Cap having a multilayer film laminated thereon, electronic device including the cap, and method of manufacturing a multilayer film

Abstract

An electronic device is disclosed. The electronic device can include a cover defining a portion of an appearance of the electronic device, a film layer attached to a first surface of the cover, at least one UV molded pattern layer disposed on the film layer, wherein the at least one UV molded pattern layer includes a first area and a second area different from the first area, a thermally cured print layer disposed on the first area of the at least one UV molded pattern layer, and a deposition layer including a first portion disposed to overlap the first area of the at least one UV molded pattern layer and a second portion disposed in the second area of the at least one UV molded pattern layer. Various other embodiments understood with the benefit of the specification are also possible.

Description

Technical Field

[0001] The embodiments disclosed herein relate to a cover laminated with a multilayer film, an electronic device including the cover, and a method for manufacturing the multilayer film. Background Technology

[0002] To achieve the desired design effect, layers with various colors and three-dimensional patterns can be applied to the back surface of the cover that defines the appearance of the electronic device. For example, a printed layer and an ultraviolet (UV) molding pattern layer laminated on the printed layer can be applied to the back surface of the cover. In the example, color can be achieved through the printed layer, and a visual three-dimensional effect can be achieved through the UV molding pattern layer. Summary of the Invention

[0003] Technical issues

[0004] To cure the UV-molded pattern layer, a specific or higher light energy may be required. Furthermore, the printed layer may require a specific transmittance to ensure that the light illuminating it reaches the UV-molded pattern layer.

[0005] Therefore, high-transmittance colors must be applied to the printing layer, and the achievable visual effects may also be limited. For example, it is difficult to achieve high color fidelity when the transmittance is high.

[0006] One aspect of this disclosure provides an electronic device comprising a multilayer film that can achieve various visual effects (e.g., prism effect) and various colors (e.g., high-purity white or black or high-chroma color).

[0007] Technical solution

[0008] According to one aspect of this disclosure, an electronic device includes a cover forming part of the exterior of the electronic device, a film layer attached to a first surface of the cover, at least one UV-molded pattern layer disposed on the film layer, wherein the at least one UV-molded pattern layer includes a first region and a second region different from the first region, a thermosetting printed layer disposed on the at least one UV-molded pattern layer in the first region, and a deposition layer including a first portion disposed overlapping the first region of the at least one UV-molded pattern layer, and a second portion disposed on the at least one UV-molded pattern layer in the second region.

[0009] According to one aspect of this disclosure, a cover for an electronic device includes a film layer attached to a first surface of the cover, an adhesive layer inserted between the first surface of the cover and the film layer, at least one UV-molded pattern layer disposed on the film layer, wherein the at least one UV-molded pattern layer includes a first region and a second region different from the first region, a thermosetting printed layer disposed on the at least one UV-molded pattern layer in the first region, and a deposition layer including a first portion disposed overlapping the first region of the at least one UV-molded pattern layer, a second portion disposed on the at least one UV-molded pattern layer in the second region, and a printed layer disposed on the deposition layer.

[0010] According to one aspect of this disclosure, a method for manufacturing a multilayer film includes forming a first UV-molded pattern layer on the film layer, wherein the first UV-molded pattern layer includes a first region and a second region different from the first region, forming a thermosetting printed layer on the first UV-molded pattern layer in the first region, and forming a second UV-molded pattern layer or a first deposition layer on the first UV-molded pattern layer in the thermosetting printed layer and the second region.

[0011] Beneficial effects

[0012] According to this disclosure, various colors and visual effects can be achieved through multilayer films with different optical property regions.

[0013] According to this disclosure, a double molding effect can be achieved by using a thermosetting printed layer to laminate two UV-molded pattern layers.

[0014] According to this disclosure, manufacturing costs can be reduced by omitting the deposition process formed between two UV-molded patterned layers.

[0015] Furthermore, this disclosure can provide various effects of direct or indirect confirmation.

[0016] Before proceeding with the following detailed description, it may be advantageous to list the definitions of certain words and phrases used in this patent document: the terms “comprising” and “including” and their derivatives mean unrestricted inclusion; the term “or” is inclusive, meaning and / or; the phrases “associated with” and “associated with” and their derivatives may mean including, being included in, interconnected with, containing, contained in, connected to or linked with, coupled to or connected with, communicable with, cooperating, interleaving, juxtaposing, proximate, bound to or combined with, having, having its attributes, etc.; the term “controller” means any device, system, or part thereof that controls at least one operation, such device may be implemented by hardware, firmware, or software, or some combination of at least two of hardware, firmware, or software. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether local or remote.

[0017] Furthermore, the various functions described below can be implemented or supported by one or more computer programs, each computer program being formed by computer-readable program code and embodied in a computer-readable medium. The terms "application program" and "program" refer to one or more computer programs, software components, instruction sets, procedures, functions, objects, classes, instances, associated data, or portions thereof suitable for implementation in appropriate computer-readable program code. The phrase "computer-readable program code" includes any type of computer code, including source code, object code, and executable code. The phrase "computer-readable medium" includes any type of medium that can be accessed by a computer, such as read-only memory (ROM), random access memory (RAM), hard disk drive, optical disc (CD), digital video disc (DVD), or any other type of storage. "Non-transitory" computer-readable media does not include wired, wireless, optical, or other communication links that transmit transient electrical signals or other signals. Non-transitory computer-readable media includes media that can permanently store data and media that can store data and be rewritten later, such as rewritable optical discs or erasable storage devices.

[0018] This patent document provides definitions for certain words and phrases, and those skilled in the art will understand that, in many cases, if not most, such definitions apply to the prior and future use of the words and phrases defined in this way. Attached Figure Description

[0019] To gain a more complete understanding of this disclosure and its advantages, reference is now made to the following description in conjunction with the accompanying drawings, wherein like reference numerals denote like parts:

[0020] Figure 1A This is a front perspective view of an electronic device according to an embodiment.

[0021] Figure 1B This is a rear perspective view of an electronic device according to an embodiment.

[0022] Figure 1C This is an exploded perspective view of an electronic device according to an embodiment.

[0023] Figure 2 This is a cross-sectional view of an electronic device according to an embodiment.

[0024] Figure 3 This is a view showing the optical properties of a first multilayer film according to an embodiment.

[0025] Figure 4 This is a cross-sectional view of an electronic device according to another embodiment.

[0026] Figure 5 This is a flowchart illustrating a method for manufacturing a multilayer film according to an embodiment.

[0027] Figure 6 This is a block diagram illustrating an electronic device in a network environment according to various embodiments.

[0028] Regarding the description of the accompanying drawings, identical or similar parts may be labeled with identical or similar reference numerals. Detailed Implementation

[0029] The following discussion Figures 1A to 6 The various embodiments used to describe the principles of this disclosure in this patent document are merely illustrative and should not be construed as limiting the scope of this disclosure in any way. Those skilled in the art will understand that the principles of this disclosure can be implemented in any suitably arranged system or device.

