Display panel and preparation method therefor, display device

Abstract

The application discloses a display screen and a preparation method thereof, and a display device. The display screen comprises a display substrate, a first circuit layer, a second circuit layer and a third circuit layer. The display substrate has a first surface and a second surface opposite to the first surface. The first circuit layer is located on the first surface of the display substrate and is used for driving and controlling a light emitting unit. The second circuit layer is partially located on the second surface of the display substrate opposite to the first surface and is separated from the second surface to be used for bonding a chip. The third circuit layer is at least partially located on a side surface of the display substrate or penetrates through the display substrate to electrically connect the first circuit layer and the second circuit layer. In this way, the chip bonding area is moved out of the display substrate, so that the problems of display failure of the display screen and poor product reliability caused by temperature and pressure in the bonding process when the chip is directly bonded on the back surface of the display substrate are avoided, and the frame size of the display screen is reduced.

Description

Technical Field

[0001] This application relates to the field of display product technology, and in particular to a display screen, a method for manufacturing the same, and a display device. Background Technology

[0002] The new generation of display technology pursues large-area and diversified display effects. Due to the limitations of the manufacturing process of large-size display screens, splicing display technology has emerged. The requirements of display splicing technology are narrow bezels, reducing splicing gaps, improving human visual enjoyment, and reducing display bezels is imperative.

[0003] To reduce display bezels, current technologies typically use side-mounted traces to bring the chip bonding area to the back of the display and bond the chip there. However, temperature and pressure during the chip bonding process can easily lead to display failures, reducing product reliability. Summary of the Invention

[0004] This application mainly provides a display screen and its manufacturing method and display device to solve the problem in the prior art that the temperature and pressure during the bonding process of bonding chips to the back of the display screen cause product display failure and reduced product reliability.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display screen, the display screen including a display substrate, a first circuit layer, a second circuit layer, and a third circuit layer; the display substrate has a first surface and a second surface opposite to the first surface; the first circuit layer is located on the first surface of the display substrate; the first circuit layer is used to drive and control light-emitting units; the second circuit layer is partially located on the second surface of the display substrate, and another part is separated from the second surface for bonding chips; the third circuit layer is at least partially located on the side of the display substrate or passes through the display substrate to electrically connect the first circuit layer and the second circuit layer.

[0006] The portion of the second circuit layer that is separated from the second surface forms a movable portion, which is used to bond the chip.

[0007] The second circuit layer includes a flexible substrate and interconnects located on one side of the second surface; the interconnects are located on the surface of the flexible substrate away from the display substrate to bond the chip; or, the interconnects are enclosed within the flexible substrate and have exposed ends to bond the chip.

[0008] The flexible substrate is a polymer layer; preferably, the flexible substrate is a polyimide layer; the flexible substrate is formed on the surface of the flexible substrate away from the display substrate by a coating process or a printing process.

[0009] Wherein, the edges of the first circuit layer and the edges of the second circuit layer are both located in the non-display area near the side; one end of the third circuit layer extends to the edge of the first circuit layer away from the first surface of the display substrate and is electrically connected to the first circuit layer, and the other end extends to the edge of the second circuit layer away from the second surface of the display substrate and is electrically connected to the second circuit layer.

[0010] Alternatively, the edge of the first circuit layer is located in a non-display area near the side, one end of the third circuit layer extends to the edge of the first circuit layer away from the first surface of the display substrate and is electrically connected to the first circuit layer; the other end of the third circuit layer extends to the second surface near the non-display area of ​​the side, and the edge of the second circuit layer covers the portion of the third circuit layer that extends to the second surface of the display substrate and is electrically connected to the third circuit layer.

[0011] Alternatively, one end of the third circuit layer extends to a non-display area near the side of the first surface of the display substrate, and the edge of the first circuit layer covers the portion of the third circuit layer extending to the first surface of the display substrate and is electrically connected to the third circuit layer; the edge of the second circuit layer is located in the non-display area near the side, and the other end of the third circuit layer extends to the edge of the second circuit layer away from the second surface of the display substrate and is electrically connected to the second circuit layer.

[0012] Alternatively, one end of the third circuit layer extends to a non-display area near the side of the first surface, and the edge of the first circuit layer covers the portion of the third circuit layer extending to the first surface and is electrically connected to the third circuit layer; the other end of the third circuit layer extends to a non-display area near the side of the second surface of the display substrate, and the edge of the second circuit layer covers the portion of the third circuit layer extending to the second surface of the display substrate and is electrically connected to the third circuit layer.

[0013] Preferably, the third circuit layer is formed by a thin film deposition process and a laser patterning process.

[0014] The display screen further includes multiple light-emitting units, which are disposed on the side of the first circuit layer away from the display substrate.

[0015] The display substrate is a rigid substrate or a flexible substrate; preferably, the display substrate is a glass substrate.

[0016] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a method for manufacturing a display screen, comprising: preparing a first circuit layer on a first surface of a display substrate, preparing a second circuit layer on a second surface opposite to the first surface, and preparing a third circuit layer on a side surface; wherein the third circuit layer electrically connects the first circuit layer and the second circuit layer;

[0017] A portion of the second circuit layer is peeled off from the second surface of the display substrate to bond with the chip.

[0018] The step of fabricating a first circuit layer on a first surface of a display substrate, fabricating a second circuit layer on a second surface opposite to the first surface, and fabricating a third circuit layer on a side surface; wherein the third circuit layer electrically connects the first circuit layer and the second circuit layer specifically includes:

[0019] First, a first circuit layer is prepared on the first surface and a second circuit layer is prepared on the second surface; then, a third circuit layer is prepared on the side surface, such that the third circuit layer electrically connects the first circuit layer and the second circuit layer.

[0020] Alternatively, the first circuit layer may be fabricated on the first surface first, and the third circuit layer may be fabricated on the side surface, such that the first circuit layer and the third circuit layer are electrically connected; finally, the second circuit layer may be fabricated on the second surface, such that the second circuit layer and the third circuit layer are electrically connected.

[0021] Alternatively, the second circuit layer may be prepared first on the second surface, and the third circuit layer may be prepared on the side surface, such that the second circuit layer and the third circuit layer are electrically connected; finally, the first circuit layer may be prepared on the first surface, such that the first circuit layer and the third circuit layer are electrically connected.

[0022] Alternatively, the third circuit layer may be prepared first on the side surface, and then the first circuit layer may be prepared on the first surface and the second circuit layer may be prepared on the second surface, wherein the third circuit layer is electrically connected to the first circuit layer and the second circuit layer;

[0023] Preferably, the step of fabricating the third circuit layer on the side surface includes:

[0024] The display substrate is cut to form multiple sub-display substrates;

[0025] The third circuit layer is fabricated on the side of each of the sub-display substrates.

[0026] The step of preparing the second circuit layer on the second surface includes:

[0027] A flexible substrate is prepared on the second surface using a coating or printing process;

[0028] Connecting lines are fabricated on the surface of the flexible substrate opposite to the display substrate;

[0029] Preferably, the step of peeling a portion of the second circuit layer off the second surface of the display substrate specifically includes:

[0030] The flexible substrate is separated from the second surface at one end away from the third circuit layer by mechanical peeling.

[0031] More preferably, the step of bonding the chip to the portion stripped from the second circuit layer and the second surface specifically includes:

[0032] The angle between the portion of the second circuit layer that is peeled off and the display substrate is greater than or equal to 70 degrees and less than or equal to 90 degrees.

[0033] Specifically, the step of fabricating the third circuit layer on the side surface includes:

[0034] A metal layer is deposited on the side surface;

[0035] The non-circuit regions in the metal layer are removed using a laser patterning process.

[0036] The method for manufacturing the display screen further includes:

[0037] Multiple light-emitting units are disposed on the side of the first circuit layer away from the display substrate.

