Active connector, backplane, backplane system, and electronic device

Abstract

This application relates to the field of communication technology and discloses an active connector, a backplane, a backplane system, and an electronic device. The active connector includes a board connection end and a backplane connection end. The board connection end is used to connect to a board, and the backplane connection end is used to connect to a backplane. The board connection end includes a carrier board, a terahertz chip, a patterned antenna, and a first waveguide. The carrier board is connected to the board, and the terahertz chip is connected to the carrier board. The terahertz chip receives the baseband signal from the board and converts the baseband signal into a terahertz signal. The terahertz chip is connected to the patterned antenna, allowing the terahertz signal to be transmitted from the terahertz chip to the patterned antenna. The first waveguide corresponds one-to-one with the patterned antenna, and the first end of the first waveguide is coupled to the patterned antenna. The backplane includes a second waveguide fixed to the backplane connection end. The second waveguide passes through the backplane connection end and is aligned and connected to the second end of the first waveguide. The above-mentioned active connector enables high-speed interconnection between boards through a backplane.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an active connector, backplane, backplane system and electronic device. Background Technology

[0002] In traditional backplane architecture systems, interconnecting boards with the backplane is typically achieved through the mating of high-speed connectors on the boards and high-speed connectors on the backplane. However, based on communication principles, the connector bandwidth should be at least greater than the Nyquist frequency corresponding to the transmission rate. Furthermore, due to manufacturing difficulties and tolerance limitations caused by small size, the actual achievable bandwidth of the backplane connector cannot be increased indefinitely with rising transmission rates, making backplane connector bandwidth a bottleneck for further speed improvements in backplane architecture systems. Summary of the Invention

[0003] This application provides an active connector, a backplane, a backplane system, and an electronic device. The active connector can be used to interconnect boards and backplanes to improve the signal transmission rate between boards and backplanes.

[0004] In a first aspect, this application provides an active connector, which may include a board connection terminal for connecting a board and a backplane connection terminal for connecting a backplane. The board connection terminal may include a carrier board, a terahertz chip, a patterned antenna, and a first waveguide. The carrier board is connected to the board, and the terahertz chip and patterned antenna are disposed on the carrier board. The terahertz chip is fixed to the carrier board and connected to the patterned antenna via a transmission line. The terahertz chip can receive baseband signals from the board, convert the baseband signals into terahertz signals, and then transmit the terahertz signals to the patterned antenna via the transmission line. The patterned antenna can couple the terahertz signals into the first waveguide. The first waveguide corresponds one-to-one with the patterned antenna, and the first end of the first waveguide is coupled to the patterned antenna. The backplane includes a second waveguide fixed to the backplane connection terminal, and the second waveguide can be aligned and connected to the first end of the first waveguide.

[0005] The active connector in this application connects to a board via a board connection terminal and to a backplane via a backplane connection terminal. The board connection terminal incorporates a terahertz chip, a patterned antenna, and a first waveguide. The baseband signal from the board is introduced to the terahertz chip via a transmission line on the carrier board and modulated onto a terahertz carrier within the chip. The modulated terahertz signal is then led out via the transmission line and coupled to the first waveguide via the patterned antenna, thus allowing the terahertz signal to enter the second waveguide of the backplane, thereby achieving the conversion from baseband to terahertz signal. Since the terahertz carrier frequency is much higher than the transmission rate of the baseband signal, this active connector enables high-speed interconnection between boards via the backplane.

[0006] In some possible implementations, the board connector can be connected to the board via a socket. The socket can be used to transmit the baseband signal of the board to the board connector, and the carrier board, terahertz chip, patterned antenna, and first waveguide are all located within the socket. By setting the socket and fixing the board connector within it, the alignment connection between the patterned antenna and the first waveguide is ensured, as is the alignment connection between the first waveguide and the second waveguide.

[0007] In some possible implementations, the socket may include a first section and a second section. The first section is connected to the board, and the second section is located on the side of the first section opposite to the board and snaps into the first section. The carrier board, the terahertz chip, and the patterned antenna are all located within the first section, and the first waveguide is fixed within the second section. This structure facilitates the one-to-one alignment and connection of the first waveguide and the patterned antenna.

[0008] In some possible implementations, the second part may be provided with a metal structure, and the first waveguide may be fixedly connected to the metal structure. In this way, the first waveguide does not need to be in direct contact with the patterned antenna, but can be coupled to the patterned antenna by means of the metal structure.

[0009] In some possible implementations, the metal structural component can be an "L"-shaped structure, comprising a first cavity structure perpendicular to the carrier plate and a second cavity structure parallel to the carrier plate. A first end of the first cavity structure can be used for coupling to a patterned antenna, and a second end can communicate with the second cavity structure. A first waveguide can be located within the second cavity structure and communicate with the second waveguide. Placing the first waveguide within the second cavity structure can reduce insertion loss that may result from bending the fiber optic waveguide.

[0010] In some possible implementations, the first waveguide is L-shaped, with the portion coupled to the patterned antenna perpendicular to the board and fixed within a metal structure, while the portion connected to the backplane is parallel to the board. This facilitates not only matching the first waveguide with the patterned antenna but also cooperating with the second waveguide.

