Composite mold, metal product, and method of manufacturing the product

Abstract

The present application provides a metal product with high reliability and a manufacturing method thereof by using a mold of an anodized film material and a mold capable of patterning in combination.

Description

Technical Field

[0001] This invention relates to a composite mold, a metal product, and a method for manufacturing the product. Background Technology

[0002] The present invention relates to a method for manufacturing a portion of a metal product having a size range of tens of micrometers by using an anodized film mold and a patternable mold in combination, and the metal product manufactured according to the method.

[0003] The following is an example of a conductive contact pin, used as an example of the aforementioned metal product. Electrical characteristic testing of semiconductor components is performed by approaching the test object (semiconductor wafer or semiconductor package) in a testing device with multiple conductive contact pins and bringing the conductive contact pins into contact with corresponding electrode pads (or solder balls or bumps) on the test object. Once the conductive contact pins reach the point of initial contact with the electrode pads on the test object, a further approach to the test object is performed. This process is called overdrive. Overdrive is a process that elastically deforms the conductive contact pins. By performing overdrive, even if there are deviations in the height of the electrode pads or the height of the conductive contact pins, all conductive contact pins can reliably contact the electrode pads. Furthermore, during overdrive, the conductive contact pins elastically deform and their tips move on the electrode pads, thereby scrubbing. This scrubbing removes the oxide film on the surface of the electrode pads and reduces contact resistance.

[0004] In manufacturing contact pins, laser technology is used to create them. For example, there is a method of manufacturing contact pins by cutting a substrate made of conductive material using a laser. The laser beam cuts the substrate along a predetermined contour corresponding to the contact pin, and sharp edges can be formed on the contact pin through different operations. However, laser cutting technology, which manufactures contact pins by cutting a metal sheet along a contour corresponding to the final shape of the contact pin, has limitations in improving the dimensional precision of the contact pins, and since each cut must be performed individually using a laser, the production speed of contact pins is low.

[0005] On the other hand, this type of contact pin can be fabricated using Microelectromechanical Systems (MEMS) processes. The process of fabricating a contact pin using MEMS processes is described as follows: First, after coating a photoresist film onto the surface of a conductive substrate, the photoresist film is patterned. Then, using the photoresist film as a mold, metal material is deposited on the exposed surface of the conductive substrate within the opening using electroplating. The photoresist film and the conductive substrate are then removed, thereby obtaining the contact pin. As described above, the contact pin fabricated using MEMS processes is called a MEMS contact pin. The shape of this type of MEMS contact pin is the same as the shape of the opening formed in the photoresist film mold. In this case, the thickness of the MEMS contact pin is affected by the height of the photoresist film mold.

[0006] When using photoresist films as molds in electroplating processes, it is difficult to achieve a sufficiently high mold height using only a single layer of photoresist film. Consequently, the thickness of the contact pins cannot be made sufficiently thick. Considering conductivity, resilience, and brittle fracture, MEMS contact pins need to be fabricated to a specific thickness. To increase the thickness of the contact pins, molds using multi-step photoresist film lamination can be used. However, this presents the following problems: minute step differences appear between the layers of the photoresist film, causing the sides of the contact pins to not be formed perpendicularly, and slightly retaining the step difference regions. Furthermore, with multi-step photoresist film lamination, it becomes difficult to accurately reproduce the shape of contact pins with dimensions ranging from tens of micrometers to below.

[0007] Existing technical documents

[0008] Patent documents

[0009] (Patent Document 1) Korean Patent Publication No. 10-2018-0004753 Summary of the Invention

[0010] The problem that the invention aims to solve

[0011] The present invention is proposed to solve the above-mentioned problems, and aims to provide a highly reliable metal product and its manufacturing method, as well as a composite mold for said metal product, by combining a mold using anodized film material with a patternable mold.

[0012] Methods for solving problems

[0013] To achieve this objective of the present invention, a method for manufacturing a metal product according to the present invention includes the following steps: configuring a composite mold with a second mold of a material that can be patterned on an area layer of a first mold of anodized film material; and filling the opening of the composite mold with a metal substance to form a metal product.

[0014] In addition, a lower metal layer is disposed at the bottom of the composite mold and the metal product is formed by plating.

[0015] On the other hand, the method for manufacturing a metal product according to the present invention includes a first metal layer and a second metal layer, comprising the following steps: forming the first metal layer using a first mold made of anodized film material; and forming the second metal layer using a second mold made of a patternable material.

[0016] In addition, the material of the second mold is a photoresist film.

[0017] In addition, the first metal layer is formed by plating in the first opening of the first mold, and the second metal layer is formed by plating in the second opening of the second mold.

[0018] On the other hand, the metal product according to the invention is a metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, wherein the side surface region located at at least a portion of the height of the side surface is configured with microgrooves differently from the side surface regions located at other heights.

[0019] In addition, at least one end of the product includes a protruding tip with a cross-sectional area smaller than that of the central section of the main body.

[0020] In addition, the tip is made of a material different from the main body.

[0021] In addition, the tip has the same width as the center of the main body and a lower height than the center of the main body.

[0022] In addition, the tip has the same height as the center of the main body and a width smaller than the width of the center of the main body.

[0023] In addition, the tip is disposed at the corner of the end of the metal product.

[0024] In addition, the tip is disposed at the center of the end of the metal product.

[0025] In addition, the tip is made of a material with higher hardness than the main body.

[0026] On the other hand, the metal product according to the present invention is a metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, comprising: a first side surface region located at a first height of the side surface of the metal product; and a second side surface region located at a second height of the side surface of the metal product, wherein the first side surface region includes micro-grooves, the micro-grooves being formed by grooves that are elongatedly recessed from the first surface in the direction of the second surface and are formed in parallel.

[0027] In addition, the height of the metal product is formed to be more than 10 μm and less than 200 μm, and the verticality of the first side region is between 0.1° and 3°.

[0028] In addition, the depth of the micro-grooves is more than 20 nm and less than 1 μm.

[0029] On the other hand, the metal product according to the present invention is a metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, comprising: a first side surface region located at a first height of the side surface of the metal product; a second side surface region located above the first side surface region; and a third side surface region located below the first side surface region, wherein the first side surface region includes micro-grooves, the micro-grooves being formed by grooves that are elongatedly recessed from the first surface toward the second surface and are formed in parallel.

[0030] In addition, the first side region is formed to be more prominent than the second side region and the third side region.

[0031] On the other hand, the metal product according to the present invention is a metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface. At least one end of the product includes a pointed tip with a cross-sectional area smaller than that of the center of the main body and protruding therein. The side surface of the pointed tip includes a micro-groove, which is formed by grooves that are elongated from the first surface in the direction of the second surface and are formed in parallel.

[0032] On the other hand, the metal product according to the present invention is a conductive contact needle.

[0033] On the other hand, the composite mold according to the present invention includes: a first mold of anodized film material; and a second mold of patternable material disposed on the first mold.

[0034] In addition, the second mold is formed of a photoresist material.

[0035] Additionally, it includes a first opening portion disposed in the first mold and a second opening portion disposed in the second mold.

[0036] In addition, the first opening and the second opening are formed with the same width.

[0037] Additionally, it includes a lower metal layer disposed at the lower part of the first mold.

[0038] Additionally, it includes a first island disposed within the first opening and a second island disposed within the second opening.

