Design method of high-speed high-voltage connector based on drop performance and electromagnetic compatibility technology

Abstract

Based on the design method of high-speed high-voltage connector based on drop performance and electromagnetic compatibility technology, first, through drop performance analysis, the impact model of high-speed high-voltage connector is established and finite element analysis is carried out, the influence mechanism of each related parameter on the drop performance of high-speed high-voltage connector is analyzed, the matching of design parameters and modal frequency is optimized, and the light weight design method is put forward through impact reliability design optimization; secondly, through electromagnetic compatibility performance analysis, considering the electromagnetic interference factor and putting forward the evaluation standard and simulation analysis process, the electromagnetic shielding efficiency theory and simulation method of high-speed high-voltage connector are analyzed, the influence factors are analyzed by using grey theory and TOPSIS method, and the optimal design scheme is found out; finally, considering the design scheme analysis and EMC performance optimization, the reliability and electromagnetic compatibility of high-speed high-voltage connector are realized; the design method can significantly improve the reliability and performance of high-speed high-voltage connector.

Description

Technical Field

[0001] This invention relates to the field of electrical connector technology, and in particular to a high-speed high-voltage connector reliability design method, specifically a high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology. Background Technology

[0002] The impact force generated by dropping electrical connectors can damage or cause malfunctions in critical components, such as contact bending and deformation, insulation cracking, shell deformation, and jamming of the connector. This is because drop impacts fall under the category of nonlinear transient dynamics, which can transfer energy in an extremely short time, resulting in very large impact forces that damage the product. Currently, the operating conditions for electrical connectors are becoming increasingly stringent, and the performance requirements are also becoming more stringent. Therefore, the drop failure modes and patterns of electrical connectors and their accessories need to be considered.

[0003] Currently, research on drop conditions of electrical connectors both domestically and internationally focuses on two aspects: firstly, exploring the contact reliability of electrical connectors based on the failure modes and causes in harsh environments, establishing mathematical models of contact life through reliability experiments to measure the contact life of products; secondly, using dynamic software to numerically simulate the drop impact phenomenon of electronic and electrical products and analyze their impact response laws.

[0004] However, traditional drop tests are difficult to control the drop posture, yield fewer physical quantities, are costly, and only allow observation of the product's surface characteristics, failing to determine whether internal parts or accessories are damaged. Furthermore, research on the drop impact dynamics of electrical connectors and reliability analysis under drop impact is lacking, and studies on the impact effects on various components of the assembly are limited.

[0005] Furthermore, high-speed, high-voltage connectors have become a hot topic in automotive wiring harness research and development, placing more stringent requirements on the design of automotive electrical connectors and terminals. Electromagnetic interference signals generated during operation may directly enter sensitive equipment, or they may enter control and signal lines through capacitive and inductive coupling between cables, affecting sensitive equipment. Electromagnetic radiation generated by the wiring harness can also affect sensitive equipment through field-line coupling, causing spatial radiation interference. With the increasing operating frequency of electronic and electrical equipment and the changing engineering application environments such as high voltage and current change rates, the electromagnetic environment of electric vehicles is deteriorating.

[0006] Therefore, electromagnetic compatibility (EMC) performance should be considered during the design of high-speed, high-voltage connectors to avoid interference with high-speed signal transmission and external interference. Currently, the EMC performance design of high-speed, high-voltage connectors often adopts a cyclical process of "design-rectification-redesign." During the R&D phase, where time determines product success, an unreliable EMC performance design cycle can lead to excessively long development cycles and missed market opportunities.

[0007] Furthermore, current standards for connectors in new energy vehicles are mainly based on standards from other industrial sectors and related product types, with few specific automotive industry standards or national standards. This results in a wide variety of product types on the market and poor versatility. The high-speed, high-voltage, and high-current connectors used in future electric vehicles will inevitably develop towards higher protection, higher stability, and higher compatibility. However, compared to well-known companies, there are relatively few domestic manufacturers in this field, and the industry's technical barriers to entry are high.

[0008] In conclusion, there is an urgent need to explore an analytical method that breaks away from the original design process and uses performance-driven design to comprehensively solve the problems of drop impact performance and electromagnetic compatibility performance of high-speed high-voltage connectors. Summary of the Invention

[0009] To overcome the shortcomings of the prior art, this invention provides a high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility (EMC) technology. This invention achieves dual assurance of reliability and EMC for high-speed high-voltage connectors through analysis of drop performance-based high-speed high-voltage connector design schemes and design and optimization of high-speed high-voltage connectors based on EMC performance.

[0010] To achieve the aforementioned inventive objectives, the present invention employs the following technical solution: A design method for high-speed high-voltage connectors based on drop performance and electromagnetic compatibility (EMC) technology is disclosed. The method includes drop impact performance and reliability design optimization, and EMC performance analysis and design methods for high-speed high-voltage connectors. The drop impact performance and reliability design optimization includes drop impact theory and application, finite element modeling and analysis of drop impact performance, analysis of the impact mechanism of drop impact performance, modal performance analysis and parameter matching, and lightweight design optimization for impact reliability. The EMC performance analysis and design methods include analysis of EMC and electromagnetic interference influencing factors, electromagnetic shielding effectiveness theory and simulation analysis, analysis of the EMC performance impact mechanism based on grey theory, analysis of EMC performance-based design schemes, and design and optimization of EMC-based high-speed high-voltage connectors.

