Metal card and method of manufacturing the same

Abstract

A metal card according to one embodiment of the present application and a method of manufacturing the same are characterized by including a coated sheet, a metal sheet, an electromagnetic wave absorbing sheet, an antenna sheet formed with an antenna, an epoxy glass sheet, a printed sheet, a protective sheet, and an electronic chip disposed in an electronic chip bonding groove formed in at least one of the coated sheet, the metal sheet, the electromagnetic wave absorbing sheet, the antenna sheet, and the epoxy glass sheet, the electronic chip bonding groove including a first introduction groove formed thereon by a milling process and a second introduction groove formed from the first introduction groove by a milling process.

Description

Technical Field

[0001] This invention relates to metal cards and their manufacturing methods, and more specifically to a metal card and its manufacturing method that minimizes electromagnetic interference. Background Technology

[0002] Credit cards are widely used as a payment method for commercial transactions. A credit card is a form of consumer credit; it's a payment method where members who have signed a contract with an issuing institution can purchase goods or services at affiliated stores by presenting the credit card issued by the issuing institution and signing the receipt, without having to spend cash. In this case, the payment will be automatically transferred from the member's deposit account to the affiliated store's account through the issuing institution's transaction bank after a certain period of time after the sale, with the affiliated store bearing a predetermined transaction fee.

[0003] As mentioned above, due to the convenience of using credit cards without having to carry cash, the advantage of payment time after purchase, and various benefits offered by credit card issuers, their use has increased dramatically, and credit card use has become increasingly common recently.

[0004] In addition, to meet the demands of luxury credit card consumers, VIP cards, distinct from regular credit cards, are being manufactured. These VIP cards offer various benefits and are designed with a luxurious appearance for immediate recognition. In particular, VIP cards feature a metal exterior, unlike regular credit cards which are typically made of plastic. However, metal cards are susceptible to electromagnetic interference. Summary of the Invention

[0005] Technical issues

[0006] The present invention addresses the aforementioned problems and aims to provide a metal card and its manufacturing method that, although using metallic materials, can effectively communicate by minimizing electromagnetic interference.

[0007] Technical solution

[0008] A metal card according to an embodiment of the present invention may include: a coating sheet formed on its surface; a metal sheet disposed on the lower portion of the coating sheet; an electromagnetic wave absorbing sheet disposed on the lower portion of the metal sheet; an antenna sheet disposed on the lower portion of the electromagnetic wave absorbing sheet and having an antenna formed thereon; an epoxy glass sheet disposed on the lower portion of the antenna sheet; a printed sheet disposed on the lower portion of the epoxy glass sheet; a protective sheet disposed on the lower portion of the printed sheet; and an electronic chip disposed in an electronic chip bonding groove formed on at least one of the coating sheet, the metal sheet, the electromagnetic wave absorbing sheet, the antenna sheet, and the epoxy glass sheet, wherein the electronic chip bonding groove includes a first inlet groove formed on its surface by a milling process and a second inlet groove formed in the first inlet groove by a milling process.

[0009] Furthermore, the first inlet groove is recessed from the top to form the antenna sheet, and the second inlet groove is recessed in the space where the antenna exposed through the first inlet groove is pulled upward. The electronic chip is connected to the antenna contact pulled upward and can be inserted into the electronic chip bonding groove for hot pressing.

[0010] Furthermore, it also includes: a solder inlet groove, which is recessed downward from the first inlet groove; and lead-free solder, which is electrically connected to the antenna and is ejected through the solder inlet groove, wherein the electronic chip can be inserted into the electronic chip bonding groove and attached to the lead-free solder by hot pressing.

[0011] Furthermore, the electronic chip includes a thermoplastic adhesive sheet, which can be hot-pressed to adhere the electronic chip to the bonding groove.

[0012] Furthermore, the metal sheet may be made of at least one of stainless steel, aluminum, super titanium, and scandium.

[0013] Furthermore, the coated sheet can be formed on the metal sheet by at least one of coating, titanium coating, digital printing, deposition, plating, laser engraving, or coating.

[0014] Furthermore, it also includes a metal adhesive layer disposed between the metal sheet and the electromagnetic wave absorbing sheet, wherein the metal adhesive layer may be an aqueous adhesive containing polyurethane resin and water.

[0015] Furthermore, the antenna is a coil antenna made of copper (Cu) and may include an insulating coating layer.

[0016] Furthermore, the epoxy glass sheet may contain fiber glass, epoxy resin, and phosphorus-based reactive flame retardants.

[0017] Furthermore, the manufacturing method of the metal card according to the present invention includes: cleaning, printing, and coating a metal sheet to form a coated sheet; applying an adhesive to an electromagnetic wave absorbing sheet, integrating and attaching the metal sheet with the coated sheet and the electromagnetic wave absorbing sheet to form a metal sheet array; applying an adhesive to an epoxy glass sheet, integrating and attaching the epoxy glass sheet, an antenna sheet with an antenna, a printed sheet, and a protective sheet to form a back-printed array; applying an adhesive to the metal sheet array, integrating and attaching the metal sheet array and the back-printed array to form a metal card array; cutting, perforating, and stamping the metal card array; forming a specific size; removing metal from the electronic chip area to form a first inlet groove and a second inlet groove, and attaching a hologram, a sign, and an electronic chip.

[0018] Furthermore, the back-side printing array includes: a plurality of printed sheets formed of the same size and arranged at equal intervals along the horizontal or vertical direction; and reference holes formed on the periphery of each printed sheet, wherein a pair of reference holes are arranged at left and right intervals on the upper and lower parts of each printed sheet, and the upper and lower printed sheets can share a pair of reference holes.

