Vacuum robotic device for variable pitch approach

Abstract

A robotic device having a variable end effector spacing is provided that is suitable for accommodating varying spacing between, for example, two adjacent processing chambers or two adjacent load lock chambers. The robotic device can operate in a dual substrate handling mode, a single substrate handling mode, or a combination thereof. The robotic device can also be an off-axis robot. Various robotic devices according to various embodiments, electronic device processing systems including these robotic devices, and methods of using the same are described.

Description

Technical Field

[0001] Embodiments of this application relate to a robot including multiple end effectors, and an electronic device processing apparatus and method including a robot having multiple end effectors. Background Technology

[0002] In semiconductor electronic device manufacturing, substrate processing can include combinations of different processes applied within the same substrate processing system. For example, processes can include chemical vapor deposition / atomic layer deposition (CVD / ALD) and physical vapor deposition (PVD) applied within the same tool or platform. These processes can be applied using different configurations of processing chambers coupled to the main frame. A robot is located in a transfer chamber within the main frame and is configured to move the substrate between the various processing chambers. Summary of the Invention

[0003] In some embodiments, a robotic device is provided. The robotic device includes at least one lower arm configured to rotate about a first rotation axis; at least one upper arm rotatably coupled to the at least one lower arm at a second rotation axis spaced apart from the first rotation axis; a first end effector optionally rotatably coupled to the at least one upper arm via a first forearm; and a second end effector optionally rotatably coupled to the at least one upper arm via a second forearm. In embodiments, the robotic device is configured to operate in both a dual-substrate handling mode and a single-substrate handling mode. In the dual-substrate handling mode, the first and second end effectors will independently rotate about one or more additional rotation axes different from the first and second rotation axes to space the first and second end effectors apart by a first gap or a second gap different from the first gap, wherein at least one of the first and second gaps is adapted to allow the first and second end effectors to simultaneously enter and exit a separate loading locking chamber or a separate processing chamber. In single substrate handling mode, the first end effector and the second end effector will rotate independently about one or more additional rotation axes to align the first end effector and the second end effector in a configuration suitable for one of the first end effectors to enter or exit a loading locking chamber or a processing chamber.

[0004] In other embodiments, an electronic device processing system is provided. The electronic device processing system includes a transfer chamber; two adjacent loading and locking chambers coupled to the transfer chamber, wherein the two adjacent loading and locking chambers are horizontally spaced apart by a first spacing; four or more processing chambers coupled to the transfer chamber, wherein at least one pair of adjacent processing chambers of the four or more processing chambers are spaced apart by a second spacing different from the first spacing; and a robotic device at least partially located within the transfer chamber. In one embodiment, the robotic device includes at least one lower arm configured to rotate about a first rotation axis; at least one upper arm rotatably coupled to the at least one lower arm at a second rotation axis spaced apart from the first rotation axis; a first end effector optionally rotatably coupled to the at least one upper arm via a first forearm; and a second end effector optionally rotatably coupled to the at least one upper arm via a second forearm. In one embodiment, the robotic device is configured to operate in both a dual-substrate handling mode and a single-substrate handling mode. In dual-substrate handling mode, the first and second end effectors will independently rotate about one or more additional rotation axes different from the first and second rotation axes, so that the first and second end effectors are separated by a first gap or a second gap different from the first gap, so that the first and second end effectors can simultaneously enter and exit two adjacent loading locking chambers or at least a pair of adjacent processing chambers. In single-substrate handling mode, the first and second end effectors will independently rotate about one or more additional rotation axes to align the first and second end effectors in a configuration suitable for one of the first or second end effectors to enter and exit a loading locking chamber or a processing chamber.

[0005] In other embodiments, a method for transporting substrates is provided. The method includes operating a robotic device in a dual-substrate transport mode and a single-substrate transport mode. In one embodiment, the robotic device includes at least one lower arm configured to rotate about a first rotation axis; at least one upper arm rotatably coupled to the at least one lower arm at a second rotation axis spaced apart from the first rotation axis; a first end effector optionally rotatably coupled to the at least one upper arm via a first forearm; and a second end effector optionally rotatably coupled to the at least one upper arm via a second forearm. In one embodiment, operation in the dual-substrate transport mode includes independently rotating the first and second end effectors about one or more additional rotation axes different from the first and second rotation axes to space the first and second end effectors apart by a first gap or a second gap different from the first gap, wherein at least one of the first or second gaps is adapted to allow the first and second end effectors to simultaneously enter and exit a separate loading locking chamber or a separate processing chamber. In one implementation, operation in single substrate handling mode includes independently rotating the first end effector and the second end effector about one or more additional rotation axes to align the first end effector and the second end effector in a configuration suitable for one of the first end effector or the second end effector to enter or exit a loading locking chamber or a processing chamber.

[0006] In other embodiments, an electronic device processing system is provided. The electronic device processing system includes a central transfer chamber; two adjacent loading and locking chambers coupled to the transfer chamber, wherein the two adjacent loading and locking chambers are horizontally spaced apart by a first spacing; four or more processing chambers coupled to the transfer chamber, wherein at least one pair of adjacent processing chambers of the four or more processing chambers are spaced apart by a second spacing different from the first spacing; and a robotic device at least partially located within the transfer chamber. In one embodiment, the robotic device includes at least one lower arm configured to rotate about a first rotation axis, wherein the first rotation axis is offset from the center of the transfer chamber; at least one upper arm rotatably coupled to at least one lower arm at a second rotation axis spaced apart from the first rotation axis; a first end effector optionally rotatably coupled to at least one upper arm via a first forearm; and a second end effector optionally rotatably coupled to at least one upper arm via a second forearm. In one embodiment, the robotic device is configured to operate in a dual-substrate handling mode. In the dual-substrate handling mode, the first end effector and the second end effector will independently rotate around one or more additional rotation axes different from the first rotation axis and the second rotation axis, so that the first end effector and the second end effector are separated by a first gap or a second gap different from the first gap, so that the first end effector and the second end effector can simultaneously enter and exit two adjacent loading locking chambers or at least a pair of adjacent processing chambers.

[0007] Numerous other aspects and features are provided according to these and other embodiments of this disclosure. Other features and aspects of the embodiments of this disclosure will become more apparent from the following description, the claims, and the accompanying drawings. Attached Figure Description

[0008] The accompanying drawings described below are for illustrative purposes only and are not necessarily drawn to scale. These drawings are not intended to limit the scope of this disclosure in any way. Wherever possible, the same or similar reference numerals will be used throughout the drawings to represent the same or similar parts.

[0009] Figure 1 A schematic top view of a substrate processing system including a robotic device located in a transfer chamber of a main frame, according to a disclosed embodiment.

[0010] Figure 2A A perspective view of a robotic device according to the disclosed embodiments is shown.

[0011] Figure 2B A top view of a robot device according to the disclosed embodiment is shown.

[0012] Figures 3A to 3D The illustration is used for explanation Figures 2A to 2B A schematic diagram of the dual-board handling mode of the robotic device.

[0013] Figures 4A to 4D The illustration is used for explanation Figures 2A to 2B A schematic diagram of the single-board handling mode of the robotic device.

[0014] Figure 5A A perspective view of a robotic device according to the disclosed embodiments is shown.

[0015] Figure 5B A top view of a robot device according to the disclosed embodiment is shown.

[0016] Figures 6A to 6D The illustration is used for explanation Figures 5A to 5B A schematic diagram of the dual-board handling mode of the robotic device.

[0017] Figures 7A to 7D The illustration is used for explanation Figures 5A to 5B A schematic diagram of the single-board handling mode of the robotic device.

[0018] Figure 8A A perspective view of a robotic device according to the disclosed embodiments is shown.

[0019] Figure 8B Draw Figure 8AThe robotic device is in a top view in a folded configuration (e.g., chamber pre-position or loading lock pre-position).

[0020] Figure 8C Draw Figure 8A The robot device is in a top view of an unfolded configuration (e.g., a dual-chamber extension or dual-loading locking extension in a dual-platen handling mode).

[0021] Figure 9 The illustration depicts a transfer chamber located within the main frame, according to the disclosed embodiment. Figures 8A to 8C A schematic top view of the substrate processing system of the robotic device. Detailed Implementation

[0022] Reference will now be made to the provided exemplary embodiments, which are illustrated in the accompanying drawings. Unless otherwise specifically stated, features of the various embodiments described herein may be combined with each other.

[0023] Electronic device processing systems can perform combinations of multiple substrate manufacturing processes. These substrate manufacturing processes may include chemical vapor deposition / atomic layer deposition (CVD / ALD), annealing, etching, physical vapor deposition (PVD), and / or other processes. Electronic device processing systems may include various processing chambers and load-locking chambers to perform combinations of multiple substrate manufacturing processes. Each of these processing chambers and load-locking chambers may include one or more processing locations where the substrate is positioned for processing. Depending on the physical arrangement or processing chambers, the type of manufacturing process to be performed in each processing chamber, and / or the configuration of the processing chambers, the processing locations in different processing chambers and / or load-locking chambers may be separated by different distances (e.g., spacing).

