Abnormal vibration source detection device and apparatus

Abstract

The application discloses an abnormal vibration source detection device and equipment, a control module outputs a detection pulse signal to the transducer and outputs a reference electric signal to the signal processing module; the transducer converts the detection pulse signal into a detection acoustic signal and emits the detection acoustic signal to a product to be detected, and converts a detection echo signal reflected by the product to be detected into a detection electric signal and transmits the detection electric signal to the signal processing module; the signal processing module outputs a plurality of detection signals corresponding to the product to be detected and a spatial position parameter of the product to be detected according to the detection electric signal and the reference electric signal; an image processing module constructs a detection three-dimensional structure image of the product to be detected according to the plurality of detection signals and the spatial position parameter, and determines an abnormal vibration source position of the product to be detected according to the detection three-dimensional structure image. The three-dimensional structure image of the product to be detected can be constructed based on the detection echo signal generated by the product to be detected reflecting the detection acoustic signal, so that the abnormal vibration source position is determined, and the positioning efficiency of the abnormal component is improved.

Description

Technical Field

[0001] This invention relates to the field of detection technology, and in particular to an abnormal vibration source detection device and equipment. Background Technology

[0002] With the development of artificial intelligence, smart speaker products are constantly iterating and improving in order to provide users with good voice interaction and excellent sound quality. If the speaker structure is not designed properly, the speaker may cause other related components inside the speaker to resonate and generate noise when it emits sound, resulting in poor sound quality. At present, it is impossible to accurately detect the location of abnormal vibration sources in smart speakers, resulting in low efficiency in improving abnormal speakers.

[0003] The above content is only used to help understand the technical solution of the present invention and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main objective of this invention is to propose an abnormal vibration source detection device, which aims to solve the technical problem that the location of abnormal vibration sources in smart speakers cannot be accurately detected in the prior art, resulting in low efficiency in improving abnormal speakers.

[0005] To achieve the above objectives, the present invention proposes an abnormal vibration source detection device, which includes: a control module, a transducer, a signal processing module, and an image processing module. The control module is connected to the transducer and the signal processing module, the transducer is connected to the signal processing module, and the signal processing module is connected to the image processing module.

[0006] The control module is used to output a detection pulse signal to the transducer and to output a reference electrical signal to the signal processing module.

[0007] The transducer is used to convert the detection pulse signal into a detection acoustic signal and transmit it to the product to be tested, and to convert the detection echo signal reflected by the product to be tested into a detection electrical signal and transmit it to the signal processing module.

[0008] The signal processing module is used to output multiple detection signals corresponding to the product to be tested and the spatial position parameters of the product to be tested based on the detection electrical signal and the reference electrical signal.

[0009] The image processing module is used to construct a detection three-dimensional structural image of the product to be detected based on the multiple detection signals and the spatial position parameters, and to determine the location of the abnormal vibration source of the product to be detected based on the detection three-dimensional structural image.

[0010] Optionally, there are multiple transducers arranged along a first direction of the product to be tested, and the multiple transducers emit detection sound signals toward a second direction of the product to be tested, wherein the first direction is different from the second direction.

[0011] Optionally, the control module includes a control unit, a main oscillator, a control circuit, and a pulse transmitting unit. The control unit and the pulse transmitting unit are both connected to the transducer. The control unit is also connected to the main oscillator and the signal processing module. The main oscillator and the control circuit are both connected to the pulse transmitting unit.

[0012] The control unit is used to control the main oscillator to output an initial detection pulse signal to the pulse transmission unit;

[0013] The control circuit is used to control the pulse transmitting unit to convert the initial detection pulse signal into a detection pulse signal and then output it to the transducer.

[0014] Optionally, the control unit is further configured to control the transducer to convert the detection pulse signal into a detection acoustic signal and then transmit it to the product to be tested; and

[0015] The transducer is controlled to convert the detection echo signal reflected by the product under test into a detection electrical signal and then transmit it to the signal processing module.

[0016] Optionally, the main oscillator is further configured to output a reference electrical signal to the signal processing module according to the control command output by the control unit.

