Laser device

Abstract

A laser device includes a support, a first heat sink, a plurality of laser light sources mounted to the support, and a plurality of electrodes erected between the plurality of laser light sources and the first heat sink. Each of the plurality of laser light sources is movable relative to the support. Each of the plurality of electrodes is electrically connected to each of the plurality of laser light sources at a first connection site and thermally connected to the first heat sink at a second connection site. In each of the plurality of electrodes, an extension between the first connection site and the second connection site has flexibility, and a length of the extension is greater than a straight-line distance between the first connection site and the second connection site.

Description

Technical Field

[0001] This invention relates to a laser device. Background Technology

[0002] Patent Document 1 describes a laser array module comprising a cooling manifold, multiple laser array units mounted on the cooling manifold, and multiple lead-out electrodes electrically connected to the multiple laser array units. In the laser array module described in Patent Document 1, multiple lead-out electrodes are respectively arranged in each of the multiple slots formed in the cooling manifold. This achieves efficient cooling for the multiple laser array units and the multiple lead-out electrodes.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2005-268650 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] However, in the laser array module described in Patent Document 1, no special consideration was given to adjusting the position of each laser array unit. Therefore, in order to reliably obtain high-quality light output, it is necessary to improve the assembly accuracy of the constituent components in a way that reduces mechanical errors.

[0008] The purpose of this invention is to provide a laser device that can reliably obtain high-quality light output with a simple structure.

[0009] Technical means to solve the problem

[0010] According to one aspect of the present invention, a laser device comprises: a support body; a first heat sink; a plurality of laser light sources mounted on the support body; and a plurality of electrodes disposed between the plurality of laser light sources and the first heat sink. Each of the plurality of laser light sources is movable relative to the support body. Each of the plurality of electrodes is electrically connected to each of the plurality of laser light sources at a first connection portion and thermally connected to the first heat sink at a second connection portion. In each of the plurality of electrodes, an extension portion between the first connection portion and the second connection portion is flexible, and the length of the extension portion is greater than the straight-line distance between the first connection portion and the second connection portion.

[0011] In this laser device, each laser source can move relative to the support. In each electrode, the extension between the first and second connecting portions is flexible, and the length of the extension is greater than the straight-line distance between the first and second connecting portions. This allows adjustment of the position of each laser source while each electrode is electrically connected to its respective laser source. Furthermore, because each electrode is thermally connected to the first heat sink, degradation of the electrodes caused by heat generation can be suppressed. Therefore, according to this laser device, high-quality light output can be reliably obtained with a simple structure.

[0012] In one aspect of the laser device of the present invention, each of the plurality of electrodes can also be in the form of a sheet. Accordingly, for example, manufacturing can be simplified compared to the case where each electrode is composed of multiple wires. Furthermore, for example, compared to the case where each electrode is composed of multiple wires, the flexibility of the extension portion can be maintained, while suppressing the deterioration of each electrode caused by heat. This is because, in order to suppress the deterioration of the electrode caused by heat in an electrode composed of multiple wires, it is necessary to thicken each wire or increase the number of wires, which would compromise the flexibility of the electrode. Moreover, when each electrode is in the form of a sheet, for example, compared to the case where each electrode is composed of multiple wires, there is an advantage that even if the electrodes are bent or twisted, physical wire breakage is less likely to occur.

[0013] In one aspect of the laser device of the present invention, the extension may also be suspended in the air between the first connecting portion and the second connecting portion. Accordingly, the position of each laser source can be adjusted more easily while each electrode is electrically connected to each laser source.

[0014] In one aspect of the laser device of the present invention, a first refrigerant flow path may also be provided in the first heat sink. Accordingly, the electrodes can be cooled more efficiently.

[0015] In one aspect of the laser device of the present invention, each of the plurality of laser light sources may also have a second heat sink and a semiconductor laser array thermally connected to the second heat sink. Accordingly, the semiconductor laser array can be cooled efficiently in each laser light source. Because the heat generated by the semiconductor laser array is greater than the heat generated by the semiconductor laser in a single unit, the structure using a second heat sink to cool the semiconductor laser array is effective.

[0016] In one aspect of the laser device of the present invention, a second refrigerant flow path may also be provided in the second heat sink. Accordingly, the semiconductor laser array can be cooled more efficiently in each laser source.

[0017] One aspect of the laser device of the present invention may also include a plurality of flexible hoses, each of which is connected to a second refrigerant flow path. Accordingly, the position of each laser source can be more easily adjusted while each electrode is electrically connected to each laser source.

[0018] One aspect of the laser device of the present invention may also include a conductive component, a plurality of laser light sources including a first laser light source and a second laser light source, and a plurality of electrodes including a first electrode electrically connected to the cathode of the first laser light source and a second electrode electrically connected to the anode of the second laser light source, wherein the first electrode and the second electrode are electrically connected by the conductive component. Accordingly, wiring can be simplified, thereby enabling miniaturization of the laser device.

[0019] In one aspect of the laser device of the present invention, the conductive component may also be thermally connected to the first heat sink. Accordingly, it is possible to suppress the deterioration of the conductive component caused by heat generation.

[0020] In one aspect of the laser device of the present invention, the cross-sectional area of ​​the conductive component may also be larger than the cross-sectional areas of the first electrode and the second electrode. Accordingly, the overall resistance of the first electrode, the second electrode, and the conductive component can be reduced, and heat generation as a whole can be suppressed.

[0021] One aspect of the laser device of the present invention may also include an optical element, and a plurality of laser light sources including a third laser light source that emits laser light toward the optical element along a first direction, and a fourth laser light source that emits laser light toward the optical element along a second direction intersecting the first direction. The optical element reflects the laser light emitted from the third laser light source and transmits the laser light emitted from the fourth laser light source. Accordingly, by adjusting the positional relationship between the third laser light source and the fourth laser light source, the laser light emitted from the third laser light source and the laser light emitted from the fourth laser light source can be combined in a desired state.

[0022] In one aspect of the laser device of the present invention, the optical element may also be a mirror. Accordingly, a structure that reflects laser light emitted from a third laser source and transmits laser light emitted from a fourth laser source can be reliably and easily achieved.

