Electrode repair assembly, method of manufacture, and massive repair method for light emitting chips

Abstract

The application relates to an electrode repairing assembly, which comprises a substrate substrate, a first glue layer, a second glue layer and a plurality of conductive units, wherein the first glue layer is arranged on the substrate substrate, the second glue layer and the plurality of conductive units are arranged on the side of the first glue layer which is opposite to the substrate substrate, the plurality of conductive units are embedded in the second glue layer and penetrate through the second glue layer, and the plurality of conductive units are used for repairing the electrode of a bad pixel. The application further provides a preparation method of the electrode repairing assembly and a mass repairing method of a light-emitting chip.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to an electrode repair component, a method for preparing an electrode repair component, and a method for mass repair of a light-emitting chip. Background Technology

[0002] Micro LEDs, as a next-generation display technology, offer higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption compared to traditional LEDs. Therefore, Micro LEDs are widely used in display products.

[0003] In the manufacturing process of Micro LED displays, mass transfer is typically used to transfer Micro LED chips onto a substrate. After mass transfer, defect detection and repair are performed on the Micro LED chips. Currently, the industry mainly uses redundant circuitry and in-situ repair techniques to repair defects. Adding redundant circuitry involves adding one or more repair pixel circuits around the pixel circuitry; when a defective pixel appears, the corresponding pixel is replaced in the repair pixel circuitry. However, this method can easily lead to limitations in the pixel density of Micro LED displays, while in-situ repair technology is still under development and not yet perfect. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide an electrode repair component, a method for preparing an electrode repair component, and a mass repair method for light-emitting chips. The aim is to solve the problem that the pixel density of MicroLED displays is easily limited when repairing defects in pixel chips by adding redundant circuits and other existing defect repair methods.

[0005] This application provides an electrode repair assembly, which includes: a substrate, a first adhesive layer, a second adhesive layer, and a plurality of conductive units. The first adhesive layer is disposed on the substrate, and the second adhesive layer and the plurality of conductive units are disposed on the side of the first adhesive layer facing away from the substrate. The plurality of conductive units are embedded in the second adhesive layer and penetrate the second adhesive layer. The plurality of conductive units are used to repair the electrodes of defective pixels.

[0006] In summary, the electrode repair assembly of this application, which completes electrode repair through the conductive unit, enables the repair of smaller, higher-density Micro LED displays without requiring redundant circuitry for defective pixel repair. Furthermore, since the conductive unit requires a low temperature for thermal bonding, laser heating can be used to locally heat the area, thus preventing damage to other pixels during the repair process.

[0007] Optionally, the thickness of the first adhesive layer is 1-3 μm, and the material of the first adhesive layer is polyimide or fluorene-based polyester.

[0008] Optionally, the thickness of the second adhesive layer is 8-10 μm, and the material of the second adhesive layer is positive photoresist.

[0009] Optionally, the conductive unit is made by mixing conductive particles, thermosetting resin and curing agent in a preset ratio, and the size of the conductive unit is less than or equal to 15 μm.

[0010] In summary, the electrode repair assembly of this application, which completes electrode repair through the conductive unit, enables the repair of smaller, higher-density Micro LED displays without requiring redundant circuitry for defective pixel repair. Furthermore, since the conductive unit requires a low temperature for thermal bonding, laser heating can be used to locally heat the area, thus preventing damage to other pixels during the repair process.

[0011] Based on the same inventive concept, this application also provides a method for preparing an electrode repair assembly, which is used to prepare the above-mentioned electrode repair assembly. The preparation method includes: providing a spare substrate; preparing a first adhesive layer on the substrate; preparing a second adhesive layer on the first adhesive layer; processing the second adhesive layer to obtain a mounting template; and preparing a plurality of conductive units on the mounting template.

[0012] In summary, the electrode repair assembly prepared by the method of this application, which completes electrode repair through the conductive unit, enables the repair of smaller, higher-density Micro LED displays without the need for redundant circuitry in defect repair. Furthermore, since the conductive unit requires a low temperature for thermal bonding, laser heating can be used locally, thus avoiding impact on other pixels during the repair process.