[0039] The effects of the invention

[0040] This invention provides a highly reliable metal product and its manufacturing method by combining a mold using anodized film material with a patternable mold, as well as a composite mold for said metal product. Attached Figure Description

[0041] Figure 1 (a) to Figure 1 Figure (e) is used to illustrate a metal product and a method of manufacturing the same according to a preferred first embodiment of the present invention.

[0042] Figure 2 (a) to Figure 2 (d) is a diagram illustrating a metal product according to a preferred second embodiment of the present invention.

[0043] Figure 3 (a) to Figure 3 (d) and Figure 4 (a) to Figure 4 (d) is a figure illustrating a method for manufacturing a metal product according to a preferred second embodiment of the present invention.

[0044] Figure 5 (a) to Figure 5 (d) is a diagram illustrating a metal product according to a preferred third embodiment of the present invention.

[0045] Figure 6 (a) to Figure 6 (d) and Figure 7 (a) to Figure 7 (d) is a figure illustrating a method for manufacturing a metal product according to a preferred third embodiment of the present invention.

[0046] Figure 8 (a) to Figure 8 (d) is a diagram illustrating a metal product according to a preferred fourth embodiment of the present invention.

[0047] Figure 9 (a) to Figure 9 (d) and Figure 10 (a) to Figure 10 (d) is a figure illustrating a method for manufacturing a metal product according to a preferred fourth embodiment of the present invention.

[0048] Figure 11 (a) to Figure 11 (d) is a diagram illustrating a metal product according to a preferred fifth embodiment of the present invention.

[0049] Figure 12 (a) to Figure 12 (d) to Figure 14 (a) to Figure 14 (c) is a figure illustrating a method for manufacturing a metal product according to a preferred fifth embodiment of the present invention.

[0050] Figure 15 (a) to Figure 15 (d) is a diagram illustrating a metal product according to a preferred sixth embodiment of the present invention.

[0051] Figure 16 (a) to Figure 16 (c) to Figure 18 (a) to Figure 18 (c) is a figure illustrating a method for manufacturing a metal product according to a preferred sixth embodiment of the present invention.

[0052] Figure 19 These are photographs taken of the micro-grooves according to a preferred embodiment of the present invention.

[0053] [Symbol Explanation]

[0054] 100: Products / Metal Products

[0055] 110: Main body

[0056] 120: First mold

[0057] 130: Tip

[0058] 140: Seed layer

[0059] 150: Second mold Detailed Implementation

[0060] The following content is merely illustrative of the principles of the invention. Therefore, even without explicit description or illustration in this specification, those skilled in the art can implement the principles of the invention and invent various devices encompassed within the concept and scope of the invention. Furthermore, all terms and embodiments listed in this specification should be understood in principle as being for the purpose of clearly understanding the concept of the invention only, and are not limited to the embodiments and states specifically listed above.

[0061] The objectives, features, and advantages described herein will become even more apparent from the following detailed description in conjunction with the accompanying drawings, so that those skilled in the art to which the invention pertains can readily implement the technical ideas of the invention.

[0062] The embodiments described in this specification will be explained with reference to cross-sectional and / or perspective views, which serve as ideal illustrative diagrams of the invention. To effectively illustrate the technical content, the thickness of the films and regions shown in these figures is exaggerated. The shapes of the illustrative figures may be varied due to manufacturing techniques and / or tolerances. Furthermore, the number of products shown in the figures is only illustrative of a portion. Therefore, embodiments of the invention are not limited to the specific shapes shown, but also include variations in shapes resulting from manufacturing processes.

[0063] In describing the various embodiments, even if the embodiments differ, for convenience, the constituent elements that perform the same function are given the same names and the same reference numerals. Furthermore, for convenience, the components and operations already described in other embodiments will be omitted.

[0064] The metal product according to a preferred embodiment of the present invention refers to an article having a specific thickness, height, and length. The metal product according to a preferred embodiment of the present invention can be manufactured using MEMS technology and may vary depending on its application field.

[0065] A metal product according to a preferred embodiment of the present invention includes conductive contact pins for detecting a test object. The conductive contact pins are disposed in a detection device and used to make electrical and physical contact with the test object to transmit electrical signals. The detection device may be a detection device for semiconductor manufacturing processes, and as an example, depending on the test object, it may be a probe card or a test socket. The detection device according to the preferred embodiment of the present invention is not limited thereto, and includes any device for applying electricity to confirm whether the test object is defective.

[0066] The metal product and its manufacturing method according to a preferred embodiment of the present invention have technical features in using a composite mold of a first mold utilizing an anodized film material and a second mold of a patternable material. Preferably, the metal product can be manufactured by forming a metal filler in the opening of the composite mold after the composite mold is pre-made, and the metal product can be manufactured by sequentially stacking the first mold of anodized film material and the second mold of patternable material according to the process sequence and forming the metal filler.

[0067] Since the composite mold according to the preferred embodiment of the present invention is a mold made of anodized film material, in the metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, the side surface region located at at least a portion of the height of the side surface is provided with microgrooves in its exposed portion, unlike the side surface regions located at other heights.

[0068] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0069] Figure 1 (a) to Figure 1 Figure (e) is for illustrating a metal product and a method of manufacturing the same according to a preferred first embodiment of the present invention. The metal product and method of manufacturing the same according to the first embodiment relate to a metal product and a method of manufacturing the same, which is made by forming a metal filler 30 in the opening of the composite mold 20 after the composite mold 20 is prefabricated.

[0070] Reference Figure 1 (a) to Figure 1 (e) According to a preferred first embodiment of the present invention, the method for manufacturing product 10 is a method of manufacturing product 10 by combining a first mold 21 using an anodized film material and a second mold 23 using a patternable material. For example... Figure 1 (a) to Figure 1 As shown in (e), the composite mold 20 includes a first mold 21 made of anodized film material and a second mold 23 made of patternable material.

[0071] The first mold 21 for the anodized film material refers to the film formed by anodizing a metal as a base material, and pores refer to the holes formed during the anodizing process. For example, if the base material is aluminum (Al) or an aluminum alloy, anodizing the base material will form an anodized film of aluminum oxide (Al2O3) on the surface of the base material. The anodized film formed as described above is vertically divided into a barrier layer without pores and a porous layer with pores. In the base material on which the anodized film with the barrier layer and the porous layer is formed, if the base material is removed, only the anodized film of aluminum oxide (Al2O3) remains. The anodized film can be formed by removing the barrier layer formed during anodizing and having pores that extend vertically, or by retaining the barrier layer formed during anodizing and sealing one end of the pores at the top or bottom. The anodized film has a coefficient of thermal expansion of 2 ppm / ℃ to 3 ppm / ℃. Therefore, when exposed to high-temperature environments, the thermal deformation caused by temperature is small. Thus, even in high-temperature environments, precision products 10 can be manufactured without thermal deformation.

[0072] The second mold 23, which is a patternable material, is formed of a material that can undergo exposure and development processes, and includes a photoresist film.

[0073] When the product 10 is manufactured using only a second mold 23 made of photoresist film material, it is difficult to make the mold height sufficiently high using only a single layer of photoresist film. Therefore, the thickness of the metal product 10 cannot be made sufficiently thick either. Considering conductivity, resilience, and brittle fracture, it is necessary to manufacture the metal product 10 to a certain thickness or greater. To increase the thickness of the metal product 10, a mold using a multi-step laminated photoresist film can be used. However, in this case, the following problems arise: slight step differences appear between the layers of the photoresist film, causing the sides of the metal product 10 to not be formed perpendicularly, and slight step difference regions are retained. In addition, when using a multi-step laminated photoresist film, it is difficult to accurately reproduce the shape of the metal product 10, which has a size range of tens of micrometers or less.

