A method of controlling an infrared readout circuit

Abstract

The application provides a control method of an infrared readout circuit, comprising: after the infrared readout circuit is powered on, the infrared readout circuit controls a shutter to open, so that each pixel in the infrared array senses a temperature value of the shutter; when each pixel in the infrared array senses the temperature value of the shutter, the infrared readout circuit determines an optimal value of a correction parameter corresponding to each pixel in the infrared array; after the optimal value of the correction parameter corresponding to each pixel is determined, the infrared readout circuit controls the shutter to close, so that each pixel in the infrared array senses an actual target temperature value of a target scene; when each pixel in the infrared array senses the actual target temperature value, the infrared readout circuit determines a voltage response value corresponding to each pixel based on the optimal value of the correction parameter corresponding to the pixel, and outputs the voltage response value corresponding to each pixel in the infrared array to the outside. According to the technical scheme, the non-uniformity correction does not need to be realized by an external processor, and the hardware resource consumption is reduced.

Description

Technical Field

[0001] This application relates to the field of infrared temperature measurement technology, and in particular to a control method for an infrared readout circuit. Background Technology

[0002] Thermal imaging temperature measurement is a non-contact temperature measurement method that can acquire the temperature value of a target object in a target scene. For example, an infrared array can include multiple pixels, each of which can be a thermistor, or sensor unit. For each pixel, after the infrared thermal radiation from the target scene reaches that pixel, the pixel can sense the ambient temperature, thereby changing the pixel's resistance value and controlling the current value passing through that pixel. Based on this current value, the corresponding voltage response value of the pixel can be determined and output. Based on this voltage response value, the corresponding temperature value of the pixel can be determined.

[0003] In thermal imaging temperature measurement, the mapping relationship (i.e., functional relationship) between voltage and temperature values ​​needs to be pre-calibrated. Therefore, based on the voltage response value corresponding to each pixel, this mapping relationship can be queried to obtain the temperature value corresponding to that pixel. In summary, the temperature value corresponding to each pixel can be obtained, and these temperature values ​​corresponding to these pixels are also the temperature values ​​corresponding to the target objects in the target scene.

[0004] Due to variations in manufacturing processes, different pixels may respond differently to the same amount of infrared radiation. For example, if the voltage response values ​​for pixel 1 and pixel 2 differ when the same infrared radiation reaches them, it will cause image inhomogeneity. This difference needs to be corrected, and this correction method is called non-uniformity correction. However, there is currently no reasonable method for performing non-uniformity correction. It is mainly achieved through external processors, but the correction effect is relatively poor. Summary of the Invention

[0005] This application provides an infrared readout circuit, comprising: a focal plane integration readout unit, a correction unit, and a digital control unit; the focal plane integration readout unit is connected to an infrared array, the infrared array comprising multiple pixels, and for each pixel in the infrared array:

[0006] The correction unit is used to determine an initial bias value based on the parameter value to be corrected corresponding to the pixel, and output the initial bias value to the focal plane integration readout unit.

[0007] The focal plane integration readout unit is used to determine the voltage response value corresponding to the pixel based on the first current corresponding to the initial bias value and the second current output by the pixel response temperature value.

[0008] The digital control unit is used to adjust the parameter value to be corrected based on the comparison result of the voltage response value and the preset voltage value to obtain the adjusted parameter value, determine the optimal value of the correction parameter corresponding to the pixel based on the adjusted parameter value, and replace the parameter value to be corrected corresponding to the pixel with the optimal value of the correction parameter corresponding to the pixel.

[0009] This application provides a control method for an infrared readout circuit, wherein the infrared readout circuit is connected to an infrared array, the infrared array comprising multiple pixels, and the method includes:

[0010] After the infrared readout circuit is powered on, the infrared readout circuit controls the baffle to open so that each pixel in the infrared array can sense the temperature value of the baffle.

[0011] When each pixel in the infrared array senses the temperature value of the baffle, the infrared readout circuit determines the optimal value of the correction parameter corresponding to each pixel in the infrared array.

[0012] After the optimal value of the correction parameter corresponding to each pixel has been determined, the infrared readout circuit controls the baffle to close, so that each pixel in the infrared array can sense the actual target temperature value of the target scene.

[0013] When each pixel in the infrared array senses the actual target temperature value, the infrared readout circuit determines the voltage response value corresponding to that pixel based on the optimal value of the correction parameter corresponding to each pixel, and outputs the voltage response value corresponding to each pixel in the infrared array to the outside.

[0014] As can be seen from the above technical solutions, the infrared readout circuit designed in this application is an uncooled infrared on-chip non-uniformity automatic correction readout circuit. Non-uniformity correction is achieved by the infrared readout circuit itself, eliminating the need for an external processor. This reduces the overhead of external hardware resources, lowers costs, simplifies development, and provides better correction results. By providing different bias voltage values ​​to different pixels (different bias voltage values ​​are controlled by the optimal values ​​of different correction parameters), the difference in response of different pixels to the same infrared radiation is corrected, making the response of different pixels to the same infrared radiation consistent. This method is called non-uniformity correction. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments of this application or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings of the embodiments of this application.

[0016] Figure 1 This is a schematic diagram of the infrared readout circuit in one embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the infrared readout circuit in one embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the storage format of a storage unit in one embodiment of this application;

[0019] Figure 4 This is a schematic diagram illustrating the reading of the parameter value to be corrected from the storage unit in one embodiment of this application;

[0020] Figure 5 This is a schematic diagram of the operation of the infrared readout circuit in one embodiment of this application;

[0021] Figure 6 This is a schematic flowchart of the control method for the infrared readout circuit in one embodiment of this application. Detailed Implementation

[0022] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “the,” and “the” as used in this application and claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to any and all possible combinations comprising one or more of the associated listed items.

[0023] It should be understood that although the terms first, second, third, etc., may be used to describe various information in embodiments of this application, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" may also be interpreted as "when," "when," or "in response to a determination."

[0024] Thermal imaging devices may include thermal imaging cameras (such as cameras and video cameras that use thermal imaging to measure temperature, such as infrared thermal imaging cameras), infrared arrays (also known as focal plane arrays, which are circuits composed of a large number of pixels), baffles, and external processors.

[0025] An infrared array can include multiple pixels, each of which can be a thermistor. For each pixel, after the infrared thermal radiation from the target scene reaches that pixel, the pixel can sense the ambient temperature, thereby changing the resistance value of the pixel and controlling the current value passing through the pixel. Based on this current value, the voltage response value corresponding to the pixel is determined and output to an external processor. In other words, the voltage response value corresponding to each pixel can be output to an external processor.

[0026] Based on the pre-calibrated mapping relationship between voltage and temperature values, after obtaining the voltage response value corresponding to each pixel, the external processor can query the mapping relationship to obtain the temperature value corresponding to each pixel. The temperature values ​​corresponding to these pixels are the actual target temperature values ​​of the target scene.

[0027] A baffle is a device used to block the lens of a thermal imaging device. When the baffle is open, it blocks the lens, and in this case, the temperature value sensed by each pixel in the infrared array is the temperature value of the baffle; different pixels will sense the same temperature value. When the baffle is closed, it does not block the lens, and in this case, the temperature value sensed by each pixel in the infrared array is the temperature value of the external target (i.e., the temperature value of the target object to be detected); different pixels may sense different temperature values.

[0028] Due to variations in the manufacturing process, different pixels may respond differently to the same infrared radiation, resulting in image inhomogeneity. This difference needs to be corrected before imaging; this correction method is called non-uniformity correction. In related technologies, non-uniformity correction is mainly achieved through an external processor, but the correction effect is poor and it consumes the resources of the external processor, wasting processing power.

[0029] To address the aforementioned issues, this application proposes an infrared readout circuit connected to an infrared array. This circuit corrects the temperature values ​​sensed by each pixel within the array, achieving non-uniformity correction directly from the infrared readout circuit, eliminating the need for an external processor. This reduces external hardware resource overhead, lowers costs, simplifies development, and provides better correction results. For example, the thermal imaging device may also include an infrared readout circuit capable of correcting the non-uniformity of the voltage response value corresponding to a pixel and outputting the corrected voltage response value to an external processor. The external processor then no longer needs to perform non-uniformity correction on the voltage response value and can directly determine the temperature value based on it.

[0030] The structure and function of the infrared readout circuit of this embodiment will be described below with reference to specific embodiments.

[0031] See Figure 1The diagram shown illustrates the structure of an infrared readout circuit, which may include, but is not limited to, a focal plane integration readout unit, a correction unit, a digital control unit, a storage unit, a comparison logic unit, and an ADC (analog-to-digital converter). This infrared readout circuit can be connected to an infrared array, which may include a large number of pixels. Figure 1 Taking M*N pixels as an example, this means that there are N pixels in each row, and a total of M rows of pixels. The number of ADCs can be N, meaning that all pixels in each column correspond to the same ADC.

[0032] See Figure 1 As shown, each column of M pixels corresponds to the same ADC, meaning that the ADC performs analog-to-digital conversion on the voltage response values ​​of the M pixels in one column. See subsequent embodiments for details. All pixels (i.e., M*N pixels) correspond to the same correction unit, meaning that one correction unit provides bias values ​​to the M*N pixels. See subsequent embodiments for details. All pixels correspond to the same digital control unit, meaning that one digital control unit determines the optimal correction parameter values ​​corresponding to the M*N pixels. See subsequent embodiments for details. All pixels correspond to the same storage unit, meaning that one storage unit stores the values ​​of the parameters to be corrected or the optimal correction parameters corresponding to the M*N pixels. See subsequent embodiments for details. All pixels correspond to the same comparison logic unit, meaning that one comparison logic unit performs the comparison operation (i.e., comparing the voltage response values ​​and preset voltage values) for the M*N pixels. See subsequent embodiments for details.