[0038] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a display device, comprising: a display screen, wherein the display screen is any of the display screens described above or a display screen prepared by any of the display screen preparation methods described above; and a chip, a portion of the second circuit layer in the display screen that is separated from the second surface.

[0039] The beneficial effects of this application are as follows: This application discloses a display screen and its manufacturing method and display device. The display screen includes a display substrate, a first circuit layer, a second circuit layer, and a third circuit layer; the display substrate has a first surface and a second surface opposite to the first surface, the first circuit layer is located on the first surface of the display substrate and is used to drive and control the light-emitting unit; the second circuit layer is partially located on the second surface of the display substrate opposite to the first surface, and another part is separated from the second surface for bonding a chip; the third circuit layer is at least partially located on the side of the display substrate or passes through the display substrate to electrically connect the first circuit layer and the second circuit layer. Through the above arrangement, the second circuit layer is disposed on the second surface of the display substrate, a portion of the second circuit layer is separated from the second surface, and the chip is bonded to the portion of the second circuit layer separated from the second surface. This allows the bonding area of ​​the chip to be removed from the display substrate, and the display screen is not affected by temperature, pressure, etc. during the bonding process. This solves the problems of display screen failure and poor product reliability caused by temperature, pressure, etc. during the chip bonding process when the chip is directly bonded to the back of the display substrate. At the same time, by electrically connecting the first circuit layer and the second circuit layer through the third circuit layer disposed on the side of the display substrate, the bezel of the display screen is reduced. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0041] Figure 1 This is a schematic diagram of the structure of an embodiment of the display device provided in this application;

[0042] Figure 2 yes Figure 1 A schematic diagram of the structure of the display screen in the first embodiment of the provided display device;

[0043] Figure 3 yes Figure 1 A schematic diagram of the structure of the display screen in the second embodiment of the provided display device;

[0044] Figure 4 yes Figure 1 A schematic diagram of the structure of the display screen in the second embodiment of the provided display device;

[0045] Figure 5 yes Figure 1 A schematic diagram of the structure of the display screen in the third embodiment of the provided display device;

[0046] Figure 6 yes Figure 1A schematic diagram of the structure of the display screen in the fourth embodiment of the provided display device;

[0047] Figure 7 This is a schematic flowchart of the method for manufacturing the display screen provided in this application;

[0048] Figure 8 yes Figure 7 A schematic diagram of the display screen structure after step S2 in the first embodiment of the provided display screen manufacturing method;

[0049] Figure 9 yes Figure 7 A schematic diagram of the structure of the display screen after step S2 in the first embodiment of the provided display screen manufacturing method;

[0050] Figure 10 yes Figure 7 A schematic diagram of the display screen structure after step S3 in the first embodiment of the provided display screen manufacturing method;

[0051] Figure 11 yes Figure 7 A schematic diagram of the display screen structure after step S1 in the second embodiment of the provided display screen manufacturing method;

[0052] Figure 12 yes Figure 7 A schematic diagram of the structure of the display screen after step S1 in the second embodiment of the provided display screen manufacturing method;

[0053] Figure 13 yes Figure 7 A schematic diagram of the structure of the display screen after step S1 in the third embodiment of the provided display screen manufacturing method;

[0054] Figure 14 yes Figure 7 A schematic diagram of the structure of the display screen after step S1 in the fourth embodiment of the provided display screen manufacturing method;

[0055] Figure 15 yes Figure 7 A schematic diagram of the display screen structure before step S12A in the fifth embodiment of the provided display screen manufacturing method;

[0056] Figure 16 yes Figure 7 A schematic diagram of the structure of the display screen after step S12A in the fifth embodiment of the provided display screen manufacturing method;

[0057] Figure 17 yes Figure 7 A schematic diagram of the display screen structure after step S12B in the fifth embodiment of the provided display screen manufacturing method. Detailed Implementation

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0059] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0060] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0061] See Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of an embodiment of the display device provided in this application. Figure 2 yes Figure 1 A schematic diagram of the structure of the first embodiment of the display screen in the provided display device.

[0062] See Figure 1 This application provides a display device 200 for implementing image display function. The display device 200 includes a display screen 100 and a chip 50, with the chip 50 bonded to the display screen 100.

[0063] The display device 200 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc., and this application does not limit it.

[0064] See Figure 2 The display screen 100 includes a display substrate 10, a first circuit layer 20, a second circuit layer 30, and a third circuit layer 40. The substrate 10 has a first surface 101 and a second surface 102 facing each other; the first circuit layer 20 is located on the first surface 101 of the display substrate 10; a portion of the second circuit layer 30 is located on the second surface 102 of the display substrate 10 to form a fixed portion 301, and another portion of the second circuit layer 30 is separated from the second surface 102 to form a movable portion 302; the third circuit layer 40 is located on the side surface 103 of the display substrate 10, and the third circuit layer 40 electrically connects the first circuit layer 20 and the second circuit layer 30; the chip 50 is bonded to the portion of the second circuit layer 30 separated from the second surface 102, that is, the chip 50 is bonded to the movable portion 302 of the second circuit layer 30. It is understood that by separating a portion of the second circuit layer 30 from the second surface 102 of the display substrate 10 to form a movable portion 302, and bonding the chip 50 to the movable portion 302 of the second circuit layer 30, the bonding area of ​​the chip 50 can be removed from the display substrate 10, so that the display screen 100 will not be affected by temperature, pressure, etc. during the bonding process of the chip 50. This solves the problems of display screen 100 failure, display screen 100 cracking, and poor product reliability caused by temperature, pressure, etc. during the bonding process of the chip 50 when the chip 50 is directly bonded to the back of the display substrate 10. At the same time, by setting the third circuit layer 40 on the side 103 of the display substrate 10 and electrically connecting the first circuit layer 20 and the second circuit layer 30 through the third circuit layer 40, the bezel of the display screen 100 can be effectively reduced.

[0065] See Figure 2 In this embodiment, the display screen 100 also includes a plurality of light-emitting units 60, and a cover plate or encapsulation layer (not shown) covering the plurality of light-emitting units 60.

[0066] A first circuit layer 20 is disposed on the first surface 101 of the display substrate 10. Multiple light-emitting units 60 are disposed on the side of the first circuit layer 20 away from the display substrate 10, for emitting light in the display screen 100. The light-emitting units 60 can be any one of LED, Mini-LED, Micro-LED, or OLED. The first circuit layer 20 is a driving circuit in the display screen 100, electrically connected to the multiple light-emitting units 60 to drive and control the light emission of the multiple light-emitting units 60, thereby controlling the display screen 100 to achieve image display function. The driving circuit includes multiple scan lines, multiple data lines, and multiple thin-film transistor (TFT) switches, etc. The display substrate 10 can be a rigid substrate or a flexible substrate; in this embodiment, the display substrate 10 is a glass substrate.

[0067] The second circuit layer 30 is disposed on the side of the display substrate 10 away from the first circuit layer 20. Specifically, the second circuit layer 30 includes a flexible substrate 31 and a first connection line 32. The flexible substrate 31 is disposed on the second surface 102 of the display substrate 10, and the first connection line 32 is disposed on the surface of the flexible substrate 31 away from the display substrate 10. The first connection line 32 is electrically connected to the driving circuit of the first circuit layer 20 through a third circuit layer 40, and electrically connects the driving circuit of the first circuit layer 20 to the chip 50. Optionally, the first connection line 32 can also be encapsulated within the flexible substrate 31 with its ends exposed to bond the chip 50. The flexible substrate 31 is a polymer layer with high flexibility and can be bent. In this embodiment, the flexible substrate 31 is a polyimide (PI) layer. The flexible substrate 31 can be formed using coating or printing processes.

