Transfer device, transfer system, transfer method, and chip pre-detection method

Abstract

The application provides a transfer device, a transfer system, a transfer method and a chip pre-detection method. The transfer device is used for transferring light emitting chips on a growth substrate to a display back plate. The transfer device comprises a first transfer member and a second transfer member which are arranged in a stack. The first transfer member is movable relative to the second transfer member. The first transfer member is provided with a plurality of first through holes for placing the light emitting chips. The spacing between adjacent first through holes is the same as the spacing between adjacent light emitting chips on the growth substrate. The second transfer member is provided with a plurality of second through holes. The spacing between adjacent second through holes is the same as the spacing between adjacent pads on the display back plate. The width of the second through hole is not less than the width of the first through hole. In the initial state, the second through hole is staggered with the first through hole in the stacking direction. The transfer device can efficiently transfer the light emitting chips to the back plate through the relative displacement of the first transfer member and the second transfer member in the stacking direction perpendicular to the transfer device.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a transfer apparatus, transfer system, transfer method, and chip pre-testing method. Background Technology

[0002] Micro-LED is an emerging display technology. Compared to conventional display technologies, Micro-LED offers advantages such as fast response time, self-illumination, high contrast, long lifespan, and high photoelectric efficiency. In the Micro-LED industry, millions or even tens of millions of LED chips are transferred from a growth substrate to a temporary storage substrate, and then from the temporary storage substrate to a backplane. However, this transfer process is complex and cannot be performed on the Micro-LED chips during the transfer, requiring additional testing and incurring high costs. Therefore, achieving flexible and low-cost Micro-LED chip transfer is a pressing issue that needs to be addressed. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the purpose of this application is to provide a transfer apparatus and a transfer method, which aims to solve the technical problem of how to achieve flexible and low-cost transfer of Micro-LED chips.

[0004] The first aspect of this application provides a transfer device for transferring a light-emitting chip on a growth substrate to a display backplane; it includes a first transfer member and a second transfer member stacked together, wherein the first transfer member is movable relative to the second transfer member;

[0005] The first transfer member has a plurality of first through holes for placing the light-emitting chip, and the spacing between adjacent first through holes is the same as the spacing between adjacent light-emitting chips on the growth substrate;

[0006] The second transfer member has a plurality of second through holes, and the spacing between adjacent second through holes is the same as the spacing between adjacent pads on the display back panel;

[0007] Wherein, the width of the second through hole is not less than the width of the first through hole, and in the initial state, the second through hole and the first through hole are offset in the stacking direction.

[0008] The first transfer member and the second transfer member can be displaced relative to each other along a direction perpendicular to the stacking direction of the transfer device. For example, the first transfer member can be displaced left or right along a direction perpendicular to the stacking direction of the transfer device; or the second transfer member can be displaced left or right along a direction perpendicular to the stacking direction of the transfer device; or the first transfer member and the second transfer member can be displaced in opposite directions perpendicular to the stacking direction of the transfer device. All of these can align and connect the first through hole and the second through hole, so that the qualified light-emitting chip can fall from the first through hole and the second through hole onto the back plate, achieving mass transfer.

[0009] The spacing between adjacent first vias is the same as the spacing between adjacent light-emitting chips on the growth substrate, so that when the first via is aligned with the light-emitting chip on the growth substrate, the light-emitting chip peeled off from the growth substrate can fall directly into the first via. Similarly, the spacing between adjacent second vias is the same as the spacing between adjacent pads on the display backplane, so that when the second via is aligned with the pad, the light-emitting chip falls from the second via onto the pad.

[0010] The aforementioned transfer device, through the relative displacement of the first transfer member and the second transfer member along a stacking direction perpendicular to the transfer device, can efficiently transfer the light-emitting chip to the backplane.

[0011] Optionally, at least two first through holes are provided between adjacent second through holes along a direction perpendicular to the stacking direction.

[0012] Optionally, the first transfer member has a plurality of spaced-apart isolation portions, adjacent isolation portions forming the first through hole, and the width of the isolation portion is not less than the diameter of the second through hole along the stacking direction perpendicular to the stacking direction.

[0013] Based on the same inventive concept, a second aspect of this application provides a transfer system with detection function, including a detection element and a transfer device as described above.

[0014] The detection element is located at the position of the second transfer element corresponding to the first through hole. The detection element is used to perform photoelectric testing, and in the initial state, the detection element is exposed through the first through hole.

[0015] The aforementioned transfer system with detection function enables the detection of the light-emitting chip before the transfer process through the detection device, thereby shortening the transfer process and reducing costs.

[0016] Optionally, the transfer system with detection function further includes detection auxiliary components;

[0017] The detection aid is configured to apply pressure to the light-emitting chip from the side away from the second transfer member when the light-emitting chip is placed in the first through hole, so that the detection aid is electrically connected to the electrode of the light-emitting chip.

[0018] Optionally, the surface of the detection element exposed through the first through hole is flush with the side of the second transfer element and the side of the first transfer element that are in contact with it.

[0019] Optionally, the detection element is magnetic, and the light-emitting chip includes electrodes. When the light-emitting chip is placed in the first through hole, the detection element and the electrodes attract each other, so that the detection element and the electrodes are electrically connected.

[0020] Optionally, the height of the light-emitting chip along the stacking direction is not less than the thickness of the first transfer member.

