Controller and new energy vehicle

Abstract

The present disclosure provides a controller and a new energy automobile, wherein the controller comprises an integrated mainboard, the integrated mainboard comprises a first circuit board and a main control module, a voltage sampling module and a PDU module; the main control module, the voltage sampling module and the PDU module are all arranged on the first circuit board; the voltage sampling module is electrically connected with the main control module, and the PDU module is electrically connected with the main control module. In the present disclosure, due to the reduction of the circuit board, the space of the controller is released, the volume of the controller is correspondingly reduced, the manufacturing and use of the corresponding supporting sheet metal parts are reduced, the number of the pin socket and other connectors and the lead wires between the circuit boards are also reduced, the integration is improved while the function is ensured, the space utilization is increased, the cost is reduced, and the controller structure is simpler, so the assembly and maintenance are easier.

Description

Technical Field

[0001] This disclosure relates to the field of new energy vehicle technology, and in particular to a controller and a new energy vehicle. Background Technology

[0002] The environmental pollution and energy shortages caused by traditional gasoline-powered vehicles have become increasingly prominent. New energy vehicles, characterized by low noise and zero pollution, can reduce dependence on petroleum. The replacement of traditional gasoline-powered vehicles with new energy vehicles has become a global trend. Beyond passenger cars, new energy logistics vehicles also possess enormous market potential.

[0003] As a core component of new energy vehicles, controllers are developing towards higher power density and higher integration. Currently, most controllers in traditional new energy vehicles have low integration, with multiple functional modules installed independently. These require independent main control solutions and circuit boards, increasing connectors and wiring, which is not conducive to maintenance and results in high manufacturing costs. Summary of the Invention

[0004] In view of this, in order to solve the technical problems that most controllers of new energy vehicles in the prior art have low integration, multiple functional modules are installed independently, require independent main control solutions and circuit boards, and increase connectors and leads, which are not conducive to maintenance and have high manufacturing costs, this disclosure provides a controller and a new energy vehicle.

[0005] According to a first aspect of the present disclosure, a controller is provided, the controller including an integrated motherboard, the integrated motherboard including a first circuit board and a main control module, a voltage sampling module and a PDU module;

[0006] The main control module, the voltage sampling module, and the PDU module are all mounted on the first circuit board;

[0007] The voltage sampling module is electrically connected to the main control module, and the PDU module is also electrically connected to the main control module.

[0008] In one optional implementation, the main control module includes a DSP chip, the main control system of the main control module is built into the DSP chip, and the PDU system of the PDU module is built into the DSP chip.

[0009] In one optional implementation, the PDU module includes a relay drive circuit, which includes a switching transistor circuit composed of switching transistors.

[0010] In one alternative implementation, the controller includes an integrated bus capacitor module, which comprises a bus capacitor module and a Y capacitor module.

[0011] In one optional implementation,

[0012] The Y-capacitor module is fixedly connected to the negative copper busbar of the bus capacitor module; and / or,

[0013] The controller includes a housing, and the Y capacitor module is fixedly connected to the housing.

[0014] In an optional implementation, the controller includes an integrated DC / DC module, which includes a third circuit board, a DC / DC module, and an OBC module, both of which are mounted on the third circuit board.

[0015] In one alternative implementation, the controller includes a housing, with the integrated motherboard and the integrated bus capacitor module located on the same side of the housing.

[0016] In one optional implementation, the controller includes an integrated bus capacitor module, the integrated motherboard and the integrated bus capacitor module are located on a first side of the housing, the integrated capacitor module is located on a second side of the housing, and the first side and the second side are opposite sides.

[0017] In one optional implementation,

[0018] The voltage sampling module is disposed adjacent to the main control module, and the voltage sampling module is electrically connected to the main control module through a first pin connector and a first wire harness; and / or,

[0019] The PDU module is arranged adjacent to the main control module, and the PDU module is electrically connected to the main control module through a second pin connector and a second wire harness.

[0020] According to a second aspect of the present disclosure, a new energy vehicle is provided, the new energy vehicle including a controller as described in the first aspect.

