antenna module

Abstract

An antenna module includes: a mounting substrate (120) that is a flat plate shape having a surface (Sf1) and a surface (Sf2); an RFIC (110) disposed on the surface (Sf1) side for supplying a high-frequency signal; a radiating electrode (121); and a molded resin (130) formed with an opening (Op) at a position of the mounting substrate (120) overlapping the radiating electrode (121) when the mounting substrate (120) is viewed from above, the molded resin (130) being filled around the radiating electrode (121) including within the opening (Op). A lens (Ln) is formed at a position of the molded resin (130) overlapping the radiating electrode (121) when the mounting substrate (120) is viewed from above and on the surface (Sf2) side.

Description

Technical Field

[0001] This disclosure relates to antenna modules with lenses and to techniques for improving antenna characteristics. Background Technology

[0002] Japanese Patent Application Publication No. 2009-081833 (Patent Document 1) discloses the structure of a wireless communication device equipped with a dielectric lens.

[0003] In the wireless communication device disclosed in Patent Document 1, an integrated antenna module with a patch antenna is housed within a housing. A dielectric lens is disposed on the outside of the housing in the direction in which the patch antenna radiates radio waves.

[0004] In the structure disclosed in Patent Document 1, a dielectric lens is used to change the path of the radio waves radiated from the patch antenna, thereby enabling arbitrary directionality.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2009-081833 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] In the wireless communication device of Patent Document 1, an air layer is formed between the patch antenna and the dielectric lens. In this case, at the interface between the air layer and the dielectric lens, an impedance mismatch occurs due to the difference in dielectric constant, which may cause reflection of radio waves. As a result, the antenna gain may be reduced.

[0010] This disclosure was made to solve such a problem, and its purpose is to suppress impedance mismatch caused by the lens in an antenna module with a lens, thereby improving the characteristics of the antenna.

[0011] Solution for solving the problem

[0012] An antenna module of one of the technical solutions disclosed herein includes a mounting substrate, a power supply circuit for supplying high-frequency signals, a radiating electrode, and a dielectric. The mounting substrate is a flat plate having a first surface and a second surface, and contains a conductor. The power supply circuit is disposed on the first surface of the mounting substrate and has a third surface opposite to the first surface. The radiating electrode is disposed on the third surface of the power supply circuit. An opening is formed on the mounting substrate at a position where it overlaps with the radiating electrode when viewed from above. The dielectric fills the area around the radiating electrode, which includes the opening. A lens portion is formed on the second surface of the mounting substrate at a position where the dielectric overlaps with the radiating electrode when viewed from above.

[0013] Another technical solution of this disclosure provides an antenna module including a mounting substrate, a power supply circuit for supplying high-frequency signals, a radiating electrode, a first dielectric, and a second dielectric. The mounting substrate is a flat plate having a first surface and a second surface, and contains a conductor. The power supply circuit is disposed on the first surface side of the mounting substrate and has a third surface opposite to the first surface. The radiating electrode is disposed on the third surface of the power supply circuit at a position that does not overlap with the conductor when viewed from above. The first dielectric fills the first surface side in contact with the radiating electrode and the first surface. The second dielectric fills the second surface side in contact with the second surface. A lens portion is formed on the second dielectric at a position on the second surface side of the mounting substrate where it overlaps with the radiating electrode when viewed from above.

[0014] The effects of the invention

[0015] In the lens-equipped antenna module of this disclosure, a dielectric material integrally formed with the lens portion is disposed on the second surface side of the mounting substrate, opposite to the first surface side where the radiating electrodes are disposed. Furthermore, the space between the lens portion and the radiating electrodes is filled by the dielectric material and / or the mounting substrate, without forming an air layer. With this structure, the dielectric constant does not change significantly until the electromagnetic wave radiated by the antenna element reaches the lens, thus preventing impedance mismatch and improving antenna characteristics. Attached Figure Description

[0016] Figure 1 This is an example of a block diagram of the communication device according to Embodiment 1.

[0017] Figure 2 This is a cross-sectional view of the antenna module in Embodiment 1. Figure 2 (A) and Figure 2 A top view of the mounting substrate, RFIC, and radiating electrodes in (A). Figure 2 (B)

[0018] Figure 3 This is a cross-sectional view of the antenna module in Embodiment 2. Figure 3 (A) and Figure 3 A top view of the mounting substrate, RFIC, and radiating electrodes in (A). Figure 3 (B)

[0019] Figure 4 This is a cross-sectional view of the antenna module according to embodiment 3.

[0020] Figure 5 This is a cross-sectional view of the antenna module in embodiment 4. Figure 5 (A) and Figure 5A top view of the mounting substrate, RFIC, and radiating electrodes in (A). Figure 5 (B)

[0021] Figure 6 This is a cross-sectional view of the antenna module according to embodiment 5.

[0022] Figure 7 This is a cross-sectional view of the antenna module according to embodiment 6.

[0023] Figure 8 This is a cross-sectional view of the antenna module according to embodiment 7.

[0024] Figure 9 This is a cross-sectional view of the antenna module in embodiment 8. Figure 9 (A) and Figure 9 Top view of the RFIC and radiation electrodes in (A) Figure 9 (B) Detailed Implementation

[0025] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, identical or equivalent parts in the drawings will be labeled with the same reference numerals and will not be described again.

[0026] [Implementation Method 1]

[0027] (Basic structure of a communication device)

[0028] Figure 1 This is an example of a block diagram of the communication device 10 according to Embodiment 1. The communication device 10 is, for example, a portable terminal such as a mobile phone, smartphone, or tablet computer, a personal computer with communication capabilities, a base station, or smart glasses. An example of the frequency band of the radio waves used by the antenna module 100 of Embodiment 1 is a millimeter wave with a center frequency of, for example, 28 GHz, 39 GHz, and 60 GHz, but radio waves in other frequency bands can also be used.

