Method for manufacturing a paster jumper for a circuit board

Abstract

The present application relates to the technical fields of patch jumper, and especially relates to a manufacturing method of patch jumper for circuit board. Compared with the prior art, the first positioning hole is processed on the substrate, and the jumper body and the insulating layer are processed subsequently, so that the first positioning hole is used to complete the processing of each step, and the orderly performance of each process is ensured. The second positioning hole is arranged on the first carrier band, so that the position during conveying is controlled, the substrate and the first carrier band are simultaneously conveyed to the stripping device, each jumper body can correspond to the first recess one by one, and each jumper body of the substrate is accurately transferred to the first recess during stripping. Since the direction of each jumper body transferred to the first recess is consistent, the first carrier band can be used to continuously convey the jumper bodies in the same direction, so that the automatic patch operation is performed, the defective products caused by the inconsistent direction of the jumper bodies are avoided, and the assembly efficiency and the assembly yield are improved.

Description

Technical Field

[0001] This invention relates to the field of surface mount jumper technology, and in particular to a method for manufacturing surface mount jumpers for circuit boards. Background Technology

[0002] In single-sided circuit board design, the following situation often occurs: multiple circuits need to cross over multiple other circuits simultaneously. To address this, existing technologies generally employ either multiple tin-plated wires or multiple single-surface jumpers.

[0003] In existing technologies, the manufacturing of surface mount jumpers typically involves cutting a large sheet of board, feeding it into a stamping die, and stamping out multiple jumpers in one go. Finally, these jumpers are unloaded into a tray. Because the overall size of the jumpers is very small, and they are stored directly in a large tray after manufacturing, subsequent use requires a vibratory feeder for sorting. Even with a vibratory feeder, the jumpers can only be individually placed into small receiving recesses, not grouped according to their orientation, thus hindering automated placement operations.

[0004] Therefore, it is necessary to research a new technical solution to address the above problems. Summary of the Invention

[0005] In view of this, the present invention addresses the deficiencies of the prior art, and its main objective is to provide a method for manufacturing surface mount jumpers for circuit boards, effectively solving the technical problem in the prior art that the surface mount jumpers are difficult to categorize according to a preset direction, thus preventing the realization of automated surface mount operations.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A method for manufacturing a surface mount jumper for a circuit board includes the following steps:

[0008] Step S1: Provide a substrate, cut the substrate to a suitable width, and trim the first end of the substrate to be flush;

[0009] Step S2: Machining a plurality of first positioning holes into the substrate, the first positioning holes being spaced apart along the extension direction of the substrate;

[0010] Step S3: The substrate is sent to the first processing station to process the jumper body, the jumper body having a first connecting part, a first welding part and a second welding part;

[0011] Step S4: Send the substrate containing the jumper body to the second processing station and tin-plate the jumper body.

[0012] Step S5: Send the jumper body from step S4 into the third processing station and apply an insulating layer to the first connecting part of the jumper body.

[0013] Step S6: Provide a first carrier tape, the first carrier tape is machined to have a plurality of second positioning holes, the second positioning holes are spaced apart along the extension direction of the first carrier tape, and the first carrier tape has a plurality of first recesses for accommodating jumper bodies, each first recess being spaced apart along the extension direction of the first carrier tape.

[0014] Step S7: Provide a stripping device to set the substrate and the first carrier tape vertically and continuously transport them to the stripping device. The substrate and the first carrier tape are positioned using the first positioning hole and the second positioning hole, respectively. The stripping device strips the jumper body of the substrate and transfers it to the first recess.

[0015] Step S8: Apply adhesive strips to the first carrier tape to complete the encapsulation. Then, the encapsulated first carrier tape is wound into a roll via the storage tray. Subsequently, the first carrier tape is unrolled using a feeder and the encapsulation film is torn off, revealing the jumper body in the first carrier tape. A robotic arm with suction cups is used to pick up and transfer the jumper body in the first carrier tape to the PCBA board. The jumper body can then be soldered onto the PCBA board using a surface mount device or a soldering device.