[0074] On the other hand, when the product 10 is manufactured using the first mold 21 made of anodized film material, it has the advantage of being able to manufacture a product 10 with vertical sides. However, since the first mold 21 made of anodized film material is manufactured through an anodizing process, it takes a lot of time to make it thick enough.

[0075] Therefore, using a first mold 21 made of anodized film material and a second mold 23 made of patternable material as an electroplating mold has the following advantages: not only can a metal product 10 with vertical sides and excellent shape precision be produced, but the second mold 23 made of patternable material can also compensate for the insufficient height of the first mold 21 made of anodized film material. Furthermore, it may be difficult to produce a product 10 with a three-dimensional shape in the height direction using only the first mold 21 made of anodized film material, but by using a first mold 21 made of anodized film material and a second mold 23 made of patternable material, it is easy to produce a metal product 10 with a three-dimensional shape in the height direction.

[0076] A second mold 23 for patternable material is disposed above a first mold 21 for anodized film material. Because the second mold 23 for patternable material is positioned above the first mold 21 for anodized film material, after the plating process is completed, the second mold 23 for patternable material can better protect the first mold 21 for anodized film material during the planarization process (chemical mechanical polishing, CMP).

[0077] The first mold 21, made of anodized film material, can be used to make the basic shape of the metal product 10, while the second mold 23, made of patternable material, can be used to make composite three-dimensional shapes other than the basic shape or to increase the height of the basic shape.

[0078] The support components disposed at the lower part of the first mold 21 of the anodic oxide film material include: a first support component 40, which is disposed at the lower part of the first mold 21 during the electroplating process to support the composite mold 20; and a second support component 50, which is disposed at the lower part of the first mold 21 during the planarization process to support the composite mold 20.

[0079] Reference Figure 1 (a) A lower metal layer 41, 43 is disposed on the upper surface of the first support member 40. The lower metal layer 41, 43 includes a first lower metal layer 41 disposed at the lower part of the composite mold 20 and a second lower metal layer 43 disposed on the upper surface of the first support member 40.

[0080] The first lower metal layer 41 is preferably made of copper (Cu), platinum (Pt), thallium (Ta), titanium (Ti) or an alloy thereof, but there is no limitation on the material as long as it functions as a seed layer for electroplating.

[0081] The second lower metal layer 43 is disposed between the upper surface of the first support member 40 and the first lower metal layer 41, and can be formed of copper (Cu), platinum (Pt), thallium (Ta), titanium (Ti), or alloys thereof, preferably copper (Cu) with good conductivity, but there is no limitation thereto. The second lower metal layer 43 is configured to improve the uniformity of electroplating on the multiple openings 21a and 23a of the composite mold 20. The second lower metal layer 43 is formed to be sufficiently thick compared to the first lower metal layer 41, so that a uniform current is supplied to the multiple openings 21a and 23a of the composite mold 20 during electroplating.

[0082] The first lower metal layer 41 disposed on the lower surface of the composite mold 20 can be configured before the composite mold 20 is installed on the first support member 40, and the second lower metal layer 43 disposed on the first support member 40 can be configured before the composite member 20 is installed on the first support member 40.

[0083] By placing the composite mold 20 having a first lower metal layer 41 on the upper surface of the second lower metal layer 43 disposed on the first support member 40, the composite mold 20 is fixed to the first support member 40, thereby completing the preparation step for electroplating. Methods for fixing the composite mold 20 to the first support member 40 include fixing it using a clamping unit, fixing it using adhesive tape, etc. As an example, the composite mold 20 can be fixed firmly by clamping a portion of the upper surface of the composite mold 20 with a clamping part disposed on the upper part of the first support member 40.

[0084] The first mold 21 has a first opening 21a. Inside the first opening 21a is a first island 21b formed of an anodized film material. The first island 21b is a region left where the anodized film was not removed when a portion of the first mold 21 was etched to form the first opening 21a, and is surrounded by an anodized film region enclosed by the first opening 21a. The thickness of the first mold 21 can be between 10 μm and 100 μm. Regarding the basic shape of the metal product 10 used to manufacture the first mold 21, the thickness of the first mold 21 is in the range of 50 μm to 80 μm.

[0085] The second mold 23 has a second opening 23a. The second opening 23a can be formed with the same width as the first opening 21a. Inside the second opening 23a is a second island 23b formed of a photoresist film material. The second island 23b is a region of photoresist film that is not removed when a portion of the second mold 23 is etched to form the second opening 23a, and is surrounded by the second opening 23a. The thickness of the second mold 23 can be between 10 μm and 100 μm. Although the second mold 23 is used for the purpose of creating a three-dimensional shape of the metal product 10 and increasing its height, if its height is high, the thickness of the second mold 23 is in the range of 10 μm to 50 μm, which reduces the shape precision.

[0086] Next, as Figure 1 As shown in (b), electroplating is performed using a first lower metal layer 41 and a second lower metal layer 43. The second lower metal layer 43 functions as an electrode for electroplating, and the first lower metal layer 41 functions as a seed layer for electroplating. Except for the first island 21b and the second island 23b, the metal filler 30 fills the first opening 21a and the second opening 23a of the composite mold 20, and fills from the lower part of the first opening 21a towards the upper part of the second opening 23a.

[0087] After electroplating is completed, the following steps are taken: Figure 1As shown in (c), the composite mold 20 is separated from the first support member 40 and positioned on the upper surface of the second support member 50 to perform a planarization process. In this case, when the composite mold 20 is separated from the first support member 40, the first lower metal layer 41 located at the lower part of the composite mold 20 is also separated from the first support member 40. A bonding layer 53 is disposed on the upper surface of the second support member 50. The composite mold 20 can be firmly fixed to the second support member 50 by the bonding layer 53. Subsequently, the metal filler 30 protruding to the upper surface of the composite mold 20 is removed by a chemical mechanical polishing (CMP) process, and considering the thickness of the product 10 design, a portion of the upper surface of the second mold 23 can also be removed.

[0088] Then as Figure 1 As shown in (d), the composite mold 20 is removed using an etchant. First, the second mold 23, made of photoresist film material, is selectively removed, and then the first mold 21, made of anodized film material, is selectively removed. At this time, the first island 21b and the second island 23b are also removed using an etchant. By removing the first island 21b and the second island 23b, a pore 60 is formed that extends vertically through the interior of the metal product 10. The product 10 manufactured as described above includes a pore 60 extending along the thickness direction of the metal product 10. The pore 60 is formed along the length direction of the metal product 10 within the metal product 10 to facilitate deformation during pressure deformation of the metal product 10.

[0089] Then as Figure 1 As shown in (e), the metal product 10 is manufactured by removing the first lower metal layer 41 using an etchant that selectively reacts with the first lower metal layer 41.

[0090] The metal product 10 has a first surface (upper surface), a second surface (lower surface) opposite to the first surface (upper surface), and a side surface connecting the first surface (upper surface) and the second surface (lower surface). The metal product 10 includes a first side surface region 11 located at a first height on the side surface of the metal product 10 and a second side surface region 13 located at a second height on the side surface of the metal product 10. The first side surface region 11 is formed using a first mold 21 made of anodized film material, and the second side surface region 13 is formed using a second mold 23 made of photoresist film material. The first side surface region 11 formed using the first mold 21 made of anodized film material has microgrooves 88 formed through the pores of the anodized film (see reference). Figure 19 In other words, the exposed portion of the first side region 11 has a plurality of micro-grooves 88 formed by a groove that extends long from the first surface (upper surface) to the second surface (lower surface).