[0030] In the following description, various embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. Therefore, those skilled in the art will recognize that different modifications, equivalents, and / or substitutions can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure.

[0031] Figure 1A This is a front perspective view of an electronic device according to an embodiment.

[0032] Figure 1B This is a rear perspective view of an electronic device according to an embodiment.

[0033] Figure 1C This is an exploded perspective view of an electronic device according to an embodiment.

[0034] refer to Figure 1A and 1B The electronic device 100 may include a front cover (or "front panel") 102, a frame structure (or "side panel structure") 118, and a rear cover (or "rear panel") 104. In one embodiment, the electronic device 100 may include a first surface (or front surface) 100A, a second surface (or rear surface) 100B, and a side surface 100C surrounding the space between the first surface 100A and the second surface 100B.

[0035] In one embodiment, the first surface 100A of the electronic device 100 may be defined by a front cover 102. In one embodiment, the front cover 102 may comprise a polymer, such as resin and / or glass. In one embodiment, at least a portion of the front cover 102 may be formed to be substantially transparent, such that light emitted from the display 101 is visually perceptible to the user.

[0036] In one embodiment, the second surface 100B of the electronic device 100 may be defined by a back cover 104. In one embodiment, the back cover 104 may be formed of, for example, glass, ceramic, resin (e.g., polycarbonate (PC)), metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two materials.

[0037] In one embodiment, the side surface 100C of the electronic device 100 may be coupled to the front cover 102 and the rear cover 104, and may be defined by a frame structure 118 comprising metal and / or polymer.

[0038] In another embodiment, the front cover 102 and / or the rear cover 104 may extend into the frame structure 118 with their edge portions deflected, and in this case, the front cover 102 and / or the rear cover 104 may together with the frame structure 118 define the side surface 100C of the electronic device 100.

[0039] In another embodiment, the back cover 104 and the frame structure 118 may be integrally formed and may be made of the same material (e.g., a metallic material such as aluminum).

[0040] In one embodiment, the front cover 102, rear cover 104, and frame structure 118 defining the front surface 100A, rear surface 100B, and side surface 100C of the electronic device 100 may be referred to as the housing of the electronic device 100. In another embodiment (not shown), the housing may refer to a structure defining some of the first surface 100A, second surface 100B, and side surface 100C of FIG. 100.

[0041] In one embodiment, the electronic device 100 may include a display 101 (e.g., Figure 6 The display module 660), camera modules 105 and 112 (e.g., Figure 6 The camera module 680 and the key input device 117.

[0042] In one embodiment, the display 101 may be exposed through the entire portion of the front cover 102. For example, at least a portion of the display 101 may be exposed through the front cover 102 defining a first surface 100A.

[0043] In one embodiment, the corners of the display 101 may have a shape substantially the same as the adjacent outer shape of the front cover 102. In other embodiments, to increase the exposed area of ​​the display 101, the spacing between the periphery of the display 101 and the periphery of the front cover 102 may be substantially the same.

[0044] In one embodiment, the front surface 100A (or front cover 102) of the electronic device 100 may include a screen display area formed when the display 101 is visually exposed. In one embodiment, the screen display area may include a sensing area (not shown) configured to acquire a user's biometric information. Here, the expression "screen display area includes sensing area" can be understood as meaning that at least a portion of the sensing area may overlap with the screen display area. For example, the sensing area (not shown) may display visual information on the display 101 like other areas of the screen display area, and additionally, the sensing area may represent an area where user biometric information (e.g., fingerprint) can be acquired.

[0045] In one embodiment, the display 101 may be connected to or configured to be adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting the magnetic field type of a stylus.

[0046] In one embodiment, camera modules 105 and 112 may include a first camera module 105 exposed on the front surface 100A of the electronic device 100 and a second camera module 112 exposed on the rear surface 100B.

[0047] In one embodiment, the first camera module 105 may be exposed through a portion of the front surface 100A of the display 101. For example, the first camera module 105 may expose a portion of the front surface 100A through an opening formed in a portion of the display 101.

[0048] In one embodiment, the second camera module 112 may include multiple camera modules (e.g., dual-camera, triple-camera, or quad-camera). However, the second camera module 112 is not limited to including multiple camera modules and may include a single camera module.

[0049] In one embodiment, the first camera module 105 and the second camera module 112 may include one or more lenses, image sensors and / or image signal processors.

[0050] In one embodiment, the key input device 117 may be disposed on the side surface 100C of the electronic device 100. In another embodiment, the key input device 117 of the electronic device 100 may be implemented in another form, such as a soft key.

[0051] The electronic device according to an embodiment may include an audio module (e.g., Figure 6 The sound output module 655), sensor module (e.g., sensor module 676), connector hole and light-emitting element, which are not shown.

[0052] In one embodiment, an audio module including a microphone and a speaker can acquire sound outside the electronic device 100 or output sound to the outside of the electronic device 100.

[0053] In one embodiment, the sensor module can generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 100 or the external environmental state. For example, the sensor module may include at least one of a proximity sensor, HRM sensor, fingerprint sensor, gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, color sensor, infrared (IR) sensor, biosensor, temperature sensor, humidity sensor, and lighting sensor.

[0054] In one embodiment, a connector hole may be provided on the side surface 100C of the electronic device 100 to accommodate a connector. For example, the connector hole may accommodate a connector for sending / receiving power and / or data to / from an external electronic device (e.g., a USB connector), or it may accommodate a connector for sending / receiving audio signals to / from an external electronic device (e.g., a headphone jack).

[0055] In one embodiment, the electronic device 100 may include a light-emitting element. For example, the light-emitting element may be disposed on a first surface 100A of the electronic device 100. The light-emitting element may provide status information about the electronic device 100 in the form of light. In another embodiment, the light-emitting element may provide a light source that interacts with the operation of the first camera module 105. For example, the light-emitting element may include an LED, an IR LED, and / or a xenon lamp.

[0056] refer to Figure 1C The electronic device 100 may include a bracket 120, a battery 149, a printed circuit board 150, a first support member 162, a second support member 164, and an adhesive member 106.

[0057] In one embodiment, the support 120 may include a surface defining the electronic device 100 (e.g., Figure 1A A frame structure 118 (part of the side surface 100C) and a plate structure 119 extending from the frame structure 118 into the interior of the electronic device 100.

[0058] In one embodiment, the board structure 119 may be located inside the electronic device 100, may be connected to the frame structure 118, or may be integrally formed with the frame structure 118. In one embodiment, the board structure 119 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). The display 101 may be coupled to one surface of the board structure 119, and the printed circuit board 150 may be coupled to the opposite surface of the board structure 119.

[0059] In one embodiment, the processor (e.g., Figure 6 The processor 620), memory (e.g., Figure 6 The memory 630) and / or interface (e.g., Figure 6 The interface 677 can be mounted on the printed circuit board 150. For example, the processor may include one or more of a central processing unit, application processor, graphics processing unit, image signal processor, sensor hub processor, or communication processor. Memory may include, for example, volatile and / or non-volatile memory. For example, the interface may include a high-definition multimedia interface (HDMI), a universal serial bus (USB), an SD card interface, and / or an audio interface. For example, the interface can electrically or physically connect the electronic device 100 to an external electronic device and may include a USB connector, an SD card / MMC connector, and an audio connector.

