Piezoelectric vibration device manufacturing apparatus and piezoelectric vibration device manufacturing method

Abstract

The present application provides a piezoelectric vibration device manufacturing apparatus and a piezoelectric vibration device manufacturing method capable of arranging a plurality of piezoelectric elements at a prescribed position in a prescribed orientation in a plurality of holding members. A plurality of suction heads (20) are moved simultaneously in a reciprocating manner by a suction head moving apparatus (12). The plurality of suction heads (20) respectively suction piezoelectric elements (P) through a plurality of suction nozzles (28). At least one of a horizontal movement mechanism (21) for the suction heads, a vertical movement mechanism (24) for the suction heads, and a rotational movement mechanism (26) for the suction heads respectively independently adjusts the position of the suction nozzles (28) based on information related to the position of the plurality of piezoelectric elements (P) respectively suctioned by the plurality of suction nozzles (28) and information related to the position of a plurality of holding members (H) supplied to a holding member supply position (Sh), so as to arrange the piezoelectric elements (P) respectively suctioned by the plurality of suction nozzles (28) in the corresponding holding members (H).

Description

Technical Field

[0001] This invention relates to an apparatus for manufacturing piezoelectric vibrating devices and a method for manufacturing piezoelectric vibrating devices. Background Technology

[0002] Piezoelectric resonators include, for example, crystal oscillators that utilize a crystal resonator. The crystal oscillator has a crystal resonator as a piezoelectric element and a holding member that holds the crystal resonator. The crystal oscillator holds the crystal resonator within the box-shaped holding member, which is made of an insulator such as ceramic. The crystal oscillator is encapsulated with the electrodes of the crystal resonator engaged with the electrodes within the holding member.

[0003] In a piezoelectric vibrating device manufacturing apparatus for manufacturing such a piezoelectric vibrating device, the piezoelectric element and the holding member are supplied separately. The piezoelectric vibrating device manufacturing apparatus places the piezoelectric element, supplied by a transfer device such as an adsorption head, within the holding member coated with a bonding material. At this time, it is necessary to place the piezoelectric element within the holding member in such a way that the portion other than the electrodes does not contact the holding member. Therefore, piezoelectric vibrating device manufacturing apparatuses that place the piezoelectric element, positioned relative to the transfer device, within the holding member are known. For example, Patent Document 1 discloses a component mounting apparatus that mounts the supplied component onto a component mounting wafer after positioning the component.

[0004] Patent Document 1 describes a component mounting apparatus comprising a tray for temporarily placing multiple component parts for positioning. The tray has multiple recesses for temporarily placing the component parts. The walls of the recesses are inclined in the depth direction and exposed on the opening side of the recess. Component parts inserted into the recesses slide on the walls of the recesses and are positioned on the bottom surface of the recesses. The component parts are positioned on the bottom surface of the recesses by the walls of the recesses. The component mounting apparatus transports the multiple component parts positioned on the bottom surfaces of the multiple recesses onto a component mounting wafer. Thus, the component mounting apparatus can arrange multiple component parts at predetermined positions on the component mounting wafer with predetermined orientations.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2012 / 99560 Summary of the Invention

[0008] The technical problem that the invention aims to solve

[0009] The component mounting device transports a plurality of supplied component parts to the tray via a suction moving unit, where they are positioned. Then, the component mounting device adsorbs the plurality of component parts positioned in the tray via the adsorption part of the suction moving unit and transports them onto the component mounting wafer. Therefore, there is a possibility that the position and orientation of the plurality of component parts may shift relative to their position in the tray during adsorption. Furthermore, in order to arrange the component parts within the recess, the recess of the tray has a bottom surface such that a gap is created between the wall surface and the component part located on the bottom surface. Therefore, there is a possibility that the position and orientation of the component parts relative to the tray may shift by the amount of the gap created between the wall surface and the component part located on the bottom surface.

[0010] The purpose of this invention is to provide an apparatus for manufacturing a piezoelectric vibrating device and a method for manufacturing a piezoelectric vibrating device, which are capable of arranging multiple piezoelectric elements at predetermined positions and in predetermined orientations to multiple holding members.

[0011] Solution to the above technical problems

[0012] The inventors have studied a piezoelectric vibrating device manufacturing apparatus and a piezoelectric vibrating device manufacturing method that can arrange multiple piezoelectric elements at specified positions and in specified orientations to multiple holding members without increasing the production cycle time. As a result of in-depth research, the inventors conceived of the following configuration.

[0013] The piezoelectric vibration device manufacturing apparatus of one embodiment of the present invention is a piezoelectric vibration device manufacturing apparatus for manufacturing a piezoelectric vibration device having at least a piezoelectric element and a holding member for holding the piezoelectric element, wherein the piezoelectric element is joined to the holding member by a bonding material.

[0014] A piezoelectric vibration device manufacturing apparatus includes: a plurality of adsorption heads, each adsorbing one piezoelectric element; and an adsorption head moving device, which carries the plurality of adsorption heads and causes them to simultaneously reciprocate between a piezoelectric element supply position for supplying the plurality of piezoelectric elements and a holding member supply position for supplying the plurality of holding members. Each adsorption head includes: an adsorption nozzle for adsorbing the piezoelectric element; a horizontal moving mechanism for moving the adsorption nozzle horizontally; a vertical moving mechanism for moving the adsorption nozzle vertically; and a rotary moving mechanism for moving the adsorption nozzle in a rotational direction about a vertical axis.

[0015] Multiple adsorption heads adsorb the piezoelectric elements supplied to the piezoelectric element supply position via multiple adsorption nozzles at the piezoelectric element supply position. The multiple adsorption heads move from the piezoelectric element supply position to the holding member supply position via an adsorption head moving device. At least one of a horizontal moving mechanism, a vertical moving mechanism, and a rotary moving mechanism for the adsorption heads independently adjusts the positions of the multiple adsorption nozzles to position each piezoelectric element adsorbed by the multiple adsorption nozzles in its corresponding holding member position, based on information related to the positions of the multiple piezoelectric elements adsorbed by the multiple adsorption nozzles and information related to the positions of the multiple holding members supplied to the holding member supply position.

[0016] In the above configuration, multiple adsorption heads adsorb the piezoelectric elements through their respective adsorption nozzles, thus conveying the multiple piezoelectric elements. At this time, each adsorption head independently adjusts the position of its adsorption nozzle based on information related to the position of the adsorbed piezoelectric elements and information related to the position of each holding member on which the adsorbed piezoelectric elements are respectively positioned. Therefore, the multiple adsorption heads can independently adjust the position of the adsorbed piezoelectric elements, taking into account any offset during adsorption, in a manner corresponding to the horizontal and vertical positions of the holding members. Furthermore, the multiple adsorption heads independently adjust the position of their adsorption nozzles based on numerical data related to the position of the piezoelectric elements and the position of the holding members. Therefore, the piezoelectric vibration device manufacturing apparatus does not require temporary placement of the piezoelectric elements for alignment. Thus, multiple piezoelectric elements can be positioned at predetermined locations and with predetermined orientations on multiple holding members without increasing the production cycle time.

[0017] According to another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: The piezoelectric vibration device manufacturing apparatus includes: a plurality of supply heads for supplying the bonding material to the holding member respectively; and a supply head moving device that carries the plurality of supply heads and causes the plurality of supply heads to simultaneously reciprocate between a standby position of the plurality of supply heads and a supply position of the holding member.

[0018] The supply head includes: a supply device for supplying the bonding material; a horizontal moving mechanism for moving the supply device horizontally; and a vertical moving mechanism for moving the supply device vertically. The supply head moving mechanism moves a plurality of supply heads from the standby position to the holding member supply position. At least one of the horizontal moving mechanism or the vertical moving mechanism independently adjusts the position of the supply device based on information related to the positions of the plurality of holding members supplied to the holding member supply position, so that the plurality of supply devices can supply the bonding material to the plurality of holding members respectively.

[0019] In the above configuration, the positions of the multiple supply heads are independently adjusted to correspond to the horizontal and vertical positions of the holding members. This allows the supply device to discharge bonding material to a predetermined position within the holding members. Furthermore, the multiple supply heads independently adjust the positions of the supply device based on information related to the positions of the multiple holding members, which is obtained numerical data. Therefore, the piezoelectric vibration device manufacturing apparatus does not require alignment of the holding members relative to the supply device. Thus, bonding material can be individually positioned at predetermined locations on the multiple holding members without increasing the production cycle time. Consequently, multiple piezoelectric elements can be individually positioned at predetermined locations and with predetermined orientations on the multiple holding members.

[0020] According to another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: At the holding member supply position, a plurality of supply heads independently and individually supply the bonding material from a plurality of supply devices to a plurality of holding members. At the holding member supply position, a plurality of suction heads independently and individually arrange the piezoelectric elements, each adsorbed by a plurality of suction nozzles, on the plurality of holding members on which the bonding material has been supplied.

[0021] In the above configuration, the plurality of supply heads independently adjust the horizontal and vertical positions of the plurality of supply devices based on information related to the position of the holding members. The plurality of supply devices independently supply the bonding material to predetermined positions of the plurality of holding members. Thus, the plurality of supply devices can discharge bonding material to predetermined positions within the holding members while taking into account deviations in the positions of the plurality of holding members. Furthermore, the plurality of suction heads independently adjust the horizontal and vertical positions of the plurality of suction nozzles based on information related to the position of the piezoelectric element and information related to the position of the holding members. The plurality of suction nozzles independently and individually position the piezoelectric element at predetermined positions on the plurality of holding members. Thus, the suction heads can position the piezoelectric element on the holding members while taking into account deviations in the shape of the holding members. Therefore, it is possible to position multiple piezoelectric elements at predetermined positions and with predetermined orientations on multiple holding members without increasing the production cycle time.

[0022] According to another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: The plurality of supply heads can simultaneously adjust the position of their respective supply devices via at least one of a horizontal moving mechanism for the supply heads or a vertical moving mechanism for the supply heads. Furthermore, the plurality of suction heads can simultaneously adjust the position of their respective suction nozzles via at least one of a horizontal moving mechanism for the suction heads, a vertical moving mechanism for the suction heads, or a rotary moving mechanism for the suction heads.

[0023] In the above configuration, the piezoelectric vibration device manufacturing apparatus simultaneously adjusts the positions of the plurality of adsorption heads and the plurality of supply heads via each moving mechanism. Therefore, regardless of the number of adsorption heads and the plurality of supply heads, the time required to adjust their positions can be suppressed. Consequently, material can be supplied to predetermined positions of the plurality of holding members without increasing the production cycle time. Furthermore, multiple piezoelectric elements can be arranged at predetermined positions of the plurality of holding members in predetermined orientations without increasing the production cycle time.

[0024] According to another viewpoint, the piezoelectric vibration device manufacturing apparatus of the present invention preferably includes the following configuration: The piezoelectric vibration device manufacturing apparatus includes: a piezoelectric element position measuring device, which measures the horizontal position and orientation of the piezoelectric elements adsorbed by the plurality of adsorption heads respectively as information related to the position of the piezoelectric elements; and a holding member position measuring device, which measures the horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position respectively as information related to the position of the holding members.

[0025] In the above configuration, the piezoelectric element position measuring device measures the horizontal position and orientation of the piezoelectric element while it is being held by multiple suction nozzles. That is, the piezoelectric element position measuring device measures the offset of each of the multiple piezoelectric elements attached to the suction nozzles. Furthermore, the holding member position measuring device measures not only the horizontal position of each of the multiple holding members supplied to the holding member supply position, but also their vertical position. Therefore, by means of the holding member position measuring device, the vertical position of each piezoelectric element disposed on one of the multiple holding members can be independently adjusted based on the vertical position of the corresponding holding member. Thus, multiple piezoelectric elements can be disposed on multiple holding members at predetermined positions and with predetermined orientations without increasing the production cycle time.

[0026] A method for manufacturing a piezoelectric vibrating device according to an embodiment of the present invention is a method for manufacturing a piezoelectric vibrating device having at least a piezoelectric element and a holding member for holding the piezoelectric element, wherein the piezoelectric element is joined to the holding member by a bonding material.

[0027] A method for manufacturing a piezoelectric vibration device includes: a piezoelectric element supply step, in which a plurality of piezoelectric elements are supplied to a piezoelectric element supply position; a piezoelectric element positioning step, in which the plurality of piezoelectric elements are positioned to the piezoelectric element supply position; a holding member supply step, in which a plurality of holding members are supplied to a holding member supply position; a holding member positioning step, in which the plurality of holding members are positioned to the holding member supply position; a piezoelectric element conveying step, in which the plurality of piezoelectric elements positioned at the piezoelectric element supply position are conveyed from the piezoelectric element supply position to the holding member supply position; and a piezoelectric element position adjustment step, in which the positions of the plurality of piezoelectric elements are independently and individually adjusted, based on information related to the positions of the plurality of piezoelectric elements conveyed from the piezoelectric element supply position to the holding member supply position and information related to the positions of the holding members positioned at the holding member supply position, such that the plurality of piezoelectric elements conveyed from the piezoelectric element supply position to the holding member supply position are respectively arranged in the corresponding holding members.

