Compression molding device

Abstract

A compression molding apparatus for improving resin supply accuracy compresses resin onto a workpiece on a carrier with multiple parts mounted via multiple connecting members to manufacture multiple packages, each with at least one part sealed in resin. The compression molding apparatus includes: a metering unit for measuring the weight of the workpiece; a calculation unit for calculating the resin supply amount based on the weight of the workpiece measured by the metering unit; a supply unit for supplying the resin amount calculated by the calculation unit; and a molding die for compressing the resin supplied by the supply unit onto the workpiece. The calculation unit calculates the total volume of the multiple packages, including multiple parts and multiple connecting members, based on the weight of the workpiece, and calculates the resin supply amount based on the total volume of the multiple packages.

Description

Technical Field

[0001] This invention relates to a compression molding apparatus. Background Technology

[0002] As an apparatus for manufacturing packages that seal semiconductor components and other parts in resin, a molding apparatus is known that forms resin on a workpiece on which multiple parts are mounted on a carrier, and batches multiple packages. One type of such molding apparatus includes a compression molding apparatus in which one of a pair of molds has a mold cavity with a variable structure. To improve the accuracy of the package thickness, the compression molding apparatus, for example, has a function to adjust the resin supply amount according to the number of missing parts in the workpiece.

[0003] Patent Document 1 discloses a liquid material ejection device. The number of chips mounted on the workpiece is calculated by subtracting the weight of the substrate unit from the weight of the workpiece, which is measured by a weight measuring device and takes into account chip detachment, and then dividing by the weight of each chip. The number of missing chips is calculated by subtracting the calculated number of chips from the standard number of chips. The amount of corrective resin is calculated by multiplying the number of missing chips by the amount of resin added when one chip is missing.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2003-165133 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] The component is mounted on the carrier via connecting members such as bonding wires, solder, and anisotropic conductive adhesive. Therefore, if a component is missing from the workpiece, the volume of the workpiece changes by a amount corresponding to the volume of the connecting members, even if the volume is smaller than that of the component. The weight or volume of the connecting members actually varies depending on the shape or size of the connecting members when the component is mounted on the carrier. Therefore, the accurate weight or volume of the mount with connecting members attached to the component actually needs to be measured while it is mounted on the workpiece. However, it is unclear how the weight of each chip and the amount of resin supplemented when a chip is missing are measured as described in Patent Document 1, so it is unclear whether connecting members are attached. In addition, in cases where part of a chip is missing and part or all of the connecting members are missing, the number of missing chips and the number of missing connecting members are sometimes inconsistent. Therefore, regarding the corrected amount of resin calculated based on the number of missing chips or the weight of each chip as described in Patent Document 1, the encapsulation thickness may sometimes be inaccurate.

[0009] The present invention was made in view of this situation, and the object of the present invention is to provide a compression molding apparatus that can improve the accuracy of resin supply.

[0010] Technical means to solve the problem

[0011] An embodiment of the compression molding apparatus of the present invention compresses resin onto a workpiece on a carrier, on which multiple parts are mounted via multiple connecting members, to manufacture multiple packages, each of which is resin-sealed with at least one part. The compression molding apparatus includes: a metering unit for measuring the weight of the workpiece; a calculation unit for calculating the amount of resin to be supplied based on the weight of the workpiece measured by the metering unit; a supply unit for supplying the amount of resin calculated by the calculation unit; and a molding die for compressing the resin supplied by the supply unit onto the workpiece. The calculation unit calculates the total volume of the multiple packages including multiple parts and multiple connecting members based on the weight of the workpiece, and calculates the amount of resin to be supplied based on the total volume of the multiple packages.

[0012] According to the embodiment described, the resin supply can be easily and quickly adjusted based on the condition of the parts on the carrier. Furthermore, by calculating the resin supply based on the total volume of the mounted component, considering not only the number of parts but also the number of connecting members, the accuracy of the resin supply calculation can be improved, thereby suppressing the generation of defective products caused by excessive or insufficient resin.

[0013] In the embodiment described above, the calculation unit may calculate the total weight of the multiple installations based on the weight of the workpiece, and calculate the total volume of the multiple installations based on the total weight of the multiple installations.

[0014] In the embodiment described above, the calculation unit may calculate the total volume of the multiple installations based on the specific gravity of the multiple installations and the total weight of the multiple installations.

[0015] In the embodiment described above, the measurement unit measures the weight of a first prototype workpiece on a reference carrier with a first set of mountings and the weight of a second prototype workpiece on a reference carrier with a second set of mountings of a different number than the first set. The calculation unit divides the weight difference between the weight of the first prototype workpiece and the weight of the second prototype workpiece by the volume difference between the volume of the first prototype workpiece and the volume of the second prototype workpiece to calculate the specific gravity of the plurality of mountings.

[0016] In the embodiment described above, the measurement unit measures the weight of a first prototype workpiece that is completely unloaded on a reference carrier and the weight of a second prototype workpiece that is loaded with all the mountings on the reference carrier. The calculation unit divides the weight difference between the weight of the first prototype workpiece and the weight of the second prototype workpiece by the volume difference between the volume of the first prototype workpiece and the volume of the second prototype workpiece to calculate the specific gravity of the multiple mountings.

[0017] In the embodiment described above, the compression forming apparatus may further include a volume measuring unit for measuring the volume of the workpiece, wherein the volume measuring unit measures the volume of the first prototype workpiece and the volume of the second prototype workpiece.

[0018] In the embodiment described above, the calculation unit may calculate the number of sets of multiple installations based on the weight of each set of installations and the weight of the multiple installations, and calculate the total volume of the multiple installations based on the volume of each set of installations and the number of sets of multiple installations.

[0019] In the embodiment described above, the compression molding apparatus may further include a thickness measuring unit for measuring the thickness of the package; a measuring unit for measuring the weight of a third prototype workpiece on a reference carrier with a third number of mountings, and the weight of a fourth prototype workpiece on a reference carrier with a fourth number of mountings; a thickness measuring unit for measuring the thickness of a first prototype assembly package formed by molding a first amount of resin onto the third prototype workpiece, and the thickness of a second prototype assembly package formed by molding a first amount of resin onto the fourth prototype workpiece; a calculation unit for calculating the volume of each mounting group by multiplying the thickness difference between the thickness of the first and second prototype assembly packages by the upper surface area of ​​the first or second prototype assembly package, and dividing by the difference in the number of groups between the third and fourth groups; and for calculating the weight of each mounting group by dividing the weight difference between the weight of the third and fourth prototype workpieces by the difference in the number of groups.

[0020] In the embodiment described above, the compression molding apparatus may further include a thickness measuring unit for measuring the thickness of the package; a measuring unit for measuring the weight of a third prototype workpiece without any mountings on a reference carrier and the weight of a fourth prototype workpiece with all mountings on a reference carrier; a thickness measuring unit for measuring the thickness of a first prototype assembly package formed by molding a first amount of resin onto the third prototype workpiece and the thickness of a second prototype assembly package formed by molding a first amount of resin onto the fourth prototype workpiece; a calculation unit for calculating the volume of each assembly by multiplying the thickness difference between the first and second prototype assembly packages by the upper surface area of ​​the first or second prototype assembly package and dividing by the number of sets of mountings on the fourth prototype workpiece; and for calculating the weight of each assembly by dividing the weight difference between the weight of the third and fourth prototype workpieces by the number of sets of mountings on the fourth prototype workpiece.

[0021] In the embodiment described above, the calculation unit may calculate the weight of multiple installations by subtracting the weight of the reference carrier from the weight of the workpiece.

[0022] In the embodiment described above, the compression forming apparatus may further include a thickness measuring unit for measuring the thickness of the carrier, a calculation unit for calculating the weight of the carrier based on the thickness of the carrier, and a subtraction of the weight of the carrier from the weight of the workpiece to calculate the weight of the plurality of installations.

[0023] In the embodiment described above, the calculation unit may calculate the volume of the molded resin required to make the multiple packages reach the desired thickness based on the total volume of the multiple mounts, and calculate the weight of the molded resin as the resin supply amount based on the volume of the molded resin.

[0024] In the embodiment described above, the calculation unit calculates the volume of the molded resin required to make the multiple packages reach the desired thickness based on the total volume of the multiple mounts, calculates the weight of the molded resin based on the volume of the molded resin, and calculates the weight of the resin before molding as the resin supply amount based on the weight change rate of the resin before and after molding, according to the weight of the molded resin.

[0025] The effects of the invention

[0026] According to the present invention, a compression molding apparatus that can improve the accuracy of resin supply can be provided. Attached Figure Description

[0027] Figure 1 This is a diagram that schematically illustrates the structure of a compression molding apparatus according to one embodiment.

[0028] Figure 2 It is a plan view that roughly represents the structure of the workpiece before the resin is compressed.

[0029] Figure 3 This is a flowchart illustrating an example of a method for calculating the amount of resin supplied.

[0030] Figure 4 This is a flowchart illustrating an example of a method for adjusting the amount of corrective resin.

[0031] Figure 5 This is a flowchart illustrating an example of a method for calculating the resin supply location.

[0032] Figure 6 This is a flowchart illustrating another example of a method for calculating the resin supply location.

[0033] Figure 7 This is a flowchart illustrating another example of a method for calculating the amount of resin supplied.

[0034] Figure 8 This is a diagram that schematically illustrates the structure of the compression forming apparatus of the first modified example.

