Optical image stabilization photosensitive assembly, assembling method thereof and corresponding camera module

Abstract

This invention relates to an optical image stabilization sensor assembly, comprising: a photosensitive chip; a chip carrier including a carrier portion and at least two cantilever portions, the carrier portion being adapted to directly or indirectly mount the photosensitive chip, the cantilever portions being formed by extending outward from the side of the carrier portion; at least one of the at least two cantilever portions having a piezoelectric drive rod adapter hole; and a piezoelectric drive assembly including a fixing portion, a piezoelectric element mounted on the fixing portion, and a drive rod with one end fixed to the piezoelectric element, the drive rod passing through the piezoelectric drive rod adapter hole of at least one of the cantilever portions and being movably connected to the cantilever portion. This invention also provides a method for assembling the optical image stabilization sensor assembly. This invention has advantages such as simple structure and no electromagnetic interference; and the chip carrier has supports on both sides, providing good balance and helping to ensure that the movement direction of the photosensitive chip is limited to the xoy plane.

Description

Technical Field

[0001] This invention relates to the field of camera module technology, and more specifically, to an optical image stabilization sensor for use in a camera module and its assembly method. This invention also relates to a camera module with an improved circuit board structure, and a camera module suitable for super-resolution shooting. Background Technology

[0002] Mobile phone camera modules are a crucial component of smart equipment, and their application scope and volume in the market are constantly growing. With technological advancements, both work and life are increasingly advocating for intelligentization, and a key prerequisite for achieving this is effective interaction with the external environment. A crucial method for achieving this interaction is visual perception, which primarily relies on camera modules. It can be said that camera modules have transformed from obscurity into a vital and critical component of smart equipment.

[0003] As a standard component of smart electronic terminal devices (hereinafter sometimes referred to as smart terminals), the form and function of camera modules are constantly changing with the evolving needs of smart terminals and the market. The development trend of smart terminals has consistently moved towards higher integration and thinner designs, while camera modules are continuously adding functions. The addition of some functions inevitably increases the size of the camera module. In future camera module designs, the installation space previously available for modules with limited functionality is becoming increasingly insufficient. Specifically, camera module designs are constantly innovating, evolving from simple single-camera modules to dual-camera and multi-camera modules; from simple linear optical path designs to designs with complex, convoluted optical paths; and from single focal length and limited zoom capabilities to wide-range optical zoom, etc. These developments continuously expand the shooting capabilities of camera modules, but also place higher demands on the pre-installed space within smart terminals (such as smartphones). Currently, the pre-installed space within smart terminals is increasingly insufficient to meet the development requirements of camera modules.

[0004] To reduce the space requirements for pre-installation, a retractable sleeve-type camera module has been proposed. This sleeve-type camera module (sometimes referred to as the sleeve-type module in this article) has multiple coaxially arranged sleeves, and the lenses of the lens group can be installed in different sleeves. In the retracted state, the inner sleeve can be housed inside the outer sleeve, thus reducing the volume occupied by the camera module. Furthermore, when this sleeve-type module is installed as a rear camera module inside a smart terminal, the surface of the camera module mounting area on the back of the smart terminal can be essentially flush. In the extended state, the inner sleeve (or outer sleeve) can extend from its original position, thereby adjusting the axial position of the lens within the sleeve in the optical system (here, axial position refers to its position along the optical axis of the camera module), achieving optical zoom or increasing the back focal distance of the optical system. For telephoto modules, a larger back focal distance is often required, which is one of the important reasons why telephoto modules occupy a large amount of space. For telescopic sleeve structures, since at least one sleeve can move relative to the others along the optical axis, it can move the lens assembly away from the image sensor, thus increasing the back focal length of the optical system. However, existing sleeve modules often require complex transmission structures fabricated on the sleeve sidewalls. For example, one sleeve module design places a gear on the outermost sleeve, and gear grooves meshing with the gear are fabricated on the sleeve sidewalls (inner and / or outer surfaces). Rotating the gear drives the sleeve to rotate, causing it to spiral upward (in the direction of extension along the optical axis) away from the image sensor, thus constructing the imaging optical path required for shooting (e.g., the imaging optical path required for a telephoto module). Although the above-mentioned telescopic sleeve structure can switch between retracted and extended states, its transmission structure is complex, and the sleeve sidewalls require precision mechanical processing, so its reliability may be insufficient (e.g., impact resistance). Furthermore, because the sleeve sidewall requires precision machining, it demands significant structural strength, making it difficult to reduce its thickness and hindering the reduction of the camera module's lateral dimensions. In this paper, the lateral dimension refers to the radial dimension of the camera module, which is the direction perpendicular to its optical axis. The longitudinal dimension of the camera module is the dimension along its optical axis, i.e., its height.

[0005] Existing technologies also include some non-gear-driven sleeve modules. For example, CN200910056990.X discloses a pneumatically driven sleeve module. In this solution, the sleeve can be driven to rise (extend) or fall (contract) by changing the air pressure at the bottom of the sleeve. However, the gas-containing cavity used to push the sleeve up or down needs to occupy a dimension in the height direction of the module, and this solution may have high requirements for the airtightness of the internal structure of the module.

[0006] In summary, existing sleeve-type modules often require complex transmission structures to be machined into the sleeve sidewalls, leading to potential reliability issues. Furthermore, with the sleeve extended, some transmission structures may be exposed, potentially affecting the aesthetics of the terminal device and impacting the consumer experience and market value. Concealing the transmission structure on the sleeve sidewalls could sacrifice the module's extension distance, negatively impacting the magnification of long-focus modules. For pneumatically driven sleeve-type modules, the high airtightness requirements, cylinder miniaturization, and reliability (e.g., impact resistance) all present uncertainties.

[0007] Therefore, there is an urgent need for retractable camera modules that are highly reliable, have a long extension distance, a simple driving structure, and an attractive appearance.

[0008] On the other hand, in existing camera modules, image stabilization is typically located at the lens end. However, with the increase in lens quality (e.g., glass lenses replacing plastic lenses, periscope lenses, etc., all of which increase lens weight), the driving force provided by traditional motors becomes insufficient, which also affects the accuracy of image stabilization adjustments. For telescopic lens assemblies (i.e., assemblies formed by mounting an optical lens onto a telescopic optical actuator), the weight will be further increased. One solution is to address the image stabilization problem during module shooting by driving the movement of the image sensor. This reduces the driving force required for the image stabilization drive element. Furthermore, since telescopic lens assemblies themselves do not require image stabilization, their structure can be simplified, contributing to the miniaturization of the camera module.

[0009] To drive the image sensor to move, OIS (Optical Image Stabilization) needs to be implemented in the image sensor assembly, which makes the internal structure of the image sensor more complex. How to provide sufficient driving force for the OIS image sensor assembly, how to ensure the reliability of the OIS image sensor assembly, and how to reduce the size of the OIS image sensor assembly (especially the size in the height direction) are all urgent problems that need to be solved.

[0010] Furthermore, the telescopic camera module has a retractable function, thus possessing the potential to integrate multiple functions such as optical image stabilization, autofocus, and optical zoom. However, to incorporate these functions, various different functional circuits corresponding to these functions must be implemented in the camera module's circuit board. This makes the circuit board design more difficult. Specifically, conventional circuit boards in the prior art are usually located on the back of the image sensor, with the circuit board and image sensor supporting each other to improve structural strength. The image sensor's imaging functional circuits and motor drive circuits are usually implemented in this circuit board. On the other hand, another conventional circuit board in the prior art is the through-hole circuit board, in which the image sensor can be mounted in the central through-hole of the circuit board. This design helps to reduce the thickness of the image sensor, thereby reducing the height of the camera module (referring to the dimension in the optical axis direction).

[0011] However, when there are many functional circuits to be implemented, the two types of conventional circuit boards mentioned above face numerous difficulties. Specifically: a) When there are many functional circuits to be implemented, the circuit board requires a larger wiring area, and miniaturization of the components is a major challenge. b) Image stabilization, focus movement, and sleeve extension / retraction in the camera module may require multiple motors (optical actuators) in different locations, and may also require auxiliary devices such as Hall elements placed in multiple different locations. These motors and auxiliary devices all need to be connected by wires. How to connect the wires to multiple different locations in the camera module is also a major design challenge. If the wires are too messy, it can easily lead to a decrease in product reliability. c) If a traditional design is used, the circuitry on the circuit board needs to be significantly increased. The weight of the circuit board itself may increase the driving force required for the moving optical components, making it difficult to miniaturize the driving components and thus increasing the overall size of the camera module. d) The wiring itself may pull or hinder the image stabilization, focus movement, or sleeve extension / retraction of the camera module, increasing the driving force required for the moving optical components and making it difficult to miniaturize the driving components. e. Finally, because the circuit itself may pull or obstruct the movement of the image stabilization or focus, the movement accuracy of the optical components will decrease, which in turn will lead to a decrease in image quality.

[0012] In summary, when a single camera module integrates many functions (such as image stabilization, focus shift, or telescopic lens extension), traditional circuit boards are difficult to apply. There is an urgent need for a circuit layout solution that can help reduce the size of multifunctional camera modules.

[0013] On the other hand, in recent years, a super-resolution shooting method based on OIS has emerged in the field of camera modules. For example, Google proposed using the user's natural shaking to achieve pixel shift shooting through tiny displacements. That is, through sub-pixel shifting, the color channels of pixels are filled, so that a single pixel can acquire multiple real color channel information during shooting. Subsequently, the information is fitted into the same image information through algorithms, thereby achieving high resolution of a single image. In traditional image shooting, a single pixel has only one color channel information, and the other color channel information is filled by interpolation. For example, if the pixel is a 4x4 grid, in actual shooting, one color information is captured, and the other three color channel information is filled by the color channel information of the periphery of the pixel. However, this method will produce moiré patterns, resulting in blurring or mosaic when the image is enlarged. Specifically, in current camera modules, a single pixel generally has four color channels, and the color arrangement is generally RGGB (red, green, green, blue). Of course, there are other color arrangements such as RWGB, which are not limited. Super-resolution shooting can overcome some of the shortcomings of traditional interpolation algorithms for image shooting. Super-resolution imaging primarily involves using vibration to shift the camera element relative to the object at the pixel level while the object remains stationary. Through four complete pixel-level movements, true color information from four color channels within a single pixel is captured. In other words, by continuously capturing multiple frames, image information from multiple color channels is filled into each corresponding pixel, thus achieving super-resolution image capture. The pixel-level movement trajectory is a "U"-shaped trajectory, meaning that three additional pixel-level offset images are added to the original image information, resulting in a single high-resolution composite image from these four images.

[0014] The aforementioned super-resolution imaging scheme can theoretically produce high-quality composite images. However, in practical applications, it is subject to numerous limitations imposed by the camera module's hardware. For example, in existing technologies, the movement precision of the optical image stabilization mechanism driving the lens may be insufficient, making it difficult to accurately achieve pixel-level (or sub-pixel) shifts in the optical system. Furthermore, if the lens's movement position and orientation precision are insufficient, distortion may occur in the composite image produced by super-resolution imaging. Summary of the Invention

[0015] The purpose of this invention is to overcome the shortcomings of the prior art and provide an optical image stabilization sensor solution with high driving force, high reliability and small size.

[0016] Another objective of this invention is to overcome the shortcomings of the prior art and provide a wiring layout solution that helps reduce the size of multi-functional camera modules.

[0017] Another objective of this invention is to overcome the shortcomings of the prior art and provide a solution for a camera module with high imaging quality suitable for super-resolution shooting.

[0018] To address the aforementioned technical problems, the present invention provides an optical image stabilization photosensitive component, comprising: a photosensitive chip; a chip carrier including a carrier portion and at least two cantilever portions, the carrier portion being adapted to directly or indirectly mount the photosensitive chip, the cantilever portions being formed by extending outward from the side of the carrier portion; at least one of the at least two cantilever portions having a piezoelectric drive rod adapter hole; and a piezoelectric drive assembly including a fixing portion, a piezoelectric element mounted on the fixing portion, and a drive rod with one end fixed to the piezoelectric element, the drive rod passing through the piezoelectric drive rod adapter hole of at least one of the cantilever portions and being movably connected to the cantilever portion, wherein the central axis of the drive rod is parallel to the photosensitive surface of the photosensitive chip.

[0019] The chip carrier includes a first chip carrier and a second chip carrier, and the piezoelectric driving assembly includes a first piezoelectric driving assembly and a second piezoelectric driving assembly with driving directions perpendicular to each other; the photosensitive chip is fixed to the carrier portion of the first chip carrier, and the fixing portion of the first piezoelectric driving assembly is fixed to the carrier portion of the second chip carrier.

[0020] The cantilever portion includes a driving-side cantilever portion and a driven-side cantilever portion. The driving-side cantilever portion has the piezoelectric drive rod adapter hole, and the driven-side cantilever portion has a guide rod bracket.

[0021] The photosensitive component further includes an auxiliary guiding structure, which includes a guide rod that passes through the guide rod bracket and is movably connected to the guide rod bracket, allowing the guide rod bracket to move along the guide rod.

[0022] Wherein, the carrier portion of the first chip carrier is a first carrier portion, the first chip carrier has a first driving side and a first driven side, the first driving side and the first driven side are two opposite sides of the first carrier portion, the driving side cantilever portion and the driven side cantilever portion of the first chip carrier extend outward from the first driving side and the first driven side respectively; the carrier portion of the second chip carrier is a second carrier portion, the second chip carrier has a second driving side and a second driven side, the second driving side and the second driven side are two opposite sides of the second carrier portion, the driving side cantilever portion and the driven side cantilever portion of the second chip carrier extend outward from the second driving side and the second driven side respectively; and the first driving side, the second driving side, the first driven side and the second driven side surround the photosensitive chip.

[0023] The piezoelectric drive rod adapter hole is constructed from a bent support portion and a flat plate portion. The cross-section of the bent support portion is "V" shaped. The drive rod is placed in the bent support portion, and the flat plate portion covers the opening of the bent support portion.

[0024] The driven side cantilever includes at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole.

[0025] The guide rod includes a first guide rod, the driven side cantilever portion of the first chip carrier is slidably connected to the first guide rod, and the two ends of the first guide rod are fixed to the carrier portion of the second chip carrier; the guiding direction of the first guide rod is parallel to the guiding direction of the driving rod of the first piezoelectric drive assembly.

[0026] The photosensitive component further includes a housing base and a support base, which encapsulate the photosensitive chip, the chip carrier, and the piezoelectric drive component inside; the top of the support base is adapted to mount the lens assembly; and the center of the support base has a light-transmitting hole.

[0027] The guide rod further includes a second guide rod, the driven side cantilever portion of the second chip carrier is slidably connected to the second guide rod, and the two ends of the second guide rod are fixed to the housing base and / or the support base; the guiding direction of the second guide rod is parallel to the guiding direction of the drive rod of the second piezoelectric drive assembly.

[0028] The fixing part of the second piezoelectric drive assembly is fixed to the housing base and / or the support base.

[0029] The first carrier portion is frame-shaped, with the photosensitive chip attached to its four edges. The photosensitive area of ​​the photosensitive chip is located at the window in the center of the first carrier portion.

[0030] The second carrier portion is frame-shaped, and the photosensitive chip and the first carrier portion are disposed at the window in the center of the second carrier portion.

[0031] The driving rods of the first piezoelectric driving assembly and the second piezoelectric driving assembly are disposed on the same reference plane, which is a plane parallel to the photosensitive surface of the photosensitive chip.

[0032] The photosensitive component further includes a module circuit board attached to the photosensitive chip. The module circuit board is a foldable circuit board, which includes multiple rigid boards and a flexible board connected between the multiple rigid boards.

[0033] The module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

[0034] The photosensitive component further includes a housing base and a support base, which encapsulate the photosensitive chip, the chip carrier, and the piezoelectric drive component inside. The top of the support base is adapted to mount a lens assembly. The support base serves as the upper cover of the photosensitive component and has lead holes. The free end of the module circuit board extends from the lead holes of the support base.

[0035] According to another aspect of this application, a method for assembling an optical image stabilization photosensitive component is also provided, comprising the following steps: 1) mounting a photosensitive chip on a first chip carrier, the first chip carrier including a first carrier portion and two first cantilever portions, the first cantilever portions extending outward from the side of the first carrier portion, the two first cantilever portions being located on two opposite side of the first carrier portion; 2) inserting a first piezoelectric drive assembly or a first guide rod into the first cantilever portion, the first piezoelectric drive assembly including a fixing portion, a piezoelectric element mounted on the fixing portion, and a first drive rod with one end fixed to the piezoelectric element, the first drive rod passing through the first cantilever portion and movably connected to the first cantilever portion, wherein the central axis of the first drive rod is parallel to the photosensitive surface of the photosensitive chip; wherein at least one of the two first cantilever portions is inserted into the first piezoelectric drive assembly; 3) inserting the first chip carrier into a second chip carrier; wherein the second chip carrier includes a second carrier portion and two second cantilever portions, the second cantilever portions extending outward from the side of the second carrier portion. The two second cantilever sections are respectively located on two opposite sides of the second carrier section; the fixing part of the first piezoelectric component is fixed to the second carrier section, and / or the two ends of the first guide rod are fixed to the second carrier section; 4) a second piezoelectric drive component or a second guide rod is installed in the second cantilever section, the second piezoelectric drive component includes a fixing part, a piezoelectric element installed in the fixing part and a second drive rod with one end fixed to the piezoelectric element, the second drive rod passes through the second cantilever section and is movably connected to the second cantilever section, wherein the central axis of the second drive rod is parallel to the photosensitive surface of the photosensitive chip, and the central axes of the second drive rod and the first drive rod are perpendicular to each other; 5) a movable chip assembly consisting of the photosensitive chip, the first chip carrier, the second chip carrier, the first piezoelectric drive component, the second piezoelectric drive component, the first guide rod and the second guide rod is installed in an inverted support base; and 6) a housing base is installed on the inverted support base to encapsulate the movable chip assembly in the receiving space between the support base and the housing base.

[0036] Step 1) further includes: assembling the photosensitive chip and the module circuit board into a photosensitive component, and mounting the photosensitive component on the first chip carrier; between steps 5) and 6), there is also a step: 51) tidying up the module circuit board, and leading the free end of the module circuit board out from the lead hole or clearance groove of the support base; wherein, the module circuit board is a foldable circuit board, the foldable circuit board includes multiple rigid boards and flexible boards connected between the multiple rigid boards; the module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

[0037] Furthermore, to solve the second technical problem mentioned above, the present invention also provides a camera module, comprising: a lens assembly including an actuator housing and an optical lens located within the actuator housing; a photosensitive assembly including a photosensitive chip, a support base, a housing base, an x-axis piezoelectric drive assembly, and a y-axis piezoelectric drive assembly, wherein the x-axis and y-axis are both parallel to the photosensitive surface of the photosensitive chip, and the x-axis and y-axis are perpendicular to each other; the support base is mounted above the housing base, and the support base and the housing base encapsulate the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly internally, the top of the support base... The lens assembly is mounted on the top of the support base, having lead holes or clearance slots on its surface; a first circuit board is attached to the photosensitive chip, and the first circuit board includes a main body and a second connecting strip; and a second circuit board includes a transfer circuit board, which rests against the top surface of the support base, and the piezoelectric elements of the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly are respectively led out from the lead holes or clearance slots through the first connecting strip, the first connecting strip being fixed and electrically connected to the surface of the transfer circuit board, and the first connecting strip being separate from the first circuit board inside the photosensitive assembly.

[0038] The second connecting strip includes at least one vertical bend and at least one horizontal bend. The vertical bend is a bend where the normal to the surface of the flexible circuit board lies on a vertical plane before and after the bend, and the horizontal bend is a bend where the normal to the surface of the flexible circuit board lies on a horizontal plane before and after the bend. The second circuit board also includes a first extension and a second extension. One side of the relay circuit board is connected to the first extension via a vertical bend, and the first extension is connected to the second extension via a horizontal bend. Both the first extension and the second extension rest against the outer surface of the actuator housing.

[0039] At least some of the electronic components are disposed on the outer surface of the second extension.

[0040] The first circuit board further includes a third extension and a fourth extension located outside the actuator housing. The third extension is connected to the second connecting strip located inside the photosensitive component via a horizontal bend, and the fourth extension is connected to the third extension via another horizontal bend. The fourth extension and the second extension are located on the same side of the actuator housing, and the fourth extension is fixedly and electrically connected to the second extension.

[0041] The fourth extension and the second extension are fastened together by a connector.

[0042] The second extension is also connected to a main connecting strip via a vertical bend, the main connecting strip having a main connector suitable for electrical connection to the outside.

[0043] The back sides of the first extension and the second extension are attached to two adjacent outer sides of the actuator housing.

[0044] The second extension includes a first sub-circuit board, a second sub-circuit board, and a horizontal bending section. The first sub-circuit board and the second sub-circuit board are connected and folded together through the horizontal bending section. The second sub-circuit board is located between the first sub-circuit board and the actuator housing. At least some electronic components are mounted on the outer surface of the first sub-circuit board. The first sub-circuit board is a rigid board, and the second sub-circuit board is either a rigid board or a flexible board.

[0045] The third extension rests against the outer side of the actuator housing.

[0046] The support base is formed using an embedded injection molding process, and the support base contains a metal sheet for the embedded injection molding process.

[0047] The lens assembly further includes an autofocus drive device, an optical image stabilization drive device, or a zoom drive device for driving the optical lens to move. The autofocus drive device, optical image stabilization drive device, or zoom drive device is located in the cavity between the actuator housing and the top surface of the support base. The leads of the autofocus drive device, optical image stabilization drive device, or zoom drive device are connected to the transfer circuit board.

[0048] The lens assembly further includes a vertical piezoelectric drive assembly, the axis of which is perpendicular to the photosensitive surface; the piezoelectric element of the vertical piezoelectric drive assembly is mounted in at least one corner region of the four corner regions on the top surface of the support base; the moving part of the vertical piezoelectric drive assembly is integrated with the optical lens to drive the optical lens to extend or retract into the actuator housing; the piezoelectric element of the vertical piezoelectric drive assembly is connected to the relay circuit board via a lead wire.

[0049] The lens assembly is a sleeve-type lens assembly, comprising a sleeve assembly, the actuator housing, and the optical lens mounted on the sleeve assembly. The sleeve assembly includes multiple nested individual sleeves, wherein any two adjacent individual sleeves are connected by a vertical piezoelectric drive assembly, the axis of the drive shaft of the vertical piezoelectric drive assembly being perpendicular to the photosensitive surface. The piezoelectric element of the vertical piezoelectric drive assembly is mounted at the bottom of the lower individual sleeve, and the moving part of the vertical piezoelectric drive assembly is integrated with the bottom of the upper individual sleeve. The leads of the piezoelectric elements of the vertical piezoelectric drive assemblies connecting adjacent individual sleeves are fixed and electrically connected to the relay circuit board.