[0021] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: In this disclosure, the main control module, voltage sampling module and PDU module in the controller can be integrated on the first circuit board to serve as the integrated motherboard of the controller. Due to the reduction of the circuit board, the space of the controller is freed up, the size of the controller is reduced accordingly, and the manufacturing and use of corresponding supporting sheet metal parts are also reduced. At the same time, the number of connectors such as pin sockets and the leads between circuit boards are also reduced. While ensuring functionality, the integration is improved, the space utilization is increased, and the cost is reduced. Moreover, since the controller structure is simpler, it is also easier to assemble and maintain.

[0022] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0026] Figure 1 This is a schematic diagram of the structure of the first side of the controller according to an exemplary embodiment.

[0027] Figure 2 This is a block diagram illustrating an integrated motherboard according to an exemplary embodiment.

[0028] Figure 3 This is a block diagram illustrating an integrated bus capacitor module according to an exemplary embodiment.

[0029] Figure 4 This is a schematic diagram of the structure of the second side of the controller according to an exemplary embodiment.

[0030] Figure 5 This is a block diagram illustrating an integrated DC / DC module according to an exemplary embodiment.

[0031] Figure 6 This is a schematic diagram of an electrical principle according to an exemplary embodiment. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0034] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0035] To address the technical problems of low integration in existing controllers for new energy vehicles, where multiple functional modules are independently installed, requiring separate main control solutions and circuit boards, increasing connectors and wiring, hindering maintenance, and resulting in high manufacturing costs, this disclosure provides a controller and a new energy vehicle. The controller integrates the main control module, voltage sampling module, and PDU module (energy distribution module) onto a first circuit board, serving as the controller's integrated mainboard. This reduction in circuit boards frees up space, reduces the controller's size, and decreases the fabrication and use of supporting sheet metal parts. It also reduces the number of connectors such as pin headers and the wiring between circuit boards. While maintaining functionality, this improves integration, increases space utilization, and reduces costs. Furthermore, the simpler controller structure makes assembly and maintenance easier.

[0036] In one exemplary embodiment, a controller is provided. This controller can be used as a controller for a new energy vehicle. The new energy vehicle can be a logistics vehicle or a passenger vehicle; there is no limitation thereto.

[0037] refer to Figure 1 and Figure 2 As shown, the controller may include an integrated motherboard 1. The integrated motherboard 1 may include a first circuit board 11 and structures such as a main control module 12, a voltage sampling module 13, and a PDU module 14. The main control module 12, the voltage sampling module 13, and the PDU module 14 may all be mounted on the first circuit board 11 to achieve an integrated design of the main control module 12, the voltage sampling module 13, and the PDU module 14.

[0038] The voltage sampling module 13 is electrically connected to the main control module 12. The voltage sampling module 13 and the main control module 12 can be arranged adjacent to each other to facilitate electrical connection. For example, the voltage sampling module 13 can be electrically connected to the main control module 12 via a first pin connector and a first wiring harness. The first pin connector not only enables electrical connection between the voltage sampling module 13 and the main control module 12 but also facilitates relative fixation between them.

[0039] It should be noted that, in addition to the above-mentioned method, the voltage sampling module 13 and the main control module 12 can also be electrically connected in other ways, and there is no limitation on this.

[0040] The PDU module 14 is electrically connected to the main control module 12. The voltage sampling module 13 and the main control module 12 can be arranged adjacent to each other to facilitate electrical connection between them. For example, the PDU module 14 can be electrically connected to the main control module 12 via a second pin connector and a second wiring harness. The second pin connector not only enables electrical connection between the PDU module 14 and the main control module 12, but also facilitates relative fixation between the PDU module 14 and the main control module 12.

[0041] It should be noted that, in addition to the above-mentioned method, the PDU module 14 and the main control module 12 can also be electrically connected in other ways, and there is no limitation on this.

[0042] In this controller, the main control module 12, voltage sampling module 13, and PDU module 14 are integrated on the first circuit board 11 as the integrated motherboard 1 of the controller. Due to the reduction of the circuit board, the space of the controller is freed up, the size of the controller is reduced accordingly, and the production and use of corresponding supporting sheet metal parts are also reduced. At the same time, the number of connectors such as pin sockets and the leads between circuit boards are also reduced. While ensuring functionality, the integration is improved, the space utilization is increased, and the cost is reduced. Moreover, because the controller structure is simpler, it is also easier to assemble and maintain.

