Inspection apparatus and inspection method

Abstract

An inspection device (100) is an inspection device that generates a spatial distribution image of an electric field, and includes: an electric field acquisition unit (112) that acquires a spatial distribution of an electric field at at least one measurement position that is relatively determined with respect to a scan position, outside an object that generates the electric field; a scan unit (119) that acquires a measurement result of the spatial distribution of the electric field at a plurality of measurement positions that are relatively determined with respect to a plurality of scan positions, by causing the electric field acquisition unit (112) to perform scanning; and a calculation unit (102) that calculates a spatial distribution of the electric field of a region including a surface of the object, using the measurement result of the spatial distribution of the electric field as a boundary condition, and generates a spatial distribution image that represents the calculated spatial distribution.

Description

Technical Field

[0001] This disclosure relates to an inspection apparatus and method for non-contact visualization of electrical wiring. Background Technology

[0002] Conventionally, electrical wiring inspections have involved checking for the presence or absence of electrical continuity based on energization. The technology described in Patent Document 1 relates to such electrical wiring inspection. Specifically, in Patent Document 1, the normal continuity of the electrical wiring is checked based on terminal connection information and by utilizing an energization determination obtained through control of a voltage application unit.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-133410 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in real-world, complexly wound wiring, determining energization often relies solely on information about which wires are conducting, making it difficult to identify conducting and non-conducting wires within a complex wiring network. Therefore, this disclosure provides an inspection apparatus and method capable of extracting specific wires from a complexly wound wiring network based on measurement results from one or more electric field sensors positioned with gaps separating them from the network.

[0008] Methods for solving problems

[0009] For example, an inspection apparatus according to one aspect of this disclosure generates a spatial distribution image of an electric field, comprising: an electric field acquisition unit that measures the spatial distribution of the electric field at at least one measurement position relatively determined relative to a scanning position outside an object generating the electric field; a scanning unit that acquires measurement results of the spatial distribution of the electric field at multiple measurement positions relatively determined relative to multiple scanning positions by scanning with the electric field acquisition unit; and a calculation unit that uses the measurement results of the spatial distribution of the electric field as boundary conditions to calculate the spatial distribution of the electric field in a region including the surface of the object, and generates a spatial distribution image representing the calculated spatial distribution.

[0010] Furthermore, for example, in one aspect of the inspection system disclosed herein, one or more single electric field sensors are arranged in a one-dimensional or two-dimensional configuration to extract voltage-applied wiring in a wiring network by acquiring electric field distribution. The inspection system includes an electric field acquisition unit with single electric field sensors arranged in a one-dimensional or two-dimensional configuration, a scanning unit for scanning the electric field acquisition unit, a position measurement unit for measuring the distance between the electric field acquisition unit and the object being measured, a data recording unit for acquiring and storing the electric field distribution in each spatial coordinate as data during scanning, a calculation unit for outputting the electric field distribution inside and outside the wiring network when analyzing the basic equation of the electric field based on the recorded data, an output unit for displaying the output results, a display unit for displaying the output results, a cloud database for storing the measurement results, and a control unit for controlling each of these units.

[0011] Furthermore, these inclusive or specific methods can be implemented by non-transitory recording media such as systems, devices, methods, integrated circuits, computer programs, or computer-readable CD-ROMs, or by any combination of systems, devices, methods, integrated circuits, computer programs, and recording media.

[0012] Invention Effects

[0013] According to one aspect of this disclosure, it is possible to measure the electric field distribution in a region separated from the wiring network without contact, and to accurately identify specific wiring within the wiring network. Attached Figure Description

[0014] Figure 1 This is a schematic diagram showing the configuration of the inspection system in the implementation method.

[0015] Figure 2 This is a schematic diagram showing other components of the inspection system in the implementation method.

[0016] Figure 3 This is a flowchart illustrating the operation of the inspection system in the implementation method.

[0017] Figure 4 This is a schematic diagram showing the first example of the electric field acquisition unit in the embodiment.

[0018] Figure 5 This is a schematic diagram showing a second example of the electric field acquisition unit in the embodiment.

[0019] Figure 6 This is a schematic diagram showing a third example of the electric field acquisition unit in the implementation method.

[0020] Figure 7 This is a schematic diagram illustrating a fourth example of an electric field sensor in the implementation method.

[0021] Figure 8This is a schematic diagram illustrating the first example of reconstruction in the implementation method.

[0022] Figure 9 This is a schematic diagram illustrating a second example of reconstruction in the implementation method.

[0023] Figure 10 This is a schematic diagram illustrating the third example of reconstruction in the implementation method.

[0024] Figure 11 This is a schematic diagram illustrating the fourth example of reconstruction in the implementation method.

[0025] Figure 12 This is a schematic diagram illustrating the fifth example of reconstruction in the implementation method.

[0026] Figure 13 This is a schematic diagram illustrating the sixth example of reconstruction in the implementation method.

[0027] Figure 14 This is a schematic diagram illustrating the seventh example of reconstruction in the implementation method.

[0028] Figure 15 This is a schematic diagram illustrating the eighth example of reconstruction in the implementation method.

[0029] Figure 16 This is a schematic diagram illustrating the ninth example of reconstruction in the implementation method.

[0030] Figure 17 This is a schematic diagram illustrating the tenth example of reconstruction in the implementation method.

[0031] Figure 18 This is a schematic diagram illustrating an example of how the inspection system is used in the implementation.

[0032] Figure 19 This is a schematic diagram illustrating an example of a display monitor in an implementation scheme.

[0033] Figure 20 This is a schematic diagram showing an example of a map displaying the area where accumulated data in the database is checked in an implementation scheme. Detailed Implementation

[0034] Generally, determining whether a specific wiring in a complex wiring network is energized is done using a voltage control device that controls the on / off state of the opposite wiring by applying voltage to it. Energization is confirmed by monitoring the current flowing through the wiring. However, when applying voltage, it is generally possible to determine which wiring in the wiring network the voltage is applied to by bringing a single electric field sensor close to the network. But in the case of complex wiring networks, even if a single electric field sensor is brought close to the network, it is difficult to pinpoint the wiring to which a specific voltage is actually applied.

[0035] Therefore, for example, an inspection apparatus according to one aspect of the present disclosure generates a spatial distribution image of an electric field, comprising: an electric field acquisition unit that measures the spatial distribution of the electric field at at least one measurement position relatively determined relative to a scanning position outside the object generating the electric field; a scanning unit that acquires measurement results of the spatial distribution of the electric field at multiple measurement positions relatively determined relative to multiple scanning positions by scanning with the electric field acquisition unit; and a calculation unit that uses the measurement results of the spatial distribution of the electric field as boundary conditions to calculate the spatial distribution of the electric field in a region including the surface of the object, and generates a spatial distribution image representing the calculated spatial distribution.

[0036] Therefore, the inspection device can measure the spatial distribution of the electric field in areas far from the object, and accurately represent the spatial distribution of the electric field in areas closer to the object than the measurement location. Thus, for example, it is possible to measure the electric field distribution non-contactly in areas separated from the wiring network, and accurately identify specific wiring within the wiring network.

