Electronic device having a glass layer with an anti-scratch coating

Abstract

An electronic device can be surrounded by an outer region and can have an inner region. Electronic components can be mounted in the inner region. Enclosure walls, such as enclosure walls formed of transparent material layers, can separate the inner region from the outer region. A display can be visible through one of the transparent material layers. The transparent material layers can be coupled to an enclosure structure in the device, and can be formed of glass or glass-ceramic. The transparent layers can have opposing chemically strengthened surface layers of different thicknesses. A coating can be formed on the thinner of the opposing chemically strengthened surface layers. The coating can have an oleophobic overcoat layer, an anti-reflective layer, and an anti-scratch layer. The anti-scratch layer can have one or more compressively stressed dielectric layers, and can have a corresponding one or more graded composition layers.

Description

[0001] This application claims priority to U.S. Patent Application No. 17 / 667,686, filed February 9, 2022; U.S. Provisional Patent Application No. 63 / 152,148, filed February 22, 2021; and U.S. Provisional Patent Application No. 63 / 213,905, filed June 23, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates generally to coatings, and more specifically, to coatings for use as transparent layers in electronic devices. Background Technology

[0003] Electronic devices, such as cellular phones, may have displays. To protect the displays in electronic devices, they may be fitted with protective display cover glass. The display cover glass may be coated. Summary of the Invention

[0004] Electronic devices may have a housing. This housing may consist of an outer region and enclose an inner region. Electronic components such as sensors, integrated circuits, and other circuits may be mounted in this inner region.

[0005] An enclosure wall, such as one formed of a transparent material layer, can separate the internal area from the external area. The display is visible through one of these transparent material layers.

[0006] These transparent material layers can be formed of glass or glass-ceramic and can consist of two opposing chemically reinforced surface layers of different thicknesses. A coating can be formed on the thinner of the two opposing chemically reinforced surface layers. The coating can have an oleophobic outer coating, an anti-reflective layer, and a scratch-resistant coating. The scratch-resistant layer can have one or more compressively stressed dielectric layers and correspondingly one or more gradient composition layers. These compressively stressed dielectric layers can help prevent damage such as scratches. These gradient composition layers can help promote adhesion, enhance scratch resistance, and reduce shear stress at the point where the coating contacts the transparent material layer. Attached Figure Description

[0007] Figure 1 It is a cross-sectional side view of an exemplary electronic device according to one embodiment.

[0008] Figure 2 This is a cross-sectional side view of an illustrative coated transparent layer according to one embodiment.

[0009] Figure 3 , Figure 4 , Figure 5 and Figure 6 An exemplary operation for coating a transparent layer is shown according to one embodiment.

[0010] Figure 7 , Figure 8 , Figure 9 and Figure 10 This is a cross-sectional side view of an illustrative coated transparent layer according to the implementation scheme. Detailed Implementation

[0011] Electronic devices may include a layer of transparent material. As an example, an electronic device with a display may have a transparent layer that overlaps with and protects the display. This type of protective layer (which may sometimes be called a display overlay) may be formed of glass, glass-ceramic (which may sometimes be called ceramic-hardened glass), or other transparent materials. Transparent layers such as these may also be used to form the back cover wall and / or other parts of the electronic device housing.

[0012] A cross-sectional side view of an exemplary electronic device that may include a transparent material layer. Figure 1 As shown in the figure. Electronic device 10 may be a computing device such as a laptop computer, a computer monitor including an embedded computer, a tablet computer, a cellular phone, a media player, or other handheld or portable electronic device, a smaller device such as a wristwatch, a pendant device, a headset or handset device, a device embedded in glasses or other equipment worn on a user's head, or other wearable or micro-devices, a television set, a computer monitor excluding an embedded computer, a gaming device, a navigation device, an embedded system (such as a system in which electronic equipment with a display is installed in an all-in-one machine or a car), equipment that enables the functionality of two or more of these devices, accessories (e.g., earbuds, remote controls, wireless touchpads, etc.), or other electronic equipment.

[0013] like Figure 1 As shown, device 10 may include components such as display 14. Display 14 may be mounted in housing 12. Housing 12 separates an internal region within device 10 from an external region surrounding device 10. Housing 12 (sometimes referred to as a shell or enclosure) may be formed of plastic, glass, glass-ceramic, ceramic, fiber composite, metal (e.g., stainless steel, aluminum, etc.), other suitable materials, or any combination of two or more of these materials. Housing 12 may be formed using a monolithic configuration in which a portion or all of housing 12 is machined or molded into a single structure, or it may be formed using multiple structures (e.g., an internal frame structure, one or more structures forming the surface of the outer housing, etc.).

[0014] Display 14 may be a touchscreen display incorporating conductive capacitive touch sensor electrodes or other touch sensor components (e.g., resistive touch sensor components, acoustic touch sensor components, force-based touch sensor components, light-based touch sensor components, etc.) or may be a non-touchscreen display. Display 14 may have a pixel array configured to display images. For example, display 14 may include a display panel, such as a display panel 14P including a pixel array. Display panel 14P may be a liquid crystal display panel, an organic light-emitting diode display panel, a light-emitting diode display panel formed from a crystalline semiconductor light-emitting diode wafer, or other display structures.