[0017] Optionally, the signal processing module includes a signal amplifier, a range gate circuit, a phase demodulation unit, and a conversion unit. The input terminal of the signal amplifier is connected to the transducer, the output terminal of the signal amplifier is connected to the range gate circuit, the controlled terminal of the range gate circuit is connected to the control unit, the output terminal of the range gate circuit is connected to the input terminal of the phase demodulation unit, the output terminal of the master oscillator is also connected to the input terminal of the phase demodulation unit, and the output terminal of the phase demodulation unit is connected to the input terminal of the conversion unit.

[0018] The signal amplifier is used to amplify the detection electrical signal output by the transducer into a detection amplified electrical signal and then output it to the distance gate circuit.

[0019] The distance gate circuit is used to determine the spatial position parameters of the product to be tested based on the detection amplified electrical signal;

[0020] The phase demodulation unit is used to extract the effective echo signal from the detection amplified electrical signal based on the reference electrical signal;

[0021] The conversion unit is used to convert the effective echo signal into multiple detection signals corresponding to the product to be tested.

[0022] Optionally, the conversion unit includes an analog-to-digital converter, a fast Fourier transform unit, and a digital-to-analog converter. The input terminal of the analog-to-digital converter is connected to the input terminal of the phase demodulation unit, the output terminal of the analog-to-digital converter is connected to the input terminal of the fast Fourier transform unit, and the output terminal of the fast Fourier transform unit is connected to the input terminal of the digital-to-analog converter.

[0023] The analog-to-digital converter is used to convert the effective echo signal into an effective echo digital signal and then transmit it to the fast Fourier transform unit.

[0024] The Fast Fourier Transform unit is used to transform the effective echo digital signal into multiple sub-digital signals;

[0025] The digital-to-analog converter is used to convert the plurality of sub-digital signals into corresponding plurality of detection signals.

[0026] Optionally, the image processing module includes an interferometric imaging unit, the input of which is connected to the output of the digital-to-analog converter;

[0027] The interferometric imaging unit is used to construct a three-dimensional structural image of the product to be inspected based on the spatial position parameters and the multiple detection signals, using the principle of interferometric imaging.

[0028] Optionally, the image processing module further includes a comparison unit, the input of which is connected to the output of the interferometric imaging unit;

[0029] The comparison unit is used to compare the detected three-dimensional structural image with the reference static three-dimensional structural image corresponding to the product to be tested, and to determine the location of the abnormal vibration source of the product to be tested based on the comparison result.

[0030] To achieve the above objectives, the present invention also proposes an abnormal vibration source detection device, which includes the abnormal vibration source detection apparatus as described above.

[0031] This invention proposes an abnormal vibration source detection device, comprising: a control module, a transducer, a signal processing module, and an image processing module. The control module is connected to both the transducer and the signal processing module, the transducer is connected to the signal processing module, and the signal processing module is connected to the image processing module. The control module is used to output a detection pulse signal to the transducer and a reference electrical signal to the signal processing module. The transducer is used to convert the detection pulse signal into a detection acoustic signal and transmit it to the product under test, and to convert the detection echo signal reflected by the product under test into a detection electrical signal and transmit it to the signal processing module. The signal processing module is used to output multiple detection signals corresponding to the product under test and spatial position parameters of the product under test based on the detection electrical signal and the reference electrical signal. The image processing module is used to construct a detection three-dimensional structural image of the product under test based on the multiple detection signals and the spatial position parameters, and to determine the location of the abnormal vibration source of the product under test based on the detection three-dimensional structural image. This invention transmits a detection acoustic signal to the product under test and converts the reflected detection echo signal into a detection electrical signal, which is then transmitted to a signal processing module. The signal processing module outputs multiple detection signals and spatial position parameters of the product under test based on the detection electrical signal and a reference electrical signal. The image processing module constructs a three-dimensional structural image of the product under test based on the multiple detection signals and spatial position parameters, and determines the location of abnormal vibration sources based on this three-dimensional structural image. This invention can construct a three-dimensional structural image of the product under test based on the detection echo signal generated by the reflected detection acoustic signal, thereby determining the location of abnormal vibration sources and improving the positioning efficiency of abnormal components. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0033] Figure 1 This is a functional block diagram of the first embodiment of the abnormal vibration source detection device of the present invention;