[0011] In some possible implementations, the backplane connection end may include a fixing structure through which the second waveguide can be aligned and connected to the first waveguide. The fixing structure can provide fixed support for the second waveguide, thereby facilitating the alignment and connection between the second waveguide and the first waveguide.

[0012] In some possible implementations, the backplane connection end may further include a connecting plate disposed on the side of the fixed structure facing the socket. The connecting plate may be connected to the fixed structure via an elastic element. The elastic element may assist the fixed structure in moving relative to the socket, thereby facilitating the reduction of alignment tolerances between the first waveguide and the second waveguide.

[0013] In some possible implementations, the outer surface of the first waveguide is provided with a metal layer or a photonic crystal bandgap, which can not only shield the carrier signal but also reduce crosstalk.

[0014] In some possible implementations, the active connector may also include a clock recovery chip or a signal relay chip. The clock recovery chip may be located at the board connection end or the backplane connection end, and the signal relay chip may be located at the board connection end or the backplane connection end, to ensure the signal integrity of the transceiver link.

[0015] Secondly, this application may provide a backplane that can be connected to the backplane connection end of the active connector in any of the above embodiments. The backplane may include a plurality of second waveguides that can be aligned with the first waveguide in the active connector so that the boards can communicate with each other through the active connector and the backplane.

[0016] In some possible implementations, the material of the second waveguide body can be a dielectric material with a dielectric constant of 2-25. This is to reduce the weight and cost of the backplane.

[0017] In some possible implementations, the backplane may also include a support structure, which may have windows corresponding one-to-one with the active connectors. The backplane connection end corresponding to the second waveguide can be aligned and connected with the board connection end corresponding to the first waveguide through the window, so as to facilitate the management of the second waveguide in the backplane and also facilitate the connection between the active connector and the backplane.

[0018] Thirdly, this application provides a backplane system that includes a frame, circuit boards, the backplane itself, and the active connector. The frame has multiple slots for accommodating the circuit boards, which can be installed in these slots. The backplane is fixedly mounted to one side of the frame and can be connected to the circuit boards via the active connector. This backplane system enables high-speed interconnection between circuit boards.

[0019] Fourthly, this application provides an electronic device including a housing and the aforementioned backplane system, wherein the backplane system can be fixed inside the housing and is used for signal transmission between the electronic device and the outside. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of an electronic device in an embodiment of this application;

[0021] Figure 2 for Figure 1 A schematic diagram of a backplane system;

[0022] Figure 3 This is a structural unfolded diagram of a backplane system in an embodiment of this application;

[0023] Figure 4 for Figure 3 Communication diagram of the connection between the middle board and the backplane;

[0024] Figure 5 This is a schematic diagram of one structure of the backplate in an embodiment of this application;

[0025] Figure 6 This is a schematic diagram of the board connection end in an embodiment of this application;

[0026] Figure 7 for Figure 6 A schematic diagram of a structure connecting the middle plate connector and the back plate connector;

[0027] Figure 8 for Figure 6 Another structural schematic diagram of a metal structural component;

[0028] Figure 9 This is another structural diagram illustrating the connection between the board connection end and the backplane connection end in the embodiments of this application;

[0029] Figure 10 This is a schematic diagram of another structure of the board connection end in the embodiments of this application;

[0030] Figure 11 for Figure 10 A schematic diagram of the connection between the middle plate card connector and the back plate connector.

[0031] Figure label:

[0032] 1-Housing; 10-Backplane system; 100-Frame; 200, 200a, 200b, 200c-Board; 210, 210a, 210b-Application-Specific Integrated Circuit Chips; 300-Backplane; 310-Second Waveguide; 320-Support Structure; 321-Window; 400, 400a, 400b, 400c-Active Connectors; 410-Board Connection Terminals; 411, 411a, 411b-Carrier Board; 412, 412a, 412b-Terahertz Chips; 413, 413a, 413b-Patterned Antennas; 4 14, 414a, 414b - First waveguide; 4141 - First segment; 4142 - Second segment; 415 - Socket; 4151 - First section; 4152 - Second section; 4153 - Metal structural component; 41531 - First cavity structure; 41532 - Second cavity structure; 4154 - Stop block; 416 - Spring piece; 420 - Backplate connection end; 421 - Fixing structure; 4211 - First frame; 4212 - Second frame; 422 - Connecting plate; 423 - Elastic component; 424 - Elastic component; 430 - Connector. Detailed Implementation

[0033] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to also include expressions such as “one or more” unless the context clearly indicates otherwise.

[0034] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0035] Traditional backplane systems typically consist of multiple boards, each with at least one application-specific integrated circuit (ASIC) chip. These ASIC chips function as either switching or processing networks, and communication between the boards is usually achieved through a backplane connecting all the boards. Traditional high-speed backplanes generally employ printed circuit boards (PCBs) or cable backplanes. However, with increasing communication frequencies, both PCBs and cable backplanes face challenges such as increased power consumption due to increased insertion loss in the transmission medium, and limitations in connector bandwidth design. For example, the feasibility of backplane systems at speeds of 112 Gbps and above remains uncertain. Furthermore, since backplanes typically connect hundreds or thousands of channels, copper-based PCBs and copper cable backplanes suffer from bulkiness and high cost.