[0028] In the above configuration, the manufacturing method of the piezoelectric vibration device includes a piezoelectric element position adjustment step. This step independently adjusts the positions of multiple piezoelectric elements based on information related to the position of the holding members and information related to the position of the piezoelectric elements acquired during transport in the piezoelectric element transport step. The information related to the position of the piezoelectric elements includes information considering the orientation of the multiple piezoelectric elements during transport. Therefore, there is no need for a separate step after the piezoelectric element transport step to position the piezoelectric elements by temporary placement or the like. Thus, multiple piezoelectric elements can be positioned at predetermined locations and with predetermined orientations in multiple holding members without increasing the production cycle time.

[0029] According to another viewpoint, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: A bonding material supply position adjustment step, wherein, at the holding member supply position, the supply position of the bonding material supplied to the holding member is adjusted based on information related to the position of the holding member supplied to the holding member supply position.

[0030] In the above configuration, during the bonding material supply position adjustment process, the position of the bonding material supplied is individually adjusted to match the position of the holding member. Furthermore, since the bonding material supply position is adjusted individually based on information relating to the positions of the multiple holding members as acquired numerical data, there is no need for individual alignment of each holding member. Therefore, it is possible to arrange multiple piezoelectric elements at predetermined positions and in predetermined orientations onto multiple holding members without increasing the production cycle time.

[0031] According to another viewpoint, the manufacturing method of the piezoelectric vibrating device of the present invention preferably includes the following configuration. The manufacturing method of the piezoelectric vibrating device includes: a bonding material supply step, wherein bonding material is supplied to a plurality of holding members respectively at the holding member supply position; and a piezoelectric element bonding step, wherein a plurality of piezoelectric elements conveyed from the piezoelectric element supply position to the holding member supply position are respectively disposed on the plurality of holding members on which the bonding material is supplied at the holding member supply position.

[0032] In the above configuration, during the bonding material supply process, the supply position of the bonding material in the plurality of holding members is adjusted based on information related to the positions of the plurality of holding members. Furthermore, during the piezoelectric element bonding process, the arrangement position of the plurality of piezoelectric elements in the plurality of holding members is adjusted based on information related to the positions of the piezoelectric elements and information related to the positions of the holding members. Therefore, it is possible to arrange the plurality of piezoelectric elements at predetermined positions and with predetermined orientations onto the plurality of holding members.

[0033] According to another viewpoint, the method for manufacturing the piezoelectric vibration device of the present invention preferably includes the following configuration: The bonding material supply position adjustment step is a step of simultaneously adjusting the position of supplying the bonding material to the plurality of holding members. Furthermore, the piezoelectric element position adjustment step is a step of simultaneously adjusting the position of the plurality of piezoelectric elements such that the plurality of piezoelectric elements can be respectively arranged in the holding members.

[0034] In the above configuration, during the piezoelectric element position adjustment step, the arrangement positions of multiple piezoelectric elements are adjusted simultaneously, and during the bonding material supply position adjustment step, multiple supply positions of the bonding material are adjusted simultaneously. Therefore, regardless of the number of piezoelectric elements disposed on the holding members, the time required to adjust the arrangement positions of the multiple piezoelectric elements and the supply positions of the bonding material can be suppressed. Thus, the supply material can be supplied to the predetermined positions of the multiple holding members without increasing the production cycle time. Furthermore, multiple piezoelectric elements can be disposed on the multiple holding members at predetermined positions and with predetermined orientations without increasing the production cycle time.

[0035] According to another viewpoint, the manufacturing method of the piezoelectric vibration device of the present invention preferably includes the following configuration: a piezoelectric element position information acquisition step, which acquires information relating to the horizontal position and orientation of a plurality of piezoelectric elements supplied from the piezoelectric element supply position to the holding member supply position; and a holding member position information acquisition step, which acquires information relating to the horizontal and vertical positions of a plurality of holding members supplied to the holding member supply position.

[0036] In the above configuration, during the piezoelectric element position information acquisition step, the horizontal positions and orientations of the multiple piezoelectric elements in the piezoelectric element conveying step are measured. That is, the posture of the adsorbed piezoelectric element is measured during the piezoelectric element position information acquisition step. Furthermore, during the holding member position information acquisition step, not only are the horizontal positions of the multiple holding members measured, but their vertical positions are also measured. Therefore, the vertical positions of the piezoelectric elements respectively positioned on the multiple holding members can be independently adjusted based on the vertical positions of the corresponding holding members. Thus, multiple piezoelectric elements can be positioned on multiple holding members at predetermined locations and with predetermined orientations without increasing the production cycle time.

[0037] [Piezoelectric Vibration Devices]

[0038] In this specification, a piezoelectric vibrating device refers to an electronic component that has a piezoelectric element that converts force applied to a piezoelectric body into voltage, or converts voltage applied to a piezoelectric body into force. Piezoelectric vibrating devices include crystal oscillators, crystal oscillators, etc. Piezoelectric vibrating devices are used in oscillation circuits, filter circuits, actuators, sensors, etc.

[0039] [Piezoelectric element]

[0040] In this specification, a piezoelectric element refers to a piezoelectric body that converts applied force into voltage or applied voltage into force. In this embodiment, the piezoelectric element is a plate-shaped crystal vibrating sheet obtained by cutting crystal in a specific direction. The piezoelectric element has electrodes formed into films by vapor deposition, sputtering, or the like.

[0041] [Retaining component]

[0042] In this specification, the retaining member refers to a container made of an insulator used to hold the piezoelectric element. In this embodiment, the retaining member is a ceramic housing. The retaining member has electrodes internally connected to the piezoelectric element. The retaining member also has recesses internally for accommodating the piezoelectric element.

[0043] [Bonding Material]

[0044] In this specification, the bonding material refers to the material used to bond the piezoelectric element to the material maintaining the conductivity of the container. Examples of bonding materials include solder and adhesives. In this embodiment, the bonding material is a thermosetting adhesive.

[0045] [Relative distance]

[0046] In this specification, relative distance refers to the distance between the centers of the components.

[0047] [Location-related information]

[0048] In this specification, position-related information refers to the coordinates of a specific point in the device, component, etc., being examined, with any point in the piezoelectric vibrating device manufacturing apparatus as the origin, in the X, Y, Z, and θ directions. The coordinates in this embodiment are based on a coordinate system with any point in the piezoelectric vibrating device manufacturing apparatus as the origin.

[0049] Invention Effects

[0050] According to one embodiment of the present invention, multiple piezoelectric elements can be disposed in predetermined positions and orientations to multiple holding members without increasing the production cycle time. Attached Figure Description

[0051] Figure 1 This is a schematic top view showing the overall configuration of the piezoelectric vibration device manufacturing apparatus according to Embodiment 1 of the present invention.

[0052] Figure 2A This is a top view showing a plurality of piezoelectric elements and a tray supplied to the piezoelectric vibration device manufacturing apparatus according to Embodiment 1 of the present invention.

[0053] Figure 2B This is a schematic top view showing a plurality of holding members supplied to a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention.

[0054] Figure 3 This is a schematic top view showing the overall configuration of the piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention, which includes a plurality of adsorption heads.

[0055] Figure 4 yes Figure 3 View A in the diagram.

[0056] Figure 5 This is a schematic side view showing the overall configuration of the piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention, which includes a plurality of supply heads.

[0057] Figure 6 This is a block diagram illustrating the control configuration of a piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention.

[0058] Figure 7 This is a schematic top view showing a piezoelectric vibrating device manufacturing apparatus according to an embodiment of the present invention, in which multiple adsorption heads transport piezoelectric elements to a position for holding components in supply.

[0059] Figure 8 This is a schematic top view showing the state in which the positions of the suction nozzles of the multiple suction heads of the piezoelectric vibration device manufacturing apparatus according to an embodiment of the present invention are adjusted.

[0060] Figure 9 This is a flowchart of a method for manufacturing a piezoelectric vibration device according to an embodiment of the present invention.

[0061] Figure 10 This is a top view showing the working state of the piezoelectric vibrating device manufacturing apparatus in the process of acquiring position information of holding component, supplying piezoelectric element, supplying holding component, positioning piezoelectric element, and positioning holding component in the manufacturing method of the piezoelectric vibrating device according to an embodiment of the present invention.

[0062] Figure 11 This is a top view showing the working state of the bonding material supply position adjustment step and the bonding material supply step of the piezoelectric vibrating device manufacturing method according to an embodiment of the present invention.

[0063] Figure 12This is a top view showing the working state of the piezoelectric vibrating device manufacturing apparatus in the piezoelectric element conveying process, piezoelectric element position information acquisition process, piezoelectric element position adjustment process, and piezoelectric element joining process of the manufacturing method of the piezoelectric vibrating device according to an embodiment of the present invention.

[0064] Figure 13 This is a top view showing the configuration of a piezoelectric vibrating device manufacturing line, which includes an embodiment of the present invention, of a piezoelectric vibrating device manufacturing apparatus.

[0065] Figure 14 This is a block diagram illustrating the control configuration of a piezoelectric vibrating device manufacturing line, which includes an embodiment of the present invention. Detailed Implementation

[0066] Hereinafter, each embodiment will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are used to label the same parts, and the description of the same parts will not be repeated. In addition, the dimensions of the constituent parts in the drawings do not faithfully represent the actual dimensions of the constituent parts or the dimensional ratios of each constituent part.

[0067] Furthermore, in the following description of the piezoelectric vibration device manufacturing apparatus 1 according to an embodiment of the present invention, the direction in which the piezoelectric element P is conveyed to the piezoelectric element supply position Sp is defined as the "X direction". The direction in which the piezoelectric element P is conveyed from the piezoelectric element supply position Sp to the holding member supply position Sh, which is orthogonal to the X direction, is defined as the "Y direction". The direction orthogonal to both the X and Y directions is defined as the "Z direction". The direction of rotation about an axis extending in the Z direction is defined as the θ direction. In addition, in this embodiment, the X and Y directions are directions in the horizontal plane. The Z direction is the vertical direction. However, it is not intended that the orientation of the piezoelectric vibration device manufacturing apparatus 1 during use be limited by the definition of these directions.

[0068] Furthermore, in the following explanation, the terms "fixed," "connected," "joined," and "installed" (hereinafter referred to as "fixed, etc.") include not only cases where components are directly fixed to each other, but also cases where they are fixed via other components. That is, in the following explanation, the term "fixed, etc." includes both direct and indirect fixing of components to each other.

[0069] [Implementation Method 1]

[0070] <Overall Composition of Piezoelectric Vibration Device Manufacturing Equipment>

[0071] use Figures 1 to 6 The piezoelectric vibrating device manufacturing apparatus 1 of Embodiment 1, which is the apparatus for manufacturing the piezoelectric vibrating device of the present invention, will be described. Figure 1This is a schematic top view showing the overall configuration of the piezoelectric vibration device manufacturing apparatus 1 according to Embodiment 1 of the present invention. Figure 2A This is a top view showing multiple piezoelectric elements P and a tray T supplied to the piezoelectric vibration device manufacturing apparatus 1. Figure 2B This is a schematic top view showing a plurality of holding members H supplied to the piezoelectric vibration device manufacturing apparatus 1. Figure 3 This is a schematic top view showing the overall configuration of the multiple adsorption heads 20 of the piezoelectric vibration device manufacturing apparatus 1. Figure 4 yes Figure 3 View A in the diagram. Figure 5 This is a schematic side view showing the overall configuration of the multiple supply heads 30 of the piezoelectric vibration device manufacturing apparatus 1. Figure 6 This is a block diagram showing the control configuration of the piezoelectric vibration device manufacturing apparatus 1.

[0072] like Figure 1 As shown, the piezoelectric vibration device manufacturing apparatus 1 includes a stand 2, a piezoelectric element supply device 10, a holding component supply device 11, a suction head moving device 12, a supply head moving device 13, a camera 14 serving as a piezoelectric element position measuring device, a laser measuring device 15 serving as a holding component position measuring device, a control device 16, a suction head 20, and a supply head 30. Each device is arranged on the horizontal surface of the stand 2, i.e., the mounting surface. The piezoelectric vibration device manufacturing apparatus 1 supplies multiple piezoelectric elements P and multiple holding components H via a supply line not shown in the figure.

[0073] like Figure 2A and Figure 2B As shown, in the piezoelectric vibration device manufacturing apparatus 1, multiple piezoelectric elements P are supplied while maintaining a relative distance from each other. In this embodiment, a tray T, which serves as a container for the piezoelectric elements P, is provided with multiple recesses C on which the piezoelectric elements P can be arranged. The recesses C are rectangular when viewed from above. On the tray T, a group of multiple recesses C arranged at intervals Px in the X direction are arranged at intervals Py in the Y direction. That is, in the tray T, the multiple recesses C are arranged in a matrix shape with intervals Px in the X direction and intervals Py in the Y direction. The piezoelectric elements P are located in the recesses C of the tray T respectively. Furthermore, the intervals Px and Py between adjacent recesses C are the intervals between the centers (intersections of the diagonals) of the rectangular recesses C when viewed from above.