[0021] Optionally, the detection auxiliary component is a light-transmitting substrate;

[0022] The light-transmitting substrate is configured to apply pressure to all the light-emitting chips from the side away from the second transfer member, so that the electrodes of all the light-emitting chips are electrically connected to the corresponding detection member.

[0023] Optionally, the detection aid includes a detection aid body, which is hollow and has one end connected to a vacuum tube, and the other end used to abut against the light-emitting chip;

[0024] The detection auxiliary body is configured to provide pressure against the light-emitting chip and the adsorption force required to adsorb the light-emitting chip.

[0025] Based on the same inventive concept, a third aspect of this application provides a transfer method, the transfer method comprising:

[0026] A transfer device as described above is provided, wherein the light-emitting chip is loaded in the first through-hole of the transfer device;

[0027] Align the transfer device with a display backplate having a plurality of solder pads;

[0028] After alignment is completed, the first transfer member and the second transfer member are controlled to move relative to each other so as to transfer the light-emitting chip in the first through hole to the pad of the display back plate via the second through hole;

[0029] A bonding process is performed on the light-emitting chip transferred to the pad.

[0030] Optionally, the step of aligning the transfer device with a display backplate having a plurality of pads includes:

[0031] Control the overall movement of the transfer device to align the second through hole or a portion of the first through hole with the pads of the display back panel; or

[0032] Control the overall movement of the display back panel to align the pads with the second through-hole or a portion of the first through-hole; or

[0033] Simultaneously control the display backplate and the transfer device to move in opposite directions so that the second through hole or part of the first through hole is aligned with the pad.

[0034] Optionally, when a portion of the first through-hole is aligned with the pad, the step of controlling the relative movement of the first transfer member and the second transfer member includes:

[0035] Keeping the first transfer member stationary, control the second transfer member to move so that the second through hole communicates with the aligned portion of the first through hole.

[0036] Optionally, when the second through-hole is aligned with the pad, the step of controlling the relative movement of the first transfer member and the second transfer member includes:

[0037] Keeping the second transfer member stationary, control the first transfer member to move so that the second through hole communicates with a portion of the first through hole.

[0038] Based on the same inventive concept, a fourth aspect of this application provides a chip pre-detection method, based on the transfer system with detection function as described above, the transfer system including a transfer device and a detection element, the chip pre-detection method comprising:

[0039] Power is applied to the detection device to perform photoelectric testing on the light-emitting chip placed on the detection device;

[0040] Replace any light-emitting chips that fail the photoelectric test.

[0041] Optionally, before powering on the detection device, the chip pre-detection method further includes:

[0042] Pressure is applied to one or all of the light-emitting chips from the side away from the second transfer element to achieve electrical connection between the light-emitting chips and the detection element. Attached Figure Description

[0043] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0044] Figure 1 This is a partial top view of a transfer device according to one embodiment of this application.

[0045] Figure 2 for Figure 1 A partial sectional view along line II.

[0046] Figure 3 This is a schematic diagram illustrating the transfer process according to one embodiment of this application.

[0047] Figure 4 This is a schematic diagram of a growth substrate provided in one embodiment of this application.

[0048] Figure 5 This is a partial cross-sectional schematic diagram of a transfer system provided in one embodiment of this application.

[0049] Figure 6 A schematic diagram of a detection auxiliary component provided in one embodiment of this application.

[0050] Figure 7 for Figure 6 A magnified view of a portion of the central circular dashed box.

[0051] Figure 8 This is a partial cross-sectional schematic diagram of a transfer system provided for another embodiment of this application.

[0052] Figure 9 A schematic diagram of a detection aid provided for another embodiment of this application.

[0053] Figure 10 This is a schematic flowchart of a transfer method provided in one embodiment of this application.

[0054] Figure 11 This is a schematic flowchart of a chip pre-detection method provided in one embodiment of this application.

[0055] Explanation of reference numerals in the attached figures:

[0056] 1-Transfer device; 11-First transfer component; 111-First through hole; 112-Isolation part; 12-Second transfer component; 121-Second through hole; 122-Support part; 2-Growth substrate; 3-Light emission chip; 31-Electrode; 4-Display backplate; 41-Pad; 5-Transfer system; 51-Detection component; 52-Detection auxiliary component; 521-Detection auxiliary body; 522-Vacuum pipeline. Detailed Implementation

[0057] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0059] The problem with existing solutions is how to achieve flexible and low-cost transfer of Micro-LED chips.

[0060] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0061] This application provides a transfer device 1, which can be found in conjunction with the following description. Figures 1-3 , Figure 1 A partial top view of a transfer device according to one embodiment of this application; Figure 2 for Figure 1 A partial sectional view along line II; Figure 3 This is a schematic diagram of a transfer process according to an embodiment of this application. The transfer device 1 is used to transfer the light-emitting chip 3 on the growth substrate 2 to the display backplate 4; it includes a first transfer member 11 and a second transfer member 12 stacked together. The first transfer member 11 is movable relative to the second transfer member 12. The first transfer member 11 has a plurality of first through holes 111 for placing the light-emitting chip 3, and the spacing between adjacent first through holes 111 is the same as the spacing between adjacent light-emitting chips 3 on the growth substrate 2. The second transfer member 12 has a plurality of second through holes 121, and the spacing between adjacent second through holes 121 is the same as the spacing between adjacent pads 41 on the display backplate 4. The width of the second through hole 121 is not less than the width of the first through hole 111, and in the initial state, the second through hole 121 and the first through hole 111 are offset in the stacking direction.