[0011] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology includes the following steps for optimizing the drop impact performance and reliability of the high-speed high-voltage connector: Step 1: Theory and Application of Drop Impact Testing for High-Speed ​​High-Voltage Connectors First, the theory and application analysis of drop impact of high-speed high-voltage connectors are carried out. Combining collision impact theory and explicit dynamics method, the contact collision mechanics model, damage boundary and safety boundary, and drop impact strength conditions of high-speed high-voltage connectors are determined. Step 2: Finite element modeling and analysis of drop impact performance of high-speed high-voltage connectors: Based on theoretical and methodological analysis, a finite element analysis model of the drop impact performance of high-speed high-voltage connectors was established using the ABAQUS finite element analysis platform. Material parameters, contact parameters, and calculation control parameters were determined, and the strain and acceleration of the high-speed high-voltage connectors under different drop heights and angles were calculated and compared with experimental results. At the same time, the drop impact performance of the plug and socket of the high-speed high-voltage connector was analyzed to understand the overall drop impact response after the plug and socket are mated, and the contact performance between the pins and the socket after the collision was analyzed. Step 3: Analysis of the impact mechanism on the drop impact performance of high-speed high-voltage connectors: The entropy weight method and TOPSIS method are introduced to analyze the influence of structural design parameters of high-speed high-voltage connectors on drop impact performance, so as to clarify the influence mechanism of different structural design parameters on the drop impact performance and critical drop height of high-speed high-voltage connectors, screen out the important design parameters and clarify their influence law. Step 4: Modal performance analysis and parameter matching of high-speed high-voltage connectors: This study investigates the relationship between the vibration and impact of a high-speed high-voltage connector model when it is dropped and impacted on the ground, and its natural frequencies and mode shapes. A finite element model for modal analysis of the high-speed high-voltage connector is established, and modal analysis is performed using the Block Lanczos method. The first six modal frequencies and mode shapes are analyzed. If resonance occurs, a matching analysis of design parameters and modal frequencies is performed. Step 5: Optimization of lightweight design for high-speed high-voltage connectors to ensure impact reliability. By taking the key parameters of plugs, pins, and sockets as design variables, a parameterized finite element analysis model is established. Sampling is carried out using experimental design methods, and the three-parameter Weibull distribution theory method is introduced. Combined with surrogate models and multi-objective optimization methods, a lightweight design optimization method for impact reliability of high-speed high-voltage connectors is proposed, forming a complete method system. Simulation and experimental verification are then conducted.

[0012] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology includes the following steps in its analysis of electromagnetic compatibility and electromagnetic interference influencing factors: The first step is to conduct theoretical and methodological research on electromagnetic compatibility and electromagnetic interference, analyze the main modes of electromagnetic compatibility and electromagnetic interference of connectors, and, based on the traditional electromagnetic compatibility analysis method and the three elements of interference source, coupling path and sensitive device, adopt new analysis methods, including high frequency characteristics, return path and voltage tolerance, to elaborate on the nature, generation conditions and propagation mechanism of electromagnetic interference and electromagnetic compatibility, and provide guidance for the design parameters of high-speed high voltage connectors. The second step is to analyze the relationship between the magnetic permeability and conductivity of the metal shield of the high-speed high-voltage connector and the absorption loss and reflection loss, and to clarify the attenuation law of high-frequency signals; combined with performance indicators such as shielding efficiency and wave impedance, to explore the electromagnetic compatibility design technology and method of high-speed high-voltage connectors based on shielding technology, grounding technology and filtering technology. The third step is to explain the influence of the material, thickness and structural radius of the shielding body on the shielding performance. At the same time, it analyzes the electromagnetic shielding effect of metal materials such as copper, aluminum, steel and lead as shielding metals in the range of 0 to 100,000 kHz. The fourth step is to investigate the influence of shielding materials, distances, and shielding characteristics, as well as variables such as ungrounded, single-point and multi-point grounding, filter capacitors, filters, and magnetic devices on the EMC performance of high-speed high-voltage connectors, and to screen out the main influencing factors on the electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors.

[0013] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology, and the electromagnetic shielding effectiveness theory and simulation analysis method of the high-speed high-voltage connector specifically include the following steps: The first step involves combining the main influencing factors of connector electromagnetic compatibility and electromagnetic interference, using the theoretical calculation method of shielding effectiveness and the calculation formula of shielding effectiveness of a complete metal plate, and comparing and analyzing the simulation analysis method of EMC performance of high-speed high-voltage connectors. The second step is to use transmission line theory to analyze the impact of shielding discontinuity and termination load on the shielding performance of high-speed high-voltage connectors, and to qualitatively analyze the importance of transfer impedance and pin allocation for improving the electromagnetic compatibility of high-speed high-voltage connectors by combining theoretical analysis and simulation. The third step is to master the shielding principle, structural design, shielding effectiveness testing, thermal protection and reliability design of high-speed high-voltage connectors, and to use HFSS electromagnetic compatibility simulation analysis software to establish a finite element model for EMC performance simulation analysis of high-speed high-voltage connectors and analyze performance indicators such as shielding effectiveness. The fourth step involves comparing and analyzing the experimental test results and validating the model to construct a finite element analysis method for the EMC performance of high-speed high-voltage connectors. A quantitative evaluation standard for the EMC performance of high-speed high-voltage connectors is proposed, forming a set of simulation analysis methods for the EMC performance of high-speed high-voltage connectors. This provides a foundation for research on the impact mechanism of EMC performance on high-speed high-voltage connectors and for design optimization.