[0060] In one embodiment, battery 149 can supply power to at least one component of electronic device 100. For example, battery 149 may include a non-rechargeable primary battery cell, a rechargeable secondary battery cell, or a fuel cell cell. In one embodiment, at least a portion of battery 149 may be disposed on a plane substantially the same as the plane of printed circuit board 150. In one embodiment, battery 149 may be integrally disposed inside electronic device 100 or may be detachably disposed on electronic device 100.

[0061] In one embodiment, the first camera module 105 may be disposed in the plate structure 119 of the bracket 120, such that the lens passes through the front cover 102 (or...) of the electronic device 100. Figure 1A A portion of the front surface (100A) is exposed.

[0062] In one embodiment, the second camera module 112 may be disposed in the printed circuit board 150, such that the lens passes through the rear cover 104 of the electronic device 100 (or... Figure 1B The camera area 114 of the rear surface 100B is exposed.

[0063] In one embodiment, the camera area 114 may be formed on the surface of the rear cover 104 (e.g., Figure 1B On the rear surface 100B. In one embodiment, the camera region 114 may be formed to be at least transparent enough to allow external light to reach the lens of the second camera module 112. In one embodiment, at least a portion of the camera region 114 may protrude from the surface of the rear cover 104 by a certain height. However, this embodiment is not limited thereto, and the camera region 114 may define a plane substantially the same as the surface of the rear cover 104.

[0064] In one embodiment, the first support member 162 and the second support member 164 may be disposed between the back cover 104 and the printed circuit board 150. In another embodiment, the first support member 162 and the second support member 164 may be coupled to the bracket 120 to cover a portion of the printed circuit board 150.

[0065] In one embodiment, the adhesive member 106 may be inserted between the back cover 104 and the frame structure 118 to attach the back cover 104 to the frame structure 118. For example, the adhesive member 106 may include double-sided adhesive tape.

[0066] Figure 2 This is a cross-sectional view of an electronic device according to an embodiment.

[0067] Figure 2 It can be along Figure 1C A cross-sectional view taken by line A-A' or line B-B'.

[0068] Figure 3 This is a view showing the optical properties of a first multilayer film according to an embodiment. Figure 2 and Figure 3 The thickness of the layers shown may not be proportional to or consistent with the actual scale.

[0069] refer to Figure 2 and Figure 3 The electronic device 200 according to the embodiment (e.g., Figure 1C Electronic device 100) may include cover 210 (e.g., Figure 1C The front cover 102 or the rear cover 104), the adhesive layer 212 and the first multilayer film 310.

[0070] In one embodiment, the cover 210 may include a first surface 210A facing a first direction "1" and a second surface 210B facing a second direction "2". In one embodiment, the first direction "1" may be a direction relative to the cover 210 toward the outside of the electronic device 200, while the second direction "2" may be a direction relative to the cover 210 toward the inside of the electronic device 200. In one embodiment, the first surface 210A of the cover 210 may correspond to... Figure 1A Front surface 100A or Figure 1B The rear surface is 100B.

[0071] In one embodiment, the first multilayer film 310 may include a base film layer 220, a first UV molding pattern layer 230, a thermosetting printing layer 250, a first deposition layer 260, and a first printing layer 270. In one embodiment, the first multilayer film 310 may be disposed on the cover 210. For example, the first multilayer film 310 may be disposed on the cover 210 in a second direction "2". For example, the first multilayer film 310 may be disposed on the second surface 210B of the cover 210.

[0072] In one embodiment, the base film layer 220 may be attached to the second surface 210B of the cover 210. For example, the base film layer 220 may be attached to the cover 210 via an adhesive layer 212 between the cover 210 and the base film layer 220. In one embodiment, the adhesive layer 212 may, for example, comprise an optically clear adhesive (OCA) or an optically clear resin (OCR) with a thickness of about 5 μm to 35 μm.

[0073] In one embodiment, the base film layer 220 may be a substrate for forming the first UV molding pattern layer 230. In one embodiment, the base film layer 220 may comprise a synthetic resin, such as substantially transparent polyethylene terephthalate (PET) or polycarbonate (PC). In one embodiment, the base film layer 220 may, for example, have a thickness of approximately 18 μm to 55 μm.

[0074] In one embodiment, the base film layer 220 may be formed to be substantially transparent. In this case, at least a portion of the light (1) input to the base film layer 220 may pass through the base film layer 220.

[0075] In another embodiment, a primer layer including pigment may be formed on the front surface 220A and / or the rear surface 220B of the base film layer 220. In this case, at least a portion of the light (1) incident on the base film layer 220 may be reflected to achieve a specific color, and the remainder may pass through the base film layer 220.

[0076] In one embodiment, the first UV molding pattern layer 230 may be disposed on the base film layer 220 (e.g., in the second direction 2). For example, the first UV molding pattern layer 230 may be disposed on the second surface 220B of the base film layer 220.

[0077] In one embodiment, the first UV molding pattern layer 230 may include finely sized patterns (e.g., embossed patterns) to provide a variety of visual effects. In one embodiment, the first UV molding pattern layer 230 may have a thickness of approximately 5 μm to approximately 15 μm.

[0078] In one embodiment, a pattern formed in the first UV molding pattern layer 230 can provide visual effects utilizing the properties of light (e.g., refraction and reflection). For example, the first UV molding pattern layer 230 can provide a polychromatic effect representing multiple colors by scattering input light (2). As another example, the first UV molding pattern layer 230 can provide a scattering and reflection effect using light scattering. As another example, the first UV molding pattern layer 230 can provide a visual sense of three dimensions (e.g., a sense of depth). In one embodiment, the first UV molding pattern layer 230 can include various patterns depending on the visual effect to be achieved.

[0079] In one embodiment, the first UV-molded pattern layer 230 may include a first region 10 and a second region 20 different from the first region 10.

[0080] In one embodiment, the thermosetting printed layer 250 may be disposed on the first UV molding pattern layer 230 in the first region 10. In one embodiment, the thermosetting printed layer 250 may comprise polyester / polyurethane, polyester / epoxy, polyester, propylene / silicone, and / or combinations thereof. In one embodiment, the thermosetting printed layer 250 may have a thickness of about 2 μm to about 10 μm. In one embodiment, the thermosetting printed layer 250 may have a thickness of about 2 μm to about 7 μm.

[0081] In one embodiment, the thermosetting printed layer 250 may be substantially opaque. For example, the thermosetting printed layer 250 may absorb and / or reflect input light (3). In one embodiment, the thermosetting printed layer 250 may have a light transmittance of less than about 1%. In one embodiment, the thermosetting printed layer 250 may be printed using mirror inks, pearl pigments, and special pigments (e.g., pigments that are only visually recognizable under specific lighting) to achieve a variety of visual effects and specific opaque colors.