[0068] In this embodiment, a portion of the second circuit layer 30 is located on the second surface 102 of the display substrate 10, while another portion of the second circuit layer 30 is separated from the second surface 102. Specifically, one end of the second circuit layer 30 near the third circuit layer 40 forms a fixed portion 301 on the second surface 102 of the display substrate 10, while the other end of the second circuit layer 30 away from the third circuit layer 40 is separated from the second surface 102, forming a movable portion 302. The movable portion 302 is bent away from the fixed portion 301 in a direction away from the second surface 102. The chip 50 is bonded to the portion of the second circuit layer 30 separated from the second surface 102, that is, the chip 50 is bonded to the end of the second circuit layer 30 away from the third circuit layer 40. Specifically, the chip 50 includes a chip-on-film (COF) 51 and a flexible circuit board (FPC) 52 interconnected. The COF 51 in the chip 50 is connected to the portion of the second circuit layer 30 separated from the second surface 102, thereby achieving bonding between the chip 50 and the second circuit layer 30, and thus enabling the chip 50 to control the display screen 100. The flexible circuit board 52 is used to connect the flip-chip film 51 to an external control circuit. It can be understood that separating the end of the second circuit layer 30 away from the third circuit layer 40 from the second surface 102 and bonding the chip 50 to the portion separated from the second surface 102 allows the bonding area of ​​the chip 50 to be removed from the display substrate 10. During the bonding process, the chip 50 will not contact the display substrate 10, and the display screen 100 will not be affected by temperature, pressure, etc., during the bonding process of the chip 50. This avoids the impact of temperature, pressure, etc., on the display screen during the chip bonding process when the chip is directly bonded to the second surface of the display substrate, which could cause problems such as display substrate cracking, display screen failure, and poor product reliability, effectively improving the performance of the display screen 100. Simultaneously, the bonding area of ​​the chip 50 is located on the side of the display substrate 10 away from the first circuit layer 20, which can effectively reduce the bezel size of the display screen 100.

[0069] The portion of the second circuit layer 30 that separates from the second surface 102 of the display substrate 10, i.e., the movable portion 302, forms an angle α with the display substrate 10 that is greater than or equal to 70 degrees and less than or equal to 90 degrees. In this embodiment, the angle α between the movable portion 302 of the second circuit layer 30 and the display substrate 10 is equal to 90 degrees. It can be understood that when the angle α is greater than or equal to 70 degrees and less than or equal to 90 degrees, the distance between the end of the movable portion 302 of the second circuit layer 30 furthest from the display substrate 10 and the second surface 102 of the display substrate 10 is greater, which ensures that the bonding area of ​​the chip 50 is farthest from the display substrate 10. When the angle α is equal to 90 degrees, the bonding area of ​​the chip 50 is farthest from the display substrate 10, which can more effectively avoid the impact of the bonding process of the chip 50 on the display screen 100. When the included angle α is outside the aforementioned range, meaning the portion of the second circuit layer 30 separated from the second surface 102 of the display substrate 10 is closer to the second surface 102 of the display substrate 10, the impact of temperature, pressure, etc., during the bonding process of the chip 50 on the display substrate 10 is greater than the impact on the display substrate 10 when the included angle α is within the aforementioned range. This invention avoids problems that could affect the performance of the display screen 100, leading to display failure and poor reliability of the display screen 100.

[0070] The display substrate 10 is divided into a display area 11 and a non-display area 12. Multiple light-emitting units 60 are located within the display area 11. The non-display area 12 is located near the side surface 103 of the display substrate 10. The side surface 103 of the display substrate 10 is connected to the first surface 101 and the second surface 102. The edges of the first circuit layer 20 and the second circuit layer 30 are both located within the non-display area 12 near the side surface 103. A third circuit layer 40 is located on the side surface 103 of the display substrate 10 and is electrically connected to the first circuit layer 20 and the second circuit layer 30. Specifically, one end of the third circuit layer 40 extends to the edge of the first circuit layer 20 on the surface away from the display substrate 10 and is electrically connected to the first circuit layer 20; the other end of the third circuit layer 40 extends to the edge of the second circuit layer 30 on the surface away from the display substrate 10 and is electrically connected to the second circuit layer 30. The third circuit layer 40 is a second connection line used to electrically connect the driving circuit and the first connection line 32. Through the electrical connection of each circuit layer, control of the display screen 100 is achieved. The third circuit layer 40 not only electrically connects the first circuit layer 20 and the second circuit layer 30, but also helps to reduce the size of the screen bezel of the display screen 100, thus realizing the design of the narrow bezel display screen 100.

[0071] The third circuit layer 40 can be formed using processes such as thin film deposition and laser patterning. For example, a metal thin film can be deposited on the side surface 103 of the display substrate 10 and at the edges of the first circuit layer 20 and the second circuit layer 30 using physical vapor deposition (PVD) processes such as sputtering, evaporation, and atomic layer deposition (ALD), or chemical vapor deposition (CVD). This ensures that the metal thin film covers the side surface 103 and the edges of the first circuit layer 20 and the second circuit layer 30 away from the surface of the display substrate 10. Then, a laser patterning process is used to laser-etch the deposited metal thin film, removing non-circuit areas, ultimately forming the third circuit layer 40 that electrically connects the first circuit layer 20 and the second circuit layer 30. In other embodiments, the third circuit layer 40 can also be electrically connected to the first circuit layer 20 and the second circuit layer 30 by passing vertically through the display substrate 10.

[0072] See Figure 3 , Figure 3 yes Figure 1 A schematic diagram of the structure of the display screen in the second embodiment of the provided display device. Figure 4 yes Figure 1 A schematic diagram of the structure of the display screen in the second embodiment of the provided display device.

[0073] See Figure 3 In this embodiment, the structures of the display substrate 10, the first circuit layer 20, and the plurality of light-emitting units 60 in the display screen 100 are the same as those in the first embodiment of the display screen 100 of this application, and will not be described again here. The difference lies in the arrangement of the second circuit layer 30 and the third circuit layer 40 in this embodiment, which is different from the arrangement in the first embodiment of the display screen 100.

[0074] The third circuit layer 40 is disposed on the side surface 103 of the display substrate 10. Specifically, one end of the third circuit layer 40 extends to the edge of the first circuit layer 20 on the surface away from the display substrate 10 and is electrically connected to the first circuit layer 20. Unlike the display screen 100 of the first embodiment, in this embodiment, as... Figure 3 As shown, the other end of the third circuit layer 40 extends directly to the edge position on the second surface 102 of the display substrate 10.

[0075] In this embodiment, the second circuit layer 30 is disposed on the surface of the display substrate 10 away from the first circuit layer 20, and a portion of the second circuit layer 30 covers the portion of the third circuit layer 40 located on the second surface 102. Specifically, the second circuit layer 30 includes a flexible substrate 31 and a first connection line 32. Unlike the display screen 100 of the first embodiment, in this embodiment, as... Figure 3As shown, a flexible substrate 31 is disposed on the second surface 102 of the display substrate 10, exposing a portion of the third circuit layer 40 located on the second surface 102. A first connection line 32 is disposed on the surface of the flexible substrate 31 away from the display substrate 10, covering the portion of the third circuit layer 40 located on the second surface 102. By covering the third circuit layer 40 with the first connection line 32, an electrical connection is achieved with the third circuit layer 40. The first connection line 32 is electrically connected to the driving circuit of the first circuit layer 20 through the third circuit layer 40, and the driving circuit of the first circuit layer 20 is electrically connected to the chip 50. The remaining structure of the second circuit layer 30 is the same as in the first embodiment of the display screen 100, and will not be described again.

[0076] See Figure 4 In one embodiment, the flexible substrate 31 in the second circuit layer 30 may also be disposed on the second surface 102 of the display substrate 10, and the flexible substrate 31 partially covers the portion of the third circuit layer 40 located on the second surface 102. The first connection line 32 is disposed on the surface of the flexible substrate 31 away from the display substrate 10, and covers the portion of the third circuit layer 40 located on the second surface 102 that is not covered by the flexible substrate 31, thereby realizing the electrical connection between the second circuit layer 30 and the third circuit layer 40.