[0014] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology, and the analysis of the EMC performance impact mechanism of the high-speed high-voltage connector based on grey theory, specifically include the following steps: The first step involves analyzing the main influencing factors of electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors, and then using the HFSS electromagnetic compatibility simulation analysis software platform to conduct EMC performance simulation analysis of high-speed high-voltage connectors. The second step involves designing different electromagnetic schemes based on factors such as the presence or absence of grounding, absorbing materials, connector material thickness variations, and ventilation holes. The radiated power structure of each scheme is then simulated to investigate its impact on EMC performance, and the schemes are compared. Simultaneously, grey theory, grey relational analysis, and the TOPSIS method are introduced to analyze the impact mechanism on connector EMC performance and identify the optimal scheme. The third step involves analyzing the impact mechanism of characteristic parameters such as rated voltage, rated current, insertion loss, ripple amplitude, cutoff frequency, bandwidth, center frequency, and quality factor on the EMC performance of high-speed high-voltage connectors.

[0015] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology, specifically includes the following steps in the analysis of the high-speed high-voltage connector design scheme based on EMC performance: The first step is to analyze the parameter requirements of the filter connector based on the actual engineering requirements and technical needs, including the characteristics of the interference source, frequency range, voltage, impedance and other parameters, as well as the requirements of the load characteristics. Based on the results of the requirements analysis, select a suitable filter connector. The second step involves taking a certain type of micro-rectangular plate array filter chip as an example, and using the correlation filtering principle, optimizing and improving the design techniques such as the design of the internal and external electrode patterns of the chip, the selection and matching of dielectric and electrode materials, and the derivation of the actual design parameters of the chip from known indicators. The third step involves using HFSS electromagnetic compatibility simulation analysis software to model and simulate the filter chip of the high-speed high-voltage connector with electromagnetic compatibility, analyzing the impact of changes in component parameters on the filter connector; and comparing and analyzing the actual test results of the product to verify the accuracy of the simulation results. The fourth step involves analyzing the working principles, structural characteristics, shielding effectiveness, applicable scope, advantages, and disadvantages of electromagnetic shielding schemes, filter structure schemes, metal shielding cover structure schemes, and cutoff waveguide hole structure schemes to provide suitable shielding solutions. Finally, based on the minimum insertion loss value of the capacitor, the corresponding capacitor, and the requirements, a high-speed high-voltage connector design scheme is selected.

[0016] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology, specifically includes the following steps for the design and optimization of high-speed high-voltage connectors based on EMC performance: The first step is to establish a finite element analysis parametric model of the EMC performance of the high-speed high-voltage connector in Meshworks based on the selected high-speed high-voltage connector design scheme. The second step is to use experimental design methods in Hyperstudy to sample and perform contribution analysis on each design variable of the high-speed high-voltage connector, and screen out the design variables with significant influence. The third step is to establish a proxy model for EMC performance design optimization of high-speed high-voltage connectors in Isight software, select a suitable hybrid multi-objective optimization algorithm, and introduce Six Sigma theory and design methods. The fourth step involves combining surrogate modeling and multi-objective optimization methods to propose robust and reliable design and optimization methods for high-speed high-voltage connectors based on EMC performance within the Isight multidisciplinary optimization design platform, forming a complete methodology. Step 5: Implement isolation filtering design to achieve a good grounding environment, perform electromagnetic interference shielding design, and optimize the design with three-dimensional reasonable process layout and other optimization measures; conduct electrostatic disturbance test and electromagnetic shielding test on the structure and scheme before and after optimization.

[0017] By employing the technical solution described above, the present invention has the following advantages: This invention employs methods such as application analysis of drop impact theory for high-speed high-voltage connectors, finite element modeling, influence mechanism analysis, modal performance analysis, and parameter matching to improve the impact reliability of high-speed high-voltage connectors and achieve lightweight design optimization. Furthermore, this invention enables a comprehensive analysis and optimization of the electromagnetic compatibility (EMC) performance of high-speed high-voltage connectors, resulting in anti-interference capabilities and interference-free operation. The novel analysis methods and optimization design techniques further enhance the EMC performance of high-speed high-voltage connectors, reduce the risk of electromagnetic interference to external devices, and improve the stability and reliability of high-speed high-voltage connectors. This invention proposes a performance-driven design approach to address the drop impact performance and EMC performance issues of high-speed high-voltage connectors. It comprehensively considers the impact of drop performance and EMC performance on the performance of high-speed high-voltage connectors, providing a comprehensive technical analysis and exploration, offering a global perspective and technical support for high-speed high-voltage connector design, and is suitable for widespread promotion and application. Attached Figure Description

[0018] Figure 1 This is a technical roadmap of the present invention; Figure 2This is a technical roadmap for optimizing the drop impact performance and reliability design of high-speed high-voltage connectors in embodiments of the present invention. Figure 3 This is a technical roadmap for the EMC performance analysis and design method of high-speed high-voltage connectors in embodiments of the present invention; Figure 4 This is a technical roadmap for analyzing the influencing factors of electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors in embodiments of the present invention; Figure 5 This is a technical roadmap for the theory and simulation analysis method of electromagnetic shielding effectiveness of high-speed high-voltage connectors in embodiments of the present invention; Figure 6 This is a technical roadmap for analyzing the EMC performance impact mechanism of high-speed high-voltage connectors based on grey theory in this invention embodiment; Figure 7 This is a technical roadmap for analyzing the high-speed high-voltage connector design scheme based on EMC performance in the embodiments of the present invention; Figure 8 This is a technical roadmap for the design and optimization of high-speed high-voltage connectors based on EMC performance in this invention embodiment; Figure 9 This is a three-dimensional structural diagram of the slot electrical connector in an embodiment of the present invention; Figure 10 This is the logarithmic strain contour plot corresponding to the peak time frame (t=0.0002s) in this embodiment of the invention; Figure 11 This is an energy output diagram of the connector during a drop impact process in an embodiment of the present invention; Figure 12 This is a three-dimensional structural diagram of the high-speed electrical connector in an embodiment of the present invention; Figure 13 The figure shows the simulation results of the differential signal transmission reflection characteristics in an embodiment of the present invention. Implementation

[0019] The present invention can be explained in more detail through the following embodiments, but the present invention is not limited to the following embodiments; Combined with appendix Figures 1-8 This invention achieves dual assurance of reliability and electromagnetic compatibility for high-speed high-voltage connectors through analysis of high-speed high-voltage connector design schemes based on drop performance and design and optimization of high-speed high-voltage connectors based on EMC performance.