[0015] Device 10 may have one or more glass layers, glass-ceramic layers, or other transparent layers, such as layer 16. Figure 1 In the example, one layer of layer 16 covers the display panel 14P and serves as the display cover layer for the display 14, while another layer of layer 16 forms the rear housing wall. The inner surface of the rear housing wall may be covered with an opaque material to conceal the internal components of the device 10 from view. Figure 1 As shown, these internal components may include electronic components 20 mounted on one or more printed circuits, such as printed circuit 18. Components 20 may include control circuitry (e.g., integrated circuits, etc.), input / output devices (e.g., buttons, touch sensors, cameras and other sensors, output devices such as light-emitting diodes, speakers and haptic output devices), radio frequency wireless communication circuitry and other communication circuitry and / or other components.

[0016] Generally speaking, transparent structures such as layer 16 that form part of the housing of device 10 can be formed in any suitable part of device 10 (e.g., these transparent structures can form housing sidewalls, camera lenses, rear and / or front housing members, display overlays and / or other suitable transparent structures in device 10).

[0017] Because layer 16 has a surface exposed to the outside of device 10, the surface is susceptible to scratches, chipping, and / or other damage if device 10 is dropped, scratched with a hard object, or otherwise exposed to excessive abrasion. Layer 16 may be provided with a coating to help protect layer 16.

[0018] Figure 2 This is a cross-sectional side view of an exemplary transparent layer with a coating. (Example:) Figure 2As shown, layer 16 (e.g., a glass layer, a glass-ceramic layer, or other transparent layer) may be provided with a coating, such as coating 32. Coating 32 may include one or more sublayers, such as layer 34. Layer 34 may include a material layer that serves, for example, as an anti-scratch layer (sometimes referred to as a hard coating, anti-scratch coating layer, etc.), an anti-fog layer, an anti-reflective layer, an antistatic layer, and / or other coating. In some configurations, each of these functions may be implemented using a separate corresponding coating layer 34 or a single set of coating layers 34. In other configurations, a single layer 34 or a set of layers 34 may provide multiple functions.

[0019] In one exemplary arrangement (which may sometimes be described herein as an example), the outermost layer 34 of coating 32 may be a fluoropolymer coating (e.g., a fluoropolymer formed from vaporized perfluoropolyether) used as an oleophobic coating (e.g., an antifouling coating). The bottommost layer 34 of coating 32 may form an antiscratch coating. One or more layers in layer 34 between the oleophobic coating and the antiscratch coating may be configured to form an antireflective layer (e.g., a thin-film interference filter antireflective coating formed by stacking dielectric layers with different refractive index values ​​(such as refractive index values ​​alternating between higher and lower values)).

[0020] To help prevent scratches, the scratch-resistant portion of coating 32 may be formed of a hard material. As an example, this hard material may be a material with a greater hardness value than the clear layer 16, such as silicon nitride or silicon oxynitride. The scratch-resistant layer may be subjected to compressive stress, which helps prevent scratch damage and crack propagation (e.g., when the device 10 is subjected to stress from an unintended drop event and / or other contact with objects that can scratch, break, and / or otherwise damage the device 10). In one exemplary configuration, the amount of compressive stress in one or more portions of the scratch-resistant coating may be at least 400 MPa, at least 500 MPa, or at least 1000 MPa (as an example).

[0021] When coating 32 (e.g., due to including a scratch-resistant layer with a compressive stress of at least 400 MPa) includes a high level of compressive stress, there is a risk that this stress can deform layer 16. As an example, if layer 16 is a symmetrical uncoated glass or glass-ceramic layer and only one surface of layer 16 is coated, the compressive stress in the coating can cause that surface to become convex due to the bending of layer 16, as the coating under compressive stress expands in an attempt to relieve its inherent stress.

[0022] To counteract the tendency of layer 16 to acquire a convex outer surface in the presence of coating 32, layer 16 can be treated prior to coating deposition to create asymmetric built-in stresses on the opposing surface layers of layer 16. For example, the outward-facing surface layer can be configured to exhibit less compressive stress compared to the opposing inward-facing surface layer to compensate for the additional compressive stresses imposed on layer 16 by coating 32.

[0023] As an example, consider Figure 3 , Figure 4 , Figure 5 and Figure 6 An example of manufacturing operations.

[0024] Initially, layer 16 may be uncoated and untreated. Layer 16 may be, for example, unstrengthened and uncoated glass or glass-ceramic sheet, such as... Figure 3 As shown.

[0025] To help provide layer 16 with resistance to damage from drop events and localized scratches, the surface of layer 16 can be strengthened (e.g., by heat tempering and / or chemical strengthening). Figure 4 As shown, for example, layer 16 can be chemically strengthened to place the outer surface layer 16-1 and the opposing inner surface layer 16-2 of layer 16 relative to the core portion 16-3 of layer 16 under compressive stress, which is therefore under tensile stress. This can be achieved by... Figure 3 Layer 16 undergoes an ion exchange process to chemically strengthen it. During the ion exchange process, smaller ions in the glass are replaced by larger ions. For example, sodium ions in the glass at the exposed surface of layer 16 can be replaced by potassium ions. This generates compressive stress within the treated surface layer of layer 16.

