A method, apparatus, electronic device, and storage medium for measuring residual stress.

Abstract

This application provides a method, apparatus, electronic device, and storage medium for measuring residual stress, including acquiring the target cutting surface of a component model and its mesh node information; determining multiple mesh node sets based on the structural characteristics of the component model, each mesh node set including at least one mesh node on the target cutting surface; applying a unit load to the mesh nodes in each mesh node set to obtain the stress basis function, displacement basis function, and corresponding support reaction function of the target cutting surface; constructing a support reaction matrix and a deformation matrix based on the stress basis function, displacement basis function, and corresponding support reaction function of all mesh node sets; and solving for the coefficient vector based on the support reaction matrix, deformation matrix, and error parameters to calculate the residual stress of the target cutting surface. This method reduces computational load, improves computational efficiency, and is not limited by the geometry of the cutting surface.

Description

Technical Field

[0001] This application relates to the field of materials technology, and more specifically, to a method, apparatus, electronic device, and storage medium for measuring residual stress. Background Technology

[0002] Residual stress refers to the stress that exists within a component and remains in self-equilibrium when it is not subjected to external forces. A comprehensive understanding of the magnitude and distribution of residual stress in components is of great significance for improving the safety and reliability of power plant operation. Residual stress testing methods are divided into two types: destructive measurement and non-destructive measurement.

[0003] There are two common methods for measuring residual stress: the profile method and the series method. The profile method mainly calculates residual stress using the finite element method. The calculation time for a single calculation is about 10 to 15 minutes. When dealing with a large number of calculation tasks, it is time-consuming and has low calculation efficiency.

[0004] The series method is greatly affected by the geometry of the cutting surface when expanding the residual stress on the cutting surface using trigonometric series. Currently, it is mainly applicable to simple geometric shapes such as rectangles in two-dimensional planes and does not yet have universality. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a method, apparatus, electronic device and storage medium for measuring residual stress, so as to improve the calculation efficiency of the measurement and at the same time improve the applicability of the measurement.

[0006] In a first aspect, this application provides a method for determining residual stress, the method comprising: acquiring the target cutting surface of a component model and the mesh node information of the target cutting surface; determining multiple mesh node sets based on the structural characteristics of the component model, each mesh node set including at least one mesh node on the target cutting surface; applying a unit load to the mesh nodes in each mesh node set to obtain the stress basis function, displacement basis function, and corresponding support reaction function of the target cutting surface; constructing a support reaction matrix and a deformation matrix based on the stress basis function, displacement basis function, and corresponding support reaction function of all mesh node sets; and solving for the coefficient vector based on the support reaction matrix, deformation matrix, and error parameters to calculate the residual stress of the target cutting surface.

[0007] Preferably, the support reaction matrix is ​​constructed in the following manner: The support reaction matrix A is represented as:

[0008]

[0009] Where, Φ ω Let Φ be the set of all displacement basis functions. R The set of support reaction functions is formed by the corresponding support reaction functions.

[0010] Preferably, the deformation matrix is ​​constructed in the following way: Deformation matrix W * Represented as:

[0011]

[0012] Where W is the set of normal variables of the target cutting surface, W=(ω1,ω2,ω3,…,ω n ), ω i Let i be the coordinates of the mesh node i of the target cutting surface in the normal direction of the cutting surface.

[0013] Preferably, the error parameters include the sum of the applied rigid body displacement and the linear regression error, and the coefficient vector is obtained by solving the following method: calculating the intermediate vector based on the difference between the deformation matrix and the error parameters; calculating the coefficient vector based on the quotient of the intermediate vector and the support reaction matrix, wherein the size of the coefficient vector is n×1.

[0014] Preferably, the residual stress of the target cutting surface is calculated by multiplying the coefficient vector and the stress basis function set composed of all stress basis functions as the residual stress of the target cutting surface, and generating the corresponding residual stress cloud map.

[0015] Preferably, multiple mesh node sets are determined by: determining all mesh nodes on the target cutting surface and each mesh node; determining the mesh node number corresponding to each mesh node as a mesh node set, or determining the mesh node numbers corresponding to two symmetrical mesh nodes as a mesh node set.

