Display panel and manufacturing method thereof

Abstract

This invention discloses a display panel and its fabrication method. The display panel includes a light-emitting element, a driving substrate, and a composite conductive component. The light-emitting element includes a chip electrode; the driving substrate includes a contact electrode; the composite conductive component includes an insulating frame and a conductive medium spaced apart within the insulating frame. The composite conductive component is disposed between the light-emitting element and the driving substrate to electrically connect the chip electrode and the contact electrode using the conductive medium. Through this method, the present invention can avoid short circuits between adjacent electrodes and prevent oxidation of the electrodes and the conductive medium.

Description

Technical Field

[0001] This invention relates to the field of optoelectronic display technology, and in particular to a display panel and its manufacturing method. Background Technology

[0002] In recent years, micro light-emitting display devices (such as MicroLEDs) have developed rapidly due to their excellent performance. When transferring micro light-emitting display devices onto a driving substrate, the micro light-emitting devices and the driving substrate are bonded and electrically connected. The connection between existing micro light-emitting display devices and driving substrates is generally achieved through soldering, bonding with anisotropic conductive adhesive, etc.

[0003] Among these methods, soldering has several drawbacks. First, the solder melts under pressure and heat during the soldering process, which can easily flow to adjacent electrodes, posing a short-circuit risk. Second, uneven solder deposition can lead to poor electrical contact between the electrodes and the solder, resulting in excessive contact resistance. Third, soldering methods often result in weak adhesion between the micro-light-emitting display device and the driving substrate, making it prone to detachment. While anisotropic conductive adhesive bonding can increase adhesion between the micro-light-emitting display device and the driving substrate, the contact area between the conductive particles in the anisotropic conductive adhesive and the upper and lower electrodes is too small, leading to excessive contact resistance, significant power consumption, and heat generation. Summary of the Invention

[0004] The main technical problem solved by this invention is to provide a display panel and its manufacturing method, which can avoid short circuits between adjacent electrodes and prevent the electrodes and conductive media from being oxidized.

[0005] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide a display panel, the display panel including a light-emitting element, a driving substrate and a composite conductive element, the light-emitting element including a chip electrode; the driving substrate including a contact electrode; the composite conductive element including an insulating frame and a conductive medium spaced apart in the insulating frame, the composite conductive element being disposed between the light-emitting element and the driving substrate, so as to electrically connect the chip electrode and the contact electrode using the conductive medium.

[0006] In one embodiment, the insulating frame includes a plurality of through slots arranged in an array, and the conductive medium includes a plurality of conductive blocks, which fill the through slots.

[0007] In one embodiment, the spacing between two adjacent conductive blocks is the same as the spacing between two adjacent chip electrodes / contact electrodes.

[0008] In one embodiment, the insulating frame includes a first insulating adhesive layer and a second insulating adhesive layer stacked together, the first insulating adhesive layer and the second insulating adhesive layer covering a conductive dielectric layer, the conductive dielectric layer including a plurality of conductive blocks spaced apart from each other.

[0009] In one embodiment, the first insulating adhesive layer and the second insulating adhesive layer comprise an adhesive polymer material.

[0010] In one embodiment, the area of ​​the conductive block relative to the chip electrode surface is greater than or equal to the area of ​​the chip electrode; and / or the area of ​​the conductive block relative to the contact electrode surface is greater than or equal to the area of ​​the contact electrode.

[0011] In one embodiment, the chip electrodes and / or contact electrodes have roughened surfaces to enable electrical contact between the chip electrodes and / or contact electrodes and a conductive medium.

[0012] In one embodiment, the conductive medium includes one or more of the following metals: indium, tin, silver, copper, and aluminum.

[0013] In one embodiment, the insulating frame is a glass frame or a resin frame.

[0014] In one embodiment, the thickness of the conductive medium is less than the thickness of the insulating frame, and the height from the surface of the conductive medium to the surface of the insulating frame is less than the height of the contact electrode / chip electrode.

[0015] In one embodiment, the thickness of the insulating frame is 6–20 μm, and the thickness of the conductive medium is 2–10 μm.

[0016] In one embodiment, the insulating frame includes a conductive region and a non-conductive region, with the non-conductive region surrounding the conductive region. The display panel also includes an adhesive disposed in the non-conductive region for adhering and connecting the composite conductive component and the driving substrate.

