Heat dissipation device and network equipment

Abstract

The application provides a heat dissipation device and network equipment, the heat dissipation device includes multiple cold plates and pipeline assemblies, the multiple cold plates are respectively detachably connected with the pipeline assemblies, and further includes a bearing member and multiple support members; the multiple cold plates are detachably assembled on the bearing member through the multiple support members; the single cold plate fixed with the single support member can be detached by detaching the single support member from the bearing member, so that the maintenance and replacement requirements of the single heat generating electronic device corresponding to the cold plate are met; and the multiple cold plates can be lifted and detached simultaneously by applying force to the bearing member by holding, so that the maintenance and replacement requirements of the multiple heat generating electronic devices are met, the operation is simple and convenient, and the maintenance and replacement difficulty and cost of the heat generating electronic devices are significantly reduced.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and more particularly to a heat dissipation device and network equipment. Background Technology

[0002] To improve the computing and processing performance of servers, servers are usually densely equipped with multiple electronic components, such as graphics processing units (GPUs) and chips (such as switch chips). As the power consumption of the entire server increases, the demand for heat dissipation is also gradually increasing. Liquid cooling has the advantages of high heat dissipation efficiency and obvious heat dissipation effect, and is gradually becoming the development trend of server heat dissipation.

[0003] Currently, heat dissipation in liquid-cooled servers is primarily achieved through cold plate modules. A cold plate module can include multiple cold plates, piping, and a water distributor. Multiple cold plates can be connected in series and parallel with the water distributor via piping, making the entire cold plate module quite large. The cold plate module can be mounted onto the server's motherboard. Multiple cold plates can individually contact and connect to various heat-generating electronic components such as the GPU and chips. Cooling water flows through the water distributor and piping across the cold plates, thereby carrying away the heat generated by the electronic components and achieving the desired cooling effect.

[0004] However, during server maintenance, current cold plate modules have problems such as difficulty in disassembling a single cold plate and inconvenience in disassembling multiple cold plates at the same time, which increases the difficulty and cost of maintenance. Summary of the Invention

[0005] This invention provides a heat dissipation device and network equipment. The heat dissipation device can facilitate the disassembly of a single cold plate or multiple cold plates at the same time. The operation is convenient and quick, which significantly reduces the difficulty and cost of operation and maintenance.

[0006] A first aspect of the present invention provides a heat dissipation device, including a plurality of cold plates and a pipe assembly, wherein the plurality of cold plates are detachably connected to the pipe assembly.

[0007] It also includes a carrier and multiple support components. The carrier is located on one side of multiple cold plates. One end of each of the multiple support components is fixed to one of the multiple cold plates, and the other end of each of the multiple support components is fixed to the side of the carrier facing away from the cold plate. The other end of each support component is detachably connected to the carrier.

[0008] In one possible implementation, the support member includes a main body, a first fixing part, and a second fixing part, with the first fixing part and the second fixing part located at opposite ends of the main body.

[0009] The first fixing part includes a first contact surface, which is attached to the side of the carrier member facing away from the cold plate. The first contact surface is perpendicular to the main body.

[0010] The second fixing part includes a second contact surface, which is attached to the side of the cold plate facing the support member. The second contact surface is perpendicular to the main body.

[0011] In one possible implementation, the support member further includes an operating protrusion, one end of which is fixed to the end of the main body that is connected to the first fixing part, and the other end of which extends in a direction away from the first fixing part.

[0012] In one possible implementation, the first fixing part has a protruding positioning part on the side facing the carrier, and the carrier has a positioning groove, and the positioning part can be inserted and removed into the corresponding positioning groove.

[0013] In one possible implementation, a first branch and a second branch are provided on the end of the main body near the cold plate, with a clearance gap between the first branch and the second branch.

[0014] The first branch and the second branch each have a second fixing part on one end facing away from the main body, and the two second fixing parts are located at opposite ends of the cold plate.

[0015] In one possible implementation, the carrier has multiple operating grooves, which are spaced apart along a first direction, which is consistent with the extension direction of the carrier.

[0016] In one possible implementation, the multiple cold plates are divided into two cold plate groups, each cold plate group including multiple cold plates distributed along a first direction, and the two cold plate groups are distributed side by side in a second direction. The first direction is consistent with the extension direction of the support member, and the second direction is perpendicular to the first direction.

[0017] In one possible implementation, the piping assembly includes two parallel piping groups, with multiple cold plates of the two cold plate groups connected in series through the two piping groups respectively.

[0018] The piping assembly also includes an inlet pipe, an inlet distributor, an outlet pipe, and an outlet distributor. The inlet pipe is connected to the inlet distributor, and the inlet distributor is connected to the inlet of each of the two pipe assemblies.

[0019] The liquid outlet pipeline is connected to the liquid outlet distributor, and the liquid outlet distributor is connected to the liquid outlet of each of the two pipeline groups.

[0020] In one possible implementation, the pipeline assembly further includes a first liquid collection box and a second liquid collection box, with the inlet diverter housed in the first liquid collection box and the outlet diverter housed in the second liquid collection box.

[0021] The inlet distributor and the first liquid collection box, the outlet distributor and the second liquid collection box are respectively fixed on the support member at opposite ends along the first direction.

[0022] In one possible implementation, the cold plate has a protruding first connector on the side facing the carrier, and the first connector is in communication with the cold plate.

[0023] The pipe assembly has a plug-in interface that can be plugged into and detached from the first plug connector. When the plug-in interface is plugged into the first plug connector, the pipe assembly is connected to the cold plate.

[0024] In one possible implementation, the cold plate has a protruding second connector on the side facing the support member, and the second connector is in communication with the cold plate.

[0025] The pipe assembly has a plug interface with a third connector. The pipe assembly can be plugged into and detached from the second connector via the third connector. When the second connector and the third connector are plugged into each other, the pipe assembly is connected to the cold plate.

[0026] A second aspect of the present invention provides a network device comprising at least a circuit board, a plurality of heat-generating electronic devices and any of the above-described heat dissipation devices, wherein the plurality of heat-generating electronic devices are respectively fixed on the circuit board.

[0027] The heat dissipation device has multiple cold plates that are in contact with multiple heat-generating electronic components and can be detachably connected.

[0028] In one possible implementation, multiple heat dissipation devices are provided on the circuit board.