[0033] Since the processing method for each pixel in the infrared array is the same, for ease of description, the processing process of one pixel will be used as an example in the following embodiments.

[0034] See Figure 2 The diagram shown is a schematic of an infrared readout circuit. This infrared readout circuit may include, but is not limited to, a focal plane integration readout unit, a correction unit, a digital control unit, a storage unit, a comparison logic unit, and an ADC. The focal plane integration readout unit is connected to the infrared array, and the infrared array may include a large number of pixels (e.g., M*N pixels). For ease of description, Figure 2 The following explanation uses a single pixel as an example.

[0035] For example, an infrared array can also be called an infrared focal plane array or an uncooled infrared focal plane array. It is an array composed of infrared sensitive pixels (hereinafter referred to as pixels). These infrared sensitive pixels can absorb external infrared radiation and cause the pixels to heat up. The heating causes a change in the resistance of the heat-sensitive material. Moreover, this array can work in environments that are not absolute zero.

[0036] For example, the infrared readout circuit is an uncooled infrared readout circuit that integrates on-chip automatic non-uniformity correction function, which can complete the automatic correction of pixel non-uniformity on the chip without the need for off-chip operation.

[0037] This infrared readout circuit supports two operating states: correction state (also known as automatic correction state) and readout state (also known as normal readout state). After power-on reset, the infrared readout circuit first enters the correction state. In the correction state, the optimal correction parameter values ​​for each pixel are obtained and written to the storage unit. After the correction state ends, it enters the readout state. In the readout state, the optimal correction parameter values ​​in the storage unit are used to correct the voltage response value of the pixel, and the corrected voltage response value is output. That is, the correction is completed in the infrared readout circuit.

[0038] The following combination Figure 2 The infrared readout circuit shown describes the functions of the focal plane integration readout unit, correction unit, digital control unit, storage unit, comparison logic unit, and ADC.

[0039] I. Focal Plane Integration Readout Unit. The focal plane integration readout unit is used to determine the voltage response value corresponding to a pixel based on the first current corresponding to the initial bias voltage value and the second current output by the pixel response temperature value. The second current output by the pixel response temperature value refers to the change in the pixel's resistance value when the temperature value of the test target sensed by the pixel changes. This change in the pixel's resistance value causes a change in the second current corresponding to the pixel; that is, the second current is related to the temperature value of the test target sensed by the pixel.

[0040] See Figure 2 As shown, the focal plane integration readout unit may include a resistor Rd, a first MOS (Metal-Oxide-Semiconductor Field-Effect Transistor), a second MOS transistor, an integration circuit, and a sample-and-hold circuit. It should be noted that... Figure 2 Although pixel Rs is placed inside the focal plane integration readout unit, this is only for the convenience of explaining the connection relationship between pixel Rs and the focal plane integration readout unit. Pixel Rs does not belong to the device of the focal plane integration readout unit.

[0041] The integrating circuit consists of an operational amplifier, a switch rst, and an integrating capacitor Cint.

[0042] Among them, the sample-and-hold circuit, also known as the sample-and-hold amplifier, is used to achieve the conversion accuracy of analog signals when performing analog-to-digital conversion. During this conversion time, the analog signal must remain basically unchanged.

[0043] See Figure 2 As shown, the input voltage of the first MOSFET is the bias value VEB. In the correction state, this bias value VEB is called the initial bias value VEB, which is the bias value determined by the correction unit based on the value of the parameter to be corrected. In the readout state, this bias value VEB is called the target bias value VEB, which is the bias value determined by the correction unit based on the optimal value of the correction parameter.

[0044] In the correction state, the larger the initial bias voltage VEB, the larger the current I1 (denoted as the first current I1) flowing through the first MOSFET. That is, the initial bias voltage VEB and the first current I1 are positively correlated. Clearly, by controlling the initial bias voltage VEB, the magnitude of the first current I1 can be adjusted. Similarly, in the readout state, the larger the target bias voltage VEB, the larger the current I1 (denoted as the third current I1) flowing through the first MOSFET. That is, the target bias voltage VEB and the third current I1 are positively correlated. For ease of description, in the following embodiments, the processing in the correction state is used as an example, where the input voltage of the first MOSFET is the initial bias voltage VEB, and the current flowing through the first MOSFET is the first current I1; that is, the initial bias voltage VEB corresponds to the first current I1.

[0045] See Figure 2 As shown, the input voltage of the second MOSFET is the voltage value VFID, which is a fixed voltage value. The working principle of this second MOSFET will not be described in detail in this embodiment.

[0046] See Figure 2 As shown, pixel Rs is a resistive element in the infrared array. For example, pixel Rs can be a MEMS (Micro-Electro-Mechanical Systems) thermistor; the type of pixel Rs is not limited. In practical applications, the number of pixels Rs can be multiple. Figure 2 Take a single pixel Rs as an example. Pixel Rs is used to convert infrared signals into electrical signals. In other words, when infrared thermal radiation from the target scene reaches pixel Rs, pixel Rs can sense the ambient temperature, thereby changing the resistance value of pixel Rs and controlling the current value passing through pixel Rs, i.e., current I2.

[0047] In the correction state, the baffles can be turned on for the infrared array. The temperature values ​​at all positions on the baffles are the same. Thus, for each pixel, taking pixel Rs as an example, the ambient temperature sensed by pixel Rs is the temperature value of the baffle. For ease of distinction, the temperature value sensed by pixel Rs is recorded as the test target temperature value; that is, the test target temperature value is the temperature value of the baffle. Clearly, based on the test target temperature value sensed by pixel Rs, the current I2 passing through pixel Rs (referred to as the second current I2) is controlled, meaning the second current I2 matches the test target temperature value sensed by pixel Rs. In the readout state, the baffles can be turned off for the infrared array. Thus, for each pixel, taking pixel Rs as an example, the ambient temperature sensed by pixel Rs is the actual target temperature value of the target scene. Clearly, based on the actual target temperature value sensed by pixel Rs, the current I2 passing through pixel Rs (referred to as the fourth current I2) can be controlled, meaning the fourth current I2 matches the actual target temperature value of the target scene sensed by pixel Rs.

[0048] For ease of description, in the following embodiments, the processing of the correction state is taken as an example, that is, the current I2 of the pixel Rs is the second current I2, and the second current I2 matches the test target temperature value sensed by the pixel Rs.

[0049] See Figure 2 As shown, the integrating circuit can be connected to the first MOSFET, the integrating circuit can be connected to the pixel Rs, and the integrating circuit can be connected to the sample-and-hold circuit. The input current Iint of the integrating circuit can also be called the integrating current Iint, and the input current Iint can be determined based on the first current I1 and the second current I2. That is, the first current I1 corresponding to the initial bias value VEB and the second current I2 of the pixel Rs can be determined. Then, the input current Iint corresponding to the integrating circuit can be determined based on the first current I1 and the second current I2. For example, the input current Iint can be determined as follows: Iint = I1 - I2.

[0050] Given the input current Iint, an integrating circuit can be used to integrate it, without restrictions on the integration process, to obtain the voltage input value Vo_int corresponding to pixel Rs. For example, the integrating circuit can be used to integrate and amplify the weak electrical signal of pixel Rs, and the output of the integrated amplification is the voltage input value Vo_int. For instance, the voltage input value Vo_int can be determined as follows: Vo_int = Vref - Iint * Tint / Cint, where Vref is the input voltage of the operational amplifier, Iint is the input current, Tint is the on-time of the switch int (i.e., the integration time), and Cint is the integrating capacitor.

[0051] See Figure 2 As shown, the input of the sample-and-hold circuit is the voltage input value Vo_int, and the output of the sample-and-hold circuit is the voltage response value Vo. The voltage input value Vo_int can be sampled and held by the sample-and-hold circuit to obtain the voltage response value Vo corresponding to the pixel Rs. That is, Vo = Vo_int.

[0052] When performing analog-to-numerical conversion on an analog signal, a certain conversion time is required. During this conversion time, the analog signal must remain basically unchanged in order to ensure conversion accuracy. The sample-and-hold circuit is the circuit that implements this function. This embodiment does not restrict the operation of the sample-and-hold circuit.

[0053] In summary, for pixel Rs, the input voltage of the first MOSFET is the initial bias value VEB, and the current flowing through the first MOSFET is the first current I1 corresponding to the initial bias value VEB. The output of pixel Rs in response to the temperature value is the second current I2. The sum of the first current I1 and the second current I2 can be determined as the input current Iint of the integrator circuit. The input current Iint is input to the integrator circuit to perform an integration operation on the input current Iint, obtaining the voltage input value Vo_int corresponding to pixel Rs. Then, based on the voltage input value Vo_int corresponding to pixel Rs, the voltage response value Vo corresponding to pixel Rs is determined. For example, the voltage input value Vo_int corresponding to pixel Rs is input to the sample-and-hold circuit to sample and hold the voltage input value Vo_int, obtaining the voltage response value Vo corresponding to pixel Rs.

[0054] After obtaining the voltage response value Vo corresponding to pixel Rs, the focal plane integration readout unit can also input the voltage response value Vo to the ADC, which will then process the data based on the voltage response value Vo.

[0055] II. ADC (Analog to Digital Converter). An ADC is used to obtain the voltage response value from the focal plane integration readout unit, perform analog-to-digital conversion on the voltage response value to obtain the digital signal voltage response value, and output the digital signal voltage response value to the comparison logic unit.

[0056] See Figure 2 As shown, the focal plane integration readout unit can input the voltage response value Vo of the analog signal to the ADC, which then performs analog-to-digital conversion on the voltage response value Vo of the analog signal to obtain the voltage response value Vo of the digital signal, and outputs the voltage response value Vo of the digital signal to the comparison logic unit.

