Temperature testing system and temperature testing method thereof

Abstract

The present application provides a temperature testing system and a temperature testing method thereof. In the temperature testing system, a standard sensor senses a standard ambient temperature to generate a reference value. A device under test senses an operating temperature to generate a test value. A processor obtains a first offset value according to a difference between the reference value and a corresponding standard ambient temperature, and generates a first correction curve according to the first offset value and the reference value. The processor adjusts the test value according to the first offset value to obtain a second correction value. The processor calculates a predicted temperature value according to the second correction value and the standard ambient temperature. The processor generates a second offset value according to a difference between the predicted temperature value and the corresponding standard ambient temperature. The processor adjusts the predicted temperature value according to the second offset value, and generates a second correction curve according to the adjusted predicted temperature value.

Description

Technical Field

[0001] This invention relates to a temperature testing technology, and more particularly to a temperature testing system and a temperature testing method thereof. Background Technology

[0002] For temperature testing technology of integrated circuits, the existing temperature testing system usually only uses a temperature sensor to sense the ambient temperature and uses the sensed ambient temperature to correct the temperature profile of the device under test (i.e., the integrated circuit under test).

[0003] However, as the requirements for temperature accuracy become increasingly stringent, existing temperature testing methods still suffer from significant temperature errors, leading to a decrease in the yield rate of temperature testing technologies. Therefore, how to effectively implement accurate temperature testing technology for integrated circuits to reduce yield losses due to temperature testing is an important issue for those skilled in the art. Summary of the Invention

[0004] This invention provides a temperature testing system and a temperature testing method, which can effectively improve the yield rate of the device under test when performing temperature testing.

[0005] The temperature testing system of the present invention includes a standard sensor, a device under test (DUT), and a processor. The standard sensor senses multiple standard ambient temperatures to generate multiple reference values. The DUT senses multiple operating temperatures to generate multiple test values. The processor is coupled to the DUT and the temperature sensor, wherein the processor is configured to: obtain a first offset value based on the difference between one of the multiple reference values ​​and the corresponding standard ambient temperatures; generate a first correction curve based on the first offset value and the multiple reference values; adjust the multiple test values ​​based on the first offset value to obtain multiple second correction values; calculate multiple predicted temperature values ​​based on the multiple second correction values ​​and the multiple standard ambient temperatures; calculate the difference between one of the multiple predicted temperature values ​​and the corresponding standard ambient temperatures to generate a second offset value; and adjust the multiple predicted temperature values ​​based on the second offset value, and generate a second correction curve based on the adjusted multiple predicted temperature values.

[0006] The temperature testing method of the temperature testing system of the present invention includes: providing a standard sensor to sense multiple standard ambient temperatures to generate multiple reference values; providing a device under test to sense multiple operating temperatures to generate multiple test values; a processor obtaining a first offset value based on the difference between one of the multiple reference values ​​and the corresponding standard ambient temperatures, and generating a first correction curve based on the first offset value and the multiple reference values; the processor adjusting the multiple test values ​​based on the first offset value to obtain multiple second correction values; the processor calculating multiple predicted temperature values ​​based on the multiple second correction values ​​and the multiple standard ambient temperatures; the processor calculating the difference between one of the multiple predicted temperature values ​​and the corresponding standard ambient temperatures to generate a second offset value; and the processor adjusting the multiple predicted temperature values ​​based on the second offset value, and generating a second correction curve based on the adjusted multiple predicted temperature values.

[0007] Based on the above, in the temperature testing system and method described in the embodiments of the present invention, after completing the first temperature correction operation, the processor can further generate a second correction curve based on the second correction value, the third correction value, and multiple test values ​​generated by the device under test, through an objective function, thereby performing a second temperature correction operation on the temperature testing system. In this way, the processor can make the second correction curve closer to the standard temperature curve, thereby improving the yield rate of the temperature testing system when performing temperature testing on the device under test and reducing yield loss during temperature testing. Attached Figure Description

[0008] Figure 1 This is a schematic diagram illustrating a temperature testing system according to an embodiment of the present invention.

[0009] Figures 2A to 2C According to the present invention Figure 1 A schematic diagram of multiple temperature profiles in one embodiment.

[0010] Figures 3A to 3B According to the present invention Figure 1 A schematic diagram of multiple temperature profiles in another embodiment.

[0011] Figure 4 This is a flowchart illustrating a temperature testing method according to an embodiment of the present invention. Detailed Implementation

[0012] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same component symbols are used in the drawings and description to denote the same or similar parts.

