Server cabinet
By designing a heat dissipation mechanism inside the server rack and an air duct structure outside the sub-rack, combining internal and external circulation modes, and utilizing linear drive and transmission mechanisms, the problems of large space occupation and difficult maintenance of heat sinks are solved, achieving efficient temperature regulation and rapid cooling.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INSPUR SUZHOU INTELLIGENT TECH CO LTD
- Filing Date
- 2023-07-28
- Publication Date
- 2026-07-31
AI Technical Summary
The heat sinks in existing server racks take up a lot of space and require disassembly of the server for repair when they are damaged, resulting in a large maintenance workload. In addition, the single control mode cannot effectively deal with overheating.
The design incorporates a heat dissipation mechanism within the outer casing and an air duct structure outside the sub-casing, supporting both internal and external circulation modes. It combines a linear drive mechanism and a transmission mechanism, adjusts the airflow path through shielding components, utilizes an evaporator and a fan for efficient heat dissipation, and optimizes temperature regulation through a control module.
The number of radiators was reduced, the frequency of maintenance was decreased, and rapid cooling and independent temperature regulation were achieved, improving heat dissipation and maintenance efficiency.
Smart Images

Figure CN116963469B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of server technology, and more specifically to a server rack. Background Technology
[0002] With the rapid development of computer technology and the establishment of many large-scale Internet data centers, the concentration of electronic devices has become increasingly high. Servers and other equipment are usually installed directly in server racks, and the temperature of the server racks will directly affect the operating performance of the servers. Among them, in data centers and other equipment with multiple rows of tightly designed server racks, how to cool the server racks is one of the important issues to ensure the good operating performance of the servers.
[0003] Servers in related technologies typically include a casing, a server motherboard housed within the casing, a GPU (Graphics Processing Unit) mounted on the motherboard, and a heatsink formed within the casing to dissipate heat from the GPU. These servers typically have a large number of heatsinks, which not only occupy significant internal space but also require disassembly of the server for repair if any heatsink fails, resulting in a substantial maintenance workload. Summary of the Invention
[0004] In view of this, the present invention provides a server and a server rack to solve the shortcomings of the prior art where the heat sink occupies a large space inside the server and each heat sink needs to be disassembled for repair when it is damaged, resulting in a large amount of server maintenance workload.
[0005] In a first aspect, the present invention provides a server rack, comprising: an outer shell having an air inlet and an air outlet, the air inlet and the air outlet being openable and closable; at least one sub-shell disposed within the outer shell and adapted to house a server motherboard, the sub-shell having an air inlet and a sub-shell air outlet; an air duct formed between the outer shell and the sub-shell, the air duct being connected to the air inlet, the air outlet, the sub-shell air inlet, and the sub-shell air outlet, the air inlet being located between the sub-shell inlet and the sub-shell air outlet; and a heat dissipation mechanism disposed within the air duct and located downstream of the air inlet and upstream of the air inlet of the sub-shell.
[0006] Beneficial effects: The server rack of the present invention includes an outer shell and a sub-shell disposed within the outer shell, with the server's motherboard disposed within the sub-shell. The heat dissipation mechanism is disposed within the outer shell and outside the sub-shell, enabling it to cool the server motherboard within the sub-shell. This avoids the heat dissipation mechanism occupying space within the sub-shell, thus helping to reduce the server's size. Furthermore, if the heat dissipation mechanism is damaged, it can be repaired without disassembling the sub-shell, thereby simplifying the maintenance process.
[0007] In addition, the server rack of the present invention only needs to be equipped with a heat dissipation mechanism inside the outer shell to dissipate heat from the server motherboards in multiple sub-shells inside the outer shell, thus reducing the number of heat dissipation mechanisms and greatly reducing the repair frequency of the heat dissipation mechanisms.
[0008] Furthermore, the air inlet and outlet of the server rack of the present invention are adjustable. When both the air inlet and outlet are open, the server rack is in external circulation mode. External airflow can enter the air duct through the air inlet, pass through the heat dissipation mechanism, and flow into the sub-shell through the sub-shell air inlet. This cools the server motherboard and the electronic components on the server motherboard inside the sub-shell, and then flows out through the sub-shell outlet and the outer shell outlet in sequence.
[0009] When the air inlet and outlet of the outer casing can be closed, the server rack is in internal circulation mode. The airflow can circulate between the heat dissipation mechanism, the air inlet of the sub-casing, and the air outlet of the sub-casing, thereby achieving internal circulation cooling and improving the cooling effect.
[0010] Therefore, the server rack of the present invention can overcome the shortcomings of the prior art, where the heat sink occupies a large space inside the server and the server needs to be disassembled for repair when each heat sink is damaged, resulting in a large amount of server maintenance workload. At the same time, the server rack of the present invention has an internal circulation mode and an external circulation mode. In the external circulation mode, it can quickly cool down the overheated server.
[0011] In one alternative implementation, the server rack further includes:
[0012] The first shield is movably disposed at the air outlet of the outer casing;
[0013] The second shield is movably disposed at the air inlet of the housing;
[0014] A first driving mechanism is connected to a first shield and a second shield. The first driving mechanism is adapted to drive the first shield to open the air outlet of the housing and drive the second shield to open the air inlet of the housing; or drive the first shield to block the air outlet of the housing and drive the second shield to block the air inlet of the housing.