[0062] It should be noted that please refer to the following as well. Figure 4 , Figure 4 This is a schematic diagram of a growth substrate provided in one embodiment of this application. The light-emitting chip 3 is a Micro-LED chip. In the fabrication technology of the light-emitting chip 3, it is necessary to first transfer the mass-produced light-emitting chips 3 into the first through-hole 111. Specifically, laser lift-off technology can be used to peel the light-emitting chip 3 from the growth substrate 2 into the first through-hole 111. In this embodiment, as... Figure 1As shown, the first through hole 111 and the light-emitting chip 3 disposed within the first through hole 111 are illustrated using a circular shape as an example, which does not imply that this application limits the shape of the first through hole 111 and the light-emitting chip 3. It is understood that in other possible embodiments, the shape of the first through hole 111 and the light-emitting chip 3 can be any shape such as circular, triangular, rectangular, or elliptical, and the shapes of the first through hole 111 and the light-emitting chip 3 can also be different, as long as it does not affect the fact that the light-emitting chip 3 can be accommodated within the first through hole 111, this application does not impose any restrictions on this.

[0063] In this embodiment, the first transfer member 11 and the second transfer member 12 can be displaced relative to each other along a stacking direction perpendicular to the transfer device 1. For example, the first transfer member 11 can be displaced left or right along a stacking direction perpendicular to the transfer device 1; or the second transfer member 12 can be displaced left or right along a stacking direction perpendicular to the transfer device 1; or the first transfer member 11 and the second transfer member 12 can be displaced in opposite directions perpendicular to the stacking direction of the transfer device 1. All of these can make the first through hole 111 and the second through hole 121 aligned and connected, so that the qualified light-emitting chip 3 falls from the first through hole 111 and the second through hole 121 onto the back plate, realizing mass transfer.

[0064] Understandably, in some possible implementations, the first transfer member 11 and the second transfer member 12 can be driven to generate displacement by a driving device disposed on both sides of the first transfer member 11 and the second transfer member 12 along the direction perpendicular to the stacking direction. The displacement of the first transfer member 11 and the second transfer member 12 can also be achieved by other implementations. This application does not limit this.

[0065] In this embodiment, such as Figure 2 As shown, in the initial state, the first transfer member 11 has a plurality of spaced-apart isolation portions 112, with two adjacent isolation portions 112 forming the first through hole 111; the second transfer member 12 has a plurality of spaced-apart support portions 122, with two adjacent support portions 122 forming the second through hole 121. When the light-emitting chip 3 is placed in the first through hole 111, the two adjacent isolation portions 112 and the support portions 122 surround the light-emitting chip 3. The isolation portions 112 prevent the light-emitting chip 3 from shifting along a direction perpendicular to the stacking direction, and the support portions 122 provide support for the light-emitting chip 3.

[0066] Understandably, such as Figure 2As shown, the spacing between adjacent first through holes 111 is the same as the spacing between adjacent light-emitting chips 3 on the growth substrate 2, so that when the first through hole 111 is aligned with the light-emitting chip 3 on the growth substrate 2, the light-emitting chip 3 peeled off from the growth substrate 2 can fall directly into the first through hole 111. Similarly, as Figure 3 As shown, the spacing between adjacent second through holes 121 is the same as the spacing between adjacent pads 41 on the display backplate 4, so that when the second through hole 121 is aligned with the pad 41, the light-emitting chip 3 falls from the second through hole 121 onto the pad 41.

[0067] Specifically, the first through-hole 111 and the second through-hole 121 have the same diameter and the same width as the light-emitting chip 3 along the direction perpendicular to the stacking direction, so that the light-emitting chip 3 can pass through the first through-hole 111 and the second through-hole 121. It is understood that in other possible embodiments, the diameters of the first through-hole 111 and the second through-hole 121 can have other relationships, as long as it does not affect the passage of the light-emitting unit through the first through-hole 111 and the second through-hole 121; this application does not impose any limitations on this.

[0068] In this embodiment, the material of the first transfer member 11 may include a sapphire substrate, a silicon substrate, a glass substrate, a silicon carbide substrate, and a quartz substrate, etc.; the material of the second transfer member 12 may include a silicon substrate, a glass substrate, etc.

[0069] The aforementioned transfer device 1, through the relative displacement of the first transfer member 11 and the second transfer member 12 along a stacking direction perpendicular to the transfer device 1, can efficiently transfer the light-emitting chip 3 to the back plate.

[0070] Please refer to it again. Figure 2 and Figure 3 , Figure 2 for Figure 1 A partial sectional view along line II; Figure 3 This is a schematic diagram of a transfer process according to an embodiment of this application. At least two first through holes 111 are provided between adjacent second through holes 121 along a direction perpendicular to the stacking direction.

[0071] In this embodiment, after the first transfer member 11 and the second transfer member 12 are displaced relative to each other, the first through hole 111 and the second through hole 121 are aligned. The light-emitting chip 3 located in the first through hole 111 falls from the second through hole 121 to the pad 41, while the light-emitting chip 3 remains in the first through hole 111. After the second through hole 121 is aligned with the part of the first through hole 111, the light-emitting chip 3 falls from the second through hole 121 to the pad 41.