[0036] Based on this, embodiments of this application provide an active connector, backplane, backplane system, and electronic device to solve the problems of increased power consumption, limited connector bandwidth, bulky backplanes, and high costs existing in current backplane systems. The following will describe the above-mentioned active connector, backplane, backplane system, and electronic device with reference to specific embodiments.

[0037] refer to Figure 1 , Figure 1This is a schematic diagram of an electronic device in an embodiment of this application. The electronic device can be a router, switch, transmission network, or other chassis-type device with communication functions; this application does not limit this. Figure 1 The illustrated embodiment uses a router as an example for explanation. The electronic device may include a housing 1 and a backplane system 10 located within the housing 1. The backplane system 10 may include multiple communication channels to realize functions such as signal transmission and signal exchange. A power supply and a heat dissipation device may also be disposed within the housing 1. The power supply provides power to the backplane system 10 and other electrical components, while the heat dissipation device dissipates heat from the backplane system 10, thereby ensuring its normal operation. Exemplarily, the power supply and heat dissipation device may be located on the top of the housing 1. The housing 1 may also be provided with input / output interfaces for communication with other devices, allowing other devices to perform network exchange processing with the backplane system 10 through these interfaces.

[0038] refer to Figure 2 , Figure 2 for Figure 1 This is a schematic diagram of a backplane system. The backplane system may include a frame 100, multiple circuit boards 200, and a backplane 300, where the circuit boards 200 can be PCBs. The frame 100 may have multiple slots, which can be parallel to each other, and the multiple circuit boards 200 can be correspondingly arranged in each slot. The backplane 300 may be located on one side of the frame 100. The end of each circuit board 200 closest to the backplane 300 can be connected to the backplane 300 via an active connector 400, while the end of each circuit board 200 furthest from the backplane 300 can be provided with an external communication interface, thus enabling the circuit boards 200 and the backplane 300 to form the main communication function of the backplane system. Circuit boards 200 can receive signals through their external communication ports, then transmit the signals to one or more other circuit boards 200 via the backplane 300, and the other circuit boards 200 can then send signals through their external communication ports, thereby enabling network switching or network processing in the electronic device.

[0039] refer to Figure 3 and Figure 4 , Figure 3 for Figure 2 A structural development diagram of a backplane system. Figure 4 for Figure 3 The diagram shown illustrates the communication between two boards in the backplane system. It should be noted that... Figure 4 Only one communication link between two boards is shown in the diagram. Other communication links between these two boards or between other boards can be found by referring to this diagram. Figure 4The configuration is as shown. As previously described, the board 200 and the backplane 300 are connected via an active connector 400. In a specific implementation, the active connector 400 may include a board connection end 410 and a backplane connection end 420, wherein the board connection end 410 can be used to connect the board 200, and the backplane connection end 420 can be used to connect the backplane 300.

[0040] One or more application-specific integrated circuit (ASIC) chips 210 can be installed on the board 200. Figure 3 (Taking two application-specific integrated circuit (ASIC) chips as an example for illustration), each ASIC chip 210 can receive external baseband signals, and then transmit them through transmission line a ( Figure 4 The solid arrow (in the diagram) transmits the signal to the board connection terminal 410, meaning that the signal transmitted by transmission line a is a baseband signal. For example, transmission line a can specifically be a trace disposed on the board 200. Furthermore, when the application-specific integrated circuit chip 210 transmits the high-level baseband signal to the board connection terminal 410, its communication channel can be one or multiple channels. Here, a communication channel can also be understood as transmission line a, and the number of communication channels is the number of transmission lines a.

[0041] It is worth mentioning that, in some other embodiments, a central processing unit (CPU) may also be set on the board 200 to replace the dedicated integrated circuit chip for receiving and transmitting signals.

[0042] The board connection terminal 410 may include a carrier board 411, a terahertz chip (THz chip) 412, a patterned antenna 413, and a first waveguide 414. The carrier board 411 may be an organic substrate, or a carrier board 411 made of other materials or processes. For example, the carrier board 411 may be made of organic materials, ceramics, glass, etc. The carrier board 411 can be directly mounted to the board 200. For example, the carrier board 411 can be soldered to the board 200, or it can be disposed on the board 200 through a planar grid array package or a ball grid array package. In some other embodiments, the carrier board 411 may also be connected to the board 200 via a connector. For example, the connector may be a passive high-speed connector, a passive high-speed connector, or a socket capable of supporting the transmission of high-speed signals, where high-speed signals can be understood as signals with a transmission rate greater than 20Gbps.

[0043] The carrier board 411 can be disposed on the board 200. The baseband signal transmitted from the application-specific integrated circuit chip 210 to the carrier board 411 can be transmitted to the terahertz chip 412 through the transmission line a within the carrier board 411. Then, the terahertz chip 412 converts the baseband signal into a terahertz signal. The terahertz chip 412 can be a bare chip, which may include multiple transceiver channels. Multiple receivers and multiple transmitters can be integrated on the same silicon substrate, or multiple receivers and multiple transmitters can be integrated on different silicon substrates. Of course, in some other embodiments, the terahertz chip 412 can also be a packaged chip.