[0026] Due to the chemical strengthening of layer 16 Figure 4 The compressive stresses generated in layers 16-1 and 16-2 are symmetrical. Therefore, the compressive stress in layer 16-1 is balanced by the equal compressive stress in layer 16-2, and layer 16 tends to remain undeformed (e.g., as shown in the image). Figure 4 (The plane shown). To prepare for the deposition of coating 32, which is expected to provide additional compressive stress, layer 16-1 can be thinned by polishing. (As shown) Figure 5 As shown, by thinning layer 16-1 while keeping the thickness of layer 16-2 constant, an unbalanced compressive stress environment is created. Layer 16-2 is thicker than the thinned layer 16-1, therefore layer 16-2 can expand outwards more than layer 16-1, causing layer 16 to bend in an arc shape, as shown... Figure 5As shown. Therefore, the outward-facing surface of layer 16 temporarily becomes slightly concave (for example, when layer 16 has a lateral dimension of about 5cm-30cm, the arcuate curvature of layer 16 can cause an inward offset of 0.1mm to 1mm relative to the edge of layer 16 in the middle of layer 16 (as an example).

[0027] After an asymmetric distribution of compressive stress is generated from the relatively chemically reinforced inner and outer surface layers of layer 16, coating 32 can be deposited on the surface of layer 16-1 (e.g., by depositing one or more layers 34 using physical vapor deposition techniques such as magnetron sputtering and / or other deposition techniques that apply compressive stress to the deposited material). Therefore, coating 32 will be subjected to compressive stress. Figure 6 As shown, the amount of compressive stress applied to layer 16 by coating 32 is configured to counteract the stress when layer 16-1 is in... Figure 5 The amount of compressive stress lost from layer 16-1 during the thinning process of the polishing operation. Therefore, the combined compressive stress of coating 32 and surface layer 16-1 will be equal to the compressive stress of surface layer 16-2. Because coating 32 and layer 16-1 are formed on the surface of layer 16 opposite to layer 16-2, layer 16 will have equal amounts of compressive stress on its inner and outer surfaces, and will therefore become planar (e.g., layer 16 will no longer be as...). Figure 5 The bow-shaped bend shown is used instead of the bow-shaped bend shown. Figure 6 The diagram will be characterized by flat, parallel inner and outer surfaces.

[0028] exist Figure 3 , Figure 4 , Figure 5 and Figure 6 In the exemplary configuration, use (in Figure 4 A symmetrical ion exchange process, which generates equal amounts of compressive stress in layers 16-1 and 16-2, generates asymmetric amounts of compressive stress in the upper and lower surfaces of layer 16. This is followed by selective thinning to reduce the thickness of layer 16-1, and thus reduces the amount of compressive stress on the upper surface of layer 16 relative to the amount of compressive stress on the lower surface. If desired, asymmetric compressive stress can be generated in layer 16 using an asymmetric ion exchange process (as a supplement or alternative to using asymmetric polishing techniques). For example, the first ion exchange process can be used to... Figure 4 A first amount of compressive stress is applied to layer 16-1, and a second ion exchange process can be used to apply a second amount of compressive stress to layer 16-2, wherein the second compressive stress is greater than the first compressive stress. After generating unequal compressive stresses in this manner, they can be combined as follows. Figure 6Deposited layer 32 as described. If desired, optional additional polishing may be applied to layer 16-1, such that layer 16-1 has less compressive stress due to: 1) using the first ion exchange process instead of the second ion exchange process, and 2) being polished more than layer 16-2. Generally, any suitable technique (e.g., using asymmetric polishing and / or using asymmetric ion exchange treatment) can be used to form surface layers 16-1 and 16-2 with different amounts of compressive stress to accommodate coating 32.

[0029] To incorporate sufficient compressive stress within coating 32 to resist damage, one or more high compressive stress layers 34 may be included in coating 32. These high-stress layers may be formed of hard materials such as silicon nitride and / or silicon oxynitride or other hard inorganic materials (as an example). The amount of compressive stress generated in these layers 34 may be at least 400 MPa, at least 500 MPa, at least 1000 MPa, 400 MPa-2000 MPa, 1200 MPa, less than 1500 MPa, etc. To reduce shear stress at the interfaces between layers 34, one or more layers in layer 34 may be gradient composition layers. Gradient composition layers may be characterized by a gradient composition and therefore other gradient properties (e.g., gradient refractive index, gradient stress, and gradient Young's modulus). The gradient composition and other properties of the gradient composition layer vary according to the depth through the layer. As an example, the gradient composition layer may vary gradually (e.g., continuously without steps or in a stepwise manner with many small steps) between a first composition at a first surface (such as the surface associated with the interface of the high-stress layer) and a second composition at a second surface (such as the surface associated with the interface of the outer surface of layer 16). The gradient composition layer may exhibit a change from a high amount at the first surface to a low amount at the second surface. In this way, shear stress at the interface within coating 32 can be reduced. For example, shear stress at the surface of layer 16 where coating 32 is deposited on layer 16 can be reduced by placing the gradient composition layer on the surface of layer 16, which acts as a buffer layer between layer 16 and the layers in coating 32 subjected to high compressive stress. The use of a gradient composition layer may also enhance adhesion (e.g., promote adhesion to layer 16) and may help enhance the overall scratch resistance of coating 32.