[0013] Based on the same inventive concept, this application also provides a mass repair method for a light-emitting chip, used to repair bad pixels in a pixel die using the above-mentioned electrode repair assembly. The mass repair method for the light-emitting chip includes: detecting and removing bad pixels in the pixel die; transferring conductive units in the electrode repair assembly to pads on a driving panel to complete electrode repair; transferring repair dies to the electrode-repaired position on the driving panel and bonding the repair dies to the driving panel.

[0014] In summary, the mass repair method for light-emitting chips in this application utilizes the conductive units to complete electrode repair, enabling the repair of smaller, higher-density Micro LED displays. Furthermore, since the conductive units require relatively low temperatures for thermal bonding, laser heating can be used for localized heating, thus preventing damage to other pixels during the repair process. Additionally, the use of pick-and-place technology to repair defective pixels within the pixel die reduces the cost of mass transfer. Moreover, the selective in-situ electrode repair scheme proposed in this application, used for rework of the micro LED display die after mass transfer, offers advantages over redundant circuit designs in existing technologies, including high resolution, selectivity, and large-scale repair capabilities.

[0015] Optionally, the step of transferring the conductive unit in the electrode repair assembly to the pad on the drive panel to complete the electrode repair includes: removing the first adhesive layer below the conductive unit in the electrode repair assembly; transferring the conductive unit to the pad on the drive panel; and bonding the conductive unit to the pad to form a new pad.

[0016] Optionally, bonding the conductive unit to the pad to form a new pad includes: bonding the conductive unit to the pad at a first preset temperature to form the new pad, wherein the first preset temperature is 60℃-70℃.

[0017] Optionally, the step of transferring the repair die to the position of the electrode repair on the driving panel and bonding the repair die to the driving panel includes: transferring the repair die to the new pad using a pick-up device; and bonding the repair die to the driving panel using the new pad.

[0018] Optionally, bonding the repair die to the new pad includes: bonding the repair die to the drive panel using the new pad at a second preset temperature and a first preset pressure value; wherein the second preset temperature is 150℃-180℃.

[0019] In summary, the mass repair method for light-emitting chips in this application utilizes the conductive units to complete electrode repair, enabling the repair of smaller, higher-density Micro LED displays. Furthermore, since the conductive units require relatively low temperatures for thermal bonding, laser heating can be used for localized heating, thus preventing damage to other pixels during the repair process. Additionally, the use of pick-and-place technology to repair defective pixels within the pixel die reduces the cost of mass transfer. Moreover, the selective in-situ electrode repair scheme proposed in this application, used for rework of the micro LED display die after mass transfer, offers advantages over redundant circuit designs in existing technologies, including high resolution, selectivity, and large-scale repair capabilities. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of an electrode repair assembly according to an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of an electrode repair assembly according to an embodiment of this application; Figure 3 This is a schematic flowchart of a method for preparing an electrode repair assembly disclosed in an embodiment of this application; Figure 4 for Figure 3 A flowchart illustrating step S10 in the massive repair method shown. Figure 5 for Figure 4 The diagram shows the corresponding structure formed in step S11 of the preparation method shown. Figure 6 for Figure 3 The diagram shows the corresponding structure formed in step S20 of the preparation method shown. Figure 7 for Figure 3 A schematic diagram of the corresponding structure formed in step S30 of the preparation method shown; Figure 8 for Figure 3 A schematic diagram of the corresponding structure formed in step S40 of the preparation method shown; Figure 9 for Figure 3 A schematic diagram of the corresponding structure formed in step S50 of the preparation method shown; Figure 10 This is a schematic flowchart of a mass repair method for a light-emitting chip disclosed in an embodiment of this application; Figure 11 for Figure 10 A schematic diagram of the corresponding structure formed in step S100 of the mass repair method shown; Figure 12 for Figure 10 A flowchart illustrating step S200 in the mass repair method shown. Figure 13 for Figure 12 A schematic diagram of the corresponding structure formed in step S210 of the mass repair method shown; Figure 14 for Figure 12 A schematic diagram of the corresponding structure formed in step S220 of the mass repair method shown; Figure 15 for Figure 12 A schematic diagram of the corresponding structure formed in step S230 of the mass repair method shown; Figure 16 for Figure 10 A schematic diagram of the corresponding structure formed in step S300 of the mass repair method shown.