[0043] In one exemplary embodiment, a controller is provided. (Reference) Figure 1 and Figure 2As shown, in this controller, the main control module 12 may include a DSP chip 121 (digital signal processing chip), wherein the main control system of the main control module 12 is built into the DSP chip 121 to realize the corresponding functions of the main control module 12.

[0044] The PDU system (also known as the PDU minimum system) of PDU module 14 can also be built into DSP chip 121 to realize the corresponding functions of PDU module 14. That is to say, in this controller, PDU module 14 can share the DSP chip 121 of main control module 12 to reduce costs.

[0045] It should be noted that in related solutions, the PDU minimum system of PDU module 14 generally uses a separate DSP chip 121. In the controller disclosed herein, the PDU minimum system and the main control system can be integrated into the same DSP chip 121, which can reduce the number of chips used and lower costs.

[0046] In addition, PDU functions generally include PDU power supply circuitry, CAN communication circuitry, and relay driver circuitry. In related technologies, relay driver circuits mostly use off-the-shelf chips for driving; however, this disclosure uses a self-built switching transistor circuit (not shown in the figure) for driving, to better reduce costs. The switching transistor circuit can be selected from transistors and / or diodes according to actual needs, and there is no limitation on this.

[0047] In this controller, the PDU module 14 can share the DSP chip 121 of the main control module 12, thereby reducing the use of the DSP chip 121 and further reducing costs. In addition, the relay drive circuit of the PDU module 14 can use a self-built switching transistor circuit to further reduce costs.

[0048] In one exemplary embodiment, a controller is provided. (Reference) Figure 1 and Figure 3 As shown, the controller may include an integrated bus capacitor module 22. The integrated bus capacitor module 22 may include a bus capacitor module 22 and a Y capacitor module 23. That is, in this controller, the bus capacitor module 22 and the Y capacitor module 23 can be integrated together to form the integrated bus capacitor module 22, thereby reducing the use of circuit boards and improving space utilization.

[0049] One end of the Y-capacitor module 23 can be fixedly connected to the negative copper busbar of the bus capacitor module 22, achieving both mechanical fixation of the Y-capacitor module 23 and electrical connection between the Y-capacitor module 23 and the bus capacitor module 22. The fixed connection can include fastener connections, snap-fit ​​connections, adhesive connections, welding connections, etc., and is not limited thereto. Fasteners can include screws or bolts, etc. For example, the Y-capacitor module 23 can be fastened to the negative copper busbar of the bus capacitor module 22 using screws.

[0050] The controller may include a housing 4, and the other end of the Y-capacitor module 23 may be fixedly connected to the housing 4. The method of fixed connection is similar to the fixed connection between the Y-capacitor module 23 and the negative copper busbar of the bus capacitor module 22, and will not be elaborated further. For example, the Y-capacitor module 23 may be fastened to the housing 4 with screws.

[0051] In this controller, the bus capacitor module 22 and the Y capacitor module 23 are integrated together to form an integrated bus capacitor module 22 module 2, thereby reducing the use of circuit boards, improving space utilization, and further reducing costs.

[0052] In one exemplary embodiment, a controller is provided. (See reference...) Figure 4 and Figure 5 As shown, the controller may include an integrated DC / DC module 3. The integrated DC / DC module 3 may include a third circuit board 31, a DC / DC module 32, and an OBC module 33 (on-board charger). Both the DC / DC module 32 and the OBC module 33 are mounted on the third circuit board 31 to form the integrated DC / DC module 3. By adding the OBC module 33, this controller greatly facilitates the charging needs of new energy vehicles equipped with it.

[0053] The third circuit board 31 can be fixedly connected to the housing 4 of the controller to improve the reliability of the third circuit board 31. The specific method of fixed connection can be referred to the fixed connection between the Y capacitor module 23 and the housing 4, and will not be described in detail here.

[0054] The controller may include a housing 4, an integrated motherboard 1, and an integrated bus capacitor module 22. The module 2 may be located on the first side of the housing 4, and the integrated capacitor module may be located on the second side of the housing 4. The first side and the second side are opposite sides, so as to make better and more reasonable use of the space of the housing 4 and further improve the space utilization rate.