[0029] This invention provides a heat dissipation device and network equipment. The heat dissipation device includes multiple cold plates and pipe assemblies, with the cold plates and pipe assemblies detachably connected. It also includes a carrier and multiple support members. The carrier is located on one side of the multiple cold plates, and one end of each support member is fixed to one of the cold plates. The other end of each support member is detachably mounted to the carrier, allowing the multiple cold plates to be detachably fixed to a single carrier member via the support members. When a single cold plate needs to be removed, the pipe assembly is detached from the cold plate, and the corresponding support member is detached from the carrier. Applying force to the support member removes the single cold plate, enabling convenient removal. When multiple cold plates need to be removed, simply holding the carrier allows all cold plates to be lifted simultaneously, making removal simple and convenient; one person can lift multiple cold plates at the same time. In summary, this heat dissipation device can achieve both portable disassembly of a single cold plate to meet the maintenance and replacement of a single heat-generating component during server operation and maintenance, and convenient disassembly of multiple cold plates at the same time to meet the maintenance and replacement of multiple heat-generating components during server operation and maintenance. The operation is simple, convenient and quick, significantly reducing the difficulty and cost of server operation and maintenance. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram illustrating the assembly of a heat dissipation device with a server circuit board, as provided in an embodiment of this application.

[0032] Figure 2 A schematic diagram showing the disassembled heat dissipation device and server circuit board provided in an embodiment of this application;

[0033] Figure 3 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0034] Figure 4 This is a schematic diagram of the disassembled structure of a heat dissipation device provided in an embodiment of this application;

[0035] Figure 5 This is a schematic diagram of the structure of a cold plate provided in an embodiment of this application;

[0036] Figure 6 This is a partial structural schematic diagram of a pipe assembly provided in an embodiment of this application;

[0037] Figure 7 This is a schematic diagram of another cold plate structure provided in an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of the structure of a support member provided in an embodiment of this application;

[0039] Figure 9 This is a structural schematic diagram of a support member from another perspective, provided in an embodiment of this application.

[0040] Figure 10 This is a schematic diagram of the structure of a carrier provided in an embodiment of this application;

[0041] Figure 11 This is a schematic diagram of the assembly of a support member and a cold plate provided in an embodiment of this application;

[0042] Figure 12 An assembly diagram of a support member and a load-bearing member provided in an embodiment of this application;

[0043] Figure 13 An assembly diagram of a carrier, multiple support members, and a cold plate provided for an embodiment of this application;

[0044] Figure 14 An assembly diagram of a carrier, a diverter, and a liquid collection box provided for an embodiment of this application;

[0045] Figure 15 This application provides an assembly diagram of a cold plate, support member, load-bearing member, and pipeline assembly.

[0046] Figure 16 This is a schematic diagram of the assembly of a heat dissipation device and a circuit board provided in an embodiment of this application;

[0047] Figure 17 A schematic diagram illustrating the disassembly of a cold plate and pipe assembly provided in an embodiment of this application;

[0048] Figure 18 This is a schematic diagram illustrating the disassembly of a support member and a load-bearing member, as provided in an embodiment of this application.

[0049] Explanation of reference numerals in the attached figures:

[0050] 100 - Heat dissipation device;

[0051] 10-Cold plate;

[0052] 10a - First cold plate group; 10b - Second cold plate group;

[0053] 11-First connector; 111-Through port; 13-Second mounting hole; 14-Elastic element; 15-Second connector;

[0054] 20 - Piping assembly;

[0055] 20a - First piping group; 201a - Liquid inlet; 201b - Liquid outlet; 20b - Second piping group;

[0056] 21-Inlet pipe; 22-Inlet distributor; 23-Outlet pipe; 24-Outlet distributor; 25-First collection box; 251-Fifth assembly hole; 26-Second collection box; 27-Insertion interface; 28-Third insertion connector; 29-Fixed fastener; 210-Snap-fit ​​structure;

[0057] 30 - Load-bearing component;

[0058] 30a-Crossbeam section; 30b-Extension section; 31-Positioning groove; 32-Operating groove; 33-First assembly section; 34-Second assembly section; 35-Fourth assembly hole; 36-Sixth assembly hole; 37-Allowance hole;

[0059] 40 - Support member; 41 - Main body; 42 - First fixing part; 42a - First contact surface; 43 - Second fixing part; 43a - Second contact surface; 431 - Third assembly hole; 44 - Operating protrusion; 45 - Positioning part; 46 - First support; 47 - Second support; 48 - Clearance clearance; 49 - Third fixing member;

[0060] 50 - First fastener;

[0061] 60 - Second fastener;

[0062] 70 - Fourth fastener;

[0063] 200 - Circuit board;

[0064] 300 - Heating electronic device; 301 - First mounting hole. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0066] This application provides a heat dissipation device that can be applied to large network devices that provide computing or application services, in order to dissipate heat from the electronic components in such devices, such as servers, workstations, switches, etc.

[0067] Of course, in some other examples, the heat dissipation device can also be applied to terminal devices, such as smartphones, tablets, laptops, desktop computers, smart speakers, smartwatches, etc.

[0068] In this application embodiment, taking the heat dissipation device as an example of a server, the server can be an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud storage, cloud communication, network services, security services, domain name services, and big data and artificial intelligence platforms.

[0069] With the increasing demand for higher computing and processing performance in servers, the power consumption of servers is growing. Servers are densely packed with multiple electronic components, such as GPUs and switch chips, which generate a significant amount of heat during operation, thus increasing the need for server cooling. Common air cooling methods are no longer sufficient to meet these demands, making liquid cooling a growing trend in server heat dissipation.

[0070] Liquid cooling primarily utilizes multi-cold-plate technology. The cold-plate module comprises multiple cold plates, piping, and a water distributor. These cold plates are connected in series and parallel to the water distributor via piping, which can be flexible or rigid. The entire module is quite large. The cold-plate module is fixed to the server's circuit board. Each cold plate can individually contact and be fixed to the heat-generating electronic components on the circuit board. Cooling water flows through the water distributor and piping to the multiple cold plates, exchanging heat with the heat-generating electronic components and carrying away heat to achieve the purpose of heat dissipation. The cold plates may have a thermally conductive material layer, which allows the cold plates to contact the heat-generating electronic components, further accelerating heat exchange.

[0071] In server maintenance, when only a few heat-generating electronic components need to be replaced or repaired, such as GPUs which are frequently replaced and maintained, individual cold plates are difficult to remove from the circuit board. The entire cold plate module needs to be disassembled, especially when the piping is rigid. This makes disassembling or assembling a single cold plate even more difficult, leading to time-consuming and labor-intensive maintenance, increasing costs. Furthermore, disassembling the entire cold plate module necessitates frequent replacement of the thermal conductive material, further increasing maintenance costs. When multiple heat-generating electronic components need to be maintained or replaced simultaneously, the bulky cold plate module makes disassembly inconvenient. It's difficult for one person to safely lift the entire module to remove multiple cold plates from the circuit board simultaneously. Especially when the piping is flexible, the lack of rigid connections between the cold plates inevitably leads to friction between the cold plates and the heat-generating electronic components, causing scratches and damage to chips and the thermal conductive material. Multiple people must operate simultaneously or use customized auxiliary tools to safely lift the cold plate module to disassemble or assemble multiple cold plates at the same time, further increasing maintenance difficulty and costs.