[0029] Reference Figure 1 The communication device 10 includes an antenna module 100 and a baseband signal processing circuitry BBIC 200. The antenna module 100 includes an RFIC 110 for supplying high-frequency signals. The communication device 10 up-converts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal in the RFIC 110, and radiates it from the radiating electrode 121. Additionally, the communication device 10 transmits the high-frequency signal received using the radiating electrode 121 to the RFIC 110, and processes the signal using the BBIC 200 after down-conversion.

[0030] exist Figure 1For ease of explanation, only the structures corresponding to four of the multiple radiation electrodes 121 of the antenna module 100 are shown; structures corresponding to the other radiation electrodes 121 having the same structure are omitted. Furthermore, in Figure 1 The illustration shows an example of multiple radiating electrodes 121 arranged in a two-dimensional array, but the radiating electrodes 121 do not necessarily need to be multiple; the antenna module 100 may also have a single radiating electrode 121. Alternatively, multiple radiating electrodes 121 may be arranged in a one-dimensional array in a column. In Embodiment 1, an example of a patch antenna with a generally square planar radiating electrode 121 is described, but the shape of the radiating electrode 121 may also be a circle, ellipse, or hexagon, or other polygons.

[0031] RFIC 110 includes switches 111A-111D, 113A-113D, 117, power amplifiers 112AT-112DT, low-noise amplifiers 112AR-112DR, attenuators 114A-114D, phase shifters 115A-115D, signal synthesizer / demultiplexer 116, mixer 118, and amplifier circuit 119.

[0032] When transmitting high-frequency signals, switches 111A-111D and 113A-113D switch to the power amplifiers 112AT-112DT, and switch 117 is connected to the transmitting amplifier of amplifier circuit 119. When receiving high-frequency signals, switches 111A-111D and 113A-113D switch to the low-noise amplifiers 112AR-112DR, and switch 117 is connected to the receiving amplifier of amplifier circuit 119.

[0033] The signal from BBIC 200 is amplified by amplifier circuit 119 and up-converted by mixer 118. The high-frequency signal obtained from the up-conversion is split into four signals by signal synthesizer / demultiplexer 116, and supplied to different radiating electrodes 121 through four signal paths. At this time, the directivity of radiating electrodes 121 can be adjusted by adjusting the phase shift of phase shifters 115A to 115D arranged in each signal path. In addition, attenuators 114A to 114D adjust the strength of the transmitted signal.

[0034] The received high-frequency signals received by each radiating electrode 121 are combined by a signal synthesizer / demultiplexer 116 via four different signal paths. The combined received signals are down-converted by a mixer 118, amplified by an amplifier circuit 119, and then transmitted to the BBIC 200.

[0035] RFIC 110 may be configured as a single-chip integrated circuit component, for example, containing the circuit structure described above. Alternatively, for the devices (switches, power amplifiers, low-noise amplifiers, attenuators, phase shifters) corresponding to each radiation electrode 121 of RFIC 110, a single-chip integrated circuit component may also be configured for each corresponding radiation electrode 121.

[0036] (Construction of the antenna module)

[0037] Next, use Figure 2 ,illustrate Figure 1 Details of antenna module 100. Figure 2 This is a cross-sectional view of the antenna module 100 according to Embodiment 1. Figure 2 (A) and Figure 2 A top view of the mounting substrate 120, RFIC 110, and radiating electrode 121 in (A). Figure 2 (B)

[0038] like Figure 2 As shown in (A), antenna module 100 is a lens antenna including lens Ln. Antenna module 100 includes a flat mounting substrate 120, RFIC 110, and molding resin 130. Molding resin 130 fills the area around radiating electrode 121 and mounting substrate 120. A convex lens Ln is formed in molding resin 130. Lens Ln has a hemispherical shape arranged to protrude from molding resin 130. Alternatively, the shape of lens Ln may be concave rather than convex.

[0039] Furthermore, in the following description, the thickness direction of the mounting substrate 120 will be defined as the Z-axis direction, and the surfaces perpendicular to the Z-axis direction will be defined as the X-axis and Y-axis. Additionally, there are cases where the positive direction of the Z-axis in each figure is referred to as the upper surface side, and the negative direction as the lower surface side. The molding resin 130 corresponds to the "dielectric" of this disclosure, and the RFIC 110 corresponds to the "power supply circuit" of this disclosure.

[0040] The mounting substrate 120 is, for example, a substrate with a dielectric substrate. The substrate of the mounting substrate 120 is, for example, a resin such as epoxy or polyimide. Alternatively, the substrate of the mounting substrate 120 may also be a resin with a lower dielectric constant, such as liquid crystal polymer (LCP), fluorine-based resin, PET (Polyethylene Terephthalate) material, or low temperature co-fired ceramic (LTCC). Figure 2The mounting substrate 120 shown is a single layer, but as will be explained later, it may also be a multilayer resin substrate formed by stacking multiple layers of these resins. Furthermore, the substrate forming the mounting substrate 120 may also be a substrate other than resin.

[0041] Mounting substrate 120 is a substrate containing a conductor 120G inside. The conductor 120G is a conductor arranged almost entirely across the flat surface of the mounting substrate 120 on the XY plane, and is a conductor that becomes ground potential. An RFIC 110 is mounted on the negative Z-axis side surface Sf1 of the mounting substrate 120. Electronic components 150A and 150B are mounted on the positive Z-axis side surface Sf2 of the mounting substrate 120. The RFIC 110 is electrically connected to the mounting substrate 120 via a connecting member 160.