[0074] In the piezoelectric vibration device manufacturing apparatus 1, a plurality of holding members H are supplied in a state that maintains a relative distance from each other. In this embodiment, for the plurality of holding members H, a group of the plurality of holding members H are aligned in the X direction at intervals Px and in the Y direction at intervals Py. That is, the plurality of holding members H are arranged in a matrix shape with intervals Px in the X direction and intervals Py in the Y direction. Furthermore, the plurality of holding members H are formed as interconnected sheets. In addition, the plurality of holding members H arranged as sheets are located at positions corresponding to the intervals Px in the X direction and Py in the Y direction of the recess C.

[0075] The holding member H is, for example, rectangular in shape when viewed from above. The holding member H is configured, for example, with a long side of 2.0 mm and a short side of 1.6 mm. Alternatively, the holding member H is configured, for example, with a long side of 1.6 mm and a short side of 1.2 mm. Furthermore, the holding member H is configured, for example, with a long side of 1.2 mm and a short side of 1.0 mm. Additionally, the size of the sheet formed by connecting multiple holding members is the same regardless of the size of the holding member H. That is, the number of holding members H contained in the sheet varies depending on the size of the holding member H. With this configuration, even if the size of the holding member H is changed, the piezoelectric vibration device manufacturing apparatus 1 does not need to replace the adsorption head moving device 12, the supply head moving device 13, etc., which will be described later.

[0076] like Figure 1 As shown, the piezoelectric element supply device 10 is a positioning device that transports a tray T containing multiple piezoelectric elements P to a piezoelectric element supply position Sp, and determines the position of the piezoelectric element P to be supplied at the piezoelectric element supply position Sp. In this embodiment, the piezoelectric element supply device 10 is a single-axis linear drive unit having a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The piezoelectric element supply device 10 is arranged on the frame 2 with the direction of transporting the piezoelectric element P when viewed in the vertical direction as the X direction.

[0077] The piezoelectric element supply device 10 has a tray holding section 10a for holding a tray T. The piezoelectric element supply device 10 can move the tray holding section 10a to any position within its operating range according to the rotation amount of a servo motor. In the piezoelectric element supply device 10, in the piezoelectric element standby position Wp, a supply line (not shown) externally supplies the tray T to the tray holding section 10a. The tray T placed in the tray holding section 10a can be conveyed to the piezoelectric element supply position Sp. Furthermore, the piezoelectric element supply position Sp in the piezoelectric element supply device 10 is predetermined. In addition, in order to position the piezoelectric element P of the plurality of piezoelectric elements P housed in the tray T to the piezoelectric element supply position Sp, the piezoelectric element supply device 10 determines a stop position of the tray holding section 10a for each piezoelectric element P of the intended supply based on the position of the intended piezoelectric element P on the tray holding section 10a. The piezoelectric element supply device 10 positions the piezoelectric element P of the supply object to the piezoelectric element supply position Sp based on the stop position determined for each piezoelectric element P of the supply object.

[0078] The holding component supply device 11 is a device that transports a plurality of holding components H connected in a sheet shape to a holding component supply position Sh, and positions the holding component H to be supplied at the holding component supply position Sh. In this embodiment, the holding component supply device 11 is a single-axis linear drive unit having a servo motor as an actuator and a ball screw unit as a linear drive mechanism, etc. The holding component supply device 11 is arranged on the frame 2 with the direction of transporting the holding component H when viewed in the vertical direction as the X direction.

[0079] The holding component supply device 11 is positioned adjacent to the piezoelectric element supply device 10 on the stand 2. The holding component supply device 11 has a holding component mounting section 11a that holds a plurality of holding components H. The holding component supply device 11 can move the holding component mounting section 11a to any position within its operating range according to the rotation amount of the servo motor. In the holding component supply device 11, in the holding component standby position Wh, a plurality of holding components H are supplied to the holding component mounting section 11a from an external supply line (not shown). The holding component supply device 11 can transport the plurality of holding components H mounted on the holding component mounting section 11a to the holding component supply position Sh. Furthermore, the holding component supply position Sh in the holding component supply device 11 is predetermined. In addition, in order to position any holding component H among the plurality of holding components H arranged in a sheet-like manner to the holding component supply position Sh, the holding component supply device 11 determines a stop position of the holding component mounting section 11a for each holding component H to be supplied, based on the position of the holding component H to be supplied on the holding component mounting section 11a. The holding component supply device 11 positions the holding component H of the supply object to the holding component supply position Sh based on the stop position determined for each holding component H of the supply object.

[0080] The adsorption head moving device 12 is a device that moves multiple adsorption heads 20 simultaneously. In this embodiment, the adsorption head moving device 12 is a single-axis linear drive unit having a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The adsorption head moving device 12 is positioned on the stand 2 with the direction in which the multiple adsorption heads 20 are transported when viewed vertically as the Y direction. Furthermore, the adsorption head moving device 12 is located above the piezoelectric element supply device 10 and the holding component supply device 11 in the vertical direction (Z direction).

[0081] The adsorption head moving device 12 has an adsorption head mounting section 12a that holds a plurality of adsorption heads 20. The adsorption head mounting section 12a has a horizontal mounting surface on which the plurality of adsorption heads 20 are mounted. The adsorption head moving device 12 can move the adsorption head mounting section 12a to any position within the operating range according to the rotation amount of the servo motor. The adsorption head moving device 12 causes the plurality of adsorption heads 20 mounted on the mounting surface of the adsorption head mounting section 12a to reciprocate between the piezoelectric element supply position Sp and the holding member supply position Sh.

[0082] In order to move the plurality of adsorption heads 20 to the piezoelectric element supply position Sp, the adsorption head moving device 12 determines the stop position of the adsorption head mounting section 12a for each piezoelectric element P of the supply object based on the position of the piezoelectric element P of the supply object on the tray mounting section 10a. Similarly, in order to move the plurality of adsorption heads 20 to the holding member supply position Sh, the adsorption head moving device 12 determines the stop position of the adsorption head mounting section 12a for each holding member H of the supply object based on the position of the holding member H of the supply object on the holding member mounting section 11a.

[0083] The supply head moving device 13 is a device that moves multiple supply heads 30 simultaneously. In this embodiment, the supply head moving device 13 is a single-axis linear drive unit having a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The supply head moving device 13 is positioned on the stand 2 with the direction in which multiple supply heads 30 are fed when viewed vertically as the Y direction. The supply head moving device 13 is located above the holding component supply device 11 in the vertical direction (Z direction).

[0084] The supply head moving device 13 has a supply head mounting section 13a that holds a plurality of supply heads 30. The supply head mounting section 13a has a horizontal mounting surface on which the plurality of supply heads 30 are mounted. The supply head moving device 13 can move the supply head mounting section 13a to any position within its operating range according to the rotation amount of the servo motor. The supply head moving device 13 can transport the plurality of supply heads 30 mounted on the supply head mounting section 13a from the standby position W to the holding member supply position Sh. In addition, in order to move the plurality of supply heads 30 to the holding member supply position Sh, the supply head moving device 13 determines a stop position of the supply head mounting section 13a for each holding member H of the supply object based on the position of the holding member H of the supply object on the holding member mounting section 11a.

[0085] like Figure 3 and Figure 4 As shown, the adsorption head 20 is a device that uses the adsorption nozzle 28 to adsorb the piezoelectric element P and place it in the recess of the holding member H. The adsorption head 20 has a horizontal moving mechanism 21 for the adsorption head, a vertical moving mechanism 24 for the adsorption head, a rotary moving mechanism 26 for the adsorption head, and an adsorption nozzle 28.

[0086] The horizontal moving mechanism 21 for the adsorption head includes a plate-shaped first moving member 22 for the adsorption head that moves in a first direction, and a plate-shaped second moving member 23 for the adsorption head that moves in a second direction different from the first direction. The first moving member 22 for the adsorption head can move in the first direction using a stepper motor and a cam mechanism as actuators. The second moving member 23 for the adsorption head can move in the second direction using a stepper motor and a cam mechanism as actuators.

[0087] The first moving member 22 for the adsorption head is disposed on the adsorption head mounting portion 12a of the adsorption head moving device 12. When viewed vertically, the first moving member 22 for the adsorption head is disposed such that the first direction of movement is the X direction in the horizontal direction. Therefore, the first moving member 22 for the adsorption head can move relative to the adsorption head mounting portion 12a in the X direction in the horizontal direction.

[0088] The second moving member 23 for the adsorption head is disposed on top of the first moving member 22 for the adsorption head. When viewed in the vertical direction, the second moving member 23 for the adsorption head is disposed such that the second direction of movement is the Y direction, which is orthogonal to the X direction in the horizontal direction. Therefore, the second moving member 23 for the adsorption head can move relative to the first moving member 22 for the adsorption head in the Y direction, which is orthogonal to the X direction in the horizontal direction.

[0089] The horizontal moving mechanism 21 for the adsorption head, configured in this way, allows the second moving member 23 for the adsorption head to move relative to the adsorption head mounting portion 12a in the horizontal X direction via the first moving member 22 for the adsorption head. Furthermore, the horizontal moving mechanism 21 for the adsorption head allows the second moving member 23 for the adsorption head to move relative to the first moving member 22 for the adsorption head in the horizontal Y direction, which is orthogonal to the X direction. In other words, the horizontal moving mechanism 21 for the adsorption head allows the second moving member 23 for the adsorption head to move relative to the adsorption head mounting portion 12a in both the horizontal X direction and the Y direction, which is orthogonal to the X direction.

[0090] The vertical moving mechanism 24 for the adsorption head has a plate-shaped third moving member 25 for the adsorption head that moves in a direction perpendicular to the moving directions of the horizontal moving mechanism 21 for the adsorption head, namely the first direction and the second direction. The third moving member 25 for the adsorption head can move in the third direction via a servo motor as an actuator and a ball screw unit as a linear drive mechanism.

[0091] The third moving member 25 for the adsorption head is mounted on the vertical moving mechanism 24 for the adsorption head. At this time, the third moving member 25 for the adsorption head is arranged such that the third direction of movement is the Z direction. As a result, the third moving member 25 for the adsorption head can move relative to the adsorption head mounting portion 12a in the horizontal X and Y directions, and can move in the vertical Z direction.

[0092] The adsorption head rotary moving mechanism 26 has a cylindrical adsorption head fourth moving member 27 that moves (rotates) about an axis extending in the third direction, which is the moving direction of the adsorption head vertical moving mechanism 24. The adsorption head fourth moving member 27 can move in the rotational direction by means of a stepper motor or the like, which acts as an actuator.

[0093] The fourth moving member 27 for the adsorption head is mounted on the rotary moving mechanism 26 for the adsorption head. At this time, the fourth moving member 27 for the adsorption head is configured such that the third direction, which is the axis of rotation, is the Z direction. That is, the fourth moving member 27 for the adsorption head can rotate in the direction of rotation about the vertical axis, i.e., the θ direction. Therefore, the fourth moving member 27 for the adsorption head can move relative to the adsorption head mounting portion 12a in the horizontal X and Y directions, and can move in the vertical Z direction, and can rotate in the θ direction.

[0094] The suction nozzle 28 is the nozzle for adsorbing the piezoelectric element P within the recess C of the adsorption tray T. The suction nozzle 28 is mounted on the fourth moving member 27 for the adsorption head. The suction nozzle 28 is positioned at the lower end of the fourth moving member 27 for the adsorption head. The suction nozzle 28 has a lower end shape capable of adsorbing the piezoelectric element P. Furthermore, the suction nozzle 28 has an adsorption hole at its lower end. When the adsorption hole is blocked by the piezoelectric element P, the suction nozzle 28 creates a negative pressure within the adsorption hole, thereby adsorbing the piezoelectric element P. The suction nozzle 28, positioned on the fourth moving member 27 for the adsorption head, can move relative to the adsorption head mounting portion 12a in the horizontal X and Y directions, and can move in the vertical Z direction, and can rotate in the θ direction.

[0095] In this way, the horizontal moving mechanism 21, the vertical moving mechanism 24, and the rotary moving mechanism 26 constituting the adsorption head 20 each have a servo motor as an actuator in each direction of movement. Furthermore, the horizontal moving mechanism 21, the vertical moving mechanism 24, and the rotary moving mechanism 26 are not interconnected. That is, the horizontal moving mechanism 21, the vertical moving mechanism 24, and the rotary moving mechanism 26 can move independently in each direction.