[0034] Figure 2(a) is a schematic diagram of the detection echo signal after the vibration sound wave and reflected sound wave of the abnormal vibration source are coupled in one embodiment of the abnormal vibration source detection device of the present invention;

[0035] Figure 2(b) is a schematic diagram of detecting echo signals in a static state in one embodiment of the abnormal vibration source detection device of the present invention;

[0036] Figure 3This is a schematic diagram showing the positional relationship between the transducer and the speaker in one embodiment of the abnormal vibration source detection device of the present invention;

[0037] Figure 4 This is a functional block diagram of the second embodiment of the abnormal vibration source detection device of the present invention;

[0038] Figure 5 This is a functional block diagram of the third embodiment of the abnormal vibration source detection device of the present invention;

[0039] Figure 6 This is a functional block diagram of an embodiment of the abnormal vibration source detection device of the present invention;

[0040] Figure 7 This is a functional block diagram of an embodiment of the abnormal vibration source detection device of the present invention.

[0041] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0044] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0045] This invention proposes an abnormal vibration source detection device.

[0046] Reference Figure 1In the first embodiment of the present invention, the abnormal vibration source detection device includes: a control module 100, a transducer 200, a signal processing module 300, and an image processing module 400. The control module 100 is connected to the transducer 200 and the signal processing module 300, the transducer 200 is connected to the signal processing module 300, and the signal processing module 300 is connected to the image processing module 400.

[0047] The control module 100 is used to output a detection pulse signal to the transducer 200 and to output a reference electrical signal to the signal processing module 300.

[0048] It is understandable that the detection pulse signal can be a pulse electrical signal used to detect abnormal vibration sources; the reference electrical signal can be an electrical signal used as a reference; and the transducer can be a device that converts electrical energy and acoustic energy into each other. The transducer includes a transmitting transducer and a receiving transducer. The transmitting transducer can convert electrical energy into acoustic energy, and the receiving transducer can convert acoustic energy into electrical energy.

[0049] The transducer 200 is used to convert the detection pulse signal into a detection acoustic signal and transmit it to the product to be tested, and to convert the detection echo signal reflected by the product to be tested into a detection electrical signal and transmit it to the signal processing module 300.

[0050] It is understood that the detection sound signal can be a sound signal used for abnormal vibration source detection; the product to be tested can be a product that needs to be detected for abnormal vibration sources, including but not limited to smart speakers, Bluetooth speakers, or other products with the same or similar functions; the detection echo signal can be the sound signal reflected by the product to be tested after the detection sound signal reaches the product to be tested; if there is no abnormal vibration source at the location where the detection echo signal is reflected on the product to be tested, then the signal frequency of the detection echo signal is the same as the signal frequency of the detection sound signal; if there is an abnormal vibration source at the location where the detection echo signal is reflected on the product to be tested, then the detection echo signal captured by the transducer includes the reflected signal of the detection sound signal and the vibration signal of the abnormal vibration source. At this time, the reflected signal and the vibration signal are coupled to form the detection echo signal, and the frequency of the detection echo signal is different from the frequency of the detection sound signal.

[0051] In one implementation, the transmitting transducer converts the detection pulse signal into a detection acoustic signal and transmits it to the product under test. The detection acoustic signal is reflected back from the product under test and received by the receiving transducer, which converts the received detection echo signal into a detection electrical signal and transmits it to the signal processing module.

[0052] The signal processing module 300 is used to output multiple detection signals corresponding to the product to be tested and the spatial position parameters of the product to be tested based on the detection electrical signal and the reference electrical signal.

[0053] It is understandable that spatial location parameters can be the location parameters of the product to be tested in the testing space.

[0054] As one implementation method, the signal processing module is used to extract the valid detection signal from the detection signal based on the reference electrical signal, convert the valid detection signal into multiple corresponding detection signals, and determine the spatial position parameters of the product to be detected based on the time of receiving the detection echo signal.

[0055] The image processing module 400 is used to construct a detection three-dimensional structural image of the product to be detected based on the plurality of detection signals and the spatial position parameters, and to determine the location of the abnormal vibration source of the product to be detected based on the detection three-dimensional structural image.

[0056] It is understandable that the detected three-dimensional structural image can be a three-dimensional structural image of the product to be inspected in the inspection space. The detected three-dimensional structural image is constructed based on spatial position parameters and detection signals. The location of abnormal vibration sources of the product to be inspected is determined based on the detected three-dimensional structural image and the reference static three-dimensional structural image.

