Airflow guide with integrated power conduction

Abstract

An information handling system can include a heat-generating information handling resource, an air mover, a power supply unit, and an airflow guide. The airflow guide can include one or more features configured to form, alone or in combination with a portion of a chassis of the information handling system, an air chamber fluidically coupled between the air mover and the heat-generating information handling resource, and an electrical conduit integrated within the airflow guide configured to deliver electrical current from the power supply unit to the heat-generating information handling resource.

Description

Technical Field

[0001] The present invention relates generally to information processing systems, and more specifically, to airflow guides for use in information processing systems having integrated electrical conduits for power conduction. Background Technology

[0002] As the value and use of information continue to increase, individuals and businesses are seeking alternative ways to process and store information. One option available to users is an information processing system. Information processing systems typically process, compile, store, and / or communicate information or data for business, personal, or other purposes, allowing users to leverage the value of this information. Because technologies and information processing needs and requirements vary between different users or applications, information processing systems may also vary in terms of what information is processed, how it is processed, how much information is processed, stored, or communicated, and how quickly and efficiently it can be processed, stored, or communicated. Variations in information processing systems allow them to be general-purpose or configured for specific users or purposes (such as financial transaction processing, flight booking, corporate data storage, or global communications). Furthermore, information processing systems may include a variety of hardware and software components that can be configured to process, store, and communicate information, and may include one or more computer systems, data storage systems, and networking systems.

[0003] As the clock speeds and power consumption of processors, graphics cards, random access memory (RAM), and other components in information processing systems increase, the heat generated by these components as a side effect of normal operation also increases. Typically, the temperature of these components needs to be kept within a reasonable range to prevent overheating, instability, malfunction, and damage that could shorten their lifespan. Therefore, airflow enhancers (e.g., cooling fans and blowers) are frequently used in information processing systems to cool the system and its components.

[0004] As information processing system servers become increasingly dense, optimizing server chassis space and effectively cooling the chassis becomes increasingly challenging. High-density designs require high power consumption and higher signal speeds, all of which lead to increased heat generation and pose challenges for wiring the electrical conduits used to deliver power and signals. Existing methods for delivering power include the use of power cables and / or busbars, all of which consume significant space within the chassis and can adversely affect airflow resistance to airflow driven by air boosters, reducing the effectiveness of thermal management systems. Another approach may involve using multiple power layers or wider power planes within the motherboard, which can lead to design complexity and limit signal routing within the motherboard. Summary of the Invention

[0005] Based on the teachings of this disclosure, the disadvantages and problems associated with conventional methods of wiring electrical conduits within information processing enclosures can be significantly reduced or eliminated.

[0006] According to embodiments of this disclosure, an information processing system may include a heat-generating information processing resource, an air booster, a power supply unit, and an airflow guide. The airflow guide may include: one or more features configured to form an air chamber, either alone or in combination with a portion of the chassis of the information processing system, the air chamber being fluidly connected between the air booster and the heat-generating information processing resource; and an electrical conduit integrated within the airflow guide, the electrical conduit being configured to deliver current from the power supply unit to the heat-generating information processing resource.

[0007] According to these and other embodiments of the present disclosure, an airflow guide may include: one or more features configured to form an air chamber, either alone or in combination with a portion of the chassis of an information processing system, the air chamber being fluidly coupled between an air booster and a heated information processing resource; and an electrical conduit integrated within the airflow guide, the electrical conduit being configured to deliver current from a power supply unit of the information processing system to the heated information processing resource.

[0008] According to these and other embodiments of the present disclosure, a method may include fluidly connecting an air chamber, at least partially formed by mechanical features of an airflow guide, between an airflow booster of an information processing system and a heated information processing resource; and electrically connecting an electrical conduit integrated within the airflow guide between a power supply unit of the information processing system and the heated information processing resource, such that the electrical conduit delivers current from the power supply unit to the heated information processing resource.

[0009] The technical advantages of this disclosure will be apparent to those skilled in the art from the accompanying drawings, description, and claims included herein. The objectives and advantages of the embodiments will be realized and achieved, at least by the elements, features, and combinations particularly pointed out in the claims.

[0010] It should be understood that the foregoing general description and the following detailed description are illustrative and not limiting of the claims set forth in this disclosure. Attached Figure Description

[0011] A more complete understanding of this embodiment and its advantages can be obtained by referring to the following description in conjunction with the accompanying drawings, in which the same reference numerals denote the same features, and wherein: Figure 1 A block diagram of an exemplary information processing system according to an embodiment of the present disclosure is shown; Figure 2 A top plan view of selected components of an exemplary information processing system according to an embodiment of the present disclosure is shown, in which a portion of the chassis has been removed; and Figure 3 A side cross-sectional front view of a selected component of an exemplary airflow guide according to an embodiment of the present disclosure is shown. Detailed Implementation

[0012] By reference Figures 1 to 3 To best understand the preferred embodiments and their advantages, the same reference numerals are used to indicate the same and corresponding parts.

