A method and apparatus for implementing a coupled current test

Abstract

The application discloses a method and device for realizing coupling current test, comprising: irradiating a printed circuit board (PCB) with preset transient X-ray and electromagnetic pulse; and measuring coupling current through a pin preset at the end of a trace of the PCB; wherein the PCB is provided with preset distributed traces, and the traces are connected with one or more wired cables, and the end of the traces is provided with a pin for measuring coupling current. Through the connection of the PCB containing the traces with the wired cables, the measurement of the coupling current of the PCB connected with the wired cables is realized through the pin at the end of the traces under the irradiation of the PCB with the preset transient X-ray and electromagnetic pulse, thereby providing technical support for electromagnetic compatibility analysis and design under a composite environment.

Description

Technical Field

[0001] This article relates to, but is not limited to, electronic circuit technology, and in particular to a method and apparatus for implementing coupling current testing. Background Technology

[0002] During operation, nuclear explosion and terrestrial nuclear radiation simulation devices (such as accelerators) and controlled nuclear fusion devices (such as laser inertial confinement fusion) generate a complex environment where transient ionizing radiation (i.e., X-rays) and electromagnetic pulses coexist. When transient X-rays irradiate equipment within the device, they interact with the equipment materials to generate photoelectrons. The electromagnetic field excited by the motion of these photoelectrons (system electromagnetic pulses) can interfere with the equipment. When system electromagnetic pulses irradiate transmission line structures, they generate coupling currents in the core wires, which can also interfere with the equipment. Printed circuit boards (PCBs) with wired connections will generate various coupling currents under the irradiation of transient X-rays and electromagnetic pulses. If these coupling currents cannot be obtained through testing, it will be detrimental to conducting electromagnetic compatibility analysis and design in this complex environment.

[0003] The aforementioned devices cannot test coupling current during operation, and the related technologies do not provide a testing method for coupling current generated on PCB boards with wired connections under transient X-ray and electromagnetic pulse irradiation; how to measure the coupling current generated on PCB boards with wired connections has become a problem to be solved. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This invention provides a method and apparatus for testing coupling current, which can measure the coupling current of PCB boards with wired cable connections, providing technical support for electromagnetic compatibility analysis and design in complex environments.

[0006] This invention provides a method for testing coupling current, comprising:

[0007] The printed circuit board (PCB) is irradiated with preset transient X-rays and electromagnetic pulses.

[0008] The coupling current is measured by pins pre-set at the ends of PCB traces;

[0009] The PCB has a pre-distributed set of traces, which are connected to one or more wired cables. The ends of the traces are provided with pins for measuring coupling current.

[0010] On the other hand, embodiments of the present invention also provide an apparatus for testing coupling current, comprising: an irradiation unit and a measurement unit; wherein,

[0011] The irradiation unit is configured to irradiate the printed circuit board (PCB) with preset transient X-rays and electromagnetic pulses.

[0012] The measurement unit is configured to measure the coupling current via a pin pre-set at the end of the PCB trace;

[0013] The PCB has a pre-distributed set of traces, which are connected to one or more wired cables. The ends of the traces are provided with pins for measuring coupling current.

[0014] The technical solution of this application includes: irradiating a printed circuit board (PCB) with preset transient X-rays and electromagnetic pulses; measuring the coupling current through pins pre-set at the ends of PCB traces; wherein, the PCB has preset distributed traces, and the traces are connected to one or more wired cables, and the ends of the traces are provided with pins for measuring the coupling current. This embodiment of the invention connects a PCB containing traces to wired cables, and under preset transient X-ray and electromagnetic pulse irradiation conditions, measures the coupling current of the PCB board connected to the wired cables through pins at the ends of the traces, providing technical support for electromagnetic compatibility analysis and design in complex environments.

[0015] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0016] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of the present invention and do not constitute a limitation on the technical solutions of the present invention.

[0017] Figure 1 This is a flowchart illustrating the method for implementing coupling current testing according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the coupling current in an embodiment of the present invention;

[0019] Figure 3 This is a structural block diagram of the device for implementing coupling current testing according to an embodiment of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

[0021] The steps illustrated in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases the steps shown or described may be performed in a different order than that presented here.

[0022] Figure 1 This is a flowchart illustrating the method for implementing coupling current testing according to an embodiment of the present invention, as shown below. Figure 1 As shown, it includes:

[0023] Step 101: Irradiate the printed circuit board (PCB) with preset transient X-rays and electromagnetic pulses;

[0024] Step 102: Measure the coupling current using pins pre-set at the ends of PCB traces;

[0025] The PCB has pre-distributed traces, which are connected to one or more wired cables. The ends of the traces are provided with pins for measuring the coupling current.