[0030] In some embodiments, in addition to including an anti-scratch coating formed of one or more high compressive stress layers and one or more gradient composition layers, an anti-reflective coating may be included in coating 32 and / or an oleophobic layer may be formed on the outer surface of coating 32. If desired, the scratch resistance of coating 32 may be enhanced by selecting a material with high fracture resistance, such as glass-ceramic or fracture-resistant glass, for layer 16. Exemplary configurations in which layer 16 is a glass-ceramic layer may sometimes be described herein as examples.

[0031] An exemplary coating for layer 16 is shown in... Figure 7 As shown in [the image]. Figure 7 In the example, coating 32 includes a stain-resistant layer, such as an oleophobic layer 34-1, that helps prevent fingerprints from being left on the exposed outer surface of device 10. For example, when layer 16 is used as a display cover layer overlapping the display panel 14P of display 14, a user can provide touch input to a touch sensor in display 14. When touch input is provided in this manner, the user's finger can press against the outer surface of the display cover layer. By using the oleophobic layer 34-1, the visibility of fingerprints is reduced, thereby helping to improve the visual quality of the image being viewed by the user on panel 14P.

[0032] A scratch-resistant layer 34-2 may be formed between the outward-facing surfaces of layer 34-1 and layer 16. Figure 7 In an exemplary configuration, the scratch-resistant layer 34-2 comprises a high compressive stress layer 34H and a gradient composition layer 34G (sometimes referred to as a gradient layer, gradient composition layer, gradient layer, etc.). Layer 34H may be formed from an inorganic dielectric under high compressive stress. As an example, layer 34H may be formed from silicon oxynitride (SiON). The compressive stress of layer 34H may be at least 400 MPa, 500 MPa, at least 250 MPa, at least 500 MPa, at least 1000 MPa, less than 1000 MPa, or other suitable values. The thickness of layer 34H may be 1800 nm or other suitable thicknesses (e.g., at least 900 nm, at least 1500 nm, less than 3600 nm, etc.). The gradient composition layer 34G may have a gradient composition that changes according to the distance traveled through layer 34G. At the interface between layers 34G and 34H, the composition of layer 34G may match the composition of layer 34H (e.g., layer 34G may be formed entirely or primarily of silicon oxynitride, the stoichiometry of which matches the stoichiometry of silicon oxynitride in layer 34H at that interface). At the interface between layer 34G and layer 16, layer 34G may have a composition that matches the composition of layer 16 (e.g., layer 34G may be formed entirely or primarily of silicon oxide at that interface). The silicon oxide may be, for example, SiO2, SiO, or a silicon oxide having another suitable stoichiometry. Between the two surfaces of layer 34G, the composition of layer 34G may be gradient and may smoothly and continuously, or in a series of small discrete steps, change from 100% silicon oxynitride (SiON) with a matching stoichiometry to layer 34H to 100% silicon oxide (SiO or SiO2, etc.) with a matching stoichiometry to layer 16.

[0033] The hardness and compressive stress of the material in the scratch-resistant layer 34-2 help to enhance the flexural strength of the layer 34-2 while resisting scratch damage. This satisfactory scratch resistance of the layer 34-2 can be achieved when it is formed of glass-ceramic (which has inherently high fracture resistance) or other glass forming layers 16 with high fracture resistance.

[0034] Figure 8 Another exemplary configuration of coating 32 is shown in the diagram. Figure 8 In the example, the scratch-resistant layer 34-2 comprises an upper high compressive stress layer 34H-1 and a lower high compressive stress layer 34H-2. Layer 34H-1 may be formed of an inorganic dielectric subject to high compressive stress, such as silicon nitride (SiN). The thickness of layer 34H-1 may be 500 nm, at least 250 nm, less than 1000 nm, or other suitable thickness. The compressive stress of layer 34H-1 may be 1000 MPa, at least 400 MPa, at least 500 MPa, at least 1000 MPa, less than 2000 MPa, or other suitable value. Layer 34H-2 may be formed of an inorganic dielectric subject to high compressive stress, such as silicon oxynitride (SiON). The thickness of layer 34H-2 may be 1000 nm, at least 500 nm, less than 2000 nm, or other suitable thickness. The compressive stress of layer 34H-2 may be 700 MPa, at least 350 MPa, at least 400 MPa, at least 500 MPa, less than 1400 MPa, less than 1000 MPa, or other suitable values.

[0035] The gradient layer 34G-1 may have a composition that varies from 100% (or nearly 100%) SiN at the interface with layer 34H-1 to 100% (or nearly 100%) SiON at the interface with layer 34H-2. The thickness of layer 34G-1 may be 300 nm, at least 150 nm, less than 600 nm, or other suitable thickness.

[0036] The gradient layer 34G-2 may have a composition that varies from 100% (or close to 100%) SiON at the interface with layer 34H-2 to 100% (or close to 100%) SiO at the interface with layer 16.