[0037] Furthermore, for example, in one aspect of the inspection system disclosed herein, one or more single electric field sensors are arranged in a one-dimensional or two-dimensional configuration to extract specific wiring of a wiring network by acquiring electric field distribution. The system includes an electric field acquisition unit with single electric field sensors arranged in a one-dimensional or two-dimensional configuration, a scanning unit that scans the electric field acquisition unit, a position measurement unit that measures the distance between the electric field acquisition unit and the object being measured, a data recording unit that acquires and stores the electric field distribution in each spatial coordinate as data during scanning, a calculation unit that outputs the electric field distribution inside and outside the wiring network when analyzing the basic equation of the electric field based on the recorded data, an output unit that displays the output results, a display unit that displays the output results, a cloud database that stores the measurement results, and a control unit that controls each of these units.

[0038] Therefore, the inspection system can identify and extract voltage-applied wirings within the wiring network based on data or images representing the electric field in a region closer to the wiring network than the electric field acquisition unit. It is assumed that the data or image accurately represents the location of the wiring where voltage is applied.

[0039] Furthermore, for example, the electric field acquisition unit is composed of a two-dimensional single electric field sensor array configured in a two-dimensional plane within a space surrounding the wiring network to be measured.

[0040] Therefore, the inspection system can fully acquire the spatial changes of the electric field through a two-dimensional single-field sensor array. Consequently, the inspection system can appropriately generate an image representing the electric field.

[0041] Furthermore, for example, the single electric field sensor array is constructed by a one-dimensional single electric field sensor array positioned on a one-dimensional straight line in the space surrounding the wiring network that is the object of measurement.

[0042] Therefore, the inspection system can properly inspect voltage-applied wiring buried in the wiring network with minimal resources and low cost.

[0043] Furthermore, for example, the electric field acquisition unit senses the electric field by a double-layer two-dimensional single electric field sensor array configured in two two-dimensional planes within the space surrounding the wiring network to be measured.

[0044] Therefore, the inspection system can properly obtain the gradient of the electric field in the vertical direction and can properly generate an image representing the electric field.

[0045] Furthermore, for example, the information processing circuit generates the image according to equation (5) described later, as an operational expression based on the perception result and the fundamental equation, in which E i (x, y, z) represents the electric field i at coordinate position (x, y, z), where i represents x, y, or z, z represents the z-coordinate value in a one-dimensional or two-dimensional region or two parallel two-dimensional regions where the electric field is measured, with the z-direction defined as the normal direction intersecting the wiring network region in the case of a one-dimensional region, the normal direction in the case of a two-dimensional region, or the normal direction in the case of two parallel two-dimensional regions. x represents the coordinate value in the x-direction orthogonal to the z-direction, and y represents the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction. f(k x k y ) represents E i The two-dimensional Fourier transform image of (x, y, 0), E i (x, y, 0) represents the perceived result on the (x, y, 0) surface, k x k represents the wavenumber associated with x. y This represents the wave number associated with y.

[0046] Therefore, the inspection system can use the measurement results to appropriately generate an image representing the electric field in a region closer to the wiring network than a single electric field sensor.

[0047] Furthermore, for example, the calculation unit generates the image according to the formula (9) described later, which is an operational expression based on the measurement results and the basic equation, wherein E i(x, y, z) represents the i-component of the electric field at coordinate position (x, y, z). i represents x, y, or z, z represents the z-coordinate value in a one-dimensional or two-dimensional region, or two parallel two-dimensional regions, where the z-direction is defined as the normal direction intersecting the wiring network region in the case of a one-dimensional region, the normal direction in the case of a two-dimensional region, or the normal direction in the case of two parallel two-dimensional regions. x represents the coordinate value in the x-direction orthogonal to the z-direction, and y represents the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction. f(k x k y ) represents E i The two-dimensional Fourier transform image of (x, y, 0) represents the measurement result on the measurement surface (x, y, 0), g(k x k y )express The two-dimensional Fourier transform image, k represents the gradient in the z-direction of the measurement result on the measurement surface (x, y, 0). x k represents the wavenumber associated with x. y This represents the wave number associated with y.

[0048] Therefore, the inspection system can use the measurement results and their gradient to appropriately generate an image representing the electric field in a region closer to the wiring network than the electric field acquisition section.

[0049] The embodiments will now be described using the accompanying drawings. Furthermore, the embodiments described below are either inclusive or specific examples. The numerical values, shapes, materials, constituent elements, their arrangement, connection methods, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the scope of the claims.

[0050] Furthermore, the electric field components described herein refer to the elements constituting the electric field. These components can also be individual electric fields among multiple overlapping electric fields within a larger electric field. Additionally, the apparatus described herein can also comprise multiple constituent elements arranged in a dispersed manner.

[0051] (Implementation Method)

[0052] Figure 1 This is a schematic diagram showing the configuration of the inspection system (inspection device) 100 in this embodiment. Figure 1 The inspection system 100 shown is a system for inspecting the electric field applied to the wiring. Figure 1 The complexly wound wiring shown at the bottom consists of wiring 117 without applied voltage (potential) and wiring 118 with applied voltage (potential).

[0053] The purpose of the inspection system 100 is to specifically target the voltage-bearing wiring 118 within the complexly wound wiring. When the electric field acquisition unit (electric field sensor unit) 112 of the inspection system 100 is brought close to the complexly wound wiring, a signal change occurs in the position measurement unit 116, a component of the inspection system 100. The signal output by the position measurement unit 116 corresponds one-to-one with the distance to the electric field acquisition unit 112. The signal output is sent to the control unit 104, another component of the inspection system 100, where it is converted into distance data and sent to the calculation unit 102. The position measurement unit 116 can be a laser displacement meter that measures distance based on laser interference, or a capacitive displacement meter that measures distance based on capacitance changes. Alternatively, it can be a contact switch that outputs a signal through contact. The electric field acquisition unit 112, positioned at a predetermined distance from the position measurement unit 116, measures the spatial distribution of the electric field generated by the voltage-bearing wiring 118, the object of measurement. The electric field acquisition unit 112 is composed of a single electric field sensor 113.

[0054] The single electric field sensor 113 outputs a signal corresponding to the intensity, orientation, and phase of the applied electric field. The single electric field sensor 113 can be a metal structure, metal sphere, metal plate, or metal needle that outputs a signal based on the intensity, orientation, and phase of the electric field. It can also be a component that, through a metal structure electrically connected to the gate electrode of an electric field-effect transistor, changes the source and drain currents of the transistor based on the intensity, orientation, and phase of the electric field. Furthermore, the single electric field sensor 113 can also be a photoelectric field sensor that changes the polarization plane of light based on the intensity, orientation, and phase of the electric field. It can also be a component that performs laser measurement on the energy splitting state that changes based on the intensity, orientation, and phase of the electric field, i.e., the energy splitting state caused by the Stark effect. Additionally, it can also be a single electric field sensor 113 that utilizes the effect of changes in the orbit of charged particles in a vacuum based on the intensity, orientation, and phase of the electric field.