[0021] Explanation of reference numerals in the attached figures: 100-Electrode Repair Assembly; 110 - Substrate; 120 - First adhesive layer; 130 - Second adhesive layer; 140 - Conductive unit; 150 - Installation Template; 200 - bad pixels; 300-Driver Panel; 310 - Pad; 400-Pickup; 500 - Repair grains; 600-mask; The steps of the preparation method of S10-S50 electrode repair assembly; Step S10 in the preparation method of the electrode repair assembly (S11-S12). Steps for mass repair of S100-S300 LED chips; Step S200 in the mass repair method for light-emitting chips (S210-S220) Detailed Implementation

[0022] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0024] Micro LEDs, as a next-generation display technology, offer higher photoelectric efficiency, higher brightness, higher contrast, and lower power consumption compared to traditional LEDs. Therefore, Micro LEDs are widely used in display products. In the manufacturing process of Micro LED displays, mass transfer is typically used to transfer Micro LED chips onto a substrate. After mass transfer, defect detection and repair are performed on the Micro LED chips. Currently, the industry mainly uses redundant circuitry and in-situ repair techniques to repair defects. Adding redundant circuitry involves adding one or more repair pixel circuits around the pixel circuitry; when a defect appears in a pixel, the corresponding pixel is added to the repair pixel circuitry. However, this method easily leads to a limitation in the pixel density of Micro LED displays. Meanwhile, in-situ repair technology is still under development and not yet perfect. Therefore, how to solve the problem of limited pixel density in Micro LED displays caused by existing defect repair methods such as adding redundant circuitry to repair defects in pixel chips is a problem that urgently needs to be solved by those skilled in the art.

[0025] Based on this, this application aims to provide a solution that can solve the above-mentioned technical problems. It can solve the problem that the pixel density of Micro LED displays is easily limited when existing defect repair methods such as adding redundant circuits are used to repair defective pixels in pixel chips. The details will be described in subsequent embodiments.

[0026] This application provides a detailed description of the electrode repair assembly, the preparation method of the electrode repair assembly, and the mass repair method for the light-emitting chip.

[0027] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an electrode repair assembly according to an embodiment of this application. Figure 2 This is a cross-sectional schematic diagram of an electrode repair assembly according to an embodiment of this application. Figure 1 and Figure 2As shown, this application provides an electrode repair assembly 100. The electrode repair assembly 100 may include at least a substrate 110, a first adhesive layer 120, a second adhesive layer 130, and a plurality of conductive units 140. The first adhesive layer 120 is disposed on the substrate 110. The second adhesive layer 130 and the plurality of conductive units 140 are disposed on the side of the first adhesive layer 120 facing away from the substrate 110. The second adhesive layer 130 surrounds the conductive units 140. The plurality of conductive units 140 are arranged in a matrix and embedded in the second adhesive layer 130. The surfaces of the plurality of conductive units 140 and the second adhesive layer 130 facing away from the first adhesive layer 120 are flush.

[0028] In this embodiment, a plurality of conductive units 140 are embedded in the second adhesive layer 130 and penetrate the second adhesive layer 130. The second adhesive layer 130 and the plurality of conductive units 140 are fixed together on the side of the first adhesive layer 120 facing away from the substrate 110.

[0029] In this embodiment of the application, the material of the substrate 110 may be sapphire or quartz glass.

[0030] In an exemplary embodiment, the thickness of the first adhesive layer 120 may be 1-3 μm, such as 1 μm, 2 μm, 3 μm, or other values. The material of the first adhesive layer 120 may be polyimide (PI) or fluorene-based polyester.