[0017] In one embodiment, the light-emitting element is a micro-LED light-emitting element.

[0018] To solve the above-mentioned technical problems, another technical solution adopted by the present invention is: to provide a method for preparing a display panel, the method comprising: aligning a composite conductive component with a driving substrate, such that the conductive medium of the composite conductive component is aligned with the contact electrode of the driving substrate; aligning a light-emitting element with the composite conductive component on the driving substrate, such that the chip electrode of the light-emitting element is aligned with the conductive medium of the composite conductive component; bonding the light-emitting element and the driving substrate, and electrically connecting the chip electrode and the contact electrode using the conductive medium.

[0019] In one embodiment, before aligning the composite conductive element with the driving substrate, the process includes: providing an insulating substrate, preferably a glass substrate or a resin substrate; performing an opening process on the insulating substrate to form a through groove; and filling the through groove with a conductive medium to form the composite conductive element.

[0020] In one embodiment, prior to aligning the composite conductive element with the driving substrate, the method includes forming an adhesive on the composite conductive element or the driving substrate for adhesively connecting the composite conductive element and the driving substrate.

[0021] In one embodiment, prior to aligning the composite conductive element with the driving substrate, the process includes: providing a first insulating adhesive layer; forming a conductive dielectric layer on the first insulating adhesive layer, the conductive dielectric layer including a plurality of spaced-apart conductive blocks; and forming a second insulating adhesive layer on the conductive dielectric layer, such that the first insulating adhesive layer and the second insulating adhesive layer cover the conductive dielectric layer to form the composite conductive element.

[0022] The beneficial effects of this invention are as follows: Unlike existing technologies, this invention provides a composite conductive component that is used to bond and connect a light-emitting element and a driving substrate. The composite conductive component includes an insulating frame and conductive media spaced apart within the insulating frame. The conductive media are used to electrically connect chip electrodes and contact electrodes. The insulating frame separates adjacent conductive media, preventing short circuits between adjacent electrodes. Furthermore, the insulating frame encapsulates adjacent electrodes, preventing oxidation of the electrodes and conductive media. Attached Figure Description

[0023] Figure 1 This is a cross-sectional structural diagram of the display panel in the embodiments of this application;

[0024] Figure 2 This is a cross-sectional structural diagram of the composite conductive element in the embodiments of this application;

[0025] Figure 3 This is a top view of the composite conductive component in the embodiments of this application;

[0026] Figure 4 This is a partially enlarged schematic diagram of the cross-sectional structure of the composite conductive component in the embodiments of this application;

[0027] Figure 5 This is a cross-sectional structural diagram of the composite conductive element in the embodiments of this application;

[0028] Figure 6 This is a schematic flowchart of the display panel manufacturing method in the embodiments of this application;

[0029] Figure 7 This is a schematic diagram of the process of manufacturing a display panel according to an embodiment of this application;

[0030] Figure 8 This is a schematic diagram of the process of manufacturing a display panel according to an embodiment of this application;

[0031] Figure 9 This is a schematic diagram of the process of manufacturing a display panel according to the embodiments of this application. Detailed Implementation

[0032] To make the purpose, technical solution and effects of this application clearer and more explicit, the following describes this application in further detail with reference to the accompanying drawings and embodiments.

[0033] Please see Figure 1 , Figure 1 This is a cross-sectional structural diagram of the display panel according to an embodiment of this application. In this embodiment, the display panel includes a light-emitting element 10, a driving substrate 20, and a composite conductive element 30.

[0034] The light-emitting element 10 is a micro-light-emitting element, such as a Micro-LED, but not limited to it. It can also be a diode array of a photodiode array detector (PDA), a MOS (Metal Oxide Semiconductor) device, a MEMS device of a micro-electro-mechanical system (MEMS), etc., but is not limited to the examples listed here. Currently, it is difficult to grow micro-light-emitting elements such as Micro-LEDs directly on glass substrates. It is necessary to rely on transfer technology to transfer micro-light-emitting elements grown on other substrates (such as sapphire substrates) to the driving substrate. After transfer, the micro-light-emitting element needs to be bonded to the driving substrate.