[0019] Furthermore, the back printing array and the metal card array each include a pair of reference points spaced apart on the left and right sides in the upper and lower parts, which can align the reference points of the back printing array and the reference points of the metal card array to the same line for integration and attachment of the metal sheet array and the back printing array.

[0020] Furthermore, when forming the specified size, the metal layer including the coating sheet, the metal sheet, and the electromagnetic wave absorbing sheet, and the plastic layer including the antenna sheet, the epoxy glass sheet, the printed sheet, and the protective sheet can be formed using different tools.

[0021] Furthermore, the metal layer can be processed using a metal layer processing tool that includes CNC tools made of ultra-hard materials, and the plastic layer can be processed using a plastic processing tool that includes CNC tools made of synthetic diamond materials.

[0022] Furthermore, the electronic chip can be formed by hot-pressing thermoplastic adhesive sheets onto the top and bottom of the plastic sheet and forming a plastic roll, the plastic roll and the electronic chip roll together.

[0023] Furthermore, the first inlet groove is formed by CNC milling to have a first length (A1) and a first cross-section (B1), the first length (A1) corresponding to the length from the top to the antenna sheet, and the first cross-section (B1) corresponding to the top of the electronic chip.

[0024] Furthermore, the second inlet groove is formed by CNC milling to have a second length (A2) and a second cross-section (B2), the second length (A2) corresponding to the cross-sectional thickness of the electronic chip, and the second cross-section (B2) corresponding to the bottom surface of the electronic chip.

[0025] Furthermore, the first inlet slot can be formed; the antenna exposed by the first inlet slot is pulled up in the upward direction; the second inlet slot is formed; the antenna pulled up in the upward direction is connected to the electronic chip contact; the electronic chip is disposed in the first inlet slot and the second inlet slot and attached by hot pressing.

[0026] Furthermore, the first inlet groove can be formed; and solder inlet grooves and second inlet grooves recessed from the first inlet groove in different shapes can be formed respectively.

[0027] Furthermore, lead-free solder electrically connected to the antenna can be ejected from inside the solder inlet groove; the electronic chip is loaded into an electronic chip bonding groove including the first inlet hole, the second inlet hole and the solder inlet hole; and the electronic chip is connected to the lead-free solder by hot pressing.

[0028] Technical effect

[0029] A metal card and its manufacturing method according to an embodiment of the present invention utilize metal materials to form a luxurious shape while minimizing electromagnetic interference, thereby having the advantage of being able to communicate effectively.

[0030] Furthermore, the metal card and its manufacturing method of the present invention distinguish between processing the metal layer and the plastic layer, thereby having the advantages of improving processing efficiency and quality.

[0031] Furthermore, the metal card and its manufacturing method of the present invention attach the electronic chip by hot pressing, thus having the advantage of not requiring an additional electronic chip medium. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of a metal card according to an embodiment of the present invention;

[0033] Figure 2 This is an exploded view of a metal card according to an embodiment of the present invention;

[0034] Figure 3 The diagram illustrates a method for manufacturing a metal card according to an embodiment of the present invention.

[0035] Figure 4 This is a simplified schematic diagram of the back-side printed array of a metal card according to an embodiment of the present invention;

[0036] Figure 5 This is a simplified schematic diagram of a metal sheet array of a metal card according to an embodiment of the present invention;

[0037] Figure 6 This is a schematic diagram of a method for processing the size and specifications of a metal card according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of a method for forming an electronic chip of a metal card according to an embodiment of the present invention;

[0039] Figure 8 This is a schematic diagram of the electronic chip of a metal card according to an embodiment of the present invention;

[0040] Figure 9 This is a schematic diagram of an electronic chip attaching method for a metal card according to an embodiment of the present invention;

[0041] Figure 10 This is a schematic diagram of an electronic chip attaching method for a metal card according to another embodiment of the present invention;

[0042] Figure 11 This is an exploded view of a metal card according to another embodiment of the present invention;

[0043] Figure 12 This is an exploded view of a metal card according to another embodiment of the present invention.

[0044] Explanation of reference numerals in the attached figures

[0045] 100: Metal card; 110: Coated sheet

[0046] 120: Metal sheet; 130: Electromagnetic wave absorbing sheet

[0047] 140: Antenna plate; 150: Epoxy glass plate

[0048] 160: Printing sheet; 170: Protective sheet

[0049] 210: Electronic chip; 220: Antenna Detailed Implementation

[0050] The following detailed description of specific embodiments of the present invention is based on the accompanying drawings. However, the concept of the present invention is not limited to the proposed embodiments. Those skilled in the art who understand the concept of the present invention can propose other regressive inventions or other embodiments included within the scope of the present invention by adding, changing, or deleting other constituent elements, etc., within the same scope of the concept, but these also fall within the scope of the present invention.

[0051] Furthermore, the same reference numerals are used to describe the same functional components within the same conceptual scope shown in the accompanying drawings of the embodiments.

[0052] Figure 1 This is a schematic diagram of a metal card according to an embodiment of the present invention. Figure 2 This is an exploded perspective view of a metal card according to an embodiment of the present invention.

[0053] like Figure 1 and Figure 2 As shown, a metal card 100 according to an embodiment of the present invention includes a coating sheet 110, a metal sheet 120, an electromagnetic wave absorbing sheet 130, an antenna sheet 140 with an antenna 220 formed thereon, an epoxy glass sheet 150, a printed sheet 160, a protective sheet 170, and an electronic chip 210.

