Methods and devices for controlling the feeding of molten tin, storage media and electronic devices

Abstract

This application discloses a method and apparatus for controlling the feeding of molten solder, a storage medium, and an electronic device. The method for controlling the feeding of molten solder includes: acquiring soldering requirement information of a target wave soldering oven, wherein the soldering requirement information indicates the type of molten solder inside the target wave soldering oven during operation, and the required temperature of the molten solder; when the type of molten solder indicated by the soldering requirement information matches the feeding parameter information of the feeding control device, controlling the feeding control device to heat the internal molten solder to the temperature indicated by the soldering requirement information; and controlling the molten solder that has reached the required temperature to be fed to the target wave soldering oven. By adopting the above technical solution, the problem of low efficiency in feeding molten solder in related technologies is solved.

Description

Technical Field

[0001] This application relates to the field of computers, and more specifically, to a method and apparatus for controlling the feeding of molten tin, a storage medium, and an electronic device. Background Technology

[0002] A wave soldering oven is a device used for soldering electronic components. Traditional wave soldering ovens heat solder to a molten state and use wave soldering technology to apply the solder to the pads of electronic components via waves, thus connecting the components to the circuit board. It offers efficient and stable soldering results, making it suitable for mass production of electronic products.

[0003] Before the wave soldering oven can be operated, solder bars need to be manually placed into the oven for heating to obtain molten solder. During the loading process, manual contact with the solder bars can cause them to become contaminated, and the molten solder may be mixed with impurities, thus affecting the soldering quality of the circuit board. Furthermore, different wave soldering ovens allow different types of solder bars to be used, and before loading, it is necessary to manually identify the type of solder bar and manually handle the solder bars, which is inefficient and greatly reduces the efficiency of wave soldering circuit boards.

[0004] There is still no effective solution to the problem of low efficiency in feeding molten tin in related technologies. Summary of the Invention

[0005] This application provides a method and apparatus for controlling the feeding of molten tin, a storage medium, and an electronic device, to at least solve the problem of low feeding efficiency of molten tin in related technologies.

[0006] According to one embodiment of this application, a method for controlling the feeding of molten tin is provided, comprising:

[0007] Obtain the soldering requirement information of the target wave soldering oven, wherein the soldering requirement information is used to indicate the type of solder liquid inside the target wave soldering oven during operation, and the solder liquid temperature that the solder liquid needs to reach;

[0008] When the type of molten solder indicated by the welding requirement information matches the feeding parameter information of the feeding control device, the feeding control device is controlled to heat the internal molten solder to the molten solder temperature indicated by the welding requirement information.

[0009] The molten solder, having reached the specified temperature, is fed into the target wave soldering oven.

[0010] Optionally, obtaining the welding requirements information of the target wave soldering furnace includes:

[0011] The target solder liquid field and target temperature field corresponding to the target wave soldering furnace are searched in the wave soldering furnace control system. The wave soldering furnace control system records wave soldering furnaces, solder liquid fields and temperature fields with corresponding relationships. The solder liquid field is used to indicate the type of solder liquid that the corresponding wave soldering furnace is allowed to use in the process of soldering the PCB board. The temperature field is used to indicate the temperature that the solder liquid needs to reach in the process of soldering the PCB board.

[0012] The soldering requirements information is determined based on the target solder liquid field and the target temperature field.

[0013] Optionally, obtaining the welding requirements information of the target wave soldering furnace includes:

[0014] Identify the PCB board models that the target wave soldering oven allows to be soldered;

[0015] The reference solder type corresponding to the PCB board model is determined as the type of solder inside the target wave soldering furnace during operation. The required solder temperature of the target wave soldering furnace during operation is determined according to the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information. The reference solder type is the type of solder that is allowed to be used for soldering PCB boards of the PCB board model.

[0016] Optionally, determining the required solder temperature of the target wave soldering furnace during operation based on the board size corresponding to the PCB board model includes:

[0017] When the board size is larger than the preset size, the first preset temperature is determined as the solder temperature that the solder needs to reach during the operation of the target wave soldering furnace;

[0018] When the board size is less than or equal to the preset size, the second preset temperature is determined as the solder temperature that the solder needs to reach during the operation of the target wave soldering furnace, wherein the second preset temperature is less than the first preset temperature.

[0019] In one exemplary embodiment, a molten solder feeding control device is provided, comprising: a device carrier, a molten solder storage tank, a drive device, a control device, and a temperature control device, wherein the molten solder storage tank, the drive device, the control device, and the temperature control device are mounted on the device carrier;

[0020] The control device is used to acquire the soldering requirement information of the target wave soldering furnace, and when the solder liquid type indicated by the soldering requirement information matches the feeding parameter information of the feeding control device, it sends a temperature control command to the temperature control device. The soldering requirement information is used to indicate the solder liquid type inside the target wave soldering furnace during operation, as well as the solder liquid temperature that the solder liquid needs to reach.

[0021] The temperature control device is used to respond to the temperature control command sent by the control device and heat the molten solder inside the molten solder tank to the molten solder temperature indicated by the soldering requirement information.

[0022] The drive device is used to control the feeding of molten solder to the target wave soldering furnace when the molten solder reaches the specified temperature.