[0044] The terahertz chip 412 can be transmitted via transmission line b ( Figure 4 The dotted arrow (in the diagram) connects to the patterned antenna 413, indicating that the signal transmitted by transmission line b is a terahertz signal. For example, transmission line b can be a trace disposed on the carrier board 411. The patterned antenna 413 can also be coupled to the first end of the first waveguide 414. The baseband signal is modulated onto a terahertz carrier within the terahertz chip 412. When multiple terahertz signal transceiver channels exist within the terahertz chip 412, the patterned antenna 413 can correspond one-to-one with each channel. When multiplexing methods such as frequency division multiplexing or polarization multiplexing are used, the patterned antenna 413 can also correspond to multiple transceiver channels. Each transceiver channel can transmit the modulated terahertz signal to the patterned antenna 413 via transmission line b, and then couple it to the first waveguide 414 via the patterned antenna 413.

[0045] In some implementations, the patterned antenna 413 can be a copper pattern processed on the carrier board 411. This process can be carried out using conventional printed circuit board or carrier board processing techniques, which will not be specifically described in this embodiment. The upper surface of the copper pattern can directly contact the first waveguide 414, or the copper pattern can indirectly contact the first waveguide 414 through a medium such as adhesive or film. In this case, a plastic fastener can be fitted onto the surface of the first waveguide 414 to fix and support the first waveguide.

[0046] In other implementations, the carrier plate 411 may also be provided with a fixing device for fixing the first waveguide 414. Figure 4 (Not shown in the image) The fixing device can be combined with the patterned antenna 413 to complete the coupling function, and the fixing device can also have a certain waveguide or filtering function. In this case, when the first waveguide 414 is coupled to the patterned antenna 413, it may not need to be in direct contact with the patterned antenna 413. Of course, in some other cases, when there is a fixing device on the carrier plate 411, the first end of the first waveguide 414 may also have a tip to achieve a better coupling function.

[0047] The first waveguide 414 can be a flexible dielectric waveguide, which can be made of plastic, and the diameter of the first waveguide 414 can be between 0.5mm and 5mm. For example, the diameter of the first waveguide 414 can be 1mm, 2mm, 3mm, 4mm, etc.

[0048] As mentioned above, the terahertz chip 412 can be a packaged chip. In some embodiments, the packaged chip can be directly soldered onto the board 200, and the patterned antenna 413 is also designed on the substrate of the packaged chip, so that the terahertz chip 412 and the patterned antenna 413 become an integrated structure.

[0049] The first end of the first waveguide 414 can be coupled to the patterned antenna 413, and the second end of the first waveguide 414 can be connected to the backplane connection end 420, thereby realizing the connection between the first waveguide 414 and the backplane 300. Figure 3 , Figure 4 and Figure 5 , Figure 5 This is a schematic diagram of a backplane structure in one embodiment of this application. The backplane 300 may include a support structure 320 and multiple second waveguides 310. The second waveguides 310 can be fixedly installed on the support structure 320, so that the support structure 320 can support the second waveguides 310 and keep them fixed to ensure the stability of signal communication. The support structure 320 can be a flat plate, and multiple windows 321 can be provided on the flat plate. Each window 321 can correspond to an active connector 400. The backplane connection end 420 of the active connector 400 can be snapped into the window 321, and the second waveguide 310 can be connected to the backplane connection end 420 through the window 321.

[0050] The second waveguide 310 is connected one-to-one with the first waveguide 414, allowing terahertz signals in the first waveguide 414 to be transmitted into the second waveguide 310. The carrier frequency within the second waveguide 310 can reach 100GHz-5THz. Furthermore, since each end of the second waveguide 310 on the backplane 300 can be connected to a communication channel on two different boards 200, the backplane 300 as a whole can support the connection of all communication channels of two or more boards 200. For example, if there are N boards 200 in the backplane system, and each board 200 has M channels that need to communicate, then the number of second waveguides 310 required by the backplane 300 is (N*M) / 2. If multiplexing methods such as frequency division multiplexing are used to transmit K channel signals in the same waveguide, then the number of second waveguides 310 is (N*M) / 2 / K.

[0051] by Figure 3 For example, Figure 3The diagram shows boards 200a, 200b, and 200c. Board 200a is connected to four active connectors 400a, each connected to board 200c via a second waveguide 310. Board 200b is connected to four active connectors 400b, each connected to board 200c via a second waveguide 310 (the second waveguide 310 between board 200b and board 200c is not shown in the diagram). Board 200c is connected to four active connectors 400c, with one signal from board 200a and one signal from board 200b connected to one active connector 400c. This can be understood as active connectors 400a and 400b being the signal initiators, and active connector 400c being the signal receiver.

[0052] In some other embodiments, the signals from one board 200a and one board 200b can also be connected to different active connectors 400c respectively. In some other embodiments, multiple signal links emitted from one active connector 400a can also be connected to one active connector 400c, and so on. It is understood that the transceiver channels within the active connector 400 in the embodiments of this application can be in the form of one-to-one transmit, one-to-many transmit, many-to-one transmit, or many-to-many transmit, and the specific structure can be designed according to actual communication requirements.

