Microwave resonant heating system and electronic atomization device, component to be heated
By setting multiple blocks to be heated and a rectangular microwave conductor structure inside the microwave resonant cavity, the problem of uneven microwave heating is solved, achieving a more uniform heating effect and efficient microwave energy utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHENZHEN MERIT TECH CO LTD
- Filing Date
- 2022-04-29
- Publication Date
- 2026-07-17
Smart Images

Figure CN116998779B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic atomization technology, and in particular to a microwave resonant heating system, an electronic atomization device, and a component for heating an object. Background Technology
[0002] Currently, most commercially available electronic atomizing devices, both domestically and internationally, employ electrothermal atomization. This method is based on the principle of heat conduction, which requires time and results in uneven heat distribution due to temperature gradients. Given these drawbacks of electrothermal atomization, those skilled in the art have proposed electronic atomizing devices using microwave resonant heating.
[0003] Because microwave signals are transmitted along microwave conductors, the microwave field generated by the conductors is not uniform along the transmission direction, resulting in poor heating uniformity. Summary of the Invention
[0004] This application provides a microwave resonant heating system, an electronic atomizing device, and a component to be heated, in order to improve the uniformity of microwave heating.
[0005] To address the aforementioned technical problems, this application proposes a microwave resonant heating system. The microwave resonant heating system includes: a microwave resonant heating assembly, comprising: a housing having a microwave resonant cavity formed inside, the housing having an outlet at its open end and an inlet away from the open end and communicating with the microwave resonant cavity; a microwave conductor disposed within the microwave resonant cavity for microwave resonance within the microwave resonant cavity to perform microwave heating; and a component to be heated, disposed between the microwave conductor and the cavity wall of the microwave resonant cavity, the component to be heated comprising multiple blocks to be heated arranged along the interval direction of the inlet and outlet, the microwave absorptivity of the multiple blocks to be heated decreasing sequentially from the inlet to the outlet.
[0006] The spacing between the inlet and outlet is along the length of the microwave conductor.
[0007] The microwave resonant cavity is rectangular, and the microwave conductor is plate-shaped. The microwave conductor includes a first conductor portion, and the object to be heated is disposed between the first conductor portion and the cavity wall. The first conductor portion is parallel to the cavity wall.
[0008] The material density of the multiple blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the multiple blocks to be heated decreases sequentially from the inlet to the outlet.
[0009] The concentration of absorbing particles in multiple heating blocks decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of multiple heating blocks decreases sequentially from the inlet to the outlet.
[0010] The microwave resonant heating assembly further includes: a support member, which is fixedly disposed inside the microwave resonant cavity and is fixedly connected to the microwave conductor for fixing the microwave conductor to the shell.
[0011] The microwave conductor further includes a second conductor section, one end of which is connected to the end of the first conductor section near the entrance, and the other end of which is connected to a microwave signal for impedance matching of the first conductor section.
[0012] The microwave resonant heating component further includes: a microwave feed line, at least partially embedded in the inlet, with one end connected to a microwave signal source and the other end connected to one end of the second conductor.
[0013] The distance between the first conductor portion and the other cavity wall is greater than the distance between the first conductor portion and the cavity wall, wherein the other cavity wall is disposed opposite to the cavity wall.
[0014] To address the aforementioned technical problems, this application proposes an electronic atomization device. This electronic atomization device includes the aforementioned microwave resonant heating system.
[0015] To address the aforementioned technical problems, this application proposes a component to be heated. This component can be heated using a microwave resonant heating assembly. The microwave heating assembly includes a housing and a microwave conductor. A microwave resonant cavity is formed inside the housing. The housing has an outlet at its open end and an inlet away from the open end but communicating with the microwave resonant cavity. The microwave conductor is disposed within the microwave resonant cavity and extends from the inlet towards the open end. The component to be heated is disposed between the microwave conductor and the cavity wall of the microwave resonant cavity. A microwave signal on the microwave conductor is fed in from the inlet, and the microwave absorptivity of the component to be heated decreases along the interval between the inlet and the outlet from the inlet to the outlet.