[0023] In one aspect of the laser device of the present invention, each of the third and fourth laser light sources may have a plurality of semiconductor laser bars stacked in a third direction intersecting both the first and second directions, and each of the third and fourth laser light sources may be movable relative to the support in the third direction. Accordingly, by adjusting the positional relationship between the third and fourth laser light sources, the gaps between the lasers emitted from the plurality of semiconductor laser bars of the third laser source can be filled using lasers emitted from each of the plurality of semiconductor laser bars of the fourth laser source.

[0024] In one aspect of the laser device of the present invention, the optical element may include: a plurality of light-reflecting portions that reflect laser light emitted from a third laser source; and a plurality of light-transmitting portions that transmit laser light emitted from a fourth laser source, wherein the plurality of light-reflecting portions and the plurality of light-transmitting portions are alternately arranged in a third direction. Accordingly, by adjusting the position of the third laser source, laser light emitted from the third laser source can be reliably incident on the plurality of light-reflecting portions. Furthermore, by adjusting the position of the fourth laser source, laser light emitted from the fourth laser source can be reliably incident on the plurality of light-transmitting portions. As a result, light loss can be suppressed, and high-quality light output can be obtained.

[0025] The laser device of one aspect of the present invention may also include a prism optical system that converges laser beams emitted from multiple laser sources into a defined area. Accordingly, high-quality light output can be obtained in the defined area.

[0026] The effects of the invention

[0027] According to the present invention, a laser device capable of reliably obtaining high-quality light output with a simple structure can be provided. Attached Figure Description

[0028] Figure 1 This is a side view of a laser device according to one embodiment.

[0029] Figure 2 yes Figure 1 A top view of the laser device shown.

[0030] Figure 3 yes Figure 1 A three-dimensional view of the laser source unit shown.

[0031] Figure 4 It is along Figure 3 The cross-sectional view of line IV-IV is shown.

[0032] Figure 5 It is along Figure 4 The cross-sectional view of the V-V line is shown.

[0033] Figure 6 yes Figure 5 The back view of a portion of the laser source unit shown.

[0034] Figure 7 yes Figure 3 The diagram shows a three-dimensional view of the piping unit of the laser source unit.

[0035] Figure 8 yes Figure 3 The diagram shows a three-dimensional view of the piping unit of the laser source unit. Detailed Implementation

[0036] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the drawings, the same or equivalent parts are labeled with the same symbols, and repeated descriptions are omitted.

[0037] [Structure of the laser device]

[0038] like Figure 1 and Figure 2 As shown, the laser device 1 includes a laser source unit 10 and a prism optical system 100. The laser source unit 10 includes a support body 2, multiple laser sources 3A, 3B, 3C, and 3D, multiple slow-axis collimating lenses 4, multiple mirrors (optical elements) 5A and 5B, and multiple slow-axis collimating lenses 6. The multiple laser sources 3A, 3B, 3C, and 3D, the multiple slow-axis collimating lenses 4, the multiple mirrors 5A and 5B, and the multiple slow-axis collimating lenses 6 are supported by the support body 2.

[0039] Multiple mirrors 5A are arranged at intervals along the X-axis. Multiple mirrors 5B are positioned relative to the multiple mirrors 5A on one side of the Y-axis, perpendicular to the X-axis, and are also arranged at intervals along the X-axis. When viewed from the Y-axis, the mirrors 5A and 5B are arranged alternately in the X-axis direction. Hereinafter, the side in the Y-axis direction will be referred to as the "lower side," and its opposite side will be referred to as the "upper side." Furthermore, the side in the Z-axis direction, perpendicular to both the X-axis and Y-axis directions, will be referred to as the "rear side," and its opposite side will be referred to as the "front side."

[0040] Each laser source 3A is positioned above each mirror 5A. Each laser source 3A emits laser light along the Y-axis toward each mirror 5A (i.e., downwards). Figure 1 and Figure 2 (Indicated by dashed lines). Each laser source 3B is positioned behind each mirror 5A. Each laser source 3B emits laser light along the Z-axis toward each mirror 5A (i.e., towards the front). Each mirror 5A reflects the laser light emitted from each laser source 3A toward the front and transmits the laser light emitted from each laser source 3B toward the front.

[0041] Each laser source 3C is positioned below each mirror 5B. Each laser source 3C emits laser light along the Y-axis toward each mirror 5B (i.e., upwards). Each laser source 3D is positioned behind each mirror 5B. Each laser source 3D emits laser light along the Z-axis toward each mirror 5B (i.e., forwards). Each mirror 5B reflects the laser light emitted from each laser source 3C forwards and transmits the laser light emitted from each laser source 3D forwards.

[0042] The details are described below, but each laser source 3A, 3B, 3C, and 3D has the same structure, comprising multiple light-emitting regions arranged in a matrix (illumination omitted). Each laser source 3A is configured to set the X-axis direction as the fast axis direction and the Z-axis direction as the slow axis direction, emitting laser light downwards from each light-emitting region. Each laser source 3B is configured to set the X-axis direction as the fast axis direction and the Y-axis direction as the slow axis direction, emitting laser light forwards from each light-emitting region. Each laser source 3C is configured to set the X-axis direction as the fast axis direction and the Z-axis direction as the slow axis direction, emitting laser light upwards from each light-emitting region. Each laser source 3D is configured to set the X-axis direction as the fast axis direction and the Y-axis direction as the slow axis direction, emitting laser light forwards from each light-emitting region. Furthermore, in this embodiment, the collection of multiple lasers emitted from multiple light-emitting regions in each laser source 3A, 3B, 3C, and 3D is simply referred to as a "laser".

[0043] Multiple slow-axis collimating lenses 4 are configured such that one slow-axis collimating lens 4 is present between each laser source 3A and each mirror 5A, between each laser source 3B and each mirror 5A, between each laser source 3C and each mirror 5B, and between each laser source 3D and each mirror 5B. Each slow-axis collimating lens 4 collimates the laser emitted from each laser source 3A, 3B, 3C, and 3D in the slow-axis direction. Multiple slow-axis collimating lenses 6 are configured such that one slow-axis collimating lens 6 is present in front of each mirror 5A and each mirror 5B. Each slow-axis collimating lens 6 collimates the laser emitted from each mirror 5A and 5B in the slow-axis direction.