[0072] Understandably, at least two first through holes 111 are provided between adjacent second through holes 121 along a direction perpendicular to the stacking direction; in other words, as... Figure 3 As shown, the distance between adjacent first through holes 111 is not equal to the distance between adjacent pads 41, thereby enabling the transfer of the light-emitting chips 3 with unequal spacing. That is, after the light-emitting chips 3 are transferred, the spacing between adjacent light-emitting chips 3 changes, which improves the application scenarios and adaptability of the transfer device 1.

[0073] Understandably, such as Figure 2 As shown, this application illustrates an example where each of the first through holes 111 contains a single light-emitting chip 3. In other possible embodiments, each of the first through holes 111 may also contain multiple light-emitting chips 3. Specifically, the method for transferring the light-emitting chips 3 can be derived by referring to the example where each of the first through holes 111 contains a single light-emitting chip 3, and will not be described in detail here.

[0074] In this embodiment, such as Figure 2 As shown, at least two first through holes 111 are provided between adjacent second through holes 121 along the stacking direction. It can be understood that in other possible embodiments, the number of first through holes 111 between adjacent second through holes 121 along the stacking direction may be other, and this application does not limit this.

[0075] Please refer to it again. Figure 2 , Figure 2 for Figure 1 A partial cross-sectional view along line II. The first transfer member 11 has a plurality of spaced-apart isolation portions 112, and adjacent isolation portions 112 surround to form the first through hole 111. Along the stacking direction perpendicular to the stacking direction, the width of the isolation portion 112 is not less than the diameter of the second through hole 121.

[0076] Specifically, the width of the isolation portion 112 is not less than the diameter of the second through hole 121. In other words, the isolation portion 112 covers the second through hole 121 in the initial state, thereby preventing the isolation portion 112 or the light-emitting chip 3 from falling onto the display back panel 4 through the second through hole 121 in the initial state.

[0077] Correspondingly, in this embodiment, such as Figure 2 As shown, in the initial state, the support portion 122 covers three of the first through holes 111. It can be understood that in other possible embodiments, in the initial state, the support portion 122 covers at least two of the first through holes 111.

[0078] Based on the same inventive concept, this application also provides a transfer system 5 with detection function, please refer to it as well. Figure 5 , Figure 5 This is a partial cross-sectional schematic diagram of a transfer system provided in one embodiment of this application. It includes a detection element 51 and a transfer device 1 as described above; wherein, the detection element 51 is disposed at the position of the second transfer element 12 corresponding to the first through hole 111, the detection element 51 is used to perform photoelectric testing, and in the initial state, the detection element 51 is exposed through the first through hole 111.

[0079] Specifically, when the light-emitting chip 3 is placed in the first through hole 111, the detection element 51 is disposed at the position of the second transfer element 12 corresponding to the first through hole 111, and the detection element 51 is electrically connected to the electrode 31 of the light-emitting chip 3, thereby realizing photoelectric testing of the light-emitting chip 3.

[0080] In this embodiment, photoelectric testing refers to the process whereby, after the detection element 51 is electrically connected to the electrode 31 of the light-emitting chip 3, the detection element 51 is energized to apply current to the electrode 31 of the light-emitting chip 3, in order to test whether the light-emitting chip 3 can emit light normally. It can be understood that by performing photoelectric testing on the light-emitting chip 3 using the detection element 51, the process of testing the light-emitting chip 3 after or before transfer is eliminated.

[0081] The aforementioned transfer system 5 with detection function enables the detection of the light-emitting chip 3 before the transfer process through the detection element 51, thereby shortening the transfer process and reducing costs.

[0082] Please refer to the following: Figure 6 , Figure 6This is a schematic diagram of a detection aid provided in one embodiment of this application. The transfer system 5 with detection function further includes a detection aid 52; the detection aid 52 is configured to apply pressure to the light-emitting chip 3 from the side away from the second transfer member 12 when the light-emitting chip 3 is placed in the first through hole 111, so that the detection aid 51 is electrically connected to the electrode 31 of the light-emitting chip 3.

[0083] Specifically, the detection auxiliary component 52 abuts against the light-emitting chip 3, thereby fixing the light-emitting chip 3 in the first through hole 111 by the weight of the detection auxiliary component 52 or by the pressure applied by the detection auxiliary component 52, and establishing a good electrical connection between the detection component 51 and the electrode 31.

[0084] In this embodiment, the detection aid 52 is a column, and the width of the detection aid 52 perpendicular to the stacking direction is smaller than the diameter of the first through hole 111. When the height of the isolation portion 112 along the stacking direction is greater than or equal to the height of the light-emitting chip 3, since the width of the detection aid 52 perpendicular to the stacking direction is smaller than the diameter of the first through hole 111, the detection aid 52 can enter the first through hole 111 from the side of the first through hole 111 away from the second transfer member 12 and abut against the light-emitting chip 3, so that the detection aid 51 is electrically connected to the electrode 31 of the light-emitting chip 3.

[0085] Understandably, in other possible implementations, as long as the detection auxiliary 52 enables the detection element 51 to be electrically connected to the electrode 31 of the light-emitting chip 3, this application does not limit the structure of the detection auxiliary 52.