[0023] Optionally, the drive device includes: a drive motor, a coupling, and an oil pump, wherein the coupling is assembled between the drive motor and the oil pump;

[0024] The oil pump is used to pump the molten tin inside the molten tin storage tank to the target wave soldering furnace.

[0025] The drive motor is used to provide power during the process of the oil pumping gear pump drawing solder liquid;

[0026] The coupling is used to adjust the speed at which the oil-pumping gear pump draws in the solder liquid.

[0027] Optionally, it may also include: a stirring device;

[0028] The stirring device is used to stir the molten tin during the heating process inside the molten tin storage tank.

[0029] Optionally, the stirring device includes: a stirring mechanism, a transmission screw, and a stirring motor, wherein the transmission screw is assembled between the stirring mechanism and the stirring motor, and the stirring mechanism is deployed inside the molten tin storage tank;

[0030] The stirring mechanism is used to stir the molten tin during the heating process inside the molten tin storage tank.

[0031] The stirring motor is used to provide power for the stirring mechanism.

[0032] The transmission screw is used to transmit the power provided by the stirring motor to the stirring mechanism.

[0033] According to another embodiment of the present application, a molten tin feeding control device is also provided, comprising:

[0034] The acquisition module is used to acquire the welding requirement information of the target wave soldering oven, wherein the welding requirement information is used to indicate the type of solder liquid inside the target wave soldering oven during operation, and the solder liquid temperature that the solder liquid needs to reach.

[0035] The first control module is used to control the feeding control device to heat the internal molten solder to the molten solder temperature indicated by the welding requirement information when the type of molten solder indicated by the welding requirement information matches the feeding parameter information of the feeding control device.

[0036] The second control module is used to control the feeding of molten solder to the target wave soldering furnace when the molten solder reaches the specified temperature.

[0037] According to another aspect of the embodiments of this application, a computer-readable storage medium is also provided, wherein a computer program is stored in the computer program, and the computer program is configured to execute the above-described molten solder feeding control method when running.

[0038] According to another aspect of the embodiments of this application, an electronic device is also provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the above-described method for controlling the feeding of molten solder through the computer program.

[0039] In this embodiment, the soldering requirement information of the target wave soldering furnace is obtained. This soldering requirement information indicates the type of molten solder inside the target wave soldering furnace during operation, and the required temperature of the molten solder. When the type of molten solder indicated by the soldering requirement information matches the feeding parameters of the feeding control device, the feeding control device is controlled to heat the internal molten solder to the temperature indicated by the soldering requirement information. The molten solder that has reached the required temperature is then fed into the target wave soldering furnace. In other words, when feeding the target wave soldering furnace, the process begins with obtaining the soldering requirement information. The system determines the type of molten solder inside the target wave soldering oven during operation and the required temperature. Then, when the molten solder type matches the feeding parameters of the feeding control equipment, the equipment heats the internal molten solder to the temperature indicated by the soldering requirements. The system then feeds the molten solder, reaching the required temperature, to the target wave soldering oven. This feeding process can be automated by the feeding control equipment, eliminating the need for manual intervention. This avoids contamination and the inefficiency associated with manual solder bar handling and sorting. This technical solution addresses the low efficiency of molten solder feeding in related technologies, achieving a significant improvement in feeding efficiency. Attached Figure Description

[0040] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0041] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic diagram of the hardware environment for a method for controlling the feeding of molten tin according to an embodiment of this application;

[0043] Figure 2 This is a flowchart of a method for controlling the feeding of molten tin according to an embodiment of this application;

[0044] Figure 3 This is a schematic diagram of welding requirement information according to an embodiment of this application;

[0045] Figure 4 This is a structural diagram of a molten tin feeding control device according to an embodiment of this application;

[0046] Figure 5 This is a structural diagram of a control device according to an embodiment of this application;

[0047] Figure 6 This is a structural diagram of a driving device according to an embodiment of this application;

[0048] Figure 7 This is a structural diagram of a stirring device according to an embodiment of this application;

[0049] Figure 8 This is a structural block diagram of a molten tin feeding control device according to an embodiment of this application. Detailed Implementation

[0050] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0051] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0052] The methods and embodiments provided in this application can be executed on a computer terminal, device terminal, or similar computing device. Taking running on a computer terminal as an example, Figure 1 This is a schematic diagram of the hardware environment for a method for controlling the feeding of molten solder according to an embodiment of this application. Figure 1 As shown, a computer terminal may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. In one exemplary embodiment, the computer terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the computer terminal described above. For example, the computer terminal may also include components that are more complex than those described above. Figure 1 The more or fewer components shown, or having the same Figure 1 Equivalent functions or ratios shown Figure 1 The functions shown have more different configurations.

[0053] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the molten solder feeding control method in this embodiment of the invention. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thereby implementing the above-described method. The memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to a computer terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0054] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider for the computer terminal. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0055] The terms used in the embodiments of this application are explained as follows:

[0056] PCB: Printed Circuit Board. It is a basic material used to support and connect electronic components. It is usually made of insulating material and has printed patterns of wires and other electronic components connected to it. PCBs are widely used in electronic devices and circuits to provide electrical connections and mechanical support.