[0042] RFIC 110 includes a semiconductor substrate such as silicon, a conductor layer, a dielectric layer, a protective film, etc. For example... Figure 2 As shown, RFIC110 has a surface Sf3 opposite to surface Sf1 of the mounting substrate 120. Figure 2 In this example, the connecting member 160 is formed by multiple solder bumps. The connecting member 160 is connected to terminals (not shown) disposed on surface Sf1 of the mounting substrate 120 and surface Sf3 of the RFIC 110. Thus, the mounting substrate 120 is electrically connected to the RFIC 110. Connecting terminals 170A and 170B are formed on surface Sf1 of the Z-axis of the mounting substrate 120, and the mounting substrate 120 is connected to external substrates, etc., via connecting terminals 170A and 170B. Furthermore, surface Sf1 corresponds to the "first surface" of this disclosure, surface Sf2 corresponds to the "second surface" of this disclosure, and surface Sf3 corresponds to the "third surface" of this disclosure.

[0043] Any one of the plurality of brazed bumps included in the connecting member 160 transmits a high-frequency signal to the radiating electrode 121. The brazed bump transmitting the high-frequency signal can also be capacitively coupled to a wiring pattern (not shown) disposed within a layer inside the RFIC 110. In this case, the high-frequency signal is transmitted to the radiating electrode 121 via this wiring pattern. Furthermore, the wiring pattern and the radiating electrode 121 can also be capacitively coupled. Moreover, the power supply method for supplying power to the radiating electrode 121 is not limited to... Figure 2 The configuration is shown. For example, the radiating electrode 121 can also be powered using a through-silicon vib (TSV). That is, the radiating electrode 121 can also be connected to the mounting substrate 120 using a through-electrode that passes through the RFIC 110.

[0044] In the antenna module 100 of Embodiment 1, a radiating electrode 121 is disposed on surface Sf3 of the RFIC 110. The radiating electrode 121 is formed of a single radiating element. An opening Op is formed between the radiating electrode 121 and the lens Ln on the mounting substrate 120. Figure 2 As shown in (B), when the mounting substrate 120 is viewed from the positive Z-axis direction, the radiating electrode 121 is disposed within the opening Op. Figure 2 As shown in (A), molding resin 130 fills the mounting substrate 120 on the Sf1 side, the Sf2 side, and the opening Op, contacting the radiating electrode 121. Thus, electronic components and the like mounted on the mounting substrate 120 are fixed by the molding resin 130, improving mechanical strength. The substrate forming the molding resin 130 is, for example, a thermosetting resin such as epoxy resin. Alternatively, the substrate forming the molding resin 130 can be other materials.

[0045] The molding resin 130 is covered by a sputtering shield 140. The sputtering shield 140 is formed by depositing a Cu-containing metal material onto the surface of the molding resin 130 via sputtering. The metal material used to form the sputtering shield 140 can also be a metal material containing Au or Ag. The sputtering shield 140 is formed to cover the region R2 in the molding resin 130 where the lens Ln is not formed. Figure 2 For ease of explanation, only the XY and YZ planes of the molding resin 130 are shown for region R2, but region R2 includes the XZ plane of the molding resin 130 and the corners and edges formed by each plane. That is, region R2 is the region other than region R1 on the surface of the molding resin 130 where the lens Ln is formed.

[0046] Sputtering shield 140 is formed on region R2. Furthermore, sputtering shield 140 does not cover region R1 in the molding resin 130 where lens Ln is formed. In other words, lens Ln is not covered by sputtering shield 140.

[0047] exist Figure 2 Signals are transmitted between the electronic components 150A and 150B and the mounting substrate 120. When signals are transmitted between the electronic components 150A and 150B and the mounting substrate 120, unwanted radio waves may radiate from the electronic components 150A and 150B. In the antenna module 100, a sputtering shield 140 is disposed at a position overlapping the electronic components 150A and 150B when viewed from above the mounting substrate 120. In other words, the electronic components 150A and 150B are covered by the sputtering shield 140. Therefore, in the antenna module 100, the radiation of radio waves radiated from the electronic components 150A and 150B to the outside of the antenna module 100 can be suppressed. Furthermore, the sputtering shield 140 corresponds to the "conductive layer" of this disclosure.

[0048] The lens Ln is circular when viewed from above the mounting substrate 120. At the periphery of the lens Ln, which is convex at its edge and contacts the sputtering shield 140, Figure 2 In example (A), the illustration shows ends P1 and P2. When viewed from above on the mounting substrate 120, the lens Ln is circular, so end P2 is located at the position furthest from end P1.

[0049] Angle Ag1 is the angle between the direction from the radiating electrode 121 toward end P1 and the direction from the radiating electrode 121 toward end P2. The angle radiated by the radiating electrode 121, which is a patch antenna, is typically 120 degrees or less. Therefore, if the lens Ln is configured with an angle Ag1 exceeding 120 degrees, the lens Ln has an area where radio waves cannot pass through. Therefore, in the antenna module 100, the radiating electrode 121 and the lens Ln are configured such that the angle Ag1 between the direction from the radiating electrode 121 toward end P1 and the direction from the radiating electrode 121 toward end P2 is 120 degrees or less. Furthermore, the opening Op formed in the mounting substrate 120 is formed in such a way that the straight line connecting the radiating electrode 121 and end P1 does not overlap with the straight line connecting the radiating electrode 121 and end P2. This prevents the size of the lens Ln, which is not covered by the sputtering shield 140, from unnecessarily increasing. That is, it can prevent radio waves radiated from electronic components 150A and 150B from radiating to the outside of antenna module 100 via lens Ln.

[0050] As described above, a convex lens Ln is formed on the molding resin 130 at a position where it overlaps with the radiating electrode 121 when viewed from above the mounting substrate 120. The molding resin 130 having the lens Ln is formed using a mold. For example, a shape corresponding to the lens Ln is formed in the mold, resin is poured into the mold, and the resin is cured to form the molding resin 130 having the lens Ln.