[0015] In one optional embodiment, the air duct includes a first section, a second section, and a third section connected in sequence. The outer casing air outlet and the sub-casing air outlet are located in the first section, the outer casing air inlet and the heat dissipation mechanism are located in the second section, and the sub-casing air inlet is located in the third section.
[0016] The second shielding component includes a first baffle and a second baffle. The first baffle is closable and disposed at the air inlet of the housing. The second baffle is adapted to cut off the first segment and the second segment when the air inlet of the housing is open, and to connect the first segment and the second segment when the air inlet of the housing is closed.
[0017] Beneficial effect: With this configuration, the second shield can cut off the first and second sections when the air inlet of the housing is closed, thereby preventing the airflow entering at the air inlet of the housing from flowing out from the air outlet of the housing without passing through the sub-housing, which helps to improve the heat dissipation effect.
[0018] In one alternative embodiment, the first driving mechanism is a linear driving mechanism, which is connected to the first blocking member and the second blocking member through a first transmission mechanism.
[0019] Beneficial effects:
[0020] This configuration allows the same linear drive mechanism to drive both the first and second shielding components simultaneously, thereby reducing the manufacturing cost of the server rack.
[0021] In one optional embodiment, the first drive mechanism further includes a rotation source fixedly mounted on the housing, and the first transmission mechanism includes:
[0022] A connecting rod is inserted into the first section of the air duct, and a first shield and a second shield are connected to the connecting rod at intervals.
[0023] A threaded rod, driven by a rotation source, extends along the length of the first section of the air duct;
[0024] A slider is fitted onto a threaded rod and threadedly connected to the threaded rod; a connecting rod is connected to the slider.
[0025] A guide rod passes through the slider and extends along the length of the first section of the air duct.
[0026] Beneficial effects:
[0027] The rotating source drives the threaded rod to rotate along its own axis, causing the slider to carry the connecting rod to move along the length of the threaded rod. The air inlet and outlet of the housing are spaced apart along the length of the first section. The first and second blocking members move synchronously along the extension direction of the first section of the air duct, thereby blocking or opening the air inlet and outlet of the housing. The guide rod prevents the slider from rotating with the threaded rod and constrains the movement path of the guide rod.
[0028] In one optional implementation, the heat dissipation mechanism includes:
[0029] The evaporator is located in the second section of the air duct;
[0030] A fan is installed in the second section of the air duct and upstream of the evaporator, and is adapted to blow air toward the evaporator.
[0031] The outdoor unit of the refrigeration unit is connected to the evaporator and is located on the outside of the casing;
[0032] The server rack also includes:
[0033] A sealing element, which is movably disposed between the evaporator and the air duct;
[0034] The second drive mechanism, connected to the sealing element, is adapted to drive the sealing element to seal or open the gap between the evaporator and the air duct. The second drive mechanism includes:
[0035] A sliding rod, which is connected to the sealing element and extends along the length of the second section;
[0036] A linear drive mechanism is mounted on the housing and connected to the slide rod.
[0037] Beneficial effects:
[0038] The second drive mechanism is communicatively connected to the control module. The control module is adapted to control the second drive mechanism to drive the sealing component to seal the gap between the evaporator and the air duct when the detected data at the temperature signal terminal is higher than the preset safe temperature. This forces the airflow blown out by the fan to pass only through the evaporator, thereby enabling the evaporator to cool the airflow more thoroughly and improve the heat dissipation effect of the heat dissipation mechanism.
[0039] When the server rack is in external circulation mode, the second drive mechanism can drive the sealing component to disengage from the gap between the evaporator and the air duct, thereby reducing the air resistance in the air duct.
[0040] In one alternative implementation, the server rack further includes:
[0041] The third shielding component is movably installed at the air inlet and / or air outlet of the sub-shell;
[0042] The third drive mechanism is adapted to drive the movement of the shielding component to adjust the ventilation area of the sub-housing air inlet and / or sub-housing air outlet.
[0043] Beneficial effects:
[0044] The third drive mechanism is preferably connected to the control module. When the temperature signal terminal detects a high temperature, the control module can control the third drive mechanism to drive the shielding component, so that the third shielding component increases the area of the sub-shell air inlet and / or sub-shell air outlet, thereby increasing the ventilation volume of the sub-shell and thus improving the cooling effect on the server motherboard inside the sub-shell.
[0045] In one alternative embodiment, a second transmission mechanism is provided between the third drive mechanism and the third blocking member.
[0046] In one optional embodiment, the air inlet and air outlet are formed on opposite sides of the sub-housing, and each air inlet and air outlet is provided with a third shielding member. The third drive mechanism includes a dual-axis motor disposed within the sub-housing.
[0047] The rotating shafts on both sides of the dual-axis motor are connected to the third shielding parts on both sides through the second transmission mechanism.
[0048] Beneficial effects:
[0049] With this configuration, the rotating shafts on both sides of the dual-axis motor can simultaneously drive the third blocking components at both ends, so that the third blocking components at both ends can synchronously adjust the area of the air inlet and air outlet of the corresponding sub-shell. This allows only one motor to be installed in each sub-shell, which can achieve the adjustment of the area of the air inlet and air outlet of the sub-shell.
[0050] Furthermore, each third drive mechanism is adapted to adjust the area of the air inlet and outlet of a corresponding sub-casing. This allows the control module to control the corresponding third drive mechanism based on the temperature of each server's motherboard, thereby adjusting the area of the air inlet and outlet of its corresponding sub-casing. This enables independent temperature regulation for each server's motherboard.