[0077] See Figure 5 , Figure 5 yes Figure 1 A schematic diagram of the structure of the display screen in the third embodiment of the provided display device.

[0078] See Figure 5 In this embodiment, the structures of the display substrate 10, the second circuit layer 30, and the multiple light-emitting units 60 in the display screen 100 are the same as those in the first embodiment of the display screen 100 of this application, and will not be described again here. The difference lies in the arrangement of the first circuit layer 20 and the third circuit layer 40 in this embodiment, which is different from the arrangement in the first embodiment of the display screen 100.

[0079] The third circuit layer 40 is disposed on the side 103 of the display substrate 10. Unlike the display screen 100 in the first embodiment, in this embodiment, one end of the third circuit layer 40 extends directly to the edge position on the first surface 101 of the display substrate 10. The remaining structure of the third circuit layer 40 is the same as that in the first embodiment of the display screen 100, and will not be described again.

[0080] Unlike the display screen 100 in the first embodiment, in this embodiment, the first circuit layer 20 is disposed on the first surface 101 of the display substrate 10 and covers the portion of the third circuit layer 40 extending onto the first surface 101 of the display substrate 10. The first circuit layer 20 covers the portion of the third circuit layer 40, thus achieving an electrical connection between the first circuit layer 20 and the third circuit layer 40. The first circuit layer 20 is electrically connected to the first connection line 32 through the third circuit layer 40, and the driving circuit of the first circuit layer 20 is electrically connected to the chip 50.

[0081] See Figure 6 , Figure 6 yes Figure 1 A schematic diagram of the structure of the display screen in the fourth embodiment of the provided display device.

[0082] See Figure 6 In this embodiment, the structures of the display substrate 10, chip 50, and multiple light-emitting units 60 in the display screen 100 are the same as those in the first embodiment of the display screen 100 of this application, and will not be described again here. The difference lies in the arrangement of the first circuit layer 20, the second circuit layer 30, and the third circuit layer 40 in this embodiment, which is different from the arrangement in the first embodiment of the display screen 100.

[0083] Unlike the display screen 100 in the first embodiment, in this embodiment, as... Figure 6 As shown, one end of the third circuit layer 40 extends directly to the edge position on the first surface 101 of the display substrate 10; the other end extends directly to the edge position on the second surface 102 of the display substrate 10.

[0084] Unlike the display screen 100 in the first embodiment, in this embodiment, the first circuit layer 20 is disposed on the first surface 101 of the display substrate 10 and covers the portion of the third circuit layer 40 that extends to the first surface 101 of the display substrate 10. The first circuit layer 20 and the third circuit layer 40 are electrically connected by the first circuit layer 20 covering the portion of the third circuit layer 40.

[0085] Unlike the display screen 100 in the first embodiment, in this embodiment, the flexible substrate 31 in the second circuit layer 30 is disposed on the second surface 102 of the display substrate 10, and exposes the portion of the third circuit layer 40 located on the second surface 102. The first connection line 32 is disposed on the surface of the flexible substrate 31 away from the display substrate 10, and covers the portion of the third circuit layer 40 located on the second surface 102. By covering the third circuit layer 40 with the first connection line 32, an electrical connection is achieved with the third circuit layer 40.

[0086] In this embodiment, the remaining structures of the first circuit layer 20, the second circuit layer 30, and the third circuit layer 40 are the same as in the first embodiment of the display screen 100, and will not be described again. By having the first circuit layer 20 and the second circuit layer 30 respectively cover the portions of the third circuit layer 40 located on the first surface 101 and the second surface 102, the third circuit layer 40 is electrically connected to the first circuit layer 20 and the second circuit layer 30, and ultimately the driving circuit of the first circuit layer 20 is electrically connected to the chip 50.

[0087] See Figures 7 to 9 , Figure 7 This is a schematic flowchart of the method for manufacturing the display screen provided in this application. Figure 8 yes Figure 7 A schematic diagram of the display screen structure after step S2 in the first embodiment of the provided display screen manufacturing method. Figure 9 yes Figure 7 A schematic diagram of the display screen structure after step S2 in the first embodiment of the provided display screen manufacturing method. Figure 10 yes Figure 7 A schematic diagram of the structure of the display screen after step S3 in the first embodiment of the provided display screen manufacturing method.

[0088] See Figure 7 This application provides a method for fabricating a display screen 100, used to prepare the display screen 100 as described above. The method for fabricating the display screen 100 provided in this application includes the following steps:

[0089] S1: A first circuit layer is prepared on a first surface of the display substrate, a second circuit layer is prepared on a second surface opposite to the first surface, and a third circuit layer is prepared on the side surface. The third circuit layer electrically connects the first circuit layer and the second circuit layer.

[0090] Specifically, in this embodiment, a display substrate 10 is first obtained. The obtained display substrate 10 can be a rigid substrate or a flexible substrate. In this embodiment, the obtained display substrate 10 is a cuboid glass substrate. The display substrate 10 includes a first surface 101, a second surface 102 opposite to the first surface 101, and a side surface 103 connected to the first surface 101 and the second surface 102.

[0091] In this embodiment, the specific steps for step S1, which involves fabricating a first circuit layer 20 on the first surface 101 of the display substrate 10, a second circuit layer 30 on the second surface 102 opposite to the first surface 101, and a third circuit layer 40 on the side surface 103, and electrically connecting the first circuit layer 20 and the second circuit layer 30, are as follows:

[0092] S11: First, a first circuit layer is prepared on the first surface and a second circuit layer is prepared on the second surface.

[0093] Specifically, the steps for fabricating the first circuit layer 20 and the second circuit layer 30 on the first surface 101 and the second surface 102 of the display substrate 10 are as follows:

[0094] S111: Prepare a first circuit layer on the first surface.

[0095] Specifically, a first circuit layer 20 is prepared on the first surface 101 of the display substrate 10. The first circuit layer 20 can be directly fixed on the first surface 101 of the display substrate 10 by adhesive bonding. Alternatively, a metal film layer and a semiconductor layer can be deposited on the first surface 101 of the display substrate 10 by physical vapor deposition or chemical vapor deposition processes such as sputtering, evaporation, and atomic layer deposition. The non-circuit areas on the metal film layer are then removed by etching methods such as laser etching, thereby forming the first circuit layer 20.

[0096] The specific steps for fabricating the second circuit layer 30 on the second surface 102 of the display substrate 10 are as follows:

[0097] S112: Prepare a flexible substrate on the second surface.

[0098] Specifically, in this embodiment, see Figure 8 When forming a flexible substrate 31 on the second surface 102 of the display substrate 10, the prepared flexible substrate 31 can be mounted onto the second surface 102 of the display substrate 10 using an adhesive method. In this case, the formed flexible substrate 31 is a polymer layer, which has high flexibility and can be bent. Alternatively, a polymer layer can be formed on the second surface 102 of the display substrate 10 using methods such as coating or printing to form the flexible substrate 31. In this embodiment, the polymer deposited on the second surface 102 of the display substrate 10 is polyimide (PI), and the flexible substrate 31 is a polyimide layer.

[0099] See Figure 9 In one embodiment, before fabricating the flexible substrate 31 on the second surface 102, a metal sheet 70 may be disposed at one end of the second surface 102 away from the side surface 103. The metal sheet 70 may not be connected to the second surface 102 of the display substrate 10, but may simply be placed on the second surface 102. Then, according to the method for fabricating the flexible substrate 31 described above, a polymer layer is coated or printed on the second surface 102 and the surface of the metal sheet 70 away from the first surface 101 to form the flexible substrate 31. At this time, the flexible substrate 31 covers the metal sheet 70 and part of the second surface 102.

[0100] S113: Fabricate connection lines on the surface of the flexible substrate away from the display substrate.