[0053] The second waveguide 310 can be a flexible dielectric waveguide, and the material of the flexible dielectric waveguide can be plastic, with a dielectric constant of 2-25. The diameter of the second waveguide 310 can be between 0.5mm and 5mm, and the length of the second waveguide 310 can be between 0.3cm and 10m. For example, the diameter of the second waveguide 310 can be 1mm, 2mm, 3mm, 4mm, etc., and the length can be 0.5cm, 1m, 3cm, 7cm, etc.

[0054] Combination Figure 4 The signal transmission process of the backplane system in this embodiment can be referred to as follows:

[0055] The dedicated integrated circuit chip 210a of board 200a receives external baseband signals and transmits them to carrier board 411a via transmission line a. Carrier board 411a transmits the baseband signal to terahertz chip 412a via transmission line a, where the baseband signal is modulated onto a terahertz carrier. The modulated terahertz signal is led out via transmission line b and coupled to the first waveguide 414a via patterned antenna 413a, and then transmitted from the first waveguide 414a to the second waveguide 310. The terahertz signal enters the first waveguide 414b of another active connector via the second waveguide 310. The terahertz signal received by the first waveguide 414b is coupled into transmission line b via patterned antenna 413b and introduced into terahertz chip 412b via transmission line b. Terahertz chip 412b demodulates the terahertz signal into a baseband signal, which is then led out via transmission line a. The transmission line a can further introduce the baseband signal into the board 200b through the carrier board 411b, and transmit it to the application-specific integrated circuit chip 210b through the transmission line a on the board 200b. The application-specific integrated circuit chip 210b communicates with the outside of the backplane system through the input / output interface.

[0056] Understandably, during signal transmission, the signal flow passes through two connection interfaces, each connecting different signals. The first interface connects the signal flow to board 200, and this signal flow is a baseband signal. The second interface connects board connection terminal 410 to backplane connection terminal 420, and this signal flow is a terahertz signal. Furthermore, during communication, the terahertz signal passes through two coupling interfaces. The first coupling interface is inside board connection terminal 410, representing coupling from a microstrip line or stripline to a waveguide. The second coupling interface is at the connection point between board connection terminal 410 and backplane connection terminal 420, representing waveguide-to-waveguide coupling.

[0057] It is worth mentioning that the backplane system can also be equipped with a clock recovery chip or a signal relay chip (not shown in the figure). The clock recovery chip or signal relay chip can be located on the signal channel between board 200a and board 200b. In specific implementation, it can be set on the signal channel between board 200a and the active connector, or on the board connection end of the active connector, or on the backplane connection end of the active connector, or on the signal channel between the active connector and board 200b, in order to ensure the signal integrity of the link.

[0058] In some embodiments, reference Figure 6 and Figure 7 , Figure 6 This is a schematic diagram of one structure of the board connection end in an embodiment of this application. Figure 7 for Figure 6This is a schematic diagram of a structure connecting the middle board connection end and the backplane connection end. In this embodiment, the board connection end of the active connector can be connected to the board 200 through the socket 415. Specifically, the socket 415 has an internal accommodating space, and the carrier board 411, terahertz chip 412, patterned antenna 413, and first waveguide 414 of the board connection end can all be located inside the socket. The carrier board 411 is located inside the socket 415 on the side closer to the board 200, while the terahertz chip 412 and patterned antenna 413 are both located on the side of the carrier board 411 facing away from the board 200. For example, a protrusion can be provided on the side of the carrier board 411 facing away from the board 200, and the terahertz chip 412 can be specifically disposed on the protrusion, thereby achieving connection with the carrier board 411. The patterned antenna 413 is connected to the terahertz chip 412 through transmission line b. The first waveguide 414 is located on the side of the patterned antenna 413 away from the board. It can directly contact the patterned antenna 413 to achieve coupling connection, or indirectly contact the patterned antenna 413 through glue, film, or other means to achieve coupling connection.

[0059] A metal structural component 4153 may also be installed inside the socket 415. The metal structural component 4153 may be located on the side of the socket 415 away from the board 200. The metal structural component 4153 has a cavity inside. The first waveguide 414 may be fixedly installed in the cavity of the metal structural component 4153. In this case, the cavity of the metal structural component 4153 may be formed as a hollow metal waveguide. There may be a certain gap between the first waveguide 414 and the patterned antenna 413. The patterned antenna 413 may be coupled to the first waveguide 414 through the gap, thereby coupling the terahertz signal into the first waveguide 414.

[0060] In the above scheme, on the one hand, the first waveguide 414 can be fixedly mounted on the metal structure 4153, and the first waveguide 414 can be aligned one-to-one with the patterned antenna 413 with the help of the metal structure 4153. On the other hand, since the metal structure 4153 can play an auxiliary coupling role, the patterned antenna can be coupled to the first waveguide 414 through the metal structure 4153.

[0061] The socket 415 may also include a first portion 4151 and a second portion 4152. The first portion 4151 is connected to the board, and the second portion 4152 is snapped into the first portion 4151. The carrier board 411, the terahertz chip 412 and the patterned antenna 413 may be located in the first portion 4151, and the metal structural component 4153 may be disposed in the second portion 4152 for fixing the first waveguide 414.