[0035] Figure 9 This is a diagram that schematically illustrates the structure of the compression forming apparatus of the second modified example.

[0036] Figure 10 This is a flowchart representing part of the method for calculating the amount of resin supplied.

[0037] Figure 11 This is a flowchart representing part of the method for calculating the amount of resin supplied.

[0038] Figure 12 This is a flowchart representing part of the method for calculating the amount of resin supplied.

[0039] Figure 13 This is a flowchart representing part of the method for calculating the amount of resin supplied.

[0040] [Explanation of Symbols]

[0041] 1: Compression forming device

[0042] 10: Workpiece

[0043] 11: Carrier

[0044] 12: Parts

[0045] 100: Resin supply device

[0046] 110: Department of Metrology

[0047] 120: Computing Department

[0048] 130: Supply Department

[0049] 140: Platform

[0050] 150: Thickness Measurement Section

[0051] 160: Camera Department

[0052] 180: Reversal Section

[0053] 190: Molding mold

[0054] 191: Lower mold

[0055] 192: Upper mold

[0056] 199: Mold cavity Detailed Implementation

[0057] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The drawings of this embodiment are illustrative, and the dimensions or shapes of the parts are schematic and should not be construed as limiting the technical scope of the present invention to the described embodiments.

[0058] <Compression Molding Apparatus>

[0059] Reference Figure 1 and Figure 2 The structure of the compression forming apparatus 1 according to an embodiment of the present invention will be described. Figure 1 This is a diagram that schematically illustrates the structure of a compression molding apparatus according to one embodiment. Figure 2 It is a plan view that roughly represents the structure of the workpiece before the resin is compressed.

[0060] The compression molding apparatus 1 is an apparatus that compresses resin R onto a workpiece 10 on a carrier 11, on which a plurality of parts 12 are mounted, to produce a plurality of packages in which at least one part 12 is resin-sealed (molded) on each package. The compression molding apparatus 1 also simultaneously produces at least one package without any part 12 mounted on it. The compression molding apparatus 1 includes a resin supply device 100 for supplying resin R and a molding die 190 for heating and compressing resin R.

[0061] As an example, carrier 11 is an interposer substrate, component 12 is a semiconductor element (integrated circuit (IC) chip, diode, transistor, etc.) mounted on carrier 11, and resin R is granular. However, carrier 11, component 12, and resin R are not limited to the above. For example, carrier 11 may be a substrate made of resin, glass, metal, semiconductor, etc., or it may be a lead frame, a carrier board with an adhesive sheet, etc. For example, component 12 may be a microelectromechanical system (MEMS) device or an electronic device (capacitor, inductor, register, etc.). Component 12 may be mounted on carrier 11 by wire bonding or flip-chip bonding, or it may be detachably fixed. Component 12 may include, for example, two components 12a and component 12b, or it may include three or more components. Resin R may be in powder, tablet, liquid, etc. Resin R may include, for example, a thermosetting resin such as epoxy resin, which can be molded into any shape by heating and compression. Furthermore, part 12 is mounted on carrier 11 via connecting members (not shown in the figure). Connecting members are components that fix part 12 to carrier 11 or electrically connect part 12 to carrier 11. For example, connecting members are bonding wires, solder, and anisotropic conductive adhesives. Hereinafter, multiple parts 12 and multiple connecting members are assembled to form multiple mounts. At least one part 12 mounted in an encapsulation region PA is combined with at least one connecting member that connects said at least one part 12 to carrier 11 to form a set of mounts. In other words, a set of mounts consists of all the sealed components on carrier 11 that have been resin-sealed in one of a plurality of packages manufactured by workpiece 10 using compression molding apparatus 1.

[0062] For example, high thickness accuracy is sometimes required for packages formed by the compression molding apparatus 1. Since the amount of resin R required to manufacture a package of the desired thickness varies depending on the state of the workpiece 10, the compression molding apparatus 1 is ideally configured to calculate the amount of resin R supplied with high accuracy.

[0063] Here, refer to Figure 2The example of workpiece 10 shown illustrates the relationship between the state of workpiece 10 and the supply amount of resin R. Multiple encapsulation regions PA are provided on workpiece 10, divided by multiple dividing lines LN1 and LN2. The multiple dividing lines LN1 and LN2 are imaginary lines used to divide the workpiece 10, which is compressed and molded with resin R, into multiple encapsulations. The multiple dividing lines LN1 and LN2 are approximately orthogonal to each other. Encapsulation regions PA are areas that form encapsulations, and the multiple encapsulation regions PA are arranged in a matrix. In the first encapsulation region PA1, a first part 12a and a second part 12b are disposed. However, in the second encapsulation regions PA2 and the third encapsulation region PA3, at least part or all of the first part 12a and the second part 12b are missing. For example, as shown in the second encapsulation region PA2, there is a situation where, when workpiece 10 is impacted, part 12b peels off, and part or all of part 12b is missing. For example, if part or all of part 12b is damaged after being mounted, but the connecting member that connects the damaged part 12b to the carrier 11 is not damaged, the number of parts 12b in the workpiece 10 is inconsistent with the number of connecting members that connect the parts 12b. Furthermore, for example, as shown in the third packaging region PA3, there are cases where, in parts that are unusable due to poor wiring on the carrier 11, the first part 12a and the second part 12b were not originally mounted to reduce part loss. In these cases, to suppress thinning of the package, it is necessary to adjust the supply of resin R by an amount corresponding to the volume of the first part 12a and the second part 12b that are intended to be mounted in the second packaging region PA2 and the third packaging region PA3 but are not present.

[0064] The resin supply device 100 calculates the amount of resin R to be supplied based on the state of the workpiece 10, and supplies resin R to the workpiece 10 or the release film RF before it is moved into the molding die 190. Figure 1 In the example shown, the resin supply device 100 supplies resin R to the release film RF. The resin supply device 100 includes a metering unit 110, a calculation unit 120, a supply unit 130, a stage 140, a thickness measuring unit 150, a camera unit 160, and a reversing unit 180.

[0065] The measuring unit 110 measures the weight of the workpiece 10 and transmits the measurement result to the calculation unit 120. For example, the measuring unit 110 is an electronic balance that measures the weight of an item mounted on the upper surface. The workpiece 10, with the mounting surface of the part 12 facing upward (opposite to the measuring unit 110), is mounted on the upper surface, and the weight of the workpiece 10 is measured.

[0066] The calculation unit 120 calculates the supply amount of resin R based on the weight of the workpiece 10 measured by the measurement unit 110. The calculation unit 120 includes computer hardware and software. Data for calculating the supply amount of resin R can also be pre-registered in the calculation unit 120. This data may include, for example, the standard weight, minimum weight, maximum weight, standard thickness, minimum thickness, maximum thickness, and specific gravity of the carrier 11. Additionally, the data may include the standard weight, minimum weight, and maximum weight of the workpiece 10; the standard number, maximum number, minimum number, standard total weight, maximum total weight, minimum total weight, and specific gravity of the parts 12 mounted on one workpiece 10; the standard supply amount, minimum supply amount, maximum supply amount, and specific gravity of resin R; and the number of encapsulation regions PA, the desired thickness of the encapsulation, and the allowable range of encapsulation thickness. The supply amount of resin R can be determined by volume or by weight. Furthermore, the supply amount of resin R can also be determined by control parameters of the supply unit 130. Here, the "standard" for standard weight, etc., refers to a value considered standard in the manufacturing process as the average or median value, based on the absence of defects or the number of defects being within acceptable limits for the products in each of the aforementioned items. The "minimum" and "maximum" of the weight, etc., are the lower and upper limits of the permissible boundaries in manufacturing, respectively. Furthermore, the data registered in the calculation unit 120 may also include statistical values ​​such as the average, median, and mode of the weight and thickness of the carrier 11, the weight of the workpiece 10, the number and total weight of the parts 12, and the supply quantity of resin R. The data registered in the calculation unit 120 may be predicted values ​​or measured values.

[0067] The standard weight of carrier 11 corresponds to an example of the "reference carrier" of the present invention, and the standard weight of carrier 11 corresponds to an example of the "reference carrier weight" of the present invention. The "reference carrier" of the present invention can be carrier 11 with the minimum or maximum weight, or it can be carrier 11 with a weight that is the average, median, or mode. That is, the "reference carrier weight" of the present invention can be the minimum, maximum, average, median, or mode of the weight of carrier 11. The standard quantity of parts 12 corresponds to an example of the "reference part quantity" of the present invention, and the standard total weight of parts 12 corresponds to an example of the "reference total part weight" of the present invention. The "reference part quantity" of the present invention can be the maximum or minimum quantity of parts 12, and the "reference total part weight" of the present invention can be the maximum or minimum total weight of parts 12.

[0068] The standard weight of workpiece 10 corresponds to an example of the "reference workpiece" of the present invention, and the standard weight of workpiece 10 corresponds to an example of the "reference workpiece weight" of the present invention. The "reference workpiece" of the present invention is a workpiece with a reference number of parts mounted on a reference carrier, and the "reference workpiece weight" of the present invention is the weight of the reference workpiece. The "reference workpiece" of the present invention can be workpiece 10 with the minimum or maximum weight, and the "reference workpiece weight" of the present invention can be the minimum or maximum weight of workpiece 10. The maximum weight of workpiece 10 is, for example, the weight of workpiece 10 with all parts 12 mounted on the reference carrier. The minimum weight of workpiece 10 is, for example, the weight of workpiece 10 without any parts 12 mounted on the reference carrier (i.e., the reference carrier weight).