[0016] The component to be heated includes multiple blocks to be heated arranged along a spacing direction, and the microwave absorption rate of the multiple blocks to be heated decreases sequentially from the inlet to the outlet.
[0017] The material density of the multiple blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the multiple blocks to be heated decreases sequentially from the inlet to the outlet.
[0018] The concentration of absorbing particles in multiple heating blocks decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of multiple heating blocks decreases sequentially from the inlet to the outlet.
[0019] Unlike existing technologies, the microwave resonant heating assembly of this application includes a housing and a microwave conductor. A microwave resonant cavity is formed inside the housing, and the housing also has an outlet at its open end and an inlet away from the open end but communicating with the microwave resonant cavity. The microwave conductor is disposed within the microwave resonant cavity for microwave resonance to perform microwave heating. The object to be heated in this application is disposed between the microwave conductor and the cavity wall of the microwave resonant cavity, and the object to be heated includes multiple blocks arranged along the interval between the inlet and the outlet. The microwave absorption rate of the multiple blocks decreases sequentially from the inlet to the outlet. The microwave signal propagates along the interval between the inlet and outlet on the microwave conductor from the inlet to the outlet, causing the microwave field generated by the microwave conductor to increase sequentially from the inlet to the outlet along the interval between the inlet and the outlet. Therefore, this application divides the component to be heated into multiple blocks to be heated arranged along the interval between the inlet and the outlet, and the microwave absorptivity of the multiple blocks to be heated decreases sequentially from the inlet to the outlet. This allows the blocks to have lower microwave absorptivity at locations with stronger microwave fields and higher microwave absorptivity at locations with weaker microwave fields, thereby improving the uniformity of microwave energy absorption by each block to be heated and improving the uniformity of microwave heating. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:
[0021] Figure 1 This is a schematic diagram of the structure of an embodiment of the microwave resonant heating system of this application;
[0022] Figure 2 yes Figure 1 Exploded structural diagram of a portion of the microwave resonant heating system in the embodiment;
[0023] Figure 3 This is a schematic cross-sectional view of an embodiment of the microwave resonant heating system of this application;
[0024] Figure 4 This is a schematic diagram of the structure of an embodiment of the electronic atomizing device of this application;
[0025] Figure 5 This is a simulation result of the electric field distribution of the microwave resonant heating system with the coaxial microstrip structure of this application;
[0026] Figure 6 This application Figure 5 Simulation results of heat distribution of the component to be heated in the microwave heating resonant system of the embodiment;
[0027] Figure 7 This is a simulation result of the electric field distribution of the microwave resonant heating system with an enlarged spatial coaxial microstrip structure according to this application;
[0028] Figure 8 This application Figure 7 Simulation results of heat distribution of the microwave heating device for the object to be heated (example);
[0029] Figure 9 This is a simulation result of the electric field distribution of the microwave resonant heating system with the coaxial microstrip structure of this application;
[0030] Figure 10 This application Figure 9 The simulation results of heat distribution when a microwave heating device heats multiple heating blocks are shown in the example diagram. Detailed Implementation
[0031] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.
[0032] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0033] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0035] Those skilled in the art have proposed an electronic atomization device for microwave resonant heating. Microwaves can penetrate the interior of the object being heated, and the heating process occurs simultaneously throughout the entire object, resulting in rapid temperature rise. The microwave output power is adjustable at any time, the temperature is uniform, and the temperature gradient is small. No high-temperature medium is required for heat transfer; the vast majority of the microwave energy is absorbed by the object and converted into the heat required for heating. Utilizing the high efficiency of microwave energy, the heat conduction time in conventional heating is significantly shortened. Microwave heating uses electrical energy, which is environmentally friendly.
[0036] However, because the microwave signal is transmitted along the microwave conductor, the microwave field generated by the microwave conductor is not uniform along the transmission direction, resulting in poor heating uniformity.
[0037] To address the aforementioned issues and improve the uniformity of microwave heating, this application proposes a microwave resonant heating system, an electronic atomizing device, and a component to be heated. The microwave resonant heating system, electronic atomizing device, and component to be heated provided in this application will be described in detail below with reference to embodiments.