[0037] Using one or more gradient layers in layer 34-2 can help to gradually reduce the compressive stress in layer 34-2 according to the increasing distance from layer 34-1 through layer 16. Arranging gradient layers such as... Figure 7 and Figure 8In those cases, scratch resistance is achieved by generating high compressive stress (e.g., at least 250 MPa, at least 400 MPa, at least 500 MPa, at least 1000 MPa, etc.) near the outer surface of layer 34-2 and relatively low compressive stress at the interface with layer 16 (so that scratch resistance is not compromised by excessive shear stress at the interface between layer 34-2 and layer 16). The high-stressed portions of layer 34-2, such as the upper surface of layer 34H-1 or... Figure 8 The material under compressive stress at the upper surface of layer 34H-2 (or Figure 7 Compared to the portion of layer 34H under compressive stress at the upper surface of layer 34H, the stress of layer 34-2 at the interface with layer 16 may be at least 1%, at least 10%, at least 20%, at least 25%, at least 40%, or other suitable reduction.

[0038] The refractive index of SiON is greater than that of SiO (and typically greater than that of layer 16). The refractive index of SiN is greater than that of SiON. Because... Figure 7 SiON exists in layer 34H of layer 34-2, therefore Figure 7 The reflectivity of layer 16 with coating 32 can be about 6%, which contrasts with the uncoated glass that can exhibit a reflectivity of about 4%. Figure 8 The presence of SiN in layer 34H-1 of layer 34-2 can cause Figure 8 The reflectivity of layer 16 with coating 32 is approximately 10%.

[0039] To help increase the light transmittance of layer 16 when coated with coating 32 (e.g., so that layer 16 can be used as a display overlay layer for display 14), it is desirable to incorporate one or more thin-film dielectric layers, serving as anti-reflection layers for thin-film interference filters, into coating 32. Figure 9 In the exemplary configuration, coating 32 includes antireflective layer 34-3. Figure 9 The antireflective layer 34-3 comprises a stack of thin-film dielectric layers formed of three dielectric layers with alternating refractive index values. These layers include two layers 34L formed of a lower refractive index material such as SiO and a layer 34B of a higher refractive index material such as SiN sandwiched between the layers 34L. The thickness of the upper layer 34L can be 99.5 nm, the thickness of the layer 34B can be 166 nm, and the thickness of the lower layer 34L can be 10 nm (as an example). Figure 9 The coating 32 includes an anti-reflective layer such as anti-reflective layer 34-3, which can help reduce visible light reflectivity to 4%, less than 6%, less than 5%, less than 4%, less than 2%, or less than 1% (as an example).

[0040] Figure 9The 34H-1 layer can be a silicon nitride layer and can have a thickness of 393 nm, at least 200 nm, less than 800 nm, or other suitable thickness. Figure 9 Layer 34G-1 can be a gradient composition layer varying between 100% SiN (at the interface with layer 34H-1) and SiON with the same stoichiometry as the SiON in layer 34H-2 (at the interface with layer 34H-2). The thickness of layer 34G-1 can be 314 nm, at least 150 nm, less than 600 nm, or other suitable thicknesses. Figure 9 The 34H-2 layer can be a SiON layer and can have a thickness of 1000 nm, at least 500 nm, less than 2000 nm, or other suitable thickness. Figure 9 Layer 34G-2 can be a gradient composition layer varying between SiON (whose stoichiometry matches that of layer 34H-2) and 100% SiO (at the lower surface of the interface between layer 34H-2 and layer 16) at the interface with layer 34H-2. The thickness of layer 34G-2 can be 200 nm, at least 100 nm, less than 400 nm, or other suitable thicknesses.

[0041] If desired, the antireflective layer 34-3 can be formed by stacking alternating refractive index thin-film dielectric layers, including scratch-resistant materials. This type of arrangement is... Figure 10 As shown in the example. Figure 10 In this arrangement, the antireflective layer 34-3 is a thin-film interference filter configured to reduce visible light reflection from layer 16, and includes layers with alternating refractive indices, such as a lower refractive index layer 34L and a higher refractive index layer 34H. Layer 34-3 may contain any suitable number (e.g., at least 3, at least 5, at least 10, 10-20, less than 50, less than 30, less than 25, etc.) of stacked dielectric layers. As an example, 9-11 high refractive index layers may be present, interspersed with 9-11 low refractive index layers. Figure 9 Similar to the arrangement, the thickness and refractive index of the layers in the antireflective layer 34-3 can be selected to help reduce light reflection from coating 32 and layer 16 (e.g., to help reduce the reflectivity of layer 16 when coated with coating 32 to less than 5%, less than 4%, or less than 2%, as an example). Figure 10 Layer 34L can be formed of SiON with high compressive stress to help resist scratches. Layer 34H can be formed of SiN, which is a hard dielectric that helps resist scratches. Compared to an arrangement using a softer thin film layer in the antireflective layer 34-3, the ability of coating 32 to withstand scratches is enhanced by using these materials (e.g., materials that are at least as hard as SiON) to form the antireflective layer 34-3.