[0101] Specifically, the first connection line 32 can be directly fixed to the surface of the flexible substrate 31 away from the display substrate 10 by adhesive bonding; or, a metal film layer and a semiconductor layer can be deposited on the surface of the flexible substrate 31 away from the display substrate 10 by physical vapor deposition or chemical vapor deposition processes such as sputtering, evaporation, and atomic layer deposition, and the non-circuit areas on the metal film layer can be removed by etching methods such as laser etching to form the first connection line 32.

[0102] In this embodiment, as Figure 8 As shown, the flexible substrate 31 prepared on the second surface 102 and the first connection line 32 prepared on the surface of the flexible substrate 31 facing away from the display substrate 10 together constitute the second line layer 30.

[0103] In one implementation, such as Figure 9 As shown, the flexible substrate 31 fabricated on the metal sheet 70 and a portion of the second surface 102, and the first connection line 32 fabricated on the surface of the flexible substrate 31 facing away from the display substrate 10, together constitute the second circuit layer 30. In this embodiment, the metal sheet 70 is not connected to the second surface 102 of the display substrate 10. In the subsequent fabrication step S2, when a portion of the second circuit layer 30 is peeled off from the second surface 102 of the display substrate 10, the metal sheet 70 is not fixed to the second surface 102 and can be easily separated. The metal sheet 70 and the second circuit layer 30 can be peeled off from the second surface 102 together without the need for mechanical peeling of the second circuit layer 30 and the second surface 102, thus avoiding the impact of the mechanical peeling process on the display substrate 10. It is understood that the bonding force between the flexible substrate 31 and the second surface 102 is usually relatively strong, and the flexible substrate 31 can be easily peeled off by setting the metal sheet 70. In the subsequent separation process of the metal sheet 70 from the flexible substrate 31, the display substrate 10 will not be affected.

[0104] Optionally, in other embodiments, when the first circuit layer 20 and the second circuit layer 30 are respectively fabricated on the first surface 101 and the second surface 102 of the display substrate 10, the second circuit layer 30 can be fabricated on the second surface 102 first according to the method in steps S112 and S113, and then the first circuit layer 20 can be fabricated on the first surface 101 according to the method in step S111. In this embodiment, only the fabrication order of the first circuit layer 20 and the second circuit layer 30 is changed; the specific fabrication method remains unchanged, and the structure of the fabricated display screen 100 will not change.

[0105] S12: Then, a third circuit layer is prepared on the side, such that the third circuit layer electrically connects the first circuit layer and the second circuit layer.

[0106] In this embodiment, the step of fabricating the third circuit layer 40 on the side surface 103 of the display substrate 10 specifically includes:

[0107] S121: Deposit a metal layer on the side.

[0108] Specifically, a metal layer can be deposited on the side surface 103 of the display substrate 10 through physical vapor deposition or chemical vapor deposition processes such as sputtering, evaporation, and atomic layer deposition. The metal layer formed by the deposition method covers the side surface 103 of the display substrate, the edge portion of the first circuit layer 20 away from the surface of the display substrate 10, and the edge portion of the second circuit layer 30 away from the surface of the display substrate 10.

[0109] S122: The non-circuit areas in the metal layer are removed using a laser patterning process.

[0110] Specifically, a laser patterning process can be used to etch the deposited metal layer, removing the non-circuit areas in the metal layer. The remaining circuit areas that are not removed by the laser eventually form the third circuit layer 40.

[0111] One end of the third circuit layer 40 extends to the edge portion of the first circuit layer 20 on the surface away from the display substrate 10 and is electrically connected to the first circuit layer 20; the other end of the third circuit layer 40 extends to the edge portion of the second circuit layer 30 on the surface away from the display substrate 10 and is electrically connected to the second circuit layer 30. The first circuit layer 20 and the second circuit layer 30 are electrically connected through the third circuit layer 40, and the driving circuit and the first connection line 32 are electrically connected through the second connection line. Through the electrical connections of the various circuit layers, control of the display screen 100 is achieved.

[0112] S2: Peel off a portion of the second circuit layer from the second surface of the display substrate.

[0113] The specific steps for peeling off a portion of the second circuit layer 30 from the second surface 102 of the display substrate 10 are as follows:

[0114] S21: Separate the flexible substrate from the second surface at the end away from the third circuit layer by mechanical peeling.

[0115] For details, see Figure 10 In this embodiment, a mechanical peeling method is used to separate the end of the flexible substrate 31 away from the third circuit layer 40 from the second surface 102 of the display substrate 10, forming a movable part 302. That is, the end of the second circuit layer 30 away from the third circuit layer 40 is peeled out of the second surface 102 and located on the side of the display substrate 10 away from the first circuit layer 20, while the end of the second circuit layer 30 close to the third circuit layer 40 remains attached and fixed to the second surface 102, forming a fixed part 301.

[0116] Preferably, after the mechanical peeling process, the angle α between the portion of the second circuit layer 30 peeled from the second surface 102 and the display substrate 10 is greater than or equal to 70 degrees and less than or equal to 90 degrees. It can be understood that when the angle α between the portion of the second circuit layer 30 peeled from the second surface 102 and the display substrate 10 is within the above range, the distance between the portion of the second circuit layer 30 peeled from the second surface 102 and the display substrate 10 is greater, facilitating the subsequent bonding of the chip 50. In this embodiment, as... Figure 10 As shown, the angle α between the portion of the second circuit layer 30 that is peeled off from the second surface 102 and the display substrate 10 is 90 degrees. That is, the portion of the second circuit layer 30 that is peeled off from the second surface 102 is perpendicular to the second surface 102 of the display substrate 10. At this time, the distance between the end of the second circuit layer 30 peeled off from the second surface 102 and the display substrate 10 is the farthest, which is most conducive to the bonding of the chip 50.

[0117] S3: Multiple light-emitting units are arranged on the side of the first circuit layer away from the display substrate.

[0118] For details, see Figure 2 A plurality of light-emitting units 60 are disposed on the surface of the first circuit layer 20 on the side away from the display substrate 10. The plurality of light-emitting units 60 are located within the display area 11. The light-emitting units 60 can be any one of LED, Mini-LED, Micro-LED, and OLED, and are used to emit light in the display screen 100.

[0119] In this embodiment, the display screen 100 can be fabricated using the above-described method to ultimately form a display screen 100 as described above. Figure 2 The display screen 100 shown.

[0120] Furthermore, this application also provides a method for fabricating a display device 200, which includes steps S1 to S3 of the method for fabricating the display screen 100 provided in this application, and further includes step S4, specifically:

[0121] S4: Bond the chip to the portion of the second circuit layer that is stripped from the second surface.

[0122] Specifically, chip 50 includes a flip-chip film 51 and a flexible circuit board 52 interconnected. The flip-chip film 51 of chip 50 is bonded to the portion of the second circuit layer 30 that is separated from the second surface 102, that is, chip 50 is bonded to the end of the second circuit layer 30 away from the second surface 102. By separating the second circuit layer 30 from the second surface 102, and bonding chip 50 to the end of the second circuit layer 30 that is separated from the second surface 102, the bonding area of ​​chip 50 is moved out of the display substrate 10. This avoids the impact of temperature, pressure, etc., on the display screen 100 during the bonding process of chip 50, which could lead to display failure, poor product reliability, and other problems.

[0123] In this application, other methods can also be used to prepare and form the display screen 100, as detailed below.

[0124] See Figure 11 and Figure 12 , Figure 11 yes Figure 7 A schematic diagram of the display screen structure after step S1 in the second embodiment of the provided display screen manufacturing method. Figure 12 yes Figure 7 A schematic diagram of the structure of the display screen after step S1 in the second embodiment of the provided display screen manufacturing method.

[0125] See Figure 11 In the method for manufacturing the display screen 100, in this embodiment, the specific manufacturing steps of the first circuit layer 20, the second circuit layer 30 and the third circuit layer 40 in step S1 are different from those in the first embodiment of the method for manufacturing the display screen 100.