[0038] This application first proposes a microwave resonant heating system, such as Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram of the structure of an embodiment of the microwave resonant heating system of this application; Figure 2 yes Figure 1An exploded structural diagram of a portion of the microwave resonant heating system in this embodiment. The microwave resonant heating system (not shown) includes: a microwave resonant heating assembly (not shown) and a component to be heated (not shown). The microwave resonant heating assembly includes: a housing 11 and a microwave conductor 12; wherein, a microwave resonant cavity is formed inside the housing 11, and the housing 11 has an outlet 112 located at its open end and an inlet 111 located away from the open end and communicating with the microwave resonant cavity; the microwave conductor 12 is disposed within the microwave resonant cavity for microwave resonance to perform microwave heating; the component to be heated is disposed between the microwave conductor 12 and the cavity wall of the microwave resonant cavity, and the component to be heated includes multiple heating blocks 131 arranged along the interval direction between the inlet 111 and the outlet 112, the microwave absorptivity of the multiple heating blocks 131 decreasing sequentially from the inlet 111 to the outlet 112.
[0039] The cavity wall is the inner wall of the shell 11.
[0040] Microwave conductor 12 receives a microwave signal and resonates within the microwave resonant cavity to emit microwaves into the cavity. The microwaves penetrate the interior of the component to be heated within the cavity, causing vibrations in the molecules and thus raising the temperature of the component. Most of the microwave energy is absorbed by the component and converted into heat, thereby heating the component.
[0041] The inlet 111 is used to feed microwave signals into the microwave conductor 12; the outlet 112 is used to output the mist or aerosol generated by heating the component to be heated in the microwave resonant cavity.
[0042] To prevent microwave signals from leaking out of the outlet 112, the size of the outlet 112 should be limited to an integer multiple of a quarter wavelength of the microwave signal. The outlet 112 can be symmetrically arranged with respect to the projection of the component to be heated onto the cavity wall (i.e., sidewall) where the outlet 112 is located, in order to improve the uniformity of the output of mist or aerosol in the microwave cavity and improve the uniformity of atomization.
[0043] The spacing between the inlet 111 and the outlet 112 is along the length of the microwave conductor 12.
[0044] Unlike existing technologies, in this embodiment, the object to be heated is disposed between the microwave conductor 12 and the cavity wall of the microwave resonant cavity. The object to be heated includes multiple heating blocks 131 arranged along the interval direction between the inlet 111 and the outlet 112, i.e., the length direction of the microwave conductor 12. The microwave absorptivity of the multiple heating blocks 131 decreases sequentially from the inlet 111 to the outlet 112. Because the microwave signal is transmitted along the length direction of the microwave conductor 12 from the inlet 111 to the outlet 112, the microwave field generated by the microwave conductor 12 extends along the inlet 111 and the outlet 112. The spacing of the openings 112 increases sequentially from the inlet to the outlet. Therefore, in this embodiment, the component to be heated is divided into multiple heating blocks 131 arranged along the spacing of the inlet 111 and the outlet 112. The microwave absorptivity of the multiple heating blocks 131 decreases sequentially from the inlet 111 to the outlet 112. This allows the heating blocks 131 in areas with stronger microwave fields to have lower microwave absorptivity, while the heating blocks 131 in areas with weaker microwave fields have higher microwave absorptivity. This improves the uniformity of microwave energy absorption by each heating block 131 and enhances the uniformity of microwave heating.
[0045] The housing 11 is a microwave resonant cavity that can confine microwaves of a specific frequency within the microwave resonant cavity. Electrical and magnetic energy are periodically exchanged to heat the components to be heated within the microwave resonant cavity.
[0046] The housing 11 should have electromagnetic shielding properties to shield microwave signals within the microwave resonant cavity; the housing 11 should also have good thermal insulation properties to reduce heat loss and improve microwave heating effect and efficiency; and the housing 11 should have a certain rigidity to protect the components within its microwave resonant cavity.
[0047] For example, the housing 11 can be a metal housing with a certain rigidity, or a metal layer coated on an outer shell with a certain height, etc.
