Display panel and preparation method thereof

Abstract

Embodiments of the present application disclose a display panel and a preparation method thereof. The display panel comprises at least two sub-display panels, two adjacent sub-display panels are spliced, and the two adjacent sub-display panels have a splicing joint therebetween. The sub-display panel comprises a substrate and a plurality of sub-pixel units located on one side of the substrate. An encapsulation part is located on the side of the substrate close to the plurality of sub-pixel units. The encapsulation part covers at least one sub-pixel unit located on at least one side of the splicing joint and covers a splicing joint area corresponding to the at least one sub-pixel unit. The technical solution of the present application helps to increase the light output of the area corresponding to the splicing joint between the adjacent sub-display panels, thereby compensating for the light intensity of the area corresponding to the splicing joint, helping to reduce the visual existence of the splicing joint, and balancing the overall display effect of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel and its manufacturing method. Background Technology

[0002] MicroLED display panels, which utilize micrometer-sized light-emitting diodes (LEDs), are now widely used in various applications. MicroLED display panels are typically composed of multiple MicroLED sub-panels spliced ​​together. The seams between adjacent sub-panels result in the seam area being darker than other display areas, making the seams more visually noticeable and affecting the overall display effect. Summary of the Invention

[0003] This invention provides a display panel and its manufacturing method to increase the light output of the area corresponding to the splicing seam between adjacent sub-display surfaces, thereby compensating for the light intensity of the area corresponding to the splicing seam, helping to reduce the visual presence of the splicing seam, and balancing the overall display effect of the display panel.

[0004] In a first aspect, embodiments of the present invention provide a display panel, comprising:

[0005] At least two sub-display panels, two adjacent sub-display panels are spliced ​​together, and there is a splicing seam between two adjacent sub-display panels. Each sub-display panel includes a substrate and a plurality of sub-pixel units located on one side of the substrate.

[0006] The encapsulation portion is located on the side of the substrate near the sub-pixel unit. The encapsulation portion covers at least one sub-pixel unit located on at least one side of the splicing seam and covers the splicing seam area corresponding to the at least one sub-pixel unit.

[0007] Preferably, the encapsulation portion covers the seam between two adjacent sub-display panels and covers the two columns of sub-pixel units located on both sides of the seam.

[0008] Preferably, the encapsulation portion includes a plurality of sub-encapsulation portions, each sub-encapsulation portion covering at least two sub-pixel units located on both sides of the splicing seam and correspondingly arranged in a direction perpendicular to the extension direction of the splicing seam, and covering the splicing seam area between the at least two sub-pixel units; the plurality of sub-encapsulation portions are arranged sequentially along the extension direction of the splicing seam, with adjacent sub-encapsulation portions abutting against each other, or with a gap between adjacent sub-encapsulation portions.

[0009] Preferably, the plurality of sub-pixel units include red sub-pixel units, green sub-pixel units, and blue sub-pixel units, with one column of the sub-pixel units located on both sides of the splicing seam being the red sub-pixel units and the other column being the blue sub-pixel units.

[0010] Preferably, the encapsulation part is formed of a light-transmitting material, and the outer surface of the encapsulation part is arc-shaped or polygonal.

[0011] Preferably, the display panel further includes an encapsulation layer located on the side of the substrate near the sub-pixel unit, the encapsulation layer covering the encapsulation portion and the sub-pixel units of each of the sub-display panels.

[0012] Preferably, the encapsulation layer has a plurality of slotted areas on the side away from the substrate, and the slotted areas are arranged one-to-one with the sub-pixel units; the vertical projection of the sub-pixel unit on the substrate is located within the vertical projection of the slotted area on the substrate, or the vertical projection of the sub-pixel unit on the substrate coincides with the vertical projection of the slotted area on the substrate.

[0013] Preferably, the depth of the slotted area corresponding to the sub-pixel unit covered by the encapsulation part is a first depth, and the depth of the slotted area corresponding to the remaining sub-pixel units is a second depth. The value of the first depth, the value of the second depth, and the light transmittance of the encapsulation part are related.

[0014] Preferably, the first depth is equal to the product of the second depth and the light transmittance of the encapsulation portion.