[0013] For the purposes of this disclosure, an information processing system may include any tool or set of tools operable to calculate, classify, process, transmit, receive, retrieve, create, switch, store, display, indicate, detect, record, reproduce, dispose of, or utilize information, intelligence, or data of any form for commercial, scientific, control, entertainment, or other purposes. For example, an information processing system may be a personal computer, a personal digital assistant (PDA), a consumer electronic device, a network storage device, or any other suitable device, and may vary in size, shape, performance, functionality, and price. An information processing system may include memory, one or more processing resources (such as a central processing unit (“CPU”)) or hardware or software control logic. Additional components of the information processing system may include one or more storage devices, one or more communication ports for communicating with external devices, and various input / output (“I / O”) devices (such as a keyboard, mouse, and video display). The information processing system may also include one or more buses operable to transmit communication between various hardware components.

[0014] For the purposes of this disclosure, computer-readable media may include any tool or set of tools that can retain data and / or instructions for a period of time. Computer-readable media may include, but is not limited to: storage media, such as direct access storage devices (e.g., hard disk drives or floppy disks), sequential access storage devices (e.g., magnetic tape drives), compact optical discs, CD-ROMs, DVDs, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and / or flash memory; and communication media, such as wires, optical fibers, microwaves, radio waves, and other electromagnetic and / or optical carrier waves; and / or any combination of the foregoing.

[0015] For the purposes of this disclosure, "information processing resources" can be broadly used to refer to any component system, apparatus, or device of an information processing system, including but not limited to: processors, service processors, basic input / output systems (BIOS), buses, memory, I / O devices and / or interfaces, storage resources, network interfaces, motherboards, and / or any other components and / or elements of the information processing system.

[0016] Figure 1 A block diagram of an exemplary information processing system 102 according to an embodiment of the present disclosure is shown. In some embodiments, the information processing system 102 may include a server. In other embodiments, the information processing system 102 may be a personal computer (e.g., a desktop computer, laptop computer, notebook computer, tablet computer, handheld device, smartphone, personal digital assistant, etc.). Figure 1 The information processing system 102 described may include a chassis 100 that houses multiple information processing resources, including but not limited to a processor 103, a memory 104 communicatively connected to the processor 103, a power supply unit (PSU) 106, an air booster 108, a heat dissipation medium 112 thermally connected to the processor 103, information processing resources 116 communicatively connected to the processor 103, and an airflow guide 114 fluidly connected between the air booster 108 and heat-generating components (e.g., the processor 103 and the memory 104) of the chassis 100 and electrically connected to the PSU 106, the processor 103, and the memory 104.

[0017] The enclosure 100 may include an outer shell serving as a container for various information processing systems and / or information processing resources, and may be constructed of steel, aluminum, plastic, and / or any other suitable material. Although the term "enclosure" is used, the enclosure 100 may also be referred to as a chassis, cabinet, tower, box, shell, and / or housing. In some embodiments, the enclosure 100 may be configured to house multiple information processing systems and / or information processing resources and / or provide them with power.

[0018] Processor 103 may include any system, apparatus, or device configured to interpret and / or execute program instructions and / or process data, and may include, but is not limited to, microprocessors, microcontrollers, digital signal processors (DSPs), application-specific integrated circuits (ASICs), or any other digital or analog circuit configured to interpret and / or execute program instructions and / or process data. In some embodiments, processor 103 may interpret and / or execute program instructions and / or process data stored in memory 104 and / or another component of information processing system 102.

[0019] Memory 104 may be communicatively coupled to processor 103 and may include any system, apparatus, or device (e.g., computer-readable medium) configured to retain program instructions and / or data for a period of time. Memory 104 may include any suitable selection and / or array of RAM, EEPROM, PCMCIA card, flash memory, magnetic storage device, opto-magnetic storage device, or volatile or non-volatile memory that retains data after power to information processing system 102 is cut off.

[0020] Generally, PSU 106 may include any system, apparatus or device configured to supply current to one or more information processing resources of information processing system 102 to provide the electrical energy required for the operation of such information processing resources.

[0021] Air booster 108 may include any mechanical or electromechanical system, device, or apparatus operable to move air and / or other gases. In some embodiments, air booster 108 may include a fan (e.g., a rotating arrangement of blades or blades acting on air). In other embodiments, air booster 108 may include a blower (e.g., a centrifugal fan employing a rotating impeller to accelerate air received at its inlet and change the direction of airflow). In these and other embodiments, the rotation and other moving parts of air booster 108 may be driven by a motor. The rotational speed of such a motor may be controlled by suitable control signals conveyed from processor 103 or a controller of air booster 108 communicating with processor 103. In operation, air booster 108 may cool the information processing resources of information processing system 102 by drawing cold air into housing 100, exhausting warm air from inside the housing to the outside of such housing, and / or moving air through a heat dissipation medium 112 inside housing 100 to cool one or more information processing resources (e.g., processor 103).