[0035] Specifically, the light-emitting element 10 includes a chip electrode 101, and the driving substrate 20 includes a contact electrode 201. When the light-emitting element 10 is bonded to the driving substrate 20, the chip electrode 101 and the contact electrode 201 are electrically connected to achieve signal transmission.

[0036] The chip electrode 101 comprises at least two electrodes, one serving as the anode of the light-emitting element 10 and the other as the cathode. Depending on the electrode location, the light-emitting element 10 can be a vertical structure or a flip-chip structure. In a vertical structure, the anode and cathode are located on the top and bottom sides of the light-emitting element, while in a flip-chip structure, the anode and cathode are located on the same side of the light-emitting element. Figure 1 As shown, the light-emitting element 10 has a flip-chip structure, with the two chip electrodes 101 located on the same side of the light-emitting element 10.

[0037] When the light-emitting element 10 is transferred onto the driving substrate 20, the chip electrode 101 and the contact electrode 201 are electrically connected in a one-to-one correspondence, that is, the number of contact electrodes 201 is the same as the number of chip electrodes 101. In other embodiments, the number of contact electrodes 201 may be less than the number of chip electrodes 101, that is, multiple chip electrodes may share a single contact electrode.

[0038] This application provides a composite conductive element 30, which is used to realize the electrical connection between the light-emitting element 10 and the driving substrate.

[0039] Please refer to the following: Figure 2 and Figure 3 , Figure 2 This is a cross-sectional structural diagram of the composite conductive element in the embodiments of this application. Figure 3 This is a top view schematic diagram of the composite conductive component in an embodiment of this application. In this embodiment, the composite conductive component 30 includes an insulating frame 301 and conductive media 302 spaced apart in the insulating frame 301. The conductive media 302 is used to electrically connect the chip electrode 101 and the contact electrode 201.

[0040] Specifically, the insulating frame 301 includes a plurality of arrayed through slots 303, and the conductive medium 302 includes a plurality of conductive blocks, which fill the through slots 303. In this way, adjacent conductive blocks are separated by the insulating frame 301 to insulate them from each other.

[0041] In one embodiment, the insulating frame 301 is a rigid frame such as a glass frame or a resin frame. In other words, the insulating frame 301 is a frame with a certain rigidity and heat resistance. When bonding the light-emitting element 10 and the driving substrate 20, the insulating frame 301 will not melt and flow when the conductive medium 302 is heated and melted, so that the insulating frame 301 can restrict the flow of the conductive medium 302 and achieve insulation between the electrodes.

[0042] Please see Figure 4 , Figure 4 This is a partially enlarged cross-sectional view of the composite conductive component in an embodiment of this application. In this embodiment, the thickness d2 of the conductive medium 302 is less than the thickness d1 of the insulating frame 301. That is, the conductive medium 302 does not completely fill the through groove 303 to prevent the conductive medium 302 from flowing to the adjacent electrode during bonding.

[0043] Furthermore, the height of the unfilled conductive medium 302 in the through groove 303 is less than the height of the contact electrode 201 and the chip electrode 101. In other words, the height from the surface of the conductive medium 302 to the surface of the insulating frame 301 (h1 or h2 shown in the figure) is less than the height of the contact electrode / chip electrode, so that the electrode can make full contact with the conductive medium 302 in the through groove 303.

[0044] In one embodiment, the thickness of the insulating frame 301 is 6 to 20 μm, and the thickness of the conductive medium 302 can be 2 to 10 μm.

[0045] In one embodiment, the through groove 303 is slightly larger than the contact electrode 301 and the chip electrode to facilitate subsequent lamination.

[0046] Furthermore, the spacing between two adjacent through slots 303 is the same as the spacing between two adjacent chip electrodes / contact electrodes. In this way, displacement of the chip electrodes / contact electrodes can be limited, and misalignment between the chip electrode 101 and the contact electrode 201 can be prevented, thus achieving an alignment function.

[0047] In one embodiment, the conductive medium 302 can be a conductive metal, such as any one of indium (In), tin (Sn), silver (Ag), copper (Cu), and aluminum (Al), or an alloy of these metals, such as Ti / Au / In, In / Sn, etc.