[0044] The prism optical system 100 converges the lasers emitted from each slow-axis collimating lens 6 (i.e., the lasers emitted from each laser source 3A, 3B, 3C, 3D) into a solid-state laser medium (defined area) S. The prism optical system 100 shapes the lasers emitted from each slow-axis collimating lens 6 to make the intensity distribution of the laser uniform across the irradiated area in the solid-state laser medium S. As an example, the solid-state laser medium S is irradiated by the laser emitted from the laser device 1 as excitation light, thereby generating emitted light in the resonant optical path of the laser resonator.

[0045] The prism optical system 100 includes multiple prisms 110A and 110B and an imaging optical system 120. The multiple prisms 110A are configured such that the incident surface of one prism 110A is located in front of each slow-axis collimating lens 6 disposed in front of each mirror 5A. The multiple prisms 110B are configured such that the incident surface of one prism 110B is located in front of each slow-axis collimating lens 6 disposed in front of each mirror 5B. Each prism 110A and 110B emits laser beams with the optical axes of each laser beam positioned identically in the Y-axis direction. The imaging optical system 120, for example, is composed of multiple cylindrical lenses and is disposed in front of the multiple prisms 110A and 110B. The imaging optical system 120 converges the laser beams emitted from each prism 110A and 110B onto the solid-state laser medium S.

[0046] [Structure of the laser source unit]

[0047] like Figure 3 , Figure 4 and Figure 5 As shown, in the laser source unit 10, the support 2 includes an upper portion 21, a lower portion 22, and a rear portion 23. The upper portion 21 extends along the X-axis and is located above the rear portion 23. The lower portion 22 extends along the X-axis and is located below the rear portion 23. The rear portion 23 extends along the X-axis and is located behind the upper portion 21 and the lower portion 22. Multiple laser sources 3A and 3B, multiple mirrors 5A, and multiple slow-axis collimating lenses 4 and 6 corresponding to them (hereinafter referred to as "structures related to the multiple laser sources 3A and 3B") are mounted on the upper portion 21 in the above-described positional relationship. Multiple laser sources 3C and 3D, multiple mirrors 5B, and multiple slow-axis collimating lenses 4 and 6 corresponding to them (hereinafter referred to as "structures related to the multiple laser sources 3C and 3D") are mounted on the lower portion 22 in the above-described positional relationship.

[0048] The upper portion 21 has a rearward-facing support surface 21a. The lower portion 22 has a rearward-facing support surface 22a. The rear portion 23 has an upward-facing support surface 23a and a downward-facing support surface 23b. Each support surface 21a, 22a, 23a, and 23b extends along the X-axis direction.

[0049] Multiple laser light sources 3A are mounted on the support surface 21a of the upper portion 21. The laser light sources 3A are arranged at intervals along the X-axis. Multiple laser light sources 3B are mounted on the support surface 23a of the rear portion 23. The laser light sources 3B are arranged at intervals along the X-axis. Multiple laser light sources 3C are mounted on the support surface 22a of the lower portion 22. The laser light sources 3C are arranged at intervals along the X-axis. Multiple laser light sources 3D are mounted on the support surface 23b of the rear portion 23. The laser light sources 3D are arranged at intervals along the X-axis.

[0050] Here, refer to Figure 5 and Figure 6 The structures related to multiple laser light sources 3A and 3B are described. For example... Figure 5 and Figure 6 As shown, each laser source 3A and 3B has a base 31, a heat sink (second heat sink) 32, a semiconductor laser array 33, multiple fast-axis collimating lenses 34, and a pair of terminals 35. The heat sink 32 is fixed to the base 31. The semiconductor laser array 33 is fixed to the heat sink 32 and is thermally connected to the heat sink 32. The multiple fast-axis collimating lenses 34 are fixed to the emission end face of the semiconductor laser array 33 (details will be described later). The pair of terminals 35 are terminals for applying voltage to the semiconductor laser array 33 and are located on both sides of the semiconductor laser array 33 in the X-axis direction.

[0051] A refrigerant flow path (second refrigerant flow path) 36 is provided in the heat sink 32 of each laser source 3A and 3B. Refrigerant (e.g., water) is supplied to the refrigerant flow path 36 via piping (not shown). In the heat sink 32, the refrigerant is introduced from the inlet 36a of the refrigerant flow path 36 and discharged from the outlet 36b of the refrigerant flow path 36 (see figure). Figure 3 ).

[0052] On the support surface 21a of the upper portion 21, multiple pairs of threaded holes 21b are formed in a manner corresponding to the plurality of laser light sources 3A. On the base 31 of each laser light source 3A, a pair of elongated holes 31a are formed in a manner corresponding to a pair of threaded holes 21b, with the X-axis direction set as the long side direction. For each laser light source 3A, a pair of bolts 37 are screwed into each of the pair of threaded holes 21b via each of the pair of elongated holes 31a, thereby mounting each laser light source 3A on the support surface 21a to emit laser light downwards from the semiconductor laser array 33 (in... Figure 5 (Seen in dashed lines). Through this mounting structure, each laser source 3A can move relative to the support 2 in the X-axis direction. Furthermore, in... Figure 6 The illustration of multiple bolts 37 is omitted.

[0053] On the support surface 23a of the rear portion 23, multiple pairs of threaded holes 23c are formed in a manner corresponding to the plurality of laser light sources 3B. On the base 31 of each laser light source 3B, a pair of elongated holes 31a are formed, with the X-axis direction set as the long side, corresponding to a pair of threaded holes 23c. For each laser light source 3B, a pair of bolts 37 are screwed into each of the pair of threaded holes 23c via each of the pair of elongated holes 31a, thereby mounting each laser light source 3B on the support surface 23a to emit laser light forward from the semiconductor laser array 33. With this mounting structure, each laser light source 3B can move relative to the support body 2 in the X-axis direction.