[0057] As one implementation, assuming the product to be tested is a speaker, the control module 100 outputs a detection pulse signal to the transducer 200. The transmitting transducer in the transducer 200 converts the detection pulse signal output by the control module 100 into an acoustic signal with a frequency of f0. After the acoustic signal reaches the target speaker, it is reflected by different components of the speaker to form a detection echo signal, which is then received by the receiving transducer in the transducer 200. The detection echo signal is converted into a detection electrical signal and output to the signal processing module. The signal processing module 300 outputs multiple detection signals and spatial position parameters of the product to be tested based on the detection electrical signal and the reference electrical signal. The image processing module 400 generates a three-dimensional structure of the target speaker based on the multiple detection signals and spatial position parameters using the principle of interferometric imaging. When the components inside the target speaker are static, the signal only experiences a time delay, and the frequency of the detection echo signal is consistent with the frequency f0 of the detection acoustic signal. When an abnormal vibration source exists inside the target speaker, the detection echo signal captured by the transducer will contain two sound waves: the vibration sound wave f1 of the abnormal vibration source and the reflected sound wave f0 of the detection sound signal. The frequency of the echo signal formed by the coupling of these two sound waves can be represented by f2. That is, when there is an abnormal vibration source inside the speaker, it will cause a frequency delay, resulting in a difference between the frequency of the detection echo signal and the frequency of the detection sound signal. This difference can be used to effectively identify the abnormal vibration source inside the target speaker. Figure 2(a) is a schematic diagram of the detection echo signal after the coupling of the vibration sound wave and the reflected sound wave of the abnormal vibration source. Figure 2(b) is a schematic diagram of the detection echo signal in a static state. It can be seen from the figures that when there is an abnormal vibration source, there is a difference between the frequency of the detection echo signal and the frequency of the detection sound signal.

[0058] Furthermore, in order to improve the accuracy of abnormal vibration source detection, there are multiple transducers 200, which are arranged along a first direction of the product to be tested, and the multiple transducers 200 emit detection sound signals to a second direction of the product to be tested, where the first direction is different from the second direction.

[0059] It is understood that the first direction can be the width or length direction of the product to be tested, and the second direction can be the width or length direction of the product to be tested; if the first direction is the width direction of the product to be tested, then the second direction is the length direction of the product to be tested; if the first direction is the length direction of the product to be tested, then the second direction is the width direction of the product to be tested; the number of transducers can be determined according to the specific testing scenario, and this embodiment does not impose any restrictions.

[0060] Furthermore, in order to improve the detection efficiency of abnormal vibration sources, the first direction is perpendicular to the second direction.

[0061] In one example, assuming the product to be tested is a speaker, refer to... Figure 3 , Figure 3This diagram illustrates the positional relationship between the transducers and the speaker enclosure. Multiple transducers 200 are arranged along the X-axis of the target speaker enclosure 500, covering its entire size in the X-axis direction. During abnormal vibration source detection, the control module 100 outputs detection pulse signals to the multiple transducers 200 and a reference electrical signal to the signal processing module 300. The transducers 200 convert the received detection pulse signals into detection acoustic signals and then scan along the Y-axis of the target speaker enclosure 500. The scanning area covers the entire space of the target speaker enclosure. Upon reaching the target speaker enclosure, the detection acoustic signal... The reflection generates a detection echo signal. After the transducer receives the corresponding detection echo signal, it converts the detection echo signal into a detection electrical signal and outputs it to the signal processing module. The signal processing module processes the detection echo signal into multiple corresponding detection signals and determines the spatial position parameters of the target speaker based on the reception time of each detection echo signal. The image processing module constructs a detection three-dimensional structural image of the target speaker based on the spatial position parameters and the multiple detection signals corresponding to each detection echo signal, using the principle of interferometric imaging. Based on the detection three-dimensional structural image, the location of the abnormal vibration source in the target speaker is determined.