[0051] In one alternative embodiment, the second transmission mechanism includes:
[0052] The first transmission gear is sleeved on the rotating shaft of the dual-shaft motor;
[0053] The second transmission gear has its rotation axis forming an angle with the rotation axis of the dual-shaft motor. The third shielding component includes a rotating cover plate, one end of which is rotatably connected to the sub-housing, and the other end of which is connected to the rotation axis of the second transmission gear.
[0054] Beneficial effects:
[0055] The rotating cover is adapted to rotate relative to the sub-casing under the drive of the second transmission gear, and to adjust the opening of the air inlet and outlet of the sub-casing. The larger the angle between the plane of the rotating cover and the plane of the air inlet or outlet of the sub-casing, the larger the ventilation area at the air inlet or outlet of the sub-casing; the smaller the angle between the plane of the rotating cover and the plane of the air inlet or outlet of the sub-casing, the smaller the ventilation area at the air inlet or outlet of the sub-casing.
[0056] In one optional embodiment, the third shielding member includes a plurality of rotating cover plates that are disposed on the air inlet or air outlet of the sub-shell and are arranged sequentially along the length of the air inlet or air outlet of the sub-shell. The second transmission gear is arranged in a one-to-one correspondence with the plurality of rotating cover plates, and two adjacent second transmission gears mesh with each other.
[0057] In one alternative embodiment, a heat-conducting plate suitable for contacting electronic components on the motherboard is provided inside the sub-housing. Heat dissipation fins are formed on the heat-conducting plate, with the two ends of the heat dissipation fins facing the air inlet and air outlet of the sub-housing, respectively.
[0058] Beneficial effects:
[0059] Airflow can pass through the sub-shell and cool the heat dissipation fins inside the sub-shell. The cooled heat dissipation fins can then cool the electronic components on the motherboard through the heat conduction plate.
[0060] In one alternative implementation, the server rack further includes a filter and / or a drying screen disposed within the air duct and upstream of the heat dissipation mechanism.
[0061] Beneficial effects:
[0062] Drying mesh is suitable for reducing humidity inside the server rack, preventing moisture in the airflow from affecting server operation. Filter mesh is suitable for filtering contaminants in the airflow, preventing airborne contaminants from adhering to the server motherboard. Attached Figure Description
[0063] To more clearly illustrate the technical solutions in the specific embodiments or related technologies of the present invention, the drawings used in the description of the specific embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0064] Figure 1 This is a schematic diagram of a server rack according to an embodiment of the present invention;
[0065] Figure 2 for Figure 1 A magnified view of point A in the server rack shown;
[0066] Figure 3 This is an enlarged view of the second transmission gear in the server rack according to an embodiment of the present invention;
[0067] Figure 4 The heat-conducting plate and heat dissipation fins of the server rack in this embodiment of the invention.
[0068] Explanation of reference numerals in the attached figures:
[0069] 1. Outer casing; 101. Air inlet of outer casing; 102. Air outlet of outer casing;
[0070] 2. Subshell;
[0071] 301. First paragraph; 302. Second paragraph; 303. Third paragraph;
[0072] 4. Heat dissipation mechanism; 401. Evaporator; 402. Fan; 403. Outdoor refrigeration unit;
[0073] 501, First shielding component; 502, Second shielding component; 5021, First baffle; 5022, Second baffle;
[0074] 601. First drive mechanism; 602. First transmission mechanism; 6021. Connecting rod; 6022. Threaded rod; 6023. Slider; 6024. Guide rod;
[0075] 701. Sealing component; 702. Second drive mechanism; 7021. Slide rod; 7022. Linear drive mechanism;
[0076] 801. Third blocking component; 802. Third drive mechanism; 803. Second transmission mechanism; 8031. First transmission gear; 8032. Second transmission gear;
[0077] 901. Heat-conducting plate; 902. Heat dissipation fins;
[0078] 10. Filter screen;
[0079] 11. Drying net;
[0080] 12. Motherboard. Detailed Implementation
[0081] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0082] In related technologies, a server rack is provided, including several branch air ducts integrated with the rack, as well as a main air inlet duct and a main air outlet duct installed on the rack. The air outlet of the main air outlet duct is connected to a heat extraction device, which upgrades the heat dissipation unit, which is independently controlled by the server motherboard or fan board, to a centralized heat dissipation controlled by the rack outside the system. Each branch air duct is suitable for cooling a server node.
[0083] While this type of server rack can reduce the number of exhaust fans and the frequency of their repair, it has a single control mode. If the exhaust fan is working but the server is still overheating, the operator can only remove the server from the rack.
[0084] The following is combined Figures 1 to 4 The following describes embodiments of the present invention.
[0085] According to an embodiment of the present invention, a server rack is provided, including an outer shell 1, at least one sub-shell 2, an air duct, and a heat dissipation mechanism 4. The outer shell 1 has an outer shell air inlet 101 and an outer shell air outlet 102. The outer shell air inlet 101 and the outer shell air outlet 102 are openable and closable. At least one sub-shell 2 is disposed within the outer shell 1 and is adapted to house a server motherboard. A sub-shell air inlet and a sub-shell air outlet are formed on the sub-shell 2. An air duct is formed between the outer shell 1 and the sub-shell 2. The air duct communicates with the outer shell air inlet 101, the outer shell air outlet 102, the sub-shell air inlet, and the sub-shell air outlet. The outer shell air inlet 101 is located between the inlet of the sub-shell 2 and the outlet of the sub-shell 2. The heat dissipation mechanism 4 is disposed within the air duct and is located downstream of the outer shell air inlet 101 and upstream of the sub-shell air inlet.