[0048] A cylindrical microwave resonant cavity is used, with microwave signals fed in from one end and resonating within the cavity. The microwave field distribution within the cavity is non-uniform. Specifically, the microwave field varies radially within the cavity, with higher intensity near the resonant column and lower intensity further away. This results in a highly uneven radial distribution of the microwave field, leading to significant differences in the degree of heating of the component to be heated within the cavity, resulting in extremely poor heating uniformity.
[0049] Therefore, the microwave resonant cavity in this embodiment can be arranged in a rectangular shape, the microwave conductor part can be arranged in a plate shape, the microwave conductor 12 includes a first conductor part 121, and the component to be heated is disposed between the first conductor part 121 and the cavity wall.
[0050] The first conductor section 121 receives a microwave signal and resonates within the microwave resonant cavity to emit microwaves into the microwave resonant cavity. The microwaves can penetrate the interior of the component to be heated within the microwave resonant cavity, causing the molecules inside the component to vibrate, thereby raising the temperature of the component. Most of the microwave energy is absorbed by the component to be heated and converted into the heat required for heating, thus achieving the heating of the component.
[0051] In this embodiment, the first conductor portion 121 used for microwave resonant heating of the component to be heated is arranged as a plate, and the cavity wall is arranged parallel to the first conductor portion 121, so that the microwave field distributed in the space between the cavity wall of the microwave resonant cavity and the first conductor portion 121 is more uniform.
[0052] In particular, since the first conductor portion 121 is arranged as a plate and the cavity wall is arranged parallel to the first conductor portion 121, the microwave field emitted by the first conductor portion 121 toward the cavity wall of the microwave resonant cavity is uniform. In the space between the cavity wall of the microwave resonant cavity and the first conductor portion 121, the microwave field is uniform and there is no divergence or aggregation. This makes the microwave field uniformly distributed along the stacking direction of the first conductor portion 121 and the cavity wall of the microwave resonant cavity and uniformly distributed in the plane parallel to the first conductor portion, thereby improving the uniformity of microwave heating of the component to be heated.
[0053] Alternatively, the microwave resonant cavity can be arranged in a rectangular shape.
[0054] In this embodiment, the first conductor portion 121 is arranged parallel to the cavity wall of the microwave resonant cavity. This structure allows the space between the first conductor portion 121 and the cavity wall of the microwave resonant cavity to be rectangular, which not only improves the uniformity of the microwave field distributed throughout the space but also facilitates the placement of the component to be heated.
[0055] For example, in this embodiment, the length direction of the first conductor portion 121, which is arranged as a plate, is parallel to the length direction of the microwave resonant cavity, which is arranged as a rectangle; the width direction of the first conductor portion 121 is parallel to the width direction of the microwave resonant cavity; and the height direction of the first conductor portion 121 is parallel to the height direction of the microwave resonant cavity. With this structure, the volume of the microwave resonant cavity can be reduced while ensuring the volume of the component to be heated and the heating effect, thereby reducing the volume of the microwave resonant heating system.
[0056] In this application, the cavity wall refers to the top or bottom wall extending along the length and width directions of the microwave resonant cavity. Specifically, in this embodiment, the cavity wall is the bottom wall of the microwave resonant cavity, and the component to be heated is disposed between the first conductor portion 121 and the bottom wall of the microwave resonant cavity.
[0057] As can be seen from the above analysis, in this embodiment, the microwave field is uniformly distributed along the stacking direction (i.e., longitudinal direction) of the first conductor portion 121 and the cavity wall (i.e., bottom wall) of the microwave resonant cavity, so that the component to be heated is uniformly heated along the longitudinal direction, and the microwave field is uniform in the plane parallel to the first conductor portion 121, so that the component to be heated is uniformly heated in the plane parallel to the first conductor portion 121.
[0058] Optionally, in one specific embodiment, the material density of the plurality of heating blocks 131 decreases sequentially from the inlet 111 to the outlet 112, so that the microwave absorption rate of the plurality of heating blocks 131 decreases sequentially from the inlet 111 to the outlet 112.