[0054] The components described herein are merely illustrative and are therefore not limited to these examples. For instance, the metal card 100 may also include other components such as back printing for implementing the metal card, a magnetic stripe, a hologram, a sign, and a brand logo.

[0055] The metal sheet 120 can be manufactured into a plate shape containing metallic material. In particular, the metal sheet 120 can be made by cutting a metal sheet containing metallic material. For example, the metallic material used to make the metal sheet 120 may include at least one of stainless steel, aluminum, super titanium, and scandium.

[0056] The coating sheet 110 is formed on the metal sheet 120. Here, text, patterns, designs (not shown) formed on the metal sheet 120 by printing, coating, and laser engraving can all be included in the coating sheet 110.

[0057] Furthermore, a laser engraving device can be used to engrave card numbers, names, expiration dates, etc., onto the metal sheet 120. Here, a laser engraving device refers to a device that can use the energy density of a laser beam to evaporate a portion of the metal to engrave it.

[0058] Furthermore, text, shapes, patterns (not shown) can be formed on the metal sheet 120 using CNC equipment. That is, card numbers, names, expiration dates, etc., can be engraved on the metal sheet 120 using CNC equipment.

[0059] The electromagnetic wave absorbing sheet 130 may include an electromagnetic wave absorber, such as an electromagnetic interference absorber (EMIAbsoder). For example, it may be formed with Fe 68%–73%, Al 3%–7%, Si 7%–11%, and Pu 31%–24%.

[0060] The antenna 220 may be a coil antenna. In particular, the antenna 220 is formed of copper (Cu) and may include an insulating coating layer. Furthermore, the thickness of the antenna 220 may be from about 0.08 mm to 0.1 mm.

[0061] The epoxy glass sheet 150 may contain fiber glass. Furthermore, the epoxy glass sheet 150 may contain fiber glass, epoxy resin, and a phosphorus-based reactive flame retardant. For example, the epoxy glass sheet 150 may be composed of 50% to 65% fiber glass, 35% to 50% epoxy resin, and 0.5% to 1.5% phosphorus-based reactive flame retardant.

[0062] Electronic chip bonding slots 250 and 260 for bonding the electronic chip 210 can be formed on the surface of the metal card 100 (see...). Figure 9 These electronic chip bonding slots 250 and 260 can be formed to a predetermined depth on the metal card 100, and can be formed by CNC milling.

[0063] The electronic chip bonding slots 250 and 260 may include a first inlet slot 250 extending to a predetermined depth on the top of the metal card 100 and a second inlet slot 260 extending to a predetermined depth in at least a portion of the bottom surface of the first inlet slot 250. This will be described in detail later.

[0064] Figure 3 The diagram illustrates a method for manufacturing a metal card according to an embodiment of the present invention.

[0065] like Figure 3 As shown, the metal card 100 is formed by combining and processing a back-printed array 400, a metal sheet array 500, and a metal card array 600.

[0066] The metal sheet array 500 can be formed through a metal sheet cleaning, printing and coating step S01, an electromagnetic wave absorbing sheet adhesive application step S02, and a metal sheet and electromagnetic wave absorbing sheet integration and attachment step S03. Here, the printing step includes coating, titanium coating, digital printing, deposition, plating, laser engraving, and coating. As described above, the layer formed on the metal sheet 120 through the printing and coating steps is referred to as the coated sheet 110.

[0067] Furthermore, the back-side printed array 400 can be formed through the epoxy glass adhesive application step S06 and the integration and attachment step S07 of epoxy glass, antenna, printed sheet and protective sheet.

[0068] Here, the back-side printing array 400 and the metal sheet array 500 are manufactured in a binary manner. That is, the manufacturing of the back-side printing array 400 and the metal sheet array 500 can be performed simultaneously or sequentially.

[0069] Furthermore, the metal sheet array 500 is formed through the metal sheet array adhesive application step S10 and the metal sheet array integration and attachment step S11 with the back printed array, and can be unified.

[0070] Furthermore, the metal card 100 of the present invention is manufactured through the following steps: metal sheet array cutting, perforation and stamping step S20, size formation step S21, metal removal of electronic chip area and formation of first inlet groove step S22, formation of second inlet groove step S23, and hologram, sign and electronic chip attachment step S24.

[0071] The following is passed Figures 4 to 9 The manufacturing method of the metal card 100 is described in detail.

[0072] Figure 4 This is a simplified schematic diagram of the printed array on the back of a metal card according to an embodiment of the present invention.

[0073] like Figure 4 As shown, the back-side printing array 400 includes a plurality of printing sheets 160. For example, the back-side printing array 400 includes 21 printing sheets 160, 3 horizontally and 7 vertically. Each printing sheet 160 is formed to the same size and can be arranged at equal intervals along the horizontal or vertical direction.

[0074] Here, the back-side printed array 400, as described above, is formed through the integration and attachment step S07 of epoxy glass, antenna, printed sheet, and protective sheet. That is, it should be understood that the back-side printed array 400 is formed to include not only the plurality of printed sheets 160, but also the epoxy glass sheet 150, the antenna sheet 140, and the protective sheet 170.

[0075] Furthermore, each printed sheet 160 has four reference holes 310 formed around its periphery. Specifically, the four reference holes 310 are respectively disposed on the upper left, upper right, lower left, and lower right of each printed sheet 160. That is, a pair of reference holes 310 spaced apart on the left and right are respectively disposed on the upper and lower parts of the printed sheet 160.