[0086] The server rack of the present invention includes an outer shell 1 and a sub-shell 2 disposed within the outer shell 1, wherein the server motherboard is disposed within the sub-shell 2. A heat dissipation mechanism 4 is disposed within the outer shell 1 and outside the sub-shell 2, enabling cooling of the server motherboard within the sub-shell 2. This avoids the heat dissipation mechanism 4 occupying space within the sub-shell 2, thus helping to reduce the server's size. Furthermore, if the heat dissipation mechanism 4 is damaged, it can be repaired without disassembling the sub-shell 2, thereby simplifying the maintenance process.
[0087] In addition, the server rack of the present invention only needs to be provided with one heat dissipation mechanism 4 inside the outer shell 1 to dissipate heat on the server motherboards in multiple sub-shells 2 inside the outer shell 1, thus reducing the number of heat dissipation mechanisms 4 and greatly reducing the repair frequency of the heat dissipation mechanism 4.
[0088] Furthermore, the air inlet 101 and air outlet 102 of the server rack of the present invention are adjustable. When both the air inlet 101 and the air outlet 102 are open, the server rack is in external circulation mode. External airflow can enter the air duct through the air inlet 101, pass through the heat dissipation mechanism 4, and flow into the sub-shell 2 through the sub-shell air inlet. This cools the server motherboard and the electronic components on the server motherboard inside the sub-shell 2. Then, the airflow flows out through the sub-shell air outlet and the air outlet 102 in sequence.
[0089] When the outer casing air inlet 101 and outer casing air outlet 102 are closed, the server rack is in internal circulation mode. The airflow can circulate between the air duct, the heat dissipation mechanism 4, the sub-casing air inlet and the sub-casing air outlet, thereby achieving internal circulation cooling. It can isolate the external environment and prevent the cold air generated by the heat dissipation mechanism from flowing out, thereby improving the cooling effect and quickly dissipating heat from the server.
[0090] Therefore, the server rack of the present invention can overcome the shortcomings of the prior art, where the heat sink occupies a large space inside the server and each heat sink needs to be disassembled for repair when it is damaged, resulting in a large amount of server maintenance workload. At the same time, the server rack of the present invention has an internal circulation mode and an external circulation mode. In the internal circulation mode, it can quickly cool down the overheated server.
[0091] The number of sub-shells 2 can be one or more, preferably multiple, and multiple sub-shells 2 are arranged sequentially.
[0092] In one embodiment, the outer shell 1 further includes an inner shell, and a plurality of sub-shells 2 are disposed within the inner shell. Ventilation holes are provided on the inner shell at locations corresponding to the air inlets and outlets of the sub-shells. An air duct is formed between the outer shell 1 and the inner shell.
[0093] In one embodiment, the server rack further includes a first shield 501, a second shield 502, and a first drive mechanism 601. The first shield 501 is movably disposed at the air outlet 102 of the housing. The second shield 502 is movably disposed at the air inlet 101 of the housing. The first drive mechanism 601 is connected to the first shield 501 and the second shield 502, and is adapted to drive the first shield 501 to open the air outlet 102 and drive the second shield 502 to open the air inlet 101; or drive the first shield 501 to block the air outlet 102 and drive the second shield 502 to block the air inlet 101.
[0094] The first drive mechanism 601 may optionally include a first drive member and a second drive member. The first drive member is adapted to drive the first shield 501 to shield or open the air outlet 102 of the housing. The second drive member is adapted to drive the second shield 502 to shield or open the air inlet 101 of the housing.
[0095] The first drive mechanism 601 can also be selected as one, and can drive the first blocking member 501 and the second blocking member 502 simultaneously.
[0096] In one embodiment, the server rack further includes a control module, which is communicatively connected to a temperature signal terminal on the server motherboard and a first drive mechanism 601. The control module obtains the server temperature through the temperature signal terminal and controls the first drive mechanism to drive the first shield and the second shield based on the obtained temperature.
[0097] Under normal conditions, when the first shield 501 opens the air outlet 102 of the outer casing, the second shield 502 opens the air inlet 101 of the outer casing.
[0098] When the temperature signal detected at the terminal exceeds the preset safe temperature, the control module controls the first drive mechanism 601 to drive the first shield 501 to shield the air inlet 101 of the outer casing, and the second shield 502 to shield the air outlet 102 of the outer casing, thereby activating the internal circulation mode to isolate the server rack from the external environment and rapidly cool down the overheated server motherboard. Once the temperature signal detected at the terminal falls below the preset safe temperature, the control module controls the first drive mechanism 601 to open the air inlet 101 of the outer casing, and the second shield 502 to open the air outlet 102 of the outer casing.
[0099] The preset safe temperature is preferably the critical temperature at which the server 200 is about to overheat, such as 70°C to 85°C. In a preferred embodiment, the preset safe temperature is 75°C.
[0100] The control module may include programmable logic control components (such as PLC or CPU), memory, and electronic components connected to the programmable logic control components, which are well known to those skilled in the art and will not be described in detail here.
[0101] As an alternative implementation, the first blocking member 501 and the second blocking member 502 may be manually driven.
