Heat dissipation device and controller assembly
By using an embedded segment structure between the controller and the cooling device, the problems of poor thermal conductivity and residual thermal conductive material caused by unevenness are solved, achieving efficient heat conduction and easy controller replacement, and extending the service life of electrical components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ROBERT BOSCH GMBH
- Filing Date
- 2022-03-11
- Publication Date
- 2026-07-31
AI Technical Summary
In the prior art, the unevenness between the controller and the cooling device leads to the formation of air gaps, which affects thermal conductivity, and the problem of residual heat-conducting material makes cleaning difficult when replacing the controller.
The structure employs an inlay segment design, including thermally conductive and elastic compensation elements and thermally conductive and low-adhesion contact areas. The inlay segments adapt to surface unevenness, achieving good heat conduction. Furthermore, the inlay segments are non-detachably connected to the inner surface of the accommodating space, avoiding the residue of thermally conductive materials.
It achieves good heat conduction on uneven surfaces, extends the service life of electrical components, simplifies the controller replacement process, and reduces manufacturing costs.
Smart Images
Figure CN116998232B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a heat dissipation device, particularly for a controller assembly in a vehicle. The invention also relates to a controller assembly, particularly for a vehicle, having such a heat dissipation device. Background Technology
[0002] Various heat dissipation techniques are known from the prior art for operating electrical components (e.g., controllers, power output stages, etc.) or individual electrical components (e.g., power semiconductors, microcontrollers, etc.) within a pre-defined temperature range. Here, the thermal connection between the component acting as a heat source and the heat sink (e.g., a cooling device) has a significant impact. Figure 7 The controller assembly 100 shown includes a controller 3 and a heat sink 9. The controller comprises a housing 4 and at least one heat source 7 (e.g., an electrical component 7A disposed on a printed circuit board 6) arranged within the housing 4. The heat sink is implemented as a cooling device 9A, and the controller 3 is detachably connected to the cooling device 9A. Here, at least one heat source 7 is thermally coupled to the housing 4 of the controller 3 via a first thermal interface 8. The first thermal interface 8 may be composed, for example, of a thermally conductive material 8A, also known as a thermal interface material (TIM). Thus, for example, a so-called gap filler, preferably composed of a thermally conductive elastomer, can be arranged as TIM 8A between the heat source 7 and the heat dissipation dome 5.1 constructed at the bottom 5 of the housing 4, forming the first thermal interface 8. Because neither the flat surface of the cooling device 9A nor the bottom 5 of the controller housing 4 facing the cooling device 9A is completely flat, an air gap LS is created when the controller 3 is mounted on the cooling device 9A, except for a few support points in the corresponding fixed area. This air gap, due to its low thermal conductivity, hinders good heat dissipation. (The text abruptly ends here.) Figure 7 As can be seen, the heat dissipation path WAP of at least one heat source 7 is distributed onto the first heat dissipation path WAP1, which dissipates a portion of the heat generated by the heat source towards the cooling device 9A via the bottom 5 of the housing 4 of the controller 3 and the fixed area. The second heat dissipation path WAP2 dissipates a portion of the heat generated by at least one heat source 7 as radiant heat and as heat conduction through air molecules within the air gap LS into the cooling device 9A. It is known in the prior art to use thermally conductive materials, such as thermal paste or gap fillers, to bridge the air gap LS in order to achieve better thermal conductivity between the controller 3 and the cooling device 9A. However, this solution hinders the easy replacement of the controller 3 because residues of the thermally conductive material used are left on the cooling device 9A when the controller 3 is removed, and these residues must first be removed through a tedious cleaning procedure. Furthermore, when assembling to replace the controller, appropriate thermally conductive materials must be provided, and a bubble-free coating that is demanding and difficult to inspect must be implemented. Summary of the Invention
[0003] Both the heat dissipation device and the controller assembly according to the invention have the advantage of compensating for unevenness between the heat source and the heat sink. Here, the insert segments adapt to surface unevenness due to compressible, thermally conductive, and elastic compensating elements. Therefore, a large contact area with uneven mating surfaces is possible, resulting in good heat transfer. Furthermore, since each contaminant particle in the air gap only hinders the contact of individual insert segments, high robustness against contaminants is achieved. This also ensures good heat transfer to all other insert segments. The intermediate spaces of the insert segments can act as "volume buffers." In the case of particles or localized unevenness, these spaces can, for example, be used as volume compensation for an adhesive medium that holds the insert segments within their corresponding receiving spaces. Due to improved heat transfer, the lifespan of electrical devices acting as heat sources can be extended. Furthermore, cheaper materials with poor thermal conductivity can be used for the housing. Moreover, a more economical manufacturing method can be used due to the widened tolerance band. The insert segments can be easily removed from the corresponding surfaces of the heat sink or heat source via the thermally conductive and low-adhesion contact areas of each insert segment.