[0062] This embodiment proposes an abnormal vibration source detection device, comprising: a control module, a transducer, a signal processing module, and an image processing module. The control module is connected to both the transducer and the signal processing module, the transducer is connected to the signal processing module, and the signal processing module is connected to the image processing module. The control module is used to output a detection pulse signal to the transducer and a reference electrical signal to the signal processing module. The transducer is used to convert the detection pulse signal into a detection acoustic signal and transmit it to the product under test, and to convert the detection echo signal reflected by the product under test into a detection electrical signal and transmit it to the signal processing module. The signal processing module is used to output multiple detection signals corresponding to the product under test and spatial position parameters of the product under test based on the detection electrical signal and the reference electrical signal. The image processing module is used to construct a detection three-dimensional structural image of the product under test based on the multiple detection signals and the spatial position parameters, and to determine the location of the abnormal vibration source of the product under test based on the detection three-dimensional structural image. This invention transmits a detection acoustic signal to the product under test and converts the reflected detection echo signal into a detection electrical signal, which is then transmitted to a signal processing module. The signal processing module outputs multiple detection signals and spatial position parameters of the product under test based on the detection electrical signal and a reference electrical signal. The image processing module constructs a three-dimensional structural image of the product under test based on the multiple detection signals and spatial position parameters, and determines the location of abnormal vibration sources based on this three-dimensional structural image. This invention can construct a three-dimensional structural image of the product under test based on the detection echo signal generated by the reflected detection acoustic signal, thereby determining the location of abnormal vibration sources and improving the positioning efficiency of abnormal components.

[0063] Reference Figure 4 In a second embodiment of the present invention, the control module 100 includes a control unit 101, a main oscillator 102, a control circuit 103, and a pulse transmitting unit 104. The control unit 101 and the pulse transmitting unit 104 are both connected to the transducer 200. The control unit 101 is also connected to the main oscillator 102 and the signal processing module 300. The main oscillator 102 and the control circuit 103 are both connected to the pulse transmitting unit 104.

[0064] The control unit 101 is used to control the main oscillator 102 to output an initial detection pulse signal to the pulse transmission unit 104.

[0065] It is understandable that the master oscillator is an energy conversion device that can convert DC power into AC power with a certain frequency. The circuit it forms is called an oscillation circuit. The initial detection pulse signal can be the pulse electrical signal output by the control unit controlling the master oscillator.

[0066] The control circuit 103 is used to control the pulse transmitting unit 104 to convert the initial detection pulse signal into a detection pulse signal and then output it to the transducer 200.

[0067] It is understandable that the control circuit converts the initial detection pulse signal into a detection pulse signal with a repetitive frequency by controlling the on and off of the pulse transmission unit; the initial detection pulse signal is a continuous signal, and the frequency of the initial pulse detection signal is the same as the frequency of the detection pulse signal.

[0068] As one implementation, the control module 100 is a central mechanism with the control unit 101 and the main oscillator 102 as its core. The control unit 101 controls the main oscillator 102 to generate an initial detection pulse signal with a certain frequency, which is then transmitted to the pulse transmission unit 104. The control circuit 103 controls the pulse formation period of the pulse transmission unit 104, thereby converting the initial detection pulse signal into a detection pulse signal and outputting it. The initial detection pulse signal generated by the main oscillator 102 is divided into two paths. One path passes through the control circuit 103 and is given to the pulse transmission circuit 104 to modulate the continuous signal into a detection pulse signal with a repetitive frequency, which is then transmitted to the transducer 200 for signal transmission. The other path is transmitted to the signal processing module as a reference electrical signal.

[0069] Furthermore, in order to improve the detection efficiency of abnormal vibration sources, the control unit 101 is also used to control the transducer 200 to convert the detection pulse signal into a detection acoustic signal and then transmit it to the product to be tested; and to control the transducer 200 to convert the detection echo signal reflected by the product to be tested into a detection electrical signal and then transmit it to the signal processing module 300.

[0070] As one implementation, the control unit 101 controls the transmitting transducer in the transducer 200 to convert the detection pulse signal into a detection acoustic signal and then scan it in the second direction of the product to be tested; the control unit 101 also controls the receiving transducer in the transducer 200 to convert the detection echo signal reflected by the product to be tested into a detection electrical signal and then transmit it to the signal processing unit.

[0071] Furthermore, to eliminate interference from noise signals, the main oscillator 102 is also used to output a reference electrical signal to the signal processing module according to the control command output by the control unit 101.