[0069] The standard supply amount of resin R corresponds to an example of the "reference resin amount" of the present invention. The "reference resin amount" of the present invention is the amount of resin required to compress and mold resin R to the desired thickness on a reference workpiece. The "reference resin amount" of the present invention can be the maximum or minimum supply amount of resin R. The minimum supply amount of resin R is, for example, the amount of resin required to compress and mold resin R to the desired thickness on the workpiece 10 with the largest weight. The maximum supply amount of resin R is, for example, the amount of resin required to compress and mold resin R to the desired thickness on the workpiece 10 with the smallest weight.

[0070] The supply unit 130 supplies the amount of resin R calculated by the calculation unit 120. Figure 1 In the example shown, the supply unit 130 is configured to supply resin R to the release film RF, but it can also be configured to supply resin R to the workpiece 10. The supply unit 130 includes a hopper 131, a control unit 133, and a linear feeder 135. The hopper 131 contains the resin R. The control unit 133 controls the supply amount, supply speed, and supply timing of the resin R based on calculation results input from the calculation unit 120. The linear feeder 135 delivers the resin R and drops it from the front end. Furthermore, the structure of the supply unit 130 is not limited to the aforementioned structure. For example, if the resin R is in liquid form, the supply unit 130 may also include a dispenser having a syringe for storing the resin R, a piston for extruding the resin R, and a pinch valve for opening and closing the front end of the syringe. In addition, the supply unit 130 may also employ a structure other than one using a linear feeder 135 or a dispenser with a syringe.

[0071] The stage 140 is a base supporting a release film RF to which resin R is supplied. The stage 140 is configured to move relative to the supply section 130. Specifically, at least one of the supply section 130 and the stage 140 is configured to be movable by a moving mechanism such as a servo motor. For example, one of the supply section 130 and the stage 140 may move relative to the other, supplying resin R over a wide area of ​​the release film RF. However, the relative positions of the supply section 130 and the stage 140 may also be substantially fixed, for example, supplying resin R to the center of the release film RF. The stage 140 may also include a vibrator that disperses the resin R supplied to the release film RF by vibration.

[0072] The thickness measuring unit 150 measures the thickness of the carrier 11, for example. The thickness measuring unit 150 is a non-contact measuring instrument, such as a reflectivity spectrometer or an ellipsometry, but is not limited to this; it can also be a contact measuring instrument, such as a micrometer. The thickness measuring unit 150 may also use a laser displacement meter to measure the thickness. The thickness measuring unit 150 may measure the thickness at multiple points or on multiple surfaces and measure the in-plane distribution of the thickness, or it may measure the thickness and the in-plane distribution of the thickness while scanning in the in-plane direction. The information measured by the thickness measuring unit 150 is transmitted to the calculation unit 120 and used to calculate the supply amount of resin R. For example, the calculation unit 120 corrects for weight variations in the workpiece 10 measured by the measurement unit 110 due to changes in the thickness of the carrier 11.

[0073] The thickness measuring unit 150 can also measure the thickness of the workpiece 10. The thickness of the workpiece 10 mentioned here includes information related to the mounting condition, such as whether a part 12 is mounted on the carrier 11, the height of the part 12, or its position. That is, the information related to the mounting condition includes the number, position, and density of the second encapsulation region PA2 and the third encapsulation region PA3. When measuring the thickness of the workpiece 10, from the viewpoint of suppressing damage to the part 12 caused by the measurement, it is preferable that the thickness measuring unit 150 measures the thickness using a non-contact measuring instrument or a laser displacement meter. The mounting condition-related information measured by the thickness measuring unit 150 is transmitted to the calculation unit 120 and used to calculate the supply amount or supply position of the resin R. Furthermore, the supply position of the resin R mentioned here includes not only information on which encapsulation region PA corresponds to the supply of resin R, but also information on which encapsulation region PA corresponds to the position where the supply amount of resin R is increased or decreased.

[0074] The thickness measuring unit 150 can also measure the thickness of the package. The thickness of the package measured by the thickness measuring unit 150 is transmitted to the calculation unit 120. For example, the calculation unit 120 can also compare the calculated supply amount of resin R with the thickness of the package formed by compression molding using the resin R, thereby adjusting the calculation method for the supply amount of resin R.

[0075] The imaging unit 160 captures images of the workpiece 10. The imaging unit 160 includes, for example, a camera (monocular or polycular) and an image processing system for processing the images captured by the camera. Thus, the imaging unit 160 captures images of the part 12 on the carrier 11 and acquires information related to its mounting status through image processing. The information acquired by the imaging unit 160 related to the mounting status is transmitted to the calculation unit 120 and used to calculate the supply amount or supply position of the resin R.

[0076] Furthermore, the thickness measuring unit 150 and the camera unit 160 can be omitted from the compression forming apparatus 1. In addition, the thickness of the carrier 11, the thickness of the workpiece 10, and the thickness of the package can also be measured by different thickness measuring units.

[0077] The reversing unit 180 reverses the direction of the workpiece 10, which has been measured by the measuring unit 110, during its transport into the molding die 190. For example... Figure 1 As shown, when workpiece 10 is measured with part 12 facing upwards and is placed in the upper mold 192 (described later) with part 12 facing downwards, the reversing section 180 reverses the vertical direction of workpiece 10. Similarly, when workpiece 10 is measured with part 12 facing downwards and is placed in the lower mold 191 (described later) with part 12 facing upwards, the reversing section 180 also reverses the vertical direction of workpiece 10. Furthermore, if the orientation of workpiece 10 when measured in the measuring section 110 is the same as the orientation of workpiece 10 when placed inside the molding die 190, the reversing section 180 is omitted.

[0078] The molding die 190 is a pair of molds (lower mold 191 and upper mold 192) used for resin sealing of the workpiece 10 using compression molding technology. A release film RF is provided on one of the molds, the lower mold 191 and the upper mold 192, which has a mold cavity 199, and the workpiece 10 is provided on the other mold. Resin R is supplied to either the release film RF or the workpiece 10 located in the lower mold 191. In this embodiment, the molding die 190 is a lower mold cavity structure having a mold cavity 199 in the lower mold 191.

[0079] The molding die 190 includes a seal ring 193 (e.g., an O-ring) that seals the interior of the molding die 190 (the space between the lower die 191 and the upper die 192). Furthermore, although not shown, the compression molding apparatus 1 includes a pressure regulating unit (e.g., a vacuum pump) for regulating the internal pressure of the molding die 190, or a temperature regulating unit (e.g., a heater) for regulating the internal temperature (molding temperature).

[0080] The lower mold 191 includes: a chase 19A, a cavity insert 19B fixed to the upper mold 192 side of the chase 19A, a clamp 19C surrounding the cavity insert 19B, and a cavity block 19D that surrounds the clamp 19C at intervals. The cavity insert 19B is fixed to the upper mold 192 side of the chase 19A. The clamp 19C protrudes further toward the upper mold 192 than the cavity insert 19B and together with the cavity insert 19B forms a mold cavity 199. The clamp 19C is configured to be connected to the chase 19A via a spring and is slidable relative to the cavity insert 19B. During mold closing, the outer edge (carrier 11) of the workpiece 10 is clamped between the clamp 19C and the upper mold 192. On the upper surface of the clamping device 19C (the surface facing the upper mold 192), a plurality of vents are provided to connect the space on the cavity block 19D side to the mold cavity 199. The plurality of vents are grooves arranged radially around the mold cavity 199. The plurality of vents function as vents to expel air remaining in the mold cavity 199 of the molded mold 190 after mold closing, or gases generated from the resin R. The vents are formed to a depth (e.g., a few μm) to expel air or gas without causing resin R to flow out. The sealing ring 193 contacts the cavity block 19D.

[0081] The compression molding apparatus 1 of this embodiment may also include a volume measuring unit. The volume measuring unit is not particularly limited as long as it can measure the volume of the workpiece 10, the volume of the assembled package obtained by molding resin R on the workpiece 10, the volume of the carrier 11, and the volume of the multiple mounts mounted on the workpiece 10.

[0082] Next, refer to Figures 3 to 7 An example of a manufacturing method for a package using compression forming apparatus 1 will be described.

[0083] Figure 3This is a flowchart illustrating an example of a method for calculating the supply amount of resin R (S110). In the method S110 for calculating the supply amount of resin R, firstly, the weight of a reference workpiece and the amount of reference resin are registered (S111). For example, the weight of the reference workpiece and the amount of reference resin are input to the calculation unit 120 from an external terminal. In this calculation method S110, the weight of the reference workpiece is the weight of the workpiece 10 (hereinafter referred to as the "reference workpiece") on which all parts 12 are mounted on a reference carrier. In other words, the weight of the reference workpiece is the weight of the workpiece 10 whose encapsulation area PA is the first encapsulation area PA1. Regarding the reference carrier, for example, a carrier 11 of standard weight is used. In this case, the amount of reference resin is the supply amount of resin R required to obtain an encapsulation of the desired thickness by compressing the resin R on the reference workpiece on which all parts 12 are mounted. Alternatively, a carrier 11 of minimum weight may also be used as the reference carrier. In this case, the amount of reference resin is the supply amount of resin R required to obtain an encapsulation of the desired thickness by compressing the resin R on a reference workpiece on which no parts 12 are mounted.

