An improved CPU heat sink

Abstract

The application relates to the technical field of heat radiators, in particular to an improved CPU heat radiator which comprises a heat radiating base, a heat radiating fin group and a heat radiating pipe, the heat radiating pipe is assembled on the heat radiating base, and both ends of the heat radiating pipe are assembled on the heat radiating fin group, the heat radiating fin group is provided with heat radiating holes and heat radiating groove holes which are arranged in correspondence with the heat radiating holes, the heat radiating fin group comprises heat radiating fins and heat radiating auxiliary fins, the heat radiating holes are arranged on the heat radiating fins and / or the heat radiating auxiliary fins, and the heat radiating groove holes are arranged on the heat radiating fins and / or the heat radiating auxiliary fins, the application has the advantages that: through the arrangement of the heat radiating fins and the heat radiating auxiliary fins, the heat radiating fins and the heat radiating auxiliary fins are repeatedly and sequentially superposed, the situation that heat is excessively concentrated on the front section of the heat radiating fin group when different heat radiating pipes transfer heat to the heat radiating fins is reduced, the uniformity of heat radiation and the heat radiation effect of each layer of the heat radiating fin group are improved, the overheating of the heat radiating fin group is reduced, and the heat radiation efficiency is improved under the condition of the same volume.

Description

Technical Field

[0001] This invention relates to the field of heat sink technology, and more particularly to an improved CPU heat sink. Background Technology

[0002] Heat sinks are widely used for heat dissipation in chips (CPUs), and they are an indispensable part of the stable operation of chips. The heat dissipation effect and size of the heat sink determine the performance and size of the device.

[0003] Existing heat sinks consist of heat sinks, heat pipes, and heat sink bases. The distribution between the heat sinks and heat pipes also affects the heat dissipation performance. Existing heat pipes and heat sinks are arranged such that the two ends of the heat pipes are inserted into the same heat sink assembly, or the two ends of the heat pipes are inserted into different heat sink assemblies. The former is simple to arrange but cannot make full use of the heat dissipation capacity of the heat sinks; the latter takes up a lot of space and requires a large chassis size.

[0004] The current arrangement of heat pipes and heat sinks is simply a matter of spacing. When the heat pipes transfer heat to the heat sinks, the area of ​​the heat sinks in contact with the heat pipes may already be in a state of waiting to be cooled (with a temperature higher than the surface temperature during standby). This is partly due to the arrangement of the heat dissipation holes on the heat pipes and heat sinks, which affects the heat dissipation effect of the radiator.

[0005] Furthermore, the temperature in the middle of the CPU is higher than that on the sides. Consequently, the temperature in the middle of the heatsink mounting base is higher than that on the sides, causing the temperature in the middle of the heatsink base to continuously disperse to the sides and not be transferred to the heatsink fins in time. This results in a slow heat dissipation speed and poor heat dissipation capacity, which cannot meet the needs of today's high-performance electronic products. In order to improve the heat dissipation efficiency of heatsinks, heat pipes with different heat dissipation powers have appeared on the market. The higher the power of the heat pipe, the better the heat dissipation effect. In order to maintain the smoothness and stability of electronic products during use, heatsinks usually use high-power heat pipes to improve the heat dissipation performance. However, because the temperature in the middle of the heatsink base will diffuse to the sides, the temperature is not evenly distributed on the heatsink base. This means that low-power heat pipes cannot be used on the sides of the heatsink base, which greatly increases the production cost of the heatsink.

[0006] Furthermore, the heat from the chip is transferred to the heat pipe through the heat sink, and then the heat from the heat pipe is transferred to the heat sink. Most of the heat is concentrated at the front end where the heat pipe contacts the heat sink, which affects the heat dissipation effect of the heat sink. Therefore, further improvements are needed. Summary of the Invention

[0007] The purpose of this invention is to provide an improved CPU heatsink designed to solve at least one technical problem in the prior art.