[0020] This invention first establishes an impact model for high-speed high-voltage connectors through drop performance analysis and performs finite element analysis. It analyzes the influence mechanism of various relevant parameters on the drop performance of high-speed high-voltage connectors, optimizes the matching of design parameters and modal frequencies, and proposes a lightweight design method through impact reliability design optimization. Secondly, through electromagnetic compatibility (EMC) performance analysis, it considers EMC factors and proposes evaluation criteria and simulation analysis procedures. It analyzes the theory and simulation methods of electromagnetic shielding effectiveness of high-speed high-voltage connectors, uses grey theory and TOPSIS method to analyze influencing factors, and identifies the optimal design scheme. Finally, by comprehensively considering design scheme analysis and EMC performance optimization, it achieves dual protection of the reliability and EMC of high-speed high-voltage connectors. The design method of this invention can significantly improve the reliability and performance of high-speed high-voltage connectors.

[0021] The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology described in this invention, such as... Figure 1 As shown, the design method includes the drop impact performance and reliability design optimization of high-speed high-voltage connectors, and the EMC performance analysis and design method of high-speed high-voltage connectors. The drop impact performance and reliability design optimization of high-speed high-voltage connectors includes drop impact theory and application of high-speed high-voltage connectors, finite element modeling and analysis of drop impact performance of high-speed high-voltage connectors, analysis of the influence mechanism of drop impact performance of high-speed high-voltage connectors, modal performance analysis and parameter matching of high-speed high-voltage connectors, and lightweight design optimization of impact reliability of high-speed high-voltage connectors. The EMC performance analysis and design method of high-speed high-voltage connectors includes analysis of electromagnetic compatibility and electromagnetic interference influencing factors of high-speed high-voltage connectors, theory and simulation analysis method of electromagnetic shielding effectiveness of high-speed high-voltage connectors, analysis of the influence mechanism of EMC performance of high-speed high-voltage connectors based on grey theory, analysis of high-speed high-voltage connector design schemes based on EMC performance, and design and optimization of high-speed high-voltage connectors based on EMC performance.

[0022] In specific implementations of this invention, such as Figure 2 As shown, the drop impact performance and reliability design optimization of the high-speed high-voltage connector includes the following steps: Step 1: Conduct theoretical and applied analysis of drop impact on high-speed high-voltage connectors. Combining collision impact theory and explicit dynamics methods, determine the contact collision mechanics model, damage boundary and safety boundary, and drop impact strength conditions for high-speed high-voltage connectors.

[0023] Step 2: Based on the theoretical and methodological analysis, a drop impact finite element analysis model of the high-speed high-voltage connector is established using the ABAQUS finite element analysis platform. Material parameters, contact parameters, and calculation control parameters are determined. The strain and acceleration of the high-speed high-voltage connector under different drop heights and angles are calculated and compared with experimental results for verification. At the same time, the drop impact performance of the high-speed high-voltage connector plug and socket is analyzed to understand the overall drop impact response after the plug and socket are mated, and the contact performance between the pins and sockets after the collision is analyzed.

[0024] Step 3: Introduce the entropy weight method and TOPSIS method to analyze the influence of structural design parameters of high-speed high-voltage connectors on drop impact performance, so as to clarify the influence mechanism of different structural design parameters on the drop impact performance and critical drop height of high-speed high-voltage connectors, screen out the important design parameters and clarify their influence laws.

[0025] Step 4: Investigate the relationship between the vibration and impact of the high-speed high-voltage connector model upon drop and impact with the ground, and its natural frequencies and mode shapes. Establish a finite element model for modal analysis of the high-speed high-voltage connector, and perform modal analysis using the Block Lanczos method to analyze its first six modal frequencies and mode shapes. If resonance occurs, perform a matching analysis between design parameters and modal frequencies.

[0026] Step 5: Using the key parameters of the plug, pins, and socket as design variables, establish a parameterized finite element analysis model, sample using experimental design methods, introduce the three-parameter Weibull distribution theory method, and combine surrogate models and multi-objective optimization methods to propose a lightweight design optimization method for high-speed high-voltage connectors to improve impact reliability, forming a complete method system, and conduct simulation analysis and experimental verification.

[0027] Furthermore, such as Figure 3 As shown, the EMC performance analysis and design method of the high-speed high-voltage connector includes five main parts: First, the electromagnetic compatibility of the high-speed high-voltage connector is studied, and the influence of various factors on its electromagnetic interference is analyzed; second, the electromagnetic shielding effectiveness theory and simulation analysis method are explored to evaluate the electromagnetic shielding performance of the high-speed high-voltage connector; simultaneously, the mechanism of the influence of the EMC performance of the high-speed high-voltage connector is analyzed using grey theory; in addition, the design scheme of the high-speed high-voltage connector based on EMC performance is analyzed to meet the electromagnetic compatibility requirements; finally, based on EMC performance, the design and optimization scheme of the high-speed high-voltage connector is proposed to ensure its good electromagnetic compatibility.