[0072] Based on this, embodiments of this application provide a heat dissipation device that enables convenient disassembly of a single cold plate, thereby facilitating the maintenance and replacement of the heat-generating electronic components corresponding to that single cold plate. This heat dissipation device can also simultaneously enable convenient disassembly of multiple cold plates, allowing one person to easily and safely lift multiple cold plates at the same time, thus enabling the maintenance and replacement of multiple heat-generating electronic components. The operation is simple, convenient, and quick, significantly reducing the difficulty and cost of server maintenance.

[0073] Figure 1This is a schematic diagram illustrating the assembly of a heat dissipation device with a server circuit board, as provided in an embodiment of this application. Figure 2 This is a schematic diagram showing the disassembled heat dissipation device and server circuit board provided in an embodiment of this application.

[0074] See Figure 1 As shown, to dissipate heat from the heat-generating electronic components 300 using a heat dissipation device 100, the heat dissipation device 100 can be installed on the server's circuit board 200. One heat dissipation device 100 can be installed on one circuit board 200, or multiple heat dissipation devices 100 can be installed on one circuit board 200, enabling effective heat dissipation from multiple heat-generating electronic components 300 to improve the heat dissipation rate and effect. The specific number of heat dissipation devices 100 can be selected and set according to the number of heat-generating electronic components 300.

[0075] Combination Figure 2 As shown, multiple heat-generating electronic devices 300 can be fixed on the circuit board 200. For example, the multiple heat-generating electronic devices 300 can be GPUs, switch chips, etc. A heat dissipation device 100 can include multiple cold plates 10, which can contact the multiple heat-generating electronic devices 300 respectively. The cold plate 10 can have a liquid inlet and a liquid outlet, and the cold plate 10 can have a heat sink. Coolant can enter the cold plate through the liquid inlet and flow through the heat sink, carrying away the heat from the heat sink. The coolant that has exchanged heat can flow out from the liquid outlet. Thus, the cold plate 10 can achieve heat exchange with the heat-generating electronic devices 300, carrying away the heat from the heat-generating electronic devices 300, thereby achieving heat dissipation for the heat-generating electronic devices 300.

[0076] For example, circuit board 200 may have 8 GPUs, 4 switch chips, and a total of 12 heat-generating electronic devices 300. Circuit board 200 may be equipped with two heat dissipation devices 100. Each heat dissipation device may have 6 cold plates, 2 of which can be fixed in contact with the 2 switch chips, and the other 4 can be fixed in contact with the GPUs, thus achieving heat dissipation for the heat-generating electronic devices. It is understood that the number of cold plates on the heat dissipation device can be selected and set according to actual needs.

[0077] A thermally conductive material layer can be provided on the side of the cold plate 10 facing the heat-generating electronic device 300, so that the thermally conductive material layer is located between the cold plate 10 and the heat-generating electronic device 300, thereby accelerating the heat exchange and transfer between the cold plate 10 and the heat-generating electronic device 300, and thus accelerating the heat dissipation of the heat-generating electronic device 300.

[0078] The cold plate 10 can be fixed to the corresponding heat-generating electronic device 300, thereby assembling the entire heat dissipation device 100 with the circuit board 200. Specifically, each cold plate 10 can be detachably fixed to the heat-generating electronic device 300, which means that the entire heat dissipation device 100 can be detachably fixed to the circuit board 200 to meet the needs of removing the cold plate 10 to maintain or replace the heat-generating electronic device 300.

[0079] Figure 3 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application.

[0080] See Figure 3 As shown, the heat dissipation device 100 also includes a pipe assembly 20, and multiple cold plates 10 can be connected to the pipe assembly 20 respectively. The multiple cold plates 10 can be connected in series and / or in parallel through the pipe assembly 20. The pipe assembly 20 can provide a flow path for the coolant, allowing the coolant to flow through the pipe assembly 20 and through the cold plates 10, thereby enabling the coolant to exchange heat with the heat-generating electronic devices within the cold plates 10.

[0081] The coolant can be cooling water, or it can be any other liquid that can achieve heat exchange.

[0082] The cold plate 10 and the pipe assembly 20 can be connected in a detachable manner. That is to say, the cold plate 10 can be connected to the pipe assembly 20, and the cold plate 10 can also be easily disassembled from the pipe assembly 20.

[0083] The heat dissipation device 100 may further include a support member 30. In this embodiment, the length extension direction of the support member 30 is taken as the first direction, such as... Figure 3 The x-direction in the figure, with the width direction of the bearing 30 as the second direction, such as... Figure 3 In the y-direction, the second direction is perpendicular to the first direction, and the third direction is perpendicular to both the first and second directions, such as... Figure 3 The z-direction in the equation.

[0084] Multiple cold plates 10 can be arranged longitudinally and transversely along a first direction and a second direction, and the carrier 30 can be located on one side of the multiple cold plates 10 along a third direction. Of course, in some other examples, the multiple cold plates 10 can also be arranged only along the first direction or only along the second direction.

[0085] The heat dissipation device 100 may further include multiple support members 40, one end of which is fixed to multiple cold plates 10. Specifically, one end of the support member 40 can be fixed to the side of the cold plate 10 facing away from the heat-generating device. The other end of the multiple support members 40 is respectively hung and fixed to the side of the carrier 30 facing away from the cold plate 10, and the other end of the support member 40 can be detachably connected to the carrier 30. This allows the multiple cold plates 10 to be detachably fixed to a carrier 30 via the multiple support members 40, achieving a rigid connection between the multiple cold plates 10 and the carrier 30, and providing good support. The cold plate 10 can be fixed to the carrier 30 via the support member 40, and the cold plate 10 can also be detached from the carrier 30 via the support member 40. The other end of the support member 40 is hung on the side of the carrier 30 facing away from the cold plate 10, ensuring that the support member 40 can be easily removed from the carrier 30.

[0086] When it is necessary to disassemble a single cold plate 10, the single cold plate 10 is disassembled from the pipe assembly 20, and the support 40 and bearing 30 connected to the single cold plate 10 are disassembled. This allows the single cold plate 10 (including the support 40) to be disassembled, making it easy to disassemble the single cold plate 10. This enables the maintenance and replacement of the heat-generating electronic components corresponding to the cold plate 10. The operation is simple, convenient and quick, reducing the difficulty and cost of maintenance of individual heat-generating electronic components.