[0051] Lens Ln improves the convergence of the high-frequency signal radiated from radiating electrode 121. In other words, lens Ln changes the beam shape of the high-frequency signal radiated by radiating electrode 121, thereby increasing gain. That is, when the molding resin 130 has lens Ln, the gain of antenna module 100 is improved compared to when the molding resin 130 does not have lens Ln. Furthermore, when the shape of lens Ln is concave, the beam width is widened.

[0052] In the antenna module 100, the molding resin 130 is formed in a solid manner between the lens Ln and the radiating electrode 121. Additionally, Figure 2In this example, the molding resin 130 is formed from a single layer of resin with a uniform dielectric constant. Therefore, the dielectric constant does not change significantly between the lens Ln, which includes the opening Op, and the radiating electrode 121. Radiated electromagnetic waves are typically reflected when passing through regions with large changes in dielectric constant. The greater the change in dielectric constant, the easier it is for the radiated electromagnetic waves to be reflected. That is, the antenna gain decreases. Figure 2 In this example, the molding resin 130 between the lens Ln and the radiating electrode 121 is formed of a single layer of resin with a uniform dielectric constant, thus making it difficult to reflect the electromagnetic waves radiated by the radiating electrode 121. That is, there is no interface between the lens Ln and the radiating electrode 121 where the dielectric constant differs significantly from that of the object. An interface, for example, is the boundary between the molding resin 130 with a higher dielectric constant and an air layer with a lower dielectric constant, and is a surface that generates impedance mismatch. In the antenna module 100, there is no interface with a large change in dielectric constant, thus impedance mismatch can be suppressed, and electromagnetic wave reflection can be suppressed.

[0053] Thus, in the antenna module 100 of Embodiment 1, the molding resin 130 is solid between the radiating electrode 121 and the lens Ln, and there is no interface between objects with significantly different dielectric constants. Therefore, compared to the case where an air layer is formed between the radiating electrode 121 and the lens Ln, the electromagnetic waves radiated from the radiating electrode 121 are less likely to be reflected. That is, in the antenna module 100, the reduction in antenna gain is suppressed. Consequently, in the antenna module 100, the antenna characteristics are improved.

[0054] In the Z-axis direction, the radiating electrode 121 and the lens Ln are positioned at a distance D1 apart. When the wavelength of the high-frequency signal supplied by the RFIC 110 is set to λ, the distance D1 is a length of 1λ or more. Therefore, compared with the case where the distance between the radiating electrode 121 and the lens Ln is less than 1λ, the distance the radio wave radiates from the lens Ln is longer. That is, the function of the lens Ln is improved in the antenna module 100.

[0055] Furthermore, in the antenna module 100, the RFIC 110 is disposed on the Sf1 side of the mounting substrate 120. Here, we consider the case where the RFIC 110 is disposed on the Sf2 side of the mounting substrate 120, and a distance D1 is maintained between the lens Ln and the radiating electrode 121. In this case, to ensure the distance D1, the lens Ln needs to be positioned relative to... Figure 2 The state further shifts towards the positive direction of the Z-axis. That is, there is a possibility that the thickness of the antenna module 100 itself in the Z-axis direction increases. On the other hand, in the antenna module 100 of this embodiment, the RFIC 110 is disposed on the surface Sf1 side of the mounting substrate 120, so it is not necessary to move the arrangement of the lens Ln to ensure the distance D1. Therefore, it is possible to achieve a low height of the antenna module 100 while ensuring the distance D1.

[0056] Increasing the distance D1 improves the function of the lens Ln; however, if the distance D1 becomes too long, the wavelength of electromagnetic waves that resonate within the shielding increases. This makes it easier for unwanted resonances to occur, interfering with the electromagnetic waves radiated from the radiating electrode 121. Therefore, in the antenna module 100, it is desirable that the distance D1 between the lens Ln and the radiating electrode 121 is 1λ or more, and less than 10λ. This allows the antenna module 100 to improve the function of the lens Ln while suppressing unwanted resonances.

[0057] also, Figure 2 The molding resin 130 does not necessarily have to be formed from a uniform substrate. For example, the molding resin 130 may be formed from multiple substrates in a stepped layer. In this case, the substrates forming each layer of the molding resin 130 are selected such that the difference in dielectric constant between adjacent substrates is within a predetermined range. As a result, the reflection of electromagnetic waves between the substrates can be suppressed.

[0058] The layer closest to the negative Z-axis direction among the layers forming the molding resin 130, and the layer in contact with the radiation electrode 121, is formed of a first substrate with a relatively high dielectric constant. A second substrate layer with a lower dielectric constant than the first substrate is disposed on the positive Z-axis direction side of the first substrate layer. The difference between the dielectric constants of the first and second substrates represents the degree to which they form an interface that minimizes electromagnetic wave reflection. Furthermore, a third substrate layer with a lower dielectric constant than the second substrate is disposed on the positive Z-axis direction side of the second substrate layer. The difference between the dielectric constants of the second and third substrates represents the degree to which they form an interface that minimizes electromagnetic wave reflection.

[0059] Thus, the molding resin 130 has a stepped layer with a gradually decreasing dielectric constant, thereby suppressing the situation where the amount of electromagnetic wave reflection increases at the interface between the radiating electrode 121 and the lens Ln. In other words, the molding resin 130 may also comprise multiple substrates and be formed in a manner in which the dielectric constants of the multiple substrates are gradually varied in layers.