[0055] (Two-dimensional sensors and two-dimensional measurement)

[0056] The single electric field sensor 113 may be a component arranged in two dimensions within the electric field acquisition section 112 in the measurement surface 114, which is located in a two-dimensional plane set in the space surrounding the object to be measured. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (5) described later.

[0057] Alternatively, at different positions along the normal direction of the two-dimensional plane, the "two-dimensionally arranged components of the single electric field sensor 113" can become two-stage components, enabling interaction with... Figure 8The electric field distribution is obtained at the measurement surface 114 and the second measurement surface 128 at different positions with different normal directions. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (9) described later.

[0058] In this case, the first-level single-field sensor 113 and the second-level single-field sensor 113 can be alternately arranged so that the first-level single-field sensor 113 is not obstructed by the second-level single-field sensor 113 when observed from the object being measured. When using the electric field acquisition unit 112, which contains the single-field sensors 113 arranged in a two-dimensional configuration, the two-dimensional distribution of one or two electric fields is measured, and the result is sent to the data recording unit 105. To acquire data at a higher resolution, the electric field acquisition unit 112 can be mechanically scanned (moved) by the scanning unit 119 to acquire data at different positions on the measurement surface 114 and interpolation can be performed. This allows for the acquisition of a higher resolution electric field distribution.

[0059] (One-dimensional sensors and two-dimensional measurement)

[0060] Furthermore, within the electric field acquisition unit 112, single electric field sensors 113 may be arranged one-dimensionally within a measurement surface 114, which is situated within a two-dimensional plane defined in the space surrounding the object to be measured. In this case, it is preferable that the direction in which the single electric field sensors 113 are arranged is parallel to or orthogonal to the voltage-applied wiring 118. To obtain a two-dimensional electric field distribution, the electric field acquisition unit 112, which encloses the one-dimensionally arranged single electric field sensors 113, may be scanned one-dimensionally along a direction orthogonal to the arrangement direction by the scanning unit 119. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (5) described later. In this case, to obtain higher resolution data, scanning may be performed simultaneously along the arrangement direction and in a direction orthogonal to the arrangement direction, or scanning may be performed alternately.

[0061] Alternatively, the distance between the measuring surface 114 and the measuring object can be varied, and the scanning unit 119 can repeat the above scanning to obtain two two-dimensional electric field distributions. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (9) described later. Using two two-dimensional electric field distributions, by implementing... Figure 8 The reconstruction shown is able to remove noise and apply voltage to wiring 118 more accurately.

[0062] (One-dimensional sensors and one-dimensional measurement)

[0063] Alternatively, one-dimensional electric field distribution data obtained by the electric field acquisition unit 112, which is arranged one-dimensionally by single electric field sensors 113, can be used to specifically apply voltage to the wiring 118 based on the calculation unit 102. However, in this case, it is preferable that the arrangement direction of the single electric field sensors 113 is orthogonal to the direction of the wiring 118 to which voltage is applied. In this case, the electric field distribution near the wiring 118 to which voltage is applied is calculated by the calculation unit 102 using equation (5a) described later.

[0064] In addition, to more accurately specify the wiring, one-dimensional electric field distribution data can be obtained by changing the position of the electric field acquisition section 112, which contains one-dimensional electric field sensors, along the direction of the normal to the arrangement direction of the one-dimensional single electric field sensor 113 that intersects the voltage-applied wiring 118.

[0065] In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (9a) described later. This allows for the removal of electric field noise and accurate wiring configuration. Compared to a two-dimensional arrangement of single electric field sensors 113, a one-dimensional arrangement of single electric field sensors 113 can achieve cost reduction.

[0066] (A sensor and two-dimensional measurement)

[0067] Furthermore, the electric field acquisition unit 112 may also include a single electric field sensor 113. Therefore, compared to a two-dimensional arrangement of single electric field sensors 113, a one-dimensional arrangement of single electric field sensors 113 can achieve cost reduction. Alternatively, the electric field acquisition unit 112, including a single electric field sensor 113, can scan two dimensions on the measurement surface 114 in a plane parallel to the voltage-applied wiring 118 using the scanning unit 119 to acquire a two-dimensional electric field distribution. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (5) described later. Therefore, compared to the inspection system 100 which includes an electric field acquisition unit 112 that includes a two-dimensional arrangement of single electric field sensors 113, cost reduction can be achieved.

[0068] Furthermore, to remove noise from the electric field, a two-dimensional scan can be performed within a measurement surface 114 parallel to the voltage-applied wiring 118 to obtain a two-dimensional electric field distribution. Then, the position of the measurement surface 114 in the direction of the normal is changed, and the single electric field sensor 113 is scanned again via the scanning unit 119 to obtain two different two-dimensional electric field distributions. Using these two two-dimensional electric field distributions, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (9) described later.

[0069] (A sensor and one-dimensional measurement)

[0070] In addition, such as Figure 2 As shown, the electric field acquisition unit 112 may also include a single electric field sensor 113. Therefore, compared to a two-dimensional arrangement of single electric field sensors 113, a one-dimensional arrangement of single electric field sensors 113 can achieve cost reduction. Alternatively, the electric field acquisition unit 112, including a single electric field sensor 113, can scan one-dimensionally along the orthogonal direction of the voltage-applied wiring 118 using the scanning unit 119 to acquire a one-dimensional electric field distribution. Figure 14 , Figure 16 or Figure 17 The reconstruction is shown. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (5a) described later. As a result, compared with the inspection system 100 which has an electric field acquisition unit 112 that includes an array of two-dimensional single electric field sensors 113, a lower cost can be achieved.

[0071] Furthermore, to remove noise from the electric field, a one-dimensional scan can be performed along the orthogonal direction of the voltage-applied wiring 118 to obtain a one-dimensional electric field distribution. Then, the position of the line intersecting the voltage-applied wiring 118 in the direction of the normal to the scan direction is changed, and the single electric field sensor 113 is scanned one-dimensionally again by the scanning unit 119, thereby obtaining two different one-dimensional electric field distributions. These two one-dimensional electric field distributions are then used to perform calculations in the calculation unit 102. In this case, the electric field distribution near the voltage-applied wiring 118 is calculated by the calculation unit 102 using equation (9a) described later.

[0072] (Processing flow)

[0073] Figure 3 It means Figure 1 The flowchart shows the operation of the inspection system 100. The inspection system 100 performs... Figure 3 The operation is as follows. First, after the measurement start button 135 on the touch panel, i.e., the display monitor 107, is pressed, the measurement begins (S101), and the electric field is sensed in the electric field acquisition unit 112 (S102). For example, the power supply to the electric field acquisition unit 112 may be turned on when the measurement start button 135 is pressed. The electric field acquisition unit 112 performs a one-dimensional scan or a two-dimensional scan by the scanning unit 119, or repeats the operation again in the measurement surface 114 at different positions to acquire one or two one-dimensional electric field distributions or two-dimensional electric field distributions (S103).