[0055] In one exemplary embodiment, a controller is provided. (Reference) Figures 1 to 5As shown, the controller's functions may include a main drive, PDU, DC / DC converter, OBC, etc. The integrated motherboard 1 of the controller integrates the main control, PDU, and voltage sampling functions. That is, the integrated motherboard 1 includes a main control module 12, a PDU module 14, and a voltage sampling module 13.

[0056] The main control module 12 may include circuits for power supply, resolver, drive function, electronic temperature sampling, phase current sampling, and phase current hardware overcurrent protection. The main control module 12 may also include a DSP chip 121, and the main control system of the main control module 12 (also known as the minimum system of the main control) is set in the DSP chip 121.

[0057] PDU module 14 is for high-voltage distribution, and its distribution targets may include the main drive module, main drive pre-charge module, air conditioning module, air conditioning pre-charge module, and PTC (heating) module, etc. The electrical schematic diagram is as follows: Figure 6 As shown, the high-voltage battery supplies power to each functional module through relays and fuses. In the schematic diagram, 'K' represents a relay, 'F' represents a fuse, 'C' represents a capacitor, and 'R' represents a resistor. F1 is the main fuse, K9 is the relay in the control circuit of the fast charging module, F8 is the fuse corresponding to the slow charging module, K8 is the relay corresponding to the slow charging module, F9 is the fuse electrically connected to the OBC, K5 is the relay corresponding to the air conditioning pre-charge module, K3 is the relay corresponding to the air conditioning module, R3 is the resistor corresponding to the air conditioning pre-charge module, F6.1 is the fuse corresponding to the air conditioning module, F7 is the fuse corresponding to the PTC module, K7 is the relay corresponding to the PTC module, and F4 is the fuse corresponding to the battery. The battery can be a low-voltage battery. The DC / DC module 32 is electrically connected to the battery. The DC / DC module 32 can convert the 336V level to the 13.5V level, thereby charging the battery of the new energy vehicle. K1 is the relay corresponding to the main drive pre-charge module, K2 is the relay corresponding to the main drive module, R1 is the resistor corresponding to the main drive pre-charge module, C1 is the bus capacitor module 22, R2 is the discharge resistor corresponding to the bus capacitor module 22, and M is the motor.

[0058] Controllers in related technologies generally employ a discrete design, comprising a Y-capacitor module 23, a voltage sampling module 13, a PDU module 14, a main control module 12, a drive module, and a DC / DC module 32. This disclosure integrates the voltage sampling, PDU, main control, and Y-capacitor module 23 modules. Specifically, the voltage sampling module 13, PDU module 14, and main control module 12 are all integrated on the first circuit board 11 to form an integrated main board 1. The Y-capacitor module 23 is integrated on the bus capacitor module 22; that is, the Y-capacitor module 23 and the bus capacitor module 22 are integrated on the second circuit board 21 to form an integrated bus capacitor module 22. Furthermore, compared to related technologies, the controller in this disclosure adds an OBC module 33 and integrates the OBC module 33 onto the DC / DC module 32 in related technologies, thereby obtaining an integrated capacitor module.

[0059] The voltage sampling module 13 may include high-voltage sampling circuits for the bus, fast charging module, slow charging module, main drive module, air conditioning module, PTC module, and OBC module 33. Related technologies employ analog sampling schemes, using analog optocouplers and isolated power supplies to ultimately output specific sampled values. This disclosure utilizes a digital sampling scheme, which reduces the use of operational amplifiers and isolated power supplies compared to analog sampling schemes, and the optocouplers used are of lower cost. Ultimately, high and low levels are output to the DSP chip 121.

[0060] PDU module 14 may include PDU power supply circuit, PDU minimum system, CAN communication circuit and relay drive circuit. In related technologies, the PDU minimum system uses a separate DSP chip 121. This disclosure reduces the use of DSP chip 121. The PDU minimum system can share a DSP chip 121 with the main control module 12 to reduce costs and simplify the structure.

[0061] For relay drive circuits, most related technologies use finished chips for driving. This disclosure can use a self-built switching transistor circuit for driving, so as to further reduce costs.

[0062] The above solution integrates the voltage sampling module 13, PDU module 14, and main control module 12 onto the first circuit board 11, reducing the area of ​​the supporting sheet metal parts and the corresponding fasteners. The voltage sampling module 13 and the main control module 12 can be electrically connected via a first pin connector and a first wiring harness, and the PDU module 14 and the main control module 12 can be electrically connected via a second pin connector and a second wiring harness. After integration, the arrangement of pin connectors and leads between each pair is reduced, which not only lowers costs but also reduces transmission loss and interference.