[0060] [Implementation Method 2]

[0061] In the antenna module 100 of Embodiment 1, the following structure is described: an opening Op is formed in the mounting substrate 120 between the lens Ln and the radiating electrode 121. In Embodiment 2, the following structure is described: no opening is formed in the mounting substrate 120 between the lens Ln and the radiating electrode 121, and the antenna gain is not reduced. Furthermore, in the antenna module 100A of Embodiment 2, the structure described is not repeated in the antenna module 100 of Embodiment 1.

[0062] Figure 3This is a cross-sectional view of the antenna module 100A according to Embodiment 2. Figure 3 (A) and Figure 3 Top view of mounting base 120 in (A) Figure 3 (B)

[0063] The mounting substrate 120 of the antenna module 100A is not formed Figure 2 An opening as shown. Therefore, as Figure 3 As shown in (B), when the mounting substrate 120 is viewed from the positive Z-axis direction, the radiation electrode 121 is covered by the mounting substrate 120.

[0064] like Figure 3 As shown, a mounting substrate 120 is disposed between the radiating electrode 121 and the lens Ln. However, the conductor 120G contained within the mounting substrate 120 is not disposed between the radiating electrode 121 and the lens Ln. In other words, in Figure 3 In the example, in the mounting substrate 120, in Figure 2 The region with the opening Op is provided with a mounting substrate 120 that does not contain conductor 120G.

[0065] That is, the radiating electrode 121 is positioned so as not to overlap with the conductor 120G when viewed from above the mounting substrate 120. Furthermore, the radiating electrode 121 is positioned so as not to overlap with the electronic components 150A and 150B when viewed from above the mounting substrate 120. Therefore, electromagnetic waves radiated from the radiating electrode 121 toward the lens Ln are not blocked by the conductor 120G and the electronic components 150A and 150B.

[0066] Thus, in antenna module 100A, no opening is formed in mounting substrate 120, and the space on surface Sf1 of mounting substrate 120 is separated from the space on surface Sf2 of mounting substrate 120 by mounting substrate 120. Therefore, in antenna module 100A, molding resin 130A and molding resin 130B fill the spaces on surface Sf1 and surface Sf2 covered by sputtering shield 140, respectively.

[0067] The filled molding resin 130A is disposed in contact with the radiating electrode 121 and the surface Sf1. The filled molding resin 130B is disposed in contact with the surface Sf2. In the molding resin 130B, the area between the lens Ln and the surface Sf2 of the mounting substrate 120 is solid. Conversely, in the molding resin 130A, the area between the radiating electrode 121 and the surface Sf1 of the mounting substrate 120 is solid.

[0068] Starting from the negative Z-axis side, molding resin 130A, a mounting substrate 120 without conductor 120G, and molding resin 130B are sequentially disposed between the radiating electrode 121 and the lens Ln. As described above, the mounting substrate 120 is formed of resins such as epoxy and polyimide. That is, the difference in dielectric constant between the mounting substrate 120 and the molding resins 130A and 130B is smaller than the difference in dielectric constant between air and the molding resins 130A and 130B.

[0069] Therefore, compared to the case where there is an air layer between the lens Ln and the radiating electrode 121, the dielectric constant does not change significantly between the lens Ln and the radiating electrode 121 in the antenna module 100A. That is, in the antenna module 100A, there is no interface with a large change in dielectric constant, as seen at the interface between the air layer and the molding resin, thus suppressing impedance mismatch and electromagnetic wave reflection.

[0070] Thus, in the antenna module 100A of Embodiment 2, the conductor 120G and electronic components 150A and 150B are positioned so as not to overlap with the radiating electrode 121 when viewed from above the mounting substrate 120. Furthermore, the space between the lens Ln and the surface Sf2, and between the radiating electrode 121 and the surface Sf1, is filled by the mounting substrate 120 and the molding resins 130A and 130B. This allows for the suppression of reflections of electromagnetic waves radiated from the radiating electrode 121 without forming an opening in the mounting substrate 120, and also suppresses the reduction of antenna gain. Therefore, the antenna characteristics are improved in the antenna module 100A. Furthermore, the molding resin 130A corresponds to the "first dielectric" of this disclosure, and the molding resin 130B corresponds to the "second dielectric" of this disclosure.

[0071] [Implementation Method 3]

[0072] In the antenna module 100 of Embodiment 1, a structure is described in which only molding resin 130 is filled between the RFIC 110 and the electronic component 150A or electronic component 150B. In Embodiment 3, a structure is described using conductive shielding components 180A and 180B to suppress unwanted resonance. Furthermore, in the antenna module 100B of Embodiment 3, the description of the structure that is repeated with the antenna module 100 of Embodiment 1 is not repeated.

[0073] Figure 4 This is a cross-sectional view of the antenna module 100B according to embodiment 3. Figure 4As shown, a conductive shielding member 180A is disposed in the portion of the molding resin 130 that overlaps with the lens Ln when viewed from above the mounting substrate 120, between the region R3 and the electronic component 150A. Additionally, a conductive shielding member 180B is disposed between region R3 and the electronic component 150B. The conductive shielding members 180A and 180B are formed of conductive materials. The conductive shielding members 180A and 180B are connected to ground potential. Furthermore, the region R3 of the molding resin 130 that overlaps with the lens Ln when viewed from above the mounting substrate 120 corresponds to the "third region" of this disclosure.

[0074] exist Figure 4 In the antenna module 100B shown, conductive shielding components 180A and 180B have a wall shape. That is, conductive shielding components 180A and 180B have a length in the Y-axis direction, dividing the area filled with molding resin 130 into three parts. Conductive shielding components 180A and 180B block radio waves generated from electronic components 150A and 150B, suppressing noise generation. RFIC 110, electronic components 150A and 150B are respectively disposed in independent spaces separated by conductive shielding components 180A and 180B. Figure 4 As shown, it is desirable that the conductive shields 180A and 180B form independent spaces disposed between and separated from the sputtering shield 140 and the mounting substrate 120, but openings may also be formed in parts of the conductive shields 180A and 180B.