[0086] Please refer to the following: Figure 7 , Figure 7 for Figure 6 A partially enlarged schematic diagram of the circular dashed frame. The surface of the detection element 51 exposed through the first through hole 111 is flush with the side of the second transfer element 12 and the first transfer element 11 that are in contact with it.

[0087] Specifically, the surface of the detection element 51 exposed through the first through hole 111 is flush with the side of the second transfer element 12 that contacts the first transfer element 11. In other words, the surface of the detection element 51 near the first transfer element 11 is flush with the surface of the second transfer element 12 near the first transfer element 11.

[0088] Understandably, the first through hole 111 is more stable when the light-emitting chip 3 is placed inside, because the surface of the detection element 51 protrudes from the surface of the second transfer element 12 near the first transfer element 11. In this embodiment, the surface of the detection element 51 exposed through the first through hole 111 is flush with the surface of the second transfer element 12 and the first transfer element 11 that are in contact with it, which is beneficial for the detection element 51 to establish a good electrical connection with the electrode 31 of the light-emitting chip 3.

[0089] Meanwhile, the surface of the detection element 51 exposed through the first through hole 111 is flush with the side of the second transfer element 12 and the first transfer element 11 that are in contact with it, which can prevent the electrode 31 of the light-emitting chip 3 and the detection element 51 from blocking each other when the first transfer element 11 and the second transfer element 12 are displaced along the direction perpendicular to the stacking direction.

[0090] The detection element 51 is magnetic, and the light-emitting chip 3 includes an electrode 31. When the light-emitting chip 3 is placed in the first through hole 111, the detection element 51 and the electrode 31 attract each other, so that the detection element 51 and the electrode 31 are electrically connected.

[0091] In this embodiment, a magnetic material is incorporated into the fabrication process of the detection element 51, thereby making the detection element 51 magnetic. The electrode 31 may be made of a metallic material, or, during the fabrication process of the electrode 31, a magnetic material may also be incorporated, making the electrode 31 magnetic as well, thereby causing the detection element 51 and the electrode 31 to attract each other. Specifically, the incorporated magnetic material includes at least one of permanent magnet alloys, neodymium iron boron permanent magnet materials, permanent magnet ferrites, rare earth permanent magnet materials, and composite permanent magnet materials.

[0092] Understandably, the detection element 51 and the electrode 31 attract each other. On the one hand, this can fix the light-emitting chip 3 in the first through hole 111. On the other hand, it can establish a good electrical connection between the detection element 51 and the electrode 31, increasing the reliability of the detection of the light-emitting chip 3 after the detection element 51 is powered on.

[0093] Please refer to the following: Figure 8 , Figure 8 This is a partial cross-sectional schematic diagram of a transfer system provided in another embodiment of this application. The height of the light-emitting chip 3 along the stacking direction is not less than the thickness of the first transfer member 11.

[0094] Specifically, the height of the light-emitting chip 3 along the stacking direction is not less than the thickness of the first transfer member 11. In other words, the height of the isolation portion 112 of the first transfer member 11 along the stacking direction is less than the height of the light-emitting chip 3.

[0095] Understandably, in other possible implementations, depending on the size specifications of the light-emitting chip 3, the height of the light-emitting chip 3 along the stacking direction may be less than or equal to the thickness of the first transfer member 11, or it may be greater than the thickness of the first transfer member 11. This application does not impose any restrictions on this.

[0096] In this embodiment, such as Figure 8 As shown, the detection auxiliary component 52 is a light-transmitting substrate; the light-transmitting substrate is configured to apply pressure to all the light-emitting chips 3 from the side away from the second transfer component 12, so that the electrodes 31 of all the light-emitting chips 3 are electrically connected to the corresponding detection component 51.

[0097] Specifically, since the height of the light-emitting chip 3 along the stacking direction is not less than the thickness of the first transfer member 11, the transparent substrate is not obstructed by the isolation part 112, so that the transparent substrate can simultaneously apply pressure toward the second transfer member 12 to all the light-emitting chips 3. In other words, the electrodes 31 of all the light-emitting chips 3 can be electrically connected to the detection member 51 at the same time, thereby realizing the simultaneous detection of all the light-emitting chips 3 and greatly improving the detection efficiency.

[0098] Meanwhile, the transparent substrate is light-transmitting. When the detection element 51 performs photoelectric detection on the light-emitting chip 3, the human eye or visual system can directly observe through the transparent substrate whether the light-emitting chip 3 can emit light normally, thereby making it easier to determine whether the photoelectric detection of the light-emitting chip 3 is qualified.

[0099] Understandably, in other possible implementations, pressure can also be applied to the light-emitting chip 3 by other types of devices to make the detection element 51 electrically connected to the electrode 31 of the light-emitting chip 3, and this application does not limit this.

[0100] Please refer to the following: Figure 9 , Figure 9 This is a schematic diagram of a detection auxiliary component provided in another embodiment of this application. The detection auxiliary component 52 includes a detection auxiliary body 521, which is hollow and has one end connected to a vacuum tube 522, and the other end used to abut against the light-emitting chip 3; the detection auxiliary body 521 is configured to provide the pressure abutting against the light-emitting chip 3 and the adsorption force required to adsorb the light-emitting chip 3.