[0091] The depth of the micro-groove 88 is in the range of 20 nm to 1 μm, and its width is also in the range of 20 nm to 1 μm. Here, since the micro-groove 88 originates from the pores formed during the fabrication of the first mold 21 of the anodized film material, the width and depth of the micro-groove 88 are values ​​within the diameter range of the pores in the first mold 21 of the anodized film material. On the other hand, during the process of forming the opening in the first mold 21 of the anodized film material, a portion of the pores in the first mold 21 of the anodized film material can be broken apart by the etching solution, and at least partially formed micro-grooves 88 with a depth greater than the diameter range of the pores formed during anodizing.

[0092] As described above, the microgrooves 88 in the side surface of the metal product 10 have the effect of increasing the surface area. Furthermore, the microgrooves 88 improve the resistance to torsion when the metal product 10 is deformed. In one embodiment of the metal product 10, the conductive contact pin slides while contacting the inner surface of the guide hole in the guide plate. At this time, the conductive contact pin may be subjected to torsional loads, and the configuration of the microgrooves 88, arranged parallel to the pressure surface on the side surface of the conductive contact pin, resists the torsion of the conductive contact pin. Therefore, the conductive contact pin is prevented from twisting, and the contact area is prevented from becoming smaller during sliding, thus minimizing the generation of cutting foreign matter on the side surface. In addition, the microgrooves 88 improve the elastic recovery capability of the metal product 10 during deformation. Furthermore, the microgrooves 88 can quickly release the heat generated in the metal product 10, thus suppressing the temperature rise of the metal product 10.

[0093] The height of the metal product 10 is formed to be more than 10 μm and less than 200 μm, and the verticality of the first side region 11 is between 0.1° and 3°.

[0094] Reference Figure 2 (a) to Figure 2 (d) to Figure 18 (a) to Figure 18 (c) describes the process of making metal products 100, 200, 300, 400, and 500 by using a first mold made of anodized film material and a second mold made of patternable material to form metal fillers in sequence according to the process order.

[0095] Figure 2 (a) to Figure 2 (d) to Figure 4 (a) to Figure 4 (d) is a diagram illustrating the metal product 100 and its manufacturing method according to a preferred second embodiment of the present invention. Figure 2 (a) is a plan view of the metal product 100 according to the second embodiment. Figure 2 (b) is Figure 2 Section A-A' of (a) Figure 2 (c) is a front view of metal product 100. Figure 2 (d) is the rear view of metal product 100. Figure 3 (a) to Figure 3 (d) and Figure 4 (a) to Figure 4 (d) is a diagram illustrating a method for manufacturing a metal product 100 according to the second embodiment.

[0096] Reference Figure 2 (a) to Figure 2 (d) The metal product 100 includes a protruding tip 130 with a cross-sectional area smaller than that of the center of the main body 110. The tip 130 has the same width as the center of the main body 110 and a lower height than that of the center of the main body 110.

[0097] The metal product 100 may be formed of a conductive material. The conductive material may be selected from at least one of platinum (Pt), rhodium (Rh), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), or alloys thereof, or nickel-cobalt (NiCo) alloys, palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys, or nickel-phosphorus (NiP) alloys. The main body of the metal product 100 may have a multilayer structure with multiple conductive materials stacked on top of each other. Each conductive layer formed of different materials may be selected from platinum (Pt), rhodium (Rh), palladium (Pd), copper (Cu), silver (Ag), gold (Au), iridium (Ir), or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys, or nickel-phosphorus (NiP) alloys.

[0098] The tip 130 and the main body 110 may be made of different materials.

[0099] Since the tip 130 functions as a portion that makes substantial contact with the object being detected, it can be formed of a material with a relatively higher hardness than the body portion 110. As one embodiment, the tip 130 can be formed of palladium (Pd) or rhodium (Rh). Conversely, the body portion 110 can be formed of at least one metal selected from materials with relatively higher conductivity or relatively higher elasticity compared to the tip 130. The body portion 110 can be laminated with various conductive materials. Therefore, the tip 130 being formed of a material with a relatively higher hardness than the body portion 110 can mean that the tip 130 is formed of a material with a higher average hardness than the body portion 110.

[0100] Reference Figure 2 (a) to Figure 2(d) A tip portion 130 is provided at each of the two ends of the product 100. A first tip portion 131 provided at one end is formed of a material different from that of the main body portion 110, and a second tip portion 133 formed at the other end is formed of a material identical to that of the main body portion 110. The first tip portion 131 is manufactured by a plating process separate from the plating process of the main body portion 110, and the material of the first tip portion 131 is different from that of the main body portion 110. The second tip portion 133 is formed together with the plating process of the main body portion 110, and the material of the second tip portion 133 is identical to that of the main body portion 110.

[0101] The central axis of the tip 130 is eccentrically positioned from the central axis of the main body 110. Because of this eccentric configuration, the product 100 can be deformed more effectively when compressed by applying pressure. This reduces the contact pressure on the object being tested.

[0102] The eccentricity direction of the central axis of the first tip 131 relative to the central axis of the main body 110 can be the same as the eccentricity direction of the second tip 133 relative to the central axis of the main body 110. Specifically, the central axis of the first tip 131 is located below the central axis of the main body 110, and the central axis of the second tip 133 is also located below the central axis of the main body 110. Thus, the bending direction of the product 100 can be fixed by bending the product 100 in the opposite direction of the eccentricity direction.

[0103] The first tip portion 131 includes a protrusion 131a that protrudes outward from the main body portion 110 of the product 100 and an embedded portion 131b located inside the main body portion 110 of the product 100. The embedded portion 131b is configured to prevent the first tip portion 131, which is made of a material different from the main body portion 110, from falling off the main body portion 110.

[0104] Reference Figure 3 (a) to Figure 3 (d) and Figure 4 (a) to Figure 4 (d) describes a method for manufacturing product 100 according to a preferred second embodiment of the present invention.

[0105] Reference Figure 3 (a) First, a first mold 120 of anodized film material is prepared. A seed layer 140 is disposed on the lower part of the first mold 120 of anodized film material. The seed layer 140 is pre-formed on the lower part of the first mold 120 for subsequent electroplating.

[0106] Reference Figure 3(b) A first opening 125 is formed in a first mold 120 of anodized film material. The first opening 125 can be formed by removing at least a portion of the first mold 120 of anodized film material. The first opening 125 can be formed by etching the first mold 120 of anodized film material. For this purpose, a photoresist can be disposed on the upper surface of the first mold 120 of anodized film material and patterned thereon, and then the anodized film in the patterned area of ​​the opening reacts with an etching solution to form the first opening 125. Specifically, a photosensitive material can be disposed on the upper surface of the first mold 120 of anodized film material before forming the first opening 125, and then an exposure process and a development process are performed. The photosensitive material forms an opening area through the exposure process and the development process, and at least a portion of it can be patterned and removed. The first mold 120 of anodized film material performs an etching process by removing the opening area of ​​the photosensitive material using a patterning process, thereby forming the first opening 125. Furthermore, if the first mold 120 of the anodic oxide film material is wet-etched using an etching solution, a first opening 125 with a vertical inner wall is formed. Thus, compared to using a photoresist as the mold, if an anodic oxide film is used as the mold to form the coating layer, the precision of the shape of the coating layer is improved, thereby enabling the production of a product 100 with a precise microstructure.