[0087] When multiple cold plates 10 need to be disassembled at the same time, since the multiple cold plates 10 are fixed on a carrier 30 by the support member 40, the multiple cold plates 10 of the heat dissipation device 100 can be lifted at the same time by holding the carrier 30. The carrier 30 has a good rigid bearing function, and one person can lift multiple cold plates 10 at the same time through the carrier 30 to realize the maintenance and replacement of multiple heat-generating electronic devices corresponding to multiple cold plates 10. The operation is simple, convenient and quick, and can also reduce or avoid damage to heat-generating electronic devices and thermal conductive material layers. At the same time, it realizes the convenient and safe disassembly of multiple cold plates, reducing the maintenance difficulty and cost of multiple heat-generating electronic devices.

[0088] In summary, by enabling multiple cold plates 10 to be detachably fixed to a single carrier 30 via multiple support members 40, it is possible to easily disassemble a single cold plate 10 to meet the maintenance and replacement needs of a single heat-generating device during server maintenance. It is also possible to simultaneously enable the easy disassembly of multiple cold plates 10 to meet the maintenance and replacement needs of multiple heat-generating devices during server maintenance, significantly reducing the difficulty and cost of server maintenance.

[0089] Figure 4 This is a schematic diagram showing the disassembled structure of a heat dissipation device provided in an embodiment of this application.

[0090] Combination Figure 3 and Figure 4 As shown in the embodiment of this application, the distribution of multiple cold plates 10 along a first direction and a second direction can be used as an example for explanation. For instance, the multiple cold plates 10 can be divided into two cold plate groups, such as a first cold plate group 10a and a second cold plate group 10b. Each cold plate group can include multiple cold plates 10 distributed along the first direction, and the first cold plate group 10a and the second cold plate group 10b are distributed side-by-side in the second direction. Increasing the number of cold plates 10 fixed on a support member 30 increases the number of cold plates 10 in the heat dissipation device 100, thereby reducing the number of heat dissipation devices 100 provided on the circuit board and helping to reduce costs.

[0091] It is understandable that each cold plate 10 is fixed to the carrier 30 by a support member 40, and the carrier 30 will also have two sets of support members arranged side by side along the second direction, each set including multiple support members 40 distributed along the first direction.

[0092] It should be noted that the heat dissipation device may include one carrier 30, and multiple cold plates 10 may be mounted on each carrier 30 via support members 40. Alternatively, in some examples, the heat dissipation device may include multiple carriers 30, and multiple cold plates 10 may be mounted on each carrier 30.

[0093] Two cold plate assemblies can be connected in series, or, in some examples, they can be connected in parallel.

[0094] For example, the pipe assembly 20 may include two parallel pipe groups, and multiple cold plates 10 in the cold plate group are connected in series through the pipe groups, combined with Figure 3 and Figure 4 As shown, the two piping groups are the first piping group 20a and the second piping group 20b, respectively. Multiple cold plates 10 of the first cold plate group 10a are connected in series through the first piping group 20a, and multiple cold plates 10 of the second cold plate group 10b are connected in series through the second piping group 20b. This means the two cold plate groups are connected in parallel through two piping groups. Compared to connecting the two cold plate groups in series, this improves the temperature uniformity of the coolant in the cold plates 10 of both cold plate groups, ensuring that the coolant in the cold plates 10 of both cold plate groups has a better cooling effect, thereby improving the heat dissipation effect.

[0095] A pipeline group may include multiple pipelines connected in series, for example, see Figure 4As shown, taking the first pipe group 20a as an example, it may include pipes 201, 202, 203, and 204 connected in series. Multiple cold plates 10 in a cold plate group can be connected through these multiple pipes. One pipe (e.g., pipe 204) may have an inlet 201a, and another pipe (e.g., pipe 201) may have an outlet 201b. Coolant can enter the first pipe group 20a through the inlet 201a, flow through the multiple cold plates 10 of the first cold plate group 10a, and then exit through the outlet 201b. Correspondingly, the second pipe may also have an inlet 201c and an outlet 201d.

[0096] Continue to combine Figure 3 and Figure 4 As shown, to achieve parallel connection of the pipe groups, the pipe assembly 20 may further include an inlet pipe 21, an inlet distributor 22, an outlet pipe 23, and an outlet distributor 24. The inlet pipe 21 is connected to the inlet distributor 22, which is connected to the inlets of two pipe groups, such as the inlet 201a of the first pipe group 20a and the inlet 201c of the second pipe group 20b. The inlet distributor 22 can divide the coolant from the inlet pipe 21 into multiple streams, flowing to the two pipe groups and then to the multiple cold plates 10 connected in series by the two pipe groups.

[0097] The outlet pipe 23 is connected to the outlet distributor 24, which is connected to the outlets of two pipe groups, such as the outlet 201b of the first pipe group 20a and the outlet 201d of the second pipe group 20b. The outlet distributor 24 can combine the coolant that has undergone heat exchange through the cold plates 10 of the two pipe groups into a single stream that flows out of the outlet pipe 23, facilitating the inlet and outlet of the two pipe groups and enabling parallel connection of the two pipe groups.

[0098] It is understood that, in the embodiments of this application, the pipes in the pipe assembly 20 can be flexible hoses to facilitate the disassembly of a single cold plate 10.

[0099] Continue to combine Figure 3 and Figure 4 As shown, the pipe assembly 20 may also include a first liquid collection box 25 and a second liquid collection box 26. The liquid inlet diverter 22 can be housed in the first liquid collection box 25. The first liquid collection box 25 can collect liquid to protect the circuit board. If the liquid inlet diverter 22 has problems such as liquid leakage, the liquid collection box can collect the leaked liquid to prevent the liquid from dripping onto the circuit board.

[0100] The liquid diverter 24 can be housed in the second liquid collection box 26. Correspondingly, the second liquid collection box 26 can also collect liquid and protect the circuit board.

[0101] The first liquid collection box 25 and the liquid inlet distributor 22, the second liquid collection box 26 and the liquid outlet distributor 24 can be fixed on the support member 30 at opposite ends along the first direction, which can improve the integration of the entire heat dissipation device 100, reduce the difficulty of layout design, and make the layout of the pipe assembly 20 more regular and neat.

[0102] The following descriptions, in conjunction with the accompanying drawings, illustrate the structure of the cold plate and the detachable connection methods between the cold plate and the heat-generating electronic devices and pipe assemblies.

[0103] Figure 5 This is a schematic diagram of the structure of a cold plate provided in an embodiment of this application.

[0104] In one example, the cold plate and the heat-generating electronic device can be detachably connected via a threaded connection; for example, see [link to example]. Figure 5 As shown, a first fixing member 50 may be provided on the cold plate 10. One end of the first fixing member 50 may be fixed on the cold plate 10, and the other end of the first fixing member 50 may have external threads.