[0084] Next, the weight of workpiece 10 is measured (S112), and the weight difference of workpiece 10 is calculated (S113). The weight of workpiece 10 is measured by the measuring unit 110, and the weight difference of workpiece 10 is calculated by the calculation unit 120. The weight difference of workpiece 10 refers to the difference between the weight of the reference workpiece and the measured weight of workpiece 10. Workpiece 10 sometimes has a second packaging area PA2 where a part of the component 12 is absent and a third packaging area PA3 where all of the components 12 are absent. For example, there may be cases where the third packaging area PA3 is scattered due to poor internal wiring of the substrate, or where half of the carrier 11 becomes the third packaging area PA3 because it is impossible to mount all of the components 12. In this case, the components 12 that are intended to be mounted in the second packaging area PA2 or the third packaging area PA3 but are not present are collectively referred to as "non-existent components 12". The weight of workpiece 10 measured in process S112 is reduced by an amount corresponding to the weight of the non-existent components 12 compared to the weight of the reference workpiece. In process S113, the weight of the non-existent part 12 is calculated as the weight difference of the workpiece 10 by subtracting the weight of the workpiece 10 measured in process S112 from the weight of the reference workpiece.

[0085] Next, the amount of corrected resin is calculated based on the weight difference of workpiece 10 (S114), and the corrected resin amount is included in the reference resin amount (S115). The corrected resin amount is calculated by the calculation unit 120 and included in the reference resin amount by the calculation unit 120. If the resin R of the reference resin amount is compressed and molded on the workpiece 10 having the second encapsulation region PA2 and the third encapsulation region PA3, the thickness of the encapsulation is reduced by an amount corresponding to the absence of part 12. Therefore, in order to obtain an encapsulation of the desired thickness, in step S115, the amount of corrected resin corresponding to the absence of part 12 is added to the reference resin amount. In step S114, the corrected resin amount is calculated, for example, in the form of the weight of resin R, by multiplying the weight difference of workpiece 10 by the specific gravity of resin R and dividing by the specific gravity of part 12. When the specific gravity of resin R is close to the specific gravity of part 12, the weight difference of workpiece 10 can also be used as the corrected resin amount.

[0086] Thus, by calculating the supply amount of resin R based on the weight of workpiece 10, the supply amount of resin R can be calculated simply and quickly. That is, compared with a compression molding apparatus that scans approximately the entire surface of the workpiece, measures the thickness, and examines the mounting condition of all parts in detail, the production capacity of encapsulation is improved in the compression molding apparatus and compression molding method using it in this embodiment.

[0087] Furthermore, in the method S110 for calculating the supply amount of resin R, the weight of the reference workpiece, as described above, can be the weight of the workpiece 10 without any parts 12 mounted on the reference carrier. In other words, the weight of the reference workpiece can be the weight of the reference carrier. The reference resin amount at this time is the amount of resin R required to obtain an encapsulation of the desired thickness by compressing the resin R on the reference workpiece without any parts mounted. In this case, the weight of the workpiece 10 measured in step S112 is heavier than the weight of the reference workpiece by an amount corresponding to the weight of the mounted parts 12. The weight difference of the mounted parts 12 is calculated by subtracting the weight of the reference workpiece 10 measured in step S112. At this time, in step S115, the supply amount of resin R is calculated by subtracting the amount of corrected resin corresponding to the amount of parts 12 mounted on the workpiece 10 from the reference resin amount.

[0088] Figure 4This is a flowchart illustrating an example of a method for adjusting the amount of corrective resin (S120). In the method for adjusting the amount of corrective resin S120, firstly, the thickness of the carrier 11 is measured (S121). The thickness of the carrier 11 is measured by a thickness measuring unit 150. Next, the weight of the carrier is calculated based on the thickness of the carrier 11 (S122), and the weight difference of the carrier 11 is calculated (S123). The amount of corrective resin is adjusted based on the weight difference of the carrier 11 (S124). The weight difference of the carrier 11 is calculated by a calculation unit 120, and the amount of corrective resin is adjusted by the calculation unit 120. The weight difference of the carrier 11 is the difference between the weight of the reference carrier in the weight of the reference workpiece and the weight of the carrier 11 in the measured workpiece 10. The weight of the carrier 11 changes according to the change in the thickness of the carrier 11. Therefore, the weight difference of the workpiece 10 calculated in step S113 includes not only the weight of the non-existent part 12, but also the weight difference of the carrier 11. However, changes in the weight of carrier 11 do not affect the supply amount of resin R required for compression molding of the package to the desired thickness. Therefore, by excluding the influence of the weight difference of carrier 11 from the corrected resin amount, the supply amount of resin R can be calculated more accurately. In step S124, as an example, after calculating the corrected resin amount based on the weight difference of workpiece 10, the corrected resin amount is adjusted based on the weight difference of carrier 11. However, the corrected resin amount can also be calculated by subtracting the weight difference of carrier 11 from the weight difference of workpiece 10.

[0089] Figure 5 This is a flowchart illustrating an example of a method for calculating the supply position of resin R (S130). In the method for calculating the supply position of resin R, S130, firstly, the thickness of workpiece 10 is measured (S131). The thickness of workpiece 10 is measured by a thickness measuring unit 150. Next, the mounting condition of part 12 is calculated (S132), and the supply position of resin R is calculated (S133). The mounting condition of part 12 is calculated based on the thickness of workpiece 10 by a calculation unit 120, and the supply position of resin R is calculated based on the mounting condition of part 12 by a calculation unit 120. The supply position of resin R is calculated based on the mounting condition of part 12. By supplying more resin R to the positions corresponding to the second encapsulation region PA2 and the third encapsulation region PA3 than to the position corresponding to the first encapsulation region PA1, the time required to fill resin R inside the molding die 190 can be shortened, thereby suppressing poor molding of resin R.

[0090] Figure 6This is a flowchart illustrating another example (S140) of the method for calculating the supply position of resin R. In the method S140 for calculating the supply position of resin R, firstly, an image of workpiece 10 is captured (S141). The image of workpiece 10 is captured by the camera unit 160. Next, the mounting condition of part 12 is calculated (S142), and the supply position of resin R is calculated (S143). The mounting condition of part 12 is calculated based on the image of workpiece 10 by the calculation unit 120, and the supply position of resin R is calculated based on the mounting condition of part 12 by the calculation unit 120. Furthermore, calculation methods S130 and S140 can also be used together in calculating the supply position of resin R.

[0091] Figure 7 This is a flowchart illustrating another example (S210) of the method for calculating the supply amount of resin R. In the method S210 for calculating the supply amount of resin R, firstly, the maximum workpiece weight, the minimum workpiece weight, and the maximum number of packages are registered (S211). For example, the maximum workpiece weight, the minimum workpiece weight, and the maximum number of packages are input to the calculation unit 120 from an external terminal. In this calculation method S210, the maximum workpiece weight is the weight of the workpiece 10 (hereinafter referred to as the "maximum workpiece") on which all parts 12 are mounted on a reference carrier. In other words, the maximum workpiece weight is the weight of the workpiece 10 whose packaging area PA is the first packaging area PA1. Furthermore, the minimum workpiece weight is the weight of the workpiece 10 (hereinafter referred to as the "minimum workpiece") on which no parts 12 are mounted on the reference carrier. In other words, the minimum workpiece weight is the weight of the reference carrier. The reference carrier is, for example, a carrier 11 of standard weight. The maximum number of packages is the number of packages that can be manufactured from the maximum workpiece, i.e., the number of packaging areas PA.

[0092] Next, the weight range is calculated and divided into multiple partial ranges (S212). The weight range is calculated by the calculation unit 120, and the weight range is divided into partial ranges by the calculation unit 120. The weight range is a numerical range from the minimum workpiece weight to the maximum workpiece weight, and the multiple partial ranges are numerical ranges obtained by dividing the weight range by the maximum number of packages.

[0093] Next, the weight of workpiece 10 is measured (S213), and the supply amount of resin R is calculated based on the range to which the weight of workpiece 10 belongs (S214). Workpiece 10 is measured by the measuring unit 110, and the supply amount of resin R is calculated by the calculation unit 120. For example, the calculation unit 120 registers the supply amount of resin R corresponding to each range, determines which range the weight of workpiece 10 belongs to, and reads the registered supply amount of resin R. Accordingly, high-precision measurement and calculation are not required, and the calculation speed of the supply amount of resin R is improved.

[0094] The following describes variations of the compression forming apparatus. Furthermore, matters common to the described embodiment are also applicable in the following variations, and their descriptions are omitted; only the different aspects are explained. In particular, the same symbols are used for the same structures, and the same structures and the resulting effects are not mentioned repeatedly.

[0095] Reference Figure 8 The structure of a modified compression forming apparatus 2 will be described. Figure 8 This is a schematic diagram showing the structure of the compression molding apparatus of the first modified example. In this modified example, the measuring unit 110 measures the weight of the workpiece 10 with the part 12 facing downwards (to one side of the measuring unit 110). The carrier 11 of the outer edge of the workpiece 10 is supported, and the part 12 does not contact the measuring unit 110, etc. The workpiece 10 is conveyed in the stated orientation state and placed on the upper mold 192 of the molding die 190.

[0096] Reference Figure 9 The structure of a modified compression forming apparatus 3 will be described. Figure 9 This is a schematic diagram showing the structure of the compression molding apparatus in the second modified example. In this modified example, the molding die 190 is an upper die cavity structure with a cavity 199 in the upper die 192. The workpiece 10, measured by the metering unit 110, is transferred to the stage 140. The workpiece 10, on which resin R is supplied, is placed on the lower die 191 on the stage 140, and the release film RF is placed on the upper die 192.