[0059] Optionally, in another specific embodiment, the concentration of absorbing particles of the plurality of heating blocks 131 decreases sequentially from the inlet 111 to the outlet 112, so that the microwave absorption rate of the plurality of heating blocks 131 decreases sequentially from the inlet 111 to the outlet 112.
[0060] In other embodiments, multiple blocks to be heated can be arranged as a single unit.
[0061] Continue reading Figure 1 and Figure 2 Optionally, the microwave conductor 12 in this embodiment further includes a second conductor portion 122. One end of the second conductor portion 122 is connected to the end of the first conductor portion 121 near the entrance 111, and the other end of the second conductor portion 122 is connected to a microwave signal for impedance matching of the first conductor portion 121.
[0062] In this embodiment, a second conductor section 122 for impedance matching is provided between the inlet 111 and the first conductor section 121, which can reduce microwave signal loss and interference and improve microwave heating efficiency.
[0063] Impedance matching refers to the prevention of reflection at the end of a system or at the connection point of transmission lines with different characteristic impedances during microwave signal transmission. This embodiment includes a second conductor section 122 to prevent microwave reflection between the microwave signal source and the first conductor section 121.
[0064] In this embodiment, impedance matching of the first conductor portion 121 can be achieved by adjusting the size of the second conductor portion 122 of the microwave conductor 12.
[0065] Optionally, in this embodiment, the second conductor portion 122 is provided as a plate. The length direction of the first conductor portion 121 is parallel to the length direction of the second conductor portion 122, the width direction of the first conductor portion 121 is parallel to the width direction of the second conductor portion 122, and the height direction of the first conductor portion 121 is parallel to the height direction of the second conductor portion 122, that is, the second conductor portion 122 is provided parallel to the first conductor portion 121.
[0066] The width direction, length direction, and the stacking direction of the first conductor portion and the cavity wall are perpendicular to each other.
[0067] Specifically, in this embodiment, the second conductor portion 122 is used to achieve impedance matching of the first conductor portion 121. Its specific shape and size change with the size of the first conductor portion 121 to ensure the impedance matching effect.
[0068] Optionally, the inlet 111 is located on another cavity wall of the microwave resonant cavity, i.e., the top wall, and the outlet 112 is located on yet another cavity wall of the microwave resonant cavity, i.e., the side wall. The other cavity wall is located opposite to the cavity wall and perpendicular to the yet another cavity wall.
[0069] The microwave resonant heating system of this embodiment further includes: a microwave feed line 124, which is at least partially embedded in the inlet 111, and one end of the microwave feed line 124 is connected to a microwave signal source, the other end of the microwave feed line 124 is connected to one end of the second conductor portion 122, and the microwave feed line 124 is arranged perpendicularly to the second conductor portion 122.
[0070] In this embodiment, the microwave feed line 124 extends from the inlet 111 to the outside of the housing 11. An insulating layer 125 is also provided around the portion of the microwave feed line 124 located outside the housing 11. This insulating layer 125 can be a polytetrafluoroethylene insulating layer, etc. The insulating layer 125 and the microwave feed line 124 together form the signal input terminal of the microwave resonant heating system.
[0071] The microwave feed line 124 includes a portion disposed inside the inlet of the housing 11 and a portion disposed outside the housing 11, and the insulating layer 125 is laid outside the portion of the microwave feed line 124 disposed outside the housing 11.
[0072] Optionally, the first conductor portion 121 and the second conductor portion 122 in this embodiment can be integrally formed and implemented through a single microstrip line.
[0073] In this embodiment, both the first conductor portion 121 and the second conductor portion 122 are plate-shaped, meaning their height is less than their length and length.
[0074] Optionally, the distance between the first conductor portion 121 and another cavity wall, i.e., the top wall, is greater than the distance between the first conductor portion 121 and the cavity wall, i.e., the bottom wall, wherein the other cavity wall is disposed opposite to the cavity wall. In this way, the microwave field intensity between the first conductor portion 121 and the bottom wall can be increased, thereby improving the microwave heating efficiency.
[0075] In this embodiment, the first conductor portion 121 can be directly connected to the top wall of the cavity wall.
[0076] In other embodiments, the housing may also be a ceramic housing with a low dielectric constant, on which a metal layer is deposited.