[0107] Reference Figure 3 (c) The first opening 125 is plated to form a first tip 131. The first tip 131 can be formed using a seed layer 140 during electroplating. When the plating process is completed, a planarization process can be performed. The plating layer protruding onto the upper surface of the first mold 120 of the anodic oxide film material is removed and planarized by a chemical mechanical polishing (CMP) process.

[0108] Reference Figure 3 (d) forms a second opening 127 for forming the first body portion 111. The second opening 127 can be formed by removing at least a portion of the first mold 120 of the anodized film material. The second opening 127 can be formed by etching the first mold 120 of the anodized film material.

[0109] Reference Figure 4 (a) The second opening 127 is plated to form the first body portion 111. The first body portion 111 may be formed by a multilayer structure of metal layers of different materials. At least one metal layer of the multilayer structure may be formed of a highly conductive material, and another metal layer of the multilayer structure may be formed of a highly elastic material. In this way, a product 100 with high conductivity and high elasticity can be produced by forming the first body portion 111 using a multilayer structure. When the plating process is completed, a planarization process may be performed.

[0110] Reference Figure 4 (b) A photoresist (PR) is formed on the upper surface.

[0111] Reference Figure 4 (c) A second mold 150 is formed by patterning the photoresist PR to create a photoresist film material. The second mold 150 of the photoresist film material has a third opening 155 formed during the patterning process of the photoresist. The second mold 150 of the photoresist film material is formed to cover a portion of the upper surface of the first tip 131 so that the upper surface of the first tip 131 disposed at one end is not entirely exposed, and is formed to cover a portion of the upper surface of the first body 111 so that the upper surface of the first body 111 disposed at the other end is not entirely exposed.

[0112] Reference Figure 4 (d) The third opening 155 is plated to form the second main body 113. The second main body 113, together with the first main body 111 formed above, constitutes the main body 110. Then, the second mold 150 of photoresist film material, the first mold 120 of anodized film material and the seed layer 140 are removed to complete the metal product 100. Thus, a first tip 131 and a second tip 133 are respectively provided at both ends of the metal product 100. The first tip 131 provided at one end is formed of a material different from that of the main body 110, while the second tip 133 formed at the other end is formed of a material of the same material as that of the main body 110.

[0113] The first tip 131 increases its bonding force with the main body 110 through the configuration of the embedded portion 131b. This prevents the first tip 131 from falling off the main body 110.

[0114] A first side surface region 11 of the metal product 100 is formed using a first mold 120 made of anodized film material, and a second side surface region 13 of the metal product 100 is formed using a second mold 150 made of photoresist film material. The first side surface region 11 formed using the first mold 120 of anodized film material has microgrooves 88 formed through the pores of the anodized film (see reference). Figure 19 In other words, the first side region 11 has a plurality of micro-grooves 88 formed by a groove that extends long from the first surface (upper surface) to the second surface (lower surface).

[0115] Figure 5 (a) to Figure 5 (d) to Figure 7 (a) to Figure 7(d) is a diagram illustrating the metal product 200 and its manufacturing method according to a preferred third embodiment of the present invention. Figure 5 (a) is a plan view of the metal product 200 according to the third embodiment. Figure 5 (b) is Figure 5 Section A-A' of (a) Figure 5 (c) is a front view of metal product 200. Figure 5 (d) is the rear view of metal product 200. Figure 6 (a) to Figure 6 (d) and Figure 7 (a) to Figure 7 (d) is a diagram illustrating a method for manufacturing a metal product 200 according to the third embodiment.

[0116] Reference Figure 5 (a) to Figure 5 (d) The metal product 200 includes a protruding tip 230 with a cross-sectional area smaller than that of the center of the main body 210. If the tip 230 has the same height as the center of the main body 210 but has a width smaller than that of the center of the main body 210, it is disposed biased toward either side of the main body 210.

[0117] Tips 230 are provided at both ends of the metal product 200. The first tip 231 provided at one end is formed of a material different from that of the main body 210, and the second tip 233 formed at the other end is also formed of a material different from that of the main body 210.

[0118] Since the central axis of the tip 230 is eccentrically positioned from the central axis of the main body 210, it has the advantage that the product 200 can be deformed more effectively when compressed by applying pressure. As a result, the contact pressure on the object being tested can be reduced.

[0119] The eccentricity direction of the central axis of the first tip 231 relative to the central axis of the main body 210 can be the same as the eccentricity direction of the second tip 233 relative to the central axis of the main body 210. Specifically, the central axis of the first tip 231 is located to the right of the central axis of the main body 210, and the central axis of the second tip 233 is also located to the right of the central axis of the main body 210. Thus, the bending direction of the metal product 200 can be fixed by bending the metal product 200 in the opposite direction of the eccentricity direction.

[0120] The first tip portion 231 includes a protrusion 231a protruding outward from the main body portion 210 of the metal product 200 and an embedded portion 231b located inside the main body portion 210 of the metal product 200. Similarly, the second tip portion 233 includes a protrusion 233a protruding outward from the main body portion 210 of the metal product 200 and an embedded portion 233b located inside the main body portion 210 of the metal product 200. The embedded portions 231b and 233b prevent the first tip portion 231 and the second tip portion 233, which are made of a material different from the main body portion 210, from detaching from the main body portion 210.

[0121] Reference Figure 6 (a) to Figure 6 (d) and Figure 7 (a) to Figure 7 (d) describes a method for manufacturing product 200 according to a preferred third embodiment of the present invention.

[0122] Reference Figure 6 (a) First, a first mold 220 of anodized film material is prepared. A seed layer 240 is disposed on the lower part of the first mold 220 of anodized film material. The seed layer 240 is pre-formed on the lower part of the first mold 220 for subsequent electroplating.

[0123] Reference Figure 6(b) A first opening 223 and a second opening 225 are formed in a first mold 220 of anodized film material. The first opening 223 and the second opening 225 can be formed by removing at least a portion of the first mold 220 of anodized film material. The first opening 223 and the second opening 225 can be formed by etching the first mold 220 of anodized film material. For this purpose, a photoresist can be disposed on the upper surface of the first mold 220 of anodized film material and patterned thereon. Then, the anodized film in the patterned and opened area reacts with an etching solution to form the first opening 223 and the second opening 225. Specifically, a photosensitive material can be disposed on the upper surface of the first mold 220 of anodized film material before the formation of the first opening 223 and the second opening 225, and then an exposure process and a development process are performed. The photosensitive material forms the opening area through the exposure process and the development process, and at least a portion of it can be patterned and removed. The first mold 220, made of anodized film material, is etched by removing the opening area of ​​the photosensitive material using a patterning process, thereby forming a first opening 223 and a second opening 225. Alternatively, if the first mold 220 of anodized film material is wet-etched using an etching solution, the first opening 223 and the second opening 225, each with a vertical inner wall, are formed. Thus, compared to using a photoresist film as the mold, using anodized film as the mold to form the coating layer improves the precision of the coating layer's shape, thereby enabling the fabrication of a metal product 200 with a precise microstructure.

[0124] Reference Figure 6 (c) The first opening 223 and the second opening 225 are plated to form the first tip 231 and the second tip 233. During electrolytic plating, the first tip 231 and the second tip 233 can be formed using the seed layer 240. When the plating process is completed, a planarization process can be performed. The plating layer protruding onto the upper surface of the first mold 220 of the anodic oxide film material is removed and planarized by a chemical mechanical polishing (CMP) process.