[0076] Furthermore, the vertically arranged printed sheets 160 can share a pair of reference holes 310. That is, the two vertically arranged printed sheets 160 share two reference holes 310, thus having a total of 6 reference holes 310. Here, the position of the reference holes 310 is exemplary and can be configured differently as needed.

[0077] Furthermore, four reference points 320 are formed on the back printing array 400. Specifically, the four reference points 320 are respectively disposed on the upper left, upper right, lower left, and lower right of the back printing array 400. That is, a pair of reference points 320 spaced apart on the left and right are respectively disposed on the upper and lower parts of the back printing array 400.

[0078] Here, even if the horizontal or vertical number of printed sheets 160 included in the back printing array 400 is changed, the reference point 320 can still have the same size and the same position value. For example, the size of the printed sheets 160 can be changed to change the number of printed sheets 160 included in the back printing array 400, and the reference point 320 can be formed in the same way.

[0079] Figure 5 This is a simplified schematic diagram of a metal sheet array of a metal card according to an embodiment of the present invention.

[0080] like Figure 5 As shown, the metal sheet array 500 includes a plurality of coated sheets 110. For example, the metal sheet array 500 includes 21 coated sheets 110, with 3 horizontally and 7 vertically arranged. Each coated sheet 110 is formed to the same size and can be arranged at equal intervals along the horizontal or vertical direction.

[0081] It can be understood that the coated sheet 110 is formed in the cleaning, printing, and coating steps S01 of the metal sheet 120. That is, the coated sheet 110 may be contained within the metal sheet 120. Furthermore, the coated sheet 110 may have a size and configuration corresponding to the printed sheet 160.

[0082] Here, the metal sheet array 500 is formed, as described above, through the integration and attachment step S03 of the metal sheet 120 including the coated sheet 110 and the electromagnetic wave absorbing sheet 130. That is, it can be understood that the metal sheet array 500 is formed to include not only the plurality of coated sheets 110, but also the metal sheet 120 and the electromagnetic wave absorbing sheet 130.

[0083] Furthermore, four reference points 330 are formed on the metal sheet array 500. Specifically, the four reference points 330 are respectively arranged on the upper left, upper right, lower left, and lower right of the metal sheet array 500. That is, a pair of reference points 330 spaced apart are arranged on the upper and lower parts of the metal sheet array 500, respectively.

[0084] Here, even if the number of coating sheets 110 included in the metal sheet array 500 changes horizontally or vertically, the reference point 330 can still have the same size and position value. For example, the number of coating sheets 110 included in the metal sheet array 120 can be changed by changing the size of the coating sheets 110, and the reference point 330 is formed in the same way.

[0085] Furthermore, the reference point 320 of the back-side printing array 400 and the reference point 330 of the metal sheet array 500 are arranged at the same size and interval. That is, each reference point 320, 330 corresponds to the overlapping reference points in step S11 of integrating the back-side printing array 400 and the metal sheet array 500.

[0086] For example, the back-printed array 400 and the metal sheet array 500 can be configured to overlap, and the reference points 320 and 330 can be aligned to the same line for integration and attachment. Furthermore, the configuration of attaching the back-printed array 400 and the metal sheet array 500 as described above is referred to as a metal card array 600.

[0087] Furthermore, step S20, which involves cutting, perforating, and stamping the metal card array 600 using the reference hole 310 as a reference, can be performed. This results in a configuration comprising a printed sheet 160 and a coated sheet 110. This configuration is formed to be approximately 0.3 mm to 0.6 mm larger than the standard size in either the horizontal or vertical direction. Therefore, step S21, which involves processing each configuration to achieve the standard size, is required.

[0088] Here, the existing processing method uses the same tool for processing. However, the back printing array 400 portion including the printed sheet 160 is equivalent to a plastic layer, and the metal sheet array 500 including the coated sheet 110 is equivalent to a metal layer. Therefore, their properties such as hardness are different, which causes problems.

[0089] For example, problems arise such as the plastic layer being smaller than the metal layer or the presence of burrs on the plastic layer. Furthermore, the tool's cutting edge processes all surfaces of the cutting area, resulting in high tool wear, a high defect rate, and decreased workability due to frequent tool changes.

[0090] The following is a detailed description of the size formation step S21 of the present invention used to solve the above problems.

[0091] Figure 6 This is a schematic diagram illustrating a method for processing the size and specifications of a metal card according to an embodiment of the present invention.

[0092] like Figure 6As shown in (a) and (b), a metal card array 600 is provided. Here, the metal card array 600 corresponds to the state after the cutting, perforating and stamping steps S20. Figure 6 (a) shows a simplified outline of the metal card array 600. Figure 6 (b) shows a cross-section of the metal card array 600.

[0093] The metal card array 600 can be divided into an upper metal layer 700 and a lower plastic layer 800. The metal layer 700 includes a coating sheet 110, a metal sheet 120, and an electromagnetic wave absorbing sheet 130, each stacked from top to bottom. The plastic layer 800 includes an antenna sheet 140 with an antenna 220 formed thereon, an epoxy glass sheet 150, a printed sheet 160, and a protective sheet 170, each stacked from top to bottom. That is, the metal layer 700 corresponds to a portion of the metal sheet array 500, and the plastic layer 800 corresponds to a portion of the back-printed array 400.

[0094] Furthermore, the metal layer 700 may include a metal adhesive layer 180 formed between the metal sheet 120 and the electromagnetic wave absorbing sheet 130. Additionally, an adhesive layer 190 may be formed between the metal layer 700 and the plastic layer 800.