[0042] The stress values ​​of the coating formed on layer 16 can be averaged to produce an average stress value. In an exemplary configuration, the average compressive stress value of the coating layer on layer 16 is in the range of 677 MPa to 734 MPa (e.g., for...). Figure 7 (arrangement of the type shown) and 811MPa to 1031MPa (for Figure 8 , Figure 9 and Figure 10 (The arrangement shown). Lower and higher values ​​can be used if necessary (e.g., at least 500 MPa, less than 1400 MPa, etc.).

[0043] Figure 7 The hardness value of the silicon oxynitride layer (e.g., layer 34H) can be 1475HV / 15.934GPa, at least 1000HV, or less than 2000HV.

[0044] The refractive index of the silicon oxynitride in the coating may be 1.75, 1.7-1.8, or may have another suitable refractive index value (e.g., at a wavelength of 500 nm or other suitable visible light wavelengths).

[0045] Although sometimes described in the context of layer 16 formed of glass-ceramic material, layer 16 may be made of glass or have sufficient fracture toughness (e.g., greater than 0.9 MPa-m) if desired. 1 / 2 Other materials (or other suitable amounts and / or Young's modulus greater than 90 GPa or other suitable amounts) are formed.

[0046] As described above, one aspect of the present invention is the collection and use of information such as sensor information. This disclosure envisions, in some cases, the collection of data including personal information that uniquely identifies or can be used to contact or locate specific individuals. Such personal information data may include demographic data, location-based data, telephone numbers, email addresses, Twitter IDs, home addresses, data or records related to a user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, username, password, biometric information, or any other identifying information or personal information.

[0047] This disclosure recognizes that the use of such personal information within the technology disclosed herein can be used to benefit users. For example, the personal information data can be used to deliver targeted content that is of interest to the user. Therefore, the use of such personal information data enables users to have planned control over the content delivered. Furthermore, this disclosure also anticipates other uses of personal information data that are beneficial to users. For example, health and fitness data can be used to provide insights into a user's overall health status or as positive feedback for individuals using technology to pursue health goals.

[0048] This disclosure assumes that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as data collection and / or use change. Personal information from users should be collected for the entity's lawful and reasonable purposes and not shared or sold outside of these lawful uses. Furthermore, such collection / sharing should be conducted only after obtaining informed consent from users. Additionally, such entities should consider taking any necessary steps to protect and safeguard access to such personal information data and ensure that others with access to such personal information data comply with their privacy policies and processes. Furthermore, such entities may be subject to third-party evaluations to demonstrate their compliance with widely accepted privacy policies and practices. Additionally, policies and practices should be adapted to the specific types of personal information data collected and / or accessed, and to applicable laws and standards, including specific considerations regarding jurisdiction. For example, in the United States, the collection or access to certain health data may be governed by federal and / or state laws such as the Health Insurance and Accountability Act (HIPAA), while in other countries health data may be subject to other regulations and policies and should be processed accordingly. Therefore, different privacy practices should be maintained for different types of personal data in each country.

[0049] Regardless of the foregoing, this disclosure also anticipates implementation schemes for users to selectively block the use or access to their personal information data. That is, this disclosure anticipates providing hardware and / or software components to prevent or block access to such personal information data. For example, the technology may be configured to allow users to opt-in or opt-out at any time during or after registering for the service. Alternatively, users may choose not to provide specific types of user data. Furthermore, users may choose to limit the length of time user-specific data is retained. In addition to providing opt-in and opt-out options, this disclosure also envisions providing notifications related to access to or use of personal information. For example, users may be informed when downloading an application (“Application”) that their personal information data will be accessed, and then reminded again before the application accesses the personal information data.

[0050] Furthermore, the purpose of this disclosure is to manage and process personal information data to minimize the risk of unintentional or unauthorized access or use. Once data is no longer needed, this risk can be minimized by limiting data collection and deleting data. Additionally, and where applicable, including in certain health-related applications, data deidentification can be used to protect user privacy. Where appropriate, deidentification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or characteristics of stored data (e.g., collecting location data at the city level rather than address level), controlling how data is stored (e.g., aggregating data among users), and / or other methods.

[0051] Therefore, while this disclosure broadly covers the use of information, including personal information data, to implement one or more of the various disclosed embodiments, it is also contemplated that various embodiments can be implemented without accessing personal information data. That is, various embodiments of the present invention will not be rendered inoperable due to the absence of all or part of such personal information data.

[0052] According to one embodiment, a coated transparent layer is provided, comprising: a glass-ceramic layer; and a coating layer located on the glass-ceramic layer, the coating layer including a scratch-resistant layer comprising: a compressive stress layer; and a gradient composition layer extending from the compressive stress layer to the glass-ceramic layer.

[0053] According to another embodiment, the coating includes an oleophobic coating layer; an additional compressive stress layer; and an additional gradient composition layer located between the oleophobic coating layer and the additional gradient composition layer, the additional gradient composition layer extending from the additional compressive stress layer to the compressive stress layer.

[0054] According to another embodiment, the compressive stress layer comprises silicon oxynitride, and the additional compressive stress layer comprises silicon nitride.