[0022] The heat dissipation medium 112 may include any system, apparatus, or device configured to transfer heat from the information processing resource, thereby reducing the temperature of the information processing resource. For example, the heat dissipation medium 112 may include a fluid that travels near the information processing resource (e.g., air carried by a fan or blower, liquid carried by a pump via a liquid conduit, etc.) or a solid that is thermally connected to the information processing resource (e.g., heat pipes, heat sinks, radiators, heat sink fin assemblies, etc.).

[0023] Generally, information processing resources 116 may include any component system, apparatus or device of information processing system 102, including but not limited to processor, graphics processing unit, bus, computer-readable medium, input-output device and / or interface, storage resources, network interface, motherboard, electromechanical device (e.g., fan), display and / or power supply.

[0024] The airflow guide 114 may include any suitable mechanical structure fluidly coupled between the air booster 108 and the heat-generating components of the chassis 100 (e.g., processor 103, memory 104, and / or information processing resource 116), and is configured to guide airflow driven by the air booster 108 to the vicinity of such heat-generating components and / or heat dissipation media (e.g., heat dissipation medium 112) thermally coupled to such heat-generating components, so as to enable heat transfer from such heat-generating components and / or heat dissipation media to the airflow. Furthermore, as described in more detail below, the airflow guide 114 may have an integrated electrical conduit and may be electrically connected between the PSU 106 and one or more information processing resources (e.g., processor 103, memory 104, and / or information processing resource 116) to conduct electrical energy to such one or more information processing resources.

[0025] In addition to processor 103, memory 104, PSU 106, air booster 108, heat dissipation medium 112, information processing resources 116, and airflow guide 114, information processing system 102 may also include one or more other information processing resources.

[0026] Figure 2 A top plan view of selected components of an exemplary information processing system 102, with a portion of the chassis 100 removed according to an embodiment of this disclosure, is shown. Figure 2 As shown, the airflow guide 114 can be placed within the chassis 100, located between the PSU 106 and the air booster 108, and between the processor 103, memory 104, and other components of the information processing system 102. Similarly, as... Figure 2As shown, the airflow guide 114 may have a first side 202 near the PSU 106 and air booster 108, and a second side 204 near the processor 103 and memory 104. The first side 202 may have one or more suitable connectors (not explicitly shown) electrically connected thereto for connecting electrical conduits integrated within the airflow guide 114 to a backplane, power delivery board, or other circuit board to which the PSU 106 is mounted or otherwise electrically connected. Similarly, the second side 204 may have one or more suitable connectors (not explicitly shown) electrically connected thereto for connecting electrical conduits integrated within the airflow guide 114 to a motherboard or other circuit board to which the processor 103, memory 104, and / or other information processing resources are mounted or otherwise electrically connected. Such connectors may include any suitable connectors now known in the art, including but not limited to copper busbars or cable connectors (e.g., RADSOK cable connectors). Furthermore, the airflow guide 114 may have one or more walls 206 arranged parallel to the desired airflow direction, such that the walls 206 individually or in cooperation with a portion of the chassis 100 define one or more air chambers, which are arranged to guide air driven by the air booster 108 from the air booster 108 through such one or more air chambers and to the vicinity of the processor 103, memory 104 and / or information processing resources 116.

[0027] Figure 3 A side cross-sectional front view of a selected component of an exemplary airflow guide 114 according to an embodiment of the present disclosure is shown. Figure 3 As shown, the airflow guide 114 may have an insulating core 302 formed of plastic or other electrically insulating material. A first conductive layer 304 of conductive material (e.g., copper) may be formed on top of the insulating core 302, and a second conductive layer 306 of conductive material (e.g., copper) may be formed on bottom of the insulating core 302. A first electrically insulating layer 308 of insulating material (e.g., plastic) may be formed above the first conductive layer 304, and a second electrically insulating layer 310 of insulating material (e.g., plastic) may be formed below the second conductive layer 306. Thus, in operation, the airflow driven by the air booster 108 can flow through and be guided by the airflow guide 114, while current from the PSU 106 can be delivered via one of the conductive layers 304 and 306, and current can return to the PSU 106 via the other conductive layer 304 and 306.

[0028] although Figure 3A specific arrangement of the elements of the airflow guide 114 has been depicted, but it should be understood that other arrangements of such elements may be made. For example, in some embodiments, a first conductive layer 304 of conductive material may be formed on top of the insulating core 302, wherein a first electrical insulating layer 308 is formed on top of the first conductive layer 304, a second conductive layer 306 is formed on top of the first electrical insulating layer 308, and a second electrical insulating layer 310 is formed on top of the second conductive layer 306.