[0057] Wave soldering ovens are used to solder electronic components onto circuit boards. They work by immersing the circuit board in a wave of molten solder, which coats the solder pads on the board. This method allows for the efficient soldering of multiple joints, improving production efficiency. Wave soldering ovens are widely used in the electronics manufacturing industry.

[0058] This embodiment provides a method for controlling the feeding of molten tin, applied to the aforementioned computer terminal. Figure 2 This is a flowchart of a method for controlling the feeding of molten tin according to an embodiment of this application, as shown below. Figure 2 As shown, the process includes the following steps:

[0059] Step S202: Obtain the soldering requirement information of the target wave soldering oven, wherein the soldering requirement information is used to indicate the type of solder liquid inside the target wave soldering oven during operation, and the solder liquid temperature that the solder liquid needs to reach.

[0060] Step S204: If the type of molten solder indicated by the welding requirement information matches the feeding parameter information of the feeding control device, control the feeding control device to heat the internal molten solder to the molten solder temperature indicated by the welding requirement information.

[0061] Step S206: Control the molten solder to reach the specified temperature and feed it into the target wave soldering oven.

[0062] Through the above steps, the soldering requirements information of the target wave soldering oven is obtained. This information indicates the type of molten solder inside the target wave soldering oven during operation, as well as the required temperature. When the molten solder type indicated by the soldering requirements information matches the feeding parameters of the feeding control equipment, the feeding control equipment is controlled to heat the internal molten solder to the temperature indicated by the soldering requirements information. The molten solder, having reached the required temperature, is then fed into the target wave soldering oven. In other words, when feeding the target wave soldering oven, the process begins with obtaining the soldering requirements information. The method determines the type of molten solder inside the target wave soldering oven during operation, as well as the required temperature. Then, when the molten solder type matches the feeding parameters of the feeding control equipment, the equipment heats the internal molten solder to the temperature indicated by the soldering requirements. The molten solder, having reached the required temperature, is then fed into the target wave soldering oven. This feeding process can be automated by the feeding control equipment, eliminating the need for manual intervention. This avoids the problems of contamination and the inefficiency associated with manually identifying and handling solder bars. This technical solution solves the problem of low molten solder feeding efficiency in related technologies, achieving a significant improvement in molten solder feeding efficiency.

[0063] In the technical solution provided in step S202 above, taking the production line scenario as an example, the target wave soldering furnace may refer to, but is not limited to, any wave soldering furnace in the production line. This application takes the feeding process of the target wave soldering furnace as an example to introduce the feeding control method of molten solder.

[0064] Optionally, in this embodiment, Figure 3 This is a schematic diagram of welding requirement information according to an embodiment of this application, such as... Figure 3 As shown, multiple wave soldering ovens may be deployed in the production line, such as wave soldering oven A, wave soldering oven B, and wave soldering oven C. The specifications and models of the different wave soldering ovens may be different, and they are used to solder different types of PCB boards. Since the size and model of different PCB boards are different, the composition of the solder liquid that can be used will also be different. At the same time, there are different regulations for the temperature of the solder liquid during the soldering process. Therefore, the soldering requirements information for different wave soldering ovens may differ. For example, the soldering requirements information for wave soldering oven A indicates that the type of solder liquid inside the oven is solder liquid A, and the required solder liquid temperature is 240°C. The soldering requirements information for wave soldering oven B indicates that the type of solder liquid inside the oven is solder liquid B, and the required solder liquid temperature is 260°C. The soldering requirements information for wave soldering oven C indicates that the type of solder liquid inside the oven is solder liquid C, and the required solder liquid temperature is 280°C.

[0065] In one exemplary embodiment, the soldering requirement information of the target wave soldering oven can be obtained, but is not limited to, by means of: searching the target solder liquid field and target temperature field corresponding to the target wave soldering oven from the wave soldering oven control system, wherein the wave soldering oven control system records wave soldering ovens, solder liquid fields and temperature fields with corresponding relationships, the solder liquid field being used to indicate the type of solder liquid allowed to be used in the corresponding wave soldering oven during the soldering process of the PCB board, and the temperature field being used to indicate the temperature that the solder liquid needs to reach in the corresponding wave soldering oven during the soldering process of the PCB board; and determining the soldering requirement information based on the target solder liquid field and target temperature field.

[0066] Optionally, in this embodiment, the welding requirement information of the target wave soldering furnace can be obtained directly from the wave soldering furnace by the feeding control equipment, or from the wave soldering furnace control system corresponding to the wave soldering furnace, or from the server (database) in the background of the wave soldering furnace. The above-mentioned welding requirement information can be obtained by active acquisition and passive request, that is, passively receiving welding requirement information issued by the information storage terminal. The information storage terminal can be the aforementioned wave soldering furnace, and / or the wave soldering furnace control system, and / or the server (database) in the background of the wave soldering furnace. When the production line technicians modify the welding requirement information, the information in each information storage terminal will be updated synchronously in real time, realizing real-time monitoring, real-time early warning, and real-time push of welding requirement information, ensuring the accuracy of the data modified by the production line technicians.

