Cold plate and cooling method

Abstract

A cold plate and a cooling method are disclosed, wherein the cold plate is used to cool an electronic component. The cold plate includes a base having a fluid channel with a fluid inlet and a fluid outlet configured to internally circulate a cooling fluid used to carry heat dissipated by the electronic component, and a lid coupled to the base such that the fluid channel is enclosed in an interior cavity of the cold plate. The lid has a vapor outlet formed at a top side of the lid to allow generated vapor to exit from the cold plate. A cooling method is also disclosed to cool an electronic component via a cold plate. The method includes allowing some fluid of the circulating cooling fluid to permeate from the fluid channel into an interior cavity, and allowing vapor to be expelled through the vapor outlet.

Description

Technical Field

[0001] This invention relates to a cold plate, and more specifically, to a cold plate designed to overcome performance degradation caused by deviation from the nucleate boiling (DNB) phase transition. Background Technology

[0002] Telecommunications equipment, such as 5G devices, cellular network base stations, and servers, typically generates heat. Air cooling is often insufficient for cooling such high-powered devices, and liquid cooling may be required. A cold plate provides localized cooling by transferring heat from a device to a liquid, which flows to a remote heat exchanger and dissipates into the environment or into another liquid in the system being cooled. Typically, a cold plate is in direct contact with the heat source to dissipate heat through conduction, allowing heat to be released into the surrounding system / environment through convection.

[0003] Typically, the thermal conductivity of a cold plate depends primarily on its material, while its heat convection efficiency is highly dependent on its interaction with the surrounding fluid. The most common method of heat convection is to increase the contact area with the fluid, for example, through finned sections. However, this method is only suitable for single-phase cooling via either air or liquid.

[0004] Figure 1A as well as Figure 1B This shows a prior art cold plate 10 for a central processing unit (CPU) assembly. Reference Figure 1A as well as Figure 1B Typically, a cold plate 10 is equipped with two pipes: an inlet pipe 11 and an outlet pipe 12. For example... Figure 1A as well as Figure 1B As shown, a heat source, such as a central processing unit, is typically coupled to the bottom side of the cold plate 10. For example, corrugated fins 20 disposed on the heat source contact the inner surface of the cold plate 10. Increasing the contact area is important for cold plates used for phase change media, and the cold plates should also be designed to initiate and enhance fluid phase change. However, most cold plate implementations enhance the phase change / boiling effect by adding a surface treatment.

[0005] In real-world applications, heat flux may vary, and sometimes it can exceed the critical heat flux, leading to a boiling crisis, such as deviated nucleus boiling (DNB). Deviated nucleus boiling reduces the heat transfer capacity of the cold plate by generating a large number of bubbles that cannot be immediately expelled.

[0006] Therefore, there is a need for an improved cold plate that can overcome the performance degradation caused by deviated nucleation boiling in phase change cold plates. The present invention aims to provide a cold plate that includes a vapor outlet for discharging vapors generated within the cold plate. Summary of the Invention

[0007] The terms used in the embodiments and similar terms (e.g., implementation, configuration, feature, example, and option) are intended to refer broadly to all objects of the invention and the following claims. Several statements containing these terms should be understood not to limit the objects described herein or to limit the meaning or scope of the following claims. The embodiments of the invention covered herein are defined by the following claims, and not by the scope of the invention itself. This summary is a high-level overview of various features of the invention and introduces some concepts further described in the following description paragraphs. This summary is not intended to identify key or essential features of the claims, nor is it intended to be used independently to determine the scope of the claims. The subject matter should be understood through reference to appropriate portions of the complete specification of the invention, any or all of the drawings, and each claim.

[0008] According to certain aspects of the present invention, a cold plate for cooling an electronic component is disclosed. The cold plate for cooling an electronic component includes a bottom and a cover. The bottom has a fluid conduit with a fluid inlet and a fluid outlet, the fluid conduit being configured to internally circulate a cooling fluid for carrying away heat dissipated by the electronic component. The cover is coupled to the bottom such that the fluid conduit is enclosed within the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate.

[0009] In some embodiments, the bottom is defined by a peripheral wall, with the fluid conduit adjacent to the peripheral wall. For example, the peripheral wall has multiple sides, including a front side, a rear side, a left side, and a right side.