[0062] The first portion 4151 may have an "L"-shaped first latch at one end facing the second portion 4152, and the second portion 4152 may have an "L"-shaped second latch at one end facing the first portion 4151. The first and second latches are interlocked. In practical applications, the first portion 4151 can be fixed to the board using screws or latches, and then the second portion 4152 can be installed from top to bottom, achieving self-locking with the first portion 4151 through the second latch. After the second portion 4152 is aligned and connected to the first portion 4151, the patterned antenna 413 and the first waveguide 414 can be coupled one-to-one. A spring clip 416 or solder ball can be provided between the first portion 4151 and the board 200, allowing the board 200 to be connected to the carrier board 411 via the spring clip 416 or solder ball, thereby facilitating signal connection between the board 200 and the carrier board 411.

[0063] In this embodiment, the spacing between two adjacent patterned antennas 413 can be less than λ0, where λ0 is the vacuum wavelength. This allows the board connection to integrate multiple transceiver channels (i.e., multiple patterned antennas 413) within a smaller size, thereby increasing the system's communication capacity. Furthermore, since the first waveguide 414 is connected to the patterned antenna 413 in a one-to-one configuration, the number of first waveguides 414 is also greater when there are many patterned antennas 413. In this case, the surface of the first waveguide 414 can be wrapped with metal, or a photonic crystal bandgap design can be used on the surface of the first waveguide 414. This not only confines the electromagnetic field inside each first waveguide 414 but also reduces crosstalk between the first waveguides 414. Additionally, since the distance between adjacent patterned antennas 413 is small, to prevent crosstalk, metal shielding or other methods can be used between adjacent patterned antennas 413 to reduce crosstalk.

[0064] Continue to refer to Figure 6 and Figure 7 The first waveguide 414 can be an "L" shaped structure, comprising a first segment 4141 and a second segment 4142 bent relative to the first segment 4141. The first segment 4141 can be used to connect to the patterned antenna 413, and the second segment 4142 can be used to connect to the second waveguide 310. The first segment 4141 of the first waveguide 414 can be set perpendicular to the carrier plate 411, thereby facilitating coupling connection between the carrier plate 411 and the patterned antenna 413. The second segment 4142 can be set parallel to the board, and the second segment 4152 can also be provided with through holes corresponding one-to-one with the second segment 4142, thereby facilitating the second segment 4142 to pass through the through holes and be aligned and connected to the second waveguide 310.

[0065] Alternatively, in some other embodiments, such as Figure 8As shown, a hollow metal waveguide can be disposed within the metal structural component 4153. The hollow metal waveguide can correspond one-to-one with the patterned antenna 413. This hollow metal waveguide can be an "L"-shaped structure. Alternatively, the metal structural component 4153 can include a first cavity structure 41531 perpendicular to the carrier plate and a second cavity structure 41532 parallel to the carrier plate. The position of the first cavity structure 41531 corresponds one-to-one with the patterned antenna 413, and the position of the second cavity structure 41532 corresponds one-to-one with the position of the second waveguide 310. The first waveguide 414 can be located within the second cavity structure 41532, meaning the first waveguide 414 is parallel to the carrier plate 411, and its coupling connection with the patterned antenna 413 is achieved through the aforementioned hollow metal waveguide.

[0066] Continue to refer to Figure 6 and Figure 7 The backplate connection end may include a fixing structure 421. One side of the fixing structure 421 may be connected to the second portion 4152, and the other side may be connected to the backplate. The second waveguide 310 may pass through the fixing structure 421 and connect to the first waveguide 414. The fixing structure 421 can provide a fixed support for the second waveguide 310, thereby allowing the second waveguide 310 to be connected to the first waveguide 414 in a one-to-one alignment. A connecting plate 422 may also be provided on the side of the fixing structure 421 connected to the second portion 4152. An elastic element 423 may be provided between the connecting plate 422 and the fixing structure 421. When the fixing structure 421 is connected to the socket 415, the second waveguide 310 passes through the fixing structure 421 and the connecting plate 422 and connects to the first waveguide 414. The elastic element 423 allows the connecting plate 422 to move relative to the socket 415, thereby reducing the alignment tolerance between the second waveguide 310 and the first waveguide 414.

[0067] In some other embodiments, the elastic element 423 and the connecting plate 422 may also be disposed on one side of the fixed structure 421 connecting back plate, which can reduce the alignment tolerance between the first waveguide 414 and the second waveguide 310.

[0068] Additionally, as mentioned earlier, the board 200 is installed in a slot within the frame. A guide structure can also be provided within the slot, allowing the board 200 to slide into the frame via the guide structure. Since the board connection end of the active connector is fixed to the board and the backplane connection end is fixed to the backplane, the second waveguide 310 can pass through the fixing structure 421 and then align with and connect to the first waveguide 414. Through the combined action of the guide structure and the elastic element 423, the alignment tolerance of the first waveguide 414 and the second waveguide 310 can be further reduced.