[0031] In an exemplary embodiment, the thickness of the second adhesive layer 130 may be 8-10 μm, such as 8 μm, 9 μm, 10 μm, or other values. The material of the second adhesive layer 130 may be a positive photoresist.

[0032] In an exemplary embodiment, the conductive unit 140 may be made by mixing conductive particles (silicone coated with a nickel / gold / silver alloy), thermosetting resin (epoxy resin, silicone, polyurethane), and a curing agent in a preset ratio. The conductive unit 140 may be cured and molded by high-temperature pressing. The size of the conductive unit 140 is the same as the electrode size of the Micro LED, or the size of the conductive unit 140 may also be the same as the size of the Micro LED. The size of the conductive unit 140 is less than or equal to 15 μm, for example: 0 μm ~ 15 μm, or for example: 1 μm, 3 μm, 5 μm, 8 μm, 10 μm, 15 μm, and other sizes.

[0033] In summary, the electrode repair assembly 100 of this application, which completes electrode repair through the conductive unit 140, enables the repair of smaller, higher-density Micro LED displays without requiring redundant circuitry for defective pixel repair. Furthermore, since the conductive unit 140 requires a low temperature for thermal bonding, laser heating can be used locally, thus avoiding impact on other pixels during the repair process. Moreover, by employing a pick-and-place method to repair defective pixels within the pixel die, the cost of mass transfer is reduced.

[0034] Please see Figure 3 This is a schematic flowchart illustrating a method for preparing an electrode repair assembly disclosed in an embodiment of this application. The method for preparing the electrode repair assembly is used to prepare the aforementioned... Figure 1 and Figure 2 The electrode repair assembly in the illustrated embodiment is used to repair the electrodes of defective pixels within a pixel die. Figure 3 As shown, the method for preparing the electrode repair assembly includes at least the following steps.

[0035] S10, Provide a spare substrate.

[0036] Please see Figure 4 As shown, in this embodiment, step S10 includes at least the following steps.

[0037] S11, Provide a substrate.

[0038] For details, please refer to Figure 5 In this embodiment, the substrate 110 is used to prepare for the subsequent fabrication of other layer structures of the electrode repair assembly 100.

[0039] S12. The substrate is cleaned.

[0040] For details, please refer to Figure 5 In this embodiment of the application, the substrate 110 is cleaned to remove particles or organic contaminants from its surface, thereby preparing for the subsequent fabrication of other layer structures of the electrode repair assembly 100.

[0041] In an exemplary embodiment, the cleaning process may be a plasma treatment.

[0042] S20. A first adhesive layer is prepared on the substrate.

[0043] For details, please refer to Figure 6In this embodiment of the application, a first adhesive material is coated on one side surface of the substrate 110, and the first adhesive material is baked to form a hard film to form the first adhesive layer 120.

[0044] In an exemplary embodiment, the thickness of the first adhesive layer 120 may be 1-3 μm, such as 1 μm, 2 μm, 3 μm, or other values. The material of the first adhesive layer 120 may be polyimide (PI) or fluorene-based polyester.

[0045] S30. Prepare a second adhesive layer on the first adhesive layer.

[0046] For details, please refer to Figure 7 In this embodiment of the application, a second adhesive material is coated on the side surface of the first adhesive layer 120 facing away from the substrate 110 to form the second adhesive layer 130.

[0047] In an exemplary embodiment, the thickness of the second adhesive layer 130 may be 8-10 μm, such as 8 μm, 9 μm, 10 μm, or other values. The material of the second adhesive layer 130 may be a positive photoresist.

[0048] S40. The second adhesive layer is processed to obtain the installation template.

[0049] For details, please refer to Figure 8 In this embodiment of the application, the mounting template 150 is obtained by exposing and developing the second adhesive layer 130. That is, processing the second adhesive layer 130 includes exposing and developing the second adhesive layer 130.

[0050] S50. A plurality of conductive units are prepared on the mounting template.