[0095] The metal adhesive layer 180 is equivalent to an aqueous adhesive comprising polyurethane resin and water. For example, the metal adhesive layer 180 may be formed comprising 38% to 42% polyurethane resin, 55% to 59% water (H2O), and 0.5% to 1.5% N-METHYL-2-PYROLIDONE.

[0096] like Figure 7 As shown in (c) and (d), the metal layer 700 and the plastic layer 800 are processed separately. Furthermore, the metal layer 700 and the plastic layer 800 can be processed using different tools. For example, the metal layer 700 can be processed using a superhard CNC tool, and the plastic layer 800 can be processed using a synthetic diamond CNC tool. The following description distinguishes between the processing tools for the metal layer and the plastic layer.

[0097] First, the first width W1 of the metal layer 700 is machined to a first depth D1 using a metal layer processing tool. The first width W1 can be approximately 0.3 mm to 0.6 mm. That is, the amount of size that needs to be removed in order to form the above-mentioned size. The first depth D1 corresponds to the depth or thickness of the metal layer 700.

[0098] Furthermore, the second width W2 of the plastic layer 800 is processed into a second depth D2 using a plastic layer processing tool. The second width W2 can be approximately 0.3 mm to 0.6 mm. That is, the amount that needs to be removed to achieve the above-mentioned dimensions can be the same as the first width W1. The second depth D2 corresponds to the depth or thickness of the plastic layer 800.

[0099] Here, it is possible to... Figure 7 (d) is flipped so that the plastic layer 800 is on top for processing. Furthermore, the attached drawings show a thicker adhesive layer 190, but this is for illustrative purposes only; the adhesive layer 190 has a thickness that is negligible at the aforementioned depth.

[0100] As described above, by using separate tools to process the metal layer 700 and the plastic layer 800, workability can be improved by reducing the wear of each processing tool and extending the replacement cycle. Furthermore, quality can be improved by reducing the defect rate through enhanced processing quality.

[0101] Figure 7 This is a schematic diagram of a method for forming an electronic chip of a metal card according to an embodiment of the present invention. Figure 7 A schematic diagram illustrating the formation of the electronic chip 210 included in the metal card 100 of the present invention is provided for illustrative purposes.

[0102] Figure 7 (a) is a schematic diagram of the electronic chip reel 200. Figure 7 (b) is a schematic diagram of plastic roll 300. Figure 7 (c) and (d) show the combination of the electronic chip roll 200 and the plastic roll 300.

[0103] The electronic chip roll 200 includes multiple mold sections, and the plastic roll 300 includes a plastic sheet 230 and a thermoplastic adhesive sheet 240. Specifically, the thermoplastic adhesive sheet 240 can be disposed on the upper and lower parts of the plastic sheet 230, and the plastic roll 300 is formed by pressure rollers. For example, the thickness of the plastic sheet 230 can be about 0.13 mm to 0.15 mm, and the thickness of the thermoplastic adhesive sheet 240 can be about 0.04 mm to 0.05 mm.

[0104] Furthermore, the electronic chip roll 200 and the plastic roll 300 can be stacked together using a thermoforming mold. In summary, the electronic chip roll 200, the thermoplastic adhesive sheet 240, the plastic sheet 230, and the thermoplastic adhesive sheet 240 are sequentially stacked. Here, the thickness of the electronic chip roll 200 can be approximately 0.15 mm to 0.17 mm.

[0105] See Figure 7In (d), the plastic roll 300 is formed with a first width W1, and the electronic chip roll 200 is formed with a second width W2. Here, the first width W1 is smaller than the second width W2. For example, the first width W1 may be formed to be approximately 29 mm, and the second width W2 may be formed to be 35 mm.

[0106] That is, the electronic chip roll 200 has a larger amplitude than the plastic roll 300, and when stacked, the electronic chip roll 200 protrudes outward. Furthermore, the plastic roll 300 is disposed at the center of the electronic chip roll 200. In other words, portions of the electronic chip roll 200 protruding to both sides of the plastic roll 300 are formed to be the same size.

[0107] Furthermore, the plastic roll 300 includes a punch 305 corresponding to the mold portion of the electronic chip roll 200. The punch 305 is configured as a circular shape with a predetermined diameter r. That is, a circular recessed shape corresponding to the punch 305 is formed on the electronic chip roll 200. Here, the punch 305 may be formed slightly larger than the shape formed on the electronic chip roll 200.

[0108] A plurality of the punches 305 are formed at intervals in both the amplitude and length directions. For example, a pair of the punches 305 may be spaced apart in the amplitude direction.

[0109] The punched holes 305 are arranged at a first interval P1 in the amplitude direction based on the center of the hole. Furthermore, the punched holes 305 are arranged at a second interval P2 in the length direction based on the center of the hole. Here, the first interval P1 is larger than the second interval P2. For example, the first interval P1 may be approximately 14.2 mm, and the second interval P2 may be approximately 9.5 mm.

[0110] Figure 8 This is a schematic diagram of the electronic chip of a metal card according to an embodiment of the present invention. Figure 9 This is a schematic diagram of an electronic chip attaching method for a metal card according to an embodiment of the present invention. Figure 8 The images are shown from above, below, and in cross-section. Figure 7 The electronic chip 210 is manufactured through a process.