[0048] Please refer to the following: Figure 3 and Figure 5 , Figure 5 This is a cross-sectional structural diagram of the composite conductive component in an embodiment of this application. In this embodiment, the insulating frame 301 is a flexible material with a certain degree of adhesion, used to fix the light-emitting element 10 to the driving substrate 20, such as... Figure 5 As shown, the insulating frame 301 completely covers the conductive medium 302. The conductive medium 302 includes multiple conductive blocks, which are arranged in an array in the insulating frame 301. Adjacent conductive blocks are separated by insulating adhesive 301 to insulate each other.

[0049] The insulating frame 301 is made of a material with a certain degree of adhesion, or a material that has been treated to become adhesive. For example, the insulating frame 301 may include an adhesive polymer material, which is inherently adhesive and can achieve adhesion and fixation of substances. The insulating frame 301 may also be a photocurable material or a thermocurable material, which becomes adhesive after being heated or exposed to light and can be cured to achieve adhesion and fixation of substances. Furthermore, the insulating frame 301 can soften when heated or pressurized, making it detachable to expose the conductive medium 302.

[0050] Specifically, the insulating frame 301 can be an organic adhesive, and the specific type and molecular structure of the adhesive are not limited here. For example, the adhesive material can be an organic adhesive, such as thermoplastic olefin polymers (polyvinyl acetate, polyvinyl alcohol, chlorinated polyethylene, polyisobutylene, etc.), polyester, polyether, polyamide, polyacrylate, etc.; thermosetting epoxy resin, phenolic resin, etc.; or rubber-based styrene-butadiene rubber, butyl rubber, phenolic-nitrile rubber, phenolic-chloroprene rubber, etc. It can also be a thermotropic or phototropic adhesive material, which is not adhesive under normal conditions but becomes adhesive under heating or light exposure. By selecting an insulating adhesive with strong adhesion, the bonding force between the light-emitting element and the driving substrate can be improved, preventing the light-emitting element from falling off. Moreover, during bonding, a smaller pressure is required to complete the bonding between the light-emitting element and the driving substrate, without damaging the light-emitting element and the driving substrate, thus avoiding defects such as electrode damage, displacement, and substrate cracking.

[0051] This application also provides a method for preparing a composite conductive component.

[0052] When the insulating frame is a rigid frame such as a glass frame, the specific method for preparing the composite conductive component includes: providing an insulating substrate, which is a glass substrate or a resin substrate; performing an opening process on the insulating substrate, for example, using photolithography, chemical etching, TGV technology, etc., to obtain multiple through-holes; filling the through-holes with a conductive medium to form a composite conductive component.

[0053] When the insulating frame is a flexible frame such as adhesive, the specific method for preparing the composite conductive component includes: providing a first insulating adhesive layer; forming a conductive dielectric layer on the first insulating adhesive layer, which can be formed using methods such as deposition or vapor deposition to form a full-surface conductive dielectric layer; then patterning the conductive dielectric layer to obtain multiple spaced conductive blocks, for example, using photolithography or chemical etching to pattern the multiple conductive dielectric layers. The arrangement of the resulting conductive blocks is not limited, but preferably corresponds to the arrangement of the driving electrodes; forming a second insulating adhesive layer on the patterned conductive dielectric layer, so that the first and second insulating adhesive layers cover the conductive blocks to form a composite conductive component. The resulting composite conductive component has a sandwich structure, with the conductive dielectric being encapsulated in the middle. In addition to its insulating properties, the insulating adhesive also has a certain function of blocking water vapor and oxygen, protecting the conductive dielectric from oxidation and improving the stability of conductivity.

[0054] The insulating adhesive used in the first insulating layer and the second insulating layer can be the same or different, and their thicknesses can be the same or different. The thickness of the first insulating adhesive and / or the second insulating adhesive can be 2–10 μm, the thickness of the conductive dielectric layer can be 2–10 μm, and the total thickness of the resulting composite conductive component can be 6–20 μm.