[0096] The piezoelectric vibration device manufacturing apparatus 1 has multiple adsorption heads 20. For example, the piezoelectric vibration device manufacturing apparatus 1 has four adsorption heads 20. The four adsorption heads 20 are mounted on the adsorption head mounting portion 12a of the adsorption head moving device 12. Thus, the four adsorption heads 20 are configured to move simultaneously between the piezoelectric element supply position Sp and the holding member supply position Sh via the adsorption head moving device 12. On the other hand, the movable portions of the four adsorption heads 20 are not interconnected. That is, the adsorption nozzles 28 of the four adsorption heads 20 can move independently in the X, Y, Z, and θ directions while mounted on the adsorption head mounting portion 12a.

[0097] Two adsorption heads 20 are arranged in the X direction. Furthermore, one adsorption head 20 is arranged in the Y direction on each of the two adsorption heads 20 arranged in the X direction. That is, the four adsorption heads 20 are arranged in a matrix in both the X and Y directions. The adsorption nozzles 28 of the adsorption heads 20 arranged in the X direction are spaced at intervals that are integer multiples of Px, i.e., A times the distance between the recess C and the sheet-like holding member H provided on the tray T. The adsorption nozzles 28 of the adsorption heads 20 arranged in the Y direction are spaced at intervals that are integer multiples of Py, i.e., B times the distance between the recess C and the sheet-like holding member H provided on the tray T.

[0098] With this configuration, the four adsorption heads 20 can adsorb the piezoelectric elements P located on the tray T one by one through the adsorption nozzles 28 at the piezoelectric element supply position Sp. That is, the four adsorption heads 20 can respectively adsorb any selected piezoelectric element P, the Ath piezoelectric element P in the X direction starting from the arbitrarily selected piezoelectric element P, the Bth piezoelectric element P in the Y direction starting from the arbitrarily selected piezoelectric element P, and the Ath piezoelectric element P in the X direction and the Bth piezoelectric element P in the Y direction starting from the arbitrarily selected piezoelectric element P.

[0099] Similarly, the four adsorption heads 20 can sequentially arrange the piezoelectric elements P adsorbed by each adsorption nozzle 28 into the recesses of the holding member H at the holding member supply position Sh. That is, the four adsorption heads 20 can respectively adsorb any selected holding member H, the Ath holding member H in the X direction starting from the arbitrarily selected holding member H, the Bth holding member H in the Y direction starting from the arbitrarily selected holding member H, and the Ath holding member H in the X direction and the Bth holding member H in the Y direction starting from the arbitrarily selected holding member H.

[0100] like Figure 5 As shown, the supply head 30 is a device for supplying bonding material into the recesses of a plurality of sheet-shaped holding members H. The supply head 30 includes a horizontal moving mechanism 31 for the supply head, a vertical moving mechanism 34 for the supply head, and a supply device 36.

[0101] The horizontal moving mechanism 31 for the supply head includes a first moving member 32 for the supply head that moves in a first direction, and a second moving member 33 for the supply head that moves in a second direction different from the first direction. The first moving member 32 for the supply head can move in the first direction via a stepper motor and a cam mechanism acting as actuators. The second moving member 33 for the supply head can move in the second direction via a stepper motor and a cam mechanism acting as actuators.

[0102] The first moving member 32 for the supply head is disposed on the supply head mounting portion 13a of the supply head moving device 13. At this time, the first moving member 32 for the supply head is disposed such that the first direction of movement when viewed in the vertical direction is the X direction. As a result, the first moving member 32 for the supply head can move relative to the supply head mounting portion 13a in the X direction in the horizontal direction.

[0103] The second moving member 33 for the supply head is disposed on top of the first moving member 32 for the supply head. The second moving member 33 for the supply head is disposed such that, when viewed in the vertical direction, the second direction of movement is the Y direction in the horizontal direction, which is orthogonal to the X direction. As a result, the second moving member 33 for the supply head can move relative to the first moving member 32 for the supply head in the Y direction in the horizontal direction.

[0104] The horizontal moving mechanism 31 for the supply head configured in this way can move the second moving member 33 for the supply head relative to the supply head mounting portion 13a in the horizontal X direction via the first moving member 32 for the supply head. Furthermore, the horizontal moving mechanism 31 for the supply head can move the second moving member 33 for the supply head relative to the first moving member 32 for the supply head in the horizontal Y direction, which is orthogonal to the X direction. In other words, the horizontal moving mechanism 31 for the supply head can move the second moving member 33 for the supply head relative to the supply head mounting portion 13a in both the horizontal X direction and the Y direction, which is orthogonal to the X direction.

[0105] The vertical moving mechanism 34 for the supply head has a plate-shaped third moving member 35 for the supply head that moves in a direction perpendicular to the moving directions of the horizontal moving mechanism 31 for the supply head, namely the first direction and the second direction. The third moving member 35 for the supply head can move in the third direction via a servo motor as an actuator and a ball screw unit as a linear drive mechanism.

[0106] The third moving member 35 for the supply head is disposed in the vertical moving mechanism 34 for the supply head. At this time, the third moving member 35 for the supply head is disposed such that the third direction of movement is the Z direction. As a result, the third moving member 35 for the supply head can move relative to the supply head mounting part 13a in the horizontal X and Y directions and can move in the vertical Z direction.

[0107] The supply device 36 is a device for supplying bonding material into the recess of the holding member H, on which the piezoelectric element P is disposed. In this embodiment, the supply device 36 is a discharge device that discharges a predetermined amount of conductive adhesive. The supply device 36 is disposed on the third moving member 35 for the supply head. The supply device 36 has a discharge nozzle 36a shaped to supply bonding material into the recess of the holding member H in the vertical direction (Z direction) downwards. When viewed in the horizontal direction, the supply device 36 discharges bonding material from the discharge nozzle 36a downwards in the vertical direction (Z direction). Furthermore, the discharge nozzle 36a is configured to move in the Z direction when in contact with the holding member H from the Z direction. The supply device 36, mounted on the third moving member 35 for the supply head, can move relative to the supply head mounting portion 13a in the horizontal X and Y directions and can move in the vertical Z direction.

[0108] Furthermore, the supply device 36 includes a cooling device 36b. The cooling device 36b consists of a Peltier element, which is a semiconductor thermoelectric element, and an air-cooled fan for cooling the Peltier element. The cooling device 36b is located near the discharge nozzle 36a. The cooling device 36b maintains the temperature of the bonding material within the supply device 36 at an appropriate temperature. Therefore, the supply device 36 maintains the viscosity of the bonding material within a certain range, thus preventing blockage of the bonding material in the discharge nozzle 36a.

[0109] Furthermore, the supply device 36 has a contact sensor (not shown) that detects the position of the discharge nozzle 36a in the Z direction. The contact sensor detects the movement of the discharge nozzle 36a in the Z direction. Therefore, the contact sensor can detect when the tip of the discharge nozzle 36a contacts the holding member H. The control device 16, described later, controls the supply device 36 using the position of the third moving member 35 of the supply head when the contact sensor detects contact between the discharge nozzle 36a and the holding member H as the zero point. The contact sensor is positioned closer to the supply device 36 than the Z-direction guide (not shown) of the third moving member 35 of the supply head. Preferably, the contact sensor is positioned on the Z-axis of the discharge nozzle 36a.

[0110] Thus, the horizontal moving mechanism 31 and the vertical moving mechanism 34 constituting the supply head 30 each have a servo motor as an actuator in each direction of movement. Furthermore, the horizontal moving mechanism 31 and the vertical moving mechanism 34 are not configured to be interconnected. That is, the horizontal moving mechanism 31 and the vertical moving mechanism 34 can move independently of each other.

[0111] The piezoelectric vibration device manufacturing apparatus 1 has multiple supply heads 30. For example, the piezoelectric vibration device manufacturing apparatus 1 has four supply heads 30. The four supply heads 30 are disposed in the supply head mounting section 13a of the supply head moving device 13. Thus, the four supply heads 30 are configured to move simultaneously between a standby position W and a component supply position Sh via the supply head moving device 13. On the other hand, the movable parts of the four supply heads 30 are not connected to each other. That is, the supply devices 36 of the four supply heads 30 can move independently in the X, Y, and Z directions while mounted on the supply head mounting section 13a.

[0112] Two supply heads 30 are arranged in the X direction. Furthermore, one supply head 30 is arranged in the Y direction, corresponding to the two supply heads 30 arranged in the X direction. That is, the four supply heads 30 are arranged in a matrix in both the X and Y directions. The discharge nozzles 36a of the supply devices 36 of the supply heads 30 arranged in the X direction are arranged at intervals that are integer multiples of the spacing Px (i.e., A times) of the sheet-like retaining members H. The discharge nozzles 36a of the supply devices 36 of the supply heads 30 arranged in the Y direction are arranged at intervals that are integer multiples of the spacing Py (i.e., B times) of the spacing Py of the sheet-like retaining members H.

[0113] Furthermore, a confirmation camera 37 for confirming the coating diameter of the bonding material pre-sprayed by the supply head 36 is placed on the supply head mounting section 13a. Additionally, a pre-spraying section 38 for pre-spraying by the supply device 36 is disposed below the supply device 36, which is in a standby position W (described later).

[0114] With this configuration, the four supply heads 30 can supply bonding material to the holding member H at the holding member supply position Sh, without moving the position of the supply device 36 via the supply head moving device 13 and the supply head horizontal moving mechanism 31. That is, the four supply heads 30 can supply bonding material to any selected holding member H, the Ath holding member H in the X direction starting from the randomly selected holding member H, the Bth holding member H in the Y direction starting from the randomly selected holding member H, and the Ath holding member H in the X direction and the Bth holding member H in the Y direction starting from the randomly selected holding member H.

[0115] like Figure 1 and Figure 6As shown, the camera 14, serving as a piezoelectric element position measuring device, measures the position of the piezoelectric elements P adsorbed by the four suction nozzles 28 relative to the suction head 20. The camera 14 is positioned on the stand 2 below the suction head moving device 12 in the vertical direction. Furthermore, when viewed vertically, the camera 14 is positioned overlapping with the suction head 20, which moves via the suction head moving device 12. Additionally, the camera 14 is configured to capture images from above in the vertical direction. Thus, the camera 14 can capture images from below the suction head 20, showing the suction head 20 moving via the suction head moving device 12, and the piezoelectric elements P adsorbed by the suction head 20. In other words, the camera 14 can capture images for measuring the position of the piezoelectric elements P adsorbed by the four suction nozzles 28 relative to the suction head 20.

[0116] The laser measuring device 15, serving as a holding member position measuring device, measures the shape, including position, of a plurality of holding members H connected in a sheet-like manner. The laser measuring device 15 is positioned on the stand 2 above the holding member supply device 11 in the vertical direction. Furthermore, when viewed vertically, the laser measuring device 15 is positioned overlapping with the sheet-like holding members H supplied by the holding member supply device 11. Additionally, the laser measuring device 15 is configured to irradiate a laser beam downwards in the vertical direction. Thus, the laser measuring device 15 can measure the sheet-like holding members H supplied to the holding member supply device 11 from above.

[0117] That is, the laser measuring device 15 can measure the shape in three dimensions based on the shape, position, and thickness information of each portion in the vertical direction of the plurality of holding members H connected in a sheet-like manner. Furthermore, the laser measuring device 15 is configured to rotate and move horizontally in a manner that matches the horizontal position and degree of rotation of each holding member H. Thus, the shape of the holding members, including their position, can be measured more accurately using laser scanning.

[0118] like Figure 6 As shown, the control device 16 controls the piezoelectric element supply device 10, the holding component supply device 11, the suction head moving device 12, the supply head moving device 13, the suction head 20, the supply head 30, the camera 14, and the laser measuring device 15. The control device 16 is essentially connected via a bus to the CPU, ROM, RAM, etc. Alternatively, the control device 16 may be composed of a single-chip LSI, etc. The control device 16 stores various programs and data for controlling the operation of each actuator, the camera 14, and the laser measuring device 15, or for processing image data.

[0119] The control device 16 is electrically connected to the servo motors of the piezoelectric element supply device 10, the holding component supply device 11, the suction head moving device 12, and the supply head moving device 13, and can be controlled independently. Furthermore, the control device 16 is electrically connected to the servo motors of the suction head horizontal moving mechanism 21, the suction head vertical moving mechanism 24, and the suction head rotary moving mechanism 26 of the suction head 20, and can be controlled independently. Additionally, the control device 16 can control the solenoid valve for suction switching of the suction head 20 (not shown). Furthermore, the control device 16 is electrically connected to the servo motors of the supply head horizontal moving mechanism 31 and the supply head vertical moving mechanism 34, and can be controlled independently. Furthermore, the control device 16 is electrically connected to the four supply devices 36, and can be controlled independently.

[0120] The control device 16 is electrically connected to the camera 14 and is capable of controlling the camera 14. Furthermore, the control device 16 is capable of acquiring images captured by the camera 14. Additionally, the control device 16 is electrically connected to the laser measuring device 15 and is capable of controlling the laser measuring device 15. Furthermore, the control device 16 is capable of acquiring measurement values ​​obtained by the laser measuring device 15 for the position and shape of each of the multiple holding members H.