[0008] To achieve the above objectives, the present invention adopts the following solution: an improved CPU heat sink, comprising a heat sink base, a heat sink assembly, and heat pipes. The heat pipes are mounted on the heat sink base, and both ends of the heat pipes are mounted on the heat dissipation hole assembly of the heat sink assembly. The heat dissipation hole assembly includes heat dissipation holes and heat dissipation slots corresponding to the heat dissipation holes. The heat sink assembly includes heat sinks and heat dissipation sub-plates. The heat sinks are provided with the heat dissipation holes and the heat dissipation slots, and the heat dissipation sub-plates are provided with the heat dissipation holes and the heat dissipation slots. The heat dissipation holes on the heat sinks and the heat dissipation slots on the heat dissipation sub-plates are correspondingly arranged.

[0009] The heat sink assembly is formed by repeatedly stacking the heat sink and the heat sink sub-slab in sequence.

[0010] The heat dissipation hole on the heat dissipation fin has a flange extending outward from the edge of the heat dissipation hole.

[0011] Wherein, the extension length of the flanged portion is equal to the distance between the side of the heat sink facing the heat sink sub-slab and the heat sink slot located on the heat sink sub-slab.

[0012] The heat dissipation hole group includes heat dissipation type holes, and at least some of the heat dissipation type holes have shapes that match the shape of the heat dissipation pipe.

[0013] The heat dissipation hole and the injection hole of the heat dissipation hole are provided with clearance space at the corresponding positions.

[0014] The heat sink includes a left heat sink region and a right heat sink region. The heat sink holes are disposed on the left heat sink region and / or the right heat sink region. The heat sink slots are disposed on the left heat sink region and / or the right heat sink region. The heat sink-shaped holes are disposed on the left heat sink region and / or the right heat sink region.

[0015] The heat sink has a cavity for accommodating the heat sink tube and a partition gap. The outer side of the heat sink has a first heat sink and a second heat sink. The second heat sink is located on one or both sides of the first heat sink. The partition gap is located between the first heat sink and the second heat sink.

[0016] The heat sink includes an upper heat sink and a lower heat sink. The upper heat sink is disposed above the lower heat sink and mounted on the top of the lower heat sink. The cavity is disposed between the upper heat sink and the lower heat sink. The first heat sink and the second heat sink are disposed on the lower heat sink.

[0017] The advantages of this invention are as follows: On the one hand, by setting up heat sinks and heat dissipation sub-slabs, and stacking heat sinks and heat dissipation sub-slabs in sequence, the situation where different heat dissipation pipes transfer heat to the heat sinks is too concentrated at the front of the heat sink assembly is reduced, thereby improving the uniformity of heat dissipation and heat dissipation effect of each layer of the heat sink assembly, reducing the overheating of some parts of the heat sink assembly, and improving the heat dissipation efficiency under the same volume.

[0018] On the other hand, by setting a partition gap on the heat sink to separate the first heat sink and the second heat sink, the temperature of the first heat sink on the heat sink will not be transferred to the second heat sink on both sides. The temperature of the first heat sink is directly transferred to the heat sink fins through the heat dissipation pipes assembled on the first heat sink, which helps to improve the heat dissipation speed and thus improve the heat dissipation efficiency of the heat sink. Replacing the heat dissipation pipes assembled on the second heat sink with low-power heat dissipation pipes helps to reduce the production cost of the heat sink and improve economic efficiency. Attached Figure Description

[0019] Figure 1 This is a three-dimensional schematic diagram of a heat sink; Figure 2 This is a left-side view of a heat sink. Figure 3 This is a three-dimensional schematic diagram of the heat sink described in structure 2 of embodiment 1. Figure 1 ; Figure 4 This is a three-dimensional schematic diagram of the heat sink described in structure 2 of embodiment 1. Figure 2 ; Figure 5 This is a left view of the heat sink described in structure 2 of embodiment 1; Figure 6 This is a three-dimensional schematic diagram of the heat dissipation upper seat described in structure 2 of embodiment 1; Figure 7 This is a three-dimensional schematic diagram of the heat dissipation base described in structure 2 of Embodiment 1; Figure 8 This is a three-dimensional schematic diagram of the heat sink described in structure 3 of Embodiment 1; Figure 9 This is a left view of the heat sink described in structure 3 of Embodiment 1; Figure 10 This is a left view of the heat sink described in structure 4 of Embodiment 1; Figure 11 This is a 3D view of an improved heat sink; Figure 12 This is a top view of an improved heat sink; Figure 13 This is for Figure 12 Enlarged view of section A; Figure 14 This is a schematic diagram of a heat sink. Figure 15 This is a schematic diagram of the structure of a heatsink fin in an improved CPU cooler; Figure 16 This is a top view of the heatsink fins in an improved CPU cooler; Figure 17 This is a top view of an improved CPU cooler; Figure 18 yes Figure 17 Sectional view of BB; Figure 19 yes Figure 18 Enlarged view of section C. Detailed Implementation