[0054] A laser source (third laser source) 3A emits laser light towards mirror 5A along the Y-axis direction (first direction). The semiconductor laser array 33 of the laser source 3A has multiple semiconductor laser bars 33a stacked along the X-axis direction. Each semiconductor laser bar 33a of the laser source 3A contains multiple light-emitting regions (not shown) arranged along the Z-axis direction. With the X-axis direction designated as the fast axis and the Z-axis direction as the slow axis direction, laser light is emitted from each light-emitting region of the laser source 3A. In the laser source 3A, each fast-axis collimating lens 34 is fixed to the emission end face of each semiconductor laser bar 33a, collimating the laser light emitted from each light-emitting region along the fast axis direction.

[0055] Laser source (fourth laser source) 3B emits laser light towards mirror 5A along the Z-axis direction (second direction). The semiconductor laser array 33 of laser source 3B has multiple semiconductor laser bars 33a stacked along the X-axis direction. Each semiconductor laser bar 33a of laser source 3B includes multiple light-emitting regions (not shown) arranged along the Y-axis direction. Laser light is emitted from each light-emitting region of laser source 3B, with the X-axis direction designated as the fast axis and the Y-axis direction as the slow axis direction. In laser source 3B, each fast-axis collimating lens 34 is fixed to the emission end face of each semiconductor laser bar 33a, collimating the laser light emitted from each light-emitting region along the fast axis direction.

[0056] Mirror 5A has multiple light-reflecting portions 51 and multiple light-transmitting portions 52. Each light-reflecting portion 51 extends in a direction parallel to the intersection of the front and upper main surface 5a of mirror 5A and a plane perpendicular to the X-axis direction. Similarly, the multiple light-transmitting portions 52 extend in a direction parallel to this intersection line. The light-reflecting portions 51 and the light-transmitting portions 52 are arranged alternately in the X-axis direction (a third direction intersecting the first and second directions). As an example, each light-reflecting portion 51 is a highly reflective coating formed along the main surface 5a, and each light-transmitting portion 52 is a slit formed in mirror 5A.

[0057] Multiple light-reflecting sections 51 reflect the laser emitted from the laser source 3A. More specifically, each light-reflecting section 51 reflects the laser emitted downward from each semiconductor laser bar 33a of the laser source 3A forward. Multiple light-transmitting sections 52 transmit the laser emitted from the laser source 3B. More specifically, each light-transmitting section 52 transmits the laser emitted forward from each semiconductor laser bar 33a of the laser source 3B forward.

[0058] The above describes the structures related to multiple laser sources 3A and 3B. The structures related to multiple laser sources 3C and 3D are only point-symmetric to the structures related to multiple laser sources 3A and 3B regarding the center point of the support 2 when viewed from the rear (see reference). Figure 4 Therefore, the description of the structures related to multiple laser light sources 3C and 3D is omitted.

[0059] like Figure 3 , Figure 4 and Figure 5 As shown, the laser source unit 10 also includes a pair of heat sinks (first heat sinks) 7A and 7B, multiple electrodes 8A, 8B, 8C, and 8D, and multiple conductive components 9A, 9B, 9C, and 9D. Heat sink 7A extends along the X-axis direction from the rear side of the upper portion 21 and the upper side of the rear portion 23. Heat sink 7B extends along the X-axis direction from the rear side of the lower portion 22 and the lower side of the rear portion 23. Heat sink 7A is held by a pair of arms 70a extending from a plate 70 erected on the rear side of the support 2 and the rear portion 23. Heat sink 7B is held by another pair of arms 70a extending from the plate 70 and the rear portion 23. Each heat sink 7A and 7B is formed of a metal such as aluminum.

[0060] Each radiator 7A and 7B is provided with a refrigerant flow path (first refrigerant flow path) 71. The refrigerant flow path 71 extends along the X-axis within each radiator 7A and 7B. Refrigerant (e.g., water) is supplied to the refrigerant flow path 71 via piping (not shown). In each radiator 7A and 7B, the refrigerant is introduced from the inlet 71a of the refrigerant flow path 71 and discharged from the outlet 71b of the refrigerant flow path 71.

[0061] Multiple electrodes 8A are mounted between multiple laser light sources 3A and a heat sink 7A. More specifically, each electrode 8A is mounted between a terminal 35 of each laser light source 3A and the upper surface 7a of the heat sink 7A. Each electrode 8A is electrically connected to each laser light source 3A at a first connection point P1 and thermally connected to the heat sink 7A at a second connection point P2. Furthermore, each electrode 8A is fixed to each terminal 35 of each laser light source 3A at the first connection point P1 using bolts (not shown).

[0062] Multiple electrodes 8B are disposed between multiple laser light sources 3B and a heat sink 7A. More specifically, each electrode 8B is disposed between a terminal 35 of each laser light source 3B and the rear surface 7b of the heat sink 7A. Each electrode 8B is electrically connected to each laser light source 3B at a first connection point P1 and thermally connected to the heat sink 7A at a second connection point P2. Furthermore, each electrode 8B is fixed to each terminal 35 of each laser light source 3B at the first connection point P1 using bolts (not shown).

[0063] Multiple electrodes 8C are mounted between multiple laser light sources 3C and a heat sink 7B. More specifically, each electrode 8C is mounted between a terminal 35 of each laser light source 3C and the lower surface 7c of the heat sink 7B. Each electrode 8C is electrically connected to each laser light source 3C at a first connection point P1 and thermally connected to the heat sink 7B at a second connection point P2. Furthermore, each electrode 8C is fixed to each terminal 35 of each laser light source 3C at the first connection point P1 using bolts (not shown).

[0064] Multiple electrodes 8D are disposed between multiple laser light sources 3D and a heat sink 7B. More specifically, each electrode 8D is disposed between a terminal 35 of each laser light source 3D and the rear surface 7b of the heat sink 7B. Each electrode 8D is electrically connected to each laser light source 3D at a first connection point P1 and thermally connected to the heat sink 7B at a second connection point P2. Furthermore, each electrode 8D is fixed to each terminal 35 of each laser light source 3D at the first connection point P1 using bolts (not shown).