[0082] When ultraviolet light is irradiated in the second direction "2" and another printed layer is disposed between the base film layer 220 and the first UV molding pattern layer 230, the other printed layer may require a specific transmittance for the UV curing of the first UV molding pattern layer 230. Therefore, the visual effects achievable through the other printed layer can be limited, and the other printed layer can affect the UV curing of the first UV molding pattern layer 230. In one embodiment, because the thermosetting printed layer 250 is disposed in the second direction "2" of the first UV molding pattern layer 230, various visual effects can be achieved without affecting the curing performance of the first UV molding pattern layer 230.

[0083] In one embodiment, the first deposited layer 260 may include a first portion 262 and a second portion 264. In one embodiment, when viewed from the second direction "2", the first portion 262 may be configured to at least partially overlap the thermosetting printed layer 250. In one embodiment, the first portion 262 may overlap with the first UV molding pattern layer 230 in the first region 10. In one embodiment, the second portion 264 may be disposed on the first UV molding pattern layer 230 in the second region 20.

[0084] In one embodiment, the first deposition layer 260 may include a metal oxide. In another embodiment, the first deposition layer 260 may have at least one layer comprising a metal oxide. For example, the first deposition layer 260 may include a first layer of SiO2 deposited thereon and a second layer of TiO2 deposited thereon.

[0085] In one embodiment, the first deposited layer 260 can maximize the visual effect achieved by the first UV molding pattern layer 230 and can impart a metallic texture to the cover 210. In one embodiment, the first deposited layer 260 can have a thickness of about 10 μm to about 700 μm.

[0086] In one embodiment, a first printed layer 270 may be disposed on a first deposited layer 260. In one embodiment, the first printed layer 270 may be formed to be substantially opaque and to shield light, making it impossible to observe the interior of the electronic device 200 from the outside. In one embodiment, the color of the cover 210 as seen from the outside may be affected by the shielding color of the first printed layer 270. For example, the first printed layer 270 may be printed in white or black to shield light after background printing. In this case, as the brightness of the light-shielding printed layer of the first printed layer 270 becomes lower, the light-shielding performance becomes better, but the brightness and chromaticity of the colors observed from the outside of the cover 210 and the thermosetting printed layer 250 may become lower. In one embodiment, since the thermosetting printed layer 250 is disposed between the first UV molding pattern layer 230 and the first printed layer 270, the effects caused by the brightness of the first printed layer 270 can be reduced. For example, even when the brightness and color of the first printed layer 270 are determined to be substantially low to ensure light shielding performance, the color intensity and brightness of the colors observed from the outside of the cover 210 and the thermosetting printed layer 250 will not be reduced by the first printed layer 270.

[0087] In one embodiment, at least some layers of the first multilayer film 310 may have different refractive indices. For example, the adhesive layer 212 may have a refractive index of approximately 1.49. For example, the base film layer 220 may have a refractive index of approximately 1.56. For example, the first UV molding pattern layer 230 may have a refractive index of approximately 1.58. For example, the first layer of the first deposited layer 260 may have a refractive index of approximately 1.48, and the second layer may have a refractive index of approximately 2.35. Due to the difference in refractive index between the interfaces of the first multilayer film 310 according to the embodiment, the amount of reflected light can be increased, and a high-brightness color can be achieved. In one embodiment, when the first deposited layer 260 includes layers with a refractive index for a specific wavelength of light, the color achieved by the first multilayer film 310 can be increased.

[0088] In one embodiment, the first multilayer film 310 can achieve complex patterns through a first region 10 and a second region 20 with different optical properties. For example, the first region 10 can be viewed substantially opaquely because light input to the first region 10 is absorbed and / or reflected by the thermosetting printed layer 250. The second region 20, where the thermosetting printed layer 250 is not provided, can provide visual effects achieved by the base film layer 220, the first UV molding pattern layer 230, the first deposition layer 260, and the first printed layer 270. For example, by using the substantially opaque thermosetting printed layer 250, colors (e.g., colors close to primary colors, such as red, yellow, and purple) can be achieved in the first region 10 based on color or high-brightness (lightness) colors (e.g., silver, black, or white). By using the substantially transparent or opaque first UV molding pattern layer 230, the second region 20 can provide visual effects using the refraction, scattering, or interference of light.

[0089] In one embodiment, the electronic device 200 can have an aesthetic aspect through a combination of first regions 10 and second regions 20 with different optical properties. For example, when the first multilayer film 310 has a pattern of alternating first regions 10 and second regions 20, a new visual effect can be provided. In one embodiment, the pattern having first regions 10 and second regions 20 can be varied according to the desired visual effect.

[0090] Figure 4 This is a cross-sectional view of an electronic device according to another embodiment.

[0091] Figure 4 It can be along Figure 1C A cross-sectional view taken by line A-A' or line B-B'. Figure 4 The thickness of the layers shown may not be proportional to or consistent with the actual scale. Figure 4 In this document, repeated descriptions of configurations with the same reference numerals as those described above will be omitted.

[0092] refer to Figure 4 The electronic device 200 according to the embodiment may include a second multilayer film 410.

[0093] In one embodiment, the second multilayer film 410 may include a second UV molding pattern layer 440, a second deposition layer 460, and a second printing layer 470.

[0094] In one embodiment, the second UV-molded pattern layer 440 may include finely sized patterns (e.g., embossed patterns) to provide a variety of visual effects.

[0095] In one embodiment, the second UV molding pattern layer 440 may include a first portion 442 corresponding to the first region 10 and a second portion 444 corresponding to the second region 20.

[0096] In one embodiment, when viewed from the second direction "2", the first portion 442 may be configured to at least partially overlap the thermosetting printed layer 250. For example, the first portion 442 may be disposed on the thermosetting printed layer 250 in the second direction "2".

[0097] In one embodiment, a second portion 444 of the second UV molding pattern layer 440 may extend from the first portion 442. In another embodiment, the second portion 444 may be disposed within the first UV molding pattern layer 230. For example, the second portion 444 may be disposed on the second direction "2" of the second region 20 of the first UV molding pattern layer 230.

[0098] In one embodiment, the second UV molding pattern layer 440 may have a different refractive index than the first UV molding pattern layer 230 (e.g., about 1.38).

[0099] In one embodiment, the first UV molding pattern layer 230 and / or the second UV molding pattern layer 440 may be implemented with a substantially translucent color.

[0100] In one embodiment, since the thermosetting printed layer 250 is disposed between the first UV molding pattern layer 230 and the second UV molding pattern layer 440, the first UV molding pattern layer 230 and the second UV molding pattern layer 440 can be laminated onto each other without another deposited layer being inserted between them. In one embodiment, more diverse visual effects can be provided by laminating two UV molding pattern layers.