[0121] The piezoelectric vibrating device manufacturing apparatus 1 configured in this way has multiple adsorption heads 20 capable of independently moving the adsorption nozzles 28 in the X, Y, Z, and θ directions. Furthermore, the piezoelectric vibrating device manufacturing apparatus 1 can independently control the position of the adsorption nozzles 28 in each of the multiple adsorption heads 20. In addition, the piezoelectric vibrating device manufacturing apparatus 1 has multiple supply heads 30 capable of independently moving the material supply device 36 in the X, Y, and Z directions. Furthermore, the piezoelectric vibrating device manufacturing apparatus 1 can independently control the position of the supply device 36 in each of the multiple supply heads 30.

[0122] <Regarding the adsorption position of piezoelectric elements and the position of retaining components>

[0123] Next, use Figure 2A and Figure 2B The positions of the piezoelectric elements P adsorbed by the four adsorption heads 20 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention on the tray T and the positions of the holding members H on which the piezoelectric elements P are arranged will be described.

[0124] The suction nozzles 28 of the four suction heads 20 are spaced apart by A times Px in the X direction and by B times Py in the Y direction. Therefore, the first suction head 20 of the four suction heads 20 adsorbs the first piezoelectric element P1 stored in any of the recesses C on the tray T containing the piezoelectric element P. The second suction head 20 of the four suction heads adsorbs the second piezoelectric element P2 stored in the recesses C adjacent to the first piezoelectric element P1 in the X direction by A units. The third suction head 20 of the four suction heads adsorbs the third piezoelectric element P3 stored in the recesses C adjacent to the first piezoelectric element P1 in the Y direction by B units. The fourth adsorption head 20 of the four adsorption heads 20 adsorbs the fourth piezoelectric element P4 stored in the recess C that is adjacent to the first piezoelectric element P1 in the X direction by A and adjacent to the first piezoelectric element P1 in the Y direction by B.

[0125] When the four adsorption heads 20 adsorb piezoelectric elements P that are housed in adjacent recesses C in the X direction starting from the recess C that houses the first piezoelectric element P1, they also adsorb piezoelectric elements P that are housed in adjacent recesses C in the X direction starting from the recesses C that house the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4. When the four adsorption heads 20 adsorb piezoelectric elements P that are housed in adjacent recesses C in the Y direction starting from the recess C that houses the first piezoelectric element P1, they also adsorb piezoelectric elements P that are housed in adjacent recesses C in the Y direction starting from the recesses C that house the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4.

[0126] Therefore, the four adsorption heads 20 respectively adsorb the piezoelectric elements P contained in the following four regions of the plurality of recesses C on the tray T. These four regions are defined by the range extending from the recess C containing the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 to the recesses C adjacent to each other in the X direction (A-1), and from the recess C containing the first piezoelectric element P1, the second piezoelectric element P2, the third piezoelectric element P3, and the fourth piezoelectric element P4 to the recesses C adjacent to each other in the Y direction (B-1). That is, the first adsorption head 20 adsorbs the piezoelectric element P within the first piezoelectric element region Rp1, including the recess C containing the first piezoelectric element P1. The second adsorption head 20 adsorbs piezoelectric elements P within the second piezoelectric element region Rp2, including the recess C containing the second piezoelectric element P2. The third adsorption head 20 adsorbs piezoelectric elements P within the third piezoelectric element region Rp3, including the recess C containing the third piezoelectric element P3. The fourth adsorption head 20 adsorbs piezoelectric elements P within the fourth piezoelectric element region Rp4, including the recess C containing the fourth piezoelectric element P4. Thus, each adsorption head 20 adsorbs a corresponding number of piezoelectric elements P contained within regions of equal shape.

[0127] A first adsorption head 20, which adsorbs the first piezoelectric element P1, positions the first piezoelectric element P1 within a recess of a holding member H, i.e., the first holding member H1, at an arbitrary position. A second adsorption head 20, which adsorbs the second piezoelectric element P2, positions the second piezoelectric element P2 within a recess of a holding member H adjacent to the first holding member H1 in the X direction, i.e., the second holding member H2. A third adsorption head 20, which adsorbs the third piezoelectric element P3, positions the third piezoelectric element P3 within a recess of a holding member H adjacent to the first holding member H1 in the Y direction, i.e., the third holding member H3. A fourth adsorption head 20, which adsorbs the fourth piezoelectric element P4, positions the fourth piezoelectric element P4 within a recess of a holding member H adjacent to the first holding member H1 in the X direction, i.e., the fourth holding member H4, in the Y direction, i.e., the fourth holding member H4. In this way, each holding member H holds a piezoelectric element P.

[0128] When the four adsorption heads 20 are configured to place the piezoelectric element P into one of the adjacent holding members H in the X direction starting from the first holding member H1 where the first piezoelectric element P1 is disposed, the piezoelectric element P is also configured into one of the adjacent holding members H in the X direction starting from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4. When the four adsorption heads 20 are configured to place the piezoelectric element P into the recess of one of the adjacent holding members H in the Y direction starting from the first holding member H1 where the first piezoelectric element P1 is disposed, the piezoelectric element P is also configured into the recess of one of the adjacent holding members H in the Y direction starting from the first holding member H1, the second holding member H2, the third holding member H3, and the fourth holding member H4.

[0129] Therefore, the four adsorption heads 20 respectively place the piezoelectric element P within the recesses of the retaining members H in the following four regions of the plurality of retaining members H connected in a sheet-like manner. These four regions are enclosed by the range from the first retaining member H1, the second retaining member H2, the third retaining member H3, and the fourth retaining member H4 up to the adjacent (A-1) retaining members H in the X direction, and the range from the first retaining member H1, the second retaining member H2, the third retaining member H3, and the fourth retaining member H4 up to the adjacent (B-1) retaining members H in the Y direction. That is, the first adsorption head 20 places the first piezoelectric element P1 within the recess of the retaining member H in the first retaining member region Rh1 containing the first retaining member H1. The second adsorption head 20 places the second piezoelectric element P2 within the recess of the retaining member H in the second retaining member region Rh2 containing the second retaining member H2. The third adsorption head 20 positions the third piezoelectric element P3 within a recess of the retaining member H in the third retaining member region Rh3, which includes the third retaining member H3. The fourth adsorption head 20 positions the fourth piezoelectric element P4 within a recess of the retaining member H in the fourth retaining member region Rh4, which includes the fourth retaining member H4. Thus, each adsorption head 20 positions a piezoelectric element P within a recess of the retaining member H in a region corresponding to the number of adsorption heads 20 and of equal shape.

[0130] Furthermore, when a piezoelectric element P, adsorbed from a recess C at any position within the first piezoelectric element region Rp1 by the adsorption head 20, is placed in a holding member H within the first holding member region Rh1 at a position corresponding to the recess C within the first piezoelectric element region Rp1 where the adsorbed piezoelectric element P was housed, the first holding member region Rh1 has the same shape as the first piezoelectric element region Rp1. The second holding member region Rh2 has the same shape as the second piezoelectric element region Rp2. The third holding member region Rh3 has the same shape as the third piezoelectric element region Rp3. The fourth holding member region Rh4 has the same shape as the fourth piezoelectric element region Rp4. That is, the arrangement of the holding members H from the first holding member region Rh1 to the fourth holding member region Rh4 is equivalent to the arrangement of the piezoelectric element P from the first piezoelectric element region Rp1 to the fourth piezoelectric element region Rp4.

[0131] <Adjustment of the position of piezoelectric elements>

[0132] Next, use Figure 1 , Figure 7 and Figure 8 The position adjustment of the adsorption nozzle 28 in the adsorption head 20 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described. Figure 7 This is a schematic top view showing the state in which multiple adsorption heads 20 of the piezoelectric vibrating device manufacturing apparatus 1 transport the piezoelectric element P to the holding component supply position Sh. Figure 8 This is a schematic top view showing the state in which the multiple adsorption heads 20 of the piezoelectric vibration device manufacturing apparatus 1 have adjusted the position of the adsorption nozzles 28.

[0133] The control device 16 has information related to the position of the holding component supply device 11, the position of the adsorption head moving device 12, the position of the supply head moving device 13, the position of the camera 14, the position of the laser measuring device 15, the position of the adsorption head 20, and the position of the supply head 30.

[0134] like Figure 1 As shown, the control device 16 measures the shape of the multiple sheet-shaped holding members H conveyed by the holding member supply device 11 via the laser measuring device 15. At this time, the control device 16 acquires the measurement values ​​of the shape of the multiple sheet-shaped holding members H measured by the laser measuring device 15. After acquiring the measurement values ​​of the shape of the holding members H, the control device 16 conveys the multiple sheet-shaped holding members H to the holding member supply position Sh via the holding member supply device 11.

[0135] The control device 16 calculates the coordinates H(n)(x0, y0, z0, θ0) of the center position of each holding component H in the X, Y, and Z directions and the orientation in the θ direction (which is the length direction) based on the acquired measurement values ​​of the multiple holding components H and the delivery position of the multiple holding components H in the holding component supply device 11 during the measurement by the laser measuring device 15. Here, (n) is the number of the holding component H. The control device 16 stores the measured coordinates H(n)(x0n, y0n, z0n, θ0n) of the holding component H as information Ih related to the position of the holding component H.

[0136] like Figure 7 As shown, the control device 16 controls the holding member supply device 11 based on the predetermined engagement sequence of the piezoelectric elements P in the plurality of holding members H, thereby conveying the first holding member H1 to the fourth holding member H4, which are configured with the first piezoelectric element P1 to the fourth piezoelectric element P4, to the holding member supply position Sh. Based on the calculated information Ih related to the position of the holding member H, the control device 16 extracts the coordinate values ​​of the first holding member H1 to the fourth holding member H4 at the holding member supply position Sh, namely H1(x11, y11, z11, θ11), H2(x12, y12, z12, θ12), H3(x13, y13, z13, θ13), and H4(x14, y14, z14, θ14).

[0137] The control device 16 controls the adsorption head moving device 12 to transport the four adsorption heads 20, each adsorbing one of the four piezoelectric elements P1 to the fourth piezoelectric element P4, to the holding component supply position Sh. The control device 16 controls the camera 14 to take pictures from below of the first piezoelectric element P1 to the fourth piezoelectric element P4 adsorbed by the four adsorption heads 20 through the adsorption nozzles 28.

[0138] The control device 16 acquires images captured by the camera 14. The control device 16 detects the adsorption head 20 and the first to fourth piezoelectric elements P1 to P4 adsorbed by the adsorption nozzle 28 from the acquired images. Based on the detected adsorption head 20 and the first to fourth piezoelectric elements P1 to P4 adsorbed by the adsorption nozzle 28, and the transport position of the adsorption head 20 in the adsorption head moving device 12 during image capture, the control device 16 calculates and displays the coordinate values ​​of the center positions in the X and Y directions of the detected first to fourth piezoelectric elements P1 to P4, and the orientation of their long sides, namely P1(x01, y01, θ01), P2(x02, y02, θ02), P3(x03, y03, θ03), and P4(x04, y04, θ04).

[0139] The control device 16 calculates the coordinate values ​​of the first piezoelectric element P1 to the fourth piezoelectric element P4 adsorbed by the suction nozzle 28 at the holding member supply position Sh based on the coordinate values ​​of the first holding member H1 to the fourth holding member H4 in the X direction, Y direction, and θ direction, namely H1(x11, y11, θ11), H2(x12, y12, θ12), H3(x13, y13, θ13), and H4(x14, y14, θ14), namely P1(x11, y11, θ11), P2(x12, y12, θ12), P3(x13, y13, θ13), and P4(x14, y14, θ14), and stores them as information Ip related to the position of the piezoelectric element P.

[0140] The control device 16 calculates the amount of movement of the suction nozzle 28 in the X, Y, θ and Z directions required to make the coordinate value of the first piezoelectric element P1 at the holding component supply position Sh, i.e., P1(x11, y11, θ11), match the coordinate value of the first holding component H1 at the holding component supply position Sh, i.e., H1(x11, y11, θ11). Similarly, the control device 16 calculates the required adjustment amount of the suction nozzle 28 in the X direction, Y direction, θ direction and Z direction, i.e. Ap2(x12, y12, z12, θ12), Ap3(x13, y13, θ13), P4(x14, y14, θ14) at the second piezoelectric element P2 to the fourth piezoelectric element P4 at the holding component supply position Sh, i.e., P2(x12, y12, θ12), H3(x13, y13, θ13), H4(x14, y14, θ14), to make the coordinate values ​​of the second holding component H2 to the fourth holding component H4 at the holding component supply position Sh consistent with the coordinate values ​​of the second holding component H2 to the fourth holding component H4 at the holding component supply position Sh, i.e., Ap2(x12, y12, z12, θ12), Ap3(x13, y13, z13, θ13), Ap4(x14, y14, z14, θ14).