[0024] In one embodiment, the transfer chamber includes multiple loading locks and / or multiple processing chambers connected to the sides or facets of the transfer chamber. The transfer chamber may include a robotic arm with end effectors for transferring substrates between the loading locks and / or transfer chambers. The robot may be designed such that the spacing or interval between the end effectors is adjustable, and may be further designed such that the end effectors can be positioned for single substrate handling (where a single substrate is removed from a processing chamber or loading lock and / or inserted into a processing chamber or loading lock) and may be further positioned for multi-substrate handling (where two substrates are removed from a processing chamber or loading lock and / or inserted into a processing chamber or loading lock).

[0025] Existing robotic devices (e.g., robotic devices with inline end effectors) enter and exit one processing chamber and / or one loading and locking chamber at a time and exhibit throughput ranging from about 60 wafers per hour (WPH) to about 80 WPH. Therefore, according to the embodiments described herein, a robotic device with enhanced throughput is provided. In some embodiments, the robotic device described herein exhibits a throughput of at least about 100 WPH, and in some embodiments even greater than 175 WPH.

[0026] A robotic device with end effectors can be implemented to simultaneously position a substrate on and remove a substrate from multiple processing chambers (e.g., side-by-side processing chambers). However, end effectors positioned at a first fixed spacing may be unable to enter or exit these processing chambers or loading / locking chambers due to one or more processing chambers or one or more loading / locking chambers being separated by a second fixed spacing different from the first fixed spacing. Therefore, according to the embodiments described herein, a robotic device with a variable end effector spacing is provided.

[0027] The robotic device described herein can operate in single-board processing mode, dual-board processing mode, or a combination thereof. This increased flexibility and independent access capability allows for sequential loading and unloading of various processing chambers or loading-locked chambers. This hybrid capability also allows the robotic device to continue operating even if one of a pair of adjacent processing chambers or loading-locked chambers fails.

[0028] In one or more embodiments described herein, a robotic device configured to operate in a single-board mode, a dual-board mode, or a combination thereof is disclosed. When operating in dual-board mode, the robotic device may have a variable end effector pitch to accommodate, for example, varying spacing between two adjacent processing chambers or between two adjacent loading locking chambers. In some embodiments, the robotic device is an eccentric (also referred to as off-axis) robot positioned off-center from the center of its transport chamber.

[0029] This article references Figures 1 to 9 This describes an example implementation of a robot that includes different spacing between end effectors.

[0030] For reference Figure 1 , Figure 1A schematic top view of a substrate processing system 100 including a robotic device 102 according to a disclosed embodiment is illustrated. The substrate processing system 100 may include a main frame 104, which includes a transfer chamber 106 formed by its walls. The transfer chamber 106 may be configured to operate, for example, in a vacuum. The transfer chamber may have a center 150. The robotic device 102 may be at least partially located in the transfer chamber 106 and may be configured to operate therein. The robotic device 102 may include a body (214 in FIG. 2, 514 in FIG. 5, and...) Figure 8A (814 in the document), the body is configured to be attached to the wall (e.g., the base plate) of the transfer chamber 106. The robotic device 102 may be “off-axis” or “eccentric”, as used herein, which means that the robotic device has at least one lower arm configured to rotate about a first axis of rotation offset from the center 150 of the transfer chamber 106.

[0031] The robotic device 102 can be configured to pick up substrates 118 (sometimes referred to as "wafers" or "semiconductor wafers") from different destinations and / or place these substrates 118 to different destinations. These destinations may be processing chambers coupled to transfer chamber 106. Destinations may also be loading and locking chambers coupled to transfer chamber 106. For example, destinations may be one or more processing chambers 120 and one or more loading and locking chambers 122 coupled to transfer chamber 106. The main frame 104 may include... Figure 1 The diagram shows more or fewer processing chambers 120 and more. Figure 1 The illustration shows more or fewer loading locking devices 122.

[0032] The processing chamber 120 can be configured to perform any number of processing steps on the substrate 118, such as deposition, oxidation, nitriding, etching, polishing, cleaning, photolithography, or the like. Figure 1 The diagram shows seven processing chambers 120 coupled to each side of the transfer chamber 106. However, it should be noted that other configurations including more or fewer processing chambers are also feasible and contemplated by this disclosure. In some embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 4 to 24. In some embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 4 to 20. In some embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 5 to 16. In some embodiments, the number of processing chambers coupled to the transfer chamber 106 ranges from 6 to 10. Figure 9An example of an electronic device processing system with 12 processing chambers is described. In some embodiments, the transfer chamber is a linear transfer chamber with two longer sides and two shorter sides. In other embodiments, the transfer chamber may have four or more sides, such as five sides, six sides, seven sides, eight sides, and so on. The multiple sides may have the same dimensions (e.g., the same length) and / or different dimensions.

[0033] The loading locking chamber 122 can be configured to dock with the factory interface 126. The factory interface 126 may include a loading / unloading robot 127 (shown as a dashed box) configured to transport substrates 118 to and from substrate carriers 128 (e.g., front-opening unified pods (FOUPs)) docked at loading ports 130 of the factory interface 126. Another loading / unloading robot may transfer substrates 118 between substrate carriers 128 and the loading locking chamber 122 in any order or sequence.

[0034] In some embodiments, two adjacent loading locking chambers 122 are horizontally spaced apart by a first distance D1. In some embodiments, the first distance D1 between the centers of the two adjacent loading locking chambers 122 may range from about 20 inches to about 25 inches. In some embodiments, the first distance D1 between the centers of the two adjacent loading locking chambers 122 may range from about 21 inches to about 23 inches. In some embodiments, the first distance D1 between the centers of the two adjacent loading locking chambers 122 may be about 22 inches. Other distances for the first distance D1 are also possible.

[0035] In some embodiments, at least one pair of adjacent processing chambers 120 are horizontally separated by a second spacing D2 that is different from the first spacing D1 (e.g., the second spacing D2 may be larger than the first spacing D1). In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may range from about 32 inches to about 40 inches. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may range from about 34 inches to about 38 inches. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may be about 36 inches. Other distances for the second spacing D2 may also be possible.

[0036] The robotic device 102 can enter or exit one or more of the loading and locking chambers 122 via the slit valve 134. The robotic device 102 can enter or exit one or more of the processing chambers 120 via the slit valve 140.

[0037] A robotic device according to embodiments described herein includes at least one lower arm configured to rotate about a first rotation axis; at least one upper arm coupled to the at least one lower arm at a second rotation axis spaced apart from the first rotation axis; a first end effector optionally rotatably coupled to the at least one upper arm via a first forearm; and a second end effector optionally rotatably coupled to the at least one upper arm via a second forearm. In some embodiments, the first and second end effectors of the robotic device 102 are coplanar.

[0038] Slit valves 134 and 140 may have slit valve widths that allow robot device 102 (and specifically, first and second end effectors) to enter and exit slit valves 134 and 140 in both dual-plate handling mode and single-plate handling mode. In some embodiments, the first and / or second end effectors (relative to the horizontal opening of slit valve 134 or slit valve 140) enter and exit (a plurality of) slit valves 134 and / or (a plurality of) slit valves 140 orthogonally. In alternative embodiments, the first and / or second end effectors (relative to the horizontal centerline of slit valve 134 or slit valve 140) enter and exit (a plurality of) slit valves 134 and / or (a plurality of) slit valves 140 at an angle. When measured relative to the horizontal centerline of slit valve 134 or slit valve 140, the first and / or second end effectors may enter or exit one or more of slit valve 134 and / or 140 at an angle ranging from about 0° to about 20°, from about 5° to about 17°, or from about 7° to about 14°.

[0039] As used herein, "dual substrate handling mode" means that the robot device 102 simultaneously enters and exits two adjacent loading locking chambers (e.g., loading locking chamber 122) or at least a pair of adjacent processing chambers (e.g., processing chamber 120). When the robot device 102 is in dual substrate handling mode, the first end effector and the second end effector will rotate independently or jointly about one or more additional axes that are different from the first axis of rotation and different from the second axis of rotation, so that the first end effector is separated from the second end effector by a first gap D1 or a second gap D2.

[0040] As used herein, "single substrate handling mode" refers to the robotic device entering or exiting a loading locking chamber (e.g., loading locking chamber 122) or a processing chamber (e.g., processing chamber 120). When the robotic device 102 is in single substrate handling mode, the first and second end effectors will independently rotate about one or more additional axes different from the first and second rotation axes to align the first and second end effectors in a configuration suitable for one of the first or second end effectors to enter or exit a loading locking chamber or a processing chamber. The second end effector, which is not being used to pick up or place substrates, may be rotated elsewhere so as not to interfere with the first end effector picking up or placing substrates.

[0041] As used herein, when one or more of the reference end effectors enter or exit one or more loading lock chambers and / or processing chambers, the term "enter or exit" means that the end effector enters or exits the chambers to pick up (a number of) substrates, place (a number of) substrates, exchange (a number of) substrates, and / or any other operation that will be understood by those skilled in the art to be performed by the end effector entering or exiting the (a number of) loading lock chambers and / or (a number of) processing chambers.