[0013] The term "coupled (or connected)" as used throughout this specification (including the claims) may refer to any direct or indirect means of connection. For example, if the text describes a first device coupled (or connected) to a second device, it should be interpreted as the first device being directly connected to the second device, or the first device being indirectly connected to the second device via other devices or some means of connection. Furthermore, wherever possible, components / components / steps using the same reference numerals in the drawings and embodiments represent the same or similar parts. Components / components / steps using the same reference numerals or the same terminology in different embodiments may be referred to mutually in the relevant descriptions.

[0014] Figure 1 This is a schematic diagram illustrating a temperature testing system according to an embodiment of the present invention. Please refer to... Figure 1 The temperature testing system 100 includes a standard sensor 110, a device under test (DUT) 120, a memory 130, and a processor 140. In this embodiment, the standard sensor 110 may be, for example, a temperature sensor, and the DUT 120 may be, for example, an integrated circuit to be tested, but is not limited thereto.

[0015] In this embodiment, the standard sensor 110 can be used to sense multiple standard ambient temperatures T1 to TN (i.e., actual ambient temperatures) in the environment, and generate multiple reference values ​​RF1 to RFN accordingly based on the sensed multiple standard ambient temperatures T1 to TN. The device under test 120 can be used to sense multiple operating temperatures of the device under test 120, and generate multiple test values ​​TS1 to TSN accordingly based on the sensed multiple operating temperatures. The device under test 120 can obtain multiple different operating temperatures by inputting multiple different voltages, and its implementation details and related operations are well known to those skilled in the art, and therefore will not be described further here. Here, N is a positive integer.

[0016] The memory 130 is coupled to the standard sensor 110 and the device under test (DUT) 120. The memory 130 can be used to store multiple reference values ​​RF1 to RFN and multiple test values ​​TS1 to TSN. The memory 130 can be located inside or outside the DUT 120; this invention is not particularly limited. In this embodiment, the memory 130 can be, for example, a resistive random-access memory (RRAM), a ferroelectric RAM (FeRAM), a magnetoresistive RAM (MRAM), a phase-change RAM (PRAM), a conductive bridge RAM (CBRAM), any type of fixed or removable random access memory (RAM), read-only memory (ROM), or flash memory.

[0017] On the other hand, processor 140 is coupled to memory 130. Processor 140 can receive (or read) reference values ​​RF1 to RFN and test values ​​TS1 to TSN from memory 130. In this embodiment, processor 140 can analyze and perform calculations on these reference values ​​RF1 to RFN and these test values ​​TS1 to TSN to generate calibration curves CV1 and CV2 associated with the device under test 120.

[0018] Figures 2A to 2C According to the present invention Figure 1 A schematic diagram of multiple temperature profiles in one embodiment. Please also refer to... Figure 1 as well as Figure 2A In this embodiment, the processor 140 can obtain a standard temperature curve STC between the operating temperature of the temperature testing system 100 and the operating voltage of the temperature testing system 100 based on multiple standard ambient temperatures T1 to TN. After the standard sensor 110 stores the reference values ​​RF1 to RFN in the memory 130, the processor 140 can obtain a first temperature curve TC1 between the operating temperature and the operating voltage based on these reference values ​​RF1 to RFN.

[0019] Among them, Figure 2A In this context, the standard temperature curve STC can be used to represent the ideal temperature state in the environment, while the first temperature curve TC1 can be used to represent the actual temperature state sensed by the standard sensor 110 in the environment.

[0020] Next, please refer to the following: Figure 1 as well as Figure 2B The processor 140 can obtain a first offset value OFFSET1 between the first temperature curve TC1 and the standard temperature curve STC by using the difference between one of the reference values ​​RF1 to RFN on the first temperature curve TC1 and the corresponding standard ambient temperatures T1 to TN on the standard temperature curve STC. For example, the processor 140 can use the standard ambient temperature of 25 degrees (°C) on the standard temperature curve STC as a reference value, determine the reference value corresponding to the standard ambient temperature of 25°C on the first temperature curve TC1, and subtract the reference value from the reference value to obtain the offset value OFFSET1 between the first temperature curve TC1 and the standard temperature curve STC.

[0021] Furthermore, after calculating the first offset value OFFSET1, the processor 140 can subtract the reference values ​​RF1 to RFN on the first temperature curve TC1 from the first offset value OFFSET1 respectively, so that the first temperature curve TC1 is shifted downward in the direction of the standard temperature curve STC by the first offset value OFFSET1 unit, thereby making the first temperature curve TC1 approach the standard temperature curve STC.