[0016] Preferably, multiple mesh node sets are determined in the following way: multiple feature mesh nodes are determined from all mesh nodes on the target cutting surface; the mesh node number corresponding to each feature mesh node is determined as a mesh node set, or the mesh node numbers corresponding to two symmetrical feature mesh nodes are determined as a mesh node set.

[0017] Secondly, this application provides a device for measuring residual stress, the device comprising:

[0018] The acquisition module is used to acquire the target cutting surface of the component model and the mesh node information of the target cutting surface;

[0019] The set module is used to determine multiple mesh node sets based on the structural characteristics of the component model. Each mesh node set includes at least one mesh node on the target switching surface.

[0020] The action module is used to apply a unit load to the mesh nodes in each mesh node set to obtain the stress basis function, displacement basis function and corresponding support reaction function of the target cutting surface;

[0021] The construction module is used to construct the support reaction matrix and deformation matrix based on the stress basis function, displacement basis function and corresponding support reaction function of all mesh node sets;

[0022] The calculation module is used to solve for the coefficient vector based on the support reaction matrix, deformation matrix and error parameters, so as to calculate the residual stress of the target cutting surface.

[0023] Thirdly, this application also provides an electronic device, including: a processor, a memory, and a bus. The memory stores machine-readable instructions that can be executed by the processor. When the electronic device is running, the processor communicates with the memory via the bus. When the machine-readable instructions are executed by the processor, the steps of the residual stress determination method described above are performed.

[0024] Fourthly, this application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, performs the steps of the residual stress determination method described above.

[0025] This application provides a method, apparatus, electronic device, and storage medium for determining residual stress. The method includes acquiring the target cutting surface of a component model and its mesh node information; determining multiple mesh node sets based on the structural characteristics of the component model, each mesh node set including at least one mesh node on the target cutting surface; applying a unit load to the mesh nodes in each mesh node set to obtain the stress basis function, displacement basis function, and support reaction force at the boundary points of the component model for the target cutting surface; constructing a support reaction force matrix and a deformation matrix based on the stress basis function, displacement basis function, and support reaction force function at the boundary points of the component model corresponding to all mesh node sets; and solving for the coefficient vector based on the support reaction force matrix, deformation matrix, and error parameters to calculate the residual stress on the target cutting surface. By sequentially applying a unit load to the mesh nodes on the target cutting surface to obtain independent stress basis functions, displacement basis functions, and support reactions, and using linear regression to solve for the corresponding residual stress, the computational load can be reduced, computational efficiency improved, and the method is not limited by the geometry of the cutting surface, thus having a wider range of applications.

[0026] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A flowchart illustrating a method for determining residual stress provided in an embodiment of this application;

[0029] Figure 2 A schematic diagram of the target cutting surface of a component provided in an embodiment of this application;

[0030] Figure 3 A schematic diagram of the boundary conditions of a component provided in an embodiment of this application;

[0031] Figure 4 A schematic diagram of a residual stress measuring device provided in an embodiment of this application;

[0032] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. Based on the embodiments of this application, every other embodiment obtained by those skilled in the art without inventive effort falls within the scope of protection of this application.

[0034] First, the applicable scenarios for this application will be introduced. This application can be applied to the determination of residual stress in metallic materials.

[0035] Research has found that there are two common methods for measuring residual stress: the profile method and the series method. The profile method mainly calculates residual stress using the finite element method, with a single calculation taking about 10 to 15 minutes. This method is time-consuming and inefficient when dealing with large-scale calculation tasks. The series method is greatly affected by the geometry of the cutting surface when expanding the residual stress on the cutting surface using trigonometric series. Currently, it is mainly applicable to simple geometric shapes such as rectangles in two-dimensional planes and does not yet have universality.

[0036] Based on this, embodiments of this application provide a method, apparatus, electronic device, and storage medium for measuring residual stress, so as to improve the calculation efficiency of the measurement and expand the applicability of the measurement.