[0042] This article envisions various implementations of the robotic device 102, such as regarding Figures 2A to 2B , Figures 5A to 5B and Figures 8A to 8C The diagram is shown in more detail. The operating modes for the dual-substrate handling mode and the single-substrate handling mode can vary depending on different implementations of the robot device 102, such as regarding... Figures 3A to 3D , Figures 4A to 4D , Figures 6A to 6D and Figures 7A to 7D It is illustrated in more detail.

[0043] The controller 142 can communicate with the robot device 102. The robot device 102 can be controlled by appropriate commands from the controller 142. The controller 142 can also control the slit valves 134 and 140 and other components, as well as the processing that occurs within the main frame 104, the loading locking chamber 122, and the processing chamber 120.

[0044] For further reference Figure 2A and Figure 2B , Figure 2A A perspective view illustrating an embodiment of the robot device 102 according to the disclosed embodiments is shown. Figure 2B A top view of the robot device 102 according to the disclosed embodiment is shown. Figures 2A to 2BThe illustrated embodiment depicts a robotic device 102A. Robotic device 102A may include a lower arm 210 configured to rotate about a first rotation axis 215. For example, one or more motors (not shown) located in a base 214 may rotate the lower arm 210 about the first rotation axis 215. Robotic device 102A may further include an upper arm 220 rotatably coupled to the lower arm 210 at a second rotation axis 225 spaced apart from the first rotation axis 215. The upper arm 220 may be configured to rotate about the second rotation axis 225. For example, one or more motors (not shown) located in the base 214 may rotate the upper arm 220 about the second rotation axis 225. In some embodiments, portions of the lower arm 210 and the upper arm 220 may operate on different planes, one plane above the other.

[0045] The robot device 102A may further include a first end effector 230A, which is rotatably coupled to the upper arm 220 at a third rotation axis 235 spaced apart from the second rotation axis 225. The first end effector may include a first bend 232A in a horizontal plane along a first direction. The robot device 102A may also include a second end effector 230B, which is rotatably coupled to the upper arm 220 at the third rotation axis 235. The second end effector may include a second bend 232B in a horizontal plane along a second direction, wherein the second direction is opposite to the first direction. The first end effector 230A and the second end effector 230B may be configured to rotate independently about the third rotation axis 235 for both a dual-substrate handling mode and a single-substrate handling mode. For example, one or more motors (not shown) located in the base 214 can independently rotate the first end effector 230A and the second end effector 230B about the third rotation axis 235 for both dual-board transport mode and single-board transport mode.

[0046] In some embodiments, this disclosure covers a method for transferring substrates by operating a robotic device in both a dual-substrate handling mode and a single-substrate handling mode. References Figures 3A to 3D The operation of the robot device 102A in the dual-board handling mode is further described.

[0047] exist Figure 3A In China, such as regarding Figures 2A to 2B The robotic device 102A is shown positioned to be adapted for entering (or exiting) two horizontally adjacent loading locking chambers (such as those from...). Figure 1The loading locking chamber 122) is deployed in an extended configuration. This configuration will be referred to herein as a “double loading locking reach”. The first end effector 230A and the second end effector 230B can be independently rotated about a third rotation axis 235 to reach a double loading locking reach in which the two end effectors are separated by a first gap. Figure 3A As can be seen, in the dual-load locking extension, the first end effector 230A and the second end effector 230B are separated by a first gap D1. In some embodiments, the first gap D1 is measured between the first end point 232A of the first end effector 230A and the second end point 232B of the second end effector 230B, such as... Figure 3A As shown in the configuration, the first spacing D1 corresponds to the distance between the centers of two horizontally adjacent loading locks 122. In some embodiments, the first spacing D1 between the centers of two adjacent loading lock chambers 122 may be in the range of about 20 inches to about 25 inches. In some embodiments, the first spacing D1 between the centers of two adjacent loading lock chambers 122 may be in the range of about 21 inches to about 23 inches. In some embodiments, the first spacing D1 between the centers of two adjacent loading lock chambers 122 may be about 22 inches. Other distances for the first spacing D1 may also be possible.

[0048] In some embodiments, the first end effector 230A and the second end effector 230B simultaneously enter and exit the two slit valves 134 of the loading locking chamber 122 at a certain angle (relative to the horizontal centerline of the slit valve 134 or slit valve 140), such as... Figure 3A As shown in the figure. In some embodiments (not shown), the first end effector 230A and the second end effector 230B simultaneously and orthogonally enter and exit the two slit valves 134 (relative to the horizontal opening of the slit valve 134 or slit valve 140).

[0049] In the dual loading and locking extension, the robot device 102A can enter and exit the two loading and locking chambers 122 to retrieve the two substrates 118 to transfer these substrates to the two processing chambers 120, or place the substrates to be processed on them to transfer them out of the main frame 104.

[0050] To further describe the dual-substrate handling mode, it will be assumed that robot device 102A retrieves two substrates 118 from loading and locking chamber 122 to transfer them to two horizontally adjacent processing chambers 120. After retrieving the two substrates, robot device 102A swivels within transfer chamber 106 to achieve a "chamber pre-positioning" alignment. Figure 3BThe first end effector 230A and the second end effector 230B are rotatable about a third rotation axis 235 to positions suitable for entering and exiting two horizontally adjacent processing chambers 120. Rotation may involve one or more of the following: rotating the lower arm 210 about a first rotation axis 215; rotating the upper arm 220 about a second rotation axis 225; and / or rotating one or more of the first end effector 230A or the second end effector 230B independently about the third rotation axis 235.

[0051] After achieving the "chamber pre-positioning" alignment, the first end effector 230A and the second end effector 230B can be further separated by a second gap D2. The first end effector 230A and the second end effector 230B can independently rotate about a third rotation axis 235 to achieve a dual-processing chamber extension where the two end effectors are separated by the second gap. In some embodiments, the second gap D2 is measured between the first end point 232A of the first end effector 230A and the second end point 232B of the second end effector 230B, such as... Figure 3C As shown in the configuration, the second spacing D2 corresponds to the distance between the centers of two horizontally adjacent processing chambers 120. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may range from about 32 inches to about 40 inches. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may range from about 34 inches to about 38 inches. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may be about 36 inches. Other distances for the second spacing D2 may also be possible.

[0052] In some embodiments (not shown), the first end effector 230A and the second end effector 230B simultaneously enter and exit the two slit valves 140 of two horizontally adjacent processing chambers 120 at a certain angle (relative to the horizontal centerline of the slit valve 140). In some embodiments, the first end effector 230A and the second end effector 230B simultaneously enter and exit the two slit valves 140 of two horizontally adjacent processing chambers 120 orthogonally (relative to the horizontal opening of the slit valve 140), such as... Figure 3C As shown in the image.

[0053] exist Figure 3C In the diagram, the robotic device 102A is shown positioned to be adapted to enter (or exit) two horizontally adjacent processing chambers (such as those from...). Figure 1 The processing chamber 120) is deployed in an extended configuration. This configuration will be referred to herein as "dual processing chamber extension". Figure 3CAs can be seen, in the dual-processing chamber extension, the first end effector 230A and the second end effector 230B are separated by a second distance D2. In the dual-processing chamber extension, the robot device 102A can enter and exit the two adjacent processing chambers 120 to place two substrates 118 for processing (or retrieve the processed substrates to transfer them for further processing or transfer them to the loading locking chamber 122).

[0054] After processing, robot 102A can retrieve the processed substrate from a pair of horizontally adjacent processing chambers 120 in a "dual processing chamber extension" configuration, rotate within transfer chamber 106, and reach a "loading lock pre-position" alignment, such as... Figure 3D As shown. Rotation may involve one or more of the following: rotating the lower arm 210 about a first rotation axis 215; rotating the upper arm 220 about a second rotation axis 225; and / or independently rotating one or more of the first end effector 230A or the second end effector 230B about a third rotation axis 235. Upon arrival Figure 3D After the “loading lock pre-positioning” shown is aligned, the robot device 102A can cyclically repeat operations 3A to 3D to sequentially load and / or unload the processing chamber 120 and the loading lock chamber 122 in the electronic device processing system 100.

[0055] refer to Figures 4A to 4D The operation of the robot device 102A in single substrate handling mode is further described.

[0056] exist Figure 4A In China, such as regarding Figure 3A As explained, the robot device 102A is shown in a "dual loading and locking extension". In the dual loading and locking extension, the robot device 102A can enter and exit two loading and locking chambers 122 to retrieve two substrates 118, which can then be simultaneously placed in two horizontally adjacent processing chambers 120, as per [reference to...]. Figures 3B to 3C As shown. Alternatively, the two substrates 118 can be sequentially unloaded into two processing chambers (these two processing chambers may or may not be horizontally adjacent), as per the description. Figures 4B to 4C As shown.