[0015] Secondly, embodiments of the present invention also provide a method for manufacturing a display panel, comprising:

[0016] At least two sub-display panels are provided, and the at least two sub-display panels are spliced ​​together, with a splicing seam between two adjacent sub-display panels. The sub-display panel includes a substrate and a plurality of sub-pixel units located on one side of the substrate.

[0017] An encapsulation portion is formed on the side of the substrate near the sub-pixel unit, such that the encapsulation portion covers at least one of the sub-pixel units located on at least one side of the splicing seam, and covers the splicing seam area corresponding to the at least one sub-pixel unit.

[0018] Preferably, it further includes: forming an encapsulation layer covering the encapsulation portion and the sub-pixel units of each of the sub-display panels, wherein a plurality of slotted areas are provided on the side of the encapsulation layer away from the substrate, and the slotted areas are provided one-to-one with the sub-pixel units; wherein the vertical projection of the sub-pixel unit on the substrate is located within the vertical projection of the slotted area on the substrate, or the vertical projection of the sub-pixel unit on the substrate coincides with the vertical projection of the slotted area on the substrate.

[0019] The display panel and its manufacturing method provided in this invention, by setting an encapsulation part, covers at least one sub-pixel unit located on at least one side of the splicing seam and covers the splicing seam area corresponding to at least one sub-pixel unit, enables the light emitted by the sub-pixel unit covered by the encapsulation part to be refracted outward through the encapsulation part, thereby changing the light emission direction of the sub-pixel unit and forming a uniform light emission surface on the outer surface of the encapsulation part, thereby increasing the light emission of the area corresponding to the splicing seam, thereby compensating for the light intensity of the area corresponding to the splicing seam, helping to reduce the visual presence of the splicing seam, and balancing the overall display effect of the display panel.

[0020] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a top view of the pre-formed encapsulation section after the two sub-display panels are spliced ​​together, as provided in an embodiment of the present invention;

[0023] Figure 2 Examples of embodiments of the present invention Figure 1 A top view of the assembled and packaged section after the two sub-display panels are joined together;

[0024] Figure 3 Examples of embodiments of the present invention Figure 1 Another top view of the assembled and packaged section after the two sub-display panels are shown;

[0025] Figure 4 Examples of embodiments of the present invention Figure 1 Another top view of the assembled and packaged section after the two sub-display panels are spliced ​​together;

[0026] Figure 5 yes Figure 2 A cross-sectional view obtained by cutting the display panel along section line LL';

[0027] Figure 6 yes Figure 2 Another sectional view obtained by cutting the display panel along section line LL';

[0028] Figure 7 yes Figure 2 Another sectional view obtained by cutting the display panel along section line LL';

[0029] Figures 8 to 12 These are cross-sectional views of the display panel formed in each step of the display panel manufacturing method provided in this embodiment of the invention. Detailed Implementation

[0030] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0031] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0032] As described in the background section, in the prior art, the area corresponding to the splicing seam between adjacent sub-display panels is darker than other display areas, making the splicing seam more visually noticeable, which affects the overall display effect of the display panel.

[0033] To address the aforementioned problems, embodiments of the present invention provide a display panel formed by splicing together two sub-display panels. (In conjunction with...) Figures 1 to 7The display panel is formed by splicing two adjacent sub-display panels 100, with a splicing seam 30 between the two adjacent sub-display panels 100. Each sub-display panel 100 includes a substrate 10 and a plurality of sub-pixel units PX arranged in an array on one side of the substrate 10. The substrate 10 includes a substrate 110 and a pixel circuit layer 120 located on one side of the substrate 110. The substrate 110 can provide buffering, protection, or support for the sub-display panel. A plurality of pixel circuits are formed in the pixel circuit layer 120, and the sub-pixel units PX are electrically connected to their corresponding pixel circuits to drive the sub-pixel units PX to emit light. In this embodiment of the invention, the sub-pixel units PX can be light-emitting diodes (LEDs), organic light-emitting diodes (OLEDs), or micron-sized light-emitting diodes (Micro LEDs). The emission colors of the sub-pixel units PX can be different to form sub-pixel units PX with different emission colors, such as red, green, and blue sub-pixel units. In this embodiment of the invention, the display panel is formed by splicing two sub-display panels 100. In other embodiments, the display panel may also be formed by splicing other numbers of sub-display panels 100.