[0105] The heating electronic device 300 may have a first mounting hole 301 (see reference). Figure 2 As shown), the inner wall of the first mounting hole 301 may have an internal thread that mates with the external thread. One end of the first fixing member 50 may be fixed to the cold plate 10, and the other end of the first fixing member 50 may pass through the cold plate 10 and be threaded into the first mounting hole 301, thereby realizing a detachable connection between the cold plate 10 and the heating electronic device 300.

[0106] See also Figure 5 As shown, an elastic element 14 can also be provided on the cold plate 10. The first fixing element 50 can be sleeved in the elastic element 14. The elastic element 14 can be fixed between one end of the first fixing element 50 and the cold plate 10. The elastic element 14 can realize the floating connection between the first fixing element 50 and the heating electronic device, thus realizing the floating connection between the cold plate 10 and the heating electronic device. Under the condition of ensuring full contact between the cold plate 10 and the heating electronic device, it can also prevent the cold plate 10 from damaging or wearing the heating electronic device or the heat-conducting material layer.

[0107] The number of first fasteners 50 can be multiple, and each first fastener 50 is fitted with an elastic element 14. Multiple first fasteners 50 can be respectively arranged around the circumference of the cold plate 10. For example... Figure 5 The shape of the intermediate cold plate 10 can be roughly square, and there can be four first fasteners 50, which can be located at the four corners of the cold plate 10 along the circumference.

[0108] Of course, in some other examples, the cold plate 10 and the heat-generating electronic device can also be connected by detachable means such as snap-fit ​​or riveting.

[0109] See also Figure 5 As shown, the cold plate 10 also has a first connector 11. Specifically, the first connector 11 can be formed by protruding on the side of the cold plate 10 facing the support member 30 (see reference). Figure 4 As shown), the first connector 11 may have a through port 111, and the first connector 11 and the through port 111 are connected to the cold plate 10.

[0110] It is understandable that there can be two first connectors 11 on the cold plate 10, which means there are two ports 111, one of which can be used as the liquid inlet of the cold plate 10 and the other of which can be used as the liquid outlet of the cold plate 10.

[0111] Figure 6 This is a partial structural schematic diagram of a pipe assembly provided in an embodiment of this application.

[0112] See Figure 6 As shown, the pipe assembly 20 may have a connector 27, and the first connector 11 is used to engage with the connector 27 of the pipe assembly 20. If the port of the pipe can form a connector, the pipe can be engaged with the first connector 11 on the cold plate 10 through the connector, thereby connecting the pipe assembly to the cold plate 10.

[0113] Taking pipe 202 as an example, one end of pipe 202 is a plug-in interface 27. The plug-in interface 27 can be inserted into and removed from the first plug-in connector 11, allowing pipe assembly 20 to be inserted into the first plug-in connector 11, thus connecting pipe assembly 20 to the cold plate 10. Pipe assembly 20 can also be removed from the first plug-in connector 11 via the plug-in interface 27, achieving disassembly of pipe assembly 20 from the cold plate 10, thus realizing a detachable connection between pipe assembly 20 and cold plate 10. The plug-in / plug-in method is convenient to operate, enabling quick disassembly and assembly, facilitating structural design, and reducing costs.

[0114] The first connector can be a pagoda-shaped connector, which has a lower cost.

[0115] To reduce or avoid coolant leakage after the first connector 11 and the connector 27 are connected, please refer to [link to relevant documentation]. Figure 6 As shown, the pipe assembly may also include a clamp 29, which can be positioned on the plug 27 and press the plug 27 and the first plug 11 together when the plug 27 is plugged into the first plug 11, thereby reducing or preventing leakage.

[0116] For example, the fastener 29 can be a clamp located at the insertion port 27 and can be wrapped around the circumference of the pipe 202. When the insertion port 27 is inserted into the connector 11, the fastener 29 can clamp and squeeze the insertion port 27 and the connector 11 in the circumferential direction, thus pressing the insertion port 27 and the connector 11 together.

[0117] Figure 7 This is a schematic diagram of another cold plate structure provided in an embodiment of this application.

[0118] For easier insertion and removal of pipe components and cold plates, please refer to [link / reference]. Figure 7 As shown, the side of the cold plate facing the support member may have a protruding second connector 15, which is also connected to the cold plate 10. A third connector 28 may be provided on the pipe interface, in conjunction with... Figure 6 As shown, for example, taking pipe 202 as an example, the other end of pipe 202 can be a plug-in interface (not shown in the figure). The plug-in interface is provided with a third plug-in connector 28 that communicates with pipe 202. The second plug-in connector 15 is used to insert and remove the third plug-in connector 28 of the pipe assembly. The third plug-in connector 28 can be inserted into the second plug-in connector 15, thereby realizing the communication between the pipe assembly and the cold plate 10. The third plug-in connector 28 can also be disassembled from the second plug-in connector 15 to realize the disassembly of the cold plate.

[0119] The insertion and connection between the cold plate 10 and the pipe assembly 4 is achieved through the third connector 28 and the second connector 15, which can improve the rigidity of the pipe assembly interface, facilitate the quick insertion and connection between the pipe assembly and the cold plate 10, and make the operation convenient and improve the efficiency of disassembly and assembly.

[0120] See also Figure 6 As shown, the third connector 28 may be provided with a snap-fit ​​structure 210. When the third connector 28 is plugged into the second connector 15, the snap-fit ​​structure 210 can engage with the second connector 15 to lock the third connector 28 and the second connector 15, ensuring a secure connection. When it is necessary to disassemble the third connector 28 and the second connector 15, the snap-fit ​​structure 210 can be pressed. If the snap-fit ​​structure 210 is released from engagement with the second connector 15, the second connector 15 and the third connector 28 can be quickly separated, making the operation convenient.

[0121] The second connector 15 can be a quick-connect male connector, and the third connector 28 can be a quick-connect female connector. The second connector 15 can be inserted into the third connector 28.

[0122] In one example, the second connector 15 can be a quick-connect male connector with a self-locking structure, and the third connector 28 can be a quick-connect female connector with a self-locking structure. When the second connector 15 and the third connector 28 are separated, the self-locking structure of the second connector 15 can lock the second connector 15 closed, preventing the coolant in the cold plate 10 from leaking out through the second connector 15. The self-locking structure of the third connector 28 can lock the third connector 28 closed, preventing the coolant in the pipe assembly 20 from leaking out through the third connector 28, thereby reducing or avoiding liquid leakage after the pipe assembly 20 is disassembled from the cold plate 10.

[0123] It is understandable that among the multiple cold plates 10, some cold plates 10 may have a first connector 11 and some cold plates 10 may have a second connector 15. For example, cold plates 10 connected to heat-generating electronic devices such as switch chips that do not require frequent maintenance or replacement (see reference). Figure 5 As shown), a first connector 11 can be provided on it. For example, a cold plate 10 (see reference) is connected to heat-generating electronic components such as GPUs that require frequent repair and replacement. Figure 7 As shown), a second connector 15 can be provided on it.