[0004] The embodiments of the heat dissipation device according to the invention enable compensation for unevenness tolerances relative to the cooling surface, and enable good heat transfer even in the case of uneven surfaces and particles between surfaces, without creating an air gap between the heat source and the cooling device.
[0005] Embodiments of the present invention provide a heat dissipation device, particularly for a controller assembly in a vehicle, having a receiving space open on at least one side and at least one insert segment disposed within the receiving space. The insert segment includes a thermally conductive and resilient compensating element and a thermally conductive and low-adhesion contact area. The at least one insert segment is arranged in the receiving space such that the thermally conductive and resilient compensating element of the at least one insert segment abuts against the inner surface of the bottom of the receiving space, and the thermally conductive and low-adhesion contact area of the at least one insert segment partially extends out of the receiving space on the open side opposite the bottom. Here, the outer surface of the bottom of the receiving space forms a rigid first contact surface for a heat source or heat sink, and the thermally conductive and low-adhesion contact area of the at least one insert segment forms a flexible second contact surface for a heat sink or heat source.
[0006] Furthermore, a controller assembly, particularly for vehicles, is proposed, comprising a controller and a heat sink. The controller includes a housing and at least one heat source disposed within the housing, the heat sink being implemented as a cooling device. The controller and the cooling device are detachably connected, wherein at least one heat source is thermally coupled to the housing of the controller via a first thermal interface. At least one heat dissipation device according to the invention is arranged between the controller and the cooling device, forming a second thermal interface between the housing and the cooling device, and dissipating heat generated by the at least one heat source to the cooling device. Here, heat generated by the at least one heat source is directly dissipated to the cooling device via the first thermal interface, the housing of the controller, and at least one insert forming the second thermal interface.
[0007] Advantageous improvements can be made to the heat dissipation device and controller assembly according to the invention given above by means of the measures and improvements listed below.
[0008] A particular advantage is that at least one insert segment is non-removably connected to the inner surface of the receiving space. At least one insert segment can be connected to the inner surface of the receiving space, for example, by adhesive bonding, welding, brazing, snap-fitting, or riveting.
[0009] In a particularly advantageous design of the heat dissipation device, at least one insert segment can be implemented in multiple parts. Here, the thermally conductive and resilient compensating element of at least one insert segment can preferably be implemented as a gap filler with a thickness, for example, 1 mm to 5 mm. The thermally conductive and low-adhesion contact area of at least one insert segment can preferably be implemented as a small metal plate that can be bonded to the gap filler. The small metal plate of the insert segment can be manufactured, for example, as a stamped or laser-cut part, and has, for example, an edge length between 5 mm and 20 mm and a thickness in the range of 0.1 mm to 1.5 mm. This provides a high degree of geometric freedom, allowing the small metal plate to be easily adapted to requirements in terms of geometry, material selection, and the area ratio of each insert segment to the entire cooling surface. The small metal plate can be made, for example, of aluminum, copper, steel, or other suitable metals. Since the gap filler is extensively covered by the individual small metal plates, and no adhesion occurs between the metals, the thermally conductive and low-adhesion contact area can be easily removed from the metal surface of the cooling device or controller housing. Therefore, for multiple small metal plates, for example, the gap filler can be bonded over a large area to the inner surface of the receiving space. The individual metal plates of the inlay segment can then be bonded to the applied gap filler. This means that multiple inlay segments can share a common thermally conductive and elastic compensating element.