[0034] The display panel also includes a packaging section 20, which is located on the side of the substrate 10 near the sub-pixel unit PX. Figure 2 This is a top view corresponding to one embodiment of the present invention. In this embodiment, the encapsulation part 20 covers the splicing seam 30 between two adjacent sub-display panels 100, and covers two columns of sub-pixel units PX located on both sides of the splicing seam 30. Specifically, the encapsulation part 20 covers the splicing seam 30, and the encapsulation part 20 covers one column of sub-pixel units PX located on one side of the splicing seam 30, and the encapsulation part 20 also covers one column of sub-pixel units PX located on the other side of the splicing seam 30. In other embodiments, the encapsulation part 20 may also cover the splicing seam 30, and cover one column of sub-pixel units PX located on one side of the splicing seam 30, for example, one column of sub-pixel units PX located on the left side of the splicing seam 30, or one column of sub-pixel units PX located on the right side of the splicing seam 30.

[0035] Combination Figure 3This is a top view corresponding to another embodiment of the present invention. In this embodiment, the encapsulation part 20 includes a plurality of sub-encapsulation parts 201, which are arranged sequentially along the extension direction of the splicing seam 30, with adjacent sub-encapsulation parts 201 abutting against each other. The sub-encapsulation part 201 covers a sub-pixel unit PX located on one side of the splicing seam 30, and also covers a sub-pixel unit PX located on the other side of the splicing seam 30. The two sub-pixel units PX located on both sides of the splicing seam 30 are correspondingly arranged in a direction perpendicular to the extension direction of the splicing seam 30. The sub-encapsulation part 201 also covers the splicing seam area corresponding to the two sub-pixel units PX located on both sides of the splicing seam 30. In other embodiments, the encapsulation part 20 may also cover a sub-pixel unit PX located on one side of the splicing seam 30, and also cover the splicing seam area corresponding to that sub-pixel unit PX in a direction perpendicular to the extension direction of the splicing seam 30.

[0036] Combination Figure 4 This is a top view corresponding to another embodiment of the present invention. In this embodiment, the encapsulation part 20 includes a plurality of sub-encapsulation parts 201, which are arranged sequentially along the extension direction of the splicing seam 30, with a gap between adjacent sub-encapsulation parts 201. The sub-encapsulation part 201 covers a sub-pixel unit PX located on one side of the splicing seam 30, and also covers a sub-pixel unit PX located on the other side of the splicing seam 30. The two sub-pixel units PX located on both sides of the splicing seam 30 are correspondingly arranged in a direction perpendicular to the extension direction of the splicing seam 30. The sub-encapsulation part 201 also covers the splicing seam area corresponding to the two sub-pixel units PX located on both sides of the splicing seam 30. In other embodiments, the encapsulation part 20 may also cover a sub-pixel unit PX located on one side of the splicing seam 30, and also cover the splicing seam area corresponding to that sub-pixel unit PX in a direction perpendicular to the extension direction of the splicing seam 30.

[0037] In this embodiment of the invention, the encapsulation portion 20 can be formed of a material with high light transmittance (e.g., an organic adhesive), and the encapsulation portion 20 is capable of refracting light. The material of the encapsulation portion 20 may include acrylic or polydimethylsiloxane (PDMS).

[0038] The technical solution of this invention, by setting an encapsulation part 20 to cover at least one sub-pixel unit PX located on at least one side of the splicing seam 30, and covering the splicing seam area corresponding to at least one sub-pixel unit PX in the direction perpendicular to the extension direction of the splicing seam 30, enables the light emitted by the sub-pixel unit PX covered by the encapsulation part 20 to be refracted through the encapsulation part 20, thereby changing the light emission direction of that part of the sub-pixel unit PX, so that the outer surface of the encapsulation part 20 forms a uniform light emission surface, thereby increasing the light emission of the area corresponding to the splicing seam 30, thereby compensating for the light intensity of the area corresponding to the splicing seam 30, helping to reduce the visual presence of the splicing seam, and balancing the overall display effect of the display panel.