[0016] The beneficial effects of the manufacturing method for surface mount jumpers for circuit boards provided in this application are as follows: Compared with the prior art, by processing the first positioning hole on the substrate, the processing of each step during the subsequent processing of the jumper body and insulating layer can be completed with the help of the first positioning hole, thereby ensuring the orderly progress of each process; at the same time, the first carrier tape is set with the help of the second positioning hole to control the position during transportation, ensuring that the substrate and the first carrier tape are transported to the stripping device at the same time, so that each jumper body can correspond one-to-one with the first recess, thereby ensuring that each jumper body on the substrate is accurately transferred to the first recess during stripping; since the direction in which each jumper body is transferred to the first recess is consistent, the jumper bodies in the same direction can be continuously transported directly with the help of the first carrier tape for automated surface mount operation, and it is not easy to produce defective products due to inconsistent directions of the jumper bodies, thereby improving assembly efficiency and assembly yield.

[0017] As a preferred option: the substrate is a copper plate, and the jumper body is made by machining in the first processing station.

[0018] As a preferred embodiment: the substrate is stamped by a stamping die, so that the first welding part and the second welding part of each jumper body on the substrate are vertically offset from the first connecting part, forming a first clearance space located on the lower surface of the first connecting part. The lower surfaces of the first welding part and the second welding part are kept flush, and the lower surface of the first welding part is kept parallel to the lower surface of the first connecting part.

[0019] As a preferred embodiment: the first welded part is located at one end of the first connecting part, the second welded part is located at the other end of the first connecting part, the first welded part, the first connecting part and the second welded part are located on the same straight line, and the first welded part, the first connecting part and the second welded part have the same thickness.

[0020] As a preferred embodiment: the substrate is milled with a first clearance space on the lower surface of each jumper body by a CNC machine tool to form a first welding part, a first connecting part and a second welding part, the bottoms of the first welding part and the second welding part are flush.

[0021] As a preferred embodiment: an insulating layer is applied to one surface of the first connection portion facing the first clearance space.

[0022] As a preferred embodiment: the substrate is a glass fiber epoxy resin copper-clad laminate or a ceramic substrate, and in the first processing station, the jumper body is formed on the glass fiber epoxy resin copper-clad laminate or ceramic substrate by an etching process.

[0023] As a preferred embodiment: In the first processing station, a first turntable is installed at its infeed end and a first discharge end. The first turntable is provided with a plurality of first positioning posts that can be adapted to the first positioning holes. When the substrate is fed into or out of the first processing station, the first positioning posts can be inserted into the first positioning holes.

[0024] As a preferred embodiment: the peeling device comprises a first peeling turntable and a first motor for driving the first peeling turntable to rotate. The surface of the first peeling turntable is provided with a plurality of first pressing protrusions for peeling the jumper body from the substrate. A second turntable and a third turntable are installed on both the left and right sides of the first peeling turntable. The second turntable and the third turntable located on the same side are arranged vertically at intervals. The second turntable is used to transport the substrate, and the third turntable is used to transport the first carrier tape. Both the second turntable and the third turntable are provided with a third positioning post that is adapted to the first positioning hole and the second positioning hole.

[0025] As a preferred embodiment: the circumferential surface of the second turntable on the left side is provided with two first convex rings spaced back and forth, and the first convex rings are equipped with first cutting blades, which are used to cut stripping edges on the jumper body. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1This is a flowchart illustrating a method for manufacturing a surface mount jumper for a circuit board, as provided in an embodiment of this application.

[0028] Figure 2 This is a top view of the jumper body obtained by a method for manufacturing a surface mount jumper for a circuit board according to an embodiment of this application;

[0029] Figure 3 yes Figure 2 A top view of the first jumper body after it has been peeled off from the substrate;

[0030] Figure 4 yes Figure 3 The main view of the first type of jumper body;

[0031] Figure 5 yes Figure 2 Front view of the second jumper body after peeling off the substrate;

[0032] Figure 6 yes Figure 1 The diagram shows a structural schematic of the jumper body being stripped and housed in the first carrier tape.

[0033] Figure 7 yes Figure 6 Enlarged view of a portion of point A in the middle;

[0034] Figure 8 yes Figure 2 A top view of the third type of jumper body;

[0035] Figure 9 yes Figure 8 The top view of the third type of jumper body shown;

[0036] Figure 10 yes Figure 1 The diagram shows a method for manufacturing surface mount jumpers for circuit boards, in which a substrate enters the first processing station to process the jumper body.

[0037] Figure 11 yes Figure 1 The diagram shows a working schematic of a stripping device for stripping the jumper body in a method for manufacturing surface mount jumpers for circuit boards.

[0038] Figure 12 yes Figure 11 Left view of the second turntable;

[0039] Figure 13 yes Figure 12 Enlarged view of a section at point B in the middle;

[0040] Figure 14 This is a schematic diagram of the material storage tray sending out the first carrier belt.