[0057] For example, it may be agreed that the voltage response value Vo of the digital signal is a K-bit binary value. In this case, the parameter value to be corrected is a K-bit binary value, and the preset voltage value is also a K-bit binary value. There is no restriction on the value of K, for example, K can be 4, 8, etc., and the subsequent description will take 4 as an example.

[0058] On this basis, when the ADC converts the voltage response value Vo of the analog signal corresponding to the pixel Rs into the voltage response value Vo of the digital signal, the voltage response value Vo is a K-bit binary value (that is, a K-bit code value).

[0059] III. Comparison logic unit. The comparison logic unit is configured to determine a logic value based on the voltage response value and the configured preset voltage value, and output the logic value to the digital control unit. Wherein, if the voltage response value is less than the preset voltage value, the logic value may be a first value (e.g., 1); or, if the voltage response value is greater than the preset voltage value, the logic value may be a second value (e.g., 0).

[0060] See Figure 2 , the comparison logic unit can acquire the preset voltage value Vtag. For example, the digital control unit can acquire the preset voltage value Vtag and send the preset voltage value Vtag to the comparison logic unit. Wherein, the preset voltage value Vtag may be the preset voltage value Vtag of a digital signal, such as a K-bit binary value, and the preset voltage value Vtag may also be referred to as a correction target value Vtag. There is no restriction on the value of the preset voltage value Vtag, and it can be configured based on experience. On this basis, after obtaining the voltage response value Vo of the digital signal corresponding to the pixel Rs, the comparison logic unit can compare the voltage response value Vo with the preset voltage value Vtag.

[0061] If the voltage response value Vo is less than the preset voltage value Vtag (i.e., Vo < Vtag), the comparison logic unit determines that the logic value is the first value, and outputs the logic value corresponding to the pixel Rs (i.e., the first value) to the digital control unit. If the voltage response value Vo is greater than the preset voltage value Vtag (i.e., Vo > Vtag), the comparison logic unit determines that the logic value is the second value, and outputs the logic value corresponding to the pixel Rs (i.e., the second value) to the digital control unit. In this embodiment, there is no restriction on both the first value and the second value. For convenience of description, in the subsequent embodiments, the first value is 1 and the second value is 0 as an example.

[0062] Exemplarily, in the correction state, the digital control unit can enable the comparison logic, that is, issue an enable command to the comparison logic unit, so that the comparison logic unit executes the comparison logic, that is, compares the voltage response value Vo with the preset voltage value Vtag. When Vo < Vtag, the comparison logic unit outputs 1 to the digital control unit; otherwise, the comparison logic unit outputs 0 to the digital control unit.

[0063] In readout mode, the digital control unit can disable the comparison logic by sending an enable command to the comparison logic unit, causing the comparison logic unit to disable the comparison logic. After disabling the comparison logic, the comparison logic unit no longer compares the voltage response value Vo and the preset voltage value Vtag, nor does it output a logic value.

[0064] In readout mode, the comparison logic unit directly performs a parallel-to-serial conversion on the voltage response value Vo output by the ADC, and outputs the voltage response value Vo corresponding to each pixel in sequence according to the timing sequence. In other words, the voltage response value Vo corresponding to each pixel in the infrared array is provided to the external processor. This process will not be described in detail.

[0065] IV. Digital Control Unit. The digital control unit adjusts the parameter value to be corrected based on the comparison between the voltage response value and the preset voltage value, and obtains the adjusted parameter value. Based on the adjusted parameter value, it determines the optimal correction parameter value for the corresponding pixel, and replaces the parameter value to be corrected for that pixel with the optimal correction parameter value. In other words, the digital control unit writes the optimal correction parameter value into the storage unit.

[0066] For example, in the process of adjusting the parameter value to be corrected based on the comparison result of the voltage response value and the preset voltage value to obtain the adjusted parameter value, if the comparison result is that the voltage response value is less than the preset voltage value, then the parameter value to be corrected is increased to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, then the parameter value to be corrected is decreased to obtain the adjusted parameter value.

[0067] For example, in the process of determining the optimal value of the correction parameter corresponding to a pixel based on the adjusted parameter value, if the number of adjustments to the parameter value to be corrected has reached the target number of adjustments, then the adjusted parameter value is determined as the optimal value of the correction parameter corresponding to the pixel. If the number of adjustments to the parameter value to be corrected has not reached the target number of adjustments, then the adjusted parameter value is determined as the parameter value to be corrected corresponding to the pixel, and the parameter value to be corrected is written into the storage unit so as to redetermine the voltage response value corresponding to the pixel based on the parameter value to be corrected.

[0068] In one possible implementation, the voltage response value can be output to the digital control unit (i.e., without involving a comparison logic unit or its comparison logic, the voltage response value is directly provided to the digital control unit), and the digital control unit can pre-configure the aforementioned preset voltage value. In this case, the digital control unit can obtain the voltage response value and the preset voltage value, and then determine the comparison result between the voltage response value and the preset voltage value. The comparison result is that the voltage response value is less than the preset voltage value, or the voltage response value is greater than the preset voltage value. Then, the value of the parameter to be corrected is adjusted based on the comparison result.

[0069] In another possible implementation, the logic value can be output to the digital control unit (i.e., involving a comparison logic unit, which performs comparison logic and provides the comparison result (i.e., the logic value) to the digital control unit). In this case, the digital control unit can obtain the logic value and determine the comparison result between the voltage response value and the preset voltage value based on the logic value. The comparison result is that the voltage response value is less than the preset voltage value, or the voltage response value is greater than the preset voltage value. Then, the value of the parameter to be corrected is adjusted based on the comparison result. For example, if the logic value is a first value of 1, the comparison result can be determined to be that the voltage response value is less than the preset voltage value; if the logic value is a first value of 0, the comparison result can be determined to be that the voltage response value is greater than the preset voltage value. Obviously, in this implementation, since the logic value can reflect the comparison result between the voltage response value and the preset voltage value, the digital control unit can directly adjust the value of the parameter to be corrected based on the logic value.

[0070] In the above embodiments, when the digital control unit adjusts the value of the parameter to be corrected based on the comparison result of the voltage response value and the preset voltage value, the voltage response value can be the voltage response value of the digital signal, and the preset voltage value can be the preset voltage value of the digital signal. That is to say, the digital control unit adjusts the value of the parameter to be corrected based on the comparison result of the voltage response value of the digital signal and the preset voltage value of the digital signal.

[0071] See Figure 2 As shown, the comparison logic unit can output a logic value to the digital control unit. If the logic value is the first value 1, the digital control unit determines that the voltage response value is less than the preset voltage value and increases the value of the parameter to be corrected to obtain the adjusted parameter value. If the logic value is the second value 0, the digital control unit determines that the voltage response value is greater than the preset voltage value and decreases the value of the parameter to be corrected to obtain the adjusted parameter value.

[0072] For example, the digital control unit can switch between a correction state and a readout state. In the correction state, it obtains the logic value corresponding to each pixel and adjusts the value of the parameter to be corrected based on the logic value. See the following embodiments for details. In the readout state, it controls the correction unit to read the optimal value of the correction parameter from the storage unit, completes the non-uniformity correction, and disables the comparison logic to ensure that the voltage response value of the ADC is output normally.

[0073] In this embodiment, in order to determine the optimal value of the correction parameter corresponding to the pixel, the successive approximation method or the sequential traversal method can be used to adjust the value of the correction parameter corresponding to the pixel to obtain the optimal value of the correction parameter corresponding to the pixel. Of course, the successive approximation method and the sequential traversal method are just examples, and this embodiment does not limit them, as long as the value of the correction parameter can be adjusted to obtain the optimal value of the correction parameter.

[0074] Regarding the successive approximation method, the conversion idea is similar to weighing on a balance scale. Starting with the heaviest weight, it is placed and compared with the object being weighed. If the object is heavier than the weight, the weight is kept; otherwise, it is removed. Then, the second heaviest weight is added, and so on, until the smallest weight is added. The weights of all the remaining weights are added together to obtain the weight of the object. The successive approximation method in this embodiment follows a similar principle, except that the corresponding "weights" here are the code values ​​of binary numbers from the most significant bit to the least significant bit. Regarding the sequential traversal method, all weight values ​​can be placed sequentially, and the closest value is selected to approximate the comparison value.

[0075] The following describes, with reference to specific embodiments, the process of adjusting the value of the parameter to be corrected corresponding to the pixel using the successive approximation method or the sequential traversal method to obtain the optimal value of the correction parameter corresponding to the pixel.

[0076] Method 1: The digital control unit (DCU) uses a successive approximation method to adjust the value of the parameter to be corrected corresponding to the pixel, obtaining the optimal value of the correction parameter for the pixel. In Method 1, the DCU can use a successive approximation method to adjust the value of the parameter to be corrected. When the value of the parameter to be corrected is a K-bit binary value, the target number of adjustments is K. Specifically, if the voltage response value is less than the preset voltage value, the DCU can use a successive approximation method to determine the target adjustment bit of the parameter to be corrected; if the target adjustment bit is 0, then the value of the target adjustment bit is changed to 1 to obtain the adjusted parameter value. If the voltage response value is greater than the preset voltage value, the DCU can use a successive approximation method to determine the target first adjustment bit and the target second adjustment bit of the parameter to be corrected, where the target first adjustment bit is the bit preceding the target second adjustment bit; if the value of the target first adjustment bit is 1 and the value of the target second adjustment bit is 0, then the value of the target first adjustment bit is changed to 0 and the value of the target second adjustment bit is changed to 1 to obtain the adjusted parameter value.

[0077] For example, if the parameter to be corrected is a 4-bit binary value, such as 1000, then the target number of adjustments is 4. In this case, the adjustment process of the successive approximation method can be seen in Table 1.