[0010] In an alternative design for the heat dissipation device, at least one insert segment can be implemented as a single piece. Therefore, at least one insert segment may include at least one spring element, which forms a thermally conductive and elastic compensating element. Here, the spring end of at least one spring element may form a thermally conductive and low-adhesion contact area. At least one spring element may be made of, for example, copper, steel, or other suitable metal, and may be welded or riveted to the inner surface of the receiving space. Since there is no adhesive structure between at least one spring element and the metal surface of the cooling device or controller housing, the thermally conductive and low-adhesion contact area can be easily removed again from the corresponding surface.
[0011] In another advantageous design of the heat dissipation device, at least one insert segment can be implemented as a metal foam element, forming a thermally conductive and resilient compensating element. Here, the supporting surface of the metal foam element facing away from the bottom of the receiving space can form a thermally conductive and low-adhesion contact area. The metal foam element can be made of, for example, copper or other suitable metal, and is bonded, welded, brazed, or snap-fitted to the inner surface of the receiving space. Alternatively, at least one insert segment can be implemented as a metal filament element, forming a thermally conductive and resilient compensating element. Here, the supporting surface of the metal filament element facing away from the bottom of the receiving space can form a thermally conductive and low-adhesion contact area. The metal filament element can be made of, for example, copper, steel, or other suitable metal, and can be bonded, welded, or brazed to the inner surface of the receiving space. Since no adhesive structure is formed between the metal foam element or metal filament element and the metal surface of the cooling device or controller housing, the corresponding thermally conductive and low-adhesion contact area can be easily removed again from the corresponding surface.
[0012] In another alternative design of the heat dissipation device, at least one inlay segment can be implemented as a sheet-like structure, also known as "skived fins," and includes multiple thin sheets protruding from the substrate, which form thermally conductive and resilient compensating elements. Here, the substrate can be abutted against the inner surface of the bottom of the receiving space, and the edges of the sheets facing away from the substrate can form thermally conductive and low-adhesion contact areas. As another alternative, at least one inlay segment can be implemented as a metal noppenfolie, which can include multiple noppes protruding from the base surface, which form thermally conductive and resilient compensating elements. Here, the base surface of the metal noppenfolie can be abutted against and bonded to the inner surface of the bottom of the receiving space. The noppes facing away from the base surface can form thermally conductive and low-adhesion contact areas.
[0013] In an advantageous design of the controller assembly, at least one heat dissipation device may have multiple embedded segments and may be formed over a large area in the controller housing or cooling device. Thus, for example, the metal base of the power module can be thermally connected over a large area to the corresponding surface of the cooling device. The cooling device may, for example, have a metal plate with a water-cooled section. Alternatively, multiple heat dissipation devices may be partially distributed and formed in the controller housing or cooling device. This allows for targeted cooling of electrical components that act as heat sources, located at so-called "hot spots."
[0014] In another advantageous design of the controller assembly, a receiving space for at least one heat dissipation device may be formed in a recess in the region of the first thermal interface of the controller housing. Alternatively, a receiving space for at least one heat dissipation device may be formed in a recess in the surface of a cooling device facing the controller, wherein, in the assembled state of the controller assembly, the cooling device is arranged in the region of the first thermal interface of the controller housing.