[0075] Furthermore, the conductive shielding elements 180A and 180B can be any shape other than a wall shape, as long as they can block electromagnetic waves. For example, the conductive shielding elements 180A and 180B can also be columnar, linear, or mesh-like. A columnar shape refers to at least one rod-shaped element disposed between the mounting substrate 120 and the sputtering shielding element 140. When the conductive shielding elements 180A and 180B are columnar, compared to the case where they are wall-shaped, noise generation can be suppressed without blocking the area where the RFIC 110 and electronic components 150A and 150B are disposed, while reducing manufacturing costs. When the conductive shielding elements 180A and 180B are columnar, multiple columns can also be disposed between the RFIC 110 and the electronic components 150A and 150B.

[0076] The linear shape is formed by at least one conductive wire that is thinner than the cylindrical shape. When the conductive shielding members 180A and 180B are linear, they can also be formed by multiple wires extending in the Y-axis direction. The conductive shielding members 180A and 180B correspond to the "conductive members" of this disclosure. By configuring the conductive shielding members 180A and 180B, unwanted resonance of the electromagnetic waves radiated relative to the radiating electrode 121 can be suppressed. Furthermore, by configuring the conductive shielding members 180A and 180B, heat generated at the electronic components 150A and 150B can be transferred to the outside of the antenna module 100B via the conductive shielding members 180A and 180B, thereby improving heat dissipation efficiency in the antenna module 100B.

[0077] Focusing on the conductive shield 180A, the conductive shield 180A is positioned on the side of the radiating electrode 121. That is, the distance D3 between the conductive shield 180A and the radiating electrode 121 is shorter than the distance D2 between the conductive shield 180A and the electronic component 150A. In other words, distance D2 is longer than distance D3. Thus, because distance D2 is longer than distance D3, the distance from the radiating electrode 121 to the conductive shield 180A in the antenna module 100B is shortened, narrowing the frequency band of the radio waves resonating with the radio waves radiated from the radiating electrode 121. In other words, the generation of unwanted resonances can be suppressed in the antenna module 100B.

[0078] When considering the conductive shield 180B, it is positioned near the electronic component 150B. Specifically, the distance D5 between the conductive shield 180B and the electronic component 150B is shorter than the distance D4 between the conductive shield 180B and the radiating electrode 121. In other words, distance D4 is longer than distance D5. This longer distance D4 improves the heat dissipation efficiency of the electronic component 150B within the antenna module 100B.

[0079] Furthermore, the conductive shielding elements 180A and 180B are not limited to shapes having length in the Y-axis direction, but can also have shapes having length in the X-axis direction. For example, the conductive shielding elements can also be formed in a way that surrounds the opening Op. This allows for more reliable suppression of unwanted resonances.

[0080] [Implementation Method 4]

[0081] In the antenna module 100 of Embodiment 1, the structure of the radiating electrode 121 being a single patch antenna is described. In Embodiment 4, the structure of the antenna module 100C having multiple radiating elements is described. Furthermore, in the antenna module 100C of Embodiment 4, the structural description that is repeated with that of the antenna module 100 of Embodiment 1 is not repeated.

[0082] Figure 5 This is a cross-sectional view of the antenna module 100C according to embodiment 4. Figure 5 (A) and Figure 5 A top view of the mounting substrate 120, RFIC 110, and radiating electrode 121C in (A). Figure 5 (B)). For example Figure 5 As shown, in antenna module 100C, a radiating electrode 121C is disposed on surface Sf3 on the positive Z-axis side of RFIC 110. (As shown...) Figure 5 (A) and Figure 5 As shown in (B), the radiating electrode 121C includes a plurality of radiating elements 122A to 122H arranged in a two-dimensional pattern. That is, the radiating electrode 121C forms an array antenna.

[0083] Angle Ag2 is the angle formed by the direction from the radiating element 122A toward the end P1 and the positive direction of the Z-axis. Angle Ag3 is the angle formed by the direction from the radiating element 122D toward the end P2 and the positive direction of the Z-axis. As described above, the angle radiated by the patch antenna is typically 120 degrees or less. Therefore, in the antenna module 100C, the radiating electrode 121C and the lens Ln are arranged such that the angle formed by adding angle Ag3 and angle Ag2 is 120 degrees or less. In addition, the opening Op formed in the mounting substrate 120 is formed in such a way that the straight line connecting the radiating element 122A and the end P1 does not overlap with the straight line connecting the radiating element 122D and the end P2. As a result, it is possible to prevent the size of the lens Ln, which is not covered by the sputtering shield 140, from unnecessarily increasing. That is, it is possible to prevent radio waves radiated from the electronic components 150A and 150B from radiating to the outside of the antenna module 100C via the lens Ln.

[0084] In the antenna module 100C with such an array-type antenna, the molding resin 130 is solid between the radiating electrode 121C and the lens Ln, eliminating the interface between objects with significantly different dielectric constants. Therefore, compared to the case where an air layer is formed between the radiating electrode 121C and the lens Ln, the proportion of reflected electromagnetic waves radiated from the radiating electrode 121C is reduced. Consequently, there are no regions with significant variations in dielectric constant, thus suppressing electromagnetic wave reflection, improving antenna characteristics, and enabling beamforming using multiple radiating elements.

[0085] [Implementation Method 5]

[0086] In the antenna module 100 of Embodiment 1, a structure in which a convex lens Ln is formed in the molding resin 130 is described. In Embodiment 5, a structure in which a lens LnC, which serves as a planar lens, is formed in the molding resin 130 is described. Furthermore, in the antenna module 100D of Embodiment 5, the description of the structure that is repeated with that of the antenna module 100 of Embodiment 1 is not repeated.