[0101] In one embodiment, the second deposition layer 460 may be disposed on the second UV molding pattern layer 440. In one embodiment, the second deposition layer 460 may be disposed on the second UV molding pattern layer 440 in the first region 10 and the second region 20. In one embodiment, the description of the first deposition layer 260 may be applied to the second deposition layer 460 in substantially the same manner, except for the location of the second deposition layer 460 in the second multilayer film 410. For example, the second deposition layer 460 may include a first portion formed on the second UV molding pattern layer 440 in the first region 10 and a second portion formed on the second UV molding pattern layer 440 in the second region 20.

[0102] In one embodiment, the second printed layer 470 may be disposed on the second deposited layer 460. In one embodiment, except for the location of the second printed layer 470 in the second multilayer film 410, the description of the first printed layer 270 of the first multilayer film 310 may be applied to the second printed layer 470 in substantially the same manner.

[0103] An electronic device 200 according to an embodiment may include at least one UV-molded patterned layer. For example, like... Figure 2 Similar to the first multilayer film 310, the electronic device 200 according to the embodiment may include a first UV-molded patterned layer 230. As another example, like Figure 4 Similar to the second multilayer film 410, the electronic device 200 according to the embodiment may include a first UV molding pattern layer 230 and a second UV molding pattern layer 440.

[0104] In one embodiment, since the second UV molding pattern layer 440 includes the same first region 10 and second region 20 as the first UV molding pattern layer 230, at least one UV molding pattern layer can be understood to include the first region 10 and the second region 20.

[0105] The electronic device according to the above embodiments (e.g., Figure 2 The electronic device 200 may include a cover that defines a portion of the appearance of the electronic device (e.g., Figure 2 The cover 210), attached to the first surface of the cover (e.g., Figure 2 The second surface 210B) of the film layer (e.g., Figure 2 The base film layer 220), and at least one UV-molded patterned layer disposed on the film layer (e.g., Figure 2 The first UV molding pattern layer 230 and / or Figure 4 The second UV molding pattern layer 440), wherein at least one UV molding pattern layer includes a first region (e.g., the first region 10 of FIG. 1) and a second region different from the first region (e.g., Figure 2The second region 20), and a thermosetting printed layer disposed on at least one UV molding pattern layer in the first region (e.g., Figure 2 Thermosetting printed layer 250) and deposited layer (e.g., first deposited layer 260 or Figure 4 The second deposition layer 460 includes a first portion (e.g.,) configured to overlap with a first region of at least one UV molding pattern layer. Figure 2 The first portion 262), and the second portion (e.g., disposed on at least one UV-molded pattern layer in the second region). Figure 2 Part 2 (264).

[0106] In one embodiment, the thermosetting printed layer may not be disposed on at least one UV molding pattern layer in the second region.

[0107] In one embodiment, at least one UV molding pattern layer may include a first UV molding pattern layer (e.g., Figure 2 The first UV molding pattern layer 230) and a first portion of the deposited layer can be formed on the thermosetting printed layer to overlap the first region, and a second portion of the deposited layer can be formed on the first UV molding pattern layer in the second region.

[0108] In one embodiment, at least one UV molding pattern layer may include a first UV molding pattern layer (e.g., Figure 4 The first UV molding pattern layer 230) and the second UV molding pattern layer (e.g., Figure 4 The second UV molding pattern layer 440) and the thermosetting printing layer can be disposed in the first region, between the first UV molding pattern layer and the second UV molding pattern layer.

[0109] In one embodiment, the second UV molding pattern layer may include a first portion corresponding to the first region and disposed on the thermosetting printed layer (e.g., Figure 4 The first portion 442), and the second portion corresponding to the second region, extending from the first portion and disposed on the first UV molding pattern layer (e.g., Figure 4 Part 2 (444).

[0110] In one embodiment, a first portion of the deposited layer may be formed on a first portion of a second UV-molded patterned layer corresponding to a first region, and a second portion of the deposited layer may be formed on a second portion of a second UV-molded patterned layer corresponding to a second region.

[0111] In one embodiment, the electronic device may include a printed layer formed on the deposited layer (e.g., Figure 2 First printing layer 270 or Figure 4 The second printing layer 470).

[0112] In one embodiment, the electronic device may include an adhesive layer between the cover and the membrane layer (e.g., Figure 2 Adhesive layer 212).

[0113] In the embodiments, the thickness of the first UV molding pattern layer can be in the range of 5 μm to 15 μm, the thickness of the second UV molding pattern layer can be in the range of 5 μm to 15 μm, the thickness of the thermosetting printed layer can be in the range of 2 μm to 7 μm, the thickness of the deposited layer can be in the range of 10 nm to 700 nm, and the thickness of the printed layer can be in the range of 2 μm to 70 μm.

[0114] In one embodiment, the cover may comprise resin or glass.

[0115] The electronic device according to the above embodiments (e.g., Figure 2 The cover of the electronic device 200) (e.g., Figure 2 The cover 210 may include a first surface attached to the cover (e.g., Figure 2 The second surface 210B) of the film layer (e.g., Figure 2 The base film layer 220), and the adhesive layer (e.g., between the first surface of the cover and the film layer) Figure 2 The adhesive layer 212), and at least one UV-molded patterned layer disposed on the film layer (e.g., Figure 2 The first UV molding pattern layer 230 and / or Figure 4 The second UV molding pattern layer 440), wherein the at least one UV molding pattern layer includes a first region (e.g., Figure 2 The first region 10) and the second region different from the first region (e.g., Figure 2 The second region 20), a thermosetting printed layer (e.g.,) disposed on at least one UV molding pattern layer in the first region. Figure 2 Thermosetting printed layer 250), deposited layer (e.g., Figure 2 The first sedimentary layer 260 or Figure 4 The second deposition layer 460 includes a first portion (e.g.,) configured to overlap with a first region of the at least one UV molding pattern layer. Figure 2 The first portion 262), and the second portion (e.g., disposed on at least one UV-molded pattern layer in the second region). Figure 2 The second part 264), and the printed layer disposed on the deposited layer (e.g., Figure 2 First printing layer 270 or Figure 4 The second printing layer 470).

[0116] In one embodiment, the thermosetting printed layer may not be disposed on at least one UV molding pattern layer in the second region.

[0117] In one embodiment, at least one UV molding pattern layer may include a first UV molding pattern layer (e.g., Figure 2 The first UV molding pattern layer 230) and a first portion of the deposited layer can be formed on the thermosetting printed layer to overlap the first region, and a second portion of the deposited layer can be formed on the first UV molding pattern layer in the second region.

[0118] In one embodiment, at least one UV molding pattern layer may include a first UV molding pattern layer (e.g., Figure 4 The first UV molding pattern layer 230) and the second UV molding pattern layer (e.g., Figure 4 The second UV molding pattern layer 440) and the thermosetting printing layer can be disposed in the first region, between the first UV molding pattern layer and the second UV molding pattern layer.

[0119] In one embodiment, the second UV molding pattern layer may include a first portion corresponding to the first region and disposed on the thermosetting printed layer (e.g., Figure 4 The first portion 442), and the second portion corresponding to the second region, extending from the first portion and disposed on the first UV molding pattern layer (e.g., Figure 4 Part 2 (444).