[0124] The following describes the structure of the support component and the detachable connection method between the support component and the cold plate and load-bearing component.

[0125] The support components and the cold plate can be detachably connected by threaded connection.

[0126] See also Figure 7 As shown, a second mounting hole 13 can be provided on the cold plate 10. The inner wall of the second mounting hole 13 can have internal threads. The second mounting hole 13 can be provided on the side of the cold plate 10 facing the support member 30 (see reference). Figure 4 (As shown).

[0127] Figure 8 This is a structural schematic diagram of a support member provided in an embodiment of this application.

[0128] See Figure 8 As shown, a third mounting hole 431 may be provided on the support member 40, such as on the second fixing part 43 of the support member 40. The heat dissipation device may also include a second fixing member 60 (see reference). Figure 4 As shown), one end of the second fixing member 60 can be fixed to the support member 40, such as one end of the second fixing member 60 can be fixed to the side of the second fixing part 43 facing the bearing member 30.

[0129] The other end of the second fastener 60 may have an external thread, and the other end of the second fastener 60 may pass through the third mounting hole 431 and be threaded into the second mounting hole 13 on the cold plate 10, thereby realizing a detachable connection between the support member 40 and the cold plate 10.

[0130] Of course, in some other examples, the support member 40 and the cold plate 10 can also be detachably connected by means of snap-fit ​​connection, riveting, etc. Alternatively, in some examples, the support member 40 and the cold plate 10 can also be fixed together by means of non-detachable means such as welding or bonding.

[0131] To facilitate the fixed fit between the support member 40 and the cold plate 10 and the load-bearing member 30, please refer to [reference needed]. Figure 8 As shown, the support member 40 may include a main body 41, a first fixing part 42 and a second fixing part 43, wherein the first fixing part 42 and the second fixing part 43 are located at both ends of the main body 41 and are fixedly connected to the main body 41 respectively.

[0132] The support member 40 can be an integral structural component, that is, the main body 41, the first fixing part 42, and the second fixing part 43 are integrally formed during the molding of the support member 40. Alternatively, the support member 40 can also be an assembly formed by molding the main body 41, the first fixing part 42, and the second fixing part 43 separately and then fixing them together.

[0133] The main body 41 plays a major supporting role. The first fixing part 42 can be detachably fixed to the bearing member 30. The second fixing part 43 can be assembled and fixed to the cold plate 10. The third mounting hole 431 can be opened on the second fixing part 43.

[0134] Specifically, the first fixing part 42 may include a first contact surface 42a. The first fixing part 42 is attached and fixed to the side of the support member 30 facing away from the cold plate 10 through the first contact surface 42a. The first contact surface 42a may be perpendicular to the main body part 41, which facilitates the support member 40 to be fixed to the support member 30 through the first fixing part 42. It can also achieve planar contact between the first fixing part 42 and the support member 30, improve the bonding firmness between the support member 30 and the support member 40, and thus improve the assembly stability of the cold plate 10.

[0135] The second fixing part 43 may include a second contact surface 43a. The second fixing part 43 can be fixed to the side of the cold plate 10 facing the support member 30 by the second contact surface 43a. The second contact surface 43a can be perpendicular to the main body part 41, so that the entire support member 40 can be fixed to the cold plate 10 by the second fixing part 43. It can also achieve planar contact between the second fixing part 43 and the cold plate 10, improve the bonding firmness between the two, and further improve the assembly stability of the cold plate 10.

[0136] In this way, the main body 41 can be parallel to a third direction, the first contact surface 42a can be parallel to the first direction, and the second contact surface 43a can also be parallel to the first direction, which is more conducive to fixing the first fixing part 42 and the second fixing part 43 to the carrier 30 and the cold plate 10 respectively, and also helps to improve the layout regularity and neatness of the entire heat dissipation device 100.

[0137] Figure 9 This is a structural schematic diagram of a support member provided in an embodiment of this application from another perspective.

[0138] Combination Figure 9 As shown, a first branch 46 and a second branch 47 may be provided on the end of the main body 41 near the cold plate 10, and a clearance gap 48 may be provided between the first branch 46 and the second branch 47. A second fixing part 43 may be provided on the end of the first branch 46 and the second branch 47 facing away from the main body 41, so that the two second fixing parts 43 are located on both sides of the end of the main body 41 facing the cold plate 10.

[0139] The two second fixing parts 43 can be fixed to the opposite ends of the cold plate 10 respectively (see reference). Figure 3 As shown, the clearance 48 can avoid other structures of the cold plate 10, which helps to improve the stability of the entire cold plate 10 and reduce or avoid damage caused by uneven compression of the cold plate 10 on the heat-generating electronic device 300 and the heat-conducting material layer.

[0140] To enhance the connection between the second fixing part 43 and the main body part 41, the support member 40 may also include a reinforcing rib 410. The second fixing part 43 is connected to the first branch 46 and the second branch 47 respectively through the reinforcing rib 410, ensuring the strength of the second fixing part 43 and thereby improving the reliability of the cold plate 10.

[0141] See also Figure 9 As shown, the support member 40 may also include an operating protrusion 44. One end of the operating protrusion 44 is fixed to the end of the main body 41 connected to the first fixing part 42, and the other end of the operating protrusion 44 extends in a direction away from the first fixing part 42, so that the entire operating protrusion 44 protrudes outside the main body 41 and the first fixing part 42. The user can easily and conveniently operate the support member 40 and the cold plate 10 connected to the support member 40 through the operating protrusion 44, thereby facilitating the disassembly and assembly of a single cold plate 10.

[0142] The support member 40 and the load-bearing member 30 can also be detachably connected by threaded connection.

[0143] See also Figure 9As shown, a third fixing member 49 can be provided on the support member 40. One end of the third fixing member 49 can be fixed on the side of the first fixing part 42 facing away from the cold plate 10, and the other end of the third fixing member 49 can be provided with an external thread.

[0144] Figure 10 This is a structural schematic diagram of a carrier provided in an embodiment of this application.

[0145] See Figure 10 As shown, a fourth mounting hole 35 can be provided on the support member 30. For example, the fourth mounting hole 35 is provided on the side of the support member 30 facing away from the cold plate 10, and an internal thread can be provided on the inner wall of the fourth mounting hole 35. The other end of the third fixing member 49 can pass through the first fixing part 42 and be threaded into the fourth mounting hole 35 on the support member 30, thereby realizing the detachable connection between the support member 40 and the support member 30. Disassembly is convenient and quick, and easy to implement.