[0065] Each electrode 8A, 8B, 8C, and 8D is sheet-shaped. Each electrode 8A, 8B, 8C, and 8D has, for example, a thickness of approximately 100 μm, a width of approximately 8 mm, and a length of approximately 40 mm. Each electrode 8A, 8B, 8C, and 8D is formed, for example, of copper. In each electrode 8A, 8B, 8C, and 8D, the extension 81 between the first connecting portion P1 and the second connecting portion P2 is flexible. The extension 81 of each electrode 8A, 8B, 8C, and 8D is suspended in the air between the first connecting portion P1 and the second connecting portion P2. In each electrode 8A, 8B, 8C, and 8D, the length of the extension 81 is greater than the straight-line distance between the first connecting portion P1 and the second connecting portion P2. Each electrode 8A, 8B, 8C, and 8D has a clearance between the first connecting portion P1 and the second connecting portion P2, and flexes between the first connecting portion P1 and the second connecting portion P2. Each electrode 8A, 8B, 8C, and 8D is mounted with clearance between the first connecting portion P1 and the second connecting portion P2. In this embodiment, each electrode 8A, 8B, 8C, and 8D is a flexible component that can be bent or twisted within the entirety including the extension 81. Furthermore, for each electrode 8A, 8B, 8C, and 8D, since each laser light source 3A, 3B, 3C, and 3D can move relative to the support 2, the position of the first connecting portion P1 changes, and the linear distance between the first connecting portion P1 and the second connecting portion P2 changes. The length of the extension 81 only needs to be greater than the minimum linear distance between the first connecting portion P1 and the second connecting portion P2 (the minimum value within the range within which each laser light source 3A, 3B, 3C, and 3D can move relative to the support 2). It is more preferable if the length of the extension 81 is greater than or equal to the maximum value of the straight-line distance between the first connecting part P1 and the second connecting part P2 (the maximum value within the range in which each laser light source 3A, 3B, 3C, 3D can move relative to the support 2).

[0066] Each conductive component 9A is disposed on the surface 7a of the heat sink 7A. Each conductive component 9A is thermally connected to the heat sink 7A. When considering an adjacent pair of laser light sources 3A, the electrode (first electrode) 8A electrically connected to the cathode (i.e., the terminal 35 on the cathode side) of one laser light source (first laser light source) 3A and the electrode (second electrode) 8A electrically connected to the anode (i.e., the terminal 35 on the anode side) of the other laser light source (second laser light source) 3A are electrically connected using the conductive components 9A. Thus, in the plurality of laser light sources 3A, a plurality of semiconductor laser arrays 33 are electrically connected and connected in series.

[0067] Each conductive component 9B is disposed on the surface 7b of the heat sink 7A. Each conductive component 9B is thermally connected to the heat sink 7A. When considering an adjacent pair of laser light sources 3B, the electrode (first electrode) 8B electrically connected to the cathode (i.e., the terminal 35 on the cathode side) of one laser light source (first laser light source) 3B and the electrode (second electrode) 8B electrically connected to the anode (i.e., the terminal 35 on the anode side) of the other laser light source (second laser light source) 3B are electrically connected using the conductive components 9B. Thus, among the plurality of laser light sources 3B, a plurality of semiconductor laser arrays 33 are electrically connected and connected in series.

[0068] Each conductive component 9C is disposed on the surface 7c of the heat sink 7B. Each conductive component 9C is thermally connected to the heat sink 7B. When considering an adjacent pair of laser light sources 3C, the electrode (first electrode) 8C electrically connected to the cathode (i.e., the terminal 35 on the cathode side) of one laser light source (first laser light source) 3C and the electrode (second electrode) 8C electrically connected to the anode (i.e., the terminal 35 on the anode side) of the other laser light source (second laser light source) 3C are electrically connected using the conductive components 9C. Thus, in the plurality of laser light sources 3C, a plurality of semiconductor laser arrays 33 are electrically connected and connected in series.

[0069] Each conductive component 9D is disposed on the surface 7b of the heat sink 7B. Each conductive component 9D is thermally connected to the heat sink 7B. When considering an adjacent pair of laser light sources 3D, the electrode (first electrode) 8D electrically connected to the cathode (i.e., the terminal 35 on the cathode side) of one laser light source (first laser light source) 3D and the electrode (second electrode) 8D electrically connected to the anode (i.e., the terminal 35 on the anode side) of the other laser light source (second laser light source) 3D are electrically connected using the conductive components 9D. Thus, in the plurality of laser light sources 3D, a plurality of semiconductor laser arrays 33 are electrically connected and connected in series.

[0070] Each conductive component 9A, 9B, 9C, and 9D is plate-shaped. Each conductive component 9A, 9B, 9C, and 9D has, for example, a thickness of approximately 1 mm, a width of approximately 8 mm, and a length of approximately 22 mm. Each conductive component 9A, 9B, 9C, and 9D is, for example, made of copper. The cross-sectional area (area of ​​the cross-section perpendicular to the direction in which the wiring extends) of each conductive component 9A, 9B, 9C, and 9D is greater than the cross-sectional area (area of ​​the cross-section perpendicular to the direction in which the wiring extends) of each electrode 8A, 8B, 8C, and 8D.

[0071] Furthermore, each electrode 8A and each conductive component 9A is disposed on the surface 7a of the heat sink 7A via an insulating plate 72 formed of an electrically insulating material (e.g., aluminum oxide, aluminum nitride, etc.), and is fixed to the surface 7a of the heat sink 7A at each second connection point P2 using bolts 73. Each electrode 8B and each conductive component 9B is disposed on the surface 7b of the heat sink 7A via the insulating plate 72, and is fixed to the surface 7b of the heat sink 7A at each second connection point P2 using bolts 73. Each electrode 8C and each conductive component 9C is disposed on the surface 7c of the heat sink 7B via the insulating plate 72, and is fixed to the surface 7c of the heat sink 7B at each second connection point P2 using bolts 73. Each electrode 8D and each conductive component 9D is disposed on the surface 7b of the heat sink 7B via the insulating plate 72, and is fixed to the surface 7b of the heat sink 7B at each second connection point P2 using bolts 73.