[0120] In one embodiment, a first portion of the deposited layer may be formed on a first portion of a second UV-molded patterned layer corresponding to a first region, and a second portion of the deposited layer may be formed on a second portion of a second UV-molded patterned layer corresponding to a second region.

[0121] In one embodiment, the cover may comprise resin or glass.

[0122] Figure 5 This is a flowchart illustrating a method for manufacturing a multilayer film according to an embodiment.

[0123] In the following text, see references Figure 5 as well as Figure 2 and Figure 4 The method for manufacturing the first multilayer film 310 and the second multilayer film 410 will be described.

[0124] refer to Figure 5 In operation 502, the first UV molding pattern layer can be formed in the base film layer. For example, see reference... Figure 2 and 4The first UV molding pattern layer 230 can be formed on the back surface 220B of the base film layer 220. In one embodiment, the first UV molding pattern layer 230 can be formed by applying a UV curing liquid to the back surface 220B of the base film layer 220, applying it to a mold with a three-dimensional pattern, and curing it by irradiating it with ultraviolet light.

[0125] In operation 504, a thermosetting printed layer can be formed in the first region. For example, refer to... Figure 2 and 4 The thermosetting printed layer 250 can be formed on the first UV molding pattern layer 230 in the first region 10. In one embodiment, the thermosetting printed layer 250 can be formed by screen printing or pad printing thermosetting ink only in the first region 10 of the first UV molding pattern layer 230 and then drying it. In one embodiment, various pigments can be applied according to the visual effect to be achieved by the thermosetting printed layer 250.

[0126] In operation 506, a second UV molding pattern layer can be formed. For example, refer to... Figure 4 The second UV molding pattern layer 440 can be formed in the second multilayer film 410, in which the thermosetting printed layer 250 is formed. In one embodiment, the second UV molding pattern layer 440 can be formed by applying a UV curing liquid to a mold with a three-dimensional pattern in a second direction "2" of the first UV molding pattern layer 230 and the thermosetting printed layer 250, and curing it by irradiation with ultraviolet light. Figure 2 In the first multilayer film 310 shown, operation 506 can be omitted.

[0127] In operation 508, a deposition layer can be formed. For example, refer to... Figure 2 The first deposited layer 260 can be formed on the second direction "2" of the first multilayer film 310, wherein a thermosetting printed layer 250 is formed. For example, refer to Figure 4 The second deposition layer 460 can be formed on the second direction "2" of the second multilayer film 410, wherein a second UV molding pattern layer 440 is formed. In one embodiment, the first deposition layer 260 and the second deposition layer 460 can be formed by a deposition process, such as electron beam (E-beam) or sputtering. In one embodiment, the first deposition layer 260 and the second deposition layer 460 can include at least one layer. For example, the first deposition layer 260 and the second deposition layer 460 can include one or more layers, wherein one material is deposited as the target, and can include multiple layers, wherein different materials are deposited as the target. In one embodiment, the type of target material, the number of layers, and / or the thickness of the layers can be varied depending on the visual effect to be achieved by the first deposition layer 260 and the second deposition layer 460.

[0128] In operation 510, a printed layer can be formed. For example, refer to... Figure 2 The first printed layer 270 can be formed on the second direction "2" of the first multilayer film 310, wherein the first deposited layer 260 is formed. For example, refer to Figure 4 The second printed layer 470 can be formed on the second direction "2" of the second multilayer film 410, wherein a second deposited layer 460 is formed. In one embodiment, the first printed layer 270 and the second printed layer 470 can be formed by screen printing or pad printing. In one embodiment, the process of printing the first printed layer 270 and the second printed layer 470 in the same color or different colors according to the thickness and / or color of the first printed layer 270 and the second printed layer 470 can be repeatedly performed.

[0129] In one embodiment, a first multilayer film 310 having a first printed layer 270 and a second multilayer film 410 having a second printed layer 470 may be attached to a second surface 210B of the cover 210. In one embodiment, when the cover 210 comprises resin, the first multilayer film 310 and the second multilayer film 410 may be cut along the boundary of the cover 210 after attachment, and in another embodiment, they may be cut according to the shape of the cover 210 and may be attached when the cover 210 comprises glass. However, this disclosure is not limited thereto.

[0130] In one embodiment, cleaning can be performed after the first multilayer film 310 and the second multilayer film 410 are attached to the cover 210, and performance checks can then be performed. For example, performance checks may include current checks, X-cut checks for testing adhesion, and / or dyne pen tests for testing surface tension.

[0131] The method for manufacturing a multilayer film according to the above embodiments may include, for example, the film layer (e.g., Figure 2 A first UV molding pattern layer (e.g.,) is formed on the base film layer 220. Figure 2 Or the operation of the first UV molding pattern layer 230 of 4 (e.g., Figure 5 Operation 502), wherein the first UV molding pattern layer includes a first region (e.g., Figure 2 Or the first region 10) and a second region different from the first region (e.g., Figure 2 Or the second region 20 of 4), a thermosetting printed layer is formed on the first UV molding pattern layer of the first region (e.g., Figure 2 Or the operation of 4 thermosetting printed layers 250) (e.g., Figure 5 Operation 504), and forming a second UV molding pattern layer on the first UV molding pattern layer in the thermosetting printed layer and the second region (e.g., Figure 4 The second UV-molded patterned layer 440) or the first deposited layer (e.g., Figure 2 The operation of the first sedimentary layer 260) (e.g., Figure 5 Operation 506 or 508).

[0132] The method for manufacturing a multilayer film according to an embodiment may include forming a second deposition layer (e.g., on a second UV-molded patterned layer) on a second UV-molded patterned layer. Figure 4 The operation of the second deposition layer 460) (e.g., Figure 5 Operation 508), and forming a printed layer on the second deposition layer (e.g., Figure 4 The operation of the second printing layer 470) (e.g., Figure 5 Operation 510).

[0133] A method for manufacturing a multilayer film according to an embodiment may include forming a printed layer (e.g., on a first deposited layer) on a first deposited layer. Figure 2 The operation of the first printed layer 270) (e.g., Figure 5 Operation 510).

[0134] Figure 6 This is a block diagram illustrating an electronic device 601 in a network environment 600 according to various embodiments.

[0135] refer to Figure 6 In network environment 600, electronic device 601 can communicate with electronic device 602 via a first network 698 (e.g., a short-range wireless communication network), or with at least one of electronic device 604 or server 608 via a second network 699 (e.g., a long-range wireless communication network). According to one embodiment, electronic device 601 can communicate with electronic device 604 via server 608. According to one embodiment, electronic device 601 may include a processor 620, memory 630, input module 650, sound output module 655, display module 660, audio module 670, sensor module 676, interface 677, connection terminal 678, haptic module 679, camera module 680, power management module 688, battery 689, communication module 690, user identification module (SIM) 696, or antenna module 697. In some embodiments, at least one component (e.g., connection terminal 678) may be omitted from electronic device 601, or one or more other components may be added to electronic device 601. In some embodiments, some components (e.g., sensor module 676, camera module 680, or antenna module 697) may be implemented as a single component (e.g., display module 660).