[0097] Next, refer to Figure 10 and Figure 11 An example of a method for calculating the amount of resin supplied according to one embodiment will be described. Figure 10 and Figure 11 This is a flowchart representing part of the method for calculating the amount of resin supplied. Figure 10 This is a flowchart representing the trial production stage. Figure 11 This is a flowchart representing the formal stage. In the following description, unless otherwise specified, calculations are performed in the calculation unit 120.

[0098] First, the weight and volume of the first and second prototype workpieces are measured (S311). The prototype workpieces are those used in the trial production process to clarify the manufacturing conditions for the formal production. The first and second prototype workpieces are workpieces mounted on a reference carrier with different numbers of mountings. Ideally, the first and second prototype workpieces are appropriately selected from all undamaged workpieces of the multiple parts 12 mounted on them, but it is also permissible if some of the multiple parts 12 are damaged. Ideally, the number of mountings on each of the first and second prototype workpieces is significantly different. Ideally, the first prototype workpiece is the smallest workpiece (i.e., the reference carrier) completely without any mountings, and the second prototype workpiece is the largest workpiece with all mountings mounted on it.

[0099] The weight of the first prototype workpiece is designated as Ww1, the weight of the second prototype workpiece as Ww2, the volume of the first prototype workpiece as Vw1, and the volume of the second prototype workpiece as Vw2. The weights Ww1 and Ww2 of the first and second prototype workpieces are measured in the measuring unit 110. Furthermore, the volumes Vw1 and Vw2 of the first and second prototype workpieces are directly measured in the volume measuring unit. The volumes Vw1 and Vw2 of the first and second prototype workpieces can also be calculated based on the thicknesses of the first and second prototype workpieces measured in the thickness measuring unit 150.

[0100] Next, the specific gravity of the multiple installations is calculated based on the weight and volume differences of the prototype workpieces (S312). The weight difference of the prototype workpieces is the difference between the weight of the first prototype workpiece and the weight of the second prototype workpiece, and the volume difference of the prototype workpieces is the difference between the volume of the first prototype workpiece and the volume of the second prototype workpiece. The specific gravity of the multiple installations is the sum of the specific gravity of the multiple parts and the multiple connecting members that connect them to the carrier; in other words, it is the specific gravity of the part remaining after removing the carrier from the workpiece.

[0101] Let the weight difference of the prototype workpieces be denoted as ΔWw21, the volume difference of the prototype workpieces be denoted as ΔVw21, and the specific gravity of the multiple installations be denoted as dm. ΔWw21 is calculated using the following formula: ΔWw21 = Ww2 - Ww1. ΔVw21 is calculated using the following formula: ΔVw21 = Vw2 - Vw1. dm is calculated using the following formula: dm = ΔWw21 / ΔVw21.

[0102] Next, the weight and volume of the first prototype assembly package or the second prototype assembly package are measured (S313). The first prototype assembly package is a molded workpiece on which a specified amount of resin has been molded, and is an assembly of multiple packages manufactured based on the first prototype workpiece. The second prototype assembly package is a molded workpiece on which a specified amount of resin has been molded, and is an assembly of multiple packages manufactured based on the second prototype workpiece.

[0103] The weight of the first prototype assembly package is designated as Wp1, the weight of the second prototype assembly package is designated as Wp2, the volume of the first prototype assembly package is designated as Vp1, and the volume of the second prototype assembly package is designated as Vp2. The weight Wp1 of the first prototype assembly package or the weight Wp2 of the second prototype assembly package is measured in the measuring unit 110. Furthermore, the volume Vp1 of the first prototype assembly package or the volume Vp2 of the second prototype assembly package can be measured directly in the volume measuring unit, or it can be calculated based on the thickness of the first prototype assembly package or the thickness of the second prototype assembly package measured in the thickness measuring unit 150. In addition, the weights Wp1 and Wp2 and the volumes Vp1 and Vp2 of both the first and second prototype assembly packages can be measured.

[0104] Furthermore, the weight of the resin supplied to the first prototype workpiece before molding for manufacturing the first prototype assembly package is defined as Wr1. The weight of the resin supplied to the second prototype workpiece before molding for manufacturing the second prototype assembly package is defined as Wr2. The weights Wr1 and Wr2 of the resin can be measured values ​​obtained after supply or set values ​​determined before supply.

[0105] Next, based on the weight and volume differences between the prototype workpiece and the prototype assembly package, the specific gravity of the molded resin is calculated (S314). The weight difference between the prototype workpiece and the prototype assembly package is the difference between the weight of the prototype workpiece before resin is supplied and the weight of the prototype workpiece after the resin is molded on it, which corresponds to the weight of the molded resin in the prototype assembly package. Similarly, the volume difference between the prototype workpiece and the prototype assembly package corresponds to the volume of the molded resin in the prototype assembly package. The specific gravity of the molded resin is the proportion of the molded resin in the prototype assembly package.

[0106] Let ΔWpw1 be the weight difference between the first prototype workpiece and the first prototype assembly package, and ΔVpw1 be the volume difference between them. Let ΔWpw2 be the weight difference between the second prototype workpiece and the second prototype assembly package, and ΔVpw2 be the volume difference between them. Let dr be the specific gravity of the molded resin. ΔWpw1 is calculated using the formula ΔWpw1 = Wp1 - Ww1. ΔVpw1 is calculated using the formula ΔVpw1 = Vp1 - Vw1. ΔWpw2 is calculated using the formula ΔWpw2 = Wp2 - Ww2. ΔVpw2 is calculated using the formula ΔVpw2 = Vp2 - Vw2.

[0107] In step S313, when the weight and volume of the first prototype assembly package are measured, the weight difference and volume difference calculated in step S314 are ΔWpw1 and ΔVpw1, respectively. dr is calculated using the formula V = ΔWpw1 / ΔVpw1. Similarly, in step S313, when the weight and volume of the second prototype assembly package are measured, the weight difference and volume difference calculated in step S314 are ΔWpw2 and ΔVpw2, respectively. dr is calculated using the formula dr = ΔWpw2 / ΔVpw2.

[0108] Furthermore, if the weight and volume of both the first and second prototype assembly packages are measured in process S313, the specific gravity of the molded resin can be set as the average of the specific gravity calculated based on the weight and volume of the first prototype assembly package and the specific gravity calculated based on the weight and volume of the second prototype assembly package. In this case, dr is calculated using the following formula: dr={(ΔWpw1 / ΔVpw1)+(ΔWpw2 / ΔVpw2)} / 2.

[0109] Next, based on the weight difference between the prototype workpiece and the prototype assembly package, the weight change rate of the resin before and after molding is calculated (S315). The weight change rate of the resin before and after molding is the ratio of the weight of the resin after molding to the weight of the resin before molding.

[0110] Let α be the rate of change in resin weight before and after molding. In step S313, when the weight and volume of the first prototype assembly package are measured, α is calculated using the formula α = ΔWpw1 / Wr1. In step S313, when the weight and volume of the second prototype assembly package are measured, α is calculated using the formula α = ΔWpw2 / Wr2.

[0111] Furthermore, since the weight and volume of both the first prototype assembly package and the second prototype assembly package are measured in process S313, the weight change rate of the resin before and after molding can be set as the average of the weight change rate of the resin supplied to the first prototype workpiece and the weight change rate of the resin supplied to the second prototype workpiece. In this case, α is calculated using the following formula: α={(ΔWpw1 / Wr1)+(ΔWpw2 / Wr2)} / 2.

[0112] Next, the weight of the workpiece 10 is measured, and the thickness of the carrier 11 is measured (S321). The weight of the workpiece 10 is set as Ww, and the thickness of the carrier 11 is set as Tc. The weight Ww of the workpiece 10 is measured in the measuring unit 110, and the thickness Tc of the carrier 11 is measured in the thickness measuring unit 150.

[0113] Here, the weight of the carrier 11 is calculated based on its thickness Tc. When the weight of the carrier 11 is set as Wc, the area of ​​the carrier 11 is set as Sc, and the specific gravity of the carrier 11 is set as dc, Wc is calculated using the following formula: Wc = Tc × Sc × dc. The area Sc and specific gravity dc of the carrier 11 are recorded as set values ​​in the calculation unit 120. The area Sc of the carrier 11 can also be a measured value.

[0114] Next, the total weight of the multiple installations is calculated based on the weight of the workpiece 10 (S322). The total weight of the multiple installations is the sum of the total weight of all parts 12 mounted on the workpiece 10 and the total weight of all connecting members that connect all parts 12 to the carrier 11. In other words, it is the weight of the portion remaining after removing the carrier 11 from the workpiece 10. In the case of a partial loss of a part 12, or in the case where the number of parts 12 is inconsistent with the number of connecting members, the total weight of the multiple installations calculated in this step S322 may be calculated as a number that is not an integer multiple of the weight of each group of installations.

[0115] When the total weight of multiple installations is set as Wm, Wm is calculated using the following formula: Wm = Ww - Wc.

[0116] Next, the total volume of the multiple installations is calculated based on their specific gravity and total weight (S323). The total volume of the multiple installations is the sum of the total volume of all parts 12 mounted on the workpiece 10 and the total volume of all connecting members connecting all parts 12 to the carrier 11. In other words, it is the volume of the portion remaining after removing the carrier 11 from the workpiece 10. Similar to the total weight of the multiple installations, the total volume of the multiple installations can be calculated as a number that is not an integer multiple of the volume of each group of installations.