[0010] In some embodiments, the bottom also includes a chamber, with the fluid conduit located between the peripheral wall and the chamber. In some embodiments, the fluid conduit completely surrounds the chamber. In some embodiments, the fluid conduit is separated from the chamber via a control gap.

[0011] In some embodiments, the cold plate further includes a control material located in a control gap, through which cooling fluid permeates from a fluid conduit through the control material to the chamber. The control material can be any material having a microstructure that creates sufficient capillary force. For example, the control material includes one or more of a core material, a powder material, or a combination thereof.

[0012] According to certain aspects of the present invention, a cold plate for cooling an electronic component includes a first member, a second member, a fluid inlet and a fluid outlet, and a vapor outlet. The first member is defined by a first wall. The second member is mechanically coupled to the first member and is defined by a second wall and a third wall. A fluid conduit is formed between the second and third walls and configured to internally circulate a cooling fluid for carrying heat dissipated by the electronic component. The fluid inlet and the fluid outlet are formed in the fluid conduit, with the fluid inlet formed at one end of the fluid conduit to allow cooling fluid to enter the fluid conduit and the fluid outlet formed at the other end of the fluid conduit to allow cooling fluid to leave the fluid conduit. A vapor outlet is formed on a top side of the first member, allowing generated vapor to exit from the cold plate.

[0013] In some embodiments, the cold plate further includes a chamber defined by a third wall. In some embodiments, a surface of the chamber is covered by a layer of one or more materials having a microstructure that creates sufficient capillary force. For example, the material having a microstructure is a core material or a powder material. In some embodiments, a fluid conduit is separated from the chamber via a control gap that allows cooling fluid to permeate from the fluid conduit through the one or more materials having a microstructure into the chamber.

[0014] In some embodiments, the height of the control gap is less than the height of one or more layers of material having a microstructure, such that the layer is always in a humid condition. In some embodiments, a portion of the cooling fluid evaporates from the chamber and exits the cold plate, and is replaced by a portion of the cooling fluid supplied by the fluid conduit via permeation.

[0015] In some embodiments, the second member is detachably coupled to the first member. In some embodiments, the vapor outlet extends from the top side of the first member. In some embodiments, an entire surface of a bottom side of the first member is flat.

[0016] According to certain aspects of the invention, a cooling method for cooling an electronic component via a cold plate is disclosed. The cooling method includes circulating a cooling fluid in a fluid conduit surrounding a peripheral surface of the cold plate; allowing a portion of the cooling fluid to permeate from the fluid conduit into an internal chamber via a control material located in a gap between the fluid conduit and the internal chamber; and discharging vapor through a dedicated vapor outlet located in a top surface of the cold plate, the vapor being generated by heat from the electronic component coupled to the cold plate.

[0017] In some embodiments, the method further includes maintaining the control material located in the internal chamber in a humid state, the humid state allowing the vaporized cooling fluid to be replenished by the permeating cooling fluid. In some embodiments, the cooling fluid in the internal chamber is maintained at a substantially constant level.

[0018] The foregoing description is not intended to present every embodiment or feature of the invention. Rather, it provides only examples of some novel features and characteristics set forth herein. The above features and advantages, as well as other features and advantages, will become apparent from the following detailed description of representative embodiments and modes for carrying out the invention, taken in conjunction with the accompanying drawings and appended claims. Additional features of the invention will be apparent to those skilled in the art from the following brief description of various embodiments with reference to the accompanying drawings and the provided symbols. Attached Figure Description

[0019] The invention and its advantages, along with the accompanying drawings, will be better understood from the following description of exemplary embodiments in conjunction with the accompanying drawings. These drawings illustrate exemplary embodiments only and should therefore not be construed as limiting the various embodiments or claims.

[0020] Figure 1A This is a schematic diagram of the external structure of an existing cold plate, and Figure 1B This is a schematic diagram of the internal structure of an existing cold plate;

[0021] Figure 2 A general perspective view of a cold plate for certain aspects of the present invention;

[0022] Figure 3A For certain aspects of the present invention, an exploded perspective view of a cold plate;

[0023] Figure 3B for Figure 3A The side view of the cold plate shown in the image;

[0024] Figure 4A For certain aspects of the invention, a general perspective view of a cold plate having a gap separating a fluid conduit from a chamber, and Figure 4B For certain aspects of the present invention, Figure 4A The enlarged view of a portion indicated by a box shows a gap;

[0025] Figure 5A For certain aspects of the invention, a generally three-dimensional view of a bottom of a cold plate shows the circulation of a cooling fluid in a fluid conduit, and Figure 5B For certain aspects of the present invention, Figure 5A The diagram shows the bottom, where cooling fluid permeates from a fluid pipe into a chamber through a gap.