[0057] Although not shown in the figures, the robotic device 102A can also enter and exit one loading lock chamber 122 at a time to retrieve a single substrate 118. This could be useful, for example, for continuing operation of the electronic device processing system when one loading lock chamber is not repaired. For instance, end effector 230A can enter and exit either of the loading lock chambers 122 without entering the other. Similarly, end effector 230B can enter and exit either of the loading lock chambers 122 without entering the other. Doing so could involve independently rotating the first end effector 230A and the second end effector 230B about a third rotation axis 235 to align the first end effector 230A and the second end effector 230B in a configuration suitable for allowing one of the first end effector 230A or the second end effector 230B to enter and exit a loading lock chamber 122. In some embodiments, the slit valve 134 of the loading locking chamber 122 may have a width suitable for allowing the first end effector 230A and / or the second end effector 230B to enter and exit, whether they enter and exit the two loading locking chambers simultaneously or sequentially into one loading locking chamber.

[0058] The angle at which the first end effector and / or the second end effector enters and exits one or more loading locking chambers can also vary depending on whether the two end effectors enter and exit two loading locking chambers simultaneously or sequentially. In some embodiments, the first end effector 230A and the second end effector 230B simultaneously and orthogonally (relative to the horizontal opening of the slit valve 134) enter and exit the two slit valves 134. In some embodiments, the first end effector 230A and the second end effector 230B simultaneously and at an angle (relative to the horizontal centerline of the slit valve 134). In some embodiments, the first end effector 230A and / or the second end effector 230B sequentially and orthogonally (relative to the horizontal opening of the slit valve 134) enter and exit the slit valve 134 of a single loading locking chamber. In some embodiments, the first end effector 230A and / or the second end effector 230B sequentially and (relative to the horizontal centerline of the slit valve 134) enter and exit the slit valve 134 of a single loading locking chamber at an angle.

[0059] exist Figure 4B and Figure 4C In this configuration, the first end effector 230A and the second end effector 230B rotate independently about a third rotation axis 235 to align the first end effector 230A and the second end effector 230B in a configuration suitable for allowing one of the first end effector 230A or the second end effector 230B to enter or exit a processing chamber 120. For example, in Figure 4B In this process, the first end effector 230A unloads the substrate into a processing chamber, and then the second end effector 230B unloads the substrate into another processing chamber (located on the opposite side of the processing chamber that receives the substrate from the first end effector 230A).

[0060] exist Figure 4C In this configuration, the first end effector 230A and the second end effector 230B are independently rotated about a third rotation axis 235 to be aligned in a configuration suitable for allowing one of the first end effector 230A or the second end effector 230B to enter or exit a processing chamber 120.

[0061] In some embodiments, the first end effector 230A and the second end effector 230B may sequentially enter and exit the same processing chamber 120 or two separate processing chambers 120 (these two processing chambers 120 may or may not be horizontally adjacent) through a slit valve 140. In some embodiments (not shown), the first end effector 230A and / or the second end effector 230B (relative to the horizontal centerline of the slit valve 140) enter and exit a given slit valve 140 at an angle. In some embodiments, the first end effector 230A and / or the second end effector 230B (relative to the horizontal opening of the slit valve 140) enter and exit the slit valve 140 of the processing chamber orthogonally, such as... Figure 4B and Figure 4C As shown in the image.

[0062] After processing, robot 102A can be utilized Figures 4B to 4C The "single processing chamber extension" configuration shown sequentially retrieves the processed substrate, rotates it within the transfer chamber 106, and aligns it to the "loading lock pre-position," as... Figure 4D As shown. Rotation may involve one or more of the following: rotating the lower arm 210 about a first rotation axis 215; rotating the upper arm 220 about a second rotation axis 225; and / or independently rotating one or more of the first end effector 230A or the second end effector 230B about a third rotation axis 235. Upon arrival Figure 4D After the “loading lock pre-positioning” shown is aligned, the robot device 102A can cyclically repeat operations 4A to 4D to sequentially load and / or unload the processing chamber 120 and the loading lock chamber 122 in the electronic device processing system 100.

[0063] Robot device 102A can also be used according to Figures 3A to 3D Dual substrate operation mode and according to Figures 4A to 4D A combination of single-board operating modes to load and / or unload the processing chamber 120 and load the locking chamber 122 in the electronic device processing system 100.

[0064] For example, in an electronics processing system having six processing chambers 120 (three chambers on the first side and three chambers on the second side opposite the first side), the robot device 102A can load substrates into the six processing chambers in three separate operations, as follows: 1) simultaneously loading two substrates into a pair of horizontally adjacent processing chambers on the first side (e.g., processing chambers 120A and 120B) in a dual-substrate operation mode; 2) simultaneously loading two substrates into a pair of horizontally adjacent processing chambers on the second side (e.g., processing chambers 120E and 120F) in a dual-substrate operation mode; 3) sequentially loading one substrate into the remaining empty processing chambers on the first side (e.g., processing chamber 120C) in a single-substrate operation mode, followed by loading one substrate into the remaining empty processing chambers on the second side (e.g., processing chamber 120D). A similar sequence can be used to unload the same exemplary electronics processing system. A similar sequence with more or fewer runs can also be implemented for other electronics processing systems with more or fewer processing chambers.

[0065] The sequences illustrated herein should not be construed as limiting. For example, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120A and 120F may be loaded sequentially. In another embodiment, processing chambers 120A and 120B may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120C and 120F may be loaded sequentially. In yet another embodiment, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120E and 120F may be loaded simultaneously, and processing chambers 120A and 120D may be loaded sequentially. The order of loading and unloading the processing chambers should not be construed as limiting.

[0066] In another example, in an electronics processing system having six processing chambers 120 (three chambers on the first side and three chambers on the second side opposite the first side) and an operable loading lock chamber (e.g., 122A), the robot device 102A may operate according to the following sequence: 1) picking up a substrate from the loading lock chamber 122A by the second end effector 230B in a single-substrate operation mode; 2) picking up a second substrate from the loading lock chamber 122A by the first end effector 230A in a single-substrate operation mode; 3) simultaneously loading two substrates into a pair of horizontally adjacent processing chambers in a dual-substrate operation mode, or sequentially loading one substrate into one processing chamber and then loading the second substrate into another processing chamber in a single-substrate operation mode; 4) repeating 1) through 3) until the electronics processing system is fully loaded. A similar sequence can be used to unload the same exemplary electronics processing system. A similar sequence with more or fewer runs can also be implemented for other electronics processing systems with more or fewer processing chambers. A similar sequence can also be used when the operable loading locking chamber is loading locking chamber 122B.

[0067] For further reference Figure 5A and Figure 5B , Figure 5A A perspective view illustrating an embodiment of the robot device 102 according to the disclosed embodiments is shown. Figure 5B A top view of the robot device 102 according to the disclosed embodiment is shown. Figures 5A to 5B The illustrated embodiment depicts a robot device 102B. Robot device 102B may include a lower arm 510 configured to rotate about a first rotation axis 515. For example, one or more motors (not shown) located in a base 514 may rotate the lower arm 510 about the first rotation axis 515. Robot device 102B may further include an upper arm 520 rotatably coupled to the lower arm 510 at a second rotation axis 525 spaced apart from the first rotation axis 515. The upper arm 520 may be configured to rotate about the second rotation axis 525. For example, one or more motors (not shown) located in the base 514 may rotate the upper arm 520 about the second rotation axis 525. In some embodiments, portions of the lower arm 510 and the upper arm 520 may operate on different planes, one plane above the other.

[0068] The robot device 102B may further include a first forearm 530A and a second forearm 530B, each rotatably coupled to the upper arm 520 at a third rotation axis 535 spaced apart from the second rotation axis 525. The first forearm 530A and the second forearm 530B may be configured to rotate independently about the third rotation axis 535 for both a dual-substrate handling mode and a single-substrate handling mode. For example, one or more motors (not shown) located in the base 514 may independently rotate the first forearm 530A and the second forearm 530B about the third rotation axis 535 for both dual-substrate handling modes and single-substrate handling modes.

[0069] The robot device 102B may further include a first end effector 540A rotatably coupled to the first forearm 530A at a fourth rotation axis 545 spaced apart from the third rotation axis 535. The robot device 102B may also include a second end effector 540B rotatably coupled to the second forearm 530B at a fifth rotation axis 555 spaced apart from the third rotation axis 535 and separate from the fourth rotation axis 545.

[0070] The first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B can be configured to rotate independently about a third rotation axis 535, a fourth rotation axis 545, and a fifth rotation axis 555 for both dual-substrate handling mode and single-substrate handling mode. For example, one or more motors (not shown) located in the base 514 can independently rotate the first forearm 530A and the second forearm 530B about the third rotation axis 535, rotate the first end effector 540A about the fourth rotation axis 545, and rotate the second end effector 540B about the fifth rotation axis 555 for both dual-substrate handling mode and single-substrate handling mode.

[0071] In an alternative embodiment, instead of using motors to control one or more components of the robot device 102B, a cam pulley design or a combination of a cam pulley design and one or more motors can be used to control one or more components of the robot device 102B. For example, one motor (not shown) located in the base 514 can be configured to independently rotate the lower arm 510 about a first rotation axis 515, one motor (not shown) located in the base 514 can be configured to independently rotate the upper arm 520 about a second rotation axis 525, two motors (not shown) located in the base 514 can be configured to independently rotate the first forearm 530A and the second forearm 530B about a third rotation axis 535, and the cam pulley design (not shown) can be configured to control the first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B such that the second end effector 540B is spaced apart from the first end effector 540A by a first distance D1 or a second distance D2.