[0111] like Figure 9 As shown in (a), a metal card array 600 is provided. Here, the metal card array 600 corresponds to the state after performing the size formation step S21. The metal card array 600 includes a coating sheet 110, a metal sheet 120, a metal adhesive layer 180, an electromagnetic wave absorbing sheet 130, an adhesive layer 190, an antenna sheet 140, an epoxy glass sheet 150, a printed sheet 160, and a protective sheet 170.

[0112] like Figure 9 As shown in (b), step S22 involves removing metal from the electronic chip area and forming the first inlet groove 250. The first inlet groove 250 can be formed by CNC milling and has a first length A1 and a first cross-section B1. The first length A1 can be understood as the length extending vertically downwards from the coating sheet 110, i.e., the depth of the recess. The first cross-section B1 can represent the cross-sectional area or the length of the cross-sectional area forming the first length A1.

[0113] The first length A1 may be formed to be adjacent to the antenna 220 of the antenna piece 140 by approximately 0.1 mm to 0.15 mm. That is, the first inlet hole 250 may be recessed into the antenna piece 140. Furthermore, the depth of the first inlet slot 250 may vary depending on the position of the antenna 220 or the stacked structure.

[0114] The antenna sheet 140 can be manufactured using different manufacturing methods. Therefore, the position of the antenna 220 within the antenna sheet 140 can vary depending on the manufacturing method. Furthermore, the thickness of the plastic sheet 230 can be varied according to the position of the antenna 220.

[0115] The first section B1 can be configured as a quadrangular shape with both horizontal and vertical lengths. The first section B1 can be formed as... Figure 8 The horizontal and vertical lengths of the electronic chip 211 shown in (a) are slightly larger. For example, the vertical length of the electronic chip 211 can be formed to be about 8.32 mm, and the horizontal length can be formed to be about 11 mm. The vertical and horizontal lengths of the first section B1 can be formed to be about 0.2 mm to 0.4 mm larger than these.

[0116] like Figure 9 As shown in (c), by pulling the antenna 220, which is exposed as the first guide groove 250 is formed, upward, the processing layer space of the second guide groove 260 can be exposed by pulling the antenna 220 upward. Furthermore, when forming the second guide groove 260, it is possible to ensure that the antenna 220 does not make contact.

[0117] like Figure 9 As shown in (d), step S23, forming the second inlet groove 260, is performed. The second inlet groove 260 can be formed by CNC milling and has a second length A2 and a second cross-section B2. The second length A2 can be understood as the length extending vertically downward from the first inlet groove 250, i.e., the depth of the recess. The second cross-section B2 can represent the cross-sectional area or the length of the cross-sectional area that forms the second length A2.

[0118] The second length A2 can be formed as a ratio Figure 8 The thickness of the electronic chip profile 213 shown in (c) is slightly larger. For example, the electronic chip profile 214 can be formed to a thickness of about 0.58 mm, and the second length A2 can be formed to be about 0.2 mm to 0.4 mm larger than that. That is, the depth of the second inlet groove 260 can be made according to the thickness of the electronic chip profile 213.

[0119] The second section B2 can be configured as a quadrangular shape with both horizontal and vertical lengths. The second section B2 can be formed as... Figure 8 The horizontal and vertical lengths of the electronic chip 212 shown in (b) are slightly larger. For example, the vertical length of the electronic chip 212 can be formed to be about 6.3 mm, and the horizontal length can be formed to be about 7 mm, while the vertical and horizontal lengths of the second section B2 can be formed to be about 0.2 mm to 0.4 mm larger.

[0120] Furthermore, it can be based on Figure 8 The second inlet groove 260 is fabricated differently from the pattern of the electronic chip mold 214 shown in (b). For example, the pattern of the electronic chip mold 214 can be square or circular, and can be formed differently depending on the manufacturing method. Furthermore, if the thickness of the electronic chip cross-section 213 is less than that of the first inlet groove 250, the second inlet groove 260 may not be formed.

[0121] like Figure 9 As shown in (e), step S24 of attaching the electronic chip 210 is performed. First, the antenna 220, which is pulled upwards, is connected to the contacts of the electronic chip 210. The connection between the antenna 220 and the contacts of the electronic chip 210 can be achieved by spot welding.

[0122] The electronic chip 210 is disposed in the first inlet slot 250 and the second inlet slot 260. Furthermore, the electronic chip 220 can be attached using heat and pressure with a thermoforming mold. Thus, the antenna 220 is hidden inside the electronic chip 210, and the antenna 220 will not come into contact with the metal sheet 120. Moreover, the communication obstruction caused by electromagnetic interference from the metal sheet 120 can be minimized by attaching an electromagnetic wave absorbing sheet 130 beneath the metal sheet 120.

[0123] Here, the electronic chip 210 is as follows Figure 7 The aforementioned structure is formed from an electronic chip roll 200 and a plastic roll 300. Furthermore, a thermoplastic adhesive sheet 240 is laminated on the lower part of the electronic chip 210. The thermoplastic adhesive sheet 240 can be attached to the first inlet groove 250 due to heat and pressure applied to the electronic chip 210.

[0124] Here, it can be followed in accordance with Figure 9 The following describes different methods for attaching electronic chips. (The rest is omitted.) Figure 9 For parts where the content is the same, the differences will be explained in detail. Furthermore, for ease of understanding, the same reference numerals will be used for the same constituent elements.

[0125] Figure 10 This is a schematic diagram of an electronic chip attaching method for a metal card according to another embodiment of the present invention.

[0126] like Figure 10 As shown in (a), a metal card array 600 is provided. Here, the metal card array 600 corresponds to the state after performing the specification-size forming step S21.