[0022] Therefore, the processor 140 can perform a first temperature correction operation on the temperature testing system 100 based on the standard ambient temperatures T1~TN, reference values ​​RF1~RFN, and the first offset value OFFSET1, and obtain a first correction curve CV1 between the operating temperature and the operating voltage (e.g., ...). Figure 2B (As shown).

[0023] On the other hand, please also refer to Figure 1 as well as Figure 2C After the processor 140 generates the first correction curve CV1, the processor 140 can subsequently receive (read) test values ​​TS1 to TSN from the memory 130. In this embodiment, the processor 140 can perform a second temperature correction operation on the temperature testing system 100 based on the test values ​​TS1 to TSN, the first offset value OFFSET1, and the standard ambient temperatures T1 to TN, using the objective function ML, thereby obtaining a second correction curve CV2 between the operating temperature and the operating voltage (e.g., ...). Figure 2C (As shown).

[0024] In this way, the processor 140 of this embodiment can make the second calibration curve CV2 closer to the standard temperature curve STC through two temperature calibration operations, thereby improving the yield of the temperature test system 100 when performing temperature tests on the device under test 120.

[0025] Details regarding the implementation of temperature profile correction will be provided later. Figure 3A as well as Figure 3B The examples presented in the document will be used to illustrate this. Figures 3A to 3B According to the present invention Figure 1 A schematic diagram of multiple temperature profiles in another embodiment.

[0026] For ease of explanation, as shown in Table (1), in this embodiment, it is assumed that the processor 140 samples the standard ambient temperatures of 10°C, 25°C and 70°C.

[0027] The standard sensor 110 can generate reference values ​​of 11°C, 27°C, and 67°C based on these standard ambient temperatures (10°C, 25°C, and 70°C). The device under test 120 can generate test values ​​of 12°C, 28°C, and 74°C based on its operating temperature at these standard ambient temperatures (10°C, 25°C, and 70°C).

[0028] Table (1)

[0029] Standard ambient temperature (°C) 10 25 70 Reference value (°C) 11 27 67 Test value (°C) 12 28 74

[0030] Please refer to the following at the same time Figure 1 as well as Figure 3A Specifically, the processor 140 can receive reference values ​​of 11°C, 27°C, and 67°C from the memory 130, and obtain a first temperature curve TC1 based on these reference values. Next, the processor 140 can use a standard ambient temperature of 25°C on the standard temperature curve STC as a reference value, and subtract the reference value of 27°C on the first temperature curve TC1 from the standard ambient temperature of 25°C to calculate a first offset value OFFSET1 of 2°C between the first temperature curve TC1 and the standard temperature curve STC.

[0031] After the processor 140 calculates the first offset value OFFSET1, the processor 140 can subtract the first offset value OFFSET1 (which is 2°C) from the multiple reference values ​​(11°C, 27°C, and 67°C) on the first temperature curve TC1 to obtain multiple first correction values ​​CC1 (9°C, 25°C, and 65°C) as shown in Table (2). Furthermore, the processor 140 can generate a first correction curve CV1 based on the first correction values ​​CC1 (which are 9°C, 25°C, and 65°C).

[0032] Table (2)

[0033]

[0034] In other words, in this embodiment, the temperature testing system 100 can perform the first temperature correction operation based on the first correction value CC1 and multiple reference values ​​generated by the standard sensor 110.

[0035] On the other hand, after the temperature testing system 100 completes the first temperature calibration, the processor 140 can subsequently receive test values ​​of 12°C, 28°C, and 74°C from the memory 130. Next, the processor 140 can subtract the test values ​​of 12°C, 28°C, and 74°C from the first offset value OFFSET1 (2°C) to obtain multiple second calibration values ​​CC2 (10°C, 26°C, and 72°C) as shown in Table (2). At this time, the processor 140 can obtain a second temperature curve TC2 based on the second calibration values ​​CC2 of 10°C, 26°C, and 72°C.

[0036] It is worth mentioning that, in this embodiment, the processor 140 can generate the objective function ML based on a plurality of second correction values ​​CC2 (10°C, 26°C and 72°C) and a plurality of standard ambient temperatures (10°C, 25°C and 70°C).

[0037] In this embodiment, the objective function ML can be, for example, a linear regression function. The processor 140 can generate the objective function ML by means of least squares analysis based on a plurality of second correction values ​​CC2 (10°C, 26°C, and 72°C) and a plurality of standard ambient temperatures (10°C, 25°C, and 70°C).