[0015] Embodiments of the invention are illustrated in the accompanying drawings, and will be explained in more detail in the following description. In the drawings, the same reference numerals describe parts or elements that perform the same or similar functions. Attached Figure Description
[0016] Figure 1 A schematic cross-sectional view of a cut-off portion of a controller assembly according to a first embodiment of the invention is shown, the controller assembly being particularly in a vehicle and having a first embodiment of a heat dissipation device according to the invention;
[0017] Figure 2 A schematic cross-sectional view of a cut-off portion of a second embodiment of a controller assembly according to the invention is shown, the controller assembly being particularly in a vehicle and having a second embodiment of a heat dissipation device according to the invention;
[0018] Figure 3 A schematic cross-sectional view of a cut-off portion of a third embodiment of a controller assembly according to the invention is shown, the controller assembly being particularly in a vehicle and having a third embodiment of a heat dissipation device according to the invention;
[0019] Figure 4 A schematic cross-sectional view of a cut-off portion of a fourth embodiment of a controller assembly according to the invention is shown, the controller assembly being particularly in a vehicle and having a fourth embodiment of a heat dissipation device according to the invention;
[0020] Figure 5 A schematic diagram of the bottom of the housing of a controller for a controller assembly according to the present invention is shown;
[0021] Figure 6A schematic cross-sectional view of a fifth embodiment of a controller assembly according to the invention is shown, the controller assembly being particularly useful in vehicles and having a fifth embodiment of a heat dissipation device according to the invention. Figure 5 The controller in; and
[0022] Figure 7 A schematic cross-sectional view of the controller assembly is shown, particularly in a vehicle, and without the cooling device according to the invention. Detailed Implementation
[0023] As from Figures 1 to 6 As can be seen, the illustrated embodiments of the controller assemblies 1, 1A, 1B, 1C, 1D, and 1E according to the invention, particularly for vehicles, respectively include controllers 3, 3A, and 3B and a heat sink 9. The controller includes a housing 4 and at least one heat source 7 disposed within the housing 4. The heat sink is implemented as a cooling device 9A. Controllers 3, 3A, and 3B are detachably connected to the cooling device 9A. At least one heat source 7 is thermally coupled to the housing 4 of the controller 3 via a first thermal interface 8. Furthermore, at least one heat dissipation device 10, 10A, 10B, 10C, 10D, or 10E according to the invention is arranged between the controllers 3, 3A, and 3B and the cooling device 9A, which forms a second thermal interface 12 between the housing 4 and the cooling device 9A and conducts heat generated by the at least one heat source 7 to the cooling device 9A. Here, the heat generated by at least one heat source 7 is directly dissipated to the cooling device 9A via the first thermal interface 8, the housing 4 of the controller 3, and the second thermal interface 12 through at least one heat dissipation device 10, 10A, 10B, 10C, 10D, 10E.
[0024] In the illustrated embodiment, the cooling device 9A includes a small metal plate having a plurality of channels (not shown) through which water or other suitable coolant is delivered to dissipate heat generated by at least one heat source 7.
[0025] As from Figures 1 to 6It can also be seen that the illustrated embodiments of the heat dissipation devices 10, 10A, 10B, 10C, 10D, and 10E according to the present invention respectively include receiving spaces 11, 11A, 11B, and 11C that are open on at least one side, and at least one inlay segment 14, 14A, 14B, 14C, and 14D arranged in the receiving spaces 11, 11A, 11B, and 11C, the inlay segment including a thermally conductive and elastic compensation element 16 and a thermally conductive and low-adhesion contact area 18. At least one inlay segment 14, 14A, 14B, 14C, 14D is arranged in receiving spaces 11, 11A, 11B, 11C such that the thermally conductive and elastic compensating element 16 of at least one inlay segment 14, 14A, 14B, 14C, 14D abuts against the inner surface of the bottom 11.1 of the receiving spaces 11, 11A, 11B, 11C, and the thermally conductive and low-adhesion contact area 18 of at least one inlay segment 14, 14A, 14B, 14C, 14D partially extends from the receiving spaces 11, 11A, 11B, 11C on the open side opposite the bottom 11.1. Here, the outer surface of the bottom 11.1 of the accommodating spaces 11, 11A, 11B, 11C forms a rigid first contact surface for the heat source 7 or the heat sink 9, and the thermally conductive and low-adhesion contact area 18 of at least one inlay segment 14, 14A, 14B, 14C, 14D forms a flexible second contact surface for the heat sink 9 or the heat source 7.
[0026] As from Figures 1 to 6 It can also be seen that electrical components 7A, 7B, and 7C arranged on the printed circuit board 6 form at least one heat source 7, which is implemented, for example, as a power semiconductor or a microcontroller. Here, at least one heat source 7 is thermally coupled to the housing 4 of the controller 3 via a first thermal interface 8. The first thermal interface 8 may be composed of, for example, a thermally conductive material 8A, also known as a thermal interface material (TIM). Thus, in the illustrated embodiment, for example, a so-called gap filler as TIM 8A is arranged between the heat source 7 and the recess 5.2 formed at the bottom 5 of the housing 4, and forms the first thermal interface 8, which is preferably composed of a thermally conductive elastomer. Here, the receiving spaces 11, 11A, 11B, and 11C of at least one heat dissipation device 10, 10A, 10B, 10C, 10D, and 10E are respectively located in the recess 5.2 in the bottom 5 of the housing 4 of the respective controller 3, 3A, and 3B in the illustrated embodiment.