[0117] When the total volume of multiple installations is set as Vm, Vm is calculated using the following formula: Vm = Wm × dm.

[0118] Next, the volume of the molded resin is calculated based on the total volume of the multiple mounts (S324). The volume of the molded resin is the volume occupied by the molded resin in the assembly package, which is the volume of the portion after removing the workpiece 10 from the assembly package.

[0119] The volume of the mold cavity 199 is defined as Vcv, and the volume of the molded resin is defined as Vrc. Vrc is calculated using the formula Vrc = Vcv - Vm. Furthermore, the volume Vcv of the mold cavity 199 is pre-designed based on the target size of the assembly package and is registered as a set value in the calculation unit 120.

[0120] Next, the weight of the molded resin is calculated based on the specific gravity of the molded resin and the volume of the molded resin (S325). The weight of the molded resin is the weight of the molded resin in the assembly package, which is the weight of the portion after removing the workpiece 10 from the assembly package.

[0121] When the weight of the molded resin is set as Wrc, Wrc is calculated using the following formula: Wrc = Vrc × dr.

[0122] Next, based on the rate of change of resin weight before and after molding, and based on the weight of the resin after molding, the weight of the resin before molding is calculated (S326). The calculated weight of the resin before molding is considered as an appropriate supply of resin relative to the workpiece 10.

[0123] When the weight of the resin before molding is set as Wr, Wr is calculated using the following formula: Wr=(1 / α)×Wrc.

[0124] Thus, in this embodiment, the total weight of the multiple installations is calculated based on the weight of the workpiece, and the total volume of the multiple installations is calculated based on their specific gravity and total weight. The resin supply amount is then calculated based on the total volume of the multiple installations. The specific gravity of the multiple installations is calculated by dividing the weight difference between the first and second prototype workpieces by the volume difference between their respective volumes.

[0125] Therefore, the resin supply quantity can be calculated, taking into account not only the number of parts but also the number of connecting components. This improves the accuracy of resin supply calculations, thereby suppressing the generation of defective products caused by resin over- or under-supplied amounts.

[0126] In addition, in this embodiment, the smallest workpiece that is not mounted on the reference carrier at all can be designated as the first prototype workpiece, and the largest workpiece that is mounted on the reference carrier with all the mountings can be designated as the second prototype workpiece.

[0127] Accordingly, the weight and volume differences between the first and second prototype workpieces increased, and the accuracy of the specific gravity calculation for multiple installations improved.

[0128] In addition, in this embodiment, the weight of the carrier, which is calculated based on the thickness of the carrier, is subtracted from the weight of the workpiece to calculate the weight of multiple installations.

[0129] Therefore, the calculation error of resin supply caused by the variation of carrier thickness can be reduced.

[0130] However, the total weight of multiple installations can also be calculated by subtracting the weight of the reference carrier from the weight of the workpiece. In this case, since the weight of the reference carrier is registered as a set value in the calculation unit, the measurement of the carrier thickness in the measuring unit included in process S321 can be omitted, thereby simplifying the manufacturing process.

[0131] In addition, in this embodiment, the volumes of the first prototype workpiece and the second prototype workpiece are directly measured by the volume measuring unit, and the volume difference between the volumes of the first prototype workpiece and the second prototype workpiece is calculated based on the measurement results obtained by the volume measuring unit.

[0132] Therefore, compared with the structure that calculates the volume of the first prototype workpiece and the second prototype workpiece based on the thickness measured by the thickness measuring unit, the time required to calculate the specific gravity of multiple installations can be shortened.

[0133] In addition, in this embodiment, the weight of the resin before molding is calculated based on the weight change rate of the resin before molding and the weight of the resin after molding, as the appropriate amount of resin to be supplied relative to the workpiece.

[0134] Therefore, the calculation error of resin supply caused by the weight change of resin before and after molding can be reduced.

[0135] However, the weight of the molded resin can also be calculated based on the volume of the molded resin to determine the appropriate amount of resin to be supplied relative to the workpiece.

[0136] Therefore, process S315 or process S326 can be omitted, thereby simplifying the manufacturing process.

[0137] Furthermore, in this embodiment, the manufacturing conditions (specific gravity of multiple components, specific gravity of the resin after molding, weight change rate of the resin before and after molding, etc.) are calculated based on two prototype workpieces. However, the manufacturing conditions can also be calculated based on three or more prototype workpieces. By increasing the number of prototype workpieces, the accuracy of the manufacturing conditions can be improved.

[0138] Next, refer to Figure 12 and Figure 13 An example of a method for calculating the amount of resin supplied according to one embodiment will be described. Figure 12 and Figure 13 This is a flowchart representing part of the method for calculating the amount of resin supplied. Figure 12 This is a flowchart representing the trial production stage. Figure 13 This is a flowchart representing the formal phase. In the following description, references to... Figure 10 and Figure 11 For processes that are identical to those described, detailed descriptions are omitted.

[0139] First, the weights of the third and fourth prototype workpieces are measured (S411). The third and fourth prototype workpieces are workpieces with different numbers of mounting elements mounted on a reference carrier. The third and fourth prototype workpieces are appropriately selected from all undamaged workpieces of the multiple mounted parts 12. Therefore, the number of mounted parts 12 in the third and fourth prototype workpieces is consistent with the number of mounting elements. Ideally, the number of mounting elements in each of the third and fourth prototype workpieces should be significantly different. Ideally, the third prototype workpiece is the smallest workpiece (i.e., the reference carrier) without any mounting elements, and the fourth prototype workpiece is the largest workpiece with all mounting elements mounted.

[0140] The weight of the third prototype workpiece is set as Ww3, and the weight of the fourth prototype workpiece is set as Ww4. The weights of the third prototype workpiece Ww3 and the fourth prototype workpiece Ww4 are measured in the measuring unit 110. The number of sets of mounts mounted on the third prototype workpiece is set as Nw3, and the number of sets of mounts mounted on the fourth prototype workpiece is set as Nw4. The number of sets of mounts Nw3 and Nw4 mounted on the third and fourth prototype workpieces is, for example, proportional to the number of parts 12 obtained by counting the third and fourth prototype workpieces through thickness measurement or image analysis, but may also be a predetermined set value registered in the calculation unit 120. In addition, either the number of sets of mounts Nw3 and Nw4 mounted on the third and fourth prototype workpieces may be 0.

[0141] Next, the thickness, upper surface area, and weight of the third to sixth prototype assembly packages are measured (S412). The third prototype assembly package is a molded workpiece obtained by molding a first-supply amount of resin onto the third prototype workpiece; it is an assembly of multiple packages manufactured based on the third prototype workpiece. The fourth prototype assembly package is a molded workpiece obtained by molding a first-supply amount of resin onto the fourth prototype workpiece; it is an assembly of multiple packages manufactured based on the fourth prototype workpiece. The fifth prototype assembly package is a molded workpiece obtained by molding a second-supply amount of resin onto the third prototype workpiece; it is an assembly of multiple packages manufactured based on the third prototype workpiece. The sixth prototype assembly package is a molded workpiece obtained by molding a second-supply amount of resin onto the fourth prototype workpiece; it is an assembly of multiple packages manufactured based on the fourth prototype workpiece. Furthermore, the first and second prototype assembly packages described in the claims of this application are, for example, the third and fourth prototype assembly packages.

[0142] The weight of the first supplied amount of resin before molding is set as Wra, and the weight of the second supplied amount of resin before molding is set as Wrb. The weights of the first supplied amount of resin before molding, Wra and Wrb, can be measured values ​​measured in the metering unit 110 after supply and before molding, or they can be set values ​​determined before supply.

[0143] The thickness of the prototype assembly package is the average thickness of the portion of the upper surface that becomes flat when the carrier side of the prototype assembly package is the lower surface and the resin side is the upper surface. The area of ​​the upper surface of the prototype assembly package is the area of ​​the portion of the upper surface that becomes flat. However, the thickness of the prototype assembly package can be the maximum or minimum thickness of the portion of the upper surface that becomes flat, or it can be the thickness at a defined location such as the center.

[0144] The thickness of the third prototype assembly package is set to Tp3, the thickness of the fourth prototype assembly package is set to Tp4, the thickness of the fifth prototype assembly package is set to Tp5, and the thickness of the sixth prototype assembly package is set to Tp6. The thicknesses Tp3 to Tp6 of the third prototype assembly package are measured in the thickness measurement unit 150. Regarding the thicknesses Tp3 to Tp6 of the third prototype assembly package, if at least three are measured, the measurement of the remaining one can be omitted. When the upper surface area is set to Sp, the upper surface area Sp can be obtained by measuring the upper surface area of ​​any one of the third to sixth prototype assembly packages, or by measuring the upper surface areas of two or more of the third to sixth prototype assembly packages and calculating the average of these values. The upper surface area Sp can also be the area of ​​the flat bottom surface of the mold cavity 199, which is registered as a set value in the calculation unit 120. The weight of the third prototype assembly package is designated as Wp3, the weight of the fourth prototype assembly package as Wp4, the weight of the fifth prototype assembly package as Wp5, and the weight of the sixth prototype assembly package as Wp6. The weights Wp3 to Wp6 of the third prototype assembly package are measured, for example, in the measurement unit 110. Regarding the weights Wp3 to Wp6 of the third prototype assembly package, if at least one is measured, the measurement of the remaining three can be omitted.