[0055] This composite conductive component can be used to bond light-emitting elements and driving substrates, enhancing the adhesion between the light-emitting elements and the driving substrate, making the light-emitting elements less prone to detachment; there is an insulating adhesive separating adjacent electrodes, which can prevent short circuits between adjacent electrodes, and the insulating adhesive wrapping between adjacent electrodes can prevent the electrodes and conductive media from being oxidized; it can increase the contact area between the electrodes of the light-emitting element and the electrodes of the driving substrate, reduce the contact resistance, and enhance the bonding force between the electrodes.

[0056] Please refer to the following: Figure 6 and Figure 7 , Figure 6 This is a schematic flowchart of the display panel manufacturing method in the embodiments of this application. Figure 7 This is a schematic diagram illustrating the process of a display panel fabrication method according to an embodiment of this application. In this embodiment, the insulating frame is a flexible frame such as adhesive, and the display panel fabrication method includes:

[0057] S110: Align the composite conductive component with the driving substrate, so that the conductive medium of the composite conductive component is aligned with the position of the contact electrode of the driving substrate.

[0058] Specifically, a composite conductive component is provided, comprising a first insulating adhesive layer, a conductive dielectric layer, and a second insulating adhesive layer stacked together. The first and second insulating adhesive layers cover the conductive dielectric layer, which includes a plurality of spaced-apart conductive blocks. The composite conductive component is manufactured using the method described in the above embodiment. Figure 7 As shown, the conductive medium 302 includes multiple conductive blocks. The number of conductive blocks is the same as the number of contact electrodes 201, and their positions correspond one-to-one. This requires that the spacing between two adjacent conductive blocks be the same as the spacing between two adjacent contact electrodes 201.

[0059] S120: Align the light-emitting element with the composite conductive component on the driving substrate, so that the chip electrode of the light-emitting element is aligned with the conductive medium of the composite conductive component.

[0060] like Figure 7 As shown, the number of chip electrodes 101 is the same as the number of contact electrodes 201, and the number of chip electrodes 101 is the same as the number of conductive blocks, and their positions correspond one-to-one. When the positions of chip electrodes 101 and conductive blocks are aligned, the positions of chip electrodes 101 and contact electrodes 201 are also aligned.

[0061] S130: Bonds the light-emitting element and the driving substrate, and uses a conductive medium to electrically connect the chip electrode and the contact electrode.

[0062] The first and second insulating adhesive layers include adhesive polymer materials that can adhere and fix the light-emitting element and the driving substrate.

[0063] In one embodiment, the chip electrode 101 and / or contact electrode 201 have roughened surfaces to make the chip electrode 101 and / or contact electrode 201 electrically contact the conductive medium 302.

[0064] like Figure 8 As shown, Figure 8 This is a schematic diagram of the display panel fabrication method according to an embodiment of this application. In this embodiment, the surfaces of the chip electrode 101 and / or the contact electrode 201 are rough and uneven, possessing a certain degree of penetrability and destructiveness. Specifically, the surfaces of the chip electrode 101 and the contact electrode 201 can be roughened to make the electrode surfaces rough. For example, the electrode surfaces can be treated by photolithography or chemical etching, or by plasma roughening treatment, etc., to give the electrodes a rough surface.

[0065] When bonding the light-emitting element 10 and the driving substrate 20, pressure is applied to the light-emitting element 10 and the driving substrate 20. The roughened electrode surface can pierce the insulating frame 301, thereby contacting the conductive medium 302 inside the insulating frame 301, realizing the electrical connection between the chip electrode 101 and the contact electrode 201. Furthermore, the roughened electrode can increase the contact area with the conductive medium, reduce the contact resistance, and improve the bonding force between the two.

[0066] In one embodiment, the conductive medium 302 includes a plurality of conductive blocks, wherein the area of ​​the conductive blocks relative to the surface of the chip electrode 101 is greater than or equal to the area of ​​the chip electrode 101; and / or the area of ​​the conductive blocks relative to the surface of the contact electrode 201 is greater than or equal to the area of ​​the contact electrode 201. In this way, the chip electrode 101 and the contact electrode 201 can be in contact with the conductive medium 302 to the greatest extent possible, increasing the contact area and reducing the contact resistance. However, considering the narrow distance between adjacent electrodes, the spacing between the conductive blocks should be controlled within an effective range, i.e., it is necessary to ensure relative insulation between the conductive blocks to avoid short circuits.