[0136] Processor 620 can execute software (e.g., program 640) to control at least one other component (e.g., hardware or software component) of electronic device 601 coupled to processor 620, and can perform various data processing or calculations. According to one embodiment, as at least part of data processing or calculation, processor 620 can store commands or data received from another component (e.g., sensor module 676 or communication module 690) in volatile memory 632, process the commands or data stored in volatile memory 632, and store the result data in non-volatile memory 634. According to one embodiment, processor 620 may include a main processor 621 (e.g., a central processing unit (CPU) or application processor (AP)) or an auxiliary processor 623 (e.g., a graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor hub processor, or communication processor (CP)) that may operate independently of or in conjunction with main processor 621. For example, when electronic device 601 includes a main processor 621 and an auxiliary processor 623, the auxiliary processor 623 may be adapted to consume less power than the main processor 621, or be specific to a particular function. The auxiliary processor 623 may be implemented independently of the main processor 621, or as part of the main processor 621.

[0137] The auxiliary processor 623 can replace the main processor 621 when the main processor 621 is inactive (e.g., in a sleep state), or, when the main processor 621 is active (e.g., executing an application), control, together with the main processor 621, at least some functions or states associated with at least one component of the electronic device 601 (e.g., display module 660, sensor module 676, or communication module 690). According to one embodiment, the auxiliary processor 623 (e.g., an image signal processor or a communication processor) can be implemented as part of another component (e.g., camera module 680 or communication module 690) functionally associated with the auxiliary processor 623. According to one embodiment, the auxiliary processor 623 (e.g., a neural processing unit) can include hardware structures specified for processing an artificial intelligence model. The artificial intelligence model can be generated through machine learning. This learning can be performed, for example, by the electronic device 601 performing artificial intelligence, or via a separate server (e.g., server 608). The learning algorithm can include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple layers of artificial neural networks. Artificial neural networks can be deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or combinations of two or more thereof, but are not limited to these. Artificial intelligence models may additionally or alternatively include software structures in addition to hardware structures.

[0138] Memory 630 may store various data used by at least one component of electronic device 601 (e.g., processor 620 or sensor module 676). The various data may include, for example, input or output data of software (e.g., program 640) and associated commands. Memory 630 may include volatile memory 632 or non-volatile memory 634.

[0139] Program 640 can be stored as software in memory 630 and may include, for example, an operating system (OS) 642, middleware 644, or application program 646.

[0140] The input module 650 can receive commands or data from outside the electronic device 601 (e.g., a user) to be used by another component of the electronic device 601 (e.g., the processor 620). The input module 650 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0141] The sound output module 655 can output sound signals to the outside of the electronic device 601. The sound output module 655 may include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented independently of the speaker or as part of the speaker.

[0142] Display module 660 can visually provide information to the outside of electronic device 601 (e.g., to a user). Display module 660 may include, for example, a display, a holographic device, or a projector, and control circuitry to control a corresponding one of the display, holographic device, and projector. According to one embodiment, display module 660 may include a touch sensor adapted to detect touch, or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0143] The audio module 670 can convert sound into electrical signals and vice versa. According to one embodiment, the audio module 670 can obtain sound via the input module 650, or output sound via the sound output module 655 or via headphones of an external electronic device (e.g., electronic device 602) directly (e.g., wired) or wirelessly connected to the electronic device 601.

[0144] Sensor module 676 can detect the operating state of electronic device 601 (e.g., power or temperature) or the environmental state outside electronic device 601 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to one embodiment, sensor module 676 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biosensor, temperature sensor, humidity sensor, or lighting sensor.

[0145] Interface 677 may support one or more specified protocols for direct (e.g., wired) or wireless connection of electronic device 601 to external electronic device (e.g., electronic device 602). According to one embodiment, interface 677 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0146] Connection terminal 678 may include a connector via which electronic device 601 can be physically connected to an external electronic device (e.g., electronic device 602). According to one embodiment, connection terminal 678 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0147] The tactile module 679 can convert electrical signals into mechanical stimulation (e.g., vibration or motion) or electrical stimulation, which can be recognized by a user through their touch or kinesthesia. According to one embodiment, the tactile module 679 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0148] Camera module 680 can capture still or moving images. According to one embodiment, camera module 680 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0149] The power management module 688 can manage the power supplied to the electronic device 601. According to one embodiment, the power management module 688 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0150] Battery 689 can supply power to at least one component of electronic device 601. According to one embodiment, battery 689 may include, for example, a non-rechargeable primary battery cell, a rechargeable secondary battery cell, or a fuel cell cell.

[0151] Communication module 690 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 601 and external electronic devices (e.g., electronic device 602, electronic device 604, or server 608), and perform communication via the established communication channel. Communication module 690 may include one or more communication processors that can operate independently of processor 620 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to one embodiment, communication module 690 may include wireless communication module 692 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 694 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 698 (e.g., a short-range communication network, such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 699 (e.g., a long-range communication network, such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These different types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components that are separate from each other (e.g., multiple chips). The wireless communication module 692 can use user information (e.g., International Mobile Subscriber Identity (IMSI)) stored in the user identification module 696 to identify and authenticate the electronic device 601 in a communication network such as the first network 698 or the second network 699.

[0152] Wireless communication module 692 can support 5G networks and next-generation communication technologies, such as New Radio (NR) access technologies, following 4G networks. NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communications (mMTC), or ultra-reliable and low-latency communications (URLLC). Wireless communication module 692 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 692 can support various technologies used to ensure performance in high-frequency bands, such as beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 692 can support various requirements specified in electronic device 601, external electronic device (e.g., electronic device 604), or network system (e.g., second network 699). According to one embodiment, the wireless communication module 692 may support peak data rates (e.g., 20 Gbps or higher) for implementing eMBB, lost coverage (e.g., 664 dB or lower) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or lower for each of the downlink (DL) and uplink (UL), or a round trip of 6 ms or lower) for implementing URLLC.

[0153] Antenna module 697 can transmit or receive signals or power to or from the outside of electronic device 601 (e.g., external electronic device). According to one embodiment, antenna module 697 may include an antenna comprising a radiating element composed of conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to one embodiment, antenna module 697 may include multiple antennas (e.g., an array antenna). In this case, for example, communication module 690 (e.g., wireless communication module 692) can select at least one antenna from the multiple antennas that is suitable for a communication scheme used in a communication network (e.g., a first network 698 or a second network 699). Signals or power can then be transmitted or received between communication module 690 and external electronic device via the selected at least one antenna. According to one embodiment, another component besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 697.

[0154] According to various embodiments, antenna module 697 can form a millimeter-wave antenna module. According to one embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., millimeter-wave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band.