[0101] In this embodiment, the detection auxiliary body 521 can be connected to a device such as an air pump through the vacuum pipeline 522. When the air pump is working, it increases or decreases the air pressure inside the detection auxiliary body 521 through the vacuum pipeline 522, thereby enabling the detection auxiliary body 521 to provide the pressure required to abut against the light-emitting chip 3 or the adsorption force required to adsorb the light-emitting chip 3.

[0102] Specifically, the air pressure inside the detection auxiliary body 521 is increased by the vacuum tube 522, and the detection auxiliary body 521 provides pressure against the light-emitting chip 3 so that the detection element 51 and the electrode 31 of the light-emitting chip 3 can establish a good electrical connection.

[0103] Understandably, after the detection element 51 performs photoelectric detection on the light-emitting chip 3, it is also necessary to remove the unqualified light-emitting chip 3 from the first through hole 111 and replace it with a new light-emitting chip 3 to re-perform photoelectric detection.

[0104] In this embodiment, the air pressure inside the detection auxiliary body 521 is reduced by the vacuum pipeline 522. The detection auxiliary body 521 provides an adsorption force to adsorb the light-emitting chip 3, so that the unqualified light-emitting chip 3 is adsorbed onto the detection auxiliary body 521 and removed from the first through hole 111 along with the detection auxiliary body 521. After that, the detection auxiliary body 521 releases its adsorption from the light-emitting chip 3 and abuts against the side of the new light-emitting chip 3 or the side of the qualified light-emitting chip 3, providing an adsorption force to adsorb the light-emitting chip 3, so as to transfer the new or qualified light-emitting chip 3 into the first through hole 111.

[0105] Based on the same inventive concept, this application also provides a transfer method, which please refer to in conjunction with the above. Figure 10 , Figure 10 This is a schematic flowchart of a transfer method provided in one embodiment of this application. The transfer method includes steps S101, S102, S103, and S104. Detailed descriptions of steps S101, S102, S103, and S104 are as follows.

[0106] S101, a transfer device as described above is provided, wherein the light-emitting chip is loaded in the first through hole of the transfer device;

[0107] S102, Align the transfer device with a display backplate having a plurality of pads;

[0108] S103, after alignment is completed, control the first transfer member and the second transfer member to move relative to each other, so as to transfer the light-emitting chip in the first through hole to the pad of the display back plate through the second through hole;

[0109] S104, perform a bonding process on the light-emitting chip transferred to the pad.

[0110] Specifically, the transfer device 1 is described above and will not be repeated here. It should be noted that the first through-hole 111 is first aligned with the light-emitting chip 3 on the growth substrate 2. Then, using laser lift-off technology, the light-emitting chip 3 is peeled from the growth substrate 2 into the first through-hole 111, so that the first through-hole 111 contains the light-emitting chip 3. The transfer device 1 is then aligned with a display backplate 4 having a plurality of pads 41, allowing the light-emitting chip 3 to fall onto the pads 41 via the second through-hole 121.

[0111] Understandably, the above two alignment processes, namely the alignment of the first through-hole 111 with the light-emitting chip 3 on the growth substrate 2 and the alignment of the transfer device 1 with a display backplate 4 having a plurality of pads 41, can be performed before the transfer begins, or the first through-hole 111 can be aligned with the light-emitting chip 3 on the growth substrate 2 first, and after the light-emitting chip 3 is loaded into the first through-hole 111, the transfer device 1 can be aligned with the display backplate 4 having a plurality of pads 41. This application does not limit this.

[0112] In this embodiment, with the first displacement of the first transfer member 11 or the second transfer member 12, a portion of the first through-hole 111 and the second through-hole 121 connect, and the light-emitting chip 3 falls onto the pad 41 of the display backplate 4. Subsequently, with the second displacement of the first transfer member 11 or the second transfer member 12, another portion of the first through-hole 111 and the second through-hole 121 connect, and the display backplate 4 cooperates with the first transfer member 11 or the second transfer member 12 to move, causing the light-emitting chip 3 to fall onto different pads 41 of the backplate. This process continues until all the qualified light-emitting chips 3 within the first through-hole 111 are transferred to the display backplate 4, thus completing the transfer of the light-emitting chip 3.

[0113] In this embodiment, the step of performing a bonding process on the light-emitting chip 3 transferred to the pad 41 includes:

[0114] Solder is applied to the pad 41 and / or the electrode 31 of the light-emitting chip 3;

[0115] After heating until the solder melts, it is cooled and fixed, so that the pad 41 and the electrode 31 are fixedly connected by the solder.

[0116] Specifically, the solder on the pads 41 and / or the electrodes 31 fuses together after heating and is fixed after cooling, thereby fixing the electrodes 31 of the light-emitting chip 3 to the pads 41, realizing the bonding process between the pads 41 and the light-emitting chip 3. Simultaneously, due to the conductivity of the solder, a good electrical connection is established between the light-emitting chip 3 and the pads 41.

[0117] Understandably, in other possible implementations, the bonding process between the pad 41 and the light-emitting chip 3 can be implemented in other ways, and this application does not limit this.