[0067] In one embodiment, when bonding the light-emitting element 10 and the driving substrate 20, the composite conductive adhesive 30 can be heated. After heating, the insulating frame 301 melts and softens, becoming more fluid. This facilitates the electrodes to pass through and contact the conductive medium 302. Furthermore, it can fill the spaces between the electrodes, providing protection for the electrodes and the conductive medium, improving the stability of the structure, preventing corrosion by water vapor and oxygen, and isolating and insulating adjacent electrodes to prevent short circuits.

[0068] In this embodiment, conductive metal is patterned into an array and sandwiched between upper and lower insulating frames to form a conductive composite. This creates an insulating medium between adjacent patterned metal elements, preventing short circuits between adjacent electrodes during the pressurized heating and welding process. The insulating medium used to encapsulate the conductive medium has a certain degree of viscosity, allowing for a stable connection between the light-emitting element and the driving substrate. Compared to existing solder bonding methods, this improves the bonding strength between the chip electrodes and contact electrodes. In this method, the conductive metal in the patterned conductive composite forms surface contact with the chip electrodes and contact electrodes, resulting in a larger contact area and lower contact resistance. Compared to existing bonding methods using anisotropic conductive adhesive, this avoids the problem of excessive contact resistance caused by conductive particles contacting electrode points during anisotropic conductive adhesive bonding. After bonding, the adhesive in the conductive composite encapsulates the conductive medium and electrodes, preventing water and oxygen from entering and oxidizing the solder metal and electrodes, thus achieving an encapsulation and water / oxygen isolation effect.

[0069] Please refer to the following: Figure 6 and Figure 9 , Figure 9 This is a schematic diagram illustrating the process of manufacturing a display panel according to an embodiment of this application. In this embodiment, the insulating frame 301 is a rigid frame such as a glass frame, and the manufacturing method of the display panel includes:

[0070] A composite conductive element is provided, comprising an insulating frame including a plurality of through-grooves arranged in an array, and a conductive medium including a plurality of conductive blocks filling the through-grooves. The composite conductive element is manufactured using the method of the above-described embodiment.

[0071] In this embodiment, the insulating frame has no adhesive force. Therefore, before aligning the composite conductive element with the driving substrate, an adhesive is formed on the composite conductive element or the driving substrate to adhere and connect the composite conductive element and the driving substrate.

[0072] Specifically, the composite conductive component 30 includes a conductive region and a non-conductive region, with the non-conductive region surrounding the conductive region. An adhesive 40 is disposed in the non-conductive region to bond and fix the composite conductive component 30 and the driving substrate 20 when they are aligned. The adhesive 40 is a viscous polymer adhesive or similar material. By disposing of the adhesive 40 in the non-conductive region, the edges of the driving substrate 20 are sealed with adhesive to prevent subsequent water and oxygen from entering the oxidation electrode and / or the conductive medium.

[0073] Furthermore, the number of through-slots is the same as the number of contact electrodes. When the composite conductive component is aligned with the driving substrate, the positions of the through-slots and contact electrodes correspond one-to-one, that is, the distance between two adjacent through-slots is the same as the distance between two adjacent contact electrodes. Similarly, when the light-emitting element is aligned with the composite conductive component, the positions of the through-slots and chip electrodes correspond one-to-one.

[0074] The light-emitting element and the driving substrate are bonded together to electrically connect the chip electrode and the contact electrode. In this embodiment, the chip electrode and the contact electrode also have roughened surfaces, which can increase the contact area between the chip electrode, the contact electrode and the conductive medium.

[0075] In this embodiment, by selecting a rigid insulating frame, the insulating frame will not melt or deform during the bonding of the light-emitting element and the driving substrate. This prevents the conductive medium from flowing to adjacent electrodes and causing short circuits, and also serves a positioning function to prevent electrode displacement. Simultaneously, the conductive metal in the conductive composite forms surface contact with the chip electrodes and contact electrodes, resulting in a larger contact area and lower contact resistance. Compared to existing bonding methods using anisotropic conductive adhesives, this avoids the problem of excessive contact resistance caused by conductive particles contacting electrode points during the anisotropic conductive adhesive bonding process.

[0076] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this invention.