[0146] To reduce or prevent the loss of the third fastener 49 after disassembly, an mounting component can be fixed on the support 40. The third fastener 49 can be located inside the mounting component and can rotate within it. For example, the mounting component and the third fastener 49 can form a non-detachable screw. The mounting component can fix the third fastener 49 and prevent it from being lost after being disassembled from the bearing 30.

[0147] To facilitate the assembly of the support member 40 and the load-bearing member 30, a positioning part 45 (see reference) can be provided on the first fixing part 42 of the support member 40. Figure 9 As shown), the positioning part 45 can be protruding on the side of the first fixing part 42 facing the carrier 30.

[0148] Combination Figure 10 As shown, a positioning groove 31 can be provided on the support member 30, and the positioning part 45 can be inserted and removed into the positioning groove 31. The cooperation between the positioning part 45 and the positioning groove 31 can play a positioning and limiting role for the support member 40. On the one hand, it can quickly and accurately realize the positioning and assembly of the support member 40 and the support member 30. On the other hand, it can also limit the displacement of the support member 40 on the support member 30, reduce or avoid damage to the heat-generating electronic devices and the heat-conducting material layer caused by repeated positioning or torsional displacement of the support member 40.

[0149] See also Figure 10 As shown, the support member 30 is also provided with a plurality of operating grooves 32. The plurality of operating grooves 32 can be distributed at intervals along the first direction. The user can apply force to the entire support member 30 through the operating grooves 32, which makes it easy to lift the support member 30 and enable one person to lift multiple cold plates through the support member 30.

[0150] It is understandable that the carrier 30 is located on one side of the plurality of cold plates along a third direction, and above the plurality of cold plates. The carrier 30 may obstruct the cold plates and the first fastener thereon. See also Figure 10 As shown, a clearance hole 37 can be formed on the carrier 30 to expose the first fastener. Auxiliary tools such as screwdrivers used to tighten the first fastener can pass through the clearance hole 37 to act on the first fastener and disassemble the cold plate.

[0151] For example, the support member 30 may include a crossbeam portion 30a and an extension portion 30b. The crossbeam portion 30a may be perpendicular to the extension portion 30b. The support member 40 is hung and fixed on the crossbeam portion 30a. The positioning groove 31, the fifth assembly hole 251, etc., may all be provided on the crossbeam portion 30a. The operating groove 32 may be provided on the extension portion 30b, making it easier for the user to hold the operating groove 32 and apply force to the support member 30. Moreover, it can ensure the strength of the crossbeam portion 30a and ensure the assembly stability of the multiple cold plates 10.

[0152] See Figure 10 As shown, the carrier 30 may also include a first assembly part 33 and a second assembly part 34. The first assembly part 33 and the second assembly part 34 may be located on the crossbeam part 30a. The first assembly part 33 and the second assembly part 34 may be located at both ends of the carrier 30 along the first direction. The inlet water distributor and the first liquid collection box 25 may be fixed on the first assembly part 33, and the outlet water distributor and the second liquid collection box 26 may be fixed on the second assembly part 34.

[0153] For example, the inlet distributor can be housed and fixed within the first liquid collection box 25, which can be fixed to the first mounting part 33 by means of threaded engagement. For example, the heat dissipation device may also include a fourth fixing member 70, and a fifth mounting hole 251 may be provided on the first liquid collection box 25 (see reference). Figure 4 As shown, a sixth assembly hole 36 can be provided on the first assembly part 33. One end of the fourth fixing member 70 can be fixed on the first liquid collection box 25, and the other end of the fourth fixing member 70 can pass through the fifth assembly hole 251 and be threadedly engaged with the sixth assembly hole 36, thereby fixing the first liquid collection box 25 and the water inlet distributor on the first assembly part 33 of the carrier member 30.

[0154] The assembly method of the outlet distributor and the second liquid collection box on the second assembly part 34 can refer to the assembly method of the first liquid collection box and the inlet distributor on the first assembly part 33.

[0155] The following description, in conjunction with the accompanying drawings, illustrates the overall assembly of the heat dissipation device and the assembly of the heat dissipation device with the circuit board.

[0156] Figure 11 This is a schematic diagram of the assembly of a support member and a cold plate provided in an embodiment of this application.

[0157] See Figure 11 As shown, the second fixing part 43 of the support member 40 can be fixed to the cold plate 10 first by the second fixing member 60. Specifically, one end of the second fixing member 60 is fixed to the side of the second fixing part 43 facing away from the cold plate 10, and the other end of the second fixing member 60 passes through the third mounting hole 431 on the second fixing part 43 and cooperates with the second mounting hole 13 on the cold plate 10 to realize the connection and fixation between the second fixing part 43 of the support member 40 and both ends of the cold plate 10.

[0158] Figure 12 This is an assembly diagram of a support member and a load-bearing member provided in an embodiment of this application.

[0159] See Figure 12 As shown, the support member 40 is then fixed to the carrier member 30. The first fixing part 42 of the support member 40 is placed on the side of the carrier member 30 facing away from the cold plate 10, and the positioning part on the first fixing part 42 is inserted into the positioning groove on the carrier member 30. Then, the first fixing part 42 of the support member 40 and the carrier member 30 can be fixed by the third fixing part 49. Specifically, one end of the third fixing part 49 is fixed to the side of the first fixing part 42 facing away from the cold plate 10, and the other end of the third fixing part 49 passes through the first fixing part 42 and engages with the fifth assembly hole on the carrier member 30, thereby fixing the support member 40 and the carrier member 30, that is, fixing the cold plate 10 and the carrier member 30.

[0160] Figure 13 This is a schematic diagram of the assembly of a carrier, multiple support members, and a cold plate provided in an embodiment of this application.

[0161] See Figure 13 As shown, the above assembly method is repeated to fix the remaining multiple support members 40 to multiple cold plates 10 respectively, and the multiple support members 40 are fixed on the carrier 30 respectively, so that the multiple cold plates 10 are respectively hung and fixed on a carrier 30 through multiple support members 40.

[0162] Figure 14 This is a schematic diagram of the assembly of a carrier, a diverter, and a liquid collection box provided in an embodiment of this application.

[0163] See Figure 14 As shown, the liquid inlet diverter 22 can be fixed to the first liquid collection box 25, and the liquid inlet diverter 22 and the first liquid collection box 25 can be fixed together on the first assembly part 33 of the carrier 30 by the fourth fixing member 70.

[0164] The liquid outlet diverter 24 is fixed to the second liquid collection box 26, and the liquid outlet diverter 24 and the second liquid collection box 26 are fixed together on the second assembly part 34 of the carrier 30.

[0165] Figure 15 This is an assembly diagram of a cold plate, support member, load-bearing member and pipeline assembly provided in an embodiment of this application.