[0063] In addition, the main function of the Y capacitor module 23 in the controller is filtering, and it can also be called the Y capacitor module 23 filtering module. In this disclosure, the Y capacitor module 23 can be mechanically connected to the housing 4 by screws, and can also be mechanically connected to the negative copper busbar of the bus capacitor module 22 by screws. The Y capacitor module 23 is electrically connected to the negative copper busbar of the bus capacitor module 22.

[0064] Among them, the integrated bus capacitor module 22 is a brand-new design, which integrates the Y capacitor module 23 and the bus capacitor module 22 into one, reducing the use of circuit boards and copper pillars, and freeing up controller space.

[0065] In this controller, the main control module 12, voltage sampling module 13 and PDU module 14 can be integrated on the first circuit board 11 to serve as the integrated motherboard 1 of the controller. Due to the reduction of the circuit board, the space of the controller is freed up, the size of the controller is reduced accordingly, and the production and use of corresponding supporting sheet metal parts are also reduced. At the same time, the number of connectors such as pin sockets and the leads between circuit boards are also reduced. While ensuring functionality, the integration is improved, the space utilization is increased, and the cost is reduced. Moreover, because the controller structure is simpler, it is also easier to assemble and maintain.

[0066] In one exemplary embodiment, a new energy vehicle is provided. This new energy vehicle can be a passenger car or a commercial vehicle such as a logistics vehicle; there is no limitation in this regard.

[0067] The new energy vehicle may include the controller described in the above embodiments. The main control module, voltage sampling module and PDU module of the controller can be integrated on the first circuit board as the integrated motherboard of the controller. Due to the reduction of the circuit board, the space of the controller is freed up, the size of the controller is reduced accordingly, and the manufacturing and use of corresponding supporting sheet metal parts are also reduced. At the same time, the number of connectors such as pin sockets and the leads between circuit boards are also reduced. While ensuring functionality, the integration is improved, the space utilization is increased, and the cost is reduced. Moreover, because the controller structure is simpler, it is also easier to assemble and maintain.

[0068] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0069] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0070] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A controller, characterized in that, The controller includes an integrated motherboard, which includes a first circuit board, a main control module, a voltage sampling module, and a PDU module. The main control module, the voltage sampling module, and the PDU module are all mounted on the first circuit board; The voltage sampling module is electrically connected to the main control module, and the PDU module is also electrically connected to the main control module. The main control module includes a DSP chip, the main control system of the main control module is built into the DSP chip, and the PDU system of the PDU module is built into the DSP chip; The PDU module includes a relay drive circuit, which includes a switching transistor circuit composed of switching transistors. The voltage sampling module adopts a digital sampling scheme. The voltage sampling module outputs a high level or a low level to the DSP chip through an optocoupler to achieve sampling of high voltage. The voltage sampling module is disposed adjacent to the main control module, and the voltage sampling module is electrically connected to the main control module through a first pin connector and a first wiring harness; the PDU module is disposed adjacent to the main control module, and the PDU module is electrically connected to the main control module through a second pin connector and a second wiring harness. The controller includes an integrated bus capacitor module, which includes a bus capacitor module and a Y capacitor module. The Y-capacitor module is fixedly connected to the negative copper busbar of the bus capacitor module; the controller includes a housing, and the Y-capacitor module is fixedly connected to the housing.

2. The controller according to claim 1, characterized in that, The controller includes an integrated DC / DC module, which includes a third circuit board, a DC / DC module, and an OBC module. Both the DC / DC module and the OBC module are mounted on the third circuit board.

3. The controller according to claim 1, characterized in that, The controller includes a housing, and the integrated motherboard and the integrated bus capacitor module are located on the same side of the housing.

4. The controller according to claim 3, characterized in that, The controller includes an integrated bus capacitor module. The integrated motherboard and the integrated bus capacitor module are located on the first side of the housing, and the integrated capacitor module is located on the second side of the housing. The first side and the second side are opposite sides.

5. A new energy vehicle, characterized in that, The new energy vehicle includes the controller as described in claim 4.

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