一种3D打印用纳米银浆及提升其均一性的分散方法与应用
By controlling the polarity of the reaction liquid and using the cross-linking products of the coating agent, combined with physical dispersion technology, the problems of uneven dispersion and material blockage of conductive silver paste in high-precision 3D printing were solved, achieving high-precision printing and good conductivity, and improving the stability and adhesion of nano silver paste.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ENOVATE3D (HANGZHOU) TECH DEV CO LTD
- Filing Date
- 2023-08-30
- Publication Date
- 2026-07-17
AI Technical Summary
Existing conductive silver pastes suffer from uneven dispersion, easy clogging, and incomplete or broken printed circuits in high-precision metal 3D printing processes of 10μm and below, resulting in decreased conductivity.
By employing specific dispersing solvents and coating agents and their crosslinking products, and by controlling the polarity and dispersion mode of the reaction solution, combined with physical dispersion technology, the uniform dispersion of silver particles in the nano-silver paste is ensured, avoiding agglomeration and sedimentation, and improving adhesion.
It achieves smooth material output during high-precision metal 3D printing of nano-silver paste at 10μm and below, complete circuit after high-temperature sintering, good conductivity, strong adhesion, and no need to add additional organic resin.
Smart Images
Figure CN117038201B_ABST