Support assembly, method of manufacturing a support assembly, and display device

By setting metal layer stacks and through-hole grooves on the substrate, the problem of inconvenience in carrying large-size display screens and heat accumulation is solved, achieving the dual effect of support and heat dissipation, and improving the user experience and lifespan of the display device.

CN116997205BActive Publication Date: 2026-07-14AVARY HLDG (SHENZHEN) CO LTD +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AVARY HLDG (SHENZHEN) CO LTD
Filing Date
2022-04-21
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

Existing large-size display screens suffer from problems such as inconvenience in carrying and reduced performance and shortened lifespan due to heat accumulation, especially in flexible OLED foldable display devices where creases and wrinkles are easily generated.

Method used

The support component design employs stacked metal layers and through holes and grooves on the substrate, and combines thermally conductive material to fill the grooves to enhance support and heat dissipation.

Benefits of technology

Support components are provided to prevent wrinkles on the flexible screen, while heat dissipation is effectively achieved through the stacking of metal layers and the use of thermally conductive materials, thereby improving the performance and lifespan of the display device.

✦ Generated by Eureka AI based on patent content.

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    Figure CN116997205B_ABST
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Abstract

The present application provides a support assembly, which includes a substrate, a first metal layer disposed on an upper surface of the substrate, a second metal layer disposed on a lower surface of the substrate, a third metal layer disposed on the first metal layer, and a fourth metal layer disposed on the second metal layer. The support assembly includes a via in a first region of the substrate. The support assembly includes a first recess and a second recess in a second region of the substrate. The support assembly includes a filling material filling the first recess and the second recess. In this way, the support assembly can have a support effect and also have a heat dissipation function.
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