[0078] Table 1

[0079] Comparison results < > > < Logical value 1 0 0 1 Parameter values ​​to be corrected 1000(8) 1100(12) 1010(10) 1001(9) Adjusted parameter values 1100(12) 1010(10) 1001(9) 1001(9)

[0080] In correction cycle 1 (i.e., the number of adjustments is 1): the value of the parameter to be corrected is 1000 (8). The initial bias value is determined based on the value of the parameter to be corrected, 1000 (see the following embodiments for the specific process), and the initial bias value is output to the focal plane integration readout unit. In this case, if the voltage response value Vo < the preset voltage value Vtag, i.e. the logic value is 1, it means that the value of the parameter to be corrected, 1000, is less than the optimal value of the correction parameter (the final goal of optimization). Therefore, it is necessary to increase the value of the parameter to be corrected to obtain the adjusted parameter value.

[0081] Since the value of the parameter to be corrected is 1000, that is, the highest bit (the 4th bit) is 1 and the 3rd bit is 0, when using the successive approximation method to determine the target adjustment bit, the 3rd bit needs to be adjusted, that is, the target adjustment bit is the 3rd bit (traversing from the highest bit, the target adjustment bit is the bit after the last bit with a value of 1). Since the value of the target adjustment bit is 0, the value of the target adjustment bit is changed to 1, that is, the third bit of the parameter value to be corrected, 1000, is changed to 1, and the adjusted parameter value is 1100 (12).

[0082] Since the number of adjustments to the parameter value to be corrected 1 has not yet reached the target value of 4, the adjusted parameter value 1100(12) can be determined as the parameter value to be corrected corresponding to the pixel, and the parameter value to be corrected 1100(12) is written into the storage unit, that is, replacing the parameter value to be corrected 1000.

[0083] In correction cycle 2 (i.e., the number of adjustments is 2): the value of the parameter to be corrected is 1100 (12). Based on the value of the parameter to be corrected 1100, the initial bias value is determined and the initial bias value is output to the focal plane integration readout unit. In this case, if the voltage response value Vo>Vtag, i.e. the logic value is 0, it means that the value of the parameter to be corrected 1100 is greater than the optimal value of the correction parameter, and the value of the parameter to be corrected needs to be reduced to obtain the adjusted parameter value.

[0084] Since the value of the parameter to be corrected is 1100, that is, the 4th bit is 1, the 3rd bit is 1, and the 2nd bit is 0, when using the successive approximation method to determine the first adjustment bit and the second adjustment bit, the 3rd bit and the 2nd bit need to be adjusted. That is, the first adjustment bit is the 3rd bit and the second adjustment bit is the 2nd bit (traversing from the highest bit, the first adjustment bit is the last bit with a value of 1, and the second adjustment bit is the bit after the first adjustment bit). Since the value of the first adjustment bit is 1 and the value of the second adjustment bit is 0, the value of the first adjustment bit is changed to 0 and the value of the second adjustment bit is changed to 1, that is, the value of the parameter to be corrected, 1100, is changed to the adjusted value, 1010 (10).

[0085] Since the number of adjustments to the parameter value to be corrected 2 has not yet reached the target number of adjustments 4, the adjusted parameter value 1010(10) can be determined as the parameter value to be corrected corresponding to the pixel, and the parameter value to be corrected 1010(10) can be written into the storage unit, that is, replacing the parameter value to be corrected 1100.

[0086] In correction cycle 3 (i.e., the number of adjustments is 3): the value of the parameter to be corrected is 1010 (10). Based on the value of the parameter to be corrected 1010, the initial bias value is determined and the initial bias value is output to the focal plane integration readout unit. In this case, if the voltage response value Vo>Vtag, i.e. the logic value is 0, it means that the value of the parameter to be corrected 1010 is greater than the optimal value of the correction parameter, and the value of the parameter to be corrected needs to be reduced to obtain the adjusted parameter value.

[0087] Since the value of the parameter to be corrected is 1010, that is, the 4th bit is 1, the 3rd bit is 0, the 2nd bit is 1, and the 1st bit is 0, when using the successive approximation method to determine the first adjustment bit and the second adjustment bit of the target, the 2nd bit and the 1st bit need to be adjusted, that is, the first adjustment bit of the target is the 2nd bit and the second adjustment bit of the target is the 1st bit. The value of the first adjustment bit of the target can be modified to 0, and the value of the second adjustment bit of the target can be modified to 1, that is, the value of the parameter to be corrected, 1010, can be modified to the adjusted value of 1001 (9).

[0088] Since the number of adjustments to the parameter value to be corrected 3 has not yet reached the target number of adjustments 4, the adjusted parameter value 1001(9) can be determined as the parameter value to be corrected corresponding to the pixel, and the parameter value to be corrected 1001(9) is written into the storage unit, that is, replacing the parameter value to be corrected 1010.

[0089] In correction cycle 4 (i.e., the number of adjustments is 4): the value of the parameter to be corrected is 1001 (9). Based on the value of the parameter to be corrected 1001, the initial bias value is determined and the initial bias value is output to the focal plane integration readout unit. If the voltage response value Vo < the preset voltage value Vtag, i.e. the logic value is 1, it means that the value of the parameter to be corrected 1001 is less than the optimal value of the correction parameter, and the value of the parameter to be corrected needs to be increased to obtain the adjusted parameter value.

[0090] Since the value of the parameter to be corrected is 1001, that is, the 4th bit is 1, the 3rd bit is 0, the 2nd bit is 0, and the 1st bit is 1, when using the successive approximation method to determine the target adjustment bit, the 1st bit needs to be adjusted, that is, the target adjustment bit is the 1st bit (the last bit with a value of 1 is the 1st bit, and since there are no bits after the 1st bit, the 1st bit is taken as the target adjustment bit). Since the value of the target adjustment bit is 1, it is impossible to increase the target adjustment bit (that is, it is impossible to adjust the value of the target adjustment bit from 0 to 1), so the value of the target adjustment bit is kept unchanged at 1, and the adjusted parameter value is 1001 (9).

[0091] Since the number of adjustments to the parameter value to be corrected has reached the target value of 4, the adjusted parameter value 1001(9) can be determined as the optimal value of the correction parameter corresponding to the pixel. The optimal value of the correction parameter 1001(9) is written into the storage unit, that is, the parameter value to be corrected 1001 in the storage unit is replaced.

[0092] Thus, after four correction cycles, the optimal correction parameter value 1001(9) corresponding to the pixel was successfully found, and the optimal correction parameter value 1001 makes the voltage response value Vo of the pixel closest to the preset voltage value Vtag. In summary, for each pixel, the digital control unit can obtain the optimal correction parameter value corresponding to the pixel and write the optimal correction parameter value corresponding to the pixel into the storage unit.

[0093] Method 2: The digital control unit can use a sequential traversal method to adjust the value of the parameter to be corrected corresponding to the pixel to obtain the optimal value of the correction parameter for the pixel. In Method 2, the digital control unit can use a sequential traversal method to adjust the value of the parameter to be corrected. For example, when the value of the parameter to be corrected is a K-bit binary value, the target number of adjustments can be 2 to the power of K. For example, if the voltage response value is less than the preset voltage value, the digital control unit can use a sequential traversal method to increment the value of the parameter to be corrected by 1 to obtain the adjusted parameter value; if the voltage response value is greater than the preset voltage value, the digital control unit can use a sequential traversal method to decrement the value of the parameter to be corrected by 1 to obtain the adjusted parameter value.

[0094] For example, assuming the parameter to be corrected is a 4-bit binary value, such as 1000, the target number of adjustments is 16. In this case, the adjustment process of the sequential traversal method can be seen in Table 2. In Table 2, for ease of description, the parameter to be corrected and the adjusted parameter value are represented by decimal values ​​instead of binary values. In practical applications, the decimal values ​​can be replaced with the corresponding binary values.

[0095] Table 2

[0096]

[0097] In correction cycle 1 (i.e., adjustment count 1): the parameter value to be corrected is 8 (1000). Based on the parameter value to be corrected 8, the initial bias voltage value can be determined (see subsequent embodiments for the determination process), and the initial bias voltage value is output to the focal plane integration readout unit. In this case, if the voltage response value Vo < the preset voltage value Vtag, i.e., the logic value is 1, it indicates that the parameter value to be corrected 8 is less than the optimal value of the correction parameter, and the parameter value to be corrected needs to be increased to obtain the adjusted parameter value. Since the parameter value to be corrected is 8, the parameter value to be corrected 8 can be incremented by 1 using a sequential traversal method to obtain the adjusted parameter value 9 (1001). Since the adjustment count 1 of the parameter value to be corrected has not yet reached the target value of adjustment count 16, the adjusted parameter value 9 can be determined as the parameter value to be corrected corresponding to the pixel, and the parameter value to be corrected 9 is written into the storage unit.

[0098] In correction cycle 2 (i.e., adjustment count 2): the parameter value to be corrected is 9. Based on this value, an initial bias voltage is determined and output to the focal plane integration readout unit. If the voltage response value Vo < the preset voltage value Vtag (logic value 1), the parameter value to be corrected can be increased to obtain the adjusted parameter value. For example, by using a sequential traversal method to increment the parameter value 9 by 1, the adjusted parameter value 10 (1010) is obtained. Since the adjustment count 2 for the parameter value to be corrected has not yet reached the target adjustment count of 16, the adjusted parameter value 10 is determined as the parameter value to be corrected and written into the storage unit.

[0099] ...

[0100] In correction cycle 5 (i.e., the adjustment count is 5): the parameter value to be corrected is 12. Based on this value, an initial bias voltage is determined and output to the focal plane integration readout unit. If the voltage response value Vo > the preset voltage value Vtag (i.e., the logic value is 0), the parameter value to be corrected can be reduced to obtain the adjusted parameter value. For example, by using a sequential traversal method to subtract 1 from the parameter value 12, the adjusted parameter value 11 is obtained. Since the adjustment count 5 for the parameter value to be corrected has not yet reached the target adjustment count of 16, the adjusted parameter value 11 is determined as the parameter value to be corrected and written into the storage unit.