[0020] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so as to intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0021] In the description of this invention, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing the invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. When a feature is referred to as "set," "fixed," or "connected" to another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, or connected to the other feature.

[0022] In the description of this invention, the term "several" means one or more; "multiple" means two or more; "greater than," "less than," or "exceeding" are all understood to exclude the stated number; and "above," "below," or "within" are all understood to include the stated number. The terms "first" and "second" are understood to distinguish technical features and not to indicate or imply relative importance, the quantity of indicated technical features, or the order of the indicated technical features.

[0023] Furthermore, unless otherwise defined, the technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for the purpose of describing particular embodiments only and not for limiting the invention. It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0024] Example 1: As Figure 1-10 As shown, a heat sink for a processor includes a heat sink 1, which has a cavity 101 for accommodating a heat pipe 3. A partition gap is provided on the heat sink 1. The outer side of the heat sink 1 has a first heat dissipation part 1201 and a second heat dissipation part 1202. The second heat dissipation part 1202 is disposed on one or both sides of the first heat dissipation part 1201. The partition gap is disposed between the first heat dissipation part 1201 and the second heat dissipation part 1202. By providing a partition gap on the heat sink, the first heat dissipation part and the second heat dissipation part on the heat sink are separated, so that the temperature of the first heat dissipation part on the heat sink will not be transferred to the second heat dissipation parts on both sides. The temperature of the first heat dissipation part is directly transferred to the heat sink assembly through the heat pipe assembled on the first heat dissipation part, which helps to improve the heat dissipation speed and thus improve the heat dissipation efficiency of the heat sink.

[0025] The heat dissipation pipe mounted on the first heat dissipation part has a higher power than the heat dissipation pipe mounted on the second heat dissipation part. Replacing the heat dissipation pipe mounted on the second heat dissipation part with a low-power heat dissipation pipe can help reduce the production cost of the radiator and improve economic efficiency.

[0026] The heat sink 1 includes an upper heat sink 11 and a lower heat sink 12. The upper heat sink 11 is disposed above the lower heat sink 12 and mounted on the top of the lower heat sink 12. The cavity 101 is disposed between the upper heat sink 11 and the lower heat sink 12. The first heat sink 1201 and the second heat sink 1202 are disposed on the lower heat sink 12. The upper heat sink and the lower heat sink are detachably assembled together, which facilitates the assembly of various parts of the heat sink, reduces the time spent on production assembly, and lowers the production cost of the heat sink.

[0027] The upper heat dissipation seat 11 is provided with an upper cavity 111, and the lower heat dissipation seat 12 is provided with a lower cavity 121. The cavity 101 is formed between the upper cavity 111 of the upper heat dissipation seat 11 and the lower cavity 121 of the lower heat dissipation seat 12. The cavity is used to accommodate the heat dissipation tube. Under the same conditions, the contact area between the heat dissipation tube and the heat dissipation seat is increased, thereby improving the heat dissipation performance.

[0028] A first protrusion 124 is provided between the lower cavities 121 adjacent to the heat dissipation base 12. The first protrusion 124 matches the gap shape between the heat dissipation pipes 3, thereby increasing the contact area and tightness between the heat dissipation pipes and the heat dissipation base.

[0029] A second protrusion 112 is provided between the upper cavities 111 adjacent to the lower heat sink 12. The second protrusion 112 matches the gap shape between the heat sink pipes 3, thereby increasing the contact area and tightness between the heat sink pipes and the heat sink base.