[0026] This invention connects a PCB with traces to a wired cable. Under preset transient X-ray and electromagnetic pulse irradiation of the PCB, the coupling current of the PCB connected by the wired cable is measured through the pins at the ends of the traces, providing technical support for electromagnetic compatibility analysis and design in complex environments.

[0027] In one exemplary instance, the PCB in this embodiment of the invention comprises a PCB fabricated with reference to the device structure in a simulation device (such as an accelerator) of a nuclear explosion, ground nuclear radiation, or a controlled nuclear fusion device (such as laser inertial confinement fusion).

[0028] In one exemplary instance, the wired cable in this embodiment of the invention includes:

[0029] Signal cables and / or power cables.

[0030] In one exemplary instance, the wired cable in this embodiment of the invention includes one or any combination of the following: bare wire, shielded wire, and twisted pair.

[0031] In one exemplary instance, before irradiating the PCB with preset transient X-rays and electromagnetic pulses in this embodiment of the invention, the method further includes:

[0032] The simulation algorithm determines one or any combination of the following: PCB board size, PCB board traces, and wired cable length.

[0033] In one exemplary instance, the simulation algorithm in this embodiment of the invention includes one or any combination of the following:

[0034] Electromagnetic algorithm (CST), high-frequency structure simulation (HFSS), finite element algorithm, and finite-difference time-domain (FDTD) algorithm.

[0035] In one exemplary instance, the wired cable in this embodiment of the invention is connected to the traces on the PCB via an adapter.

[0036] In one exemplary instance, the pins at the end of the trace in this embodiment of the invention are connected to a current probe or a device in related technologies that can be used to test the coupling current, thereby enabling the testing of the coupling current.

[0037] In one exemplary instance, the coupling current in this embodiment of the invention includes:

[0038] When a wired cable is irradiated by transient X-rays, the core metal material and the shielding metal material emit photoelectrons due to the photoelectric effect and Compton scattering effect of the transient X-rays, and these photoelectrons are deposited in the insulating medium inside the cable. The induced current I1 is generated by the emission of photoelectrons and the deposition on the core of the wired cable.

[0039] When a wired cable is irradiated by an electromagnetic pulse, an electromagnetic field coupling current I2 is generated in the core wire of the wired cable.

[0040] When traces (metal traces) on a PCB are irradiated by transient X-rays, photoelectrons are emitted and deposited, generating a coupling current I3 on ​​the traces;

[0041] The traces on the PCB are subjected to electromagnetic pulse irradiation, which generates an electromagnetic field coupling current I4.

[0042] In this embodiment of the invention, when a wired cable is irradiated by transient X-rays, the core metal material and the shielding layer metal material undergo photoelectric effect and Compton scattering with the transient X-rays, thereby emitting photoelectrons. The range of these photoelectrons is typically tens of micrometers, and they are deposited in the internal insulating medium of the wired cable. The emission and deposition of photoelectrons occur on the core of the wired cable. Figure 2 The induced current I1 shown is called the electromagnetic pulse of the cable system. In this embodiment of the invention, the wired cable is connected to the trace on the PCB through an adapter, and the current transmitted to the trace is the sum of the four coupling currents mentioned above, i.e., I... 总 =I1+I2+I3+I4.

[0043] Figure 3 This is a structural block diagram of the device for implementing coupling current testing according to an embodiment of the present invention, as shown below. Figure 3 As shown, it includes: an irradiation unit and a measurement unit; wherein,

[0044] The irradiation unit is configured to irradiate the printed circuit board (PCB) with preset transient X-rays and electromagnetic pulses.

[0045] The measurement unit is configured to measure the coupling current via a pin pre-set at the end of the PCB trace;

[0046] The PCB has pre-distributed traces, which are connected to one or more wired cables. The ends of the traces are provided with pins for measuring the coupling current.

[0047] In one exemplary instance, the wired cable in this embodiment of the invention includes:

[0048] Signal cables and / or power cables.

[0049] In one exemplary instance, the wired cable in this embodiment of the invention includes one or any combination of the following: bare wire, shielded wire, and twisted pair.

[0050] In one exemplary embodiment, the apparatus of the present invention further includes a simulation unit, configured as follows:

[0051] The simulation algorithm determines one or any combination of the following: PCB board size, PCB board traces, and wired cable length.

[0052] In one exemplary instance, the simulation algorithm in this embodiment of the invention includes one or any combination of the following:

[0053] Electromagnetic algorithm (CST), high-frequency structure simulation (HFSS), finite element algorithm, and finite-difference time-domain (FDTD) algorithm.

[0054] In one exemplary instance, the wired cable in this embodiment of the invention is connected to the traces on the PCB via an adapter.

[0055] In one exemplary instance, the coupling current in this embodiment of the invention includes:

[0056] When a wired cable is irradiated by transient X-rays, the core metal material and the shielding metal material emit photoelectrons due to the photoelectric effect and Compton scattering effect of the transient X-rays, and these photoelectrons are deposited in the insulating medium inside the cable. The induced current I1 is generated by the emission of photoelectrons and the deposition on the core of the wired cable.