[0102] In one embodiment, the air duct includes a first section 301, a second section 302, and a third section 303 connected in sequence. The outer casing air outlet 102 and the sub-casing air outlet are located in the first section 301. The outer casing air inlet 101 and the heat dissipation mechanism 4 are located in the second section 302. The sub-casing air inlet is located in the third section 303.
[0103] The second baffle 502 includes a first baffle 5021 and a second baffle 5022. The first baffle 5021 is closable at the air inlet 101 of the housing. The second baffle 5022 is adapted to cut off the first segment 301 and the second segment 302 when the air inlet 101 of the housing is open, and to connect the first segment 301 and the second segment 302 when the air inlet 101 of the housing is closed.
[0104] With this configuration, the second shield 502 can cut off the first section 301 and the second section 302 when the housing air inlet 101 is closed, thereby preventing the airflow entering at the housing air inlet 101 from flowing out from the housing air outlet 102 without passing through the sub-housing 2, which helps to improve the heat dissipation effect.
[0105] The first baffle 5021 and the second baffle 5022 form an angle with each other, for example, in... Figure 1 In the embodiment shown, the first baffle 5021 and the second baffle 5022 are perpendicular to each other and form an L-shaped baffle. This allows the second baffle 5022 to fit against the inner wall of the outer casing 1 when the first baffle 5021 blocks the air inlet 101 of the outer casing, which helps to improve the air tightness of the air duct.
[0106] In one embodiment, the sub-shell 2 is connected to the top wall of the outer shell 1, and U-shaped air ducts are formed on both sides and below the sub-shell 2. The heat dissipation mechanism 4 is disposed below the sub-shell 2. The outer shell air inlet 101 and the outer shell air outlet 102 are arranged sequentially in the vertical direction.
[0107] As an alternative implementation, the sub-shell 2 is connected to the side wall of the outer shell 1, and a U-shaped air duct is formed on the other three sides of the sub-shell 2. The heat dissipation mechanism 4 is disposed between the other side wall of the outer shell 1 and the sub-shell 2. The outer shell air inlet 101 and the outer shell air outlet 102 are arranged sequentially in the horizontal direction.
[0108] In one embodiment, the first drive mechanism 601 is a linear drive mechanism. The linear drive mechanism is connected to the first shield 501 and the second shield 502 via a first transmission mechanism 602. This configuration allows the same linear drive mechanism to simultaneously drive the first shield 501 and the second shield 502, thereby reducing the manufacturing cost of the server rack.
[0109] In one embodiment, the first driving mechanism 601 further includes a rotation source fixedly mounted on the housing 1, and the first transmission mechanism 602 includes a connecting rod 6021, a threaded rod 6022, and a slider 6023. The connecting rod 6021 passes through the first section 301 of the air duct, and a first shielding member 501 and a second shielding member 502 are spaced apart and connected to the connecting rod 6021. The threaded rod 6022 is driven by the rotation source and extends along the length of the first section 301 of the air duct. The slider 6023 is sleeved on the threaded rod 6022 and threadedly connected to it, and the connecting rod 6021 is connected to the slider 6023. A guide rod 6024 passes through the slider 6023 and extends along the length of the first section 301 of the air duct.
[0110] The rotation source can drive the threaded rod 6022 to rotate along its own axis, so that the slider 6023 carrying the connecting rod 6021 moves along the length direction of the threaded rod 6022. The air inlet 101 and the air outlet 102 of the housing are distributed at intervals along the length direction of the first section. The first shielding member 501 and the second shielding member 502 move synchronously along the extension direction of the first section 301 of the air duct, thereby shielding or opening the air inlet 101 and the air outlet 102 of the housing. The guide rod 6024 can prevent the slider 6023 from rotating with the threaded rod 6022 and constrain the movement path of the guide rod 6024.
[0111] The rotation source can be a device capable of outputting rotation, such as an electric motor, engine, hydraulic motor, or a combination of one of these with a speed reducer.
[0112] As a possible implementation method, the linear drive device can be selected as a device capable of outputting linear motion, such as a hydraulic cylinder, a pneumatic cylinder, an electric cylinder, or a combination of a motor and a rack and pinion.
[0113] In one embodiment, the heat dissipation mechanism 4 includes an evaporator 401, a fan 402, and a cooling outdoor unit 403. The evaporator 401 is disposed within the second section 302 of the air duct. The fan 402 is disposed within the second section 302 of the air duct and located upstream of the evaporator 401, adapted to blow air toward the evaporator 401. The cooling outdoor unit 403 is connected to the evaporator 401 and is located outside the housing 1.
[0114] The refrigeration outdoor unit 403 mainly includes a compressor, condenser, fan motor, electrical control components, throttling components, gas-liquid separator, liquid receiver, four-way reversing valve, housing, etc., which are well known to those skilled in the art and will not be described in detail here.
[0115] The fan 402 drives airflow through the evaporator 401, whereby the airflow is cooled by the evaporator 401. The cooled airflow then passes through the sub-casing 2 and cools the server's motherboard and its electronic components inside the sub-casing 2. The fan 402 is preferably an axial flow fan that is compact, small in size, lightweight, has high rotational speed, and is easy to adjust in terms of airflow.
[0116] In one embodiment, the server rack further includes a sealing element 701 and a second drive mechanism 702. The sealing element 701 is movably disposed between the evaporator 401 and the air duct. The second drive mechanism 702 is connected to the sealing element 701 and is adapted to drive the sealing element 701 to seal or open the gap between the evaporator 401 and the air duct.