[0072] refer to Figures 6A to 6D The operation of the robot device 102B in the dual-board handling mode is further described.

[0073] exist Figure 6A In China, such as regarding Figures 5A to 5B The robotic device 102B is shown positioned to be adapted for entering (or exiting) two horizontally adjacent loading locking chambers (such as those from...). Figure 1 The deployment configuration is within the loading locking chamber 122. This configuration will be referred to herein as the "double loading locking extension". The first forearm 530A and the second forearm 530B are independently rotatable about a third rotation axis 535, the first end effector 540A is independently rotatable about a fourth rotation axis 545, and the second end effector 540B is independently rotatable about a fifth rotation axis 555, to achieve a double loading locking extension in which the two end effectors are separated by a first gap. Figure 6A As can be seen, in the dual-load locking extension, the first end effector 540A and the second end effector 540B are separated by a first gap D1. In some embodiments, the first gap D1 is measured between the first end point 542A of the first end effector 540A and the second end point 542B of the second end effector 540B, such as... Figure 6A As shown in the configuration, the first spacing D1 corresponds to the distance between the centers of two horizontally adjacent loading locking chambers 122. In some embodiments, the first spacing D1 between the centers of two adjacent loading locking chambers 122 may be in the range of about 20 inches to about 25 inches. In some embodiments, the first spacing D1 between the centers of two adjacent loading locking chambers 122 may be in the range of about 21 inches to about 23 inches. In some embodiments, the first spacing D1 between the centers of two adjacent loading locking chambers 122 may be about 22 inches. Other distances for the first spacing D1 may also be possible.

[0074] In the dual loading and locking extension, the robot device 102B can enter and exit the two loading and locking chambers 122 to retrieve the two substrates 118 to transfer these substrates to the two processing chambers 120, or place the substrates to be processed on them to transfer them out of the main frame 104.

[0075] To further describe the dual-substrate handling mode, it is assumed that robot device 102B retrieves two substrates 118 from loading locking chamber 122 to transfer them to two horizontally adjacent processing chambers 120. After retrieving the two substrates, robot device 102B rotates (and / or retracts) the first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B, and rotates within transfer chamber 106 to achieve a "chamber pre-positioning" alignment, which in this embodiment may also be referred to as a "W-shaped pre-positioning" alignment. Figure 6B In a "W"-shaped pre-positioning alignment, the first forearm 530A, the second forearm 530B, the first end effector 540A, and the second end effector 540B can be rotated about their respective axes of rotation to positions suitable for entering and exiting two horizontally adjacent processing chambers 120. Rotation may involve one or more of the following: rotating the lower arm 510 about a first axis of rotation 515; rotating the upper arm 520 about a second axis of rotation 525; independently rotating one or more of the first forearm 530A or the second forearm 530B about a third axis of rotation 535; rotating the first end effector 540A about a fourth axis of rotation 545; and / or rotating the second end effector about a fifth axis of rotation 555.

[0076] After reaching the “chamber pre-position” alignment or the “W” shaped pre-position alignment and rotating to a direction suitable for processing chamber elongation, the first end effector 540A and the second end effector 540B can be further separated by a second gap D2. The first forearm 530A and the second forearm 530B can rotate independently about a third rotation axis 535, the first end effector 540A can rotate independently about a fourth rotation axis 545, and the second end effector 540B can rotate independently about a fifth rotation axis 555 to achieve a dual processing chamber elongation with the two end effectors separated by the second gap. In some embodiments, the second gap D2 is measured between the first end point 542A of the first end effector 540A and the second end point 542B of the second end effector 540B, such as... Figure 6C As shown in the configuration, the second spacing D2 corresponds to the distance between the centers of two horizontally adjacent processing chambers 120. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may range from about 32 inches to about 40 inches. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may range from about 34 inches to about 38 inches. In some embodiments, the second spacing D2 between the centers of two adjacent processing chambers 120 may be about 36 inches. Other distances for the second spacing D2 may also be possible.

[0077] exist Figure 6C In the diagram, the robotic device 102B is shown positioned to be adapted for entry (or exit) of two horizontally adjacent processing chambers (such as those from...). Figure 1 The expanded configuration within the processing chamber 120. This configuration will be referred to herein as "dual processing chamber extension". Figure 6CAs can be seen, during the dual-processing chamber extension, the first end effector 540A and the second end effector 540B are separated by a second distance D2. During the dual-processing chamber extension, the robot device 102B can simultaneously enter and exit two adjacent processing chambers 120 to place two substrates 118 for processing (or retrieve the processed substrates for transfer to further processing or transfer them to the loading locking chamber 122).

[0078] After processing, robot 102B can simultaneously retrieve the processed substrate from a pair of horizontally adjacent processing chambers 120 in a "dual processing chamber extension" configuration, rotate within transfer chamber 106, and reach a "loading lock pre-position" alignment, which can also be called a "V"-shaped pre-position alignment, such as... Figure 6D As shown in the diagram. Rotation may involve one or more of the following: rotating the lower arm 510 about a first rotation axis 515; rotating the upper arm 520 about a second rotation axis 525; rotating one or more of the first forearm 530A or the second forearm 530B independently about a third rotation axis 535; rotating the first end effector 540A about a fourth rotation axis 545; and / or rotating the second end effector about a fifth rotation axis 555. Upon arrival Figure 6D After the “loading lock pre-positioning” shown is aligned, the robot device 102B can cyclically repeat operations 6A to 6D to sequentially load and / or unload the processing chamber 120 and the loading lock chamber 122 in the electronic device processing system 100.

[0079] refer to Figures 7A to 7D The operation of the robot device 102B in single substrate handling mode is further described.

[0080] exist Figure 7A In China, such as regarding Figure 6A As explained, the robotic device 102B is shown in a "dual loading and locking extension". In the dual loading and locking extension, the robotic device 102B can enter and exit two loading and locking chambers 122 to retrieve two substrates 118, which can then be simultaneously placed in two horizontally adjacent processing chambers 120, as per [reference to...]. Figures 6B to 6C As shown. Alternatively, the two substrates 118 can be sequentially unloaded into two processing chambers (which may or may not be horizontally adjacent), as per the description. Figures 7B to 7C As shown.

[0081] Although not shown in the accompanying drawings, the robotic device 102B can also enter and exit one loading lock chamber 122 at a time to retrieve a single substrate 118. This may be useful, for example, for continuing operation of the electronics processing system when one loading lock chamber is not repaired. For instance, the end effector 540A can enter and exit either of the loading lock chambers 122 without entering the other. Similarly, the end effector 540B can enter and exit either of the loading lock chambers 122 without entering the other. Such operation involves independently rotating the first forearm 530A and the second forearm 530B about a third rotation axis 535, independently rotating the first end effector 540A about a fourth rotation axis 545, and independently rotating the second end effector 540B about a fifth rotation axis 555, to align the first end effector 540A and the second end effector 540B in a configuration suitable for allowing one of the first end effector 540A or the second end effector 540B to enter or exit a loading locking chamber 122. In some embodiments, the slit valve 134 of the loading locking chamber 122 may have a width suitable for allowing the first end effector 540A and / or the second end effector 540B to enter or exit, whether both enter or exit the two loading locking chambers simultaneously or sequentially into one loading locking chamber.

[0082] exist Figure 7B and Figure 7C In this configuration, the first forearm 530A and the second forearm 530B rotate independently about a third rotation axis 535, the first end effector 540A rotates independently about a fourth rotation axis 545, and the second end effector 540B rotates independently about a fifth rotation axis 555, to align the first end effector 540A and the second end effector 540B in a configuration suitable for allowing one of the first end effector 540A or the second end effector 540B to enter or exit a processing chamber 120. For example, in Figure 7B In the process, the first end effector 540A unloads the substrate into a processing chamber, and thereafter... Figure 7C In this process, the second end effector 540B unloads the substrate into another processing chamber (located on the opposite side of the processing chamber that receives the substrate from the first end effector 540A).

[0083] After processing, robot 102B can Figures 7B to 7C The "single processing chamber extension" configuration shown sequentially retrieves the processed substrate, rotates it within the transfer chamber 106, and reaches the "loading lock pre-position" alignment. This alignment can also be referred to as "V-shaped pre-position" alignment. Figure 7DAs shown in the diagram. Rotation may involve one or more of the following: rotating the lower arm 510 about a first rotation axis 515; rotating the upper arm 520 about a second rotation axis 525; rotating one or more of the first forearm 530A or the second forearm 530B independently about a third rotation axis 535; rotating the first end effector 540A about a fourth rotation axis 545; and / or rotating the second end effector about a fifth rotation axis 555. Upon arrival Figure 7D After the “load lock pre-positioning” or “V” shaped pre-positioning shown, the robot device 102B can cyclically repeat operations 7A to 7D to sequentially load and / or unload the processing chamber 120 and the loading lock chamber 122 in the electronic device processing system 100.