[0118] The step of aligning the transfer device 1 with a display backplate 4 having a plurality of solder pads 41 includes:

[0119] Control the overall movement of the transfer device 1 so that the second through hole 121 or part of the first through hole 111 is aligned with the pad 41 of the display back panel 4; or

[0120] Control the overall movement of the display back panel 4 so that the pad 41 is aligned with the second through hole 121 or part of the first through hole 111; or

[0121] Simultaneously control the display backplate 4 and the transfer device 1 to move in opposite directions so that the second through hole 121 or part of the first through hole 111 is aligned with the pad 41.

[0122] Specifically, as described above, since at least two first through holes 111 are provided between adjacent second through holes 121, the distance between adjacent first through holes 111 is not equal to the distance between adjacent pads 41. Therefore, in order for the light-emitting chip 3 to fall onto the pad 41 via the second through hole 121, during a single transfer process, only the second through hole 121 or part of the first through hole 111 is aligned with the pad 41.

[0123] Understandably, in this embodiment, the final result is that the second through-hole 121 or part of the first through-hole 111 is aligned with the pad 41 of the display backplate 4, so that when the first through-hole 111 and the second through-hole 121 are connected, the light-emitting chip 3 can fall onto the pad 41 through the second through-hole 121. Therefore, this application is not limited to controlling the movement of the transfer device 1 and / or the display backplate 4.

[0124] When a portion of the first through-hole 111 is aligned with the pad 41, the step of controlling the relative movement of the first transfer member 11 and the second transfer member 12 includes:

[0125] Keeping the first transfer member 11 stationary, control the second transfer member 12 to move so that the second through hole 121 communicates with the aligned portion of the first through hole 111.

[0126] Specifically, since part of the first through hole 111 is aligned with the pad 41, the first transfer member 11 is kept stationary so that the aligned part of the first through hole 111 remains stationary. The second transfer member 12 is controlled to move so that the second through hole 121 communicates with the aligned part of the first through hole 111, thereby allowing the light-emitting chip 3 to accurately fall onto the aligned part of the pad 41 via the second through hole 121.

[0127] Understandably, in this embodiment, the light-emitting chip 3 is directly transferred to the pad 41. Therefore, in subsequent process steps, the bonding process can be directly performed on the light-emitting chip 3 and the pad 41 without having to move the position of the light-emitting chip 3, thus saving corresponding process steps.

[0128] When the second through-hole 121 is aligned with the pad 41, the step of controlling the relative movement of the first transfer member 11 and the second transfer member 12 includes:

[0129] Keeping the second transfer member 12 stationary, control the first transfer member 11 to move so that the second through hole 121 communicates with part of the first through hole 111.

[0130] Understandably, the difference between this embodiment and the previous embodiment is that, since the second through hole 121 is aligned with the pad 41, the second transfer member 12 is kept stationary, so that the aligned second through hole 121 remains stationary, and the first transfer member 11 is controlled to move so that the second through hole 121 communicates with a portion of the first through hole 111, so that the light-emitting chip 3 accurately falls onto the aligned portion of the pad 41 via the second through hole 121.

[0131] Understandably, before the first transfer member 11 or the second transfer member 12 performs its first displacement, a portion of the first through hole 111 is aligned with the pad 41 or the second through hole 121 is aligned with the pad 41. During subsequent transfer processes, since the displacement of the first transfer member 11 or the second transfer member 12 connects a portion of the first through hole 111 and the second through hole 121, in each subsequent transfer, a portion of the first through hole 111 or the second through hole 121 is still aligned with the pad 41, and no additional alignment is required.

[0132] It should be noted that different light-emitting chips 3 are placed thereon, and the distance between adjacent pads 41 is a positive integer multiple of the distance between adjacent second through holes 121. This allows the light-emitting chip 3 to fall onto the pad 41 through the first through hole 111 and the second through hole 121 after some of the first through holes 111 or the second through hole 121 are aligned with the pads 41.

[0133] Based on the same inventive concept, this application also provides a chip pre-detection method, which can be referred to in conjunction with the above. Figure 11 , Figure 11 This is a schematic flowchart of a chip pre-detection method provided in one embodiment of this application. Based on the transfer system 5 with detection function as described above, the transfer system 5 includes a transfer device 1 and a detection element 51. The chip pre-detection method includes steps S111 and S112. The detailed descriptions of steps S111 and S112 are as follows.

[0134] S111, Power is applied to the detection element to perform photoelectric testing on the light-emitting chip placed on the detection element;

[0135] S112, Replace the light-emitting chip that fails the photoelectric test.

[0136] Specifically, the transfer system 5, the transfer device 1, and the detection element 51 are described above and will not be repeated here. In this embodiment, the step of replacing the light-emitting chip 3 that fails the photoelectric test can be achieved by removing the light-emitting chip 3 that fails the test, or by replacing the light-emitting chip 3 that passes the test in the first through hole 111 with the light-emitting chip 3 that fails the test in the first through hole 111, or by replacing the light-emitting chip 3 that has not been tested with the light-emitting chip 3 that fails the test in the first through hole 111. This application does not limit this to any particular method.

[0137] Specifically, for the implementation method of replacing the light-emitting chip 3 that fails the photoelectric test, please refer to the relevant description of the detection auxiliary component 52 mentioned above, which will not be repeated here.

