Electroless plating jig

By designing a chemical plating fixture suitable for chips of different shapes and sizes, and using a telescopic rod assembly to hold the chips, the incompatibility problem of existing fixtures was solved, thereby improving the efficiency of the chemical plating process and the quality of chip output.

CN116970932BActive Publication Date: 2026-06-26ACCELINK TECHNOLOGIES CO LTD
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Patent Information

Application Number
CN202311030039.3
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2023-08-14
Publication Date
2026-06-26
Estimated Expiration
2043-08-14

AI Technical Summary

Technical Problem

Existing chemical plating fixtures are not effectively compatible with chips of different shapes and sizes, resulting in low efficiency of chemical plating processes for irregularly shaped chips. Furthermore, existing fixtures are prone to gold particle aggregation during batch processing, affecting chip appearance and output.

Method used

A chemical plating fixture was designed, which adopts a structure including a first fixing ring, a second fixing ring, a support column and multiple sets of telescopic rod assemblies. The telescopic rod assemblies can extend and retract according to the shape and size of the chip, and can stably clamp multiple chips, thereby improving the applicability and process efficiency.

Benefits of technology

It enables stable clamping of chips of different shapes and sizes, improves the efficiency of the chemical plating process and the output of qualified chips, and reduces the cost of wafer fabrication time.

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Abstract

The embodiment of the present application provides a chemical plating clamp, which is suitable for the chemical plating process of chips with irregular sizes and shapes in the field of semiconductor technology. The chemical plating clamp comprises a first fixing ring, a second fixing ring, a support column and a plurality of telescopic rod assemblies. The second fixing ring is arranged on one side of the first fixing ring in a spaced manner, and the central axis of the first fixing ring coincides with the central axis of the second fixing ring. One end of the support column is connected with the first fixing ring, and the other end is connected with the second fixing ring; the extension direction of the support column is parallel to the central axis of the first fixing ring. The plurality of telescopic rod assemblies are arranged on the support column in a spaced manner; one telescopic rod assembly is used for clamping one chip; one end of the telescopic rod assembly in one group is connected with the support column, and the other end is telescopically extended in a direction away from the support column and clamps different positions of the chip.
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Citation Information

Patent Citations

  • Chemical plating jig

    CN201785523U

  • Quick positioning clamp for numerical control laser cutting of heat preservation outer protection color-coated sheet

    CN218362792U