[0072] [Structure of Piping Unit]

[0073] like Figure 4 As shown, a main inlet 24, multiple sub-outlets 25, multiple sub-inlets 26, and a main outlet 27 are formed on the rear surface 23d of the rear portion 23 of the support body 2. The main inlet 24 is located on one side in the X-axis direction. Each sub-outlet 25 is located below each laser source 3B. Each sub-inlet 26 is located above each laser source 3D. The main outlet 27 is located on the other side in the X-axis direction. A refrigerant supply flow path (not shown) is provided in the rear portion 23, through which refrigerant (e.g., water) is introduced from the main inlet 24 and discharged from the multiple sub-outlets 25, and a refrigerant recovery flow path (not shown) is provided, through which refrigerant (e.g., water) is introduced from the multiple sub-inlets 26 and discharged from the main outlet 27. Furthermore, as shown... Figure 3 As shown, a main inlet pipe 11 is connected to the main inlet 24, and a main outlet pipe 12 is connected to the main outlet 27. The main inlet pipe 11 and the main outlet pipe 12 are supported by the rear portion 23 and pass through the hole formed in the plate 70 when separated from the plate 70.

[0074] like Figure 7 and Figure 8 As shown, the laser source unit 10 also includes multiple piping units 13A and 13B. Each piping unit 13A and 13B includes a connector 14, a pair of flexible hoses 15A and 15B, a mating head 16A and 16B, multiple flexible hoses 17A, 17B, 17C, and 17D, and multiple connectors 18A, 18B, 18C, and 18D. Each flexible hose 15A, 15B, 17A, 17B, 17C, and 17D is flexible. Furthermore, in Figure 3 , Figure 4 , Figure 5 and Figure 6 The illustrations of several piping units 13A and 13B are omitted in the text.

[0075] One end of hose 15A is connected to connector 14, and the other end of hose 15A is connected to fitting 16A. One end of hose 15B is connected to connector 14, and the other end of hose 15B is connected to fitting 16B. One end of hose 17A is connected to fitting 16A, and the other end of hose 17A is connected to connector 18A. One end of hose 17B is connected to fitting 16A, and the other end of hose 17B is connected to connector 18B. One end of hose 17C is connected to fitting 16B, and the other end of hose 17C is connected to connector 18C. One end of hose 17D is connected to fitting 16B, and the other end of hose 17D is connected to connector 18D.

[0076] like Figure 7 As shown, the connection part 14 of each piping unit 13A and each sub-outlet 25 (refer to) Figure 4 Connection. The connection part 18A of each piping unit 13A is connected to the inlet 36a of each laser source 3A (refer to...). Figure 3 The connection part 18B of each piping unit 13A is connected to the inlet 36a of each laser source 3B (see reference). Figure 3 Each piping unit 13A has a connecting portion 18C that is connected to the inlet 36a of each laser light source 3C. Each piping unit 13A has a connecting portion 18D that is connected to the inlet 36a of each laser light source 3D. Each hose 17A, 17B, 17C, and 17D of each piping unit 13A is connected to the refrigerant flow path 36 of each laser light source 3A, 3B, 3C, and 3D.

[0077] like Figure 8 As shown, the connection part 14 of each piping unit 13B and each sub-inlet 26 (refer to) Figure 4 Connection. The connection part 18A of each piping unit 13B is connected to the outlet 36b of each laser source 3A (refer to...). Figure 3 The connection portion 18B of each piping unit 13B is connected to the outlet 36b of each laser source 3B (see reference). Figure 3 Each piping unit 13B has a connecting portion 18C connected to the outlet 36b of each laser light source 3C. Each piping unit 13B has a connecting portion 18D connected to the outlet 36b of each laser light source 3D. Each hose 17A, 17B, 17C, and 17D of each piping unit 13B is connected to the refrigerant flow path 36 of each laser light source 3A, 3B, 3C, and 3D.

[0078] In the laser device 1, refrigerant is introduced from the main inlet pipe 11 through the main inlet 24 into the refrigerant supply path of the rear portion 23, and then through each sub-outlet 25 and each piping unit 13A into the refrigerant flow path 36 of each laser source 3A, 3B, 3C, 3D. Then, refrigerant is introduced from the refrigerant flow path 36 of each laser source 3A, 3B, 3C, 3D through each piping unit 13B and each sub-inlet 26 into the refrigerant recovery path of the rear portion 23, and finally discharged from the main outlet pipe 12 through the main outlet 27.

[0079] [Functions and Effects]

[0080] In the laser device 1, each laser source 3A, 3B, 3C, and 3D is movable relative to the support 2. In each electrode 8A, 8B, 8C, and 8D, the extension 81 between the first connecting portion P1 and the second connecting portion P2 is flexible, and the length of the extension 81 is greater than the straight-line distance between the first connecting portion P1 and the second connecting portion P2. Therefore, the positions of each laser source 3A, 3B, 3C, and 3D can be adjusted while each electrode 8A, 8B, 8C, and 8D is electrically connected to each laser source 3A, 3B, 3C, and 3D. Thus, the irradiation pattern of the laser emitted from each laser source 3A, 3B, 3C, and 3D (i.e., the irradiation pattern of the laser that can irradiate the solid-state laser medium S) can be confirmed, and the positions of each laser source 3A, 3B, 3C, and 3D can be adjusted simultaneously. Furthermore, because electrodes 8A and 8B are thermally connected to heat sink 7A, and electrodes 8C and 8D are thermally connected to heat sink 7B, the degradation of electrodes 8A, 8B, 8C, and 8D caused by heat generation can be suppressed. Therefore, according to laser device 1, high-quality light output can be reliably obtained with a simple structure.