[0141] like Figure 8As shown, the control device 16, based on the calculated adjustment amounts of the four suction nozzles 28 in the X, Y, and θ directions and the movement amounts in the Z direction, namely Ap1(x11, y11, z11, θ11), Ap2(x12, y12, z12, θ12), Ap3(x13, y13, z13, θ13), and Ap4(x14, y14, z14, θ14), controls the horizontal movement mechanism 21 and the rotational movement mechanism 26 of each suction head 20 to independently adjust the horizontal position and tilt of the suction nozzle 28 for each suction head 20. Furthermore, based on the calculated movement amount in the Z direction, the control device 16 controls the vertical movement mechanism 24 of each suction head 20 to arrange the first piezoelectric element P1 to the fourth piezoelectric element P4 within the first holding member H1 to the fourth holding member H4. That is, the control device 16 controls at least one of the horizontal moving mechanism 21, the vertical moving mechanism 24, or the rotary moving mechanism 26 of each adsorption head 20 based on the information Ip related to the position of the piezoelectric element P and the information Ih related to the position of the holding member H, so as to adjust the position of the adsorption nozzle 28.

[0142] <Adjustment of the supply location of bonding materials>

[0143] Next, the position adjustment of the discharge nozzle 36a in the supply head 30 of the piezoelectric vibration device manufacturing apparatus 1 of the present invention will be described.

[0144] The control device 16 controls the supply head moving device 13 to deliver the four supply heads 30 to the holding member supply position Sh. Based on information related to the position of the supply heads 30 and the coordinate values ​​of the first holding member H1 to the fourth holding member H4 at the holding member supply position Sh, namely H1(x11, y11, z11, θ11), H2(x12, y12, z12, θ12), H3(x13, y13, z13, θ13), and H4(x14, y14, z14, θ14), the control device 16 calculates the coordinate values ​​of the four discharge nozzles 36a at the holding member supply position Sh, namely J1(x11, y11), J2(x12, y12), J3(x13, y13), and J4(x14, y14), and stores them as information related to the position of the bonding material.

[0145] The control device 16 calculates the amount of adjustment in the X and Y directions and the amount of movement in the Z direction required for the discharge nozzle 36a to make the coordinate value J1(x11, y11, z11) of one of the four supply devices 36 at the holding component supply position Sh consistent with the coordinate value H1(x11, y11, z11, θ11) of the corresponding first holding component H1 at the holding component supply position Sh. Similarly, the control device 16 calculates the adjustment amount in the X direction, Y direction, and movement amount in the Z direction required for the discharge nozzles 36a to be consistent with the coordinate values ​​of the other three discharge nozzles 36a at the holding component supply position Sh, namely J2(x12, y12), J3(x13, y13), J4(x14, y14) at the holding component supply position Sh, namely H2(x12, y12, z12, θ12), H3(x13, y13, z13, θ13), H4(x14, y14, z14, θ14) at the corresponding second holding component H2 to fourth holding component H4, respectively.

[0146] The control device 16 controls the horizontal movement mechanism 31 of each supply head 30 based on the calculated adjustment amount in the X direction, Y direction and movement amount in the Z direction of the four discharge nozzles 36a, namely Aj1(x11, y11, z11), Aj2(x12, y12, z12), Aj3(x13, y13, z13) and Aj4(x14, y14, z14), so as to independently adjust the horizontal position of the discharge nozzle 36a for each supply head 30. Furthermore, the control device 16 controls the vertical movement mechanism 34 of each supply head 30 based on Aj1(x11, y11, z11), Aj2(x12, y12, z12), Aj3(x13, y13, z13), and Aj4(x14, y14, z14) to move the discharge nozzle 36a vertically for each supply head 30, thereby disposing the bonding material within the recess of the holding member H. That is, the control device 16 controls at least one of the horizontal movement mechanism 31 or the vertical movement mechanism 34 of each supply head 30 based on information related to the position of the supply head 30 and information Ih related to the position of the holding member H, to adjust the position of the supply device 36.

[0147] Next, use Figures 9 to 12 The piezoelectric element mounting step S100, which is included in the manufacturing method of the piezoelectric vibrating device using the piezoelectric vibrating device manufacturing apparatus 1, will be described. Figure 9 This is a flowchart of the piezoelectric element mounting process S100 included in the manufacturing method of a piezoelectric vibration device. Figure 10This is a top view showing the working state of the piezoelectric vibration device manufacturing apparatus 1 in the piezoelectric element mounting process S100, the piezoelectric element supply process S120, the holding component supply process S125, the piezoelectric element positioning process S130, and the holding component positioning process S135. Figure 11 This is a top view showing the working state of the piezoelectric vibrating device manufacturing apparatus 1 in the bonding material supply position adjustment process S140 of the piezoelectric element mounting process S100 and the bonding material supply process S150. Figure 12 This is a top view showing the working state of the piezoelectric vibrating device manufacturing apparatus 1 in the piezoelectric element mounting process S100, the piezoelectric element conveying process S160, the piezoelectric element position information acquisition process S170, the piezoelectric element position adjustment process S180, and the piezoelectric element joining process S190.

[0148] like Figure 9 As shown, the piezoelectric element mounting process S100 includes a holding component position information acquisition process S110, a piezoelectric element supply process S120, a holding component supply process S125, a piezoelectric element positioning process S130, a holding component positioning process S135, a bonding material supply position adjustment process S140, a bonding material supply process S150, a piezoelectric element conveying process S160, a piezoelectric element position information acquisition process S170, a piezoelectric element position adjustment process S180, and a piezoelectric element bonding process S190.

[0149] In the initial state of the piezoelectric vibration device manufacturing apparatus 1, in the piezoelectric element supply device 10, a tray T containing a plurality of piezoelectric elements P is supplied to the tray mounting section 10a via an external supply line (not shown). Furthermore, in the holding member supply device 11, a plurality of sheet-like holding members H (see reference 11a) are supplied to the holding member mounting section 11a via an external supply line (not shown). Figure 1 ).

[0150] The holding component position information acquisition process S110 is a process of acquiring information Ih related to the positions of multiple holding components H. In the holding component position information acquisition process S110, the laser measuring device 15 measures the shape of the multiple holding components H while the holding component supply device 11 moves the multiple holding components H. The laser measuring device 15 sends the measured values ​​to the control device 16. The piezoelectric element mounting process S100 is transferred to the piezoelectric element supply process S120 after the holding component position information acquisition process S110 is completed.

[0151] like Figure 10As shown, the piezoelectric element supply process S120 is a process of supplying the piezoelectric element P, which is housed in a plurality of piezoelectric elements P stored in a tray T and mounted on a holding member H, to the piezoelectric element supply position Sp. In the piezoelectric element supply process S120, the piezoelectric element supply device 10 transports the target piezoelectric element P from the plurality of piezoelectric elements P stored in the tray T on the tray mounting part 10a from the piezoelectric element standby position Wp to the transport reference position of the piezoelectric element supply position Sp via the tray mounting part 10a. After completing the piezoelectric element supply process S120, the piezoelectric element mounting process S100 is transferred to the holding member supply process S125.

[0152] The holding component supply process S125 is a process of supplying the holding component H with the piezoelectric element P disposed among the plurality of holding components H to the holding component supply position Sh. In the holding component supply process S125, the holding component supply device 11 transports the target holding component H among the plurality of holding components H on the holding component mounting section 11a from the holding component standby position Wh to the transport reference position of the holding component supply position Sh through the holding component mounting section 11a. After completing the holding component supply process S125, the piezoelectric element mounting process S100 proceeds to the piezoelectric element positioning process S130.

[0153] The piezoelectric element positioning process S130 is a process of positioning the piezoelectric element P that is to be engaged with the holding member H among the multiple piezoelectric elements P that are conveyed to the conveying reference position Sp. The piezoelectric element supply device 10 positions the piezoelectric element P that is to be engaged with the holding member H among the multiple piezoelectric elements P stored in the tray T at the conveying reference position Sp via the tray mounting part 10a at the piezoelectric element supply position Sp. After completing the piezoelectric element positioning process S130, the piezoelectric element mounting process S100 is transferred to the holding member positioning process S135.

[0154] The holding component positioning process S135 is a process of positioning the holding component H that is to be joined by the piezoelectric element P among the multiple holding components H that have been conveyed to the holding component supply position Sh. The holding component supply device 11 positions the holding component H that is to be joined by the piezoelectric element P among the multiple holding components H at the holding component supply position Sh using the holding component mounting part 11a. After completing the holding component positioning process S135, the piezoelectric element mounting process S100 proceeds to the joining material supply position adjustment process S140.

[0155] like Figure 11As shown, the bonding material supply position adjustment process S140 is a process for adjusting the position of the bonding material supply device 36. In the bonding material supply position adjustment process S140, the supply head moving device 13 transports the supply head 30 from the standby position W to the holding component supply position Sh. The supply head of each supply head 30 is individually adjusted in the horizontal direction by the horizontal moving mechanism 31 based on the adjustment amount of the discharge nozzle 36a of each supply device 36 in the X and Y directions calculated by the control device 16. After completing the bonding material supply position adjustment process S140, the piezoelectric element mounting process S100 is transferred to the bonding material supply process S150.

[0156] The bonding material supply process S150 is a process of supplying bonding material into the recess of the holding member H. In the bonding material supply process S150, the supply head of each supply head 30 is moved independently to a vertically downward position by the vertical movement mechanism 34 based on the amount of movement of the discharge nozzle 36a of each supply device 36 in the Z direction calculated by the control device 16. The supply device 36 supplies bonding material into the recess of the holding member H. When the bonding material supply is completed, the supply head of each supply head 30 is moved to a vertically upward position by the vertical movement mechanism 34. The supply head moving device 13 transports the supply head 30 from the holding member supply position Sh to the standby position W. The piezoelectric element mounting process S100 is transferred to the piezoelectric element conveying process S160 after the bonding material supply process S150 is completed.

[0157] like Figure 12 As shown, the piezoelectric element conveying process S160 is a process of conveying the piezoelectric element P disposed on the holding member H from the piezoelectric element supply position Sp to the holding member supply position Sh. In the piezoelectric element conveying process S160, the suction head of each suction head 20 is moved vertically downward at the piezoelectric element supply position Sp by the vertical moving mechanism 24. Each suction head 20 adsorbs the piezoelectric element P from the tray T through the suction nozzle 28. The suction head of each suction head 20 is moved vertically upward at the piezoelectric element supply position Sp by the vertical moving mechanism 24. The suction head moving device 12 conveys the suction head 20 to the holding member supply position Sh. After completing the piezoelectric element conveying process S160, the piezoelectric element mounting process S100 proceeds to the piezoelectric element position information acquisition process S170.

[0158] The piezoelectric element position information acquisition step S170 is a step of acquiring information Ip related to the position of the adsorbed piezoelectric element P. In the piezoelectric element position information acquisition step S170, the camera 14 captures images of the piezoelectric element P adsorbed by the adsorption head 20 and adsorption nozzle 28, which are being transported by the adsorption head moving device 12. The camera 14 sends the captured images to the control device 16. After completing the piezoelectric element position information acquisition step S170, the piezoelectric element mounting step S100 proceeds to the piezoelectric element position adjustment step S180.

[0159] The piezoelectric element position adjustment process S180 is a process for adjusting the position of the suction nozzle 28. In the piezoelectric element position adjustment process S180, the horizontal moving mechanism 21 and the rotary moving mechanism 26 of each suction head 20, based on the adjustment amounts of each suction nozzle 28 in the X, Y, and θ directions calculated by the control device 16, independently adjust the horizontal position and orientation of each suction nozzle 28 for each suction head 20 (refer to...). Figure 7 , Figure 8 After completing the piezoelectric element positioning process S180, the piezoelectric element mounting process S100 is transferred to the piezoelectric element bonding process S190.

[0160] The piezoelectric element bonding process S190 involves placing the piezoelectric element P within the recess of the holding member H, on which bonding material is supplied, and bonding the piezoelectric element P to the holding member H. In the piezoelectric element bonding process S190, the adsorption head of each adsorption head 20 is moved independently to a vertically downward position by the vertical movement mechanism 24 based on the Z-direction movement amount of each adsorption nozzle 28 calculated by the control device 16. Thus, the piezoelectric element P is bonded to the holding member H via the bonding material. Each adsorption head 20 releases the piezoelectric element P from the adsorption nozzle 28. The adsorption head of each adsorption head 20 is moved to a vertically upward position by the vertical movement mechanism 24. The adsorption head moving device 12 transports the adsorption head 20 to the piezoelectric element supply position Sp. After completing the piezoelectric element bonding process S190, the piezoelectric element mounting process S100 proceeds to the piezoelectric element positioning process S130.