[0087] Figure 6 This is a cross-sectional view of the antenna module 100D according to embodiment 5. (As shown...) Figure 6 As shown, in antenna module 100D, the lens LnC formed in molding resin 130 is a planar lens.

[0088] A planar lens is a planar lens with a lens effect, formed from metamaterials or similar materials. Metamaterials are artificial materials that possess electromagnetic or optical properties not found in naturally occurring substances. Metamaterials have properties such as negative permeability (μ < 0), negative dielectric constant (ε < 0), or negative refractive index (when both permeability and dielectric constant are negative). Therefore, even with a planar shape, the path of radio waves radiated from the radiating electrode 121 can be altered. In the example of antenna module 100D, lens LnC is formed from an FSS (Frequency-Selective Surface), but it can also be a planar lens formed from other manufacturing methods and materials.

[0089] In the antenna module 100D with a planar lens, the molding resin 130 is solid between the radiating electrode 121 and the lens LnC, eliminating the interface between objects with significantly different dielectric constants. Therefore, compared to the case where an air layer is formed between the radiating electrode 121 and the lens LnC, the proportion of reflected electromagnetic waves radiated from the radiating electrode 121 is reduced. Since the dielectric constant between the lens LnC and the radiating electrode 121 does not change significantly, there are no regions with large variations in dielectric constant, thus suppressing electromagnetic wave reflection and improving antenna characteristics. Furthermore, the use of a planar lens further reduces the antenna's height.

[0090] [Implementation Method 6]

[0091] In the antenna module 100 of Embodiment 1, a structure is described in which a connecting member 160, which connects the RFIC 110 and the mounting substrate 120, is disposed between the mounting substrate 120 and the RFIC 110. In Embodiment 6, an antenna module 100E having a structure formed by adding an intermediate member 190 to the structure of the antenna module 100 is described. Furthermore, in the antenna module 100E of Embodiment 6, the description of the structure that is repeated with the antenna module 100 of Embodiment 1 is not repeated.

[0092] Figure 7 This is a cross-sectional view of the antenna module 100E according to embodiment 6. (Example) Figure 7 As shown, in antenna module 100E, RFIC 110 is electrically connected to intermediate component 190 via connecting member 160Ea. When viewed from above the mounting substrate 120, intermediate component 190 has an opening Op2 in the region overlapping with opening Op. The region of opening Op2 when viewed from above the mounting substrate 120 can also be smaller than the region of opening Op when viewed from above the mounting substrate 120. Intermediate component 190 may be, for example, a printed circuit board, a ceramic substrate, an intermediate substrate formed of silicon or glass, or a flexible substrate. Connecting member 160Ea is disposed between the positive Z-axis side of RFIC 110 and the negative Z-axis side of intermediate component 190. Intermediate component 190 is electrically connected to mounting substrate 120 via connecting member 160Eb. Connecting member 160Eb is disposed between the positive Z-axis side of intermediate component 190 and the negative Z-axis side of mounting substrate 120. Connecting components 160Ea and 160Eb each contain six brazed bumps. Connecting components 160Ea and 160Eb can also be connecting components other than brazed bumps.

[0093] In the antenna module 100E, where an intermediate member 190 is disposed between the RFIC 110 and the mounting substrate 120, molding resin 130 is filled between the lens Ln and the radiating electrode 121. Therefore, the dielectric constant between the lens Ln and the radiating electrode 121 does not change significantly. Consequently, there is no region where the dielectric constant changes considerably, and in the antenna module 100E, electromagnetic wave reflections can be suppressed, antenna characteristics improved, and the intermediate member 190 is mounted simultaneously.

[0094] [Implementation Method 7]

[0095] In the antenna module 100 of Embodiment 1, a structure formed in which the lens Ln protrudes from the molding resin 130 is described. In Embodiment 7, a structure is described in which the formation position of the lens LnF is adjusted to prevent physical interference between the lens LnF and external objects such as devices, while further reducing the overall height of the antenna module 100F. Furthermore, in the antenna module 100F of Embodiment 7, the structural descriptions that are repeated in the antenna module 100 of Embodiment 1 are not repeated.

[0096] Figure 8 This is a cross-sectional view of the antenna module 100F according to embodiment 7. (See attached image.) Figure 8As shown, compared to the lens Ln in Embodiment 1, the lens LnF of the antenna module 100F is formed inside the molding resin 130. Specifically, the hemispherical vertex T1 of the lens LnF is positioned closer to the negative Z-axis side than the positive Z-axis side of the sputtering shield 140. In other words, in the Z-axis direction, the vertex T1 is separated from the positive Z-axis side of the sputtering shield 140 by a distance D6. This prevents physical interference between the lens LnF and external devices or other objects, while further reducing the overall height of the antenna module 100F.

[0097] In the antenna module 100F, where the lens LnF is positioned on the negative Z-axis side compared to the sputtering shield 140, molding resin 130 is filled between the lens LnF and the radiating electrode 121. Therefore, the dielectric constant between the lens LnF and the radiating electrode 121 does not change significantly, and there are no regions with large variations in the dielectric constant. Consequently, in the antenna module 100F, electromagnetic wave reflections can be suppressed, antenna characteristics improved, and physical interference between the lens LnF and external devices or other objects prevented, further achieving a lower overall height for the antenna module 100F.

[0098] [Implementation Method 8]

[0099] In the antenna module 100 of Embodiment 1, the structure in which the radiating electrode 121 forms a patch antenna was described. In Embodiment 8, the structure in which the radiating electrode 121G forms a dipole antenna was described. Furthermore, in the antenna module 100G of Embodiment 8, the description of the structure that is the same as that of the antenna module 100 of Embodiment 1 is not repeated.