[0126] Specifically, in this embodiment, step S1 involves fabricating a first circuit layer 20 on the first surface 101 of the display substrate 10, fabricating a second circuit layer 30 on the second surface 102 opposite to the first surface 101, and fabricating a third circuit layer 40 on the side surface 103; the third circuit layer 40 electrically connects the first circuit layer 20 and the second circuit layer 30. The specific steps are as follows:

[0127] S11a: First, prepare the first circuit layer on the first surface.

[0128] Specifically, in this embodiment, the specific preparation method for forming the first circuit layer 20 on the first surface 101 of the display substrate 10 is the same as the preparation method in step S111 in the first embodiment of the preparation method of the display screen 100, and will not be repeated here.

[0129] S12a: Then, a third circuit layer is prepared on the side, and the third circuit layer is electrically connected to the first circuit layer.

[0130] Unlike the first embodiment of the method for fabricating the display screen 100, in this embodiment, the third circuit layer 40 is fabricated directly after the first circuit layer 20 is formed. Specifically, the step of fabricating the third circuit layer 40 on the side surface 103 of the display substrate 10 is as follows:

[0131] S121a: Deposit a metal layer on the side.

[0132] Specifically, a metal layer can be deposited on the side surface 103 of the display substrate 10 using physical vapor deposition (PVD) or chemical vapor deposition (CVD) processes such as sputtering, evaporation, and atomic layer deposition. For example... Figure 11 As shown, a metal layer formed by deposition covers the side surface 103 of the display substrate. One end of the metal layer extends to the first circuit layer 20 and covers the edge portion of the first circuit layer 20 away from the surface of the display substrate 10. The other end of the metal layer extends directly to the second surface 102 and covers the edge position of the second surface 102 near the side surface 103.

[0133] S122a: The non-circuit areas in the metal layer are removed using a laser patterning process.

[0134] Specifically, in this embodiment, the method for laser etching of non-circuit areas is the same as in the first embodiment, and will not be described again. The third circuit layer 40 is located at the edge of the first circuit layer 20 and is electrically connected to the first circuit layer 20, that is, the driving circuit in the first circuit layer 20 is electrically connected to the second connecting circuit.

[0135] S13a: Finally, a second circuit layer is prepared on the second surface, and the second circuit layer is electrically connected to the third circuit layer.

[0136] Specifically, in this embodiment, the steps for fabricating the second circuit layer 30 on the second surface 102 are as follows:

[0137] S131a: A flexible substrate is prepared on the second surface.

[0138] In this embodiment, the method for fabricating the flexible substrate 31 on the second surface 102 is the same as the method in step S112 of the first embodiment of the display screen 100, and will not be repeated here. Unlike the first embodiment, in this embodiment, as... Figure 11 As shown, the flexible substrate 31 formed is located on the second surface 102 and exposes the portion of the third circuit layer 40 located on the second surface 102, that is, the flexible substrate 31 does not cover the edge portion of the second surface 102 near the side 103.

[0139] In one implementation, such as Figure 12As shown, the flexible substrate 31 formed can also be located on the second surface 102 and cover part of the third circuit layer 40 extending to the second surface 102, such that part of the third circuit layer 40 extending to the second surface 102 is covered by the flexible substrate 31 and the other part is exposed.

[0140] S132a: Fabricate connection lines on the surface of a flexible substrate away from the display substrate.

[0141] Specifically, in this embodiment, the method for fabricating the first connection line 32 on the surface of the flexible substrate 31 facing away from the display substrate 10 is the same as in the first embodiment of the method for fabricating the display screen 100, and will not be described again. Unlike the first embodiment, in this embodiment, as... Figure 11 As shown, the first connection line 32 is disposed on the surface of the flexible substrate 31 facing away from the display substrate 10 and on the surface of the third circuit layer 40 extending to the second surface 102 facing away from the display substrate 10. By disposing the first connection line 32 on the portion of the third circuit layer 40 extending to the second surface 102, the first connection line 32 and the third circuit layer 40 are electrically connected, thereby realizing the electrical connection between the first connection line 32 and the second connection line and the driving circuit, and realizing the control of the display screen 100.

[0142] In one implementation, such as Figure 12 As shown, the flexible substrate 31 extends to the third circuit layer 40 on the second surface 102. At this time, the first connection line 32 is disposed on the surface of the flexible substrate 31 away from the display substrate 10 and on the part of the third circuit layer 40 on the second surface 102 that is not covered by the flexible substrate 31. By disposing the first connection line 32 on the part of the third circuit layer 40 on the second surface 102 that is exposed to the flexible substrate 31, the first connection line 32 and the third circuit layer 40 are electrically connected.

[0143] In this embodiment, the specific preparation methods and steps for other structures in the preparation method of the display screen 100 are the same as those in the first embodiment of the preparation method of the display screen 100, and will not be repeated here. In this embodiment, the structure of the finally prepared display screen 100 is the same as... Figure 3 The structure of the display screen 100 shown is the same.

[0144] See Figure 13 , Figure 13 yes Figure 7 A schematic diagram of the structure of the display screen after step S1 in the third embodiment of the provided display screen manufacturing method.

[0145] See Figure 13In the method for manufacturing the display screen 100, in this embodiment, the specific manufacturing steps of the first circuit layer 20, the second circuit layer 30 and the third circuit layer 40 in step S1 are different from those in the first embodiment of the method for manufacturing the display screen 100.

[0146] Specifically, in this embodiment, step S1 involves fabricating a first circuit layer 20 on the first surface 101 of the display substrate 10, fabricating a second circuit layer 30 on the second surface 102 opposite to the first surface 101, and fabricating a third circuit layer 40 on the side surface 103; the third circuit layer 40 electrically connects the first circuit layer 20 and the second circuit layer 30. The specific steps are as follows:

[0147] S11b: First, prepare the second circuit layer on the second surface.

[0148] For details, see Figure 13 In this embodiment, the specific preparation method for forming the second circuit layer 30 on the second surface 102 of the display substrate 10 is the same as the preparation method in steps S112 and S113 in the first embodiment of the preparation method of the display screen 100, and will not be repeated here. The structure of the second circuit layer 30 formed is also the same as the structure in the first embodiment.

[0149] S12b: Then, a third circuit layer is prepared on the side, and the third circuit layer is electrically connected to the second circuit layer.

[0150] Unlike the first embodiment of the method for fabricating the display screen 100, in this embodiment, the second circuit layer 30 is formed first, and then the third circuit layer 40 is directly fabricated. Specifically, the step of fabricating the third circuit layer 40 on the side surface 103 of the display substrate 10 is as follows:

[0151] S121b: A metal layer is deposited on the side.

[0152] Specifically, a metal layer can be deposited on the side surface 103 of the display substrate 10 using physical vapor deposition (PVD) or chemical vapor deposition (CVD) processes such as sputtering, evaporation, and atomic layer deposition. For example... Figure 13 As shown, a metal layer formed by deposition covers the side surface 103 of the display substrate. One end of the metal layer extends directly to the first surface 101 and covers the edge of the first surface 101 near the side surface 103. The other end of the metal layer extends to the second circuit layer 30 and covers the edge portion of the second circuit layer 30 away from the surface of the display substrate 10.

[0153] S122b: The non-circuit areas in the metal layer are removed using a laser patterning process.

[0154] Specifically, in this embodiment, the method for laser etching the non-circuit area is the same as in the first embodiment, and will not be described again. The third circuit layer 40 is located at the edge of the second circuit layer 30 and is electrically connected to the second circuit layer 30, that is, the first connecting line 32 in the second circuit layer 30 and the second connecting line in the third circuit layer 40 are electrically connected.

[0155] S13b: Finally, a first circuit layer is prepared on the first surface, and the first circuit layer is electrically connected to the third circuit layer.