[0039] For example, combined Figure 2 Each sub-display panel 100 includes multiple columns of sub-pixel units PX. One side of the splicing seam 30 is adjacent to the last column of sub-pixel units PX in one sub-display panel 100, and the other side of the splicing seam 30 is adjacent to the first column of sub-pixel units PX in another sub-display panel 100. An encapsulation part 20 can be provided to cover the splicing seam 30 and the two columns of sub-pixel units PX located on the left and right sides of the splicing seam 30. That is, the encapsulation part 20 covers the last column of sub-pixel units PX in one sub-display panel 100 and the first column of sub-pixel units PX in another sub-display panel 100. This allows the encapsulation unit 20 to cover the entire splicing seam 30 between two adjacent sub-display panels 100, as well as the two columns of sub-pixel units PX located on both sides of the splicing seam 30. This changes the light emission direction of the two columns of sub-pixel units PX on both sides of the splicing seam 30, allowing the light emitted by the two columns of sub-pixel units PX on both sides of the splicing seam 30 to be refracted through the encapsulation unit 20. This further increases the light emission in the corresponding area of ​​the splicing seam 30, compensates for the light intensity in the corresponding area of ​​the splicing seam 30, reduces the visual presence of the splicing seam 30, and balances the overall display effect of the display panel.

[0040] It should be noted that, Figure 1 This illustration only shows that the display panel is composed of two horizontally arranged sub-display panels 100 spliced ​​together, and the splicing seam 30 extends in the column direction of the sub-pixel units PX. In other embodiments, the display panel can also be composed of vertically arranged sub-display panels 100 spliced ​​together. Correspondingly, the splicing seam 30 can extend in the row direction of the sub-pixel units PX. In this case, the encapsulation part 20 can be set to cover the splicing seam 30 and the two rows of sub-pixel units PX located on both sides of the splicing seam 30, so as to compensate for the light intensity of the corresponding area of ​​the splicing seam 30 through the encapsulation part 20. In practical applications, the sub-pixel units PX covered by the encapsulation part 20 can be specifically set according to the splicing method of the sub-display panels 100 and the extension direction of the splicing seam 30.

[0041] Combination Figure 5In this embodiment, the outer surface of the encapsulation part 20 is arc-shaped, which allows the light emitted by the sub-pixel unit PX covered by the encapsulation part 20 to be refracted by the encapsulation part 20 and emitted in all directions from the outer surface of the encapsulation part 20. This helps to improve the uniformity of light emitted by the encapsulation part 20, reduce the difference in light effect between the splicing seam 30 area and other display areas, and improve the consistency of the overall display effect of the display panel.

[0042] In other embodiments, the outer surface of the encapsulation portion 20 may be polygonal. Figure 6 and Figure 7 All the solutions show that the outer surface of the encapsulation part 20 is polygonal. With this setting, the light emitted by the sub-pixel unit PX covered by the encapsulation part 20 can be refracted by the encapsulation part 20 and emitted in all directions from the outer surface of the encapsulation part 20, thereby compensating for the light intensity loss in the corresponding area of ​​the splicing seam 30, reducing the visual presence of the splicing seam 30, and improving the consistency of the overall display effect of the display panel.

[0043] In this embodiment of the invention, the encapsulation part 20 covers the splicing seam 30 between two adjacent sub-display panels 100 and covers the two columns of sub-pixel units PX located on both sides of the splicing seam 30. Preferably, the specific form in which the encapsulation part 20 covers the sub-pixel units PX can be "encapsulation", for example, the encapsulation part 20 can wrap around the corresponding sub-pixel units PX. Figures 5 to 7 Both cases show the case where the encapsulation portion 20 covers the seam 30 between two adjacent sub-display panels 100 and encapsulates the two rows of sub-pixel units PX located on both sides of the seam 30.

