Inner lead bonding apparatus and inner lead bonding method

Abstract

The present application provides an inner lead bonding apparatus including a carrying platform, a press head, an image acquisition module and a processor. The carrying platform is used to carry a flexible package tape having a plurality of package units, each of which has a chip bonding area and a plurality of inner leads located in the chip bonding area. The press head is used to receive a chip and is movably arranged above the carrying platform to move towards the carrying platform and apply pressure to make the chip arranged in the chip bonding area, and a plurality of bumps of the chip are correspondingly bonded with the plurality of inner leads. The image acquisition module is movably arranged above the carrying platform and is used to acquire an image of the chip bonding area. The processor is coupled with the image acquisition module to obtain the width of the inner lead according to the image, and after the width is calculated and compared, the pressure value applied to the press head is determined as a preset pressure value or a pressure correction value.

Description

Technical Field

[0001] This invention relates to an internal lead bonding device and an internal lead bonding method. Background Technology

[0002] In existing technologies, chip packaging using chip-on-film (COF) technology involves using a roll of flexible packaging tape containing multiple packaging units, transported reel to reel, to sequentially place the chip onto each of the packaging units. Specifically, multiple bumps are formed on the active surface of the chip, and each packaging unit of the flexible packaging tape contains multiple circuits. Each circuit has internal leads for bonding to the bumps, a process known as inner lead bonding (ILB). Current ILB processes typically employ thermal compression, where the inner lead partially sinks into the corresponding bump during bonding, creating a depression and forming a eutectic bond for electrical connection.

[0003] It is worth noting that due to limitations in the fabrication capabilities (e.g., etching capabilities) of flexible packaging tape, the internal leads of package units with the same design within the same roll of flexible packaging tape may exhibit some degree of size variation after actual fabrication. In other words, the widths of the internal leads of these package units with identical designs may not be the same. If the same pressure is applied to all package units with internal leads of varying widths during the internal lead bonding process, inconsistent lead depression may occur. For example, the depression is smaller when a bump is pressed against a wider internal lead, and larger when pressed against a narrower internal lead. If the depression is too small, insufficient bonding strength can lead to the internal lead peeling off from the bump; if the depression is too large, the bump may collapse and be damaged. In such cases, multiple package units within the entire roll of flexible packaging tape cannot achieve consistent and stable internal lead bonding quality, resulting in poor manufacturing yield. Summary of the Invention

[0004] This invention relates to an internal lead bonding device and an internal lead bonding method, which enables multiple packaging units of flexible packaging tape to maintain consistent and stable internal lead bonding quality.

[0005] According to an embodiment of the present invention, an internal lead bonding apparatus includes a carrier platform, a pressing head, an image acquisition module, and a processor. The carrier platform carries a flexible packaging tape, wherein the flexible packaging tape has multiple packaging units, each packaging unit having a chip bonding area and multiple internal leads located within the chip bonding area. The packaging units are sequentially arranged on the carrier platform, and the carrier platform at least corresponds to the chip bonding area of ​​the packaging unit disposed on the carrier platform. The pressing head receives a chip and is movably disposed above the carrier platform and corresponds to the packaging unit disposed on the carrier platform. The pressing head moves toward the carrier platform and applies pressure to deposit the chip within the chip bonding area of ​​the packaging unit, and multiple bumps on the chip correspondingly engage with the multiple internal leads. The image acquisition module is movably disposed above the carrier platform and is used to acquire images of the chip bonding area of ​​the packaging unit disposed on the carrier platform. The processor is coupled to an image acquisition module to obtain multiple widths of a portion of multiple inner leads based on the image. It calculates the width value based on the multiple widths of the multiple inner leads and calculates the difference between the width value and the standard width value of the multiple inner leads. Based on the difference, it determines the pressure value to be applied to the pressing head and calculates the pressure compensation value. When the absolute value of the difference is less than or equal to a preset difference, the pressure value applied to the pressing head is the preset pressure value. When the absolute value of the difference is greater than the preset difference, the pressure value applied to the pressing head is the sum of the preset pressure value and the pressure compensation value.