[0156] In this embodiment, the method for fabricating the first circuit layer 20 on the first surface 101 is the same as the method for fabricating the display screen 100 in the first embodiment, and will not be repeated here. In this embodiment, as Figure 13 As shown, the first circuit layer 20 is located on the first surface 101, and the third circuit layer 40 extends to the edge portion of the first surface 101 on the side away from the first surface 101. The first circuit layer 20 is disposed on the portion of the third circuit layer 40 located at the edge of the first surface 101, thereby achieving electrical connection between the driving circuit in the first circuit layer 20 and the third circuit layer 40, and further achieving electrical connection between the driving circuit and the first connection line 32 and the second connection line, thereby controlling the display screen 100 to perform image display function.

[0157] In this embodiment, the specific preparation methods and steps for other structures in the preparation method of the display screen 100 are the same as those in the first embodiment of the preparation method of the display screen 100, and will not be repeated here. In this embodiment, the structure of the finally prepared display screen 100 is the same as... Figure 5 The structure of the display screen 100 shown is the same.

[0158] See Figure 14 , Figure 14 yes Figure 7 A schematic diagram of the structure of the display screen after step S1 in the fourth embodiment of the provided display screen manufacturing method.

[0159] See Figure 14 In the method for manufacturing the display screen 100, in this embodiment, the specific manufacturing steps of the first circuit layer 20, the second circuit layer 30 and the third circuit layer 40 in step S1 are different from those in the first embodiment of the method for manufacturing the display screen 100.

[0160] Specifically, in this embodiment, step S1 involves fabricating a first circuit layer 20 on the first surface 101 of the display substrate 10, fabricating a second circuit layer 30 on the second surface 102 opposite to the first surface 101, and fabricating a third circuit layer 40 on the side surface 103; the third circuit layer 40 electrically connects the first circuit layer 20 and the second circuit layer 30. The specific steps are as follows:

[0161] S11c: First, prepare the third circuit layer on the side.

[0162] Specifically, unlike the first embodiment of the fabrication method for the display screen 100, in this embodiment, a third circuit layer 40 is first fabricated on the side 103 of the display substrate 10. The specific fabrication method of the third circuit layer 40 is the same as that in the first embodiment, both fabricated according to the methods in steps S121 and S122. In this embodiment, as... Figure 13 As shown, the third circuit layer 40 formed is located on the side 103 of the display substrate 10, with one end extending directly to the edge portion of the first surface 101 near the side 103, and the other end extending directly to the edge portion of the second surface 102 near the side 103.

[0163] S12c: Then, a first circuit layer is prepared on the first surface, and the first circuit layer is electrically connected to the third circuit layer.

[0164] Specifically, in this embodiment, the method for fabricating the first circuit layer 20 on the first surface 101 is the same as the method for fabricating the display screen 100 in the first embodiment, and will not be repeated here. In this embodiment, as... Figure 14 As shown, the structure of the first circuit layer 20 formed is the same as that in the third embodiment of the method for fabricating the display screen 100, and will not be described again. The first circuit layer 20 is electrically connected to the third circuit layer 40.

[0165] S13c: Finally, a second circuit layer is prepared on the second surface, and the second circuit layer is electrically connected to the third circuit layer.

[0166] In this embodiment, after the third circuit layer 40 and the first circuit layer 20 are formed, the second circuit layer 30 is finally formed. The method for forming the second circuit layer 30 is the same as that for the first embodiment of the method for forming the display screen 100, and will not be described again. Figure 14 As shown, in this embodiment, the structure of the second circuit layer 30 formed is the same as that of the second circuit layer 30 in the second embodiment of the method for preparing the display screen 100, and will not be described again.

[0167] Optionally, in one embodiment, after the third circuit layer 40 is formed first, the second circuit layer 30 can be formed first, followed by the first circuit layer 20. The specific preparation method is the same as that used for the first circuit layer 20 and the second circuit layer 30 described above. In this embodiment, only the preparation order of the first circuit layer 20 and the second circuit layer 30 is changed; the structure of the formed first circuit layer 20 and the second circuit layer 30 remains unchanged. After step S1, the following is obtained: Figure 14 The display screen 100 shown.

[0168] In this embodiment, the third circuit layer 40 is prepared first, and then the first circuit layer 20 and the second circuit layer 30 are prepared. This can avoid the problem of short circuits in the display screen 100 caused by sputtering metal onto the already prepared first circuit layer 20 or second circuit layer 30 during the preparation of the third circuit layer 40 using sputtering or other processes in the first embodiment of the display screen 100 preparation method.

[0169] In this embodiment, the specific preparation methods and steps for other structures in the preparation method of the display screen 100 are the same as those in the first embodiment of the preparation method of the display screen 100, and will not be repeated here. The structure of the finally prepared display screen 100 is similar to... Figure 6 The structure of the display screen 100 shown is the same.

[0170] In the embodiments of the above four display screen 100 fabrication methods, the display substrate 10 is a small-sized glass substrate, and the third circuit layer 40 is fabricated on the side 103 of the display substrate 10. The fabrication method of the third circuit layer 40 in the above display screen 100 fabrication method can be applied to small-sized display substrates 10.

[0171] For a large-size display substrate 10, the display screen 100 can be formed by first preparing the first circuit layer 20 and the second circuit layer 30, then cutting and preparing the third circuit layer 40.

[0172] See Figures 15 to 17 , Figure 15 yes Figure 7 A schematic diagram of the display screen structure before step S12A in the fifth embodiment of the provided display screen manufacturing method. Figure 16 yes Figure 7 A schematic diagram of the display screen structure after step S12A in the fifth embodiment of the provided display screen manufacturing method. Figure 17 yes Figure 7 A schematic diagram of the display screen structure after step S12B in the fifth embodiment of the provided display screen manufacturing method.

[0173] See Figure 15 In this embodiment, the display substrate 10 in the display screen 100 is a large-size display substrate 10. The fabrication method of the display screen 100 is the same as that in the first embodiment, except that the fabrication method of the third circuit layer 40 is slightly different from that in the first embodiment. Therefore, it will not be repeated here. The specific steps for fabricating the third circuit layer 40 in this embodiment are as follows:

[0174] S12A: Cut the display substrate to form multiple sub-display substrates.

[0175] Specifically, such as Figure 15As shown, before fabricating the third circuit layer 40, a first circuit layer 20 and a second circuit layer 30 have been formed on the first surface 101 and the second surface 102 of the display substrate 10, respectively. In this embodiment, as... Figure 16 As shown, the display substrate 10 is cut to form multiple smaller sub-display substrates 10a. The multiple sub-display substrates 10a have the same dimensions and include opposing first sub-surfaces 101a and second sub-surfaces 102a, as well as sub-side surfaces 103a connecting the first sub-surfaces 101a and 102a. The display screen 100 is also cut to form multiple sub-display screens 100a, and the multiple sub-display screens 100a have the same structure.

[0176] S12B: A third circuit layer is fabricated on the side of each sub-display substrate.

[0177] See Figure 17 After cutting and forming multiple small-sized sub-display substrates 10a, a third circuit layer 40 is prepared on the sub-side surface 103a of each sub-display substrate 10a. Specifically, the method for preparing the third circuit layer 40 on the sub-side surface 103a of the sub-display substrate 10a is the same as the method for preparing the third circuit layer 40 on the side surface 103a of the display substrate 10 in the first embodiment, both using the methods in steps S121 and S122, which will not be described again here.

[0178] In this embodiment, the structure of each sub-display substrate 10a formed by cutting is the same as the structure of the small-sized display substrate 10 in the above embodiment. Through the preparation method in this embodiment, the structure of the multiple sub-display screens 100a formed is also the same as the structure of the display screen 100 in the first embodiment, ultimately forming a structure as shown in the image. Figure 2 The display screen 100 shown.