[0037] Please see Figure 1 , Figure 1 This is a flowchart illustrating a method for determining residual stress provided in an embodiment of this application. Figure 1 As shown in the embodiment of this application, a method for determining residual stress includes:

[0038] S101. Obtain the target cutting surface of the component model and the mesh node information of the target cutting surface.

[0039] The components and cut surfaces here are all predetermined, for example... Figure 2 The components and cut surfaces are shown. The components here can also be irregular shapes, and the cut surfaces are vertical cross-sections.

[0040] By constructing a three-dimensional model of the component after it has been cut in a three-dimensional simulation software, and then meshing the three-dimensional model of the component, the mesh node information can be obtained. Each mesh node is edited with a corresponding number.

[0041] S102. Based on the structural characteristics of the component model, multiple mesh node sets are determined, and each mesh node set includes at least one mesh node on the target switching surface.

[0042] Specifically, multiple sets of grid nodes are determined in the following way:

[0043] Identify all mesh nodes on the target cutting surface and each mesh node. Assign the mesh node number corresponding to each mesh node to a mesh node set, or assign the mesh node numbers corresponding to two symmetrical mesh nodes to a mesh node set.

[0044] Multiple sets of grid nodes can also be determined in the following ways:

[0045] From all the mesh nodes on the target cutting surface, identify multiple feature mesh nodes. Determine a mesh node set by the mesh node number corresponding to each feature mesh node, or by determining a mesh node set by the mesh node numbers corresponding to two symmetrical feature mesh nodes.

[0046] In step S102, all mesh nodes can be used as nodes to be tested, or feature nodes can be selected based on the structure or geometry of the component, which can reduce the amount of computation.

[0047] S103. For each set of mesh nodes, apply a unit load to the mesh nodes in the set to obtain the stress basis function, displacement basis function, and corresponding support reaction function of the target cutting surface.

[0048] Here, based on the existing contour method, and combined with the inverse solution approach of the series method, the stress distribution is solved by using the numerical fundamental solution instead of the trigonometric series expansion. A unit load F is applied to a node on an undeformed cut surface. i Under this unit load, the cutting surface generates a set of stress basis functions. and displacement basis functions At the same time, the fixed constraint ends of the entire model generate corresponding support reaction functions. Because it satisfies the superposition principle, under different unit loads F i Under the action, its corresponding stress basis function (Stress values ​​at all nodes on the cross section), displacement basis functions and support reaction function All are independent of each other. For such a set of stress basis functions... and displacement basis functions This is called the fundamental numerical solution.

[0049] S104. Based on the stress basis functions, displacement basis functions, and support reaction force functions of the boundary points of the component model corresponding to all mesh node sets, construct the support reaction force matrix and deformation matrix.

[0050] The matrix components here are for ease of calculation and to simplify the solution process.

[0051] S105. Based on the support reaction matrix, deformation matrix, and error parameters, solve for the coefficient vector to calculate the residual stress on the target cutting surface.

[0052] Specifically, the residual stress on the target cut surface is calculated using the following method:

[0053] The product of the coefficient vector and the stress basis function set consisting of all stress basis functions is calculated as the residual stress of the target cutting surface, and the corresponding residual stress cloud map is generated.

[0054] The formula for solving the residual stress here can ultimately be equivalent to:

[0055] W * =Ax+ε0,

[0056] Where ε0 is the sum of the rigid body displacement R0 and the error term ε of the linear regression;

[0057] After obtaining the coefficient vector x, the corresponding residual stress The solution can be found in the following ways:

[0058]

[0059] The residual stress measurement method provided in this application embodiment only requires one linear regression based on the basis function to solve for the residual stress on the target cutting surface of the component. Furthermore, as long as the cutting surface can be meshed, the measurement can be completed without limiting the geometry of the cutting surface. This improves the computational efficiency of the measurement while also expanding its applicability.

[0060] In one embodiment of this application, the support reaction matrix is ​​constructed in the following manner:

[0061] The support reaction matrix A is represented as:

[0062]

[0063] Where, Φ ω Let Φ be the set of all displacement basis functions. R The set of support reaction functions is formed by the corresponding support reaction functions.