[0155] At least some of the aforementioned components can be interconnected and transmit signals (e.g., commands or data) between them via peripheral communication schemes (e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0156] According to one embodiment, commands or data can be sent or received between electronic device 601 and external electronic device 604 via server 608 connected to a second network 699. Each of electronic devices 602 or 604 can be a device of the same or different type as electronic device 601. According to one embodiment, all or some operations to be performed at electronic device 601 can be performed at one or more of external electronic devices 602, 604, or 608. For example, if electronic device 601 is required to automatically perform a function or service, or in response to a request from a user or another device, electronic device 601 may request one or more external electronic devices to perform at least a portion of the function or service, in addition to performing the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the requested function or service, or additional functions or services related to the request, and transmit the result of the performance to electronic device 601. Electronic device 601 may provide the result, with or without further processing of the result, as at least part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. Electronic device 601 can use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 604 may include Internet of Things (IoT) devices. Server 608 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, external electronic device 604 or server 608 may be included in a second network 699. Electronic device 601 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0157] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer equipment, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0158] It should be understood that the various embodiments of this disclosure and the terminology used herein are not intended to limit the technical features set forth herein to the particular embodiments, but rather to include various modifications, equivalents, or substitutions of the corresponding embodiments. Regarding the description of the drawings, similar reference numerals may be used to denote similar or related elements. It should be understood that the singular form of a noun corresponding to an item may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any or all possible combinations of items enumerated together in the corresponding phrase. As used herein, terms such as “first” and “second” or “primary” and “secondary” may be used simply to distinguish one component from another and do not limit other aspects of the components (e.g., importance or order). It should be understood that if an element (e.g., the first element) is referred to as “connected to another element (e.g., the second element),” “linked to,” “connected to,” or “connected to” with or without the terms “operably” or “communically”, it means that the element can be connected to the other element directly (e.g., wired), wirelessly, or via a third element.

[0159] As used in conjunction with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "component," or "circuit." A module may be a single integral component, or its smallest unit or portion, adapted to perform one or more functions. For example, according to one embodiment, the module may be implemented as an application-specific integrated circuit (ASIC).

[0160] The various embodiments described herein can be implemented as software (e.g., program 640), comprising one or more instructions stored in a machine-readable storage medium (e.g., internal memory 636 or external memory 638). For example, a processor (e.g., processor 620) of the machine (e.g., electronic device 601) can invoke at least one of the one or more instructions stored in the storage medium and execute it under the processor's control, with or without one or more other components. This allows the machine to be operated according to the invoked at least one instruction to perform at least one function. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between locations where data is semi-permanently stored in the storage medium and locations where data is temporarily stored in the storage medium.

[0161] According to one embodiment, the methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., an optical disc read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM Online distribution (e.g., downloading or uploading) or direct distribution between two user devices (e.g., smartphones). If distributed online, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as the memory of a manufacturer's server, an app store's server, or a relay server.

[0162] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be respectively located in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each of the multiple components in the same or similar manner as before integration by the corresponding one of the multiple components. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0163] Although this disclosure has been described with reference to various embodiments, various changes and modifications may be suggested to those skilled in the art. This disclosure is intended to include such changes and modifications that fall within the scope of the appended claims.

Claims

1. An electronic device, comprising: A cover that forms part of the exterior of the electronic device; A membrane layer is attached to the first surface of the cover; At least one ultraviolet (UV) molding pattern layer is disposed on the film layer, wherein the at least one UV molding pattern layer includes a first region and a second region different from the first region; A thermosetting printed layer is disposed on at least one UV-molded pattern layer in the first region; and Depositional layers, including: The first part is configured to overlap with a first region of the at least one UV-molded patterned layer, and The second part is disposed on and in contact with the at least one UV molding pattern layer in the second region. The thermosetting printed layer is disposed between the at least one UV molding pattern layer and the first portion of the deposited layer.

2. The electronic device according to claim 1, wherein, The thermosetting printed layer is not disposed on the at least one UV molding pattern layer in the second region.

3. The electronic device according to claim 1, wherein: The at least one UV molding pattern layer includes a first UV molding pattern layer. The first portion of the deposited layer is formed on the thermosetting printed layer to overlap the first region, and The second portion of the deposited layer is formed on the first UV-molded patterned layer in the second region.

4. The electronic device according to claim 1, wherein: The at least one UV molding pattern layer includes a first UV molding pattern layer and a second UV molding pattern layer, and The thermosetting printed layer is disposed in the first region, located between the first UV molding pattern layer and the second UV molding pattern layer.

5. The electronic device according to claim 4, wherein, The second UV-molded patterned layer includes: The first part corresponds to the first region and is disposed on the thermosetting printed layer; and The second part, corresponding to the second region, extends from the first part and is disposed on the first UV molding pattern layer.

6. The electronic device according to claim 5, wherein: The first portion of the deposited layer is formed on the first portion of the second UV molding pattern layer corresponding to the first region, and The second portion of the deposited layer is formed on the second portion of the second UV molding pattern layer corresponding to the second region.

7. The electronic device according to claim 6, comprising: A printed layer formed on the deposited layer.

8. The electronic device according to claim 7, comprising: An adhesive layer is inserted between the cap and the film layer.

9. The electronic device according to claim 8, wherein: The thickness of the first UV-molded patterned layer is in the range of 5 μm to 15 μm. The thickness of the second UV-molded patterned layer is in the range of 5 μm to 15 μm. The thickness of the thermosetting printed layer is in the range of 2μm to 7μm. The thickness of the deposited layer is in the range of 10 nm to 700 nm, and The thickness of the printed layer is in the range of 2 μm to 70 μm.

10. The electronic device according to claim 1, wherein, The cover may be made of resin or glass.

11. The electronic device according to claim 1, wherein, The first region and the second region have different optical properties.

12. The electronic device according to claim 1, wherein, The cover has a pattern in which the first region and the second region are alternately arranged.

13. A method for manufacturing a multilayer film, the method comprising: At least one UV molding pattern layer is formed on the film layer, the at least one UV molding pattern layer including a first UV molding pattern layer, wherein the first UV molding pattern layer includes a first region and a second region different from the first region; A thermosetting printed layer is formed on the first UV molding pattern layer in the first region; and A deposition layer is formed on at least one UV-molded pattern layer and a thermosetting printed layer in the second region. The deposition layer includes: The first part is configured to overlap with the first region of the at least one UV-molded patterned layer, and The second part is disposed on and in contact with the at least one UV molding pattern layer in the second region. The thermosetting printed layer is disposed between the at least one UV molding pattern layer and the first portion of the deposited layer.

14. The method of claim 13, further comprising: A printing layer is formed on the deposition layer. Wherein, the at least one UV molding pattern layer includes a first UV molding pattern layer formed on the film layer and a second UV molding pattern layer formed on the first UV molding pattern layer. The deposited layer is formed on and in contact with the second UV molding pattern layer.

15. The method according to claim 13, wherein, The deposited layer is formed on the first UV-molded patterned layer and is in contact with the first UV-molded patterned layer in the second region.

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