[0077] In this embodiment, the projection of the first conductor portion 121 on the bottom wall completely overlaps with the projection of the component to be heated on the bottom wall, so as to make full use of the microwave field of the first conductor portion 121.
[0078] Optionally, the microwave resonant heating system of this embodiment further includes: a support member 14, which is fixedly disposed in the microwave resonant cavity, and the support member 14 is fixedly connected to the microwave conductor 12 for fixing the microwave conductor 12 to the housing 11.
[0079] The support 14 not only secures the component to be heated, but also provides an air passage and increases heat dissipation.
[0080] Specifically, the support member 14 is plate-shaped and has grooves (through holes) for fixing the first conductor part 121 and the second conductor part 122.
[0081] In another embodiment, such as Figure 3 As shown, the support member 34 is disposed between the microwave conductor 12 and another cavity wall of the microwave resonant cavity, i.e., the top wall, and the support member 34 is fixedly disposed with the other cavity wall to fix the microwave conductor 12 to the housing 11; wherein, the other cavity wall and the cavity wall, i.e. the bottom wall, are disposed opposite to each other.
[0082] The aforementioned support component can be a dielectric plate with a low dielectric constant to reduce microwave loss, such as a ceramic plate.
[0083] The ceramic plate can also be provided with multiple through holes to increase the contact area between the gas in the microwave resonant cavity and the component to be heated, thereby improving its atomization effect.
[0084] In other embodiments, the housing may also be a ceramic housing with a low dielectric constant, on which a metal layer is deposited.
[0085] Other structures and working principles of this embodiment can be found in the above embodiments, and will not be repeated here.
[0086] In this embodiment, the dimension of the object to be heated assembly along the length of the first conductor portion 121 is smaller than the length of the first conductor portion 121. Since the microwave signal propagates along the length of the first conductor portion 121 to the end of the first conductor portion 121 near the outlet 112, the microwave field increases sequentially along the length of the first conductor portion 121 from the inlet 111 to the outlet 112. To further improve the microwave heating efficiency, the object to be heated assembly can be correspondingly positioned in a section of the first conductor portion 121 near the outlet 112.
[0087] In this embodiment, the dimension of the first conductor portion along the width direction is greater than or equal to the dimension of the component to be heated along the width direction. The component to be heated is only subjected to microwaves emitted from the side of the first conductor portion near the bottom wall, which can further improve the heating uniformity of the component to be heated.
[0088] In this embodiment, the width of the microwave conductor is smaller than the width of the microwave resonant cavity to provide an air passage.
[0089] In this embodiment, the material to be heated can be tobacco or other materials that can be atomized by heating, such as traditional Chinese medicine.
[0090] This application further proposes an electronic atomizing device, such as Figure 4 As shown, Figure 4 This is a schematic diagram of the structure of an embodiment of the electronic atomizing device of this application. The electronic atomizing device of this embodiment includes: a microwave resonant heating system 51, a main body 52, a battery 53, a controller (not shown), a microwave generator (not shown), etc.
[0091] The structure and working principle of the microwave resonant heating system 51 can be found in the above embodiments, and will not be repeated here.
[0092] The controller and microwave generator can be mounted on circuit board 54. The microwave generator is connected to the controller and the microwave conductor in the microwave resonant heating system 51, respectively, and is used to generate microwave signals of characteristic frequency under the control of the controller.
[0093] Battery 53 is connected to the controller and microwave generator to provide power to them. The microwave resonant heating system 51, battery 53, controller, microwave generator and circuit board are housed inside the main body 52; the main body 52 has an opening for inserting the component 13 to be heated.
[0094] The microwave generator can be implemented using a magnetron or an oscillating circuit.
[0095] This application further proposes a heating assembly that can be heated using the aforementioned microwave resonant heating assembly. The microwave heating assembly includes a housing and a microwave conductor. A microwave resonant cavity is formed inside the housing. The housing has an outlet at its open end and an inlet away from the open end and communicating with the microwave resonant cavity. The microwave conductor is disposed inside the microwave resonant cavity and extends from the inlet to the open end. The heating assembly is disposed between the microwave conductor and the cavity wall of the microwave resonant cavity. The microwave signal on the microwave conductor is fed in from the inlet, and the microwave absorptivity of the heating assembly decreases sequentially from the inlet to the outlet.