[0028] Furthermore, such as Figure 4 As shown, the analysis of electromagnetic compatibility and electromagnetic interference influencing factors of the high-speed high-voltage connector includes the following steps: Step 1: Conduct theoretical and methodological research on electromagnetic compatibility and electromagnetic interference, analyze the main modes of electromagnetic compatibility and electromagnetic interference in high-speed high-voltage connectors, and based on the traditional electromagnetic compatibility analysis method, which considers the three elements of interference source, coupling path and sensitive device, adopt new analysis methods, including high-frequency characteristics, return path and voltage tolerance, to elaborate on the nature, generation conditions and propagation mechanism of electromagnetic interference and electromagnetic compatibility, and provide guidance for the design parameters of high-speed high-voltage connectors.

[0029] Step 2: Analyze the relationship between the magnetic permeability and conductivity of the metal shield of the high-speed high-voltage connector and the absorption loss and reflection loss, and clarify the attenuation law of high-frequency signals; combine shielding efficiency and wave impedance and other performance indicators to explore the electromagnetic compatibility design technology and method of high-speed high-voltage connector based on shielding technology, grounding technology and filtering technology.

[0030] Step 3: Explain the influence of the material, thickness, and structural radius of the shielding body on the shielding performance. At the same time, analyze the electromagnetic shielding effect of metal materials such as copper, aluminum, steel, and lead as shielding metals in the range of 0 to 100,000 kHz.

[0031] Step 4: Investigate the influence of shielding materials, distance, and shielding characteristics, as well as variables such as ungrounded, single-point and multi-point grounding, filter capacitors, filters, and magnetic devices on the EMC performance of high-speed high-voltage connectors, and screen out the main influencing factors on the electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors.

[0032] Furthermore, such as Figure 5 As shown, the theoretical and simulation analysis method for the electromagnetic shielding effectiveness of the high-speed high-voltage connector includes the following steps: Step 1: Combining the main influencing factors of electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors, the simulation analysis method of EMC performance of high-speed high-voltage connectors is compared and analyzed by using the theoretical calculation method of shielding effectiveness and the calculation formula of shielding effectiveness of complete metal plate.

[0033] Step 2: Analyze the impact of shielding discontinuities and termination loads on the shielding performance of high-speed high-voltage connectors using transmission line theory, and qualitatively analyze the importance of transfer impedance and pin assignment for improving the electromagnetic compatibility of high-speed high-voltage connectors through a combination of theoretical analysis and simulation.

[0034] Step 3: Master the shielding principle, structural design, shielding effectiveness testing, thermal protection and reliability design of high-speed high-voltage connectors. Use HFSS electromagnetic compatibility simulation analysis software to establish a finite element model for EMC performance simulation analysis of high-speed high-voltage connectors and analyze performance indicators such as shielding effectiveness.

[0035] Step 4: Based on the experimental test results, conduct comparative analysis and model verification, construct a finite element analysis method for the EMC performance of high-speed high-voltage connectors, propose a quantitative evaluation standard for the EMC performance of high-speed high-voltage connectors, and form a set of simulation analysis method and process for the EMC performance of high-speed high-voltage connectors, providing a foundation for the research and design optimization of the EMC performance influencing mechanism of high-speed high-voltage connectors.

[0036] Step 5: Taking a certain high-speed high-voltage connector as an example, through research on shielding effectiveness testing technology, the shielding effectiveness of the product is made to meet the development requirements of better than 20dB in the frequency range of 10kHz to 0.03GHz and better than 40dB in the frequency range of 0.03GHz to 18GHz.

[0037] Furthermore, such as Figure 6 As shown, the analysis of the EMC performance impact mechanism of high-speed high-voltage connectors based on grey theory includes the following steps: Step 1: Based on the analysis of the main influencing factors of electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors, the HFSS electromagnetic compatibility simulation analysis software platform is used to conduct EMC performance simulation analysis of high-speed high-voltage connectors.

[0038] Step 2: Based on the presence or absence of grounding, absorbing materials, connector material thickness variations, and ventilation holes, design different electromagnetic schemes. Calculate the radiated power structure of each scheme through simulation to explore its impact mechanism on EMC performance and compare the various schemes. At the same time, introduce grey theory, grey relational analysis, and TOPSIS to analyze the impact mechanism on the EMC performance of high-speed high-voltage connectors and find the optimal scheme.

[0039] Step 3: For filter connectors, analyze the influence mechanism of characteristic parameters such as rated voltage, rated current, insertion loss, ripple amplitude, cutoff frequency, bandwidth, center frequency, and quality factor on the EMC performance of high-speed high-voltage connectors.

[0040] Furthermore, such as Figure 7 As shown, the analysis of the high-speed high-voltage connector design scheme based on EMC performance includes the following steps: Step 1: Starting from the actual engineering situation and combining technical requirements, analyze the parameter requirements of the filter connector, including interference source characteristics, frequency range, voltage, impedance and other parameters, as well as load characteristics. Based on the requirements analysis results, select a suitable filter connector.

[0041] Step 2: Taking a certain type of micro rectangular plate array filter chip as an example, the design techniques such as the design of the internal and external electrode patterns, the selection and matching of dielectric and electrode materials, and the derivation of the actual design parameters of the chip from known indicators are optimized and improved by adopting the correlation filtering principle.

[0042] Step 3: Using HFSS electromagnetic compatibility simulation analysis software, model and simulate the filter chip of the high-speed high-voltage connector with electromagnetic compatibility, analyze the impact of changes in component parameters on the filter connector; compare and analyze the actual test results of the product to verify the accuracy of the simulation results.