[0044] See Figures 5 to 7 The display panel may further include an encapsulation layer 40, located on the side of the substrate 10 near the sub-pixel unit PX. The encapsulation layer 40 covers the sub-pixel units PX and the encapsulation portion 20 of each sub-display panel 100. The encapsulation layer 40 can encapsulate each sub-display panel 100 as a whole, effectively isolating it from water and oxygen. The encapsulation layer 40 isolates each sub-pixel unit PX to prevent light interference between adjacent sub-pixel units PX; simultaneously, the encapsulation layer 40 can reduce the reflectivity of light emitted by each sub-pixel unit PX, thereby improving the display effect. Specifically, the encapsulation layer 40 can be formed of a material with low light transmittance; for example, the material of the encapsulation layer 40 may include chromium, chromium oxide, or black resin.

[0045] The encapsulation layer 40 has a plurality of slotted areas 50 on the side away from the substrate 10. Specifically, by removing at least a portion of the encapsulation layer 40 directly above each sub-pixel unit PX, slotted areas 50 corresponding one-to-one with each sub-pixel unit PX can be formed. The slotted areas 50 are arranged one-to-one with the sub-pixel units PX so that the sub-pixel units PX emit light outward through the corresponding slotted areas 50; the vertical projection of the sub-pixel unit PX on the substrate 10 is located within the vertical projection of the slotted area 50 on the substrate 10, or the vertical projection of the sub-pixel unit PX on the substrate 10 coincides with the vertical projection of the slotted area 50 on the substrate 10. Specifically, the minimum cross-sectional area of ​​each slotted area 50 in the direction parallel to the plane of the substrate is equal to or greater than the surface area of ​​the light-emitting surface of the corresponding sub-pixel unit PX. By providing a slotted area 50 corresponding to each sub-pixel unit PX on the side of the encapsulation layer 40 away from the substrate 10, the encapsulation layer 40 can form a black matrix (BM). The advantages of this arrangement are twofold: firstly, the thickness of the encapsulation layer 40 directly above each sub-pixel unit PX is thinner, thereby improving the light transmittance of the encapsulation layer 40 directly above the sub-pixel unit PX and reducing the impact of the encapsulation layer 40 on the display effect of the sub-pixel unit PX; secondly, the encapsulation layer 40 can also block light in the area between adjacent sub-pixel units PX and in the area corresponding to the splicing seam 30, so that the light emission effect of the sub-pixel units PX around the splicing seam 30 is similar to that of the sub-pixel units PX in other areas, thereby reducing the impact of the splicing seam 30 on the display effect and improving the consistency of the overall display effect of the display panel.

[0046] See Figures 5 to 7In this embodiment of the invention, by adjusting the thickness of the encapsulation layer 40, the depth of the slotted area 50 corresponding to the sub-pixel unit PX covered by the encapsulation portion 20, and the depth of the slotted areas 50 corresponding to the remaining sub-pixel units PX, it is helpful to balance the light emission intensity of the sub-pixel unit PX covered by the encapsulation portion 20 and the remaining sub-pixel units PX. Specifically, the thickness of the encapsulation layer 40 refers to the thickness of the encapsulation layer 40 where the slotted area 50 is not formed. The thickness of the encapsulation layer 40 and the depth of the slotted area 50 can determine the thickness of the portion of the encapsulation layer 40 located directly above the sub-pixel unit PX. For example, when the encapsulation portion 20 covers the sub-pixel units PX on both sides of the seam 30, since the encapsulation portion 20 forms a uniform light-emitting surface, the light emitted by the sub-pixel units PX on both sides of the seam 30 is refracted through the encapsulation portion 20, thereby increasing the light emission intensity of the sub-pixel units PX in the area covered by the encapsulation portion 20. Therefore, the depth of the slotted area 50 corresponding to the sub-pixel units PX covered by the encapsulation portion 20 can be set to be less than the depth of the slotted area 50 corresponding to the sub-pixel units PX not covered by the encapsulation portion 20, so as to balance the light emission intensity of the sub-pixel units PX covered by the encapsulation portion 20 and the other sub-pixel units PX. In addition, for the sub-pixel units PX not covered by the encapsulation portion 20, the depth of the slotted area 50 corresponding to the sub-pixel units PX with the same emission color can also be set to be the same, so that the thickness of the encapsulation layer 40 above the sub-pixel units PX with the same emission color is the same, thereby making the light emission intensity of the sub-pixel units PX with the same emission color the same.