[0074] These data are sent and recorded to the data recording unit 105. Then, in the calculation unit 102, based on the solution to the equations for a constant or quasi-constant electric field, a one-dimensional or two-dimensional electric field distribution is calculated in the location closer to the object being measured, i.e., the voltage-applied wiring 118, than the electric field acquisition unit 112 (S104). At this time, the distance between the calculated one-dimensional or two-dimensional electric field distribution and the measurement surface 114 can also be the distance between the measurement surface 114 and the object being measured, obtained by the position measurement unit 116. Furthermore, an image representing the one-dimensional or two-dimensional electric field distribution can be generated as the calculation result.

[0075] The obtained calculation results are sent to the output unit 103 via the arithmetic unit 102 (S105) and displayed on the display monitor 107 (S106). In addition, the results are simultaneously sent from the output unit 103 to the database 106 in the cloud and saved (S107).

[0076] (Electric field sensor 1)

[0077] Figure 4 This illustrates an example of a single electric field sensor 113 housed within an electric field acquisition unit 112. The single electric field sensor 113 has a hole penetrating the interior and exterior of a hollow metal housing 121 at one location. A flat metal structure 120 is disposed inside the hole. The metal housing 121 is electrically grounded, and the metal structure 120 is connected to a preamplifier 126 (a current-to-voltage converter, a differential amplifier that adjusts and amplifies the offset voltage, and an amplifier that adjusts the output voltage), outputting a voltage signal corresponding to the electric field. The metal structure 120 can be needle-shaped, spherical, or have other three-dimensional shapes. The grounded metal housing 121 prevents interference, and the metal structure 120 can acquire a signal corresponding to a stable electric field.

[0078] (Electric field sensor, part 2)

[0079] Figure 5 This is another example of a single electric field sensor 113 housed within the electric field acquisition unit 112. The single electric field sensor 113 has a hole penetrating the interior and exterior of a hollow metal housing 121 at one location. A flat metal structure 120 is disposed inside the hole. The metal housing 121 is electrically grounded, and the metal structure 120 is connected to a preamplifier 126 (a current-to-voltage converter, a differential amplifier that adjusts and amplifies the offset voltage, and an amplifier that adjusts the output voltage), outputting a voltage signal corresponding to the electric field.

[0080] The metal housing 121 is equipped with an opening / closing device 125 that electrically controls the opening and closing of the metal structure 120 by applying an electric field only when the opening / closing device 125 is open. For example, the opening / closing device 125 may be alternately opened and closed by an electrical signal output from an oscillator 124. Furthermore, in the mixer 122, the output of a preamplifier 126, which corresponds to the electric field signal associated with the opening / closing, may be multiplied with the output obtained from the oscillator 124 as a reference signal. The low-frequency components of the mixer 122's output may also be detected in a low-pass filter (LPF) 123. This allows for the acquisition of a signal with reduced interference effects with high sensitivity. The opening / closing device 125 may be constructed from a piezoelectric element, or a motor may be used to move a metal plate moving on a guide rail back and forth.

[0081] The metal structure 120 can be needle-shaped, spherical, or have other three-dimensional shapes. The grounded metal housing 121 can prevent interference, and the metal structure 120 can obtain a signal corresponding to a stable electric field.

[0082] (Electric field sensor, part 3)

[0083] Figure 6 This illustrates an example of a one-dimensional arrangement of single electric field sensors 113 enclosed within the electric field acquisition unit 112. The arranged plurality of single electric field sensors 113 have holes penetrating the interior and exterior of a hollow metal housing 121 at multiple locations. Multiple flat metal structures 120 are disposed within the holes. The metal housing 121 is electrically grounded, and each metal structure 120 is connected to a preamplifier 126 (a current-to-voltage converter, a differential amplifier for adjusting and amplifying the offset voltage, and an amplifier for adjusting the output voltage) to output a voltage signal corresponding to the electric field.

[0084] The metal housing 121 is equipped with multiple openings and closing devices 125, which are electrically controlled to apply an electric field to the multiple metal structures 120 only when the multiple openings and closing devices 125 are open. For example, the multiple openings and closing devices 125 may open and close alternately and synchronously by an electrical signal output from one or more oscillators 124. Furthermore, in the multiple mixers 122, the outputs of multiple preamplifiers 126, which are signals corresponding to the electric field applied to each metal structure 120 according to the opening and closing, are multiplied with the outputs obtained from one or more oscillators 124 as a reference signal. Furthermore, the low-frequency components of the outputs of the multiple mixers 122 may be detected by multiple low-pass filters (LPFs) 123. Thus, the signal corresponding to the one-dimensional electric field distribution after reducing the influence of interference can be obtained with high sensitivity. The multiple openings and closing devices 125 may be composed of multiple piezoelectric elements, or multiple metal plates moving on a guide rail may be moved back and forth by a motor.

[0085] The multiple metal structures 120 can be needle-shaped, spherical, or have other three-dimensional shapes. The grounded metal casing 121 can prevent interference, and the multiple metal structures 120 can obtain data corresponding to a stable one-dimensional electric field distribution.

[0086] (Electric field sensor, part 4)

[0087] Figure 7 This illustrates an example of a one-dimensional arrangement of single electric field sensors 113 enclosed within the electric field acquisition unit 112. The arranged plurality of single electric field sensors 113 have holes penetrating the interior and exterior of a hollow metal housing 121 at multiple locations. Multiple flat metal structures 120 are disposed within the holes. The metal housing 121 is electrically grounded, and each metal structure 120 is connected to a preamplifier 126 (a current-to-voltage converter, a differential amplifier for adjusting and amplifying the offset voltage, and an amplifier for adjusting the output voltage) to output a voltage signal corresponding to the electric field.

[0088] A metal casing 121 is mounted on an oscillator 127 that vibrates vertically or horizontally, and is electrically controlled by an oscillator 124 to vibrate alternately. Alternatively, in a plurality of mixers 122, the outputs of a plurality of preamplifiers 126, which are signals corresponding to the vibrations of the electric fields applied to each metal structure 120 according to these vibrations, can be multiplied with the outputs obtained from one or more oscillators 124 as reference signals. Furthermore, low-frequency components of the outputs of the plurality of mixers 122 can be detected by a plurality of low-pass filters (LPFs) 123. Thus, a signal corresponding to a one-dimensional electric field distribution with reduced interference effects can be obtained with high sensitivity. In this case, the vertical component of the electric field is detected during vertical vibration, and the horizontal component of the electric field is detected during horizontal vibration. Furthermore, using equations (5), (5a), (9), or (9a) described later, the calculation unit 102 calculates the spatial distribution of the vertical component of the electric field in the vertical vibration and the electric field distribution of the horizontal component of the electric field in the horizontal vibration near the voltage-applied wiring 118.

[0089] The multiple metal structures 120 can be needle-shaped, spherical, or have other three-dimensional shapes. The grounded metal casing 121 can prevent interference, and the multiple metal structures 120 can obtain data corresponding to a stable one-dimensional electric field distribution.