[0161] Furthermore, in the piezoelectric element bonding process S190, after all the holding members H have been bonded with piezoelectric elements P, the multiple holding members H, each with piezoelectric elements P bonded to them, are transported from the holding member supply position Sh to the holding member standby position Wh. Additionally, for the transported multiple holding members H, information Ih related to the position of the multiple holding members H is acquired by the laser measuring device 15 to confirm the mounting status of the piezoelectric elements P.

[0162] The piezoelectric vibrating device manufacturing apparatus 1 configured in this way supplies multiple piezoelectric elements P in a matrix arrangement that maintains a relative distance between them. Similarly, multiple holding members H are supplied in a matrix arrangement that maintains a relative distance between them. As a result, the piezoelectric vibrating device manufacturing apparatus 1 can simultaneously acquire information Ip related to the position of the multiple piezoelectric elements P adsorbed by the adsorption head 20, and information Ih related to the position of the holding members H.

[0163] Furthermore, the piezoelectric vibration device manufacturing apparatus 1 independently adjusts the positions of the multiple adsorption nozzles 28 in the X, Y, and θ directions respectively, based on information related to the position of each of the multiple piezoelectric elements P adsorbed by the adsorption head 20 and information Ih related to the position of the holding member H, using the horizontal moving mechanism 21 and the rotary moving mechanism 26 for the adsorption head. Thus, the multiple adsorption heads 20 can individually adjust the position of each of the multiple adsorbed piezoelectric elements P according to the position of the holding member H. Therefore, the adsorption head 20 can position the piezoelectric element P within the recess of the holding member H while taking into account deviations in the shape of the holding member H. Moreover, since the multiple adsorption heads 20 can individually adjust the positions of the adsorption nozzles 28 based on the position-related information Ip of the piezoelectric element P and the position-related information Ih of the holding member H as numerical data, temporary placement for alignment is unnecessary.

[0164] Furthermore, the multiple supply heads 30 are individually and independently adjusted to match the position of the supply bonding material with the position of the holding member H via the supply head horizontal moving mechanism 31 and the supply head vertical moving mechanism 34. Moreover, the multiple supply heads 30 can individually adjust the position of the supply device 36 by acquiring information Ih related to the position of the holding member H as numerical data, thus eliminating the need for alignment of the holding member H. Furthermore, the laser measuring device 15 measures not only the horizontal position of the multiple holding members H supplied to the holding member supply position Sh, but also their vertical position. Therefore, the vertical position of the piezoelectric elements P disposed on the multiple holding members H can be independently and individually adjusted based on the vertical position of the holding members H. Therefore, multiple piezoelectric elements P can be precisely positioned in the recesses of the multiple holding members H at specified positions and orientations without increasing the production cycle time.

[0165] Furthermore, the manufacturing method of the piezoelectric vibrating device includes a piezoelectric element position adjustment step S180, which independently adjusts the positions of multiple piezoelectric elements P based on information Ih related to the position of the holding member H and information Ip related to the position of the piezoelectric element P obtained during transport in the piezoelectric element transport step S160. The camera 14 simultaneously captures images of the piezoelectric element P and the suction nozzle 28 adsorbed by the suction nozzle 28 of the suction head 20. Therefore, the offset of the piezoelectric element P relative to the multiple suction nozzles 28 is taken into account in the information Ip related to the position of the piezoelectric element P. Thus, there is no need to separately position the piezoelectric element P relative to the suction nozzle 28 by temporarily placing the piezoelectric element P after the piezoelectric element transport step S160. Furthermore, the bonding material supply position adjustment step S140 adjusts the supply position of the bonding material separately based on information Ih related to the position of the holding member H as numerical data. Therefore, the manufacturing method of the piezoelectric vibrating device does not require separate alignment of each holding member H. Therefore, multiple piezoelectric elements P can be arranged in specified positions and orientations within the recesses of multiple retaining members H without increasing the production cycle time.

[0166] [Implementation Method 2]

[0167] <Assembly of piezoelectric vibration device manufacturing equipment>

[0168] Next, use Figure 13 and Figure 14 The piezoelectric vibrating device manufacturing line 100, which includes the piezoelectric vibrating device manufacturing apparatus 1 of the present invention, as part of Embodiment 2, will be described. Figure 13 This is a top view showing the configuration of a piezoelectric vibrating device manufacturing line 100, which includes a piezoelectric vibrating device manufacturing apparatus 1. Figure 14 This is a block diagram showing the control configuration of a piezoelectric vibrating device manufacturing line 100 including a piezoelectric vibrating device manufacturing apparatus 1. In this embodiment, a part of the piezoelectric vibrating device manufacturing line 100 is a mounting portion 110 for mounting piezoelectric elements P to holding members H.

[0169] like Figure 13 As shown, the mounting unit 110 includes a conveying device for conveying a tray T containing multiple piezoelectric elements P and multiple holding members H arranged in sheet form, and multiple piezoelectric vibration device manufacturing apparatuses 1. In this embodiment, the mounting unit 110 consists of a robot moving device 111 as a conveying device, a supply table 112 and a conveying robot 113, and four piezoelectric vibration device manufacturing apparatuses 1. The mounting unit 110 includes a line control device 120 of the piezoelectric vibration device manufacturing line 100 (see reference 120). Figure 14 )control.

[0170] The robot moving device 111 and the conveying robot 113 respectively transport the tray T containing multiple piezoelectric elements P to the piezoelectric element supply device 10 of the four piezoelectric vibration device manufacturing apparatus 1. Furthermore, the robot moving device 111 and the conveying robot 113 respectively transport multiple holding members H arranged in sheet form to the holding member supply device 11 of the four piezoelectric vibration device manufacturing apparatus 1. Then, the robot moving device 111 and the conveying robot 113 retrieve the sheet-shaped holding members H with piezoelectric elements P attached from the holding member supply device 11 of the four piezoelectric vibration device manufacturing apparatus 1.

[0171] The robot moving device 111 is a device for moving the conveying robot 113. The robot conveying device is, for example, a single-axis linear drive unit having a servo motor as an actuator and a ball screw unit as a linear drive mechanism. The conveying robot 113 is mounted on the movable part of the robot moving device 111. The robot moving device 111 is configured such that the direction in which the conveying robot 113 moves when viewed in the Z direction is the Y direction. Therefore, the robot moving device 111 is configured to enable the conveying robot 113 to move to any position in the Y direction.

[0172] The supply table 112 is a platform for storing a tray T containing multiple piezoelectric elements P and a sheet-like holding member H. The tray T containing the piezoelectric elements P and the sheet-like holding member H are supplied to the supply table 112 by a supply device or operator in an upstream process (not shown). The supply table 112 is located at the end of the robot moving device 111.

[0173] The conveying robot 113 supplies a tray T containing a piezoelectric element P to the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1. Furthermore, the conveying robot 113 supplies a sheet-like holding member H to the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1. The conveying robot 113 is, for example, a two-armed horizontal articulated robot (SCARA type robot). The conveying robot 113 is mounted on the movable part of the robot moving device 111. Therefore, the conveying robot 113 is configured to be able to move to any position in the Y direction when viewed in the Z direction via the robot moving device 111. Furthermore, the conveying robot 113 is configured to be able to move the tray T and the sheet-like holding member H to one side (X+ direction side) and the other side (X- direction side) in the X direction, which is perpendicular to the Y direction (the direction of movement using the robot moving device 111), when viewed in the vertical direction via each arm.

[0174] Four piezoelectric vibration device manufacturing devices 1 independently engage piezoelectric elements P with holding members H. Viewed vertically, two of the four piezoelectric vibration device manufacturing devices 1 are positioned on one side of the robot moving device 111. Furthermore, two of the two piezoelectric vibration device manufacturing devices 1 are arranged in a Y-direction configuration. At this time, the two piezoelectric vibration device manufacturing devices 1 are configured such that the moving direction (Y-direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111. Moreover, the two piezoelectric vibration device manufacturing devices 1 are configured such that the piezoelectric element standby position Wp in the piezoelectric element supply device 10 and the holding member standby position Wh in the holding member supply device 11 are located on the side of the robot moving device 111 and within the movable range of the conveying robot 113.

[0175] When viewed vertically, two of the four piezoelectric vibrating device manufacturing devices 1 are positioned on the other side of the robot moving device 111. Furthermore, two of the two piezoelectric vibrating device manufacturing devices 1 are arranged in a Y-direction configuration. At this time, the two piezoelectric vibrating device manufacturing devices 1 are configured such that the moving direction (Y-direction) of the suction head moving device 12 is parallel to the moving direction of the robot moving device 111. Moreover, the two piezoelectric vibrating device manufacturing devices 1 are configured such that the piezoelectric element standby position Wp in the piezoelectric element supply device 10 and the holding member standby position Wh in the holding member supply device 11 are located on the side of the robot moving device 111 and within the movable range of the conveying robot 113.

[0176] The mounting unit 110 configured in this way can supply the trays T stored in the supply table 112 to the piezoelectric element standby positions Wp in the piezoelectric element supply devices 10 of the four piezoelectric vibration device manufacturing apparatus 1 via the conveying robot 113. Furthermore, the mounting unit 110 can supply the sheet-like holding members H stored in the supply table 112 to the holding member standby positions Wh in the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatus 1 via the conveying robot 113. Moreover, the mounting unit 110 can retrieve the sheet-like holding members H, each containing a piezoelectric element P, from the holding member standby positions Wh in the holding member supply devices 11 of the four piezoelectric vibration device manufacturing apparatus 1 via the conveying robot 113. The mounting unit 110 is configured to supply the sheet-like holding members H retrieved by the conveying robot 113 to a downstream adhesive curing oven (not shown).

[0177] like Figure 13 and Figure 14As shown, when a control signal related to the start of production is input from the line control device 120 of the piezoelectric vibration device manufacturing line 100, at least one of the four piezoelectric vibration device manufacturing apparatus 1 in the mounting unit 110 begins manufacturing piezoelectric vibration devices. Furthermore, the line control device 120 determines the number of piezoelectric vibration device manufacturing apparatus 1 to be operated based on the production volume of the piezoelectric vibration devices.

[0178] For example, when a piezoelectric element P needs to be supplied, the operating piezoelectric vibration device manufacturing apparatus 1 outputs a supply signal for the piezoelectric element P to the line control device 120. Upon receiving the supply signal for the piezoelectric element P, the line control device 120 outputs a control signal for supplying the piezoelectric element P to the conveying device. The robot moving device 111 and the conveying robot 113 supply a tray T containing multiple piezoelectric elements P from the supply table 112 to the piezoelectric element standby position Wp in the piezoelectric element supply device 10 of the piezoelectric vibration device manufacturing apparatus 1.

[0179] For example, when it is necessary to discharge a tray T containing a piezoelectric element P, the operating piezoelectric vibration device manufacturing apparatus 1 outputs a signal to the line control device 120 to discharge the tray T containing the piezoelectric element P. Upon receiving the signal to discharge the tray T containing the piezoelectric element P, the line control device 120 outputs a control signal to the robot moving device 111 and the conveying robot 113 to discharge the tray T containing the piezoelectric element P. The robot moving device 111 and the conveying robot 113 retrieve the tray T containing the piezoelectric element P from the holding member standby position Wh in the holding member supply device 11 of the piezoelectric vibration device manufacturing apparatus 1 and supply it to an adhesive curing oven (not shown).

[0180] Thus, the piezoelectric vibration device manufacturing line 100 can flexibly handle the production volume of piezoelectric vibration devices by combining multiple piezoelectric vibration device manufacturing devices 1.

[0181] [Other Implementation Methods]

[0182] Furthermore, in the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 has four adsorption heads 20 and four supply heads 30. However, the piezoelectric vibration device manufacturing apparatus 1 only needs to have multiple adsorption heads 20 and supply heads 30 respectively.

[0183] Furthermore, in the above embodiment, the plurality of supply heads 30 may also be configured to allow simultaneous adjustment of the position of each supply device 36. Additionally, the plurality of suction heads 20 may also be configured to allow simultaneous adjustment of the position of each suction nozzle 28. Therefore, regardless of the number of suction heads 20 and supply heads 30, the time required to adjust the positions of the plurality of suction heads 20 and supply heads 30 can be suppressed.

[0184] Furthermore, in the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 measures the position of the piezoelectric element P relative to the adsorption head 20 based on an image captured by the camera 14, which serves as a piezoelectric element position measuring device. However, the piezoelectric element position measuring device can be any device capable of measuring the position of the piezoelectric element adsorbed by the adsorption nozzle. For example, a laser measuring device could also be used.

[0185] Furthermore, in the above embodiment, the camera 14 is disposed on the stand 2. However, the camera may also be mounted on the suction head.

[0186] Furthermore, in the above embodiment, the piezoelectric vibration device manufacturing apparatus 1 calculates the positions of the multiple holding members H based on the measurement values ​​measured by the laser measuring device 15, which serves as a holding member position measuring device. However, the holding member position measuring device can be any device capable of measuring the shape of the multiple holding members. The holding member position measuring device could also be a camera or the like.