[0179] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A display screen, characterized in that, include: The display substrate has a first surface and a second surface opposite to the first surface; The first circuit layer is located on the first surface of the display substrate; The first circuit layer is used to drive and control the light-emitting unit; The second circuit layer is partially located on the second surface of the display substrate, and the other part is separated from the second surface for bonding chips. and A third circuit layer, at least partially located on the side of the display substrate, electrically connects the first circuit layer and the second circuit layer; wherein the portion of the second circuit layer separated from the second surface forms a movable portion for bonding a chip; The second circuit layer includes a flexible substrate and interconnecting circuits located on one side of the second surface; The flexible substrate is formed on the second surface using a coating or printing process; the connection lines are located on the surface of the flexible substrate away from the display substrate to bond the chip; or, the connection lines are enclosed within the flexible substrate with their ends exposed to bond the chip. The third circuit layer is electrically connected to the connecting circuit. Wherein, a metal sheet is provided at the end of the second surface away from the side, and the metal sheet is not connected to the second surface; The flexible substrate is prepared by coating or printing processes and formed on the surface of the metal sheet opposite to the display substrate and part of the second surface; The active part is formed by peeling off the metal sheet together with a portion of the second circuit layer covering the surface of the metal sheet from the second surface using a peeling process, and peeling the metal sheet off from the second circuit layer.

2. The display screen according to claim 1, characterized in that, The flexible substrate is a polymer layer.

3. The display screen according to claim 2, characterized in that, The flexible substrate is a polyimide layer.

4. The display screen according to claim 1, characterized in that, The edges of the first circuit layer and the second circuit layer are both located in the non-display area near the side; one end of the third circuit layer extends to the edge of the first circuit layer away from the first surface of the display substrate and is electrically connected to the first circuit layer, and the other end extends to the edge of the second circuit layer away from the second surface of the display substrate and is electrically connected to the second circuit layer. Alternatively, the edge of the first circuit layer is located in a non-display area near the side, one end of the third circuit layer extends to the edge of the first circuit layer away from the first surface of the display substrate and is electrically connected to the first circuit layer; the other end of the third circuit layer extends to the second surface near the non-display area of ​​the side, and the edge of the second circuit layer covers the portion of the third circuit layer that extends to the second surface of the display substrate and is electrically connected to the third circuit layer. Alternatively, one end of the third circuit layer extends to a non-display area near the side of the first surface of the display substrate, and the edge of the first circuit layer covers the portion of the third circuit layer extending to the first surface of the display substrate and is electrically connected to the third circuit layer; the edge of the second circuit layer is located in the non-display area near the side, and the other end of the third circuit layer extends to the edge of the second circuit layer away from the second surface of the display substrate and is electrically connected to the second circuit layer. Alternatively, one end of the third circuit layer extends to the non-display area of ​​the first surface near the side, and the edge of the first circuit layer covers the portion of the third circuit layer extending to the first surface and is electrically connected to the third circuit layer; the other end of the third circuit layer extends to the non-display area of ​​the second surface of the display substrate near the side, and the edge of the second circuit layer covers the portion of the third circuit layer extending to the second surface of the display substrate and is electrically connected to the third circuit layer.

5. The display screen according to claim 4, characterized in that, The third circuit layer is formed by thin film deposition and laser patterning processes.

6. The display screen according to claim 1, characterized in that, The display screen also includes a plurality of light-emitting units, which are disposed on the side of the first circuit layer away from the display substrate; The display substrate is a rigid substrate or a flexible substrate.

7. The display screen according to claim 6, characterized in that, The display substrate is a glass substrate.

8. A method for manufacturing a display screen, characterized in that, include: A first circuit layer is prepared on a first surface of a display substrate, a second circuit layer is prepared on a second surface opposite to the first surface, and a third circuit layer is prepared on a side surface. The third wiring layer electrically connects the first wiring layer and the second wiring layer; A portion of the second circuit layer is peeled off from the second surface of the display substrate to bond with the chip; wherein, the portion of the second circuit layer separated from the second surface forms a movable portion for bonding the chip; the second circuit layer includes a flexible substrate and interconnects located on one side of the second surface; the flexible substrate is formed on the second surface using a coating or printing process; the interconnects are located on the surface of the flexible substrate away from the display substrate to bond the chip; or, the interconnects are encased within the flexible substrate with exposed ends to bond the chip; the third circuit layer is electrically connected to the interconnects. Prior to the step of fabricating the second circuit layer on the second surface, a metal sheet is disposed on one end of the second surface away from the side surface; the metal sheet is placed on the second surface and is not connected to the second surface. The step of preparing the second circuit layer on the second surface includes: A flexible substrate is prepared on the surface of the metal sheet opposite to the display substrate and a portion of the second surface using a coating or printing process; Connecting lines are fabricated on the surface of the flexible substrate opposite to the display substrate; The step of peeling a portion of the second circuit layer off the second surface of the display substrate specifically includes: The metal sheet, together with the second circuit layer covering the surface of the metal sheet, is peeled off from the second surface; The second circuit layer covering the surface of the metal sheet is separated from the metal sheet.

9. The method for manufacturing a display screen according to claim 8, characterized in that, The first circuit layer is prepared on the first surface of the display substrate, the second circuit layer is prepared on the second surface opposite to the first surface, and the third circuit layer is prepared on the side surface. The step of electrically connecting the first and second line layers by the third line layer specifically includes: First, the first circuit layer is prepared on the first surface and the second circuit layer is prepared on the second surface; Then, the third circuit layer is fabricated on the side surface, such that the third circuit layer electrically connects the first circuit layer and the second circuit layer; Alternatively, the first circuit layer may be fabricated on the first surface first, and the third circuit layer may be fabricated on the side surface, such that the first circuit layer and the third circuit layer are electrically connected; finally, the second circuit layer may be fabricated on the second surface, such that the second circuit layer and the third circuit layer are electrically connected. Alternatively, the second circuit layer may be prepared first on the second surface, and the third circuit layer may be prepared on the side surface, such that the second circuit layer and the third circuit layer are electrically connected; finally, the first circuit layer may be prepared on the first surface, such that the first circuit layer and the third circuit layer are electrically connected. Alternatively, the third circuit layer may be prepared first on the side surface, and then the first circuit layer may be prepared on the first surface and the second circuit layer may be prepared on the second surface, wherein the third circuit layer is electrically connected to the first circuit layer and the second circuit layer.

10. The method for manufacturing a display screen according to claim 9, characterized in that, The step of fabricating the third circuit layer on the side includes: The display substrate is cut to form multiple sub-display substrates; The third circuit layer is fabricated on the side of each of the sub-display substrates.

11. The method for manufacturing a display screen according to claim 8, characterized in that, The step of preparing the second circuit layer on the second surface includes: A flexible substrate is prepared on the second surface using a coating or printing process; Connection lines are fabricated on the surface of the flexible substrate opposite to the display substrate.

12. The method for manufacturing a display screen according to claim 11, characterized in that, The step of peeling a portion of the second circuit layer off the second surface of the display substrate specifically includes: The flexible substrate is separated from the second surface at one end away from the third circuit layer by mechanical peeling.

13. The method for manufacturing a display screen according to claim 12, characterized in that, The step of peeling a portion of the second circuit layer from the second surface of the display substrate to bond it with the chip specifically includes: The angle between the portion of the second circuit layer that is peeled off and the display substrate is greater than or equal to 70 degrees and less than or equal to 90 degrees.

14. The method for manufacturing a display screen according to claim 8, characterized in that, The step of fabricating the third circuit layer on the side specifically includes: A metal layer is deposited on the side surface; The non-circuit regions in the metal layer are removed using a laser patterning process. The method for manufacturing the display screen further includes: Multiple light-emitting units are disposed on the side of the first circuit layer away from the display substrate.

15. A display device, characterized in that, include: The display screen is the display screen as described in any one of claims 1 to 7 or the display screen prepared by the method of preparing the display screen as described in any one of claims 8 to 14; A chip, bonded to the portion of the second circuit layer in the display screen that is separated from the second surface.

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