[0081] In the laser device 1, each electrode 8A, 8B, 8C, and 8D is in the form of a sheet. This simplifies manufacturing compared to the case where each electrode 8A, 8B, 8C, and 8D is composed of multiple wires. Furthermore, compared to the case where each electrode 8A, 8B, 8C, and 8D is composed of multiple wires, the flexibility of the extension 81 can be maintained, while suppressing the deterioration of each electrode 8A, 8B, 8C, and 8D caused by heat generation. This is because, in order to suppress electrode deterioration caused by heat generation in electrodes composed of multiple wires, it is necessary to thicken the wires or increase the number of wires, which compromises the flexibility of the electrode. Moreover, when each electrode 8A, 8B, 8C, and 8D is in the form of a sheet, for example, compared to the case where each electrode is composed of multiple wires, there is an advantage that even if each electrode 8A, 8B, 8C, and 8D is bent or twisted, physical wire breakage is less likely to occur.

[0082] In the laser device 1, the extensions 81 of each electrode 8A, 8B, 8C, and 8D are suspended in the air between the first connection portion P1 and the second connection portion P2. This allows for easier adjustment of the positions of each laser source 3A, 3B, 3C, and 3D while each electrode 8A, 8B, 8C, and 8D is electrically connected to each laser source 3A, 3B, 3C, and 3D.

[0083] In the laser device 1, a refrigerant flow path 71 is provided in each heat sink 7A and 7B. This allows for more efficient cooling of each electrode 8A, 8B, 8C, and 8D.

[0084] In the laser device 1, each laser source 3A, 3B, 3C, and 3D has a heat sink 32 and a semiconductor laser array 33 thermally connected to the heat sink 32. This allows for efficient cooling of the semiconductor laser array 33 within each laser source 3A, 3B, 3C, and 3D. Since the heat generated by the semiconductor laser array 33 is greater than the heat generated by the individual semiconductor laser components, the structure using the heat sink 32 to cool the semiconductor laser array 33 is effective.

[0085] In the laser device 1, a refrigerant flow path 36 is provided in the heat sink 32. This allows for more efficient cooling of the semiconductor laser array 33 in each laser source 3A, 3B, 3C, and 3D.

[0086] In the laser device 1, flexible hoses 17A, 17B, 17C, and 17D are connected to the refrigerant flow paths 36 of the laser light sources 3A, 3B, 3C, and 3D. This allows for easier adjustment of the positions of the laser light sources 3A, 3B, 3C, and 3D while the electrodes 8A, 8B, 8C, and 8D are electrically connected to them.

[0087] In the laser device 1, multiple semiconductor laser arrays 33 are electrically connected and connected in series in each laser source 3A, 3B, 3C, and 3D using conductive components 9A, 9B, 9C, and 9D. This simplifies the wiring and enables the miniaturization of the laser device 1.

[0088] In the laser device 1, each conductive component 9A and 9B is thermally connected to the heat sink 7A, and each conductive component 9C and 9D is thermally connected to the heat sink 7B. This suppresses the deterioration of the conductive components 9A, 9B, 9C, and 9D caused by heat generation.

[0089] In the laser device 1, the cross-sectional area of ​​each conductive component 9A, 9B, 9C, and 9D is larger than the cross-sectional area of ​​each electrode 8A, 8B, 8C, and 8D. This reduces the overall resistance of the plurality of electrodes 8A and the plurality of conductive components 9A, and suppresses heat generation as a whole. The same applies to the overall distribution of the plurality of electrodes 8B and the plurality of conductive components 9B, the plurality of electrodes 8C and the plurality of conductive components 9C, and the plurality of electrodes 8D and the plurality of conductive components 9D.

[0090] In laser device 1, each mirror 5A reflects laser light emitted from each laser source 3A and transmits laser light emitted from each laser source 3B. Therefore, by adjusting the positional relationship between the corresponding laser sources 3A and 3B, the laser light emitted from laser sources 3A and 3B can be combined in a desired state. Similarly, each mirror 5B reflects laser light emitted from each laser source 3C and transmits laser light emitted from each laser source 3D. Therefore, by adjusting the position of the corresponding laser sources 3C and 3D, the laser light emitted from laser sources 3C and 3D can be combined in a desired state.

[0091] In the laser device 1, each laser source 3A and 3B has multiple semiconductor laser bars 33a stacked along the X-axis, and each laser source 3A and 3B can move relative to the support 2 in the X-axis direction. Therefore, by adjusting the positional relationship between the corresponding laser sources 3A and 3B, the gaps between the lasers emitted from the semiconductor laser bars 33a of the laser source 3B can be filled using the laser emitted from each semiconductor laser bar 33a of the laser source 3A. Similarly, each laser source 3C and 3D has multiple semiconductor laser bars 33a stacked along the X-axis, and each laser source 3C and 3D can move relative to the support 2 in the X-axis direction. Therefore, by adjusting the positional relationship between the corresponding laser sources 3C and 3D, the gaps between the lasers emitted from the semiconductor laser bars 33a of the laser source 3D can be filled using the laser emitted from each semiconductor laser bar 33a of the laser source 3C.

[0092] In the laser device 1, each mirror 5A has multiple light-reflecting portions 51 that reflect laser light emitted from each laser source 3A and multiple light-transmitting portions 52 that transmit laser light emitted from each laser source 3B. In each mirror 5A, the light-reflecting portions 51 and the light-transmitting portions 52 are arranged alternately in the X-axis direction. Therefore, by adjusting the position of each laser source 3A, laser light emitted from each laser source 3A can be reliably incident on each light-reflecting portion 51. Similarly, by adjusting the position of each laser source 3B, laser light emitted from each laser source 3B can be reliably incident on each light-transmitting portion 52. Likewise, each mirror 5B has multiple light-reflecting portions 51 that reflect laser light emitted from each laser source 3C and multiple light-transmitting portions 52 that transmit laser light emitted from each laser source 3D. In each mirror 5B, the light-reflecting portions 51 and the light-transmitting portions 52 are arranged alternately in the X-axis direction. Therefore, by adjusting the position of each laser source 3C, the laser emitted from each laser source 3C can be reliably incident on each light reflecting part 51. Furthermore, by adjusting the position of each laser source 3D, the laser emitted from each laser source 3D can be reliably incident on each light transmitting part 52. As a result, light loss can be suppressed, and high-quality light output can be obtained.