[0030] The second protrusion 112 is arranged opposite to the first protrusion 124, and the downward side of part of the second protrusion 112 is in contact with or nearly in contact with the upward side of the opposite first protrusion 124, which helps to enhance the stability of the heat dissipation upper seat on the heat dissipation lower seat.

[0031] The upper heat sink is provided with a slot 113 on the surface facing the lower heat sink. The shape of the lower heat sink matches the shape of the slot, which helps to improve the stability of the upper heat sink on the lower heat sink and reduces the materials used in the production of the heat sink, thereby reducing manufacturing costs.

[0032] Structure 2: Reference Figure 3-7 The difference from structure 1 is that a groove 122 with an opening at one end and a bottom at the other end is provided on the heat dissipation base 12. The groove 122 is recessed from the top of the heat dissipation base 12 to the bottom of the heat dissipation base 12 to form the partition gap. The heat dissipation efficiency of the heat sink is improved by setting the groove. The method of setting the groove on the heat dissipation base is simple and convenient for the production of the heat dissipation base.

[0033] In a preferred embodiment, the groove 122 is connected to the top surface of the first protrusion 124.

[0034] The heat dissipation base 12 is also provided with a transition part 125, which is located at the connection between the groove opening of the groove 122 and the top surface of the first protrusion 124.

[0035] Structure 3: Reference Figure 8-9 The difference from structure 1 is that a groove 122 is provided on the heat dissipation base 12. The groove 122 extends from the top surface of the heat dissipation base 12 to the bottom surface of the heat dissipation base 12 to form the partition gap. The heat dissipation efficiency of the heat sink is improved by setting the groove. The method of setting the groove on the heat dissipation base is simple and convenient for the production of the heat dissipation base.

[0036] Structure 4: Reference Figure 10The difference from structure 1 is that a through hole 123 is provided on the heat dissipation base 12. The through hole 123 extends from one side of the heat dissipation base 12 to the other side of the heat dissipation base 12 to form the partition gap. The heat dissipation efficiency of the heat sink is improved by providing the through hole. The method of providing the through hole on the heat dissipation base is simple and convenient for the production of the heat dissipation base.

[0037] Example 2: As Figure 1-10 As shown, a heat sink includes a heat sink assembly 2, a heat sink pipe 3, and a heat sink base as described in any of the structures in Embodiment 1. The heat sink pipe 3 is assembled in the cavity 101 of the heat sink base 1, and both ends of the heat sink pipe 3 are assembled on the heat sink assembly 2.

[0038] By setting a partition gap on the heat sink to separate the first heat sink and the second heat sink, the temperature of the first heat sink on the heat sink will not be transferred to the second heat sink on both sides. The temperature of the first heat sink is directly transferred to the heat sink assembly through the heat dissipation pipes assembled on the first heat sink, which helps to improve the heat dissipation speed and thus improve the heat dissipation efficiency of the heat sink. Replacing the heat dissipation pipes assembled on the second heat sink with low-power heat dissipation pipes helps to reduce the production cost of the heat sink and improve economic efficiency.

[0039] Example 3: As Figure 11-14 As shown, an improved heat sink includes a heat sink 201. The heat sink 201 has a group of heat dissipation holes 4 for the two ends of a heat dissipation pipe 3 to be inserted and assembled. The group of heat dissipation holes 4 includes heat dissipation holes 401 and heat dissipation slots 402. The heat dissipation slots 402 and the heat dissipation holes 401 are spaced apart on the heat sink 201. The arrangement of the heat dissipation holes and heat dissipation slots makes the spacing between the heat dissipation pipes located in the heat dissipation holes and those located in the heat dissipation slots more reasonable, improving the heat dissipation efficiency of the heat sink and the overall heat dissipation efficiency of the radiator. The heat dissipation slots are used to stagger the heat dissipation of the heat dissipation pipes in the same layer of the heat sink, transferring the heat from one section of the heat dissipation pipe to the next layer of the heat sink for heat dissipation treatment. This improves the heat dissipation uniformity of each layer of the heat sink, reduces the concentration of heat in the front section of the heat dissipation pipe, improves the overall heat dissipation of the heat dissipation pipe, and improves the heat dissipation effect and efficiency of the radiator. Furthermore, in the case of the same layer of heat sink, it reduces the situation where the heat transferred from one heat dissipation hole to another heat dissipation hole is offset by the heat transferred from the heat dissipation pipe to another heat dissipation hole, further improving the heat dissipation effect of the radiator.