[0038] For example, the objective function ML in this embodiment can be, for example, the following equation (1), where X in the following equation (1) is the standard ambient temperature, Y in the following equation (1) is the predicted temperature value, and n in the following equation (1) is the number of temperature samples:

[0039] Y = a + bX (1)

[0040] Where, parameter b = ((sum of the products of X and corresponding Y) - n × (mean of X) × (mean of Y)) / ((sum of squares of X) - n × (square of the mean of X))

[0041] = (10×10+25×26+70×72-3×35×36) / (10×10+25×25+70×70-3×35×35)

[0042] =2010 / 1950

[0043] =1.03

[0044] Where, parameter a = (mean of Y) - (b × mean of X)

[0045] =36 - 1.03 × 35

[0046] =-0.05

[0047] Based on the above analysis and calculation, it can be seen that the processor 140 can obtain the objective function ML of Y = 1.03X - 0.05 by using the least squares method based on multiple second correction values ​​CC2 (10℃, 26℃ and 72℃) and multiple standard ambient temperatures (10℃, 25℃ and 70℃).

[0048] Furthermore, after the processor 140 obtains the objective function ML, the processor 140 can calculate multiple predicted temperature values ​​PT1 to PTN based on multiple standard ambient temperatures (10°C, 25°C, and 70°C) and the objective function ML.

[0049] For example, as shown in Table (3), the processor 140 can input these standard ambient temperatures (10°C, 25°C, and 70°C) into the parameter X in the objective function ML, respectively, to obtain predicted temperature values ​​of 10.25°C, 25.7°C, and 72.05°C. Furthermore, the processor can obtain a third temperature curve TC3 based on these predicted temperature values ​​(10.25°C, 25.7°C, and 72.05°C).

[0050] Next, the processor 140 can use the standard ambient temperature of 25°C on the standard temperature curve STC as a reference value, and subtract the predicted temperature value of 25.7°C on the third temperature curve TC3 from the standard ambient temperature of 25°C to calculate the second offset value OFFSET2 between the third temperature curve TC3 and the standard temperature curve STC as 0.7°C.

[0051] After the processor 140 calculates the second offset value OFFSET2, the processor 140 can subtract the second offset value OFFSET2 (0.7℃) from the multiple predicted temperature values ​​(10.25℃, 25.7℃, and 72.05℃) on the third temperature curve TC3 to obtain multiple third correction values ​​CC3 (9.55℃, 25℃, and 71.35℃) as shown in Table (3). Furthermore, the processor 140 can generate the second correction curve CV2 based on the third correction values ​​CC3 (9.55℃, 25℃, and 71.35℃).

[0052] Table (3)

[0053]

[0054] In other words, such as Figure 3BAs shown, after completing the first temperature correction operation (that is, after generating the first correction curve CV1), the processor 140 of this embodiment can further generate the second correction curve CV2 based on the second correction value CC2, the third correction value CC3 and the multiple test values ​​generated by the device under test 120, and through the objective function ML, thereby performing a second temperature correction operation on the temperature test system 100.

[0055] In this way, by performing two temperature calibration operations on the temperature testing system 100 through the processor 140, the second calibration curve CV2 can be made closer to the standard temperature curve STC, thereby improving the yield of the temperature testing system 100 when performing temperature testing on the device under test 120 and reducing the yield loss during temperature testing.

[0056] Figure 4 This is a flowchart illustrating a temperature testing method according to an embodiment of the present invention. Please also refer to... Figure 1 as well as Figure 4 In step S410, the temperature testing system provides a standard sensor to sense multiple standard ambient temperatures to generate multiple reference values. In step S420, the temperature testing system provides the device under test to sense multiple operating temperatures to generate multiple test values. In step S430, the temperature testing system uses a processor to obtain a first offset value based on the difference between one of the multiple reference values ​​and the corresponding standard ambient temperature, and generates a first calibration curve based on the first offset value and the multiple reference values.

[0057] In step S440, the temperature testing system uses a processor to adjust multiple test values ​​based on a first offset value to obtain multiple second correction values. In step S450, the temperature testing system uses a processor to calculate multiple predicted temperature values ​​based on the multiple second correction values ​​and multiple standard ambient temperatures. In step S460, the temperature testing system uses a processor to calculate the difference between one of the multiple predicted temperature values ​​and the corresponding standard ambient temperature to generate a second offset value. In step S470, the temperature testing system uses a processor to adjust the multiple predicted temperature values ​​based on the second offset value and generates a second correction curve based on the adjusted multiple predicted temperature values.

[0058] The implementation details of each step are explained in detail in the foregoing embodiments and implementation methods, and will not be repeated here.