[0069] In some embodiments, reference Figure 9 , Figure 9This is another schematic diagram illustrating the connection between the board connection end and the backplane connection end in this embodiment. In this embodiment, a connection structure 430 can also be provided between the socket 415 and the backplane connection end. The connection structure 430 can be fixed to the board 200 with screws. The connection structure 430 can be provided with a channel that can pass through the connection structure 430 in a direction parallel to the board 200. The second segment 4142 of the first waveguide 414 can pass through the channel and be aligned and connected with the second waveguide 310 at the port of the connection structure 430 away from the socket 415.

[0070] By providing a socket 415 and a connection structure 430 on the board 200, the board's connection end can be divided into two independent functional modules. One functional module can convert between baseband signals and THz signals, leading the THz signal out from inside the board 200. The other functional module can connect the first waveguide 414 to the backplane. This also frees up the space for installing the socket 415 on the board 200, allowing it to be installed near the dedicated integrated circuit chip according to actual needs. Furthermore, it can be understood that in practical applications, the two functional modules can be used independently or simultaneously.

[0071] In some embodiments, reference Figure 10 and Figure 11 , Figure 10 This is a schematic diagram of another structure of the board connection end in the embodiments of this application. Figure 11 for Figure 10 A schematic diagram of the connection between the middle board connection end and the backplane connection end. In this embodiment, the board connection end of the active connector is connected to the board 200 through a socket 415. Specifically, the socket 415 has an internal accommodating space, and the carrier board 411, terahertz chip 412, patterned antenna 413, and first waveguide 414 of the board connection end can all be located inside the socket 415. The carrier board 411 is located inside the socket 415 on the side closer to the board 200, while the terahertz chip 412 and patterned antenna 413 are both located on the side of the carrier board 411 facing away from the board 200. For example, a protrusion can be provided on the side of the carrier board 411 facing away from the board 200, and the terahertz chip 412 can be specifically disposed on the protrusion, thereby achieving connection with the carrier board 411. The patterned antenna 413 is connected to the terahertz chip 412 through transmission line b. The first waveguide 414 is located on the side of the patterned antenna 413 away from the board 200. It can directly contact the patterned antenna 413 to achieve coupling connection, or indirectly contact the patterned antenna 413 through glue, film or other means to achieve coupling connection.

[0072] The socket 415 may include a first part 4151 and a second part 4152. The first part 4151 is connected to the board 200, and the second part 4152 is snapped into the first part 4151. The carrier board 411, the terahertz chip 412 and the graphic antenna 413 may all be located in the first part 4151.

[0073] The first section 4151 has an "L"-shaped first latch at one end facing the second section 4152, and the second section 4152 has an "L"-shaped second latch at one end facing the first section 4151. The first and second latches engage with each other. In practical applications, the first section 4151 can be fixed to the board 200 first using screws or latches, and then the second section 4152 can be installed from top to bottom, achieving self-locking with the first section 4151 through the second latch. After the second section 4152 is aligned and connected to the first section 4151, the patterned antenna 413 and the first waveguide 414 can be coupled one-to-one. A spring clip 416 or solder ball can be provided between the first section 4151 and the board 200, allowing the board 200 to be connected to the carrier board 411 via the spring clip 416 or solder ball, thereby facilitating signal connection between the board 200 and the carrier board 411.

[0074] In this embodiment, the spacing between the patterned antennas 413 can be less than λ0, where λ0 is the vacuum wavelength. This allows the board connection to integrate multiple transceiver channels (i.e., multiple patterned antennas 413) within a smaller size, enabling the transmission of more signals. Furthermore, since the first waveguides 414 are connected one-to-one with the patterned antennas 413, the number of first waveguides 414 is also greater when there are many patterned antennas 413. In this case, the surface of the first waveguides 414 can be wrapped with metal, or a photonic crystal bandgap design can be used on the surface of the first waveguides 414. This not only confines the electromagnetic field inside each first waveguide 414 but also reduces crosstalk between the first waveguides 414. Additionally, since the distance between adjacent patterned antennas 413 is small, to prevent crosstalk, metal shielding or other methods can be used between adjacent patterned antennas 413 to reduce crosstalk.

[0075] The first waveguide 414 may include a first segment 4141 and a second segment 4142. The first segment 4141 may be fixedly disposed on the second portion 4152 and perpendicular to the board 200. The end of the first segment 4141 facing the carrier plate 411 may be used for coupling connection with the patterned antenna 413. The second portion 4152 may also have through holes corresponding to the second segment 4142, so that the first segment 4141 can pass through the through holes and connect with the second segment 4142.

[0076] The backplate connection end may include a fixing structure 421, which may include a first frame 4211 and a second frame 4212. The first frame 4211 and the second frame 4212 are arranged in a direction parallel to the board 200, and the first frame 4211 is connected to the second frame 4212 by an elastic member 424. The elastic member 424 can be used to reduce the alignment tolerance between the second frame 4212 and the socket 415. The second segment 4142 of the first waveguide 414 may be fixed inside the first frame 4211. The second segment 4142 of the first waveguide 414 has an "L" shaped structure. The part of the second segment 4142 connected to the first segment 4141 is perpendicular to the board 200 and passes through the first frame 4211 to connect with the first segment 4141. The part of the second waveguide 310 connected to the second waveguide 310 is parallel to the board 200. The second waveguide 310 can pass through the second frame 4212 and then connect with the second segment 4142.