[0006] According to an embodiment of the present invention, an internal lead bonding method includes the following steps. The process involves transmitting a flexible packaging tape with multiple packaging units, sequentially arranging each packaging unit on a carrier platform. Each packaging unit has a chip bonding area and multiple inner leads located within the chip bonding area. The carrier platform corresponds at least to the chip bonding area of ​​the packaging unit arranged on the carrier platform. A chip with multiple bumps is picked up and placed on a pressing head. An image of the chip bonding area of ​​the packaging unit arranged on the carrier platform is acquired. Multiple widths of some of the inner leads are obtained based on the image. A width value is calculated based on the multiple widths of some of the inner leads, and the difference between the width value and the standard width value of the inner leads is calculated. A pressure value is applied to the pressing head based on the difference, and a pressure compensation value is calculated. When the absolute value of the difference is less than or equal to a preset difference, the pressure value applied to the pressing head is the preset pressure value; when the absolute value of the difference is greater than the preset difference, the pressure value applied to the pressing head is the sum of the preset pressure value and the pressure compensation value. The pressing head is moved toward the carrier platform, and the pressing head pressure value is applied to place the chip within the chip bonding area, with the multiple bumps and multiple inner leads correspondingly engaged.

[0007] Based on the above, the internal lead bonding apparatus and bonding method of the present invention adjust the pressure applied to the bonding head according to the width value of the internal lead of the packaging unit. This configuration ensures that when the chip is bonded to multiple packaging units with different internal lead widths, the amount of internal lead sinking into the chip bumps of each packaging unit remains within an acceptable range. This avoids problems such as bump collapse or internal lead peeling from the bumps due to excessive or insufficient sinking. Therefore, the internal lead bonding apparatus and bonding method of the present invention can maintain consistent and stable internal lead bonding quality across multiple packaging units in a roll of flexible packaging tape, thereby improving overall manufacturing yield. Attached Figure Description

[0008] The accompanying drawings are included to further illustrate the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0009] Figure 1 This is a schematic diagram of an internal lead bonding device according to an embodiment of the present invention;

[0010] Figure 2 This is a partial schematic diagram of an internal lead bonding device according to an embodiment of the present invention;

[0011] Figure 3 This is a cross-sectional schematic diagram of the chip bonding inner leads according to an embodiment of the present invention;

[0012] Figure 4 This is a schematic diagram of the chip bonding area of ​​a packaging unit according to an embodiment of the present invention;

[0013] Figure 5 This is a schematic diagram of an image acquired by the image acquisition module of an internal lead bonding device according to an embodiment of the present invention;

[0014] Figure 6 This is a schematic diagram showing the relationship between the calculated inner lead width value and the pressure value for multiple packaging units according to an embodiment of the present invention.

[0015] Figure 7 This is a schematic diagram of the internal lead bonding in three different scenarios according to an embodiment of the present invention;

[0016] Figure 8 yes Figure 7 The diagram shows the curves of the inner lead width, pressure, and subsidence for three different scenarios of inner lead bonding.

[0017] Explanation of icon numbers

[0018] 100: Internal lead bonding equipment

[0019] 110: Supporting Platform

[0020] 120: Press head

[0021] 130: Image Acquisition Module

[0022] 140: Processor

[0023] 150: Controller

[0024] 160: Storage circuit

[0025] 170; Conveying equipment

[0026] 172; Conveying track

[0027] 174, 176: Tape reel turntable

[0028] 200: Flexible Packaging Tape

[0029] 220: Packaging Unit

[0030] 221: Flexible substrate

[0031] 222: Route

[0032] 222a: Inner lead

[0033] 222a1: Short side inner lead

[0034] 222a2: Inner lead on the long side

[0035] 223: Solder mask layer

[0036] 300: Chip

[0037] 320: Bump

[0038] A1, A2: Areas

[0039] C: Cartridge nozzle

[0040] D0: Subsidence

[0041] F1, F2, F3, F4: Pressure values

[0042] Fc2, Fc3, Fc4: Pressure compensation values

[0043] F0: Preset pressure value

[0044] IM: Image

[0045] P1, P2, P3, P4: Boxes

[0046] R1: Chip bonding area

[0047] T1, T2, T3, T4: Differences

[0048] T0: Preset difference

[0049] X1, X2, Y1, Y2: Boxes

[0050] W1, W2, W3, W4: Width values

[0051] W0: Standard width value

[0052] UL: Maximum width value

[0053] LL: Lower limit of width value

[0054] Wf: Chip Detailed Implementation

[0055] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present invention. Furthermore, in the following embodiments, the same or similar elements will be referred to by the same or similar reference numerals.