[0050] Each of the individual sleeves has a corresponding sleeve circuit board, which includes a support portion and a lead portion. Each individual sleeve includes a sleeve wall and a bottom plate. A sleeve circuit board support is provided in each individual sleeve. The bottom of the sleeve circuit board support is integrally connected to the bottom plate of the corresponding individual sleeve. The top of the sleeve circuit board support passes through a through hole through the bottom plate of the upper-layer individual sleeve. The support portion of the sleeve circuit board rests against the sleeve circuit board support. The lead portion is a foldable circuit board. When the sleeve assembly is in an extended state, the lead portion unfolds and suspends in the air, and the lead portion passes through the bottom plate of the individual sleeve and is electrically connected to the sleeve circuit board of the next layer of individual sleeves or to the relay circuit board.

[0051] In each of the aforementioned individual sleeves, a Hall element is mounted on the top of the circuit board bracket, and the sleeve circuit board is electrically connected to the Hall element.

[0052] For each of the individual sleeves, the sleeve circuit board further has a third connecting strip, which rests on the upper surface of the base plate of the individual sleeve. The third connecting strip is used to connect the piezoelectric element of the vertical piezoelectric drive assembly installed on the individual sleeve, or to connect the sleeve circuit board of the next layer of the individual sleeve.

[0053] The IC element used to sense the Hall element is mounted in the second extension section.

[0054] The second circuit board contains the drive circuit for the piezoelectric drive assembly, while the first circuit board contains the working circuit for the photosensitive chip.

[0055] The photosensitive component further includes a chip carrier, which comprises a carrier portion and at least two cantilever portions. The carrier portion is adapted to directly or indirectly mount the photosensitive chip, and the cantilever portions are formed by extending outward from the side of the carrier portion. At least one of the at least two cantilever portions has a piezoelectric drive rod adapter hole. The x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly are both horizontally arranged piezoelectric drive assemblies, each including a fixing portion, a piezoelectric element mounted on the fixing portion, and a drive rod with one end fixed to the piezoelectric element. The drive rod passes through the piezoelectric drive rod adapter hole of at least one of the cantilever portions and is movably connected to the cantilever portion, wherein the axis of the drive rod is parallel to the photosensitive surface of the photosensitive chip.

[0056] The chip carrier includes a first chip carrier and a second chip carrier; the piezoelectric driving assembly includes a first piezoelectric driving assembly and a second piezoelectric driving assembly with driving directions perpendicular to each other; the photosensitive chip is fixed to the carrier portion of the first chip carrier, and the fixing portion of the first piezoelectric driving assembly is fixed to the carrier portion of the second chip carrier; the cantilever portion includes a driving-side cantilever portion and a driven-side cantilever portion, the driving-side cantilever portion having the piezoelectric driving rod adapter hole, and the driven-side cantilever portion having a guide rod bracket; the photosensitive assembly further includes an auxiliary guiding structure, the auxiliary guiding structure including a guide rod, the guide rod passing through the guide rod bracket and being movably connected to the guide rod bracket, so that the guide rod bracket can move along the guide rod.

[0057] Wherein, the carrier portion of the first chip carrier is a first carrier portion, the first chip carrier has a first driving side and a first driven side, the first driving side and the first driven side are two opposite sides of the first carrier portion, the driving side cantilever portion and the driven side cantilever portion of the first chip carrier extend outward from the first driving side and the first driven side respectively; the carrier portion of the second chip carrier is a second carrier portion, the second chip carrier has a second driving side and a second driven side, the second driving side and the second driven side are two opposite sides of the second carrier portion, the driving side cantilever portion and the driven side cantilever portion of the second chip carrier extend outward from the second driving side and the second driven side respectively; and the first driving side, the second driving side, the first driven side and the second driven side surround the photosensitive chip.

[0058] Furthermore, to address the third technical problem mentioned above, the present invention provides a camera module suitable for super-resolution imaging, comprising: a lens assembly; a photosensitive assembly including a photosensitive chip and a driving device, the driving device being used to drive the photosensitive chip to move in the x-axis and y-axis directions, wherein the x-axis and y-axis are coordinate axes parallel to the photosensitive surface of the photosensitive chip, and the x-axis and y-axis are perpendicular to each other; a first control unit being used to control a driving signal applied to the driving device to control the super-resolution imaging movement path of the photosensitive chip on the xoy plane; the super-resolution imaging movement path including multiple super-resolution offsets, after each super-resolution offset, the photosensitive chip is moved to an image sample acquisition position; wherein each super-resolution offset causes a photosensitive pixel unit in the photosensitive chip to move along the xoy plane to a pixel position on the image plane where the super-resolution image is mapped; and a data processing unit being used to synthesize a super-resolution image from image samples acquired by the photosensitive chip at the multiple image sample acquisition positions.

[0059] The photosensitive area of ​​the photosensitive chip includes multiple macropixels, and each macropixel includes multiple monochrome photosensitive pixel units of different colors; the super-resolution offset of the photosensitive chip is adapted to move one of the monochrome photosensitive pixel units of the macropixel to the position of another monochrome photosensitive pixel unit.

[0060] The moving route satisfies the following condition: for any pixel position on the image plane where the super-resolution image is mapped, the monochrome photosensitive pixel unit of each color is moved to that pixel position at least once.

[0061] In the macropixels of the photosensitive chip, a plurality of monochrome photosensitive pixel units are arranged in a rectangular or triangular pattern.

[0062] Wherein, the resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the amount of super-resolution offset is less than the spacing between adjacent photosensitive pixel units of the photosensitive chip.

[0063] Wherein, the resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the amount of super-resolution offset is less than the spacing between adjacent macropixels of the photosensitive chip.

[0064] The driving device includes a piezoelectric driving assembly. The piezoelectric element of the piezoelectric driving assembly includes a first type of piezoelectric material layer and a second type of piezoelectric material layer. The first type of piezoelectric material layer and the second type of piezoelectric material layer are stacked to form the piezoelectric element. The first type of piezoelectric material layer is configured to drive the moving part to move a first distance during a single activation. The first distance is a set super-resolution offset distance. The second type of piezoelectric material layer is configured to drive the moving part to move a second distance during a single activation. The second distance is greater than the first distance.

[0065] The driving device includes a piezoelectric driving component; the first control unit is further configured to: control the amplitude of the driving voltage of the piezoelectric driving component or control its single activation time to make the single movement distance of the photosensitive chip equal to the super-resolution offset distance.

[0066] The driving device is a piezoelectric driving device, comprising: a chip carrier, each chip carrier including a carrier portion and at least two cantilever portions, the carrier portion being adapted to directly or indirectly mount the photosensitive chip, and the cantilever portions extending outward from the side of the carrier portion; at least one of the at least two cantilever portions having a piezoelectric driving rod adapter hole; and a piezoelectric driving assembly including a fixing portion, a piezoelectric element mounted on the fixing portion, and a driving rod with one end fixed to the piezoelectric element, the driving rod passing through the piezoelectric driving rod adapter hole of at least one cantilever portion and being movably connected to the cantilever portion, such that the chip carrier can move along the driving rod, and the guiding direction of the driving rod is parallel to the photosensitive surface of the photosensitive chip. The chip carrier includes a first chip carrier and a second chip carrier, and the piezoelectric driving assembly includes a first piezoelectric driving assembly and a second piezoelectric driving assembly with driving directions in the x-axis direction and the y-axis direction, respectively; the photosensitive chip is fixed to the carrier portion of the first chip carrier, and the fixing portion of the first piezoelectric driving assembly is fixed to the carrier portion of the second chip carrier.

[0067] The cantilever portion includes a drive-side cantilever portion and a driven-side cantilever portion. The drive-side cantilever portion has the piezoelectric drive rod adapter hole, and the driven-side cantilever portion has a guide rod bracket. The photosensitive component also includes an auxiliary guiding structure, which includes a guide rod. The guide rod passes through the guide rod bracket and is movably connected to the guide rod bracket, allowing the guide rod bracket to move along the guide rod.

[0068] Wherein, the carrier portion of the first chip carrier is the first carrier portion, and the cantilever portion of the first chip carrier includes a driving side cantilever portion and a driven side cantilever portion, which are formed by extending outward from two opposite sides of the first carrier portion.

[0069] Wherein, the carrier portion of the second chip carrier is the second carrier portion, and the cantilever portion of the second chip carrier includes a driving side cantilever portion and a driven side cantilever portion, which are formed by extending outward from two opposite sides of the second carrier portion.

[0070] The driven-side cantilever portion includes at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole; the driven-side cantilever portion of the first chip carrier is slidably connected to the first guide rod, and the two ends of the first guide rod are fixed to the carrier portion of the second chip carrier; the guiding direction of the first guide rod is parallel to the guiding direction of the driving rod of the first piezoelectric drive assembly.

[0071] The photosensitive component further includes a housing base and a support base, which encapsulate the photosensitive chip, the chip carrier, and the piezoelectric drive component inside; the top of the support base is adapted to mount the lens assembly.

[0072] Wherein, the driven side cantilever portion of the second chip carrier is slidably connected to the second guide rod, and the two ends of the second guide rod are fixed to the housing base and / or the support base; the guiding direction of the second guide rod is parallel to the guiding direction of the driving rod of the second piezoelectric drive assembly; the fixing portion of the second piezoelectric drive assembly is fixed to the housing base and / or the support base.

[0073] The first carrier portion is frame-shaped, with the photosensitive chip attached to its four edges. The photosensitive area of ​​the photosensitive chip is located at the window in the center of the first carrier portion. The second carrier portion is frame-shaped, with the photosensitive chip and the first carrier portion located at the window in the center of the second carrier portion. The driving rods of the first piezoelectric driving assembly and the second piezoelectric driving assembly are located on the same reference plane, which is a plane parallel to the photosensitive surface of the photosensitive chip.

[0074] The photosensitive component further includes a module circuit board attached to the photosensitive chip. The module circuit board is a foldable circuit board, which includes multiple rigid boards and a flexible board connected between the multiple rigid boards. The module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

[0075] The driving device is an electromagnetic driving device, comprising: an electromagnetic driving element; a support base; a module circuit board, wherein the photosensitive chip is fixed together with the module circuit board; and a housing base, wherein the housing base and the support base encapsulate the photosensitive chip and the module circuit board internally; a lens assembly mounted on the top of the support base; a first chip carrier; and a second chip carrier, wherein the first chip carrier is located between the second chip carrier and the support base, and the first chip carrier has a light window in its center; the photosensitive chip is mounted on the upper surface of the second chip carrier; the first chip carrier is adapted to move relative to the support base in the y-axis direction under the drive of the electromagnetic driving element; the second chip carrier is adapted to move relative to the first chip carrier in the x-axis direction under the drive of the electromagnetic driving element; wherein the x-axis and the y-axis are coordinate axes parallel to the surface of the photosensitive chip, and the x-axis and the y-axis are perpendicular to each other.

[0076] A single layer of balls is arranged between the support base and the second chip carrier. The first chip carrier has ball holes through which the balls pass. The support base and the first chip carrier are supported by the balls in the z-axis direction, and the first chip carrier and the second chip carrier are also supported by the balls in the z-axis direction. The z-axis is a coordinate axis perpendicular to the x-axis and the y-axis. The inner surface of the ball hole rests against a portion of the outer surface of the balls.

[0077] The lens assembly includes an optical lens and a first driving unit, the first driving unit being adapted to drive the optical lens to translate in the x-axis and y-axis directions. The camera module also includes a second control unit for implementing image stabilization, which is configured to control the first driving unit and the driving device to move the optical lens and the photosensitive chip in opposite directions.

[0078] The second control unit is further configured to control the first driving unit and the driving device to simultaneously drive the optical lens and the photosensitive chip to move.

[0079] Compared with the prior art, this application has at least one of the following technical effects:

[0080] 1. This application uses a piezoelectric drive assembly in a photosensitive component to achieve optical image stabilization (OIS) in a camera module by moving the photosensitive chip. It offers advantages such as simple structure and absence of electromagnetic interference, making it particularly suitable for retractable camera modules. Specifically, the piezoelectric drive assembly boasts advantages such as small size, high thrust, and high precision. Furthermore, its drive structure is relatively simple, and compared to traditional electromagnetic drive assemblies, it avoids electromagnetic interference problems, making it ideal for camera modules with numerous drive components. For example, in a retractable camera module, the optical lens is mounted in a multi-stage sleeve. To drive each stage of the sleeve to achieve the retraction function, a large number of drive components may be required. Therefore, the simple structure and absence of electromagnetic interference of the piezoelectric drive assembly make it particularly suitable for use in the photosensitive component of a retractable camera module.

[0081] 2. In some embodiments of this application, the x-axis and y-axis driving elements (e.g., the drive shaft of a piezoelectric drive assembly) can be arranged on the same reference plane, which can effectively reduce the space occupied by the photosensitive component in the height direction. Reducing the height of the photosensitive component has a more significant effect on the telescopic camera module. The telescopic camera module includes multiple telescopic sleeves. If the height of the photosensitive component is reduced by G, it means that the height of the telescopic optical actuator can be increased by G. Therefore, the height of each sleeve of the telescopic optical actuator can be increased by G, and the total extension distance of the telescopic optical actuator can be several times G. This multiple is consistent with the number of sleeves. Therefore, reducing the height of the photosensitive component, when applied to a telescopic camera module, can significantly increase the extension distance of the camera module, thereby providing stronger telephoto shooting capabilities.

[0082] 3. In some embodiments of this application, the module circuit board attached to the photosensitive chip is a foldable circuit board, which provides two orthogonal bending directions. This ensures that the movement of the photosensitive chip along the x-axis and y-axis is not affected by the pulling of the module circuit board, thereby reducing the resistance to the movement of the photosensitive chip and lowering the driving force requirement for the piezoelectric drive component. Simultaneously, because the module circuit board provides two orthogonal bending directions, the movement of the photosensitive chip along the x-axis and y-axis will not result in a broken circuit due to the pulling of the module circuit board, thus improving the reliability of the optical image stabilization photosensitive component.

[0083] 4. In some embodiments of this application, the center of the chip carrier is hollowed out, and the photosensitive chip can be arranged in the hollowed-out area. The chip carrier used to realize the OIS function does not occupy the dimension in the height direction, thereby helping to reduce the height of the photosensitive component.

[0084] 5. In some embodiments of this application, a drive rod and a driven rod (a guide rod without piezoelectric elements) can be arranged on opposite sides of the chip carrier, thereby enabling the photosensitive chip to be driven in two degrees of freedom with fewer piezoelectric drive components. This design can save costs and simplify the device structure.

[0085] 6. In some embodiments of this application, the chip carrier is provided with cantilevered portions and corresponding drive rods or guide rods on both sides (that is, the chip carrier has supports on both sides), which has good balance and helps to ensure that the movement direction of the photosensitive chip is limited to the xoy plane (i.e., the reference plane parallel to the photosensitive surface). Attached Figure Description

[0086] Figure 1 A perspective view of an optical image stabilization sensor according to an embodiment of this application is shown;

[0087] Figure 2 A perspective view of a combination of a first chip carrier and a second chip carrier in one embodiment of this application is shown;

[0088] Figure 3 A three-dimensional schematic diagram of a first chip carrier in one embodiment of this application is shown;

[0089] Figure 4 A perspective view of a second chip carrier and a first chip carrier assembled together is shown in one embodiment of this application;

[0090] Figure 5 This illustration shows a schematic diagram of mounting a combination of first and second chip carriers and a photosensitive chip onto a support base according to one embodiment of this application;

[0091] Figure 6 A schematic diagram showing the unassembled state of the photosensitive chip and the first chip carrier is shown;

[0092] Figure 7 A three-dimensional schematic diagram of the appearance of a photosensitive component in one embodiment of this application is shown;

[0093] Figure 8 A three-dimensional schematic diagram of the appearance of the photosensitive component is shown from another angle;

[0094] Figure 9 A perspective view of a retractable camera module according to an embodiment of this application is shown;

[0095] Figure 10 A perspective view of a retractable camera module with the actuator housing removed is shown in one embodiment of this application.

[0096] Figure 11 This shows the sleeve assembly retracted into the actuator housing;

[0097] Figure 12 A schematic diagram of an example piezoelectric drive assembly is shown;

[0098] Figure 13 A schematic diagram of a piezoelectric element and its corresponding drive rod for vibration transmission is shown.

[0099] Figure 14 A module circuit board according to another embodiment of this application is shown;

[0100] Figure 15 A perspective view of a photosensitive component and its circuitry and connections in one embodiment of this application is shown;

[0101] Figure 16a and Figure 16b The three-dimensional structures of the second circuit board are shown from two different angles in one embodiment of this application;

[0102] Figure 17 This application illustrates a photosensitive component assembled from a circuit board structure according to one embodiment of the present application;

[0103] Figure 18 A partial structural schematic diagram of the second extension portion in one embodiment of this application is shown;

[0104] Figure 19 A perspective structural diagram of a sleeve-type camera module according to one embodiment of this application is shown;

[0105] Figure 20 A schematic diagram showing the connection relationship between the photosensitive component and the sleeve component in one embodiment of this application is illustrated.

[0106] Figure 21 This paper shows a schematic diagram of the sleeve assembly and photosensitive assembly in one embodiment of the present application from a top view angle;

[0107] Figure 22 A longitudinal cross-sectional perspective view of a sleeve-type camera module in an extended state, according to one embodiment of this application, is shown.

[0108] Figure 23 The assembly process of an optical image stabilization sensor component according to one embodiment of this application is shown.

[0109] Figure 24 The arrangement of monochrome photosensitive pixel units of different colors in the photosensitive chip is shown;

[0110] Figure 25 The image sensor's movement direction and four different position states are shown in the super-resolution image capture.

[0111] Figure 26The image shows the movement path of the photosensitive chip during super-resolution imaging in another embodiment and the image sample coverage area obtained by the four position states of the photosensitive chip.

[0112] Figure 27 It shows Figure 26 A top-view diagram showing the movement of the driving device, carrier, and the photosensitive chip along the moving path of the photosensitive chip.

[0113] Figure 28 An exploded three-dimensional view of a photosensitive component in one embodiment of this application is shown;

[0114] Figure 29 This invention provides an assembly schematic diagram of the internal structure of a photosensitive component according to one embodiment of the present application.

[0115] Figure 30 A three-dimensional schematic diagram of a first chip carrier in one embodiment of this application is shown;

[0116] Figure 31 This is a schematic cross-sectional view of the ball connection between the support base, the first chip carrier, and the second chip carrier in one embodiment of the present application.

[0117] Figure 32 The ball bearing hole of the first chip carrier and the second ball bearing guide groove of the second chip carrier are shown.

[0118] Figure 33 The diagram illustrates the relationship between the moving distance of the lens and the image sensor and the tilt angle of the module under four different scenarios in this application. Detailed Implementation

[0119] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0120] It should be noted that in this specification, the terms "first," "second," etc., are used only to distinguish one feature from another and do not imply any limitation on the features. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.

[0121] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0122] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to an example or illustration.

[0123] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0124] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0125] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0126] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0127] Figure 1 A perspective view of an optical image stabilization sensor according to one embodiment of this application is shown. To avoid obstruction, Figure 1 The top cover of the image sensor is no longer visible. (Reference) Figure 1In this embodiment, the optical image stabilization sensor (OIS sensor) includes a photosensitive chip 10, a chip carrier 20, and a piezoelectric drive assembly 30. The photosensitive chip 10 receives light passing through the optical lens and converts it into electrical signals to output image data. The chip carrier includes a carrier portion 21 and at least two cantilever portions 22. The carrier portion 21 is adapted to directly or indirectly mount the photosensitive chip 10. The cantilever portions 22 are formed by extending outward from the side of the carrier portion 21. In this embodiment, at least one of the at least two cantilever portions 22 has a piezoelectric drive rod adapter hole 23. The piezoelectric drive assembly 30 includes a fixing part 31, a piezoelectric element 32 mounted on the fixing part 31, and a drive rod 33 with one end fixed to the piezoelectric element 32. The drive rod 33 passes through at least one piezoelectric drive rod adapter hole 23 of the cantilever part 22 and is movably connected to the cantilever part 22, allowing the chip carrier 21 to move along the drive rod 33. The guiding direction of the drive rod 33 is parallel to the photosensitive surface of the photosensitive chip 10. When the photosensitive surface is horizontal, the drive rod 33 of the piezoelectric drive assembly 30 is also horizontal. Thus, in this embodiment, under the drive of the piezoelectric drive assembly 30, the photosensitive chip 10 can move linearly in the horizontal direction (i.e., parallel to the photosensitive surface). In this embodiment, the photosensitive chip 10 can be directly attached to the chip carrier 20; or it can be indirectly connected to the chip carrier 20. For example, there can be two chip carriers, one chip carrier directly attached to the photosensitive chip, and the other chip carrier connected to the first chip carrier, thereby indirectly carrying the photosensitive chip. These two chip carriers can be designed to move along the x-axis and y-axis respectively (this OIS structure based on two chip carriers will be further described below with reference to more figures and embodiments), where the x-axis and y-axis are two mutually perpendicular coordinate values, and both the x-axis and y-axis are parallel to the photosensitive surface. The z-axis is perpendicular to the photosensitive surface, and the z-axis direction is the height direction of the photosensitive component. In this embodiment, the piezoelectric drive component can drive the photosensitive chip to move horizontally, thereby realizing the image stabilization function of the camera module. The piezoelectric drive component has the advantages of small size, large thrust, and high precision, and the drive structure is relatively simple. Moreover, compared with the traditional electromagnetic drive component, the piezoelectric drive component avoids electromagnetic interference problems, making it very suitable for camera modules with a large number of drive elements. For example, for a retractable camera module, the optical lens is installed in a multi-stage sleeve. In order to drive each stage of the sleeve to achieve the retraction function, a large number of drive elements may be needed. Therefore, the simple structure and electromagnetic interference-free characteristics of the piezoelectric drive component make it particularly suitable for use in the photosensitive component of a retractable camera module.

[0128] Furthermore, Figure 2 A perspective view of a combination of a first chip carrier and a second chip carrier according to one embodiment of this application is shown. (Reference) Figure 2In this embodiment, the chip carrier includes a first chip carrier 20a and a second chip carrier 20b. The piezoelectric driving assembly includes a first piezoelectric driving assembly 30a and a second piezoelectric driving assembly 30b with driving directions perpendicular to each other. The photosensitive chip 10 is fixed to the carrier portion (i.e., the first carrier portion 21a) of the first chip carrier 20a, and the fixing portion of the first piezoelectric driving assembly 30a is fixed to the carrier portion (i.e., the first carrier portion 21b) of the second chip carrier 20b. In this embodiment, the cantilever portion includes a driving-side cantilever portion 22a and a driven-side cantilever portion 22b. The driving-side cantilever portion 22a has the piezoelectric driving rod adapter hole 23, and the driven-side cantilever portion 22b has a guide rod bracket 24. The photosensitive assembly also includes an auxiliary guiding structure, which includes a guide rod 40. The guide rod 40 passes through the guide rod bracket 24 and is movably connected to the guide rod bracket 24, so that the guide rod bracket 24 can move along the guide rod 24. The carrier portion of the first chip carrier 20a is a first carrier portion 21a. The cantilever portion of the first chip carrier 20a includes a driving-side cantilever portion 22a and a driven-side cantilever portion 22b, which are formed by extending outward from two opposite sides of the first carrier portion 21a. The carrier portion of the second chip carrier 20b is a second carrier portion 21b. The cantilever portion of the second chip carrier 21b includes a driving-side cantilever portion 22a and a driven-side cantilever portion 22b, which are formed by extending outward from two opposite sides of the second carrier portion 21b.