[0084] Robot device 102B can also use a dual-board operating mode (according to...) Figures 6A to 6D ) and single-substrate operation mode (according to Figures 7A to 6D The combination of these components is used to load and / or unload the processing chamber 120 and load the locking chamber 122 in the electronic device processing system 100.

[0085] For example, in an electronics processing system having six processing chambers 120 (three chambers on the first side and three chambers on the second side opposite the first side), the robot device 102B can load substrates into the six processing chambers in three separate operations, as follows: 1) simultaneously loading two substrates into a pair of horizontally adjacent processing chambers on the first side (e.g., processing chambers 120A and 120B) in a dual-substrate operation mode; 2) simultaneously loading two substrates into a pair of horizontally adjacent processing chambers on the second side (e.g., processing chambers 120E and 120F) in a dual-substrate operation mode; 3) sequentially loading one substrate into the remaining empty processing chambers on the first side (e.g., processing chamber 120C) in a single-substrate operation mode, followed by loading one substrate into the remaining empty processing chambers on the second side (e.g., processing chamber 120D). A similar sequence can be used to unload the same exemplary electronics processing system. A similar sequence with more or fewer runs can also be implemented for other electronics processing systems with more or fewer processing chambers.

[0086] The sequences illustrated herein should not be construed as limiting. For example, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120A and 120F may be loaded sequentially. In another embodiment, processing chambers 120A and 120B may be loaded simultaneously, processing chambers 120D and 120E may be loaded simultaneously, and processing chambers 120C and 120F may be loaded sequentially. In yet another embodiment, processing chambers 120B and 120C may be loaded simultaneously, processing chambers 120E and 120F may be loaded simultaneously, and processing chambers 120A and 120D may be loaded sequentially. The order of loading and unloading the processing chambers should also not be construed as limiting.

[0087] In another example, in an electronics processing system having six processing chambers 120 (three chambers on the first side and three chambers on the second side opposite the first side) and an operable loading lock chamber (e.g., 122A), the robot device 102B can operate according to the following sequence: 1) picking up a substrate from the loading lock chamber 122A by the second end effector 540B in a single-substrate operation mode; 2) picking up a second substrate from the loading lock chamber 122A by the first end effector 540A in a single-substrate operation mode; 3) simultaneously loading two substrates into a pair of horizontally adjacent processing chambers in a dual-substrate operation mode, or sequentially loading one substrate into one processing chamber and then loading the second substrate into another processing chamber in a single-substrate operation mode; 4) repeating 1) through 3) until the electronics processing system is fully loaded. A similar sequence can be used to unload the same exemplary electronics processing system. A similar sequence with more or fewer runs can also be implemented for other electronics processing systems with more or fewer processing chambers. A similar sequence can also be used when the operable loading locking chamber is loading locking chamber 122B.

[0088] For further reference Figure 8A , Figure 8B and Figure 8C , Figure 8A A perspective view illustrating an embodiment of the robot device 102 according to the disclosed embodiments is shown. Figure 8B A top view of a robotic device 102 in a retracted (or folded) configuration according to the disclosed embodiment is shown. Figure 8C A top view of a robot device 102 in an deployed configuration according to the disclosed embodiment is shown. Figures 8A to 8C In the illustrated embodiment, a robot device 102C is depicted. The robot device 102C may include a body 814 mounted on a linear track 816. The body 814 may be configured to move along the linear track 816.

[0089] The robot device 102C may further include a first lower arm 810A configured to rotate about a first rotation axis 815, and a second lower arm 810B configured to rotate about the first rotation axis 815. For example, one or more motors (not shown) located in the base 814 may independently rotate the first lower arm 810A and / or the second lower arm 810B about the first rotation axis 815.

[0090] The robot device 102C may further include a first upper arm 820A rotatably coupled to the first lower arm 810A at a second rotation axis 825 spaced apart from the first rotation axis 815. The first upper arm 820A may be configured to rotate about the second rotation axis 825. For example, one or more motors (not shown) located in the base 814 may cause the first upper arm 820A to rotate about the second rotation axis 825.

[0091] The robot device 102C may further include a second upper arm 820B rotatably coupled to the second lower arm 810B at a sixth rotation axis 835 spaced apart from the first rotation axis 815. The second upper arm 820B may be configured to rotate about the sixth rotation axis 835. For example, one or more motors (not shown) located in the base 814 may cause the second upper arm 820B to rotate about the sixth rotation axis 835.

[0092] The robot device 102C may further include a first forearm 830A rotatably coupled to the first upper arm 820A at a seventh rotation axis 845 spaced apart from the second rotation axis 825. The first forearm 830A may include a first bend in a first direction in a horizontal plane. The first forearm may be configured to rotate independently about the seventh rotation axis 845. For example, one or more motors (not shown) located in the base 814 may independently rotate the first forearm 830A about the seventh rotation axis 845 for both dual-board handling mode and single-board handling mode.

[0093] The robot device 102C may further include a second forearm 830B rotatably coupled to the second upper arm 820B at an eighth rotation axis 855 spaced apart from the sixth rotation axis 835. The second forearm 830B may include a second bend in a horizontal plane along a second direction, wherein the second direction is opposite to the first direction. The second forearm may be configured to rotate independently about the eighth rotation axis 855. For example, one or more motors (not shown) located in the base 814 may independently rotate the second forearm 830B about the eighth rotation axis 855 for both dual-board handling and single-board handling modes.

[0094] The robotic device 102C may further include a first end effector 840A optionally coupled to a first forearm 830A via a first wrist 850A (optionally rotatable). The robotic device 102C may also include a second end effector 840B optionally coupled to a second forearm 830B via a second wrist 850B (optionally rotatable).

[0095] In robot device 102C, when robot device 102C is in such a state Figure 8B In the retracted (or folded) configuration shown, the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, the (optional) first wrist 850A, the (optional) second wrist 850B, the first end effector 840A, and the second end effector 840B together form a "W" shape.

[0096] In robot device 102C, when robot device 102C is in such a state Figure 8C In the unfolded configuration shown, the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, the (optional) first wrist 850A, the (optional) second wrist 850B, the first end effector 840A, and the second end effector 840B together form a "V" shape, suitable for entering the loading locking chamber (e.g., loading locking chamber 122) or the processing chamber (e.g., processing chamber 120) in the dual-substrate operation mode.

[0097] In the robot device 102C, the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, the (optional) first wrist 850A, the (optional) second wrist 850B, the first end effector 840A, and the second end effector 840B are configured to rotate independently about their corresponding rotation axes (e.g., about the first rotation axis 815, the second rotation axis 825, the sixth rotation axis 835, the seventh rotation axis 845, the eighth rotation axis 855, and / or about additional rotation axes (if present)) for both the dual-board handling mode and the single-board handling mode.

[0098] For example, one or more motors (not shown) located in the base 814 can independently rotate the first lower arm 810A and the second lower arm 810B about the first rotation axis 815, rotate the first upper arm 820A about the second rotation axis 825, rotate the second upper arm 820B about the sixth rotation axis 835, rotate the first forearm 830A about the seventh rotation axis 845, and rotate the second forearm 830B about the eighth rotation axis 855 for both dual-board handling mode and single-board handling mode.

[0099] During operation, the robot device 102C can move along a linear track 816 to enter and exit various processing chambers 920 or load locking chambers 922. Similarly, the robot device 102C can operate in a single-board handling mode, a dual-board handling mode, or a combination thereof to load and / or unload processing chambers 920 and load locking chambers 922 in the electronic device handling system 900, such as... Figure 9 As shown in the image.

[0100] For the robot device 102C, operation in the dual-board handling mode includes independently rotating the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, (optionally) the first wrist 850A, (optionally) the second wrist 850B, the first end effector 840A, and the second end effector 840B around the first rotation axis 815, the second rotation axis 825, the sixth rotation axis 835, the seventh rotation axis 845, and the eighth rotation axis 855, so that the first end effector 850A and the second end effector 850B are separated by a first gap D91 or a second gap D92.

[0101] As in Figure 9 As can be seen, in some embodiments, the first gap D91 is measured between the first endpoint 942A of the first end effector 940A and the second endpoint 942B of the second end effector 940B, such as... Figure 9 As shown in the configuration, the first spacing D91 corresponds to the distance between the centers of two horizontally adjacent loading locking chambers 922. In some embodiments, the first spacing D91 between the centers of two adjacent loading locking chambers 922 may range from about 20 inches to about 25 inches. In some embodiments, the first spacing D91 between the centers of two adjacent loading locking chambers 922 may range from about 21 inches to about 23 inches. In some embodiments, the first spacing D91 between the centers of two adjacent loading locking chambers 922 may be about 22 inches. Other distances for the first spacing D91 may also be possible.

[0102] As in Figure 9As can be seen, in some embodiments, the second gap D92 is measured between the first endpoint 942A of the first end effector 940A and the second endpoint 942B of the second end effector 940B, such as... Figure 9 As shown in the configuration, the second spacing D92 corresponds to the distance between the centers of two horizontally adjacent loading locking chambers 922. In some embodiments, the second spacing D92 between the centers of two adjacent loading locking chambers 922 may range from about 20 inches to about 25 inches. In some embodiments, the second spacing D92 between the centers of two adjacent loading locking chambers 922 may range from about 21 inches to about 23 inches. In some embodiments, the second spacing D92 between the centers of two adjacent loading locking chambers 922 may be about 22 inches. Other distances for the second spacing D91 are also possible.