[0096] Optionally, the assembly to be heated includes a plurality of blocks to be heated arranged along a spacing direction, wherein the microwave absorptivity of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet.
[0097] Because the microwave signal is transmitted from the inlet to the outlet along the interval between the inlet and outlet of the shell on the microwave conductor, the microwave field generated by the microwave conductor is successively enhanced from the inlet to the outlet along the interval between the inlet and the outlet. Therefore, in this embodiment, the component to be heated is divided into multiple blocks to be heated arranged along the interval between the inlet and the outlet, and the microwave absorptivity of the multiple blocks to be heated decreases from the inlet to the outlet. This makes the microwave absorptivity of the blocks to be heated where the microwave field is stronger lower, and the microwave absorptivity of the blocks to be heated where the microwave field is weaker higher, thereby improving the uniformity of microwave energy absorption by each block to be heated and improving the uniformity of microwave heating.
[0098] The material to be heated can be tobacco or other materials that can be atomized by heating, such as traditional Chinese medicine.
[0099] Optionally, the material density of the multiple blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the multiple blocks to be heated decreases sequentially from the inlet to the outlet.
[0100] The material density of the multiple blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the multiple blocks to be heated decreases sequentially from the inlet to the outlet.
[0101] For example, the tobacco density of the tobacco block closest to the outlet among multiple tobacco blocks to be heated can be 0.28 g / cm³. 3 The tobacco density of the tobacco block near the entrance can be 1.11 g / cm³. 3 Furthermore, the tobacco density of the multiple tobacco blocks to be heated decreases sequentially from the inlet to the outlet along the interval between the inlet and outlet. Different tobacco densities result in different dielectric constants, thus achieving different microwave absorption rates.
[0102] Optionally, the concentration of absorbing particles in the multiple heating blocks decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the multiple heating blocks decreases sequentially from the inlet to the outlet.
[0103] The concentration of absorbing particles in multiple heating blocks decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the multiple heating blocks decreases sequentially from the inlet to the outlet.
[0104] For example, different concentrations of carbon particles can be added to different tobacco blocks to achieve different concentrations of absorbing particles in different tobacco blocks. Among multiple tobacco blocks to be heated, the tobacco block near the outlet has the lowest concentration of carbon particles, while the tobacco block near the inlet has the highest concentration of carbon particles. Furthermore, the concentration of carbon particles added to multiple tobacco blocks to be heated decreases sequentially from the inlet to the outlet along the interval between the inlet and the outlet.
[0105] Of course, in other embodiments, the microwave absorption rate of multiple heating blocks can be reduced sequentially from the inlet to the outlet by combining the material density of the heating blocks and the concentration of absorbing particles.
[0106] In other embodiments, the object to be heated can be a single unit, i.e., multiple blocks to be heated are integrated into one unit.
[0107] For other technical solutions regarding the components to be heated, please refer to the above embodiments.
[0108] like Figures 5 to 8 As shown, Figure 5 This is a simulation result of the electric field distribution of the microwave resonant heating system with the coaxial microstrip structure of this application; Figure 6 This application Figure 5 Simulation results of heat distribution of the component to be heated in the microwave resonant heating system of the embodiment; Figure 7 This is a simulation result of the electric field distribution of the microwave resonant heating system with an enlarged spatial coaxial microstrip structure according to this application; Figure 8 This application Figure 7 The simulation results of the heat distribution of the microwave resonant heating system for the object to be heated are shown in the figure. It can be seen that when the microwave heating device of this application is used to microwave heat the object to be heated, the heating energy and temperature of the object to be heated are relatively uniform along the spacing direction between the first conductor and the cavity wall and in the plane parallel to the first conductor.