[0187] Furthermore, in the above embodiment, the adsorption head moving device 12 is composed of a single-axis linear drive unit. However, the adsorption head moving device is only required to be a device capable of moving the adsorption head from the piezoelectric element supply position to the holding component supply position. The adsorption head moving device can also be, for example, a horizontal multi-joint robot or a vertical multi-joint robot. The same applies to the piezoelectric element supply device and the holding component supply device.

[0188] Furthermore, in the above embodiment, the piezoelectric vibrating device manufacturing apparatus 1 supplies a plurality of retaining components H to the retaining component supply position Sh via a single retaining component supply device 11. However, the piezoelectric vibrating device manufacturing apparatus may also have multiple retaining component supply devices. By having multiple retaining component supply devices, the piezoelectric vibrating device manufacturing apparatus can, while discharging multiple retaining components through a single retaining component supply device that have completed the arrangement of the piezoelectric element, arrange the piezoelectric element on multiple retaining components supplied by other retaining component supply devices.

[0189] Furthermore, in the above embodiment, the tray T has a recess C for receiving the piezoelectric element P. However, the tray T only needs to be able to supply multiple piezoelectric elements in a matrix configuration.

[0190] Furthermore, in the above embodiment, the plurality of retaining members H supplied to the piezoelectric vibration device manufacturing apparatus 1 are connected in a sheet-like manner. However, it is acceptable as long as the plurality of retaining members can be supplied in a matrix configuration. For example, the plurality of retaining members may also be individually housed in a tray having a plurality of recesses arranged in a matrix configuration.

[0191] Furthermore, in the above embodiments, the piezoelectric element supply device 10, the holding member supply device 11, the adsorption head moving device 12, the supply head moving device 13, the horizontal moving mechanism 21, the vertical moving mechanism 24, and the rotary moving mechanism 26 for the adsorption head of the adsorption head 20, and the horizontal moving mechanism 31 and the vertical moving mechanism 34 for the supply head of the supply head 30 are single-axis linear drive units that use servo motors as actuators, but are not limited to this. The piezoelectric element supply device 10, the holding member supply device 11, the adsorption head moving device 12, the supply head moving device 13, the moving mechanism of the adsorption head 20, and the moving mechanism of the supply head 30 can be any configuration that allows for controllable movement, such as a linear motor.

[0192] Furthermore, in the above embodiment, the laser measuring device 15 is configured to rotate and move horizontally in a manner that matches the position and degree of rotation of each holding member H in the horizontal direction. However, when the holding members are configured with high precision relative to the holding member supply device, the laser measuring device may also be configured to move only in the Y direction. In this case, the holding members can move in the X direction via the holding member supply device. Therefore, the laser measuring device can measure the shape of the sheet-like holding members. By configuring the laser measuring device to move only in the Y direction, it is possible to suppress the swaying and positional deviation of the movable parts, thereby enabling measurement with higher precision. Alternatively, the laser measuring device may be fixed, and only the holding members can move in the X and Y directions via the holding member supply device.

[0193] Furthermore, in the above embodiment, the retaining member H is a housing having a recess capable of arranging the piezoelectric element P. The piezoelectric element P is arranged within the recess of the retaining member H. However, the retaining member may also be a flat plate member without a recess capable of arranging the piezoelectric element. In this case, the piezoelectric element is arranged on the plane of the flat plate member. The retaining member is covered by a cover member (drawn-out cover structure) having a recess.

[0194] Furthermore, in the above-described embodiment 2, the mounting unit 110 has four piezoelectric vibration device manufacturing apparatuses 1. However, the mounting unit may also have one or more but three or fewer piezoelectric vibration device manufacturing apparatuses. Additionally, the mounting unit may also have five or more piezoelectric vibration device manufacturing apparatuses.

[0195] The embodiments of the present invention have been described above, but these embodiments are merely illustrative examples for implementing the present invention. Therefore, the present invention is not limited to the above embodiments and can be implemented with appropriate modifications without departing from its spirit.

[0196] Explanation of reference numerals in the attached figures

[0197] 1. Piezoelectric Vibration Device Manufacturing Equipment

[0198] 2 racks

[0199] 10 Piezoelectric element supply device

[0200] 10a Tray Loading Section

[0201] 11. Maintaining component supply device

[0202] 11a Holding component mounting section

[0203] 12 Adsorption Head Moving Device

[0204] 12a Adsorption head placement section

[0205] 13. Supply head moving device

[0206] 13a Supply Head Mounting Section

[0207] 14 cameras

[0208] 15 Laser Measurement Device

[0209] 16 control devices

[0210] 20 adsorption heads

[0211] 21. Horizontal moving mechanism for adsorption head

[0212] 22 Adsorption head first moving part

[0213] 23. Adsorption head with second moving part

[0214] 24. Vertical moving mechanism for adsorption head

[0215] 25. Adsorption head with third moving part

[0216] 26. Adsorption head rotary moving mechanism

[0217] 27. Adsorption head with 4th moving part

[0218] 28 suction nozzle

[0219] 30 supply heads

[0220] 31. Horizontal moving mechanism for supply head

[0221] 32. First moving part for supply head

[0222] 33. Supply head with second moving part

[0223] 34 Vertical moving mechanism for supply head

[0224] 35. Third moving part for supply head

[0225] 36 supply devices

[0226] 36a discharge nozzle

[0227] 36b Cooling Unit

[0228] 100 piezoelectric vibration device manufacturing line

[0229] 110 equipped unit

[0230] 111 Robotic Mobile Device

[0231] 112 Supply Station

[0232] 113 Conveying Robot

[0233] 120-line control device

[0234] P piezoelectric element

[0235] P1 First piezoelectric element

[0236] P2 Second piezoelectric element

[0237] P3 Third piezoelectric element

[0238] P4, fourth piezoelectric element

[0239] H retaining component

[0240] H1 First Holding Component

[0241] H2 second retaining component

[0242] H3 Third Holding Component

[0243] H4 fourth retaining component

[0244] Information related to the location of the piezoelectric element (IP)

[0245] Information related to the position of the retaining component.

[0246] C concavity.

Claims

1. A piezoelectric vibration device manufacturing apparatus, which is used to manufacture a piezoelectric vibration device having at least a piezoelectric element and a holding member for holding the piezoelectric element, wherein the piezoelectric element is joined to the holding member by a bonding material in the holding member, characterized in that, The piezoelectric vibration device manufacturing apparatus has the following features: Multiple adsorption heads adsorb the piezoelectric element one by one; A suction head moving device, equipped with the plurality of suction heads, allows the plurality of suction heads to simultaneously reciprocate between a piezoelectric element supply position for supplying the plurality of piezoelectric elements and a holding member supply position for supplying the plurality of holding members. The adsorption head has: The suction nozzle adsorbs the piezoelectric element; The suction head uses a horizontal moving mechanism to move the suction nozzle in the horizontal direction; The suction head uses a vertical moving mechanism to move the suction nozzle in the vertical direction; The suction head uses a rotary moving mechanism to move the suction nozzle in a rotational direction about a vertical axis. Multiple adsorption heads adsorb the piezoelectric element supplied to the piezoelectric element supply position via multiple adsorption nozzles at the piezoelectric element supply position, and the adsorption head moving device moves the multiple adsorption heads from the piezoelectric element supply position to the holding member supply position. The adsorption head uses at least one of a horizontal moving mechanism, a vertical moving mechanism, or a rotary moving mechanism. Based on information relating to the positions of the piezoelectric elements adsorbed by the plurality of adsorption nozzles and the positions of the plurality of holding members supplied to the holding members, the positions of the adsorption nozzles are independently adjusted so that the piezoelectric elements adsorbed by the plurality of adsorption nozzles are respectively positioned on the corresponding holding members. Information relating to the positions of the plurality of holding members supplied to the holding member supply position includes position information of the horizontal and vertical positions of the plurality of holding members supplied to the holding member supply position.

2. The piezoelectric vibration device manufacturing apparatus as described in claim 1, characterized in that, have: Multiple supply heads supply the bonding material to the retaining member respectively; A supply head moving device, carrying the plurality of supply heads, enables the plurality of supply heads to simultaneously reciprocate between a standby position and a supply position of the holding component. The supply head has: The supply device supplies the bonding material; The supply head uses a horizontal moving mechanism to move the supply device in the horizontal direction; The supply head uses a vertical moving mechanism to move the supply device in the vertical direction. The feed head moving device moves the plurality of feed heads from the standby position to the holding component supply position. The supply head uses at least one of a horizontal moving mechanism or a vertical moving mechanism. Based on information relating to the positions of the plurality of retaining members supplied to the retaining member supply positions, the positions of the supply devices are individually and independently adjusted so that the plurality of supply devices can supply the bonding material to the plurality of retaining members respectively.

3. The piezoelectric vibration device manufacturing apparatus as described in claim 2, characterized in that, At the holding component supply position, the plurality of supply heads independently and individually supply the bonding material to the plurality of holding components via the plurality of supply devices. At the holding member supply position, the plurality of adsorption heads independently and individually arrange the piezoelectric elements adsorbed by the plurality of adsorption nozzles on the plurality of holding members supplied with the bonding material.

4. The piezoelectric vibration device manufacturing apparatus according to any one of claims 2 to 3, characterized in that, The plurality of supply heads can simultaneously adjust the position of their respective supply devices via at least one of the supply head horizontal moving mechanism or the supply head vertical moving mechanism.

5. The piezoelectric vibration device manufacturing apparatus as described in claim 1, characterized in that, The positions of the respective suction nozzles of the multiple suction heads can be adjusted simultaneously by at least one of the horizontal moving mechanism of the suction head, the vertical moving mechanism of the suction head, or the rotary moving mechanism of the suction head.

6. The piezoelectric vibration device manufacturing apparatus as described in claim 1, characterized in that, have: A piezoelectric element position measuring device measures the horizontal position and orientation of the piezoelectric elements adsorbed by the multiple adsorption heads, respectively, as information related to the position of the piezoelectric elements. A holding component position measuring device measures the horizontal and vertical positions of a plurality of holding components supplied to the holding component supply position as information related to the position of the holding component.

7. A method for manufacturing a piezoelectric vibrating device, comprising at least a piezoelectric element and a holding member for holding the piezoelectric element, wherein the piezoelectric element is joined to the holding member by a bonding material, characterized in that, have: The piezoelectric element supply process involves supplying a plurality of the piezoelectric elements to the piezoelectric element supply position; The piezoelectric element positioning process involves positioning a plurality of the piezoelectric elements to the piezoelectric element supply position. The component supply process involves supplying a plurality of the holding components to the holding component supply position; The component positioning process involves positioning a plurality of the retaining components to the retaining component supply position. The piezoelectric element conveying process involves conveying a plurality of piezoelectric elements positioned at the piezoelectric element supply position from the piezoelectric element supply position to the holding component supply position; The piezoelectric element position adjustment process, based on information related to the positions of the plurality of piezoelectric elements conveyed from the piezoelectric element supply position to the holding member supply position, and information related to the position of the holding member positioned at the holding member supply position, enables the independent and individual adjustment of the positions of the plurality of piezoelectric elements conveyed from the piezoelectric element supply position to the holding member supply position to be respectively arranged on the corresponding holding members. Information relating to the positions of the plurality of retaining components located at the retaining component supply position includes position information of the respective horizontal and vertical positions of the plurality of retaining components located at the retaining component supply position.

8. The method for manufacturing a piezoelectric vibration device as described in claim 7, characterized in that, have: In the bonding material supply position adjustment process, at the holding member supply position, the supply position of the bonding material supplied to the holding member is adjusted based on information related to the position of the holding member supplied to the holding member supply position.

9. The method for manufacturing a piezoelectric vibration device as described in claim 8, characterized in that, have: In the bonding material supply process, the bonding material is supplied to the plurality of retaining components at the retaining component supply position; In the piezoelectric element bonding process, at the holding member supply position, a plurality of piezoelectric elements, which are conveyed from the piezoelectric element supply position to the holding member supply position, are respectively disposed on a plurality of holding members on which the bonding material is supplied.

10. A method for manufacturing a piezoelectric vibration device according to any one of claims 8 to 9, characterized in that, The bonding material supply position adjustment process is a process of simultaneously adjusting the position of the bonding material supplied to multiple holding components.

11. The method for manufacturing a piezoelectric vibration device as described in claim 7, characterized in that, The piezoelectric element position adjustment process is a process in which the positions of multiple piezoelectric elements are simultaneously adjusted by respectively arranging multiple piezoelectric elements in the holding member.

12. The method for manufacturing a piezoelectric vibration device as described in claim 7, characterized in that, have: The piezoelectric element position information acquisition process acquires information related to the horizontal position and orientation of a plurality of piezoelectric elements that are transported from the piezoelectric element supply position to the holding component supply position. The process of acquiring component position information involves acquiring information related to the horizontal and vertical positions of a plurality of holding components supplied to the holding component supply position.

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