[0101] ...

[0102] In correction cycle 16 (i.e., adjustment count 16): the parameter value to be corrected is 11. Based on parameter value 11, an initial bias value is determined and output to the focal plane integration readout unit. If the voltage response value Vo < preset voltage value Vtag (logic value is 1), the parameter value to be corrected can be increased to obtain the adjusted parameter value. For example, by using a sequential traversal method to increment parameter value 11, the adjusted parameter value 12 is obtained. Since the adjustment count 16 for the parameter value to be corrected has reached the target value of 16, the adjusted parameter value 12 can be determined as the optimal correction parameter value corresponding to the pixel. The optimal correction parameter value 12 is written into the storage unit, replacing the parameter value 11 in the storage unit.

[0103] Thus, after 16 correction cycles, the optimal value of the correction parameter 12 (1100) corresponding to the pixel was successfully found, and the optimal value of the correction parameter 12 makes the voltage response value Vo of the pixel closest to the preset voltage value Vtag.

[0104] In summary, for each pixel, the digital control unit can obtain the optimal value of the correction parameter corresponding to that pixel and write the optimal value of the correction parameter corresponding to that pixel into the storage unit.

[0105] In summary, for the digital control unit, the optimal value of the correction parameter corresponding to each pixel in the infrared array can be determined and written into the storage unit.

[0106] V. Storage Unit. The storage unit is used to store the correction parameter values ​​corresponding to the pixels. After the digital control unit obtains the optimal correction parameter values, the storage unit is used to store the optimal correction parameter values ​​corresponding to the pixels.

[0107] For example, when using the successive approximation method, the digital control unit can acquire the parameter value to be corrected, 1000, and write it into the storage unit, where the storage unit stores the parameter value to be corrected, 1000. In correction cycle 1, the digital control unit acquires the parameter value to be corrected, 1100, and writes it into the storage unit, where the storage unit stores the parameter value to be corrected, 1100. In correction cycle 2, the digital control unit acquires the parameter value to be corrected, 1010, and writes it into the storage unit, where the storage unit stores the parameter value to be corrected, 1010. In correction cycle 3, the digital control unit acquires the parameter value to be corrected, 1001, and writes it into the storage unit, where the storage unit stores the parameter value to be corrected, 1001. In correction cycle 4, the digital control unit obtains the optimal value of the correction parameter 1001 and writes it into the storage unit, which stores the optimal value of the correction parameter 1001.

[0108] When using the sequential traversal method, the storage process of the storage unit is similar, and will not be described again in this embodiment.

[0109] For example, when the parameter value to be corrected is a K-bit binary value, the storage unit can include K data areas, each corresponding one-to-one with a K-bit binary value. Specifically, when storing the parameter value to be corrected corresponding to a pixel, the storage unit stores the m-th bit of the parameter value in the m-th data area, where m ranges from 1 to K. Similarly, when storing the optimal correction parameter value for a pixel, the storage unit stores the m-th bit of the optimal correction parameter value in the m-th data area.

[0110] For example, when the parameter value to be corrected is a 4-bit binary value, the storage unit can include four data areas, denoted as Data Area 1, Data Area 2, Data Area 3, and Data Area 4. Data Area 1 corresponds to the first bit (least significant bit) of the parameter value to be corrected, Data Area 2 corresponds to the second bit, Data Area 3 corresponds to the third bit, and Data Area 4 corresponds to the fourth bit (most significant bit). Based on this, the storage unit stores the first bit of the parameter value to be corrected (or the optimal value) through Data Area 1, the second bit through Data Area 2, the third bit through Data Area 3, and the fourth bit through Data Area 4.

[0111] In summary, the storage process for the parameter value to be corrected corresponding to each pixel (the storage method for the optimal value of the correction parameter is similar and will not be repeated later) involves first storing the first bit of the parameter value to be corrected in data area 1, then storing the second bit in data area 2, then the third bit in data area 3, and finally the fourth bit in data area 4. The reading process for the parameter value to be corrected corresponding to each pixel involves first reading the first bit from data area 1, then reading the second bit from data area 2, then the third bit from data area 3, and finally the fourth bit from data area 4. After obtaining these four values, they can be concatenated to obtain the parameter value to be corrected.

[0112] For example, in the correction state, the storage unit can cooperate with the digital control unit to store the values ​​of the parameters to be corrected, and these values ​​can be updated in each correction cycle. After the correction state is completed, the storage unit can store the optimal values ​​of the correction parameters. In the readout state, the optimal values ​​of the correction parameters corresponding to the pixel can be read from the storage unit, and subsequent correction processes can be performed based on these optimal values.

[0113] For example, the storage unit can use SRAM (Static Random Access Memory) to store the values ​​of the parameters to be corrected; that is, the storage unit stores the value of the parameters to be corrected corresponding to each pixel. See also Figure 1 As shown, if the total number of pixels is M*N, and the parameter value to be corrected is a K-bit binary value, then the storage size of the storage unit can be M*N*K bits. For ease of description, let's take a total number of pixels of 196*264 and a K-bit binary value as an example.

[0114] See Figure 3 The diagram shows the storage format of a storage unit. The storage unit can be divided into four data areas, which are denoted as data area 1, data area 2, data area 3 and data area 4.

[0115] Data area 1 stores the first value of the parameter to be corrected for each pixel (e.g., 196*264 pixels). For example, first store the first value of the parameter to be corrected for the 264 pixels in the first row, then store the first value of the parameter to be corrected for the 264 pixels in the second row, and so on, until finally storing the first value of the parameter to be corrected for the 264 pixels in the 196th row.

[0116] In addition, the second value of the parameter value to be corrected for each pixel is stored in data area 2. For example, the second value of the parameter value to be corrected for the 264 pixels in the first row is stored first, and so on, until the second value of the parameter value to be corrected for the 264 pixels in the 196th row is finally stored.

[0117] In addition, the third value of the parameter value to be corrected for each pixel is stored in data area 3. For example, the third value of the parameter value to be corrected for the 264 pixels in the first row is stored first, and so on, until the third value of the parameter value to be corrected for the 264 pixels in the 196th row is finally stored.

[0118] In addition, the fourth value of the parameter value to be corrected for each pixel is stored in data area 4. For example, the fourth value of the parameter value to be corrected for the 264 pixels in the first row is stored first, and so on, until the fourth value of the parameter value to be corrected for the 264 pixels in the 196th row is finally stored.

[0119] For example, since SRAM is written in address words (8 bits), the address range allocated for each row is 0-32 (2^64 / 8 = 33). The address range allocated for each parameter value to be corrected is 33 * 196 = 6468. Therefore, the address ranges of the four data areas are as follows: Data area 4: 0x0000-0x1943, Data area 3: 0x1944-0x3287, Data area 2: 0x3288-0x4BCB, Data area 1: 0x4BCC-0x650F.

[0120] See Figure 4 The diagram illustrates the process of reading the parameter value to be corrected from a storage unit. When retrieving the parameter value, one bit can be read from each of the data areas 1, 2, 3, and 4 of the storage unit. These read bits are then concatenated to obtain the parameter value to be corrected. For example, the first bit of the parameter value to be corrected can be read from data area 1, the second bit from data area 2, the third bit from data area 3, and the fourth bit from data area 4. These four bits are then concatenated to obtain the parameter value to be corrected.

[0121] VI. Correction Unit. The correction unit is used to acquire the parameter value to be corrected corresponding to the pixel, determine the initial bias value based on the parameter value to be corrected corresponding to the pixel, and output the initial bias value to the focal plane integration readout unit. For example, the correction unit can directly read the parameter value to be corrected from the storage unit, or the digital control unit can read the parameter value to be corrected from the storage unit and send the read parameter value to the correction unit, which then retrieves the parameter value to be corrected from the storage unit.

[0122] For example, the correction unit may include a DAC (Digital to Analog Converter), which performs digital-to-analog conversion on the parameter value to be corrected in the digital signal to obtain an analog voltage signal, and determines the voltage value corresponding to the analog voltage signal as the initial bias value.

[0123] See Figure 2 As shown, the value of the parameter to be corrected can be denoted as VEB_NUC. VEB_NUC can be a 4-bit value. The DAC can convert the value of the parameter to be corrected, VEB_NUC, from a digital signal into an analog voltage signal.

[0124] Based on this, the voltage value corresponding to the analog voltage signal can be used as the initial bias value VEB, and the initial bias value VEB can be output to the focal plane integration readout unit. That is, the initial bias value VEB is used as the input voltage of the first MOSFET, which can control the current I1 passing through the first MOSFET.

[0125] Clearly, different initial bias voltage values ​​VEB can provide different biases for the focal plane integration readout unit. When the initial bias voltage value VEB is larger, the voltage response value Vo corresponding to the pixel is larger, thereby eliminating the problem of the focal plane integration readout unit having different responses to the same radiation caused by manufacturing deviations.

[0126] For example, when using the successive approximation method, the correction unit obtains the parameter value to be corrected, 1000, in correction cycle 1. Based on the parameter value to be corrected, 1000, it determines the initial bias value VEB and outputs the initial bias value VEB to the focal plane integration readout unit. In correction cycle 2, it obtains the parameter value to be corrected, 1100, and based on this value, determines the initial bias value VEB and outputs it to the focal plane integration readout unit. In correction cycle 3, it obtains the parameter value to be corrected, 1010, and based on this value, determines the initial bias value VEB and outputs it to the focal plane integration readout unit. In correction cycle 4, it obtains the parameter value to be corrected, 1001, and based on this value, determines the initial bias value VEB and outputs it to the focal plane integration readout unit.

[0127] In summary, the correction state allows for the acquisition of optimal correction parameter values ​​for each pixel, which can then be written to the storage unit. After correction, the readout state can commence. In readout, the baffle can be closed, ensuring that the sensed ambient temperature for each pixel is the actual target temperature of the target scene.