[0125] Reference Figure 6 (d) forms a third opening 227 for forming the first body portion 211. The third opening 227 can be formed by removing at least a portion of the first mold 220 of the anodized film material. The third opening 227 can be formed by etching the first mold 220 of the anodized film material.

[0126] Reference Figure 7(a) The third opening 227 is plated to form the first body portion 211. The first body portion 211 can be formed by a multilayer structure of metal layers of different materials. At least one metal layer of the multilayer structure can be formed of a highly conductive material, and another metal layer of the multilayer structure can be formed of a highly elastic material. In this way, a highly conductive and highly elastic metal product 200 can be manufactured by forming the first body portion 211 using a multilayer structure. A planarization process can be performed when the plating process is completed.

[0127] Reference Figure 7 (b) forms a photoresist PR on the upper surface.

[0128] Reference Figure 7 (c) A second mold 250 is formed by patterning the photoresist PR to create a photoresist film material. The second mold 250 of the photoresist film material has a fourth opening 255 formed during the patterning process of the photoresist. The second mold 250 of the photoresist film material is formed to cover a portion of the upper surface of the first tip 231 so that the upper surface of the first tip 231 disposed at one end is not entirely exposed, and is formed to cover a portion of the upper surface of the second tip 233 so that the upper surface of the second tip 233 disposed at the other end is not entirely exposed.

[0129] Reference Figure 7 (d) The fourth opening 255 is plated to form the second main body 213. The second main body 213, together with the first main body 211 formed above, constitutes the main body 210. Then, the second mold 250 of photoresist film material, the first mold 220 of anodized film material, and the seed layer 240 are removed to complete the metal product 200. As a result, a first tip 231 and a second tip 233 are respectively disposed at both ends of the metal product 200. The first tip 231 and the second tip 233 disposed at both ends are formed of a material different from that of the main body 210.

[0130] The first tip 231 and the second tip 233 increase their bonding force with the main body 210 through the configuration of the embedded portions 231b and 233b. This prevents the first tip 231 and the second tip 233 from falling off the main body 210.

[0131] A first side surface region 11 of the metal product 200 is formed using a first mold 220 made of anodized film material, and a second side surface region 13 of the metal product 200 is formed using a second mold 250 made of photoresist film material. The first side surface region 11 formed using the first mold 220 of anodized film material has microgrooves 88 formed through the pores of the anodized film (see reference). Figure 19In other words, the first side region 11 has a plurality of micro-grooves 88 formed by a groove that extends long from the first surface (upper surface) to the second surface (lower surface).

[0132] Figure 8 (a) to Figure 8 (d) to Figure 10 (a) to Figure 10 (d) is a diagram illustrating the metal product 300 and its manufacturing method according to a preferred fourth embodiment of the present invention. Figure 8 (a) is a plan view of the metal product 300 according to the fourth embodiment. Figure 8 (b) is Figure 8 Section A-A' of (a) Figure 8 (c) is a front view of metal product 300. Figure 8 (d) is the rear view of metal product 300. Figure 9 (a) to Figure 9 (d) and Figure 10 (a) to Figure 10 (d) is a diagram illustrating a method for manufacturing a metal product 300 according to the fourth embodiment.

[0133] Reference Figure 8 (a) to Figure 8 (d) The metal product 300 includes a protruding tip 330 with a cross-sectional area smaller than that of the center of the main body 310. The tip 330 is disposed on the corner side of the end of the metal product 300.

[0134] Reference Figure 8 (a) to Figure 8 (d) Tips 330 are provided at both ends of the metal product 300. The first tip 331 provided at one end is formed of a material different from that of the main body 310, and the second tip 333 formed at the other end is also formed of a material different from that of the main body 310.

[0135] Since the central axis of the tip 330 is eccentrically positioned from the central axis of the main body 310, it has the advantage that the product 300 can be deformed more effectively when compressed by applying pressure. As a result, the contact pressure on the object being tested can be reduced.

[0136] The eccentricity direction of the central axis of the first tip 331 relative to the central axis of the main body 310 can be the same as the eccentricity direction of the second tip 333 relative to the central axis of the main body 310. Specifically, the central axis of the first tip 331 is located above and to the right of the central axis of the main body 310, and the central axis of the second tip 333 is also located above and to the right of the central axis of the main body 310. Thus, the bending direction of the product 300 can be fixed by bending the product 300 in the opposite direction of the eccentricity direction.

[0137] Since the lower surface of the tip 330 engages with the main body 310 protruding in the central region of the main body 310, the tip 330 is prevented from falling off the main body 310.

[0138] Reference Figure 9 (a) to Figure 9 (d) and Figure 10 (a) to Figure 10 (d) describes a method for manufacturing a metal product 300 according to a preferred fourth embodiment of the present invention.

[0139] Reference Figure 9 (a) First, a first mold 320 of anodized film material is prepared. A seed layer 340 is disposed on the lower part of the first mold 320 of anodized film material. The seed layer 340 is pre-formed on the lower part of the first mold 320 for subsequent electroplating.

[0140] Reference Figure 9(b) A first opening 325 is formed in a first mold 320 of anodized film material. The first opening 325 can be formed by removing at least a portion of the first mold 320 of anodized film material. The first opening 325 can be formed by etching the first mold 320 of anodized film material. For this purpose, a photoresist can be disposed on the upper surface of the first mold 320 of anodized film material and patterned thereon, and then the anodized film in the patterned and opened area reacts with an etching solution to form the first opening 325. Specifically, a photosensitive material can be disposed on the upper surface of the first mold 320 of anodized film material before forming the first opening 325, and then an exposure process and a development process are performed. The photosensitive material forms an opening area through the exposure process and the development process, and at least a portion of it can be patterned and removed. The first mold 320 of anodized film material performs an etching process by removing the opening area of ​​the photosensitive material using the patterning process, thereby forming the first opening 325. Furthermore, if the first mold 320 made of anodized film material is wet-etched using an etching solution, a first opening 325 with a vertical inner wall is formed. Thus, compared to using photoresist as the mold, if anodized film is used as the mold to form the coating layer, the precision of the shape of the coating layer is improved, thereby enabling the production of a product 300 with a precise microstructure.

[0141] Reference Figure 9 (c) The first opening 325 is plated to form the first main body 311. The first main body 311 can be formed using a seed layer 340 during electrolytic plating. When the plating process is completed, a planarization process can be performed. The plating layer protruding onto the upper surface of the first mold 320 of the anodic oxide film material is removed and planarized by a chemical mechanical polishing (CMP) process.

[0142] Reference Figure 9 (d) forms a photoresist PR on the upper surface.

[0143] Reference Figure 10 (a) A second mold 350 is formed by patterning a photoresist PR to create a photoresist film material. The second mold 350 of the photoresist film material has a second opening 327 formed during the patterning process of the photoresist.

[0144] Reference Figure 10 (b) The second opening 327 is plated to form the second main body 313. The second main body 313 together with the first main body 311 formed above constitutes the main body 310.

[0145] Reference Figure 10(c) The second mold 350 of the photoresist film material is patterned to form the third opening 329. The third opening 329 is disposed on both ends.

[0146] Reference Figure 10 (d) The third opening 329 is plated to form the first tip 331 and the second tip 333. Then, the second mold 350 (photoresist film), the first mold 320 (anodized film), and the seed layer 340 are removed to complete the product 300. Thus, the first tip 331 and the second tip 333 are respectively disposed at both ends of the product 300. The first tip 331 and the second tip 333 disposed at both ends are formed of a material different from that of the main body 310.