[0103] For the robot device 102C, operation in single-board handling mode includes independently rotating the first lower arm 810A, the second lower arm 810B, the first upper arm 820A, the second upper arm 820B, the first forearm 830A, the second forearm 830B, (optionally) the first wrist 850A, (optionally) the second wrist 850B, the first end effector 840A, and the second end effector 840B about the first rotation axis 815, the second rotation axis 825, the sixth rotation axis 835, the seventh rotation axis 845, and the eighth rotation axis 855 to align the first end effector 840A and the second end effector 840B in a configuration suitable for moving one of the first end effector 840A or the second end effector 840B into or out of a loading locking chamber 922 or a processing chamber 920.

[0104] The foregoing description discloses exemplary embodiments of this disclosure. Modifications to the disclosed apparatus, systems, and methods within the scope of this disclosure will be apparent to those skilled in the art. Therefore, although this disclosure has been disclosed in conjunction with exemplary embodiments, it should be understood that other embodiments may fall within the scope of this disclosure as defined by the claims.

Claims

1. A robotic device, comprising: At least one lower arm, the at least one lower arm being configured to rotate about a first rotation axis; At least one upper arm, said at least one upper arm being rotatably coupled to said at least one lower arm at a second rotation axis spaced apart from the first rotation axis; A first end effector, the first end effector being rotatably coupled to the at least one upper arm via a first forearm; as well as A second end effector, the second end effector being rotatably coupled to the at least one upper arm via a second forearm; The robotic device is configured to operate in both dual-board handling mode and single-board handling mode. In the dual-substrate handling mode, the first end effector and the second end effector will independently rotate about one or more additional rotation axes different from the first rotation axis and the second rotation axis, so that the first end effector and the second end effector are separated by a first gap or a second gap different from the first gap. The first end effector and the second end effector separated by the first gap are adapted to allow the first end effector to enter and exit a first loading locking chamber while simultaneously allowing the second end effector to enter and exit a second loading locking chamber, the first loading locking chamber and the second loading locking chamber being adjacent to each other and separated by the first gap. Similarly, the first end effector and the second end effector separated by the second gap are adapted to allow the first end effector to enter and exit a first processing chamber while simultaneously allowing the second end effector to enter and exit a second processing chamber, the first processing chamber and the second processing chamber being adjacent to each other and separated by the second gap. In the single substrate handling mode, the first end effector and the second end effector will rotate independently about one or more additional rotation axes to align the first end effector and the second end effector in a configuration suitable for one of the first end effector or the second end effector to enter or exit a loading locking chamber or a processing chamber.

2. The robot device according to claim 1, wherein the first end effector and the second end effector are coplanar.

3. The robotic device of claim 1, wherein the first pitch is in the range of about 20 inches to about 25 inches, and wherein the second pitch is in the range of about 32 inches to about 40 inches.

4. The robotic device of claim 1, wherein the first pitch is about 22 inches and wherein the second pitch is about 36 inches.

5. The robot device according to claim 1, wherein: The at least one lower arm includes a lower arm configured to rotate about the first rotation axis; The at least one upper arm includes an upper arm that is rotatably coupled to the lower arm at a second rotation axis spaced apart from the first rotation axis; The first end effector is rotatably coupled to the upper arm at a third rotation axis, wherein the first end effector includes a first bend in a first direction within a horizontal plane; and The second end effector is rotatably coupled to one of the upper arms at the third rotation axis, wherein the second end effector includes a second bend in the horizontal plane along a second direction, wherein the second direction is opposite to the first direction. The first and second end effectors are configured to rotate independently around the third rotation axis for both the dual-substrate handling mode and the single-substrate handling mode.

6. The robot device according to claim 1, wherein: The at least one lower arm includes a lower arm configured to rotate about the first rotation axis; The at least one upper arm includes an upper arm that is rotatably coupled to the lower arm at a second rotation axis spaced apart from the first rotation axis; The first forearm and the second forearm are each rotatably coupled to the upper arm at a third rotation axis; The first end effector is rotatably coupled to the first forearm at the fourth rotation axis; The second end effector is rotatably coupled to the second forearm at the fifth rotation axis; The first forearm, the second forearm, the first end effector, and the second end effector are configured to rotate independently around the third rotation axis, the fourth rotation axis, and the fifth rotation axis for both the dual-substrate handling mode and the single-substrate handling mode.

7. The robotic device of claim 1, further comprising a body mounted on a linear track, wherein the body is configured to move along the linear track, wherein the at least one lower arm and the at least one upper arm are coupled to the body, and wherein: The at least one lower arm includes: A first lower arm, the first lower arm being configured to rotate about a first rotation axis; and A second lower arm, configured to rotate about the first axis of rotation; The at least one upper arm includes: A first upper arm, rotatably coupled to a first lower arm at a second rotation axis spaced apart from the first rotation axis; and The second upper arm is rotatably coupled to the second lower arm at a sixth rotation axis spaced apart from the first rotation axis; A first forearm, rotatably coupled to a first upper arm at a seventh axis of rotation, wherein the first forearm includes a first bend in a first direction in a horizontal plane; A second forearm, rotatably coupled to a second upper arm at an eighth axis of rotation, wherein the second forearm includes a second bend in the horizontal plane along a second direction, wherein the second direction is opposite to the first direction; A first end effector, the first end effector being coupled to the first forearm via a first wrist; and The second end effector is coupled to the second forearm via the second wrist. The first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, the first wrist, the second wrist, the first end effector, and the second end effector together form a "W" shape and are configured to rotate independently around the first rotation axis, the second rotation axis, the sixth rotation axis, the seventh rotation axis, and the eighth rotation axis for both the dual-substrate handling mode and the single-substrate handling mode.

8. An electronic device processing system, comprising: Transfer chamber; Two adjacent loading locking chambers are coupled to the transfer chamber, wherein the two adjacent loading locking chambers are horizontally separated by a first spacing. Four or more processing chambers coupled to the transfer chamber, wherein at least one pair of adjacent processing chambers in the four or more processing chambers are separated by a second spacing different from the first spacing; as well as A robotic device, at least partially located within the transfer chamber, comprising: At least one lower arm, the at least one lower arm being configured to rotate about a first rotation axis; At least one upper arm, said at least one upper arm being rotatably coupled to said at least one lower arm at a second rotation axis spaced apart from the first rotation axis; A first end effector, the first end effector being rotatably coupled to the at least one upper arm via a first forearm; and A second end effector, the second end effector being rotatably coupled to the at least one upper arm via a second forearm; The robotic device is configured to operate in both a dual-board handling mode and a single-board handling mode. In the dual-substrate handling mode, the first end effector and the second end effector will independently rotate about one or more additional rotation axes different from the first rotation axis and the second rotation axis, so that the first end effector and the second end effector are separated by the first spacing or a second spacing different from the first spacing. The first end effector and the second end effector separated by the first spacing are adapted such that the first end effector enters and exits one of the two adjacent loading locking chambers while the second end effector enters and exits the other of the two adjacent loading locking chambers. Similarly, the first end effector and the second end effector separated by the second spacing are adapted such that the first end effector enters and exits one of the at least one pair of adjacent processing chambers while the second end effector enters and exits the other of the at least one pair of adjacent processing chambers. In the single substrate handling mode, the first end effector and the second end effector will rotate independently about the one or more additional rotation axes to align the first end effector and the second end effector in a configuration suitable for one of the first end effector or the second end effector to enter or exit a loading locking chamber or a processing chamber.

9. The electronic device processing system according to claim 8, wherein the first end effector and the second end effector are coplanar.

10. The electronic device processing system of claim 8, wherein the first pitch is in the range of about 20 inches to about 25 inches, and wherein the second pitch is in the range of about 32 inches to about 40 inches.

11. The electronic device processing system according to claim 8, wherein, In the robotic device: The at least one lower arm includes a lower arm configured to rotate about the first rotation axis; The at least one upper arm includes an upper arm that is rotatably coupled to the lower arm at a second rotation axis spaced apart from the first rotation axis; The first end effector is rotatably coupled to the upper arm at a third rotation axis, wherein the first end effector includes a first bend in a first direction within a horizontal plane; and The second end effector is rotatably coupled to one of the upper arms at the third rotation axis, wherein the second end effector includes a second bend in the horizontal plane along a second direction, wherein the second direction is opposite to the first direction. The first and second end effectors are configured to rotate independently around the third rotation axis for both the dual-substrate handling mode and the single-substrate handling mode.

12. The electronic device processing system according to claim 8, wherein, In the robotic device: The at least one lower arm includes a lower arm configured to rotate about the first rotation axis; The at least one upper arm includes an upper arm that is rotatably coupled to the lower arm at a second rotation axis spaced apart from the first rotation axis; The first forearm and the second forearm are each rotatably coupled to the upper arm at a third rotation axis; The first end effector is rotatably coupled to the first forearm at the fourth rotation axis; The second end effector is rotatably coupled to the second forearm at the fifth rotation axis; The first forearm, the second forearm, the first end effector, and the second end effector are configured to rotate independently around the third rotation axis, the fourth rotation axis, and the fifth rotation axis for both the dual-substrate handling mode and the single-substrate handling mode.