[0026] While the invention is readily adaptable to various modifications and alternatives, specific embodiments have been illustrated by way of example in the accompanying drawings and will be described in further detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

[0027] Symbol Explanation

[0028] 10: Cold Plate

[0029] 11: Inlet pipe

[0030] 12: Export Pipeline

[0031] 20: Rippled fins

[0032] 100: Cold Plate

[0033] 101: Capping

[0034] 102: Bottom

[0035] 102-1: Surrounding wall

[0036] 102-2: Inner wall

[0037] 110: Fluid inlet

[0038] 120: Fluid outlet

[0039] 130: Steam outlet

[0040] 140: Chamber / Inner Chamber

[0041] 150: Fluid Pipeline

[0042] 160: Floor

[0043] 170: Clearance / Control Clearance Detailed Implementation

[0044] This invention relates to a cold plate for cooling electronic components. The cold plate is configured with a chamber covered by a layer of one or more materials having a microstructure that creates sufficient capillary forces, allowing cooling fluid to permeate through this layer into the chamber from a fluid conduit. The cold plate is also configured with a vapor outlet, allowing vapor generated in the chamber to exit, thus overcoming the performance degradation that can result from deviations from nucleation boiling in phase-change cold plates.

[0045] Various embodiments are described with reference to the accompanying drawings, throughout which similar reference numerals are used to designate similar or equivalent elements. The drawings are not drawn to scale and are provided solely to illustrate the features and characteristics of the invention. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, those skilled in the art will readily appreciate that various embodiments may be practiced without one or more specific details or in other ways. In some cases, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments are not limited to the order in which actions or events are shown, as some actions may occur in different orders and / or simultaneously with other actions or events. Furthermore, not all actions or events shown are necessary for implementing certain features and characteristics of the invention.

[0046] For the purposes of this embodiment, unless explicitly stated otherwise, the singular includes the plural and vice versa. The term "including" means "including but not limited to". Furthermore, approximate words such as "about (about), almost, substantially, approximatelyly" and similar words may be meant herein as, for example, "at," "near, nearly at," "within 3-5% of," "within acceptable manufacturing tolerances," or any logical combination thereof. Additionally, the terms "vertical" or "horizontal" are intended to further include "within 3-5%" in the vertical or horizontal direction, respectively. Furthermore, directional terms such as "top," "bottom," "left," "right," "above," and "below" are intended to relate to the equivalent directions depicted in the reference illustrations; to be understood from the context of the referenced object or element, such as from its usual location; or other such descriptions.

[0047] Reference Figure 2 According to one embodiment of the present invention, a cold plate 100 has a fluid inlet 110, a fluid outlet 120, and a steam outlet 130. In some embodiments, at least one or all of the fluid inlet 110, fluid outlet 120, and steam outlet 130 are formed externally. Specifically, the steam outlet 130 is located at the top of the cold plate 100. For example, as Figure 2 As shown, fluid inlet 110 and fluid outlet 120 are formed in the horizontal direction, while steam outlet 130 is formed in the vertical direction. However, the formation direction of fluid inlet 110, fluid outlet 120, and steam outlet 130 is not limited to this. For example, all inlets / outlets 110, 120, and 130 may be formed in the same direction, either vertically or horizontally.