[0117] In one embodiment, the second drive mechanism 702 is communicatively connected to the control module. The control module is adapted to control the second drive mechanism 702 to drive the sealing member 701 to block the gap between the evaporator 401 and the air duct when the detected data at the temperature signal terminal is higher than a preset safe temperature. This forces the airflow blown out by the fan 402 to pass only through the evaporator 401, thereby enabling the evaporator 401 to cool the airflow more thoroughly and improve the heat dissipation effect of the heat dissipation mechanism 4.
[0118] When the server rack is in external circulation mode, the second drive mechanism 702 can drive the sealing component 701 to disengage from the gap between the evaporator 401 and the air duct, thereby reducing the air resistance in the air duct.
[0119] As an alternative implementation, the server rack also includes a connecting rod, one end of which is connected to a sealing element 701 and the other end of which passes through the housing 1. The user can hold the connecting rod and force the sealing element 701 to seal or open the gap between the evaporator 401 and the air duct.
[0120] As an alternative implementation, the second drive mechanism 702 is controlled by a switch located outside the housing 1. The user can operate the second drive mechanism 702 by pressing the switch to block or open the gap between the evaporator 401 and the air duct.
[0121] In one embodiment, the second drive mechanism 702 includes a slide rod 7021 and a linear drive mechanism 7022. The first end of the slide rod 7021 is connected to the sealing member 701 and extends along the length of the second segment 302 of the air duct. The linear drive mechanism 7022 is disposed on the housing and connected to the second end of the slide rod 7021. The linear drive mechanism 7022 is capable of driving the slide rod to move along the length of the second segment 302 of the air duct, thereby causing the sealing member to block or open the gap between the evaporator 401 and the air duct.
[0122] The linear drive mechanism 7022 is preferably disposed outside the housing 1 to avoid increasing the air resistance within the air duct, or to prevent the linear drive mechanism 7022 from generating heat that would raise the temperature inside the housing 1. Alternatively, the linear drive mechanism 7022 may be disposed inside the air duct. The linear drive mechanism 7022 may be a device capable of outputting linear motion, such as a hydraulic cylinder, pneumatic cylinder, electric cylinder, or a combination of a motor and rack and pinion.
[0123] In one embodiment, the server rack further includes a third shield 801 and a third drive mechanism 802. The third shield 801 is movably disposed at the sub-shell air inlet and / or sub-shell air outlet. The third drive mechanism 802 is adapted to drive the shield to adjust the ventilation area of the sub-shell air inlet and / or sub-shell air outlet.
[0124] The third drive mechanism 802 is preferably connected to the control module. When the temperature signal terminal detects a high value, the control module can control the third drive mechanism 802 to drive the shielding component, so that the third shielding component 801 increases the area of the sub-shell air inlet and / or sub-shell air outlet, thereby increasing the ventilation volume of the sub-shell 2 and thus improving the cooling effect on the server motherboard inside the sub-shell 2.
[0125] In one embodiment, a second transmission mechanism 803 is provided between the third drive mechanism 802 and the third blocking member 801.
[0126] In one embodiment, an air inlet and an air outlet are formed on opposite sides of the sub-housing 2. Each air inlet and outlet is provided with a third shielding member 801. The third drive mechanism 802 includes a dual-axis motor disposed within the sub-housing 2, with the rotating shafts on both sides of the dual-axis motor connected to the third shielding members 801 on both sides via a second transmission mechanism 803.
[0127] With this configuration, the rotating shafts on both sides of the dual-axis motor can simultaneously drive the third blocking components 801 at both ends, so that the third blocking components 801 at both ends can synchronously adjust the area of the sub-shell air inlet and sub-shell air outlet of the corresponding sub-shell 2. This allows each sub-shell 2 to have only one motor, which can adjust the area of the sub-shell air inlet and sub-shell air outlet.
[0128] Furthermore, each third drive mechanism 802 is adapted to adjust the area of the sub-shell air inlet and outlet corresponding to a sub-shell 2. This allows the control module to control the corresponding third drive mechanism 802 based on the temperature of each server's motherboard, thereby adjusting the area of the sub-shell air inlet and outlet of its corresponding sub-shell 2. This enables independent temperature regulation for each server's motherboard.
[0129] As a variable implementation, there are multiple sub-shells 2, which are connected in sequence. The air inlets of the multiple sub-shells are located on the same side, and the air outlets of the multiple sub-shells are located on the same side. The third drive mechanism 802 includes a first rotation source and / or a second rotation source.
[0130] The first rotation source is disposed outside the sub-shell 2 and located on the side of the sub-shell 2 where the sub-shell air inlet is provided. The second transmission mechanism 803 includes a first transmission rod driven by the first rotation source, and a plurality of third blocking members 801 are connected to the first transmission rod at intervals. The first rotation source is adapted to drive the first transmission rod to rotate about its own axis, and cause the plurality of third blocking members 801 to rotate relative to the plurality of sub-shell air inlets, so as to achieve the area adjustment of the plurality of sub-shell air inlets by means of a first rotation source.