[0027] In an alternative embodiment of the controller assembly 1 (not shown), a receiving space 11 for at least one heat dissipation device 10 is formed in a recess in the surface of the cooling device 9A facing the controller 3. Here, the recess is located at the cooling device 9A, so that, in the assembled state of the controller assembly 1, the cooling device is positioned in the region of the first thermal interface 8 at the housing 4 of the controller 3.
[0028] As from Figures 1 to 4 and Figure 6 It can also be seen that the heat dissipation path WAP of the heat generated by at least one heat source 7 is distributed on the first heat dissipation path WAP1, which conducts a portion of the heat generated by the at least one heat source 7 to the cooling device 9A via the bottom 5 and fixed area of the housing 4 of the controllers 3, 3A, and 3B. The second heat dissipation path WAP2 conducts a portion of the heat generated by the at least one heat source 7 as radiant heat and as heat conduction through air molecules in the air gap LS to the cooling device 9A. The heat dissipation devices 10, 10A, 10B, 10C, 10D, and 10E form a third heat dissipation path WAP3, which directly conducts a portion of the heat generated by the at least one heat source 7 to the cooling device 9A. In the illustrated embodiment, different embodiments of the heat dissipation devices 10, 10A, 10B, 10C, 10D, and 10E bridge the air gap LS between the controllers 3, 3A, and 3B and the cooling device 9A to achieve better thermal conductivity. Here, when removing controllers 3, 3A, and 3B, heat dissipation devices 10, 10A, 10B, 10C, 10D, and 10E will not leave residue on cooling device 9A, which would otherwise require a tedious cleaning process. Furthermore, thermally conductive materials are not required when assembling or replacing controllers.
[0029] In the illustrated embodiment, each inlay segment 14, 14A, 14B, 14C, 14D is non-removably connected to the inner surface of the corresponding receiving spaces 11, 11A, 11B, 11C via a thermally conductive adhesive connection. This means that the thermally conductive and elastic compensating element 16 is bonded to the corresponding receiving spaces 11, 11A, 11B, 11C. Of course, other suitable connection techniques can also be used to non-removably connect each inlay segment 14, 14A, 14B, 14C, 14D to the inner surface of the corresponding receiving spaces 11, 11A, 11B, 11C.
[0030] As from Figure 1 and Figure 6 It can also be seen that at least one embedded segment 14A is implemented in multiple pieces in the illustrated embodiments of controller assemblies 1A and 1E. Here, in Figure 1 The heat dissipation device 10A shown has only a single inlay segment 14A, while Figure 6The heat dissipation device 10E shown has a plurality of inlay segments 14A arranged side by side. The thermally conductive and elastic compensation elements 16 of the inlay segments 14A are respectively implemented as gap fillers 16A. The thermally conductive and low-adhesion contact areas 18 of the inlay segments 14A are implemented as small metal plates 18A bonded to the gap fillers 16A.
[0031] As from Figures 2 to 4 It can also be seen that at least one inlay segment 14B, 14C, 14D is implemented in one piece in the illustrated embodiments of controller components 1B, 1C, 1D. Here, in Figures 2 to 4 The heat dissipation devices 10B, 10C, and 10D shown in the figure each have only a single inlay segment 14B, 14C, and 14D.
[0032] As from Figure 2 It can also be seen that the shown inlay segment 14B includes a plurality of spring elements 16B, which form a thermally conductive and elastic compensation element 16. Here, the flattened spring ends 18B of the two spring elements 16B form a thermally conductive and low-adhesion contact area 18.
[0033] As from Figure 3 It can also be seen that the shown inlay segment 14C is implemented as a compressible elastic metal foam 16C, which forms a thermally conductive and elastic compensation element 16. Here, the support surface 18C of the metal foam 16C facing away from the bottom 11 of the receiving space 11 forms a thermally conductive and low-adhesion contact area 18.