[0029] Advantageously, the airflow guide 114 enables airflow to be directed within the chassis 100 while minimizing the presence of electrical conduits (e.g., cables) in the airflow path, and also minimizing the presence of power and grounding conductors in the backplane, motherboard, or other circuit boards located below the airflow guide 114.

[0030] As used herein, when two or more elements are referred to as “connected” to each other, such terminology indicates that such two or more elements are in electronic communication or mechanical connection, whether indirect or direct, with or without intermediate elements, as applicable.

[0031] This disclosure covers all changes, substitutions, variations, alterations, and modifications to the exemplary embodiments herein that would be contemplated by those skilled in the art. Similarly, where appropriate, the appended claims cover all changes, substitutions, variations, alterations, and modifications to the exemplary embodiments herein that would be contemplated by those skilled in the art. Furthermore, references in the appended claims to a device or system or a component of a device or system adapted to, arranged to, capable of, configured to, enabled to, operable to, or operated to perform a particular function cover that device, system, or component, whether or not it is activated, turned on, or unlocked, as long as the device, system, or component is adapted to, arranged to, capable of, configured to, enabled to, operable to, or operated to perform the particular function. Therefore, modifications, additions, or omissions may be made to the systems, devices, and methods described herein without departing from the scope of this disclosure. For example, components of a system and device may be integrated or separate. Furthermore, the operation of the systems and devices disclosed herein may be performed by more, fewer, or other components, and the described methods may include more, fewer, or other steps. Additionally, the steps may be performed in any suitable order. As used in this document, “each” means each member of a set or each member of a subset of a set.

[0032] Although exemplary embodiments are shown in the accompanying drawings and described above, the principles of this disclosure can be implemented using any number of techniques, whether currently known or not. This disclosure should not be limited in any way to the exemplary embodiments and techniques shown in the accompanying drawings and described above.

[0033] Unless otherwise specified, the items depicted in the illustrations are not necessarily drawn to scale.

[0034] All examples and conditional language described herein are intended for pedagogical purposes to aid the reader's understanding of the concepts of this disclosure and those contributed by the inventors to advance the art, and are not to be construed as being limited to such specific examples and conditions. Although embodiments of this disclosure have been described in detail, it should be understood that various changes, substitutions, and modifications may be made thereto without departing from the spirit and scope of this disclosure.

[0035] While specific advantages have been listed above, various embodiments may include some, exclude, or include all of the listed advantages. Furthermore, other technical advantages will become apparent to those skilled in the art after reading the foregoing figures and description.

Claims

1. An information processing system, comprising: Resources for handling fever information; An air booster, the air booster being used to generate airflow in a desired direction; Power supply unit; as well as Airflow guide, the airflow guide comprising: One or more walls, arranged parallel to the desired airflow direction, are configured to form an air chamber, either alone or in combination with a portion of the chassis of the information processing system, the air chamber being fluidly connected between the air booster and the heat-generating information processing resource; A layered structure covering the one or more walls, wherein the layered structure includes a first conductive layer and a second conductive layer and an insulating layer located between the first conductive layer and the second conductive layer, the layered structure being integrated within the airflow guide and configured to deliver current from the power supply unit to the heat information processing resource; Integrated electrical conduit; and One or more connectors are provided for connecting the integrated electrical conduit to a motherboard, and the heat dissipation information processing resource is mounted on the motherboard.

2. The information processing system as described in claim 1, further comprising: A first connector, configured to connect the first conductive layer and the second conductive layer to a first circuit board, wherein the power supply unit is electrically connected to the first circuit board; as well as A second connector is configured to connect the first conductive layer and the second conductive layer to a second circuit board, and the heat information processing resource is electrically connected to the second circuit board.

3. An airflow guide, comprising: One or more walls are arranged parallel to the desired airflow direction and configured to form an air chamber, either alone or in combination with a portion of the chassis of the information processing system. The air chamber is fluidly connected between an air booster and a heated information processing resource, the air booster being used to generate airflow along the desired direction. A layered structure covering the one or more walls, wherein the layered structure includes a first conductive layer and a second conductive layer and an insulating layer located between the first conductive layer and the second conductive layer, the layered structure being integrated within the airflow guide and configured to deliver current from the power supply unit to the heat information processing resource; Integrated electrical conduit; as well as One or more connectors are provided for connecting the integrated electrical conduit to a motherboard, and the heat dissipation information processing resource is mounted on the motherboard.

4. The airflow guide as claimed in claim 3, further comprising: A first connector, configured to connect the first conductive layer and the second conductive layer to a first circuit board, wherein the power supply unit is electrically connected to the first circuit board; as well as A second connector is configured to connect the first conductive layer and the second conductive layer to a second circuit board, and the heat information processing resource is electrically connected to the second circuit board.

Images