[0064] The deformation matrix W is constructed as follows: * Represented as:

[0065]

[0066] Where W is the set of normal variables of the target cutting surface, W=(ω1,ω2,ω3,…,ω n ), ω i Let i be the coordinates of the mesh node i of the target cutting surface in the normal direction of the cutting surface.

[0067] The deformation matrix and support reaction matrix are constructed to simplify the calculation. The derivation process of the formula for calculating residual stress is introduced below:

[0068] By applying unit loads sequentially to a series of nodes on the cut surface, the stress basis functions and displacement basis functions corresponding to these nodes are combined to obtain the stress basis function set. Displacement basis function set

[0069] Similarly, its support reaction function set

[0070] Let the normal deformation of the cut surface be W(ω1,ω2,ω3,…,ω). n ), ω i This represents the coordinates of the nodes on the cutting surface along the normal to the cutting surface. Least-squares approximation of W is performed using the displacement basis function set:

[0071]

[0072] Where R0 represents the artificially applied rigid body displacement, the purpose of which is to account for potential errors between the measured surface and the actual surface during the measurement of deformation W. Therefore, the calculation can be corrected by applying rigid body displacement. Simultaneously, the fixed constraint end reaction force must be zero, and the reaction force R is expressed as:

[0073] R = Φ R x,

[0074] Let x be the coefficient vector to be solved. Combining the above formulas, we can solve for the coefficients x(x1,x2,x3,…,x). n ) T This is equivalent to solving the following constrained least squares optimization problem:

[0075]

[0076] Considering that the constraints are a set of homogeneous equations about solving the coefficient vector x, constructing an intermediate matrix to transform the problem yields an unconstrained least-squares optimization problem:

[0077]

[0078] The above equation can be solved using linear regression, which is equivalent to:

[0079] W * =Ax+ε0.

[0080] In one embodiment of this application, the corresponding residual stress cloud map can be obtained in the following way:

[0081] Due to issues such as mesh generation when calculating stress basis functions, the final calculated residual stress is not smoothly distributed across the entire cross section, affecting the post-processing results. Here, stress values ​​can be smoothed.

[0082] The solution obtained These represent the stress values ​​at the nodes on the cut surface. The cut surface is a mesh surface composed of quadrilateral grids connecting the nodes. In other words, the entire cut surface can be viewed as an undirected graph. Construct an undirected graph by considering the mesh connections between nodes on the cross section. adjacency matrix Let be an n×n sparse matrix, where each row consists of 0s and 1s. If (i,j) = 1, it means that node i and node j are connected; if (i,k) = 0, it means that node i and node k are not connected.

[0083] When performing smoothing, the stress value at each node on the cut surface can be replaced with the average value between itself and the four adjacent nodes, and then the corresponding residual stress cloud map can be generated.

[0084] In one embodiment of this application, a basis function database can be established for different parts. Each calculation only requires calling the corresponding basis function in the database to perform a linear regression. Compared to the contour method, which requires a finite element calculation for each iteration, this significantly improves computational efficiency.

[0085] In one specific embodiment, such as Figure 2 The component shown has the following material parameters: elastic modulus (mPa) of 225e3 and Poisson's ratio of 0.35. The fixed constraint boundary conditions and loads are as follows: Figure 3 As shown in Table 1, the boundary conditions are as follows:

[0086] Table 1

[0087]

[0088]

[0089] Since the cut surface selected for this component is symmetrical, a unit load can be applied to the symmetrical mesh nodes. Specifically, there can be multiple mesh node sets such as (24, 44), (23, 45), (4957, 15940), where the two mesh nodes in each mesh node set are symmetrical to each other.

[0090] Next, the script is used to submit the basis functions for automatic calculation of stress, displacement, and support reaction forces. For the normal deformation of the cutting surface, W, a sixth-order polynomial is used to reconstruct the surface from the point cloud data. Substituting the coordinates of the section nodes into the fitted polynomial yields the normal undeformed deformation W of the cutting surface nodes.

[0091] After completing a series of preliminary data collection and calculations, the coefficient vector x is calculated, and its residual stress is obtained by substituting it into the stress basis function set and smoothing it.

