covered by a transparent cover.

7. The installation device according to claim 1 or 2, characterized in that, The first imaging unit is fixedly supported at a position where the first image can be captured.

8. The installation device according to claim 1 or 2, characterized in that, The second imaging unit is fixedly supported at a position where it can capture the second image and the third image.

9. An installation method using the installation device according to claim 1, characterized in that, include: The first image is captured using the first imaging unit. The first image is obtained by capturing the electronic component held by the connector together with the head mark. The second image is captured by the second imaging unit. The second image is obtained by capturing the substrate markings on the mounting area of ​​the electronic component disposed on the substrate. The third image is captured using the second imaging unit. The third image is obtained by capturing the head mark after capturing the second image, with the connector configured so that the electronic component faces the mounting area. The first positional relationship calculation unit calculates the positional relationship between the head mark and the electronic component, i.e., the first positional relationship, based on the first image; The second positional relationship calculation unit calculates the positional relationship between the head mark and the substrate mark, i.e., the second positional relationship, based on the second image and the third image; The third positional relationship calculation unit calculates the positional relationship between the electronic component and the substrate mark, i.e., the third positional relationship, based on the first positional relationship and the second positional relationship; The positioning mechanism positions the electronic component and the substrate mark based on the third positional relationship; as well as The mounting device mounts the electronic component held by the connector onto the mounting area of ​​the substrate.

Images