[0128] In one possible implementation, the optimal value of the correction parameter is used to correct the actual target temperature value sensed by the pixel. That is, in the readout state, the actual target temperature value sensed by the pixel can be corrected based on the optimal value of the correction parameter. In other words, the purpose of correcting the actual target temperature value sensed by the pixel is achieved by correcting the voltage response value Vo of the focal plane integral readout unit.

[0129] The following describes the process of using the optimal value of the correction parameter with reference to specific embodiments.

[0130] The digital control unit (DCU) can determine the state of the infrared readout circuit. For example, after the infrared readout circuit is powered on, its corresponding correction state can be determined; after the optimal correction parameter value for each pixel has been determined, its corresponding readout state can be determined. Furthermore, in the correction state, the DCU controls the baffle to open, allowing each pixel in the infrared array to sense the baffle's temperature value. In the readout state, the DCU controls the baffle to close, allowing each pixel in the infrared array to sense the actual target temperature value of the target scene.

[0131] Based on this, when the infrared readout circuit is in the corresponding readout state: the correction unit can determine the target bias voltage value based on the optimal value of the correction parameters corresponding to the pixel, and output the target bias voltage value to the focal plane integration readout unit; the focal plane integration readout unit can determine the voltage response value corresponding to the pixel based on the third current corresponding to the target bias voltage value and the fourth current output by the pixel response temperature value; after receiving the voltage response value corresponding to the pixel, the comparison logic unit outputs the voltage response value to the outside, that is, outputs the voltage response value to the external processor, so that the external processor can determine the actual target temperature value based on the voltage response value.

[0132] See Figure 2 As shown, the storage unit has stored the optimal value of the correction parameter corresponding to the pixel Rs. The correction unit can obtain the optimal value of the correction parameter corresponding to the pixel Rs from the storage unit (it can be read directly from the storage unit by the correction unit, or it can be read from the storage unit by the digital control unit and sent to the correction unit). Based on the optimal value of the correction parameter, the target bias voltage VEB is determined, and the target bias voltage VEB is output to the focal plane integration readout unit, such as the first MOS transistor of the focal plane integration readout unit.

[0133] The focal plane integration readout unit is used to determine the third current I1 corresponding to the target bias value VEB and the fourth current I2 of pixel Rs. The fourth current I2 matches the actual target temperature value sensed by pixel Rs (i.e., the actual target temperature value sensed by pixel Rs after the baffle is closed). Based on this, the focal plane integration readout unit can determine the voltage response value Vo corresponding to pixel Rs based on the third current I1 and the fourth current I2. The voltage response value Vo is used to determine the temperature value of the target object in the target scene. That is, the voltage response value Vo can be provided to an external processor, which can query a pre-calibrated mapping relationship between voltage and temperature values ​​to obtain the temperature value corresponding to the voltage response value Vo. This temperature value is the temperature value of the target object, i.e., the final detected temperature value. There are no restrictions on the process of determining this temperature value.

[0134] See Figure 2As shown, in the readout state, when the target bias value VEB is larger, the third current I1 through the first MOS transistor is larger. That is, the target bias value VEB and the third current I1 are positively correlated. Thus, the target bias value VEB is controlled by the optimal value of the correction parameter, and then the third current I1 is controlled by the target bias value VEB, thereby affecting the voltage response value Vo corresponding to the pixel Rs, so as to achieve the purpose of non-uniformity correction.

[0135] In one possible implementation, when the infrared readout circuit is in the correction state, the digital control unit can send a first control signal to the comparison logic unit, causing the comparison logic unit to determine the correction state of the infrared readout circuit based on the first control signal. Upon receiving a voltage response value, the comparison logic unit determines a logic value based on the voltage response value and a preset voltage value, and outputs the logic value to the digital control unit. When the infrared readout circuit is in the readout state, the digital control unit can send a second control signal to the comparison logic unit, causing the comparison logic unit to determine that the infrared readout circuit has entered the readout state based on the second control signal. Upon receiving a voltage response value, the comparison logic unit outputs the voltage response value externally, i.e., outputs the voltage response value to an external processor.

[0136] As can be seen from the above technical solutions, in this embodiment, an uncooled infrared on-chip non-uniformity automatic correction readout circuit, referred to as an infrared readout circuit, is designed. Non-uniformity correction is achieved by the infrared readout circuit, eliminating the need for an external processor, thus reducing external hardware resource overhead, lowering costs, simplifying development, and achieving better correction results. Furthermore, by providing different bias values ​​to different pixels, the difference in response of different pixels to the same infrared radiation is corrected, making the response of different pixels to the same infrared radiation consistent. This method can be called non-uniformity correction. Two correction algorithms can be selected to update the optimal value of the correction parameters. In practical applications, the appropriate correction algorithm can be selected according to the scenario.

[0137] See Figure 5 The diagram shown illustrates the operation of an infrared readout circuit. This method may include:

[0138] Step 501: Power on and start the infrared readout circuit.

[0139] Step 502: After power-on startup, configuration information can be written to the digital control unit, such as line time, integral time, parameter value to be corrected (e.g., 1000 in the above embodiment), preset voltage value, and correction algorithm type. The correction algorithm type can be, for example, sequential traversal method or successive approximation method.

[0140] Step 503: Initialize the storage unit. For example, the digital control unit uses the parameter value to be corrected as the parameter value to be corrected for each pixel and writes the parameter value to be corrected for each pixel into the storage unit.

[0141] Wherein, for the plurality of pixels included in the infrared array, the parameter values to be corrected corresponding to different pixels may be the same; or, the parameter values to be corrected corresponding to different pixels may be different. In this embodiment, an example is given in which the parameter values to be corrected corresponding to different pixels are the same, that is, the same parameter value to be corrected is written into the storage unit.

[0142] Step 504: a digital control unit determines to enter a correction state, and opens a shutter, wherein the temperature at each position of the shutter is the same, so that the test target temperature perceived by each pixel is the temperature of the shutter.

[0143] Step 505: a correction unit acquires the parameter value to be corrected from the storage unit, determines an initial bias voltage value based on the parameter value to be corrected, and outputs the initial bias voltage value to a focal plane integration readout unit.

[0144] Step 506: the focal plane integration readout unit determines a voltage response value Vo corresponding to the pixel based on a first current corresponding to the initial bias voltage value and a second current output in response to the pixel temperature.

[0145] Step 507: a comparison logic unit compares the voltage response value Vo with a preset voltage value Vtag. If Vo<Vtag, output a logic value 1 to the digital control unit; otherwise, output a logic value 0 to the digital control unit.

[0146] Step 508: the digital control unit adjusts the parameter value to be corrected based on the logic value to obtain an adjusted parameter value, and updates the adjusted parameter value to the storage unit to replace the parameter value to be corrected.

[0147] Step 509: determining whether correction is completed. If correction is completed, taking the adjusted parameter value updated to the storage unit as an optimal correction parameter value, and executing step 510; if correction is not completed, taking the adjusted parameter value updated to the storage unit as the parameter value to be corrected, and executing step 505 based on the parameter value to be corrected.

[0148] Step 510: the digital control unit determines to enter a readout state, and closes the shutter, so that each pixel perceives the actual target temperature value of the target scene. In the readout state, the correction unit acquires the optimal correction parameter value from the storage unit, determines a target bias voltage value based on the optimal correction parameter value, outputs the target bias voltage value to the focal plane integration readout unit, and the focal plane integration readout unit determines the voltage response value Vo corresponding to the pixel based on a third current corresponding to the target bias voltage value and a fourth current output in response to the pixel temperature.

[0149] Finally, the voltage response value Vo is output to an external processor, so as to determine the temperature value corresponding to the pixel.

[0150] The following is a brief explanation of the timing sequence of the infrared readout circuit, using a specific application scenario. After the infrared readout circuit is powered on, it enters the correction phase. After correction is completed, it enters the readout phase. The operating state of the infrared readout circuit can be represented by ON_CHIP_NUC: ON_CHIP_NUC = 1 indicates the correction phase, and ON_CHIP_NUC = 0 indicates the readout phase. The following example illustrates the circuit with a total of 196*264 pixels and 4-bit parameters to be corrected.

[0151] The correction phase can be divided into two phases: Phase 1: Initialization (i.e., initializing the parameter values ​​to be corrected). In Phase 1, only the initialization write operation of the storage unit is performed. Under the selection signal of each row, the initialization of the parameter values ​​to be corrected for all columns in that row is completed. The parameter value to be corrected is 1000.

[0152] The second stage: Correction processing (correcting the parameter values ​​to be corrected). In this stage, read and write operations are required on the storage unit. A pre-set parameter value to be corrected is loaded into the first row; that is, the corresponding parameter value to be corrected is read from the storage unit and configured into the correction unit. Then, when the comparison begins at the start of the row, the configuration of the next frame's parameter values ​​to be corrected and the data update of the current correction bit are completed sequentially for the corresponding column of that row. When using the successive approximation method for correction, each row and each of the next 8 columns constitutes an operation cycle. At the beginning of each cycle, the data for the next frame's parameter values ​​to be corrected is configured. After the comparison of these 8 columns is completed, the corrected data for these 8 columns is written to the corresponding address unit. This process is repeated for each cycle, thus completing the update of the current correction bit data for that row and simultaneously writing the data for the next frame's parameter values ​​to be corrected.

[0153] When using the sequential traversal method for correction, the configuration of correction data during the correction phase differs from that of the successive approximation method. Each row and each set of eight columns constitutes an operation cycle. In each operation cycle, the values ​​of the parameters to be corrected used in that row and those eight columns are read out. After the comparison of these eight columns is completed, the digital control unit increments or decrements the values ​​of the parameters to be corrected by 1 based on the comparison results, and saves the correction data for these eight columns in the first two cycles of the next eight-column cycle. This process is repeated until the correction data after comparison is written. Specifically, the first eight columns of the first row of each frame do not require NUC writing operations. The correction data for the last eight columns of the middle rows will be written in the first eight columns of the next row. The last eight columns of the last row will have two additional column cycles for writing the correction data for these eight columns.