[0041] The following are the labeling elements in the figure:

[0042] 10. Substrate; 11. First positioning hole;

[0043] 20. Jumper body; 21. First connecting part; 211. First clearance space; 22. First welding part; 23. Second welding part; 24. Insulation layer; 25. Foolproof notch;

[0044] 30. First carrier tape; 31. Second positioning hole; 32. First recess;

[0045] 40. First turntable; 41. First positioning post;

[0046] 50. Peeling device; 51. First peeling turntable; 511. First pressing protrusion; 52. Second turntable; 521. First protruding ring; 522. First cutting blade; 53. Third turntable; 54. Second positioning post;

[0047] 60. Storage tray. Detailed Implementation

[0048] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0049] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0050] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0052] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0053] Please refer to the following: Figures 1 to 14 The present application will now describe a method for manufacturing a surface mount jumper for a circuit board according to an embodiment of the present application.

[0054] A method for manufacturing a surface mount jumper for a circuit board includes the following steps:

[0055] Step S1: Provide substrate 10, use a shearing machine to cut substrate 10 to a suitable width, and cut the first end of substrate 10 flat;

[0056] Step S2: Machining a plurality of first positioning holes 11 into the substrate 10, wherein the first positioning holes 11 are spaced apart along the extension direction of the substrate 10.

[0057] Step S3: The substrate 10 is sent to the first processing station to process the jumper body 20. The jumper body 20 has a first connecting part 21, a first welding part 22 and a second welding part 23.

[0058] Step S4: The substrate 10 containing the jumper body 20 is sent to the second processing station to tin-plate the jumper body 20.

[0059] Step S5: Send the jumper body 20 from step S4 into the third processing station and apply an insulating layer 24 to the first connecting part 21 of the jumper body 20.

[0060] Step S6: Provide a first carrier tape 30, and machine a plurality of second positioning holes 31 on the first carrier tape 30. The second positioning holes 31 are spaced apart along the extension direction of the first carrier tape 30, and the first carrier tape 30 has a plurality of first recesses 32 for accommodating jumper bodies 20. Each first recess 32 is spaced apart along the extension direction of the first carrier tape 30.

[0061] Step S7: Provide a peeling device 50, and continuously transport the substrate 10 and the first carrier tape 30 to the peeling device 50 by setting them up vertically. The substrate 10 and the first carrier tape 30 are respectively positioned by the first positioning hole 11 and the second positioning hole 31. The peeling device 50 peels off the jumper body 20 of the substrate 10 and transfers it to the first recess 32.

[0062] Specifically, by processing the first positioning hole 11 on the substrate 10, the processing of jumper bodies 20 and insulating layers 24 on the substrate 10 can be completed with the help of the first positioning hole 11, thereby ensuring the orderly progress of each process; at the same time, the first carrier tape 30 is provided with the second positioning hole 31 to control the position during transport, ensuring that the substrate 10 and the first carrier tape 30 are transported to the stripping device 50 at the same time, so that each jumper body 20 can correspond one-to-one with the first recess 32, thereby ensuring that each jumper body 20 of the substrate 10 is accurately transferred to the first recess 32 during stripping; since the direction in which each jumper body 20 is transferred to the first recess 32 is the same, the jumper bodies 20 in the same direction can be continuously transported directly with the first carrier tape 30 for automated placement, and it is not easy for defective products to occur due to inconsistent directions of the jumper bodies 20, thereby improving assembly efficiency and assembly yield.

[0063] Please refer to the following: Figures 1 to 6 In some embodiments of this application, the substrate 10 is a copper plate, and the jumper body 20 is formed by machining at the first processing station. Preferably, the first processing station can be equipped with a stamping die, a CNC machine tool or a wire cutting machine, etc., to machine the jumper body 20 from the substrate 10.

[0064] It should be noted that the first, second, and third processing stations may or may not be on the same production line. If each processing station completes a process, the substrates 10 are collected using a tray and then transferred to the next station for loading. Furthermore, during subsequent surface mount soldering operations, the jumper bodies 20 can also be collected using a tray and fed during surface mount soldering, achieving automated soldering.