[0040] The heat sink 201 includes a left heat sink 2011 and a right heat sink 2012. The heat sink 401 is disposed on the left heat sink 2011 and / or the right heat sink 2012, and the heat sink slot 402 is disposed on the left heat sink 2011 and / or the right heat sink 2012.

[0041] The heat dissipation hole group 4 includes heat dissipation type holes 403, which are disposed on the heat dissipation left area 2011 and / or the heat dissipation right area 2012.

[0042] The heat dissipation holes 401 are one or more sets, and the multiple sets of heat dissipation holes 401 are distributed at intervals on the heat sink 201.

[0043] The heat dissipation slot 402 is inclined from the middle position near the heat sink 201 toward the outside of the heat sink 201.

[0044] The inclination direction of the multiple sets of heat dissipation holes 401 is the same as or opposite to the inclination direction of the heat dissipation slot holes 402.

[0045] The heat dissipation holes 401 and heat dissipation slots 402 placed on the heat sink 201 are evenly distributed on the heat dissipation left area 2011 and / or the heat dissipation right area 2012.

[0046] A first heat dissipation interval is formed between the heat dissipation hole 401 and the heat dissipation slot hole 402, and the first heat dissipation interval is adjacent to the heat dissipation hole and the heat dissipation slot hole.

[0047] A second heat dissipation interval is formed between the heat dissipation hole 403 and the heat dissipation hole 401 and / or between the heat dissipation hole 403 and the heat dissipation slot hole 402.

[0048] The lines connecting the heat dissipation holes 401 and / or the heat dissipation slot holes 402 and / or the heat dissipation type holes 403 located on the periphery are arranged in a polygonal pattern.

[0049] The heat dissipation holes 401, heat dissipation slot holes 402, and heat dissipation type holes 403 are evenly spaced.

[0050] In this embodiment, at least a portion of the heat dissipation holes 403 have shapes that match the shape of the heat dissipation pipe 3.

[0051] The heat dissipation hole 403 has a clearance space at the position corresponding to the injection hole of the heat dissipation hole 401.

[0052] The arrangement of heat dissipation holes, heat dissipation slots, and heat dissipation shaped holes makes the heat transfer from the heat pipes to the heat sink more even. Secondly, the arrangement of heat dissipation holes, heat dissipation slots, and heat dissipation shaped holes allows the heat to be distributed more evenly in the left and right heat dissipation areas, improving the heat transfer efficiency of the heat sink. Under the same volume, the heat dissipation efficiency of the heat sink is improved, and the cost of the heat sink is reduced.

[0053] Example 4: Figure 11-14As shown, a heat sink includes a heat sink pipe, a heat sink base, and an improved heat sink fin as described in any of the structures in Embodiment 3. The heat sink pipe is mounted on the heat sink base and both ends of the heat sink pipe are connected to the heat sink fin.