[0090] (Reconstructing its 1-two-dimensional measurement results)

[0091] Figure 9 This is a schematic diagram illustrating an example of reconstruction in this embodiment. For example, in Figure 10In the example, the scanning unit 119 scans the "single electric field sensor 113 arranged one-dimensionally along a direction orthogonal to the complexly wound wiring" included in the electric field acquisition unit 112 of the inspection system 100, thereby enabling scanning of the two-dimensional measurement surface 114 above the voltage-applied wiring 118. This allows for the acquisition of the electric field measurement result in the two-dimensional measurement surface 114, i.e., the two-dimensional measurement result.

[0092] Figure 9 The measurement surface 114 and the reconstruction surface 115 in the xyz orthogonal coordinate system are shown. For example, the reconstruction surface 115 may be located in a region closer to the wiring mesh than the measurement surface 114, or it may correspond to the surface of the wiring mesh.

[0093] z is the coordinate value in the z-direction from the top of the inspection system 100 toward the bottom where the object to be measured exists; x is the coordinate value in the x-direction orthogonal to the z-direction; and y is the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction.

[0094] For example, the x-direction corresponds to the left-right direction of the inspection system 100, and the y-direction corresponds to the front-back direction of the inspection system 100. Alternatively, the x-direction corresponds to the front-back direction of the inspection system 100, and the y-direction corresponds to the left-right direction of the inspection system 100. Furthermore, the electric field is measured at z = 0. That is, z = 0 corresponds to the measurement surface 114.

[0095] For example, the fundamental equations for a constant and quasi-constant electric field in free space, where "the source of the electric field does not exist," are expressed through the Laplace equation. Specifically, the i-component of the electric field vector in the orthogonal xyz coordinate system, i.e., E... i (x, y, z), the following equation (1) holds.

[0096]

Mathematical Formula 1

[0097] ΔE i =0…(1)

[0098] For example, i is x, y, or z. Δ is the Laplace operator, also known as the Laplace element. The general solution of equation (1) above is the sum of terms that increase exponentially with respect to the z direction and terms that decrease exponentially with respect to the z direction, as shown in equation (2) below.

[0099]

Mathematical Formula 2

[0100]

[0101] In equation (2) above, k x and k y These represent the wavenumbers in the x-direction and y-direction, respectively. Furthermore, a(k) x ky ) and b(k x k y ) is from k x and k y The function represented. In this example, it is assumed that the electric field source exists on the positive side of the z-direction. Therefore, for convenience, the term that decays exponentially with respect to the z-direction is omitted. Thus, equation (2) is as shown in equation (3) below.

[0102]

Mathematical Expression 3

[0103]

[0104] For example, by measurement, the i-component of the electric field vector in the plane z=0, i.e., E, can be obtained. i (x, y, 0). Using E i (x, y, 0), as shown in equation (4) below, find a(k) of equation (3). x k y ).

[0105]

Mathematical Expression 4

[0106] a(k x ,k y )=f(k x ,k y (4)

[0107] Here, f(k) x k y ) is E i The two-dimensional Fourier transform image of (x, y, 0). By substituting equation (3) into equation (4), E is obtained as shown in equation (5) below. i (x, y, z).

[0108]

Mathematical Expression 5

[0109]

[0110] As mentioned above, equation (5) representing the electric field (specifically, the i-component of the electric field vector) is derived according to the perception results of the electric field, the fundamental equations of the constant electric field and the quasi-constant electric field.

[0111] That is, using E as a Dirichlet boundary condition. i (x, y, 0) allows us to derive the Laplace equations, which are the fundamental equations for the constant and quasi-constant electric fields in the free space. Specifically, it allows us to derive the E at any z-coordinate in a space where no electric field source exists. i(x, y, z). That is, based on the electric field in the xy plane, i.e. the measurement surface 114, where z = 0, it is possible to reconstruct the electric field in the reconstruction surface 115 near the voltage-applied wiring 118.

[0112] For example, E i (x, y, 0) can be obtained as a perception result in the measurement surface 114 where z = 0. Furthermore, this is achieved by e relative to the E obtained from the perception result. i Performing a two-dimensional Fourier transform on (x, y, 0) with respect to x and y, we can obtain f(k) x k y Furthermore, f(k) obtained through two-dimensional Fourier transform will be... x k y And the z-coordinate value of the reconstructed plane 115. a Substituting into equation (5), we can obtain E in the reconstructed surface 115. i (x, y, z) a Therefore, information about the electric field in the reconstructed surface 115 can be accurately obtained.

[0113] Finally, E in reconstruction surface 115 i (x, y, z) a As shown in equation (6) below.

[0114]

Mathematical Expression 6

[0115]

[0116] The arithmetic unit 102 can also generate E according to the above equation (6). i (x, y, z) a The image is presented as an image representing the electric field in the reconstructed surface 115.

[0117] In use Figure 9 , Figure 10 In the example described, one measuring surface 114 is used, but two measuring surfaces 114 can also be used.

[0118] (Reconstructing its two-dimensional measurement results)

[0119] The following uses Figure 8 as well as Figure 11 , to be explained in detail.

[0120] Figure 11 It means Figure 1This is a schematic diagram of an example of the electric field acquisition unit 112 of the enclosed single electric field sensor 113. In this example, by scanning the single electric field sensor 113, which is arranged one-dimensionally along the y-direction, along the x-direction (which is the scanning direction), the scanning unit 119 can acquire a two-dimensional electric field distribution in the measurement surface 114 above the complexly wound wiring and parallel to the complexly wound wiring. Alternatively, by changing the position in the z-direction in the scanning unit 119, a one-dimensional scan can be performed in the second measurement surface 128 to acquire two two-dimensional electric field distributions.

[0121] Thus, the measurement results of the two surfaces, measurement surface 114 and second measurement surface 128, can be obtained.

[0122] Figure 8 It means used for Figure 11 A schematic diagram of the reconstructed coordinate system is shown. Figure 8 In the diagram, two measurement surfaces 114 and 128, and a reconstruction surface 115 are shown in an orthogonal xyz coordinate system. Figure 10 Similarly, z is the coordinate value in the z-direction from the upper part of the electric field acquisition section 112 toward the lower part where the complexly wound wiring exists, x is the coordinate value in the x-direction orthogonal to the z-direction, and y is the coordinate value in the y-direction orthogonal to both the z and x directions. Furthermore, the electric field is sensed at z = 0 and z = d. That is, z = 0 and z = d correspond to the two surfaces, measurement surface 114 and the second measurement surface 128.

[0123] Furthermore, as mentioned above, the i-component of the electric field vector in the xyz orthogonal coordinate system, namely E... i (x, y, z), the above equation (1) holds. Furthermore, the general solution of the above equation (1) is shown in the above equation (2).

[0124] In this example, it is assumed that the electric field source exists on both the positive and negative sides of the z-direction. For example, there is a possibility that the electric field source of interest, which is the object of measurement, exists on the positive side of the z-direction, and that an electric field noise source exists on the negative side of the z-direction. Therefore, terms that decay exponentially with respect to the z-direction are omitted.