13. The electronic device processing system of claim 8, wherein the robotic device further comprises a body mounted on a linear track, wherein the body is configured to move along the linear track, wherein the at least one lower arm and the at least one upper arm are coupled to the body, and wherein, In the robotic device: The at least one lower arm includes: A first lower arm, the first lower arm being configured to rotate about a first rotation axis; and A second lower arm, configured to rotate about the first axis of rotation; The at least one upper arm includes: A first upper arm, rotatably coupled to a first lower arm at a second rotation axis spaced apart from the first rotation axis; and The second upper arm is rotatably coupled to the second lower arm at a sixth rotation axis spaced apart from the first rotation axis; A first forearm, rotatably coupled to a first upper arm at a seventh axis of rotation, wherein the first forearm includes a first bend in a first direction in a horizontal plane; A second forearm, rotatably coupled to a second upper arm at an eighth axis of rotation, wherein the second forearm includes a second bend in the horizontal plane along a second direction, wherein the second direction is opposite to the first direction; A first end effector, the first end effector being coupled to the first forearm via a first wrist; and The second end effector is coupled to the second forearm via the second wrist. The first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, the first wrist, the second wrist, the first end effector, and the second end effector together form a "W" shape and are configured to rotate independently around the first rotation axis, the second rotation axis, the sixth rotation axis, the seventh rotation axis, and the eighth rotation axis for both the dual-substrate handling mode and the single-substrate handling mode.

14. The electronic device processing system according to claim 8, comprising 4 to 24 processing chambers.

15. A method for transferring a substrate, comprising the following steps: Operating the robot device in both dual-board handling mode and single-board handling mode. The robotic device includes: At least one lower arm, the at least one lower arm being configured to rotate about a first rotation axis; At least one upper arm, said at least one upper arm being rotatably coupled to said at least one lower arm at a second rotation axis spaced apart from the first rotation axis; A first end effector, the first end effector being rotatably coupled to the at least one upper arm via a first forearm; and A second end effector, the second end effector being rotatably coupled to the at least one upper arm via a second forearm; The operation in the dual-substrate handling mode includes the following steps: The first and second end effectors are independently rotated about one or more additional rotation axes different from the first and second rotation axes, such that the first and second end effectors are separated by a first gap or a second gap different from the first gap. The first and second end effectors separated by the first gap are adapted to allow the first end effector to enter and exit a first loading locking chamber while simultaneously allowing the second end effector to enter and exit a second loading locking chamber, the first and second loading locking chambers being adjacent to each other and separated by the first gap. The first and second end effectors separated by the second gap are adapted to allow the first end effector to enter and exit a first processing chamber while simultaneously allowing the second end effector to enter and exit a second processing chamber, the first and second processing chambers being adjacent to each other and separated by the second gap. The operation in single substrate handling mode includes the following steps: The first end effector and the second end effector are independently rotated about the one or more additional rotation axes to align the first end effector and the second end effector in a configuration suitable for one of the first end effector or the second end effector to enter or exit a loading locking chamber or a processing chamber.

16. The method of claim 15, wherein the first spacing is in the range of about 20 inches to about 25 inches, and wherein the second spacing is in the range of about 32 inches to about 40 inches.

17. The method of claim 15, wherein in the robotic device: The at least one lower arm includes a lower arm configured to rotate about the first rotation axis; The at least one upper arm includes an upper arm that is rotatably coupled to the lower arm at a second rotation axis spaced apart from the first rotation axis; The first end effector is rotatably coupled to the upper arm at a third axis of rotation, wherein the first end effector includes a first bend in a first direction within a horizontal plane; and The second end effector is rotatably coupled to one of the upper arms at the third rotation axis, wherein the second end effector includes a second bend in the horizontal plane along a second direction, wherein the second direction is opposite to the first direction. The operation in the dual-substrate handling mode includes the following steps: Independently rotate the first end effector and the second end effector about the third rotation axis to separate the first end effector from the second end effector by the first spacing or the second spacing; and The operation in the single substrate handling mode includes the following steps: The first and second end effectors are independently rotated about the third rotation axis to align the first and second end effectors in a configuration suitable for one of the first or second end effectors to enter or exit a loading locking chamber or a processing chamber.

18. The method of claim 15, wherein in the robotic device: The at least one lower arm includes a lower arm configured to rotate about the first rotation axis; The at least one upper arm includes an upper arm that is rotatably coupled to the lower arm at a second rotation axis spaced apart from the first rotation axis; The first forearm and the second forearm are each rotatably coupled to the upper arm at a third rotation axis; The first end effector is rotatably coupled to the first forearm at the fourth rotation axis; The second end effector is rotatably coupled to the second forearm at the fifth rotation axis; The operation in the dual-substrate handling mode includes the following steps: The first forearm, the second forearm, the first end effector, and the second end effector are independently rotated about the third rotation axis, the fourth rotation axis, and the fifth rotation axis, so that the first end effector and the second end effector are separated by the first gap or the second gap; and The operation in the single substrate handling mode includes the following steps: The first forearm, the second forearm, the first end effector, and the second end effector are independently rotated about the third rotation axis, the fourth rotation axis, and the fifth rotation axis to align the first end effector and the second end effector in a configuration suitable for moving one of the first end effector or the second end effector into or out of a loading locking chamber or a processing chamber.

19. The method of claim 15, wherein the robotic device further comprises a body mounted on a linear track, wherein the body is configured to move along the linear track, wherein the at least one lower arm and the at least one upper arm are coupled to the body, and wherein in the robotic device: The at least one lower arm includes: A first lower arm, the first lower arm being configured to rotate about a first rotation axis; as well as A second lower arm, configured to rotate about the first axis of rotation; The at least one upper arm includes: A first upper arm, rotatably coupled to a first lower arm at a second rotation axis spaced apart from the first rotation axis; and The second upper arm is rotatably coupled to the second lower arm at a sixth rotation axis spaced apart from the first rotation axis; A first forearm, rotatably coupled to a first upper arm at a seventh axis of rotation, wherein the first forearm includes a first bend in a first direction in a horizontal plane; A second forearm, rotatably coupled to a second upper arm at an eighth axis of rotation, wherein the second forearm includes a second bend in the horizontal plane along a second direction, wherein the second direction is opposite to the first direction; A first end effector, the first end effector being coupled to the first forearm via a first wrist; and The second end effector is coupled to the second forearm via the second wrist. The operation in the dual-substrate handling mode includes the following steps: The first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, the first wrist, the second wrist, the first end effector, and the second end effector are independently rotated around the first rotation axis, the second rotation axis, the sixth rotation axis, the seventh rotation axis, and the eighth rotation axis, so that the first end effector and the second end effector are separated by the first gap or the second gap; and The operation in the single substrate handling mode includes the following steps: The first lower arm, the second lower arm, the first upper arm, the second upper arm, the first forearm, the second forearm, the first wrist, the second wrist, the first end effector, and the second end effector are independently rotated about the first rotation axis, the second rotation axis, the sixth rotation axis, the seventh rotation axis, and the eighth rotation axis to align the first end effector and the second end effector in a configuration suitable for moving one of the first end effector or the second end effector into or out of a loading locking chamber or a processing chamber.

20. An electronic device processing system, comprising: A transfer chamber having a center; Two adjacent loading locking chambers are coupled to the transfer chamber, wherein the two adjacent loading locking chambers are horizontally separated by a first spacing. Four or more processing chambers coupled to the transfer chamber, wherein at least one pair of adjacent processing chambers in the four or more processing chambers are separated by a second spacing different from the first spacing; as well as A robotic device, at least partially located within the transfer chamber, comprising: At least one lower arm, the at least one lower arm being configured to rotate about a first rotation axis, wherein the first rotation axis is offset from the center of the transfer chamber; At least one upper arm, said at least one upper arm being rotatably coupled to said at least one lower arm at a second rotation axis spaced apart from the first rotation axis; A first end effector, the first end effector being rotatably coupled to the at least one upper arm via a first forearm; and A second end effector, the second end effector being rotatably coupled to the at least one upper arm via a second forearm; The robotic device is configured to operate in a dual-board handling mode. In the dual-substrate handling mode, the first end effector and the second end effector will independently rotate about one or more additional rotation axes different from the first rotation axis and the second rotation axis, so that the first end effector and the second end effector are separated by the first spacing or different from the first spacing and the second spacing. The first end effector and the second end effector separated by the first spacing are adapted to allow the first end effector to enter and exit one of the two adjacent loading locking chambers and simultaneously allow the second end effector to enter and exit the other of the two adjacent loading locking chambers. The first end effector and the second end effector separated by the second spacing are adapted to allow the first end effector to enter and exit one of the at least one pair of adjacent processing chambers and simultaneously allow the second end effector to enter and exit the other of the at least one pair of adjacent processing chambers.

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