[0047] See Figures 5 to 7 The depth of the slotted area 50 corresponding to the sub-pixel unit PX covered by the encapsulation section 20 is a first depth H1, and the depth of the slotted area 50 corresponding to the remaining sub-pixel units PX is a second depth H2. Since the values ​​of the first depth H1 and the second depth H2 are related to the light transmittance TR of the encapsulation section 20, setting the first depth H1 and the second depth H2 according to the light transmittance TR of the encapsulation section 20 helps to balance the light emission intensity of the sub-pixel unit PX covered by the encapsulation section 20 and the remaining sub-pixel units PX. Specifically, the first depth H1 is equal to the product of the second depth H2 and the light transmittance TR of the encapsulation section 20, that is, H1 = H2 * TR. This setting helps to further balance the light emission intensity of the sub-pixel unit PX covered by the encapsulation section 20 and the remaining sub-pixel units PX.

[0048] In this embodiment of the invention, the sub-pixel unit PX includes a red sub-pixel unit PX1, a green sub-pixel unit PX2, and a blue sub-pixel unit PX3; a column of sub-pixel units PX adjacent to one side of the splicing seam 30 is a red sub-pixel unit PX1, and a column of sub-pixel units PX adjacent to the other side of the splicing seam 30 is a blue sub-pixel unit PX3. The encapsulation part 20 covers a column of red sub-pixel units PX1 and a column of blue sub-pixel units PX3 located on both sides of the splicing seam 30.

[0049] For example, the sub-pixel units in each column of the sub-display panel 100 are configured in a Real RGB arrangement, that is, the sub-pixel units in each column are arranged alternately in the order of a column of red sub-pixel units PX1, a column of green sub-pixel units PX2 and a column of blue sub-pixel units PX3, and one column of the first column and the last column of sub-pixel units in each sub-display panel 100 is set to be red sub-pixel units PX1 and the other column is set to be blue sub-pixel units PX3. The column of red sub-pixel units PX1 and the column of blue sub-pixel units PX3 of the two sub-display panels that are spliced ​​together are set on both sides of the splicing seam 30. Since the human eye is more sensitive to light emitted by green sub-pixel unit PX2 than to light emitted by red sub-pixel unit PX1 and blue sub-pixel unit PX3, this embodiment of the invention, by setting red sub-pixel unit PX1 and blue sub-pixel unit PX3 on both sides of the splicing seam 30, helps to reduce the stimulation of the human eye by the light emitted by the sub-pixel units around the splicing seam 30, thereby further reducing the visual presence of the splicing seam 30 and improving the consistency of the overall display effect of the display panel.

[0050] This invention also provides a method for preparing a display panel, applicable to preparing the display panel in any of the above embodiments of this invention.

[0051] Figures 8 to 12 These are cross-sectional views of the display panel formed in each step of the manufacturing method of the display panel provided in this embodiment of the invention. (In conjunction with...) Figures 8 to 12 The method specifically includes the following steps:

[0052] Step 1: Provide at least two sub-display panels 100 and splice the at least two sub-display panels 100 together. There is a splicing seam 30 between two adjacent sub-display panels 100. The sub-display panel 100 includes a substrate 10 and a plurality of sub-pixel units PX located on one side of the substrate 10.

[0053] The sub-pixel unit PX can be a light-emitting diode (LED), an organic light-emitting diode (OLED), or a micron-sized light-emitting diode (Micro LED). This embodiment of the invention uses Micro LED as an example for explanation. During the fabrication of the sub-display panel 100, sub-pixel units PX are bonded to one side of the substrate 10, forming an array of multiple sub-pixel units PX. The multiple sub-pixel units include red sub-pixel units, green sub-pixel units, and blue sub-pixel units. Furthermore, one column of the first and last columns of sub-pixel units in the sub-display panel 100 is designated as red sub-pixel units, and the other column as blue sub-pixel units.

[0054] For example, see Figure 8 Each sub-display panel 100 is placed on one side of the stage 60, and optical equipment is used to align each sub-display panel 100 and splice adjacent sub-display panels 100 together. The stage 60 can be a quartz or glass stage.