[0129] Furthermore, Figure 3 A perspective view of a first chip carrier according to one embodiment of this application is shown. (Reference) Figure 3 In this embodiment, the first chip carrier includes a first carrier portion 21a and a driving-side cantilever portion 22a and a driven-side cantilever portion 22b extending outward from both sides of the first carrier portion 21a, respectively. The driving-side cantilever portion 22a has a piezoelectric drive rod adapter hole 23. The piezoelectric drive rod adapter hole 23 is constructed from a bent support portion 23a and a flat portion 23b. The cross-section of the bent support portion 23a is "V" shaped, the drive rod 33 is placed in the bent support portion 23a, and the flat portion 23b covers the opening of the bent support portion 23a. The driven-side cantilever portion 22b includes at least one cantilever 25 with a through hole, through which the guide rod passes. Figure 3 In each embodiment, each driven-side cantilever portion 22b has two cantilever 25, and a guide rod passes through these two cantilever 25 (see reference). Figure 2 and Figure 3Furthermore, the cantilever 25 can slide on the guide rod. In this embodiment, the guide rod mounted on the side of the first chip carrier 20a can be referred to as the first guide rod 40a. The driven side cantilever portion 22b of the first chip carrier is slidably connected to the first guide rod 40a, and the two ends of the first guide rod 40a can be fixed to the carrier portion of the second chip carrier 20b (i.e., the second carrier portion 21b, which can be referred to in conjunction with reference). Figure 2 The guiding direction of the first guide rod 40a is parallel to the guiding direction of the drive rod 33 of the first piezoelectric drive assembly 30a.

[0130] Furthermore, Figure 4 This illustration shows a perspective view of a second chip carrier and a first chip carrier assembled together according to one embodiment of this application. The driven-side cantilever portion 22b of the second chip carrier 20b is slidably connected to a second guide rod 40b. The two ends of the second guide rod 40b can be fixed to the housing base and / or support (see reference). Figure 1 and Figure 5 The guiding direction of the second guide rod 40b is parallel to the guiding direction of the drive rod 33 of the second piezoelectric drive assembly 30b. Figure 5 This diagram illustrates a configuration of a first and second chip carrier and a photosensitive chip mounted on a support base according to one embodiment of this application. (Refer to the reference...) Figure 1 and Figure 5 In this embodiment, the photosensitive component may further include a housing base 50 and a support base 60, which are used to encapsulate the photosensitive chip 10, the chip carrier 20, and the piezoelectric driving component 30 internally. It should be noted that... Figure 5 The support base 60 and the assembly of the first and second chip carriers and the photosensitive chip are all inverted. This arrangement facilitates assembly; after assembly, the assembly can be inverted again so that the photosensitive surface of the photosensitive chip faces upwards. The support base 60 has a central light-transmitting hole, allowing light to pass through the support base 60 after being transmitted through the optical lens, and then project onto the photosensitive area of ​​the photosensitive chip. Finally, the photosensitive chip converts the light signal into an electrical signal and outputs image data. In this embodiment, the support base 60 is located above the housing base 50 and the assembly, and the support base 60 can serve as the top cover of the entire photosensitive assembly. Furthermore, the top of the support base 60 is suitable for mounting a lens assembly. The lens assembly may include an optical lens and an optical actuator. The lens assembly and the photosensitive assembly are assembled together to form a camera module.

[0131] Further, refer to Figure 5 In one embodiment of this application, the fixing portion 31b of the second piezoelectric drive assembly 30b can be fixed to the lower surface 61 of the support base 60. It should be noted that, due to... Figure 5The support 60 is inverted, therefore its lower surface 61 is... Figure 5 The center is facing upwards.

[0132] Furthermore, Figure 6 This diagram shows the unassembled state of the photosensitive chip and the first chip carrier. (Reference) Figure 6 In this embodiment, the first chip carrier 20a (refer to reference) Figures 2-4 The assembly includes a first carrier portion 21a and a drive-side cantilever portion 22a and a driven-side cantilever portion 22b extending outward from both sides of the first carrier portion 21a. The first carrier portion 21a is frame-shaped, and the photosensitive chip 10 is attached to its surrounding edge region 26a. After assembly, the photosensitive area of ​​the photosensitive chip 10 can be positioned at the window 26b in the center of the first carrier portion 21a. Figures 1-5 The images show the state after the photosensitive chip 10 and the first carrier portion 21a are assembled together. It can be seen that the photosensitive chip 10 is placed at the central window. In this embodiment, since the center of the first carrier portion of the first chip carrier is hollowed out, the first chip carrier does not occupy the dimension in the height direction (i.e., the z-axis direction), which helps to reduce the height of the photosensitive component.

[0133] Further, refer to Figure 4 In one embodiment of this application, the second carrier portion 20b of the second chip carrier is frame-shaped, and the photosensitive chip 10 and the first carrier portion 20a are disposed at the window in the center of the second carrier portion 20b. Based on the previous embodiment, the center of the second carrier portion 20b of the second chip carrier in this embodiment is also hollowed out, so the second chip carrier does not occupy the dimension in the height direction (i.e., the z-axis direction), thereby helping to better reduce the height of the photosensitive component.

[0134] Further, refer to Figure 2 In one embodiment of this application, the driving rods of the first piezoelectric driving assembly 30a and the second piezoelectric driving assembly 30b are disposed on the same reference plane, which is a plane parallel to the photosensitive surface of the photosensitive chip. In this embodiment, since the driving rods of the first piezoelectric driving assembly and the second piezoelectric driving assembly, which are used to drive the x-axis and y-axis movements respectively, can be disposed on the same reference plane, it is not necessary to arrange piezoelectric driving assemblies with different driving directions in two layers in the height direction (i.e., the z-axis direction), thereby helping to reduce the height of the photosensitive assembly.

[0135] Further, refer to Figure 6In one embodiment of this application, the photosensitive component further includes a module circuit board 70 attached to the photosensitive chip 10. The module circuit board 70 may be a foldable circuit board, which includes a plurality of rigid boards 71 ​​(PCBs) and flexible boards 72 (FPCs) connected between the plurality of rigid boards 71. Furthermore, in this embodiment, the module circuit board 70 has at least two bends, and the at least two bends include at least one vertical bend 73a and at least one horizontal bend 73b. In this embodiment, the vertical bend is a bend that folds the foldable circuit board upwards or downwards, and the horizontal bend is a bend that folds the foldable circuit board forwards, backwards, lefts, or rights. The bend angle may be approximately 90 degrees, but it should be noted that the bend angle in this application is not limited to 90 degrees; in other embodiments, the bend angle may also be 60 degrees, 120 degrees, or other angles. In this embodiment, the flexible circuit board is generally plate-shaped or strip-shaped, with two surfaces and four sides, and its thickness direction is consistent with the normal direction of the flexible circuit board surface. In this embodiment, for the vertical bend 73a, the normal of the flexible circuit board surface lies on the vertical plane before and after the bend; for the horizontal bend 73b, the normal of the flexible circuit board surface lies on the horizontal plane before and after the bend. In this embodiment, the module circuit board 70 can have multiple horizontal bends, making a portion of the module circuit board 70 "S"-shaped, such as... Figure 6 As shown. Furthermore, Figure 14 A module circuit board according to another embodiment of this application is shown. (Reference) Figure 14 In this embodiment, the number of horizontal bends of the module circuit board 70 is less than [number missing]. Figure 6The embodiment describes the number of bends in the horizontal direction, and the module circuit board 70 in this embodiment does not have an "S"-shaped section. In the two embodiments described above, both ends of the module circuit board 70 have bends in the two directions (vertical and horizontal), and the free end of the module circuit board 70 (which can typically have a connector) can be led out from both ends. However, in some other embodiments of this application, the module circuit board 70 may have bends in the two directions (vertical and horizontal) at only one end, and the connector of the module circuit board 70 is led out from only one end. Here, the connector refers to the connection structure of the module circuit board for electrical connection with the outside world (e.g., electrical connection with the mobile phone motherboard). In the above embodiments, the module circuit board adopts a foldable circuit board and provides two mutually orthogonal bending directions, so that the movement of the photosensitive chip on the x-axis and y-axis will not be pulled by the module circuit board, thereby reducing the resistance to the movement of the photosensitive chip and reducing the driving force requirement of the piezoelectric drive component. Meanwhile, since the module circuit board provides two orthogonal bending directions, the image sensor chip will not break the circuit due to the module circuit board being stretched when it moves on the x and y axes, thereby improving the reliability of the optical image stabilization image sensor component.

[0136] Furthermore, Figure 7 A perspective view of the appearance of a photosensitive component in one embodiment of this application is shown. Figure 8 A three-dimensional schematic diagram of the photosensitive component's appearance from another angle is shown. (Reference) Figure 7 and Figure 8 In this embodiment, the photosensitive component includes a photosensitive chip 10, a chip carrier 20, and a piezoelectric driving component 30, as well as a housing base 50 and a support base 60. The housing base 50 and the support base 60 encapsulate the photosensitive chip 10, the chip carrier 20, and the piezoelectric driving component 30 internally (encapsulated within a cavity constructed by the housing base 50 and the support base 60). The top of the support base 60 is adapted to mount a lens assembly; the support base 60 serves as a top cover for the photosensitive component, and the top cover has a lead hole 62 or a clearance groove 63. The free end 79 of the module circuit board 70 can be led out from the lead hole 62 or the clearance groove 63 of the support base 60. Further, the piezoelectric driving component 30 may have a flexible circuit board 39 for connection to an external circuit, which can be electrically connected to the piezoelectric element of the piezoelectric driving component 30 to provide a driving voltage. Each piezoelectric driving component 30 may have an independent flexible circuit board 39. The flexible circuit board 39 can be led out from the lead hole 62 of the support 60. The lead hole 62 can also be replaced by a clearance groove 63 or other types of clearance structure.

[0137] Furthermore, still referencing Figure 7 and Figure 8In this embodiment, the top surface of the support base 60 may also have a circuit board bracket 64, which can be used to support the circuit board of the lens assembly. The lens assembly may include an optical actuator and an optical lens mounted within the optical actuator. The circuit board of the lens assembly may be a foldable circuit board or a flexible circuit board. The circuit board of the lens assembly can be used to provide a driving circuit for the optical actuator. In this embodiment, the optical actuator may be a sleeve-type optical actuator. The support base 60 may also have a circuit board through hole 65, which is located in the adjacent area of ​​the circuit board bracket 64, so that the circuit board of the lens assembly can pass through the support base through the circuit board through hole 65 and communicate with the module circuit board located inside the photosensitive assembly. On the other hand, the circuit board of the lens assembly can still be supported on the circuit board bracket 64. In this embodiment, the support base 60 also has a light-transmitting hole 66, which may be located in the central area of ​​the support base 66, so that light passing through the optical lens can pass through the support base and be received by the photosensitive chip.

[0138] Furthermore, Figure 9 A perspective view of a retractable camera module according to an embodiment of this application is shown. (Referring to the reference...) Figure 9 and Figure 10According to one embodiment of this application, a retractable camera module is provided, which may include a photosensitive component 200, a sleeve-type optical actuator 100, and an optical lens 300. The photosensitive component 200 may be any of the photosensitive components described in the preceding embodiments. The optical lens 300 may be mounted within the sleeve-type optical actuator 100. The sleeve-type optical actuator 100 includes an actuator housing 140, a sleeve assembly 190, and a drive assembly. The sleeve assembly 190 is mounted within the actuator housing 140 and is adapted to extend in a controlled manner (from a light-transmitting aperture) from or retract within the actuator housing 140; the sleeve assembly 190 includes a plurality of coaxially nested sleeves (e.g., a first sleeve 110, a second sleeve 120, and a third sleeve 130); wherein at least one of the sleeves is extendable and retractable relative to another sleeve. In this embodiment, the sleeve assembly includes three sleeves (sleeves can also be referred to as single sleeves or sleeve units) arranged coaxially nested. For any two adjacent sleeves, the inner sleeve can extend or retract relative to the outer sleeve. In this embodiment, the driving device of the optical actuator may include a piezoelectric driving assembly; in the sleeve assembly, at least two sleeves are connected by the piezoelectric driving assembly; the piezoelectric driving assembly includes a fixing block (i.e., a fixing part), a piezoelectric element mounted on the fixing block, a driving rod with one end mounted on the piezoelectric element, and a moving block mounted on the driving rod and movable along the driving rod. The moving block is fixed to the bottom of one sleeve of the sleeve assembly, and the fixing block is fixed to the bottom of the other sleeve of the sleeve assembly; the moving block can move along the driving rod, such that the sleeve connected to the moving block extends or retracts relative to the other sleeve connected to the fixing block.

[0139] Furthermore, in one embodiment of this application, in the retractable camera module, the driving device of the optical actuator further includes a vertically arranged piezoelectric driving component for driving the sleeve assembly to extend out of the housing or retract into the housing. The fixed part of the vertically arranged piezoelectric driving component (which may be simply referred to as the vertical piezoelectric driving component) is installed on the module base, and the driving rod of the first piezoelectric driving component passes through the support base.

[0140] Furthermore, Figure 10 A perspective view of a retractable camera module with the actuator housing removed, according to one embodiment of this application, is shown. (Reference) Figure 10 In this embodiment, the circuit board of the optical actuator 100 can surround the sleeve assembly 190. Figure 10 The middle sleeve assembly is in the extended state, while Figure 11The diagram shows the sleeve assembly retracted within the actuator housing, with the sleeve assembly 190 surrounded by the circuit board of the optical actuator 100. This circuit board of the optical actuator 100 can be referred to as actuator circuit board 180, and its surface 181 can be perpendicular to the top surface of the support 60. Further, the surface 181 of the actuator circuit board 180 (e.g., its outward-facing surface) can be equipped with an IC controller 182. This IC controller 182 can cooperate with Hall elements installed in the individual sleeves of the sleeve assembly 190 to acquire the position of each sleeve based on electromagnetic induction, thereby controlling the extension and retraction of each sleeve.

[0141] Furthermore, the camera module of this application is not limited to a retractable camera module. For example, the piezoelectric-driven optical image stabilization sensor in the foregoing embodiments can also be combined with other types of lens assemblies to form various types of camera modules. For example, in one embodiment, the optical image stabilization sensor can be combined with a lens assembly with autofocus function to form a camera module with autofocus and optical image stabilization functions. The lens assembly may include an optical actuator for autofocus and an optical lens mounted on the optical actuator. The bottom of the optical actuator can be mounted on the top surface of the support of the optical image stabilization sensor. As another example, in another embodiment, the optical image stabilization sensor can be combined with a lens assembly with optical zoom function to form a camera module with optical zoom and optical image stabilization functions. The lens assembly with optical zoom function can also be called a zoom lens, which can directly adopt existing mature designs, and its bottom can be mounted on the top surface of the support of the optical image stabilization sensor. For example, in another embodiment, the optical image stabilization sensor can be combined with a traditional fixed-focus lens to form an optical image stabilization camera module. Since the fixed-focus lens eliminates the need for mechanisms such as motors, it can have a larger aperture. On the other hand, since optical image stabilization is achieved through the movement of the image sensor, the camera module of this embodiment can simultaneously possess the characteristics of a large aperture and optical image stabilization.

[0142] The piezoelectric drive components are mentioned in many places in the various embodiments above. For ease of understanding, the working principle of the piezoelectric drive components is briefly introduced below. Figure 12 A schematic diagram of an example piezoelectric drive assembly is shown. (Reference) Figure 12 In this example, the piezoelectric drive assembly includes: a piezoelectric element 1 (sometimes also called a piezoelectric component), a drive rod 2, a fixed part 3 (also called a counterweight), and a moving block (…). Figure 12 (The moving block is not shown). The piezoelectric element 1 can be mounted on the fixed part 3, and the piezoelectric element 1 is adapted to generate mechanical vibration under the drive of voltage. One end of the drive rod 2 is fixed to the vibration surface of the piezoelectric element 1. Figure 13A schematic diagram illustrating a piezoelectric element and its corresponding drive rod for vibration transmission is shown. The piezoelectric element 1 can be diaphragm-like, and one end of the drive rod 2 is fixed to the center of the piezoelectric element 1. Under voltage, the piezoelectric element 1 vibrates vertically, thereby pushing the drive rod 2 to rise or fall. Further, a moving block can be mounted on the drive rod 2. In this embodiment, the piezoelectric drive assembly can be an inertial-driven piezoelectric assembly. Specifically, in the non-operating state of the piezoelectric element, the moving block is fixed to the drive rod by static friction. In a specific design, the moving block can have a through hole through which the drive rod passes. By selecting an appropriate material, static friction can be formed between the wall of the through hole and the outer surface of the drive rod. This static friction is sufficient to support the weight of the moving block and components such as the sleeve connected to it, thereby ensuring that the relative position of the moving block and the drive rod remains unchanged when the piezoelectric element is not operating. When the piezoelectric element is in operation, controlling the driving voltage allows it to move upwards relatively slowly, thus pushing the driving rod upwards relatively slowly. At this time, because the upward force on the driving rod is small, the static friction between the contact surface of the moving block and the driving rod can still maintain the relative fixation of the moving block and the driving rod, causing the moving block to rise along with the driving rod. When the piezoelectric element reaches its highest point, controlling the driving voltage allows it to move downwards relatively quickly, thus pulling the driving rod downwards relatively quickly. At this time, because the downward force on the driving rod is large, the friction between the contact surface of the moving block and the driving rod is insufficient to maintain the relative fixation of the moving block and the driving rod, causing the driving rod to move downwards relative to the moving block (at this point, the friction between the contact surface of the moving block and the driving rod has actually been converted into kinetic friction). In other words, when the driving rod moves downwards at a faster speed, the moving block will not descend with the driving rod, but will remain at approximately its original height. When the piezoelectric element descends to its lowest point, the driving voltage again drives it to slowly move upwards, thus lifting the moving block again. This cycle repeats, continuously lifting the moving block until it reaches the desired position. In summary, by setting the driving voltage, the piezoelectric element can be controlled to rise slowly and descend rapidly. When the driving rod rises, it uses static friction to lift the moving block, and when it descends, it overcomes dynamic friction to descend rapidly, preventing the moving block from being dragged down by the driving rod. In this way, the moving block is effectively lifted within one vibration cycle of the piezoelectric element. By repeating multiple vibration cycles, the moving block can be continuously lifted upwards until the desired position is reached. Conversely, by setting the driving voltage to control the piezoelectric element to rise and descend slowly and descend rapidly, the moving block can be lowered. By repeating multiple vibration cycles, the moving block can be continuously lowered until the desired position is reached.Based on the above principle, the moving block can move bidirectionally along the direction of the drive rod (e.g., vertically) under the control of a voltage signal, thereby realizing the extension and retraction of the sleeve. The working principle of the inertial-driven piezoelectric component has been briefly described above. It should be noted that this application is not limited to this type of piezoelectric component. More types of piezoelectric components will be exemplarily described at the end of this document.

[0143] In the prior art, there are various implementation schemes for piezoelectric drive components. The Tula scheme was briefly described above as an example. More detailed implementation details of the Tula scheme can be found in CN204993106U and CN105319663A. In this application, the piezoelectric drive component can also adopt other types of piezoelectric drive schemes besides the Tula scheme, such as multilayer piezoelectric element schemes, USM schemes, etc. Implementation details of the linear actuation scheme can be found in CN107046093B, and implementation details of the USM scheme can be found in CN10109301B. The common feature of the above piezoelectric drive schemes is that these piezoelectric drive components all have a fixed block, a piezoelectric element mounted on the fixed block, a drive rod (the top or bottom end of the drive rod is mounted on the piezoelectric element), and a movable block mounted on the drive rod and movable along the drive rod. The movable block can be formed separately or integrally formed with the driven object (e.g., the driven sleeve).

[0144] Both the Tula and multilayer piezoelectric actuator solutions are linear actuation solutions, offering advantages such as small size, high thrust, and high precision. Their relatively simple drive structure makes them suitable for driving heavier products and aligns with the trend towards large image sensors and glass lenses in camera modules, enabling applications like chip-based image stabilization and prism-based image stabilization. The multilayer piezoelectric actuator solution uses a smaller piezoelectric element area (disc-shaped when viewed from above) compared to the Tula solution, which helps reduce the radial dimensions (radial dimension, i.e., the dimension perpendicular to the optical axis) of the sleeve-type optical actuator and the corresponding camera module. Conversely, the Tula solution has a smaller piezoelectric element thickness, resulting in a smaller axial dimension (axial dimension, i.e., the dimension parallel to the optical axis), further reducing the axial dimensions of the sleeve-type optical actuator and the corresponding camera module. Additionally, the wiring in the multilayer piezoelectric actuator solution extends through the side of the linear actuator's base, resulting in relatively simple wiring suitable for use in space-constrained modules.

[0145] Furthermore, according to one embodiment of this application, a method for assembling an optical image stabilization sensor is also provided. Figure 23 The assembly process of an optical image stabilization sensor component according to one embodiment of this application is illustrated. Figure 23 As shown, the assembly process includes the following steps.

[0146] Step S1: Attach the photosensitive component to the first chip carrier. For ease of description, in this embodiment, the assembly of the photosensitive chip and the module circuit board is referred to as the photosensitive component. In this step, the first chip carrier may include a carrier portion and two cantilever portions. One cantilever portion is a drive-side cantilever portion, and the other cantilever portion is a driven-side cantilever portion. The drive-side cantilever portion includes a bent support portion and a flat plate portion. The cross-section of the bent support portion is "V"-shaped, and the flat plate portion covers the opening of the bent support portion. The bent support portion and the flat plate portion can form a piezoelectric drive rod adapter hole. In this step, the complete first chip carrier can be fabricated first, and then the first chip carrier is attached to the photosensitive component. Alternatively, the main body portion and the flat plate portion of the first chip carrier can be fabricated separately first, and then the photosensitive component is attached to the main body portion of the first chip carrier (this step can correspond to...). Figure 15 Sub-step S1-1); then weld the flat plate to the opening of the bent bearing portion, thereby constructing the piezoelectric drive rod adapter hole (this step can correspond to...). Figure 15 Sub-steps S1-2, S1-1, and S1-2 together constitute step S1. In this step, the photosensitive component may include a photosensitive chip and a module circuit board. The module circuit board may be a foldable circuit board, and its specific structure can be referred to the previous description, which will not be repeated here.