[0057] When a wired cable is irradiated by an electromagnetic pulse, an electromagnetic field coupling current I2 is generated in the core wire of the wired cable.

[0058] When traces on a PCB are irradiated by transient X-rays, photoelectrons are emitted and deposited, generating a coupling current I3 on ​​the traces;

[0059] The traces on the PCB are subjected to electromagnetic pulse irradiation, which generates an electromagnetic field coupling current I4.

[0060] In this embodiment of the invention, the wired cable is connected to the traces on the PCB via an adapter, and the current transmitted to the traces is the sum of the four coupling currents mentioned above, i.e., I. 总 =I1+I2+I3+I4.

[0061] It will be understood by those skilled in the art that all or some of the steps, systems, or apparatuses disclosed above, and their functional modules / units, can be implemented as software, firmware, hardware, or suitable combinations thereof. In hardware implementations, the division between functional modules / units mentioned above does not necessarily correspond to the division of physical components; for example, a physical component may have multiple functions, or a function or step may be performed collaboratively by several physical components. Some or all components may be implemented as software executed by a processor, such as a digital signal processor or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit (ASIC). Such software may be distributed on a computer-readable medium, which may include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and can be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

Claims

1. A method for measuring coupling current, characterized in that, include: The printed circuit board (PCB) is irradiated with preset transient X-rays and electromagnetic pulses. The coupling current is measured by pins pre-set at the ends of PCB traces; The PCB has pre-distributed traces connected to one or more types of wired cables. Each trace has a pin at its end for measuring coupling current. The coupling current includes: when the wired cable is irradiated by transient X-rays, the core metal material and shielding metal material emit photoelectrons due to the photoelectric effect and Compton scattering effect, which are deposited in the internal insulating medium of the cable. The induced current I1 is generated by the emission and deposition of photoelectrons on the core of the wired cable; when the wired cable is irradiated by an electromagnetic pulse, an electromagnetic field coupling current I2 is generated on the core of the wired cable; when the traces on the PCB are irradiated by transient X-rays, photoelectron emission and deposition occur, generating a coupling current I3 on ​​the traces; and when the traces on the PCB are irradiated by an electromagnetic pulse, an electromagnetic field coupling current I4 is generated. The wired cable is connected to the traces on the PCB via an adapter, and the current transferred to the traces is I. 总 =I1+I2+I3+I4.

2. The method according to claim 1, characterized in that, The wired cable includes: Signal cables and / or power cables.

3. The method according to claim 1, characterized in that, The wired cable includes one or any combination of the following: bare wire, shielded wire, and twisted pair.

4. The method according to any one of claims 1-3, characterized in that, Before irradiating the PCB with preset transient X-rays and electromagnetic pulses, the method further includes: The following one or any combination of the following is determined by simulation algorithms: the size of the PCB, the traces on the PCB, and the length of the wired cable.

5. The method according to claim 4, characterized in that, The simulation algorithm includes one or any combination of the following: Electromagnetic algorithm CST, high-frequency structure simulation HFSS, finite element algorithm and finite-difference time-domain (FDTD) algorithm.

6. A device for measuring coupling current, characterized in that, include: Irradiation unit and measurement unit; wherein, The irradiation unit is configured to irradiate the printed circuit board (PCB) with preset transient X-rays and electromagnetic pulses. The measurement unit is configured to measure the coupling current via a pin pre-set at the end of the PCB trace; The PCB has pre-distributed traces connected to one or more types of wired cables. Each trace has a pin at its end for measuring coupling current. The coupling current includes: when the wired cable is irradiated by transient X-rays, the core metal material and shielding metal material emit photoelectrons due to the photoelectric effect and Compton scattering effect, which are deposited in the internal insulating medium of the cable. The induced current I1 is generated by the emission and deposition of photoelectrons on the core of the wired cable; when the wired cable is irradiated by an electromagnetic pulse, an electromagnetic field coupling current I2 is generated on the core of the wired cable; when the traces on the PCB are irradiated by transient X-rays, photoelectron emission and deposition occur, generating a coupling current I3 on ​​the traces; and when the traces on the PCB are irradiated by an electromagnetic pulse, an electromagnetic field coupling current I4 is generated. The wired cable is connected to the traces on the PCB via an adapter, and the current transferred to the traces is I. 总 =I1+I2+I3+I4.

7. The apparatus according to claim 6, characterized in that, The wired cable includes: Signal cables and / or power cables.

8. The apparatus according to claim 6 or 7, characterized in that, The device further includes a simulation unit, configured as follows: The following one or any combination of the following is determined by simulation algorithms: the size of the PCB, the traces on the PCB, and the length of the wired cable.

Images