[0056] Figure 1 This is a schematic diagram of an internal lead bonding device according to an embodiment of the present invention. Figure 2 This is a partial schematic diagram of an internal lead bonding device according to an embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of the chip bonding inner leads according to an embodiment of the present invention. Please also refer to... Figures 1 to 3 In some embodiments, the internal lead bonding apparatus 100 includes a carrier platform 110, a pressing head 120, an image acquisition module 130, and a processor 140. In one embodiment, the carrier platform 110 can be used to carry a flexible packaging reel 200, wherein the flexible packaging reel 200 may have a plurality of packaging units 220 arranged adjacent to each other. Each packaging unit 220 may have a chip bonding area R1 for a chip 300 to be disposed therein. More specifically, in this embodiment, each packaging unit 220 may include a flexible substrate 221 and a plurality of lines 222 disposed on the flexible substrate 221, wherein each line 222 has an internal lead 222a, and these internal leads 222a of these lines 222 are located within the chip bonding area R1. That is, each packaging unit 220 may have a plurality of internal leads 222a located within the chip bonding area R1 for the chip 300 to be bonded thereto. Further, please refer to Figure 3Each packaging unit 220 may also include a solder mask layer 223, which partially covers multiple lines 222 and exposes the chip bonding area R1 and these internal leads 222a. In one embodiment, the flexible substrate 221 may be an electrically insulating film, such as polyimide (PI), which has arbitrary bending flexibility to facilitate tape-and-roll transport.

[0057] Please refer to the following at the same time Figure 1 and Figure 3 In one embodiment, multiple packaging units 220 of the flexible packaging tape 200 can be sequentially conveyed to the carrier platform 110 via a conveying device 170. For example, the conveying device 170 may include a conveying track 172 for carrying and conveying the flexible packaging tape 200 and two tape reels 174 and 176 respectively disposed at opposite ends of the conveying track 172. Thus, the two ends of the flexible packaging tape 200 can be wound onto the tape reels 174 and 176 respectively, and by rotating the tape reels 174 and 176, the flexible packaging tape 200 is moved along the conveying track 172 by tension, so that each packaging unit 220 of the flexible packaging tape 200 is sequentially arranged on the carrier platform 110. In this embodiment, the carrier platform 110 at least corresponds to the chip bonding area R1 of the packaging unit 220 disposed on the carrier platform 110, so as to provide support for the chip bonding area R1 of the packaging unit 220 in the subsequent internal wire bonding process.

[0058] Next, a pick and place device (e.g., die nozzle C) can be used to pick up the chip 300 from the wafer Wf and place the chip 300 onto the bonding head 120. The method of picking up the chip 300 may include vacuum suction, but is not limited to this. The chip 300 has a plurality of bumps 320. For example, the bumps 320 may include electroplated bumps, and the material may include gold, copper, nickel, silver, or any combination thereof.

[0059] In some embodiments, the pressing head 120 is movably disposed above the carrier platform 110. Specifically, the position of the pressing head 120 may correspond to the packaging unit 220 disposed on the carrier platform 110. The pressing head 120 is used to receive the chip 300, and after receiving the chip 300, it moves toward the carrier platform 110 and applies pressure to place the chip 300 in the chip bonding area R1 of the packaging unit 220, and the plurality of bumps 320 on the chip 300 respectively engage with the plurality of inner leads 222a of the packaging unit 220. Generally, the chip 300 is bonded to the inner leads 222a using a thermoforming method. Specifically, the bonding head 120 is heated to a preset temperature (e.g., approximately 460°C to 480°C) and receives the chip 300. Then, the support platform 110 is heated to a preset bonding temperature (e.g., approximately 110°C to 150°C). Finally, the bonding head 120 applies pressure towards the support platform 110 to bond the bumps 320 on the chip 300 to the corresponding inner leads 222a. During this bonding process, each inner lead 222a may partially sink into the corresponding bonding bump 320, resulting in a recess (e.g., ...). Figure 7 The subsidence amount D0 is shown.