[0092] By comparing the measurement results of this application with the calculation results of the existing profile method, and generating comparative cloud maps and stress distribution maps on the path, it can be determined that the measurement method of this application is consistent with the traditional profile method in terms of stress distribution trend, but there is a certain numerical error. The calculated average error is 26.5456 MPa, and the average error rate is 16.67%. In terms of calculation time, the calculation time of both methods is mainly affected by the mesh size.

[0093] When the model was meshed using a 3mm mesh size, the computation time of the traditional contour method, as obtained from the log file, was 9 minutes and 10 seconds from task submission to completion. The computation time of the numerical basic solution method, obtained using the MATLAB system function tic / toc, was 7.91 seconds from data import to final linear regression calculation, only 1% of the time required by the traditional contour method, demonstrating a significant improvement in computational efficiency.

[0094] Based on the same inventive concept, this application also provides a residual stress measuring device corresponding to the residual stress measuring method. Since the principle of the device in this application is similar to the residual stress measuring method described above in this application, the implementation of the device can refer to the implementation of the method, and the repeated parts will not be described again.

[0095] Please see Figure 4 , Figure 4 This is a schematic diagram of a residual stress measuring device provided in an embodiment of this application. Figure 4 As shown, the measuring device 400 includes:

[0096] The acquisition module 410 is used to acquire the target cutting surface of the component model and the mesh node information of the target cutting surface;

[0097] The set module 420 is used to determine multiple mesh node sets based on the structural features of the component model, and each mesh node set includes at least one mesh node on the target switching surface;

[0098] The action module 430 is used to apply a unit load to the mesh nodes in each mesh node set to obtain the stress basis function, displacement basis function and corresponding support reaction function of the target cutting surface;

[0099] Module 440 is used to construct the support reaction matrix and deformation matrix based on the stress basis function, displacement basis function and corresponding support reaction function of all mesh node sets.

[0100] The calculation module 450 is used to solve for the coefficient vector based on the support reaction matrix, deformation matrix and error parameters, so as to calculate the residual stress of the target cutting surface.

[0101] In a preferred embodiment, the construction module 440 constructs the support reaction matrix in the following manner: The support reaction matrix A is represented as:

[0102]

[0103] Where, Φ ω Let Φ be the set of all displacement basis functions. RThe set of support reaction functions is formed by the corresponding support reaction functions.

[0104] Preferably, the construction module 440 constructs the deformation matrix in the following manner: Deformation matrix W * Represented as:

[0105]

[0106] Where W is the set of normal variables of the target cutting surface, W=(ω1,ω2,ω3,…,ω n ), ω i Let i be the coordinates of the mesh node i of the target cutting surface in the normal direction of the cutting surface.

[0107] Preferably, the error parameters include the sum of the applied rigid body displacement and the linear regression error. The calculation module 450 solves for the coefficient vector in the following way: the intermediate vector is calculated based on the difference between the deformation matrix and the error parameters; the coefficient vector is calculated based on the quotient of the intermediate vector and the support reaction matrix, and the size of the coefficient vector is n×1.

[0108] Preferably, the calculation module 450 calculates the residual stress of the target cutting surface in the following way: the product of the calculation coefficient vector and the stress basis function set composed of all stress basis functions is used as the residual stress of the target cutting surface, and the corresponding residual stress cloud map is generated.

[0109] Preferably, the set module 420 determines multiple mesh node sets in the following ways: determining all mesh nodes on the target cutting surface and each mesh node; determining the mesh node number corresponding to each mesh node as a mesh node set, or determining the mesh node numbers corresponding to two symmetrical mesh nodes as a mesh node set.

[0110] Preferably, the set module 420 determines multiple mesh node sets in the following way: from all mesh nodes on the target cutting surface, multiple feature mesh nodes are determined; the mesh node number corresponding to each feature mesh node is determined as a mesh node set, or the mesh node numbers corresponding to two symmetrical feature mesh nodes are determined as a mesh node set.

[0111] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 5 As shown, the electronic device 500 includes a processor 510, a memory 520, and a bus 530.