[0147] In step S2, a piezoelectric drive assembly is installed on the drive-side cantilever of the first chip carrier, and a guide rod is installed on its driven-side cantilever. The axis of the guide rod is parallel to the axis of the drive rod of the piezoelectric drive assembly.

[0148] Step S3: The first chip carrier is inserted into the second chip carrier. The fixing part of the first piezoelectric drive assembly (referring to the piezoelectric drive assembly installed on the driving side of the first chip carrier) is fixed to the carrier part of the second chip carrier; the two ends of the guide rod of the first chip carrier (referring to the guide rod of the piezoelectric drive assembly installed on the driven side of the first chip carrier) are fixed to the carrier part of the second chip carrier.

[0149] Step S4: A piezoelectric drive assembly is installed in the drive-side cantilever portion of the second chip carrier, and a guide rod is installed in its driven-side cantilever portion. In this embodiment, the carrier portion of the first chip carrier can be referred to as the first carrier portion. The first chip carrier has a first drive side and a first driven side, which are two opposite sides of the first carrier portion. The drive-side cantilever portion and the driven-side cantilever portion of the first chip carrier extend outward from the first drive side and the first driven side, respectively. The carrier portion of the second chip carrier can be referred to as the second carrier portion. The second chip carrier has a second drive side and a second driven side, which are two opposite sides of the second carrier portion. The drive-side cantilever portion and the driven-side cantilever portion of the second chip carrier extend outward from the second drive side and the second driven side, respectively. Furthermore, the first drive side, the second drive side, the first driven side, and the second driven side surround the photosensitive chip. That is, the first driving side, the second driving side, the first driven side, and the second driven side are respectively located on the four peripheral sides of the photosensitive chip. In this embodiment, the axes of the guide rod and the drive rod of the piezoelectric drive assembly mounted on the second chip carrier are parallel. For ease of description, the guide rod slidably connected to the first chip carrier is called the first guide rod, the drive rod movably connected to the first chip carrier is called the first drive rod, the guide rod slidably connected to the second chip carrier is called the second guide rod, and the drive rod movably connected to the second chip carrier is called the second drive rod. The axes of the first drive rod and the second drive rod are perpendicular to each other, and the axes of the first guide rod and the second guide rod are also perpendicular to each other. In this way, the photosensitive chip can have two degrees of freedom of movement: the first guide rod direction (i.e., the x-axis direction) and the second guide rod direction (i.e., the y-axis direction). In this embodiment, preferably, the first drive rod and the second drive rod can be disposed on the same reference plane, which is a plane parallel to the photosensitive surface of the photosensitive chip. In this embodiment, since the driving rods of the first piezoelectric driving assembly and the second piezoelectric driving assembly (i.e., the first driving rod and the second driving rod) used to drive the x-axis and y-axis movement respectively can be set on the same reference plane, it is not necessary to arrange piezoelectric driving assemblies with different driving directions on two layers in the height direction (i.e., the z-axis direction), which helps to reduce the height of the photosensitive assembly.

[0150] Step S5: The photosensitive component, the first chip carrier, the second chip carrier, the first piezoelectric drive assembly, the second piezoelectric drive assembly, the first guide rod, and the second guide rod are assembled into the inverted support base. For ease of description, the above assembly is referred to as the movable chip assembly. In this embodiment, the lower surface of the support base (with its lower surface facing upwards in the inverted state) can be made into a receiving space to accommodate the movable chip assembly, so that the assembly can be easily assembled with the support base. Specifically, on the second driving side, the fixing block (or fixing part) of the second piezoelectric drive assembly can be fixed to the support base, and on the second driven side, both ends of the second guide rod can be fixed to the support base. The second chip carrier can be supported by the second piezoelectric drive assembly and the second guide rod, that is, the second chip carrier can be suspended relative to the support base.

[0151] Step S6: Arrange the flexible circuit board of the module circuit board of the photosensitive component, and lead the free end of the module circuit board (the free end may be equipped with a connector) out from the lead hole or clearance groove of the support base. Here, the connector of the module circuit board refers to the connection structure of the module circuit board for electrical connection with the outside world (e.g., electrical connection with the mobile phone motherboard). In this embodiment, the module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend. The details of the vertical and horizontal bends have been described above and will not be repeated here.

[0152] Step S7: Install the flat housing base onto the inverted support, and encapsulate the movable chip assembly within the receiving space between the support and the housing base. After installation, flip the finished product so that the support is on top. Step S7 completes the process to obtain the photosensitive component. This photosensitive component can be combined with the lens assembly to form a camera module.

[0153] Figure 15 A perspective view of a photosensitive component and its circuitry and connections according to one embodiment of this application is shown. (Refer to reference...) Figure 2-8 and Figure 15The photosensitive component of this embodiment includes a photosensitive chip 10, a first chip carrier 20a, a second chip carrier 20b, a first piezoelectric driving component 30a, a second piezoelectric driving component 30b, a first guide rod 40a, a second guide rod 40b, a housing base 50, and a support base 60. The housing base 50 and the support base 60 can encapsulate the photosensitive chip 10, the first chip carrier 20a, the second chip carrier 20b, the first piezoelectric driving component 30a, the second piezoelectric driving component 30b, the first guide rod 40a, and the second guide rod 40b internally, that is, encapsulated within the cavity formed by the housing base 50 and the support base 60. The technical details of the photosensitive chip 10, the first chip carrier 20a, the second chip carrier 20b, the first piezoelectric driving component 30a, the second piezoelectric driving component 30b, the first guide rod 40a, the second guide rod 40b, the housing base 50, and the support base 60 have been described in Part I and will not be repeated here. The difference between this embodiment and the embodiments in the first part is that the circuit board structure of the camera module in this embodiment has been improved to make it more suitable for photosensitive components and camera modules based on piezoelectric drive components that allow the photosensitive chip to move in the x-axis and y-axis directions. Specifically, in this embodiment, the circuit board structure may include a first circuit board 71 and a second circuit board 72. The first circuit board 71 may include a main body located inside the photosensitive component and an extension extending to the outside of the photosensitive component, and the main body may be attached to the photosensitive chip 10. Figure 15 The main body is shielded by the support base 60 and the photosensitive chip 10. The position and shape of this main body can be consistent with the module circuit board 70 described above, so it will not be repeated here. Unlike the module circuit board 70 in the previous embodiment, the main body of the first circuit board in this embodiment may not have a drive circuit for the piezoelectric drive assembly, but only a support circuit for realizing the image acquisition function of the photosensitive chip. This reduces the wiring area required for the first circuit board, thereby reducing the driving force required to move the photosensitive chip 10 and the first circuit board 71. In this embodiment, since the functional circuit in the main body of the first circuit board 71 can be dedicated to supporting the image acquisition of the photosensitive chip 10, the main body of the first circuit board 71 can also be called a chip circuit board. In this embodiment, the second circuit board 72 may include a transfer circuit board 72a attached to the top surface of the support base 60. This transfer circuit board 72a can be used to electrically connect the first piezoelectric drive assembly 30a and the second piezoelectric drive assembly 30b (see reference). Figure 2-8This allows the piezoelectric elements of both components to output a driving voltage, thereby controlling the direction and amount of movement of the photosensitive chip 10. The relay circuit board 72a can rest on the top surface of the support base 60, thus ensuring high mechanical reliability and maintaining a stable connection even during high-frequency vibration of the piezoelectric elements. Furthermore, the location of the relay circuit board 72a on the top surface of the support base 60 also facilitates the connection of the lens assembly's wiring. For example, some lens assemblies may include optical actuators (e.g., conventional autofocus optical actuators or optical actuators for optical image stabilization). In this case, the wiring of the optical actuator can be connected to the relay circuit board 72a located on the top surface of the support base, and then connected to the outside world (e.g., a mobile phone motherboard) through the relay circuit board 72a. Moreover, in this embodiment, the driving circuits of each piezoelectric driving component are located on the second circuit board 72, and the operating circuit of the photosensitive chip 10 (e.g., an image acquisition circuit) is located on the first circuit board 71. This allows for the separation of these two types of functional circuits, preventing interference between the driving circuit and the photosensitive chip's operating circuit. For example, the line width of the lines in the first circuit board 71 can be smaller than the line width of the lines in the second circuit board 72. The larger line width of the second circuit board 72 helps to support a larger current, thereby increasing the driving power of the piezoelectric drive component and improving the response speed of anti-shake movement or other types of movement. On the other hand, using a smaller line width in the first circuit board 71 is beneficial to reduce the required wiring area while achieving various functions, thereby reducing the size and weight of the first circuit board 71.

[0154] Furthermore, Figure 16a and Figure 16b The three-dimensional structures of the second circuit board from two different angles in one embodiment of this application are shown. (Refer to reference...) Figure 15 , Figure 16a and Figure 16b In this embodiment, the second circuit board 72 may include a relay circuit board 72a, a first extension 72b, and a second extension 72c. The relay circuit board 72a is as described above and will not be repeated. In this embodiment, the first extension 72b is formed by bending upwards from one side of the relay circuit board 72a, that is, the first extension 72b is connected to the relay circuit board 72a through a vertical bend 73. The second extension 72c is formed by bending horizontally from the first extension 72b, that is, the second extension 72c is connected to the first extension 72b through a horizontal bend 74. In this embodiment, the first extension 72b and the second extension 72c can rest on an actuator housing 80 (see reference). Figure 15The actuator housing 80 can serve as the outer casing of the lens assembly, covering the support 60. An optical lens and an optical actuator (sometimes referred to as a motor) for driving the optical lens can be accommodated between the actuator housing 80 and the support 60. The first extension 72b and the second extension 72c can respectively rest against two mutually perpendicular outer surfaces of the actuator housing 80.

[0155] Furthermore, still referencing Figure 15 , Figure 16a and Figure 16b In one embodiment of this application, the relay circuit board 72a in the second circuit board 72 can be a PCB board (rigid board) or a flexible board (FPC board). Since the relay circuit board 72a rests on the top surface of the support base 60, it can have high mechanical reliability regardless of whether a rigid board or a flexible board is used, and can maintain a stable connection when the piezoelectric element vibrates at high frequency. Furthermore, the drive circuit of the piezoelectric drive component of the photosensitive component can be set in the first extension portion 72b and / or the second extension portion 72c, so that the wiring of the relay circuit board 72a will be simpler, which will help reduce the thickness of the relay circuit board 72a and thus help reduce the overall height of the camera module. At the same time, since the first extension portion 72b and the second extension portion 72c are both located outside the actuator housing 80, it is also beneficial to improve the heat dissipation performance of the drive circuit. Furthermore, when the lens assembly has an optical actuator, the drive circuit of the lens assembly can also be set in the first extension portion 72b and / or the second extension portion 72c, thereby further simplifying the wiring of the built-in relay circuit board. Of course, this application is not limited to the above embodiments. In other embodiments of this application, the relay circuit board 72a may also be arranged with functional circuits, such as the drive circuit of the piezoelectric drive component of the photosensitive component or the drive circuit of the lens component.

[0156] Further Figure 17 A photosensitive component assembled from a circuit board structure according to one embodiment of this application is shown. (Referring to the reference...) Figure 15 , Figure 16a , Figure 16b and Figure 17In this embodiment, the first circuit board may include a chip circuit board (or the main body of the first circuit board), which can be bonded to the photosensitive chip 10. One end of the chip circuit board may have at least one vertical bend and at least one horizontal bend to prevent the x-axis and y-axis movement of the photosensitive chip 10 from being obstructed by the chip circuit board (the shape and structure of the chip circuit board can be referred to the description of the module circuit board 70 above). Further, the chip circuit board can be led out from the lead groove on the top surface of the support 60. Specifically, the chip circuit board can be connected to the outside of the support 60 by a second connecting strip. The second connecting strip can be located inside the photosensitive assembly and includes at least one vertical bend and at least one horizontal bend. The second connecting strip can be connected to the outside of the support 60 by an "S"-shaped transition section 71a. The other end of the "S"-shaped transition section 71a is connected to a third extension 71b, the back of which can rest against the actuator housing 80 (see reference). Figure 15 The outer side of the third extension 71b. In this embodiment, the third extension 71b can be connected to the fourth extension 71c via a horizontal bend (note that...). Figure 17 The fourth extension 71c (not yet bent relative to the third extension 71b) can be engaged with the second extension 72c via a connector after bending (e.g., the second extension 72c can be equipped with a pin-type connector, and the fourth extension 71c can be equipped with a socket-type connector). For example, a connector 75a can be provided on the second extension 72c, and a connector 75b can be provided on the fourth extension. The connector engagement can electrically connect the second extension 72c and the fourth extension 71c, and also firmly fix them to the outer side of the actuator housing 80. This design not only results in neat wiring but also facilitates circuit board assembly, is suitable for automated assembly processes, and helps improve product production efficiency and yield.

[0157] Furthermore, in one embodiment of this application, one side of the actuator housing 80 may have an outward protrusion 81, such that the outer surface of the actuator housing 80 on this side has a stepped structure 82, and the third extension 72b may be disposed above the stepped structure 82. This design allows for a larger internal space within the actuator housing 80 to accommodate devices such as piezoelectric drive components or guide rods, or a second connecting strip of the first circuit board disposed within the internal cavity of the photosensitive component, at the location of the outward protrusion 81. On the other hand, an obstacle avoidance area is formed above the stepped mechanism on the outside of the actuator housing, which can avoid other functional modules of a smart electronic device (e.g., a smartphone equipped with a camera module). Alternatively, this obstacle avoidance area can be used to house the third extension, thereby improving the space utilization of the camera module.

[0158] Furthermore, still referencing Figure 15 and Figure 17 In one embodiment of this application, the back sides of the first extension portion 72b and the second extension portion 72c can be attached to the side of the actuator housing 80, thereby increasing the robustness and mechanical reliability of the circuit board structure. The third extension portion 71b can be left unattached and simply rest on the outer side of the actuator housing 80. In this embodiment, the third extension portion 71b can be a flexible connecting strip made of a flexible printed circuit board (FPC). This design allows the third extension portion 71b to have a certain amount of room to move. When the movement stroke of the photosensitive chip is large, this design can better avoid the decrease in the movement accuracy of the photosensitive chip caused by the pulling of the chip circuit board, thereby improving the imaging quality. Referring to the description of the piezoelectric drive component principle above, it is easy to understand that the movement range of the photosensitive chip is usually significantly larger than the vibration range of the piezoelectric element. Therefore, in this embodiment, the first circuit board 71 (chip circuit board) can be provided with a larger range of movement than the second circuit board 72 in order to adapt to the larger range of movement of the photosensitive chip. Since the fourth extension 71c and the second extension 72c can be fixed by a connector, and the back of the third extension 71b can rest against the outer side of the actuator housing 80, the third extension 71b and the fourth extension 71c will not transmit the movement of the photosensitive chip to the outside (e.g., the motherboard of a mobile phone), thereby avoiding the break or poor contact caused by the pulling of the cable (e.g., the flexible connecting strip).

[0159] It should be noted that the implementation of the first circuit board in this application is not limited to the previous embodiment. For example, in another embodiment, the back side of the third extension of the first circuit board can also be attached to the outer side of the actuator housing. This embodiment is better suited for situations where the travel distance (or range of motion) of the photosensitive chip is small.

[0160] In one embodiment of this application, the relay circuit board, the first extension section and the second extension section of the second circuit board can all be arranged with functional circuits (e.g., the drive circuits of each piezoelectric drive component), thereby making better use of the wiring space of the second circuit board.

[0161] In one embodiment of this application, the second extension portion of the second circuit board may be constructed from a rigid board (PCB). Electronic components, such as resistors, capacitors, and IC chips, may be arranged on the outer surface of the second extension portion (i.e., the surface facing outwards). Arranging electronic components on the outer side of the second extension portion helps reduce the number of electronic components inside the photosensitive assembly and the actuator housing, thereby contributing to the miniaturization of the camera module and improving its heat dissipation capabilities.

[0162] Further, refer to Figure 15 , Figure 16a , Figure 16b and Figure 17 In one embodiment of this application, the relay circuit board 72a can be a rigid board (PCB) or a flexible board (FPC), with its back side attached to the top surface of the support base 60. The support base 60 has a central light-transmitting hole 66, and the top surface of the support base 60 can also be provided with multiple clearance slots or clearance holes to allow the leads of the piezoelectric drive assembly to be led out. In this embodiment, the shape of the relay circuit board 72a from a top view angle can be adapted to the top surface of the support base 60. For example, a light-transmitting hole can also be provided in the central area of ​​the relay circuit board 72a, and the relay circuit board 72a avoids the clearance slots or clearance holes on the top surface of the support base 60. In this embodiment, the piezoelectric element of the piezoelectric drive assembly can have three electrode plates. The first and third electrode plates can be located on the upper and lower surfaces of the piezoelectric element, respectively (i.e., the upper end face and the lower end face; the end face of the piezoelectric element is the outer surface perpendicular to the central axis of the drive shaft, and the outer surface parallel to the central axis of the drive shaft can be called the side surface of the piezoelectric element). The second electrode plate can be led out from the middle region of the side surface of the piezoelectric element. The second electrode plate can extend into the interior of the piezoelectric element. Piezoelectric material layers can be present between the first and second electrode plates, and between the second and third electrode plates. The polarities of the first and third electrode plates can be the same, for example, both can be positive. The polarity of the second electrode plate can be opposite to that of the first and third electrode plates; for example, the second electrode plate can be negative. In practical use, the polarities of the first and third electrode plates can also be negative, while the polarity of the second electrode plate can be positive. For further details regarding the arrangement of the three electrode plates in the piezoelectric element, please refer to patent document CN204993106U. In this embodiment, the first, second, and third electrode plates of the piezoelectric element can be connected by a flexible connecting strip with three branches (hereinafter referred to as the first connecting strip), which can be made of a flexible printed circuit board (FPC). The three branches at the branched ends of the flexible connecting strip are respectively connected to the first, second, and third electrode plates, while the non-branched ends are led out from the clearance groove or clearance hole of the support base and then fixed to the relay circuit board by conductive adhesive (e.g., conductive silver paste) or by welding. Since the support base can be manufactured based on an embedded injection molding process, in which metal sheets can be embedded, the support base can have high structural strength and a flat surface. Furthermore, the top surface of the support base has a large area, making it very convenient for automated equipment to operate. In other words, the process of leading the flexible connecting strip out from the clearance groove or clearance hole and bonding or welding it to the upper surface of the relay circuit board is easy to implement with automated equipment, which is very beneficial to improving the production efficiency and yield of the camera module.

[0163] Furthermore, in one embodiment of this application, reference is made to... Figure 16a , Figure 16band Figure 17 The second extension 72c can also lead out a main connecting strip 72d, which can be connected to the motherboard of an electronic device (e.g., a smartphone with a camera module) or other modules of the electronic device. In one example, the main connecting strip 72d can be connected to the second extension 72c via a vertical bend. This vertical bend can be bent at approximately 90 degrees in the vertical direction, making the main connecting strip 72d horizontal, i.e., the surface of the main connecting strip 72d is approximately horizontal. This design facilitates the connection of the main connecting strip 72d to the motherboard of the electronic device or other modules of the electronic device. The end of the main connecting strip 72d can have a main connector. After being connected to the outside world through the main connecting strip and the main connector, the entire circuit board structure of the camera module can receive external power and signals from the outside world (e.g., from the processor).

[0164] Further Figure 18 A partial structural schematic diagram of the second extension portion in one embodiment of this application is shown. (Reference) Figure 18 In this embodiment, the second expansion board can be implemented using a folded composite circuit board. This composite circuit board can include two PCBs (which can be referred to as the first sub-circuit board 72c1 and the second sub-circuit board 72c2, respectively) and a horizontal bending portion 72c3 connecting the two PCBs. This horizontal bending portion can be bent 180 degrees, allowing the two PCBs to fold together. Electronic components, including resistors, capacitors, and IC chips, can be mounted on the outer PCB (first sub-circuit board 72c1). This design helps improve the structural strength of the second expansion board while increasing its wiring area. Furthermore, the second expansion board can also include a reinforcing plate, which can be disposed between the PCB and the actuator housing. The second expansion board is fixed to the outer side of the actuator housing by the reinforcing plate. In this embodiment, the main connecting strip can be connected to the PCB on the back (i.e., the second sub-circuit board 72c2) through the vertical bending portion. This design avoids poor contact or open circuit problems caused by relative displacement between the camera module and the electronic device's motherboard (e.g., relative displacement due to external impacts or the influence of moving parts themselves). In another embodiment, the second expansion board may also include a PCB board, a horizontal bend, and an FPC board. The horizontal bend can be bent 180 degrees, allowing the PCB board and FPC board to be folded together, or the FPC board can be attached to the back of the PCB board. Furthermore, a reinforcing plate 72c4 can be provided on the back of the FPC board to improve structural strength. In this case, the main connecting strip can be led out from the FPC board located on the back through a vertical bend.

[0165] Further, refer to Figure 17In one embodiment of this application, the second expansion section 72c may be provided with two connectors distributed in different sections, and the fourth expansion board 71c is also provided with two connectors in corresponding positions. By the snap-fit ​​of the two pairs of connectors, the first circuit board 71c and the second circuit board 72c can be more securely fixed together, and the connection channels (I / O channels) for electrical signals of the first circuit board 71 and the second circuit board 72 can also be increased. The fourth expansion board 71c can be a rigid board (PCB board) or a flexible board (FPC board).

[0166] Below, we will introduce the improved wiring layout and connection of the retractable camera module with reference to some embodiments.