[0147] A first side surface region 11 of the metal product 300 is formed using a first mold 320 made of anodized film material, and a second side surface region 13 of the metal product 300 is formed using a second mold 350 made of photoresist film material. The first side surface region 11 formed using the first mold 320 of anodized film material has microgrooves 88 formed through the pores of the anodized film (see reference). Figure 19 In other words, the first side region 11 has a plurality of micro-grooves 88 formed by a groove that extends long from the first surface (upper surface) to the second surface (lower surface).

[0148] Figure 11 (a) to Figure 11 (d) to Figure 14 (a) to Figure 14 (c) is a diagram illustrating a metal product 400 and a method of manufacturing thereof according to a preferred fifth embodiment of the present invention. Figure 11 (a) is a plan view of the metal product 400 according to the fifth embodiment. Figure 11 (b) is Figure 11 Section A-A' of (a) Figure 11 (c) is a front view of metal product 400. Figure 11 (d) is the rear view of metal product 400. Figure 12 (a) to Figure 12 (d) to Figure 14 (a) to Figure 14 (c) is a diagram illustrating a method for manufacturing a metal product 400 according to the fifth embodiment.

[0149] Reference Figure 11 (a) to Figure 11 (d) The metal product 400 includes a protruding tip 430 with a cross-sectional area smaller than that of the center of the main body 410. The tip 430 is disposed on the central side of the end of the metal product 400.

[0150] Reference Figure 11 (a) to Figure 11 (d) A pointed tip 430 is provided at each of the two ends of the metal product 400. The first pointed tip 431 provided at one end is formed of a material different from that of the main body 410, and the second pointed tip 433 provided at the other end is also formed of a material different from that of the main body 410. The central axis of the pointed tip 430 is located on the central axis of the main body 410.

[0151] The first tip portion 431 includes a protrusion 431a protruding outward from the main body portion 410 of the metal product 400 and an embedded portion 431b located inside the main body portion 410 of the metal product 400. Similarly, the second tip portion 433 includes a protrusion 433a protruding outward from the main body portion 410 of the metal product 400 and an embedded portion 433b located inside the main body portion 410 of the metal product 400. The embedded portions 431b and 433b prevent the first tip portion 431 and the second tip portion 433, which are made of a material different from the main body portion 410, from detaching from the main body portion 410.

[0152] Reference Figure 12 (a) to Figure 12 (d) to Figure 14 (a) to Figure 14 (c) describes a method for manufacturing a metal product 400 according to a preferred fifth embodiment of the present invention.

[0153] Reference Figure 12 (a) First, a first mold 420 of anodic oxide film material is prepared. A first seed layer 441 is disposed at the lower part of the first mold 420 of anodic oxide film material, and a second seed layer 442 is disposed at the upper part of the first mold 420 of anodic oxide film material. In order to perform electroplating later, the first seed layer 441 and the second seed layer 442 are pre-formed at the upper and lower parts of the first mold 420.

[0154] Reference Figure 12 (b) Patterning is performed on the second seed layer 442. Then refer to... Figure 12 (c) A photoresist PR is formed on the upper surface. Then refer to... Figure 12 (d) The photoresist PR is patterned, and the patterned photoresist PR is used as a mask to etch the anodic oxide film to form a first opening 425. A first mold 420 of anodic oxide film material having the first opening 425 and a second mold 450 of photoresist film material are configured. The second mold 450 of photoresist film material is located above the first mold 420 of anodic oxide film material.

[0155] Reference Figure 13 (a) The first opening 425 is plated to form the first main body 411. Next, refer to... Figure 13 (b) forms a photoresist PR on the upper surface.

[0156] Reference Figure 13 (c) A third mold 451 is formed by patterning the photoresist PR to create a photoresist film material having a second opening 429. The second opening 429 is formed by patterning the photoresist PR to expose the upper surface of the first main body 411 and the upper surface of the second seed layer 442. Due to the height difference between the upper surface of the first main body 411 and the upper surface of the second seed layer 442, the second opening 429 has a stepped shape at its end.

[0157] Reference Figure 13 (d) The stepped second opening 429 is plated to form the first tip 431 and the second tip 433. Due to the stepped surface, the joint area between the first tip 431, the second tip 433 and the first main body 411 is increased, which can more effectively prevent the first tip 431 and the second tip 433 from falling off. The first tip 431 and the second tip 433 are formed by embedded portions 431b and 433b and protrusions 431a and 433a. The protrusions 431a and 433a are formed thicker than the embedded portions 431b and 433b. The enlarged thickness surface of the protrusions 431a and 433a joins with the first main body 411 and more effectively prevents the first tip 431 and the second tip 433 from falling off.

[0158] Next refer to Figure 14 (a) A photoresist PR is formed on the upper surface. Then refer to... Figure 14 (b) A fourth mold 453 is formed by patterning the photoresist PR to create a photoresist film material with a third opening 429. The third opening 429 exposes the embedded portions 431b and 433b of the first tip 431 and the second tip 433. Next, refer to... Figure 14 (c) The third opening 429 is plated to form the second main body 413. Then, the fourth mold 453 (photoresist film), the first mold 420 (anodized film), and the first seed layer 441 and second seed layer 442 are removed to complete the product 400. Thus, a first tip 431 and a second tip 433 are respectively disposed at both ends of the product 400. The first tip 431 and the second tip 433 disposed at both ends are formed of a material different from that of the main body 410.

[0159] The preferred fifth embodiment of the present invention describes a case where the embedded portions 431b and 433b are formed separately and spaced apart from each other. However, as a variation of the fifth embodiment, the embedded portions 431b and 433b can be connected to each other, and the first tip portion 431 and the second tip portion 433 are configured as a single unit. Therefore, in this variation of the fifth embodiment, the increased thickness of the protrusions 431a and 433a can be used to perform a stop-edge function, thereby more effectively preventing the first tip portion 431 and the second tip portion 433 from falling off.

[0160] The first side surface region 11 of the product 400 is formed using a first mold 420 made of anodized film material, and the second side surface region 13 of the metal product 400 is formed using a second mold 450, a third mold 451, and a fourth mold 453 made of photoresist film material. The first side surface region 11 formed using the first mold 420 of anodized film material has microgrooves 88 formed through the pores of the anodized film (see reference). Figure 19 In other words, the first side region 11 has a plurality of micro-grooves 88 formed by a groove that extends long from the first surface (upper surface) to the second surface (lower surface).

[0161] Figure 15 (a) to Figure 15 (d) to Figure 18 (a) to Figure 18 (c) is a diagram illustrating a metal product 500 and a method of manufacturing it according to a preferred sixth embodiment of the present invention. Figure 15 (a) is a plan view of the metal product 500 according to the sixth embodiment. Figure 15 (b) is Figure 15 Section A-A' of (a) Figure 15 (c) is a front view of metal product 500. Figure 15 (d) is the rear view of metal product 500. Figure 16 (a) to Figure 16 (c) to Figure 18 (a) to Figure 18 (c) is a diagram illustrating a method for manufacturing a metal product 500 according to the sixth embodiment.

[0162] Reference Figure 15 (a) to Figure 15 (d) The metal product 500 includes a protruding tip 530 with a cross-sectional area smaller than that of the center of the main body 510. The tip 530 is disposed on the central side of the end of the product 500.