[0077] The first frame 4211 can be connected to the second section 4152 so that the first segment 4141 and the second segment 4142 are aligned and connected. The second section 4152 can also be provided with a stop block 4154. One side, two sides or three sides of the first frame 4211 can abut against the stop block 4154 to limit the position of the first frame 4211, thereby realizing the alignment of the first segment 4141 and the second segment 4142.

[0078] Compared to traditional backplane systems, the active connectors and backplane in this embodiment not only enable the conversion of baseband signals to terahertz carrier signals, but also allow for the alignment, coupling, and fixing of the first waveguide and the terahertz chip. Furthermore, precise alignment between the board and the backplane is achieved when blindly inserting the board into the frame. Since the second waveguide can be made of plastic, the weight and cost of the backplane can be reduced. Because terahertz carrier communication has no theoretical bandwidth limitations, interconnection communication at speeds of 112Gbps and above between boards can be achieved. In addition, each board can connect to multiple active connectors, further increasing the communication capacity of the backplane system.

[0079] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An active connector for connecting a circuit board and a backplane, characterized in that, It includes a board connection terminal and a backplane connection terminal, wherein the board connection terminal is used to connect the board, and the backplane connection terminal is used to connect the backplane, wherein: The board connection terminal includes a carrier board, a terahertz chip, a patterned antenna, and a first waveguide. The carrier board is disposed on the board, and the terahertz chip is disposed on the carrier board. The terahertz chip is used to convert the baseband signal of the board into a terahertz signal. The terahertz chip is connected to the patterned antenna so that the terahertz signal is transmitted to the patterned antenna. The terahertz chip includes multiple transceiver channels, and the patterned antenna corresponds one-to-one with the multiple transceiver channels. The spacing between two adjacent patterned antennas is less than λ0, where λ0 is the vacuum wavelength. The first waveguide corresponds one-to-one with the patterned antenna, and the first end of the first waveguide is coupled to the patterned antenna. The outer surface of the first waveguide is provided with a metal layer or a photonic crystal bandgap. The backplate connection end is disposed on the backplate, and the backplate includes a second waveguide fixed to the backplate connection end, the second waveguide being aligned and connected to the second end of the first waveguide.

2. The active connector according to claim 1, characterized in that, It also includes a socket, which comprises a first portion and a second portion, the first portion being connected to the board, and the second portion being snapped into the first portion; The carrier plate, the terahertz chip, and the patterned antenna are all located within the first section, and the first waveguide is fixed within the second section.

3. The active connector according to claim 2, characterized in that, The second part is provided with a metal structural component, and the first waveguide is disposed on the metal structural component.

4. The active connector according to claim 3, characterized in that, The metal structural component has an L-shaped structure, and includes a first cavity structure and a second cavity structure, wherein: The first cavity structure is perpendicular to the carrier plate, and the first end of the first cavity structure is coupled to the patterned antenna. The second cavity structure is parallel to the carrier plate, and the second cavity structure is connected to the second end of the first cavity structure. The first waveguide is located inside the second cavity structure.

5. The active connector according to claim 3, characterized in that, The first waveguide has an L-shaped structure. The portion of the first waveguide coupled to the patterned antenna is perpendicular to the board and fixed to the metal structural component. The portion of the first waveguide connected to the backplate is parallel to the board.

6. The active connector according to any one of claims 2-5, characterized in that, The backplate connection end includes a fixed structure, through which the second waveguide passes and is aligned with the first waveguide.

7. The active connector according to claim 6, characterized in that, The backplate connection end also includes a connecting plate, which is located on the side of the fixing structure facing the socket, and the connecting plate is connected to the fixing structure by an elastic element; The second waveguide passes through the connecting plate and is aligned with the first waveguide.

8. The active connector according to claim 1, characterized in that, It also includes a clock recovery chip or a signal relay chip, wherein the clock recovery chip is disposed at the board connection end or the backplane connection end, and the signal relay chip is disposed at the board connection end or the backplane connection end.

9. A backplate, characterized in that, The backplate can be used to connect to the backplate connection end of the active connector as described in any one of claims 1-8, the backplate including a second waveguide for alignment connection with the first waveguide in the active connector.

10. The backplate according to claim 9, characterized in that, The material of the second waveguide body is a dielectric material, and the dielectric constant of the dielectric material is 2-25.

11. The backplate according to claim 9 or 10, characterized in that, The backplate also includes a support structure, which has windows corresponding to the active connectors. The backplate connection end is aligned and connected to the corresponding board connection end through the window.

12. A backplane system, characterized in that, Includes a frame, a circuit board, a backplane as described in any one of claims 9-11, and an active connector as described in any one of claims 1-8, wherein: The frame is provided with multiple slots, and the board is installed in the slots; The backplate is mounted on one side of the frame and connected to the board via the active connector.

13. An electronic device, characterized in that, It includes a housing and a backplane system as described in claim 12, the backplane system being located within the housing and used for signal transmission.

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