[0034] As from Figure 4 It can also be seen that the shown inlay segment 14D is implemented as a compressible elastic metal wire 16D, which forms a thermally conductive and elastic compensation element 16. Here, the support surface 18C of the metal wire 16D facing away from the bottom 11.1 of the receiving space 11 forms a thermally conductive contact area 18.
[0035] In an alternative embodiment (not shown) of the heat dissipation device 10, at least one inlay segment 14 is implemented as a sheet structure comprising a plurality of thin sheets protruding from a substrate, the sheets forming thermally conductive and resilient compensating elements 16. Here, the substrate rests against the inner surface of the bottom 11.1 of the receiving space 11, and is preferably bonded to the bottom 11.1 of the receiving space 11 by a thermally conductive adhesive connection. The edges of the sheets facing away from the substrate form thermally conductive and low-adhesion contact areas 18. In another alternative embodiment (not shown) of the heat dissipation device 10, at least one inlay segment 14 is implemented as a metal cushion film comprising a plurality of cushion portions protruding from a base surface, the cushion portions forming thermally conductive and resilient compensating elements 16. Here, the base surface of the metal cushion film rests against the inner surface of the bottom 11.1 of the receiving space 11, and is preferably bonded to the bottom 11.1 of the receiving space 11 by a thermally conductive adhesive connection. The cushion portions facing away from the base surface form thermally conductive and low-adhesion contact areas 18.
[0036] As from Figure 5 It can also be seen that, in the illustrated embodiment, two heat dissipation devices 10E and 10F are partially distributed at the bottom 5 of the controller 3B. Here, the first heat dissipation device 10E includes twelve embedded segments 14A, which are arranged in the first receiving space 11B and are used to dissipate the heat generated by the first electrical component 7B. The second heat dissipation device 10F includes six embedded segments 14A, which are arranged in the second receiving space 11C and are used to dissipate the heat generated by the second electrical component 7C.
[0037] In an embodiment not shown, the heat dissipation device 10 is implemented over a large area with multiple embedded segments 14. Here, the embedded segments 14 are distributed over the entire bottom 5 of the controller 3, so that the controller 3 is thermally connected to the cooling device 9A over a large area for heat dissipation.
Claims
1. Heat sink (10) having a housing space (11) which is open at least on one side and at least one inlay section (14) arranged in the housing space (11), which inlay section comprises a heat-conducting and elastic compensation element (16) and a heat-conducting and low-adhesion contact area (18), wherein The at least one inlay segment (14) is arranged in the receiving space (11) such that the thermally conductive and elastic compensating element (16) of the at least one inlay segment (14) abuts against the inner surface of the bottom (11.1) of the receiving space (11), and the thermally conductive and low-adhesion contact area (18) of at least one inlay segment (14) partially extends from the receiving space (11) on the open side of the receiving space (11) opposite to the bottom (11.1), wherein the outer surface of the bottom (11.1) of the receiving space (11) forms a rigid first contact surface for the heat source (7) or heat sink (9), and the thermally conductive and low-adhesion contact area (18) of the at least one inlay segment (14) forms a flexible second contact surface for the heat sink (9) or the heat source (7).
2. The heat dissipating device (10) according to claim 1, characterized in that The at least one inlay segment (14) is non-detachably connected to the inner surface of the receiving space (11).
3. The heat dissipating device (10) according to claim 1, characterized in that The at least one inlay segment (14) is implemented in multiple pieces.
4. The heat dissipating device (10) according to claim 2, characterized in that The at least one inlay segment (14) is implemented in multiple pieces.
5. The heat dissipating device (10) according to claim 3, characterized in that The thermally conductive and elastic compensation element (16) of the at least one inlay segment (14) is implemented as a gap filler (16A), and the thermally conductive and low-adhesion contact area (18) of the at least one inlay segment (14) is implemented as a metal plate (18A), which is bonded to the gap filler (16A).
6. The heat dissipation device (10) according to claim 1, characterized in that, The at least one inlay segment (14) is implemented in one piece.