[0051] For details, please refer to Figure 9 In this embodiment of the application, a conductive adhesive material formed by mixing conductive particles (e.g., silicone coated with a nickel / gold / silver alloy), thermosetting resin (e.g., epoxy resin, silicone, polyurethane), and curing agent in a preset ratio can be applied to the mounting template 150 using a wet film preparation device, and then the conductive adhesive material can be cured and molded by high temperature pressing to form a plurality of conductive units 140.

[0052] In an exemplary embodiment, the size of the conductive unit 140 is the same as the electrode size of the Micro LED, or the size of the conductive unit 140 may also be the same as the size of the Micro LED. The size of the conductive unit 140 is less than or equal to 15 μm, for example: 0 μm ~ 15 μm, or for example: 1 μm, 5 μm, 8 μm, 10 μm, 15 μm, or other sizes.

[0053] In summary, the electrode repair assembly 100 prepared by the method of this application completes electrode repair through the conductive unit 140 without the need for a defective pixel repair method that adds redundant circuitry, thus enabling the repair of smaller, higher-density Micro LED displays. Furthermore, since the conductive unit 140 requires a low temperature for thermal bonding, laser heating can be used locally, thereby avoiding impact on other pixels during the repair process. Moreover, the use of pick-and-place to repair defective pixels 200 in the pixel die reduces the cost of mass transfer.

[0054] Please see Figure 10 This is a flowchart illustrating a mass repair method for a light-emitting chip disclosed in an embodiment of this application. In this embodiment, the mass repair method is used to repair defective pixels in pixel chips after mass transfer, achieving high-resolution, selective, and large-scale repair. Please refer to [further details omitted]. Figures 11 to 15 As shown in the embodiments of this application, the mass repair method for the light-emitting chip may include at least the following steps.

[0055] S100: Detect and remove bad pixels from the pixel grain.

[0056] Specifically, in the embodiments of this application, such as Figure 11 As shown, the Micro LED display module is inspected to identify bad pixels 200 in the Micro LED display module. The bad pixels 200 are removed by laser trimming using a mask 600. Then, the residual solder on the pads 310 of the driver panel 300 is removed by a low-energy laser.

[0057] In an exemplary embodiment, the laser adjustment may use a high-energy laser.

[0058] S200: Transfer the conductive unit in the electrode repair assembly to the pads on the drive panel to complete the electrode repair.

[0059] Please see Figure 12 As shown, in this embodiment, step S200 includes at least the following steps.

[0060] S210. Remove the first adhesive layer below the conductive unit in the electrode repair assembly.

[0061] For details, please refer to Figure 13 In this embodiment, the first adhesive layer 120 below the conductive unit 140 in the electrode repair assembly 100 is removed by laser.

[0062] S220. Transfer the conductive unit to the pads of the drive panel.

[0063] For details, please refer to Figure 14 In this embodiment of the application, the conductive unit 140 is transferred to the pad 310 of the drive panel 300 by the pickup 400.

[0064] In an exemplary embodiment, the pickup 400 may be made of pyrolytic gel or polydimethylsiloxane (PDMS).

[0065] S230. The conductive unit is bonded to the pad to form a new pad.

[0066] For details, please refer to Figure 15 In this embodiment of the application, the conductive unit 140 is bonded to the pad 310 of the driving panel 300 at a first preset temperature to form a new pad and complete the electrode repair.

[0067] In an exemplary embodiment, the first preset temperature may be 60℃-70℃, for example: 60℃, 62℃, 65℃, 67℃, 70℃, or other temperatures.

[0068] S300: Transfer the repair die to the position of the electrode repair on the drive panel, and bond the repair die to the drive panel.

[0069] Specifically, in the embodiments of this application, such as Figure 16 As shown, the repair die 500 is transferred to a new pad by the pickup 400, and the repair die 500 is bonded to the drive panel 300 using the new pad at a second preset temperature and a first preset pressure value. The conductive unit 140 can be used for adhesion and insulation, as well as for electrical connection.