[0167] In some embodiments of this application, the camera module may be a retractable camera module, which may include a retractable lens assembly. The retractable lens assembly includes at least one piezoelectric drive assembly capable of driving the optical lens to extend or retract. The piezoelectric drive assembly used to drive the movement of the photosensitive chip provides a horizontal driving force, i.e., a driving force in the x-axis and y-axis directions, and therefore can be called a horizontal piezoelectric drive assembly. The piezoelectric drive assembly used to drive the extension or retraction of the optical lens provides a vertical driving force (i.e., in the z-axis direction), and for ease of description, it can be called a vertical piezoelectric drive assembly. The axis of the drive rod (or drive shaft) of the vertical piezoelectric drive assembly is vertical. (See reference...) Figure 17In this embodiment, the top surface of the support base 60 has a mounting groove 67 suitable for mounting the vertical piezoelectric drive assembly 90. The mounting groove 67 opens upwards, allowing the drive element of the piezoelectric drive assembly 90 to be inserted into the mounting groove 67, thereby helping to reduce the overall height of the camera module (actuator housing) while providing sufficient telescopic travel. In this embodiment, the piezoelectric element of the vertical piezoelectric drive assembly 90 can be connected via a bifurcated flexible connecting strip. This flexible connecting strip has a bifurcated end and a non-bifurcated end; the bifurcated end is used to connect the electrodes of the piezoelectric element, and the non-bifurcated end of the flexible connecting strip is connected to the upper surface of the relay circuit board. In this embodiment, from a top-down view, the vertical piezoelectric drive assembly can be mounted in a corner area of ​​the support base 60. The other two corner areas of the support base 60 can be equipped with guide posts (or pillars 69), and the other corner area can be equipped with a circuit board bracket 68. This circuit board bracket 68 can be used to support and mount flexible connecting strips (e.g., FPC boards) extending from the photosensitive component and / or lens assembly, allowing for better connection of the photosensitive component and / or lens assembly to the relay circuit board 72a. In this embodiment, the drive rod of the vertical piezoelectric drive assembly and the two pillars can jointly support the lens assembly, thereby making the movement of the retractable module more stable. Simultaneously, since only one vertical piezoelectric drive assembly is used, it helps to save costs and reduce installation difficulty. It should be noted that in other embodiments of this application, more vertical drive assemblies can also be provided to support the lens assembly. In this embodiment, the optical lens can be a conventional optical lens, a zoom lens, or an optical lens with image stabilization. The retractable module can have two states. In the first state, the optical lens can be placed inside the actuator housing, such that the top surface of the optical lens is approximately flush with the back of the electronic device (or flush with the height of the camera module area on the back of the electronic device). In the second state, the optical lens can extend out of the actuator housing from the central through-hole of the actuator housing, driven by the vertical piezoelectric drive assembly. This second state is typically suitable for telephoto shooting that requires a long back focus.

[0168] In some embodiments of this application, the lens assembly of the camera module can be selected from various different types of lens assemblies. For example, the lens assembly can be an autofocus lens assembly, an optical image stabilization lens assembly, or an optical zoom lens assembly. The autofocus lens assembly may further include an autofocus drive device, the leads of which are connected to the relay circuit board. The optical image stabilization lens assembly may further include an optical image stabilization drive device, the leads of which are connected to the relay circuit board. The optical zoom lens assembly may further include a zoom drive device, the leads of which are connected to the relay circuit board.

[0169] Below, we will introduce the improved wiring layout and connection of the sleeve-type camera module with reference to some embodiments.

[0170] Furthermore, in one embodiment of this application, the camera module may be a sleeve-type camera module. Figure 19 A perspective structural diagram of a sleeve-type camera module according to one embodiment of this application is shown. Figure 20 A schematic diagram showing the connection relationship between the photosensitive component and the sleeve component in one embodiment of this application is shown. Figure 21 The diagram shows a top-view structural schematic of the sleeve assembly and photosensitive assembly in one embodiment of this application. Figure 22 A longitudinal cross-sectional perspective view of a sleeve-type camera module in an extended state, according to one embodiment of this application, is shown. (Refer to reference...) Figures 19-22 In this embodiment, the sleeve-type camera module may include a sleeve-type lens assembly, which may include a sleeve assembly 990, an optical lens 300, and a vertical first piezoelectric drive assembly 810 (see reference). Figure 20 and Figure 21 ), Vertical second piezoelectric drive assembly 820 (reference) Figure 22 ) and vertical third piezoelectric drive assembly 830 (reference) Figure 22 (Note that most of its drive rod is obscured by the optical lens 300). The vertical first piezoelectric drive assembly 810 is used to drive the entire sleeve assembly 990 to extend or retract into the actuator housing 80. The vertical second piezoelectric drive assembly 820 and the vertical third piezoelectric drive assembly 830 are used to drive the extension and retraction of each individual sleeve of the sleeve assembly. In this embodiment, because multiple vertical piezoelectric drive assemblies are arranged in each individual sleeve, and each individual sleeve can extend and retract, more wiring is involved. Specifically, in the sleeve-type lens assembly, the sleeve assembly includes multiple nested individual sleeves. In this embodiment, the sleeve assembly 990 may include three individual sleeves: the first sleeve 910, the second sleeve 920, and the third sleeve 930 (see reference). Figure 19The first sleeve 910, the second sleeve 920, and the third sleeve 930 are nested sequentially from the outside in. The vertical second piezoelectric drive assembly 820 and the vertical third piezoelectric drive assembly 830 can be arranged in two layers. The vertical second piezoelectric drive assembly 820 can connect to the first sleeve 910 and the second sleeve 920. The vertical third piezoelectric drive assembly 830 can connect to the second sleeve 920 and the third sleeve 930. For two adjacent individual sleeves, the bottom plate of one individual sleeve is connected to the moving part of the corresponding vertical piezoelectric drive assembly, and the bottom of the other individual sleeve can be connected to the fixed part of the corresponding vertical piezoelectric drive assembly. Furthermore, when all individual sleeves are in the extended state, the topmost individual sleeve (the third sleeve 930 in this embodiment) can include a lens carrier, the inner side of which is adapted to mount an optical lens 300. With each sleeve in its retracted state, two vertical piezoelectric drive assemblies (e.g., a second vertical piezoelectric drive assembly 820 and a third vertical piezoelectric drive assembly 830) are housed within the same receiving cavity, located between the lens carrier and the sleeve's wall. In this embodiment, the position of the first vertical piezoelectric drive assembly can be consistent with the embodiment in Part III above, i.e., its piezoelectric element can be located in one corner of the four corner areas of the support base. The moving part (or moving block) of this vertical piezoelectric element can be integrated with the bottom of the first sleeve 910, thereby pushing the entire sleeve assembly 990 to extend or retract into the actuator housing 80.

[0171] Furthermore, in one embodiment of this application, each individual sleeve of the sleeve assembly is provided with corresponding wiring to connect to the piezoelectric element of the piezoelectric drive assembly located on that individual sleeve. Additionally, to accurately detect the actual movement position of the individual sleeves, a Hall element is typically installed on each individual sleeve. This Hall element can be used as a position sensor to obtain the actual position of the corresponding individual sleeve in real time. Each Hall element is typically connected by a flexible circuit board (e.g., an FPC flexible board). The wiring of the sleeve assembly is connected to the aforementioned relay circuit board via a foldable circuit board, and then connected to the outside via a first extension, a second extension, and a main connecting strip. (Referring to the reference...) Figure 22In this embodiment, each individual sleeve can be provided with a sleeve circuit board bracket, and the sleeve circuit board can be mounted and supported on the sleeve circuit board bracket. A Hall element can be mounted on the top of the sleeve circuit board bracket, and the sleeve circuit board extends along the sleeve circuit board bracket to its top and is electrically connected to the Hall element. The second extension 72c of the second circuit board 72 can be provided with an IC sensing module corresponding to the Hall element mounted on each individual sleeve. The IC sensing module can sense the position change of the Hall element of each individual sleeve, thereby calculating the actual movement direction and movement amount of each individual sleeve. In this embodiment, the sleeve circuit board of each layer of individual sleeves includes a support part and a lead part. The following description takes the first sleeve 910 and its sleeve circuit board bracket 821 as an example. Within the first sleeve 910, the support portion 822 of the sleeve circuit board rests against and is mounted on the sleeve circuit board bracket 821, while the lead portion 823 is a foldable circuit board. When the sleeve assembly 990 is in the extended state, the lead portion 823 unfolds and suspends, allowing it to pass through the base plate of the individual sleeve (e.g., the first sleeve 910) and be electrically connected to the relay circuit board. It should be noted that when there is a next layer of individual sleeves below the individual sleeves (e.g., the second sleeve 920 or the third sleeve 930), the lead portion of the sleeve circuit board of that individual sleeve (e.g., the second sleeve 920 or the third sleeve 930) passes through the base plate and connects to the sleeve circuit board of the next layer of individual sleeves. The lead portion of the sleeve circuit board of the bottommost sleeve (e.g., the first sleeve 910) can be directly electrically connected to the relay circuit board. Through this layered connection, power can be supplied to the piezoelectric elements and Hall elements in each different layer of sleeves, and control signals can be provided. When the sleeve assembly is in the retracted state, the lead portions of each sleeve circuit board can be folded, thereby facilitating storage when the sleeve assembly is retracted inside the actuator housing.

[0172] Furthermore, in one embodiment of this application, in each layer of the individual sleeve, the sleeve circuit board can be connected to the piezoelectric element of the piezoelectric drive assembly located in that layer via a flexible connecting strip. In this application, the connecting strip resting on the upper surface of the base plate can also be referred to as a third connecting strip. Figure 21 The diagram shows the connection of the first sleeve 910 and its sleeve circuit board. (Reference) Figure 21The third connecting strip 911 can be arc-shaped when viewed from above to avoid the light-transmitting hole in the center of the single sleeve. The flexible connecting strip 911 can rest against the bottom plate of the single sleeve. When the piezoelectric element is close to the sleeve circuit board support 821, the third connecting strip 911 can also be suspended, that is, the branched flexible connecting strip of the piezoelectric element can be directly connected to the sleeve circuit board. When the piezoelectric element is far from the sleeve circuit board support 821, the supporting part 822 of the sleeve circuit board can lead out an arc-shaped or zigzag connecting strip (e.g., the third connecting strip 911). This arc-shaped connecting strip rests against the upper surface of the bottom plate of the single sleeve at this level and extends to the vicinity of the piezoelectric element 824 at this level. Then, the branched flexible connecting strip 825 of the piezoelectric element 824 connects with the arc-shaped or zigzag connecting strip and conducts electricity. It should be noted that in this application, the piezoelectric element of the piezoelectric drive assembly may have only two electrode plates with opposite polarities. Thus, the bifurcated flexible connecting strip only requires two bifurcated portions, which are respectively connected to the two electrode plates of the piezoelectric element. The piezoelectric drive assembly includes both horizontal and vertical piezoelectric drive assemblies.

[0173] Furthermore, still referencing Figure 21 In one embodiment of this application, the third connecting strip 911 can also be used to connect the sleeve circuit boards of adjacent layer single sleeves. From a top-down view, the sleeve circuit board supports of the upper sleeve and the lower sleeve are typically offset by a certain distance. Therefore, the sleeve circuit board of the upper sleeve can be connected to the sleeve circuit board support of the lower sleeve (or corresponding to the opening in the bottom plate of the lower sleeve circuit board support) along the surface of the bottom plate of the upper sleeve using the arc-shaped connecting strip. The bearing portion of the sleeve circuit board of the lower sleeve and the sleeve circuit board support of the lower sleeve can pass through the through-hole in the bottom plate of the upper sleeve and be electrically connected to the arc-shaped connecting strip. Using this method, the uppermost sleeve circuit board can be led down layer by layer until it is connected to the transfer circuit board located on the top surface of the support. The arc-shaped connecting strip can also be other shapes, as long as it avoids the central light-transmitting hole. Note that... Figure 21 In this configuration, the first sleeve 910 is located at the bottom layer of the sleeve assembly, therefore no sleeve circuit board bracket passes through the opening in its base plate for leading the wires downwards. (Refer to reference...) Figure 22 As can be seen, the sleeve circuit board support 831 of the second sleeve 920 is offset from the sleeve circuit board support 821 of the first sleeve 910 (referring to the offset position from a top view angle), thereby avoiding interference between the two sleeve circuit board supports 821 and 831 when the sleeve assembly retracts. The lead wire 833 extending downward from the sleeve circuit board support 831 can be connected to the sleeve circuit board of the next layer of single sleeve at the position of the sleeve circuit board 821 via the third connecting strip 911 (see reference). Figure 22 Furthermore, in this embodiment, for each of the individual sleeves, a Hall element is mounted on the top of the circuit board bracket, and the sleeve circuit board is electrically connected to the Hall element. For example, for the first sleeve 910, a Hall element 826 is mounted on the top of its sleeve circuit board bracket 821, and the bearing portion 822 of the sleeve circuit board is electrically connected to the Hall element 826.

[0174] In the aforementioned piezoelectric-driven sleeve assembly, multi-stage piezoelectric drive rods can progressively push different layers of individual sleeves (for ease of description, individual sleeves will sometimes be simply referred to as sleeves) up or down, thereby extending the total extension distance of the top sleeve (referring to the sleeve at the very top in the extended state), and thus increasing the back focal distance in telephoto shooting. Furthermore, based on the design scheme of the above embodiments, the extension distance of the top sleeve can be expanded by increasing the number of sleeve layers, thereby further improving the back focal distance and magnification in telephoto shooting. Specifically, in a modified embodiment of this application, sleeves of any adjacent layers can be connected by the piezoelectric drive assembly. Specifically, the fixing block of the piezoelectric drive assembly can be fixed to the i-th layer of sleeve, and this fixing block can be located at the bottom of the i-th layer of sleeve. The drive rod can be in a vertical state (i.e., the axis of the drive rod is approximately parallel to the axis of the sleeve, i.e., the optical axis). A moving block is mounted on the drive rod and can move vertically along the drive rod. Furthermore, this moving block is fixed to the (i+1)-th layer of sleeve. In this embodiment, the moving block is fixed to the bottom of the (i+1)th layer sleeve. Thus, the (i+1)th layer sleeve can move vertically under the action of the moving block, thereby achieving the extension and contraction of the (i+1)th layer sleeve relative to the ith layer sleeve. Here, i = 1, 2, ..., N-2, N-1. In this embodiment, multiple layers of sleeves can be connected layer by layer based on this piezoelectric drive assembly (this connection is movable), thereby achieving a wide range of extension and contraction of the multiple layers of sleeves. Compared to periscope telephoto modules, the piezoelectrically driven sleeve actuator of this embodiment can reduce the pre-installed space inside the smart terminal in the contracted state. In the extended state, based on this piezoelectrically driven, layer-by-layer connected sleeve assembly, the optical path length of the module can reach several times the thickness of the smart terminal (e.g., a mobile phone), sufficient to support the needs of telephoto shooting. When N = 4, the sleeve assembly has 4 layers of sleeves; when N = 5, the sleeve assembly has 5 layers of sleeves. Generally speaking, as the number of sleeve layers increases, the top sleeve will have a greater extension distance, which allows the camera module to support a greater zoom magnification.

[0175] On the other hand, in conjunction with reference Figure 21 and Figure 22In some embodiments of this application, the piezoelectric drive rods for driving the extension and retraction of different levels of sleeves in the sleeve module can be arranged in the same receiving cavity, thereby avoiding the need to set up multiple mutually isolated receiving cavities between the cylinder walls of multiple adjacent sleeves, which helps to reduce the structural complexity of the module. At the same time, since the drive rods of different levels can be arranged in the same annular receiving cavity, there can be a larger installation space when assembling the telescopic sleeve assembly, which facilitates the automated assembly of the actual product.

[0176] Furthermore, in conjunction with references Figure 21 In some embodiments of this application, each sleeve may have multiple piezoelectric drive components. When viewed from above, these piezoelectric drive components can be evenly distributed in different orientations, thereby providing stable support for the sleeve and helping to ensure the straightness of the telescopic sleeve (i.e., ensuring that the telescopic direction of each sleeve is kept as straight as possible parallel to the optical axis).

[0177] Further, in some embodiments of this application, the Nth layer sleeve (topmost sleeve) includes an Nth layer cylinder wall, a top cover, and the lens carrier; the inner surface of the Nth layer cylinder wall, the outer surface of the lens carrier, and the lower surface of the top cover form the annular receiving cavity. From a top-down view, multiple piezoelectric drive components of the same layer are evenly distributed around the lens carrier. In the contracted state, the piezoelectric drive components of different layers are arranged alternately in the annular receiving cavity. Furthermore, from a top-down view, the piezoelectric drive components located at different layers (excluding the piezoelectric drive components installed between the inner surface of the housing and the outer surface of the sleeve assembly) are staggered circumferentially and arranged in a single annular pattern. In this text, circumferential refers to the circumferential direction. Circumferential staggering means staggering along the circumferential direction, not radial staggering. Radial refers to the diametrical direction. Correspondingly, the circumferentially staggered design results in the piezoelectric drive components and auxiliary guide structures at different levels being distributed on the same ring (i.e., on a single ring or in a single-ring distribution), rather than on two or more concentric rings. This design improves the space utilization of the annular cavity and helps reduce the radial dimension of the module.

[0178] Furthermore, in some embodiments of this application, for any layer of sleeve, a portion of the multiple piezoelectric drive components driving the extension and retraction of that layer of sleeve can be replaced by an auxiliary guiding structure. For example, assuming i is any integer from 2 to N, then for the i-th layer of sleeve, the auxiliary guiding structure may include, for example, a guide post having a vertical guide groove. The bottom of the guide post may be connected to the (i-1)-th layer of sleeve, for example, to the bottom plate of the (i-1)-th layer of sleeve. A sliding block may be connected to the wall or bottom plate of the i-th layer of sleeve, and the sliding block may slide along the guide post. The sliding block is provided with a ball receiving groove, in which the ball is located, and the ball is supported between the guide post and the sliding block, such that when the sliding block slides along the guide post, the ball can roll along the vertical guide groove, and the ball is always located between the ball receiving groove and the vertical guide groove. This ball-based auxiliary guiding structure can reduce the resistance of the i-th layer of sleeve in its extension and retraction relative to the (i-1)-th layer of sleeve. The auxiliary guiding structure can enhance the stability and straightness of the sleeve's extension and retraction, while also helping to reduce the number of piezoelectric drive components and corresponding drive circuits, thereby reducing costs and assembly process complexity. In a modified embodiment, the guide post of the auxiliary guiding structure can be omitted, and the vertical guide groove can be disposed on the inner side of the sleeve wall of the (i-1)th layer sleeve.

[0179] Furthermore, in some embodiments, i can be 1, in which case the (i-1)th sleeve layer is the 0th sleeve layer, and the housing can be regarded as the 0th sleeve layer. That is, the vertical guide groove can be provided on the housing, for example, on a guide post directly or indirectly connected to the housing, or directly on the inner side of the housing. The 1st sleeve layer can extend and retract relative to the housing under the combined action of the piezoelectric drive assembly and the auxiliary guide structure.

[0180] Further, in one embodiment, i = 3, meaning the sleeve assembly has three sleeve layers (or four sleeves if the housing is considered the 0th sleeve layer). In this embodiment, the number of first piezoelectric drive components can be two, respectively disposed in two diagonally opposite corner areas, while the other two diagonally opposite corner areas can be provided with first auxiliary guide structures. There can be four second piezoelectric drive components, which are evenly distributed and staggered from the first piezoelectric drive components and the first auxiliary guide structure. There can be four third piezoelectric drive components, which are evenly distributed and staggered from the first piezoelectric drive components, the first auxiliary guide structure, and the second piezoelectric drive components. It should be noted that in some modified embodiments, some second piezoelectric drive components can be replaced by the second auxiliary guide structure. In other modified embodiments, some third piezoelectric drive components can be replaced by the third auxiliary guide structure. The specific configuration of the first, second, and third auxiliary guide structures can be referred to the description of the auxiliary guide structures above, and will not be repeated here.

[0181] Furthermore, in some embodiments of this application, the Nth layer sleeve (topmost sleeve) includes an Nth layer cylinder wall, a top cover, and the lens carrier; the inner surface of the Nth layer cylinder wall, the outer surface of the lens carrier, and the lower surface of the top cover form the annular receiving cavity. For the same pair of adjacent layers of sleeves (referring to two sleeves adjacent vertically in the extended state), these two sleeves can be supported by at least one piezoelectric drive assembly (driving direction is vertical) and at least one auxiliary guide structure. From a top view, at least one piezoelectric drive assembly and at least one auxiliary guide structure connecting the same pair of adjacent layers of sleeves are evenly distributed around the lens carrier. Furthermore, from a top view, the piezoelectric drive assemblies and auxiliary guide structures located at different layers are staggered in the circumferential direction and distributed in a single ring (except for the piezoelectric drive assembly and auxiliary guide structure installed between the inner surface of the housing and the outer surface of the sleeve assembly).

[0182] Furthermore, in some embodiments of this application, a light-transmitting hole may be provided in the center of the base plate of each sleeve of the sleeve assembly to allow light to pass through each layer of sleeves. It should be noted that the base plate (e.g., the first base plate of the first layer of sleeves or the second base plate of the second layer of sleeves) is not a necessary component of the sleeve. For example, in some modified embodiments of this application, the base plates of some or all of the sleeves may be omitted, in which case the piezoelectric drive assembly can be mounted on the outward or inward cantilever structure of the sleeve wall.

[0183] Furthermore, in some embodiments of this application, the sleeve assembly has three sleeves, and the back focal distance of the sleeve module in its fully extended state is 15-25mm (the back focal distance D can be referenced). Figure 5The height of the sleeve-type optical actuator is 5mm-10mm. In the fully extended state, the distance the top surface of the sleeve assembly extends relative to the top surface of the housing is 20mm-35mm. (Refer to reference...) Figure 5 The ratio of the extension distance L1 of the sleeve-type optical actuator to its original height L2 ranges from 2 to 5, i.e., L1 / L2 ranges from 2 to 5. Preferably, L1 / L2 ranges from 3 to 4. Here, the extension distance L1 of the sleeve-type optical actuator refers to the extension distance excluding the original height of the sleeve-type optical actuator itself.

[0184] Furthermore, in one embodiment of this application, in the contracted state, the top surfaces of each layer of the sleeve assembly are flush.

[0185] Furthermore, in some embodiments of this application, the piezoelectric-driven optical image stabilization sensor can be used to achieve super-resolution shooting, which will be further described below.

[0186] In one embodiment, a camera module suitable for super-resolution shooting is provided. The camera module includes a lens assembly, an optical image stabilization sensor assembly, a super-resolution shooting control unit (also referred to as a first control unit), and an image synthesis unit (also referred to as a data processing unit). The super-resolution shooting control unit controls the piezoelectric drive component of the optical image stabilization sensor assembly, driving the image sensor chip to move linearly along the x and y axes. Super-resolution shooting is achieved through the linear movement of the image sensor chip along the x and y axes. The image synthesis unit combines multiple images captured when the image sensor chip is moved to multiple different positions into a super-resolution image.