[0060] Figure 4 This is a schematic diagram of the chip bonding area of ​​a packaging unit according to an embodiment of the present invention. Figure 5 This is a schematic diagram of an image acquired by the image acquisition module of an internal lead bonding device according to an embodiment of the present invention. Please refer to... Figure 2 , Figure 4 and Figure 5 In some embodiments, the image acquisition module 130 is movably disposed above the carrier platform 110 and is used to acquire an image IM of the chip bonding area R1 of the packaging unit 220 disposed on the carrier platform 110. Specifically, before using the pressing head 120 to place the chip 300 within the chip bonding area R1, the image acquisition module 130 may first move above the carrier platform 110 to acquire an image IM of the chip bonding area R1 of the packaging unit 220. The image acquisition module 130 may, for example, acquire images IM of one or more regions (e.g., two regions A1 and A2) in the chip bonding area R1. In this embodiment, regions A1 and A2 may, for example, be two corners located on a diagonal of the chip bonding area R1; in other words, the image IM acquired by the image acquisition module 130 may be as follows: Figure 4 The image shown includes two corners (regions A1 and A2) on a diagonal of the chip bonding area R1. Of course, this embodiment is merely illustrative, and the present invention does not limit the location or number of regions for image acquisition. Furthermore, the image IM acquired by the image acquisition module 130 (e.g., images of regions A1 and A2) can, for example, serve as a reference for alignment during the internal lead bonding process.

[0061] In one embodiment, the image acquisition module 130 of the internal lead bonding device 100 may have multiple image acquisition devices, which may be respectively disposed at two corners on a diagonal of the corresponding chip bonding area R1, so as to simultaneously acquire images such as... Figure 5 The images IM of the two regions A1 and A2 shown are illustrated. Of course, in other embodiments, the image acquisition module 130 may also have an image acquisition device that can move freely between the two regions A1 and A2 to acquire images as shown in the image. Figure 5 The images IM of the two regions A1 and A2 shown are illustrated. Of course, this embodiment is only for illustrative purposes, and the image acquisition module 130 can acquire one or more images of any location in the chip bonding area R1 according to actual needs.

[0062] Specifically, in this embodiment, the chip bonding area R1 of the packaging unit 220 corresponds to the chip 300 and has two opposing long sides and two opposing short sides. The plurality of inner leads 222a of the packaging unit 220 may include a plurality of short-side inner leads 222a1 arranged adjacent to the two short sides and a plurality of long-side inner leads 222a2 arranged adjacent to the two long sides. At least one short-side inner lead 222a1 and at least one long-side inner lead 222a2 are disposed in each of the two corners (regions A1 and A2) of the chip bonding area R1. That is, the images IM acquired by the image acquisition module 130 in regions A1 and A2 may each include at least one short-side inner lead 222a1 and at least one long-side inner lead 222a2.

[0063] Please refer to the following at the same time Figure 1 and Figure 5 In some embodiments, the processor 140 is coupled to the image acquisition module 130 to obtain multiple widths of partial inner leads 222a in the image IM acquired by the image acquisition module 130. For example, in this embodiment, the processor 140 obtains multiple widths of partial inner leads 222a in each image IM based on the image IM acquired by the image acquisition module 130 at the two corners (regions A1 and A2) of the chip bonding region R1, and these widths include at least one short-side inner lead 222a1 (e.g., ...) disposed in each of the two corners (regions A1 and A2). Figure 5 (as shown in the boxes X1 and X2) and at least one long side inner leader 222a2 (as shown in the box X2) Figure 5 The width of the boxes Y1 and Y2 shown is then calculated by the processor 140 based on these widths. In this embodiment, the width value is, for example, the average of the widths of at least one short side inner lead 222a1 and at least one long side inner lead 222a2 disposed in each of the two corners (regions A1 and A2).