[0154] Based on the same concept as the infrared readout circuit described above, this application proposes another infrared readout circuit, which may include, but is not limited to, a focal plane integration readout unit, a correction unit, and a digital control unit. The focal plane integration readout unit is connected to an infrared array, which includes multiple pixels. For each pixel in the infrared array: a correction unit is used to determine an initial bias value based on the parameter value to be corrected corresponding to that pixel, and outputs the initial bias value to the focal plane integration readout unit; the focal plane integration readout unit is used to determine a voltage response value corresponding to that pixel based on a first current corresponding to the initial bias value and a second current output by the pixel in response to a temperature value; the digital control unit is used to adjust the parameter value to be corrected based on a comparison between the voltage response value and a preset voltage value, obtain an adjusted parameter value, determine an optimal correction parameter value corresponding to that pixel based on the adjusted parameter value, and replace the parameter value to be corrected corresponding to that pixel with the optimal correction parameter value. This optimal correction parameter value is used to correct the actual target temperature value sensed by the pixel.

[0155] In one possible implementation, the infrared readout circuit may further include a storage unit; the digital control unit is further configured to acquire the parameter value to be corrected corresponding to the pixel, and write the parameter value to be corrected into the storage unit for storage. Based on this, the correction unit is further configured to acquire the parameter value to be corrected corresponding to the pixel from the storage unit. Wherein, for multiple pixels included in the infrared array, the parameter values ​​to be corrected corresponding to different pixels are the same; or, the parameter values ​​to be corrected corresponding to different pixels are different.

[0156] In one possible implementation, the correction unit may include a DAC; the correction unit may use the DAC to perform digital-to-analog conversion on the parameter value to be corrected of the digital signal to obtain an analog voltage signal, and determine the voltage value corresponding to the analog voltage signal as the initial bias value.

[0157] In one possible implementation, when the parameter value to be corrected is a K-bit binary value, the storage unit includes K data areas, each corresponding to a K-bit binary value, where K is a positive integer greater than 1; wherein: when the storage unit stores the parameter value to be corrected, it is specifically used to: store the value of the m-th bit in the parameter value to be corrected through the m-th data area, where the value of m can be in the range of 1-K.

[0158] In one possible implementation, the focal plane integration readout unit may include a first MOSFET and an integrating circuit. The input voltage of the first MOSFET is an initial bias value, and the current flowing through the first MOSFET is a first current corresponding to the initial bias value. The integrating circuit is connected to the first MOSFET and to the pixel. The sum of the first current and a second current can be determined as the input current of the integrating circuit. The input current is input to the integrating circuit to perform integration on the input current, obtaining the voltage input value corresponding to the pixel. Based on the voltage input value corresponding to the pixel, the voltage response value corresponding to the pixel is determined.

[0159] The focal plane integration readout unit may also include a sample-and-hold circuit, which is connected to the integration circuit. Based on this, the voltage input value corresponding to the pixel can be input to the sample-and-hold circuit, so that the voltage input value can be sampled and held by the sample-and-hold circuit to obtain the voltage response value corresponding to the pixel.

[0160] In one possible implementation, when the digital control unit determines the optimal value of the correction parameter corresponding to a pixel based on the adjusted parameter value, if the number of adjustments to the parameter value to be corrected has reached the target number of adjustments, the digital control unit can determine the adjusted parameter value as the optimal value of the correction parameter corresponding to that pixel; or, if the number of adjustments to the parameter value to be corrected has not reached the target number of adjustments, the digital control unit can determine the adjusted parameter value as the parameter value to be corrected corresponding to that pixel and repeat the above correction process.

[0161] In one possible implementation, when the digital control unit adjusts the value of the parameter to be corrected, if the comparison result is that the voltage response value is less than the preset voltage value, the digital control unit can increase the value of the parameter to be corrected to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, the digital control unit can decrease the value of the parameter to be corrected to obtain the adjusted parameter value.

[0162] In one possible implementation, the infrared readout circuit may further include a comparison logic unit; the comparison logic unit is used to determine a logic value based on the voltage response value and a preset voltage value, and output the logic value to the digital control unit; wherein, if the voltage response value is less than the preset voltage value, the logic value is a first value; or, if the voltage response value is greater than the preset voltage value, the logic value is a second value. The digital control unit is further used to determine the comparison result between the voltage response value and the preset voltage value based on the logic value; wherein, if the logic value is the first value, the comparison result is determined to be that the voltage response value is less than the preset voltage value; or, if the logic value is the second value, the comparison result is determined to be that the voltage response value is greater than the preset voltage value.

[0163] In one possible implementation, the infrared readout circuit further includes an analog-to-digital converter (ADC); the ADC is used to obtain the voltage response value from the focal plane integration readout unit, perform analog-to-digital conversion on the voltage response value to obtain the voltage response value of the digital signal, output the voltage response value of the digital signal to the digital control unit, and the digital control unit adjusts the value of the parameter to be corrected based on the comparison result between the voltage response value of the digital signal and the preset voltage value of the digital signal to obtain the adjusted parameter value.

[0164] In one possible implementation, the digital control unit is further configured to determine the state corresponding to the infrared readout circuit; wherein, after the infrared readout circuit is powered on, the infrared readout circuit is in a correction state; after the optimal value of the correction parameter corresponding to the pixel has been determined, the infrared readout circuit is in a readout state; the digital control unit is further configured to control the baffle to open when the infrared readout circuit is in the correction state, so that each pixel in the infrared array can sense the temperature value of the baffle; and to control the baffle to close when the infrared readout circuit is in the readout state, so that each pixel in the infrared array can sense the actual target temperature value of the target scene.

[0165] In one possible implementation, the digital control unit is further configured to send a first control signal to the comparison logic unit when the infrared readout circuit is in a correction state, so that the comparison logic unit determines the correction state of the infrared readout circuit based on the first control signal, and upon receiving a voltage response value, determines a logic value based on the voltage response value and a preset voltage value, and outputs the logic value to the digital control unit. When the infrared readout circuit is in a readout state, the digital control unit sends a second control signal to the comparison logic unit, so that the comparison logic unit determines that the infrared readout circuit has entered a readout state based on the second control signal, and upon receiving a voltage response value, outputs the voltage response value externally, such as to an external memory.

[0166] In one possible implementation, when the infrared readout circuit is in the readout state: a correction unit is used to determine the target bias value based on the optimal value of the correction parameters corresponding to the pixel, and output the target bias value to the focal plane integration readout unit; the focal plane integration readout unit is used to determine the voltage response value corresponding to the pixel based on the third current corresponding to the target bias value and the fourth current output by the pixel response temperature value; and a comparison logic unit is used to output the voltage response value to the outside after receiving the voltage response value corresponding to the pixel.

[0167] Based on the same concept as the infrared readout circuit described above, this application proposes a control method for an infrared readout circuit. This infrared readout circuit is connected to an infrared array, which may include multiple pixels. See [link to relevant documentation]. Figure 6 The diagram shown is a flowchart of the method, which may include:

[0168] Step 601: After the infrared readout circuit is powered on, the infrared readout circuit controls the baffle to open, so that each pixel in the infrared array can sense the temperature value of the baffle. For example, the temperature value at each position of the baffle can be the same, so that each pixel in the infrared array senses the same temperature value of the baffle.

[0169] Step 602: When each pixel in the infrared array senses the temperature value of the baffle, the infrared readout circuit determines the optimal value of the correction parameter corresponding to each pixel in the infrared array.

[0170] Step 603: After determining the optimal value of the correction parameter corresponding to each pixel, the infrared readout circuit controls the baffle to close, so that each pixel in the infrared array can sense the actual target temperature value of the target scene.

[0171] Step 604: When each pixel in the infrared array senses the actual target temperature value, the infrared readout circuit determines the voltage response value corresponding to that pixel based on the optimal value of the correction parameter corresponding to each pixel, and outputs the voltage response value corresponding to each pixel in the infrared array to the external processor.

[0172] In one possible implementation, the infrared readout circuit determines the optimal value of the correction parameter corresponding to each pixel in the infrared array, which may include, but is not limited to: for each pixel, determining an initial bias voltage value based on the parameter value to be corrected corresponding to that pixel; determining a voltage response value corresponding to that pixel based on a first current corresponding to the initial bias voltage value and a second current output by the pixel in response to the temperature value; adjusting the parameter value to be corrected based on a comparison between the voltage response value and a preset voltage value to obtain an adjusted parameter value; and determining the optimal value of the correction parameter corresponding to that pixel based on the adjusted parameter value. For example, both the parameter value to be corrected and the preset voltage value are pre-configured; for multiple pixels in the infrared array, the parameter values ​​to be corrected corresponding to different pixels may be the same or different, and the preset voltage values ​​corresponding to different pixels may be the same.

[0173] For example, determining the initial bias value based on the parameter value to be corrected corresponding to the pixel may include, but is not limited to: performing digital-to-analog conversion on the parameter value to be corrected of the digital signal to obtain an analog voltage signal, and determining the voltage value corresponding to the analog voltage signal as the initial bias value.

[0174] For example, determining the voltage response value of a pixel based on the first current corresponding to the initial bias value and the second current output by the pixel response temperature value may include, but is not limited to: determining the sum of the first current and the second current as the input current; performing an integration operation on the input current to obtain the voltage input value corresponding to the pixel; and determining the voltage response value corresponding to the pixel based on the voltage input value corresponding to the pixel.