[0093] In the laser device 1, lasers emitted from each laser source 3A, 3B, 3C, and 3D are converged into a solid-state laser medium S by a prism optical system 100. This allows for high-quality light output within the solid-state laser medium S.

[0094] [Variation Example]

[0095] This invention is not limited to the embodiments described above. For example, each electrode 8A, 8B, 8C, and 8D may be flexible at least in the extension portion 81. Each electrode 8A, 8B, 8C, and 8D is not limited to being sheet-like; for example, it may be composed of multiple wires or may have a spring-like extension portion 81. In each electrode 8A, 8B, 8C, and 8D, the extension portion 81 may not be suspended in the air between the first connection portion P1 and the second connection portion P2.

[0096] Alternatively, the refrigerant flow path 71 may not be provided in each heat sink 7A, 7B. Each laser source 3A, 3B, 3C, 3D may also not have a heat sink 32 and a semiconductor laser array 33. For example, each laser source 3A, 3B, 3C, 3D may be composed of a single semiconductor laser unit. In each laser source 3A, 3B, 3C, 3D, the refrigerant flow path 36 may also not be provided in the heat sink 32. Each laser source 3A, 3B, 3C, 3D may also be movable relative to the support 2 in directions other than the X-axis direction. The prism optical system 100 only needs to focus the lasers emitted from each laser source 3A, 3B, 3C, 3D into a designated area.

[0097] The laser source unit 10 may also have other optical elements such as polarizing elements and wavelength combining elements to replace the mirrors 5A and 5B. The polarizing element only needs to reflect the first polarized laser light (e.g., one of P-polarized and S-polarized light) and transmit the second polarized laser light (e.g., the other of P-polarized and S-polarized light), which is different from the first polarized laser light. The wavelength combining element only needs to reflect the first wavelength of laser light and transmit the second wavelength of laser light, which is different from the first wavelength. However, according to mirrors 5A and 5B, a structure that reliably and easily reflects laser light incident along the Y-axis and transmits laser light incident along the Z-axis can be achieved.

[0098] The structures of the above-described embodiments are not limited to the materials and shapes described above, and various materials and shapes can be used. Furthermore, the structures of one embodiment or modification described above can be arbitrarily applied to the structures of other embodiments or modifications.

[0099] Explanation of symbols

[0100] 1…Laser device, 2…Support body, 3A, 3B, 3C, 3D…Laser source, 5A, 5B…Mirror (optical element), 7A, 7B…Heat sink (first heat sink), 8A, 8B, 8C, 8D…Electrode, 9A, 9B, 9C, 9D…Conductive component, 17A, 17B, 17C, 17D…Hose, 32…Heat sink (second heat sink), 33…Semiconductor laser array, 33a…Semiconductor laser rod, 36…Refrigerant flow path (second refrigerant flow path), 51…Light reflecting part, 52…Light transmitting part, 71…Refrigerant flow path (first refrigerant flow path), 81…Extension part, 100…Prism optical system, P1…First connection part, P2…Second connection part, S…Solid-state laser medium (defined area).

Claims

1. A laser device, wherein, have: Support structure; First radiator; Multiple laser light sources are mounted on the support. Multiple electrodes are mounted between the multiple laser light sources and the first heat sink. Each of the plurality of laser light sources is movable relative to the support. Each of the plurality of electrodes is electrically connected to each of the plurality of laser light sources at a first connection point, and thermally connected to the first heat sink at a second connection point. In each of the plurality of electrodes, the extension between the first connection portion and the second connection portion is flexible. The length of the extension is greater than the straight-line distance between the first connecting portion and the second connecting portion. The positions of the plurality of laser light sources can be adjusted while each of the plurality of electrodes is electrically connected to each of the plurality of laser light sources.

2. The laser device according to claim 1, wherein, Each of the plurality of electrodes is in the form of a sheet.

3. The laser device according to claim 1 or 2, wherein, The extension is suspended in the air between the first connecting portion and the second connecting portion.

4. The laser device according to any one of claims 1 to 3, wherein, A first refrigerant flow path is provided in the first radiator.

5. The laser device according to any one of claims 1 to 4, wherein, Each of the plurality of laser light sources has: Second radiator; A semiconductor laser array, which is thermally connected to the second heat sink.

6. The laser device according to claim 5, wherein, A second refrigerant flow path is provided in the second radiator.

7. The laser device according to claim 6, wherein, It also features multiple flexible hoses. Each of the plurality of hoses is connected to the second refrigerant flow path.

8. The laser device according to any one of claims 1 to 7, wherein, It also has conductive components. The plurality of laser sources includes a first laser source and a second laser source. The plurality of electrodes includes a first electrode electrically connected to the cathode of the first laser source and a second electrode electrically connected to the anode of the second laser source. The first electrode and the second electrode are electrically connected using the conductive component.

9. The laser device according to claim 8, wherein, The conductive component is thermally connected to the first heat sink.

10. The laser device according to claim 8 or 9, wherein, The cross-sectional area of ​​the conductive component is larger than the cross-sectional areas of the first electrode and the second electrode.

11. The laser device according to any one of claims 1 to 10, wherein, It also has optical components. The plurality of laser sources includes a third laser source that emits laser light toward the optical element along a first direction, and a fourth laser source that emits laser light toward the optical element along a second direction intersecting the first direction. The optical element reflects the laser emitted from the third laser source and transmits the laser emitted from the fourth laser source.

12. The laser device according to claim 11, wherein, The optical element is a mirror.

13. The laser device according to claim 11 or 12, wherein, Each of the third and fourth laser light sources has a plurality of semiconductor laser bars stacked in a third direction, intersecting the first and second directions. Each of the third and fourth laser light sources is movable relative to the support in the third direction.

14. The laser device according to claim 13, wherein, The optical element has: Multiple light reflectors reflect the laser emitted from the third laser source; Multiple light-transmitting sections transmit the laser light emitted from the fourth laser source. The plurality of light-reflecting portions and the plurality of light-transmitting portions are arranged alternately in the third direction.

15. The laser device according to any one of claims 1 to 14, wherein, It also features a prism optical system that converges laser beams emitted from the plurality of laser sources into a designated area.

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