[0064] Figure 6This is a schematic diagram illustrating the relationship between the calculated inner lead width value and the pressure value for multiple package units according to an embodiment of the internal lead bonding method of the present invention. Please refer to... Figure 1 and Figure 6 , Figure 6 The multiple black dots represent multiple width values ​​Wn of the inner leads 222a of the multiple package units 220 calculated by the processor 140, where n is a positive integer greater than zero, for example, n = 1, 2, 3, 4, ... (and so on). The processor 140 can calculate the difference Tn between the aforementioned width value Wn and the standard width value W0 of the inner leads 222a of these package units 220 (i.e., Tn = Wn - W0, n = 1, 2, 3, 4, ... (and so on)). Specifically, in this embodiment, the inner lead bonding device 100 may further include a storage circuit 160, which can be used to store standard (preset) size information of the package units 220 and / or the chip 300, such as the standard width value W0 of the inner leads 222a of these package units 220. Thus, the processor 140 is coupled to the storage circuit 160 to read the standard width value W0 of the inner lead 222a of these package units 220 and compare it with the calculated width value Wn of each package unit 220 to obtain the difference Tn, where n = 1, 2, 3, 4, ... (and so on).

[0065] In one embodiment, when the absolute value of the difference Tn between the calculated width value Wn and the standard width value W0 is less than or equal to a preset difference T0, it indicates that the difference between the width value Wn of the inner lead 222a of this packaging unit 220 and the standard width value W0 is still within an acceptable range. Based on this, the processor 140 sets the pressure value Fn to be applied to the pressing head 120 as the preset pressure value F0. In this embodiment, this preset pressure value F0 can also be stored in the storage circuit 160. For example, such as... Figure 6 As shown in the embodiment of block P1, the absolute value of the difference T1 between the calculated width value W1 of the inner lead 222a and the standard width value W0 is less than the preset difference T0, that is, the width value W1 falls within the allowable range (i.e., between the upper limit UL and the lower limit LL of the width value). Therefore, the pressure value F1 applied to the pressure head 120 is the preset pressure value F0.

[0066] In one embodiment, when the absolute value of the difference Tn is greater than the preset difference T0, it means that the difference between the width Wn of the inner lead 222a of this package unit 220 and the standard width W0 has exceeded the allowable range (i.e., higher than the upper limit UL or lower than the lower limit LL). At this time, the processor 140 can calculate the pressure compensation value Fcn (n = 1, 2, 3, 4, ... (and so on)) based on this difference Tn, and set the pressure value Fn to be applied to the pressure head 120 as the sum of the preset pressure value F0 and this pressure compensation value Fcn. For example, as Figure 6 As shown in the embodiment of block P2, when the absolute value of the above difference T2 is greater than the preset difference T0 and the difference T2 is negative, it means that the width W2 of the inner lead 222a of this package unit 220 is less than the standard width W0, and the difference between the two has exceeded the allowable range, that is, the width W2 is lower than the allowable lower limit LL. In this case, if the preset pressure value F0 is still applied to the pressing head 120, it may cause the inner lead 222a to sink too much. Therefore, the processor 140 will calculate a negative pressure compensation value Fc2 based on this difference T2, that is, the pressure value F2 to be applied to the pressing head 120 (the sum of the preset pressure value F0 and the pressure compensation value Fc2) will be less than the preset pressure value F0.

[0067] Conversely, such as Figure 6 As shown in the embodiment of block P3, when the absolute value of the above difference T3 is greater than the preset difference T0 and this difference T3 is positive, it means that the width value W3 of the inner lead 222a of this package unit 220 is greater than the standard width value W0, and the difference between the two has exceeded the allowable range, that is, the width value W3 is higher than the upper limit of the allowable width value UL. In this case, if the preset pressure value F0 is still applied to the pressing head 120, it may cause the sinking amount of the inner lead 222a to be too small. Therefore, the processor 140 will calculate a positive pressure compensation value Fc3 based on this difference T3, that is, the pressure value F3 to be applied to the pressing head 120 (the sum of the preset pressure value F0 and the pressure compensation value Fc3) will be greater than the preset pressure value F0.

[0068] It is worth mentioning that, such as Figure 6 As shown, after the processor 140 applies a compensated pressure value Fn (greater than or less than a preset pressure value F0) to the pressing head 120 according to the aforementioned difference Tn to connect the chip 300 to the inner lead 222a, the processor 140 adjusts the pressure value back to the preset pressure value F0, and then proceeds to connect the inner leads of the next packaging unit 220. In addition, as... Figure 6 As shown in the embodiments of blocks P3 and P4, the width values ​​W3 and W4 of the inner lead 222a are both higher than the upper limit of the allowable width value UL. The pressure compensation values ​​Fc3 and Fc4 calculated based on the differences T3 and T4 between the width values ​​W3 and W4 of the inner lead 222a and the standard width value W0 are both positive, meaning that the pressure values ​​F3 and F4 applied to the pressure head 120 are both greater than the preset pressure value F0. However, the difference T4 is significantly greater than the difference T3, and the pressure compensation value Fc4 calculated based on the difference T4 will also be greater than the pressure compensation value Fc3 calculated based on the difference T3. Therefore, the pressure value F4 applied to the pressure head 120 will be greater than the pressure value F3.