[0043] Step 4: Analyze the working principles, structural characteristics, shielding effectiveness, applicable scope, advantages and disadvantages of electromagnetic shielding schemes, filter structure schemes, metal shielding cover structure schemes, and cutoff waveguide hole structure schemes to provide a suitable shielding scheme; finally, select a high-speed high-voltage connector design scheme based on the minimum insertion loss value of the capacitor, the corresponding capacitor, and the requirements.

[0044] Furthermore, such as Figure 8 As shown, the design and optimization of the high-speed high-voltage connector based on EMC performance includes the following steps: Step 1: Based on the selected high-speed high-voltage connector design scheme, establish a finite element analysis parametric model of the EMC performance of the high-speed high-voltage connector in Meshworks.

[0045] Step 2: Use experimental design methods in Hyperstudy to sample and perform contribution analysis on each design variable of the connector to screen out the design variables with significant influence.

[0046] Step 3: Establish a proxy model for EMC performance design optimization of high-speed high-voltage connectors in Isight software, select a suitable hybrid multi-objective optimization algorithm, and introduce Six Sigma theory and design methods.

[0047] Step 4: Combining the surrogate model method and the multi-objective optimization method, a robust and reliable design and optimization method for high-speed high-voltage connectors based on EMC performance is proposed in the Isight multidisciplinary optimization design platform, forming a complete methodological system.

[0048] Step 5: Optimize the design by adopting isolation filtering design to achieve a good grounding environment, implementing electromagnetic interference shielding design, and optimizing the layout of the three-dimensional process design; conduct electrostatic disturbance tests and electromagnetic shielding tests on the structure and scheme before and after optimization.

[0049] Step Six: Perform EMC performance testing on the high-speed high-voltage connector based on EMC design within the frequency range of 1 to 18 GHz to ensure that the high-speed high-voltage connector can work stably and reliably in actual use.

[0050] The technical method of this invention is universally applicable in the design of various high-speed, high-voltage connectors, providing a reliable guarantee for the normal operation of the entire electrical system. The technical solutions involved are detailed and complete, allowing engineers to extract relevant sub-technical solutions according to different design requirements. This invention preferably uses the drop test of a certain slot electrical connector and the differential signal analysis of a certain high-speed connector as examples, extracting the following technical solutions for detailed explanation: This embodiment uses Abaqus / Explicit finite element simulation software and an explicit dynamics solution method to simulate the drop condition of a connector. Specifically, a plastic electrical connector is simulated to be dropped vertically from a height of 1m at a 0° angle to the ground. By analyzing the logarithmic strain diagram and energy curve changes after the impact, the connector's ability to withstand such an impact load is evaluated. In addition, HFSS software is used to simulate a single differential pair to analyze the differential signal behavior of a high-speed connector, and the corresponding simulation results are given in conjunction with the high-speed connector.

[0051] First, such as Figure 9 The diagram shows a three-dimensional structural schematic of an electrical connector for a certain slot. In engineering applications, this component consists of a plastic electrical connector and hundreds of upper and lower rows of metal terminals. PA material is selected as the material for this electronic connector because it is not affected by electromagnetic interference during operation. Parameters such as the material's density (1.57×10-8 tonne / mm3), Poisson's ratio (0.5), and Young's modulus (8381.3 MPa) were considered.

[0052] Next, as Figure 10 As shown, a large number of strain contour maps were output during the entire drop process, which included the strain distribution at multiple moments. Here, only the logarithmic strain contour map corresponding to the peak time frame, i.e., t=0.0002s, is shown. The current moment is when the connector begins to make contact with the ground, and the corresponding maximum strain is 2.369e-02 MPa.

[0053] Secondly, such as Figure 11 The diagram shows the energy output during the connector drop impact process. It can be observed that the total energy is approximately constant, indicating that the energy is well maintained during the drop. Furthermore, compared to real energy indicators such as strain energy (ALLSE), kinetic energy (ALLKE), and total internal energy (ALLIE), the pseudo-strain energy (ALLAE) is negligible, confirming the accuracy of the drop analysis results in this example. Figure 11 It can also be observed that at the beginning of the simulation, the electrical connector undergoes free fall, and the entire model contains only kinetic energy. When the connector contacts the ground, a collision occurs, and the connector deforms, converting kinetic energy into internal energy. Throughout the process, the kinetic energy shows a trend of first decreasing, then increasing, and then decreasing again, while the strain energy shows a trend of first increasing and then decreasing.

[0054] In addition, such as Figure 12 The image shows a 3D structural diagram of a high-speed electrical connector displayed in HFSS software. A 100-ohm differential impedance PCB structure is connected to the upper end of the connector's pins. Using Si9000 calculations, a suitable PCB size was selected so that the differential impedance of the PCB is 100 ohms.

[0055] Finally, as Figure 13 The figure shows the simulation results of the differential signal transmission reflection characteristics. As can be seen from the figure, the trend is consistent with the performance of conventional connectors. According to the SAS 3.0 parameter specifications, Sdd11 should be less than -12dB and Sdd21 should be less than -1dB. The simulation results of this embodiment meet these requirements.

[0056] Compared with existing technical solutions, the present invention has the following advantages: 1. This invention employs methods such as application analysis of drop impact theory for high-speed high-voltage connectors, finite element modeling, influence mechanism analysis, modal performance analysis, and parameter matching to improve the impact reliability of high-speed high-voltage connectors and achieve lightweight design optimization.

[0057] 2. The technical solution of this invention enables a comprehensive analysis and optimization of the electromagnetic compatibility performance of high-speed high-voltage connectors, giving them anti-interference capabilities and the ability to prevent interference. Furthermore, the novel analysis methods and optimization design techniques further improve the electromagnetic compatibility performance of high-speed high-voltage connectors, reduce the risk of electromagnetic interference to external equipment, and enhance the stability and reliability of high-speed high-voltage connectors.