[0067] The above provides a variety of methods to obtain soldering requirement information, addressing various scenarios. For example, in offline scenarios, soldering requirement information can be obtained directly from the wave soldering oven (via wired connection or short-range connection technologies such as Bluetooth). In online scenarios, soldering requirement information can be obtained from the wave soldering oven control system and / or the wave soldering oven's backend server (database). This approach can handle various requirement scenarios, ensuring stable solder feeding in the wave soldering oven. It also simplifies the process of obtaining soldering requirement information. Compared to traditional methods of manually identifying solder bar types and memorizing wave soldering oven types, this significantly improves solder feeding efficiency and avoids information errors caused by human uncertainty.

[0068] In one exemplary embodiment, the soldering requirement information of the target wave soldering oven can be obtained, but is not limited to, by: identifying the PCB board model that the target wave soldering oven is allowed to solder; determining the reference solder type corresponding to the PCB board model as the solder type of the internal solder of the target wave soldering oven during operation; and determining the solder temperature that the solder of the target wave soldering oven needs to reach during operation based on the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information, wherein the reference solder type is the solder type that is allowed to be used for soldering PCB boards of the PCB board model.

[0069] Optionally, in this embodiment, the welding requirement information mentioned in the above embodiments can be obtained directly from the information storage terminal. This application also provides a way to indirectly obtain welding requirement information. Different wave soldering ovens may have different specifications and models, and are used to solder different models of PCB boards. Different PCB boards have different sizes and models, so the allowed solder liquid composition will also be different. At the same time, there are different regulations for the temperature of the solder liquid during the soldering process. It can be seen that the welding requirement information of the wave soldering oven can actually be understood as the soldering requirement information of the PCB board corresponding to the wave soldering oven.

[0070] Optionally, in this embodiment, the PCB board model that the target wave soldering oven allows to be soldered can be identified. The identification method may include, but is not limited to, material code identification, or an image recognition model may be used to compare PCB board features to identify the PCB board model.

[0071] In one exemplary embodiment, the solder temperature required for the target wave soldering furnace during operation can be determined, but is not limited to, based on the board size corresponding to the PCB board model, in the following manner: when the board size is larger than a preset size, a first preset temperature is determined as the solder temperature required for the target wave soldering furnace during operation; when the board size is smaller than or equal to the preset size, a second preset temperature is determined as the solder temperature required for the target wave soldering furnace during operation, wherein the second preset temperature is less than the first preset temperature.

[0072] Optionally, in this embodiment, the method for determining the required solder temperature of the target wave soldering furnace during operation based on the board size corresponding to the PCB model is explained below: Different PCBs may require different solder temperatures during soldering, mainly due to differences in PCB size. For example, larger PCBs require more soldering points during the soldering process, and to achieve good soldering results, the solder needs to maintain a relatively long fluid state; therefore, a higher solder temperature is required. Conversely, smaller PCBs require fewer soldering points during the soldering process, and the solder needs to maintain a relatively short fluid state; therefore, a lower solder temperature is required.

[0073] Optionally, in this embodiment, the second preset temperature is lower than the first preset temperature, but both the second preset temperature and the first preset temperature need to be higher than the melting point temperature of the solder rod.

[0074] In the technical solution provided in step S204 above, when the type of solder liquid indicated by the welding requirement information matches the feeding parameter information of the feeding control device, it means that the type of solder liquid in the feeding control device is consistent with the type of solder liquid indicated by the welding requirement information, or the type of solder liquid in the feeding control device falls into the type of solder liquid indicated by the welding requirement information. The type of solder liquid can be a set of types, or a set of solder liquid components. The solder liquid can be a mixture whose main component is tin.

[0075] Optionally, in this embodiment, the molten solder can be the product of melting solder bars. The main elements of the solder bars include tin, lead, copper, and silver, and also contain small amounts of other elements such as nickel (Ni), antimony (Sb), zinc (Zn), bismuth (Bi), indium (In), and rare earth elements. These trace alloying elements in the solder bar have a significant impact on its performance. For example, adding chromium can lower the melting temperature of the solder bar and improve wettability, but excessive addition will reduce the fatigue life and stability of the solder joint. The bismuth content is approximately 0.2% to 1.5%. Adding nickel can change the alloy structure and refine the grains, thereby improving the mechanical properties and fatigue life of the solder joint.

[0076] In the technical solution provided in step S206 above, the temperature of the molten solder can be controlled by a temperature control device in the feeding control equipment, but is not limited to that of the molten solder. The molten solder can also be kept at a specified molten solder temperature by a heat preservation device.

[0077] This embodiment provides a device for controlling the feeding of molten tin. Figure 4 This is a structural diagram of a molten tin feeding control device according to an embodiment of this application, as shown below. Figure 4As shown, the molten tin feeding control equipment includes: an equipment carrier, a molten tin storage tank, a drive device, a control device, and a temperature control device, wherein the molten tin storage tank, the drive device, the control device, and the temperature control device are installed on the equipment carrier;

[0078] The control device is used to acquire the soldering requirement information of the target wave soldering furnace, and when the solder liquid type indicated by the soldering requirement information matches the feeding parameter information of the feeding control device, it sends a temperature control command to the temperature control device. The soldering requirement information is used to indicate the solder liquid type inside the target wave soldering furnace during operation, as well as the solder liquid temperature that the solder liquid needs to reach.