[0059] In summary, in the temperature testing system and method described in the embodiments of the present invention, after completing the first temperature correction operation, the processor can further generate a second correction curve based on the second correction value, the third correction value, and multiple test values ​​generated by the device under test, through an objective function, thereby performing a second temperature correction operation on the temperature testing system. In this way, the processor can make the second correction curve closer to the standard temperature curve, thereby improving the yield rate of the temperature testing system when performing temperature testing on the device under test and reducing yield loss during temperature testing.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A temperature testing system, characterized in that, include: A standard sensor senses multiple standard ambient temperatures to generate multiple reference values. The device under test senses multiple operating temperatures to generate multiple test values; as well as A processor, coupled to the device under test and the standard sensor, wherein the processor is used to: A first offset value is obtained based on the difference between one of the plurality of reference values ​​and the corresponding standard ambient temperature, and a first correction curve is generated based on the first offset value and the plurality of reference values. The plurality of test values ​​are adjusted based on the first offset value to obtain a plurality of second correction values; A target function is generated based on the plurality of second correction values ​​and the plurality of standard ambient temperatures; Multiple predicted temperature values ​​are calculated based on the multiple standard ambient temperatures and the objective function; Calculate the difference between one of the plurality of predicted temperature values ​​and the corresponding standard ambient temperatures to generate a second offset value; as well as The plurality of predicted temperature values ​​are adjusted based on the second offset value, and a second correction curve is generated based on the adjusted plurality of predicted temperature values. Among them, the plurality of reference values, the plurality of test values, the first offset value, the second offset value, and the plurality of second correction values ​​are temperature values, and the first correction curve and the second correction curve are voltage-temperature curves.

2. The temperature testing system according to claim 1, characterized in that, The temperature testing system further includes: A memory, coupled between the standard sensor, the device under test, and the processor, is used to store the plurality of reference values ​​and the plurality of test values.

3. The temperature testing system according to claim 1, characterized in that, The processor is also used for: The plurality of reference values ​​are adjusted according to the first offset value to obtain a plurality of first correction values; and The first correction curve is generated based on the plurality of first correction values.

4. The temperature testing system according to claim 3, characterized in that, The processor is also used for: The plurality of reference values ​​are subtracted from the first offset value to obtain the plurality of first correction values.

5. The temperature testing system according to claim 1, characterized in that, The processor is also used for: The plurality of predicted temperature values ​​are subtracted from the second offset value to obtain a plurality of third correction values, and the second correction curve is generated based on the plurality of third correction values.

6. A temperature testing method for a temperature testing system, characterized in that, include: It provides a standard sensor to sense multiple standard ambient temperatures to generate multiple reference values ​​respectively; It enables the device under test to sense multiple operating temperatures to generate multiple test values; The processor obtains a first offset value based on the difference between one of the plurality of reference values ​​and the corresponding standard ambient temperature, and generates a first correction curve based on the first offset value and the plurality of reference values. The processor adjusts the plurality of test values ​​based on the first offset value to obtain a plurality of second correction values; The processor generates the objective function based on the plurality of second correction values ​​and the plurality of standard ambient temperatures; The processor calculates multiple predicted temperature values ​​based on the multiple standard ambient temperatures and the objective function; The processor calculates the difference between one of the plurality of predicted temperature values ​​and the corresponding standard ambient temperatures to generate a second offset value; as well as The processor adjusts the plurality of predicted temperature values ​​based on the second offset value, and generates a second correction curve based on the adjusted plurality of predicted temperature values. Among them, the plurality of reference values, the plurality of test values, the first offset value, the second offset value, and the plurality of second correction values ​​are temperature values, and the first correction curve and the second correction curve are voltage-temperature curves.

7. The temperature testing method according to claim 6, characterized in that, Also includes: A memory is provided to store the plurality of reference values ​​and the plurality of test values.

8. The temperature testing method according to claim 6, characterized in that, The step of generating the first correction curve based on the first offset value and the plurality of reference values ​​includes: The processor adjusts the plurality of reference values ​​according to the first offset value to obtain a plurality of first correction values; and The processor generates the first correction curve based on the plurality of first correction values.

9. The temperature testing method according to claim 8, characterized in that, The step of the processor adjusting the plurality of reference values ​​according to the first offset value to obtain the plurality of first correction values ​​includes: The processor subtracts the first offset value from each of the plurality of reference values ​​to obtain the plurality of first correction values.

10. The temperature testing method according to claim 6, characterized in that, The step of the processor adjusting the plurality of predicted temperature values ​​according to the second offset value and generating the second correction curve according to the adjusted plurality of predicted temperature values ​​includes: The processor subtracts the multiple predicted temperature values ​​from the second offset value to obtain multiple third correction values, and generates the second correction curve based on the multiple third correction values.

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