[0055] When splicing adjacent sub-display panels, the first column of sub-pixel units PX in one sub-display panel and the last column of sub-pixel units PX in another sub-display panel are set to be adjacent. This makes the sub-pixel units PX on both sides of the splicing seam 30 between adjacent sub-display panels red sub-pixel unit PX1 and blue sub-pixel unit PX3 respectively. This reduces the stimulation of the human eye by the light emitted by the sub-pixel units PX around the splicing seam 30, thereby further reducing the visual presence of the splicing seam 30 and improving the consistency of the overall display effect of the display panel.

[0056] Step 2: Form an encapsulation portion 20 on the side of the substrate 10 near the sub-pixel unit PX, such that the encapsulation portion 20 covers at least one sub-pixel unit PX located on at least one side of the splicing seam 30, and covers the splicing seam area corresponding to at least one sub-pixel unit PX.

[0057] For example, see Figure 9 On the side of the substrate 10 near the sub-pixel unit PX, an encapsulation portion 20 is formed by inkjet printing stacking or photolithography coating followed by patterning etching. The encapsulation portion 20 covers the seam 30 between two adjacent sub-display panels, and also covers a row of red sub-pixel units PX1 and a row of blue sub-pixel units PX3 located on both sides of the seam 30. The encapsulation portion 20 is then UV cured to prevent deformation.

[0058] Step 3: Form a packaging layer 40 covering the sub-pixel units PX of each sub-display panel 100 and the packaging section 20.

[0059] See Figure 10 After UV curing of the encapsulation section 20, an encapsulation layer 40 is applied to one side of the substrate 10 of each sub-display panel 100, so that the encapsulation layer 40 covers each sub-pixel unit PX and the encapsulation section 20 located on one side of the substrate 10.

[0060] Step 4: On the side of the encapsulation layer 40 away from the substrate 10, a plurality of slotted areas 50 are provided. The slotted areas 50 are set one-to-one with the sub-pixel units PX, so that the sub-pixel units PX emit light outward through the corresponding slotted areas 50.

[0061] The vertical projection of the sub-pixel unit PX on the substrate 10 is located within the vertical projection of the slotted area 50 on the substrate 10, or the vertical projection of the sub-pixel unit PX on the substrate 10 coincides with the vertical projection of the slotted area 50 on the substrate 10.

[0062] For example, see Figure 11 By using laser or etching processes, at least a portion of the encapsulation layer 40 directly above each sub-pixel unit PX is removed to form a slotted area 50 that corresponds one-to-one with each sub-pixel unit PX. Furthermore, the minimum cross-sectional area of ​​each slotted area 50 in the direction parallel to the plane of the substrate 10 is equal to or greater than the surface area of ​​the light-emitting surface of the corresponding sub-pixel unit PX.

[0063] By adjusting the thickness of the encapsulation layer 40, the depth of the slotted area 50 corresponding to the sub-pixel unit PX covered by the encapsulation portion 20, and the depth of the slotted area 50 corresponding to the remaining sub-pixel units PX, it is helpful to further balance the light emission intensity of the sub-pixel unit PX covered by the encapsulation portion 20 and the remaining sub-pixel units PX. Optionally, the depth of the slotted area 50 corresponding to the sub-pixel unit PX covered by the encapsulation portion 20 is a first depth H1, and the depth of the slotted area 50 corresponding to the remaining sub-pixel units PX is a second depth H2. The values ​​of the first depth H1 and the second depth H2 are related to the light transmittance TR of the encapsulation portion 20. Optionally, the first depth H1 is equal to the product of the second depth H2 and the light transmittance TR of the encapsulation portion 20, that is, H1 = H2 * TR.

[0064] After creating a slotted area 50 on the side of the encapsulation layer 40 away from the substrate 10, the stage 60 is removed to obtain the following result: Figure 12 Based on the display panel shown, subsequent processes are carried out to complete the fabrication of the display panel.