[0079] The temperature control device is used to respond to the temperature control command sent by the control device and heat the molten solder inside the molten solder tank to the molten solder temperature indicated by the soldering requirement information.

[0080] The drive device is used to control the feeding of molten solder to the target wave soldering furnace when the molten solder reaches the specified temperature.

[0081] Optionally, in this embodiment, the feeding control device can be understood as a solder molten metal feeding device for feeding solder (molten solder) into a wave soldering furnace. This feeding control device is equipped with a solder molten metal storage tank. The volume of the storage tank can be adjusted according to actual needs. There can be one or more storage tanks, and different tanks can be used to store different types of solder molten metal. The temperature in each tank can be controlled independently. Alternatively, when there is only one storage tank, multiple independent solder molten metal storage compartments can be set inside the tank to store and temperature-control different types of solder molten metal. In this case, even if different wave soldering furnaces exist on the production line (see reference...), Figure 3 In scenarios where the wave soldering oven is replaced, a single feeding control device can meet the requirements. When the wave soldering oven is replaced, the molten solder can be fed from the corresponding molten solder tank or molten solder storage compartment. This further improves the feeding efficiency of molten solder.

[0082] Optionally, in this embodiment, the temperature control device may include, but is not limited to, heating devices, cooling devices, and heat preservation devices, etc., which are devices capable of temperature control.

[0083] Optionally, in this embodiment, Figure 5 This is a structural diagram of a control device according to an embodiment of this application, such as... Figure 5As shown, the control device includes a human-machine interface, an integrated circuit chassis, and a Wi-Fi device. Most of the internal electrical components of the entire feeding control equipment can be controlled by a microcontroller with simple logic circuits, in conjunction with an intelligent monitoring device for wave soldering furnace operation information, using standard electrical control components. This intelligent monitoring device for wave soldering furnace operation information uses Wi-Fi to achieve real-time monitoring and push of wave soldering furnace operation information, ensuring that production line technicians can adjust the solder molten metal feeding method in a timely manner.

[0084] Optionally, in this embodiment, the equipment carrier may be designed as a mobile trolley structure, including a base plate that can move in all directions with the moving rollers. Upon reaching the destination position, a brake can be applied to ensure that the position is fixed, precise, and stable during the automatic solder loading process. The trolley is not expensive and will not affect the loading speed. Simultaneously, the equipment carrier can automatically move to a preset loading position to load the corresponding wave soldering furnace via a matching drive motor and control system.

[0085] In one exemplary embodiment, Figure 6 This is a structural diagram of a driving device according to an embodiment of this application, such as... Figure 6 As shown, the drive device may include, but is not limited to, a drive motor, a coupling, and a gear pump, wherein the coupling is mounted between the drive motor and the gear pump; the gear pump is used to pump molten solder from inside the molten solder storage tank to the target wave soldering furnace; the drive motor is used to provide power during the process of the gear pump pumping molten solder; and the coupling is used to adjust the speed at which the gear pump pumps molten solder.

[0086] Optionally, in this embodiment, the coupling can be replaced by a speed reducer, but is not limited to, to achieve the function of driving speed conversion.

[0087] In one exemplary embodiment, the molten tin feeding control device may include, but is not limited to, a stirring device; the stirring device is used to stir the molten tin during the heating of the molten tin inside the molten tin storage tank.

[0088] Optionally, in this embodiment, in order to accelerate the temperature diffusion effect, a stirring device can be deployed in the feeding control equipment to stir the molten tin during the heating process.

[0089] In one exemplary embodiment, Figure 7 This is a structural diagram of a stirring device according to an embodiment of this application, such as... Figure 7As shown, the stirring device may include, but is not limited to, a stirring mechanism, a transmission screw, and a stirring motor, wherein the transmission screw is mounted between the stirring mechanism and the stirring motor, and the stirring mechanism is deployed inside the molten tin storage tank; the stirring mechanism is used to stir the molten tin during the heating process of the molten tin inside the molten tin storage tank; the stirring motor is used to provide power for the stirring of the stirring mechanism; and the transmission screw is used to transmit the power provided by the stirring motor to the stirring mechanism.

[0090] Optionally, in this embodiment, personnel can set parameters such as the solder molten material feeding speed, the temperature inside the solder molten material storage tank, and the stirring speed of the solder molten material inside the tank through a human-machine interface; the control signal is sent to the drive motor through the integrated circuit chassis, and the main drive motor is connected to the oil pump through a coupling to extract the solder molten material at the set feeding speed. The actuator is controlled by the motor to control the action and the automatic feeding speed of the solder molten material, and the transmission is carried out by the motor, coupling (or reducer), oil pump, and stirring mechanism.

[0091] In an exemplary embodiment, the control device may, but is not limited to, also be used to obtain the soldering requirement information of the target wave soldering oven by: searching for the target solder liquid field and target temperature field corresponding to the target wave soldering oven from the wave soldering oven control system, wherein the wave soldering oven control system records a wave soldering oven, solder liquid field and temperature field with a corresponding relationship, the solder liquid field being used to indicate the type of solder liquid allowed to be used in the corresponding wave soldering oven during the soldering process of the PCB board, and the temperature field being used to indicate the temperature that the solder liquid needs to reach in the corresponding wave soldering oven during the soldering process of the PCB board; and determining the soldering requirement information based on the target solder liquid field and target temperature field.