[0187] In traditional image capture, a single pixel contains only one color channel, and other color channel information is filled in using interpolation methods. For example... Figure 24 This illustrates the arrangement of monochrome photosensitive pixel units of different colors within the image sensor chip. Figure 24In the example, a complete color macropixel consists of a 2x2 grid containing four monochrome photosensitive pixel units. In actual shooting, one color information is captured, while the other three color channel information are filled by the color channel information around the pixel. However, this method produces moiré patterns, resulting in blurring or mosaic when the image is magnified. The color of a color channel to be filled is filled based on the information of the four color channels around it, i.e., interpolation. Currently, in camera modules, a single pixel generally has four color channels, and the color arrangement is generally RGGB (red, green, green, blue). In this embodiment, the photosensitive chip is periodically moved by the x-axis piezoelectric drive component (e.g., the first piezoelectric drive component mentioned above) and the y-axis piezoelectric drive component (e.g., the second piezoelectric drive component mentioned above), so that each pixel of the image can obtain the measured values ​​of the red, green, and blue color channels. Specifically, assuming that the pixel array arrangement of the photosensitive chip is RGGB (red, green, green, blue), as... Figure 24 As shown. Furthermore, Figure 25 The diagram illustrates the movement direction of the image sensor during super-resolution imaging and four different positional states. Thick arrows indicate transitions from one state to another, while thin arrows indicate the movement direction of the image sensor. In this embodiment, the image sensor's sample image acquisition position can be shifted from one positional state to another by moving it; this process is called super-resolution offset. This offset is typically performed at the pixel or sub-pixel scale. Specifically, refer to... Figure 25 When performing super-resolution imaging, a base image is first captured. The base image corresponds to... Figure 25 In state a, the photosensitive chip is then translated by one pixel in the positive x-axis direction using the x-axis piezoelectric drive component. At this point, the photosensitive area of ​​the photosensitive chip will be translated by one pixel in the positive x-axis direction, entering the second state. Figure 25 In state b, the four photosensitive pixels from state one move to the right. The two rightmost pixels enter the dashed box in state two, while the two leftmost pixels occupy the positions previously occupied by the two rightmost pixels. The two leftmost pixels, located outside the solid box in state one, are moved into the two leftmost pixels in state two. After capturing the image in state two, the piezoelectric drive assembly moves the image sensor one pixel away in the negative y-axis direction. This shifts the entire photosensitive area of ​​the image sensor one pixel away in the negative y-axis direction, entering state three. Figure 25In state c, after completing the third state of shooting, the photosensitive chip is shifted by one pixel in the negative x-axis direction via the x-axis piezoelectric drive component. At this time, the photosensitive area of ​​the photosensitive chip will shift by one pixel in the negative x-axis direction, entering the fourth state, i.e. Figure 25 In state d, after completing the fourth state of shooting, the photosensitive chip is translated by one pixel in the positive y-axis direction via the y-axis piezoelectric drive component. At this time, the photosensitive area of ​​the photosensitive chip will be translated by one pixel in the positive y-axis direction, entering the first state, i.e. Figure 25 In this context, state 'a' represents the state of returning to the base image. Since only the photosensitive chip moves during the transitions between shooting states in this embodiment, the four shooting states can also be understood as chip position states. For two adjacent chip position states, the amount of movement of the photosensitive chip can be the distance of one pixel in the image to be synthesized (note that here, a pixel refers to the pixel of the image to be synthesized, i.e., the pixel of the super-resolution image, not the original macropixel of the photosensitive chip; in this context, a macropixel is a basic unit containing all monochrome photosensitive pixel units, for example...). Figure 24 The four monochrome photosensitive pixel units in the image can form a macropixel, which will be further introduced below.

[0188] Examining the four shooting states above, it can be seen that for each pixel unit within the solid-line frame, within a complete shooting cycle, the photosensitive pixel units of the three colors (i.e., the three primary colors) of the image sensor are moved to that pixel unit at least once (i.e., the pixel unit corresponding to the solid-line frame). For example, assume the pixel unit in the upper left corner is the first pixel unit. In the first state, the green photosensitive pixel unit (assuming the square mark represents green) is moved to the first pixel unit, at which time the green photosensitive pixel unit receives the light signal and outputs the green channel value of the image; in the second state, the red photosensitive pixel unit (assuming the circular mark represents red) is moved to the first pixel unit, at which time the red photosensitive pixel unit receives the light signal and outputs the red channel value of the image; in the third state, another green photosensitive pixel unit is moved to the first pixel unit, at which time the second green photosensitive pixel unit receives the light signal and outputs the green channel value of the image; in the fourth state, the blue photosensitive pixel unit (assuming the triangle mark represents blue) is moved to the first pixel unit, at which time the blue photosensitive pixel unit receives the light signal and outputs the blue channel value of the image. In this way, by merging the images from four shots within one shooting cycle, the channel values ​​of all three primary colors for the first pixel unit can be obtained, thus yielding the complete image data of the color super-resolution image for that pixel unit without interpolation. Similarly, for the second pixel unit in the upper right corner, the third pixel unit in the lower right corner, and the fourth pixel unit in the lower left corner, the complete channel values ​​of the three primary colors can be obtained within four shots in one shooting cycle, thereby deriving the complete image data of the color super-resolution image corresponding to that pixel unit without interpolation.

[0189] In the above embodiments, the pixel arrangement of the photosensitive chip is RGGB, where the four monochrome photosensitive pixel units (RGGB) can constitute a macropixel containing all color image information. Alternatively, the four monochrome photosensitive pixel units (RGGB) can be considered as four sub-pixels of the macropixel. The photosensitive area of ​​the photosensitive chip is an array composed of a large number of macropixels.

[0190] Note Figure 24The four pixel units represented by the solid-line box in the diagram represent the four pixel units of the color super-resolution image to be synthesized (hereinafter sometimes simply referred to as the image to be synthesized). Within one cycle of super-resolution shooting, the position of the pixel units in the image to be synthesized remains constant. If the image sensor moves fast enough and the duration of one cycle of super-resolution shooting is short enough, the subject and its shooting conditions (e.g., lighting conditions) can be considered constant. Furthermore, assuming the position and orientation of the camera module's optical lens also remain constant, the position of the light rays from the subject and passing through the optical lens projected onto the image plane also remains constant. For any position on the image plane (which can be represented by the pixel unit position of the image to be synthesized), the image sensor is translated so that the monochromatic photosensitive pixel units of the three colors appear at least once within one cycle, thus obtaining the complete measured color values ​​of the three primary colors. Filling all pixel units of the image to be synthesized with the measured color values ​​of the three primary colors from one shooting cycle yields a color synthesized image based on the measured values. It is important to note that each pixel unit (or each pixel) in the image to be synthesized corresponds to a coordinate position on the image plane (also called the image surface) in the actual shooting. This coordinate position is the pixel position of the super-resolution image mapped onto the image plane. During the movement of the image sensor in super-resolution shooting, the pixel position of each pixel mapped onto the image plane remains unchanged. In other words, the super-resolution offset of the image sensor only changes the position of the image sensor and the monochromatic photosensitive pixel units used to collect light signals. Through super-resolution offset, one monochromatic photosensitive pixel unit can be moved from its original position to the position of another monochromatic photosensitive pixel unit. These two monochromatic photosensitive pixel units can be monochromatic photosensitive pixel units of different color channels in the same macropixel. The movement path is designed to satisfy the following: for any pixel position mapped onto the image plane by the super-resolution image, the monochromatic photosensitive pixel unit of each color is moved to that pixel position at least once. In this way, monochrome photosensitive pixel units of all colors can be moved to each pixel position of the super-resolution image, thereby obtaining the measured data values ​​of all colors at all pixel positions. Compared with the difference algorithm based on the surrounding data values, the imaging quality of the synthesized super-resolution image can be improved.

[0191] It should be noted that Figure 24 The shown routes are not unique. For example Figure 26 The diagram illustrates the movement path of the image sensor during super-resolution imaging in another embodiment, as well as the image sample coverage area obtained from the four positional states of the image sensor. Figure 27 It shows Figure 26 A top-view diagram showing the movement of the driving device, carrier, and the onboard photosensitive chip along its movement path. Combined with... Figure 26 and Figure 27 In this embodiment, a shooting cycle includes: capturing an original image, wherein the image sample coverage area obtained when the photosensitive chip is in a first position state is as follows: Figure 26 As shown in part a of the diagram. Based on the original image capture (i.e., the initial sample), step ① is first executed, where the photosensitive chip moves approximately one pixel in the positive y-axis direction. At this point, the photosensitive chip is in the second position state, and the area covered by the obtained image sample is as shown in the diagram. Figure 26 As shown in part b; then, step ② is executed, and the photosensitive chip moves approximately one pixel along the positive x-axis. At this time, the photosensitive chip is in the third position state, and the image sample coverage area obtained is as shown. Figure 26 As shown in section c; then, step ③ is executed, and the photosensitive chip moves approximately one pixel along the negative y-axis. At this point, the photosensitive chip is in the fourth position, and the image sample coverage area obtained is as shown. Figure 26 As shown in part d in the diagram. After completing step ③, one super-resolution image capture is complete. Finally, the image sensor returns to the original image capture position, meaning it has moved approximately one pixel in the negative x-axis direction to begin the next super-resolution image capture. The movement path of this application can also have many variations. For example, in another embodiment of the invention, the movement path of the image sensor can be: first, a negative y-axis movement; then, a positive x-axis movement; then, a positive y-axis movement; and finally, a positive x-axis movement. In yet another embodiment, it can be: first, a negative x-axis movement; then, a positive y-axis movement; and finally, a positive x-axis movement. Many other similar square cyclic movement paths can be listed, which will not be elaborated upon here.

[0192] It's important to note that the pixel arrangement of the image sensor is not limited to RGGB. For example, in some designs, each macropixel can consist of three monochrome photosensitive pixel units, which can be arranged in a triangle. In this case, the movement path of a single shooting cycle configured by the super-resolution imaging control unit can be adjusted accordingly. For instance, the movement path of a single shooting cycle can be defined as a path consistent with the pixel arrangement, i.e., a triangular movement path (such as...). Figure 25 The illustrated movement path can be referred to as a square movement path or a "U"-shaped movement path. Specifically, in one embodiment of this application, the pixel arrangement of the photosensitive chip in the camera module is triangular. The super-resolution imaging control unit controls the driving voltage of the x-axis piezoelectric drive component and the y-axis piezoelectric drive component, so that the movement path of the photosensitive chip is also a triangular movement path, where the movement distance of each movement is the distance of a single pixel. Each movement can be driven by only the x-axis or y-axis piezoelectric drive component, or it can be driven by both the x-axis and y-axis piezoelectric drive components (for example, when the movement path has both x-components and y-components, i.e., when the movement path has non-zero angles with both the x-axis and y-axis).

[0193] In one embodiment of this application, during a super-resolution image capture cycle, the super-resolution capture control unit is configured to control the amplitude and frequency of the driving voltage of the piezoelectric drive component of the photosensitive element. By periodically changing the driving voltage at a certain frequency, the photosensitive element can be made to vibrate periodically along the x and y axes under the drive of the piezoelectric drive component, thereby obtaining sub-images in all states of a capture cycle required for the super-resolution image. Here, a sub-image refers to the photosensitive chip at each position state (e.g., ...) during a capture cycle. Figure 25 Images in the first, second, third, and fourth states (in the image processing unit). From the four sub-images captured in a single shooting cycle, the overlapping areas of these four shots can be extracted to synthesize a super-resolution image. In this application, each captured sub-image can also be referred to as an image sample. Each positional state in a shooting cycle can be referred to as an image sample acquisition position of the photosensitive chip.

[0194] In this application, the movement path of a single shooting cycle configured by the super-resolution imaging control unit is not limited to a square path; the movement path can be flexibly designed according to the pixel arrangement of the image sensor. This movement path satisfies the following condition: within one shooting cycle, for each position in the image (the position corresponding to each pixel unit in the image to be synthesized), each color's monochromatic photosensitive pixel unit appears at least once at that position. Thus, by driving the image sensor to move according to this movement path, complete color information can be obtained to synthesize a super-resolution image.

[0195] In some embodiments of this application, a piezoelectric driving component is introduced into the photosensitive assembly to radially drive the photosensitive chip (radial refers to the direction parallel to the photosensitive surface of the photosensitive chip, and the axis is the normal direction of the photosensitive surface), enabling the photosensitive chip to translate a single pixel distance along the image plane with high precision. Specifically, the super-resolution imaging control unit only needs to control the amplitude of the driving voltage to control the actual amplitude of the piezoelectric element, thereby adjusting the amount of movement of the carrier of the piezoelectric driving component in one vibration cycle. Therefore, by controlling the amplitude of the driving voltage, the movement of the carrier and the photosensitive chip it carries can be controlled within one pixel distance, ensuring that the positions of the photosensitive pixel units precisely overlap during multiple shots along the same super-resolution image capture path, thus guaranteeing the imaging quality of the synthesized super-resolution image.

[0196] On the other hand, in some embodiments of this application, the super-resolution imaging control unit only needs to control the frequency of the driving voltage to control the moving speed of a single super-resolution image capture. Increasing the frequency of the driving voltage can increase the moving speed of the photosensitive chip, thereby completing one shooting cycle of super-resolution imaging in a shorter time. Shortening the super-resolution imaging time will help reduce the error of the synthesized super-resolution image. Ideally, for the multiple shots required for super-resolution imaging, the target object should be in the same position each time, and its lighting and other shooting conditions should be the same. However, this is not the case in reality. That is to say, for the multiple shots required for super-resolution imaging, the actual target object and shooting conditions may change each time. Under this premise, if the moving speed of the photosensitive component is slow, the time interval between multiple shots will be too long, and the position of the target object and the shooting conditions may shift or change, resulting in a large error in the synthesized super-resolution image. Compared with the traditional OIS driving method, the piezoelectric driving component of this embodiment has a large driving force and a fast response speed, so it can help shorten the super-resolution imaging time and thus reduce the error of the synthesized super-resolution image. In this embodiment, a single super-resolution image capture is preferably completed within 0.1 seconds. Of course, in some other embodiments, a single super-resolution image capture can also be completed within 1 second.

[0197] In the aforementioned embodiments, high-precision translation of the photosensitive chip along the x and y axes is achieved based on a piezoelectric driving component. This allows for single-pixel-level translation of the photosensitive chip on its image plane along a preset path during super-resolution imaging, while maintaining the position and orientation of the imaging lens group of the optical lens. This enables the acquisition of image data from all pixel units and all color channels of the super-resolution image through multiple shots, which are then synthesized into a super-resolution image. All image data in this super-resolution image is actual acquired imaging data, resulting in superior image quality compared to traditional interpolation algorithms. Compared to super-resolution imaging schemes that rely on driving optical lens translation or tilt adjustment, the direct translation of the photosensitive chip in this application provides better consistency across multiple shots within the same shooting cycle. Specifically, if the position or tilt of the optical lens needs to be adjusted to change the position of the image within the same shooting cycle, the repeatability of the light information projected onto each point on the image plane will decrease. Therefore, the optical imaging system cannot achieve strict consistency across multiple shots (e.g., four shots in an RGGB configuration). In other words, the light information projected onto each point on the image plane after passing through the optical imaging system changes with each shot. However, in this application, the position and orientation of the imaging lens group of the optical lens can remain constant within the same shooting cycle. Therefore, the corresponding optical imaging system is strictly consistent across all shots within the same cycle, and the light information projected onto each point on the image plane is exactly the same. Thus, the direct translation of the image sensor in this application allows for better consistency across shots within the same shooting cycle of a super-resolution image, thereby improving image quality.

[0198] Furthermore, in the above embodiments, the piezoelectric driving component can be used to achieve both image stabilization and super-resolution image capture. However, it should be noted that in some other embodiments of this application, the piezoelectric driving component can also be used solely for super-resolution image capture. In such embodiments, the piezoelectric element of the piezoelectric driving component can be configured such that a single vibration of the piezoelectric element causes the photosensitive chip to move exactly one pixel distance. Here, pixel distance refers to the distance of one pixel in the image to be synthesized. The pixel of the image to be synthesized is the pixel of the super-resolution image.

[0199] In one embodiment of this application, the first control unit controls the movement distance of the photosensitive chip via a driving voltage. The frequency of this driving voltage ranges from 500 to 1000 kHz, and the amplitude ranges from -5V to +5V. The control precision of the first control unit over the piezoelectric driving component can be from 0.1 μm to 1 pm. With this level of control precision, the offset distance of the photosensitive chip can be the size of a single pixel, or even a sub-pixel level, such as half the size of a pixel.

[0200] Furthermore, in one embodiment of this application, the piezoelectric element of the piezoelectric drive assembly can be composed of multiple stacked piezoelectric material layers, which can be divided into a first type of piezoelectric material layer and a second type of piezoelectric material layer. The first type of piezoelectric material layer and the second type of piezoelectric material layer can be separated by an electrode sheet, so that each can be driven by a driving voltage individually. The surfaces of both the first and second type of piezoelectric material layers can be perpendicular to the drive rod of the piezoelectric driving assembly (i.e., the thickness directions of the first and second type of piezoelectric material layers are aligned with the axial direction of the drive rod). The first type of piezoelectric material layer can be configured to drive the moving part to move a first distance during a single activation, the first distance being a set super-resolution offset distance (e.g., one pixel distance); the second type of piezoelectric material layer is configured to drive the moving part to move a second distance during a single activation, the second distance being greater than the first distance. Specifically, the first type of piezoelectric material layer can be dedicated to achieving super-resolution image capture. For example, when a mobile phone (or other smart device) needs to perform super-resolution capture, only the corresponding driving voltage can be applied to the first type of piezoelectric material layer (the driving voltage can be omitted from the second type of piezoelectric material layer), so that the photosensitive chip can accurately measure the single-pixel distance on the xoy plane (i.e., the image plane). The second type of piezoelectric material layer can be used to achieve image stabilization. When the phone shakes, a corresponding driving voltage can be applied only to the second type of piezoelectric material layer. The vibration of the second type of piezoelectric material layer can provide a larger driving force, thereby increasing the speed of the image sensor chip movement, resulting in a faster image stabilization response and a larger image stabilization travel. Furthermore, when used for image stabilization, a driving voltage can be applied to both the first and second type of piezoelectric material layers simultaneously, thereby providing a greater driving force to further improve the image stabilization response speed and image stabilization travel. In this embodiment, the piezoelectric element is designed to include both the first and second type of piezoelectric material layers, and the amplitude of the second type of piezoelectric material layer can be greater than that of the first type of piezoelectric material layer. The first type of piezoelectric material layer with a smaller amplitude can be dedicated to the movement of the image sensor chip at the single pixel or even sub-pixel level, so as to provide more precise chip positioning for super-resolution image shooting, thereby improving the imaging quality of super-resolution images.

[0201] Furthermore, in one embodiment of this application, the camera module may further include a second control unit, which is used to control the driving voltage supplied to the piezoelectric driving assembly, and is configured to control the photosensitive chip to perform image stabilization movement. For example, a position sensor can be used to detect camera module jitter and calculate the direction and amount of movement of the photosensitive chip required to compensate for the jitter. Then, based on the calculated direction and amount of movement of the photosensitive chip, a corresponding driving voltage is output to the piezoelectric driving assembly.

[0202] Furthermore, in one embodiment of this application, during super-resolution imaging, by applying a predetermined pixel-level movement driving voltage to the piezoelectric driving component in the x-axis direction, the photosensitive chip can be controlled to move at the pixel level in the x-axis direction, thereby achieving the super-resolution shift described above in the x-axis direction. Similarly, by applying a predetermined pixel-level movement driving voltage to the piezoelectric driving component in the y-axis direction, the photosensitive chip can be controlled to move at the pixel level in the y-axis direction, thereby achieving the super-resolution shift described above in the y-axis direction. In one example, assuming the single-activation movement distance of a commercially available piezoelectric driving device is L, and the single-pixel size of the photosensitive chip is U (here, the single-pixel size refers to the size of a monochrome photosensitive pixel unit, not the size of a macropixel), and the driving voltage of the piezoelectric driving device is V (e.g., its rated driving voltage is V), then the driving voltage required for super-resolution shift can be configured as (U / L)V, so that the single-activation distance of the piezoelectric driving device during super-resolution imaging is exactly one pixel distance.

[0203] Furthermore, in one embodiment of this application, when the distance the photosensitive chip moves due to a single vibration of the piezoelectric element of the purchased piezoelectric drive assembly in its standard operating state is greater than a single pixel distance, the movement of the photosensitive chip can be controlled within a single pixel distance by proportionally controlling the amplitude of the drive voltage.

[0204] Furthermore, in another embodiment of this application, when the distance the photosensitive chip moves due to a single vibration of the piezoelectric element of the purchased piezoelectric drive assembly in its standard operating state is greater than a single pixel distance, the movement of the photosensitive chip can be controlled within a single pixel distance by shortening the single activation time of the piezoelectric drive assembly.

[0205] Furthermore, in one embodiment of this application, the resolution of the super-resolution image can be higher than the resolution of the photosensitive chip. In this embodiment, during super-resolution imaging, the amount of movement of the super-resolution offset is less than the spacing between adjacent photosensitive pixel units in the photosensitive chip. That is, after the super-resolution offset, the photosensitive pixel unit can be moved to a position between two pixels in the original image sample (hereinafter referred to as the middle position) to collect the actual light signal of the "image" at that middle position. Compared with the data value of the middle position virtually calculated by interpolation, this scheme of actually collecting the light signal through super-resolution offset in this embodiment can effectively improve the imaging quality of the super-resolution image. It should be noted that in this embodiment, the middle position is not limited to the exact center position between two pixels (i.e., the position offset by 1 / 2 pixel along the x-axis or y-axis of the photosensitive chip). For example, the middle position can also be the position offset by 1 / 3 or 2 / 3 pixel along the x-axis or y-axis. That is, a single super-resolution offset can be the position offset by 1 / 3 or 2 / 3 pixel along the x-axis or y-axis of the photosensitive chip. In this embodiment, for a photosensitive chip used for color image imaging, the distance of a pixel in the photosensitive chip can be understood as the distance of a macropixel (i.e., the spacing between adjacent macropixels, which can be calculated with the center point of the macropixel as the reference). For a photosensitive chip used for black and white image imaging, the distance of a pixel in the photosensitive chip can be understood as the distance of a photosensitive pixel unit (i.e., the spacing between adjacent photosensitive pixel units, which can be calculated with the center point of the photosensitive pixel unit as the reference).

[0206] The following describes a scheme based on a ball bearing suspension system and an electromagnetic drive component, using some examples.

[0207] In the foregoing embodiments, high-precision translation of the photosensitive chip along the x and y axes was achieved using a piezoelectric drive assembly. However, it should be noted that this application is not limited to this. In other embodiments, a ball bearing suspension system and an electromagnetic drive assembly can be used to achieve high-precision translation of the photosensitive chip along the x and y axes. Specifically, the ball bearing suspension system can limit the carrier of the photosensitive chip along the z-axis using ball bearings, thereby ensuring that the photosensitive chip translates precisely within the xoy plane.