[0109] Entering a place, such as Figure 9 and Figure 10 As shown, Figure 9 This is a simulation result of the electric field distribution of the microwave resonant heating system with the coaxial microstrip structure of this application; Figure 10 This application Figure 9 The simulation results of the heat distribution of the microwave resonant heating system heating multiple heating blocks in the embodiment are shown in the figure. It can be seen that the component to be heated is divided into multiple heating blocks arranged along the interval between the inlet and outlet of the shell, and the microwave absorptivity of the multiple heating blocks decreases sequentially from the inlet to the outlet, which can improve the uniformity of microwave energy absorption by each heating block and improve the uniformity of microwave heating.
[0110] Unlike existing technologies, the microwave resonant heating assembly of this application includes a housing and a microwave conductor. A microwave resonant cavity is formed inside the housing, and the housing also has an outlet at its open end and an inlet away from the open end but communicating with the microwave resonant cavity. The microwave conductor is disposed within the microwave resonant cavity for microwave resonance to perform microwave heating. The object to be heated in this application is disposed between the microwave conductor and the cavity wall of the microwave resonant cavity, and the object to be heated includes multiple blocks arranged along the interval between the inlet and the outlet. The microwave absorption rate of the multiple blocks decreases sequentially from the inlet to the outlet. The microwave signal propagates from the inlet to the outlet along the interval direction of the microwave conductor, causing the microwave field generated by the microwave conductor to increase sequentially from the inlet to the outlet along the interval direction. Therefore, this application divides the component to be heated into multiple blocks to be heated arranged along the interval direction of the inlet and outlet, and the microwave absorptivity of the multiple blocks to be heated decreases sequentially from the inlet to the outlet. This allows the blocks to have lower microwave absorptivity at locations with stronger microwave fields and higher microwave absorptivity at locations with weaker microwave fields, thereby improving the uniformity of microwave energy absorption by each block to be heated and improving the uniformity of microwave heating.
[0111] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A microwave resonant heating system, characterized in that, include: A microwave resonant heating assembly, comprising: A housing having a microwave resonant cavity formed inside it, the housing having an outlet at its open end and an inlet away from the open end and communicating with the microwave resonant cavity; A microwave conductor is disposed within the microwave resonant cavity to perform microwave resonance within the microwave resonant cavity for microwave heating. The object to be heated is disposed between the microwave conductor and the cavity wall of the microwave resonant cavity. The object to be heated includes a plurality of blocks to be heated arranged along a spacing direction from the inlet to the outlet. The microwave absorptivity of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet. The microwave conductor is plate-shaped and includes a first conductor portion. The object to be heated is disposed between the first conductor portion and the cavity wall, and the first conductor portion is parallel to the cavity wall. The microwave conductor further comprises: The second conductor section has one end connected to the end of the first conductor section near the inlet, and the other end connected to a microwave signal for impedance matching of the first conductor section. The first conductor portion is used to emit microwaves to the assembly to be heated.
2. The microwave resonant heating system according to claim 1, characterized in that, The direction of the interval from the inlet to the outlet is the length direction of the microwave conductor.
3. The microwave resonant heating system according to claim 1, characterized in that, The material density of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet.
4. The microwave resonant heating system according to claim 1, characterized in that, The concentration of absorbing particles in the plurality of blocks to be heated decreases sequentially from the inlet to the outlet, so that the microwave absorption rate of the plurality of blocks to be heated decreases sequentially from the inlet to the outlet.
5. The microwave resonant heating system according to any one of claims 1 to 4, characterized in that, The microwave resonant heating assembly further includes: A support member is fixedly disposed inside the microwave resonant cavity. The support member is fixedly connected to the microwave conductor and is used to fix the microwave conductor to the housing.
6. The microwave resonant heating system according to any one of claims 1 to 4, characterized in that, The microwave resonant heating assembly further includes: The microwave feed line is at least partially embedded in the inlet, with one end connected to the microwave signal source and the other end connected to one end of the second conductor.
7. The microwave resonant heating system according to any one of claims 1 to 4, characterized in that, The distance between the first conductor portion and the other cavity wall is greater than the distance between the first conductor portion and the cavity wall, wherein the other cavity wall is disposed opposite to the cavity wall.
8. An electronic atomizing device, characterized in that, Includes the microwave resonant heating system according to any one of claims 1 to 7.