[0092] In an exemplary embodiment, the control device may, but is not limited to, also be used to obtain the soldering requirement information of the target wave soldering oven by: identifying the PCB board model that the target wave soldering oven is allowed to solder; determining the reference solder type corresponding to the PCB board model as the solder type of the internal solder of the target wave soldering oven during operation; and determining the solder temperature that the solder of the target wave soldering oven needs to reach during operation based on the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information, wherein the reference solder type is the solder type that is allowed to be used for soldering PCB boards of the PCB board model.

[0093] In an exemplary embodiment, the control device may, but is not limited to, also be configured to determine the solder temperature required for the target wave soldering furnace during operation based on the board size corresponding to the PCB board model in the following manner: when the board size is greater than a preset size, a first preset temperature is determined as the solder temperature required for the target wave soldering furnace during operation; when the board size is less than or equal to the preset size, a second preset temperature is determined as the solder temperature required for the target wave soldering furnace during operation, wherein the second preset temperature is less than the first preset temperature.

[0094] To better understand the above-mentioned process of controlling the feeding of molten tin, the following description of the molten tin feeding control process is provided in conjunction with optional embodiments, but it is not intended to limit the technical solutions of the embodiments of this application.

[0095] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of this application.

[0096] Figure 8 This is a structural block diagram of a molten tin feeding control device according to an embodiment of this application; as shown... Figure 8 As shown, it includes:

[0097] The acquisition module 802 is used to acquire the welding requirement information of the target wave soldering oven, wherein the welding requirement information is used to indicate the type of solder liquid inside the target wave soldering oven during operation, and the solder liquid temperature that the solder liquid needs to reach.

[0098] The first control module 804 is used to control the feeding control device to heat the internal molten solder to the molten solder temperature indicated by the welding requirement information when the type of molten solder indicated by the welding requirement information matches the feeding parameter information of the feeding control device.

[0099] The second control module 806 is used to control the feeding of molten solder to the target wave soldering furnace when the molten solder reaches the specified temperature.

[0100] Understandably, the solder molten material feeding control method proposed in this application can solve the problems of safe operation and high material maintenance costs. It avoids operators from manually touching solder bars and consuming physical labor to handle them. It can not only improve feeding efficiency, but also prevent impurities from mixing into the solder molten material, ensuring the stability of product quality, and further prevent operators from being affected by contamination.

[0101] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0102] Through the above embodiments, the soldering requirements information of the target wave soldering furnace is obtained. This soldering requirements information indicates the type of molten solder inside the target wave soldering furnace during operation, as well as the required temperature of the molten solder. When the type of molten solder indicated by the soldering requirements information matches the feeding parameters of the feeding control equipment, the feeding control equipment is controlled to heat the internal molten solder to the temperature indicated by the soldering requirements information. The molten solder that has reached the required temperature is then fed into the target wave soldering furnace. In other words, when feeding the target wave soldering furnace, the information is first obtained from the soldering requirements information... The system determines the type of molten solder inside the target wave soldering oven during operation and the required temperature. Then, when the molten solder type matches the feeding parameters of the feeding control equipment, the equipment heats the internal molten solder to the temperature indicated by the soldering requirements. The system then feeds the molten solder, reaching the required temperature, to the target wave soldering oven. This feeding process can be automated by the feeding control equipment, eliminating the need for manual intervention. This avoids contamination and the inefficiency associated with manual solder bar handling and sorting. This technical solution addresses the low efficiency of molten solder feeding in related technologies, achieving a significant improvement in feeding efficiency.

[0103] In one exemplary embodiment, the acquisition module includes:

[0104] The lookup unit is used to look up the target solder liquid field and target temperature field corresponding to the target wave soldering oven from the wave soldering oven control system. The wave soldering oven control system records wave soldering ovens, solder liquid fields and temperature fields with corresponding relationships. The solder liquid field is used to indicate the type of solder liquid that the corresponding wave soldering oven is allowed to use in the process of soldering PCB boards. The temperature field is used to indicate the temperature that the solder liquid needs to reach in the process of soldering PCB boards.

[0105] The first determining unit is used to determine the welding requirement information based on the target molten solder field and the target temperature field.

[0106] In one exemplary embodiment, the acquisition module includes:

[0107] The identification unit is used to identify the PCB board model that the target wave soldering oven allows to be soldered.

[0108] The second determining unit is used to determine the reference solder type corresponding to the PCB board model as the solder type of the solder inside the target wave soldering furnace during operation, and to determine the solder temperature that the solder needs to reach during operation of the target wave soldering furnace according to the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information, wherein the reference solder type is the solder type that is allowed to be used for soldering PCB boards of the PCB board model.

[0109] In one exemplary embodiment, the second determining unit is further configured to:

[0110] When the board size is larger than the preset size, the first preset temperature is determined as the solder temperature that the solder needs to reach during the operation of the target wave soldering furnace;

[0111] When the board size is less than or equal to the preset size, the second preset temperature is determined as the solder temperature that the solder needs to reach during the operation of the target wave soldering furnace, wherein the second preset temperature is less than the first preset temperature.