[0069] Figure 7 This is a schematic diagram of internal lead bonding in three different scenarios according to an embodiment of the present invention. Figure 8 yes Figure 7 The diagram illustrates the curves showing the inner lead width, pressure, and subsidence amount for three different inner lead bonding scenarios. Specifically, Figure 7 and Figure 8 It corresponds Figure 6 The diagrams illustrate three different scenarios of the embodiments of blocks P1, P2, and P3. Please also refer to... Figure 1 , Figure 7 and Figure 8 After the processor 140 obtains the pressure value Fn to be applied to the pressing head 120 according to the above method, the controller 150 coupled to the processor 140 can control the pressing head 120 to move toward the support platform 110 and apply the obtained pressure value Fn to the pressing head 120, so that the chip 300 is placed in the chip bonding area R1 and the bumps 320 of the chip 300 are correspondingly bonded to the inner leads 222a of the packaging unit 220. In this way, the inner lead bonding device 100 and bonding method of the present invention can ensure that when the chip 300 is bonded to multiple packaging units 220 with inner leads 222a of different width values ​​Wn, the amount of sinking of the inner lead 222a into the bump 320 can be maintained within an allowable range, and problems such as the bump 320 collapsing or the inner lead 222a peeling off from the bump 320 will not occur due to excessive or insufficient sinking, so as to maintain a more consistent and stable inner lead bonding quality. For example, in an embodiment where the width W1 of the inner lead 222a falls within the allowable range (i.e., between the upper limit UL and the lower limit LL), a subsidence amount D0 can be obtained by applying a preset pressure value F0 to the inner lead bonding. In an embodiment where the width W2 of the inner lead 222a is lower than the allowable lower limit LL, a pressure value F2 less than the preset pressure value F0 is applied to the inner lead bonding to obtain a consistent subsidence amount D0. In an embodiment where the width W3 of the inner lead 222a is higher than the allowable upper limit UL, a pressure value F3 greater than the preset pressure value F0 is applied to the inner lead bonding to obtain a consistent subsidence amount D0. Here, the subsidence amount D0 can be the allowable subsidence range of the inner lead 222a.

[0070] In summary, the internal lead bonding apparatus and method of the present invention adjust the pressure applied to the bonding head according to the width value of the internal lead of the packaging unit. This configuration ensures that when the chip is bonded to multiple packaging units with different internal lead widths, the amount of internal lead penetration into the chip bumps of each packaging unit remains within an acceptable range. This avoids problems such as bump collapse or internal lead peeling from the bumps due to excessive or insufficient penetration. Therefore, the internal lead bonding apparatus and method of the present invention enable consistent and stable internal lead bonding quality across multiple packaging units in a roll of flexible packaging tape, thereby improving overall manufacturing yield.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An internal lead bonding device, characterized in that, include: A carrier platform for carrying flexible packaging tape, wherein the flexible packaging tape has a plurality of packaging units, each packaging unit having a chip bonding area and a plurality of internal leads located within the chip bonding area, each packaging unit being sequentially arranged on the carrier platform, and the carrier platform at least corresponding to the chip bonding area of ​​the packaging unit arranged on the carrier platform. A pressing head is used to receive a chip and is movably disposed above the carrier platform and corresponds to the packaging unit disposed on the carrier platform. The pressing head is used to move toward the carrier platform and apply pressure to place the chip in the chip bonding area of ​​the packaging unit, and a plurality of bumps on the chip are correspondingly engaged with the plurality of inner leads. An image acquisition module is movably disposed above the carrier platform and is used to acquire an image of the chip bonding area of ​​the packaging unit configured on the carrier platform; as well as The processor, coupled to the image acquisition module, is configured to acquire multiple widths of a portion of the plurality of inner leads based on the image, calculate width values ​​based on the multiple widths of the plurality of inner leads, calculate the difference between the width values ​​and the standard width values ​​of the plurality of inner leads, determine the pressure value applied to the crimping head based on the difference, and calculate a pressure compensation value. When the absolute value of the difference is less than or equal to a preset difference, the pressure applied to the crimping head is a preset pressure value; when the absolute value of the difference is greater than the preset difference, the pressure applied to the crimping head is the sum of the preset pressure value and the pressure compensation value.