[0070] In an exemplary embodiment, the second preset temperature can be 150℃-180℃, for example: 150℃, 160℃, 170℃, 175℃, 180℃, or other temperatures.

[0071] In summary, the mass repair method for light-emitting chips in this application utilizes the conductive unit 140 to complete electrode repair, enabling the repair of smaller, higher-density Micro LED displays. Furthermore, since the conductive unit 140 requires a low temperature for thermal bonding, laser heating can be used locally, thus avoiding impact on other pixels during the repair process. Additionally, the use of pick-and-place to repair defective pixels 200 in the pixel die reduces the cost of mass transfer. Moreover, the selective in-situ electrode repair scheme proposed in this application, used for rework of the micro LED display die after mass transfer, offers advantages over redundant circuit designs in the prior art, including high resolution, selectivity, and large-scale repair capabilities.

[0072] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An electrode repair assembly, characterized in that, The electrode repair assembly includes: a substrate, a first adhesive layer, a second adhesive layer, and a plurality of conductive units. The first adhesive layer is disposed on the substrate, and the second adhesive layer and the plurality of conductive units are disposed on the side of the first adhesive layer facing away from the substrate. The plurality of conductive units are embedded in the second adhesive layer and penetrate the second adhesive layer. The plurality of conductive units are used to repair the electrodes of the defective pixels.

2. The electrode repair assembly according to claim 1, characterized in that, The thickness of the first adhesive layer is 1-3 μm, and the material of the first adhesive layer is polyimide or fluorene-based polyester.

3. The electrode repair assembly according to claim 1, characterized in that, The thickness of the second adhesive layer is 8-10 μm, and the material of the second adhesive layer is positive photoresist.

4. The electrode repair assembly according to any one of claims 1-3, characterized in that, The conductive unit is made by mixing conductive particles, thermosetting resin and curing agent in a preset ratio, and the size of the conductive unit is less than or equal to 15 μm.

5. A method for preparing an electrode repair assembly, used to prepare the electrode repair assembly as described in any one of claims 1-4, characterized in that, The preparation method includes: Provide a spare substrate; A first adhesive layer is prepared on the substrate. A second adhesive layer is prepared on the first adhesive layer; The second adhesive layer is processed to obtain the installation template; A plurality of the conductive units are prepared on the mounting template.

6. A method for mass repair of a light-emitting chip, used to repair defective pixels in a pixel die using an electrode repair assembly as described in any one of claims 1-4, characterized in that, The mass repair method for the light-emitting chips includes: Detect and remove bad pixels from the pixel grain; The conductive unit in the electrode repair assembly is transferred to the pads on the drive panel to complete the electrode repair. The repair die is transferred to the position of the electrode repair on the drive panel, and the repair die is bonded to the drive panel.

7. The mass repair method for light-emitting chips as described in claim 6, characterized in that, The step of transferring the conductive units in the electrode repair assembly to the pads of the drive panel to complete the electrode repair includes: Remove the first adhesive layer beneath the conductive unit in the electrode repair assembly; The conductive unit is transferred to the pads of the drive panel; The conductive unit is bonded to the pad to form a new pad.

8. The mass repair method for light-emitting chips as described in claim 7, characterized in that, The step of bonding the conductive unit to the pad to form a new pad includes: The conductive unit is bonded to the pad at a first preset temperature to form the new pad, wherein the first preset temperature is 60℃-70℃.

9. The mass repair method for light-emitting chips as described in claim 8, characterized in that, The step of transferring the repair die to the position on the driving panel after electrode repair and bonding the repair die to the driving panel includes: The repair die is transferred to the new pad using a pick-up device; The repair die is bonded to the drive panel using the new pads.

10. The mass repair method for light-emitting chips as described in claim 9, characterized in that, The bonding of the repaired die to the new pad includes: At a second preset temperature and a first preset pressure value, the repair die is bonded to the drive panel using the new pads; The second preset temperature is 150℃-180℃.

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