[0112] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0113] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0114] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0115] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0116] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0117] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0118] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for controlling the feeding of molten tin, characterized in that, include: Obtain the soldering requirement information of the target wave soldering oven, wherein the soldering requirement information is used to indicate the type of solder liquid inside the target wave soldering oven during operation, and the solder liquid temperature that the solder liquid needs to reach; When the type of molten solder indicated by the welding requirement information matches the feeding parameter information of the feeding control device, the feeding control device is controlled to heat the internal molten solder to the molten solder temperature indicated by the welding requirement information. The molten solder, having reached the specified temperature, is fed into the target wave soldering oven. The acquisition of the welding requirements information of the target wave soldering furnace includes: The target solder liquid field and target temperature field corresponding to the target wave soldering oven are retrieved from the wave soldering oven control system. The wave soldering oven control system records corresponding wave soldering ovens, solder liquid fields, and temperature fields. The solder liquid field indicates the type of solder liquid allowed to be used in the corresponding wave soldering oven during PCB soldering, and the temperature field indicates the required temperature of the solder liquid in the corresponding wave soldering oven during PCB soldering. The soldering requirements information are determined based on the target solder liquid field and target temperature field. Alternatively, identify the PCB board model that the target wave soldering oven is allowed to solder; determine the reference solder type corresponding to the PCB board model as the solder type of the solder inside the target wave soldering oven during operation, and determine the solder temperature that the solder needs to reach during operation of the target wave soldering oven according to the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information, wherein the reference solder type is the solder type that is allowed to be used for soldering PCB boards of the PCB board model; The step of identifying the PCB board model that the target wave soldering oven is allowed to solder includes: identifying the PCB board model by identifying the material code of the PCB board, or using an image recognition model to compare the features of the PCB board to identify the PCB board model; The feeding control device is equipped with one or more molten solder tanks. When the feeding control device is equipped with one molten solder tank, multiple independent molten solder storage compartments are set in a single molten solder tank. Different molten solder tanks or different molten solder storage compartments are used to store molten solder of different types. The step of controlling the feeding control device to heat the molten solder inside to the molten solder temperature indicated by the soldering requirement information includes: controlling the molten solder tank or molten solder storage compartment that matches the molten solder type indicated by the soldering requirement information to independently heat the molten solder inside to the molten solder temperature indicated by the soldering requirement information. The step of acquiring the welding requirement information of the target wave soldering furnace includes: passively receiving the welding requirement information issued by the wave soldering furnace control system, wherein the welding requirement information is stored in one or more information storage terminals, and the information storage terminals include at least one of the following: the target wave soldering furnace, the wave soldering furnace control system, and the server in the background of the target wave soldering furnace. When the welding requirement information is modified, the welding requirement information in one or more information storage terminals is updated synchronously in real time and pushed to the feeding control equipment in real time.

2. The method according to claim 1, characterized in that, The step of determining the required solder temperature of the target wave soldering furnace during operation based on the board size corresponding to the PCB board model includes: When the board size is larger than the preset size, the first preset temperature is determined as the solder temperature that the solder needs to reach during the operation of the target wave soldering furnace; When the board size is less than or equal to the preset size, the second preset temperature is determined as the solder temperature that the solder needs to reach during the operation of the target wave soldering furnace, wherein the second preset temperature is less than the first preset temperature.

3. A molten tin feeding control device, characterized in that, include: The equipment includes a carrier, a molten solder tank, a drive unit, a control unit, and a temperature control unit, wherein the molten solder tank, the drive unit, the control unit, and the temperature control unit are mounted on the equipment carrier. The control device is used to acquire the soldering requirement information of the target wave soldering furnace, and when the solder liquid type indicated by the soldering requirement information matches the feeding parameter information of the feeding control device, it sends a temperature control command to the temperature control device. The soldering requirement information is used to indicate the solder liquid type inside the target wave soldering furnace during operation, as well as the solder liquid temperature that the solder liquid needs to reach. The temperature control device is used to respond to the temperature control command sent by the control device and heat the molten solder inside the molten solder tank to the molten solder temperature indicated by the soldering requirement information. The driving device is used to control the feeding of molten solder to the target wave soldering furnace when the molten solder reaches the specified temperature. The acquisition of the welding requirements information of the target wave soldering furnace includes: The control device is used to search for the target solder liquid field and target temperature field corresponding to the target wave soldering furnace from the wave soldering furnace control system. The wave soldering furnace control system records corresponding wave soldering furnaces, solder liquid fields, and temperature fields. The solder liquid field indicates the type of solder liquid allowed to be used in the corresponding wave soldering furnace during PCB soldering, and the temperature field indicates the temperature the solder liquid needs to reach in the corresponding wave soldering furnace during PCB soldering. The device determines the soldering requirement information based on the target solder liquid field and target temperature field. Alternatively, the control device is used to identify the PCB board model that the target wave soldering oven is allowed to solder; determine the reference solder type corresponding to the PCB board model as the solder type of the solder inside the target wave soldering oven during operation; and determine the solder temperature that the solder needs to reach during operation of the target wave soldering oven according to the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information, wherein the reference solder type is the solder type that is allowed to be used for soldering PCB boards of the PCB board model; The step of identifying the PCB board model that the target wave soldering oven is allowed to solder includes: the control device is used to identify the PCB board model by identifying the material code of the PCB board, or to use an image recognition model to compare the features of the PCB board to identify the PCB board model; The feeding control device is equipped with one or more solder tanks. When the feeding control device is equipped with one solder tank, multiple independent solder storage compartments are set in a single solder tank. Different solder tanks or different solder storage compartments are used to store solder of different types. The step of responding to the temperature control command sent by the control device and heating the solder inside the solder tank to the solder temperature indicated by the soldering requirement information includes: controlling the solder tank or solder storage compartment that matches the solder type indicated by the soldering requirement information to independently heat the solder inside to the solder temperature indicated by the soldering requirement information. The step of acquiring the welding requirement information of the target wave soldering furnace includes: passively receiving the welding requirement information issued by the wave soldering furnace control system, wherein the welding requirement information is stored in one or more information storage terminals, and the information storage terminals include at least one of the following: the target wave soldering furnace, the wave soldering furnace control system, and the server in the background of the target wave soldering furnace. When the welding requirement information is modified, the welding requirement information in one or more information storage terminals is updated synchronously in real time and pushed to the feeding control equipment in real time.