7. The heat dissipating device (10) according to claim 2, characterized in that The at least one inlay segment (14) is implemented in one piece.
8. The heat dissipating device (10) according to claim 6, characterized in that The at least one inlay segment (14) includes at least one spring element (16B) forming the thermally conductive and elastic compensation element (16), wherein the spring end (18B) of the at least one spring element (16B) forms the thermally conductive and low-adhesion contact area (18).
9. The heat dissipating device (10) according to claim 6, characterized in that The at least one inlay segment (14) is implemented as a metal foam (16C) forming the thermally conductive and elastic compensation element (16), wherein the support surface (18C) of the metal foam (16C) opposite to the bottom (11.1) of the receiving space (11) forms the thermally conductive and low-adhesion contact area (18).
10. The heat dissipating device (10) according to claim 6, characterized in that The at least one inlay segment (14) is implemented as a metal filament (16D) forming the thermally conductive and elastic compensation element (16), wherein the support surface (18C) of the metal filament (16D) facing away from the bottom (11.1) of the receiving space (11) forms the thermally conductive and low-adhesion contact area (18).
11. The heat dissipating device (10) according to claim 6, characterized in that The at least one inlay segment (14) is implemented as a sheet structure comprising a plurality of thin sheets protruding from a substrate, the thin sheets forming the thermally conductive and elastic compensation element (16), wherein the substrate is abutted against the inner surface of the bottom (11.1) of the receiving space (11), and the edges of the thin sheets opposite to the substrate form the thermally conductive and low-adhesion contact area (18).
12. The heat dissipating device (10) according to claim 6, characterized in that The at least one inlay segment (14) is implemented as a metal cushion film, the metal cushion film including a plurality of cushion portions protruding from the base surface, the cushion portions forming the thermally conductive and elastic compensation element (16), wherein the base surface of the metal cushion film abuts against the inner surface of the bottom (11.1) of the receiving space (11), and the cushion portions opposite to the base surface form the thermally conductive and low-adhesion contact area (18).
13. The heat dissipating device (10) according to any one of claims 1 to 12, characterized in that The heat dissipation device (10) is a heat dissipation device for the controller assembly (1) in the vehicle.
14. A controller assembly (1) having a controller (3) and a heat sink (9), the controller including a housing (4) and at least one heat source (7) disposed within the housing, the heat sink being implemented as a cooling device (9A), wherein, The controller (3) is detachably connected to the cooling device (9A), wherein the at least one heat source (7) is thermally coupled to the housing (4) of the controller (3) through a first thermal interface (8), wherein at least one heat dissipation device (10) is arranged between the controller (3) and the cooling device (9A), the heat dissipation device forming a second thermal interface (12) between the housing (4) and the cooling device (9A), and discharging the heat generated by the at least one heat source (7) to the cooling device (9A), characterized in that the at least one heat dissipation device (10) is implemented according to any one of claims 1 to 13, thereby dissipating the heat generated by the at least one heat source (7) directly to the cooling device (9) via the first thermal interface (8), the housing (4) of the controller (3) and at least one embedded segment (14) forming the second thermal interface (12).
15. A controller assembly (1) according to claim 14, characterized in that The at least one heat dissipation device (10) has multiple embedded segments (14) and is formed over a large area at the housing of the controller (3) or at the cooling device (9).
16. The controller assembly (1) according to claim 14, characterized in that, Multiple heat dissipation devices (10) are partially distributed in the housing of the controller (3) or in the cooling device (9).
17. A controller assembly (1 ) according to any one of claims 14 to 16, characterized in that The receiving space (11) of the at least one heat dissipation device (10) is formed in a recess (5.2) in the region of the first thermal interface (8) of the housing (4) of the controller (3).
18. A controller assembly (1 ) according to any one of claims 14 to 16, characterized in that The receiving space (11) of the at least one heat dissipation device (10) is formed in a recess (5.2) in the surface of the cooling device (9A) facing the controller (3), in the assembled state of the controller assembly (1), the cooling device is arranged in the region of the first thermal interface (8) at the housing (4) of the controller (3).
19. A controller assembly (1 ) according to any one of claims 14 to 16, characterized in that The controller component (1) is a controller component for a vehicle.