[0175] For example, adjusting the parameter value to be corrected based on the comparison result of the voltage response value and the preset voltage value to obtain the adjusted parameter value may include, but is not limited to: if the comparison result is that the voltage response value is less than the preset voltage value, then increasing the parameter value to be corrected to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, then decreasing the parameter value to be corrected to obtain the adjusted parameter value.

[0176] For example, determining the optimal value of the correction parameter corresponding to the pixel based on the adjusted parameter value may include: if the number of adjustments to the parameter value to be corrected has reached the target number of adjustments, then the adjusted parameter value is determined as the optimal value of the correction parameter corresponding to the pixel; or, if the number of adjustments to the parameter value to be corrected has not reached the target number of adjustments, then the adjusted parameter value is determined as the parameter value to be corrected corresponding to the pixel, and the operation of adjusting the parameter value to be corrected based on the comparison result of the voltage response value and the preset voltage value is returned.

[0177] For example, adjusting the parameter value to be corrected based on the comparison between the voltage response value and the preset voltage value to obtain the adjusted parameter value may include, but is not limited to: when the parameter value to be corrected is a K-bit binary value, where K is a positive integer greater than 1, then: if the successive traversal method is used for adjustment, the target number of adjustments is 2 to the power of K; if the comparison result is that the voltage response value is less than the preset voltage value, the parameter value to be corrected can be increased based on the successive traversal method to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, the parameter value to be corrected can be decreased based on the successive traversal method to obtain the adjusted parameter value; or, if the successive approximation method is used for adjustment, the target number of adjustments is K; if the comparison result is that the voltage response value is less than the preset voltage value, the parameter value to be corrected can be increased based on the successive approximation method to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, the parameter value to be corrected can be decreased based on the successive approximation method to obtain the adjusted parameter value.

[0178] For example, increasing the value of the parameter to be corrected based on the sequential traversal method to obtain the adjusted parameter value may include: incrementing the value of the parameter to be corrected by 1 using the sequential traversal method to obtain the adjusted parameter value.

[0179] For example, reducing the value of the parameter to be corrected based on the sequential traversal method to obtain the adjusted parameter value may include: using the sequential traversal method to subtract 1 from the value of the parameter to be corrected to obtain the adjusted parameter value.

[0180] For example, improving the value of the parameter to be corrected based on the successive approximation method to obtain the adjusted parameter value may include: determining the target adjustment position of the parameter to be corrected using the successive approximation method; if the value of the target adjustment position is 0, then modifying the value of the target adjustment position to 1 to obtain the adjusted parameter value.

[0181] For example, reducing the value of the parameter to be corrected based on the successive approximation method to obtain the adjusted parameter value may include: determining the target first adjustment position and the target second adjustment position of the parameter value to be corrected using the successive approximation method, wherein the target first adjustment position may be the position preceding the target second adjustment position; if the value of the target first adjustment position is 1 and the value of the target second adjustment position is 0, then the value of the target first adjustment position can be modified to 0 and the value of the target second adjustment position can be modified to 1 to obtain the adjusted parameter value.

[0182] The systems, devices, modules, or units described in the above embodiments can be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer, which can take the form of a personal computer, laptop computer, cellular phone, camera phone, smartphone, personal digital assistant, media player, navigation device, email sending and receiving device, game console, tablet computer, wearable device, or any combination of these devices.

[0183] For ease of description, the above devices are described separately by function as various units. Of course, in implementing this application, the functions of each unit can be implemented in one or more software and / or hardware.

[0184] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, embodiments of this application can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0185] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0186] Furthermore, these computer program instructions can also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in the process. Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0187] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0188] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A control method for an infrared readout circuit, characterized in that, The thermal imaging device includes an infrared readout circuit, an infrared array, a baffle, and an external processor. The infrared readout circuit is connected to the infrared array, which includes multiple pixels. The method includes: After the infrared readout circuit is powered on, the infrared readout circuit controls the baffle to open so that each pixel in the infrared array can sense the temperature value of the baffle. When each pixel in the infrared array senses the temperature value of the baffle, the infrared readout circuit determines the optimal value of the correction parameter corresponding to each pixel in the infrared array and writes the optimal value of the correction parameter corresponding to each pixel into the storage unit of the infrared readout circuit. After the optimal value of the correction parameter corresponding to each pixel has been determined, the infrared readout circuit controls the baffle to close, so that each pixel in the infrared array can sense the actual target temperature value of the target scene. When each pixel in the infrared array senses the actual target temperature value, the infrared readout circuit determines the voltage response value corresponding to that pixel based on the optimal value of the correction parameter corresponding to each pixel in the storage unit, and outputs the voltage response value corresponding to each pixel in the infrared array to the external processor.

2. The method according to claim 1, characterized in that, The infrared readout circuit determines the optimal value of the correction parameter corresponding to each pixel in the infrared array, including: For each pixel, an initial bias value is determined based on the parameter value to be corrected corresponding to that pixel; Based on the first current corresponding to the initial bias value and the second current output by the pixel response temperature value, the voltage response value corresponding to the pixel is determined. Based on the comparison result between the voltage response value and the preset voltage value, the value of the parameter to be corrected is adjusted to obtain the adjusted parameter value, and the optimal value of the correction parameter corresponding to the pixel is determined based on the adjusted parameter value; Wherein, both the parameter value to be corrected and the preset voltage value are pre-configured; For the multiple pixels of the infrared array, the values ​​of the parameters to be corrected corresponding to different pixels may be the same or different, and the preset voltage values ​​corresponding to different pixels are the same.

3. The method according to claim 2, characterized in that, The step of determining the initial bias value based on the parameter value to be corrected corresponding to the pixel includes: The parameter values ​​to be corrected in the digital signal are converted from digital to analog to obtain an analog voltage signal, and the voltage value corresponding to the analog voltage signal is converted into the initial bias value.

4. The method according to claim 2, characterized in that, The adjustment of the parameter value to be corrected based on the comparison result between the voltage response value and the preset voltage value to obtain the adjusted parameter value includes: If the comparison result is that the voltage response value is less than the preset voltage value, then the value of the parameter to be corrected is increased to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, then the value of the parameter to be corrected is decreased to obtain the adjusted parameter value.

5. The method according to claim 2 or 4, characterized in that, Determining the optimal value of the correction parameter corresponding to the pixel based on the adjusted parameter value includes: If the number of adjustments to the parameter value to be corrected has reached the target number of adjustments, then the adjusted parameter value is determined as the optimal value of the correction parameter corresponding to the pixel; or, If the number of adjustments to the parameter value to be corrected does not reach the target number of adjustments, then the adjusted parameter value is determined as the parameter value to be corrected corresponding to the pixel, and the operation of adjusting the parameter value to be corrected based on the comparison result of the voltage response value and the preset voltage value is returned.

6. The method according to claim 5, characterized in that, The adjustment of the parameter value to be corrected based on the comparison result between the voltage response value and the preset voltage value to obtain the adjusted parameter value includes: When the parameter value to be corrected is a K-bit binary value, where K is a positive integer greater than 1, then: If the adjustment is performed using a sequential traversal method, the target number of adjustments is 2 to the power of K. If the comparison result is that the voltage response value is less than the preset voltage value, the value of the parameter to be corrected is increased based on the sequential traversal method to obtain the adjusted parameter value. Alternatively, if the comparison result is that the voltage response value is greater than the preset voltage value, the value of the parameter to be corrected is decreased based on the sequential traversal method to obtain the adjusted parameter value. or, If the successive approximation method is used for adjustment, the target number of adjustment times is K; if the comparison result is that the voltage response value is less than the preset voltage value, the value of the parameter to be corrected is increased based on the successive approximation method to obtain the adjusted parameter value; or, if the comparison result is that the voltage response value is greater than the preset voltage value, the value of the parameter to be corrected is decreased based on the successive approximation method to obtain the adjusted parameter value.

7. The method according to claim 6, characterized in that, The step of increasing the value of the parameter to be corrected based on the sequential traversal method to obtain the adjusted parameter value includes: incrementing the value of the parameter to be corrected by 1 using the sequential traversal method to obtain the adjusted parameter value; The step of reducing the value of the parameter to be corrected based on the sequential traversal method to obtain the adjusted parameter value includes: subtracting 1 from the value of the parameter to be corrected using the sequential traversal method to obtain the adjusted parameter value.

8. The method according to claim 6, characterized in that, The step of improving the value of the parameter to be corrected based on the successive approximation method to obtain the adjusted parameter value includes: determining the target adjustment position of the parameter to be corrected using the successive approximation method; if the value of the target adjustment position is 0, then modifying the value of the target adjustment position to 1 to obtain the adjusted parameter value. The step of reducing the value of the parameter to be corrected based on the successive approximation method to obtain the adjusted parameter value includes: determining the target first adjustment position and the target second adjustment position of the parameter to be corrected using the successive approximation method, wherein the target first adjustment position is the position preceding the target second adjustment position; if the value of the target first adjustment position is 1 and the value of the target second adjustment position is 0, then the value of the target first adjustment position is modified to 0 and the value of the target second adjustment position is modified to 1 to obtain the adjusted parameter value.

9. The method according to claim 2, characterized in that, The adjustment of the parameter value to be corrected based on the comparison result between the voltage response value and the preset voltage value to obtain the adjusted parameter value includes: The voltage response value is converted from analog to digital to obtain the voltage response value of the digital signal; Based on the comparison between the voltage response value of the digital signal and the preset voltage value of the digital signal, the parameter value to be corrected is adjusted to obtain the adjusted parameter value.

10. The method according to claim 1, characterized in that, The infrared readout circuit determines the voltage response value corresponding to each pixel based on the optimal value of the correction parameters corresponding to each pixel in the storage unit, including: For each pixel, the target bias value is determined based on the optimal value of the correction parameters corresponding to that pixel; The voltage response value corresponding to the pixel is determined based on the third current corresponding to the target bias value and the fourth current output by the pixel response temperature value.

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