4. The device according to claim 3, characterized in that, The drive device includes: a drive motor, a coupling, and an oil pump, wherein the coupling is assembled between the drive motor and the oil pump; The oil pump is used to pump the molten tin inside the molten tin storage tank to the target wave soldering furnace. The drive motor is used to provide power during the process of the oil pumping gear pump drawing solder liquid; The coupling is used to adjust the speed at which the oil-pumping gear pump draws in the solder liquid.

5. The device according to claim 3, characterized in that, It also includes: a stirring device; The stirring device is used to stir the molten tin during the heating process inside the molten tin storage tank.

6. The device according to claim 5, characterized in that, The stirring device includes: a stirring mechanism, a transmission screw, and a stirring motor, wherein the transmission screw is assembled between the stirring mechanism and the stirring motor, and the stirring mechanism is deployed inside the molten tin storage tank; The stirring mechanism is used to stir the molten tin during the heating process inside the molten tin storage tank. The stirring motor is used to provide power for the stirring mechanism. The transmission screw is used to transmit the power provided by the stirring motor to the stirring mechanism.

7. A device for controlling the feeding of molten tin, characterized in that, include: The acquisition module is used to acquire the welding requirement information of the target wave soldering oven, wherein the welding requirement information is used to indicate the type of solder liquid inside the target wave soldering oven during operation, and the solder liquid temperature that the solder liquid needs to reach. The first control module is used to control the feeding control device to heat the internal molten solder to the molten solder temperature indicated by the welding requirement information when the type of molten solder indicated by the welding requirement information matches the feeding parameter information of the feeding control device. The second control module is used to control the feeding of molten solder to the target wave soldering furnace when the molten solder reaches the specified temperature. The acquisition module includes: A lookup unit is used to look up the target solder liquid field and target temperature field corresponding to the target wave soldering oven from the wave soldering oven control system. The wave soldering oven control system records corresponding wave soldering ovens, solder liquid fields, and temperature fields. The solder liquid field indicates the type of solder liquid allowed to be used in the corresponding wave soldering oven during PCB board soldering, and the temperature field indicates the temperature the solder liquid needs to reach in the corresponding wave soldering oven during PCB board soldering. A first determination unit is used to determine the soldering requirement information based on the target solder liquid field and target temperature field. Alternatively, the identification unit is used to identify the PCB board model that the target wave soldering oven is allowed to solder; the second determination unit is used to determine the reference solder type corresponding to the PCB board model as the solder type of the solder inside the target wave soldering oven during operation, and determine the solder temperature that the solder needs to reach during operation of the target wave soldering oven according to the board size corresponding to the PCB board model, thereby obtaining the soldering requirement information, wherein the reference solder type is the solder type that is allowed to be used for soldering PCB boards of the PCB board model; The identification unit is further configured to: identify the material code of the PCB board to obtain the PCB board model, or to use an image recognition model to compare the features of the PCB board to identify the PCB board model; The feeding control device is equipped with one or more molten solder tanks. When the feeding control device is equipped with one molten solder tank, multiple independent molten solder storage compartments are set in a single molten solder tank. Different molten solder tanks or different molten solder storage compartments are used to store molten solder of different types. The first control module is also used to: control the molten solder tank or molten solder storage compartment that matches the type of molten solder indicated by the welding requirement information, and independently heat the molten solder inside to the temperature of the molten solder indicated by the welding requirement information. The acquisition module is further configured to: passively receive the welding requirement information issued by the wave soldering furnace control system, wherein the welding requirement information is stored in one or more information storage terminals, and the information storage terminals include at least one of the following: the target wave soldering furnace, the wave soldering furnace control system, and the server in the background of the target wave soldering furnace. When the welding requirement information is modified, the welding requirement information in one or more information storage terminals is updated synchronously in real time and pushed to the feeding control device in real time.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored program, wherein the program, when executed, performs the method of any one of claims 1 to 2.

9. An electronic device comprising a memory and a processor, characterized in that, The memory stores a computer program, and the processor is configured to execute the method of any one of claims 1 to 2 through the computer program.

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