[0072] It is understandable that the control command can be a command that controls the output signal of the master oscillator.

[0073] The control module in this embodiment includes a control unit, a main oscillator, a control circuit, and a pulse transmitting unit. Both the control unit and the pulse transmitting unit are connected to the transducer. The control unit is also connected to the main oscillator and the signal processing module. Both the main oscillator and the control circuit are connected to the pulse transmitting unit. The control unit controls the main oscillator to output an initial detection pulse signal to the pulse transmitting unit. The control circuit controls the pulse transmitting unit to convert the initial detection pulse signal into a detection pulse signal and then output it to the transducer.

[0074] In this embodiment, the control unit controls the main oscillator to output an initial detection pulse signal to the pulse transmission unit. The control circuit controls the pulse transmission unit to convert the initial detection pulse signal into a detection pulse signal and then output it to the transducer. This can convert a continuous signal into a detection pulse signal with a repetitive frequency, so that the transducer can convert the detection pulse signal into an acoustic signal to detect the product under test. This not only detects the product under test with abnormal vibration sources, but also determines the location of the abnormal vibration source in the product under test based on the difference between the detection echo signal and the detection acoustic signal, thus improving the accuracy of abnormal vibration source detection.

[0075] Reference Figure 5In a third embodiment of the present invention, the signal processing module 300 includes a signal amplifier 301, a range gate circuit 302, a phase demodulation unit 303, and a conversion unit 34. The input terminal of the signal amplifier 301 is connected to the transducer 200, the output terminal of the signal amplifier 301 is connected to the range gate circuit 302, the controlled terminal of the range gate circuit 302 is connected to the control unit 101, the output terminal of the range gate circuit 302 is connected to the input terminal of the phase demodulation unit 303, the output terminal of the master oscillator 102 is also connected to the input terminal of the phase demodulation unit 303, and the output terminal of the phase demodulation unit 303 is connected to the input terminal of the conversion unit 34.

[0076] The signal amplifier 301 is used to amplify the detection electrical signal output by the transducer 200 into a detection amplified electrical signal and then output it to the distance gate circuit 302.

[0077] It is understandable that the detection amplified electrical signal can be an electrical signal obtained by amplifying the detection electrical signal.

[0078] The distance gate circuit 302 is used to determine the spatial position parameters of the product to be tested based on the detection amplified electrical signal.

[0079] It is understandable that the distance gate circuit 302 can be an electronic circuit that can select a signal within a specified time. The distance gate circuit 302 uses the time delay method to measure distance, which is equal to time multiplied by the speed of light divided by 2. Therefore, as long as the time is known, the distance of the product to be tested can be known. The distance gate circuit 302 can accurately capture the time of the detection electrical signal. Its specific working principle is as follows: the distance gate circuit opens and closes in a specific time sequence, automatically forming a circuit that samples the time. Each switch corresponds to a specific distance. When there is a target echo signal, i.e., a detection electrical signal, if the signal passes through when a certain distance gate is closed, the distance information of the component on the product to be tested can be determined according to the sequence number of the distance gate. The distance information corresponding to each detection electrical signal constitutes the control position parameters of the product to be tested.

[0080] The phase demodulation unit 303 is used to extract the effective echo signal from the detection amplified electrical signal based on the reference electrical signal.

[0081] It should be noted that, because the transmitting and receiving transducers are very close, some of the transmitted signal from the transmitting transducer may pass through and directly couple to the receiving transducer; these unwanted waves are called clutter. The phase demodulation unit 303 can extract the effective echo signal from the complex detection electrical signal. The phase demodulation unit 303 compares the received reference electrical signal with the detection amplified electrical signal to obtain the phase difference of the signal, effectively eliminating the interference of clutter signals, thereby extracting the effective echo signal from the detection amplified electrical signal.

[0082] The conversion unit 34 is used to convert the effective echo signal into multiple detection signals corresponding to the product to be tested.

[0083] Understandably, the conversion unit converts the valid echo signal into multiple detection signals with different amplitudes, phases, and frequencies.