[0131] The second rotation source is disposed outside the sub-shell 2 and located on the side of the sub-shell 2 where the sub-shell air outlet is provided. The second transmission mechanism 803 includes a second transmission rod driven by the second rotation source. A plurality of third blocking members 801 are connected to the second transmission rod at intervals. The second rotation source is adapted to drive the second transmission rod to rotate around its own axis and cause the plurality of third blocking members 801 to rotate relative to the plurality of sub-shell air outlets, so as to achieve the area adjustment of the plurality of sub-shell air outlets by means of a second rotation source.
[0132] In one embodiment, such as Figure 2 As shown, the second transmission mechanism 803 includes a first transmission gear 8031 and a second transmission gear 8032. The first transmission gear 8031 is sleeved on the rotating shaft of the dual-axis motor. The rotation axis of the second transmission gear 8032 forms an angle with the rotating shaft of the dual-axis motor. The third blocking member 801 includes a rotating cover plate. One end of the rotating cover plate is rotatably connected to the sub-housing 2, and the other end is connected to the rotating shaft of the second transmission gear 8032.
[0133] The rotating cover is adapted to rotate relative to the sub-housing 2 under the drive of the second transmission gear 8032, and to adjust the opening of the air inlet and outlet of the sub-housing 2. The larger the angle between the plane of the rotating cover and the plane of the air inlet or outlet of the sub-housing, the larger the ventilation area at the air inlet or outlet of the sub-housing; the smaller the angle between the plane of the rotating cover and the plane of the air inlet or outlet of the sub-housing, the smaller the ventilation area at the air inlet or outlet of the sub-housing.
[0134] In one embodiment, such as Figure 3 As shown, the third shielding member 801 includes multiple rotating cover plates that are installed at the air inlet or air outlet of the sub-shell and are arranged sequentially along the length of the air inlet or air outlet of the sub-shell. The second transmission gear 8032 is arranged in correspondence with the multiple rotating cover plates, and two adjacent second transmission gears 8032 mesh with each other.
[0135] In one embodiment, such as Figure 4 As shown, a heat-conducting plate suitable for contacting electronic components on the motherboard is provided inside the sub-shell 2, and heat dissipation fins 902 are formed on the heat-conducting plate. The two ends of the heat dissipation fins 902 are respectively positioned towards the air inlet and air outlet of the sub-shell. Airflow can pass through the sub-shell 2 and cool the heat dissipation fins 902 inside the sub-shell 2. The cooled heat dissipation fins 902 can then cool the electronic components on the motherboard through the heat-conducting plate.
[0136] In one embodiment, the server rack further includes a filter 10 and / or a drying screen 11 disposed within the air duct and upstream of the heat dissipation mechanism. The drying screen 11 is adapted to reduce the humidity within the server rack, preventing moisture in the airflow from affecting the server's operation. The filter 10 is adapted to filter contaminants in the airflow, preventing airborne contaminants from adhering to the server's motherboard.
[0137] Next, the method of using the server rack of the present invention will be described:
[0138] Under normal operating conditions, the outer casing air inlet 101 and outer casing air outlet 102 are open, the fan 402 works and drives the airflow. The airflow passes through the second section 302 and the third section 303 of the air duct from the outer casing air inlet 101, and then enters the sub-casing 2 through the sub-casing air inlet, carrying away the heat of the heat sink 902 so that the heat conduction plate 901 can cool the electronic components on the motherboard, such as the GPU. Cooled air flows out through the sub-casing air outlet and then is discharged through the outer casing air outlet 102. During operation, the control module acquires temperature data from the temperature signal terminal. When the temperature data is too high, the dual-axis motor drives the first transmission gear 8031 to rotate, which in turn drives the second transmission gear 8032 to rotate. The second transmission gear 8032 then drives multiple rotating covers to rotate. The rotation of the rotating covers adjusts the opening of the sub-casing air inlet and the sub-casing air outlet. When the GPU temperature is high, the opening of the sub-casing air inlet and the sub-casing air outlet is larger. Centralized ventilation solves the problem of increased maintenance workload caused by the need for separate heat dissipation in existing technologies.
[0139] When the temperature of one of the mainboards is high and its corresponding sub-casing air inlet and outlet are open to their maximum opening, the outdoor cooling unit 403 starts working. After working for a period of time, the first drive mechanism 601 drives the threaded rod 6022 to rotate. The rotation of the threaded rod 6022 causes the slider 6023 to descend. The slider 6023 carries the connecting rod 6021 down, so that the first shielding member 501 descends to close the outer casing air outlet 102. At the same time, the second shielding member 502 descends to close the outer casing air inlet 101 and connects the first section 301 and the second section 302 of the ventilation duct. Meanwhile, the second drive mechanism 702 drives the sealing member 701 to seal the gap between the evaporator 401 and the air duct, thereby allowing the air to pass through the evaporator 401 and cool down, thus achieving internal circulation cooling and isolating the external environment, thereby achieving classified heat dissipation.