[0125] Furthermore, for example, by measurement, the i-component of the electric field vector in the plane z=0, i.e., E, can be obtained. i (x, y, 0) and the gradient in the z-direction of the i-component of the electric field vector, i.e. Using them, we can find a(k) of equation (2) as shown in equations (7) and (8) below. x k y ) and b(k x k y ).

[0126]

Mathematical Expression 7

[0127]

[0128]

Mathematical Expression 8

[0129]

[0130] In equations (7) and (8) above, f(k) x k y ) is E i The two-dimensional Fourier transform image of (x, y, 0), g(k x k y )yes The two-dimensional Fourier transform image. By substituting equation (2) into equations (7) and (8), E i (x, y, z) is obtained as shown in equation (9) below.

[0131]

Mathematical Expression 9

[0132]

[0133] As mentioned above, equation (9) representing the electric field (specifically, the i-component of the electric field vector) is derived from the perception of the electric field, the constant electric field of the free space, and the fundamental equations of the quasi-constant electric field.

[0134] That is, using E as a Dirichlet boundary condition. i (x, y, 0) and as von Neumann-type boundary conditions It is possible to find the solutions to the Laplace equations, which are the fundamental equations for the constant and quasi-constant electric fields in the free space. Specifically, it is possible to derive the E at any z-coordinate in a space where there is no source of electric field generation. i (x, y, z). That is, based on the electric field in the xy plane (i.e., the measurement surface 114) where z = 0 and the nearby measurement surface (i.e., the second measurement surface 128), it is possible to reconstruct the electric field in the reconstruction surface 115 near the voltage-applied wiring 118.

[0135] For example, E i (x, y, 0) is obtained as the perception result in the measurement surface 114 of z = 0. The result is calculated based on the perception results from the two surfaces, measurement surface 114 and the second measurement surface 128. For example, by obtaining the perception result from measurement surface 114 (z = 0) and the perception result from the second measurement surface 128 (z = d), the difference between the two results can be approximately obtained by dividing the difference by the distance d between measurement surfaces 114 and 128.

[0136] Furthermore, through E obtained relative to the perception result i (x, y, 0) and Performing a two-dimensional Fourier transform with respect to x and y yields f(k). x k y ) and g(k x k y Furthermore, f(k) obtained through two-dimensional Fourier transform will be... x k y ), g(k x k y And the z-coordinate value of the reconstructed plane 115. a Substituting into equation (9), we can obtain E in the reconstructed surface 115. i (x, y, z) a Therefore, information about the electric field in the reconstructed surface 115 can be accurately obtained.

[0137] Finally, E in reconstruction surface 115 i (x, y, z) a As shown in equation (10) below.

[0138]

Mathematical Formula 10

[0139]

[0140] The arithmetic unit 102 can also generate E according to the above equation (10). i (x, y, z) a The image is presented as an image representing the electric field in the reconstructed surface 115.

[0141] (Reconstructing its 3-dimensional measurement results)

[0142] Figure 12 This is a schematic diagram illustrating an example of reconstruction in this embodiment. Figure 12 In the example, by examining the single electric field sensor 113, which is orthogonal to the complexly wound wiring and arranged in one dimension within the electric field acquisition unit 112 of the system 100, it is possible to obtain the one-dimensional electric field distribution within the two-dimensional measurement surface 114 above the voltage-applied wiring 118. Figure 14 Indicates in Figure 12 When the electric field acquisition unit 112 includes a single electric field sensor 113, scanning is performed by the scanning unit 119 to acquire the electric field sensor 113. Figure 12 The same one-dimensional electric field distribution.

[0143] also, Figure 12 The straight lines on the measurement surface 114 and the reconstruction surface 115 in the xyz orthogonal coordinate system are shown.

[0144] z is the coordinate value in the z-direction when the direction of the line intersecting the direction of the voltage-applied wiring 118 is set as the normal line of the one-dimensional arrangement of the single electric field sensors 113 within the electric field acquisition unit 112 of the inspection system 100, x is the coordinate value in the x-direction orthogonal to the z-direction, and y is the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction.

[0145] For example, the y-direction corresponds to the one-dimensional arrangement direction of the single electric field sensor 113 of the inspection system 100, and the x-direction corresponds to its orthogonal direction. Furthermore, at z = 0, the one-dimensional electric field distribution is measured. That is, x = 0 and z = 0 correspond to the straight line on the measurement surface 114 where the data is acquired.

[0146] Here, the problem is reduced to two dimensions when it is possible to set up a scenario where no changes in the object are measured along the x-direction.

[0147] For example, the fundamental equations for a constant and quasi-constant electric field in free space, where "there is no source of electric field generation," are expressed using the two-dimensional Laplace equations. Specifically, the i-component of the electric field vector in the orthogonal yz coordinate system, namely E... i (y, z), the following equation (1a) holds.

[0148]

Mathematical Expression 11

[0149] △E i =0…(1a)

[0150] For example, i is y or z. Δ is the Laplace operator, also known as the Laplace element. The general solution of equation (1a) above is the sum of terms that increase exponentially with respect to the z direction and terms that decrease exponentially, as shown in equation (2a) below.

[0151]

Mathematical Expression 12

[0152]

[0153] In equation (2a) above, k y This shows the wave number in the y-direction. Furthermore, a(k) y ) and b(k y ) is from k y The function is represented by . In this example, it is assumed that the electric field source exists on the positive side in the z direction. Therefore, for convenience, the term that decays exponentially with respect to the z direction is omitted. Thus, equation (2a) is as shown in equation (3a) below.

[0154]

Mathematical Expression 13

[0155]

[0156] For example, by measurement, the i-component of the electric field vector in the plane z=0, i.e., E, can be obtained. i (y, 0). Using E i (y, 0), as shown in equation (4a) below, find a(k) of equation (3a). y ).

[0157]

Mathematical Expression 14

[0158] a(k y )=f(k y (4a)

[0159] Here, f(k) y ) is E i One-dimensional Fourier transform data of (y, 0). By substituting equation (3a) into equation (4a), E is obtained as shown in equation (5a) below. i (y, z).

[0160]

Mathematical Expression 15

[0161]

[0162] As mentioned above, equation (5a) representing the electric field (specifically, the i-component of the electric field vector) is derived from the fundamental equations of the electric field, the constant electric field, and the quasi-constant electric field, based on the perception results of the electric field.

[0163] That is, E using Dirichlet-type boundary conditions i (y, 0) allows us to derive the Laplace equations, which are the fundamental equations for the constant and quasi-constant electric fields in the free space. Specifically, it allows us to derive the E at any z-coordinate in a space where no electric field source exists. i (y, z). That is, based on the electric field distribution on the straight line in the measurement surface 114 where x = 0 and z = 0, it is possible to reconstruct the electric field distribution on the straight line in the reconstruction surface 115 near the voltage-applied wiring 118.