[0065] More specifically, the first type of jumper body 20 is manufactured by stamping the substrate 10 using a stamping die, such that the first welding portion 22 and the second welding portion 23 of each jumper body 20 on the substrate 10 are vertically offset from the first connecting portion 21, forming a first clearance space 211 located on the lower surface of the first connecting portion 21. The lower surfaces of the first welding portion 22 and the second welding portion 23 are flush, and the lower surface of the first welding portion 22 is parallel to the lower surface of the first connecting portion 21. The first welding portion 22 is located at one end of the first connecting portion 21, and the second welding portion 23 is located at the other end of the first connecting portion 21. The first welding portion 22, the first connecting portion 21, and the second welding portion 23 are located on the same straight line, and the thickness of the first welding portion 22, the first connecting portion 21, and the second welding portion 23 is the same.

[0066] Continuing from the above, both the first soldering part 22 and the second soldering part 23 have a foolproof notch 25 on one side. This foolproof notch 25 is used to identify the direction of the jumper body 20 during soldering, thereby reducing soldering errors and improving product yield. Specifically, the foolproof notch 25 is located on the right side of the first soldering part 22 and on the left side of the second soldering part 23. With this structure, when implementing automated surface mount soldering operations, a CCD camera can be used to capture images, providing the jumper body 20 with accurate orientation information during soldering.

[0067] Please refer to the following: Figures 1 to 6 In some embodiments of this application, the second method of manufacturing the jumper body 20 is as follows: the substrate 10 is milled with a CNC machine tool to create first clearance spaces 211 on the lower surface of each jumper body 20 to form a first welding part 22, a first connecting part 21, and a second welding part 23. The bottoms of the first welding part 22 and the second welding part 23 are flush. Since the first welding part 22, the first connecting part 21, and the second welding part 23 can be formed by directly milling the first clearance spaces 211 on the jumper body 20 with a CNC machine tool, it is not necessary to stamp the jumper body 20, thereby reducing tearing of the jumper body 20, reducing metal fatigue, and improving service life. Moreover, using a CNC machine tool for milling reduces the possibility of breakage of the jumper body 20 during stamping, thus improving product yield.

[0068] Preferably, the insulating layer 24 is applied to one surface of the first connecting portion 21 facing the first clearance space 211. The insulating layer 24 can be insulating ink or insulating adhesive, and the thickness of the insulating layer 24 is less than the height of the first clearance space 211; that is, the insulating layer 24 will not protrude from the lower surface of the first welding portion 22 and the second welding portion 23, thereby facilitating subsequent surface mount soldering operations on the jumper body 20.

[0069] Please refer to the following: Figure 1 as well as Figures 8 to 9In some other embodiments of this application, the third jumper body 20 is manufactured by an etching process. An etching machine is installed in the first processing station, and the substrate 10 is a glass fiber epoxy resin copper-clad laminate or a ceramic substrate. The jumper body 20 is formed by etching the glass fiber epoxy resin copper-clad laminate or ceramic substrate 10. When the jumper body 20 is formed by etching, the jumper body 20 only needs to be tin-plated or nickel-plated on the exposed surfaces of the first soldering part 22 and the second soldering part 23. Except for the tin-plated or nickel-plated parts, the insulating layer 24 is used for coating and covering. When using a glass fiber epoxy resin copper-clad laminate or a ceramic substrate 10, the jumper body 20 can be at least one or more on the glass fiber epoxy resin copper-clad laminate or ceramic substrate 10 to form a multi-jump structure, that is, two jumpers are used for two-jump, three jumpers are used for three-jump, and so on. In subsequent peeling, the substrate 10 is directly divided into multiple parts, and each jumper body 20 can be transferred to the first recess 32.

[0070] It should be noted that when the substrate 10 is made of metal materials such as copper, the jumper body is tin-plated; when the substrate 10 is made of glass fiber epoxy resin copper-clad laminate or ceramic substrate, it is tin-plated or nickel-plated.

[0071] Please refer to the following: Figure 1 as well as Figure 10 In some other embodiments of this application, a first turntable 40 is installed at both the infeed and discharge ends of the first processing station. Each turntable 40 is equipped with multiple first positioning posts 41 that can fit into the first positioning holes 11. The substrate 10 is fed into or out of the first processing station, and the first positioning posts 41 can be inserted into the first positioning holes 11. Because both the infeed and discharge ends are equipped with first turntables 40, the accuracy of the substrate 10's position when entering the first processing station is ensured. Furthermore, the two turntables 40 ensure reliable transport of the substrate 10, preventing it from being broken during transport. Both first turntables 40 are connected to motors, which drive the two turntables 40 to rotate.