[0127] like Figure 10 As shown in (b), step S22, which involves removing metal from the electronic chip region and forming the first inlet groove 270, is performed. The first inlet groove 270 is formed by CNC milling and has a third length A3 and a third profile B3. Here, the third profile B3 is... Figure 9 The first section B1 is the same.

[0128] The third length A3 can be formed to be slightly larger than the thickness of the metal sheet 120. For example, the third length A1 can be formed to be approximately 0.1 mm to 0.15 mm larger than the depth of the metal sheet 120. That is, the third length A1 can be formed differently depending on the thickness of the coating sheet 110 and the metal sheet 120.

[0129] like Figure 10 As shown in (c), a solder inlet groove 216 can be formed. The solder inlet groove 216 can be formed by CNC milling and has a predetermined recess length c. The recess length c can be formed to a length of approximately 0.03 mm to 0.035 mm for the antenna 220 after removing the antenna piece 140.

[0130] Furthermore, the solder inlet groove 216 is recessed downwards from the first inlet groove 270. The length c of the recess can be formed to be approximately 0.08 mm to 0.1 mm. The solder inlet groove 216 can be formed differently depending on the position of the antenna piece 140 and the various stacked structures.

[0131] like Figure 10 As shown in (d), step S23, forming the second inlet groove 280, is performed. The second inlet groove 280 can be formed by CNC milling and has a fourth length A4 and a fourth cross-section B4. Here, the second inlet groove 280, the fourth length A4, and the fourth cross-section B4 are... Figure 9The second inlet groove 260, the second length A2, and the second section B2 are the same as those described.

[0132] like Figure 10 As shown in (e), lead-free solder 217 is ejected from inside the solder inlet 216. Here, the antenna 220 of the antenna piece 140 is electrically connected to the lead-free solder 217. Here, the solder inlet 216 is formed with a narrow cross-section. (Dam) structure. Therefore, it is possible to prevent the lead-free solder 217 from overflowing to the outside of the solder inlet hole 216.

[0133] like Figure 10 As shown in (f), the electronic chip 210 is mounted in an electronic chip bonding groove, and the upper part of the electronic chip 210 is pressed together with heat and pressure using a hot press mold. Here, the electronic chip bonding groove includes the first inlet hole 270, the second inlet hole 280, and the solder inlet groove 216.

[0134] When the electronic chip 210 is brought into contact with heat and pressure, the lead-free solder 217 connects to the contacts of the electronic chip 210 through a reaction of heat and pressure. Therefore, the lead-free solder 217 solidifies into a highly durable material, thus avoiding contact with the metal sheet 120.

[0135] Figure 11 This is an exploded view of a metal card according to another embodiment of the present invention.

[0136] See Figure 11 According to another embodiment of the present invention, the metal card 100a may include a coating sheet 110, a metal sheet 120, a metal adhesive layer 180, an electromagnetic wave absorbing sheet 130, an adhesive layer 190, an antenna sheet 140, an epoxy glass sheet 150, a printed sheet 160, a protective sheet 170, an electronic chip 210, and an antenna 220.

[0137] The metal card 100a described above is equivalent to... Figure 2 The structure includes an additional metal adhesive layer 180 and an adhesive layer 190. This is for ease of understanding. Figure 6 , Figure 9 and Figure 10 The metal adhesive layer 180 and adhesive layer 190 shown in the cross-section are illustrated as an additional configuration.

[0138] Figure 12 This is an exploded view of a metal card according to another embodiment of the present invention.

[0139] See Figure 12According to another embodiment of the present invention, the metal card 100b may include a coating sheet 110, a metal sheet 120, a metal adhesive layer 180, an electromagnetic wave absorbing sheet 130, an adhesive layer 190, an antenna sheet 140, a printed sheet 160, a protective sheet 170, an electronic chip 210, and an antenna 220.

[0140] The metal card 100a described above is equivalent to... Figure 2 The composition includes an additional metal bonding layer 180 and a bonding layer 190, while omitting the epoxy glass sheet 150. This is for ease of explanation. Figure 6 , Figure 9 and Figure 10 The cross-section shown illustrates the metal adhesive layer 180 and adhesive layer 190 as an additional configuration, demonstrating the state in which the back-printed array 400 is manufactured without the epoxy glass sheet 150.

[0141] The above description provides a specific example of one embodiment of the present invention, but the scope of the claims is not limited thereto. Various modifications and variations can be made within the scope of the technical concept of the present invention as described in the claims, which will be obvious to those skilled in the art.

Claims

1. A metal card, characterized in that, include: The coated sheet is formed on the top surface; A metal sheet disposed at the lower part of the coated sheet; An electromagnetic wave absorbing sheet is disposed at the lower part of the metal sheet; An antenna sheet is disposed at the lower part of the electromagnetic wave absorbing sheet and forms an antenna. An epoxy glass sheet is disposed at the lower part of the antenna sheet; A printed sheet, which is disposed at the lower part of the epoxy glass sheet; A protective sheet, disposed at the lower part of the printed sheet; and An electronic chip, disposed in an electronic chip bonding slot formed on the metal card, The electronic chip has an upper surface and a lower surface, wherein the horizontal length of the upper surface is greater than the horizontal length of the lower surface; The electronic chip bonding groove includes a first inlet groove, a solder inlet groove, and a second inlet groove. The first inlet groove is formed by milling to have a third length (A3) and a third cross-section (B3), where the third length (A3) corresponds to the thickness of the metal sheet, and the third cross-section (B3) corresponds to the upper surface of the electronic chip. The solder inlet groove is formed by milling to have a predetermined recess length c from the first inlet groove downwards, where the recess length c is the length of a portion of the antenna strip removed. The second inlet groove is formed by milling to have a fourth length (A4) and a fourth cross-section (B4) from the first inlet groove downwards, where the fourth length (A4) corresponds to the cross-sectional thickness of the electronic chip, and the fourth cross-section (B4) corresponds to the lower surface of the electronic chip. The solder inlet groove is located around the second inlet groove. The metal card further includes: lead-free solder, which is electrically connected to the antenna in the antenna sheet. The electronic chip is inserted into the electronic chip bonding slot and connected to the lead-free solder for attachment.