[0208] Figure 28 An exploded three-dimensional view of a photosensitive component according to one embodiment of this application is shown. (Reference) Figure 28In one embodiment of this application, the photosensitive component includes a support base 210, a first chip carrier 220, a photosensitive chip 230, a first electromagnetic drive component 240, a second electromagnetic drive component 250, a second chip carrier 260, a module circuit board 270, and a housing base 280. The housing base 280 includes a base plate 281 and sidewalls 282. The support base 210 is fixed to the housing base 280, forming the upper cover of the photosensitive component. The support base 210 and the housing base 280 can encapsulate other parts of the photosensitive component internally, thereby providing protection. Simultaneously, the support base 210 can also support the sleeve-type optical actuator. In the entire camera module, the housing 140 (referring to the square housing of the sleeve-type optical actuator) can be fixed integrally with the support base 210 and the housing base 280. Below the support base 210, the first chip carrier 220, the photosensitive chip 230, the second chip carrier 260, and the module circuit board 270 are arranged sequentially. In this embodiment, the second chip carrier 260 is flat, and the photosensitive chip 230 is mounted on the upper surface of the second chip carrier 260. The combination of the photosensitive chip 230 and the second chip carrier 260 is mounted on the upper surface of the module circuit board 270. The module circuit board 270 may include a rigid board 271, an S-shaped flexible board 272, and a connecting part 273. The rigid board 271 may be a PCB board with a rectangular shape. The four sides of the rigid board 271 are respectively connected to the S-shaped flexible board 272 (each side may connect multiple S-shaped flexible boards 272), and the other end of the S-shaped flexible board 272 is connected to the connecting part 273. The connecting part 273 rests against the side wall 282 of the housing base 280, and the connecting part 273 can be used to realize the electrical connection between the module circuit board 270 and the outside world. In this embodiment, the support base 210, the first chip carrier 220, and the second chip carrier 260 are movably connected by ball bearings, allowing the second chip carrier 260 to move relative to the first chip carrier 220 along the x-axis under the drive of the second electromagnetic drive assembly 250, and allowing the combination of the first chip carrier 220 and the second chip carrier 260 to move relative to the support base 210 along the y-axis under the drive of the first electromagnetic drive assembly 240. Both the x-axis and y-axis are coordinate axes parallel to the surface of the photosensitive chip 230 and are perpendicular to each other. In this document, the z-axis represents the coordinate axis in the normal direction of the surface of the photosensitive chip 230. Based on the analysis above, for telescopic camera modules, since their lens assembly includes telescopic optical actuators for telescopic functions, the telescopic assembly and its drive structure (such as multiple electric motor assemblies) require a certain volume (the dimensions in the x, y, and z axes may be larger than those of ordinary optical actuators); on the other hand, telescopic camera modules often serve telephoto shooting, and telephoto shooting is particularly sensitive to shake, so telescopic camera modules have a need to implement image stabilization functions.However, directly adding the drive module and suspension system for image stabilization to the lens assembly would inevitably increase the size of the optical actuator, hindering the miniaturization of the camera module. This embodiment cleverly uses a support base as the foundation to allow the image sensor to move relative to the support base along the x and y axes, thereby compensating for camera module shake during shooting. Since the image sensor's mass is smaller than that of the lens assembly, the driving force required for the chip-based image stabilization drive module can be reduced, thus helping to decrease the size of the drive module itself (e.g., magnets and coils). Furthermore, the piezoelectric drive component of the sleeve-type optical actuator occupies a certain lateral space around the lens (i.e., space along the x and y axes), and the components used for chip-based image stabilization can be arranged precisely within this additional lateral space added by the sleeve-type optical actuator, effectively improving the space utilization of the sleeve-type camera module. Furthermore, in this embodiment, the support base 210 is located at the top of the entire photosensitive assembly (that is, the support base 210 can act as the top cover of the photosensitive assembly). It not only guides the movement of the photosensitive chip in the y-axis direction but also encapsulates the entire photosensitive assembly, encapsulating other components within the housing base 280, thus ensuring the overall structure remains stable during operation. Moreover, the integrated encapsulation formed by the support base 210 and the housing base 280 supports the telescopic lens assembly (including the sleeve-type optical actuator and the optical lens installed therein). This better ensures the stability of the bottom structure of the telescopic lens during its telescopic movement, thereby improving the accuracy of the telescopic lens's telescopic movement.

[0209] Furthermore, Figure 19 A schematic diagram of the internal structure of a photosensitive component according to one embodiment of this application is shown. To clearly illustrate the internal structure, Figure 19 Support base 210 has been omitted. (Refer to reference.) Figure 28 and reference Figure 19 In one embodiment of this application, the first chip carrier 220 has a rectangular frame shape with a central perforated window (i.e., a light window), where the assembled photosensitive chip 230 can be positioned after assembly. Further, Figure 30 A perspective view of a first chip carrier according to one embodiment of this application is shown. (Referring to the reference...) Figure 30The first chip carrier 220 has two pairs of parallel sides, one pair of which (referred to as the first side 221) has a convex cover 221a, which is formed by the upward bulge of the first chip carrier 220 side (first side 221). An x-axis magnet 251 is mounted on the lower surface of the convex cover 221a. The x-axis magnet 251 may be sheet-like, appearing as a strip when viewed from above, and its length direction is parallel to the first side 221. The convex cover 221a may be made of a magnetic shielding material to prevent or suppress electromagnetic interference between the first electromagnetic drive assembly 240 (which consists of the y-axis magnet 241 and the y-axis coil 242) and the second electromagnetic drive assembly 250 (which consists of the x-axis magnet 251 and the x-axis coil 252). The other pair of parallel sides of the first chip carrier 220 (referred to as the second side 222) has a clearance groove 222a, which is adapted to avoid the y-axis magnet 241. The y-axis magnet 241 can be sheet-like, appearing as a long strip when viewed from above, with its length parallel to the second side 222. In this embodiment, the x-axis coil 252 and the y-axis coil 242 can be fixed to the second chip carrier 260 or to the module circuit board 270, and are electrically connected to the module circuit board 270. After assembly, the x-axis coil 252 is positioned directly below the x-axis magnet 251, and the y-axis coil 242 is positioned directly below the y-axis magnet 241. In this embodiment, the photosensitive chip 230 can be fabricated using a wire bonding process.

[0210] The photosensitive chip 230 is electrically connected to the module circuit board 270 using a bonding process (of course, the photosensitive chip in this application can also be electrically connected to the module circuit board using other processes). Since the module circuit board 270 and the photosensitive chip 230 are fixed together, the x-axis coil 252, y-axis coil 242, and the connecting wires between the photosensitive chip 230 and the module circuit board 270 will not be pulled during anti-shake movement, ensuring the reliability of the module. Ball bearing holes 223 can be provided at the four corners of the first chip carrier 220, and each ball bearing hole 223 can accommodate one ball bearing 224. In this embodiment, the y-axis magnet 241 can be fixed to the lower surface of the support base 210.

[0211] (Or the inner side), and after assembly, the y-axis magnet 241 is positioned at the clearance groove 222a of the first chip carrier 220. The lower surface of the support 210 also has a first ball guide groove 211 (refer to reference). Figure 31The position of the first ball guide groove 211 can be adapted to the position of the ball hole of the first chip carrier 220. Viewed from below, the first ball guide groove can be strip-shaped, and its guiding direction is the y-axis direction. Second ball guide grooves 261 can be provided at the four corners of the second chip carrier 260, and the position of the second ball guide groove 261 can be adapted to the position of the ball hole 223 of the first chip carrier 220. Viewed from above, the second ball guide groove 261 can be strip-shaped, and its guiding direction is the x-axis direction.

[0212] Furthermore, still referencing Figure 30 In one embodiment of this application, the convex cover 221a of the first chip carrier 220 may have a magnetically conductive hole 221b. The convex cover 221a may include raised connecting portions 221d on both sides and a plate-shaped protrusion 221c in the center. The magnetically conductive hole 221b is disposed on the plate-shaped protrusion 221c of the convex cover 221a and penetrates the upper and lower surfaces of the plate-shaped protrusion 221c. In this way, the magnetic field of the magnet installed under the convex cover 221a can be discharged through the magnetically conductive hole 221b, thereby ensuring sufficient driving force in the corresponding direction (e.g., the x-axis direction). At the same time, the convex cover 221a can still suppress electromagnetic interference between the first electromagnetic drive assembly 240 and the second electromagnetic drive assembly 250.

[0213] Furthermore, in one embodiment of this application, the second chip carrier is in the form of a flat plate, which can also be referred to as a pad. The pad is attached to the module circuit board, which on the one hand increases the structural strength of the module circuit board, and on the other hand, the surface flatness of the pad can be higher than that of the module circuit board, thereby helping to provide a stable carrier for the movement of the photosensitive chip (for example, it can prevent the support surface of the photosensitive chip from bending during the movement).

[0214] Furthermore, in one embodiment of this application, the height of the housing base is less than or equal to 5mm, the module circuit board is housed inside the housing base, and its periphery is in contact with the housing base through an S-shaped flexible board and a connector.

[0215] Furthermore, in one embodiment of this application, the x-axis magnet and the y-axis magnet are disposed on the same plane, and the x-axis magnet can be wrapped under the convex cover of the first chip carrier, thus suppressing electromagnetic interference between the x-axis magnet and the y-axis magnet. Simultaneously, disposing the x-axis magnet and the y-axis magnet on the same plane can also effectively reduce the space occupied by the photosensitive component in the height direction.

[0216] Furthermore, in one embodiment of this application, the movement of the photosensitive chip in the x-axis and y-axis directions can share the same ball bearing. This design simplifies the structure and effectively reduces the height of the photosensitive component and the dimensions in other directions. Figure 31 A cross-sectional schematic diagram of the ball connection between the support base, the first chip carrier, and the second chip carrier in one embodiment of this application is shown. Figure 32 The ball bearing holes of the first chip carrier and the second ball bearing guide groove of the second chip carrier are shown. (Reference) Figure 31 and Figure 32 In this embodiment, the top and bottom of the ball bearing 224 can respectively rest against the lower surface of the support base 210 and the upper surface of the second chip carrier 260. The first chip carrier 220 is located between the support base 210 and the second chip carrier 260, and the ball bearing 224 passes through the ball bearing hole 223 of the first chip carrier 220. The inner surface of the ball bearing hole 223 can rest against a portion of the outer surface of the ball bearing 224, so that after assembly, there are gaps between the support base 210 and the first chip carrier 220, and between the first chip carrier 220 and the second chip carrier 260. That is, in the z-axis direction (i.e., the normal direction of the photosensitive chip surface), the support base 210 and the first chip carrier 220, and the first chip carrier 220 and the second chip carrier 260 are both supported by the ball bearing 224. Note that... Figure 31 Only one location of the ball bearing 224 and its surrounding partial structure is shown. In this embodiment, from a top-view perspective, the ball bearing 224 can be arranged in the four corner regions of the first chip carrier 220. In other embodiments of this application, the ball bearing can also be arranged in other locations from a top-view perspective, as long as it can provide support for the support base and the first chip carrier in the z-axis direction, and support for the first chip carrier and the second chip carrier in the z-axis direction. The guiding direction of the second ball bearing guide groove 261 is the x-axis direction. Figure 32 The x-axis direction is perpendicular to the paper surface. Since the ball bearings 224 provide rolling support, the frictional force during the movement of the first chip carrier 220 relative to the second chip carrier 260 can be reduced, as can the frictional force during the movement of the first chip carrier 220 relative to the support base 210. In this embodiment, a single layer of ball bearings achieves the movable connection for movement in the x-axis and y-axis directions. Compared to a solution using two layers of ball bearings, this reduces the structural complexity of the photosensitive component and also lowers its height.

[0217] Furthermore, in some embodiments of this application, the camera module suitable for super-resolution shooting can also utilize the x-axis and y-axis movement capabilities of the image sensor to achieve optical image stabilization. For example, the lens assembly of the camera module may not include an optical actuator (i.e., a motor); or the optical actuator of the lens assembly may only be able to move the optical lens on the z-axis, meaning that the lens assembly may only have autofocus functionality and not optical image stabilization. In this case, the camera module can still achieve optical image stabilization through the x-axis and y-axis movement capabilities of the image sensor.

[0218] The following describes a solution involving dual motion stabilization with reference to some examples.

[0219] Furthermore, in some embodiments of this application, the camera module suitable for super-resolution shooting may include a lens assembly and a photosensitive assembly, both of which may have optical image stabilization (OIS). The photosensitive assembly may be the aforementioned OIS photosensitive assembly, which not only achieves OIS but also enables super-resolution shooting. More specifically, in this embodiment, since both the lens assembly and the photosensitive assembly have OIS, the dual movement capabilities of the photosensitive chip and the optical lens are utilized to improve the performance of OIS. For example, moving the photosensitive chip and the optical lens in opposite directions allows for a greater range of motion in the OIS, thereby compensating for greater camera shake. As another example, moving the photosensitive chip and the optical lens simultaneously in opposite directions improves the OIS response speed of the shooting device.

[0220] The following is combined Figure 33 and one The series of embodiments further describes the scheme in this application that utilizes the dual movement capabilities of the image sensor and the optical lens to improve the performance of optical image stabilization. In the third part (i.e., the scheme involving dual movement image stabilization), the driving device for driving the optical lens can be referred to as the first driving unit, which can be a conventional optical actuator for optical image stabilization. The driving device for driving the movement of the image sensor can be referred to as the second driving unit, which can be the driving device based on the piezoelectric driving component described in the previous embodiments, or the driving device based on the ball bearing suspension system and electromagnetic driving component described in the previous embodiments.

[0221] In one embodiment of this application, the camera module may include a lens (i.e., an optical lens), a photosensitive chip, a first driving unit, and a second driving unit. The photosensitive component may include a photosensitive chip. The first driving unit is configured to drive the lens to move in both the x and y directions, and the second driving unit is configured to drive the photosensitive chip to move in both the x and y directions. In this embodiment, the x and y directions are perpendicular to each other and parallel to the photosensitive surface of the photosensitive chip. The z-direction is parallel to the normal direction of the photosensitive surface. In this embodiment, optical image stabilization of the camera module is achieved by simultaneously driving the lens and the photosensitive chip to move in opposite directions through a control module (e.g., a second control unit). Specifically, the lens and image sensor are configured to move simultaneously but in opposite directions. For example, if the lens is driven to move in the positive x-axis direction, the image sensor is driven to move in the negative x-axis direction; if the lens is driven to move in the positive y-axis direction, the image sensor is driven to move in the negative y-axis direction; or the lens is driven to move along both the x and y axes, while the image sensor is driven to move along both the x and y axes in the opposite direction to the lens movement. In other words, when simultaneous movement along both the x and y axes is required, the displacement vectors of the lens and the image sensor in the xoy plane are in opposite directions. The camera module typically includes a position sensor used to detect shake in the camera module or terminal device (i.e., the electronic device equipped with the camera module, such as a mobile phone). When shake is detected, the position sensor sends a signal to the camera module, driving the lens and image sensor to make corresponding movements to compensate for the shake, thereby achieving optical image stabilization. In this embodiment, the lens and image sensor are configured to move simultaneously in opposite directions, enabling faster response and better image stabilization. Furthermore, the stabilization angle range of a typical camera module is limited by the suspension and drive systems, preventing a large compensation angle range. This embodiment achieves large-angle shake compensation by simultaneously driving the lens and image sensor in opposite directions. Additionally, by simultaneously driving the lens or image sensor in opposite directions, compared to a solution that only moves the lens, this embodiment allows for a larger relative movement distance between the lens and image sensor (for ease of description, this relative movement distance can be referred to as the stabilization distance), resulting in better compensation. In particular, due to the increased stabilization distance, this embodiment also provides better compensation for tilt shake of the camera module. Furthermore, the stabilization movement direction in this embodiment can be limited to the xoy plane, eliminating the need to tilt the optical axis of the lens or the image sensor, thus avoiding image blurring caused by stabilization movement.

[0222] Further, in one embodiment of this application, the camera module includes a first driving unit, a lens, a second driving unit, and a photosensitive component. The lens is mounted on the first driving unit. The first driving unit may have a cylindrical first motor carrier, which can serve as a movable part of the first driving unit, and the lens is mounted on the inner side of the first motor carrier. The first driving unit also has a stationary part, or a base part. In this embodiment, the base part can be implemented as a motor housing. The motor housing may include a base and a cover. The base has a light-transmitting hole. The movable part is movably connected to the base part. The driving element may be a coil magnet combination, which can be installed between the movable part and the base part. For example, it can be installed between the first motor carrier and the motor housing. In fact, the first driving unit in this embodiment can directly adopt the common structure of optical image stabilization motors in the prior art. Further, in this embodiment, the second driving unit can rest against and be fixed to the bottom surface of the first driving unit. Specifically, the top surface of the support base can rest against and be fixed to the bottom surface of the first driving unit. Driven by the carrier of the second driving unit, the photosensitive chip can be translated relative to the support in the x and y directions.

[0223] The following further describes a method for compensating for camera module tilt jitter through dual movement, based on the design concept of this application. When the second driving unit used to drive the movement of the photosensitive chip adopts the piezoelectric driving component-based driving device described in the previous embodiment, or the driving device based on a ball bearing suspension system and an electromagnetic driving component described in the previous embodiment, the following method for compensating for camera module tilt jitter through dual movement is applicable.

[0224] Figure 33 This diagram illustrates the relationship between the lens and image sensor movement distance and the module tilt angle under four different scenarios in this application. Position A in the diagram represents the combination of lens and image sensor movement distances used to compensate for camera module shake angle α. Figure 33As shown in the figure, the lens moves a distance of b, and the image sensor (sometimes referred to as the sensor in the following text) moves a distance of c. The movement distance of the lens or the sensor can be equivalent to the angle by which the image plane deviates from the optical axis during optical imaging. Specifically, when the lens moves a distance of b in the xoy plane, the resulting image plane offset angle αl has an arithmetic relationship with the image distance. The image distance is different at different shooting distances. For ease of calculation and expression, the image distance is represented by the image-side focal length. Specifically, the relationship between the resulting image plane offset angle αl and the image-side focal length f of the lens is: tan(α1) = b / f. When the image sensor moves a distance of c in the xoy plane, the relationship between the resulting image plane offset angle α2 and the image-side focal length f of the lens is: tan(α2) = c / f. In this embodiment, the movement directions of the lens and the image sensor are opposite. Therefore, the calculation method for the comprehensive compensation angle a of the camera module is: a = αl + α2 = arctan(b / f) + arctan(c / f). In one embodiment, the movement distances of the lens and the image sensor can be set to be the same, i.e., b = c. In another embodiment, the movement distances of the lens and the image sensor can be set to be unequal; for example, the movement distance of the lens can be greater than the movement distance of the image sensor, i.e., b > c.

[0225] Furthermore, in one embodiment of this application, the ratio of the lens movement distance to the image sensor movement distance can be optionally set to maintain a fixed ratio, such as b / c = 6:4, b / c = 7:3, or b / c = 5:5. Regardless of the compensation value of the camera module shake (e.g., the comprehensive compensation angle α), the movement distance of the lens and the image sensor remains at this preset ratio. This is beneficial for ensuring uniform compensation effect of the camera module within the compensable range, and also helps to reduce the design difficulty of the camera module's image stabilization system drive logic module.

[0226] Furthermore, in a configuration where the lens movement distance and the image sensor movement distance are based on a fixed ratio for image stabilization, the limited range of motion of the image sensor sometimes means that camera module shake may exceed the maximum movement distance of the image sensor. Therefore, in one embodiment of this application, an image stabilization threshold can be set. For example, for a shake angle 'a' that needs compensation, a threshold K can be set. When the actually calculated shake angle 'a' is less than or equal to the image stabilization threshold K, the lens movement distance 'b' and the image sensor movement distance 'c' are maintained at a fixed ratio. This fixed ratio can be preset, for example, b / c = 6:4, b / c = 7:3, or b / c = 5:5. When the actually calculated shake angle 'a' is greater than the image stabilization threshold K, the image sensor movement distance 'c' is taken as the maximum value of its movement distance, i.e., the maximum movement distance 'c' of the image sensor. max The distance the camera moves, b = tan(a / f) - C maxIn other words, when the camera module needs to compensate for shake angles above the stabilization threshold K, based on a preset fixed ratio, the lens moves to the maximum distance corresponding to the sensor's movement (i.e., the sensor's maximum travel distance c). max After reaching the position, the first drive unit can drive the lens to continue moving until the lens has moved a distance b = tan(a / f) - C. max At the same time, the photosensitive chip first moves synchronously in the opposite direction to the maximum distance c that the photosensitive chip has moved. max Then remain still.

[0227] Furthermore, in another embodiment of this application, the maximum travel distance b of the lens movement within the xoy plane is... max The corresponding stabilization angle (referring to the angle of camera module tilt) can be less than the maximum travel distance c of the image sensor. max The corresponding stabilization angle. With this design, the camera module's stabilization system can have a faster response speed. High-end lenses often have a large number of lens elements; for example, the rear main camera lens in current smartphones can have up to eight elements. To further improve image quality, some lenses also use glass lenses, all of which result in a heavier lens. When the driving force does not increase significantly, the speed at which the driving device moves the lens will decrease. However, the image sensor or image sensor assembly is relatively lightweight and can reach the preset position with a smaller driving force. Therefore, in this embodiment, the relatively light weight and relatively fast movement speed of the image sensor can be better utilized to effectively improve the response speed of the camera module's stabilization system.

[0228] Furthermore, in another embodiment of this application, the fixed ratio between the lens movement distance and the image sensor movement distance can be set according to factors such as the lens weight, the driving force of the first drive unit, the weight of the image sensor (or image sensor assembly), and the driving force of the second drive unit. Setting an appropriate fixed ratio allows the time taken for the lens and the image sensor to reach their respective image stabilization target positions to be substantially the same, thereby achieving a better image stabilization effect. Specifically, the lens weight and the driving force of the first drive unit can substantially determine the lens movement speed, while the weight of the image sensor (or image sensor assembly) and the driving force of the second drive unit can substantially determine the image sensor movement speed. When the lens movement speed is less than the image sensor movement speed (e.g., in the case of a heavier lens), the image sensor movement distance can account for a larger proportion when setting the fixed ratio. This utilizes the characteristic of the image sensor's faster movement speed, allowing the image sensor to move a longer distance, thus ensuring that the time taken for the lens and the image sensor to reach their respective image stabilization target positions is substantially the same.

[0229] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. An optical image stabilization photosensitive assembly, characterized by comprising: include: Photosensitive chip; A chip carrier comprising a carrier portion and at least two cantilever portions, the carrier portion being adapted to directly or indirectly mount the photosensitive chip, the cantilever portions being formed by extending outwardly from the side of the carrier portion; and A piezoelectric drive assembly includes a fixed part, a piezoelectric element mounted on the fixed part, and a drive rod with one end fixed to the piezoelectric element, wherein the drive rod is movably connected to at least one of the at least two cantilever parts. The piezoelectric drive assembly includes a first piezoelectric drive assembly and a second piezoelectric drive assembly with driving directions perpendicular to each other. The drive rods of the first piezoelectric drive assembly and the second piezoelectric drive assembly are disposed on the same reference plane.

2. The photosensitive assembly of claim 1, wherein, The chip carrier includes a first chip carrier and a second chip carrier; the photosensitive chip is fixed to the carrier portion of the first chip carrier, and the fixing portion of the first piezoelectric drive assembly is fixed to the carrier portion of the second chip carrier.

3. The photosensitive component according to claim 2, characterized in that, The cantilever section includes a drive-side cantilever section and a driven-side cantilever section. The drive-side cantilever section has a piezoelectric drive rod adapter hole, and the driven-side cantilever section has a guide rod bracket.