[0072] Please refer to the following: Figure 1 as well as Figures 11 to 14The peeling device 50 consists of a first peeling turntable 51 and a first motor (not shown in the figure) for driving the first peeling turntable 51 to rotate. The surface of the first peeling turntable 51 is provided with a plurality of first pressing protrusions 511 for peeling the jumper body 20 from the substrate 10. A second turntable 52 and a third turntable 53 are installed on both the left and right sides of the first peeling turntable 51. The second turntable 52 and the third turntable 53 located on the same side are arranged vertically at intervals. The second turntable 52 is used to transport the substrate 10, and the third turntable 53 is used to transport the first carrier tape 30. The second turntable 52 and the third turntable 53 are both provided with second positioning posts 54 that are adapted to the first positioning hole 11 and the second positioning hole 31.

[0073] Specifically, the two second turntables 52 can pull the substrate 10 into the first stripping turntable 51, allowing the first stripping turntable 51 to peel the jumper body 20 from the substrate 10; while the third turntable 53 can straighten the first carrier tape 30 into the first stripping turntable 51, with each of the first recesses 32 of the first carrier tape 30 facing upwards. Since the first positioning hole 11 provides positioning for the substrate 10, and the second positioning hole 31 provides positioning for the first carrier tape 30, when the substrate 10 and the first carrier tape 30 are transported, one jumper body 20 corresponds to one first recess 32. When the first stripping turntable 51 peels off the jumper body 20, the jumper body 20 can be transferred to the first recess 32 for storage; the first carrier tape 30 is sealed by applying adhesive strips, and then the sealed first carrier tape 30 is wound up by the storage tray 60. Subsequently, the first carrier tape 30 is unfolded using a feeding feeder and the encapsulation film is torn off, revealing the jumper body in the first carrier tape 30. A robotic arm with a suction cup is used to pick up and transfer the jumper body in the first carrier tape 30 to the PCBA board. The jumper body can then be soldered onto the PCBA board using a surface mount device or a soldering device.

[0074] In some embodiments of this application, the circumferential surface of the second turntable 52 located on the left side is provided with two first convex rings 521 spaced back and forth. The first convex rings 521 are equipped with first cutting blades 522, which are used to cut stripping edges on the jumper body 20.

[0075] Specifically, when the substrate 10 is continuously fed through two second turntables 52 to peel off the jumper body 20, the first protruding ring 521 in the second turntable 52 on the left can abut against the front and rear edges of the substrate 10. When the substrate 10 is continuously transported, the first cutting blade 522 can cut a peeling edge at the position where the jumper body 20 is separated from the substrate 10. When the substrate 10 with the peeling edge cut is transported to the first peeling turntable 51, the first pressing protrusion 511 can abut against the jumper body 20 and press the jumper body 20 downward to complete the peeling of the jumper body 20 from the substrate 10 and fall into the first recess 32. This structure can prevent burrs from remaining when the jumper body 20 is peeled off and can also improve the reliability of peeling, making it less likely to be unpeeled or incompletely peeled off. Moreover, the method of cutting the jumper body 20 before peeling off the first peeling turntable 51 can reduce the occurrence of the jumper body 20 falling off when the substrate 10 is transferred to various stations, compared with the traditional method of completing the peeling edge production in the stamping mold.

[0076] The above are merely preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the scope of protection of the present invention in any way. Based on this explanation, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention, as well as other specific embodiments of the present invention that can be conceived by those skilled in the art without creative effort, should be included within the scope of protection of the present invention.

Claims

1. A method for manufacturing a surface mount jumper for a circuit board, characterized in that: Includes the following steps: Step S1: Provide a substrate (10), use a shearing machine to cut the substrate (10) to a suitable width, and cut the first end of the substrate (10) flat; Step S2: Machining a plurality of first positioning holes (11) into the substrate (10), the first positioning holes (11) being spaced apart along the extension direction of the substrate (10); Step S3: The substrate (10) is sent to the first processing station to process the jumper body (20), the jumper body (20) having a first connecting part (21), a first welding part (22) and a second welding part (23); Step S4: The substrate (10) containing the jumper body (20) is sent to the second processing station to tin-plat the jumper body; Step S5: Send the jumper body (20) from step S4 into the third processing station and apply an insulating layer (24) to the first connecting part (21) of the jumper body (20); Step S6: Provide a first carrier tape (30), the first carrier tape (30) is machined to have a plurality of second positioning holes (31), the second positioning holes (31) are spaced apart along the extension direction of the first carrier tape (30), and the first carrier tape (30) has a plurality of first recesses (32) for accommodating jumper bodies, each first recess (32) is spaced apart along the extension direction of the first carrier tape (30); Step S7: Provide a peeling device to set the substrate (10) and the first carrier tape (30) vertically and continuously transport them to the peeling device. The substrate (10) and the first carrier tape (30) are respectively positioned by the first positioning hole (11) and the second positioning hole (31). The peeling device peels off the jumper body (20) of the substrate (10) and transfers it to the first recess (32). Step S8: Apply adhesive strips to the first carrier tape to complete the encapsulation. Then, the encapsulated first carrier tape is wound into a roll via a storage tray. Subsequently, the first carrier tape is unrolled using a feeder and the encapsulation film is torn off, revealing the jumper body in the first carrier tape. A robotic arm with suction cups is used to pick up and transfer the jumper body in the first carrier tape to the PCBA board. The jumper body can then be soldered onto the PCBA board using a surface mount device or a soldering device.