[0055] According to another embodiment, the layer subjected to compressive stress comprises silicon oxynitride.

[0056] According to another embodiment, the glass-ceramic layer comprises a chemically reinforced first surface layer and a chemically reinforced second surface layer.

[0057] According to another embodiment, the chemically reinforced first surface layer is thinner than the chemically reinforced second surface layer.

[0058] According to another embodiment, the coating is located on the chemically reinforced first surface layer.

[0059] According to another embodiment, the compressive stress layer includes a silicon oxynitride layer, and the gradient composition layer has a composition that changes from silicon oxynitride to silicon oxide depending on the distance through the gradient composition layer.

[0060] According to another embodiment, the coated transparent layer includes an oleophobic layer and an antireflective layer located between the oleophobic layer and the compressive stress layer.

[0061] According to another embodiment, the antireflective coating includes alternating layers of a first dielectric and a second dielectric having corresponding first and second refractive index values.

[0062] According to another embodiment, the first dielectric comprises silicon oxynitride.

[0063] According to another embodiment, the second dielectric comprises silicon nitride.

[0064] According to another embodiment, the glass-ceramic layer comprises a relatively asymmetric chemically reinforced first surface layer and a chemically reinforced second surface layer, wherein the chemically reinforced first surface layer has lower compressive stress compared to the chemically reinforced second layer.

[0065] According to one embodiment, an electronic device is provided, comprising: a housing structure; a pixel array; and a display cover layer coupled to the housing structure and overlapping the pixel array, the display cover layer including a chemically reinforced layer having a chemically reinforced first surface layer and a chemically reinforced second surface layer having corresponding first and second thicknesses, wherein the first thickness is less than the second thickness; and a coating layer located on the first surface layer.

[0066] According to another embodiment, the coating includes a scratch-resistant layer having a dielectric layer under compressive stress and a gradient composition layer located between the dielectric layer under compressive stress and the first surface layer.

[0067] According to another embodiment, the compressive stress dielectric layer has opposing first and second surfaces, wherein the gradient composition layer has opposing first and second surfaces, the first surface of the gradient composition layer contacts the second surface of the compressive stress layer, the second surface of the gradient composition layer faces the first surface layer, the scratch-resistant layer is characterized by a first compressive stress at the first surface of the compressive stress dielectric layer, and is characterized by a second compressive stress at the second surface of the gradient composition layer, wherein the second compressive stress is at least 20% smaller than the first compressive stress.

[0068] According to another embodiment, the first compressive stress is at least 400 MPa.

[0069] According to another embodiment, the dielectric layer subjected to compressive stress comprises silicon and nitrogen.

[0070] According to another embodiment, the dielectric layer subjected to compressive stress includes oxygen.

[0071] According to another embodiment, the second surface of the gradient composition layer contacts the first surface layer.

[0072] According to another embodiment, the chemically strengthened layer comprises a chemically strengthened layer of ceramic-hardened glass, and wherein the coating comprises an oleophobic layer and an antireflective layer located between the oleophobic layer and the scratch-resistant layer.

[0073] According to another embodiment, the chemically reinforced layer has a strength of at least 0.9 MPa-m. 1 / 2 Fracture toughness.

[0074] According to one embodiment, an electronic device is provided, surrounded by an outer region and having an inner region, the electronic device comprising: a display; electronic components including a sensor located in the inner region; a chemically strengthened glass-ceramic layer located between the inner region and the outer region, the chemically strengthened glass-ceramic layer having a first surface layer and a second surface layer of relative compressive stress with corresponding first and second thicknesses, and the first surface layer of compressive stress being thinner than the second surface layer of compressive stress; and a scratch-resistant coating located on the first surface layer of compressive stress, the scratch-resistant coating comprising: a compressive-stressed dielectric layer having a compressive stress of at least 400 MPa; and a gradient composition layer located between the compressive-stressed dielectric layer and the first surface layer of compressive stress.

[0075] According to another embodiment, the compressive stress dielectric layer includes a compressive stress silicon oxynitride layer.

[0076] According to another embodiment, the scratch-resistant coating includes a silicon nitride layer subjected to compressive stress.

[0077] According to another embodiment, the dielectric layer subjected to compressive stress has a compressive stress of at least 1000 MPa.

[0078] According to one embodiment, an electronic device is provided, surrounded by an outer region and having an inner region, the electronic device comprising: a display; electronic components including a sensor located in the inner region; a chemically strengthened glass-ceramic layer located between the inner region and the outer region, the chemically strengthened glass-ceramic layer having a first surface layer and a second surface layer subjected to compressive stress, the first surface layer subjected to compressive stress having a smaller compressive stress than the second surface layer subjected to compressive stress; and a scratch-resistant coating located on the first surface layer subjected to compressive stress, the scratch-resistant coating comprising: a dielectric layer subjected to compressive stress.

[0079] According to another embodiment, the scratch-resistant coating has a compressive stress of at least 400 MPa.

[0080] According to another embodiment, the scratch-resistant coating includes a gradient composition layer located between the compressive stress dielectric layer and the compressive stress first surface layer.