[0054] Example 5: Figure 1-19 As shown, the difference from Embodiment 1 and / or Embodiment 2 and / or Embodiment 3 and / or Embodiment 4 is as follows: An improved CPU heatsink includes a heatsink base, a heatsink assembly 2, and heat pipes 3. The heat pipes 3 are mounted on the heatsink base, and both ends of the heat pipes are mounted on heat dissipation hole groups 4 of the heatsink assembly 2. The heat dissipation hole groups 4 are provided with heat dissipation holes 401 and heat dissipation slots 402 corresponding to the heat dissipation holes 401. The heatsink assembly 2 includes heatsinks 201 and heat dissipation sub-plates 202. The heat dissipation holes 401 are provided on the heatsinks 201 and / or heat dissipation sub-plates 202, and the heat dissipation slots 402 are provided on the heatsinks 201 and / or heat dissipation sub-plates 202. On the one hand, the heat dissipation holes on the heatsinks and the heat dissipation slots on the heat dissipation sub-plates are correspondingly arranged, and the heat dissipation slots provide space for the heat dissipation holes of different layers to avoid each other, so that the heat dissipation pipes transfer heat to the heatsink assembly with heat dissipation is more uniform, reducing the impact of local heating of the heatsink assembly on the heatsink, thereby improving the heat dissipation efficiency and heat dissipation effect of the heatsink. On the other hand, the number of heatsinks is reduced, which improves the heat dissipation efficiency and heat dissipation effect of the heatsink with the same volume.

[0055] The heat sink assembly 2 is formed by the heat sink 201 and the heat sink sub-fin 202 being stacked in sequence, which reduces the excessive heating of the front part of the heat sink assembly, improves the uniformity of heat transfer of the heat sink assembly, and also improves the heat dissipation effect.

[0056] The heat dissipation holes 401 on the heat sink 201 are correspondingly provided with the heat dissipation slot holes 402 on the heat dissipation sub-plate 202, and the heat dissipation slot holes 402 on the heat sink 201 are correspondingly provided with the heat dissipation holes 401 on the heat dissipation sub-plate 202.

[0057] The heat dissipation hole 401 on the heat dissipation sub-plate 202 is provided with a flange 4011 extending outward from the edge of the heat dissipation hole 401.

[0058] Wherein, the extension length of the flange 4011 is equal to the distance between the side of the heat sink 201 facing the heat sink sub-plate 202 and the heat sink slot 402 located on the heat sink sub-plate 202.

[0059] The heat dissipation hole group 4 includes heat dissipation holes 403, and at least a portion of the heat dissipation holes 403 have shapes that match the shape of the heat dissipation pipe 3.

[0060] The heat dissipation hole 403 is provided with clearance space at the position corresponding to the injection hole 4012 of the heat dissipation hole 401.

[0061] The heat sink 201 includes a left heat sink region 2011 and a right heat sink region 2012. The heat sink hole 401 is disposed on the left heat sink region 2011 and / or the right heat sink region 2012. The heat sink groove hole 402 is disposed on the left heat sink region 2011 and / or the right heat sink region 2012. The heat sink type hole 403 is disposed on the left heat sink region 2011 and / or the right heat sink region 2012.

[0062] The heat sink includes a heat sink 1, which has a cavity 101 for accommodating the heat dissipation pipe 3. A partition gap is provided on the heat sink 1. The outer side of the heat sink 1 has a first heat dissipation part 1201 and a second heat dissipation part 1202. The second heat dissipation part 1202 is disposed on one or both sides of the first heat dissipation part 1201. The partition gap is disposed between the first heat dissipation part 1201 and the second heat dissipation part 1202. By providing a partition gap on the heat sink, the first heat dissipation part and the second heat dissipation part on the heat sink are separated, so that the temperature of the first heat dissipation part on the heat sink will not be transferred to the second heat dissipation parts on both sides. The temperature of the first heat dissipation part is directly transferred to the heat dissipation fin assembly through the heat dissipation pipe assembled on the first heat dissipation part, which helps to improve the heat transfer speed and thus improve the heat dissipation efficiency of the heat sink.

[0063] The heat sink 1 includes an upper heat sink 11 and a lower heat sink 12. The upper heat sink 11 is disposed above the lower heat sink 12 and mounted on the top of the lower heat sink 12. The cavity 101 is disposed between the upper heat sink 11 and the lower heat sink 12. The first heat sink 1201 and the second heat sink 1202 are disposed on the lower heat sink 12. The upper heat sink and the lower heat sink are detachably assembled together, which facilitates the assembly of various parts of the heat sink, reduces the time spent on production assembly, and lowers the production cost of the heat sink.