[0048] Reference Figure 3A as well as Figure 3B According to various embodiments of the present invention, the cold plate 100 includes a cover 101 and a bottom 102. In some embodiments, a vapor outlet 130 is located on the top side of the cover 101. The bottom 102 has a fluid conduit 150 with a fluid inlet 110 at one end and a fluid outlet 120 at the other end. The fluid inlet 110 allows cooling fluid to enter the fluid conduit 150 and the fluid outlet 120 allows cooling fluid to exit the fluid conduit. The fluid conduit 150 is configured to internally circulate cooling fluid to carry heat dissipated by electronic components (e.g., a central processing unit). The cover 101 is coupled to the bottom 102 such that the fluid conduit 150 is internally enclosed within the cold plate 100. In some embodiments, the cover 101 is detachably coupled to the bottom 102. In some embodiments, a bottom side of the cover 101 has a flat surface. The cover 101 has a vapor outlet 130 formed on the top side of the cover, and the vapor outlet allows generated vapor to exit from within the cold plate 100. In some embodiments, the vapor outlet 130 extends from the top side of the cap 101. In some embodiments, the fluid inlet 110 and the fluid outlet 120 extend from the side of the bottom 102. However, in some embodiments, at least one or all of the fluid inlet 110, the fluid outlet 120, and the vapor outlet 130 are not formed extending outwards.

[0049] refer to Figure 3A The bottom 102 is defined by a peripheral wall or outer wall 102-1, and the fluid conduit 150 is adjacent to the peripheral wall. The peripheral wall 102-1 has multiple sides, including a front side, a rear side, a left side, and a right side. The bottom 102 also includes a chamber 140, and the fluid conduit 150 is located between the peripheral wall 102-1 and the chamber 140 defined by an inner wall 102-2. The fluid conduit 150 completely surrounds the chamber 140.

[0050] Reference Figure 4A Inside the bottom 102, a chamber 140 is located on the top side of the heat source. A layer 160 of control material covers the surface of the chamber 140. In some embodiments, any material having a microstructure that creates sufficient capillary force is used as the control material. For example, the control material includes a core material, a powder material, or both. In some embodiments, the thickness of the layer 160 is based on a defined thermal power control or determination. That is, if the heat generated by the heat source is greater, the thickness of the layer 160 should be increased compared to when the heat is less. The chamber 140 is surrounded by a fluid conduit 150 filled with cooling fluid.

[0051] Reference Figure 4A as well as Figure 4BIn some embodiments, the fluid conduit 150 is separated from the chamber 140 via a control gap 170. In some embodiments, a control material is located in the control gap 170, such that cooling fluid permeates from the fluid conduit 150 through the control material into the chamber 140. Depending on the heat generated by the heat source, the gap 170 of the cold plate 100 may be smaller or larger, because less or more vapor will be generated in the chamber 140 based on the amount of heat. That is, the size of the gap 170 can affect the amount of cooling fluid permeating into the chamber 140, and also affect the amount of vapor generated in the chamber.

[0052] In some embodiments, the fluid or coolant in the fluid conduit 150 is at a saturation temperature. In some embodiments, the height of the control gap 170 is defined to be less than the height of the control material layer 160, which includes a core and / or powder material, to ensure that this layer is always wet but not submerged in the cooling liquid. That is, due to the height difference between this layer and the control gap 170, the control material layer 160 is never submerged.

[0053] Reference Figure 5A According to some embodiments of the present invention, a method for cooling an electronic component via a cold plate 100 includes circulating a cooling fluid in a fluid conduit 150 surrounding a peripheral surface of the cold plate. (See also...) Figure 5B Due to capillary action, some of the cooling fluid seeps from the fluid conduit 150 into an internal chamber 140. This seepage is achieved through a control material located in the gap 170 between the fluid conduit and the internal chamber, such as... Figure 4A as well as Figure 4B As shown. Vapor generated from heat from electronic components coupled to the cold plate 100 via the cooling fluid is discharged through a dedicated vapor outlet 130 located on a top surface of the cold plate. In some embodiments, the method for cooling electronic components via the cold plate 100 further includes maintaining a control material located in the internal chamber 140 in a moist state, such that a portion of the evaporated cooling fluid is replenished or replaced by a portion of the cooling fluid supplied by permeation from the fluid conduit 150. Thus, the amount of cooling fluid in the internal chamber is maintained at a substantially constant level.

[0054] According to various aspects of the invention, the cold plate 100 achieves the following effects. During heating caused by a heat source, such as an electronic component (e.g., a central processing unit), no bubbles are generated because cooling is achieved by keeping the core and / or powder layer 160 sufficiently wet, and the phase change material (i.e., vapor) floats directly to the top side, with the vapor dissipating through the vapor outlet 130. In some embodiments, the discharged vapor is directed to a condenser. Due to capillary effects, the evaporated fluid is immediately replenished or replaced by saturated cooling fluid supplied from the fluid conduit 150. Therefore, the layer 160 in the chamber 140 is always kept in a wetted state.