4. The photosensitive component according to claim 3, characterized in that, The photosensitive component also includes an auxiliary guiding structure, which includes a guide rod that passes through the guide rod bracket and is movably connected to the guide rod bracket, allowing the guide rod bracket to move along the guide rod.

5. The photosensitive component according to claim 4, characterized in that, The carrier portion of the first chip carrier is a first carrier portion. The first chip carrier has a first driving side and a first driven side. The first driving side and the first driven side are two opposite sides of the first carrier portion. The driving side cantilever portion and the driven side cantilever portion of the first chip carrier extend outward from the first driving side and the first driven side, respectively. The carrier portion of the second chip carrier is a second carrier portion. The second chip carrier has a second driving side and a second driven side. The second driving side and the second driven side are two opposite sides of the second carrier portion. The driving side cantilever portion and the driven side cantilever portion of the second chip carrier extend outward from the second driving side and the second driven side, respectively. The first driving side, the second driving side, the first driven side and the second driven side surround the photosensitive chip.

6. The photosensitive component according to claim 4, characterized in that, The piezoelectric drive rod adapter hole is constructed from a bent support portion and a flat plate portion. The cross-section of the bent support portion is "V" shaped. The drive rod is placed in the bent support portion, and the flat plate portion covers the opening of the bent support portion.

7. The photosensitive component according to claim 4, characterized in that, The driven side cantilever includes at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole.

8. The photosensitive component according to claim 7, characterized in that, The guide rod includes a first guide rod, the driven side cantilever portion of the first chip carrier is slidably connected to the first guide rod, and the two ends of the first guide rod are fixed to the carrier portion of the second chip carrier; the guiding direction of the first guide rod is parallel to the guiding direction of the driving rod of the first piezoelectric drive assembly.

9. The photosensitive component according to claim 8, characterized in that, The photosensitive component also includes a housing base and a support base, which encapsulate the photosensitive chip, the chip carrier, and the piezoelectric drive component inside; the top of the support base is adapted to mount the lens assembly; and the center of the support base has a light-transmitting hole.

10. The photosensitive component according to claim 9, characterized in that, The guide rod further includes a second guide rod, the driven side cantilever portion of the second chip carrier is slidably connected to the second guide rod, and the two ends of the second guide rod are fixed to the housing base and / or the support base; the guiding direction of the second guide rod is parallel to the guiding direction of the drive rod of the second piezoelectric drive assembly.

11. The photosensitive component according to claim 10, characterized in that, The fixing part of the second piezoelectric drive assembly is fixed to the housing base and / or the support base.

12. The photosensitive component according to claim 5, characterized in that, The first carrier portion is frame-shaped, with the photosensitive chip attached to its four edges. The photosensitive area of ​​the photosensitive chip is located at the window in the center of the first carrier portion.

13. The photosensitive component according to claim 12, characterized in that, The second carrier portion is frame-shaped, and the photosensitive chip and the first carrier portion are disposed at the window in the center of the second carrier portion.

14. The photosensitive component according to claim 2, characterized in that, The reference plane is a plane parallel to the photosensitive surface of the photosensitive chip.

15. The photosensitive component according to claim 2, characterized in that, The photosensitive component also includes a module circuit board attached to the photosensitive chip. The module circuit board is a foldable circuit board, which includes multiple rigid boards and a flexible board connected between the multiple rigid boards.

16. The photosensitive component according to claim 15, characterized in that, The module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

17. The photosensitive component according to claim 15, characterized in that, The photosensitive component further includes a housing base and a support base, which encapsulate the photosensitive chip, the chip carrier, and the piezoelectric drive component inside; the top of the support base is adapted to mount a lens assembly; the support base serves as the upper cover of the photosensitive component, and the upper cover has lead holes; the free end of the module circuit board extends from the lead holes of the support base.

18. A method for assembling an optical image stabilization sensor, characterized in that, Includes the following steps: 1) The photosensitive chip is mounted on a first chip carrier, the first chip carrier including a first carrier portion and two first cantilever portions, the first cantilever portions being formed by extending outward from the side of the first carrier portion, and the two first cantilever portions being located on two opposite sides of the first carrier portion respectively; 2) A first piezoelectric drive assembly or a first guide rod is installed in the first cantilever portion. The first piezoelectric drive assembly includes a fixing portion, a piezoelectric element mounted on the fixing portion, and a first drive rod with one end fixed to the piezoelectric element. The first drive rod passes through the first cantilever portion and is movably connected to the first cantilever portion. The central axis of the first drive rod is parallel to the photosensitive surface of the photosensitive chip. At least one of the two first cantilever portions is fitted with the first piezoelectric drive assembly. 3) The first chip carrier is inserted into the second chip carrier; wherein the second chip carrier includes a second carrier portion and two second cantilever portions, the second cantilever portions are formed by extending outward from the side of the second carrier portion, and the two second cantilever portions are respectively located on two opposite sides of the second carrier portion; the fixing portion of the first piezoelectric drive assembly is fixed to the second carrier portion, and / or the two ends of the first guide rod are fixed to the second carrier portion; 4) A second piezoelectric drive assembly or a second guide rod is installed in the second cantilever portion. The second piezoelectric drive assembly includes a fixing portion, a piezoelectric element installed in the fixing portion, and a second drive rod with one end fixed to the piezoelectric element. The second drive rod passes through the second cantilever portion and is movably connected to the second cantilever portion. The central axis of the second drive rod is parallel to the photosensitive surface of the photosensitive chip, and the central axes of the second drive rod and the first drive rod are perpendicular to each other. 5) The movable chip assembly comprising the photosensitive chip, the first chip carrier, the second chip carrier, the first piezoelectric drive assembly, the second piezoelectric drive assembly, the first guide rod, and the second guide rod is inserted into the inverted support base; and 6) Install the housing base onto the inverted support to encapsulate the movable chip assembly in the receiving space between the support and the housing base.

19. The assembly method of the optical image stabilization sensor according to claim 18, characterized in that, Step 1) further includes: assembling the photosensitive chip and the module circuit board into a photosensitive component, and mounting the photosensitive component onto the first chip carrier; The step between step 5) and step 6) further includes: 51) Arrange the module circuit board and lead the free end of the module circuit board out from the lead hole or clearance groove of the support base; wherein, the module circuit board is a foldable circuit board, the foldable circuit board includes a plurality of rigid boards and a flexible board connected between the plurality of rigid boards; the module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

20. A camera module, characterized in that, include: A lens assembly, comprising an actuator housing and an optical lens located within the actuator housing; A photosensitive assembly includes a photosensitive chip, a support base, a housing base, an x-axis piezoelectric drive assembly, and a y-axis piezoelectric drive assembly, wherein the x-axis and y-axis are both parallel to the photosensitive surface of the photosensitive chip and are perpendicular to each other; the support base is mounted on top of the housing base, and the support base and the housing base encapsulate the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly internally; the top surface of the support base has a lead hole or clearance groove; and the lens assembly is mounted on the top of the support base. A first circuit board is attached to the photosensitive chip, and the first circuit board includes a main body and a second connecting strip; as well as The second circuit board includes a relay circuit board, which rests against the top surface of the support base. The piezoelectric elements of the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly are respectively led out from the lead hole or clearance groove through a first connecting strip. The first connecting strip is fixed and electrically connected to the surface of the relay circuit board, and the first connecting strip is separate from the first circuit board inside the photosensitive assembly. The photosensitive component also includes a chip carrier, which includes a carrier portion and at least two cantilever portions. The carrier portion is adapted to directly or indirectly mount the photosensitive chip, and the cantilever portions are formed by extending outward from the side of the carrier portion. Both the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly are horizontally arranged piezoelectric drive assemblies, each including a fixing part, a piezoelectric element mounted on the fixing part, and a drive rod with one end fixed to the piezoelectric element. The drive rod is movably connected to at least one of the cantilever parts, wherein the drive rod of the x-axis piezoelectric drive assembly and the drive rod of the y-axis piezoelectric drive assembly are arranged on the same reference plane.

21. The camera module according to claim 20, characterized in that, The second connecting strip includes at least one vertical bend and at least one horizontal bend, wherein the vertical bend is a bend in which the normal to the surface of the flexible circuit board lies on a vertical plane before and after the bend, and the horizontal bend is a bend in which the normal to the surface of the flexible circuit board lies on a horizontal plane before and after the bend; the second circuit board also includes a first extension and a second extension, one side of the relay circuit board is connected to the first extension through a vertical bend, and the first extension is connected to the second extension through a horizontal bend; both the first extension and the second extension rest against the outer surface of the actuator housing.

22. The camera module according to claim 21, characterized in that, At least some of the electronic components are disposed on the outer surface of the second extension.

23. The camera module according to claim 22, characterized in that, The first circuit board further includes a third extension and a fourth extension located outside the actuator housing. The third extension is connected to the second connecting strip located inside the photosensitive component via a horizontal bend, and the fourth extension is connected to the third extension via another horizontal bend. The fourth extension and the second extension are located on the same side of the actuator housing, and the fourth extension is fixedly and electrically connected to the second extension.

24. The camera module according to claim 23, characterized in that, The fourth extension and the second extension are fastened together by a connector.

25. The camera module according to claim 23, characterized in that, The second extension is also connected to a main connecting strip via one of the aforementioned vertical bends, the main connecting strip having a main connector suitable for electrical connection to the outside.

26. The camera module according to claim 23, characterized in that, The first extension and the second extension are attached to two adjacent outer surfaces of the actuator housing.

27. The camera module according to claim 26, characterized in that, The second extension includes a first sub-circuit board, a second sub-circuit board, and a horizontal bending portion. The first sub-circuit board and the second sub-circuit board are connected and folded together through the horizontal bending portion. The second sub-circuit board is located between the first sub-circuit board and the actuator housing. At least some electronic components are mounted on the outer surface of the first sub-circuit board. The first sub-circuit board is a rigid board, and the second sub-circuit board is either a rigid board or a flexible board.

28. The camera module according to claim 23, characterized in that, The third extension rests against the outer side of the actuator housing.

29. The camera module according to claim 20, characterized in that, The support base is formed using an embedded injection molding process, wherein the support base contains a metal sheet for the embedded injection molding process.

30. The camera module according to claim 20, characterized in that, The lens assembly also includes an autofocus drive, an optical image stabilization drive, or a zoom drive for driving the optical lens to move. The autofocus drive, optical image stabilization drive, or zoom drive is located in the cavity between the actuator housing and the top surface of the support base. The leads of the autofocus drive, optical image stabilization drive, or zoom drive are connected to the transfer circuit board.

31. The camera module according to claim 20, characterized in that, The lens assembly further includes a vertical piezoelectric drive assembly, the axis of which is perpendicular to the photosensitive surface; the piezoelectric element of the vertical piezoelectric drive assembly is mounted in at least one corner region of the four corner regions on the top surface of the support base; the moving part of the vertical piezoelectric drive assembly is integrated with the optical lens to drive the optical lens to extend or retract into the actuator housing; the piezoelectric element of the vertical piezoelectric drive assembly is connected to the relay circuit board via a lead wire.

32. The camera module according to claim 20, characterized in that, The lens assembly is a sleeve-type lens assembly, which includes a sleeve assembly, the actuator housing, and the optical lens mounted on the sleeve assembly. The sleeve assembly includes multiple nested individual sleeves, wherein any two adjacent individual sleeves are connected by a vertical piezoelectric drive assembly, the axis of which is perpendicular to the photosensitive surface; the piezoelectric element of the vertical piezoelectric drive assembly is mounted at the bottom of the lower individual sleeve, and the moving part of the vertical piezoelectric drive assembly is integrated with the bottom of the upper individual sleeve; the lead wires of the piezoelectric elements of the vertical piezoelectric drive assembly connecting adjacent individual sleeves are fixed and electrically connected to the relay circuit board.

33. The camera module according to claim 32, characterized in that, Each of the individual sleeves has a corresponding sleeve circuit board, which includes a support portion and a lead portion. The individual sleeve includes a sleeve wall and a bottom plate. Each individual sleeve is provided with a sleeve circuit board bracket. The bottom of the sleeve circuit board bracket is integrally connected to the bottom plate of the corresponding individual sleeve. The top of the sleeve circuit board bracket passes through the bottom plate of the upper individual sleeve through a through hole. The support portion of the sleeve circuit board rests against the sleeve circuit board bracket. The lead portion is a foldable circuit board. When the sleeve assembly is in the extended state, the lead portion unfolds and is suspended in the air. The lead portion passes through the bottom plate of the individual sleeve and is electrically connected to the sleeve circuit board of the next layer of individual sleeves or to the relay circuit board.

34. The camera module according to claim 33, characterized in that, For each of the aforementioned individual sleeves, a Hall element is mounted on the top of the circuit board bracket, and the sleeve circuit board is electrically connected to the Hall element.

35. The camera module according to claim 33, characterized in that, For each of the aforementioned individual sleeves, the sleeve circuit board further has a third connecting strip that rests against the upper surface of the base plate of the individual sleeve. The third connecting strip is used to connect the piezoelectric element of the vertical piezoelectric drive assembly mounted on the individual sleeve, or to connect the sleeve circuit board of the next layer of the individual sleeve.

36. The camera module according to claim 34, characterized in that, The second connecting strip includes at least one vertical bend and at least one horizontal bend, wherein the vertical bend is a bend in which the normal to the surface of the flexible circuit board lies on a vertical plane both before and after the bend, and the horizontal bend is a bend in which the normal to the surface of the flexible circuit board lies on a horizontal plane both before and after the bend; the second circuit board also includes a first extension and a second extension, one side of the relay circuit board is connected to the first extension via a vertical bend, and the first extension is connected to the second extension via a horizontal bend; both the first extension and the second extension rest against the outer surface of the actuator housing. An IC element for sensing the Hall element is mounted in the second extension.

37. The camera module according to any one of claims 20-36, characterized in that, The second circuit board contains the drive circuits for the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly, while the first circuit board contains the working circuits for the photosensitive chip.

38. The camera module according to any one of claims 20-36, characterized in that, At least one of the at least two cantilever portions has a piezoelectric drive rod adapter hole, the drive rod passes through the piezoelectric drive rod adapter hole of at least one of the cantilever portions and is movably connected to the cantilever portion, wherein the axis of the drive rod is parallel to the photosensitive surface of the photosensitive chip.

39. The camera module according to claim 38, characterized in that, The chip carrier includes a first chip carrier and a second chip carrier. The piezoelectric driving assembly includes a first piezoelectric driving assembly and a second piezoelectric driving assembly with driving directions perpendicular to each other. The first piezoelectric driving assembly is one of the x-axis piezoelectric driving assembly and the y-axis piezoelectric driving assembly, and the second piezoelectric driving assembly is the other. The photosensitive chip is fixed to the carrier portion of the first chip carrier, and the fixing portion of the first piezoelectric driving assembly is fixed to the carrier portion of the second chip carrier. The cantilever includes a driving-side cantilever and a driven-side cantilever. The driving-side cantilever has the piezoelectric drive rod adapter hole, and the driven-side cantilever has a guide rod bracket. The photosensitive component also includes an auxiliary guiding structure, which includes a guide rod that passes through the guide rod bracket and is movably connected to the guide rod bracket, allowing the guide rod bracket to move along the guide rod.

40. The camera module according to claim 39, characterized in that, The carrier portion of the first chip carrier is a first carrier portion. The first chip carrier has a first driving side and a first driven side. The first driving side and the first driven side are two opposite sides of the first carrier portion. The driving side cantilever portion and the driven side cantilever portion of the first chip carrier extend outward from the first driving side and the first driven side, respectively. The carrier portion of the second chip carrier is a second carrier portion. The second chip carrier has a second driving side and a second driven side. The second driving side and the second driven side are two opposite sides of the second carrier portion. The driving side cantilever portion and the driven side cantilever portion of the second chip carrier extend outward from the second driving side and the second driven side, respectively. The first driving side, the second driving side, the first driven side and the second driven side surround the photosensitive chip.

41. A camera module suitable for super-resolution shooting, characterized in that, include: Lens assembly; A photosensitive assembly includes a photosensitive chip, a chip carrier, and a driving device. The driving device drives the photosensitive chip to move in the x-axis and y-axis directions, wherein the x-axis and y-axis are coordinate axes parallel to the photosensitive surface of the photosensitive chip and perpendicular to each other. The chip carrier includes a carrier portion and at least two cantilever portions. The carrier portion is adapted to directly or indirectly mount the photosensitive chip, and the cantilever portions are formed by extending outward from the side of the carrier portion. The driving device includes a piezoelectric driving assembly, which includes a fixing portion, a piezoelectric element mounted on the fixing portion, and a driving rod with one end fixed to the piezoelectric element. The driving rod is movably connected to at least one of the at least two cantilever portions. The piezoelectric driving assembly includes a first piezoelectric driving assembly and a second piezoelectric driving assembly with driving directions in the x-axis and y-axis directions, respectively. The driving rods of the first and second piezoelectric driving assemblies are disposed on the same reference plane. A first control unit is used to control the drive signal applied to the drive device to control the super-resolution imaging movement path of the photosensitive chip on the xoy plane; the super-resolution imaging movement path includes multiple super-resolution offsets, and after each super-resolution offset is executed, the photosensitive chip is moved to an image sample acquisition position; wherein, each super-resolution offset causes the photosensitive pixel unit in the photosensitive chip to move along the xoy plane to a pixel position on the image plane where the super-resolution image is mapped. as well as A data processing unit is used to synthesize super-resolution images from image samples acquired by the photosensitive chip at multiple image sample acquisition locations.

42. The camera module according to claim 41, characterized in that, The photosensitive area of ​​the photosensitive chip includes multiple macropixels, and each macropixel includes multiple monochrome photosensitive pixel units of different colors; the super-resolution offset of the photosensitive chip is adapted to move one of the monochrome photosensitive pixel units of the macropixel to the position of another monochrome photosensitive pixel unit.

43. The camera module according to claim 42, characterized in that, The movement path satisfies the following condition: for any pixel position on the image plane where the super-resolution image is mapped, the monochrome photosensitive pixel unit of each color is moved to that pixel position at least once.

44. The camera module according to claim 43, characterized in that, In the macropixels of the photosensitive chip, a plurality of monochrome photosensitive pixel units are arranged in a rectangular or triangular pattern.

45. The camera module according to claim 41, characterized in that, The resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the amount of super-resolution offset is less than the spacing between adjacent photosensitive pixel units of the photosensitive chip.

46. ​​The camera module according to claim 42, characterized in that, The resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the amount of super-resolution offset is less than the spacing between adjacent macropixels of the photosensitive chip.

47. The camera module according to claim 41, characterized in that, The piezoelectric element of the piezoelectric drive assembly includes a first type of piezoelectric material layer and a second type of piezoelectric material layer, which are stacked to form the piezoelectric element. The first type of piezoelectric material layer is configured to drive a moving part to move a first distance during a single activation, the first distance being a set super-resolution offset distance. The second type of piezoelectric material layer is configured to drive the moving part to move a second distance during a single activation, the second distance being greater than the first distance.

48. The camera module according to claim 41, characterized in that, The first control unit is further configured to: control the amplitude of the driving voltage of the piezoelectric driving component or control its single activation time to make the single movement distance of the photosensitive chip equal to the super-resolution offset distance.

49. The camera module according to claim 41, characterized in that, At least one of the at least two cantilever sections has a piezoelectric drive rod adapter hole; The drive rod passes through the piezoelectric drive rod adapter hole of at least one of the cantilever portions and is movably connected to the cantilever portion, so that the chip carrier can move along the drive rod, and the guiding direction of the drive rod is parallel to the photosensitive surface of the photosensitive chip; The chip carrier includes a first chip carrier and a second chip carrier; the photosensitive chip is fixed to the carrier portion of the first chip carrier, and the fixing portion of the first piezoelectric drive assembly is fixed to the carrier portion of the second chip carrier.

50. The camera module according to claim 49, characterized in that, The cantilever includes a driving-side cantilever and a driven-side cantilever. The driving-side cantilever has the piezoelectric drive rod adapter hole, and the driven-side cantilever has a guide rod bracket. The photosensitive component also includes an auxiliary guiding structure, which includes a guide rod that passes through the guide rod bracket and is movably connected to the guide rod bracket, allowing the guide rod bracket to move along the guide rod.

51. The camera module according to claim 50, characterized in that, The carrier portion of the first chip carrier is a first carrier portion, and the cantilever portion of the first chip carrier includes a driving side cantilever portion and a driven side cantilever portion, which are formed by extending outward from two opposite sides of the first carrier portion.

52. The camera module according to claim 51, characterized in that, The carrier portion of the second chip carrier is the second carrier portion, and the cantilever portion of the second chip carrier includes a driving side cantilever portion and a driven side cantilever portion, which are formed by extending outward from two opposite sides of the second carrier portion.

53. The camera module according to claim 50, characterized in that, The driven-side cantilever portion includes at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole; the driven-side cantilever portion of the first chip carrier is slidably connected to the first guide rod, and the two ends of the first guide rod are fixed to the carrier portion of the second chip carrier; the guiding direction of the first guide rod is parallel to the guiding direction of the driving rod of the first piezoelectric drive assembly.

54. The camera module according to claim 50, characterized in that, The photosensitive component also includes a housing base and a support base, which encapsulate the photosensitive chip, the chip carrier, and the piezoelectric drive component inside; the top of the support base is adapted to mount the lens assembly.

55. The camera module according to claim 54, characterized in that, The driven side cantilever of the second chip carrier is slidably connected to the second guide rod, and the two ends of the second guide rod are fixed to the housing base and / or the support base; the guiding direction of the second guide rod is parallel to the guiding direction of the driving rod of the second piezoelectric drive assembly; the fixing part of the second piezoelectric drive assembly is fixed to the housing base and / or the support base.

56. The camera module according to claim 52, characterized in that, The first carrier portion is frame-shaped, with the photosensitive chip attached to its four edges. The photosensitive area of ​​the photosensitive chip is located at the window in the center of the first carrier portion. The second carrier portion is frame-shaped, with the photosensitive chip and the first carrier portion located at the window in the center of the second carrier portion. The driving rod of the first piezoelectric driving assembly and the driving rod of the second piezoelectric driving assembly are located on the same reference plane, which is a plane parallel to the photosensitive surface of the photosensitive chip.

57. The camera module according to claim 49, characterized in that, The photosensitive component also includes a module circuit board attached to the photosensitive chip. The module circuit board is a foldable circuit board, which includes multiple rigid boards and a flexible board connected between the multiple rigid boards. The module circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

58. The camera module according to claim 41, characterized in that, The lens assembly includes an optical lens and a first driving unit, the first driving unit being adapted to drive the optical lens to translate in the x-axis and y-axis directions; The camera module also includes a second control unit for implementing image stabilization, which is configured to control the first drive unit and the drive device to move the optical lens and the photosensitive chip in opposite directions.

59. The camera module according to claim 58, characterized in that, The second control unit is also configured to control the first drive unit and the drive device to simultaneously drive the optical lens and the photosensitive chip to move.

Images