2. The metal card according to claim 1, characterized in that: The electronic chip includes a thermoplastic adhesive sheet. The thermoplastic adhesive sheet is hot-pressed to the electronic chip bonding groove to attach the electronic chip.

3. The metal card according to claim 1, characterized in that: The metal sheet is made of at least one of stainless steel, aluminum, super titanium, and scandium.

4. The metal card according to claim 1, characterized in that: The coated sheet is formed on the metal sheet by at least one of coating, titanium coating, digital printing, deposition, plating, laser engraving, and coating.

5. The metal card according to claim 1, characterized in that, Also includes: A metal bonding layer is disposed between the metal sheet and the electromagnetic wave absorbing sheet. The metal adhesive layer is an aqueous adhesive containing polyurethane resin and water.

6. The metal card according to claim 1, characterized in that: The antenna is a coil antenna made of copper (Cu) and includes an insulating coating layer.

7. The metal card according to claim 1, characterized in that: The epoxy glass sheet contains fiber glass, epoxy resin, and phosphorus-based reactive flame retardant.

8. A method for manufacturing a metal card, characterized in that: The metal sheet is cleaned, printed, and coated to form a coated sheet; An adhesive is applied to an electromagnetic wave absorbing sheet, and a metal sheet with the coating and the electromagnetic wave absorbing sheet are integrated and attached to form a metal sheet array. An adhesive is applied to an epoxy glass sheet, and the epoxy glass sheet is integrated and attached to form an antenna sheet, a printed sheet, and a protective sheet to form a back-printed array. An adhesive is applied to the metal sheet array, and the metal sheet array and the back printing array are integrated and attached to form a metal card array, such that the metal card array, from top to bottom, sequentially includes a coated sheet, a metal sheet, an electromagnetic wave absorbing sheet, an antenna sheet, an epoxy glass sheet, a printed sheet, and a protective sheet; the metal card array is then cut, perforated, and stamped. Forming specifications and sizes; The metal formation for removing the electronic chip area includes an electronic chip bonding trench comprising a first introduction trench, a solder introduction trench, and a second introduction trench. Attach holograms, signs, and electronic chips; The electronic chip has an upper surface and a lower surface, wherein the horizontal length of the upper surface is greater than the horizontal length of the lower surface; The process of removing metal from the electronic chip region to form an electronic chip bonding trench includes: The first inlet groove is formed by milling, having a third length (A3) and a third cross-section (B3), wherein the third length (A3) corresponds to the thickness of the metal sheet and the third cross-section (B3) corresponds to the top surface of the electronic chip; The solder inlet groove is formed by milling, having a predetermined recess length c from the first inlet groove downwards, the recess length c being the length of the antenna after removing a portion of the antenna sheet; A second inlet groove is formed by milling, having a fourth length (A4) and a fourth cross-section (B4) extending downward from the first inlet groove. The fourth length (A4) corresponds to the cross-sectional thickness of the electronic chip, and the fourth cross-section (B4) corresponds to the bottom surface of the electronic chip. The solder inlet groove is located around the periphery of the second inlet groove. Lead-free solder, which is electrically connected to the antenna, is inserted into the solder inlet groove. The electronic chip is loaded into the electronic chip bonding slot on the metal card; The electronic chip is connected to the lead-free solder by hot pressing.

9. The method for manufacturing a metal card according to claim 8, characterized in that, The back-side printing array includes: Multiple printed sheets, formed of the same size and arranged at equal intervals along the horizontal or vertical direction; and Reference holes are formed around the periphery of each printed circuit board. Each printed sheet has a pair of reference holes spaced apart at the top and bottom, left and right. The upper and lower printed sheets share a pair of reference holes.

10. The method for manufacturing a metal card according to claim 8, characterized in that: The back-printed array and the metal card array each include a pair of reference points spaced apart from each other in the upper and lower portions. Align the reference points of the back-printed array and the reference points of the metal card array to the same line, and integrate and attach the metal sheet array and the back-printed array.

11. The method for manufacturing a metal card according to claim 8, characterized in that: When forming the specified size, the metal layer of the coating sheet, the metal sheet and the electromagnetic wave absorbing sheet and the plastic layer of the antenna sheet, the epoxy glass sheet, the printed sheet and the protective sheet are processed using different tools.

12. The method for manufacturing a metal card according to claim 11, characterized in that: The metal layer is processed using a metal layer machining tool that includes CNC tools made of ultra-hard materials, and the plastic layer is processed using a plastic layer machining tool that includes CNC tools made of synthetic diamond materials.

13. The method for manufacturing a metal card according to claim 8, characterized in that: The electronic chip is formed by hot-pressing thermoplastic adhesive sheets onto the top and bottom of a plastic sheet, forming a plastic roll, and then combining the plastic roll with an electronic chip roll.

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