[0064] On the one hand, by setting up heat sinks and heat dissipation sub-fins, the heat sinks and heat dissipation sub-fins are stacked one after another, which reduces the situation where different heat pipes transfer heat to the heat sinks too much at the front of the heat sink assembly, improves the uniformity of heat dissipation and heat dissipation effect of each layer of the heat sink assembly, reduces the overheating of some parts of the heat sink assembly, and improves the heat dissipation efficiency under the same volume.

[0065] On the other hand, by setting a partition gap on the heat sink to separate the first heat sink and the second heat sink, the temperature of the first heat sink on the heat sink will not be transferred to the second heat sink on both sides. The temperature of the first heat sink is directly transferred to the heat sink fins through the heat dissipation pipes assembled on the first heat sink, which helps to improve the heat dissipation speed and thus improve the heat dissipation efficiency of the heat sink. Replacing the heat dissipation pipes assembled on the second heat sink with low-power heat dissipation pipes helps to reduce the production cost of the heat sink and improve economic efficiency.

[0066] Example 6: As Figure 1-19 As shown, an improved CPU heatsink includes a heatsink base, a heatsink assembly, and a heat pipe, all of the structures described in Embodiment 1. The heat pipe is mounted on the heatsink base, and both ends of the heat pipe are mounted on the heat dissipation hole group of the heatsink assembly. The heatsink hole group includes heat dissipation holes and heat dissipation slots corresponding to the heat dissipation holes. The heatsink assembly includes heatsinks and heat dissipation sub-plates. The heatsinks are provided with the heat dissipation holes and the heat dissipation slots, and the heat dissipation sub-plates are also provided with the heat dissipation holes and the heat dissipation slots. The heat dissipation holes on the heatsinks correspond to the heat dissipation slots on the heat dissipation sub-plates, and the heat dissipation slots on the heatsinks correspond to the heat dissipation holes on the heat dissipation sub-plates.

[0067] The heat sink assembly 2 is formed by the heat sink 201 and the heat sink sub-fin 202 being stacked in sequence, which reduces the excessive heating of the front part of the heat sink assembly, improves the uniformity of heat transfer of the heat sink assembly, and also improves the heat dissipation effect.

[0068] The heat dissipation hole 401 on the heat dissipation sub-plate 202 is provided with a flange 4011 extending outward from the edge of the heat dissipation hole 401.

[0069] Wherein, the extension length of the flange 4011 is equal to the distance between the side of the heat dissipation fin 202 facing the heat dissipation fin 201 and the heat dissipation slot 402 located on the heat dissipation fin 201.

[0070] The heat dissipation hole group 4 includes heat dissipation holes 403, and at least a portion of the heat dissipation holes 403 have shapes that match the shape of the heat dissipation pipe 3.

[0071] The heat dissipation hole 403 is provided with clearance space at the position corresponding to the injection hole 4012 of the heat dissipation hole 401.

[0072] The heat sink 201 includes a left heat sink region 2011 and a right heat sink region 2012. The heat sink hole 401 is disposed on the left heat sink region 2011 and / or the right heat sink region 2012. The heat sink groove hole 402 is disposed on the left heat sink region 2011 and / or the right heat sink region 2012. The heat sink type hole 403 is disposed on the left heat sink region 2011 and / or the right heat sink region 2012.

[0073] The heat sink includes a heat sink 1, which has a cavity 101 for accommodating the heat dissipation pipe 3. A partition gap is provided on the heat sink 1. The outer side of the heat sink 1 has a first heat dissipation part 1201 and a second heat dissipation part 1202. The second heat dissipation part 1202 is disposed on one or both sides of the first heat dissipation part 1201. The partition gap is disposed between the first heat dissipation part 1201 and the second heat dissipation part 1202. By providing a partition gap on the heat sink, the first heat dissipation part and the second heat dissipation part on the heat sink are separated, so that the temperature of the first heat dissipation part on the heat sink will not be transferred to the second heat dissipation parts on both sides. The temperature of the first heat dissipation part is directly transferred to the heat dissipation fin assembly through the heat dissipation pipe assembled on the first heat dissipation part, which helps to improve the heat transfer speed and thus improve the heat dissipation efficiency of the heat sink.