[0138] Before powering on the detection element 51, the chip pre-detection method further includes:

[0139] Pressure is applied to one or all of the light-emitting chips 3 from the side away from the second transfer member 12 to achieve electrical connection between the light-emitting chip 3 and the detection member 51.

[0140] Specifically, for an embodiment in which pressure is applied to one or all of the light-emitting chips 3 from the side away from the second transfer member 12, please refer to the relevant description of the detection auxiliary member 52 above, which will not be repeated here.

[0141] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A transfer system with detection function, characterized in that, include: Inspection items; A transfer device for transferring light-emitting chips from a growth substrate to a display backplane; The transfer device includes a first transfer member and a second transfer member stacked together, wherein the first transfer member is movable relative to the second transfer member; The first transfer member has a plurality of first through holes for placing the light-emitting chips, and the spacing between adjacent first through holes is the same as the spacing between adjacent light-emitting chips on the growth substrate; The second transfer member has a plurality of second through holes, and the spacing between adjacent second through holes is the same as the spacing between adjacent pads on the display back panel; the width of the second through hole is not less than the width of the first through hole, and in the initial state, the second through hole and the first through hole are offset in the stacking direction; The detection element is located at the position of the second transfer element corresponding to the first through hole. The detection element is used to perform photoelectric testing, and in the initial state, the detection element is exposed through the first through hole.

2. The transfer system with detection function as described in claim 1, characterized in that, At least two first through holes are provided between adjacent second through holes along the stacking direction perpendicular to the stacking direction.

3. The transfer system with detection function as described in claim 1, characterized in that, The first transfer member has a plurality of spaced-apart isolation portions, which are arranged adjacent to each other to form the first through hole. Along the stacking direction, the width of the isolation portion is not less than the diameter of the second through hole.

4. The transfer system with detection function as described in any one of claims 1 to 3, characterized in that, It also includes testing auxiliary components; The detection aid is configured to apply pressure to the light-emitting chip from the side away from the second transfer member when the light-emitting chip is placed in the first through hole, so that the detection aid is electrically connected to the electrode of the light-emitting chip.

5. The transfer system with detection function as described in claim 4, characterized in that, The surface of the detection element exposed through the first through hole is flush with the side of the second transfer element and the side of the first transfer element that are in contact with it.

6. The transfer system with detection function as described in claim 4, characterized in that, The detection element is magnetic, and the light-emitting chip includes electrodes. When the light-emitting chip is placed in the first through hole, the detection element and the electrodes attract each other, so that the detection element and the electrodes are electrically connected.

7. The transfer system with detection function as described in claim 4, characterized in that, The height of the light-emitting chip along the stacking direction is not less than the thickness of the first transfer member.

8. The transfer system with detection function as described in claim 7, characterized in that, The detection auxiliary component is a light-transmitting substrate; The light-transmitting substrate is configured to apply pressure to all the light-emitting chips from the side away from the second transfer member, so that the electrodes of all the light-emitting chips are electrically connected to the corresponding detection member.

9. The transfer system with detection function as described in claim 4, characterized in that, The detection auxiliary component includes a detection auxiliary body, which is hollow, with one end connected to a vacuum tube and the other end used to abut against the light-emitting chip. The detection auxiliary body is configured to provide pressure against the light-emitting chip and the adsorption force required to adsorb the light-emitting chip.

10. The transfer system with detection function as described in claim 1, characterized in that, The transfer method of the transfer device includes: The light-emitting chip is loaded in the first through-hole of the transfer device; Align the transfer device with a display backplate having a plurality of solder pads; After alignment is completed, the first transfer member and the second transfer member are controlled to move relative to each other so as to transfer the light-emitting chip in the first through hole to the pad of the display back plate via the second through hole; A bonding process is performed on the light-emitting chip transferred to the pad.

11. The transfer method as described in claim 10, characterized in that, The step of aligning the transfer device with a display backplate having a plurality of pads includes: Control the overall movement of the transfer device to align the second through hole or a portion of the first through hole with the pads of the display back panel; or Control the overall movement of the display back panel to align the pads with the second through-hole or a portion of the first through-hole; or Simultaneously control the display backplate and the transfer device to move in opposite directions so that the second through hole or part of the first through hole is aligned with the pad.

12. The transfer method as described in claim 11, characterized in that, When a portion of the first through-hole is aligned with the pad, the step of controlling the relative movement of the first transfer member and the second transfer member includes: Keeping the first transfer member stationary, control the second transfer member to move so that the second through hole communicates with the aligned portion of the first through hole.

13. The transfer method as described in claim 11, characterized in that, When the second through-hole is aligned with the pad, the step of controlling the relative movement of the first transfer member and the second transfer member includes: Keeping the second transfer member stationary, control the first transfer member to move so that the second through hole communicates with a portion of the first through hole.

14. A chip pre-detection method, characterized in that, Based on the transfer system with detection function as described in any one of claims 1-13, the transfer system includes a transfer device and a detection component, and the chip pre-detection method includes: Power is applied to the detection device to perform photoelectric testing on the light-emitting chip placed on the detection device; Replace any light-emitting chips that fail the photoelectric test.

15. The chip pre-detection method as described in claim 14, characterized in that, Before powering on the detection device, the chip pre-detection method further includes: Pressure is applied to one or all of the light-emitting chips from the side away from the second transfer element to achieve electrical connection between the light-emitting chips and the detection element.

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