[0058] 3. This invention proposes a performance-driven design approach to address the drop impact performance and EMC performance issues of high-speed high-voltage connectors. It comprehensively considers the impact of drop performance and electromagnetic compatibility performance on the performance of high-speed high-voltage connectors, and conducts a comprehensive technical analysis and exploration, providing a global perspective and technical support for the design of high-speed high-voltage connectors.

[0059] The parts of this invention not described in detail are prior art.

[0060] The embodiments selected herein for the purpose of disclosing the inventive objectives are currently considered suitable; however, it should be understood that the invention is intended to include all variations and modifications of the embodiments that fall within the scope of this concept and invention.

Claims

1. A design method for high-speed high-voltage connectors based on drop-through performance and electromagnetic compatibility technology, characterized by: The design methods include drop impact performance and reliability design optimization of high-speed high-voltage connectors, and EMC performance analysis and design methods of high-speed high-voltage connectors. The drop impact performance and reliability design optimization of high-speed high-voltage connectors includes drop impact theory and application of high-speed high-voltage connectors, finite element modeling and analysis of drop impact performance of high-speed high-voltage connectors, analysis of the impact mechanism of drop impact performance of high-speed high-voltage connectors, modal performance analysis and parameter matching of high-speed high-voltage connectors, and lightweight design optimization of impact reliability of high-speed high-voltage connectors. The EMC performance analysis and design methods of high-speed high-voltage connectors include analysis of electromagnetic compatibility and electromagnetic interference influencing factors of high-speed high-voltage connectors, theory and simulation analysis methods of electromagnetic shielding effectiveness of high-speed high-voltage connectors, analysis of the impact mechanism of EMC performance of high-speed high-voltage connectors based on grey theory, analysis of design schemes of high-speed high-voltage connectors based on EMC performance, and design and optimization of high-speed high-voltage connectors based on EMC performance. The optimization of the drop impact performance and reliability design of the high-speed high-voltage connector specifically includes the following steps: Step 1: Theory and Application of Drop Impact Testing for High-Speed ​​High-Voltage Connectors First, the theory and application analysis of drop impact of high-speed high-voltage connectors are carried out. Combining collision impact theory and explicit dynamics method, the contact collision mechanics model, damage boundary and safety boundary, and drop impact strength conditions of high-speed high-voltage connectors are determined. Step 2: Finite element modeling and analysis of drop impact performance of high-speed high-voltage connectors: Based on theoretical and methodological analysis, a finite element analysis model of the drop impact performance of high-speed high-voltage connectors was established using the ABAQUS finite element analysis platform. Material parameters, contact parameters, and calculation control parameters were determined, and the strain and acceleration of the high-speed high-voltage connectors under different drop heights and angles were calculated and compared with experimental results. At the same time, the drop impact performance of the plug and socket of the high-speed high-voltage connector was analyzed to understand the overall drop impact response after the plug and socket are mated, and the contact performance between the pins and the socket after the collision was analyzed. Step 3: Analysis of the impact mechanism on the drop impact performance of high-speed high-voltage connectors: The entropy weight method and TOPSIS method are introduced to analyze the influence of structural design parameters of high-speed high-voltage connectors on drop impact performance, so as to clarify the influence mechanism of different structural design parameters on the drop impact performance and critical drop height of high-speed high-voltage connectors, screen out the important design parameters and clarify their influence law. Step 4: Modal performance analysis and parameter matching of high-speed high-voltage connectors: This study investigates the relationship between the vibration and impact of a high-speed high-voltage connector model when it is dropped and impacted on the ground, and its natural frequencies and mode shapes. A finite element model for modal analysis of the high-speed high-voltage connector is established, and modal analysis is performed using the Block Lanczos method. The first six modal frequencies and mode shapes are analyzed. If resonance occurs, a matching analysis of design parameters and modal frequencies is performed. Step 5: Optimization of lightweight design for high-speed high-voltage connectors to ensure impact reliability. By taking the key parameters of plugs, pins, and sockets as design variables, a parameterized model of finite element analysis is established. Sampling is carried out using experimental design methods. The three-parameter Weibull distribution theory method is introduced. Combined with surrogate models and multi-objective optimization methods, a lightweight design optimization method for impact reliability of high-speed high-voltage connectors is proposed, forming a complete method system. Simulation and experimental verification are then carried out. The analysis of electromagnetic compatibility and electromagnetic interference influencing factors of the high-speed high-voltage connector specifically includes the following steps: The first step is to conduct theoretical and methodological research on electromagnetic compatibility and electromagnetic interference, analyze the main modes of electromagnetic compatibility and electromagnetic interference of connectors, and, based on the traditional electromagnetic compatibility analysis method and the three elements of interference source, coupling path and sensitive device, adopt new analysis methods, including high frequency characteristics, return path and voltage tolerance, to elaborate on the nature, generation conditions and propagation mechanism of electromagnetic interference and electromagnetic compatibility, and provide guidance for the design parameters of high-speed high voltage connectors. The second step is to analyze the relationship between the magnetic permeability and conductivity of the metal shield of the high-speed high-voltage connector and the absorption loss and reflection loss, and to clarify the attenuation law of high-frequency signals; combined with performance indicators such as shielding efficiency and wave impedance, to explore the electromagnetic compatibility design technology and method of high-speed high-voltage connectors based on shielding technology, grounding technology and filtering technology. The third step is to explain the influence of the material, thickness and structural radius of the shielding body on the shielding performance. At the same time, it analyzes the electromagnetic shielding effect of metal materials such as copper, aluminum, steel and lead as shielding metals in the range of 0 to 100,000 kHz. The fourth step is to investigate the influence of shielding materials, distances, and shielding characteristics, as well as variables such as ungrounded, single-point and multi-point grounding, filter capacitors, filters, and magnetic devices on the EMC performance of high-speed high-voltage connectors, and to screen out the main influencing factors on the electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors.