[0164] For example, E i (y, 0) is obtained as the perception result in the measurement surface 114 where z = 0. Furthermore, it is obtained relative to E from the perception result. i Performing a one-dimensional Fourier transform on (y, 0) with respect to y, we can obtain f(k). y Furthermore, f(k) obtained through one-dimensional Fourier transform will be... y And the z-coordinate value of the line on the reconstructed plane 115. a Substituting into equation (5a), we can obtain E on the straight line in the reconstructed surface 115. i (y, z) aTherefore, information on the electric field distribution on the straight line in the reconstructed surface 115 can be accurately obtained.

[0165] Finally, E in reconstruction surface 115 i (y, z) a As shown in equation (6a) below.

[0166]

Mathematical Expression 16

[0167]

[0168] The arithmetic unit 102 can also generate E from the above equation (6a). i (y, z) a The image is presented as an image representing the electric field on a straight line in the reconstructed surface 115.

[0169] In use Figure 12 , Figure 14 In the example described, data from a single line on one measurement surface 114 is used, but data from two lines on two measurement surfaces 114 and 128 can also be used.

[0170] (Reconstructing its 4-two one-dimensional measurement results)

[0171] The following uses Figure 13 as well as Figure 15 , to be explained in detail.

[0172] Figure 13 It means Figure 1 This is a schematic diagram of an example of the electric field acquisition unit 112 of the enclosed single electric field sensor 113. In this example, the single electric field sensor 113, arranged one-dimensionally along the y-direction, can acquire a one-dimensional electric field distribution on a straight line orthogonal to the voltage-applied wiring 118 in the measurement surface 114 above the voltage-applied wiring 118. Furthermore, by changing the position in the z-direction in the scanning unit 119, another one-dimensional electric field distribution can be acquired on a straight line in the second measurement surface 128. Figure 15 Indicates in Figure 13 When the electric field acquisition unit 112 includes a single electric field sensor 113, scanning performed by the scanning unit 119 can acquire the electric field sensor 113. Figure 13 The same one-dimensional electric field distribution.

[0173] Thus, different measurement results can be obtained for the two straight lines on the measuring surface 114 and the second measuring surface 128.

[0174] exist Figure 13 The figure shows the straight lines on the measurement surfaces 114 and 128, and the straight line on the reconstruction surface 115, in the xyz orthogonal coordinate system where the data was obtained or reconstructed.

[0175] z is the coordinate value in the z-direction when the direction of the line intersecting the direction of the voltage-applied wiring 118 is set as the normal line of the one-dimensional arrangement of the single electric field sensors 113 within the electric field acquisition unit 112 of the inspection system 100, x is the coordinate value in the x-direction orthogonal to the z-direction, and y is the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction.

[0176] For example, the y-direction corresponds to the one-dimensional arrangement direction of the single electric field sensor 113 of the inspection system 100, and the x-direction corresponds to its orthogonal direction. Furthermore, at z = 0, the one-dimensional electric field distribution is measured. That is, x = 0 and z = 0 correspond to the straight line on the measurement surface 114 where the data is acquired.

[0177] Furthermore, as mentioned above, the i-component of the electric field vector in the xyz orthogonal coordinate system, namely E... i (x, y, z), the above equation (1a) holds. Furthermore, the general solution of the above equation (1a) is shown in the above equation (2a).

[0178] In this example, it is assumed that the electric field source exists on both the positive and negative sides of the z-direction. For example, there is a possibility that the electric field source of interest, which is the object of measurement, exists on the positive side of the z-direction, and that an electric field noise source exists on the negative side of the z-direction. Therefore, terms that decay exponentially with respect to the z-direction are omitted.

[0179] Furthermore, for example, by measurement, the i-component of the electric field vector in the plane z=0, i.e., E, can be obtained. i (y, 0) and the gradient of the i-component of the electric field vector in the z-direction, i.e. Using them, we can find a(k) of equation (2a) as shown in equations (7a) and (8a) below. y ) and b(k y ).

[0180]

Mathematical Expression 17

[0181]

[0182]

Mathematical Expression 18

[0183]

[0184] In equations (7a) and (8a) above, f(k) y ) is E i The one-dimensional Fourier transform image of (y, 0), g(k y )yes The one-dimensional Fourier transform of E. By substituting equation (2a) into equations (7a) and (8a), E is obtained as shown in equation (9a) below. i (y, z).

[0185]

Mathematical Expression 19

[0186]

[0187] As mentioned above, equation (9a) representing the electric field (specifically, the i-component of the electric field vector) is derived from the perception of the electric field, the constant electric field of the free space, and the fundamental equations of the quasi-constant electric field.

[0188] That is, E using Dirichlet-type boundary conditions i (y, 0) and von Neumann-type boundary conditions It is possible to derive the solutions to the Laplace equations, which are the fundamental equations for the constant and quasi-constant electric fields in the free space. Specifically, it is possible to derive the E at any z-coordinate in a space where no electric field source exists. i (y, z). That is, based on the straight line (x = 0, z = 0) on the measurement surface 114 and the electric field on the straight line in the measurement surface near the measurement surface 114, namely the second measurement surface 128, it is possible to reconstruct the electric field on the straight line in the reconstruction surface 115 near the voltage-applied wiring 118.

[0189] For example, E i (y, 0) is obtained as the perception result on the straight line in the measurement surface 114 where z = 0. The result is calculated based on the perception results on the straight lines of the two surfaces, measurement surface 114 and the second measurement surface 128. For example, by obtaining the perception results on the straight line of measurement surface 114 (z = 0) and the perception results on the straight line of the second measurement surface 128 (z = d), and dividing the difference between them by the distance d between measurement surfaces 114 and 128, an approximate result is obtained.

[0190] Furthermore, through E obtained relative to the perception result i (y, 0) and Performing a one-dimensional Fourier transform related to y, we can obtain f(k) y ) and g(k y Furthermore, f(k) obtained through a one-dimensional Fourier transform will be... y ), g(k y And the z-coordinate value of the reconstructed plane 115. a Substituting into equation (9a), we can obtain E in the reconstructed surface 115. i (y, z) aTherefore, information about the electric field on the straight line in the reconstructed surface 115 can be accurately obtained.

[0191] Finally, E on the straight line in the reconstructed plane 115 i (y, z) a As shown in equation (10a) below.

[0192]

Mathematical Expression 20

[0193]

[0194] The arithmetic unit 102 can also generate E according to the above formula (10a). i (y, z) a The image is presented as data representing the electric field on the straight line in the reconstructed surface 115.

[0195] Figure 16 It shows Figure 1 This is one example of another method of the inspection system 100 shown. The position of the electric field acquisition unit 112 can also be identified by the spatial coordinate identification device 130, obtaining the electric field distribution along a straight line on the measurement surface 114. The spatial coordinate identification device 130 is as follows... Figure 17 As shown, for example, it can be a camera 131, or the position of the electric field acquisition unit 112 can be determined from the position of the field of view of the camera 131, and the electric field distribution can be obtained. By obtaining the one-dimensional electric field distribution, the one-dimensional electric field distribution near the voltage-applied wiring 118 can be calculated by the calculation unit 102 according to the above equations (5a) and (9a).