[0084] Furthermore, referring to Figure 6 To improve the accuracy of abnormal vibration source detection, the conversion unit 34 includes an analog-to-digital converter 304, a fast Fourier transform unit 305, and a digital-to-analog converter 306. The input terminal of the analog-to-digital converter 304 is connected to the input terminal of the phase demodulation unit 303, the output terminal of the analog-to-digital converter 304 is connected to the input terminal of the fast Fourier transform unit 305, and the output terminal of the fast Fourier transform unit 305 is connected to the input terminal of the digital-to-analog converter 306.

[0085] The analog-to-digital converter 304 is used to convert the effective echo signal into an effective echo digital signal and then transmit it to the fast Fourier transform unit 305.

[0086] The Fast Fourier Transform unit 305 is used to transform the effective echo digital signal into multiple sub-digital signals.

[0087] The digital-to-analog converter 306 is used to convert the plurality of sub-digital signals into corresponding plurality of detection signals.

[0088] As one implementation, the signal processing module 300 preamplifies the multi-channel acoustic signal received by the transducer 200 through the signal amplifier 301, and then passes it through the distance gate circuit 302, phase demodulation 303, analog-to-digital converter 304, fast Fourier transform 305 and digital-to-analog converter 306, thereby decomposing the complex effective echo signal into many detection signals with different amplitudes, phases and frequencies, thus simplifying the analysis of complex information in diagnosis.

[0089] Furthermore, referring to Figure 7In order to accurately locate the position of abnormal vibration source in the product to be tested, the image processing module 400 includes an interference imaging unit 401, the input end of which is connected to the output end of the digital-to-analog converter 306;

[0090] The interferometric imaging unit 401 is used to construct a detection three-dimensional structural image of the product to be detected based on the spatial position parameters and the multiple detection signals, using the principle of interferometric imaging.

[0091] Understandably, the interferometric imaging unit performs three-dimensional structural imaging based on the spatial position parameters of the product under test and multiple detection signals of each effective echo signal, thereby obtaining a three-dimensional structural image of the product under test.

[0092] Furthermore, continue to refer to Figure 7 In order to accurately locate the position of abnormal vibration source in the product to be tested, the image processing module 400 further includes a comparison unit 402, the input end of the comparison unit 402 being connected to the output end of the interferometric imaging unit 401; the comparison unit 402 is used to compare the detected three-dimensional structural image with the reference static three-dimensional structural image corresponding to the product to be tested, and determine the position of abnormal vibration source of the product to be tested based on the comparison result.

[0093] In one example, assuming the product to be tested is a smart speaker, the detected 3D structural image is compared with a reference static 3D structural image. Based on the differences between the two images, the abnormal vibration source in the smart speaker can be identified, thereby locating the component in the smart speaker that is causing abnormal vibration.

[0094] In this embodiment, the detection electrical signal is first amplified. The distance gate circuit determines the spatial position parameters of the product to be tested based on the amplified signal. The phase demodulation unit extracts the effective echo signal from the amplified detection electrical signal based on the reference electrical signal. The conversion unit converts the effective echo signal into multiple detection signals. The image processing unit constructs a three-dimensional structural image based on the spatial position parameters and the multiple detection signals corresponding to each effective echo signal, using the principle of interferometric imaging. This decomposes the complex waveform into multiple simple waveforms, simplifying the analysis of complex information in diagnosis and improving the detection efficiency of abnormal vibration sources.

[0095] To achieve the above objectives, the present invention also proposes an abnormal vibration source detection device, which includes the abnormal vibration source detection apparatus as described above. The specific structure of this device is as described in the above embodiments. Since this device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here.

[0096] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An abnormal vibration source detection device, characterized in that, The abnormal vibration source detection device includes: a control module, a transducer, a signal processing module, and an image processing module. The control module is connected to the transducer and the signal processing module, the transducer is connected to the signal processing module, and the signal processing module is connected to the image processing module. The control module is used to output a detection pulse signal to the transducer and to output a reference electrical signal to the signal processing module. The transducer is used to convert the detection pulse signal into a detection acoustic signal and transmit it to the product to be tested, and to convert the detection echo signal reflected by the product to be tested into a detection electrical signal and transmit it to the signal processing module. There are multiple transducers, which are arranged along a first direction of the product to be tested. The multiple transducers transmit detection acoustic signals to a second direction of the product to be tested, and the first direction is perpendicular to the second direction. The signal processing module is used to output multiple detection signals corresponding to the product to be tested and the spatial position parameters of the product to be tested based on the detection electrical signal and the reference electrical signal. The image processing module is used to construct a detection three-dimensional structural image of the product to be detected based on the multiple detection signals and the spatial position parameters, and to determine the location of the abnormal vibration source of the product to be detected based on the detection three-dimensional structural image.