[0145] Next, the volume of each set of mounts is calculated based on the first thickness difference and the difference in the number of mounts (S413). The first thickness difference is the difference in thickness that occurs when the same amount of resin is molded on two workpieces with different numbers of mounts, and is related to the difference in the number of mounts. The difference in the number of mounts is the difference between the number of mounts Nw3 mounted on the third prototype workpiece and the number of mounts Nw4 mounted on the fourth prototype workpiece. The volume of each set of mounts is the sum of the volume of the undamaged part 12 mounted on a packaging area and the volume of the undamaged connecting member that connects the part 12 to the carrier 11.

[0146] Let the first thickness difference be ΔT1, the difference in the number of installation groups be ΔNw43, and the volume of each installation group be Vs.

[0147] If the measurement of either the thickness Tp5 of the fifth prototype assembly package or the thickness Tp6 of the sixth prototype assembly package is omitted in process S412, the first thickness difference ΔT1 is the difference between the thickness Tp4 of the fourth prototype assembly package and the thickness Tp3 of the third prototype assembly package. In this case, ΔT1 is calculated using the following formula: ΔT1 = |Tp4 - Tp3|. If the measurement of either the thickness Tp3 of the third prototype assembly package or the thickness Tp4 of the fourth prototype assembly package is omitted in process S412, the first thickness difference ΔT1 is the difference between the thickness Tp6 of the sixth prototype assembly package and the thickness Tp5 of the fifth prototype assembly package. In this case, ΔT1 is calculated using the following formula: ΔT1 = |Tp6 - Tp5|. If, in process S412, all thicknesses from the third prototype assembly package (Tp3) to the sixth prototype assembly package (Tp6) are measured, the first thickness difference ΔT1 can also be set as the average of the thickness differences between the fourth and third prototype assembly packages and the thickness differences between the sixth and fifth prototype assembly packages. In this case, ΔT1 is calculated using the following formula: ΔT1 = (|Tp4 - Tp3| + |Tp6 - Tp5|) / 2.

[0148] ΔNw43 is calculated using the formula ΔNw43=|Nw4-Nw3|. For example, when the third prototype workpiece is the smallest workpiece (Nw=0), the number of sets of mountings on the fourth prototype workpiece is the difference in the number of sets (ΔNw43=Nw4). Furthermore, since the third and fourth prototype workpieces are selected from all undamaged workpieces of the multiple parts 12 mounted on them, Nw3 and Nw4 are 0 or positive integers, and ΔNw43 is a positive integer.

[0149] Vs is calculated using the following formula: Vs=(ΔTl×Sp) / ΔNw43.

[0150] Next, based on the weight difference of the prototype workpieces and the difference in the number of sets of the mountings, the weight of each set of mountings is calculated (S414). The weight difference of the prototype workpieces is the difference between the weight Ww4 of the fourth prototype workpiece and the weight Ww3 of the third prototype workpiece, which is equivalent to the total weight of the mountings with a difference in the number of sets ΔNw43. The weight of each set of mountings is the sum of the weight of the undamaged part 12 mounted on a packaging area and the weight of the undamaged connecting member that connects the part 12 to the carrier 11.

[0151] The weight difference of the prototype workpieces is denoted as ΔWw43, and the weight of each set of installations is denoted as Ws. ΔWw43 is calculated using the formula ΔWw43=|Ww4-Ww3|. Ws is calculated using the formula Ws=ΔWw43 / ΔNw43.

[0152] Next, based on the second thickness difference and the supply amount difference, the estimated specific gravity of the resin is calculated (S415). The second thickness difference is the difference in thickness that occurs when different supply amounts of resin are molded on two workpieces with the same number of mounting elements, and is related to the volume of the molded resin. The supply amount difference is the difference between the weight Wra of the first supply amount of resin before molding and the weight Wrb of the second supply amount of resin before molding. The estimated specific gravity of the resin is the specific gravity of the resin calculated assuming that the weight of the resin before and after molding is approximately constant.

[0153] Set the second thickness difference as ΔT2, the supply difference as ΔWr, and the estimated specific gravity of the resin as drx.

[0154] If the measurement of either the thickness Tp4 of the fourth prototype assembly package or the thickness Tp6 of the sixth prototype assembly package is omitted in process S412, the second thickness difference ΔT2 is the difference between the thickness Tp5 of the fifth prototype assembly package and the thickness Tp3 of the third prototype assembly package. In this case, ΔT2 is calculated using the following formula: ΔT2 = |Tp5 - Tp3|. If the measurement of either the thickness Tp3 of the third prototype assembly package or the thickness Tp5 of the fifth prototype assembly package is omitted in process S412, the second thickness difference ΔT2 is the difference between the thickness Tp6 of the sixth prototype assembly package and the thickness Tp4 of the fourth prototype assembly package. In this case, ΔT2 is calculated using the following formula: ΔT2 = |Tp6 - Tp4|. If, in process S412, all thicknesses of the third prototype assembly package (Tp3) to the sixth prototype assembly package (Tp6) are measured, the second thickness difference ΔT2 can also be set as the average of the thickness differences between the fifth and third prototype assembly packages and the thickness differences between the sixth and fourth prototype assembly packages. In this case, ΔT2 is calculated using the following formula: ΔT2 = (|Tp5 - Tp3| + |Tp6 - Tp4|) / 2.

[0155] ΔWr is calculated using the following formula: ΔWr=|Wrb-Wra|.

[0156] drx is calculated using the following formula: drx=ΔWr / (ΔT2×Sp).

[0157] Next, based on the estimated specific gravity of the resin, the maximum weight of the resin is calculated (S416). The maximum weight of the resin is the weight of resin required to supply the smallest workpiece (i.e., the reference carrier) without any mounted parts in order to manufacture the assembly package of the target size.

[0158] The maximum weight of the resin is set as Wrm, and the target thickness of the assembly package, registered as a set value in the calculation unit 120, is set as Tpt. When the third prototype workpiece is used as the reference carrier, the maximum weight of the resin, Wrm, can be calculated by correcting the weight difference between the weight of the prototype assembly package manufactured from the third prototype workpiece and the target weight of the assembly package, relative to the weight of the resin supplied to the third prototype workpiece. In this case, Wrm is calculated using the following formula: Wrm = Wra - {(Tp3 - Tpt) × Sp / drx} or Wrm = Wrb - {(Tp5 - Tpt) × Sp / drx}.

[0159] When the thickness of the reference carrier is recorded as a set value in the calculation unit 120, if the thickness of the reference carrier is set to Tcs, Wrm can also be calculated using the following formula: Wrm = (Tpt - Tcs) × Sp / drx. Furthermore, in the formula for calculating Wrm, the measured value obtained by measuring the thickness of the carrier included in the third or fourth prototype workpiece can be used instead of Tcs, which is the set value for the thickness of the reference carrier.

[0160] Next, the weight of workpiece 10 is measured, and the thickness of carrier 11 is measured (S421). The weight of workpiece 10 is set as Ww, and the thickness of carrier 11 is set as Tc. In addition, the weight Wc of carrier 11 is calculated based on the thickness Tc of carrier 11.

[0161] Next, the total weight of the multiple installations is calculated based on the weight of the workpiece (S422). The total weight of the multiple installations is set as Wm.

[0162] Next, the number of sets of multiple installations is calculated based on the weight of each set of installations and the total weight of the multiple installations (S423). The number of sets of multiple installations is the total number of sets of multiple installations mounted on the workpiece 10. In the case of a partial loss of a part 12, or in the case where the number of parts 12 is inconsistent with the number of connecting members, the number of sets of multiple installations may also be calculated as a non-integer number.

[0163] When the number of groups of multiple installations is set to Nm, Nm is calculated using the following formula: Nm = Wm / Ws.

[0164] Next, the total volume of the multiple installations is calculated based on the weight of each group of installations and the number of groups of installations (S424).

[0165] When the total volume of multiple installations is set as Vm, Vm is calculated using the following formula: Vm = Nm × Vs.

[0166] Next, based on the estimated specific gravity of the resin, the resin equivalent weight of the multiple mounts is calculated according to the total volume of the multiple mounts (S425). The resin equivalent weight of the multiple mounts is the weight when the multiple mounts in the workpiece 10 are replaced by the molded resin. In other words, it is the weight of the molded resin of the same volume as the total volume of the multiple mounts.

[0167] When the equivalent weight of resin for multiple installations is set as Wrx, Wrx is calculated using the following formula: Wrx = Vm × drx.

[0168] Next, the weight of the molded resin is calculated based on the maximum weight of the molded resin and the converted weight of the resin of the multiple installations (S426).

[0169] When the weight of the molded resin is set as Wrc, Wrc is calculated using the following formula: Wrc = Wrm - Wrx. The calculated weight of the molded resin, Wrc, is considered as the appropriate amount of resin supplied relative to the workpiece 10.