[0196] Figure 18 It shows Figure 1 This is one example of another embodiment of the inspection system 100 shown. The inspection system 100 may include a handheld bar, or it may have one-dimensionally arranged single electric field sensors 113, enclosed within the electric field acquisition unit 112, arranged orthogonally to the voltage-applied wiring 118 in the complexly wound wiring. Furthermore, a display monitor 107 with touch panel functionality may be provided on the surface opposite the electric field acquisition unit 112 in the inspection system 100. Thus, the operator can easily identify the voltage-applied wiring 118 from the complexly wound wiring.

[0197] Figure 19 An example of how a one-dimensional electric field distribution is displayed on the display monitor 107 is shown. Alternatively, in the display monitor 107, a grid is arranged in a one-dimensional manner and assigned colors corresponding to the electric field intensity. The display monitor 107 may have a touch panel function, and may also have buttons such as a save button 108, a map switching button 109, a color display / distribution map display switching button 110, an end button 111, and a measurement start button 135.

[0198] Figure 20 An example of data displayed on a map when the map switching button 109 among the buttons displayed on the display monitor 107 is pressed is shown. The inspection system 100 may have GPS functionality, displaying the measured location on the map, and may also display the value of the electric field strength calculated by the calculation unit 102. In addition, the displayed value may also be the on / off state of the power supply.

[0199] Furthermore, the components of the inspection system 100 can be constructed using dedicated hardware, general-purpose hardware that executes programs for the aforementioned processing, or a combination thereof. Additionally, the general-purpose hardware can be constructed using a memory containing a program and a general-purpose processor that reads the program from the memory and executes it. Here, the memory can be a semiconductor memory or a hard disk, and the general-purpose processor can be a CPU.

[0200] Furthermore, dedicated hardware can be constructed using memory and dedicated processors, among other things. For example, a dedicated processor can execute the aforementioned automatic operation control method, referring to the memory used for recording data.

[0201] Furthermore, the components of the inspection system 100 can be electrical circuits. These electrical circuits can be configured as a whole into a single electrical circuit, or they can be separate electrical circuits. Moreover, these electrical circuits can correspond to dedicated hardware or to general-purpose hardware that executes the aforementioned programs, etc.

[0202] Furthermore, while wiring or wiring networks are shown here as examples of objects that generate electric fields, the objects that generate electric fields are not limited to these examples. Various objects, such as electronic components, electrical circuits, and electrical equipment, can be used as objects that generate electric fields.

[0203] Industrial availability

[0204] One method disclosed herein is useful in inspection systems for investigating wiring under applied voltage, and can be applied to non-destructive inspections, etc.

[0205] Explanation of reference numerals in the attached figures

[0206] 100 Inspection System (Inspection Device)

[0207] 101 Control Device

[0208] 102 Computing Department

[0209] 103 Output Section

[0210] 104 Control Departments

[0211] 105 Data Recording Department

[0212] 106 Database

[0213] 107 Display Monitor

[0214] 108 Save button

[0215] 109 Map Switching Button

[0216] 110 Color Display / Distribution Map Display Switch Button

[0217] 111 End button

[0218] 112 Electric Field Acquisition Unit (Electric Field Sensor Unit)

[0219] 113 Single Electric Field Sensor

[0220] 114, 128 measuring surfaces

[0221] 115 Reconstruction Surface

[0222] 116 Position Measurement Unit

[0223] 117, 118 wiring

[0224] 119 Scanning Department

[0225] 120 Metal Structure

[0226] 121 Metal Casing

[0227] 122 Mixer

[0228] 123 Low-pass filter (LPF)

[0229] 124 oscillator

[0230] 125 switch

[0231] 126 preamplifier

[0232] 127 oscillator

[0233] 130 Spatial Coordinate Identification Device

[0234] 131 camera

[0235] 135 Measurement Start Button

Claims

1. An inspection device that generates a spatial distribution image of an electric field, comprising: The electric field acquisition unit measures the spatial distribution of the electric field at at least one measurement position, which is determined relative to the scanning position, outside the object that generates the electric field. The scanning unit acquires measurement results of the spatial distribution of the electric field at multiple measurement positions that are relatively determined relative to multiple scanning positions by scanning the electric field acquisition unit. as well as The calculation unit uses the measurement results of the spatial distribution of the electric field as boundary conditions to calculate the spatial distribution of the electric field in the region including the surface of the object, and generates a spatial distribution image representing the calculated spatial distribution. The scanning unit enables the electric field acquisition unit, which is composed of a single electric field sensor, to perform a two-dimensional scan of the inspection device in the left-right and front-back directions, thereby obtaining measurement results of the spatial distribution of the electric field at the plurality of measurement positions along the left-right and front-back directions of the inspection device. The computing unit, according to Mathematical Formula 1 Generate the spatial distribution image. E i (x, y, z) represents the i-component of the electric field at coordinate position (x, y, z), where i represents x, y, or z, z represents the coordinate value in the z-direction from the inspection device toward the object, x represents the coordinate value in the x-direction orthogonal to the z-direction, and y represents the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction, f(k x k y ) represents E i The two-dimensional Fourier transform image of (x, y, 0), E i (x, y, 0) represents the measurement result of the spatial distribution of the electric field on the measurement surface (x, y, 0), k x k represents the wavenumber associated with x. y This represents the wave number associated with y.

2. The inspection device according to claim 1, The scanning unit obtains measurement results of the spatial distribution of the electric field at the plurality of measurement positions in a layer along the front-back direction and the left-right direction of the inspection device.

3. A method for detecting the spatial distribution of an electric field. Outside the object generating the electric field, the spatial distribution of the electric field is measured at at least one measurement position, which is determined relatively relative to the scanning position, by means of an electric field acquisition unit. By scanning the electric field acquisition unit, measurement results are obtained of the spatial distribution of the electric field at multiple measurement positions that are relatively determined relative to multiple scanning positions. Using the measured spatial distribution of the electric field as boundary conditions, the spatial distribution of the electric field in the region including the surface of the object is calculated, and a spatial distribution image representing the calculated spatial distribution is generated. In the inspection method, an electric field acquisition unit, consisting of a single electric field sensor, performs a two-dimensional scan in the left-right and front-back directions of the inspection device equipped with the electric field acquisition unit, thereby obtaining measurement results of the spatial distribution of the electric field at multiple measurement positions along the left-right and front-back directions of the inspection device. The spatial distribution image is according to Mathematical formula 2 Generated, E i (x, y, z) represents the i-component of the electric field at coordinate position (x, y, z), where i represents x, y, or z, z represents the coordinate value in the z-direction from the inspection device toward the object, x represents the coordinate value in the x-direction orthogonal to the z-direction, and y represents the coordinate value in the y-direction orthogonal to both the z-direction and the x-direction, f(k x k y ) represents E i The two-dimensional Fourier transform image of (x, y, 0), E i (x, y, 0) represents the measurement result of the spatial distribution of the electric field on the measurement surface (x, y, 0), k x k represents the wavenumber associated with x. y This represents the wave number associated with y.

Images