2. The abnormal vibration source detection device as described in claim 1, characterized in that, The control module includes a control unit, a main oscillator, a control circuit, and a pulse transmission unit. The control unit and the pulse transmission unit are both connected to the transducer. The control unit is also connected to the main oscillator and the signal processing module. The main oscillator and the control circuit are both connected to the pulse transmission unit. The control unit is used to control the main oscillator to output an initial detection pulse signal to the pulse transmission unit; The control circuit is used to control the pulse transmitting unit to convert the initial detection pulse signal into a detection pulse signal and then output it to the transducer.

3. The abnormal vibration source detection device as described in claim 2, characterized in that, The control unit is further configured to control the transducer to convert the detection pulse signal into a detection acoustic signal and then transmit it to the product to be tested; and The transducer is controlled to convert the detection echo signal reflected by the product under test into a detection electrical signal and then transmit it to the signal processing module.

4. The abnormal vibration source detection device as described in claim 2, characterized in that, The main oscillator is also used to output a reference electrical signal to the signal processing module according to the control command output by the control unit.

5. The abnormal vibration source detection device as described in any one of claims 2-4, characterized in that, The signal processing module includes a signal amplifier, a range gate circuit, a phase demodulation unit, and a conversion unit. The input terminal of the signal amplifier is connected to the transducer, the output terminal of the signal amplifier is connected to the range gate circuit, the controlled terminal of the range gate circuit is connected to the control unit, the output terminal of the range gate circuit is connected to the input terminal of the phase demodulation unit, the output terminal of the main oscillator is also connected to the input terminal of the phase demodulation unit, and the output terminal of the phase demodulation unit is connected to the input terminal of the conversion unit. The signal amplifier is used to amplify the detection electrical signal output by the transducer into a detection amplified electrical signal and then output it to the distance gate circuit. The distance gate circuit is used to determine the spatial position parameters of the product to be tested based on the detection amplified electrical signal; The phase demodulation unit is used to extract the effective echo signal from the detection amplified electrical signal based on the reference electrical signal; The conversion unit is used to convert the effective echo signal into multiple detection signals corresponding to the product to be tested.

6. The abnormal vibration source detection device as described in claim 5, characterized in that, The conversion unit includes an analog-to-digital converter, a fast Fourier transform unit, and a digital-to-analog converter. The input terminal of the analog-to-digital converter is connected to the input terminal of the phase demodulation unit, the output terminal of the analog-to-digital converter is connected to the input terminal of the fast Fourier transform unit, and the output terminal of the fast Fourier transform unit is connected to the input terminal of the digital-to-analog converter. The analog-to-digital converter is used to convert the effective echo signal into an effective echo digital signal and then transmit it to the fast Fourier transform unit. The Fast Fourier Transform unit is used to transform the effective echo digital signal into multiple sub-digital signals; The digital-to-analog converter is used to convert the plurality of sub-digital signals into corresponding plurality of detection signals.

7. The abnormal vibration source detection device as described in claim 6, characterized in that, The image processing module includes an interferometric imaging unit, the input of which is connected to the output of the digital-to-analog converter. The interferometric imaging unit is used to construct a three-dimensional structural image of the product to be inspected based on the spatial position parameters and the multiple detection signals, using the principle of interferometric imaging.

8. The abnormal vibration source detection device as described in claim 7, characterized in that, The image processing module further includes a comparison unit, the input of which is connected to the output of the interferometric imaging unit; The comparison unit is used to compare the detected three-dimensional structural image with the reference static three-dimensional structural image corresponding to the product to be tested, and to determine the location of the abnormal vibration source of the product to be tested based on the comparison result.

9. An abnormal vibration source detection device, characterized in that, The abnormal vibration source detection equipment includes the abnormal vibration source detection device as described in any one of claims 1-8.

Images