[0170] Thus, in this embodiment, the total weight of multiple mounts is calculated based on the weight of the workpiece, and the number of sets of multiple mounts is calculated based on the weight of each set of mounts and the total weight of the multiple mounts. The total volume of the multiple mounts is calculated based on the volume of each set of mounts and the number of sets of multiple mounts, and the resin supply is calculated based on the total volume of the multiple mounts. The volume of each set of mounts is calculated, for example, by multiplying the thickness difference between the thickness of the third prototype assembly package and the thickness of the fourth prototype assembly package by the upper surface area of ​​the third or fourth prototype assembly package, and dividing by the difference in the number of sets of mounts for the third prototype workpiece and the number of sets of mounts for the fourth prototype workpiece. The weight of each set of mounts is calculated, for example, by dividing the weight difference between the weight of the third prototype workpiece and the weight of the fourth prototype workpiece by the difference in the number of sets of mounts for the third prototype workpiece and the number of sets of mounts for the fourth prototype workpiece.

[0171] Therefore, the resin supply quantity can be calculated, taking into account not only the number of parts but also the number of connecting components. This improves the accuracy of resin supply calculations, thereby suppressing the generation of defective products caused by resin over- or under-supplied amounts.

[0172] In addition, in this embodiment, the smallest workpiece that is not mounted on the reference carrier at all can be designated as the third prototype workpiece, and the largest workpiece that is mounted on the reference carrier with all the mountings can be designated as the fourth prototype workpiece.

[0173] Accordingly, the thickness difference between the third and fourth prototype assembly packages, as well as the difference in the number of mounting groups between the third and fourth prototype workpieces, increases, and the calculation accuracy of the volume of each mounting group improves. Furthermore, the weight difference between the third and fourth prototype workpieces also increases, and the calculation accuracy of the weight of each mounting group improves.

[0174] In addition, in this embodiment, the weight of the carrier, calculated based on the thickness of the carrier, is subtracted from the weight of the workpiece to calculate the weight of multiple installations.

[0175] Therefore, the calculation error of resin supply caused by the variation of carrier thickness can be reduced.

[0176] However, the weight of multiple installations can also be calculated by subtracting the weight of the reference carrier from the weight of the workpiece. In this case, since the weight of the reference carrier is registered as a set value in the calculation unit, the measurement of the carrier thickness in the measuring unit included in process S321 can be omitted, thereby simplifying the manufacturing process.

[0177] In addition, in this embodiment, the estimated specific gravity of the resin is calculated by dividing the weight of the resin before molding by the volume of the resin after molding, and the maximum weight of the resin is calculated based on the estimated specific gravity of the resin, and the weight of the resin after molding is calculated based on the maximum weight of the resin.

[0178] However, the method for calculating the maximum weight Wrm of the resin is not limited to the method described above. For example, the specific gravity of the molded resin can also be set as drc, and calculated using the following formula: Wrm = Wrb - {(Tp5 - Tpt) × Sp / drc}. When the weight difference between the fifth prototype assembly package weight Wp5 and the third prototype assembly package weight Wp3 is set as ΔWp53, drc is calculated using the following formula: drc = ΔWp53 / (ΔT2 × Sp).

[0179] The maximum weight of the resin, Wrm, can also be calculated by multiplying the capacity of the mold cavity 199, which is registered as a design value in the calculation unit 120, by the estimated specific gravity of the resin or the specific gravity of the molded resin.

[0180] In addition, in this embodiment, the weight of the resin after molding is calculated as the appropriate amount of resin to be supplied relative to the workpiece.

[0181] However, the weight change rate of the resin before and after molding can also be calculated, and the weight of the resin before molding can be calculated based on the weight Wrc of the resin after molding, which is regarded as the appropriate supply amount of resin relative to the workpiece. The weight change rate of the resin before and after molding can be calculated, for example, by dividing the weight difference between the weight Wp5 of the fifth prototype assembly package and the weight Wp3 of the third prototype assembly package by the weight difference between the weight of the second supply amount of resin and the weight of the first supply amount of resin.

[0182] As described above, according to one embodiment of the present invention, a compression molding apparatus that can improve the accuracy of resin supply can be provided.

[0183] The embodiments described above are provided for ease of understanding of the present invention and are not intended to limit the scope of the invention. The components, their configurations, materials, conditions, shapes, and dimensions included in the embodiments are not limited to the illustrated components, their configurations, materials, conditions, shapes, and dimensions, and can be appropriately modified. Furthermore, the structures shown in different embodiments can be partially interchanged or combined with each other.

Claims

1. A compression molding apparatus for compressing resin onto a workpiece having multiple parts mounted on a carrier via multiple connecting members to manufacture multiple packages, each having at least one part sealed in resin, the compression molding apparatus comprising: The metrology department measures the weight of the workpiece. The calculation unit calculates the amount of resin to be supplied based on the weight of the workpiece measured by the measurement unit. The supply unit supplies the amount of resin calculated by the calculation unit. as well as A molding die is used to compress and shape the resin supplied through the supply section onto the workpiece. The computing unit is Based on the weight of the workpiece, the total volume of the multiple installations, including the multiple parts and the multiple connecting components, is calculated, and The amount of resin supplied is calculated based on the total volume of the plurality of installations.

2. The compression forming apparatus according to claim 1, wherein, The computing unit is The total weight of the plurality of installations is calculated based on the weight of the workpiece, and The total volume of the multiple installations is calculated based on their total weight.

3. The compression forming apparatus according to claim 2, wherein, The computing unit is The total volume of the multiple installations is calculated based on their specific gravity and total weight.

4. The compression forming apparatus according to claim 3, wherein, The measurement unit measures the weight of a first prototype workpiece having a first set of mountings mounted on a reference carrier, and the weight of a second prototype workpiece having a second set of mountings mounted on a reference carrier, which has a different number of mountings than the first set. The calculation unit calculates the specific gravity of the plurality of installations by dividing the weight difference between the first prototype workpiece and the second prototype workpiece by the volume difference between the volume of the first prototype workpiece and the volume of the second prototype workpiece.

5. The compression forming apparatus according to claim 3, wherein, The measurement unit measures the weight of a first prototype workpiece without any mounting on the reference carrier, and the weight of a second prototype workpiece with all mountings mounted on the reference carrier. The calculation unit calculates the specific gravity of the plurality of installations by dividing the weight difference between the first prototype workpiece and the second prototype workpiece by the volume difference between the volume of the first prototype workpiece and the volume of the second prototype workpiece.

6. The compression forming apparatus according to claim 4 or 5 further includes a volume measuring unit for measuring the volume of the workpiece. The volume measurement unit measures the volume of the first prototype workpiece and the volume of the second prototype workpiece.

7. The compression forming apparatus according to claim 2, wherein, The computing unit is The number of groups of installations is calculated based on the weight of each group of installations and the total weight of the multiple installations. The total volume of the multiple installations is calculated based on the volume of each group of installations and according to the number of groups of the multiple installations.

8. The compression forming apparatus according to claim 7 further includes a thickness measuring unit for measuring the thickness of the package. The measurement unit measures the weight of the third prototype workpiece mounted on a reference carrier with a third set of mountings, and the weight of the fourth prototype workpiece mounted on a reference carrier with a fourth set of mountings. The thickness measuring unit measures the thickness of the first prototype assembly package obtained by molding the first supplied amount of resin onto the third prototype workpiece, and the thickness of the second prototype assembly package obtained by molding the first supplied amount of resin onto the fourth prototype workpiece. The computing unit is The volume of each assembly is calculated by multiplying the thickness difference between the first and second prototype assembly thicknesses by the upper surface area of ​​either the first or second prototype assembly, and then dividing by the difference between the third and fourth group numbers. The weight of each set of installations is calculated by dividing the weight difference between the third and fourth prototype workpieces by the difference in the number of groups.

9. The compression forming apparatus according to claim 7 further includes a thickness measuring unit for measuring the thickness of the package. The measurement unit measures the weight of the third prototype workpiece without any mounting on the reference carrier, and the weight of the fourth prototype workpiece with all mountings mounted on the reference carrier. The thickness measuring unit measures the thickness of the first prototype assembly package obtained by molding the first supplied amount of resin onto the third prototype workpiece, and the thickness of the second prototype assembly package obtained by molding the first supplied amount of resin onto the fourth prototype workpiece. The computing unit is The volume of each set of mounting objects is calculated by multiplying the thickness difference between the first and second prototype assembly packages by the upper surface area of ​​either the first or second prototype assembly package, and then dividing by the number of sets of mounting objects mounted on the fourth prototype workpiece. The weight of each set of mountings is calculated by dividing the weight difference between the third prototype workpiece and the fourth prototype workpiece by the number of sets of mountings mounted on the fourth prototype workpiece.

10. The compression forming apparatus according to claim 2, wherein, The calculation unit calculates the weight of the plurality of mounts by subtracting the weight of the reference carrier from the weight of the workpiece.

11. The compression molding apparatus according to claim 2, further comprising a thickness measuring unit for measuring the thickness of the carrier. The calculation unit calculates the weight of the carrier based on the thickness of the carrier, and calculates the weight of the plurality of installations by subtracting the weight of the carrier from the weight of the workpiece.

12. The compression forming apparatus according to claim 1, wherein, The computing unit is Based on the total volume of the plurality of mounts, the volume of molded resin required to make the plurality of packages achieve the desired thickness is calculated, and Based on the volume of the molded resin, the weight of the molded resin is calculated as the resin supply amount.

13. The compression forming apparatus according to claim 1, wherein, The computing unit is Based on the total volume of the plurality of mounts, the volume of molded resin required to make the plurality of packages achieve the desired thickness is calculated, and The weight of the molded resin is calculated based on its volume, and Based on the rate of change of resin weight before and after molding, the weight of resin before molding is calculated as the supply amount of resin according to the weight of the resin after molding.

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