[0074] The heat sink 1 includes an upper heat sink 11 and a lower heat sink 12. The upper heat sink 11 is disposed above the lower heat sink 12 and mounted on the top of the lower heat sink 12. The cavity 101 is disposed between the upper heat sink 11 and the lower heat sink 12. The first heat sink 1201 and the second heat sink 1202 are disposed on the lower heat sink 12. The upper heat sink and the lower heat sink are detachably assembled together, which facilitates the assembly of various parts of the heat sink, reduces the time spent on production assembly, and lowers the production cost of the heat sink.

[0075] On the one hand, by setting up heat sinks and heat dissipation sub-fins, the heat sinks and heat dissipation sub-fins are stacked one after another, which reduces the situation where different heat pipes transfer heat to the heat sinks too much at the front of the heat sink assembly, improves the uniformity of heat dissipation and heat dissipation effect of each layer of the heat sink assembly, reduces the overheating of some parts of the heat sink assembly, and improves the heat dissipation efficiency under the same volume.

[0076] On the other hand, by setting a partition gap on the heat sink to separate the first heat sink and the second heat sink, the temperature of the first heat sink on the heat sink will not be transferred to the second heat sink on both sides. The temperature of the first heat sink is directly transferred to the heat sink fins through the heat dissipation pipes assembled on the first heat sink, which helps to improve the heat dissipation speed and thus improve the heat dissipation efficiency of the heat sink. Replacing the heat dissipation pipes assembled on the second heat sink with low-power heat dissipation pipes helps to reduce the production cost of the heat sink and improve economic efficiency.

[0077] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An improved CPU heatsink, comprising a heatsink base, a heatsink fin assembly, and heat pipes, wherein the heat pipes are mounted on the heatsink base and both ends of the heatsinks are mounted on heat dissipation holes in the heatsink fin assembly, characterized in that: The heat dissipation hole group includes heat dissipation holes and heat dissipation slots corresponding to the heat dissipation holes. The heat dissipation fin group includes heat dissipation fins and heat dissipation sub-fins. The heat dissipation fins are provided with the heat dissipation holes and the heat dissipation slots, and the heat dissipation sub-fins are provided with the heat dissipation holes and the heat dissipation slots are provided with the heat dissipation holes. The heat dissipation fin group is formed by the heat dissipation fins and the heat dissipation sub-fins being stacked in sequence. The heat dissipation slots are used to offset the heat dissipation of the heat pipe by the heat dissipation fins or heat dissipation sub-fins of the current layer, so that the heat of the current heat pipe is transferred to the next layer of heat dissipation fins or heat dissipation sub-fins for heat dissipation treatment.

2. An improved CPU heatsink according to claim 1, characterized in that: A flange is provided around the heat dissipation hole on the heat dissipation fin, and the flange extends outward from the edge of the heat dissipation hole.

3. An improved CPU heatsink according to claim 2, characterized in that: The extension length of the flange is equal to the distance between the side of the heat dissipation fin facing the heat dissipation fin and the heat dissipation slot located on the heat dissipation fin.

4. An improved CPU heatsink according to claim 1, characterized in that: The heat dissipation hole group includes heat dissipation type holes, and at least some of the heat dissipation type holes have shapes that match the shape of the heat dissipation pipe.

5. An improved CPU heatsink according to claim 4, characterized in that: A clearance space is provided at the position corresponding to the injection hole of the heat dissipation hole.

6. An improved CPU heatsink according to claim 4, characterized in that: The heat sink includes a left heat sink region and a right heat sink region. The heat sink holes are disposed on the left heat sink region and / or the right heat sink region. The heat sink slots are disposed on the left heat sink region and / or the right heat sink region. The heat sink-shaped holes are disposed on the left heat sink region and / or the right heat sink region.

7. An improved CPU heatsink according to claim 1, characterized in that: The heat sink is provided with a cavity for accommodating the heat sink tube, and a partition gap is provided on the heat sink. The outer side of the heat sink has a first heat sink and a second heat sink. The second heat sink is located on one or both sides of the first heat sink. The partition gap is located between the first heat sink and the second heat sink.

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