2. The internal lead bonding device according to claim 1, characterized in that, The width value is the average of the widths of a portion of the plurality of inner leads.

3. The internal lead bonding device according to claim 1, characterized in that, The pressure compensation value is positive when the absolute value of the difference is greater than the preset difference and the difference is positive, and the pressure compensation value is negative when the absolute value of the difference is greater than the preset difference and the difference is negative.

4. The internal lead bonding device according to claim 1, characterized in that, The image includes images of two corners along the diagonal of the chip bonding area.

5. The internal lead bonding device according to claim 4, characterized in that, The chip bonding area has two opposing long sides and two opposing short sides. The plurality of inner leads include a plurality of long side inner leads arranged adjacent to each of the two long sides and a plurality of short side inner leads arranged adjacent to each of the two short sides. At least one long side inner lead and at least one short side inner lead are arranged in each of the two corners. The plurality of widths of the plurality of inner leads obtained according to the image include the widths of at least one long side inner lead and at least one short side inner lead arranged in each of the two corners.

6. The internal lead bonding device according to claim 1, characterized in that, When the plurality of bumps are engaged with the plurality of inner leads, each inner lead is partially sunk into the corresponding engaged bump, resulting in a sinking amount.

7. A method for bonding internal leads, characterized in that, include: A flexible packaging tape having multiple packaging units is transmitted, such that each packaging unit is sequentially arranged on a carrier platform, wherein each packaging unit has a chip bonding area and multiple internal leads located within the chip bonding area, and the carrier platform corresponds at least to the chip bonding area of ​​the packaging unit arranged on the carrier platform. A chip with multiple bumps is placed on a pressing head; Acquire an image of the chip bonding area of ​​the packaging unit configured on the carrier platform; Based on the image, obtain a plurality of widths for some of the plurality of inner leads; The width value is calculated based on the width of the plurality of inner leads, and the difference between the width value and the standard width value of the plurality of inner leads is calculated. The pressure value applied to the pressing head is determined based on the difference and a pressure compensation value is calculated. When the absolute value of the difference is less than or equal to a preset difference, the pressure value applied to the pressing head is the preset pressure value. When the absolute value of the difference is greater than the preset difference, the pressure value applied to the pressing head is the sum of the preset pressure value and the pressure compensation value. as well as The pressing head is moved toward the support platform and the pressure value is applied to the pressing head so that the chip is placed in the chip bonding area, and the plurality of bumps are correspondingly engaged with the plurality of inner leads.

8. The internal lead bonding method according to claim 7, characterized in that, The width value is the average of the widths of a portion of the plurality of inner leads.

9. The internal lead bonding method according to claim 7, characterized in that, The pressure compensation value is positive when the absolute value of the difference is greater than the preset difference and the difference is positive, and the pressure compensation value is negative when the absolute value of the difference is greater than the preset difference and the difference is negative.

10. The internal lead bonding method according to claim 7, characterized in that, The image includes images of two corners along the diagonal of the chip bonding area.

11. The internal lead bonding method according to claim 10, characterized in that, The chip bonding area has two opposing long sides and two opposing short sides. The plurality of inner leads include a plurality of long side inner leads arranged adjacent to each of the two long sides and a plurality of short side inner leads arranged adjacent to each of the two short sides. At least one long side inner lead and at least one short side inner lead are arranged in each of the two corners. The plurality of widths of the plurality of inner leads obtained according to the image include the widths of at least one long side inner lead and at least one short side inner lead arranged in each of the two corners.

12. The internal lead bonding method according to claim 7, characterized in that, When the plurality of bumps are engaged with the plurality of inner leads, each inner lead is partially sunk into the corresponding engaged bump, resulting in a sinking amount.

Images