[0100] Figure 9 This is a cross-sectional view of the antenna module 100G according to embodiment 8. Figure 9 (A) and Figure 9 Top view of RFIC 110 and radiation electrode 121G in (A) Figure 9 (B)). For example Figure 9 As shown, the radiating electrode 121G forms a dipole antenna. Furthermore, the radiating electrode 121G can also be formed as an antenna other than a patch antenna and a dipole antenna. For example, the radiating electrode 121G can be formed as a slot antenna.

[0101] In the antenna module 100G, which has antennas other than patch antennas, there is no region between the lens Ln and the radiating electrode 121G where the dielectric constant changes significantly. Therefore, it is possible to suppress the reflection of radio waves, improve the characteristics of the antenna, and install various types of antennas.

[0102] The embodiments disclosed herein should be considered illustrative and not limiting in all respects. The scope of the invention is defined by the claims rather than by the foregoing description of the embodiments, and is intended to include all modifications within the equivalent meaning and scope of the claims.

[0103] Explanation of reference numerals in the attached figures

[0104] 10. Communication devices; 100, 100A~100G, antenna modules; 110. RFIC; 111A~111D, 113A~113D, 117. Switches; 112AR~112DR, low-noise amplifiers; 112AT~112DT, power amplifiers; 114A~114D, attenuators; 115A~115D, phase shifters; 116. Signal synthesizers / demultiplexers; 118. Mixers; 119. Amplifier circuits; 120. Mounting substrates; 120G. Conductors; 121, 121C, 121G. Radiating electrodes; 122A~1 22H, Radiation element; 130, 130A, 130B, Molded resin; 140, Sputtering shield; 150A, 150B, Electronic component; 160, 160Ea, 160Eb, Connecting component; 170A, 170B, Connecting terminal; 180A, 180B, Conductive shield; 190, Intermediate component; 200, BBIC; Ag1~Ag3, Angle; D1~D6, Distance; Ln, LnC, LnF, Lens; P1, P2, End; Op, Op2, Opening; R1~R3, Region; Sf1~Sf3, Surface; T1, Vertex.

Claims

1. An antenna module, wherein, The antenna module includes: The mounting substrate is a flat plate with a first side and a second side, and contains a conductor; A power supply circuit is disposed on the first surface side of the mounting substrate and has a third surface opposite to the first surface for supplying high-frequency signals; A radiating electrode is disposed on the third surface in a position that does not overlap with the conductor when viewed from above the mounting substrate. A first dielectric material, which fills the first surface side in a manner that contacts the radiating electrode and the first surface; and A second dielectric material is filled on the side of the second surface in such a way that it contacts the second surface. A lens portion is formed on the second surface of the mounting substrate at a position where the second dielectric material overlaps with the radiating electrode when viewed from above.

2. The antenna module according to claim 1, wherein, The antenna module also includes a conductive layer that covers at least a portion of the second dielectric. The second dielectric includes a first region forming the lens portion and a second region other than the first region. The conductive layer is formed in the second region.

3. The antenna module according to claim 1 or 2, wherein, The antenna module also includes electronic components mounted on the mounting substrate. The electronic components are positioned so as not to overlap with the radiating electrodes when viewed from above the mounting substrate.

4. The antenna module according to claim 3, wherein, The antenna module also includes a conductive component disposed between the electronic components and the power supply circuit.

5. The antenna module according to claim 1 or 2, wherein, When the wavelength of the high-frequency signal supplied from the power supply circuit is set to λ, the distance between the lens portion and the radiation electrode in a direction perpendicular to the plane of the mounting substrate is a length of 1λ or more.

6. The antenna module according to claim 4, wherein, When the wavelength of the high-frequency signal supplied from the power supply circuit is set to λ, the distance between the lens portion and the radiation electrode in a direction perpendicular to the plane of the mounting substrate is a length of 1λ or more.

7. The antenna module according to claim 4, wherein, The conductive component has any of the following shapes: wall shape, column shape, or line shape.

8. The antenna module according to claim 4, wherein, The distance between the conductive component and the electronic component is longer than the distance between the conductive component and the radiation electrode.

9. The antenna module according to claim 7, wherein, The distance between the conductive component and the electronic component is longer than the distance between the conductive component and the radiation electrode.

10. The antenna module according to claim 4, wherein, The distance between the conductive component and the radiation electrode is longer than the distance between the conductive component and the electronic component.

11. The antenna module according to claim 7, wherein, The distance between the conductive component and the radiation electrode is longer than the distance between the conductive component and the electronic component.

12. The antenna module according to claim 1 or 2, wherein, The radiation electrode includes a first radiation element and a second radiation element.

13. The antenna module according to claim 4, wherein, The radiation electrode includes a first radiation element and a second radiation element.

14. The antenna module according to claim 7, wherein, The radiation electrode includes a first radiation element and a second radiation element.

15. The antenna module according to claim 1 or 2, wherein, The lens section is a plane lens.

16. The antenna module according to claim 4, wherein, The lens section is a plane lens.

17. The antenna module according to claim 7, wherein, The lens section is a plane lens.

18. The antenna module according to claim 1 or 2, wherein, The radiating electrodes form a patch antenna.

19. The antenna module according to claim 4, wherein, The radiating electrodes form a patch antenna.

20. The antenna module according to claim 7, wherein, The radiating electrodes form a patch antenna.

21. The antenna module according to claim 1 or 2, wherein, The radiating electrodes form a dipole antenna.

22. The antenna module according to claim 4, wherein, The radiating electrodes form a dipole antenna.

23. The antenna module according to claim 7, wherein, The radiating electrodes form a dipole antenna.

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