[0140] Therefore, the scope of protection of this invention should be determined by the scope of the claims. As long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any way. This invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
Claims
1. A server rack, characterized in that, include: The outer casing (1) has an air inlet (101) and an air outlet (102), which are openable and closable. At least one sub-shell (2) is disposed within the outer shell (1) and is adapted to house the motherboard of the server. The sub-shell (2) has a sub-shell air inlet and a sub-shell air outlet. An air duct is formed between the outer shell (1) and the sub-shell (2), and the air duct is connected to the outer shell air inlet (101), the outer shell air outlet (102), the sub-shell air inlet and the sub-shell air outlet; A heat dissipation mechanism (4) is disposed in the air duct and located downstream of the outer casing air inlet (101) and upstream of the sub-casing air inlet; The second shield (502) is movably disposed at the air inlet (101) of the outer casing; The air duct includes a first section (301), a second section (302), and a third section (303) connected in sequence. The outer shell air outlet (102) and the sub-shell air outlet are located in the first section (301), the outer shell air inlet (101) and the heat dissipation mechanism (4) are located in the second section (302), and the sub-shell air inlet is located in the third section (303). The second shield (502) includes a first baffle (5021) and a second baffle (5022). The first baffle (5021) is closable at the air inlet (101) of the housing. The second baffle (5022) is adapted to cut off the first segment (301) and the second segment (302) when the air inlet (101) of the housing is open, and to connect the first segment (301) and the second segment (302) when the air inlet (101) of the housing is closed.
2. The server rack according to claim 1, characterized in that, The server rack also includes: A first shield (501) is movably disposed at the air outlet (102) of the outer casing; A first driving mechanism (601) is connected to the first shielding member (501) and the second shielding member (502). The first driving mechanism (601) is adapted to drive the first shielding member (501) to open the air outlet (102) of the outer casing and drive the second shielding member (502) to open the air inlet (101) of the outer casing; or drive the first shielding member (501) to block the air outlet (102) of the outer casing and drive the second shielding member (502) to block the air inlet (101) of the outer casing.
3. The server rack according to claim 2, characterized in that, The first driving mechanism (601) is a linear driving mechanism, which is connected to the first blocking member (501) and the second blocking member (502) through the first transmission mechanism (602).
4. The server rack according to claim 3, characterized in that, The first drive mechanism (601) further includes a rotation source fixedly mounted on the housing (1), and the first transmission mechanism (602) includes: A connecting rod (6021) is inserted into the first section (301) of the air duct, and the first shielding member (501) and the second shielding member (502) are connected to the connecting rod (6021) at intervals. A threaded rod (6022), driven by the rotation source, extends along the length of the first segment (301) of the air duct; A slider (6023) is sleeved on the threaded rod (6022) and threadedly connected to the threaded rod (6022). The connecting rod (6021) is connected to the slider (6023). A guide rod (6024) passes through the slider (6023) and extends along the length of the first segment (301) of the air duct.
5. The server rack according to any one of claims 1 to 4, characterized in that, The heat dissipation mechanism (4) includes: An evaporator (401) is disposed within the second section (302) of the air duct; A fan (402) is disposed in the second section (302) of the air duct and located upstream of the evaporator (401), and is adapted to blow air toward the evaporator (401); The outdoor refrigeration unit (403) is connected to the evaporator (401) and is located on the outside of the outer casing (1); The server rack also includes: A sealing element (701) is movably disposed between the evaporator (401) and the air duct; The second drive mechanism (702) is connected to the sealing member (701) and is adapted to drive the sealing member (701) to seal or open the gap between the evaporator (401) and the air duct; The second drive mechanism (702) includes: A slide bar (7021) has its first end connected to the sealing member (701) and extends along the length of the second section (302) of the air duct; A linear drive mechanism (7022) is disposed on the housing and connected to the second end of the slide bar (7021).
6. The server rack according to any one of claims 1 to 4, characterized in that, Also includes: The third shield (801) is movably installed at the air inlet and / or air outlet of the sub-shell (2); The third drive mechanism (802) is adapted to drive the shield to move in order to adjust the ventilation area of the sub-housing air inlet and / or sub-housing air outlet.
7. The server rack according to claim 6, characterized in that, A second transmission mechanism (803) is provided between the third drive mechanism (802) and the third shielding member (801).
8. The server rack according to claim 7, characterized in that, The air inlet and air outlet are respectively formed on opposite sides of the sub-shell (2), and the air inlet and air outlet are respectively provided with the third shielding member (801). The third drive mechanism (802) includes a dual-axis motor disposed in the sub-shell (2). The rotating shafts on both sides of the dual-axis motor are connected to the third shielding members (801) on both sides through the second transmission mechanism (803).
9. The server rack according to claim 8, characterized in that, The second transmission mechanism (803) includes: The first transmission gear (8031) is sleeved on the rotating shaft of the dual-shaft motor; The second transmission gear (8032) has its rotation axis forming an angle with the shaft of the dual-axis motor. The third shielding member (801) includes a rotating cover plate, one end of which is rotatably connected to the sub-housing (2), and the other end is connected to the shaft of the second transmission gear (8032).
10. The server rack according to claim 9, characterized in that, The third shielding member (801) includes a plurality of rotating cover plates that are disposed on the air inlet or air outlet of the sub-shell and are arranged sequentially along the length of the air inlet or air outlet of the sub-shell. The second transmission gear (8032) is arranged in a one-to-one correspondence with the plurality of rotating cover plates, and two adjacent second transmission gears (8032) mesh with each other.
11. The server rack according to any one of claims 1 to 4, characterized in that, The sub-shell (2) is provided with a heat-conducting plate suitable for contacting electronic devices on the motherboard. Heat dissipation fins (902) are formed on the heat-conducting plate, and the two ends of the heat dissipation fins (902) are respectively arranged towards the air inlet and air outlet of the sub-shell.
12. The server rack according to any one of claims 1 to 4, characterized in that, It also includes a filter (10) and / or a drying screen (11) disposed in the air duct and located upstream of the heat dissipation mechanism (4).