2. The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology according to claim 1, characterized in that: The theoretical and simulation analysis method for the electromagnetic shielding effectiveness of high-speed high-voltage connectors specifically includes the following steps: The first step involves combining the main influencing factors of connector electromagnetic compatibility and electromagnetic interference, using the theoretical calculation method of shielding effectiveness and the calculation formula of shielding effectiveness of a complete metal plate, and comparing and analyzing the simulation analysis method of EMC performance of high-speed high-voltage connectors. The second step is to use transmission line theory to analyze the impact of shielding discontinuity and termination load on the shielding performance of high-speed high-voltage connectors, and to qualitatively analyze the importance of transfer impedance and pin allocation for improving the electromagnetic compatibility of high-speed high-voltage connectors by combining theoretical analysis and simulation. The third step is to master the shielding principle, structural design, shielding effectiveness testing, thermal protection and reliability design of high-speed high-voltage connectors, and to use HFSS electromagnetic compatibility simulation analysis software to establish a finite element model for EMC performance simulation analysis of high-speed high-voltage connectors and analyze performance indicators such as shielding effectiveness. The fourth step involves comparing and analyzing the experimental test results and validating the model to construct a finite element analysis method for the EMC performance of high-speed high-voltage connectors. A quantitative evaluation standard for the EMC performance of high-speed high-voltage connectors is proposed, forming a set of simulation analysis methods for the EMC performance of high-speed high-voltage connectors. This provides a foundation for research on the impact mechanism of EMC performance on high-speed high-voltage connectors and for design optimization.

3. The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology according to claim 1, characterized in that: The analysis of the EMC performance impact mechanism of high-speed high-voltage connectors based on grey theory specifically includes the following steps: The first step involves analyzing the main influencing factors of electromagnetic compatibility and electromagnetic interference of high-speed high-voltage connectors, and then using the HFSS electromagnetic compatibility simulation analysis software platform to conduct EMC performance simulation analysis of high-speed high-voltage connectors. The second step involves designing different electromagnetic schemes based on factors such as the presence or absence of grounding, absorbing materials, connector material thickness variations, and ventilation holes. The radiated power structure of each scheme is then simulated to investigate its impact on EMC performance, and the schemes are compared. Simultaneously, grey theory, grey relational analysis, and the TOPSIS method are introduced to analyze the impact mechanism on connector EMC performance and identify the optimal scheme. The third step involves analyzing the impact mechanism of characteristic parameters such as rated voltage, rated current, insertion loss, ripple amplitude, cutoff frequency, bandwidth, center frequency, and quality factor on the EMC performance of high-speed high-voltage connectors.

4. The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology according to claim 1, characterized in that: The analysis of the high-speed high-voltage connector design scheme based on EMC performance specifically includes the following steps: The first step is to analyze the parameter requirements of the filter connector based on the actual engineering requirements and technical needs, including the characteristics of the interference source, frequency range, voltage, impedance and other parameters, as well as the requirements of the load characteristics. Based on the results of the requirements analysis, select a suitable filter connector. The second step involves taking a certain type of micro-rectangular plate array filter chip as an example, and using the correlation filtering principle, optimizing and improving the design techniques such as the design of the internal and external electrode patterns of the chip, the selection and matching of dielectric and electrode materials, and the derivation of the actual design parameters of the chip from known indicators. The third step involves using HFSS electromagnetic compatibility simulation analysis software to model and simulate the filter chip of the high-speed high-voltage connector with electromagnetic compatibility, and to analyze the impact of changes in component parameters on the filter connector. Compare and analyze the actual test results of the product to verify the accuracy of the simulation results; The fourth step involves analyzing the working principles, structural characteristics, shielding effectiveness, applicable scope, advantages, and disadvantages of electromagnetic shielding schemes, filter structure schemes, metal shielding cover structure schemes, and cutoff waveguide hole structure schemes to provide suitable shielding solutions. Finally, based on the minimum insertion loss value of the capacitor, the corresponding capacitor, and the requirements, a high-speed high-voltage connector design scheme is selected.

5. The high-speed high-voltage connector design method based on drop performance and electromagnetic compatibility technology according to claim 1, characterized in that: The design and optimization of high-speed, high-voltage connectors based on EMC performance specifically includes the following steps: The first step is to establish a finite element analysis parametric model of the EMC performance of the high-speed high-voltage connector in Meshworks based on the selected high-speed high-voltage connector design scheme. The second step is to use experimental design methods in Hyperstudy to sample and perform contribution analysis on each design variable of the high-speed high-voltage connector, and screen out the design variables with significant influence. The third step is to establish a proxy model for EMC performance design optimization of high-speed high-voltage connectors in Isight software, select a suitable hybrid multi-objective optimization algorithm, and introduce Six Sigma theory and design methods. The fourth step involves combining surrogate modeling and multi-objective optimization methods to propose robust and reliable design and optimization methods for high-speed high-voltage connectors based on EMC performance within the Isight multidisciplinary optimization design platform, forming a complete methodology. Step 5: Implement isolation filtering design to achieve a good grounding environment, perform electromagnetic interference shielding design, and optimize the design with three-dimensional reasonable process layout and other optimization measures; conduct electrostatic disturbance test and electromagnetic shielding test on the structure and scheme before and after optimization.

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