[0081] The foregoing description is merely illustrative and various modifications can be made to the described implementation scheme. The described implementation scheme can be implemented independently or in any combination.

Claims

1. A coated transparent layer, comprising: A glass-ceramic layer, wherein the glass-ceramic layer comprises opposing chemically reinforced first surface layer and second surface layer, and wherein the chemically reinforced first surface layer is thinner than the chemically reinforced second surface layer; as well as A coating, the coating being located on the glass-ceramic, the coating comprising a scratch-resistant layer located on a chemically strengthened first surface layer, the scratch-resistant layer comprising: A layer subjected to compressive stress, wherein the layer subjected to compressive stress has a compressive stress of at least 400 MPa; as well as A gradient composition layer that extends from the compressive stress layer to the glass-ceramic layer.

2. The coated transparent layer according to claim 1, wherein the coating further comprises: Oleophobic coating; A layer subjected to additional compressive stress; as well as An additional gradient composition layer, wherein the additional compressive stress layer is located between the oleophobic coating layer and the additional gradient composition layer, and wherein the additional gradient composition layer extends from the additional compressive stress layer to the compressive stress layer.

3. The coated transparent layer of claim 2, wherein the compressive stress layer comprises silicon oxynitride, and wherein the additional compressive stress layer comprises silicon nitride.

4. The coated transparent layer according to claim 1, wherein the compressive stress-bearing layer comprises silicon oxynitride.

5. The coated transparent layer of claim 1, wherein the compressive stress-bearing layer comprises a silicon oxynitride layer, and wherein the gradient composition layer has a composition that changes from silicon oxynitride to silicon oxide according to the distance through the gradient composition layer.

6. An electronic device, comprising: Shell structure; Pixel array; as well as A display cover layer coupled to the housing structure and overlapping the pixel array, wherein the display cover layer includes a chemically reinforced layer having a chemically reinforced first surface layer and a chemically reinforced second surface layer with corresponding first and second thicknesses, and wherein the first thickness is less than the second thickness. as well as A coating is located on a chemically reinforced first surface layer, wherein the coating comprises a scratch-resistant layer having a compressive-stressed dielectric layer and a gradient composition layer located between the compressive-stressed dielectric layer and the chemically reinforced first surface layer, wherein the compressive-stressed dielectric layer has a compressive stress of at least 400 MPa.

7. The electronic device of claim 6, wherein the compressively stressed dielectric layer has opposing first and second surfaces, wherein the gradient composition layer has opposing first and second surfaces, wherein the first surface of the gradient composition layer contacts the second surface of the compressively stressed layer, wherein the second surface of the gradient composition layer faces the chemically reinforced first surface layer, wherein the scratch-resistant layer is characterized by a first compressive stress at the first surface of the compressively stressed dielectric layer, and is characterized by a second compressive stress at the second surface of the gradient composition layer, wherein the second compressive stress is at least 20% less than the first compressive stress.

8. The electronic device of claim 7, wherein the first compressive stress is at least 400 MPa.

9. The electronic device of claim 8, wherein the compressive stress-bearing dielectric layer comprises silicon and nitrogen.

10. The electronic device of claim 9, wherein the compressive stress-bearing dielectric layer comprises oxygen.

11. The electronic device of claim 6, wherein the chemically reinforced layer has a strength of at least 0.9 MPa-m. 1 / 2 Fracture toughness.

12. An electronic device surrounded by an outer region and having an inner region, the electronic device comprising: monitor; Electronic components, including sensors located in the internal region; A chemically strengthened glass-ceramic layer is located between the inner region and the outer region, wherein the chemically strengthened glass-ceramic layer has a first surface layer and a second surface layer subjected to compressive stress with corresponding first and second thicknesses, and wherein the first surface layer subjected to compressive stress is thinner than the second surface layer subjected to compressive stress. as well as A scratch-resistant coating, wherein the scratch-resistant coating is located on the first surface layer subjected to compressive stress, wherein the scratch-resistant coating comprises: A dielectric layer subjected to compressive stress, wherein the dielectric layer subjected to compressive stress has a compressive stress of at least 400 MPa; as well as A gradient composition layer is located between the compressive stress-exposed dielectric layer and the compressive stress-exposed first surface layer.

13. The electronic device of claim 12, wherein the dielectric layer subjected to compressive stress has a compressive stress of at least 1000 MPa.

14. An electronic device surrounded by an outer region and having an inner region, the electronic device comprising: monitor; Electronic components, including sensors located in the internal region; A chemically strengthened glass-ceramic layer is located between the inner region and the outer region, wherein the chemically strengthened glass-ceramic layer has a first surface layer and a second surface layer subjected to compressive stress, and wherein the first surface layer subjected to compressive stress has a smaller compressive stress than the second surface layer subjected to compressive stress. as well as A scratch-resistant coating, wherein the scratch-resistant coating is located on the first surface layer subjected to compressive stress, wherein the scratch-resistant coating comprises: A dielectric layer subjected to compressive stress, wherein the dielectric layer subjected to compressive stress has a compressive stress of at least 400 MPa; and A gradient composition layer is located between the compressive stress-exposed dielectric layer and the compressive stress-exposed first surface layer.

Images