Claims

1. A display panel, characterized by, include: Light-emitting elements, including chip electrodes; The driving substrate includes contact electrodes; A composite conductive element includes an insulating frame and a conductive medium spaced apart within the insulating frame. The composite conductive element is disposed between a light-emitting element and a driving substrate to electrically connect the chip electrode and the contact electrode using the conductive medium. The insulating frame includes a plurality of arrayed through-grooves, and the conductive medium includes a plurality of conductive blocks filling the through-grooves. The thickness of each conductive block is less than the thickness of the insulating frame, and the height from the surface of the conductive block to the surface of the insulating frame is less than the height of the contact electrode / chip electrode. The spacing between two adjacent conductive blocks is the same as the spacing between two adjacent chip electrodes / contact electrodes. The area of ​​each conductive block relative to the surface of the chip electrode is greater than or equal to the area of ​​the chip electrode. The area of ​​each conductive block relative to the surface of the contact electrode is greater than or equal to the area of ​​the contact electrode.

2. The display panel according to claim 1, characterized in that, The insulating frame is a glass frame or a resin frame.

3. The display panel according to claim 1, characterized in that, The insulating frame includes a first insulating adhesive layer and a second insulating adhesive layer stacked together, the first insulating adhesive layer and the second insulating adhesive layer covering the conductive dielectric layer, and the conductive dielectric layer including a plurality of conductive blocks spaced apart from each other.

4. The display panel according to claim 3, characterized in that, The first insulating adhesive layer and the second insulating adhesive layer comprise adhesive polymer materials.

5. The display panel according to claim 1, characterized in that, The conductive medium includes one or more of the following metals: indium, tin, silver, copper, and aluminum.

6. The display panel according to claim 1, characterized in that, The thickness of the insulating frame is 6~20μm, and the thickness of the conductive medium is 2~10μm.

7. The display panel according to claim 1, characterized in that, The insulating frame includes a conductive region and a non-conductive region, the non-conductive region surrounding the conductive region, and the display panel further includes: An adhesive is disposed in the non-conductive area for adhering and connecting the composite conductive element to the driving substrate.

8. The display panel according to claim 1, characterized in that, The chip electrodes and / or the contact electrodes have roughened surfaces.

9. A method for manufacturing a display panel, characterized in that, include: Align the composite conductive component with the driving substrate, such that the conductive medium of the composite conductive component is aligned with the position of the contact electrode of the driving substrate. Align the light-emitting element with the composite conductive element on the driving substrate, so that the chip electrode of the light-emitting element is aligned with the conductive medium of the composite conductive element. The light-emitting element and the driving substrate are bonded together, and the chip electrode and the contact electrode are electrically connected by the conductive medium. Before aligning the composite conductive element with the driving substrate, the following steps are included: Provide insulating substrate; The insulating substrate is perforated to form a through groove; The through-groove is filled with a conductive medium to form the composite conductive component; Wherein, the thickness of the conductive medium is less than the thickness of the insulating substrate, and the height from the surface of the conductive medium to the surface of the insulating substrate is less than the height of the contact electrode / the chip electrode; the spacing between two adjacent conductive media is the same as the spacing between two adjacent chip electrodes / contact electrodes; the area of ​​the conductive medium relative to the surface of the chip electrode is greater than or equal to the area of ​​the chip electrode; the area of ​​the conductive medium relative to the surface of the contact electrode is greater than or equal to the area of ​​the contact electrode.

10. The method for manufacturing a display panel according to claim 9, characterized in that, The insulating substrate is a glass substrate or a resin substrate.

11. The method for manufacturing a display panel according to claim 9, characterized in that, Before aligning the composite conductive element with the driving substrate, the following steps are included: An adhesive is formed on the composite conductive element or the driving substrate for bonding the composite conductive element to the driving substrate.

12. The method for manufacturing a display panel according to claim 9, characterized in that, Before aligning the composite conductive element with the driving substrate, the following steps are included: Provide the first insulating adhesive layer; A conductive dielectric layer is formed on the first insulating adhesive layer, the conductive dielectric layer comprising a plurality of conductive blocks spaced apart from each other; A second insulating adhesive layer is formed on the conductive dielectric layer, so that the first insulating adhesive layer and the second insulating adhesive layer cover the conductive dielectric layer to form the composite conductive component.

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