2. The method for manufacturing a surface mount jumper for a circuit board according to claim 1, characterized in that: The substrate (10) is a copper plate, and the jumper body (20) is made by machining at the first processing station.

3. The method for manufacturing a surface mount jumper for a circuit board according to claim 2, characterized in that: The substrate (10) is stamped by a stamping die, so that the first welding part (22) and the second welding part (23) of each jumper body (20) on the substrate (10) are vertically offset from the first connecting part (21) and form a first clearance space (211) located on the lower surface of the first connecting part (21). The lower surface of the first welding part (22) and the lower surface of the second welding part (23) are kept flush, and the lower surface of the first welding part (22) is kept parallel to the lower surface of the first connecting part (21).

4. The method for manufacturing a surface mount jumper for a circuit board according to claim 3, characterized in that: The first welded part (22) is located at one end of the first connecting part (21), and the second welded part (23) is located at the other end of the first connecting part (21). The first welded part (22), the first connecting part (21) and the second welded part (23) are located on the same straight line, and the thickness of the first welded part (22), the first connecting part (21) and the second welded part (23) is the same.

5. The method for manufacturing a surface mount jumper for a circuit board according to claim 2, characterized in that: The substrate (10) is milled with a first clearance space (211) on the lower surface of each jumper body (20) by a CNC machine tool to form a first welding part (22), a first connecting part (21) and a second welding part (23), with the bottoms of the first welding part (22) and the second welding part (23) being flush.

6. A method for manufacturing a surface mount jumper for a circuit board according to claim 3 or 5, characterized in that: The insulating layer (24) is applied to one surface of the first connection (21) facing the first clearance space (211).

7. The method for manufacturing a surface mount jumper for a circuit board according to claim 1, characterized in that: The substrate is a glass fiber epoxy resin copper-clad laminate or a ceramic substrate. In the first processing station, the jumper body (20) is formed on the glass fiber epoxy resin copper-clad laminate or ceramic substrate by an etching process.

8. A method for manufacturing a surface mount jumper for a circuit board according to claim 1, characterized in that: In the first processing station, a first turntable is installed at its feeding end and discharge end respectively. The first turntable is provided with a plurality of first positioning posts (41) that can be adapted to the first positioning hole (11). When the substrate is fed into or out of the first processing station, the first positioning post (41) can be inserted into the first positioning hole (11).

9. A method for manufacturing a surface mount jumper for a circuit board according to claim 1, characterized in that: The peeling device (50) includes a first peeling turntable (51) and a first motor for driving the first peeling turntable (51) to rotate. The surface of the first peeling turntable (51) is provided with a plurality of first pressing protrusions (511) for peeling the jumper body (20) from the substrate (10). The first peeling turntable (51) is equipped with a second turntable (52) and a third turntable (53) on both the left and right sides. The second turntable (52) and the third turntable (53) located on the same side are arranged vertically at intervals. The second turntable (52) is used to transport the substrate (10), and the third turntable (53) is used to transport the first carrier tape (30). The second turntable (52) and the third turntable (53) are both provided with a second positioning post (54) that is adapted to the first positioning hole (11) and the second positioning hole (31).

10. A method for manufacturing a surface mount jumper for a circuit board according to claim 9, characterized in that: The second turntable (52) located on the left side has two first convex rings (521) spaced back and forth on its circumferential surface. The first convex ring (521) is equipped with a first cutting blade (522), which is used to cut a stripping edge on the jumper body (20).

Images