[0065] The technical solution of this invention, by setting the encapsulation part 20 to cover at least one sub-pixel unit PX located on at least one side of the splicing seam 30, and covering the splicing seam area corresponding to at least one sub-pixel unit PX, enables the light emitted by the sub-pixel unit PX covered by the encapsulation part 20 to be refracted through the encapsulation part 20, thereby changing the light emission direction of that part of the sub-pixel unit PX, so that the outer surface of the encapsulation part 20 forms a uniform light emission surface, thereby increasing the light emission of the area corresponding to the splicing seam 30, thereby compensating for the light intensity of the area corresponding to the splicing seam 30, helping to reduce the visual presence of the splicing seam, and balancing the overall display effect of the display panel.

[0066] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, include: At least two sub-display panels, two adjacent sub-display panels are spliced ​​together, and there is a splicing seam between two adjacent sub-display panels. Each sub-display panel includes a substrate and a plurality of sub-pixel units located on one side of the substrate. The encapsulation portion is located on the side of the substrate close to the sub-pixel unit, and the encapsulation portion covers at least one sub-pixel unit located on at least one side of the splicing seam, and covers the splicing seam area corresponding to the at least one sub-pixel unit; The display panel further includes an encapsulation layer, which has multiple slotted areas on the side away from the substrate, and the slotted areas are arranged one-to-one with the sub-pixel units; The depth of the slotted area corresponding to the sub-pixel unit covered by the encapsulation part is the first depth, and the depth of the slotted area corresponding to the remaining sub-pixel units is the second depth. The value of the first depth and the value of the second depth are related to the light transmittance of the encapsulation part. The first depth is equal to the product of the second depth and the light transmittance of the encapsulation portion.

2. The display panel according to claim 1, characterized in that, The encapsulation portion covers the seam between two adjacent sub-display panels and covers the two columns of sub-pixel units located on both sides of the seam.

3. The display panel according to claim 1, characterized in that, The encapsulation portion includes a plurality of sub-encapsulation portions, each sub-encapsulation portion covering at least two sub-pixel units located on both sides of the splicing seam and correspondingly arranged in a direction perpendicular to the extension direction of the splicing seam, and covering the splicing seam area between the at least two sub-pixel units; the plurality of sub-encapsulation portions are arranged sequentially along the extension direction of the splicing seam, with adjacent sub-encapsulation portions abutting against each other, or with a gap between adjacent sub-encapsulation portions.

4. The display panel according to claim 1, characterized in that, The plurality of sub-pixel units include red sub-pixel units, green sub-pixel units and blue sub-pixel units, with one column of the sub-pixel units located on both sides of the splicing seam being the red sub-pixel units and the other column being the blue sub-pixel units.

5. The display panel according to claim 1, characterized in that, The encapsulation part is formed of a light-transmitting material, and the outer surface of the encapsulation part is arc-shaped or polygonal.

6. The display panel according to claim 1, characterized in that, The encapsulation layer is located on the side of the substrate near the sub-pixel unit, and the encapsulation layer covers the encapsulation portion and the sub-pixel units of each of the sub-display panels.

7. The display panel according to claim 6, characterized in that, The vertical projection of the sub-pixel unit on the substrate is located within the vertical projection of the slotted area on the substrate, or the vertical projection of the sub-pixel unit on the substrate coincides with the vertical projection of the slotted area on the substrate.

8. A method for manufacturing a display panel, applicable to the display panel according to any one of claims 1-7, characterized in that, include: At least two sub-display panels are provided, and the at least two sub-display panels are spliced ​​together, with a splicing seam between two adjacent sub-display panels. The sub-display panel includes a substrate and a plurality of sub-pixel units located on one side of the substrate. An encapsulation portion is formed on the side of the substrate near the sub-pixel unit, such that the encapsulation portion covers at least one of the sub-pixel units located on at least one side of the splicing seam, and covers the splicing seam area corresponding to the at least one sub-pixel unit.

9. The method for manufacturing a display panel according to claim 8, characterized in that, Also includes: An encapsulation layer is formed that covers the encapsulation portion and the sub-pixel units of each of the sub-display panels. A plurality of slotted areas are provided on the side of the encapsulation layer away from the substrate, and the slotted areas are provided one-to-one with the sub-pixel units. Wherein, the vertical projection of the sub-pixel unit on the substrate is located within the vertical projection of the slotted area on the substrate, or the vertical projection of the sub-pixel unit on the substrate coincides with the vertical projection of the slotted area on the substrate.

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