[0112] The memory 520 stores machine-readable instructions executable by the processor 510. When the electronic device 500 is running, the processor 510 and the memory 520 communicate via the bus 530. When the machine-readable instructions are executed by the processor 510, they can perform the operations described above. Figure 1 The steps of a residual stress determination method in the illustrated embodiment can be found in the method embodiment for specific implementation, and will not be repeated here.

[0113] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, can perform the above-described actions. Figure 1 The steps of a residual stress determination method in the illustrated embodiment can be found in the method embodiment for specific implementation, and will not be repeated here.

[0114] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0115] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the shown or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0116] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0117] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0118] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0119] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The scope of protection of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method of measuring residual stress, characterized by, The method includes: Obtain the target cutting surface of the component model and the mesh node information of the target cutting surface; Based on the structural characteristics of the component model, multiple mesh node sets are determined, and each mesh node set includes at least one mesh node on the target cutting surface; For each set of mesh nodes, a unit load is applied to the mesh nodes in the set to obtain the stress basis function, displacement basis function, and corresponding support reaction function of the target cutting surface; Based on the stress basis functions, displacement basis functions and corresponding support reaction functions of all mesh node sets, construct the support reaction matrix and deformation matrix; Based on the support reaction matrix, deformation matrix, and error parameters, the coefficient vector can be solved. The product of the coefficient vector and the stress basis function set consisting of all stress basis functions is calculated as the residual stress of the target cutting surface, and the corresponding residual stress contour map is generated. The support reaction matrix is ​​constructed in the following manner: The support reaction matrix is expressed as: in, Let be the set of all displacement basis functions. The set of support reaction functions is formed by the corresponding support reaction functions; The deformation matrix is ​​constructed in the following manner: The deformation matrix Represented as: in, Let the set of normal variables of the target cutting surface be . , Mesh nodes for the target cutting surface The coordinates of the cutting surface normal.

2. The method according to claim 1, characterized in that, The error parameters include the sum of the applied rigid body displacement and the linear regression error, and the coefficient vector is obtained by solving for it in the following way: The intermediate vector is calculated based on the difference between the deformation matrix and the error parameter; The coefficient vector is calculated based on the quotient of the intermediate vector and the support reaction matrix, and the magnitude of the coefficient vector is... .

3. The method according to claim 1, characterized in that, Multiple sets of grid nodes are determined in the following way: Determine all mesh nodes on the target cutting surface and each mesh node; Each grid node is assigned a grid node number, which is then used to define a grid node set. Alternatively, the grid node numbers corresponding to two symmetrical grid nodes can be used to define a grid node set.

4. The method according to claim 1, characterized in that, Multiple sets of grid nodes are determined in the following way: Multiple feature mesh nodes are identified from all mesh nodes on the target cutting surface; Each feature grid node is assigned a grid node set by its corresponding grid node number, or two symmetrical feature grid nodes are assigned a grid node set by their corresponding grid node numbers.

5. A device for measuring residual stress, characterized in that, The apparatus suitable for determining residual stress according to any one of claims 1 to 4 comprises: The acquisition module is used to acquire the target cutting surface of the component model and the mesh node information of the target cutting surface; The set module is used to determine multiple mesh node sets based on the structural characteristics of the component model. Each mesh node set includes at least one mesh node on the target switching surface. The action module is used to apply a unit load to the mesh nodes in each mesh node set to obtain the stress basis function, displacement basis function and corresponding support reaction function of the target cutting surface; The construction module is used to construct the support reaction matrix and deformation matrix based on the stress basis function, displacement basis function and corresponding support reaction function of all mesh node sets; The calculation module is used to solve for the coefficient vector based on the support reaction matrix, deformation matrix and error parameters, so as to calculate the residual stress of the target cutting surface.

6. An electronic device, characterized in that, include: The device includes a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device is in operation, the processor communicates with the memory via the bus, and the processor executes the machine-readable instructions to perform the steps of the residual stress determination method as described in any one of claims 1 to 4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, performs the steps of the residual stress determination method as described in any one of claims 1 to 4.

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