[0163] Tips 530 are provided at both ends of the product 500. A first tip 531 provided at one end is formed of a material different from that of the main body 510, and a second tip 533 provided at the other end is also formed of a material different from that of the main body 510. The central axis of the tip 530 is located on the central axis of the main body 510.

[0164] The first tip portion 531 includes a protrusion 531a protruding outward from the main body portion 510 of the metal product 500 and an embedded portion 531b located inside the main body portion 510 of the metal product 500. Similarly, the second tip portion 533 includes a protrusion 533a protruding outward from the main body portion 510 of the metal product 500 and an embedded portion 533b located inside the main body portion 510 of the metal product 500. The embedded portions 531b and 533b prevent the first tip portion 531 and the second tip portion 533, which are made of a material different from the main body portion 510, from detaching from the main body portion 510.

[0165] Reference Figure 16 (a) to Figure 16 (c) to Figure 18 (a) to Figure 18 (c) describes a method for manufacturing a metal product 500 according to a preferred sixth embodiment of the present invention.

[0166] Reference Figure 16 (a) First, a first mold 520 of anodized film material is prepared. A seed layer 540 is disposed at the lower part of the first mold 520 of anodized film material. The seed layer 540 is pre-formed at the lower part of the first mold 520 for subsequent electroplating.

[0167] Reference Figure 16 (b) A first opening 525 is formed in the first mold 520 of the anodized film material. The first opening 525 can be formed by removing at least a portion of the first mold 520 of the anodized film material.

[0168] Reference Figure 16 (c) The first opening 525 is plated to form the first main body 511.

[0169] Reference Figure 17 (a) A second opening 527 is formed in the first mold 520 of the anodized film material. The second opening 527 can be formed by removing at least a portion of the first mold 520 of the anodized film material.

[0170] Reference Figure 17 (b) The second opening 527 is plated to form the first tip 531 and the second tip 533.

[0171] Reference Figure 17 (c) A second mold 550 is formed by forming a photoresist film on the upper part and patterning it. The opening of the second mold 550 is longer than the length of the first main body 511. Then, the opening of the second mold 550 is plated to form the second main body 513.

[0172] Reference Figure 18 (a), in will Figure 17 The seed layer 540 is removed after the product made in (c) is inverted.

[0173] Reference Figure 18 (b) A third mold 570 is formed by forming a photoresist film on the upper part and patterning it. The third mold 570 of the photoresist film material has a third opening 529. The length of the third opening 529 is longer than the length of the first main body 511.

[0174] Reference Figure 18 (c) The third opening 529 is plated to form the third main body 515. Then, the second mold 550 (photoresist film material), the third mold 570 (photoresist film material), and the first mold 520 (anodized film material) are removed to complete the product 500. Thus, a first tip 531 and a second tip 533 are respectively disposed at both ends of the product 500. The first tip 531 and the second tip 533 disposed at both ends are formed of a material different from that of the main body 510.

[0175] The metal product 500 includes a first side region 11 located at a first height on the side of the metal product 500, a second side region 13 located above the first side region, and a third side region 15 located below the first side region. The first side region 11 protrudes further in the length direction than the second side region 13 and the third side region 15. The first side region 11 of the metal product 500 is formed using a first mold 520 made of anodized film material, and the second side region 13 and the third side region 15 of the metal product 500 are formed using a second mold 550 and a third mold 570 made of photoresist film material. The first side region 11 formed using the first mold 520 made of anodized film material has microgrooves 88 formed through the pores of the anodized film (see reference). Figure 19In other words, the first side surface region 11 has a groove that extends long from the first surface (upper surface) to the second surface (lower surface) and a plurality of fine grooves 88 are formed side by side. Since the first side surface region 11 is a region with a first tip 531 and a second tip 533 that have a cross-sectional area smaller than that of the center of the main body 510 and protrude therein, a groove that extends long from the first surface (upper surface) to the second surface (lower surface) and a plurality of fine grooves 88 are formed side by side on the sides of the first tip 531 and the second tip 533.

[0176] As explained above, the metal product according to a preferred embodiment of the present invention is characterized in that it is manufactured by a composite mold using a first mold made of anodized film material and a second mold made of a patternable material. Preferably, the metal product can be manufactured by forming a metal filler in the opening of the composite mold after the composite mold is pre-made in one step, and the metal product can be manufactured by sequentially stacking the first mold made of anodized film material and the second mold made of patternable material according to the process sequence and forming the metal filler.

[0177] According to a preferred embodiment of the present invention, if a first mold using an anodized film material and a second mold using a patternable material are used as an electroplating mold, the following advantages are available: the second mold using the patternable material can compensate for the insufficient height of the first mold using an anodized film material. Furthermore, it may be difficult to manufacture metal products with a three-dimensional shape in the height direction using only the first mold using an anodized film material, but by combining the first mold using an anodized film material and the second mold using a patternable material, it is easy to manufacture metal products with a three-dimensional shape in the height direction.

[0178] As described above, although preferred embodiments of the present invention have been distinguished, those skilled in the art can make various modifications or variations to the embodiments without departing from the spirit and field of the present invention as set forth in the following claims.

Claims

1. A method for manufacturing a metal product, comprising the following steps: A second mold capable of patterning is deposited on a surface of a first mold made of anodized film material to configure a composite mold; The opening of the composite mold is filled with a metallic substance to form a metal product; as well as Remove the first mold and the second mold. The side region of the metal product located at at least a portion of the side height is configured with microgrooves on its exposed portion, unlike the side regions located at other heights.

2. The method for manufacturing metal products according to claim 1, wherein... A lower metal layer is disposed at the bottom of the composite mold, and the metal product is formed by plating.

3. A method for manufacturing a metal product, comprising a first metal layer and a second metal layer, comprising the following steps: The first metal layer is formed using a first mold made of anodized film material; The second metal layer is formed using a second mold made of a patternable material; as well as Remove the first mold and the second mold. The side region of the metal product located at at least a portion of the side height is configured with microgrooves on its exposed portion, unlike the side regions located at other heights.

4. The method for manufacturing a metal product according to claim 3, wherein... The material of the second mold is a photoresist film.

5. The method for manufacturing a metal product according to claim 3, wherein... The first metal layer is formed by plating within the first opening of the first mold. The second metal layer is formed by plating within the second opening of the second mold.

6. A metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, comprising: The first side region is located at a first height on the side of the metal product; as well as The second side region is located at the second height of the side of the metal product. The exposed portion of the first side region includes microgrooves, which are formed by grooves that are elongated and recessed from the first surface to the second surface, and are arranged in parallel.

7. The metal product according to claim 6, wherein... The height of the metal product is formed to be more than 10 μm and less than 200 μm, and the verticality of the first side region is between 0.1° and 3°.

8. The metal product according to claim 6, wherein The depth of the micro-grooves is more than 20 nm and less than 1 μm.

9. A metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, comprising: The first side region is located at a first height on the side of the metal product; The second side region is located above the first side region; The third side region is located below the first side region. The exposed portion of the first side region includes microgrooves, which are formed by grooves that are elongated and recessed from the first surface to the second surface, and are arranged in parallel.

10. The metal product according to claim 9, wherein... The first side region is formed to be more prominent than the second side region and the third side region.

11. A metal product having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, wherein... At least one end of the metal product includes a protruding tip with a cross-sectional area smaller than that of the center of the main body. The exposed portion on the side of the tip includes microgrooves, which are formed by grooves that are elongated and recessed from the first surface to the second surface, and are arranged in parallel.

12. The metal product according to claim 6, claim 9 or claim 11, wherein... The metal product is a conductive contact needle.

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