[0166] See Figure 15 As shown, pipe assemblies 20a and 20b are connected to the cold plate 10 (first connector and / or second connector), the liquid inlet distributor 22, and the liquid outlet distributor 24, respectively. The liquid outlet pipe 23 is connected to the liquid outlet distributor 24, and the liquid inlet pipe 21 is connected to the liquid inlet distributor 22. This completes the assembly of the entire heat dissipation device.

[0167] Figure 16 This is a schematic diagram of the assembly of a heat dissipation device and a circuit board provided in an embodiment of this application.

[0168] See Figure 16 As shown, by holding the carrier 30, the entire heat dissipation device 100 can be placed on the circuit board 200. Multiple cold plates 10 can be respectively connected to the heat-generating electronic device 300 through the first fixing member 50, thus completing the assembly of the heat dissipation device 100 and the circuit board 200.

[0169] Conversely, when it is necessary to disassemble multiple cold plates 10, multiple first fixing parts 50 can be twisted to separate the other end of the first fixing part 50 from the first mounting hole 301 of the heat-generating electronic device 300, thereby separating the multiple cold plates 10 and the heat-generating electronic device 300. By holding the carrier 30, the multiple cold plates 10 and the entire heat dissipation device 100 can be lifted, thereby exposing the multiple heat-generating electronic devices 300 and enabling the maintenance and replacement of the multiple heat-generating electronic devices 300.

[0170] The following description, in conjunction with the accompanying drawings, illustrates the disassembly and assembly of a single cold plate.

[0171] Figure 17 This is a schematic diagram illustrating the disassembly of a cold plate and pipe assembly, provided as an embodiment of this application.

[0172] When it is necessary to disassemble a single cold plate 10 to maintain or replace the single heat-generating electronic device 300 corresponding to that cold plate 10, see [reference needed]. Figure 17 As shown, the pipe assembly connected to the cold plate 10 is disassembled and separated. For example, pipes 202 and 203 are disassembled and separated from the cold plate 10 respectively, and pipes 202 and 203 can be thrown to the outside of the entire heat dissipation device 100.

[0173] Figure 18 This is a schematic diagram illustrating the disassembly of a support member and a load-bearing member, as provided in an embodiment of this application.

[0174] The third fixing member 49 can be unscrewed to separate the other end of the third fixing member 49 from the fifth mounting hole on the carrier member 30. The first fixing member can be unscrewed to separate the other end of the first fixing member from the first mounting hole on the heating electronic device 300. By holding the operating protrusion, the support member 40 and the single cold plate 10 can be removed together, exposing the heating electronic device 300 for maintenance and replacement.

[0175] Conversely, when assembling a single cold plate 10, the support 40 and the carrier 30 can be fixed by the third fastener 49, the cold plate 10 can be fixed by the first fastener, and the pipes of the pipe assembly can be connected to the cold plate 10, thus realizing the assembly of a single cold plate 10 and the support 40.

[0176] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0177] In the description of this invention, it should be understood that the terms “comprising” and “having” as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0178] Unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0179] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: Multiple cold plates and pipe assemblies, wherein the multiple cold plates are detachably connected to the pipe assemblies; It also includes a carrier and multiple support members. The carrier is located on one side of the multiple cold plates. One end of each of the multiple support members is fixed to the multiple cold plates, and the other end of each of the multiple support members is fixed to the side of the carrier facing away from the cold plate. The other end of each support member is detachably connected to the carrier. The support member includes a main body, a first fixing part, and a second fixing part, wherein the first fixing part and the second fixing part are respectively located at both ends of the main body; The first fixing part includes a first contact surface, and the first fixing part is fixed to the side of the carrier facing away from the cold plate through the first contact surface. The first contact surface is perpendicular to the main body. The length extension direction of the bearing member is a first direction, the width direction of the bearing member is a second direction, the second direction is perpendicular to the first direction, and the third direction is a direction that is perpendicular to both the first and second directions; the main body is parallel to the third direction, the first contact surface is parallel to the first direction, and the second fixing part includes a second contact surface, which is parallel to the first direction. The second fixing part is fixed to the side of the cold plate facing the carrier through the second contact surface, and the second contact surface is perpendicular to the main body part; The support also includes an operating protrusion, one end of which is fixed to the end of the main body that is connected to the first fixing part, and the other end of which extends in a direction away from the first fixing part. The first fixing part has a protruding positioning part on the side facing the carrier, and the carrier has a positioning groove, and the positioning part can be inserted and removed into the corresponding positioning groove; The main body is provided with a first branch and a second branch at one end near the cold plate, and there is a clearance between the first branch and the second branch; The first branch and the second branch are respectively connected to the second fixing part at one end away from the main body, and the two second fixing parts are respectively fixed to the two ends opposite to the cold plate.

2. The heat dissipation device according to claim 1, characterized in that, The support member has multiple operating grooves, which are spaced apart along a first direction, which is consistent with the extension direction of the support member.

3. The heat dissipation device according to claim 1, characterized in that, The plurality of cold plates are divided into two cold plate groups, each cold plate group including a plurality of cold plates distributed along a first direction, the two cold plate groups being arranged side by side in a second direction, the first direction being consistent with the extension direction of the support member, and the second direction being perpendicular to the first direction.

4. The heat dissipation device according to claim 3, characterized in that, The piping assembly includes two parallel pipe groups, and multiple cold plates of the two cold plate groups are connected in series through the two pipe groups respectively; The pipeline assembly further includes an inlet pipeline, an inlet distributor, an outlet pipeline, and an outlet distributor. The inlet pipeline is connected to the inlet distributor, and the inlet distributor is connected to the inlet ports of the two pipeline assemblies respectively. The liquid outlet pipeline is connected to the liquid outlet distributor, and the liquid outlet distributor is connected to the liquid outlet of each of the two pipeline groups.

5. The heat dissipation device according to claim 1, characterized in that, The cold plate has a protruding first connector on the side facing the support member, and the first connector is in communication with the cold plate. The pipe assembly has a plug interface that is pluggable to the first plug connector. When the plug interface is plugged into the first plug connector, the pipe assembly is connected to the cold plate. And / or, the cold plate has a protruding second connector on the side facing the carrier, the second connector being in communication with the cold plate; The pipe assembly has a plug interface, and a third plug is provided on the plug interface. The pipe assembly can be plugged and detached with the second plug through the third plug. When the second plug is plugged into the third plug, the pipe assembly is connected to the cold plate.

6. A network device, characterized in that, It includes at least a circuit board, a plurality of heat-generating electronic devices, and a heat dissipation device as described in any one of claims 1-5, wherein the plurality of heat-generating electronic devices are respectively fixed on the circuit board; The multiple cold plates of the heat dissipation device are in contact with the multiple heat-generating electronic devices and are detachably connected.

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