[0055] While various embodiments of the invention have been described above, it should be understood that they are presented by way of example only and not as limiting. Various modifications may be made to the embodiments disclosed herein without departing from the spirit or scope of the invention. Therefore, the breadth and scope of the invention should not be limited by any of the foregoing embodiments. Rather, the scope of the invention should be defined by the following claims and their equivalents.

[0056] One or more elements, aspects, steps, or any part thereof from any one or more of the following claims may be combined with one or more elements, aspects, steps, or any part thereof from one or more other claims, or combinations thereof, to form one or more additional embodiments and / or claims of the present invention.

[0057] Although embodiments of the invention have been shown and described with respect to one or more implementations, equivalents and modifications will arise in those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while specific features of the invention may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous for any given or particular application.

[0058] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. The singular forms "a" and "the" as used herein are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, the terms "including," "having," or variations thereof, as used in embodiments and / or the claims of the patent application, are intended to be included in a manner similar to the word "comprising."

[0059] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as understood by one of ordinary skill in the art. Furthermore, terms (e.g., those defined in common dictionaries) should be interpreted as having the same meaning as they have in the relevant art, and will not be interpreted herein in an idealized or overly formal sense unless explicitly defined as such.

Claims

1. A cold plate for cooling electronic components, the cold plate comprising: At the bottom, there is a fluid conduit with a fluid inlet and a fluid outlet, the fluid conduit being configured to internally circulate cooling fluid to carry away the heat dissipated by the electronic components; as well as A cap, coupled to the bottom, encloses the fluid conduit within the cold plate. The cap has a vapor outlet formed on its top side, allowing generated vapor to exit from within the cold plate. The bottom is defined by a peripheral wall, and the fluid conduit is adjacent to the peripheral wall. The bottom also includes a chamber, the fluid conduit is located between the peripheral wall and the chamber and separated from the chamber via a control gap, and a control material layer covers the surface of the chamber, and the height of the control gap is defined to be less than the height of the control material layer.

2. The cold plate as claimed in claim 1, wherein the fluid conduit completely surrounds the chamber.

3. The cold plate as claimed in claim 1 further includes a control material located in the control gap, through which the cooling fluid permeates from the fluid conduit through the control material to the chamber.

4. The cold plate as claimed in claim 3, wherein the control material is a material having a microstructure that creates sufficient capillary force, and the control material includes one or more of a core material and a powder material.

5. A cold plate for cooling electronic components, the cold plate comprising: The first component is defined by the first wall; A second component is mechanically coupled to the first component. The second component is defined by a second wall and a third wall. A fluid conduit is formed between the second wall and the third wall. The fluid conduit is configured to circulate internal cooling fluid to carry away the heat dissipated by the electronic component. A chamber defined by the third wall, wherein the fluid conduit is located between the second wall and the chamber and is separated from the chamber via a control gap; A fluid inlet and a fluid outlet are formed in the fluid conduit. The fluid inlet is formed at one end of the fluid conduit to allow the cooling fluid to enter the fluid conduit, and the fluid outlet is formed at the other end of the fluid conduit to allow the cooling fluid to exit the fluid conduit; and A steam outlet is formed on the top side of the first component, which allows the generated steam to exit from the cold plate; In this configuration, a control material layer covers the surface of the chamber, and the height of the control gap is defined to be less than the height of the control material layer.

6. A cooling method for cooling an electronic component via a cold plate, the cooling method comprising: Cooling fluid circulates in fluid pipes that surround the peripheral surface of the cold plate; A portion of the cooling fluid is allowed to permeate from the fluid conduit into the internal chamber, and this permeation is achieved by a control material located in a control gap between the fluid conduit and the internal chamber; as well as The vapor is discharged through a dedicated vapor outlet located on the top surface of the cold plate. The vapor is generated by the heat from the electronic component coupled to the cold plate. In this configuration, a control material layer covers the surface of the chamber, and the height of the control gap is defined to be less than the height of the control material layer.

7. The cooling method of claim 6, further comprising maintaining the control material located in the internal chamber in a moist state, the moist state allowing the vaporized cooling fluid to be replenished by the permeated cooling fluid.

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